JP2015502857A - 薄膜とその調製プロセス - Google Patents
薄膜とその調製プロセス Download PDFInfo
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- JP2015502857A JP2015502857A JP2014537814A JP2014537814A JP2015502857A JP 2015502857 A JP2015502857 A JP 2015502857A JP 2014537814 A JP2014537814 A JP 2014537814A JP 2014537814 A JP2014537814 A JP 2014537814A JP 2015502857 A JP2015502857 A JP 2015502857A
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 52
- 239000010410 layer Substances 0.000 description 52
- 239000002131 composite material Substances 0.000 description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 39
- 239000011135 tin Substances 0.000 description 39
- 229910052802 copper Inorganic materials 0.000 description 33
- 229910001369 Brass Inorganic materials 0.000 description 28
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- 229910052718 tin Inorganic materials 0.000 description 24
- 239000011888 foil Substances 0.000 description 23
- 229910000831 Steel Inorganic materials 0.000 description 20
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- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 19
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- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 3
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- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- QCUOBSQYDGUHHT-UHFFFAOYSA-L cadmium sulfate Chemical compound [Cd+2].[O-]S([O-])(=O)=O QCUOBSQYDGUHHT-UHFFFAOYSA-L 0.000 description 2
- 229910000331 cadmium sulfate Inorganic materials 0.000 description 2
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- 238000003466 welding Methods 0.000 description 2
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- XQGSVNHIIVBMPX-UHFFFAOYSA-N Improsulfan tosylate Chemical compound CC1=CC=C(S([O-])(=O)=O)C=C1.CS(=O)(=O)OCCC[NH2+]CCCOS(C)(=O)=O XQGSVNHIIVBMPX-UHFFFAOYSA-N 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000370 acceptor Substances 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
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- 230000015556 catabolic process Effects 0.000 description 1
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- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
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- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000010409 ironing Methods 0.000 description 1
- 230000036244 malformation Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
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- 235000012239 silicon dioxide Nutrition 0.000 description 1
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- 239000002356 single layer Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
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- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical class [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0272—Selenium or tellurium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0326—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising AIBIICIVDVI kesterite compounds, e.g. Cu2ZnSnSe4, Cu2ZnSnS4
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03923—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIBIIICVI compound materials, e.g. CIS, CIGS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
- Recrystallisation Techniques (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Metal Rolling (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本特許仕様に使用されている「シート」なる用語は、ワイヤー及び格子/配列 /これらのメッシュを含む導電性材料を限定することなく意味する。これらのシートは少なくとも1つの平面および非平面の状を持っている。
これらの定義は、技術の中に表明されているものに追加される。
それをより経済的に実行可能でない方法で実行しないで、当該追加前兆プロセスが薄膜製造のプロセスの複雑さが追加される。
の複合積み重ね構造物の調製
(厚みが23μmの)銅箔および(厚みが0.4mm)のアルミニュームシートの各ストリップを一緒に圧延通路を通過させて60%圧延して、厚みが約0.17mmのよく接着された複合ストリップを取得した。複合ストリップを、ロール間に最小ギャップを維持した圧延機を数回通過させて圧延して、Cu/Alストリップを約0.051mm厚のものにした。複合ストリップのアルミ側を0.4mm厚のアルミニユームの上に配置し、シングルパスで60%更に圧延して、約1μmの銅の層を持つ約0.18mm厚のCu/Al複合ストリップを取得した。
23μmの厚みを持つ銅の薄箔を、ロール間ギャップを0.1mmに維持しった圧延機をシングルパスで通過させて、0.4mm厚のアルミニュームストリップに接着させた。結果として取得した銅/アルミニューム複合ストリップの厚みは、約0.18mm(約57%の厚み削減)となり、銅の箔はアルミニュームとよく接着した。銅/アルミニュームの複合ストリップをロール間に最小ギャップを維持した圧延機を更に通過させて、約0.10mmの厚み(約45%圧延済み)を持つストリップを取得した。この段階における銅の厚みはおよそ5.5μmであった。
実験2で与えられた複合構造物中にある銅層中の圧延方向に直角にクラックが見られた。これはアルミニュームの持つ銅より優れた可鍛性に起因するかもしれない。圧延プロセス中に、複合ストリップ中に発生する応力とバランスさせるため、より薄いアルミニュームシートを使い、厚い銅の追加ストリップをアルミニューム側に接着して、銅の中にクラックが発生するのを回避した。
実験2で付与されたと同等なプロセスを錫/真鍮/アルミニュームの複合構造部を作るために使用できる。真鍮箔 (Cu:Zn=63:37wt%,厚み=50μm)およびアルミニュームシート(0.4mm厚)の接着面は、カールさせたワイヤーハンドル・ブラシを使って摩耗させた後、接着/糊の小さな点滴を使って互いに接触させた状態で最先端に配置した。真鍮箔のアルミニュームシートとの接着は、ロール間ギャップを最小に維持した圧延装置を通過させることによって活化される。これによって、厚みが約20μmの真鍮と アルミニュームの接着がもたらされる。
23μmの厚みを持つ真鍮箔(Cu:Zn=63:37wt%)を合計厚みが18μmの錫の層(箔のいずれかの側に施した9μm厚の錫メッキ)で電気メッキした。0.4mmの厚みを持つのアルミニュウムシートの一方の側をカールしたワイアーホィールブラシを使って摩耗させ、最先端において、錫メッキを施した真鍮箔と接着性/糊の小滴を使って接触させて配置した。箔をロール間のギャップを最小に保った圧延機を通過させることによって、箔のロール接着をその後達成させた。これによって、厚いアルミニューム製基盤上に、7.5μm厚の真鍮を含み、よく接着された箔と厚みの合計が5.9μmの錫(厚みの約6.7%削減)がもたらされた。
実験1、2、4および5に付与された個別構造物のプロセスを、アルミニュームの代わりに、厚みが1 mmの鋼の基盤を使って繰り返した。プロセスで使われたスチールはAISI 304、316、430あるいはこれらと類似のものに準拠したものであり得る。
硫化プロセス:Cu/Al(実験1)あるいはCu/Steel(実験6)の複合箔を、H2Sガス(N2中の5%)の流れの中か、30分間、摂氏500度で清掃して閉じた小瓶に入れた硫黄の粉末を使って硫化して、アルミニュームかスチール上にそれぞれ、Cu2Sの層を取得した。
結果:アルミニューム上に準備されたサンプルがD−65照明の下で約100ミリボルトのVocを付与した。
硫化プロセス: アルミニューム、アルミニューム/厚肉銅またはスチールの上にCIS層を取得するため、In/Cu/Al(実験2)、In/Cu/Al/thick Cu(実験3)またはIn/Cu/Steel(実験6)の複合箔を、H2Sガス(5% in N2) の流れの中、あるいは窒素ガスを使って摂氏500度で1時間パージして閉じた小瓶の中で、硫黄の粉末を使ってそれぞれ硫化した。
セレニゼーションプロセス:アルミニュームまたはアルミニューム/厚肉銅の上にCISe層を取得するため、In/Cu/Al(実験2)、In/Cu/Al/厚肉Cu(実験3)またはIn/Cu/Steel(実験6)の複合箔を、窒素ガスを使って摂氏500度で1時間パージして閉じた小瓶の中に入れたセレニュームペレットを使ってセレン化した。スチール上のサンプルを同様な方法で、摂氏600度で1時間処理した。セレン化されたサンプルをその後、セレン化プロセス中にその上に堆積した余分なセレン除去するため、(vol/vol)メタノール中の0.2%臭素溶液中に15秒間浸し、脱イオン水で洗浄した後、空気で乾燥させた。CdSの薄膜をCBDによって、CISeの層の上に析出させ、実験7に付与された手順に従ってVocを試験した。
結果: アルミニューム上に調製したサンプルは約2mVのVocVocを与えたが、D−65光線の下で試験した場合、鋼上のこれらから約70−80mVのVocが得られた。
CZTS層をアルミニュームあるいは鋼上に取得するため、Sn/Brass/Al(実験4) Sn/Brass/Sn/Al(実験5) Sn/Brass/Steel(実験6)またはSn/Brass/Sn/Steel(実験6)の複合箔をそれぞれ、実験9に付与したプロセスを使って硫化した。
CdSの薄膜をCBDによって、CZTSの層の上に析出させ、実験7に付与された手順に従ってVocを試験した。
CZTS層をアルミニュームあるいは鋼上に取得するため、Sn/Brass/Al(実験4)、Sn/Brass/Sn/Al(実験5)、Sn/Brass/Sn/Steel(実験6) またはSn/Brass/Sn/Steel(実験6)の複合箔をそれぞれ、実験10に付与したプロセスを使って硫化した。
結果: 鋼上に準備されたサンプルがD−65照明の下で約5ミリボルトのVocを付与した。
本公開特許によって提供される技術的利点には以下が含まれる:
・5ミクロンを超えない事前に定めた厚みを持つ少なくとも1枚の層を含む、コスト効果の高い薄膜を精製するプロセス;
・少なくとも1枚のシートを含む薄膜を調製する効率的なプロセス;
・生産レートを高める薄膜を調製するシンプルなプロセス;
・薄膜; およびそこにフィルムの完全性が維持される薄膜。
Claims (16)
- 薄膜を調製するためのプロセス、
前述のプロセスには以下が含まれる:
予め定めた5ミクロンを超えない厚みの少なくとも1枚の層を持ち、薄膜の完全性が維持されている前述の薄膜を取得するための金属加工、
前述のシートは、金属、合金もしくはこれらの組み合わせのシートで、当該金属はIB、IIB, IIIA、IV, IVB、VBおよびVIBからなるグループの中から選ばれる。 - 金属加工の前述のステップが、予め定めた厚みを持つ基盤上に前述のシートの少なくとも1枚を積み重ねるステップによって先行されることを特徴とする、請求項1で請求されたようなプロセス。
- 金属加工の前述のステップが前述のシートの1枚によって示された最小の厚みの少なくとも5倍の厚みを示す基盤上に前述のシートの少なくとも1枚を積み重ねるステップによって先行されることを特徴とする、請求項1中に請求されたプロセス。
- 積み重ねの前述のステップが少なくとも10ミクロンの厚みを持つ前述のシートの少なくとも1枚の上で実施されることを特徴とする、請求項2中で請求されたようなプロセス。
- 前述の積み重ねステップに前述のシートを互いに接着するステップが更に含まれることを特徴とする、請求項2で請求されたようなプロセス。
- 積み重ねる前述のステップが少なくとも1枚の当該シートを前述の基盤に接着するステップを更に含むことを特徴とする、請求項2で請求したようなプロセス。
- 前述の金属加工ステップが予め定めた温度で実施されることを特徴とする、請求項1の中で請求されたプロセス。
- 前述の層の少なくとも1つがセレニゼーション、硫化およびテレニセーションからなるグループの中から選んだ少なくとも1つのプロセスの影響を受けることを特徴とする、請求項1で請求したプロセス。
- 金属、合金あるいはこれらを組み合わせたものの少なくとも1枚のシートを含む薄膜、但し、金属および合金はグループ、IB, IIB, IIIA, IVA, IVB, VB and VIBの中から選ばれ、前述の薄膜は5ミクロンを超えない値の予め定めた厚みの少なくとも1枚の層によって特徴付けられ、前述の薄膜の完全性は保存され、少なくとも1枚の層が金属加工によって取得される。
- 前述の少なくとのも1枚の層が、予め定めた厚みを持つ基盤上に前述のシートを積み重ねるプロセスによって先行される前述の金属加工のプロセスによって取得されることを特徴とする、請求項9の中で請求された薄膜。
- 前述のシートのいずれかの1枚によって示される最小厚みの少なくとも5倍の厚みを示す基盤上に前述のシートを積み重ねプロセスによって先行される前述の金属加工のプロセスによって、前述の少なくとも1枚のシートが取得されことを特徴とする、請求項9で請求されたような薄膜。
- 少なくとも10ミクロンの厚みを持つ少なくとも1枚のシート上で実施される積み重ねプロセスによって先行される金属加工の前述のプロセスによって、前述の少なくとのも1枚の層が取得されることを特徴とする、請求項10の中で請求されたような薄膜。
- 吸収体層として、請求項9の少なくとも1枚の薄膜を使用することによって取得されたソーラーセル。
- 請求項13の中で請求したようなソーラーセルを含むソーラーモジュール。
- 接触/導電層として、請求項9の少なくとも1枚の薄膜を使用することによって、取得されたソーラーセル。
- 請求項15の中で請求したようなソーラーセルを含むソーラーモジュール。
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