JP2016057997A - Electric communication computing module capable of housing printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric communication computing module capable of housing a printed circuit board.SOLUTION: The electric communication computing module capable of housing the printed circuit board guides air outside of a casing main body, by sucking the air outside of the casing body, so as to enter the casing main body, thereby enabling heat generated on the circuit board to be removed to prevent a damage of the circuit board due to an excessive amount of the heat remaining on the circuit board. The casing main body is provided with at least a bottom outer casing and a set of inner partition plates. The inside of the casing main body is divided by the set of the inner partition plates into four storage areas, and air is taken in through a plurality of sets of ventilation ports to obtain a heat radiation effect.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat dissipation structure, and more particularly to a heat dissipation structure that can be applied to contain printed circuit boards and electronic devices.

In electronic products, including electrical elements such as electrical resistors, electrical capacitors, and central processing units, heat is generated during work, and excessive amounts of heat accumulate, causing the internal temperature of the electronic product to rise, damaging the elements. Therefore, it is necessary to use a heat dissipation device for heat dissipation.
In the conventional heat dissipation technique, a fan is additionally mounted in the housing, and heat is radiated to the electric element by utilizing the convection effect of air generated by the fan. In addition, as a common heat dissipation technology, heat dissipation is realized by exhausting hot air or increasing the heat dissipation area by additionally attaching a heat dissipation device such as a heatsink or heatsink to the electrical element or housing. To do.

  In general, a set of heat sinks are additionally mounted above the central processor in the server to assist in heat dissipation of the central processor using a large amount of contact area between the heat sink and air. To do. However, even if the heat dissipation purpose of the central processing unit can be achieved, the amount of discharged heat is conducted to other electric elements through heat conduction, and the temperature of the other electric elements may become excessively high. Therefore, it cannot be said that sufficient heat dissipation has been completed with a heat sink alone. Furthermore, it is necessary to effectively discharge heat in consideration of heat convection. If this is not done, the true heat dissipation effect cannot be achieved.

When the airflow is passed through the central processor, the thermal energy generated in the central processor is removed, and at the same time, the thermal energy is absorbed and the temperature of the airflow rises. When such a high-temperature air flow is allowed to flow again through the other electronic elements, the other electric elements are unlikely to dissipate heat and the temperature rises.
In order to overcome one of the prior arts, how to improve the flow rate of the airflow, increase the work efficiency of the heat radiating and blowing device, or increase the amount of exhausted air is a problem. However, when the work rate of the heat dissipation / blower device is increased, the burden on the system is relatively increased accordingly. Even if the heat energy generated in the heat dissipation / blower device is increased, the overall heat dissipation effect cannot be improved. In addition, the server volume is always reduced as much as possible in order to obtain the maximum utilization rate. Therefore, in order to achieve a desired heat dissipation effect, it is necessary to appropriately utilize a space that can be used for the circulation of the internal airflow.

In order to improve the server to a higher operating efficiency, the mounting density on the circuit board has been increased more and more as the dimensions of the electric elements are further reduced. In the future, the electrical circuit integration density of the circuit board in the server will surely increase, and the generated thermal energy will increase accordingly, so the work of heat dissipation design is also becoming more and more important. Server cooling or cooling methods need to pay more attention to thermal convection design and structural design, otherwise they will meet the heat dissipation demands of high thermal energy generated by the high operating efficiency of current servers I couldn't.
In view of the above, the present inventors have invented a telecommunication computing module that can accommodate a printed circuit board.

  The main object of the present invention is to absorb the gas outside the casing body and guide the gas by the structure, thereby removing the amount of heat generated on the circuit board and damaging the circuit board due to excessive accumulation of heat. By designing the structure in consideration of the thermal convection effect, the heat radiation function can be achieved without the need for additional cooling equipment such as water-cooled pipes. It is an object of the present invention to provide a telecommunication computing module that can accommodate a printed circuit board.

In order to achieve the object of the present invention, the present inventors have invented a telecommunication computing module that can accommodate a printed circuit board. The present invention includes a housing main body, and the housing main body further includes a bottom outer housing, an internal partition board set, an adapter circuit board, a first main circuit board module, and a second main circuit board module. Prepare.
The bottom outer casing includes an external right side plate and an external left side plate, and a first external ventilation port and a second external ventilation port are further formed on the external right side plate.
The internal partition plate set is installed in the bottom outer casing, and further includes a front right side plate, a front partition plate, a rear right side plate, a rear partition plate, and a rear left side plate. The front right side plate is locked and fixed inside the external right side plate, and has a front right side air inlet. In addition, the gas is caused to flow into the housing body through the second external ventilation port and the front right side ventilation port in order. The front partition plate has a front partition plate vent. The rear right side plate is locked and fixed inside the outer right side plate, and has a plurality of rear right side air inlets, and the plurality of rear right side air inlets correspond to the first external air outlet. The rear left side plate is locked and fixed inside the outer left side plate.
The adapter circuit board is installed in the bottom outer casing and has a plurality of adapter board ventilation holes. A first accommodation area is formed by the adapter circuit board, the front right side plate, and the front partition plate. A second receiving area is formed by the adapter circuit board, the front partition plate, and the external left side plate. A third accommodation area is formed by the adapter circuit board, the rear right side plate, and the rear partition plate. A fourth receiving area is formed by the adapter circuit board, the rear partition plate, and the rear left side plate.
In addition, gas is allowed to flow from the fourth accommodation area into the second accommodation area via the adapter substrate vent. In addition, gas is allowed to enter the third accommodation area through the first external ventilation port and the rear right ventilation port in order. In addition, gas is allowed to flow from the third accommodation area to the first accommodation area via the adapter substrate vent. In addition, gas is allowed to flow from the second accommodation area into the first accommodation area via the front partition plate vent.
The first main circuit board module is installed in the first accommodation area and is electrically connected to the adapter circuit board, and further includes a plurality of lower heat dissipation modules, a first side heat transfer path, and a second side heat transfer path. A path, a first main processor, a second main processor, a side heat transfer air inlet, and a plurality of memory modules. The plurality of lower heat dissipation modules are installed at a front portion of the first main circuit board module and are used to suck out gas in the first accommodation area. The first side heat conduction path is installed on the right side of the first main circuit board module, and one end thereof is close to the side heat conduction air inlet. The second heat transfer path is installed on the left side of the first main circuit board module. The first main processor is installed in the second half of the first main circuit board module. The second main processor is close to the first side heat transfer path. The side heat conduction air inlet is located on the right side of the first main circuit board module. A plurality of memory modules are installed on both sides of the first main processor and the second main processor, respectively. Further, the gas in the first housing area is sucked out by the lower heat radiating module, and at the same time, the front right side air inlet and the side heat inlet are passed through the second external air outlet from the outside of the bottom outer casing. Sequentially flow into the first containment zone and flow through the second main processor.
The second main circuit board module is installed in the first accommodation area, is located above the first main circuit board module, and is electrically connected to the adapter circuit board. The second main circuit board module further includes a plurality of upper heat dissipation modules, and the plurality of upper heat dissipation modules are installed at a front portion of the second main circuit board module, From the first containment zone. Thus, by sucking out the gas in the first housing area by the lower heat radiating module and the upper heat radiating module, the gas is allowed to flow from the third housing area into the first housing area, and at the same time, the gas is allowed to flow into the fourth housing area. Into the second receiving area and into the first receiving area. Further, gas is passed through the first main processor, the second main processor, and a plurality of memory modules. Further, the gas is sucked out from the first accommodation area by the upper heat dissipation module through the second main circuit board module from the front partition plate vent.

  More specifically, the rear right side plate further includes a plurality of first circuit board support frames, each of which is formed inside the plurality of rear right side air inlets. The rear partition plate further includes a plurality of second circuit board support frames, each corresponding to the plurality of first circuit board support frames. In addition, the apparatus includes a plurality of network circuit boards inserted into the third accommodation area and electrically connected to the adapter circuit board, and each network circuit board includes the first circuit board support frame and It is supported by the second circuit board support frame.

  More specifically, the rear right side plate further has a rear right wall surface air inlet, is formed on a side surface of the rear right side plate, and communicates with the first external ventilation port. One of the plurality of adapter board ventilation holes of the adapter circuit board is formed on the right side, and is connected to the rear right side wall ventilation hole. Gas is allowed to penetrate from the first external ventilation port, and the rear right side wall surface ventilation port and the adapter board ventilation port are sequentially entered into the first accommodation area, and then the first side heat conduction path is passed through. Guide to the second main processor.

  In addition, the telecommunication computing module capable of accommodating the printed circuit board of the present invention is further installed in the second accommodation area, and can suck out the gas in the second accommodation area, and the adapter circuit. A power supply that is electrically connected to the board; and a plurality of access devices that are stacked in the fourth accommodation area and electrically connected to the adapter circuit board.

  More specifically, in the present invention, a first guide surface is formed at one end of the first side heat conducting path, and a lower heat radiating module is connected to the other end. Thus, gas is first accommodated from the side heat conducting air inlet. After entering the zone, it flows along the first guide surface to the second main processor, and is sucked out of the first receiving zone by the lower heat dissipation module along the first side heat transfer path.

  More specifically, in the present invention, the first main circuit board module further includes at least one arithmetic processing unit and is close to the second side heat conduction path. The arithmetic processor is used to perform an arithmetic operation, and all of them generate heat similarly. For this reason, a heat dissipating piece is mounted above the arithmetic processor. The second side heat transfer path has a longitudinal flow port, and a second guide surface is formed at each end of the second side heat transfer path, and thus gas flows from the lower side of the second side heat transfer path from the vertical side. Guide to the upper side of the second side heat transfer path through the counterflow port. In addition, gas is allowed to flow from the third accommodation area to the first accommodation area, the arithmetic processor is caused to flow along one second guide surface of the gas, and the second treatment surface is passed along the second guide surface. It sucks out from the said 1st accommodation area by a lower heat dissipation module.

It is a disassembled schematic diagram of the housing body of the present invention. It is a plane schematic diagram of the housing body of the present invention. It is a plane schematic diagram of the 1st main circuit board module of the present invention. It is a perspective schematic diagram which shows the state by which the 1st main circuit board module and 2nd main circuit board module of this invention are inserted in the 1st accommodation area. It is a perspective schematic diagram of the rear right side plate of the present invention. It is a perspective schematic diagram of the rear part partition plate of this invention. It is a perspective schematic diagram which shows the state by which the network circuit board is inserted in the housing body of this invention. It is a front view of the adapter circuit board of this invention. It is a schematic diagram which shows the state by which the power supply device and the access apparatus are installed in the housing body of this invention. It is a side view which shows the assembly state of the bottom part housing | casing and internal partition board set of this invention. It is a perspective schematic diagram of the 1st main circuit board module of the present invention.

  In order to more clearly describe the telecommunications computing module capable of accommodating a printed circuit board submitted by the present invention, a preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

The electronic device included in the present invention is defined in conformity with the Advanced Telecommunication Computing Architecture (Advanced Telecommunication Computing Architecture). Please refer to FIGS. 1 is an exploded schematic view of the casing body of the present invention, FIG. 2 is a schematic plan view of the casing body of the present invention, and FIG. 3 is a first main circuit board module of the present invention. FIG. 4 is a schematic perspective view showing a state where the first main circuit board module and the second main circuit board module of the present invention are inserted into the first accommodation area.
As shown in FIGS. 1 to 4, the telecommunications computing module capable of accommodating the printed circuit board according to the present invention includes a housing body 1, which further includes a bottom outer housing 11, An internal partition board set 12, an adapter circuit board 13, a first main circuit board module 14, and a second main circuit board module 15 are provided.
The bottom outer casing 11 includes an external right side plate 111 and an external left side plate 112, and a first external ventilation port 1111 and a second external ventilation port 1112 are further formed on the external right side plate 111.
The internal partition plate set 12 is installed in the bottom outer casing 11, and further includes a front right plate 121, a front partition plate 122, a rear right plate 123, a rear partition plate 124, and a rear left plate. 125. The front right side plate 121 is locked and fixed inside the external right side plate 111 and has a front right side air inlet 1211. In addition, the gas is caused to flow into the casing body 1 through the second external ventilation port 1112 and the front right-side ventilation port 1211 sequentially. The front partition plate 122 has a front partition plate ventilation port 1221. The rear right side plate 123 is locked and fixed to the inside of the external right side plate 111 and has a plurality of rear right side air inlets 1231, and the plurality of rear right side air inlets 1231 are connected to the first external air outlet 1111. Correspond. The rear left side plate 125 is locked and fixed inside the outer left side plate 112.
The adapter circuit board 13 is installed in the bottom outer casing 11 and has a plurality of adapter board ventilation holes 131. The adapter circuit board 13, the front right side plate 121 and the front partition plate 122 form a first accommodation area 21. The adapter circuit board 13, the front partition plate 122 and the external left side plate 112 form a second accommodation area 22. The adapter circuit board 13, the rear right side plate 123 and the rear partition plate 124 form a third accommodation area 23. The adapter circuit board 13, the rear partition plate 124 and the rear left side plate 125 form a fourth accommodation area 24. Further, the gas is caused to flow into the second accommodation area 22 from the fourth accommodation area 24 via the adapter board ventilation hole 131. Further, the gas is allowed to enter the third accommodation area 23 through the first external ventilation port 1111 and the rear right ventilation port 1231 sequentially. In addition, gas is allowed to flow into the first accommodation area 21 from the third accommodation area 23 through the adapter substrate vent 131. In addition, the gas is caused to flow into the first accommodation area 21 from the second accommodation area 22 via the front partition plate vent 1221.
The first main circuit board module 14 is installed in the first accommodation area 21 and is electrically connected to the adapter circuit board 13, and further includes a plurality of lower heat radiation modules 141, first side heat conduction paths 142, and the like. The second side heat conduction path 143, the first main processor 144, the second main processor 145, the side heat conduction air inlet 146, and a plurality of memory modules 147. The plurality of lower heat dissipation modules 141 are installed at the front portion of the first main circuit board module 14 and are used to suck out the gas in the first accommodation area 21. The first heat conduction path 142 is installed on the right side of the first main circuit board module 14, and one end thereof is close to the side heat conduction air inlet 146. The second heat conduction path 143 is installed on the left side of the first main circuit board module 14.
The first main processor 144 is installed in the second half of the first main circuit board module 14. The second main processor 145 is close to the first side heat transfer path 142. The side heat conduction air inlet 146 is located on the right side of the first main circuit board module 14. The plurality of memory modules 147 are installed on both sides of the first main processor 144 and the second main processor 145, respectively. In addition, the lower heat dissipation module 141 sucks out the gas in the first accommodation area 21 and simultaneously, the gas is discharged from the outside of the bottom outer casing 11 through the second external ventilation port 1112 and the front right air inlet 1211 and the Then, the air is introduced into the first accommodation area 21 through the side heat conduction air inlets 146 in sequence, and the second main processor 145 is allowed to flow through.
The second main circuit board module 15 is installed in the first receiving area 21, is located above the first main circuit board module 14, and is electrically connected to the adapter circuit board 13. The second main circuit board module 15 further includes a plurality of upper heat dissipation modules 151, and the plurality of upper heat dissipation modules 151 are installed at a front portion of the second main circuit board module 15, It is used to suck out the gas in the first storage area 21 from the first storage area 21.
In this way, by sucking out the gas in the first housing area 21 by the lower heat radiation module 141 and the upper heat radiation module 151, the gas flows into the first housing area 21 from the third housing area 23, and at the same time the gas is The fluid flows from the fourth storage area 24 into the second storage area 22 and flows into the first storage area 21. Further, the gas is passed through the first main processor 144, the second main processor 145, and the plurality of memory modules 147. In addition, the gas is sucked out from the first accommodation area 21 by the upper heat radiation module 151 through the front partition plate vent 1221 through the second main circuit board module 15.

Subsequently to the above, the front right side plate 121 and the front partition plate 122 are installed in parallel, and are fixed in length on both sides of the same plane. The rear partition plate 124 and the rear left side plate 125 are installed side by side, and are fixed to both sides of one plane with the same length. At this time, the internal partition plate set 12 is formed.
Next, after the inner partition plate set 12 is locked and fixed to the bottom outer casing 11, the adapter circuit board 13 is fixed to the bottom outer casing 11. Since the adapter circuit board 13 belongs to an electronic device, there is a problem that the adapter circuit board 13 needs to be newly changed every time the standard is changed, or the element may be damaged. In comparison, the internal partition set 12 and the like belong to the mechanism and are not easily damaged. For this reason, it is possible to change the constituent elements more easily by attaching the adapter circuit board 13 last.

Subsequent to the above, the first main circuit board module 14 and the second main circuit board module 15 of the present invention are stacked in the first receiving area 21, both of which are also electronic signals such as network signals. Used for computation and processing. Similarly, the second main circuit board module 15 has a processor capable of calculating and processing electronic signals. The first main circuit board module 14 and the second main circuit board module 15 generate heat when performing calculation operations and processing operations such as network signals.
The greater the amount of work, the higher the amount of heat generated. Over time, a large amount of heat will naturally accumulate in the first accommodation area 21, affecting the computation and processing of electronic signals. Will be affected. In order to prevent the amount of heat from becoming too high, the amount of heat generated by the operation by attaching the lower heat dissipation module 141 and the upper heat dissipation module 151 to the first main circuit board module 14 and the second main circuit board module 15, respectively. Can be eliminated.

Reference is now made to FIGS. 5 is a schematic perspective view of the rear right side plate of the present invention, FIG. 6 is a schematic perspective view of the rear partition plate of the present invention, and FIG. 7 is a network circuit in the casing body of the present invention. It is a perspective schematic diagram which shows the state in which the board | substrate is inserted.
As shown in FIGS. 5 to 7, the rear right side plate 123 further includes a plurality of first circuit board support frames 1232, each of which is formed inside the plurality of rear right side air inlets 1231. The rear partition plate 124 further includes a plurality of second circuit board support frames 1241, each corresponding to the plurality of first circuit board support frames 1232. In addition, a plurality of network circuit boards 3 inserted in the third accommodation area 23 and electrically connected to the adapter circuit board 13 are provided, and each network circuit board 3 includes the first circuit. It is supported by the substrate support frame 1232 and the second circuit board support frame 1241. As shown in the figure, the first circuit board support frame 1232 and the second circuit board support frame 1241 are formed inwardly and have a corresponding installation, so that the network circuit board 3 can be supported by this. In addition, the network circuit board 3 can be arranged flat.
The network circuit board 3 is used for receiving network signals and processing network signals. Further calculation and processing can be performed by transmitting the network signal of processing completion to the first main circuit board module 14 and the second main circuit board module 15 via the adapter circuit board 13. The larger the number of network circuit boards 3, the faster the processing speed of the network signal. However, since the space of the third accommodation area 23 is also increased, the overall volume dimension and the heat conduction path diameter are affected.
In the embodiment of the present invention, three network circuit boards 3 are used. Thus, the thickness of the three network circuit boards 3 is equal to the stack of the first main circuit board module 14 and the second main circuit board module 15. Is the same thickness as This provides an optimal balance between efficiency, heat dissipation effect and volume size. However, the three network circuit boards 3 are merely examples of the present invention, and do not limit the present invention. Actually, for example, when the thickness of one network circuit board 3 is relatively thin, it is possible to accommodate more network circuit boards 3 in the third accommodation area 23.

FIG. 8 is a front view of the adapter circuit board of the present invention. As shown in FIGS. 1 to 2, 4 to 5, and 8, the rear right side plate 123 further has a rear right side wall airflow inlet 1233 and is formed on a side surface of the rear right side plate 123. , And communicated with the first external ventilation port 1111. One of the plurality of adapter board air vents 131 of the adapter circuit board 13 is formed on the right side, and is connected to the rear right wall surface air inlet 1233 in communication. Gas is allowed to penetrate from the first external ventilation port 1111, and sequentially enters the first accommodation area 21 through the rear right wall surface ventilation port 1233 and the adapter substrate ventilation port 131, and the first side heat conduction path The information is guided to the second main processor 145 via 142.
In consideration of the fact that turbulence is likely to be formed at the corners when the gas flows, the present invention effectively uses the gas to achieve the maximum efficiency of heat dissipation. As a result, the gas at the corners of the wall surface can be flowed to reduce the generation of turbulent airflow and increase the efficiency of heat dissipation. Since the rear right wall surface air inlet 1233 of the present invention adopts a net-like design, it is possible to block the larger debris penetrating from the first external air outlet 1111, so that the first accommodation area 21 can be cleaned. Can be held.
Please refer to FIG. The gas is made to enter the first accommodation area 21 through the rear right wall surface air inlet 1233 and the adapter board air inlet 131, and the second main processor 145 and the plurality of memory modules 147 are installed along the first side heat transfer path 142. The heat dissipation effect is achieved by allowing it to flow.

Following the above, a plurality of adapter board ventilation holes 131 are formed on the adapter circuit board 13, thereby guiding the gas in the third accommodation area 23 to the first accommodation area 21, A heat dissipation effect is provided. One adapter board ventilation hole 131 (for example, a rectangular opening above the adapter circuit board 13 in the figure) of the plurality of adapter circuit boards 13 is formed at the upper side. A gas is allowed to flow from the adapter board vent 131 into the first accommodation area 21 and through the second main circuit board module 15. As can be seen from this, the adapter board ventilation hole 131 formed above is used to guide the gas in the third accommodation area 23 to the second main circuit board module 15, thereby the second main circuit board module. Heat dissipation to 15 is provided.
One adapter board ventilation hole 131 (for example, four aligned square openings below the adapter circuit board 13 in the figure) among the plurality of adapter circuit boards 13 is formed below, and the first By flowing the gas in the three storage areas 23 from the adapter substrate vent 131 into the first storage area 21 and passing through the first main circuit board module 14, the first processor 144 is allowed to flow through. The amount of heat generated in the first processor 144 can be removed. The adapter board ventilation hole 131 formed on the adapter circuit board 13 is designed based on the principle of fluid dynamics, and at the same time, the installation and installation of the connector are considered and the optimum size and position of the heat radiation effect are found and set. .

  FIG. 9 is a schematic diagram showing a state where the power supply device and the access device are installed in the housing body of the present invention. As shown in the drawing, the present invention is installed in the second storage area 22, can suck out the gas in the second storage area 22, and is electrically connected to the adapter circuit board 13. A feeder 4 and a plurality of access devices 5 that are stacked in the fourth storage area 24 and electrically connected to the adapter circuit board 13 are provided. The power supply 4 supplies power to the first main circuit board module 14, the second main circuit board module 15, the network circuit board 3, the access device 5, etc. via the adapter circuit board 13, all of which Operation is not possible unless power is supplied by the supply device 4. The access device 5 is used to store specific information, and can provide a storage space by converting to a larger capacity as necessary.

Following the above, reference is made to FIGS. The power supply 4 itself has a fan capable of sucking out the gas in the second accommodation area 22, and the amount of heat generated in the power supply 4 can be taken out of the housing body 1. After the gas in the second storage area 22 is sucked out, the gas in the fourth storage area 24 is guided to the second storage area 22 via the adapter board ventilation hole 131 of the adapter circuit board 13.
Please refer to FIG. 8 at the same time. Several openings are formed in the left half part of the adapter circuit board 13, and two adapter board ventilation holes 131 arranged in an up-and-down direction are included, both of which pass gas from the fourth accommodation area 24 to the second accommodation area 22. Used to flow up to. Thus, the amount of heat generated in the access device 5 can flow from the fourth storage area 24 to the second storage area 22 and can be discharged from the second storage area 22 to the outside of the housing body 1. It becomes. At the same time, a part of the gas in the second housing area 22 also flows to the first housing area 21 through the front partition plate vents 1221, passes through the second main circuit board module 15, and the second The amount of heat of the main circuit board module 15 can be removed, and the heat dissipation module 151 sucks out the heat from the first accommodation area 21. In fact, the gas in the fourth accommodation area 24 flows into the third accommodation area 23 not a little.
Please refer to FIG. There are three aligned connectors in the middle of the adapter circuit board 13, and a square adapter board ventilation hole 131 is formed on the left side of the connector, and the adapter board ventilation hole 131 is formed in the fourth accommodation area. It is used to discharge the gas flowing from 24 to the third storage area 23 to the first storage area 21.

Please refer to FIG. 10 and FIG. Each is a side view showing the assembled state of the bottom outer casing and the inner partition plate set of the present invention, and a perspective schematic view of the first main circuit board module of the present invention. Reference is again made to FIG. As shown in FIG. 10, when viewed from the side, the first external ventilation port 1111 and the second external ventilation port 1112 are formed in the upper half of the external right side plate 111, and debris is sucked in. A mask structure for preventing the The front right side air inlet 1211 is formed in the lower half of the front right side plate 121, and one blocking plate is installed on one side of the front right side air inlet 1211. After entering from the second external ventilation port 1112, it can be blocked by a blocking plate, and all the gas passes through the front right air inlet 1211 and enters the first accommodation area 21, and the first It becomes possible to remove the heat quantity of the 1 main circuit board module 14.
Since the amount of heat generated by the operation of the first main circuit board module 14 is very large, heat radiation is not easy because the second main circuit board module 15 is further installed above. Therefore, the inventor designs the front right air inlet 1211 and enhances the fluid flow force by the height difference formed between the second external air inlet 1112 and the front right air inlet 1211. Thus, the amount of heat generated in the first main circuit board module 14 can be quickly removed. In addition, the first external ventilation port 1111 can provide a large amount of gas to the third accommodation area 23 by directly corresponding to the rear right ventilation port 1231. As can be seen from the figure, a blocking plate is further provided between the rear right air inlet 1231 and the front right air inlet 1211. The purpose is to block the gas and prevent the gas flowing in from the first external air vent 1111 from flowing to the front right air inlet 1211.

Following the above, FIG. 1 to FIG. 2 and FIG. A first guide surface 1421 is formed at one end of the first side heat conduction path 142, and a lower heat radiation module 141 is connected to the other end, and gas is allowed to enter the first accommodation area 21 from the side heat conduction airflow port 146. Thereafter, the fluid flows along the first guide surface 1421 to the second main processor 145, and is sucked out from the first accommodation area 21 by the lower heat dissipation module 141 along the first heat conduction path 142.
As can be seen, the first side heat transfer path 142 is used to supply more gas to the second main processor 145. When the work amount of the second main processor 145 is very large, the amount of heat generated is very large. However, since the gas from the third storage area 23 first absorbs the amount of heat from the first main processor 144, it becomes difficult to absorb the amount of heat from the second main processor 145 again. For this reason, the front right air inlet 1211 designed according to the present invention guides the gas outside the housing body 1 from the side surface so as to enter the first accommodation area 21, and the first side heat transfer path 142 supplies the gas. Is guided to the second main processor 145 to provide a heat dissipation function. The lower heat dissipation module 141 is directly connected to the other end of the first side heat transfer path 142, and the gas can be prevented from generating turbulence in the gap so as not to leave a gap in the middle.

Following the above, the first main circuit board module 14 further includes at least one arithmetic processor 148 and is close to the second heat conduction path 143. The arithmetic processor 148 is used to perform an arithmetic operation, and all of them generate heat similarly. For this reason, a heat dissipating piece is mounted above the arithmetic processor 148. The second side heat transfer path 143 has a longitudinal flow port 1431, and second guide surfaces 1432 are formed at both ends of the second side heat transfer path 143, respectively. Thus, gas is supplied to the second side heat transfer path 143. From above the second side heat transfer path 143 through the vertical flow port 1431. Further, gas is allowed to flow from the third accommodation area 23 into the first accommodation area 21, the arithmetic processor 148 is caused to flow along one second guide surface 1432, and another second guide surface. The air is sucked out from the first accommodation area 21 by the lower heat radiation module 141 along the line 1432.
Since the gas from the third storage area 23 first absorbs the heat quantity by the first main processor 144, it becomes difficult to absorb the heat quantity by the arithmetic processor 148 again. Therefore, it is possible to remove the heat amount of the arithmetic processor 148 by guiding the gas from the second storage area 22 so as to enter the first storage area 21. After removing the amount of heat of the processor 148 with gas, the gas is sucked out by the lower heat dissipation module 141 along another second guide surface 1432. The amount of gas flow can be increased by the second guide surface 1432 to increase the heat dissipation effect. An electrical element is further provided below the second heat conduction path 143, and the electrical element similarly generates heat. For this reason, according to the design of the vertical flow port 1431, it is possible to increase the gas flow path diameter and remove the heat quantity of the electric element.

  The above detailed description has been given so that the structure of the present invention can be clearly understood. In summary, the present invention has the following advantages.

  (1) The maximum working efficiency is achieved by mounting a plurality of sets of circuit boards in a finite space, while the gas outside the housing body is sucked out and guided by the structure. It is possible to remove the amount of heat generated in the circuit board, and it is possible to prevent damage to the circuit board due to excessive accumulation of heat.

  (2) By designing the structure in consideration of the thermal convection effect, the heat radiation function can be achieved without the need to add cooling equipment such as water-cooled pipes, cost can be saved, and space can be used effectively. it can.

  The above detailed description specifically describes the embodiments in which the present invention can be carried out. However, the scope of the present invention is not limited to these embodiments, and the spirit of the present invention is not limited thereto. Unless otherwise deviated, the implementation or modification of such effects is still included in the scope of the claims of the present invention.

DESCRIPTION OF SYMBOLS 1 Case body 11 Bottom outer case 111 External right side plate 1111 1st external ventilation port 1112 2nd external ventilation port 112 External left side plate 12 Internal partition board assembly 121 Front right side plate 1211 Front right side airflow guidance port 122 Front partition plate 1221 Front partition plate air vent 123 Rear right side plate 1231 Rear right side airflow vent 1232 First circuit board support frame 1233 Rear right wall surface air duct 124 Rear partition plate 1241 Second circuit board support frame 125 Rear left side plate 13 Adapter circuit board 131 Adapter Substrate vent 14 First main circuit board module 141 Lower heat dissipation module 142 First side heat transfer path 1421 First guide surface 143 Second side heat transfer path 1431 Longitudinal flow port 1432 Second guide surface 144 First main processor 145 Second Main processor 146 Side heat transfer vent 147 Memory module 148 Arithmetic processor 15 Second main circuit Plate module 151 above the heat radiation module 21 first receiving area 22 second receiving area 23 third receiving area 24 fourth receiving area 3 network circuit board 4 Power supply unit 5 access device

Claims (11)

A telecommunications computing module capable of accommodating a printed circuit board comprising a housing body,
The case body includes a bottom outer case, an internal partition set, an adapter circuit board, a first main circuit board module, and a second main circuit board module.
The bottom outer casing includes an external right side plate and an external left side plate, and a first external ventilation port and a second external ventilation port are further formed on the external right side plate,
The internal partition plate set is installed in the bottom outer casing, and further includes a front right side plate, a front partition plate, a rear right side plate, a rear partition plate, and a rear left side plate, The front right side plate is locked and fixed to the inside of the external right side plate, has a front right side air inlet, and allows gas to sequentially pass through the second external air inlet and the front right side air inlet. The front partition plate has a front partition plate vent, the rear right plate is locked and fixed inside the outer right plate, and a plurality of rear right sides A plurality of rear right air inlets corresponding to the first external air outlets, and the rear left side plate is locked and fixed inside the outer left side plate,
The adapter circuit board is installed in the bottom outer casing and has a plurality of adapter board ventilation holes. The adapter circuit board, the front right side plate, and the front partition plate are first. A housing area is formed, and a second housing area is formed by the adapter circuit board, the front partition plate, and the external left side plate, and a second housing area is formed by the adapter circuit board, the rear right side plate, and the rear partition plate. 3 accommodation areas are formed, a fourth accommodation area is formed by the adapter circuit board, the rear partition plate, and the rear left side plate, and gas is passed from the fourth accommodation area via the adapter board vent. The gas is allowed to flow into the second housing area, and gas is allowed to enter the third housing area through the first external ventilation port and the plurality of rear right air guiding ports in order, and gas is allowed to enter the third housing area. 3 accommodation By way of the adapter board vent from band to flow into the first receiving area, also the gas from the second receiving area by way of the front partition plate vent hole is introduced into the first receiving area,
The first main circuit board module is installed in the first accommodation area and is electrically connected to the adapter circuit board, and further includes a plurality of lower heat radiation modules, a first side heat conduction path, and a second side. A heat conduction path, a first main processor, a second main processor, a side heat conduction air inlet, and a plurality of memory modules; and the plurality of lower heat dissipation modules are arranged on the first main circuit board. Installed in the front part of the module, used for sucking out gas in the first housing area, the first side heat transfer path is installed on the right side of the first main circuit board module, one end of the module Close to the side heat transfer air inlet, the second side heat transfer path is installed on the left side of the first main circuit board module, and the first main processor is located in the rear half of the first main circuit board module. Installed, and the second main processor Proximate to the first side heat transfer path, the side heat transfer air inlet is located on the right side of the first main circuit board module, and the plurality of memory modules are respectively connected to the first main processor and the second main processor. The gas is sucked out of the gas in the first housing area by the plurality of lower heat dissipation modules, and at the same time, the gas is discharged from the outside of the bottom outer casing through the second external ventilation port. The front right side air inlet and the side heat inlet are sequentially passed through the first storage area, and the second main processor is passed through,
The second main circuit board module is installed in the first receiving area, is located above the first main circuit board module, and is electrically connected to the adapter circuit board, and the second main circuit The board module further includes a plurality of upper heat dissipation modules, and the plurality of upper heat dissipation modules are installed at a front portion of the second main circuit board module, and the first accommodation from the first accommodation area. Used to suck out the gas in the area, and the gas from the third receiving area to the first receiving area by sucking out the gas in the first receiving area by the plurality of lower heat dissipating modules and the plurality of upper heat dissipating modules. At the same time, gas flows from the fourth storage area into the second storage area and flows into the first storage area, and gas flows into the first main processor, the first Via the main processor and the plurality of memory modules, and through the second main circuit board module through the front partition plate vent and the gas from the first accommodation area by the plurality of upper heat dissipation modules. A telecommunications computing module capable of accommodating a printed circuit board, characterized by sucking out.   The rear right side plate further includes a plurality of first circuit board support frames, and each of the first circuit board support frames is formed inside the plurality of rear right air inlets. A telecommunications computing module capable of accommodating the printed circuit board of claim 1.   The rear partition plate further includes a plurality of second circuit board support frames, and each second circuit board support frame corresponds to the plurality of first circuit board support frames. A telecommunications computing module capable of accommodating the printed circuit board according to Item 2.   The network circuit board further includes a plurality of network circuit boards inserted into the third accommodation area and electrically connected to the adapter circuit board, and each network circuit board includes the first circuit board support frame and the network circuit board. 4. The telecommunication computing module capable of accommodating a printed circuit board according to claim 3, wherein the telecommunication computing module is capable of being accommodated by a second circuit board support frame.   2. The rear right side plate further includes a rear right side wall air duct, is formed on a side surface of the rear right side plate, and communicates with the first external vent. Telecommunication computing module capable of accommodating any printed circuit board.   One of the plurality of adapter board ventilation holes of the adapter circuit board is formed on the right side, and is connected to the rear right wall surface ventilation hole, gas is allowed to penetrate from the first external ventilation hole, The rear right wall surface air inlet and the adapter board air inlet are sequentially passed through the first housing area, and are guided to the second main processor via the first side heat transfer path. A telecommunications computing module capable of accommodating a printed circuit board according to claim 5.   One of the plurality of adapter board ventilation holes of the adapter circuit board is formed above, and the gas in the third accommodation area flows into the first accommodation area from the adapter board ventilation hole, so that the first 2 through one main circuit board module, one of the plurality of adapter board ventilation holes of the adapter circuit board is formed below, and the gas in the third accommodation area is passed from the adapter board ventilation hole to the first 2. The electricity capable of accommodating a printed circuit board according to claim 1, wherein the electric circuit is capable of flowing into the receiving area and passing through the first main circuit board module and causing the first main processor to flow through. Communication computing module.   Further, it is installed in the second storage area, can suck out the gas in the second storage area, and is electrically connected to the adapter circuit board, and is loaded in the fourth storage area. The telecommunications computing module capable of accommodating a printed circuit board according to claim 1, further comprising a plurality of access devices that are stacked and electrically connected to the adapter circuit board. .   After a first guide surface is formed at one end of the first side heat transfer path, the plurality of lower heat dissipation modules are connected to the other end, and gas enters the first accommodation area from the side heat transfer air vent. The liquid is caused to flow along the first guide surface to the second main processor, and is sucked out of the first accommodation area by the plurality of lower heat radiation modules along the first heat conduction path. A telecommunications computing module capable of accommodating the printed circuit board according to claim 1.   2. The telecommunications computer capable of accommodating a printed circuit board according to claim 1, wherein the first main circuit board module further includes at least one arithmetic processing unit, and is close to the second heat conduction path. 3. Module.   The second side heat transfer path has a vertical flow port, and second guide surfaces are formed at both ends of the second side heat transfer path, respectively, and gas flows from the lower side of the second side heat transfer path to the vertical flow direction. Guides to the upper side of the second side heat transfer path through the mouth, and allows gas to flow from the third accommodation area into the first accommodation area, so that the second of one of the second guide surfaces 11. The at least one processor is caused to flow along a guide surface, and is sucked out of the first receiving area by the plurality of lower heat radiation modules along another second guide surface. A telecommunication computing module capable of accommodating the printed circuit board according to claim 1.

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