JP2016051527A - Organic EL display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a top emission type organic EL display device including an in-cell touch panel.SOLUTION: An organic EL display device includes: a first substrate having a display area and a non-display area NA; a second substrate 12 having pattern wiring 111; and a seal material 5 sandwiched between the first substrate and the second substrate 12 and disposed in the non-display area NA. The non-display area NA has: protrusion parts 104; a pattern electrode 105 covering the protrusion parts; and an insulation layer 109 covering the pattern electrode. The seal material 5 includes a conductor 110 contacting with the first substrate and the second substrate 12. The insulation layer 109 is broken by the conductor 110 to cause the pattern wiring 111 and the pattern electrode 105 to be electrically connected with each other.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a display device including a pixel including an electroluminescence (EL) element. In particular, the present invention relates to an organic EL display device using an organic material as a light emitting layer.

  An electroluminescence (hereinafter also referred to as “EL”) element is known as a light-emitting element utilizing an electroluminescence phenomenon. EL elements can emit light with various wavelengths depending on the selection of materials constituting the light-emitting layer, and their application to display devices and lighting fixtures is being promoted.

  In an EL display device in which an EL element is applied to a display device, each pixel arranged in a matrix is provided with an EL element as a light emitting element and a switching element for controlling light emission of the EL element. An arbitrary image can be displayed as a whole by controlling on / off of the switching element for each pixel. Such EL display devices are used in various portable information terminals such as mobile phones and tablet computers.

  When used for the portable information terminal described above, the display device often has not only a function as a display unit but also a function as a user interface. For example, it is possible to perform desired display processing and information processing by mounting a touch panel on the display device and tapping the display screen with a fingertip.

  When a touch panel is mounted on a display device, a configuration provided outside the display device and a configuration provided inside the display device are known. When the touch panel is configured to be provided outside the display device, after the display device is manufactured, an on-cell type touch panel (hereinafter referred to as “on-cell TP”) is attached. Therefore, although the display device can be manufactured by a conventional process, Since the display device and the touch panel are stacked, the thickness of the entire display device is increased.

  On the other hand, in the case where the touch panel is configured to be provided inside, an in-cell type touch panel (hereinafter referred to as “in-cell TP”) is formed inside by slightly changing the manufacturing process of the display device. Therefore, there is an advantage that a display device having a touch panel function with the same thickness as that of a conventional display device can be realized without any significant change in the manufacturing process of the display device. For this reason, in recent years, the development of display devices using in-cell TP has become active.

  Conventionally, development of a top emission type EL display device has been progressing as an EL display device. The top emission type EL display device is a type of display device that emits light emitted from an EL element to the upper side of the switching element (on the opposite substrate side), and has attracted attention as an EL display device with high light extraction efficiency.

  In the above-described top emission type EL display device, when the structure using the in-cell TP is employed, the in-cell TP is formed using a technique such as photolithography after the EL element is formed. However, EL elements are weak against moisture and have the property of deteriorating due to the penetration of moisture. Therefore, after the EL element is formed, there is a problem that the photolithography technique including the cleaning process cannot be used, and the in-cell TP cannot be formed.

  Therefore, an object of the present invention is to provide a top emission type organic EL display device provided with an in-cell TP.

  Another object is to realize such an organic EL display device with a simple configuration without greatly changing the manufacturing process.

  According to one embodiment of the present invention, a first substrate having a display region in which a plurality of organic EL elements are arranged, a non-display region surrounding the display region, a first pattern wiring, and a dielectric on the first pattern wiring An organic EL comprising: a second substrate having a second pattern wiring overlapping with each other; and a sealing material sandwiched between the first substrate and the second substrate and disposed in the non-display area In the display device, the non-display area includes a plurality of protrusions formed of a first insulating layer, a pattern electrode that covers the protrusion, and a second insulating layer that covers the pattern electrode. And the sealing material includes a conductor in contact with the first substrate and the second substrate, and the first pattern wiring or the second pattern wiring and the pattern electrode are formed by the conductor. It is an organic EL display device that is electrically connected.

  The first insulating layer may be a layer containing a resin, and the resin may be a photosensitive resin.

  The conductor may be electrically connected to the pattern electrode by destroying the second insulating layer.

  A touch panel may be configured by the first pattern wiring, the second pattern wiring, and the dielectric, and the touch panel may be controlled based on a signal from the first substrate.

  A fill material made of resin is provided between the first substrate and the second substrate on the display region, and the diameter of the conductor is between the first substrate and the second substrate. It is preferable that it is smaller than this distance.

  A fill material made of a resin is provided between the first substrate and the second substrate on the display area, and an added value of the diameter of the conductor and the height of the protrusion is the first value. It is preferable that the distance is larger than the distance between one substrate and the second substrate.

  The pattern electrode may be made of the same material as the anode of the organic EL element.

  The non-display area may further include a reflector disposed around the protrusion. Moreover, it is good also as a structure which provided the said projection part connected in the direction orthogonal to the said reflector using the several linear reflector arrange | positioned in parallel as the said reflector.

  According to another aspect of the present invention, there is provided a step of forming a first substrate having a display area in which a plurality of organic EL elements are arranged and a non-display area surrounding the display area, a first pattern wiring, and the first pattern Forming a second substrate having a second pattern wiring superimposed on the wiring via a dielectric, forming a sealing material including a conductor in the non-display area of the first substrate, A step of pressure-bonding one substrate and the second substrate, and the step of forming the first substrate forms a plurality of protrusions formed of a first insulating layer in the non-display area. A step of forming a pattern electrode that covers the protruding portion, and a step of forming a second insulating layer that covers the pattern electrode, wherein the first substrate and the second substrate are pressure-bonded to each other. Depending on the conductor, the first pattern wiring or the second pattern wiring The turn wires, electrically connects the pattern electrode, a method of manufacturing the organic EL display device.

  A step of forming the first insulating layer with a resin may be included. At that time, a photosensitive resin may be used as the resin.

  The conductor may be electrically connected to the pattern electrode by destroying the second insulating layer.

  The step of pressure-bonding the first substrate and the second substrate includes a step of bonding the first substrate and the second substrate in a vacuum, and the bonding of the first substrate and the second substrate to the atmosphere. And exposing to the inside.

  The step of forming the first substrate further includes a step of providing a fill material made of a resin on the display region, and the distance between the first substrate and the second substrate as the conductor. A conductor having a smaller diameter may be used.

  The step of forming the first substrate further includes a step of providing a fill material made of a resin on the display area, and an added value of the diameter of the conductor and the height of the protrusion is the first value. It may be larger than the distance between one substrate and the second substrate.

  The pattern electrode may be formed of the same material as the anode of the organic EL element.

  The step of forming the first substrate may further include a step of forming a reflector around a position constituting the protrusion in the non-display area.

  The step of forming the first substrate further includes a step of forming a plurality of linear reflectors arranged in parallel and a linear resin pattern continuous in a direction orthogonal to the linear reflectors. You may have a process.

1 is a plan view showing a schematic configuration of an organic EL display device according to a first embodiment of the present invention. 1 is a cross-sectional view illustrating a schematic configuration of an organic EL display device according to a first embodiment of the present invention. It is sectional drawing which shows schematic structure of the display area DA in the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows schematic structure of non-display area | region NA in the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows schematic structure of non-display area | region NA in the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is a figure which shows the manufacturing method of the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is a figure which shows the manufacturing method of the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is a figure which shows the manufacturing method of the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is a figure which shows the manufacturing method of the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is a figure which shows the manufacturing method of the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is a figure which shows the manufacturing method of the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is a figure which shows the manufacturing method of the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is a figure which shows the manufacturing method of the projection part in the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is a top view which shows schematic structure of the non-display area | region of the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is a figure which shows the structure of the pixel circuit of the organic electroluminescence display which concerns on the 1st Embodiment of this invention. 1 is a plan view showing a schematic configuration of a counter substrate of an organic EL display device according to a first embodiment of the present invention. 1 is a plan view showing a schematic configuration of a part of a counter substrate in an organic EL display device according to a first embodiment of the present invention. It is sectional drawing which shows schematic structure of the opposing board | substrate of the organic electroluminescence display which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows schematic structure of the opposing board | substrate of the organic electroluminescence display which concerns on the 2nd Embodiment of this invention. It is a top view which shows schematic structure of the non-display area | region in the organic electroluminescence display which concerns on the 3rd Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
However, the present invention can be implemented in various modes without departing from the gist thereof, and is not construed as being limited to the description of the embodiments exemplified below. Further, in order to make the explanation clearer, the drawings may be schematically represented with respect to the width, thickness, shape, and the like of each part as compared with the actual embodiment, but are merely examples, and the interpretation of the present invention. It is not intended to limit. In the present specification and drawings, the same elements as those described above with reference to the previous drawings may be denoted by the same reference numerals, and detailed description thereof may be omitted.

(First embodiment)
<Structure of display device>
With reference to FIG.1 and FIG.2, schematic structure of the organic electroluminescent display apparatus 100 which concerns on the 1st Embodiment of this invention is demonstrated. FIG. 1 is a plan view illustrating a schematic configuration of the organic EL display device 100, and FIG. 2 is a cross-sectional view illustrating a schematic configuration of the organic EL display device 100.

  As shown in FIG. 1, the organic EL display device 100 according to this embodiment includes a display area DA, a non-display area NA, a driver IC 7, an FPC (Flexible Printed Circuits) 8, and a scanning line formed on a substrate 11. A drive circuit 13 is provided. In the display area DA, a plurality of control signal lines g1-1 to g1-3 running in the X direction and a plurality of data signal lines d1 to d3 running in the Y direction are arranged so as to intersect with each other. A plurality of pixels 10 are arranged in a matrix at positions corresponding to intersections between g1-1 to g1-3 and the data signal lines d1 to d3.

  FIG. 1 shows the pixels 10 included in the display area DA. As an example, FIG. 1 illustrates a configuration in which three control signal lines g1-1 to g1-3 and one data signal line d1 are arranged so as to intersect each pixel 10. The configuration is not limited. Although not shown, wiring for supplying a constant voltage such as a power supply line and an erasing line may be arranged in the display area DA.

  The light emission of the pixel 10 is controlled by a control signal (scanning signal) given to the control signal lines g1-1 to g1-3 and a data signal given to the data signal line d1. The light emission is controlled by a thin film transistor (TFT) as a switching element provided in the pixel 10. In addition, the pixel 10 includes a pixel circuit including a capacitor or the like that holds a voltage given according to a data signal.

As shown in FIG. 2, such a pixel circuit is formed on a hard substrate 1 such as glass to constitute a TFT drive circuit layer 2. Here, the TFT drive circuit layer refers to a layer in which a drive circuit composed of TFTs and a functional circuit such as a capacitor are formed using a thin film formation technique or a photolithography technique. Hereinafter, a configuration including the TFT drive circuit layer 2 on the substrate 1 is referred to as a “TFT substrate 9”.

  FIG. 2 shows a configuration in which the organic EL element 3 included in each pixel 10 is disposed on the TFT substrate 9. An organic EL element is a light-emitting element provided with a layer containing an organic electroluminescent material (hereinafter also referred to as “organic EL layer”) between a pair of electrodes called an anode and a cathode. As an example, the organic EL layer includes a layer in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and the like are stacked.

  Since the organic EL element 3 has a property of rapidly deteriorating when exposed to moisture in the atmosphere, the organic EL element 3 needs to be sealed from outside air as much as possible. For this reason, the surface of the organic EL element 3 is covered with a sealing film 4 including, for example, a silicon nitride film. Hereinafter, a configuration in which the organic EL element 3 and the sealing film 4 are formed on the TFT substrate 9 is referred to as a “first substrate 11”.

  The TFT drive circuit layer 2 formed on the first substrate 11 can constitute various functional circuits using TFTs and capacitors. An example of such a functional circuit is shown in FIG. The circuit configuration shown in FIG. 9 includes TFTs 901 to 904 and capacitors 905 and 906, and an organic EL element 907 is provided on the output side of the TFT 904. Of course, the organic EL display device 100 according to the present embodiment is not limited to the circuit configuration shown in FIG.

  A substrate 12 is provided on the first substrate 11 so as to cover the organic EL element. Hereinafter, the substrate 12 disposed to face the first substrate 11 is referred to as a “second substrate 12”. The second substrate 12 is also referred to as a counter substrate, and may include a color filter and a black mask (also referred to as a black matrix).

  In the display device 100 of this embodiment, an in-cell TP is provided on the second substrate (counter substrate) 12, and the in-cell TP is electrically connected to a functional circuit formed on the TFT substrate 9 in the first substrate 11. It has a configuration. Here, the structure of the in-cell TP will be described with reference to FIGS.

  The in-cell TP is a functional circuit that functions as a touch panel provided inside the second substrate 12 (side facing the first substrate 11). As shown in FIG. The second pattern wiring 111b is arranged so as to cross each other.

  In addition, as shown in FIG. 12, an insulating layer 113 is provided between the first pattern wiring 111 a and the second pattern wiring 111 b, and both overlap with each other via the insulating layer 113. The in-cell TP mounted on the organic EL display device 100 of the present embodiment operates as a capacitive touch panel with the pattern wirings 111a and 111b and the insulating layer 113 as a dielectric.

  FIG. 11 is a partially enlarged view in a circle indicated by R1 in FIG. Reference numeral 20 denotes a node where the first pattern wiring 111a and the TFT drive circuit layer 9 are electrically connected, and reference numeral 21 denotes a node where the second pattern wiring 111b and the TFT drive circuit layer 9 are electrically connected. is there. The detailed structure of these nodes will be described later.

  Therefore, the first pattern wiring 111a and the second pattern wiring 111b can be individually controlled on the basis of the signal from the TFT drive circuit layer 9, whereby the outside of the second substrate (the side toward the outside of the display device). ) Can detect the position of an object (for example, a pen or a finger) touched.

  12 corresponds to a cross-sectional view taken along A-A ′ in FIG. 10. An opening 114 is provided in a part of the insulating layer 113, and the first pattern wiring 111 a and the TFT drive circuit layer 9 are electrically connected through the opening 114. Since the second pattern wiring 111b is not covered with an insulating layer, it is not necessary to provide an opening. However, when an insulating layer is also provided on the second pattern wiring 111b, it is separately provided at the end of the second pattern wiring 111b. An opening may be provided.

  As shown in FIG. 2, the organic EL display device 100 according to the present embodiment maintains a constant distance between the first substrate 11 and the second substrate 12, thereby maintaining the surface of the organic EL element 3 and the second substrate 12. The surface is kept substantially parallel.

  In order to prevent light reflection and refraction at the interface between the two substrates, the display area DA (see FIG. 1) is surrounded by a sealing material (also referred to as a dam material) 5 made of epoxy resin or the like. The inside is filled with a filler composed of a transparent resin such as polyimide resin. Thus, in the display device 100 of this embodiment, the distance between the substrates is controlled by the volume of the filler.

The resin used for the sealing material 5 and the filler 6 need not be limited to those described above, and a necessary material may be used as appropriate.

  Further, when the display device 100 of the present embodiment is a color display device, the pixel 10 may include a plurality of sub-pixels that emit different colors. For example, one pixel 10 may be configured such that each sub-pixel emits three primary colors (red (R), green (G), and blue (B)), and the three primary colors (red (R)). , Green (G), blue (B)), and white (W) or yellow (Y), may be used. A desired image is displayed in the display area DA by selectively driving the organic EL elements 3 of the sub-pixels included in the plurality of pixels 10 while adjusting the light emission amount.

  Hereinafter, a more specific configuration of the organic EL display device 100 according to the present embodiment will be described with reference to FIGS. 3 to 5.

  FIG. 3 shows a cross-sectional structure of a pixel in the organic EL display device 100 of the present embodiment. In the organic EL display device 100 of this embodiment, a TFT drive circuit layer 102 is provided on a substrate 101, and the substrate 101 and the TFT drive circuit layer 102 constitute a TFT substrate 9.

  Reference numeral 101 denotes a substrate, and a glass substrate, a quartz substrate, a flexible substrate (polyimide, polyethylene terephthalate, polyethylene naphthalate, or other bendable substrate) can be used.

  A TFT (thin film transistor) as a switching element is provided on the substrate 101 through a base film by a known method. In FIG. 3, a top gate type TFT is shown as a TFT, but any known TFT such as an inverted stagger type TFT may be used. Here, the base film and the TFT are collectively referred to as a TFT driving circuit layer 102, and description of a specific configuration is omitted.

  Reference numeral 103 denotes a conductive layer A that functions as a drain electrode of the TFT, and reference numeral 104 denotes an insulating layer A made of polyimide resin or the like. As the conductive layer A103, an aluminum film, a titanium film, a stacked film of aluminum and titanium, or the like can be used. In the organic EL display device 100 of the present embodiment, a conductive layer containing aluminum as a main component is used in order to use the conductive layer A103 as a reflector as will be described later.

  The insulating layer A104 serves not only to insulate the conductive layer B105 functioning as the anode of the light emitting element from the conductive layer A103, but also to planarize unevenness caused by the structure of the TFT. be called. In the organic EL display device 100 of the present embodiment, it is preferable to use a photosensitive resin, typically a polyimide resin or an acrylic resin, as the insulating layer A104. Of course, not only a single layer structure but also a laminated structure is possible.

  Note that in FIG. 3, the conductive layer B105 functions as a pixel electrode, and thus is processed into a rectangular pattern that is electrically separated for each pixel.

  The conductive layer A103 and the conductive layer B105 are connected through a contact hole 15 provided in the insulating layer A104. Therefore, a voltage based on the data signal input through the TFT functioning as a switching element is applied to the conductive layer B105 as the pixel electrode.

  On the conductive layer B105, an insulating layer B106 formed by patterning polyimide resin, acrylic resin, or the like is provided. The insulating layer B106 functions as a bank that partitions a plurality of pixels provided in the display area DA in FIG. 3, and a region where the insulating layer B106 does not exist (that is, an opening of the insulating layer B106) functions as a light emitting element. It will be.

  Over the conductive layer B105 and the insulating layer B106, a light-emitting layer 107, a conductive layer C108 that functions as a cathode (also referred to as a common electrode) of the light-emitting element, and an insulating layer C109 that functions as a sealing film are sequentially stacked. In FIG. 3, the region where the conductive layer B105, the light emitting layer 107, the conductive layer C108, and the insulating layer C109 are stacked serves as a light emitting element, and the insulating layer B106 exists between the conductive layer B105 and the light emitting layer 107. The region to be used is a region that does not function as a light emitting element.

  The organic EL display device 100 shown in this embodiment is a so-called top emission type display device that emits light emitted from a light emitting element upward. The light-emitting element has a structure in which a light-emitting layer 107 is sandwiched between a conductive layer B105 functioning as an anode and a conductive layer C108 functioning as a cathode, and light emitted from the light-emitting layer 107 is reflected upward by the conductive layer B105 and conductive. The layer C108 and the insulating layer C109 are transmitted and emitted upward in the drawing.

  In the organic EL display device 100 of the present embodiment, the conductive layer B105 is preferably formed of a metal film having a high reflectance, but ITO (Indium Tin Oxide), which is a transparent conductive film having a high work function, and metal A laminated structure with a film may be used. The conductive layer C108 is preferably formed of a transparent conductive film such as light-transmitting ITO or ZnO (zinc oxide).

  The light-emitting layer 107 can be formed using a low-molecular or high-molecular organic material. Of course, not only the light-emitting layer, but also a structure provided with layers other than the light-emitting layer (also referred to as functional layers) constituting the light-emitting element, such as an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer. In other words, any known element structure can be employed.

  In the organic EL display device 100 of the present embodiment, an insulating layer C109 is provided on the conductive layer C108 to prevent entry of moisture and air from the outside, and suppress deterioration of the light emitting layer 107 and the TFT below it. Therefore, it is preferable to use a silicon nitride insulating layer having a dense film quality as the insulating layer C109.

  Here, a connection structure between the TFT substrate 9 and the counter substrate 12 in the organic EL display device 100 of the present embodiment will be described with reference to FIGS. 4 and 5. 4 shows a cross-sectional structure (a state before the TFT substrate 9 and the counter substrate 12 are pressure-bonded) in the vicinity of the sealing material 5 of the display device 100 of the present embodiment, and FIG. 5 shows the display device 100 of the present embodiment. A cross-sectional structure in the vicinity of the sealing material 5 (a state after the TFT substrate 9 and the counter substrate 12 are pressure-bonded) is shown.

  In FIG. 4, on the TFT substrate 9, a projecting portion made of an insulating layer A104 is provided. The protruding portion formed of the insulating layer A104 is a portion that is formed at the same time as the planarizing layer described with reference to FIG. 3 and is patterned into a protruding shape when the contact hole 15 is formed.

  Further, a conductive layer B105 and an insulating layer C109 functioning as a pattern electrode are stacked on the protruding insulating layer A104. These layers are made of the same material as the conductive layer B105 functioning as an anode and the insulating layer C109 functioning as a sealing film in FIG. The conductive layer B105 is connected to the conductive layer A103 provided on the TFT substrate 9 through the contact hole 15.

  A sealing material 5 is provided on the insulating layer C109, and a conductor 110 is disposed inside the sealing material 5. As the conductor 110, any known conductor can be used, but it is preferable to use a hard one as much as possible. The shape of the conductor 110 is preferably spherical, but is not limited thereto, and may be various shapes such as a rod shape and a polygonal shape.

  A substrate 112 provided with a conductive layer D111 functioning as a counter electrode is disposed through a sealing material 5 including a conductor 110. The substrate 112 and the conductive layer D111 constitute the counter substrate 12 shown in FIG. Here, the conductive layer D111 functions as a part of the in-cell TP provided on the counter substrate 12 (a part of the wiring pattern constituting the in-cell type touch panel).

  As described above, since the cross-sectional structure shown in FIG. 4 is a state before the TFT substrate 9 and the counter substrate 12 are pressure-bonded, the conductive layer B105 (pattern electrode) and the conductive layer D111 (pattern wiring) are electrically connected. Not connected to. That is, although the conductive layer D111 and the conductor 110 are electrically connected, the conductor 110 and the conductive layer B105 are insulated by the insulating layer C109. Therefore, electrical connection between the TFT substrate 9 and the counter substrate 12 is not ensured.

  The cross-sectional structure shown in FIG. 5 is a state after the TFT substrate 9 and the counter substrate 12 are pressure-bonded, and is a cross-sectional structure after the organic EL display device 100 of the present embodiment is completed. As shown in FIG. 5, by pressing the TFT substrate 9 and the counter substrate 12, the protruding portion formed of the insulating layer A <b> 104 is deformed, and the conductive layer B <b> 105 and the insulating layer C <b> 109 are crushed. ing. Then, the insulation layer C109 is broken by being crushed, for example, cracks are generated, and in the conductor 110, electrical connection between the two is ensured at the contact portion 110a in contact with the conductive layer B105. In this manner, the conductor 110 is arranged in such a manner that it is supported by the side surfaces of the two protrusions via the conductive layer B105.

  In addition to the case where the conductor 110 and the conductive layer B105 are short-circuited due to a crack generated in the insulating layer C109, a defect level is generated in the insulating layer C109 due to concentration of pressure and stress, and the conductor is passed through the defect level. In some cases, electrical connection may be made between 110 and the conductive layer B105. That is, the display device 100 according to the present embodiment includes the conductor 110 and the conductive layer via a current path generated in the insulating layer C109 due to the pressure applied by the conductor 110 (that is, via the insulating layer C109). Connection with B105 is ensured.

  Therefore, the conductor 110 is electrically connected to the conductive layer B105 at the contact portion 110a and is also electrically connected to the conductive layer D111 at the contact portion 110b. As a result, the TFT substrate 9 and the counter substrate 12 An electrical connection between the two is ensured. Further, the protrusion is deformed by the pressure bonding so that the conductor 110 approaches the substrate 101 side. This makes it possible to provide a desired substrate opening distance due to the volume of the fill material 6. When the diameter of the conductor 110 is larger than the distance between the first substrate 11 and the second substrate 12, a portion that cannot be filled with the fill material 6 exists between the substrates, bubbles are generated, the substrate is bent, etc. A problem of visibility arises from the problem, but this is not the case in the present invention.

  As described above, in the organic EL display device 100 according to the present embodiment, the conductor 110 provided inside the sealing material 5 presses the protruding portion formed of the insulating layer A104 disposed inside the sealing material 5. Thus, the structure in which the insulating layer C109 formed on the insulating layer A104 is destroyed is adopted. As a result, electrical connection (conduction) between the TFT substrate 9 and the counter substrate 12 can be ensured inside the sealing material 5. Further, the in-cell TP provided on the counter substrate 12 side can be controlled using a driving circuit on the TFT substrate 9 side.

  Moreover, in order to set it as the above structures, the diameter of the conductor 110 used for the organic electroluminescence display device 100 of this embodiment is between the 1st board | substrate 11 and the 2nd board | substrate 12 determined by the volume of the fill material 6. FIG. It is desirable that the distance be smaller than the distance (see FIG. 2). Use of such a conductor 110 eliminates the following problems. That is, when the diameter of the conductor 110 is larger than the distance between the first substrate 11 and the second substrate 12, a portion that cannot be filled with the fill material 6 exists between the substrates, bubbles are generated, and the substrate is bent. However, in the present invention, this is not the case.

  It is possible to use a plurality of types of conductors having different diameters as the conductor 110, as long as the diameter of any conductor is smaller than the distance between the first substrate 11 and the second substrate 12. Good.

  Furthermore, it is desirable that the diameter of the conductor 110 + the height of the protrusion (insulating layer A104) be higher than the distance between the first substrate 11 and the second substrate 12 determined by the volume of the fill material 6. As a result, when the first substrate 11 and the second substrate 12 are bonded together, the insulating layer C109 on the protruding portion 104 is destroyed and the protruding portion 104 is deformed, and the first substrate 11 and the second substrate 12 are stabilized. Can be conducted electrically.

  In this case as well, a plurality of types of conductors having different diameters can be used as the conductor 110, and the diameter of the conductor 110 + the height of the protrusion (insulating layer A104) is the same for any conductor 110. What is necessary is just to make it higher than the distance between the 1st board | substrate 11 and the 2nd board | substrate 12 determined by the volume of the fill material 6. FIG.

  Hereinafter, the manufacturing process of the organic EL display device 100 of the present embodiment having the above-described configuration will be described with reference to FIGS. 6A to 6G.

<Manufacturing method of display device>
First, as shown in FIG. 6A, a TFT drive circuit layer 102 including a conductive layer A103 is formed on a substrate 101. At this time, by patterning the conductive layer A103, the TFT drain electrode 103a is formed in the display area DA, and the matrix-like reflector 103b (see FIG. 8) is formed in the non-display area NA.

  Next, as shown in FIG. 6B, after forming an insulating layer A104 made of a photosensitive polyimide resin, the insulating layer A104 is patterned to form a planarizing layer 104a having an opening 15 in the display area DA. The protrusion 104b is formed in the non-display area NA. A state during patterning at this time will be described with reference to FIG.

  FIG. 7A shows a state when the protrusion 104b is exposed in the non-display area NA. A photomask 701 for forming the protrusion 104b is provided over the insulating layer A104, and exposure is performed in a state where a part of the insulating layer A104 is shielded by the photomask 701. At this time, the exposure light L1 is reflected by the edge of the reflector 103b and reaches below the photomask 701. That is, the exposure amount of the insulating layer A104 located below the photomask 701 varies between the upper end portion and the lower end portion thereof.

  As a result, as shown in FIG. 7B, the taper angle of the protrusion 104b formed of the insulating layer A104 is increased (steepened), and the aspect ratio of the protrusion 104b is increased. With such a shape, when the TFT substrate 9 and the counter substrate 12 are pressure-bonded and pressure is applied to the protrusion 104b by the conductor 110, the protrusion 104b is easily deformed.

  Here, FIG. 8 shows a top view of the non-display area NA as viewed from the light emitting side (opposite substrate side). As shown in FIG. 8, a matrix-like reflector 103b obtained by patterning the conductive layer A103 and a protrusion 104b surrounded by the reflector 103b are formed in the non-display area NA. In this manner, by surrounding the protrusion 104b with the reflector 103b, it is possible to form a columnar or conical protrusion 104b.

  Next, as shown in FIG. 6C, after forming the conductive layer B105, the conductive layer B105 is patterned to form the pixel electrode 105a functioning as the anode of the light emitting element in the display area DA, and to form the non-display area NA. A pattern electrode 105b is formed to cover the reflector 103b and the protrusion 104b. At this time, the reflector 103b and the pattern electrode 105b are electrically connected to each other. In the present embodiment, a conductive layer having a stacked structure in which ITO (Indium Tin Oxide) is stacked on an aluminum film is used as the conductive layer B105.

  Next, as shown in FIG. 6D, after the insulating layer B106 is formed, the insulating layer B106 is patterned to form the planarizing layer 106 in the display area DA, and all the insulating layers in the non-display area NA. B106 is removed. At that time, an opening 16 is provided in the planarization layer 106 in a region functioning as a light emitting element.

  Next, as shown in FIG. 6E, a light emitting element is completed by sequentially stacking a light emitting layer 107 and a conductive layer C108 functioning as a cathode. At this time, the light emitting layer 107 and the conductive layer C108 are formed by selectively depositing on the display area DA by masking the non-display area NA.

  When the light emitting element is formed, the entire surface of the TFT substrate 9 is covered with an insulating layer C109. The formation of the insulating layer C109 is preferably performed continuously without opening to the atmosphere from the formation of the light emitting layer 107 and the conductive layer C108. This is because it is important that the light-emitting layer 107 and the conductive layer C108 are not exposed to the atmosphere as much as possible because they are deteriorated by moisture. Through the above steps, the first substrate 11 (see FIG. 2) is completed.

  Next, as illustrated in FIG. 6F, the sealing material 5 including the conductor 110 is formed in the non-display area NA, and the display area DA is surrounded by the sealing material 5. Thereafter, a fill material 6 made of a liquid or gel resin is dropped onto the display area DA surrounded by the seal material 5 with a dispenser or the like.

  Finally, as shown in FIG. 6G, the counter substrate 12 composed of the substrate 11 and the conductive layer D111 functioning as a part of the in-cell TP is bonded and pressure bonded. In the present embodiment, the bonding process is performed in a vacuum container, and then the first substrate 11 and the second substrate 12 are pressure-bonded at atmospheric pressure by being exposed to the atmosphere. As a result, the conductor 110 disposed inside the sealing material 5 deforms the protruding portion 104b, and the electrical crack between the conductor 110 and the conductive layer B105 is generated by utilizing the crack of the insulating layer C109 generated at that time. Connection can be secured.

  As described above, in the manufacturing process of the organic EL display device 100 according to the present embodiment, when the planarization layer 104a is formed using the insulating layer A104, the protrusions 104b are simultaneously formed in the non-display area NA, and the sealing material 5 is a simple configuration in which the conductor 110 is disposed, and electrical conduction between the first substrate 11 (specifically, the TFT drive circuit layer 102) and the second substrate 12 (specifically, the in-cell TP) is achieved. There is an effect that it can be secured.

(Second Embodiment)
The configuration of the organic EL display device according to the second embodiment of the present invention will be described. As shown in FIG. 13, the organic EL display device of this embodiment is provided with the first pattern wiring 111 a and the second pattern wiring 111 b on different surfaces of the substrate 112. In this embodiment, neither the first pattern wiring 111a nor the second pattern wiring 111b is covered with an insulating layer, but it may be covered with an insulating layer as in the organic EL display device 100 according to the first embodiment. Good.

  Although not shown, the first pattern wiring 111a and the second pattern wiring 111b are arranged so as to be orthogonal to each other, similar to the organic EL display device 100 of the first embodiment.

  The organic EL display device of this embodiment can be operated as a capacitive touch panel by using the substrate 112 as a dielectric. Accordingly, it is not necessary to separately provide an insulating layer covering the first pattern wiring 111a and the second pattern wiring 111b, and it is not necessary to provide an opening by patterning, so that the manufacturing process can be simplified.

(Third embodiment)
The configuration of the organic EL display device according to the third embodiment of the present invention will be described. The organic EL display device of this embodiment is an example in which the shape of the reflector 103b is different from that of the first embodiment when the reflector 103b is formed by patterning the conductive layer A103.

  FIG. 14A is a top view of the non-display area NA in the organic EL display device of this embodiment as viewed from the counter substrate side. On the TFT substrate 9, a reflector 103c and a protrusion 104c are formed. FIG. 14B is a cross-sectional view taken along B-B ′ of FIG. 14A, and FIG. 14C is a cross-sectional view taken along C-C ′.

  In the organic EL display device of the present embodiment, the reflector 103c is arranged in parallel as a plurality of linear reflectors extending in a predetermined direction, and the protrusion 104c is orthogonal to the plurality of linear reflectors 103c. It becomes the structure which continues in multiple directions. In such a structure, a plurality of linear resin patterns that will later form the protrusions 104c may be arranged in a direction orthogonal to the linear reflector.

  In this case, as shown in FIG. 14B, in the region where the reflector 103c does not exist, the taper angle of the protrusion 104c becomes small because the light is not affected by the reflected light from the reflector 103c. 104c is formed. On the other hand, as shown in FIG. 14C, the region where the reflector 103c exists is affected by the reflected light from the reflector 103c, so that the taper angle of the protrusion 104c is large, the aspect ratio is large, and steep. A protruding portion 104c is formed.

  In the organic EL display device according to the present embodiment, the projection 104c has not only a portion with a large taper angle but also a steep portion, and also a portion with a small taper angle, and thus the coverage of the pattern electrode 105b formed on the projection 104c. Can be made good. A portion with a small taper angle is wide, and a portion with a large taper angle is narrow. If the diameter of the conductor 110 and the distance between the upper and lower substrates are appropriately set, the conductor 110 is fitted in a portion having a large taper angle. Since the conductor 110 fits in such a shape, the area where the pattern electrode 105b and the conductor 110 come into contact with each other after the insulating film C109 on the pattern electrode 105b is broken increases, and electrical contact can be achieved more reliably. .

  The embodiments described above as the embodiments of the present invention can be implemented in appropriate combination as long as they do not contradict each other. Also, those in which those skilled in the art appropriately added, deleted, or changed the design based on the display device of each embodiment, or those in which the process was added, omitted, or changed in conditions are also included in the present invention. As long as the gist is provided, it is included in the scope of the present invention.

  In addition, even for other operational effects different from the operational effects brought about by the aspects of the above-described embodiments, those that are apparent from the description of the present specification, or that can be easily predicted by those skilled in the art, Of course, it is understood that the present invention provides.

DESCRIPTION OF SYMBOLS 1 Substrate 2 TFT drive circuit layer 3 Organic EL element 4 Sealing film 5 Seal material 6 Fill material 7 Driver IC
8 FPC
9 TFT substrate 10 Pixel 11 First substrate 12 Second substrate 13 Scan line drive circuit 100 Organic EL display device 101 Substrate 102 TFT drive circuit layer 103 Conductive layer A (drain electrode)
103b Reflector 104 Insulating layer A (flattening layer)
104b Projection 105 Conductive layer B (pixel electrode, anode)
105b Pattern electrode 106 Insulating layer B (bank)
107 Light-Emitting Layer 108 Conductive Layer C (Common Electrode, Cathode)
109 Insulating layer C (sealing film)
110 conductor 111 conductive layer D (first pattern wiring, second pattern wiring)
112 Substrate 701 Photomask 901-904 TFT
905, 906 Capacitor 907 Organic EL element

Claims (20)

A first substrate having a display area in which a plurality of organic EL elements are arranged, and a non-display area surrounding the display area;
A second substrate having a first pattern wiring and a second pattern wiring superimposed on the first pattern wiring through a dielectric;
A sealing material sandwiched between the first substrate and the second substrate and disposed in the non-display area;
An organic EL display device comprising:
The non-display area includes a plurality of protrusions formed of a first insulating layer, a pattern electrode that covers the protrusions, and a second insulating layer that covers the pattern electrodes,
The sealing material includes a conductor in contact with the first substrate and the second substrate,
The organic EL display device, wherein the first pattern wiring or the second pattern wiring and the pattern electrode are electrically connected by the conductor.   The organic EL display device according to claim 1, wherein the first insulating layer includes a resin.   The organic EL display device according to claim 2, wherein the resin is a photosensitive resin.   The organic EL display device according to claim 1, wherein the conductor is electrically connected to the pattern electrode by destroying the second insulating layer.   The organic EL display device according to claim 1, wherein a touch panel is configured by the first pattern wiring, the second pattern wiring, and the dielectric, and the touch panel is controlled based on a signal from the first substrate. A fill material made of resin is provided between the first substrate and the second substrate on the display area,
The organic EL display device according to claim 1, wherein a diameter of the conductor is smaller than a distance between the first substrate and the second substrate. A fill material made of resin is provided between the first substrate and the second substrate on the display area,
The organic EL display device according to claim 6, wherein an added value of the diameter of the conductor and the height of the protrusion is larger than a distance between the first substrate and the second substrate.   The organic EL display device according to claim 1, wherein the pattern electrode is made of the same material as the anode of the organic EL element.   The organic EL display device according to claim 1, further comprising a reflector disposed around the protrusion in the non-display area.   10. The organic EL display device according to claim 9, wherein the reflector is a plurality of linear reflectors arranged in parallel, and the protrusions continuous in a direction orthogonal to the reflector are provided. Forming a first substrate having a display area in which a plurality of organic EL elements are arranged and a non-display area surrounding the display area;
Forming a second substrate having a first pattern wiring and a second pattern wiring superimposed on the first pattern wiring through a dielectric;
Forming a sealing material including a conductor in the non-display region of the first substrate;
Crimping the first substrate and the second substrate, and
The step of forming the first substrate includes:
Forming a plurality of protrusions composed of a first insulating layer in the non-display area;
Forming a pattern electrode covering the protruding portion;
Forming a second insulating layer covering the pattern electrode, and
An organic EL display device that electrically connects the first pattern wiring or the second pattern wiring and the pattern electrode by the conductor by pressure-bonding the first substrate and the second substrate. Production method.   The method of manufacturing an organic EL display device according to claim 11, comprising a step of forming the first insulating layer with a resin.   The method of manufacturing an organic EL display device according to claim 12, wherein the resin is a photosensitive resin.   The method of manufacturing an organic EL display device according to claim 11, wherein the conductor is electrically connected to the pattern electrode by breaking the second insulating layer.   The step of pressure-bonding the first substrate and the second substrate includes a step of bonding the first substrate and the second substrate in a vacuum, and the bonding of the first substrate and the second substrate to the atmosphere. The manufacturing method of the organic electroluminescence display of Claim 11 which has a process exposed inside. The step of forming the first substrate further includes a step of providing a fill material made of resin on the display area,
The method of manufacturing an organic EL display device according to claim 11, wherein a conductor having a diameter smaller than a distance between the first substrate and the second substrate is used as the conductor. The step of forming the first substrate further includes a step of providing a fill material made of resin on the display area,
17. The method of manufacturing an organic EL display device according to claim 16, wherein an added value of the diameter of the conductor and the height of the protrusion is larger than a distance between the first substrate and the second substrate.   The method of manufacturing an organic EL display device according to claim 11, wherein the pattern electrode is formed of the same material as the anode of the organic EL element.   The method of manufacturing an organic EL display device according to claim 11, wherein the step of forming the first substrate further includes a step of forming a reflector around a position constituting the protrusion in the non-display area. The step of forming the first substrate further includes a step of forming a plurality of linear reflectors arranged in parallel,
The method of manufacturing an organic EL display device according to claim 19, further comprising a step of forming a linear resin pattern continuous in a direction orthogonal to the linear reflector.

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