JP2016018856A - Board protection cover and board protection structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board protection cover capable of suppressing the occurrence of a migration phenomenon and also capable of improving a heat dissipation effect and strength of a fastening part.SOLUTION: The present board protection cover is a board protection cover 3 arranged on a side of one surface of a board 2, electronic components (a switch 8, a light emitting diode 9) being mounted on another surface of the board. The board protection cover includes a cover body 15 fastened to the board so as to cover the one surface of the board, and a protrusion 16 projecting from the surface of a cover body to be in contact with the one surface of the board. The protrusion 16 is formed at a position where the cover body 15 is fastened to the board 2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate protection cover and a substrate protection structure, and more particularly to a substrate protection cover and a substrate protection structure for protecting a substrate on which an electronic component is mounted.

  2. Description of the Related Art Conventionally, a board protection structure that protects a board (that is, a printed circuit board) on which electronic components are mounted is generally used. As this conventional board protection structure 101, for example, as shown in FIGS. 6 and 7, a map lamp board 102 mounted on the vehicle ceiling, and a protective cover arranged on the surface side of the board 102 outside the passenger compartment. 103 is known. The protective cover 103 prevents the substrate 102 and the body 107 from interfering with each other and causing a short circuit. The protective cover 103 is made of a flat insulating film, and is fastened to the resin component (design component) 104 with a plurality of fastening screws 118 with the substrate 102 interposed therebetween. Contact is made on almost the entire surface.

JP 2003-198106 A

  However, in the conventional substrate protection structure 101, since the protective cover 103 and the substrate 102 are in contact with each other on almost the entire surface, moisture entering between the protective cover 103 and the substrate 102 is transmitted through the surface of the protective cover 103 and the substrate. It is easy to spread over the entire surface of 102. Therefore, the migration phenomenon of the metal component is likely to occur in the wiring pattern formed on the outer surface of the passenger compartment of the substrate 102 and the solder part 110, and there is a possibility that the circuit is short-circuited. This migration phenomenon is particularly likely to occur at the ceiling where the vehicle tends to be hot and humid. In addition, heat generated by an electronic component (for example, a high-brightness LED) 109 mounted on the surface of the board 102 on the vehicle interior side is difficult to escape from between the board 102 and the protective cover 103, and the heat dissipation effect is reduced. Furthermore, since the relatively thin flat plate-shaped protective cover 103 is fastened to the substrate 102 with the fastening screw 118, the strength of the fastening portion is lowered.

  Note that Patent Document 1 discloses a printed circuit board protection structure formed by bonding the peripheral edge of a resin film that wraps the printed circuit board. However, even in the protective structure of the printed circuit board disclosed in Patent Document 1, a migration phenomenon occurs because the resin film and the printed circuit board are in contact with each other substantially in the same manner as the above-described conventional circuit board protective structure. The heat dissipation effect and the strength of the fastening portion are reduced.

  The present invention has been made in view of the above situation, and an object of the present invention is to provide a substrate protection cover and a substrate protection structure that can suppress the occurrence of the migration phenomenon and can improve the heat dissipation effect and the strength of the fastening portion. And

In order to solve the above problem, the invention according to claim 1 is a substrate protective cover disposed on the other surface side of the substrate on which the electronic component is mounted on one surface, and the other surface of the substrate A cover body that is fastened to the substrate so as to cover the substrate, and a protrusion that protrudes from the surface of the cover body and abuts against the other surface of the substrate, and the protrusion includes the protrusion of the cover body. The gist is that it is formed at a position to be fastened to the substrate.
According to a second aspect of the present invention, in the first aspect of the present invention, the protrusion is configured such that the cover body is on the other surface of the substrate in a state where the protrusion is in contact with the other surface of the substrate. The gist is to have a protruding height that does not contact the formed solder portion.
According to a third aspect of the present invention, in the first or second aspect of the present invention, the cover body protrudes from the surface of the cover body and abuts against the other surface of the substrate at a position not fastened to the substrate. The gist is that a non-fastening protrusion is formed.

  In order to solve the above problem, an invention according to claim 4 is a board protection structure disposed on a vehicle ceiling, wherein a board on which an electronic component is mounted on a surface on the vehicle interior side, and a vehicle of the board. The board protective cover according to any one of claims 1 to 3, which is disposed on a surface side of the outdoor side, wherein the board and the board protective cover are fastened by the protrusion, The gist of the invention is that the projecting portion is in contact with the surface of the substrate outside the cabin, so that a facing space is formed between the substrate protective cover and the substrate.

According to the substrate protection cover of the present invention, the cover main body is fastened to the substrate so as to cover the other surface of the substrate, and the protrusion protrudes from the surface of the cover main body and contacts the other surface of the substrate. . And the protrusion is formed in the position fastened to the board | substrate of a cover main body. As a result, the protrusion comes into contact with the surface of the substrate, so that a facing space is formed between the substrate protective cover and the substrate. Due to this opposing space, the moisture that enters between the substrate protection cover and the substrate becomes a ball shape and easily escapes to the outside. Therefore, the occurrence of the migration phenomenon is suppressed. In addition, heat generated by the electronic component can easily escape from between the substrate protection cover and the substrate. Therefore, the heat dissipation effect is enhanced. Furthermore, since the substrate protective cover is fastened to the substrate with the relatively thick protrusion, the strength of the fastening portion is increased.
The protrusion has a protrusion height such that the cover body does not contact a solder portion formed on the other surface of the substrate in a state where the protrusion is in contact with the other surface of the substrate. In this case, since the substrate protective cover does not come into contact with the solder portion on the substrate, the stagnation of moisture hardly occurs in the vicinity of the solder portion. Therefore, the occurrence of the migration phenomenon is more reliably suppressed.
Further, when a non-fastening projection that protrudes from the surface of the cover body and abuts against the other surface of the board is formed at a position not fastened to the board of the cover body, a relatively wide board protection cover Even so, the substrate protective cover can be held in an appropriate posture while reducing the number of fastenings.

  According to the board protection structure of the present invention, it includes the board on which the electronic component is mounted on the surface on the vehicle interior side, and the above-mentioned board protection cover disposed on the surface side of the board outside the vehicle cabin. And the board | substrate and the board | substrate protective cover are fastened by the protrusion, and the opposing space is formed between the board | substrate protective cover and the board | substrate because the protrusion contact | abuts on the surface outside the compartment of a board | substrate. This opposing space makes it easier for moisture that enters between the substrate protection cover and the substrate to escape to the outside. Therefore, even if it is a vehicle ceiling part which becomes high temperature and humidity easily, generation | occurrence | production of a migration phenomenon is suppressed. In addition, heat generated by the electronic component can easily escape from between the substrate protection cover and the substrate. Therefore, the heat dissipation effect is enhanced. Furthermore, since the substrate protective cover is fastened to the substrate with the relatively thick protrusion, the strength of the fastening portion is increased.

The present invention will be further described in the following detailed description with reference to the drawings referred to, with reference to non-limiting examples of exemplary embodiments according to the present invention. Similar parts are shown throughout the several figures.
1 is a longitudinal sectional view of a substrate protection structure according to Example 1. FIG. It is an enlarged view of the II arrow part of FIG. FIG. 3 is a perspective view of the substrate protective cover according to the first embodiment as viewed from the back surface. 6 is a plan view of a substrate holding structure including a substrate protection cover according to Embodiment 2. FIG. It is the perspective view seen from the back surface of the said board | substrate protective cover. It is a disassembled perspective view of the conventional board | substrate protection structure. It is a longitudinal cross-sectional view of the said board | substrate protection structure.

  The items shown here are exemplary and illustrative of the embodiments of the present invention, and are the most effective and easy-to-understand explanations of the principles and conceptual features of the present invention. It is stated for the purpose of providing what seems to be. In this respect, it is not intended to illustrate the structural details of the present invention beyond what is necessary for a fundamental understanding of the present invention. It will be clear to those skilled in the art how it is actually implemented.

<Board protection cover>
The board protection cover according to the present embodiment is a board protection cover (3, 3 ′) disposed on the other surface side of the board (2) on which electronic components (8, 9) are mounted on one surface. A cover body (15) fastened to the substrate (2) so as to cover the other surface of the substrate (2), and protrudes from the surface of the cover body (15) and contacts the other surface of the substrate (2). And a projecting portion (16) in contact (see, for example, FIGS. 1 to 5). And the said protrusion (16) is formed in the position fastened to the board | substrate (2) of a cover main body (15) (for example, refer FIG. 1 etc.).

  As the substrate protective cover according to the present embodiment, for example, the protrusion (16) has the protrusion (16) in contact with the other surface of the substrate (2), and the cover body (15) has a substrate ( 2) (see FIG. 2 etc.) having a protruding height (h) that does not contact the solder part (10) formed on the other surface of 2).

  Examples of the protrusion height (h) of the protrusion include 2.5 to 5.0 mm (preferably 3.0 to 3.5 mm). Moreover, as thickness (t) of the said cover main body (15), 0.1-0.5 mm (preferably 0.25-0.50 mm) etc. can be mentioned, for example. Furthermore, examples of the protruding height (h ′) of the solder part (10) include 0.5 to 2.0 mm (preferably 1.0 to 1.5 mm).

  As the substrate protective cover according to the present embodiment, for example, at a position not fastened to the substrate (2) of the cover main body (15), it protrudes from the surface of the cover main body (15) to the other surface of the substrate (2). The form (for example, refer FIG.4, FIG.5 etc.) in which the non-fastening protrusion (23) which contact | abuts is formed can be mentioned.

  In the case of the above-described embodiment, for example, the non-fastening protrusion (23) is surrounded by a line segment connecting the center points of the three or more protrusions (16) when the cover body (15) is viewed from the surface (above). It can be arranged in the region (R) (see, for example, FIG. 4). Thereby, a board | substrate protective cover can be hold | maintained more reliably in a proper attitude | position.

  As the substrate protective cover according to the present embodiment, for example, a fastening screw (18) for fastening the cover body (15) to the substrate (2) is provided on the cover body (15) and the protrusion (16). The form (for example, refer FIG. 2 etc.) in which the accommodation recessed part (19) which accommodates the head (18a) of this is formed can be mentioned. Thereby, since the head part of a fastening screw does not protrude from the surface of a board | substrate protective cover, the integrated object of a board | substrate protective cover and a board | substrate can be easily assembled | attached to an assembly | attachment object. Furthermore, since the protrusion has a cylindrical shape with an inner flange, the strength of the fastening portion is further increased. Examples of the flange thickness (f) of the protrusion (16) include 0.1 to 0.5 mm (preferably 0.25 to 0.50 mm) and the like (for example, see FIG. 2 and the like). .

<Board protection structure>
The board protection structure according to the present embodiment is a board protection structure (1) disposed on a vehicle ceiling, and a board (2) on which electronic components (8, 9) are mounted on the surface on the vehicle interior side; The board protective cover (3, 3 ′) of the above-described embodiment is provided on the surface side of the board (2) outside the passenger compartment (see, for example, FIGS. 1 to 5). And the said board | substrate (2) and the board | substrate protective cover (3, 3 ') are fastened by the protrusion (16), and the protrusion (16) contacts the surface of the board | substrate outside of a board | substrate (2). Thus, a facing space (S) is formed between the substrate protective cover (3, 3 ′) and the substrate (2) (see, for example, FIG. 1 and the like).

  The board protection structure according to the present embodiment includes, for example, a design component (4) disposed on the surface of the board (2) on the vehicle interior side, and the board protection cover (3, 3 ') and the design component (4) can be in the form of being fastened by the protrusion (16) (see, for example, FIG. 1). Thereby, a board | substrate, a board | substrate protective cover, and a design component can be handled as an integrated object.

  In addition, the code | symbol in the parenthesis of each structure described in the said embodiment shows the correspondence with the specific structure as described in the Example mentioned later.

  Hereinafter, the present invention will be specifically described with reference to the drawings. In this embodiment, a substrate protection structure used for an illumination device (for example, a map lamp, a room lamp, etc.) disposed on the vehicle ceiling is illustrated.

<Example 1>
(1) Configuration of Board Protection Structure A board protection structure 1 according to the present embodiment is disposed on a flat board (printed circuit board) 2 and a surface side of the board 2 outside the cabin as shown in FIG. The resin-made board protective cover 3 and the resin-made design component 4 disposed on the surface side of the board 2 on the vehicle interior side are provided. In FIG. 1, reference numeral 6 denotes a ceiling material, and reference numeral 7 denotes a metal body (ceiling panel).

  A switch 8 and a light emitting diode (high brightness LED) 9 as electronic components are mounted on the surface of the board 2 on the vehicle interior side. The light emitting diode 9 emits light when the switch 8 is operated. Further, a solder portion 10 for mounting the switch 8 and the light emitting diode 9 is formed on the surface of the substrate 2 on the outside of the passenger compartment. Further, a wiring pattern (not shown) is formed on the surface of the board 2 outside the passenger compartment, and a connector (not shown; electronic component) connected to the wiring pattern is mounted.

  The design component 4 includes a main body 12 whose surface on the vehicle interior side forms a design surface, and a plurality (four in the figure) of bosses 13 rising from the main body 12. The main body 12 is provided with a lens 12a through which light from the light emitting diode 9 is transmitted. Each boss 13 is disposed at a position corresponding to a later-described protrusion of the substrate protection cover 3.

(2) Configuration of Board Protective Cover A board protective cover 3 according to this embodiment is a flat plate fastened to the board 2 so as to cover all or part of the surface of the board 2 outside the passenger compartment, as shown in FIG. And a plurality of (four in the figure) protrusions 16 protruding from the surface of the cover body 15 and coming into contact with the outer surface of the substrate 2 (see FIG. 3). Each of the protrusions 16 is formed at a position to be fastened to the substrate 2 of the cover body 15 with a fastening screw 18. In addition, the opposing space S is formed between the substrate protective cover 3 and the substrate 2 by the contact of each protrusion 16 with the surface of the substrate 2 outside the passenger compartment. The substrate protection cover 3 exhibits a function of preventing the surface of the substrate 2 outside the passenger compartment from interfering with the body 7 and causing a short circuit.

  As shown in FIG. 2, the protrusion 16 is in a state where the protrusion 16 is in contact with the other surface of the substrate 2 and the cover body 15 does not contact the solder portion 10 formed on the other surface of the substrate 2. Such a protrusion height h (for example, about 3.5 mm; the interval between the opposing spaces S) is provided. Further, the thickness t of the cover body 15 is about 0.25 mm. Further, the protruding height h ′ of the solder part 10 is about 1.5 mm.

  The cover body 15 and the protrusion 16 are formed with a receiving recess 19 that is recessed downward to receive the head 18 a of the fastening screw 18. Further, on the shaft end side of the protrusion 16, an insertion hole 20 is formed which is connected to the housing recess 19 and through which the screw shaft portion 18 b of the fastening screw 18 is inserted. Therefore, the protrusion 16 is formed in a cylindrical shape with an inner flange. The flange thickness f of the protrusion 16 is about 0.25 mm. Furthermore, an insertion hole 21 through which the screw shaft portion 18b of the fastening screw 18 is inserted is formed in the substrate 2. Then, by inserting the screw shaft portion 18b of the fastening screw 18 into the insertion holes 20 and 21 and screwing it into the center hole of the boss 13 of the design component 4, the substrate protection cover 3 and the design component 4 are integrated with the substrate 2 interposed therebetween. It is concluded to.

(3) Action of Substrate Protective Cover Next, the action of the substrate protective cover 3 having the above configuration will be described. According to the present substrate protection cover 3, as shown in FIG. 2, since the facing space S is formed between the substrate protection cover 3 and the substrate 2, the moisture w entering between the substrate protection cover 3 and the substrate 2. Becomes a ball and escapes to the outside. Further, the heat generated by the electronic components 8 and 9 is released from between the board protective cover 3 and the board 2 to the outside.

(4) Effects of Example According to the substrate protective cover 3 of this example, the cover body 15 fastened to the substrate 2 so as to cover the other surface of the substrate 2 and the substrate protruding from the surface of the cover body 15 2 and a protrusion 16 that abuts against the other surface. And the protrusion 16 is formed in the position fastened to the board | substrate 2 of the cover main body 15. FIG. Thereby, the opposing space S is formed between the substrate protection cover 3 and the substrate 2 by the protrusions 16 coming into contact with the surface of the substrate 2. Due to the facing space S, the moisture that enters between the substrate protective cover 3 and the substrate 2 becomes a ball shape and easily escapes to the outside. Therefore, the occurrence of the migration phenomenon is suppressed. In particular, the occurrence of a migration phenomenon is suitably suppressed even in a vehicle ceiling that tends to be hot and humid. Further, the heat generated by the electronic components 8 and 9 can easily escape from between the substrate protective cover 3 and the substrate 2. Therefore, the heat dissipation effect is enhanced. Furthermore, since the board protective cover 3 is fastened to the board 2 by the relatively thick protrusion 16, the strength of the fastening part is increased.

  Further, in the present embodiment, the protrusion 16 prevents the cover body 15 from coming into contact with the solder portion 10 formed on the other surface of the substrate 2 in a state where the protrusion 16 is in contact with the other surface of the substrate 2. Has a high protrusion height h. As a result, the substrate protective cover 3 does not contact the solder portion 10 on the substrate 2, so that moisture stagnation hardly occurs in the vicinity of the solder portion 10. Therefore, the occurrence of the migration phenomenon is more reliably suppressed.

  In the present embodiment, the cover main body 15 and the protrusion 16 are formed with an accommodating recess 19 for accommodating a head 18 a of a fastening screw 18 for fastening the cover main body 15 to the substrate 2. Thereby, since the head 18a of the fastening screw 18 does not protrude from the surface of the substrate protection cover 3, the integrated body of the substrate protection cover 3 and the substrate 2 can be easily assembled to the assembly target. Furthermore, since the protrusion 18 has a cylindrical shape with an inner flange, the strength of the fastening portion is further increased.

  Further, in the present embodiment, the design component 4 is provided on the surface side of the board 2 on the vehicle interior side, and the board protection cover 3 and the design part 4 are fastened by the protrusion 16 with the board 2 interposed therebetween. Thereby, the board | substrate 2, the board | substrate protective cover 3, and the design components 4 can be handled as an integrated object.

<Example 2>
Next, the substrate holding cover according to the second embodiment will be described. The same components as those of the substrate holding cover 3 according to the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. Explain in detail.

(1) Configuration of Board Protective Cover As shown in FIGS. 4 and 5, the board protective cover 3 ′ according to this embodiment includes a cover body 15 and a plurality of (four in the drawing) protrusions (fastening protrusions). 16). A non-fastening projection 23 that protrudes from the surface of the cover body 15 and contacts the other surface of the board 2 is formed at a position where the fastening body 18 is not fastened to the board 2 of the cover body 15. This non-fastening projection 23 is formed in a shape substantially similar to that of the projection 16, but is not fastened by the fastening screw 18. Further, the non-fastening protrusion 23 is disposed in a region R surrounded by a line segment (shown by a one-dot chain line in FIG. 4) connecting the center points of the plurality of protrusions 16 when the cover body 15 is viewed from the surface. ing.

(2) Action and Effect of Substrate Protective Cover According to the substrate protective cover 3 ′ of the present embodiment, in addition to the effects and effects substantially similar to those of the substrate protective cover 3 of the first embodiment, the substrate 2 of the cover body 15 Since a non-fastening projection 23 that protrudes from the surface of the cover body 15 and contacts the other surface of the substrate 2 is formed at a position that is not fastened to the cover body 15, The board protective cover 3 ′ can be held in an appropriate posture while reducing the number of fastenings.

  Further, in the present embodiment, the non-fastening protrusion 23 is disposed in a region R surrounded by a line segment connecting the center points of the three or more protrusions 16 when the cover body 15 is viewed from the surface (above). . Thereby, the substrate protection cover 3 ′ can be more reliably held in an appropriate posture.

  In the present invention, the present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention depending on the purpose and application. In other words, in the first and second embodiments, the board protection cover 3 and 3 ′ are fastened to the board 2 by the fastening screw 18, but the invention is not limited to this. For example, a rivet, a locking tool, and a clamping tool. The substrate protective cover may be fastened to the substrate by adhesion, welding, or the like. In the first and second embodiments, the substrate protective cover 3, 3 ′ and the design component 4 are fastened with the substrate 2 interposed therebetween. However, the present invention is not limited to this. For example, the substrate 2 and the substrate protective cover 3 are connected. 3 'may be fastened directly.

  Moreover, in the said Example 1, 2, although the protrusions 16 and 23 in which the accommodation recessed part 19 was formed were illustrated, it is not limited to this, For example, it is good also as a protrusion in which the accommodation recessed part 19 is not formed. In the first and second embodiments, the protrusions 16 and 23 may be formed integrally with the cover main body 15, or separate protrusions 16 and 23 may be attached to the cover main body 15. Good. Further, the shape, size, number, etc. of the protrusions 16, 23 are not particularly limited.

  Moreover, in the said Example 1, 2, although the switch 8 and the light emitting diode 9 were illustrated as an electronic component, it is not limited to this, For example, as an electronic component, a light bulb, a fluorescent lamp, a connector, a fuse, a semiconductor, a passive element (For example, a resistor, a capacitor, etc.). In the first and second embodiments, an electronic component may be mounted on the surface (the other surface of the substrate 2) protected by the substrate protection cover 3, 3 ′ of the substrate 2.

  Furthermore, in the said Example 1, 2, although the board | substrate protective cover 3, 3 'for the illuminating device of a vehicle was illustrated, it is not limited to this, For example, For vehicle air conditioners, For speaker apparatuses, For seat control apparatuses Further, it may be a substrate protective cover for a window control device or the like. Furthermore, it is good also as a board | substrate protective cover for electric machine apparatuses, such as a television, an audio equipment, an amusement apparatus, an air conditioning appliance, a white goods home appliance, for example. Moreover, in the said Example 1, 2, although the board | substrate protective cover 3, 3 'distribute | arranged to a vehicle ceiling part was illustrated, it is not limited to this, For example, vehicles, such as an instrument panel part, a pillar part, a door trim part, etc. It is good also as a board | substrate protective cover distribute | arranged to an interior part.

  The foregoing examples are for illustrative purposes only and are not to be construed as limiting the invention. Although the invention has been described with reference to exemplary embodiments, it is to be understood that the language used in the description and illustration of the invention is illustrative and exemplary rather than limiting. As detailed herein, changes may be made in its form within the scope of the appended claims without departing from the scope or spirit of the invention. Although specific structures, materials and examples have been referred to in the detailed description of the invention herein, it is not intended to limit the invention to the disclosure herein, but rather, the invention is claimed. It covers all functionally equivalent structures, methods and uses within the scope.

  The present invention is not limited to the embodiments described in detail above, and various modifications or changes can be made within the scope of the claims of the present invention.

  The present invention is widely used as a technique for protecting the surface of a substrate. In particular, it is suitably used as a technique for protecting the surface of the substrate disposed on the vehicle ceiling.

  DESCRIPTION OF SYMBOLS 1; Board | substrate protective structure, 2; Board | substrate, 3,3 '; Board | substrate protective cover, 8; Switch, 9; Light emitting diode, 10; Solder part, 15; , H: protrusion height of the protrusion, S: facing space.

Claims (4)

A substrate protective cover disposed on the other surface side of the substrate on which electronic components are mounted on one surface,
A cover body fastened to the substrate so as to cover the other surface of the substrate;
A protrusion protruding from the surface of the cover main body and abutting against the other surface of the substrate,
The substrate protective cover according to claim 1, wherein the protrusion is formed at a position to be fastened to the substrate of the cover body.   The protrusion has a protruding height such that the cover body does not contact a solder portion formed on the other surface of the substrate in a state where the protrusion is in contact with the other surface of the substrate. The substrate protective cover according to 1.   3. The substrate protection according to claim 1, wherein a non-fastening protrusion that protrudes from a surface of the cover body and contacts the other surface of the substrate is formed at a position of the cover body that is not fastened to the substrate. cover. A board protection structure arranged on the vehicle ceiling,
A board on which electronic components are mounted on the surface of the vehicle interior;
The board protective cover according to any one of claims 1 to 3, which is disposed on a surface side of the board outside the cabin.
The substrate and the substrate protection cover are fastened by the protrusion,
The substrate protection structure according to claim 1, wherein an opposing space is formed between the substrate protection cover and the substrate by contacting the protrusion with an outer surface of the substrate.

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