JP2016062878A - Led lighting device and heat sink used for led lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a long-life LED lighting device which is lightweight and hard to be affected by heat degradation.SOLUTION: A plurality of tabular radiation fins 4 extended outward and formed from an outer peripheral wall of a cylindrical body 3 are provided with gaps in between in a peripheral direction of the cylindrical body 3 to form a heat sink 2 integrating the cylindrical body 3 with the radiation fins 4. A substrate 5 is provided on one end side of the cylindrical body 3, the cylindrical body 3 and the radiation fins 4 are disposed on one surface side of the substrate 5, a substrate surface 16 side opposite the surface where the radiation fins 4 of the substrate 5 are disposed is a surface thermally connected to a plurality of LED light sources 6 disposed with gaps in between, and electronics related equipment 10 including a power supply of the LED light sources 6 is housed inside the cylindrical body 3. The heat sink 2 is formed by connecting heat sink formation parts 8a, 8b via insulation members 9 lower than the cylindrical body 3 in thermal conductivity, the upper side heat sink formation part 8b is thermally connected to the electronics related equipment 10, and the lower heat sink formation part 8b is in a non-connection state.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an LED lighting device formed using an LED (light emitting diode) and a heat sink used in the LED lighting device.

  The LED light source is also characterized in that it has a long life compared to the light source of conventional lighting devices such as incandescent bulbs, fluorescent lamps, mercury lamps, metal halide lamps, and the like. In recent years, such LED light sources have attracted attention, and various LED lighting devices using LED light sources have been proposed. In particular, an LED lighting device with a built-in power source that incorporates the power source of the LED light source in the LED lighting device facilitates installation when installing the LED lighting device at its installation location, and quality control as a device (equipment). It has been attracting attention because of its great merit, such as ease of the process (for example, see Patent Documents 1 to 4).

JP 2006-203778 A JP 2011-528924 A JP 2011-46675 A Special table 2012-502432 gazette

  However, the LED lighting device with a built-in power source has a great merit as described above, but the LED lighting device becomes unusable even when the power source fails or has reached the end of its life, and the entire LED lighting device must be replaced. In many cases, this point causes a decrease in the service life. In other words, in the LED lighting device with a built-in power source, the amount of heat generated by the LED light source is large, and the amount of heat generated by the power source of the LED light source is large. Or internal electronic devices (electronic-related equipment) may be deteriorated. When these deteriorations occur, the LED lighting device cannot be used, and the entire life of the LED lighting device (LED lighting fixture) is reduced. There was a problem.

  In addition, since LED lighting devices are often installed at high places, light weight is also required. Furthermore, although LED lighting devices save power, the cost of the main body is high. In addition, there is a problem that the initial equipment cost is high, and it is also an issue to reduce the manufacturing cost to the following in order to suppress the main body cost.

  The present invention has been made in order to solve the above-mentioned problems. The purpose of the present invention is that even if a power supply is incorporated, the heat of the power supply is unlikely to cause an effect such as a decrease in life, and the weight can be reduced as much as possible. An object of the present invention is to provide a low-cost LED lighting device and a heat sink that enables the LED lighting device.

  In order to achieve the above object, the present invention has the following configuration as means for solving the problems. That is, in the LED lighting device according to the first aspect of the present invention, a plurality of plate-like heat radiating fins formed by extending outward from the outer peripheral wall of the cylindrical body are provided at intervals in the circumferential direction of the cylindrical body. A heat sink is formed by integrating the cylindrical body and the radiation fin, and a substrate is provided on one end side of the cylindrical body of the heat sink, and the cylindrical body and the heat dissipation are provided on one side of the substrate. A plurality of LED light sources disposed at intervals are directly or indirectly disposed on the substrate surface side of the substrate opposite to the surface on which the heat dissipating fins are disposed. A thermal connection surface that is thermally connected, and electronic equipment including a power source of the LED light source is housed in the cylinder of the cylindrical body, and a thermal connection portion with the electronic equipment Hands to solve the problem with the configuration provided in the cylinder It is set to.

  Further, in the LED lighting device of the second invention, in addition to the configuration of the first invention, the cylindrical body of the heat sink is divided into a plurality of upper and lower parts, and the divided bodies are arranged with an interval in the vertical direction. The heat dissipating fins are disposed for each of the divided bodies of the cylindrical body, and the heat dissipating fins of the divided bodies are spaced apart from each other in the vertical direction. A heat sink forming part having a plurality of heat dissipating fins is formed, and the heat sink forming parts are arranged to overlap each other in the vertical direction with a space therebetween, and the divided parts of the cylindrical body are the cylindrical body Connected through a heat insulating member having a lower thermal conductivity than the above, and at least one of the divided bodies of the second stage or more from the bottom among the divided parts of the cylinder, Is formed.

  Further, in the LED lighting device of the third invention, in addition to the configuration of the second invention, the lowermost divided body adjacent to the substrate among the divided bodies of the cylindrical body is in a state of being thermally disconnected from the electronic related equipment. It is characterized by that.

  Furthermore, in addition to the configuration of the second or third invention, the LED lighting device of the fourth invention is provided in a cylinder of a cylindrical divided body that is thermally connected to the electronic equipment. A device support part having a fixing surface for fixing the electronic equipment is formed, and the fixing surface of the equipment support part forms a thermal connection with the electronic equipment.

  Further, in the LED lighting device of the fifth invention, in addition to the configuration of the second, third or fourth invention, the plurality of heat sink forming parts are formed in the same cross-sectional shape, and each of the heat sinks In the cylinder of the forming part, a device support part having a surface capable of forming a fixing surface of the electronic equipment is formed, and the electronic equipment is thermally connected to the fixed surface of the equipment support part. The heat sink forming part having a cylindrical divided body and the heat sink forming part having a cylindrical divided body which is not thermally connected to the equipment supporting portion without being supported by the electronic equipment. It is characterized in that the circumferential positions of the cylindrical bodies are shifted from each other so as to overlap in the vertical direction so that the equipment support portions do not overlap in the vertical direction.

  Further, in the LED lighting device of the sixth invention, in addition to the configuration of the fifth invention, the distance from the center of the cylindrical body of the equipment support portion is opposite from the surface fixed to the fixed surface of the electronic equipment. A heat sink forming part having a cylindrical divided body that is thermally connected to the electronic equipment and a cylinder that is thermally disconnected from the electronic equipment, and is formed to be larger than half of the width to the side surface A heat sink forming part having a body divided body is disposed in such a manner that the relative positions in the circumferential direction of the cylindrical body are shifted from each other by 180 degrees and overlapped in the vertical direction, and thermally connected to the electronic equipment A side equipment support part and a non-connection side equipment support part that is not thermally connected to the electronic related equipment are arranged to face each other with an interval, and the electronic related equipment is arranged at the interval, and the connection side Fixed to the fixed surface of the equipment support And wherein the are.

  Furthermore, in addition to the configuration of any one of the second to sixth inventions, the LED lighting device of the seventh invention is configured such that the heat dissipating fins provided on the heat sink forming parts adjacent to each other above and below are mutually connected. The position is shifted in the circumferential direction of the cylindrical body.

  Further, in the LED lighting device of the eighth invention, in addition to the configuration of any one of the second to seventh inventions, the heat sink forming part arranged on the upper side among the plurality of heat sink forming parts is The length in the extending direction from the outer peripheral wall of the cylindrical body of the radiating fin to the outside is shorter than the heat sink forming part arranged on the lower side.

  Furthermore, in the LED lighting device of the ninth invention, in addition to the configuration of any one of the first to eighth inventions, the plurality of radiating fins extending outward from the outer peripheral wall of the cylindrical body are respectively And at least three sheets which are formed in a direction extending radially from the inner center portion of the cylindrical body and which are at least the lower end side in the horizontal posture when the heat sink is arranged so that the cylindrical length direction of the cylindrical body is horizontal. The adjacent radiating fins are formed to have the same length so that the tip positions of the adjacent radiating fins are arranged on the same plane.

  Furthermore, in the LED lighting device of the tenth invention, in addition to the configuration of any one of the first to ninth inventions, the electronic equipment is provided with a heat pipe along the longitudinal direction of the cylinder, The heat pipe is thermally connected to a cylindrical divided body having a fixed surface that is thermally connected to the electronic equipment.

  Furthermore, the heat sink of the eleventh invention is a heat sink used in the LED lighting device of any one of the first to tenth inventions, and is formed by extending outward from the outer peripheral wall of the cylindrical body. A plurality of plate-shaped radiating fins are provided in the circumferential direction of the cylindrical body at intervals, the cylindrical body and the radiating fin are integrally formed, and a substrate is provided on one end side of the cylindrical body. The cylindrical body and the heat radiating fins are arranged on one side of the substrate.

  According to the LED lighting device of the present invention, a plurality of plate-like heat radiation fins formed to extend outward from the outer peripheral wall of the cylindrical body are provided at intervals in the circumferential direction of the cylindrical body, A heat sink is formed by integrating a cylindrical body and the radiating fin. A substrate is provided on one end side of the cylindrical body of the heat sink, and the cylindrical body and the radiating fin are provided on one side of the substrate. The cylindrical body and the heat radiating fin are disposed on one side of the substrate, and the substrate surface side opposite to the surface on which the heat radiating fin is disposed is spaced from each other. Since the plurality of LED light sources disposed via the thermal connection are directly or indirectly thermally connected, the heat of the plurality of LED light sources connected to the thermal connection surface ( For example, a substantially uniform heat and integrated LED light source over the entire substrate surface of the substrate Heat), it can be efficiently radiated by even sink even wide substrate area.

  In the LED lighting device of the present invention, an electronic equipment including a power source of the LED light source is accommodated in a cylinder of the heat sink, and a thermal connection portion with the electronic equipment is provided in the cylinder. Therefore, heat can be transmitted to the cylindrical body through the thermal connection portion, and further, the heat can be radiated through the radiation fins, so that the electronic equipment can be cooled. Therefore, it can prevent that the lifetime of the whole LED lighting apparatus (LED lighting fixture) falls, and can implement | achieve LED lighting apparatus with a long lifetime. Moreover, since the LED lighting device of the present invention is formed by thermally connecting the heat sink having the above simple structure to a plurality of LED light sources, the structure is simple and the device is low in cost. can do.

  For example, if a through hole corresponding to the cylindrical hole of the cylindrical body is formed in the substrate of the heat sink, for example, the electronic body is caused by natural convection of air flowing in the cylindrical body along the cylindrical extending direction (cylinder core direction). Can be cooled more efficiently, and an LED lighting device with a longer life can be realized.

  Further, the heat sink cylinder applied to the LED lighting device of the present invention is divided into a plurality of parts in the vertical direction, and the divided parts are arranged with an interval in the vertical direction. The heat dissipating fins are arranged for each body, and the heat dissipating fins for each of the divided bodies also have a plurality of heat dissipating fins provided for each of the divided bodies, with a space between each other in the vertical direction. The heat sink forming parts are formed, and the heat sink forming parts are arranged so as to overlap each other in the vertical direction with a space therebetween. By devising various ways of thermal connection with the LED light source, it is possible to further improve the lifetime and cost of the LED lighting device.

  For example, the cylindrical body parts forming the heat sink forming parts are connected to each other through a heat insulating member having a lower thermal conductivity than the cylindrical body, and the second or higher stage from the bottom of the cylindrical body parts. By making at least one of the divided bodies thermally connected to the electronic equipment, the heat of the electronic equipment is made efficient through the heat sink forming part having the divided body thermally connected to the electronic equipment. Heat can be released.

  In addition, heat sink forming parts are arranged one above the other with a space between them, and the divided parts of the cylinders are connected to each other via a heat insulating member having a lower thermal conductivity than the cylinders. By doing so, the heat sink forming parts are not thermally connected or hardly connected (insulated or substantially insulated by the heat insulating member). If a heat sink forming part that is in a disconnected state is provided, the heat sink forming part is not thermally connected to the heat sink forming part that is thermally connected to the electronic equipment, or is in a state of being hardly connected to the heat sink forming part. can do.

  For this reason, among the plurality of heat sink forming parts, the lowermost divided body adjacent to the substrate is thermally disconnected from the electronic related equipment, so that the heat sink forming part having the lowermost divided body is electronic related equipment. In this case, the heat sink forming part having the lowermost divided body is thermally connected only to the LED light source or almost only to the LED light source. This heat can be dissipated more efficiently.

  That is, in this way, the heat sink forming part having the lowermost division is thermally disconnected from the electronic equipment, and at least one of the second and higher divisions is thermally connected to the electronic equipment. When in the connected state, the heat of the LED light source is dissipated by the heat sink forming part having the lowermost divided body, and the divided body that is thermally connected to the electronic equipment among the second and higher divided bodies By making it possible to share the role of radiating the heat of the electronic equipment with the heat sink forming parts having both, the heat of the LED light source and the heat of the electronic equipment can both be radiated more efficiently. it can.

  Furthermore, a device support portion having a fixing surface for fixing the electronic device is formed in a cylinder of the cylindrical body that is thermally connected to the electronic device. By fixing the electronic equipment to the fixing surface, the electronic equipment and the divided body of the cylinder are thermally connected to each other. Connection can be made easily and in good condition.

  In addition, a device including a plurality of heat sink forming parts that have the same cross-sectional shape and a surface that enables a fixing surface for electronic equipment to be formed in a cylinder of each of the heat sink forming parts. By forming the support part, each heat sink forming part can be formed efficiently, and any heat sink forming part can be used to form a heat sink forming part that can be thermally connected to electronic equipment. it can. Therefore, by forming a heat sink using these heat sink forming parts and forming an LED lighting device, it is possible to form a low-cost LED lighting device with high manufacturing efficiency.

  In this configuration, the heat sink forming part having a cylindrical divided body in which the electronic-related equipment is thermally connected to the fixed surface of the equipment support portion, and the electronic-related equipment is provided in the equipment support portion. A heat sink forming part having a cylindrical divided body that is not supported and is thermally disconnected is positioned relative to the circumferential direction of the cylindrical body so that the equipment support portions do not overlap each other in the vertical direction. Since the equipment support parts do not overlap each other in the vertical direction by shifting them from each other in the vertical direction, the electronic equipment that houses the power supply and the electronic device, for example, in a box-shaped housing is installed in the cylindrical shape. When arranged, for example, the electronic equipment may be supported only by some equipment support sections, and the electronic equipment may not be supported by some equipment support sections.

  That is, by arranging the heat sink forming parts so as not to overlap each other in the vertical direction, the circumferential positions of the cylindrical bodies are shifted from each other so as to overlap each other in the vertical direction, for example, at the lowest level. The heat sink forming part is not connected to the electronic equipment on the equipment support part of the cylindrical divided body and is thermally disconnected, and at least one of the second and higher stages from the bottom (electronic related equipment and thermal In the heat sink forming part, it is possible to easily connect the electronic related equipment to the equipment support portion of the cylindrical divided body and to be in the thermal connection state, and the above effects can be achieved. it can.

  Further, as described above, in the configuration in which the equipment support portion is provided in the cylinder of the cylindrical body forming the heat sink forming part, the distance from the center of the cylinder body of the equipment support portion is set to the fixing surface of the electronic related equipment. A heat sink forming part having a cylindrical divided body that is formed to be larger than half of the width from the fixed surface to the opposite surface and thermally connected to the electronic equipment and the electronic equipment In the configuration in which the heat sink forming parts having the cylindrical divided bodies that are in the non-connected state are arranged so that the circumferential relative positions of the cylindrical bodies are shifted 180 degrees from each other and stacked in the vertical direction, the heat sink forming parts are It is possible to more easily perform the work of arranging in the vertical direction, and the following effects can be obtained by this superposition.

  In other words, in this configuration, the connection-side equipment support that is thermally connected to the electronic equipment and the non-connection-side equipment support that is not thermally connected to the electronic equipment are spaced apart from each other. If the electronic equipment is arranged at the interval, the electronic equipment is arranged near the fixing surface of the equipment support portion on the connection side, and is fixed to the fixing surface, the electronic equipment is obtained. It can arrange | position via the space | interval with the equipment support part of the non-connection side which is not thermally connected.

  In other words, the electronic equipment can be thermally connected to the fixed surface of the equipment support section simply by placing the electronic equipment between the equipment support sections arranged opposite to each other and fixing the electronic equipment to one equipment support section. In addition, it is possible to easily make the other equipment support portion not thermally connected as an interval with no electronic-related equipment fixed.

  Further, when heat is radiated by the heat sink, the heat exchange between the radiating fin and the air in the area where the radiating fin is disposed is mainly performed in a region near the surface from the surface of the radiating fin to about 3 mm, for example, and is a region away from the surface of the radiating fin In what is not done. Therefore, the following effects can be achieved by providing the heat dissipating fins provided in the heat sink forming parts adjacent to each other in the vertical direction so as to be shifted from each other in the circumferential direction of the cylindrical body.

  That is, for example, the air that rises upward through the area away from the surface of the heat sink fin in the space between the heat sink fins of the lower heat sink forming part exchanges heat with the heat sink fin of the heat sink forming part. Without being done, it reaches the space between the radiating fins of the upper heat sink forming part in a cold state, proceeds to the radiating fin surface side of the upper heat sink forming part, and heats with the radiating fin on the radiating fin surface side. Can be exchanged.

  Therefore, it is possible to exchange heat efficiently by using heat dissipating fins compared to the case where heat dissipating fins provided on heat sink forming parts adjacent to each other are arranged in the circumferential direction of the cylinder without shifting their positions. Can be increased.

  Furthermore, among the heat sink forming parts, the heat sink forming part arranged on the upper side extends outward from the outer peripheral wall of the cylindrical body of the heat radiating fin than the heat sink forming part arranged on the lower side. By making the length in the direction short, variations can be given to the design of the LED lighting device, and the appearance can be improved.

  Furthermore, each of the plurality of radiating fins extending outward from the outer peripheral wall of the cylinder is formed in a direction extending radially from the inner center of the cylinder, and the cylinder length direction of the cylinder is laterally When the heat sinks are arranged in such a manner that the lengths of the adjacent radiating fins are aligned so that the tip positions of at least three adjacent radiating fins which are at least the lower end side in the horizontal orientation are arranged on the same plane. According to the formed structure, the following effects can be obtained.

  That is, the heat sink applied to the LED lighting device of the present invention can be easily and efficiently formed by extrusion using a material such as aluminum or an alloy thereof. In order to efficiently form the heat sink, the material for forming the heat sink is extruded from the extrusion mold in a state where the heat sink is arranged so that the cylinder length direction of the cylinder body is in the horizontal direction while the material forming the heat sink is soft. The material having the shape formed in the extruded state is solidified by cooling, but the shape is likely to be deformed during the soft period until the material is cooled.

  That is, in the LED lighting device having this configuration, the heat dissipating fins of the heat sink are formed in a direction extending radially from the inner center portion of the cylindrical body and are formed into a thin plate shape, for example, as described above. If the heat sink is placed in a state where the tube length direction of the body is in the horizontal direction, if it is pushed out from the extrusion die, the tip positions of at least three adjacent radiating fins that are the lower end side in the horizontal posture are arranged on the same plane. If the adjacent radiating fins are not formed to have the same length, the two radiating fin tips are in contact with the arrangement surface of the arrangement area of the extruded product of the heat sink. The extrudate of the heat sink is supported by the two radiating fins.

  In that case, depending on the two radiating fins, there is a concern that the heat sink extrudate may not be supported and the shape of the heat sink extrudate that is still soft may collapse. By forming the lengths of the adjacent radiating fins so that the tip positions of at least three adjacent radiating fins that are at least the lower end side are arranged on the same plane, the above-described problems occur. However, a heat sink can be formed, and an LED lighting device can be formed.

  As mentioned above, if the heat sink forming parts are formed by extrusion molding and the heat sink is formed, the thickness of the heat radiating fins can be made uniform, so that the thickness of the heat radiating fins can be reduced and the heat sink weight is reduced. Therefore, the LED lighting device can be reduced in weight.

  Further, the electronic equipment is provided with a heat pipe along the longitudinal direction of the cylinder, and the heat pipe is thermally connected to a divided body of the cylinder having a fixed surface thermally connected to the electronic equipment. By transmitting the heat of the electronic equipment through the heat pipe to the divided body of the cylindrical body having a fixed surface thermally connected to the electronic equipment, through the heat sink forming part having the divided body Since heat can be dissipated, the heat of the electronic equipment can be dissipated more efficiently. As described above, the heat of the power supply is often quite large, and the heat of the electronic equipment including the power supply is often large. Thus, by efficiently radiating the heat of the electronic equipment, the LED The lifetime of the lighting device can be further increased.

  Furthermore, according to the heat sink of this invention, the outstanding heat sink which can construct | assemble the LED lighting apparatus which has the said outstanding effect by simple structure can be provided.

It is the side view (a) which shows typically 1st Example of the LED lighting apparatus which concerns on this invention, and its A-A 'sectional drawing (b). They are the figure (a) seen from the bottom face for demonstrating typically the LED lighting apparatus of 1st Example, and the perspective view (b) seen from diagonally lower side. They are the perspective view (a) and the top view (b) which were seen from the diagonally upper side for showing typically the LED lighting apparatus of 1st Example. It is a perspective view which abbreviate | omits one part structure and shows typically the heat sink applied to the LED lighting apparatus of 1st Example. A plan view (a) schematically showing a heat sink forming part of a heat sink applied to the LED lighting device of the first embodiment, with a part of the configuration omitted, and a schematic plan view of the assembly (b) It is. It is typical sectional explanatory drawing (a) which shows a partial structure of the LED lighting apparatus of 1st Example, and typical plane explanatory drawing (b) which shows the example of arrangement | positioning of a LED light source. It is typical sectional explanatory drawing for demonstrating the thermal radiation operation | movement in the LED lighting apparatus of 1st Example. It is a perspective view which shows typically the structure of the electronic related equipment applied to the LED lighting apparatus of 1st Example. It is the side view (a) which shows typically 2nd Example of the LED lighting apparatus which concerns on this invention, and its A-A 'sectional drawing (b). It is the figure (a) seen from the bottom face for showing typically the LED lighting apparatus of 2nd Example, and the perspective view (b) seen from diagonally lower side. It is the perspective view (a) top view (b) seen from the diagonally upper side for showing typically the LED lighting apparatus of 2nd Example. It is a top view which shows typically the heat sink formation parts applied to the LED lighting apparatus of 2nd Example, abbreviate | omitting some structures. It is the side view (a) which shows typically 3rd Example of the LED lighting apparatus which concerns on this invention, and its A-A 'sectional drawing (b). It is the figure (a) seen from the bottom face for showing typically the LED lighting apparatus of 3rd Example, and the perspective view (b) seen from diagonally lower side. It is the perspective view (a) top view (b) seen from the diagonally upper side for showing typically the LED lighting apparatus of 3rd Example. It is the side view (a) which shows typically 4th Example of the LED lighting apparatus which concerns on this invention, and its A-A 'sectional drawing (b). It is the figure (a) seen from the bottom face for demonstrating the LED lighting apparatus of 4th Example typically, and the perspective view (b) seen from diagonally lower side. It is the perspective view (a) top view (b) seen from the diagonally upper side for showing typically the LED lighting apparatus of 4th Example. It is a perspective view which shows typically the heat sink currently applied to the LED lighting apparatus of the other Example. It is a top view which shows typically the example of another arrangement structure of the LED light source applied to the LED lighting apparatus of this invention. It is a top view which abbreviate | omits one part structure and shows typically the heat sink applied to the further another Example of the LED lighting apparatus which concerns on this invention. It is a top view which abbreviate | omits one part structure and shows typically the heat sink used for the further another Example of the LED lighting apparatus which concerns on this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1A schematically shows a side view of the first embodiment of the LED lighting device according to the present invention, and FIG. 1B schematically shows a cross-sectional view taken along line AA ′. Is shown in Further, FIG. 2A schematically shows a view from the bottom side of the LED lighting device of the first embodiment, and FIG. 2B shows the LED lighting device of the first embodiment obliquely. A perspective view seen from the lower side is schematically shown, and FIG. 3A schematically shows a perspective view of the LED lighting device of the first embodiment seen obliquely from the upper side, and FIG. The figure (top view) seen from the upper surface side of the LED lighting apparatus of 1st Example is typically shown.

  As shown in these drawings, the LED lighting device 1 of the first embodiment includes a heat sink 2 that dissipates heat of an electronic equipment including an LED light source and a power source of the LED light source, and is applied to this embodiment. A perspective view of the heat sink 2 is shown in FIG. 4 with a part of the configuration omitted, and FIG. 5 is a plan view thereof.

  As shown in FIGS. 1 to 5, the heat sink 2 provided in the LED lighting device 1 of the first embodiment has a cylindrical body 3 and extends outward from the outer peripheral wall of the cylindrical body 3. The plurality of plate-like heat radiation fins 4 formed in this manner are provided in the circumferential direction of the cylindrical body 3 with a space between each other, and the cylindrical body 3 and the thermal radiation fin 4 are integrally formed. The plate surfaces of the radiating fins 4 are opposed to each other, and although not shown in FIGS. 4 and 5, as shown in FIGS. 1 to 3, on one end side of the cylindrical body 3 of the heat sink 2, A substrate 5 in which a through hole 15 corresponding to the tube hole of the tube body 3 is formed is provided, and the tube body 3 and the radiation fins 4 are disposed on one side (surface side) of the substrate 5.

  Each of the plurality of radiating fins 4 is formed in a direction extending radially from the inner center portion of the cylindrical body 3, and in this embodiment, a part of the radiating fins 4 is excluded, and the tip side of the radiating fin 4 (the cylindrical body 3). The projecting front end side is formed to protrude several mm (for example, 5 mm) from the substrate 5. In addition, although the front end side of many radiation fins 4 is protruded from the board | substrate 5 here, the front end side of the radiation fin 4 does not need to protrude from the board | substrate 5. FIG. Further, the heat source to which the LED light source 6 is directly or indirectly thermally connected to the substrate surface 16 side (back surface side) of the substrate 5 of the heat sink 2 opposite to the surface on which the radiation fins 4 are disposed. It is made of a connecting surface.

  Further, in the LED lighting device of the present invention, a plurality of LED light sources 6 are arranged at intervals, and in this embodiment, a plurality of LED light sources 6 are integrated as shown in FIG. A COB (chip-on-board) 40 that is an LED light source integrated body is formed, and is directly bonded to the substrate surface 16 of the substrate 5 that is a thermal connection surface of the heat sink 2 and arranged with a space therebetween. In this way, the LED light source 6 can be directly and thermally connected to the back side of the substrate 5 of the heat sink 2.

  Further, as shown in FIG. 6A and the like, a transparent cover 14 covering the area where the LED light source 6 is disposed is provided on the substrate surface 16 side with an interval from the LED light source 6. The area where the LED light source 6 is disposed is airtight and liquid-tight, and the LED light source 6 is formed so as not to be affected by adverse effects such as moisture. The cover 14 is provided with a support plate portion 41 that supports a part (folded portion) of the cable 20 that is drawn out from the lower side of the electronic equipment 10 and is folded back. Air is introduced into the through hole 15 of the substrate 5 of the heat sink 2 through the opening. In addition, in FIG.1 (b), description of the cable 20 is abbreviate | omitted.

  Further, in this embodiment, the through hole 15 of the substrate 5 is formed so as to correspond to the cylindrical hole of the cylinder 3, but the through hole 15 is formed to a minimum size through which the cable 20 can penetrate, for example. May be. Further, the substrate 5 does not have to be formed with a through hole. For example, a through hole through which the cable 20 is passed is formed on the cylindrical body 3 side, and the cable 20 can be connected to the LED light source 6 through the hole. May be. Thus, the connection mode between the electronic equipment 10 and the LED light source 6 is not particularly limited, and is appropriately set.

  As shown in FIG. 1B, in this embodiment, the cylindrical body 3 of the heat sink 2 is divided into a plurality of upper and lower parts to form divided bodies 7 (7a, 7b). Are arranged in the vertical direction with a gap therebetween. And the radiation fin 4 is arrange | positioned for every division body 7a, 7b of the cylindrical body 3, and the radiation fins 4 for every division body 7a, 7b are mutually spaced apart in the up-down direction, The division body of the cylinder body 3 A heat sink forming part 8 (8a, 8b) is formed having 7a, 7b and a plurality of radiating fins 4 provided for each of the divided bodies 7a, 7b.

  Each of the heat sink forming parts 8a and 8b is an aluminum alloy 6063 (JIS standard) of an aluminum-containing metal, and the cross section is formed in the same shape by extrusion molding, and the heat sink forming parts 8a and 8b are spaced apart from each other. The heat sink 2 is formed so as to be light in weight by being superposed in the vertical direction. The heat sink 2 can be anodized or painted to prevent corrosion.

  A ring-shaped heat insulating member 9 having a thermal conductivity lower than that of the cylindrical body 3 is provided in an interval between the divided bodies 7 a and 7 b of the cylindrical body 3, and the divided bodies 7 a and 7 b are connected to each other via the thermal insulating member 9. The heat sink forming parts 8a and 8b are connected to each other. The heat insulating member 9 is fixed using, for example, a screw (not shown) provided on the screwing portion 26. And in the cylinder of the cylinder 3 of the heat sink 2, an electronic related equipment (for example, a power supply BOX: box) 10 including the power source of the LED light source 6 is accommodated.

  Further, in the present embodiment, when the heat sink 2 is arranged so that the cylinder length direction of the cylinder 3 is lateral, that is, as shown in FIG. 5, the heat sink forming parts 8 a and 8 b are connected to the cylinder of the cylinder 3. When arranged so that the longitudinal direction is horizontal, the tip positions of at least three (four in this example) adjacent radiating fins 4 which are the lower end side in the horizontal posture are on the same plane (see chain line C1). The adjacent radiating fins 4 are formed so as to have the same length. In the following description, the state in which the lengths of the radiating fins 4 are formed in this way is also referred to as a fin cut configuration.

  In the present embodiment, the length of the radiating fin 4 is such that the tip positions of the five adjacent radiating fins 4 on the upper end side in the horizontal orientation of the heat sink 2 are arranged on the same plane (see the chain line C2). Are formed in a uniform shape (having a fin-cut configuration), and the cross-sectional shape of the heat sink 2 is formed substantially symmetrically.

  By applying such a fin cut configuration and providing the fin cut configuration at least on the lower end side in the horizontal orientation of the heat sink 2, when forming the heat sink forming parts 8a and 8b by extrusion molding, the heat sink 2 is still in a soft state immediately after extrusion. The heat sink 2 can be formed without causing a problem that the shape of the extruded product of the heat sink is lost, and the yield of manufacturing the heat sink 2 can be improved.

  Further, by applying such a fin cut configuration, the heat sink forming part 8 is formed. For example, the substrate 5 of the heat sink 2 is also shaped to match the fin cut configuration of the heat sink forming part 8 (part of the circle is dissipated). When the plurality of LED lighting devices 1 are used as an aggregate, for example, as shown in FIG. 5B, the heat sink forming part 8 is formed. Since the density of each other can be improved (the density of the heat sink 2 can be improved), the density of the LED lighting device 1 can be further improved.

  Note that the heat sink forming parts 8a and 8b are not necessarily formed by extrusion, and an appropriate manufacturing method such as a die casting method or a forging method can be applied.

  Moreover, the cylinder 3 is not necessarily a true cylindrical shape, and may be an elliptical cylindrical shape or a polygonal cylindrical shape (a cylindrical shape whose cross section is a polygonal shape). If a large number of corners are formed, such as a square shape, it can be approximated to a perfect circle. Therefore, for example, as shown in FIG. 22, for each one side 35 of the 36-corner shape, one heat radiating fin 4 extending outward from the side 35 or a plurality of the fins 4 spaced apart from each other is provided (in this figure, heat radiation The heat sink 2 may be formed by forming the member 36 having a shape of one fin 4) using a press process or the like and then joining the members 36 to form the heat sink forming part 8. In addition, the number of corners in the case of forming a polygonal cylinder shape is not particularly limited, and is appropriately set.

  In this embodiment, of the divided bodies 7a and 7b of the cylindrical body 3, the lowermost divided body 7a adjacent to the substrate 5 is thermally disconnected from the electronic equipment 10 and is the second stage from the bottom. The divided body 7b is thermally connected to the electronic equipment 10. That is, the equipment support portion 12 having the fixing surface 11 for fixing the electronic equipment 10 is formed in the cylinder 7b of the cylinder 3 that is thermally connected to the electronic equipment 10. The electronic equipment 10 is fixed to the fixing surface 11 of the equipment support 12 so that the electronic equipment 10 and the divided body 7b of the cylinder 3 are thermally connected (the fixing surface 11 is the electronic equipment). 10), and the electronic equipment 10 is not thermally connected to the equipment support 12 formed in the cylinder of the divided body 7a.

  In the present embodiment, the plurality of heat sink forming parts 8a and 8b are formed to have the same cross-sectional shape as described above, and electronic equipment is provided in the cylindrical body 3 of each of the heat sink forming parts 8a and 8b. An equipment support portion 12 having a surface capable of forming 10 fixed surfaces is formed (as described above, the equipment support portion 12 is also provided in the cylinder of the divided body 7a).

  However, the heat sink forming parts 8a and 8b are arranged so as to be overlapped in the vertical direction with the relative positions in the circumferential direction of the cylinder 3 being shifted from each other so that the equipment support parts 12 do not overlap in the vertical direction. The equipment 10 is arranged through a space (see S in FIG. 1B) with the equipment support portion 12 of the heat sink forming part 8a. With such an arrangement, the electronic equipment 10 is not supported by the equipment support portion 12 of the heat sink forming part 8a and is thermally disconnected.

  That is, in the present embodiment, the distance from the center of the cylindrical body of the equipment support 12 (see B in FIG. 1B) is the surface opposite to the surface fixed to the fixing surface of the electronic equipment 10. The heat sink forming part 8b (lower side) is formed to be larger than half of the width (see C in FIG. 1B) and has a divided body 7b of the cylindrical body 3 that is thermally connected to the electronic equipment 10 The heat sink forming part 8b) and the heat sink forming part 8a (the upper heat sink forming part 8a) having the divided body 7a of the cylindrical body 3 that is thermally disconnected from the electronic equipment 10 are the cylindrical body. The three relative positions in the circumferential direction are shifted from each other by 180 degrees and are superposed in the vertical direction.

  Then, as shown in FIG. 1B, the equipment support portion 12 of the heat sink formation part 8b (the connection side equipment support portion thermally connected to the electronic equipment 10) and the heat sink formation part 8a The equipment support section 12 (the equipment support section on the non-connection side that is not thermally connected to the electronic equipment 10) is arranged to face each other with a space therebetween, and the electronic equipment 10 is placed in the space. The related equipment 10 is fixed to the fixing surface 11 of the equipment support portion 12 on the heat sink forming part 8b side (thermal connection side with the electronic related equipment 10), and is spaced from the equipment support portion 12 of the heat sink forming part 8a ( 1 (see S in FIG. 1B).

  In the LED lighting device 1 of the present embodiment, a plurality of vent holes 32 are arranged on the upper side of the heat sink 2 (upper side of the upper heat sink forming part 8b) with a space in the circumferential direction of the cylindrical body 3. The air outlet base holder 33 is provided, and the base 31 is provided above the base holder 33.

  Here, the base 31 can be formed in a size specified in, for example, the JIS base E39, and as a result, the illumination device corresponding to the size of the base 31 is 50 W or more (up to about 300 W depending on the performance of the LED light source). LED illuminating device 1 having a high wattage can be formed. Even in that case, in the present embodiment, the LED lighting device 1 can also be reduced in weight by reducing the weight of the heat sink 2. Therefore, it is possible to reduce the risk of falling of the LED lighting device 1 against an earthquake, and it is possible to improve the workability at the time of construction and enable one person to work.

  As shown in FIG. 8, the electronic equipment 10 is provided with a heat pipe 13 along the longitudinal direction (in a mode along the longitudinal direction of the cylinder), and the heat pipe 13 is an electronic equipment. 10 is thermally connected to the divided body 7b of the cylindrical body 3 having the fixed surface 11 thermally connected to the body 10. That is, the electronic equipment 10 is thermally connected to the divided body 7b of the heat sink forming part 8b even through the heat pipe 13. In FIG. 1B, the heat pipe 13 is not shown, but the heat pipe 13 is provided on the right end side of the electronic equipment 10 in FIG. 1B, and the heat sink forming part 8b. It is thermally connected in the form of contacting with the fixed surface 11.

  Further, as shown in FIG. 8, an AC input cable 19 and a DC output cable 20 are connected to the electronic equipment 10 and pulled out from the casing of the electronic equipment 10, and the AC input cable 19 and the DC output cable are drawn. Waterproof connectors 21 and 22 are respectively connected to the end portions 20 (the AC input cable 19 and the waterproof connectors 21 and 22 are not shown in FIGS. 1 to 3 and the like).

  As shown in FIG. 7, in the LED lighting device 1 of the present embodiment, as indicated by an arrow A, the cylinder passes through the through hole 15 of the substrate 5 of the heat sink 2 from the lower side of the LED lighting device 1. 3 is led upward from the vent hole 32 of the cap holder 33 shown in FIG. The heat of the electronic equipment 10 is radiated by this air flow. Further, since the electronic equipment 10 is thermally connected to the fixed surface 11 of the divided body 7b of the heat sink forming part 8b, the heat of the electronic related equipment 10 can be efficiently transmitted through the heat sink forming part 8b. Heat is dissipated. Therefore, the heat of the electronic equipment 10 is dissipated very efficiently.

  When the mounting surface (substrate surface 16) of the LED light source 6 on the substrate 5 is downward, the air flow in the heat sink forming parts 8a and 8b is mainly as shown by arrows B and C in FIG. Yes, air flows from the projecting front end side of the radiating fin 4 on the lower side of each heat sink forming part 8a, 8b toward the cylindrical body 3 side, and the upper side along the outer peripheral side of the cylindrical body 3 or the plate surface of the radiating fin 4 It flows toward. As described above, the heat of the electronic equipment 10 is dissipated by the air flow, and the heat of the LED light source 6 is also efficiently dissipated.

  In this embodiment, since the cylinder 3 of the heat sink forming part 8a is not thermally connected to the electronic equipment 10, the heat of the LED light source 6 is efficiently dissipated by the heat sink forming part 8a. The heat of the electronic equipment 10 is radiated by the air passing through the cylinder 3 of the heat sink forming parts 8a and 8b as shown by the arrow A in FIG. 7 and the heat sink forming part 8b.

  By the way, in the heat sink 2 applied to the present embodiment, the number of radiating fins 4 provided in each heat sink forming part 8a, 8b is an odd number (for example, 25), and each heat sink forming part 8a, 8b. The intervals between the heat radiation fins 4 are equal pitches formed at equal intervals. In this way, by disposing the heat sink forming parts 8a and 8b in which odd-numbered heat dissipating fins 4 are arranged at equal pitches while being shifted by 180 ° in the circumferential direction as described above, heat sinks adjacent to each other in the vertical direction are formed. The heat radiation fins 4 provided on the parts 8a and 8b for the heat sink are provided with the half pitch (half pitch) position of the arrangement pitch shifted in the circumferential direction of the cylindrical body 3, so that the heat sink with higher heat radiation efficiency can be obtained. It is also one of the features of this embodiment that 2 can be manufactured more easily.

  As described above, the method of manufacturing the heat sink forming parts 8 (8a, 8b) is not particularly limited. In this embodiment, the heat sink forming parts 8a, 8b are manufactured by extrusion molding as described above. Therefore, the heat sink forming parts 8a and 8b having the same cross-sectional shape can be manufactured very easily and quickly, and the cost can be reduced to a very low cost. Yes.

  In other words, as is well known, in extrusion molding, even if the length of the molded product to be manufactured (length in the direction perpendicular to the cross section) is different from each other, it can be manufactured using one extrusion mold (die). The heat sink forming parts 8a and 8b having the same cross-sectional shape as in the present embodiment can be manufactured by using a single extrusion molding die, since it may be cut to an appropriate length in the extruded state. Therefore, the heat sink forming parts 8a and 8b can be manufactured at a very low cost, whereby the heat sink 2 can be manufactured at a low cost and the cost of the LED lighting device 1 can be reduced.

  In addition, when trying to manufacture the heat sink forming parts 8a, 8b as applied to the present embodiment by applying the manufacturing method of the die casting method, in the case of the die casting method, after molding the molded product, Since there is a process of pulling the mold from one direction of the molded product, the thickness increases so that the thickness increases from one end side (that is, the leading end side) to the other end side (base end side) in the direction of pulling the mold. It is necessary to form with a gradient of Therefore, when the length from one end side to the other end side in the direction in which the mold is pulled out is long, the thickness on the other end side (base end side) becomes considerably thick.

  That is, for example, when the heat sink forming parts 8a and 8b are provided as in the present embodiment, the length of the cylindrical body 3 of each of the heat sink forming parts 8a and 8b is long. When the mold used in the die casting method is pulled out in the longitudinal direction of the cylindrical body 3, the thickness of the base end side (lower side) of the radiating fin 4 is increased to about 5 to 8 mm, for example. When the heat sink forming parts 8a and 8b are formed by extrusion molding as described above, the thickness of the heat radiating fins 4 can be thin, for example, about 2 mm, and can be formed uniformly or substantially uniformly.

  Therefore, since the heat radiation fins 4 can be arranged at a narrow interval and a heat radiation area can be sufficiently secured, the heat radiation efficiency by the heat sink 2 can be improved, and the heat radiation fin 4 having a small thickness can reduce the weight of the heat sink 2. The life of the LED lighting device 1 can be improved and the weight thereof can be reduced.

  Furthermore, the material generally used when the heat sink 2 is formed by the die-cast method is ADC12 (JIS standard), and the thermal conductivity of this material is about 96 W / mk. The aluminum alloy 6063 (JIS standard) applied in the example has a thermal conductivity of about 210 W / mk and a thermal conductivity of more than twice, so that in this respect, the heat dissipation efficiency can be improved. The long-life LED lighting device 1 can be realized by the excellent heat dissipation efficiency of the heat sink 2.

  In addition, although the magnitude | size of the LED lighting apparatus 1 of a present Example is not specifically limited, As an example, the height shown by (H) of Fig.1 (a) is 340 mm, and the heat sink formation part 8a The height from the substrate surface of the heat sink 2 to the upper surface of the heat sink forming part 8b is 230 mm. Further, the outer diameter of the cover 14 shown by (R1) in FIG. 1A is 166 mmφ, and the outer diameter of the substrate 5 of the heat sink 2 shown by (R2) is 187 mmφ. .

  Hereinafter, a second embodiment of the LED lighting device according to the present invention will be described. In the description of the second embodiment, the same reference numerals are assigned to the same name portions as those in the first embodiment, and the duplicate description is omitted or simplified.

  FIG. 9A schematically shows a side view of the LED lighting device 1 of the second embodiment, and its AA ′ cross-sectional view is schematically shown in FIG. 9B. The figure seen from the bottom face side of the LED illuminating device 1 of 2nd Example is typically shown by a), and the perspective view which looked at the LED illuminating device 1 from diagonally lower side to FIG.10 (b) is typical. FIG. 11 (a) schematically shows a perspective view of the LED illumination device of the second embodiment as viewed obliquely from above, and FIG. 11 (b) shows the LED illumination of the second embodiment. The figure (plan view) seen from the upper surface side of the apparatus is schematically shown.

  As shown in these drawings, the second embodiment is configured in substantially the same manner as the first embodiment, and the second embodiment is different from the first embodiment in that there are a plurality of features (here Among the two heat sink forming parts 8a and 8b, the heat sink forming part 8b arranged on the upper side is more outward from the outer peripheral wall of the cylindrical body 3 than the heat sink forming part 8a arranged on the lower side. That is, the length in the extending direction of the radiating fins 4 is formed short (for example, the value of R3 in FIG. 9 is 156 mm).

  Further, in the second embodiment, as shown in FIG. 12, the protruding (extension) lengths of the radiating fins 4 from the cylindrical body 30 in the respective heat sink forming parts 8a and 8b are almost the same ( 10 and FIG. 11), as in the first embodiment, the lengths of adjacent radiating fins 4 are aligned so that the tip positions are arranged on the same plane when the heat sink 2 is arranged sideways. None are formed (does not have a fin-cut configuration).

  As in the second embodiment, even if the lengths of the heat sink fins 4 of the heat sink forming part 8a arranged on the upper side and the heat sink forming part 8b arranged on the lower side are different from each other, Since the cross-sectional configurations other than are substantially the same, it is easy to manufacture the heat sink forming parts 8a and 8b. Therefore, the cost of the heat sink 2 can be reduced and the cost of the LED lighting device 1 can be reduced. Also, by forming the upper heat sink forming part 8a to be smaller in diameter, heat dissipation can be achieved than in the first embodiment. Although the efficiency is slightly reduced, it is possible to further reduce the weight and improve the appearance.

  Hereinafter, a third embodiment of the LED lighting device according to the present invention will be described. In the description of the third embodiment, the same reference numerals are assigned to the same name portions as those in the first and second embodiments, and the duplicate description is omitted or simplified.

  FIG. 13 (a) schematically shows a side view of the LED lighting device 1 of the third embodiment, and its AA ′ cross-sectional view is schematically shown in FIG. 13 (b). The figure seen from the bottom face side of the LED illuminating device 1 of 2nd Example is typically shown by a), and the perspective view which looked at the LED illuminating device 1 from diagonally lower side to FIG.14 (b) is typical. FIG. 15 (a) schematically shows a perspective view of the LED lighting device of the third embodiment as viewed obliquely from above, and FIG. 15 (b) shows the LED lighting of the third embodiment. The figure (plan view) seen from the upper surface side of the apparatus is schematically shown.

  As shown in these drawings, the third embodiment is configured in substantially the same manner as the first embodiment, and the third embodiment is different from the first embodiment in that the third embodiment is vertically different from each other. That is, the heat dissipating fins 4 disposed at equal pitches provided in the adjacent heat sink forming parts 8a and 8b are provided in such a manner that they are vertically overlapped at the same position.

  That is, in the third embodiment, the equipment support part 12 is also arranged so as to overlap vertically so that the heat sink forming parts 8a and 8b having the same cross-sectional shape are in the same direction. The electronic equipment 10 is fixed to the fixing surface 11 of each equipment support 12 of the parts 8a and 8b and is also thermally connected. In the third embodiment, since the electronic equipment 10 is thermally connected to the fixed surface 11 of each equipment support 12 of the heat sink forming parts 8a and 8b as described above, it is provided in the first embodiment. The heat pipe 13 is omitted.

  In addition, the heat sink 2 close | similar to the aspect of the heat sink 2 applied to the LED lighting apparatus 1 of 3rd Example is shown with the typical perspective view by FIG. The heat sink 2 applied to the third embodiment is formed by applying the fin-cut configuration as described in the first embodiment to the heat sink 2 having the perspective view configuration shown in FIG.

  Hereinafter, a fourth embodiment of the LED lighting device according to the present invention will be described. In the description of the fourth embodiment, the same reference numerals are assigned to the same name portions as those in the first to third embodiments, and the duplicate description is omitted or simplified.

  FIG. 16A schematically shows a side view of the LED lighting device 1 of the third embodiment, and its AA ′ cross-sectional view is schematically shown in FIG. 16B. The figure which looked at from the bottom face side of the LED lighting apparatus 1 of 2nd Example is typically shown by a), and the perspective view which looked at the LED lighting apparatus 1 from diagonally lower side by FIG. 17 (b) is typical. FIG. 18A schematically shows a top view of the LED illumination device 1 as viewed from above (plan view), and FIG. 18B is a perspective view of the LED illumination device 1 as viewed from diagonally above. Is schematically shown.

  As shown in these drawings, the fourth embodiment is configured in substantially the same manner as the third embodiment, and the fourth embodiment is different from the third embodiment in that there are a plurality of features (here Among the two heat sink forming parts 8a and 8b, the heat sink forming part 8a arranged on the upper side is more of the cylindrical body 3 of the heat radiating fin 4 than the heat sink forming part 8b arranged on the lower side. That is, the length in the extending direction from the outer peripheral wall to the outside is short.

  The present invention is not limited to the above embodiments, and can take various forms. For example, in the above-described embodiment, the COB 40 is directly joined to the heat sink 2 when the LED light source 6 is disposed, but instead, for example, the LED light source disposed in a scattered manner as shown in FIG. The substrate 17 may be provided on the back side of the heat sink 2 and the LED light source 6 may be indirectly thermally connected to the back side of the substrate 5 of the heat sink 2. In addition, the code | symbol 27 of FIG. 19 shows a through-hole.

  In each of the above embodiments, the heat sink 2 is formed by arranging two heat sink forming parts 8a and 8b so as to overlap each other. However, the heat sink 2 may be configured not to be divided. The above heat sink forming parts 8 may be formed by being stacked one above the other. In addition, the size and shape of each heat sink forming part 8 when three or more heat sink forming parts 8 are arranged in an overlapping manner are also set as appropriate.

  Furthermore, in each said Example, although the ring-shaped heat insulation member 9 was provided in the space | interval of the division bodies 7a and 7b of the cylinder 3, the heat insulation member 9 is not necessarily made into a ring shape, What is necessary is just what can be hold | maintained in the aspect which can maintain the space | interval of the division bodies 7a and 7b. Further, the connection mode between the heat insulating member 9 and the divided bodies 7a and 7b is not limited to mechanical connection by screwing or the like, and may be connected by bonding using an adhesive or welding. However, it is desirable to connect the heat insulating member 9 by screwing or the like because the fixing strength between the divided bodies 7a and 7b and the heat insulating member 9 can be increased.

  Moreover, in the said 1st Example and 3rd Example, the length of the radiation fin 4 for each heat sink formation part 8a, 8b is the same like 2nd, 4th Example, without providing a fin cut structure. In the second and fourth embodiments, a fin cut configuration may be provided as in the first and third embodiments.

  Further, in the first embodiment and the third embodiment, in the horizontal orientation of the heat sink 2, the tip positions of the four adjacent radiation fins 4 that are the lower end side and the tip positions of the five radiation fins 4 that are the upper end side, (The fin cut configuration is applied to both the upper end side and the lower end side in the horizontal posture of the heat sink forming parts 8a and 8b), but the tip position of the radiating fin 4 that becomes the lower end side in the horizontal posture of the heat sink 2 Alternatively, the tips of the plurality of adjacent radiating fins 4 on at least one of the left and right sides in the lateral orientation of the heat sink 2 may be aligned.

  That is, in the heat sink 2 applied to the present invention, if the radiating fins 4 are formed to extend outward from the outer peripheral wall of the cylindrical body 3 and the radiating fins 4 and the cylindrical body 3 are integrated, the radiating fins 4 are provided. The details of the shape of the heat sink 2, such as the number, shape, thickness, size, etc., are appropriately set.

  Furthermore, in the above-described embodiment, the equipment support portion 12 of the heat sink forming part 8b and the equipment support portion 12 of the heat sink forming part 8a are arranged to face each other with a space therebetween. For example, as shown in FIG. The equipment support portion 12 (12b) of the heat sink formation part 8b and the equipment support portion 12 (12a) of the heat sink formation part 8a may be arranged so as to be shifted in a manner perpendicular to each other.

  Even in such a mode, the equipment support portions 12a and 12b are arranged so as to be shifted from each other, so that the electronic equipment 10 is on the heat sink forming part 8b side (thermal connection side with the electronic equipment 10). The equipment of the heat sink forming part 8 which is predetermined as the electronic related equipment 10 is fixed to the fixing surface 11 of the equipment supporting part 12 and arranged with a distance from the equipment supporting part 12 of the heat sink forming part 8a. It can be selectively fixed to the fixing surface 11 of the support portion 12 and can be selectively thermally connected to the heat sink forming part 8 side.

  Furthermore, a fin for heat dissipation may be provided in the electronic equipment 10. In this case, one or a plurality of fins spaced from each other may be formed so as to protrude outward from the casing of the electronic equipment 10, and the heat radiation area (air) of the electronic equipment 10 is formed by the formation of the heat radiation fins. Can be expanded.

  Further, when the fins for heat dissipation are formed to extend in the cylinder core direction of the cylinder 3 of the heat sink 2 (Z-axis direction in FIG. 7 and the like), the air flowing in the cylinder 3 as shown in FIG. The heat dissipation efficiency can be further improved. For example, it has been confirmed that by providing fins for heat dissipation in the electronic equipment 10, the temperature of the electronic equipment 10 can be lowered by about 4 to 5 ° C. In addition, when providing the fin for heat dissipation in the electronic equipment 10, it may be formed on one surface of the casing, or may be formed on two or more surfaces. It may be applied.

  Further, a fan or the like that forcibly generates an air flow from the through hole 15 side to the vent hole 32 side in a portion of the cylinder 3 of the heat sink 2 corresponding to the vicinity of the through hole 15 of the substrate 5. The forced cooling means may be provided. In this case, the power source of the fan can be selected so that it can be used in common with the power source of the LED light source 6, and the cooling efficiency of the electronic equipment 10 can be improved by providing the forced cooling means.

  Further, in the configuration in which the forced cooling means such as a fan is provided in this way, the temperature means for detecting at least one of the temperature in the electronic equipment 10 and the temperature of the casing, and the temperature detected by the temperature detection means You may provide the control structure which starts operation of a forced cooling means, when the forced cooling start temperature set beforehand is exceeded. The forced cooling start temperature is determined based on the heat resistant temperature of electronic components such as capacitors provided in the electronic equipment 10 and is set to 80 ° C., for example.

  Furthermore, you may provide the fixing | fixed part which fixes the touch stop of an illuminating device in the cover member 14 or the heat sink 2 of the LED illuminating device 1. FIG.

  The LED lighting device of the present invention can be used as a lighting device for home use or industrial field because it has a simple configuration and can improve the life and can be reduced in weight.

DESCRIPTION OF SYMBOLS 1 LED illuminating device 2 Heat sink 3 Cylindrical body 4 Radiation fin 5 Board | substrate 6 LED light source 7,7a, 7b Divided body 8,8a, 8b Heat sink formation part 9 Thermal insulation member 10 Electronic-related equipment 11 Fixed surface 12 Equipment support part 13 Heat Pipe 14 Cover 15 Through-hole 16 Substrate surface 17 LED light source mounting substrate 18 Heat pipe

Claims (11)

  A plurality of plate-like radiating fins formed to extend outward from the outer peripheral wall of the cylindrical body are provided at intervals in the circumferential direction of the cylindrical body, and the cylindrical body and the radiating fin are integrated. A heat sink is formed, and a substrate is provided on one end side of the cylindrical body of the heat sink, and the cylindrical body and the radiation fins are disposed on one side of the substrate. The substrate surface side opposite to the surface on which the heat dissipating fins are disposed is a thermal connection surface on which a plurality of LED light sources disposed at intervals are thermally connected directly or indirectly. The electronic equipment including the power source of the LED light source is accommodated in the cylinder of the cylindrical body, and a thermal connection with the electronic related equipment is provided in the cylindrical body. LED lighting device.   The heat sink cylinder is divided into a plurality of upper and lower parts, and the divided parts are arranged with an interval in the vertical direction. A radiating fin is provided for each of the divided parts of the cylindrical body. They are also spaced apart from each other in the vertical direction, and each of the heat sink forming parts is formed by having a divided body of the cylindrical body and a plurality of heat dissipating fins provided for each of the divided bodies. Are arranged so as to overlap each other with a gap therebetween, and the divided parts of the cylindrical bodies are connected to each other via a heat insulating member having a lower thermal conductivity than the cylindrical bodies. 2. The LED lighting device according to claim 1, wherein a thermal connection part with an electronic-related equipment is formed in at least one of the two or more divided parts from the bottom of the body.   3. The LED according to claim 2, wherein, among the divided parts of the cylindrical body forming the heat sink forming part, the lowermost part adjacent to the substrate is thermally disconnected from the electronic equipment. Lighting device.   An equipment support portion having a fixing surface for fixing the electronic equipment is formed in a cylinder of the cylindrical body that is thermally connected to the electronic equipment, and the fixing of the equipment support section is performed. The LED lighting device according to claim 2 or 3, wherein a surface is formed as a thermal connection portion with the electronic equipment.   A plurality of heat sink forming parts are formed in the same cross-sectional shape, and a device support portion having a surface capable of forming a fixing surface of electronic equipment is formed in the cylinder of each of the heat sink forming parts. , A heat sink forming part having a cylindrical divided body in which the electronic equipment is thermally connected to the fixed surface of the equipment support section, and the equipment support section is not supported by the electronic equipment. In addition, the heat sink forming part having the cylindrical divided body in the non-connected state is overlapped in the vertical direction by shifting the relative positions in the circumferential direction of the cylindrical body so that the equipment support portions do not overlap in the vertical direction. The LED illumination device according to claim 2, wherein the LED illumination device is disposed.   The distance from the center of the cylinder of the equipment support is larger than half the width from the surface fixed to the fixed surface of the electronic equipment to the opposite surface, and it is thermally connected to the electronic equipment. A heat sink forming part having a cylindrical divided body and a heat sink forming part having a cylindrical divided body that is thermally disconnected from the electronic-related equipment are positioned relative to each other in the circumferential direction of the cylindrical body. A connection-side equipment support portion that is arranged 180 degrees apart from each other and stacked in the vertical direction and is thermally connected to the electronic equipment, and a non-connection equipment that is not thermally connected to the electronic equipment 6. The LED according to claim 5, wherein the support part is disposed opposite to each other with a space therebetween, and the electronic equipment is disposed at the space and fixed to a fixed surface of the connection-side material support part. Lighting device.   The heat dissipating fins provided in the heat sink forming parts adjacent to each other in the vertical direction are provided so as to be displaced from each other in the circumferential direction of the cylindrical body. LED lighting device as described in one.   Of the plurality of heat sink forming parts, the heat sink forming part arranged on the upper side is in the direction of extension from the outer peripheral wall of the cylindrical body of the radiating fin to the outside than the heat sink forming part arranged on the lower side. The LED lighting device according to any one of claims 2 to 7, wherein the LED lighting device has a short length.   The plurality of radiating fins extending outward from the outer peripheral wall of the cylindrical body are each formed in a direction extending radially from the inner center portion of the cylindrical body, and the cylindrical length direction of the cylindrical body is lateral. When the heat sinks are arranged in such a manner, the lengths of the adjacent radiation fins are aligned so that the tip positions of at least three adjacent radiation fins that are at least the lower end side in the horizontal orientation are arranged on the same plane. The LED lighting device according to claim 1, wherein the LED lighting device is formed.   The electronic equipment is provided with a heat pipe along the longitudinal direction of the cylindrical body, and the heat pipe is thermally connected to a divided body of the cylindrical body having a fixed surface thermally connected to the electronic equipment. The LED lighting device according to claim 1, wherein the LED lighting device is a light emitting diode.   It is a heat sink used for the LED illuminating device as described in any one of Claims 1 thru | or 10, Comprising: The several plate-shaped radiation fin formed by extending outward from the outer peripheral wall of a cylinder is formed. Provided in the circumferential direction of the cylindrical body at intervals, the cylindrical body and the heat radiating fin are integrally formed, a substrate is provided at one end side of the cylindrical body, and is provided on one side of the substrate. A heat sink, wherein the cylindrical body and the heat radiating fins are disposed.

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