JP2016074884A - Photocurable resin composition and optical film using the same - Google Patents
Photocurable resin composition and optical film using the same Download PDFInfo
- Publication number
- JP2016074884A JP2016074884A JP2015182727A JP2015182727A JP2016074884A JP 2016074884 A JP2016074884 A JP 2016074884A JP 2015182727 A JP2015182727 A JP 2015182727A JP 2015182727 A JP2015182727 A JP 2015182727A JP 2016074884 A JP2016074884 A JP 2016074884A
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- JP
- Japan
- Prior art keywords
- film
- component
- acrylate
- resin composition
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 title claims abstract description 36
- 239000012788 optical film Substances 0.000 title claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 35
- 239000000178 monomer Substances 0.000 claims abstract description 32
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 29
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims abstract description 19
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 17
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims abstract description 12
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000007787 solid Substances 0.000 claims abstract description 8
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical group NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 claims abstract description 8
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical group NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 109
- 150000001875 compounds Chemical class 0.000 claims description 15
- 150000003242 quaternary ammonium salts Chemical group 0.000 claims description 13
- 229920001940 conductive polymer Polymers 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 6
- 150000004706 metal oxides Chemical class 0.000 claims description 6
- 239000010419 fine particle Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 abstract description 29
- 229920005989 resin Polymers 0.000 abstract description 29
- -1 isocyanate compound Chemical class 0.000 abstract description 17
- 239000012948 isocyanate Substances 0.000 abstract description 9
- 239000004925 Acrylic resin Substances 0.000 description 22
- 229920000178 Acrylic resin Polymers 0.000 description 22
- 238000006243 chemical reaction Methods 0.000 description 20
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 18
- 230000015572 biosynthetic process Effects 0.000 description 17
- 238000003786 synthesis reaction Methods 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 15
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- 239000002585 base Substances 0.000 description 11
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 10
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
- 238000001816 cooling Methods 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 238000001723 curing Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000002985 plastic film Substances 0.000 description 7
- 229920006255 plastic film Polymers 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000011787 zinc oxide Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000004645 polyester resin Substances 0.000 description 6
- 229920001225 polyester resin Polymers 0.000 description 6
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000005058 Isophorone diisocyanate Substances 0.000 description 5
- 229910052787 antimony Inorganic materials 0.000 description 5
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 5
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 5
- 229910001887 tin oxide Inorganic materials 0.000 description 5
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical compound C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- WHNPOQXWAMXPTA-UHFFFAOYSA-N 3-methylbut-2-enamide Chemical compound CC(C)=CC(N)=O WHNPOQXWAMXPTA-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 3
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 150000002596 lactones Chemical group 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000013638 trimer Substances 0.000 description 3
- 229960000834 vinyl ether Drugs 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- GNWBLLYJQXKPIP-ZOGIJGBBSA-N (1s,3as,3bs,5ar,9ar,9bs,11as)-n,n-diethyl-6,9a,11a-trimethyl-7-oxo-2,3,3a,3b,4,5,5a,8,9,9b,10,11-dodecahydro-1h-indeno[5,4-f]quinoline-1-carboxamide Chemical compound CN([C@@H]1CC2)C(=O)CC[C@]1(C)[C@@H]1[C@@H]2[C@@H]2CC[C@H](C(=O)N(CC)CC)[C@@]2(C)CC1 GNWBLLYJQXKPIP-ZOGIJGBBSA-N 0.000 description 2
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- GCYHRYNSUGLLMA-UHFFFAOYSA-N 2-prop-2-enoxyethanol Chemical compound OCCOCC=C GCYHRYNSUGLLMA-UHFFFAOYSA-N 0.000 description 2
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 2
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- YNXCGLKMOXLBOD-UHFFFAOYSA-N oxolan-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCCO1 YNXCGLKMOXLBOD-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 238000011002 quantification Methods 0.000 description 2
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- KCZQSKKNAGZQSZ-UHFFFAOYSA-N 1,3,5-tris(6-isocyanatohexyl)-1,3,5-triazin-2,4,6-trione Chemical compound O=C=NCCCCCCN1C(=O)N(CCCCCCN=C=O)C(=O)N(CCCCCCN=C=O)C1=O KCZQSKKNAGZQSZ-UHFFFAOYSA-N 0.000 description 1
- 239000005968 1-Decanol Substances 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- 229940054273 1-propoxy-2-propanol Drugs 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- WULAHPYSGCVQHM-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethanol Chemical compound OCCOCCOC=C WULAHPYSGCVQHM-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XRBWKWGATZNBFW-UHFFFAOYSA-N 2-[2-(2-ethenoxyethoxy)ethoxy]ethanol Chemical compound OCCOCCOCCOC=C XRBWKWGATZNBFW-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- GXLJBLOTDUSSRR-UHFFFAOYSA-N 2-[bis(2-ethenoxyethyl)amino]ethanol Chemical compound C=COCCN(CCO)CCOC=C GXLJBLOTDUSSRR-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- WGKZYJXRTIPTCV-UHFFFAOYSA-N 2-butoxypropan-1-ol Chemical compound CCCCOC(C)CO WGKZYJXRTIPTCV-UHFFFAOYSA-N 0.000 description 1
- 125000001340 2-chloroethyl group Chemical group [H]C([H])(Cl)C([H])([H])* 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 229940093475 2-ethoxyethanol Drugs 0.000 description 1
- DEDUBNVYPMOFDR-UHFFFAOYSA-N 2-ethoxypropan-1-ol Chemical compound CCOC(C)CO DEDUBNVYPMOFDR-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- YTTFFPATQICAQN-UHFFFAOYSA-N 2-methoxypropan-1-ol Chemical compound COC(C)CO YTTFFPATQICAQN-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RKOOOVKGLHCLTP-UHFFFAOYSA-N 2-methylprop-2-enoic acid;propane-1,2,3-triol Chemical compound CC(=C)C(O)=O.OCC(O)CO RKOOOVKGLHCLTP-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- LOJHHQNEBFCTQK-UHFFFAOYSA-N 2-phenoxypropan-1-ol Chemical compound OCC(C)OC1=CC=CC=C1 LOJHHQNEBFCTQK-UHFFFAOYSA-N 0.000 description 1
- CUZKCNWZBXLAJX-UHFFFAOYSA-N 2-phenylmethoxyethanol Chemical compound OCCOCC1=CC=CC=C1 CUZKCNWZBXLAJX-UHFFFAOYSA-N 0.000 description 1
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 description 1
- 229940023741 2-propoxy-1-propanol Drugs 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- PSKIVCBTSGNKBB-UHFFFAOYSA-N 2-propoxypropan-1-ol Chemical compound CCCOC(C)CO PSKIVCBTSGNKBB-UHFFFAOYSA-N 0.000 description 1
- XHMWPVBQGARKQM-UHFFFAOYSA-N 3-ethoxy-1-propanol Chemical compound CCOCCCO XHMWPVBQGARKQM-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- JDFDHBSESGTDAL-UHFFFAOYSA-N 3-methoxypropan-1-ol Chemical compound COCCCO JDFDHBSESGTDAL-UHFFFAOYSA-N 0.000 description 1
- FYRWKWGEFZTOQI-UHFFFAOYSA-N 3-prop-2-enoxy-2,2-bis(prop-2-enoxymethyl)propan-1-ol Chemical compound C=CCOCC(CO)(COCC=C)COCC=C FYRWKWGEFZTOQI-UHFFFAOYSA-N 0.000 description 1
- QRUOTIJTSNETKW-UHFFFAOYSA-N 4-ethoxybutan-1-ol Chemical compound CCOCCCCO QRUOTIJTSNETKW-UHFFFAOYSA-N 0.000 description 1
- KOVAQMSVARJMPH-UHFFFAOYSA-N 4-methoxybutan-1-ol Chemical compound COCCCCO KOVAQMSVARJMPH-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 102100040409 Ameloblastin Human genes 0.000 description 1
- 101001074560 Arabidopsis thaliana Aquaporin PIP1-2 Proteins 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- XVZXOLOFWKSDSR-UHFFFAOYSA-N Cc1cc(C)c([C]=O)c(C)c1 Chemical group Cc1cc(C)c([C]=O)c(C)c1 XVZXOLOFWKSDSR-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 101000891247 Homo sapiens Ameloblastin Proteins 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- JQRRFDWXQOQICD-UHFFFAOYSA-N biphenylen-1-ylboronic acid Chemical compound C12=CC=CC=C2C2=C1C=CC=C2B(O)O JQRRFDWXQOQICD-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- BMFYCFSWWDXEPB-UHFFFAOYSA-N cyclohexyl(phenyl)methanone Chemical compound C=1C=CC=CC=1C(=O)C1CCCCC1 BMFYCFSWWDXEPB-UHFFFAOYSA-N 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920006130 high-performance polyamide Polymers 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 150000003949 imides Chemical group 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 229960004592 isopropanol Drugs 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- RQAKESSLMFZVMC-UHFFFAOYSA-N n-ethenylacetamide Chemical compound CC(=O)NC=C RQAKESSLMFZVMC-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920003050 poly-cycloolefin Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- DAQRWPVESCTUEK-UHFFFAOYSA-N prop-1-ene prop-2-enoic acid Chemical group C(C=C)(=O)O.C=CC.C=CC DAQRWPVESCTUEK-UHFFFAOYSA-N 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 150000003839 salts Chemical group 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- RRHXZLALVWBDKH-UHFFFAOYSA-M trimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]azanium;chloride Chemical compound [Cl-].CC(=C)C(=O)OCC[N+](C)(C)C RRHXZLALVWBDKH-UHFFFAOYSA-M 0.000 description 1
- PLCFYBDYBCOLSP-UHFFFAOYSA-N tris(prop-2-enyl) 2-hydroxypropane-1,2,3-tricarboxylate Chemical compound C=CCOC(=O)CC(O)(CC(=O)OCC=C)C(=O)OCC=C PLCFYBDYBCOLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Surface Treatment Of Optical Elements (AREA)
- Polymerisation Methods In General (AREA)
- Polyurethanes Or Polyureas (AREA)
- Paints Or Removers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
本発明は、光硬化型樹脂組成物及びこれを用いた光学用フィルムに関する。 The present invention relates to a photocurable resin composition and an optical film using the same.
従来、液晶表示装置に用いられる偏光板は、ポリビニルアルコールフィルムにヨウ素などを吸着させ延伸等により配向させた偏光子の両面に保護フィルムとしてトリアセチルセルロースフィルム(TACフィルム)を貼りあわせ、さらにその表面には、透明な光硬化型樹脂組成物を塗布、硬化させて高硬度の被膜(ハードコート層)が形成され、傷つきなどから保護されている。このような硬化被膜を形成させる材料として、たとえば、ハードコート層を形成する材料として、多官能ウレタン(メタ)アクリレートなどを用いた活性エネルギー線硬化型の樹脂組成物が知られている(特許文献1)。 Conventionally, a polarizing plate used in a liquid crystal display device is obtained by attaching a triacetyl cellulose film (TAC film) as a protective film on both surfaces of a polarizer obtained by adsorbing iodine or the like on a polyvinyl alcohol film and orienting it by stretching or the like. A transparent photocurable resin composition is applied and cured to form a hard film (hard coat layer), which is protected from scratches and the like. As a material for forming such a cured film, for example, an active energy ray-curable resin composition using polyfunctional urethane (meth) acrylate or the like is known as a material for forming a hard coat layer (Patent Document). 1).
近年、液晶装置の大型化や高品質化およびモバイル用途の拡大からより厳しい使用環境(例えば、高温、高湿条件など)に耐えるものが求められ、TACフィルムは特性面において限界があることが明らかになった。そのような中で、保護フィルムの材質について種々の検討がなされ、TACフィルムからPET(ポリエチレンテレフタレート)フィルム、アクリル樹脂系フィルム等への代替が検討されている状況にある。しかしながら、これらのフィルムは、TACフィルムに比べるとフィルムとハードコート層間の密着性が劣るという問題があった。 In recent years, liquid crystal devices are required to withstand severer use environments (for example, high temperature and high humidity conditions) due to the increase in size and quality of liquid crystal devices and the expansion of mobile applications, and it is clear that TAC films have limitations in terms of characteristics. Became. Under such circumstances, various studies have been made on the material of the protective film, and alternatives from a TAC film to a PET (polyethylene terephthalate) film, an acrylic resin film, and the like are being studied. However, these films have a problem that the adhesion between the film and the hard coat layer is inferior to that of the TAC film.
このような問題に対し、例えば、特許文献2には基材フィルムにコロナ放電処理・酸化処理等の物理的な処理のほか、アンカー剤又はプライマーと呼ばれる塗料の塗布を行った後、ハードコート層を形成することで、基材フィルムとハードコート層との密着性の向上を図ることが開示されている(特許文献2)。しかしながら、特許文献2に記載の方法では、ハードコートフィルムの製造に必要な工程が増えるため、生産性に欠けるものであった。 To deal with such problems, for example, Patent Document 2 discloses that the base film is subjected to physical treatment such as corona discharge treatment and oxidation treatment, and after applying a coating called an anchor agent or primer, It is disclosed that the adhesion between the base film and the hard coat layer is improved by forming (Patent Document 2). However, the method described in Patent Document 2 lacks productivity because the number of steps necessary for the production of the hard coat film is increased.
一方、一般に高分子材料やガラスからなる基材は、絶縁特性に優れている一方で帯電しやすいため、これらの基材を偏向板用保護フィルムとして用いた精密機械等には、埃等が付着して汚れたり、誤作動したりする問題がある。そのため、当該基材の表面には、(メタ)アクリロイル基を複数有するポリ(メタ)アクリレート化合物等の活性エネルギー線硬化型樹脂に各種帯電防止剤を配合してなる活性エネルギー線硬化型樹脂組成物を塗布し、帯電防止性の硬化皮膜(ハードコート層)が設けられている。 On the other hand, base materials made of polymer materials or glass generally have excellent insulating properties but are easily charged. Therefore, dust or the like adheres to precision machines using these base materials as protective films for deflecting plates. As a result, it may become dirty or malfunction. Therefore, an active energy ray-curable resin composition obtained by blending various antistatic agents with an active energy ray-curable resin such as a poly (meth) acrylate compound having a plurality of (meth) acryloyl groups on the surface of the base material. And an antistatic cured film (hard coat layer) is provided.
このような問題に対し、例えば、本出願人は特許文献3において、四級アンモニウム塩構造含有共重合体に水酸基末端のラクトン鎖と脂環系アルキルエステル鎖をグラフトさせたものが、活性エネルギー線硬化型樹脂との相溶性に優れており、かつ硬化皮膜に優れた帯電防止性を付与できることを提案している。しかし、上述したPETフィルムやアクリル樹脂系フィルムに対して帯電防止性及び密着性について十分とはいえず、これらのフィルムに対する高い密着性と優れた帯電防止性の両立が可能な樹脂組成物は未だ開発されていない。 In order to deal with such a problem, for example, in the case of Patent Document 3, the applicant of the present invention has grafted a hydroxyl group-terminated lactone chain and an alicyclic alkyl ester chain on a quaternary ammonium salt structure-containing copolymer. It has been proposed that it has excellent compatibility with the curable resin and can impart excellent antistatic properties to the cured film. However, it cannot be said that the antistatic property and adhesiveness are sufficient with respect to the above-described PET film and acrylic resin-based film, and a resin composition capable of achieving both high adhesiveness and excellent antistatic property with respect to these films is still available. Not developed.
本発明は、様々な樹脂フィルムに対して、優れた密着性及び帯電防止性を有する光硬化型樹脂組成物を提供することである。特に難接着性の樹脂フィルムに対して高い密着性を有する光硬化性樹脂組成物を提供することである。 This invention is providing the photocurable resin composition which has the outstanding adhesiveness and antistatic property with respect to various resin films. It is providing the photocurable resin composition which has high adhesiveness especially with respect to a resin film of difficult adhesion.
本発明者は、前記課題を解決すべく鋭意検討したところ、水酸基を有さない重合性不飽和基含有モノマー、特定のウレタンアクリレート、導電性材料を含む樹脂組成物を用いることにより、前記課題を解決することができることを見出し、本発明を完成させた。 As a result of intensive studies to solve the above problems, the present inventor has obtained the above problems by using a resin composition containing a polymerizable unsaturated group-containing monomer having no hydroxyl group, a specific urethane acrylate, and a conductive material. The inventors have found that the problem can be solved and completed the present invention.
すなわち、本発明は、下記項1〜項4に示す光硬化型樹脂組成物及びこれを用いた光学フィルムである。 That is, this invention is the photocurable resin composition shown to the following items 1 to 4, and an optical film using the same.
項1. 水酸基を有さない重合性不飽和基含有モノマー(A)、ウレタンアクリレート(B)、導電性材料(C)を含み、該水酸基を有さない重合性不飽和基含有モノマー(A)は、溶解度パラメータが9〜13(cal/cm3)1/2、重量平均分子量が350以下、25℃での粘度が30mPa・s以下であり、該ウレタンアクリレート(B)が、分子中に1つの水酸基を有する重合性不飽和基含有モノマー(b1)と分子中にイソシアネート基を有しイソシアヌレート環構造、ビウレット構造及びアロファネート構造から選ばれる少なくとも1つの構造を有するイソシアネート化合物(b2)を反応させて得られるものであり、重量平均分子量が500以上、アクリロイル基当量140〜400g/eqであり、水酸基を有さない重合性不飽和基含有モノマー(A):ウレタンアクリレート(B):導電性材料(C)の固形重量部比が10〜70:10〜70:0.2〜25である光硬化型樹脂組成物である。 Item 1. The polymerizable unsaturated group-containing monomer (A) containing a polymerizable unsaturated group-containing monomer (A) having no hydroxyl group, urethane acrylate (B), and conductive material (C) and having no hydroxyl group has a solubility. The parameter is 9 to 13 (cal / cm 3 ) 1/2 , the weight average molecular weight is 350 or less, the viscosity at 25 ° C. is 30 mPa · s or less, and the urethane acrylate (B) has one hydroxyl group in the molecule. It is obtained by reacting a polymerizable unsaturated group-containing monomer (b1) having an isocyanate compound (b2) having an isocyanate group in the molecule and at least one structure selected from an isocyanurate ring structure, a biuret structure and an allophanate structure. It has a weight average molecular weight of 500 or more, an acryloyl group equivalent of 140 to 400 g / eq, and has no hydroxyl group. It is a photocurable resin composition whose solid weight part ratio of a saturated group containing monomer (A): urethane acrylate (B): conductive material (C) is 10-70: 10-70: 0.2-25.
項2. 導電性材料(C)が、4級アンモニウム塩構造を含む化合物、導電性高分子及び金属酸化物微粒子の少なくともいずれか1種を含む前記項1記載の光硬化型樹脂組成物である。 Item 2. Item 2. The photocurable resin composition according to Item 1, wherein the conductive material (C) includes at least one of a compound containing a quaternary ammonium salt structure, a conductive polymer, and metal oxide fine particles.
項3. フィルムの少なくとも片面に本発明1又は2の光硬化型樹脂組成物の硬化被膜が形成された前記項1または2記載の光学用フィルムである。 Item 3. Item 3. The optical film according to Item 1 or 2, wherein a cured film of the photocurable resin composition of the present invention 1 or 2 is formed on at least one surface of the film.
項4. 硬化皮膜表面における表面抵抗値が、1.0×1012Ω/□以下である前記項3記載の光学用フィルムである。 Item 4. Item 4. The optical film according to Item 3, wherein the surface resistance value on the surface of the cured film is 1.0 × 10 12 Ω / □ or less.
本発明によれば、様々な樹脂フィルムに対して、使用する溶剤の種類が限定されず、優れた密着性及び帯電防止性を有する樹脂組成物を提供することができる。特に、難接着性のアクリル系樹脂フィルムやポリエステル系樹脂フィルムに対しても優れた密着性を有することから保護フィルムとして、光学部品用途や、フラットパネルディスプレイ等のディスプレイ用途に好適に使用することができる。 According to this invention, the kind of solvent to be used is not limited with respect to various resin films, and a resin composition having excellent adhesion and antistatic properties can be provided. In particular, since it has excellent adhesion to difficult-to-adhere acrylic resin films and polyester resin films, it can be suitably used as a protective film for display applications such as optical parts and flat panel displays. it can.
本発明の光硬化型樹脂組成物は、水酸基を有さない重合性不飽和基含有モノマー(A)、ウレタンアクリレート(B)、導電材料(C)を含むものである。 The photocurable resin composition of the present invention comprises a polymerizable unsaturated group-containing monomer (A) having no hydroxyl group, urethane acrylate (B), and conductive material (C).
[水酸基を有さない重合性不飽和基含有モノマー(A)]
上記水酸基を有さない重合性不飽和基含有モノマー(A)(以下、「(A)成分」ともいう。)は、後述する条件を満たす水酸基を有さない重合性不飽和モノマーであれば特に限定されず、具体的には、N−ビニルホルムアミド、ジメチル(メタ)アクリルアミド、ジエチル(メタ)アクリルアミド、メチルメタクリレート、エチル(メタ)クリレート、N−ビニルアセトアミド、N−ビニルピロリドン、(メタ)アクリル酸、テトラヒドロフルフリル(メタ)アクリレート、4−アクリロイルモルホリン、ベンジルアクリレート、1−4ブタンジオールジ(メタ)アクリレート等のアルキルジオール類のアクリル、酸付加物、テトラエチレングリコールジ(メタ)アクリレート等のエチレンングリコール類のアクリル酸付加物、ジプロピレングリコールジ(メタ)アクリレート等のプロピレングリコール類のアクリル酸付加物などが挙げられる。また、(A)成分としては、これらの1種または2種以上の化合物を併用してもよい。水酸基を有する重合性不飽和モノマーを用いると、表面抵抗値が高くなる。好ましくは、分子量と溶解パラメータのバランスに優れ、少量でも密着性が上がり、表面抵抗値が出る点で、N−ビニルホルムアミド等、ジメチルアクリルアミド等のビニルアミド系、アクリルアミド系のモノマーである。
[Polymerically unsaturated group-containing monomer having no hydroxyl group (A)]
The polymerizable unsaturated group-containing monomer (A) having no hydroxyl group (hereinafter also referred to as “component (A)”) is particularly a polymerizable unsaturated monomer having no hydroxyl group that satisfies the conditions described later. Specifically, N-vinylformamide, dimethyl (meth) acrylamide, diethyl (meth) acrylamide, methyl methacrylate, ethyl (meth) acrylate, N-vinylacetamide, N-vinylpyrrolidone, (meth) acrylic acid , Acrylics of alkyl diols such as tetrahydrofurfuryl (meth) acrylate, 4-acryloylmorpholine, benzyl acrylate, 1-4 butanediol di (meth) acrylate, acid addition products, ethylene such as tetraethylene glycol di (meth) acrylate Dipropylene, an acrylic acid adduct of glycols Such as glycol di (meth) acrylate of propylene glycol adduct of such acrylate. Moreover, as (A) component, you may use together these 1 type, or 2 or more types of compounds. When a polymerizable unsaturated monomer having a hydroxyl group is used, the surface resistance value is increased. Preferred are vinylamide-based and acrylamide-based monomers such as N-vinylformamide, dimethylacrylamide, and the like because they are excellent in the balance between molecular weight and solubility parameter, increase adhesion even in a small amount, and give a surface resistance value.
上記(A)成分の溶解度パラメータは、9〜13(cal/cm3)1/2、分子量が350以下、25℃での粘度が30mPa・s以下である。溶解パラメータが9(cal/cm3)1/2未満の場合、または13(cal/cm3)1/2を超えると、基材との極性差が大きくなりすぎ、塗れ性が劣るため密着性が劣る結果となる。この範囲のSP値を有していても、水酸基を有する重合性不飽和基モノマーを用いた場合は、表面抵抗値が高くなる。好ましくは9〜12(cal/cm3)1/2である。 The solubility parameter of the component (A) is 9 to 13 (cal / cm 3 ) 1/2 , the molecular weight is 350 or less, and the viscosity at 25 ° C. is 30 mPa · s or less. When the solubility parameter is less than 9 (cal / cm 3 ) 1/2 or more than 13 (cal / cm 3 ) 1/2 , the polarity difference from the base material becomes too large, and the paintability is inferior, resulting in poor adhesion. Results in inferior. Even when the SP value is in this range, the surface resistance value is increased when a polymerizable unsaturated group monomer having a hydroxyl group is used. Preferably it is 9-12 (cal / cm < 3 >) <1/2 >.
上記(A)の溶解度パラメーターδ(SP値)はFedorsの算出法である下記の数式1に基づき算出した。下記の数式は、非特許文献「山本秀樹著、SP値基礎・応用と計算方法、情報機構、p.66−67」による。
上記(A)成分の粘度は、30mPa・sを超えるとこれも基材への浸透能力が低くなり、密着性が劣る。(A)成分の粘度は25℃に設定されたE型粘度計を用いて測定した。好ましくは、25mPa・s以下である。 When the viscosity of the component (A) exceeds 30 mPa · s, this also lowers the ability to penetrate the substrate, resulting in poor adhesion. The viscosity of component (A) was measured using an E-type viscometer set at 25 ° C. Preferably, it is 25 mPa · s or less.
上記(A)成分の分子量は、350以下である。分子量が350を超えると分子が大きく基材への浸透能力が低くなり、結果として密着性が劣る。好ましくは、70〜350である。(A)成分の分子量はその分子構造より算出した理論分子量を用いた。 The molecular weight of the component (A) is 350 or less. When the molecular weight exceeds 350, the molecules are large and the ability to penetrate the substrate is lowered, resulting in poor adhesion. Preferably, it is 70-350. As the molecular weight of component (A), the theoretical molecular weight calculated from the molecular structure was used.
上記(A)成分は、下記要件(1)を満たす樹脂系フィルムを満たすものを用いることが好ましい。
要件(1):樹脂系フィルムは、測定試料200mgあたりの120℃における揮発性分量が100ppm以下であって、厚み125μmの樹脂系フィルムを測定試料としてメチルブチルケトン溶液中に常温で1分間浸漬した場合において、浸漬前に対する浸漬後のフィルムの表面ヘイズの上昇値が0.5以下である。
The component (A) preferably uses a resin film that satisfies the following requirement (1).
Requirement (1): The resin film has a volatile content at 120 ° C. per 200 mg of a measurement sample of 100 ppm or less, and a resin film having a thickness of 125 μm is immersed in a methyl butyl ketone solution at room temperature for 1 minute. In some cases, the increase in the surface haze of the film after immersion relative to that before immersion is 0.5 or less.
上記要件(1)におけるメチルブチルケトン溶液とは、それぞれ溶媒等の他の成分を含まない純粋溶液を意味する。また、「測定試料として」とは、樹脂系フィルムの表面ヘイズの上昇値を測定するための条件であることを明確にしたものであり、本発明の実施態様が厚み125μmの樹脂系フィルムに限定されるものではない。 The methyl butyl ketone solution in the above requirement (1) means a pure solution that does not contain other components such as a solvent. Further, “as a measurement sample” is a clarification that it is a condition for measuring an increase in the surface haze of a resin film, and the embodiment of the present invention is limited to a resin film having a thickness of 125 μm. Is not to be done.
要件(1)は、本発明の光硬化型樹脂組成物の用途、すなわち硬化被膜形成の対象となる樹脂系フィルムの樹脂特性を特定したものである。 Requirement (1) specifies the application of the photocurable resin composition of the present invention, that is, the resin characteristics of a resin-based film that is a target for forming a cured film.
要件(1)で規定する、測定試料200mgあたりの120℃における揮発成分量が100ppm以下とは、樹脂系フィルムの溶剤等による浸食を受けにくさ(耐浸食性)を表わす。通常、一般的な樹脂系フィルムの前記揮発成分量は100ppmを超える。かかる樹脂系フィルムであれば、公知の光硬化型樹脂組成物により比較的容易に硬化被膜の形成が可能であるのに対し、100ppm以下の樹脂系フィルムは、その表面に密着性の高い硬化被膜の形成が困難である。 The amount of volatile components at 120 ° C. per 200 mg of the measurement sample defined in the requirement (1) indicates that the resin film is not easily eroded by a solvent or the like (erosion resistance). Usually, the amount of the volatile component of a general resin film exceeds 100 ppm. With such a resin film, a cured film can be formed relatively easily with a known photocurable resin composition, whereas a resin film with 100 ppm or less is a cured film with high adhesion to the surface. Is difficult to form.
要件(1)における樹脂フィルムの種類としては、後述するアクリル樹脂系フィルムの他、ポリエステル樹脂系フィルム、シクロオレフィンコポリマー樹脂系フィルム、ポリイミド樹脂系フィルム、ポリカーボネート系樹脂フィルム、ナイロン系樹脂フィルム、ポリエーテル系樹脂フィルム等が挙げられる。 As a kind of the resin film in the requirement (1), in addition to the acrylic resin film described later, polyester resin film, cycloolefin copolymer resin film, polyimide resin film, polycarbonate resin film, nylon resin film, polyether Based resin films and the like.
上記アクリル樹脂としては、具体的には、(メタ)アクリル酸、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸n−プロピル、(メタ)アクリル酸n−ブチル、(メタ)アクリル酸tert−ブチル、(メタ)アクリル酸n−ヘキシル、(メタ)アクリル酸2−クロロエチル、(メタ)アクリル酸2−ヒドロキシエチル、(メタ)アクリル酸3−ヒドロキシプロピル、(メタ)アクリル酸2,3,4,5,6−ペンタヒドロキシエキシルおよび(メタ)アクリル酸2,3,4,5−テトラヒドロキシペンチルなどの(メタ)アクリレートの1種または2種以上をモノマー成分とし、これらを重合反応させて得られるものである。さらに、前記アクリル樹脂は、ラクトン環構造、N−フェニルマレイミド等のマレイミド類、無水マレイン酸類、無水グルタル酸等をアクリル樹脂中の分子鎖に導入して耐熱性を向上させたものや架橋性モノマー等の使用により高架橋構造を導入し、耐熱性および形状安定性を向上させたものや、2種以上のアクリル樹脂の混合物としたものであってもよい。これらは、アクリル樹脂系フィルムまたはその原料であるアクリル樹脂の例示であり、本発明においては、前記要件(1)を満たす限り、原料となるアクリル樹脂をこれらに限定するものではない。さらに、アクリル樹脂系フィルムは、特開平10−244629号公報に記載のアクリル樹脂系フィルムにさらに3次元架橋したアクリル樹脂層が形成されたものも含まれる。 Specific examples of the acrylic resin include (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, ( Tert-butyl (meth) acrylate, n-hexyl (meth) acrylate, 2-chloroethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, (meth) acryl One or more of (meth) acrylates such as acid 2,3,4,5,6-pentahydroxyexyl and (meth) acrylate 2,3,4,5-tetrahydroxypentyl are used as monomer components, These are obtained by polymerization reaction. Further, the acrylic resin may be one having a lactone ring structure, maleimides such as N-phenylmaleimide, maleic anhydride, glutaric anhydride, etc. introduced into the molecular chain in the acrylic resin to improve heat resistance or a crosslinkable monomer. For example, a highly cross-linked structure may be introduced to improve heat resistance and shape stability, or a mixture of two or more acrylic resins may be used. These are exemplifications of an acrylic resin film or an acrylic resin that is a raw material thereof, and in the present invention, the acrylic resin that is a raw material is not limited to these as long as the requirement (1) is satisfied. Furthermore, the acrylic resin film includes those in which an acrylic resin layer further three-dimensionally crosslinked is formed on the acrylic resin film described in JP-A-10-244629.
上記揮発成分量の測定は、ガスクロマトグラフ質量分析法による全揮発成分の定量値である。また、表面ヘイズの上昇値におけるヘイズの測定は、JIS K7136に基づく測定値である。 The measurement of the amount of volatile components is a quantitative value of all volatile components by gas chromatography mass spectrometry. Moreover, the measurement of the haze in the increase value of surface haze is a measured value based on JISK7136.
要件(1)で規定する表面ヘイズの上昇値が0.5以下であるとは、メチルブチルケトン溶液による浸透を受けにくく、外観変化が実質的に生じない樹脂系フィルムであり、例えば、液晶表示装置に組み込まれる偏光板の保護フィルムをはじめ、位相差フィルム、集光シート、拡散フィルム、導光板、光反射シートなどの光学フィルムに好適に使用されているものである。通常、樹脂系フィルムは、種々のモノマー組成や構造のもの、各種ポリマーブレンドの樹脂を原料としてフィルム状に成形加工されたものが多数あり、それらの特性は様々である。要件(1)を満たす樹脂系フィルムは、通常、汎用品として知られる樹脂系フィルムに比べ、高分子量化、高架橋化された樹脂を原料に成形され、強靭で耐熱性や熱履歴等による形状安定性に優れる反面、有機溶剤に侵されにくく、それゆえ密着性が低い(難密着性)という特色がある。 An increase in surface haze specified by requirement (1) is 0.5 or less is a resin-based film that is less susceptible to penetration by a methylbutylketone solution and does not substantially change its appearance. It is suitably used for optical films such as a protective film for a polarizing plate incorporated in an apparatus, a retardation film, a light collecting sheet, a diffusion film, a light guide plate, and a light reflecting sheet. In general, many resin-based films have various monomer compositions and structures, and many are formed and processed into films using resins of various polymer blends as raw materials, and their characteristics are various. Resin-based films that satisfy requirement (1) are usually molded from high-molecular-weight, highly-crosslinked resins as compared to resin-based films known as general-purpose products, and are tough and stable in shape due to heat resistance, thermal history, etc. Although it has excellent properties, it is difficult to be attacked by an organic solvent, and therefore has low adhesion (hard adhesion).
[ウレタンアクリレート(B)]
本発明で用いるウレタンアクリレート(B)(以下、「(B)成分」ともいう。)は、分子中に1つの水酸基を有する重合性不飽和基含有モノマー(b1)(以下、「(b1)成分」ともいう。)と分子中にイソシアネート基を有しイソシアヌレート環構造、ビウレット構造及びアロファネート構造から選ばれる少なくとも1つの構造を有するイソシアネート化合物(b2)(以下、「(b2)成分」ともいう。)を反応させて得られるものであり、重量平均分子量が500以上、アクリロイル基当量140〜400g/eqである。以下、上記(b1)成分と(b2)成分を反応させて得られるウレタンアクリレートについてさらに説明する。
[Urethane acrylate (B)]
The urethane acrylate (B) used in the present invention (hereinafter also referred to as “component (B)”) is a polymerizable unsaturated group-containing monomer (b1) having one hydroxyl group in the molecule (hereinafter referred to as “component (b1)”. And an isocyanate compound (b2) (hereinafter also referred to as “component (b2)”) having an isocyanate group in the molecule and having at least one structure selected from an isocyanurate ring structure, a biuret structure and an allophanate structure. ) Having a weight average molecular weight of 500 or more and an acryloyl group equivalent of 140 to 400 g / eq. Hereinafter, the urethane acrylate obtained by reacting the component (b1) and the component (b2) will be further described.
上記(b1)成分としては、分子中に1つの水酸基を有する重合性不飽和基含有モノマーであれば公知のものを使用することができる。これにより、得られる光硬化型樹脂組成物の帯電防止性を優れたものとすることができ、基材に対して高い密着性を有するものとすることができる。分子中に2つ以上水酸基を有する重合性不飽和基含有モノマーを用いた場合は、他の樹脂成分との相溶性を保持する事が困難となる。 As the component (b1), known monomers can be used as long as they are polymerizable unsaturated group-containing monomers having one hydroxyl group in the molecule. Thereby, the antistatic property of the obtained photocurable resin composition can be made excellent, and it can have high adhesiveness with respect to a base material. When a polymerizable unsaturated group-containing monomer having two or more hydroxyl groups in the molecule is used, it becomes difficult to maintain compatibility with other resin components.
上記(b1)成分としては、分子中に1つの水酸基と重合性不飽和基を少なくとも1つ有するものであれば公知のものを使用することができる。具体的には、(メタ)アクリロイル基を1つ有する化合物として、例えば、モノヒドロキシモノ(メタ)アクリレート〔2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート等〕、モノヒドロキシモノビニルエーテル〔2−(ビニルオキシ)エタノール、ジエチレングリコールモノビニルエーテル、トリエチレングリコールモノビニルエーテル等〕、モノヒドロキシモノアリルエーテル〔2−(アリルオキシ)エタノール等〕などが挙げられる。(b1)成分としては、これらの1種または2種以上の化合物を併用してもよい。 As the component (b1), known compounds can be used as long as they have at least one hydroxyl group and polymerizable unsaturated group in the molecule. Specifically, as a compound having one (meth) acryloyl group, for example, monohydroxy mono (meth) acrylate [2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, etc.], monohydroxy mono And vinyl ether [2- (vinyloxy) ethanol, diethylene glycol monovinyl ether, triethylene glycol monovinyl ether, etc.], monohydroxy monoallyl ether [2- (allyloxy) ethanol, etc.] and the like. As the component (b1), one or more of these compounds may be used in combination.
上記分子中に1つの水酸基と2つの重合性不飽和基を有する化合物として、例えば、モノヒドロキシジ(メタ)アクリレート〔グリセロールジ(メタ)アクリレート等〕、モノヒドロキシジビニルエーテル〔トリメチロールプロパンジビニルエーテル、トリエタノールアミンジビニルエーテル等〕、モノヒドロキシジアリルエーテル〔トリメチロールプロパンジアリルエーテル、ジアリルグリセリン等〕などが挙げられる。 Examples of the compound having one hydroxyl group and two polymerizable unsaturated groups in the molecule include monohydroxy di (meth) acrylate [glycerol di (meth) acrylate and the like], monohydroxy divinyl ether [trimethylolpropane divinyl ether, Triethanolamine divinyl ether, etc.), monohydroxy diallyl ether [trimethylolpropane diallyl ether, diallyl glycerol, etc.] and the like.
上記分子中に1つの水酸基と3つ以上の重合性不飽和基を有する化合物として、モノヒドロキシポリ(メタ)アクリレート〔ペンタエリスリトールトリ(メタ)アクリレート、ジペンタエリトリトールペンタ(メタ)アクリレート等〕、モノヒドロキシポリアリルエーテル〔ペンタエリスリトールトリアリルエーテル、クエン酸トリアリル等〕、等が挙げられる。 Monohydroxy poly (meth) acrylate [pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, etc.], monohydroxypoly (meth) acrylate, etc. as a compound having one hydroxyl group and three or more polymerizable unsaturated groups in the molecule. Hydroxy polyallyl ether [pentaerythritol triallyl ether, triallyl citrate, etc.] and the like.
上記(b2)成分は、分子中にイソシアネート基を有し、イソシアヌレート環構造、ビウレット構造及びアロファネート構造から選ばれる少なくとも1つの構造を有するイソシアネート化合物である。これらの構造のものを使用することにより、硬化時に生じる収縮が小さくなるため、得られる硬化被膜に高硬度で高い密着性を付与することができる。また、(b2)成分としては、上記化合物の1種のみを使用しても良いし、2種以上を併用してもよい。 The component (b2) is an isocyanate compound having an isocyanate group in the molecule and having at least one structure selected from an isocyanurate ring structure, a biuret structure, and an allophanate structure. By using a thing of these structures, since the shrinkage which arises at the time of hardening becomes small, it can give high adhesiveness with high hardness to the hardened film obtained. Moreover, as a (b2) component, only 1 type of the said compound may be used, and 2 or more types may be used together.
上記(b2)成分に含まれるイソシアヌレート環構造を有するイソシアネート化合物としては、イソホロンジイソシアネートの3量体(イソシアヌレート体)、1,6−ヘキサメチレンジイソシアネートの3量体(イソシアヌレート体)、水添キシリレンジイソシアネートの3量体(イソシアヌレート体)、または上記3量体の反応物等が挙げられる。 Examples of the isocyanate compound having an isocyanurate ring structure contained in the component (b2) include isophorone diisocyanate trimer (isocyanurate), 1,6-hexamethylene diisocyanate trimer (isocyanurate), and hydrogenation. A trimer of xylylene diisocyanate (isocyanurate), a reaction product of the trimer, or the like can be given.
上記アロファネート構造を有するイソシアネート化合物としては、イソホロンジイソシアネートのアダクト体、1,6−ヘキサメチレンジイソシアネートのアダクト体等が挙げられる。 Examples of the isocyanate compound having an allophanate structure include an adduct body of isophorone diisocyanate and an adduct body of 1,6-hexamethylene diisocyanate.
上記ビウレット構造を有するイソシアネート化合物としては、1,6−ヘキサメチレンジイソシアネートの反応物等が挙げられる。 Examples of the isocyanate compound having the biuret structure include a reaction product of 1,6-hexamethylene diisocyanate.
上記(B)成分の合成方法としては、公知の方法を採用すればよく、例えば、(b1)成分と(b2)成分を、無溶剤または、トルエンなどの非アルコール系有機溶媒中、トリエチレンジアミン、1,8−ジアザビシクロ−[5,4,0]−ウンデセン−7、オクチル酸第一スズ、ジオクチル酸鉛などより選ばれる触媒存在下で、通常、反応温度60〜90℃程度で反応させればよい。 As a method for synthesizing the component (B), a known method may be employed. For example, the component (b1) and the component (b2) may be mixed with a triethylenediamine, a non-alcohol organic solvent such as toluene, In the presence of a catalyst selected from 1,8-diazabicyclo- [5,4,0] -undecene-7, stannous octylate, lead dioctylate and the like, the reaction is usually performed at a reaction temperature of about 60 to 90 ° C. Good.
上記(b1)成分と(b2)成分の使用割合としては、特に限定されないが、(b1)成分の水酸基/(b2)成分のイソシアネート基のモル比が1.0〜1.25程度、好ましくは1.0〜1.15程度の範囲であることが好ましい。前記モル比が1.0未満では、最終的に得られる(B)成分中に、未反応イソシアネート基が残存することになり、得られる組成物が、経時で増粘、ゲル化等安定性が悪くなる傾向がある。また前記モル比が1.25を超える場合は、未反応(b1)成分が残存することになり、得られる(B)成分の含有比率が低下し、十分な塗膜強度や密着性が得られないなどの問題がある。 The use ratio of the component (b1) and the component (b2) is not particularly limited, but the molar ratio of the hydroxyl group of the component (b1) / the isocyanate group of the component (b2) is about 1.0 to 1.25, preferably A range of about 1.0 to 1.15 is preferable. When the molar ratio is less than 1.0, unreacted isocyanate groups remain in the finally obtained component (B), and the resulting composition has increased stability over time, such as thickening and gelation. Tend to get worse. Moreover, when the said molar ratio exceeds 1.25, an unreacted (b1) component will remain, the content rate of the obtained (B) component will fall, and sufficient coating-film intensity | strength and adhesiveness will be obtained. There is no problem.
残存イソシアネート基の定量は、例えばJIS K1556に準拠して、水酸基当量数の定量は、例えばJIS K1557に準拠して測定することができる。 The quantification of the residual isocyanate group can be measured according to, for example, JIS K1556, and the quantification of the number of hydroxyl equivalents can be measured, for example, according to JIS K1557.
本発明で用いる(B)成分は、重量平均分子量が500以上、(メタ)アクリロイル基当量が140〜400g/eqであることを特徴とする。ここで、重量平均分子量とは、ゲルパーメーションクロマトグラフ法によるポリスチレン換算値である。重量平均分子量と(メタ)アクリロイル基当量をかかる数値の範囲内とすることにより、硬化時に生じる収縮が少なく、得られる硬化皮膜の硬度(鉛筆硬度)に優れており、保護フィルムとして求められる物理的強度などの強靭性や、長期にわたる密着性を確保するなど光学用フィルムとしての基本特性を確保することができる。同様の観点から、重量平均分子量は500〜30,000であることが好ましい。 The component (B) used in the present invention has a weight average molecular weight of 500 or more and a (meth) acryloyl group equivalent of 140 to 400 g / eq. Here, the weight average molecular weight is a polystyrene-converted value obtained by gel permeation chromatography. By making the weight average molecular weight and (meth) acryloyl group equivalent within the range of such values, there is little shrinkage that occurs during curing, and the resulting cured film has excellent hardness (pencil hardness), which is a physical film required as a protective film Basic properties as an optical film such as toughness such as strength and long-term adhesion can be ensured. From the same viewpoint, the weight average molecular weight is preferably 500 to 30,000.
上記(メタ)アクリロイル基当量が140g/eq未満の場合は、硬化時に生じる硬化収縮により密着性が低下する傾向となり、400g/eqを超えると得られる硬化皮膜の硬度(鉛筆硬度)が不十分となるためいずれも使用に適さない。同様の観点から、(メタ)アクリロイル基当量は140〜400g/eqであることが好ましい。 When the (meth) acryloyl group equivalent is less than 140 g / eq, the adhesion tends to decrease due to curing shrinkage that occurs at the time of curing, and when the hardness exceeds 400 g / eq, the hardness (pencil hardness) of the cured film obtained is insufficient. Neither is suitable for use. From the same viewpoint, the (meth) acryloyl group equivalent is preferably 140 to 400 g / eq.
[導電性材料(C)]
本発明で用いる導電性材料(C)(以下、「(C)成分」ともいう。)としては、電気抵抗値が107Ω・cm以下の材料であれば、特に限定されず、カーボンブラック・金属・金属酸化物・金属化合物の微粒子(導電性フィラー)、4級アンモニウム塩構造を含む化合物、導電性高分子、イオン性液体等が挙げられる。これらの中でも帯電防止性の経時安定性の点で、4級アンモニウム塩構造を含む化合物、導電性高分子及びカーボンブラック・金属酸化物の微粒子のいずれか1種が好ましい。透明性の観点から特に好ましくは、4級アンモニウム塩構造を含む化合物と導電性高分子である。
[Conductive material (C)]
The conductive material (C) (hereinafter, also referred to as “component (C)”) used in the present invention is not particularly limited as long as it is a material having an electric resistance value of 10 7 Ω · cm or less. Examples thereof include fine particles of metal, metal oxide, and metal compound (conductive filler), a compound containing a quaternary ammonium salt structure, a conductive polymer, and an ionic liquid. Among these, one of a compound containing a quaternary ammonium salt structure, a conductive polymer, and carbon black / metal oxide fine particles is preferred from the viewpoint of antistatic properties with time. Particularly preferred from the viewpoint of transparency are a compound containing a quaternary ammonium salt structure and a conductive polymer.
上記4級アンモニウム塩構造を含む化合物としては、例えば4級アンモニウム塩構造と重合性不飽和基を分子内に併せ持つ重合性モノマーや、上記4級アンモニウム塩構造と重合性不飽和基を併せ持つモノマーと他の重合性不飽和基を有するモノマーの共重合物、4級アンモニウム塩構造を分子内に含む多価アルコールの有機イソシアネートとの反応物を含むウレタン化合物等が挙げられる。他成分との相溶性、帯電防止性の安定性の点で4級アンモニウム塩構造と重合性不飽和基を併せ持つモノマーと他の重合性不飽和基を有するモノマーの共重合物である事が好ましい。 Examples of the compound containing the quaternary ammonium salt structure include a polymerizable monomer having a quaternary ammonium salt structure and a polymerizable unsaturated group in the molecule, and a monomer having both the quaternary ammonium salt structure and a polymerizable unsaturated group. Examples thereof include copolymers of monomers having other polymerizable unsaturated groups and urethane compounds containing a reaction product of a polyhydric alcohol containing a quaternary ammonium salt structure in the molecule with an organic isocyanate. A copolymer of a monomer having both a quaternary ammonium salt structure and a polymerizable unsaturated group and another monomer having a polymerizable unsaturated group is preferable in view of compatibility with other components and antistatic properties. .
上記導電性高分子としては、例えば、ポリ(3,4−エチレンジオキシチオフェン)(以下、PEDOTという場合がある。)、ポリアセチレン、ポリアニリン、ポリピロールおよびこれらの誘導体のドーピング処理を施したもの等が挙げられる。他成分との相溶性、帯電防止性の点で好ましくは、ポリスチレンスルホン酸でドープされたPEDOT(以下、PEDOT/PSSという場合がある。)である。 Examples of the conductive polymer include poly (3,4-ethylenedioxythiophene) (hereinafter sometimes referred to as PEDOT), polyacetylene, polyaniline, polypyrrole, and derivatives of these derivatives. Can be mentioned. PEDOT doped with polystyrene sulfonic acid (hereinafter sometimes referred to as PEDOT / PSS) is preferable from the viewpoint of compatibility with other components and antistatic properties.
金属酸化物微粒子としては、例えば、酸化錫・酸化インジウム・酸化錫含有酸化インジウム(ITO)・アンチモン含有酸化錫(ATO)、リン含有酸化錫(PTO)、酸化セリウム、酸化亜鉛、アルミニウム含有酸化亜鉛、アンチモン含有酸化亜鉛、インジウム含有酸化亜鉛等が挙げられる。透明性、帯電防止性の点で好ましくはリン含有酸化錫(PTO)、アンチモン含有酸化亜鉛である。 Examples of the metal oxide fine particles include tin oxide, indium oxide, tin oxide-containing indium oxide (ITO), antimony-containing tin oxide (ATO), phosphorus-containing tin oxide (PTO), cerium oxide, zinc oxide, and aluminum-containing zinc oxide. Antimony-containing zinc oxide, indium-containing zinc oxide and the like. In terms of transparency and antistatic properties, phosphorus-containing tin oxide (PTO) and antimony-containing zinc oxide are preferred.
本発明の活性エネルギー線硬化性樹脂組成物は、(A)〜(C)成分を含有するものである。
(A)〜(C)成分の使用割合は、密着性の確保および硬化皮膜の強度の観点から、上記(A)成分:(B)成分:(C)成分の固形重量部比が10〜70:10〜70:0.2〜25である。好ましくは、20〜60:10〜60:0.2〜20である。より好ましくは、30〜60:15〜60:0.3〜20である。
The active energy ray-curable resin composition of the present invention contains the components (A) to (C).
From the viewpoint of ensuring adhesion and strength of the cured film, the ratio of the components (A) to (C) used is such that the solid part by weight ratio of the above component (A): component (B): component (C) is 10-70. : 10-70: 0.2-25. Preferably, it is 20-60: 10-60: 0.2-20. More preferably, it is 30-60: 15-60: 0.3-20.
本発明の光硬化性樹脂組成物は、上記(A)〜(C)成分に加え、さらに光増感剤、酸化防止剤、光安定剤、レベリング剤、顔料等の各種公知の添加剤および光重合開始剤(D)などを含有させてもよい。 In addition to the components (A) to (C), the photocurable resin composition of the present invention further includes various known additives such as photosensitizers, antioxidants, light stabilizers, leveling agents, pigments, and light. A polymerization initiator (D) or the like may be contained.
本発明の光硬化性樹脂組成物の製造方法は、特に限定されず、上記(A)、(B)及び(C)成分を混合することにより製造することができる。各成分の混合順は特に限定されず、例えば、高粘度の(B)成分を(A)成分で希釈して減粘した後に、(C)成分を加える方法が挙げられる。金属酸化物や導電高分子の分散液を配合する際は、粒子の凝集・沈降を防ぐため好ましくは常温化で極性の近いものから混合すると良い。また、必要に応じて、溶剤も混合することができる。 The manufacturing method of the photocurable resin composition of this invention is not specifically limited, It can manufacture by mixing the said (A), (B) and (C) component. The order of mixing the components is not particularly limited, and examples thereof include a method of adding the component (C) after diluting the highly viscous component (B) with the component (A) to reduce the viscosity. When blending a dispersion of a metal oxide or a conductive polymer, it is preferable to mix them from those having a polarity at room temperature in order to prevent aggregation and sedimentation of the particles. Moreover, a solvent can also be mixed as needed.
上記溶剤としては、特に限定されず、アルコール系溶剤、グリコール系溶剤、及びケトン系溶剤等が挙げられる。 The solvent is not particularly limited, and examples thereof include alcohol solvents, glycol solvents, and ketone solvents.
上記アルコール系溶剤としては、メタノール、エタノール、1−プロパノール、2−プロパノール、1−ブタノール、2−ブタノール、ターシャリーブタノール、1−ヘキサノール、1−オクタノール、2−エチル−ヘキサノール、1−ノナノール、1−デカノール、ベンジルアルコール、ジアセトンアルコール、エチレングリコール、1,3−ブタンジオール、1,4−ブタンジオール、1,6−ヘキサンジオール、グリセリン等、及びその混合溶剤が挙げられる。 Examples of the alcohol solvent include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, tertiary butanol, 1-hexanol, 1-octanol, 2-ethyl-hexanol, 1-nonanol, 1 -Decanol, benzyl alcohol, diacetone alcohol, ethylene glycol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, glycerin, and the like, and mixed solvents thereof.
上記グリコール系溶剤としては、2−メトキシエタノール、2−エトキシエタノール、2−プロピオキシエタノール、2−イソプロポキシエタノール、2−ブトキシエタノール、2−フェノキシエタノール、2−(ベンジルオキシ)エタノール、2−アリルオキシエタノール、3−メトキシプロパノール、3−エトキシプロパノール、4−メトキシブタノール、4−エトキシブタノール、2−(2−メトキシエトキシ)エタノール、1−メトキシ−2−プロパノール、2−メトキシ−1−プロパノール、1−エトキシ−2−プロパノール、2−エトキシ−1−プロパノール、1−プロポキシ−2−プロパノール、2−プロポキシ−1−プロパノール、1−ブトキシ−2−プロパノール、2−ブトキシ−1−プロパノール、1−フェノキシ−2−プロパノール、2−フェノキシ−1−プロパノールが挙げられる。 Examples of the glycol solvent include 2-methoxyethanol, 2-ethoxyethanol, 2-propoxyethanol, 2-isopropoxyethanol, 2-butoxyethanol, 2-phenoxyethanol, 2- (benzyloxy) ethanol, 2-allyloxy Ethanol, 3-methoxypropanol, 3-ethoxypropanol, 4-methoxybutanol, 4-ethoxybutanol, 2- (2-methoxyethoxy) ethanol, 1-methoxy-2-propanol, 2-methoxy-1-propanol, 1- Ethoxy-2-propanol, 2-ethoxy-1-propanol, 1-propoxy-2-propanol, 2-propoxy-1-propanol, 1-butoxy-2-propanol, 2-butoxy-1-propanol, 1-phenoxy- 2 Propanol, 2-phenoxy-1-propanol.
上記ケトン系溶剤としては、アセトン、メチルエチルケトン(MEK)、メチルイソブチルケトン(MIBK)、ジエチルケトン、ジイソブチルケトン、シクロヘキサノン等が挙げられる。 Examples of the ketone solvent include acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), diethyl ketone, diisobutyl ketone, and cyclohexanone.
[光重合開始剤(D)]
光重合開始剤(D)(以下、(D)成分という)としては、特に限定されず公知のものを用いることができる。具体的には、例えば、1−ヒドロキシ−シクロヘキシル−フェニルケトン、2,2−ジメトキシ−1,2−ジフェニルエタン−1−オン、1−シクロヘキシルフェニルケトン、2−ヒドロキシ−2−メチル−1−フェニル−プロパン−1−オン、1−[4−(2−ヒドロキシエトキシ)−フェニル]−2−ヒドロキシ−2−メチル−1−プロパン−1−オン、2−メチル−1−[4−(メチルチオ)フェニル]−2−モルフォリノプロパン−1−オン、2−ベンジル−2−ジメチルアミノ−1−(4−モルフォリノフェニル)−ブタノン−1、ビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド、2,4,6−トリメチルベンゾイル−ジフェニル−フォスフィンオキサイド、4−メチルベンゾフェノン等が挙げられる。これらは1種を単独で用いてもよく、2種以上を混合して用いてもよい。なお、(D)成分は、紫外線硬化を行なう場合に使用するが、電子線硬化をする場合には、必ずしも必要ではない。(D)成分を使用する場合の使用量は特に限定されないが、通常、(A)〜(C)成分の合計量100重量部に対し、1〜10重量部程度とすることが好ましい。
[Photoinitiator (D)]
As a photoinitiator (D) (henceforth (D) component), it does not specifically limit but a well-known thing can be used. Specifically, for example, 1-hydroxy-cyclohexyl-phenyl ketone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-cyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl -Propan-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-methyl-1- [4- (methylthio) Phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, bis (2,4,6-trimethylbenzoyl) -phenylphos Examples include fin oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and 4-methylbenzophenone. That. These may be used alone or in combination of two or more. In addition, although (D) component is used when performing ultraviolet curing, it is not necessarily required when performing electron beam curing. Although the usage-amount in the case of using (D) component is not specifically limited, Usually, it is preferable to set it as about 1-10 weight part with respect to 100 weight part of total amounts of (A)-(C) component.
本発明の光硬化型樹脂組成物は、フィルムの少なくとも片面に塗布され、乾燥後、硬化させることにより、硬化被膜が形成される。このように本発明の光硬化型樹脂組成物の硬化皮膜が形成され光学用フィルムもまた、本発明の1つである。本発明の光学用フィルムは、
難燃性のアクリル樹脂系フィルムに対して高い密着性を有しつつ・優れた帯電防止性を有することから、保護フィルムとして、光学部品用途や、フラットパネルディスプレイ等のディスプレイ用途に好適に使用できるものである。
The photocurable resin composition of the present invention is applied to at least one surface of a film, dried, and then cured to form a cured film. Thus, the cured film of the photocurable resin composition of the present invention is formed, and an optical film is also one aspect of the present invention. The optical film of the present invention is
It has high adhesion to flame retardant acrylic resin film, and has excellent antistatic properties, so it can be used as a protective film for display applications such as optical parts and flat panel displays. Is.
上記フィルムの基材としては、特に限定されず、アクリル系樹脂・ポリエステル系樹脂・ポリシクロオレフィン系樹脂・透明ポリイミド樹脂等が挙げられる。 The substrate of the film is not particularly limited, and examples thereof include acrylic resins, polyester resins, polycycloolefin resins, and transparent polyimide resins.
上記アクリル系樹脂としては、特に限定されないが、耐熱性、耐湿性、耐溶剤性、機械的硬度、成型加工性を例えばラクトン環構造やイミド環構造を導入することで強化したアクリル系樹脂が挙げられる。 The acrylic resin is not particularly limited, and examples thereof include an acrylic resin in which heat resistance, moisture resistance, solvent resistance, mechanical hardness, and molding processability are enhanced by introducing, for example, a lactone ring structure or an imide ring structure. It is done.
上記硬化皮膜表面における表面抵抗値は、帯電防止性を付与することができる点で1.0×1012Ω/□以下であることが好ましい。この場合は、本発明の光学用フィルムを用いた精密機械等において、埃等が付着して汚れたり、誤作動したりする問題がなく、好適に用いることができる。より好ましくは1.0×1011Ω/□以下である。 The surface resistance value on the surface of the cured film is preferably 1.0 × 10 12 Ω / □ or less from the viewpoint of imparting antistatic properties. In this case, in the precision machine using the optical film of the present invention, there is no problem that dust or the like adheres to it, and it can be used preferably. More preferably, it is 1.0 × 10 11 Ω / □ or less.
本発明の光硬化型樹脂組成物を用いた硬化被膜の形成方法は、通常、基材フィルムに塗工し乾燥し、活性エネルギー線を照射することにより、フィルム表面上で硬化反応を生じさせれば硬化被膜を形成させればよい。また、接着剤として使用する場合は、アクリル樹脂系フィルムに塗工し乾燥させた後、接着対象となる相手方の基材と密着させた後、活性エネルギー線を照射することにより接着層を硬化させることにより行えばよい。また、接着剤として使用する場合は、相手方の基材に塗工し乾燥させた後、基材フィルムと密着させてもよい。 The method for forming a cured film using the photocurable resin composition of the present invention is generally such that a curing reaction is caused on the film surface by coating the substrate film, drying it, and irradiating it with active energy rays. For example, a cured film may be formed. In addition, when used as an adhesive, after being applied to an acrylic resin film and dried, the adhesive layer is cured by irradiating active energy rays after being in close contact with the other substrate to be bonded. You can do that. Moreover, when using as an adhesive agent, you may make it closely_contact | adhere with a base film, after applying and drying to the other party's base material.
上記塗工方法としては、例えばバーコーター塗工、ワイヤーバー塗工、メイヤーバー塗工、エアナイフ塗工、グラビア塗工、リバースグラビア塗工、オフセット印刷、フレキソ印刷、スクリーン印刷法等が挙げられる。 Examples of the coating method include bar coater coating, wire bar coating, Mayer bar coating, air knife coating, gravure coating, reverse gravure coating, offset printing, flexographic printing, and screen printing.
上記塗工量は、特に限定されないが、通常、乾燥後の重量が0.1〜30g/m2程度、好ましくは1〜20g/m2が好ましい。 The coating amount is not particularly limited, but usually the weight after drying is about 0.1 to 30 g / m 2 , preferably 1 to 20 g / m 2 .
上記硬化反応に用いる活性エネルギー線としては、例えば紫外線や電子線が挙げられる。紫外線の光源としては、キセノンランプ、高圧水銀灯、メタルハライドランプを有する紫外線照射装置を使用できる。なお、光量や光源配置、搬送速度などは必要に応じて調整でき、例えば高圧水銀灯を使用する場合には、通常80〜160W/cm程度の光量を有するランプ1灯に対して搬送速度5〜50m/分程度で硬化させるのが好ましい。一方、電子線の場合には、通常10〜300kV程度の加速電圧を有する電子線加速装置にて、搬送速度5〜50m/分程度で硬化させるのが好ましい。 Examples of active energy rays used for the curing reaction include ultraviolet rays and electron beams. As an ultraviolet light source, an ultraviolet irradiation device having a xenon lamp, a high-pressure mercury lamp, or a metal halide lamp can be used. The light amount, light source arrangement, transport speed, etc. can be adjusted as necessary. For example, when a high-pressure mercury lamp is used, the transport speed is 5 to 50 m for one lamp having a light amount of about 80 to 160 W / cm. It is preferable to cure at about / min. On the other hand, in the case of an electron beam, it is preferable to cure at an conveyance speed of about 5 to 50 m / min with an electron beam accelerator having an acceleration voltage of about 10 to 300 kV.
以下、実施例及び比較例をあげて本発明方法を更に詳しく説明するが、本発明がこれらに限定されないことはもとよりである。なお、実施例中、部または%は重量基準である。 Hereinafter, the method of the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these. In the examples, parts or% is based on weight.
<(A)成分について>
水酸基を有さない重合性不飽和モノマーとして、N−ビニルホルムアミド、テトラヒドロフルフリルアクリレート、ベンジルアクリレート、ジメチルアクリルアミド、ステアリルアクリレート、ポリエチレングリコール(PEG#400)ジアクリレート、トリメチロールプロパントリアクリレートを用いた。
一方、水酸基を有する重合性不飽和モノマーとして、HEA(ヒドロキシエチルアクリレート、共栄社化学(株)製:ライトアクリレートHOA(N))、PETA(ペンタエリスリトールトリアクリレート、共栄社化学(株)製:ライトアクリレートPE−3A)を用いた。
<About (A) component>
As the polymerizable unsaturated monomer having no hydroxyl group, N-vinylformamide, tetrahydrofurfuryl acrylate, benzyl acrylate, dimethyl acrylamide, stearyl acrylate, polyethylene glycol (PEG # 400) diacrylate, and trimethylolpropane triacrylate were used.
On the other hand, as a polymerizable unsaturated monomer having a hydroxyl group, HEA (hydroxyethyl acrylate, manufactured by Kyoeisha Chemical Co., Ltd .: Light acrylate HOA (N)), PETA (pentaerythritol triacrylate, manufactured by Kyoeisha Chemical Co., Ltd .: Light acrylate PE) -3A) was used.
(重量平均分子量の測定)
本実施例において、重量平均分子量は、ゲルパーメーションクロマトグラフィー(東ソー(株)製、商品名「HLC−8220」、カラム:東ソー(株)製、商品名「TSKgel superHZ2000」、「TSKgel superHZM−M」)により測定した値を示す。
(Measurement of weight average molecular weight)
In this example, the weight average molecular weight was determined by gel permeation chromatography (trade name “HLC-8220” manufactured by Tosoh Corporation, column: manufactured by Tosoh Corporation, trade names “TSKgel superHZ2000”, “TSKgel superHZM-M”. The value measured by “)” is shown.
<(B)成分の合成>
合成例1
撹拌装置、冷却管、滴下ロート及び窒素導入管を備えた反応容器に、イソホロンジイソシアネートのイソシアヌレート体200部、オクチル酸スズ0.2部、PETA268部を仕込んだ後、約1時間かけて、系内の温度を約80℃に昇温した。次いで、同温度において、反応系を3時間保持した後、冷却して、ウレタンアクリレート(B−1)を得た。(B−1)成分の(メタ)アクリロイル基当量は約173g/eq、重量平均分子量は1,560であった。
<Synthesis of component (B)>
Synthesis example 1
After charging an isocyanurate body of isophorone diisocyanate 200 parts, tin octylate 0.2 parts, and PETA 268 parts into a reaction vessel equipped with a stirrer, a cooling pipe, a dropping funnel and a nitrogen introduction pipe, the system was taken over about 1 hour. The temperature inside was raised to about 80 ° C. Next, at the same temperature, the reaction system was held for 3 hours and then cooled to obtain urethane acrylate (B-1). The (meth) acryloyl group equivalent of the component (B-1) was about 173 g / eq, and the weight average molecular weight was 1,560.
合成例2
撹拌装置、冷却管、滴下ロート及び窒素導入管を備えた反応容器に、ヘキサメチレンジイソシアネートのビウレット体(以下、HDIビウレットという)200部、オクチル酸スズ0.2部、PETA334部を仕込んだ後、約1時間かけて、系内の温度を約80℃に昇温した。次いで、同温度において、反応系を3時間保持した後、冷却して、ウレタンアクリレート(B−2)を得た。(B−2)成分の(メタ)アクリロイル基当量は約155g/eq、重量平均分子量は1,400であった。
Synthesis example 2
Into a reaction vessel equipped with a stirrer, a cooling tube, a dropping funnel and a nitrogen introduction tube, 200 parts of bimure of hexamethylene diisocyanate (hereinafter referred to as HDI biuret), 0.2 part of tin octylate, and 334 parts of PETA were charged. The temperature inside the system was raised to about 80 ° C. over about 1 hour. Next, at the same temperature, the reaction system was held for 3 hours and then cooled to obtain urethane acrylate (B-2). The (meth) acryloyl group equivalent of the component (B-2) was about 155 g / eq, and the weight average molecular weight was 1,400.
合成例3
撹拌装置、冷却管、滴下ロート及び窒素導入管を備えた反応容器に、ヘキサメチレンジイソシアネートのアロファネート体(以下、HDIアロファネートという)200部、オクチル酸スズ0.2部、PETA273部を仕込んだ後、約1時間かけて、系内の温度を約80℃に昇温した。次いで、同温度において、反応系を3時間保持した後、冷却して、ウレタンアクリレート(B−3)を得た。(B−3)成分の(メタ)アクリロイル基当量は約183g/eq、重量平均分子量は1,100であった。
Synthesis example 3
In a reaction vessel equipped with a stirrer, a cooling tube, a dropping funnel and a nitrogen introduction tube, 200 parts of hexamethylene diisocyanate allophanate (hereinafter referred to as HDI allophanate), 0.2 part of tin octylate, and 273 parts of PETA were charged. The temperature inside the system was raised to about 80 ° C. over about 1 hour. Next, at the same temperature, the reaction system was held for 3 hours and then cooled to obtain urethane acrylate (B-3). The (meth) acryloyl group equivalent of the component (B-3) was about 183 g / eq, and the weight average molecular weight was 1,100.
合成例4
撹拌装置、冷却管、滴下ロート及び窒素導入管を備えた反応容器に、ヘキサメチレンジイソシアネートのイソシアヌレート体縮合物(以下、HDIイソシアネート縮合物という)200部、オクチル酸スズ0.3部、PETA458部を仕込んだ後、約1時間かけて、系内の温度を約80℃に昇温した。次いで、同温度において、反応系を3時間保持した後、冷却して、ウレタンアクリレート(B−4)を得た。(B−4)成分の(メタ)アクリロイル基当量は約146g/eq、重量平均分子量は21,000であった。
Synthesis example 4
In a reaction vessel equipped with a stirrer, a cooling tube, a dropping funnel and a nitrogen introduction tube, 200 parts of isocyanurate condensate of hexamethylene diisocyanate (hereinafter referred to as HDI isocyanate condensate), 0.3 part of tin octylate, 458 parts of PETA Then, the temperature in the system was raised to about 80 ° C. over about 1 hour. Next, at the same temperature, the reaction system was held for 3 hours and then cooled to obtain urethane acrylate (B-4). The (meth) acryloyl group equivalent of the component (B-4) was about 146 g / eq, and the weight average molecular weight was 21,000.
合成例5 (B)成分の比較合成例
撹拌装置、冷却管、滴下ロート及び窒素導入管を備えた反応容器に、HDI200部、オクチル酸スズ0.3部、PETA709部を仕込んだ後、約1時間かけて、系内の温度を約80℃に昇温した。次いで、同温度において、反応系を3時間保持した後、冷却して、ウレタンアクリレート(B−5)を得た。(B−5)成分のアクリロイル基当量は127g/eq、重量平均分子量は764であった。
Synthesis Example 5 Comparative Synthesis Example of Component (B) After charging 200 parts of HDI, 0.3 part of tin octylate and 709 parts of PETA in a reaction vessel equipped with a stirrer, a cooling tube, a dropping funnel and a nitrogen introducing tube, about 1 Over time, the temperature in the system was raised to about 80 ° C. Next, at the same temperature, the reaction system was held for 3 hours and then cooled to obtain urethane acrylate (B-5). The acryloyl group equivalent of the component (B-5) was 127 g / eq, and the weight average molecular weight was 764.
合成例6 (B)成分の比較合成例
撹拌装置、冷却管、滴下ロート及び窒素導入管を備えた反応容器に、イソホロンジイソシアネートのイソシアヌレート体200部、オクチル酸スズ0.2部、2−ヒドロキシ−3−フェノキシプロピルアクリレート(以下、HPPAという)205部を仕込んだ後、約1時間かけて、系内の温度を約80℃に昇温した。次いで、同温度において、反応系を3時間保持した後、冷却して、ウレタンアクリレート(B−6)を得た。(B−6)成分のアクリロイル基当量は約440g/eq、重量平均分子量は914であった。
Synthesis Example 6 Comparative Synthesis Example of Component (B) In a reaction vessel equipped with a stirrer, a cooling tube, a dropping funnel and a nitrogen introduction tube, 200 parts of an isocyanurate body of isophorone diisocyanate, 0.2 part of tin octylate, 2-hydroxy After charging 205 parts of -3-phenoxypropyl acrylate (hereinafter referred to as HPPA), the temperature in the system was raised to about 80 ° C. over about 1 hour. Next, at the same temperature, the reaction system was held for 3 hours and then cooled to obtain urethane acrylate (B-6). Component (B-6) had an acryloyl group equivalent of about 440 g / eq and a weight average molecular weight of 914.
合成例7 (B)成分の比較合成例
撹拌装置、冷却管、滴下ロート及び窒素導入管を備えた反応容器に、HDI200部、オクチル酸スズ0.2部、ヒドロキシエチルアクリレート(以下、HEAという)276部を仕込んだ後、約1時間かけて、系内の温度を約80℃に昇温した。次いで、同温度において、反応系を3時間保持した後、冷却して、ウレタンアクリレート(B−7)を得た。(B−7)成分のアクリロイル基当量は200g/eq、重量平均分子量は400であった。
Synthesis Example 7 Comparative Comparison Example of Component (B) In a reaction vessel equipped with a stirrer, a cooling tube, a dropping funnel and a nitrogen introducing tube, 200 parts of HDI, 0.2 part of tin octylate, hydroxyethyl acrylate (hereinafter referred to as HEA) After charging 276 parts, the temperature in the system was raised to about 80 ° C. over about 1 hour. Next, at the same temperature, the reaction system was maintained for 3 hours and then cooled to obtain urethane acrylate (B-7). The acryloyl group equivalent of the component (B-7) was 200 g / eq, and the weight average molecular weight was 400.
合成例8 (B)成分の比較合成例
撹拌装置、冷却管、滴下ロート及び窒素導入管を備えた反応容器に、イソホロンジイソシアネートのイソシアヌレート体200部、オクチル酸スズ0.1部、グリセリンモノメタクリレート(以下、GLMという)80部を仕込んだ後、系内の温度を昇温したが、途中で系全体が溶解しないゲル物となり目的の化合物は得られなかった。
Synthesis Example 8 Comparative Synthesis Example of Component (B) In a reaction vessel equipped with a stirrer, a cooling tube, a dropping funnel and a nitrogen introducing tube, 200 parts of isocyanurate of isophorone diisocyanate, 0.1 part of tin octylate, glycerin monomethacrylate After charging 80 parts (hereinafter referred to as GLM), the temperature in the system was raised, but the entire system became a gel that did not dissolve in the middle, and the target compound was not obtained.
<(C)成分の合成>
合成例9(C)成分の共重合モノマー(c−1)成分の合成例
撹拌装置、冷却管を備えた反応装置に、HEAを130部、ε−カプロラクトンを1140部、及びオクチル酸スズを1.3部加え、150℃まで昇温し、6時間保温した後に冷却することにより、重量平均分子量約5500のポリエステル構造含有単官能ビニルモノマー(「(c−1)成分」)を得た。
<Synthesis of component (C)>
Synthesis Example 9 Synthesis Example of Component (C) Copolymerization Monomer (c-1) Component In a reactor equipped with a stirrer and a condenser, 130 parts of HEA, 1140 parts of ε-caprolactone, and 1 part of tin octylate .3 parts was added, the temperature was raised to 150 ° C., the temperature was kept for 6 hours, and then cooled to obtain a polyester structure-containing monofunctional vinyl monomer (“(c-1) component”) having a weight average molecular weight of about 5500.
合成例10 (C−1)成分の合成例
撹拌装置、冷却管、滴下ロート及び窒素導入管を備えた反応容器に、四級アンモニウム塩構造を含むメタクリロイルオキシエチルトリメチルアンモニウムクロリド(以下、DMCという。)を100部、(c−1)成分を60部、tert−ブチルメタアクリレート(以下、t−BMAという。)を40部、及びプロピレングリコールモノメチルエーテル(PGM)を800部加え、90℃まで昇温した。次いで2,2´−アゾビス(メチルブチロニトリル)(AMBN)8部及びPGM 32部加え、重合反応を開始、100℃で6時間保温した後に冷却し、四級アンモニウム塩構造含有共重合体の溶液(不揮発分20%)(「(C−1)成分」)を得た。
Synthesis Example 10 Synthesis Example of Component (C-1) Methacryloyloxyethyltrimethylammonium chloride (hereinafter referred to as DMC) containing a quaternary ammonium salt structure in a reaction vessel equipped with a stirrer, a cooling tube, a dropping funnel and a nitrogen introduction tube. ) 100 parts, (c-1) component 60 parts, tert-butyl methacrylate (hereinafter referred to as t-BMA) 40 parts, and propylene glycol monomethyl ether (PGM) 800 parts. Warm up. Next, 8 parts of 2,2′-azobis (methylbutyronitrile) (AMBN) and 32 parts of PGM were added, the polymerization reaction was started, the mixture was kept at 100 ° C. for 6 hours, cooled, and then the quaternary ammonium salt structure-containing copolymer was obtained. A solution (non-volatile content 20%) (“(C-1) component”) was obtained.
(C−2)成分として、荒川化学工業(株)製 ビームセットEL−1(PEDOT/PSSの他官能アクリレート溶液の分散体、PEDOT/PSS:約20%)を使用し、(C−3)成分として、日産化学工業(株)製 セルナックス CX−Z610M−F2(アンチモン含有酸化亜鉛のメタノール分散体)を用いた。 (C-2) As a component, Arakawa Chemical Industries, Ltd. beam set EL-1 (PEDOT / PSS other functional acrylate solution dispersion, PEDOT / PSS: about 20%), (C-3) As a component, Celnax CX-Z610M-F2 (methanol dispersion of antimony-containing zinc oxide) manufactured by Nissan Chemical Industries, Ltd. was used.
<アクリル樹脂系フィルム>
硬化被膜を形成させるアクリル樹脂系フィルムとしては、厚み125μmの住友化学株式会社製 テクノロイS001を使用した。なお、本フィルム200mgを採取し、120℃における揮発成分量を測定したところ、55ppmであり、このフィルムをメチルブチルケトン100%溶25℃)に1分間浸漬させた後、直ちに表面ヘイズ値を測定したところヘイズの上昇値は0.0%であった。よって、上述の要件(1)を満たす事を確認している。
<Acrylic resin film>
As an acrylic resin film for forming a cured film, Technoloy S001 manufactured by Sumitomo Chemical Co., Ltd. having a thickness of 125 μm was used. In addition, when 200 mg of this film was sampled and the amount of volatile components at 120 ° C. was measured, it was 55 ppm, and after immersing this film in methylbutylketone 100% solution at 25 ° C. for 1 minute, the surface haze value was measured immediately. As a result, the increase in haze was 0.0%. Therefore, it has been confirmed that the above requirement (1) is satisfied.
<ポリエステル樹脂系フィルム>
硬化被膜を形成させるポリエステル樹脂系フィルムとしては、厚み75μmの、東レ株式会社製 ルミラー75−T60を使用した。なお、本フィルム200mgを採取し、120℃における揮発成分量を測定したところ、92ppmであり、このフィルムをメチルブチルケトン100%溶液(25℃)に1分間浸漬させた後、直ちに表面ヘイズ値を測定したところヘイズの上昇値は0.1%であった。よって、上述の要件(1)を満たす事を確認している。
<Polyester resin film>
As a polyester resin film for forming a cured film, Lumirror 75-T60 manufactured by Toray Industries, Inc. having a thickness of 75 μm was used. In addition, when 200 mg of this film was sampled and the amount of volatile components at 120 ° C. was measured, it was 92 ppm, and after immersing this film in a methylbutylketone 100% solution (25 ° C.) for 1 minute, the surface haze value was immediately measured. When measured, the increase in haze was 0.1%. Therefore, it has been confirmed that the above requirement (1) is satisfied.
<光硬化型樹脂組成物の製造>
実施例1
(A−1)成分を40部、(B−1)成分を50部、(C)成分として上述の4級塩構造を有する共重合体(C−1)を10部、及び(D)成分として1−ヒドロキシ−シクロヘキシル−フェニルケトン(BASFジャパン(株)製、商品名「イルガキュアー184」、以下HCPKという。)を5部、固形分割合で配合し、メチルエチルケトン(MEK)、プロピレングリコールモノメチルエーテル(PGME)、1−プロパノールで希釈して、不揮発分50%の活性エネルギー線硬化型組成物を調製した。
<Manufacture of a photocurable resin composition>
Example 1
40 parts of component (A-1), 50 parts of component (B-1), 10 parts of copolymer (C-1) having the above-described quaternary salt structure as component (C), and component (D) As a blend, 5 parts of 1-hydroxy-cyclohexyl-phenyl ketone (trade name “Irgacure 184”, hereinafter referred to as HCPK) manufactured by BASF Japan Ltd.) in a solid content ratio, methyl ethyl ketone (MEK), propylene glycol monomethyl ether (PGME) was diluted with 1-propanol to prepare an active energy ray-curable composition having a nonvolatile content of 50%.
実施例2〜実施例9
表1に記載のとおりに各成分及び配合比を変更した以外は、実施例1と同様に光硬化型樹脂組成物を製造した。実施例5の(C)成分は、上記(C−2)成分であるビームセット−EL1の固形分(有機オリゴマ−・分散剤を含む)が1.5部、このうち導電性材料(C)の固形分であるPEDOT/PSSは0.3部であった。
Example 2 to Example 9
A photocurable resin composition was produced in the same manner as in Example 1 except that each component and the mixing ratio were changed as described in Table 1. The component (C) of Example 5 is 1.5 parts of the solid content (including the organic oligomer / dispersant) of Beam Set-EL1, which is the component (C-2), of which the conductive material (C) The solid content of PEDOT / PSS was 0.3 part.
実施例10〜13
基材をポリエステル系樹脂フィルムに変更した以外は、表1に記載のとおりに各成分及び配合比を変更し、実施例1と同様に光硬化型樹脂組成物を製造した。
Examples 10-13
Except having changed the base material into the polyester-type resin film, each component and compounding ratio were changed as described in Table 1, and the photocurable resin composition was manufactured similarly to Example 1.
比較例1
(A)成分としてHEAを40部、(B−1)成分を50部、(C−1)成分を10部、及び(D)成分として1−ヒドロキシ−シクロヘキシル−フェニルケトン(BASFジャパン(株)製、商品名「イルガキュアー184」、以下HCPKという。)を5部、固形分割合で配合し、メチルエチルケトン(MEK)、プロピレングリコールモノメチルエーテル(PGME)、1−プロパノールで希釈して、不揮発分50%の活性エネルギー線硬化型組成物を調製した。
Comparative Example 1
40 parts of HEA as component (A), 50 parts of component (B-1), 10 parts of component (C-1), and 1-hydroxycyclohexyl-phenylketone as component (D) (BASF Japan K.K.) Product, trade name “Irgacure 184”, hereinafter referred to as HCPK) in a solid content ratio, diluted with methyl ethyl ketone (MEK), propylene glycol monomethyl ether (PGME), 1-propanol, and a non-volatile content of 50 % Active energy ray-curable composition was prepared.
比較例2〜比較例11
表1に記載のとおりに各成分及び配合比を変更した以外は、比較例1と同様に光硬化型樹脂組成物を製造した。
Comparative Example 2 to Comparative Example 11
A photocurable resin composition was produced in the same manner as in Comparative Example 1 except that each component and the mixing ratio were changed as described in Table 1.
比較例12〜比較例15
基材をポリエステル系樹脂フィルムに変更し、表1に記載のとおりに各成分及び配合比を変更し、比較例1と同様に光硬化型樹脂組成物を製造した。
Comparative Examples 12 to 15
The base material was changed to a polyester resin film, each component and the compounding ratio were changed as shown in Table 1, and a photocurable resin composition was produced in the same manner as in Comparative Example 1.
<硬化被膜の作成>
上記アクリル樹脂系フィルム上に、表1に記載の実施例1に係る樹脂組成物を、硬化後の被膜の膜厚が5μmとなるように#10バーコーターにて塗布し、60℃で1分乾燥させた。次いで、得られたフィルムを紫外線硬化装置(製品名:UBT−080−7A/BM、(株)マルチプライ製、高圧水銀灯600mJ/cm2))を使用し、硬化被膜を供えたプラスチックフィルムを得た。実施例2〜10、および比較例1〜15に係る樹脂組成物についても同様にフィルム作成した。結果を表1に示す。
<Creation of cured film>
On the said acrylic resin film, the resin composition which concerns on Example 1 of Table 1 is apply | coated with a # 10 bar coater so that the film thickness of the film after hardening may be set to 5 micrometers, and it is 1 minute at 60 degreeC. Dried. Next, the obtained film was used with an ultraviolet curing device (product name: UBT-080-7A / BM, manufactured by Multiply, high pressure mercury lamp 600 mJ / cm 2 ) to obtain a plastic film provided with a cured film. It was. Films were similarly prepared for the resin compositions according to Examples 2 to 10 and Comparative Examples 1 to 15. The results are shown in Table 1.
<硬化被膜の評価> <Evaluation of cured film>
(1)密着性
表1に記載の実施例1に係るプラスチックフィルムについて、JIS K5600−5−4に準じ、100マス碁盤目剥離試験により、硬化被膜の密着性を評価した。実施例2〜13、および比較例1〜15に係るプラスチックフィルムについても同様にした。結果を表1に示す。
(1) Adhesiveness About the plastic film which concerns on Example 1 of Table 1, according to JISK5600-5-4, the adhesiveness of the cured film was evaluated by the 100 square cross peel test. The same applies to the plastic films according to Examples 2 to 13 and Comparative Examples 1 to 15. The results are shown in Table 1.
(2)表面抵抗値
表1に記載の実施例1に係るプラスチックフィルムについて、表面抵抗値を、市販抵抗率計(三菱化学(株)製、製品名「ハイレスタMCP−HT−450」)を用い、JIS K 6911に準じ、印加電圧500Vで測定した。実施例2〜13、および比較例1〜15に係るプラスチックフィルムについても同様にした。結果を表1に示す。
(2) Surface resistance value About the plastic film which concerns on Example 1 of Table 1, surface resistance value was used for the commercially available resistivity meter (Mitsubishi Chemical Corporation make, product name "Hiresta MCP-HT-450"). According to JIS K 6911, measurement was performed at an applied voltage of 500V. The same applies to the plastic films according to Examples 2 to 13 and Comparative Examples 1 to 15. The results are shown in Table 1.
(3)鉛筆硬度
表1に記載の実施例1に係るプラスチックフィルムについて、JIS K5600−5−4に準じ、荷重500gの鉛筆引っかき試験により、硬化被膜の硬度を評価した。実施例2〜13、および比較例1〜15に係るプラスチックフィルムについても同様にした。結果を表1に示す。
(3) Pencil hardness About the plastic film which concerns on Example 1 of Table 1, according to JISK5600-5-4, the hardness of the cured film was evaluated by the pencil scratch test of the load of 500g. The same applies to the plastic films according to Examples 2 to 13 and Comparative Examples 1 to 15. The results are shown in Table 1.
表1中の記号は以下のとおりである。
NVF:N−ビニルホルムアミド
(荒川化学工業(株)製:ビームセット770)
HEA:ヒドロキシエチルアクリレート
(共栄社化学(株)製:ライトアクリレートHOA(N))
THF−A:テトラヒドロフルフリルアクリレート
(共栄社化学(株)製:ライトアクリレートTHF−A)
BZA:ベンジルアクリレート
(大阪有機化学(株)製:ビスコート#160)
DMAA:ジメチルアクリルアミド
(KJケミカルズ(株)製:DMAA)
PETA:ペンタエリスリトールトリアクリレート
(共栄社化学(株)製:ライトアクリレートPE−3A)
AN:アクリロニトリル(三菱レイヨン製:アクリロニトリル)
SA:ステアリルアクリレート(共栄社化学(株)製:ライトアクリレートS−A)
9EGA:ポリエチレングリコール(PEG#400)ジアクリレート
(共栄社化学(株)製:ライトアクリレート9EGA)
TMPTA:トリメチロールプロパントリアクリレート
(共栄社化学(株)製:ライトアクリレートTMP−A)
C−2:荒川化学工業(株)製 ビームセットEL−1
(PEDOT/PSSの他官能アクリレート溶液の分散体、PEDOT/PSS:約20%)
C−3:日産化学工業(株)製 セルナックス CX−Z610M−F2
(アンチモン含有酸化亜鉛のメタノール分散体)
The symbols in Table 1 are as follows.
NVF: N-vinylformamide (Arakawa Chemical Industries, Ltd .: Beam Set 770)
HEA: Hydroxyethyl acrylate (manufactured by Kyoeisha Chemical Co., Ltd .: Light acrylate HOA (N))
THF-A: Tetrahydrofurfuryl acrylate (Kyoeisha Chemical Co., Ltd .: Light acrylate THF-A)
BZA: benzyl acrylate (Osaka Organic Chemical Co., Ltd .: Biscote # 160)
DMAA: dimethylacrylamide (manufactured by KJ Chemicals: DMAA)
PETA: Pentaerythritol triacrylate (manufactured by Kyoeisha Chemical Co., Ltd .: Light acrylate PE-3A)
AN: Acrylonitrile (Mitsubishi Rayon: Acrylonitrile)
SA: Stearyl acrylate (manufactured by Kyoeisha Chemical Co., Ltd .: Light acrylate SA)
9EGA: Polyethylene glycol (PEG # 400) diacrylate (manufactured by Kyoeisha Chemical Co., Ltd .: Light acrylate 9EGA)
TMPTA: Trimethylolpropane triacrylate (manufactured by Kyoeisha Chemical Co., Ltd .: Light acrylate TMP-A)
C-2: Arakawa Chemical Industries, Ltd. Beam Set EL-1
(Dispersion of PEDOT / PSS other functional acrylate solution, PEDOT / PSS: about 20%)
C-3: Nissan Chemical Co., Ltd. Cellnax CX-Z610M-F2
(Methanol dispersion of antimony-containing zinc oxide)
Claims (4)
該水酸基を有さない重合性不飽和基含有モノマー(A)は、溶解度パラメータが9〜13(cal/cm3)1/2、分子量が350以下、25℃での粘度が30mPa・s以下であり、
該ウレタンアクリレート(B)が、分子中に1つの水酸基を有する(メタ)アクリレート(b1)と分子中にイソシアネート基を有しイソシアヌレート環構造、ビウレット構造及びアロファネート構造から選ばれる少なくとも1つの構造を有するイソシアネート化合物(b2)を反応させて得られるものであり、重量平均分子量が500以上、アクリロイル基当量140〜400g/eqであり、
水酸基を有さない重合性不飽和基含有モノマー(A):ウレタンアクリレート(B):導電性材料(C)の固形重量部比が10〜70:10〜70:0.2〜25であることを特徴とする光硬化型樹脂組成物。 Including a polymerizable unsaturated group-containing monomer having no hydroxyl group (A), urethane acrylate (B), conductive material (C),
The polymerizable unsaturated group-containing monomer (A) having no hydroxyl group has a solubility parameter of 9 to 13 (cal / cm 3 ) 1/2 , a molecular weight of 350 or less, and a viscosity at 25 ° C. of 30 mPa · s or less. Yes,
The urethane acrylate (B) has at least one structure selected from a (meth) acrylate (b1) having one hydroxyl group in the molecule and an isocyanurate ring structure, biuret structure and allophanate structure having an isocyanate group in the molecule. Having a weight average molecular weight of 500 or more and an acryloyl group equivalent of 140 to 400 g / eq,
Solid weight part ratio of polymerizable unsaturated group-containing monomer (A): urethane acrylate (B): conductive material (C) having no hydroxyl group is 10 to 70:10 to 70: 0.2 to 25 A photocurable resin composition characterized by the above.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017122662A1 (en) * | 2016-01-12 | 2017-07-20 | 信越ポリマー株式会社 | Conductive polymer dispersion and method for preparing same, and method for manufacturing conductive film |
WO2018174102A1 (en) * | 2017-03-23 | 2018-09-27 | 富士フイルム株式会社 | Curable composition for sheets, cured product and method for producing same, sheet for three-dimensional shaping, optical member, lenticular sheet and three-dimensional structure |
JP7587201B2 (en) | 2020-09-14 | 2024-11-20 | 日産化学株式会社 | Curable composition for forming hard coat layer containing specific urethane (meth)acrylate |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000264939A (en) * | 1999-03-15 | 2000-09-26 | Kyoeisha Chem Co Ltd | Urethane (meth)acrylate oligomer and antistatic coating material composition containing the same |
US20040234743A1 (en) * | 2002-08-22 | 2004-11-25 | Klaus Wissing | Process for primer coating fiber-reinforced plastics substrates |
JP2005054088A (en) * | 2003-08-06 | 2005-03-03 | Nippon Synthetic Chem Ind Co Ltd:The | Active energy ray-curable resin composition |
JP2007332181A (en) * | 2006-06-12 | 2007-12-27 | Nippon Kasei Chem Co Ltd | Antistatic composition, antistatic layer and antistatic film |
JP2008056872A (en) * | 2006-09-04 | 2008-03-13 | Soken Chem & Eng Co Ltd | Resin composition for hard coat layer formation |
JP2009040021A (en) * | 2007-08-13 | 2009-02-26 | Mitsubishi Rayon Co Ltd | Carbon nanotube-containing structure, carbon nanotube-containing composition, and method for producing carbon nanotube-containing structure |
JP2009114302A (en) * | 2007-11-06 | 2009-05-28 | San Nopco Ltd | Antistatic radiation curing composition and light diffusion sheet |
-
2015
- 2015-09-16 JP JP2015182727A patent/JP6652738B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000264939A (en) * | 1999-03-15 | 2000-09-26 | Kyoeisha Chem Co Ltd | Urethane (meth)acrylate oligomer and antistatic coating material composition containing the same |
US20040234743A1 (en) * | 2002-08-22 | 2004-11-25 | Klaus Wissing | Process for primer coating fiber-reinforced plastics substrates |
JP2005054088A (en) * | 2003-08-06 | 2005-03-03 | Nippon Synthetic Chem Ind Co Ltd:The | Active energy ray-curable resin composition |
JP2007332181A (en) * | 2006-06-12 | 2007-12-27 | Nippon Kasei Chem Co Ltd | Antistatic composition, antistatic layer and antistatic film |
JP2008056872A (en) * | 2006-09-04 | 2008-03-13 | Soken Chem & Eng Co Ltd | Resin composition for hard coat layer formation |
JP2009040021A (en) * | 2007-08-13 | 2009-02-26 | Mitsubishi Rayon Co Ltd | Carbon nanotube-containing structure, carbon nanotube-containing composition, and method for producing carbon nanotube-containing structure |
JP2009114302A (en) * | 2007-11-06 | 2009-05-28 | San Nopco Ltd | Antistatic radiation curing composition and light diffusion sheet |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017122662A1 (en) * | 2016-01-12 | 2017-07-20 | 信越ポリマー株式会社 | Conductive polymer dispersion and method for preparing same, and method for manufacturing conductive film |
KR20180093024A (en) * | 2016-01-12 | 2018-08-20 | 신에츠 폴리머 가부시키가이샤 | Conductive polymer dispersion, production method thereof, and production method of conductive film |
JPWO2017122662A1 (en) * | 2016-01-12 | 2018-08-30 | 信越ポリマー株式会社 | Conductive polymer dispersion, method for producing the same, and method for producing conductive film |
KR102049236B1 (en) | 2016-01-12 | 2019-11-28 | 신에츠 폴리머 가부시키가이샤 | Conductive Polymer Dispersion, Manufacturing Method Thereof, and Manufacturing Method of Conductive Film |
US10647858B2 (en) | 2016-01-12 | 2020-05-12 | Shin-Etsu Polymer Co., Ltd. | Conductive polymer dispersion and method for preparing same, and method for manufacturing conductive film |
US11236238B2 (en) | 2016-01-12 | 2022-02-01 | Shin-Etsu Polymer Co., Ltd. | Conductive polymer dispersion and method for preparing same, and method for manufacturing conductive film |
US11814545B2 (en) | 2016-01-12 | 2023-11-14 | Shin-Etsu Polymer Co., Ltd. | Conductive polymer dispersion and method for preparing same, and method for manufacturing conductive film |
WO2018174102A1 (en) * | 2017-03-23 | 2018-09-27 | 富士フイルム株式会社 | Curable composition for sheets, cured product and method for producing same, sheet for three-dimensional shaping, optical member, lenticular sheet and three-dimensional structure |
JPWO2018174102A1 (en) * | 2017-03-23 | 2019-11-07 | 富士フイルム株式会社 | Curable composition for sheet, cured product and production method thereof, three-dimensional molding sheet, optical member, lenticular sheet, and three-dimensional structure |
JP7587201B2 (en) | 2020-09-14 | 2024-11-20 | 日産化学株式会社 | Curable composition for forming hard coat layer containing specific urethane (meth)acrylate |
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