JP2016076695A - Imprint device and control method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint device where a foreign material never adheres to a mold after transfer, and to provide a control method thereof.SOLUTION: A control method of imprint device includes a step for performing dummy discharge of resin from an ink jet head 7 to a dummy discharge receiving section 8, before carrying a substrate 111 into a chamber 1A, and a step for not performing dummy discharge at least after transferring a pattern to the resin until the substrate 111 is carried out from the chamber 1A.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an imprint apparatus, in particular, an imprint apparatus that supplies a resin by an ink jet method, and a structure having a desired pattern (a figure composed of a concavo-convex structure such as a line or a pattern) and / or a smooth thin film having no pattern The present invention relates to an imprint apparatus for manufacturing a printer and a control method thereof.

  In recent years, a pattern forming technique using an imprint method has attracted attention as a fine pattern forming technique that replaces the photolithography technique. The imprint method is a pattern forming technique in which a fine structure is transferred at an equal magnification by using a mold member (mold) having a fine concavo-convex structure and transferring the concavo-convex structure to a molding object. For example, in an imprint method using a photocurable resin, a droplet of a photocurable resin is supplied as a molding to the workpiece surface, and a mold having a desired concavo-convex structure and the workpiece are separated by a predetermined distance The mold is filled with a photocurable resin in the concavo-convex structure, light is irradiated from the mold side in this state to cure the photocurable resin, and then the mold is separated from the resin layer, thereby providing the concavo-convex provided in the mold. A pattern structure having a concavo-convex structure (concave / convex pattern) is formed.

  The photocurable resin in the imprint method is supplied as droplets having a liquid amount of several pL to several tens pL by, for example, an inkjet method. However, such a micro droplet has high volatility, and the environment caused by leakage of the volatile component of the photocurable resin, the gas supplied to the transfer unit where the mold and the workpiece are located, etc., leaks out of the imprint apparatus. Contamination was a problem. Another problem is the occurrence of pattern defects caused by contaminants such as fine particles entering the imprint apparatus from the environment outside the imprint apparatus. For this reason, a chamber covering the imprint apparatus is provided, and a transfer part (mold, workpiece, ink jet apparatus, etc.) is arranged in the chamber to prevent leakage and intrusion of gas and contaminants into the transfer part. (Patent Document 1).

JP 2012-49471 A

  By the way, in the supply of resin droplets by the ink jet method, in order to prevent the clogging of the ink jet head and maintain the discharge performance, the droplets not intended for the resin supply during the discharge of the droplets intended for the resin supply This preliminary discharge (dummy discharge) must be performed periodically. However, a micro droplet of pL unit easily volatilizes, and the droplet itself tends to drift as mist in the air. As described above, when some or all of the components originally contained in the resin droplets are volatilized (hereinafter referred to as volatile components) or mist diffuses to the transfer portion where the mold and the workpiece are located, In particular, volatile components and mist will adhere to unintended locations in the workpiece, for example, the way in which the resin spreads at the site where the volatile components are locally attached differs from the resin at other sites, or The film thickness distribution is caused by the deviation from the appropriately controlled resin amount due to the mist adhering, the resin filling into the intended recess pattern of the mold is hindered, or the mold and the resin There has been a problem that pattern defects occur due to influence on separation from the layer. In addition, there is a problem that pattern defects occur due to solidification or gelation of the resin due to volatilization of the components in the resin. Further, during the transfer, the air current is disturbed near the transfer portion, and the foreign matter may be wound up. Further, when the mold and the resin layer are separated from each other, static electricity is charged to the mold, but the wound foreign matter may be attracted to the charged mold and contaminate the mold.

  The present invention has been made in consideration of the above points, and the resin mist does not adhere to the workpiece, and the foreign matter does not adhere to the mold. An object of the present invention is to provide an imprint apparatus capable of forming a pattern structure and a control method thereof.

  The present invention relates to a mold holding portion, a substrate holding portion, a droplet supply portion having an inkjet head, a dummy discharge receiving portion, these mold holding portions, a substrate holding portion, a droplet supply portion, and a dummy discharge receiving portion. In the control method of the imprint apparatus including a chamber for storing a portion and a control unit, a step of carrying a mold into the chamber, holding the mold by the mold holding unit, and aligning the mold, and the chamber Carrying the substrate into the substrate, holding the substrate by the substrate holder and aligning the substrate, discharging the resin from the inkjet head onto the substrate, and the mold for the resin on the substrate A step of transferring a pattern onto the resin by pressing the substrate, and a step of unloading the substrate from the chamber. Before carrying in, dummy discharge is performed to discharge resin from the inkjet head to the dummy discharge receiving portion, and at least after the pattern is transferred to the resin, the dummy discharge is performed until the substrate is discharged from the chamber. A control method for an imprint apparatus, characterized in that it is reserved.

  The present invention relates to a mold holding portion, a substrate holding portion, a droplet supply portion having an inkjet head, a dummy discharge receiving portion, these mold holding portions, a substrate holding portion, a droplet supply portion, and a dummy discharge receiving portion. In the control method of the imprint apparatus including a chamber for storing a portion and a control unit, a step of carrying a mold into the chamber, holding the mold by the mold holding unit, and aligning the mold, and the chamber Carrying the substrate into the substrate, holding the substrate by the substrate holder and aligning the substrate, discharging the resin from the inkjet head onto the substrate, and the mold for the resin on the substrate A step of transferring a pattern to the resin by pressing the substrate, a step of unloading the substrate from the chamber, and a process of removing electricity from the mold Before carrying the substrate into the chamber, and performing dummy discharge for discharging resin from the inkjet head to the dummy discharge receiving portion, and at least transferring a pattern to the resin, In contrast, the imprint apparatus control method is characterized in that dummy discharge is refrained until the charge is eliminated.

  The present invention is characterized by performing dummy discharge for discharging resin from the inkjet head to the dummy discharge receiving portion after holding and aligning the mold and before carrying the substrate into the chamber. It is a control method of an imprint apparatus.

  The present invention provides a control method for an imprint apparatus, in which dummy discharge is performed to discharge resin from the inkjet head to the dummy discharge receiving portion during or before holding and aligning the mold. is there.

  The present invention provides an imprint apparatus in which dummy discharge is refrained while a pattern is transferred to the resin after a substrate is carried into the chamber, the substrate is held and aligned by the substrate holding unit. This is a control method.

  The present invention relates to a mold holding portion, a substrate holding portion, a droplet supply portion having an inkjet head, a dummy discharge receiving portion, these mold holding portions, a substrate holding portion, a droplet supply portion, and a dummy discharge receiving portion. In an imprint apparatus comprising a chamber for storing a part and a control part, the control part carries in the mold into the chamber and holds and aligns the mold by the mold holding part; Carrying the substrate into the chamber, holding the substrate by the substrate holding unit and aligning the substrate; discharging the resin from the inkjet head onto the substrate; and for the resin on the substrate A step of transferring the pattern to the resin by pressing the mold; and a step of unloading the substrate from the chamber. Before carrying in the dummy discharge of the resin from the ink jet head to the dummy discharge receiving portion, and at least after transferring the pattern to the resin until the substrate is discharged from the chamber An imprint apparatus that executes a control method characterized by refraining from ejection.

  The present invention relates to a mold holding unit, a substrate holding unit, a droplet supply unit having an inkjet head, a dummy discharge receiving unit, a static eliminator, these mold holding unit, a substrate holding unit, and a droplet supply unit. In the imprint apparatus comprising a dummy discharge receiving part, a chamber for storing the static eliminator, and a control part, the control part carries the mold into the chamber and holds the mold by the mold holding part. And aligning, carrying the substrate into the chamber, holding and aligning the substrate by the substrate holding unit, discharging the resin from the inkjet head onto the substrate, A step of pressing the mold against the resin on the substrate to transfer a pattern to the resin; a step of unloading the substrate from the chamber; A step of discharging the mold with the discharging device, and before carrying the substrate into the chamber, performing dummy discharge for discharging resin from the inkjet head to the dummy discharge receiving portion, and at least the resin The imprinting apparatus executes a control method characterized in that dummy discharge is refrained after the pattern is transferred to the mold until the mold is discharged.

  The present invention is characterized by performing dummy discharge for discharging resin from the inkjet head to the dummy discharge receiving portion after holding and aligning the mold and before carrying the substrate into the chamber. It is an imprint apparatus.

  The present invention is the imprint apparatus characterized in that dummy discharge is performed to discharge resin from the ink jet head to the dummy discharge receiving portion during or before holding and aligning the mold.

  The present invention provides an imprint apparatus in which dummy discharge is refrained while a pattern is transferred to the resin after a substrate is carried into the chamber, the substrate is held and aligned by the substrate holding unit. It is.

  According to the present invention, a normal resin with a minimal effect of volatilization is filled, and foreign matter does not adhere to the mold and substrate after transfer. A structure can be formed, and mold breakage in the second and subsequent imprints can also be prevented.

FIG. 1 is a side view showing an embodiment of an imprint apparatus according to the present invention. FIG. 2 is a flowchart showing a control method of the imprint apparatus. 3A, 3B, 3C and 3D are process diagrams for explaining the imprint method of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  Note that the drawings are schematic or conceptual, and the dimensions of each member, the ratio of sizes between the members, etc. are not necessarily the same as the actual ones, and represent the same members. However, in some cases, the dimensions and ratios may be different depending on the drawing.

(Imprint device)
FIG. 1 is a side view showing an embodiment of the imprint apparatus of the present invention, and FIG. 2 is a flowchart showing a control method of the imprint apparatus shown in FIG. 1 and 2, the imprint apparatus 1 of the present invention includes a mold holding unit 2 for holding a mold 101, a base material holding unit 4 for holding a base material 111, and light on the base material 111. A droplet supply unit 6 that includes an inkjet head 7 that ejects droplets of a curable resin, and an ink receiving member (dummy) for receiving droplets of resin that has been preliminarily ejected (dummy ejected) from the inkjet head 7. A discharge receiving portion) 8, an exhaust portion 10, and a control portion 12 that controls these constituent members 2, 4, 6, 7, and 10.

  In the imprint apparatus of the present invention, the mold holding unit 2, the substrate holding unit 4 and the inkjet head 7 can be changed in relative positions. In the imprint apparatus 1 shown in the drawing, the substrate holding unit 4 is In addition, it is possible to move between a transfer position that faces the mold holding unit 2 and performs transfer, and a droplet supply position that receives supply of resin droplets from the inkjet head 7 to the substrate 111 to be held.

  Among these, the substrate holding part 4 is movable along the x direction, and the ink receiving member 8 is installed in the substrate holding part 4. Further, the holding unit 4, the ink receiving member 8, and the mold holding unit 2 are all housed in the chamber 1A. Further, in the chamber 1A, a static elimination device 11 is provided for removing static electricity charged in the mold 101 when the mold 101 and the resin are peeled off after the transfer.

(Mold holding part 2)
The mold holding unit 2 constituting the imprint apparatus 1 holds the mold 101 with the surface having the concavo-convex structure region 102 directed toward the base material holding unit 4. The mold holding unit 2 holds the mold 101 by a holding mechanism by suction, a holding mechanism by mechanical clamping, a holding mechanism by static electricity, or the like, and the holding mechanism is not particularly limited.

(Base material holding part 4)
The base material holding part 4 constituting the imprint apparatus 1 holds the base material 111 for imprinting. For example, the base material 111 is configured by a holding mechanism by suction, a holding mechanism by mechanical clamping, a holding mechanism by static electricity, or the like. Can be held. The base material holding unit 4 is illustrated between a droplet supply position located below the inkjet head 7 and a transfer position (a lower position of the mold holding unit 2) that faces the mold holding unit 2 and performs transfer. It can be reciprocated in the x direction. The mold holding unit 2 and the substrate holding unit 4 are separated from each other in the z direction shown in the figure, and the reciprocating movement of the substrate holding unit 4 in the x direction is performed by a driving mechanism unit (not shown). The mold holding unit 2 and the substrate holding unit 4 may be separated from each other by either driving the mold holding unit 2 or the substrate holding unit 4 or by driving both of them. In addition, the drive mechanism unit receives the droplets from the inkjet head 7 of the droplet supply unit 6 at the droplet supply position for the purpose of receiving the droplets at a desired position. 7 may be used to control the position of the base material holder 4 in the illustrated x direction.

(Droplet supply unit 6)
The droplet supply unit 6 constituting the imprint apparatus 1 supplies resin droplets (not shown) onto the substrate 111 held by the substrate holding unit 4, and is an inkjet device (see FIG. In the example shown, only the inkjet head 7 is shown). In the illustrated example, the inkjet head 7 of the droplet supply unit 6 is in a droplet supply position for supplying resin droplets onto the substrate 111 held by the substrate holding unit 4. The ink jet apparatus included in the liquid drop supply unit 6 is a desired operation of the ink jet head 7 for supplying resin droplets onto the substrate 111 at the liquid drop supply position, for example, in the y direction shown in FIG. Reciprocating operation, or a combination of the reciprocating operation in the y direction and the reciprocating operation in the x direction, a drive unit, an ink supply unit to the inkjet head 7, and the inkjet head 7 and the drive unit and ink supply The control part etc. which control a part are comprised. Further, the droplet supply unit 6 moves between the droplet supply position above the substrate holding unit 4 and the head standby position that moves in the y direction and moves away from the substrate holding unit 4, as shown in FIG. The inkjet head 7 can be reciprocated in the x direction shown.

(Ink receiving member 8)
The ink receiving member (dummy discharge receiving portion) 8 constituting the imprint apparatus 1 is located below the head standby position of the inkjet head 7 and is periodically arranged at the head standby position for the purpose of maintaining the ejection performance of the inkjet head 7. For example, a container having a bottom is provided with an opening of a desired shape. In addition, a porous body may be provided at the bottom of such a bottomed container, thereby improving the acceptability of liquid droplets. The porous body is not particularly limited as long as it is made of a material that does not dissolve or deteriorate due to the components of the liquid droplets, such as a known inorganic or organic porous body or cloth.

(Exhaust part 10)
Further, the exhaust unit 10 constituting the imprint apparatus 1 removes volatile components and mist from the resin droplets ejected from the inkjet head 7, so that the mold 101, the base material 111, and the constituent members of the imprint apparatus 1 are removed. This prevents unnecessary adhesion to the surface. In the present invention, the mist means a liquid droplet that originates from an ink jet head and drifts in the apparatus unintentionally. The droplets constituting such mist are droplets that have been intentionally ejected from the inkjet head, but have not landed on the intended predetermined position on the substrate, mold, ink receiving member, etc. Unintentionally generated liquid, such as small liquid droplets (generally called satellites) that are formed later, or liquid droplets that are generated when the liquid accumulated on the nozzle surface of the inkjet head is shaken off by the operation of the inkjet head Contains drops.

  Next, the operation of the present embodiment having such a configuration, that is, the control method of the imprint apparatus by the control unit 12 will be described with reference to FIGS. 2 and 3A to 3D.

(Mold loading and alignment)
First, the mold 101 is carried into the chamber 1A by a mold conveyance unit (not shown), and the mold 101 is held by the mold holding unit 2 in the chamber 1A and aligned with a predetermined position of the mold holding unit 2.

  During this time, that is, during the loading and positioning of the mold 101, the inkjet head 7 of the droplet supply unit 6 moves in the y direction in FIG. 1 and reaches the head standby position. At this time, the substrate holding portion 4 moves in the x direction, and the ink receiving member 8 comes below the ink jet head 7 at the head standby position.

  Next, resin is discharged into the ink receiving member 8 from the inkjet head 7 in the head standby position, and in this way, resin dummy discharge is performed. Such a dummy discharge of resin is performed at regular intervals. Thus, by performing dummy discharge before carrying in the substrate 111 described later, the inkjet head 7 can be maintained in a good state in a state where the substrate 11 is not contaminated by the volatile component of resin or mist.

(PC board loading and alignment)
Next, in the substrate transfer path 3 provided adjacent to the chamber 1A, the substrate 111 is loaded by the transfer robot 5, and the substrate 111 transferred by the transfer robot 5 is transferred from the substrate transfer section 1B into the chamber 1A. .

  The substrate 111 carried into the chamber 1 </ b> A is then held by the substrate holding unit 4 and aligned with a predetermined position of the substrate holding unit 4.

  During this time, after the mold 101 is held and aligned in the mold holding unit 2 in the chamber 1A, before the substrate 111 is carried into the chamber 1A, the resin is discharged from the inkjet head 7 in the head standby position into the ink receiving member 8. In this way, resin dummy discharge is performed. Such dummy discharge is always performed for a certain time. Further, by performing dummy ejection immediately before the substrate 111 is carried in, the time interval until the actual ejection operation of the inkjet head 7 can be shortened, and ejection can be performed from the inkjet head 7 at substantially the same interval. By being able to discharge at the same interval, the position accuracy of the resin application and the volume of one drop are stabilized. Thus, while maintaining the inkjet head 7 in a good state, the actual discharge operation can be executed smoothly.

  Both of the above-described resin dummy discharge performed during the loading and positioning of the mold 101 and the resin dummy discharging performed between the holding and positioning of the mold 101 and the loading of the substrate 111 are both inkjet heads 7. By performing such dummy discharge, the resin can be smoothly discharged from the inkjet head 7 to the substrate 111 as will be described later.

(Resin dispensing process)
In the resin discharge process, the photocurable resin is transferred from the inkjet head 7 of the droplet supply unit 6 to a desired region on the substrate 111 for imprint held by the substrate holding member 4 at the droplet supply position. A droplet 51 is discharged and supplied (FIG. 3A).

  By the way, the base material 111 used in the present embodiment can be appropriately selected. For example, glass such as quartz, soda lime glass, borosilicate glass, semiconductor such as silicon, gallium arsenide, gallium nitride, polycarbonate, polypropylene, polyethylene, etc. Such a resin substrate, a metal substrate, or a composite material substrate made of any combination of these materials may be used. Further, for example, a desired pattern structure such as a fine wiring used in a semiconductor or a display, a photonic crystal structure, an optical waveguide, or an optical structure such as holography may be formed.

  In addition, the photocurable resin is generally composed of a main agent, an initiator, and a crosslinking agent, and if necessary, in order to improve the adhesion to the mold release agent and the base material for suppressing adhesion to the mold. Contains an adhesive. There is no restriction | limiting in particular in the photocurable resin used by this invention, According to the use of the pattern structure manufactured by imprint from a well-known photocurable resin, a required characteristic, a physical property, etc., it can select suitably. it can. For example, if the use of the pattern structure is a lithography application, it is required that the etching resistance and viscosity are low and the remaining film thickness is small. If the use of the pattern structure is an optical member, a specific refractive index and light transmittance are required. Is required, and a photocurable resin can be appropriately selected according to these requirements. However, in any application, it is required to have characteristics (viscosity, surface tension, etc.) satisfying the compatibility with the ink jet head to be used. Note that the viscosity, surface tension, and the like of a compatible liquid differ depending on the structure and material of the inkjet head. For this reason, it is possible to appropriately adjust the viscosity, surface tension, etc. of the photocurable resin, or to select an ink jet head suitable for the photocurable resin to be used.

  The number of droplets 51 of the photocurable resin supplied from the inkjet head 7 of the droplet supply unit 6 onto the substrate 111, the distance between adjacent droplets, the drop amount of each droplet, and the required photocuring It can be set as appropriate based on the total amount of the curable resin, the wettability of the photocurable resin with respect to the base material, the gap between the mold 101 and the base material 111 in the subsequent contact step.

  In the imprint method of the present invention using the imprint apparatus 1 of the present invention, the exhaust operation in the chamber 1 </ b> A can be performed by operating the exhaust pump of the exhaust unit 10.

  Thereby, it is possible to prevent volatile components and mist from resin droplets discharged from the inkjet head 7 at the droplet supply position onto the substrate 111 from diffusing in the direction of the transfer position and adhering to the mold 101 or the like. .

(Transfer process)
Next, in the transfer step, the base material holding unit 4 is moved from the droplet supply position to the transfer position, and the mold holding unit 2 and the base material holding unit 4 are brought close to each other so that the mold 101 and the base material 111 having a concavo-convex structure are provided. The resin droplets 51 are spread between the mold 101 and the base material 111 to form a photocurable resin layer 52 (FIG. 3B).

  In the illustrated example, the mold 101 has a mesa structure having a convex structure portion, and the concavo-convex structure region 102 is located at the convex structure portion. Although the material of such a mold 101 can be selected as appropriate, it can be formed using a transparent base material that can transmit irradiation light for curing the photocurable resin layer. For example, quartz glass, silica System glass, calcium fluoride, magnesium fluoride, acrylic glass, etc., or any laminated material thereof can be used. The thickness of the mold 101 can be set in consideration of the shape of the concavo-convex structure, material strength, handling suitability, and the like, and can be set as appropriate within a range of about 300 μm to 10 mm, for example. The mold 101 may not have a mesa structure.

  In the imprint method of the present invention using the imprint apparatus 1 of the present invention, in this transfer step, the ink jet head 7 of the droplet supply unit 6 moves from the droplet supply position to the head standby position and moves to the ink receiving member 8. A standby state is taken above. In this transfer step, the exhaust operation in the chamber 1A can be performed by operating the exhaust pump of the exhaust unit 10.

  Next, light irradiation is performed from the mold 101 side, and the photocurable resin layer 52 is cured to form a transfer resin layer 55 to which the uneven structure of the mold 101 is transferred (FIG. 3C). In this curing step, if the substrate 111 is a material that transmits light, light irradiation may be performed from the substrate 111 side, or light irradiation may be performed from both sides of the substrate 111 and the mold 101.

  Even during the curing, the exhaust operation in the chamber 1A can be performed.

  Next, the transfer resin layer 55 and the mold 101 are separated from each other, so that the pattern structure 61 that is the transfer resin layer 55 is positioned on the substrate 111 (FIG. 3D).

  Also in this peeling step, the exhaust operation in the chamber 1A can be performed.

(Unloading the board)
Next, the substrate 111 held on the substrate holding unit 4 in the chamber 1A is unloaded from the chamber 4 to the substrate transfer path 3 side by the transfer robot 5 via the substrate transfer unit 1B.

(Mold neutralization)
By the way, in the peeling process of the transfer resin layer 55 on the substrate 111 and the mold 101, the mold 101 side may be charged by static electricity. When static electricity is charged in the mold 101 as described above, the mold 101 needs to be neutralized by the neutralization device 11 in the chamber 1A. And by such static elimination of the mold 101, it is prevented that a foreign material is attracted to the mold 101.

  Such a static elimination device 11 is, for example, a soft X-ray ionizer. Specifically, the static elimination device 11 ionizes gas molecules in the chamber 1A by irradiating soft X-rays (low energy X-rays), and eliminates static electricity. There may be. When a soft X-ray ionizer is used, dust generation does not occur and stable static elimination performance can be obtained.

  In the step of neutralizing, it is preferable to operate the static eliminator for a predetermined time after the peeling step or during the peeling until the mold is neutralized.

  The state in which the mold 101 is neutralized is a state in which the electrostatic potential on the mold 101 side is close to a grounded state to the extent that foreign matter is not attracted, and is generally +50 volts or less and −50 volts or more. desirable. The time until the mold is neutralized may be determined by, for example, an electrostatic potential measuring device of the mold installed in the chamber 1A, and may be determined in advance.

(Dummy discharge timing)
During this time, dummy discharge of resin discharged from the inkjet head 7 to the ink receiving member 8 is performed consistently from loading and positioning of the substrate to resin discharge and transfer to the substrate, transfer, transfer of the substrate and discharge of the mold. (Dummy discharge is refrained.)

  In this way, since the substrate 111 is carried into the chamber 1A and positioned, and the substrate 111 is unloaded and the mold 101 is discharged, the resin is not discharged in a consistent manner. For example, into the chamber 1A. Resin volatile components and mist accompanying dummy discharge do not adhere to the substrate 111 that has been carried in and aligned. For this reason, for example, the wetness and spread of the resin at the site where the volatile component locally adheres is different from the resin at the other site, or the amount of resin that has been appropriately managed due to the mist adhering The film thickness distribution does not occur, the resin filling into the concave pattern intended by the mold 101 is not hindered, or the separation between the mold 101 and the transfer resin layer 55 is affected, and a pattern defect does not occur.

  Furthermore, since no dummy discharge is performed until the mold 101 is discharged, even if the mold 101 is charged when the mold 101 and the transfer resin layer 55 are peeled off, no foreign matter is attracted to the mold 101. .

  That is, it is considered that the mold 101 after the peeling from the transfer resin layer 55 and before discharging is charged. However, before discharging the mold 101, dummy discharge from the inkjet head 7 is refrained, so that the inkjet head 7. The foreign matter generated by the operation of each part when operating the mold is attracted to the mold 101, and the foreign matter does not adhere to the mold 101.

  For this reason, there is no problem that foreign matter is caught in the second and subsequent imprints, and a highly accurate pattern structure can be formed using this mold 101.

  In the above embodiment, the example has been described in which the discharge of the mold 101 is performed after the unloading process of the substrate 111 and the dummy discharge is not performed from the loading of the substrate 111 to the discharge of the mold 101. The process may be performed before the unloading process of the substrate 111. Further, the charge removal step of the mold 101 is not necessarily performed. In this case, the dummy discharge is refrained until the substrate 111 unloading process.

  Although an example in which dummy discharge is not performed between the loading of the substrate 111 and the mold neutralization process has been shown, dummy discharge is not performed at least after the transfer process until either the substrate unloading process or the mold neutralization process. By avoiding this, at least the problem of attracting and adhering foreign matter to the mold 101 can be solved.

  By the way, as described above, the substrate holding portion 4 is movable along the x direction, and the ink receiving member 8 is installed on the substrate holding portion 4 (see FIG. 1).

  For this reason, the substrate 111 and the ink receiving member 8 on the substrate holding part 4 move together in the chamber 1A. Thus, by moving the substrate 111 and the ink receiving member 8 together, it is possible to reduce the movable parts of the apparatus and prevent the generation of foreign matters or the like.

  On the other hand, when the substrate 111 and the ink receiving member 8 are moved together, the base material 111 is in the vicinity of the ink receiving member 8, so that it is conceivable that volatile components and mist of the resin accompanying dummy ejection adhere.

  On the other hand, according to the present invention, it is possible to prevent the volatile components and mist of the resin accompanying the dummy discharge from adhering to the substrate 111 by refraining the dummy discharge until the unloading process of the substrate 111.

  Further, by refraining the dummy discharge until the substrate 111 unloading process is completed and the mold neutralization process is completed, it is possible to prevent the resin volatile components and mist accompanying the dummy discharge from adhering to the substrate 111, In addition, the volatile components and mist of these resins can be prevented from being attracted to the mold 101 and attached to the mold.

  Furthermore, in the above embodiment, an example in which the mold 101 is neutralized by using the static eliminator 11 has been described. However, the present invention is not limited to this, and the mold 101 may be neutralized by natural discharge without using the static eliminator 11. . In the case of natural discharge, after the mold and the substrate are peeled off by performing the imprinting operation, the mold and the substrate may be kept waiting for a certain time in the state after peeling, or the substrate may be carried out during the natural discharge of the mold. good. The time until the mold is neutralized may be determined by, for example, installing a mold electrostatic potential measuring device in the chamber 1A and measuring the electrostatic potential, or the time for the discharge to reach a predetermined value. You may make a prediction and decide in advance.

DESCRIPTION OF SYMBOLS 1 Imprint apparatus 1A Chamber 1B Substrate delivery part 2 Mold holding part 3 Substrate conveyance path 4 Base material holding part 5 Conveyance robot 6 Droplet supply part 7 Ink jet head 8 Ink receiving member 10 Exhaust part 11 Static elimination apparatus 12 Control part 101 Mold 111 Base material

Claims (10)

A mold holding unit, a substrate holding unit, a droplet supply unit having an inkjet head, a dummy discharge receiving unit, a mold holding unit, a substrate holding unit, a droplet supply unit, and a dummy discharge receiving unit are accommodated. In the control method of the imprint apparatus including the chamber and the control unit,
Carrying the mold into the chamber, and holding and aligning the mold by the mold holding unit; and
Carrying the substrate into the chamber and holding and aligning the substrate by the substrate holding unit;
Discharging the resin from the inkjet head onto the substrate;
Pressing the mold against the resin on the substrate to transfer a pattern to the resin;
And unloading the substrate from the chamber,
Before carrying the substrate into the chamber, performing a dummy discharge to discharge resin from the inkjet head to the dummy discharge receiving portion,
A control method for an imprint apparatus, wherein dummy discharge is refrained from at least after a pattern is transferred to the resin until the substrate is unloaded from the chamber. A mold holding unit, a substrate holding unit, a droplet supply unit having an inkjet head, a dummy discharge receiving unit, a mold holding unit, a substrate holding unit, a droplet supply unit, and a dummy discharge receiving unit are accommodated. In the control method of the imprint apparatus including the chamber and the control unit,
Carrying the mold into the chamber, and holding and aligning the mold by the mold holding unit; and
Carrying the substrate into the chamber and holding and aligning the substrate by the substrate holding unit;
Discharging the resin from the inkjet head onto the substrate;
Pressing the mold against the resin on the substrate to transfer a pattern to the resin;
Unloading the substrate from the chamber;
A step of removing electricity from the mold,
Before carrying the substrate into the chamber, performing a dummy discharge to discharge resin from the inkjet head to the dummy discharge receiving portion,
A control method for an imprint apparatus, wherein dummy discharge is refrained from at least after a pattern is transferred to the resin until charge is removed from the mold.   The dummy discharge for discharging the resin from the inkjet head to the dummy discharge receiving portion is performed after the mold is held and aligned and before the substrate is carried into the chamber. 3. A method for controlling an imprint apparatus according to 2.   4. The control method for an imprint apparatus according to claim 3, wherein dummy discharge for discharging resin from the inkjet head to the dummy discharge receiving portion is performed during or before holding and aligning the mold. .   5. The dummy discharge is refrained while the pattern is transferred to the resin after the substrate is carried into the chamber and held and aligned by the substrate holder. A control method for an imprint apparatus as described above. A mold holder,
A substrate holder,
A droplet supply unit having an inkjet head;
A dummy discharge receiver,
A chamber for storing these mold holding part, substrate holding part, droplet supply part, and dummy discharge receiving part;
In an imprint apparatus comprising a control unit,
The controller is
Carrying the mold into the chamber, and holding and aligning the mold by the mold holding unit; and
Carrying the substrate into the chamber and holding and aligning the substrate by the substrate holding unit;
Discharging the resin from the inkjet head onto the substrate;
Pressing the mold against the resin on the substrate to transfer a pattern to the resin;
And unloading the substrate from the chamber,
Before carrying the substrate into the chamber, performing a dummy discharge to discharge resin from the inkjet head to the dummy discharge receiving portion,
An imprint apparatus for executing a control method, characterized in that dummy discharge is refrained from at least after a pattern is transferred to the resin until the substrate is unloaded from the chamber. A mold holder,
A substrate holder,
A droplet supply unit having an inkjet head;
A dummy discharge receiver,
A static eliminator,
A chamber for storing the mold holding unit, the substrate holding unit, the droplet supply unit, the dummy discharge receiving unit, and the static eliminator;
In an imprint apparatus comprising a control unit,
The controller is
Carrying the mold into the chamber, and holding and aligning the mold by the mold holding unit; and
Carrying the substrate into the chamber and holding and aligning the substrate by the substrate holding unit;
Discharging the resin from the inkjet head onto the substrate;
Pressing the mold against the resin on the substrate to transfer a pattern to the resin;
Unloading the substrate from the chamber;
A step of removing electricity from the static eliminator with respect to the mold,
Before carrying the substrate into the chamber, performing a dummy discharge to discharge resin from the inkjet head to the dummy discharge receiving portion,
An imprint apparatus for executing a control method, characterized in that dummy discharge is refrained from at least after a pattern is transferred to the resin until charge is removed from the mold.   The dummy discharge for discharging resin from the inkjet head to the dummy discharge receiving portion is performed after the mold is held and aligned and before the substrate is carried into the chamber. 8. The imprint apparatus according to 7.   9. The imprint apparatus according to claim 8, wherein dummy discharge is performed to discharge resin from the ink-jet head to the dummy discharge receiving portion before or during alignment while holding the mold.   10. A dummy discharge is refrained while a pattern is transferred to the resin after a substrate is carried into the chamber, the substrate is held and aligned by the substrate holder. Or an imprint apparatus.

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