JP2016021427A - Mold package and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mold package and a manufacturing method thereof capable of preventing breakage of a mold-sealed housing.SOLUTION: A mold package 100 includes: a ceramic component 20 which includes a housing which air-tightly stores an electronic component 21 and is mounted on a circuit board 10; a mold resin 40 which seals the ceramic component 20; and a peeling member 30 disposed between the housing and the mold resin 40. The housing includes: a case 22 which has an opened part; a cover 23 which covers the opening of the case 22; and an adhesive agent 24 which mechanically connects the case 22 and the cover 23. The peeling member 30 is disposed between the mold resin 40 in a state being mechanically connected to the opposite side of a part facing to the case 22 in the cover 23, and the affinity with the mold resin 40 is lower than the affinity of the mold resin 40 with the case 22 and the cover 23.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a mold package formed by sealing a casing in which electronic components are stored, and a method for manufacturing the same.

  Conventionally, there is a mold package disclosed in Patent Document 1 as an example of a mold package formed by sealing a hollow casing in which electronic components are stored. In this mold package, surface mount components are sealed with a mold resin. In addition, this surface mount component has a SAW chip housed in a space formed by an interposer and a cover member.

JP 2011-147882 A

  By the way, in the surface mount component as described above, the interposer and the cover member are mechanically connected with an adhesive or the like. In addition, the mold package hardens while the mold resin constituent material cures and shrinks during molding. Therefore, in the mold package, tensile stress due to the constituent material is applied to the cover member due to curing shrinkage of the constituent material. The mold package may be damaged due to a crack in the adhesive due to the tensile stress.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a mold package and a method for manufacturing the same that can prevent the molded and sealed casing from being damaged.

In order to achieve the above object, the present invention provides:
A circuit board (10);
A mounting component (20) mounted on a circuit board, including an electronic component (21) and a housing (22, 23, 24) for accommodating the electronic component in an airtight manner;
Mold resin (40) sealing the mounting component;
A peeling member (30) provided between the housing and the mold resin,
The housing includes a case (22) partially opened, a cover (23) that closes the opening of the case, and an adhesive (24) that mechanically connects the case and the cover; Have
The peeling member is disposed between the mold resin and the mold resin in a state mechanically connected to at least one of the opposite side of the case opposite the cover and the opposite side of the cover opposite the case. The affinity with the resin is lower than the affinity between the mold resin and the case and the cover.

  Thus, according to the present invention, the mounting component in which the electronic component is hermetically accommodated by the housing is sealed with the mold resin. In addition, the case and the cover of the casing are mechanically connected with an adhesive.

  By the way, when the mold package is molded, a tensile stress due to the constituent material of the mold resin is applied to the molding target. However, in the present invention, the peeling member is mechanically connected to at least one of the opposite side of the case opposite the cover and the opposite side of the cover opposite the case. Moreover, the peeling member is arrange | positioned between mold resin in the state connected in this way. Furthermore, the release member has a lower affinity with the mold resin than the affinity between the mold resin and the case and the cover.

  Therefore, this invention can suppress the tensile stress applied to the member to which the peeling member in a housing | casing is mechanically connected, ie, at least one of a case and a cover. For this reason, this invention can suppress the damage | damage of a housing | casing, such as a crack producing in an adhesive agent or peeling of an adhesive agent and a case and a cover removing.

Further features of the invention include
A method for producing a mold package according to claim 1 or 2,
A forming step of forming a cured peeling member on at least one of the opposite side of the case opposite to the cover and the opposite side of the cover opposite to the case;
And a molding step of forming a mold resin after the forming step.

  Thereby, this invention can make affinity of mold resin and peeling member lower than affinity of mold resin, a case, and a cover. Therefore, this invention can suppress damage to a housing | casing, such as a crack producing in an adhesive agent or peeling of an adhesive agent and a case and a cover removing. Therefore, the present invention can easily manufacture a mold package whose casing is not damaged.

  The reference numerals in parentheses described in the claims and in this section indicate the correspondence with the specific means described in the embodiments described later as one aspect, and the technical scope of the invention is as follows. It is not limited.

It is sectional drawing which shows schematic structure of the mold package in embodiment. It is sectional drawing for demonstrating the formation process in embodiment. It is sectional drawing for demonstrating the molding process in embodiment. It is sectional drawing of the mold package of the state in which the tensile stress produced in the mold process in embodiment. It is sectional drawing of the mold package in the state in which the space in embodiment was formed. It is sectional drawing which shows schematic structure of the mold package in a comparative example. FIG. 10 is a cross-sectional view illustrating a schematic configuration of a mold package in Modification 1; 10 is a cross-sectional view showing a schematic configuration of a mold package in Modification 2. FIG.

  Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. The mold package 100 includes a circuit board 10, a ceramic component 20, a peeling member 30, a mold resin 40, and the like. The mold package 100 can be applied to, for example, a vehicle electronic control device mounted on a vehicle such as an automobile.

  The circuit board 10 includes a base material made of an insulating material such as resin or ceramics, and wiring formed on the base material. Therefore, the circuit board 10 can be restated as a resin board, a ceramic board, or the like. The circuit board 10 has a flat plate shape, for example. The circuit board 10 has a ceramic component 20 mounted on one surface. That is, one surface of the circuit board 10 is used as a mounting surface on which the ceramic component 20 is mounted. The circuit board 10 may be mounted with other circuit elements in addition to the ceramic component 20. The ceramic component 20 and other circuit elements are mounted in a mounting area on the mounting surface. The circuit board 10 is formed with a mold resin 40 for sealing the ceramic component 20 and other circuit elements mounted on the circuit board 10. The circuit board 10 may be a multilayer board in which wirings are laminated via the insulating material, or a single layer board in which a single layer of wiring is formed.

  The ceramic component 20 corresponds to a mounting component in the claims, and includes an electronic component 21, a case 22, a cover 23, an adhesive 24, and the like. The ceramic component 20 is a component such as a crystal oscillator or a capacitor. The electronic component 21 is a crystal (crystal resonator) for forming a crystal oscillator, a ceramic capacitor element for forming a capacitor, or the like. The electronic component 21 is surrounded by a casing including a case 22 and a cover 23 that are configured. That is, the electronic component 21 is accommodated in the housing. In the present embodiment, an example in which the ceramic component 20 is mounted on the circuit board 10 while the case 22 is mechanically connected to the circuit board 10 is employed.

  In the present embodiment, a case 22 and a cover 23 made of ceramics are employed. However, the present invention is not limited to this. The case 22 and the cover 23 only need to be capable of being sealed with the mold resin 40 while accommodating the electronic component 21, and may be, for example, glass. Further, the case 22 and the cover 23 may be a can case made of metal.

  The case 22 is a box member provided with a bottom 22a and an annular side wall 22b protruding from the bottom 22a, and opened at a position facing the bottom 22a. In other words, the case 22 is provided with an annular side wall portion 22b and a bottom portion 22a that closes one opening of the side wall portion 22b. In the present embodiment, as an example, a case 22 having a bottom 22a and a side wall 22b that stands upright from the bottom 22a is employed. In addition, the case 22 can be rephrased as a box member having one opened. Furthermore, the case 22 can be rephrased as a concave member on which the electronic component 21 can be placed.

  The cover 23 is a lid member that closes the opening of the case 22, and is mechanically connected to the case 22 via an adhesive 24. The cover 23 is disposed so as to face the opening of the case 22 and is mechanically connected to the opening end of the case 22 via an adhesive 24. That is, the cover 23 is fixed to the tip 22 c of the side wall portion 22 b of the case 22 via the adhesive 24. In the present embodiment, as an example, a flat cover 23 having a facing surface facing the opening of the case 22 and a surface opposite to the facing surface is employed.

  The case 22 and the cover 23 are fixed to each other with an adhesive 24 to form an accommodation space for accommodating the electronic component 21. The adhesive 24 is provided over the entire circumference of the tip 22c. The case 22 and the cover 23 are fixed with the adhesive 24 to form an airtight housing space. That is, the case 22 and the cover 23 are configured so that the mold resin 40 does not enter the accommodation space. Therefore, it can be said that the electronic component 21 is airtightly accommodated by the case 22 and the cover 23. As the adhesive 24, for example, an adhesive mainly composed of glass or an epoxy resin can be used. Further, the case 22 and the cover 23 are not limited to the above configuration, and the cover 23 is mechanically connected to the case 22 via the adhesive 24, and the cover 23 closes the opening of the case 22 and is airtight. Any device that forms a housing space can be used.

  A peeling member 30 is formed on the opposite surface of the cover 23. That is, the peeling member 30 is mechanically connected to the opposite side of the cover 23 facing the case 22. The peeling member 30 is formed on the opposite surface of the cover 23 and is covered with the mold resin 40. The peeling member 30 is a member for suppressing the tensile stress due to the mold resin 40 from being transmitted to the cover 23. The release member 30 has a lower affinity for the mold resin 40 than for the mold resin 40 and the case 22 and the cover 23.

  In the mold package 100, the mold resin 40 is easily peeled off from the peeling member 30 before the adhesive 24 is cracked due to the tensile stress described later, or before the cover 23 is removed from the case 22 due to the adhesive 24 being peeled off. It is configured as follows. That is, in the mold package 100, even when the peeling member 30 and the constituent material of the mold resin 40 are bonded at the time of molding, the constituent material is easily peeled from the peeling member 30 due to the curing shrinkage of the constituent material. It is configured. In this way, the mold package 100 suppresses transmission of tensile stress to the cover 23. Therefore, the peeling member 30 can be rephrased as a stress relieving member for relieving the tensile stress applied to the cover 23.

  The peeling member 30 is made of a material having low affinity with the mold resin 40. For example, an epoxy resin, silicone, a fluororesin, polytetrafluoroethylene, or the like can be used. The peeling member 30 is formed on the cover 23 in advance before being sealed with the mold resin 40. More specifically, the peeling member 30 is cured on the cover 23 in advance. Therefore, it can be paraphrased that the peeling member 30 is formed on the cover 23 in a state where the cross-linking hand with the mold resin 40 is lost.

  As described above, in the mold package 100, the peeling member 30 is provided between the mold resin 40 and the cover 23. Further, as shown in FIG. 5, in the mold package 100, when the constituent material of the mold resin 40 is peeled from the peeling member 30 due to tensile stress, the peeling member 30 and the space S are interposed between the mold resin 40 and the cover 23. It will have.

  Here, the manufacturing method of the mold package 100 will be described with reference to FIGS. First, a formation process is performed. As shown in FIG. 2, in the forming step, the peeling member 30 is formed on the ceramic component 20. For example, in the forming process, the constituent material of the peeling member 30 is applied on the cover 23. In the forming step, the peeling member 30 is formed by curing the constituent material. In this manner, the peeling member 30 is formed on the cover 23 in a state where the cross-linking hand with the mold resin 40 is lost. The forming process may be performed before the molding process described later, and may be performed after the ceramic component 20 is mounted on the circuit board 10 or before the ceramic component 20 is mounted on the circuit board 10. You may do it. In the following, the structure in which the ceramic component 20 is mounted on the circuit board 10 and the peeling member 30 is formed may be referred to as a basic structure.

  After the forming process, a molding process (sealing process) is performed. As shown in FIG. 3, in the molding step, sealing is performed by a well-known compression molding method. In the molding process, an example in which an upper mold 210, a clamp mold 221 and a lower mold 222 are used as the mold is adopted. The compression mold and mold are well-known techniques and will be described briefly.

  The upper mold 210 is a surface with which the back surface of the mounting surface of the circuit board 10 is brought into contact, and has a flat contact surface 210a. The clamp mold 221 is provided with a hole. A lower mold 222 is disposed in the hole of the clamp mold 221 so as to be movable along the hole. In the clamp mold 221 and the lower mold 222, a recess in which the constituent material of the mold resin 40 is disposed is formed in the space by the annular wall surface 221 a in the hole of the clamp mold 221 and the upper surface 222 a of the lower mold 222.

  The lower mold 222 can move up and down in the hole of the clamp mold 221. In other words, it can be said that the lower mold 222 can move in a direction approaching the upper mold 210 and a direction moving away from the upper mold 210 in a state where the basic structure is fixed to the upper mold 210 and the clamp mold 221. In other words, the lower mold 222 can be moved in the direction of decreasing the volume of the recess and the direction of increasing the volume of the recess.

  In the molding process, the abutting surface 210a of the upper mold 210 is brought into contact with the back surface of the circuit board 10, and the clamping mold 221 is placed on the mounting surface of the circuit board 10 so that the concave portion faces the mounting area of the circuit board 10. Abut. Thereafter, in the molding process, the lower mold 222 is moved toward the upper mold 210 in a state in which the constituent material of the mold resin 40, that is, the constituent material before curing is put in the concave portion, and a forming pressure is applied to the constituent material. . At this time, the mold is heated to a predetermined temperature in order to apply heat to the constituent material. At this time, in the basic structure, the mounting region, the ceramic component 20, and the peeling member 30 are covered with the constituent materials. Accordingly, the peeling member 30 is in contact with the constituent material. In the molding step, the molding resin 40 is formed by curing the component material while applying the forming pressure. Thus, in the present invention, the ceramic component 20 can be sealed. Further, in the molding process, in addition to the ceramic component 20, other circuit elements can be sealed together.

  By the way, the constituent material hardens first from the periphery 40a close to the mold when it is cured. Then, the constituent material hardens and shrinks inside, that is, the part that contacts the ceramic component 20. Further, the cured component material and the mold, and the cured resin and the ceramic component 20 are bonded with a strong bonding force. The constituent material applies tensile stress to the basic structure during curing shrinkage. For example, this tensile stress is applied to the basic structure in the direction indicated by the arrow in FIG. That is, the basic structure is pulled by the constituent material in which the peeling member 30 formed on the cover 23 is cured and contracted. Note that the mold is not shown in FIG.

  Here, as described above, the peeling member 30 is formed on the cover 23 in a state in which the cross-linking hand with the mold resin 40 is lost. In other words, the peeling member 30 is configured so that the mold resin 40 is easily peeled off. That is, it can be said that the peeling member 30 is configured so that the constituent material that is cured and contracted is easily peeled off.

  For this reason, when the tensile stress applied to the peeling member 30 exceeds a predetermined value, the constituent material that is in contact with the peeling member 30 is peeled off. That is, the mold resin 40 peels from the peeling member 30 itself. In other words, the constituent material is separated from the peeling member 30. Thereby, as shown in FIG. 5, in the mold package 100, a space S is formed between the peeling member 30 and the mold resin 40. Note that the mold is not shown in FIG.

  As described above, when the mold package 100 is molded, the mold resin 40 and the peeling member 30 are easily peeled off by the tensile stress, so that the tensile stress applied to the cover 23 can be suppressed. In other words, the mold package 100 can make it difficult for the tensile stress generated when the constituent materials are cured and contracted to be transmitted to the cover 23. Therefore, when the tensile stress is large, the mold package 100 peels the mold resin 40 from the peeling member 30 before the adhesive 24 cracks or the adhesive 24 is peeled off and the cover 23 is removed from the case 22. Can be made. For this reason, when the mold package 100 is molded, the casing 24 can be prevented from being damaged such as cracks in the adhesive 24 or peeling of the cover 24 from the case 22 due to the adhesive 24 being peeled off.

  Note that the mold resin 40 and the peeling member 30 may not be peeled depending on the magnitude of the tensile stress. However, if the mold package 100 has a tensile stress that does not cause the mold resin 40 and the peeling member 30 to peel off, the adhesive 24 will not crack.

  Further, it is preferable that the forming range of the peeling member 30 is as wide as possible. Therefore, it is preferable that the peeling member 30 is provided in the entire area on the opposite surface of the cover 23. That is, in the mold package 100, the peeling member 30 is provided on a part of the opposite surface of the cover 23 as shown in FIG. It is preferable that 30 is provided. In the mold package 100, the contact area between the mold resin 40 and the cover 23 can be reduced by forming the peeling member 30 in as wide a range as possible. The mold package 100 can suppress the tensile stress applied to the cover 23 by reducing the contact area between the mold resin 40 and the cover 23. Therefore, in the mold package 100, when the peeling member 30 is provided in the entire area on the opposite surface of the cover 23, the crack of the adhesive 24 is greater than when the peeling member 30 is provided on a part of the opposite surface of the cover 23. Etc. can be further suppressed.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  Note that the object of the present invention can be achieved even with the mold package 110 of Modification 1 shown in FIG. In the mold package 110, the ceramic component 20 is mounted on the circuit board 10 in a state where the cover 23 is mechanically connected to the circuit board 10. In this case, the peeling member 30 is mechanically connected to the case 22 on the outer surface of the bottom 22a. The inner surface of the bottom 22 a is the bottom surface of the case 22. In this way, the peeling member 30 is mechanically connected to the opposite side of the case 22 opposite to the cover 23.

  Further, the present invention can achieve the object even with the mold package 120 of the second modification shown in FIG. In the mold package 120, the ceramic component 20 is mounted on the circuit board 10 with the side surface of the case 22 and the side surface of the cover 23 mechanically connected to the circuit board 10. That is, in the mold package 120, the case 22 and the cover 23 are both mechanically connected to the circuit board 10. In this case, the peeling member 30 is mechanically connected to the case 22 on the outer surface of the bottom 22 a and the outer surface of the cover 23. The inner surface of the cover 23 is a surface facing the case 22. Thus, the peeling member 30 is mechanically connected to the opposite side of the case 22 opposite to the cover 23 and the opposite side of the cover 23 to the case 22.

  DESCRIPTION OF SYMBOLS 10 Circuit board, 20 Ceramic component, 21 Electronic component, 22 Case, 23 Cover, 24 Adhesive, 30 Release member, 40 Mold resin, 100 Mold package

Claims (3)

A circuit board (10);
A mounting component (20) mounted on the circuit board, including an electronic component (21) and a housing (22, 23, 24) that hermetically accommodates the electronic component;
Mold resin (40) sealing the mounting component;
A peeling member (30) provided between the housing and the mold resin,
The housing includes a case (22) partially opened, a cover (23) that closes the opening of the case, and an adhesive (24) that mechanically connects the case and the cover. A housing, and
The release member is mechanically connected to at least one of the opposite side of the case opposite to the cover and the opposite side of the cover opposite to the case. A mold package, characterized in that the mold package has a lower affinity with the mold resin than with the mold resin and the case and the cover.   The peeling member is mechanically connected to at least one of the entire region of the case opposite to the portion facing the cover and the entire region of the cover opposite to the portion facing the case. The mold package according to claim 1. A method for producing a mold package according to claim 1 or 2,
A forming step of forming the peeling member in a state of being cured on at least one of the opposite side of the case opposite to the cover and the opposite side of the cover opposite to the case;
A mold package manufacturing method comprising: a mold step of forming the mold resin after the forming step.

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