JP2015206685A - X-ray apparatus, control method of x-ray apparatus, image forming method, manufacturing method of structure, and structure manufacturing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress a reduction in the accuracy of examination.SOLUTION: An X-ray apparatus includes an X-ray source that emits X-rays, a detection device that detects at least a part of the X-rays emitted from the X-ray source and passed through a measuring object, and a control device that forms a third projection image by using a first projection image obtained from the measuring object with a first X-ray irradiation condition and a second projection image obtained from the measuring object with a second X-ray irradiation condition different from the first X-ray condition.

Description

  The present invention relates to an X-ray apparatus, an X-ray apparatus control device, an image forming method, a structure manufacturing method, and a structure manufacturing system.

  As an apparatus that acquires information inside an object nondestructively, for example, an X-ray apparatus that irradiates an object with X-rays and detects X-rays passing through the object is known. This X-ray apparatus has an X-ray source that irradiates X-rays, and can detect X-rays passing through an object and observe the inside (see Patent Document 1). Thereby, information inside the object is acquired.

US Patent Application Publication No. 2010/0098209

  However, the image acquired by the X-ray apparatus as described above may include a false image or the like in the acquired image due to the X-rays irradiated on the object. As a result, there is a problem that the inspection accuracy is lowered.

  An object of the aspect of the present invention is to provide an X-ray apparatus, an X-ray apparatus control device, an image forming method, a structure manufacturing method, and a structure manufacturing system that can suppress a decrease in inspection accuracy.

  According to the first aspect of the present invention, an X-ray source that emits X-rays, a detection device that detects at least part of the X-rays emitted from the X-ray source and passed through the measurement object, and the measurement object Using the first projection image obtained under the first X-ray irradiation condition and the second projection image obtained under the second X-ray irradiation condition different from the first X-ray irradiation condition for the measurement object, a third projection image is obtained. An X-ray device is provided that includes a control device to form.

  According to the second aspect of the present invention, the control device for the X-ray apparatus that forms an image using the detection result from the detection device that detects at least a part of the X-ray emitted from the X-ray source and passed through the measurement object. A first projection image obtained on the measurement object under the first X-ray irradiation condition and a second projection image obtained on the measurement object under a second X-ray irradiation condition different from the first X-ray irradiation condition. In use, a control device for an X-ray apparatus for forming a third projection image is provided.

  According to a third aspect of the present invention, there is provided an image forming method for forming an image by detecting at least a part of X-rays emitted from an X-ray source and passed through a measurement object. Forming a third projection image using the first projection image obtained under the irradiation condition and the second projection image obtained under the second X-ray irradiation condition different from the first X-ray irradiation condition for the measurement object; An image forming method is provided.

  According to the fourth aspect of the present invention, the design process for creating the design information related to the shape of the structure, the molding process for creating the structure based on the design information, and the shape of the manufactured structure There is provided a method for manufacturing a structure having a measurement process using an X-ray apparatus according to one aspect, and an inspection process for comparing shape information obtained in the measurement process with design information.

  According to the fifth aspect of the present invention, the design apparatus for producing design information relating to the shape of the structure, the molding apparatus for producing the structure based on the design information, and the present invention for measuring the shape of the produced structure. There is provided a structure manufacturing system including an X-ray apparatus according to the first aspect of the present invention and an inspection apparatus that compares design information with shape information related to the shape of the structure obtained by the X-ray apparatus.

  According to the aspect of the present invention, it is possible to suppress a decrease in inspection accuracy.

It is a figure which shows an example of the whole structure of the X-ray apparatus which concerns on 1st Embodiment. It is a figure which shows an example of an X-ray apparatus. It is a figure which shows an example of an X-ray source. It is a figure which shows typically a mode that an electron injects into a target and a X-ray | X_line generate | occur | produces. It is a figure which shows an example of the mode of an image synthesis | combination by a control apparatus. It is a figure which shows an example in the case of changing X-ray conditions. It is a figure which shows the mode of an image synthesis | combination by a control apparatus. It is a figure which shows an example which reverses a measurement object. It is a figure which shows the other example which reverses a measurement object. It is a figure which shows an example of a structure of a stage apparatus. It is a figure which shows an example of operation | movement of an X-ray source in the X-ray apparatus which concerns on 2nd Embodiment. It is a figure which shows an example of the X-ray apparatus which concerns on 3rd Embodiment. It is a block block diagram of a structure manufacturing system. It is the flowchart which showed the flow of the process by a structure manufacturing system.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. Further, in the drawings, in order to describe the embodiment, the scale is appropriately changed and expressed, for example, partly enlarged or emphasized. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as the Z-axis direction, a direction orthogonal to the Z-axis direction in the horizontal plane is defined as the X-axis direction, and a direction orthogonal to each of the Z-axis direction and the X-axis direction (that is, the vertical direction) is defined as the Y-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
FIG. 1 is a diagram illustrating an example of the overall configuration of the X-ray apparatus 1 according to the first embodiment. FIGS. 2A and 2B are diagrams illustrating an example of the X-ray apparatus 1. As shown in FIGS. 1, 2 (a) and 2 (b), the X-ray apparatus 1 irradiates the measurement object S with X-ray XL and detects transmitted X-rays transmitted through the measurement object S. The X-ray apparatus 1 irradiates the measurement object S with X-rays, detects the X-rays that have passed through the measurement object S, and acquires information (for example, internal structure) inside the measurement object S in a non-destructive manner. X-ray CT inspection apparatus. In the present embodiment, the measurement object S includes industrial parts such as mechanical parts and electronic parts. The X-ray CT inspection apparatus includes an industrial X-ray CT inspection apparatus that irradiates industrial parts with X-rays and inspects the industrial parts.

  The X-ray apparatus 1 includes an X-ray source 100 that emits X-ray XL, a stage apparatus 3 that can move while holding the measurement object S, and a measurement object that is emitted from the X-ray source 100 and held on the stage apparatus 3. The detector 4 which detects at least one part of the X-ray which passed S, and the control apparatus 5 which controls operation | movement of the X-ray apparatus 1 whole are provided. The X-ray apparatus 1 includes a chamber member 6 that forms an internal space SP in which the X-ray XL emitted from the X-ray source 100 travels. The X-ray source 100, the stage device 3, and the detector 4 are disposed in the internal space SP.

  In the present embodiment, the measurement object S is shown as an example. The measurement object S has a tapered portion Sa and a cylindrical portion Sb. For example, as illustrated in FIG. 1, the lower surface (the surface on the −Y side) of the tapered portion Sa includes an end surface Sc. The end surface Sc is a flat surface formed in a circular shape. For example, as shown in FIG. 1, an end surface Sd is formed on the upper surface (the surface on the + Y side) of the cylindrical portion Sb. The end surface Sd is a plane formed in a circular shape. The end surface Sc and the end surface Sd are arranged in parallel. The measurement object S can be placed upright on the stage 9 of the stage apparatus 3 with the end face Sc or the end face Sd being the bottom. For example, the entire measured object S from the end surface Sc to the end surface Sd is formed of a material having a uniform density.

  The X-ray source 100 irradiates the measurement object S with X-ray XL. The X-ray source 100 can adjust the intensity of X-rays applied to the measurement object S based on the X-ray absorption characteristics of the measurement object S. The X-ray source 100 includes a point X-ray source and irradiates the measurement object S with conical X-rays (so-called cone beam). The X-ray source 100 is installed so as to be long in the Y direction. An exit port 100a is formed at the tip of the X-ray source 100 on the + Y side. The injection port 100a opens toward the measurement object S. The injection port 100a may be closed with a material having high X-ray XL permeability. The X-ray XL is emitted from the injection port 100a in the + Z direction. At least a part of the X-ray XL emitted from the X-ray source 100 travels in the + Z direction. Note that the emission port 100a of the X-ray source 10 does not have to open toward the measurement object S, and may protrude from the housing 42 described later.

  The stage device 3 includes a stage 9 and a stage drive mechanism (not shown). The stage 9 is provided so as to be movable while holding the measurement object S. The stage 9 has a holding unit that holds the measurement object S. The stage 9 can be translated in, for example, the X direction, the Y direction, and the Z direction by a stage drive mechanism (not shown), and can be rotated in the θY direction. Note that the position of the stage 9 (position of the measuring object S) by the stage driving mechanism is controlled by the control device 5.

  The stage 9 has a holding unit (not shown) that can hold both the end surface Sc and the end surface Sd of the measurement object S. For example, as illustrated in FIG. 2A, when the end surface Sc on the tapered portion Sa side is placed on the stage 9, the end surface Sc is placed on the stage 9 so that the position of the end surface Sc does not shift by a holding unit (not illustrated). Can be held. Further, as shown in FIG. 2B, when the end surface Sd on the cylindrical portion Sb side is placed on the stage 9, the stage 9 has an end surface Sd that is not displaced by a holding unit (not shown). Can be held. As described above, the stage 9 can hold the end faces Sc and Sd regardless of which of the end faces Sc and Sd having different areas is placed. However, the stage 9 may not include a holding unit for the measurement object S. In this case, the measuring object S is placed on the stage 9 with the end surface Sc or the end surface Sd in contact with the stage 9.

  The detector 4 is disposed on the opposite side of the X-ray source 100 across the stage 9 (measurement object S). The detector 4 is arranged on the + Z side with respect to the stage 9. For example, the detector 4 is fixed at a predetermined position of the X-ray apparatus 1, but may be movable. The detector 4 includes an incident surface 33, a scintillator unit 34, and a light receiving unit 35. The incident surface 33 is a plane formed in parallel with the XY plane and is directed in the −Z direction. The incident surface 33 is disposed to face the measurement object S held on the stage 9. The X-ray XL from the X-ray source 100 including the transmitted X-ray that has passed through the measurement object S is incident on the incident surface 33. Even when the same measurement object S is measured, for example, when the end surface Sc is placed on the stage 9 as shown in FIG. 2A and when the end surface Sd is shown in FIG. The detection result detected by the detector 4 is different from the case where is placed on the stage 9.

  The scintillator section 34 includes a scintillation substance that generates light when it is irradiated with X-rays. The light receiving unit 35 includes a photomultiplier tube. The photomultiplier tube includes a phototube that converts light energy into electrical energy by a photoelectric effect. The light receiving unit 35 receives and amplifies the light generated in the scintillator unit 34, converts it into an electrical signal, and outputs it. The detector 4 has a plurality of scintillator sections 34. A plurality of scintillator sections 34 are arranged in an array in the XY plane. The detector 4 has a plurality of light receiving portions 35 so as to be connected to each of the plurality of scintillator portions 34. The output result in the light receiving unit 35 is transmitted to the control device 5.

  The control device 5 comprehensively controls the operations of the X-ray source 100, the stage device 3 (stage 9), and the detection unit 4. In addition, the control device 5 has an image configuration unit 51. The image construction unit 51 forms an image of the measuring object S based on the detection result in the detector 4. The image construction unit 51 forms an image of the measurement object S using one or a plurality of detection results from the detector 4. The image construction unit 51 can form both a two-dimensional image and a three-dimensional image. The control device 51 is a computer having an automatic calculation function. In addition, the control apparatus 5 may not be one place but a several place. For example, the image construction unit 51 forms an image of the measurement object S based on the detection result in the detector 4, but transmits the detection result in the detector 4 to a plurality of computers, and the detection result in each computer is transmitted. Further, it may be integrated with another computer. In this case, it is needless to say that there may be a plurality of control devices 5 connected to the X-ray device by electric wires and control devices 5 connected wirelessly such as the Internet. Therefore, for example, the image composition unit 51 of the control device 5 can have a plurality of image composition units 51 of the control device 5 by introducing a program for executing the image composition unit into the computer. In the present embodiment, the control device 5 transmits signals by wire in order to comprehensively control the operations of the X-ray source 100, the stage device 3 (stage 9), and the detection unit 4. It does not matter. A plurality of control devices 5 may be provided, and the operations of the X-ray source 100, the stage device 3 (stage 9), and the detection unit 4 may be controlled by each of the plurality of control devices 5. In addition, when a plurality of X-ray apparatuses are controlled, the controlling apparatus may be used.

  FIG. 3 is a diagram illustrating an example of the X-ray source 100 according to the present embodiment. As shown in FIG. 3, the X-ray source 100 includes a filament 39, a target 40, an electron optical system 41, a housing 42, a deflection device 43, and an anode 44. The filament 39, the electron optical system 41, the deflecting device 43, and the anode 44 are arranged along the Y direction. The filament 39 includes, for example, tungsten (W). When a current flows through the filament 39 and the filament 39 is heated by the current, electrons (thermoelectrons) EB are emitted from the filament 39.

  The target 40 is arranged in the emission direction of the electrons EB from the electron optical system 41. The target 40 generates X-rays by collision of electrons accelerated by the anode 44 or transmission of electrons. X-rays are electromagnetic waves having a wavelength of about 1 pm to 30 nm, for example. X-rays include ultra-soft X-rays of about several tens eV, soft X-rays of about 0.1 to 2 keV, X-rays of about 2 to 20 keV, and hard X-rays of about 20 to 50 KeV. The target 40 is a parallel plate containing heavy metal such as tungsten (W) or molybdenum (Mo), for example, and generates X-rays by collision of electrons or transmission of electrons. In the present embodiment, the target 40 is a reflective target that reflects generated X-rays and emits them in the Z direction. For example, the target 40 may be electrically connected to the ground GND or the like, or may not be electrically connected to the ground GND or the like.

  The electron optical system 41 is disposed between at least a part of the periphery of the path of the electron EB from the filament 39 between the filament 39 and the target 40. The electron optical system 41 includes a coil and a focusing lens, and guides the electron EB from the filament 39 to the target 40. The electron optical system 41 has an optical axis AX1. The optical axis AX1 is set parallel to the Y axis. The electron optical system 41 causes the electron EB to collide with a partial region (X-ray generation region) of the target 40. The size (spot size) of the region where the electron EB collides with the target 40 is sufficiently small. Thereby, a point X-ray source is substantially formed.

  In the present embodiment, the size of the region where the electron EB collides on the surface of the target is, for example, in units of μm. For example, the size of the region where the electrons collide may be any size from 0.1 μm to 1 cm. Of course, the size of the region where the electrons collide is not limited to this. Further, the shape of the XY plane of the region where the electrons collide is not limited to a circle. For example, a polygon such as an ellipse, an ellipse, or a rectangle may be used.

  The housing 42 accommodates at least a part of members constituting the X-ray source 100. The housing 42 accommodates each of the filament 39, the target 40, the electron optical system 41, the deflecting device 43, and the anode 44. The housing 42 is provided with an injection port 100a for emitting X-rays. The housing 42 is connected to an exhaust system (not shown) and includes a vacuum pump such as a turbo molecular pump (not shown). The inside of the housing 42 is set to a high vacuum state by this vacuum pump.

  The deflecting device 43 changes the traveling direction of electrons emitted from the filament 39. The deflecting device 43 includes, for example, a coil and an electron lens. The deflection device 43 is arranged on both the front side (filament 39 side) and the rear side (target 40 side) with respect to the electron optical system 41. The deflection device 43 is also referred to as an aligner or a deflector. The plurality of deflection devices 43 are not limited to being arranged, and for example, one may be arranged behind the electron optical system 41.

  The anode 44 accelerates the electrons emitted from the filament 39 toward the target 40. However, the anode 44 is not limited to being used. For example, by applying a voltage between the target 40 and the filament 39 using the target 40 as the anode and the filament 39 as the cathode, the thermoelectrons emitted from the filament 39 are accelerated toward the target (anode) 40, and the target 40 may be irradiated.

  The electrons emitted from the filament 39 are accelerated by the anode 44 and converged by the electron optical system 41 to travel. At least some of the electrons emitted from the electron optical system 41 travel in the + Y direction. The electron irradiation direction (traveling direction) is the Y direction. The traveling direction of the electrons is adjusted by the deflecting device 43. The X-ray XL emitted from the target 40 has an optical axis AX2. The optical axis AX2 is a direction parallel to the Z direction.

  In addition, as shown in FIG. 1, the chamber member 6 is arrange | positioned on the support surface FR. The support surface FR includes a floor surface of a factory or the like. The chamber member 6 is supported by a plurality of support members 6S. The chamber member 6 is disposed on the support surface FR via the support member 6S. The lower surface of the chamber member 6 and the support surface FR are separated by the support member 6S. That is, a space is formed between the lower surface of the chamber member 6 and the support surface FR. However, at least a part of the lower surface of the chamber member 6 may be in contact with the support surface FR. The chamber member 6 is formed of a material containing lead. The chamber member 6 suppresses the X-ray XL in the internal space SP from leaking out of the chamber member 6. The support member 6S may include a driving device for correcting the inclination of the chamber member 6 and removing vibrations.

  One or both of the inner surface and the outer surface of the chamber member 6 may be provided with a heat insulating material having a lower thermal conductivity than the chamber member 6. Thereby, it is suppressed that the temperature of internal space SP receives the influence of external temperature (temperature change), and suppresses that external heat is transmitted to internal space SP. As the heat insulating material, for example, plastic or polystyrene foam is used.

  Next, an example of the operation of the X-ray apparatus 1 will be described. In the detection of the measurement object S, the control device 5 controls the stage device 3 to place the measurement object S held on the stage 9 between the X-ray source 100 and the detector 4. The control device 5 adjusts the position of the stage 9 holding the measurement object S. Then, the control device 5 causes a current to flow through the filament 39 in order to emit X-rays from the X-ray source 100. Thereby, the filament 39 is heated and electrons are emitted from the filament 39. The electrons emitted from the filament 39 are applied to the target 40. Thereby, X-rays are generated from the target 40.

  At least a part of the X-ray XL generated from the X-ray source 100 is irradiated on the measurement object S. When the measurement object S is irradiated with the X-ray XL, at least a part of the X-ray XL irradiated to the measurement object S passes through the measurement object S. The transmitted X-rays that have passed through the measurement object S enter the incident surface 33 of the detector 4. The detector 4 detects transmitted X-rays that have passed through the measurement object S. The detector 4 detects an image of the measurement object S obtained based on the transmitted X-rays transmitted through the measurement object S. The detection result of the detector 4 is output to the control device 5.

  The control device 5 irradiates the measurement object S with the X-ray XL while rotating the stage 9 holding the measurement object S in the θY direction. The control device 5 changes the irradiation region of the X-ray XL from the X-ray source 100 in the measurement object S by changing the position of the measurement object S with respect to the X-ray source 100. Transmitted X-rays that have passed through the measurement object S at each position (each rotation angle) of the stage 9 are detected by the detector 4. The detector 4 acquires an image of the measuring object S at each position. The control device 5 calculates the internal structure of the measurement object S from the detection result of the detector 4. The control device 5 acquires an image Im1 (see FIG. 7) of the measurement object S based on the transmitted X-rays that have passed through the measurement object S at each position (each rotation angle) of the measurement object S. The control device 5 acquires a plurality of images Im1 of the measurement object S.

  The internal space SP that irradiates the measurement object S with the X-ray XL may be supplied with, for example, a gas whose temperature is adjusted by a temperature adjusting device (not shown). Thus, when the temperature of the internal space SP is adjusted, the X-ray apparatus 1 may be calibrated prior to the measurement of the measurement object S. For example, the calibration is performed in a state where, for example, a sphere different from the measurement object S is held on the table 12 and the temperature of the internal space SP including the X-ray source 100 is adjusted. The outer shape (dimension) of the sphere is known and is an object in which thermal deformation is suppressed at least as compared with the measurement object S. Even if the temperature changes in the internal space SP, the outer shape (size) of the sphere does not substantially change.

Here, characteristics of the X-ray XL irradiated to the measurement object S will be described.
FIG. 4 is a diagram schematically illustrating a state in which electrons enter the target 40 and X-rays are generated. As shown in FIG. 4, the target 40 has a surface 46. The surface 46 is a surface on which electrons are incident. The surface 46 is inclined with respect to the optical axis AX1 of the electron optical system. The electrons incident on the surface 46 enter the target 40. When the electrons reach the X-ray generation region 45, X-rays XL are generated in the X-ray generation region 45. The generated X-ray XL travels in the + Z direction along the optical axis AX2 while diffusing in the Y direction. In the present embodiment, among the generated X-rays XL, X-rays XLA diffused to the + Y side travel through the target 40 from the X-ray generation region 45 to a position 46A on the surface 46, and are emitted from the position 46A. . Further, the X-ray XLB diffused to the −Y side travels in the target 40 from the X-ray generation region 45 to a position 46B on the surface 46, and is emitted from the position 46B.

  As the X-ray XL travels through the target 40, the X-ray XL is absorbed by the target 40 and the intensity decreases. In this case, the longer the distance traveled within the target 40, the greater the amount of absorption by the target 40 and the lower the intensity of the X-ray XL. The X-ray XLA travels within the target 40 by a distance LA from the X-ray generation region 45 to the position 46A. Further, the X-ray XLB travels within the target 40 by a distance LB from the X-ray generation region 45 to the position 46B. Since the target 40 is tilted, the distance LA is longer than the distance LB. Therefore, the amount of X-ray XLA absorbed by the target 40 is increased and the strength is weaker than that of the X-ray XLB. In this case, the intensity of the X-ray XL is the intensity of the X-ray XL at a predetermined wavelength of the X-ray XL. Therefore, the amount of decrease at the distance LA differs depending on the wavelength of the X-ray XL.

  The graph of FIG. 4 shows the relationship between the position of X-rays emitted from the surface 46 of the target 40 and the intensity of X-rays. The vertical axis of the graph indicates the position in the Y direction of the X-ray XL emitted from the target 40. The horizontal axis of the graph indicates the intensity of X-rays. As shown in this graph, the intensity of X-rays emitted from the surface 46 has a non-uniform distribution depending on the position. Note that the graph of FIG. 4 shows changes in the intensity of the X-ray XL at a predetermined wavelength of the X-ray. In addition, when the X-ray to be used is an X-ray XL having a wavelength in a predetermined range, the spectrum area in the wavelength in the predetermined range may be used as the X-ray intensity. In addition, the spectrum in this case is a spectrum showing the intensity | strength of the X-ray for every wavelength.

  In general, the X-ray XL generated from the X-ray generation region 45 of the target 40 is not a single wavelength but an X-ray having a plurality of continuous wavelengths. That is, the generated X-ray XL has a spectral distribution having a predetermined range of wavelengths. In general, the absorption coefficient of a substance varies depending on the wavelength. X-ray XL having a long wavelength of X-ray XL is absorbed by more substances than X-ray XL having a short wavelength of X-ray XL. Further, along with the propagation distance of the X-ray XL within the target 40, the intensity of the X-ray XL is reduced. Accordingly, the rate at which the intensity of the X-ray XL decreases with the propagation distance in the target 40 of the X-ray XL differs depending on the wavelength of the X-ray XL. That is, the rate at which the intensity of the X-ray XL with a short wavelength of the X-ray XL decreases is larger than the rate at which the intensity of the X-ray XL with a long wavelength of the X-ray XL decreases. Note that the rate at which the intensity of X-ray XL decreases is how much the X-ray has decreased with respect to the propagation distance of the X-ray XL within the target 40 being zero. Of course, the X-ray XL having a short wavelength of the X-ray XL may be absorbed by more substances than the X-ray XL having a long wavelength of the X-ray XL.

  For this reason, the X-ray XL generated from the X-ray generation region 45 has a non-uniform X-ray spectrum according to the X-ray emission direction. That is, when the spectrum of the X-ray XLA emitted from the position 46A on the surface 46 of the target 40 and the spectrum of the X-ray XLB emitted from the position 46B on the surface 46 of the target 40 are compared, The shape is different. In this case, in the XLA spectrum, the ratio of the X-ray intensity of the X-ray XL having a shorter wavelength than the X-ray intensity of the X-ray XL having a longer wavelength than that of the X-ray XL, and the X-ray XL of the XLB spectrum. The ratio of the intensity of X-rays with a short wavelength of X-rays is different from that of X-rays with a long wavelength. That is, since the X-ray XLA emitted from the position 46A on the surface 46 of the target 40 propagates a distance LA longer than the distance LB, a lot of X-rays having lower energy than the X-ray XLB are absorbed. . Thus, the spectrum of X-rays radiated from the target 40 varies depending on the radiation direction. Therefore, when calculating the absorption coefficient of the measurement range, which will be described later, the absorption coefficient calculated for the same substance may be different. Thereby, a false image may be included in the measurement result, which may cause a detection failure of the measurement object.

  As shown in FIG. 4, an X-ray XL having an intensity distribution is measured on the measurement object S. FIG. 5 is a diagram illustrating an example of how images are synthesized by the control device. FIG. 5B shows an example of a projection image created when X-rays are incident on the XY plane of the measurement object S in FIG. 5 and receive the X-rays that have passed through the measurement object S. In FIG. 5, the measuring object S is a quadrangular prism, and X-rays are incident on a surface parallel to one XY plane, and X-rays transmitted through a surface parallel to the opposing XY plane are converted into an XY plane (not shown). Light is received by a detector having a parallel light receiving surface. 5A has the same propagation distance in the Z-axis direction of X-rays incident on the XY plane. In addition, the measurement object S in FIG. 5A is a single substance, and the absorption coefficient for X-rays is the same in the measurement object S. Therefore, if the intensity of the X-rays incident on the XY plane of the measurement object S is the same along the Y-axis direction, the X-rays transmitted through the measurement object S are equally reduced. Therefore, the detected X-ray intensity is the same along the Y-axis direction.

  On the other hand, as shown in FIG. 4, the measurement object S is irradiated with an X-ray XL having an intensity distribution in the Y-axis direction. In this case, an X-ray is used in which the X-ray intensity increases in the + Y-axis direction and the X-ray intensity decreases in the -Y-axis direction in FIG. Therefore, originally, the X-ray intensity transmitted through the measurement object S along the Y-axis direction is the same. However, since the X-ray XL having the intensity distribution is irradiated in the Y-axis direction, a projection image as shown in FIG. 5B is obtained. Therefore, since the intensity of the X-ray XL increases in the + Y axis direction, the ratio of noise to the signal obtained by the detector decreases along the + Y axis direction. Further, the brightness of the image obtained by the detector varies along the Y-axis direction.

  Further, the intensity of the X-rays incident on the measurement object S varies depending on the location. Further, in the present embodiment, the X-ray used is not a single wavelength but an X-ray including a plurality of wavelengths in a predetermined range. That is, the X-ray used can be represented by a spectrum of intensity distribution for each wavelength. In this case, the spectrum of the irradiated X-ray differs depending on the irradiation direction from the X-ray generation region 45. Therefore, the X-ray spectra incident at the position of the test object are different. In the present embodiment, the intensity of X-rays is a large or small number of photons when X-rays are considered by the number of photons at a plurality of wavelengths of the X-ray XL. Further, the X-ray intensity may be the number of photons at a predetermined wavelength.

  On the other hand, depending on the substance, the absorption coefficient differs for each wavelength. Therefore, the attenuation rate of X-rays when propagating a predetermined distance of a predetermined substance differs for each wavelength. Therefore, the shape of the X-ray spectrum is different before and after propagating a predetermined distance of a predetermined substance. Further, when X-rays after propagating a predetermined distance of the predetermined substance are propagated a predetermined distance of the same predetermined substance, the spectrum shapes are different before and after propagation. In this case, the absorption coefficient of the predetermined substance at a predetermined distance that is incident first is different from the absorption coefficient of the predetermined substance that has been propagated next. In this case, the absorption coefficient of the predetermined substance at a predetermined distance is not due to the absorption coefficient obtained from a single wavelength but to the absorption coefficient obtained from multiple wavelengths. Therefore, as described above, since the X-ray spectrum differs depending on the position of the X-ray incident on the test object, the calculated absorption coefficient depends on the position of the test object even for the same substance. May be different.

  In the present embodiment, the X-ray XL irradiated to the measurement object S is irradiated, and the projected image of the measurement object S is measured. Thereafter, the projection image of the measurement object S is measured by changing the condition of the X-ray XL irradiated to the measurement object S. By combining the respective measurement results with different X-ray XL conditions for irradiating the measurement object, the variation in the intensity of the X-rays irradiated at the position of the measurement object can be compared with the respective measurement results before combining. Can be suppressed. Thereby, the measurement result with which the measurement object was irradiated can be acquired using the X-rays with which the variation in the intensity of the X-rays is small.

FIG. 5 shows an example of changing the X-ray XL condition.
The image (first projection image) obtained in FIG. 5B has a high intensity of the X-ray XL irradiated along the + Y axis direction. In the present embodiment, the change of the X-ray XL condition is, for example, from the X-ray irradiation (first X-ray irradiation condition) of the intensity distribution in which the intensity of the X-ray XL increases along the + Y axis direction to the + Y axis direction. It is changing to irradiation (2nd X-ray irradiation conditions) from which the intensity | strength of X-ray XL becomes weak along. A projection image (second projection image) acquired by irradiation of the X-ray XL with the irradiation condition changed is shown in FIG. In the image shown in FIG. 5C, the intensity of the X-ray XL that is examined along the + Y-axis direction is weak.

  Further, the rate of change of the intensity of the X-ray XL in the + Y-axis direction of the X-ray XL irradiated to the measurement object S in FIG. 5B and the X-ray XL irradiated to the measurement object S in FIG. The rate of change in the intensity of the X-ray XL in the −Y-axis direction is the same. Further, the intensity of the X-ray irradiated to S1 of the measuring object S in FIG. 5B is the same as the intensity of the X-ray irradiated to S2 of the measuring object S in FIG. Further, the sum of the X-ray intensity irradiated to S1 in FIG. 5B and the X-ray intensity irradiated to S1 in FIG. 5C and the X-ray irradiated to S2 in FIG. 5B. The total intensity of the X-rays irradiated to S2 in FIG. 5C is the same. 5B and 5C, the total X-ray intensity at the same position in each image is the same at any position.

  Further, the brightness of the image obtained in FIGS. 5B and 5C varies depending on the intensity of the X-ray received by the detector. Therefore, in this case, the total luminance of the images at the same position in each image in FIGS. 5B and 5C is the same at any position.

  Next, the obtained image shown in FIG. 5B and the image shown in FIG. 5C are combined to create a combined image (third projection image) shown in FIG. In this case, alignment is performed so that the image shown in FIG. 5B and the image shown in FIG. As shown in FIG. 5D, the brightness of the synthesized image is the same in the + Y-axis direction, unlike the images shown in FIGS. 5B and 5C. Therefore, the image is obtained as if the X-rays transmitted through the measuring object S received the same X-rays in the Y-axis direction. Further, in FIG. 5D, the measurement object S is irradiated with the same X-ray intensity in the Y-axis direction.

  FIG. 6 is a diagram illustrating an example of changing the X-ray XL condition. As shown in FIG. 6, in this embodiment, the reference plane α is set as a plane including the optical axis AX1 of the electron optical system 41 and the optical axis AX2 of the X-ray XL. This reference plane α is set parallel to the YZ plane. The reference plane α is set along the up-down direction D parallel to the Y-axis direction. The vertical direction D is a direction in which the intensity distribution and the quality distribution of the X-ray XL are mainly formed. In the present embodiment, when the condition of the X-ray XL is changed, the arrangement of the measurement object S is changed so that the measurement object S is in the opposite direction with respect to the vertical direction D, as indicated by a broken line in FIG. By this arrangement change, the end surface Sc on the taper portion Sa side is disposed on the + Y side, and the end surface Sd on the columnar portion Sb side is disposed on the −Y side (on the stage 9). Thus, by changing the arrangement of the measurement object S with respect to the reference plane α, the intensity distribution and the quality distribution of the X-rays irradiated to the measurement object S are changed so as to be reversed in the vertical direction D. Is done. In the present embodiment, the arrangement of the measurement object S is reversed so that the X-ray irradiation on the measurement object changes by 180 ° around the reference plane α. In the present embodiment, the arrangement of the measurement object X is reversed so as to change by 180 °, but is not limited thereto. It may be 170 ° or 175 °.

  Thereafter, the measurement object S is irradiated with X-ray XL to obtain an image of the measurement object S. At this time, the intensity distribution and the quality distribution of the X-ray XL are the same as in the previous irradiation. On the other hand, the arrangement of the measurement object S in the vertical direction D is opposite to that at the previous irradiation. For this reason, the conditions of the X-ray XL irradiated to the same position of the measuring object S are different from the previous irradiation.

  In the present embodiment, the X-ray dose attenuated by Sb of the measurement object S and the X-ray dose attenuated by Sa of the measurement object S are the same. Also, the absorptance for each wavelength of X-rays is the same for the measurement object Sa and the measurement object Sb. Therefore, if there is no distribution in the X-ray dose irradiated to the measurement object, an image obtained like the image Im3 in FIG. 7 shows the same luminance depending on the position of the measurement object S. This is because, for example, the displayed image changes in luminance according to the intensity of X-rays received by the detector. In this embodiment, when the intensity of received X-rays increases, the image is sent from the detector to the control device. The signal is not large, and the luminance (brightness) of the area corresponding to the pixel changes with the magnitude of the signal to display brighter. Of course, the luminance of the region corresponding to the pixel may be displayed darker according to the intensity of the X-ray detected by the detector.

  Therefore, as shown in FIG. 7, in the image Im2 of the measurement object S obtained as a result, a luminance distribution of the luminance image along the Y direction is formed. However, in this case, contrary to the image Im1, in the image Im2, the end surface Sc side of the tapered portion Sa is displayed with high luminance, and the end surface Sd side of the cylindrical portion Sb is displayed with low luminance.

  As described above, the taper portion Sa of the measurement object S is displayed with high luminance luminance in the image Im1 and is displayed with low luminance luminance in the image Im2 for the two measurement results. Further, the cylindrical portion Sb is displayed with low luminance in the image Im1, and is displayed with high luminance in the image Im2. Note that the connection portion between the tapered portion Sa and the cylindrical portion Sb is displayed with a medium luminance in both the image Im1 and the image Im2.

  Next, the image configuration unit 51 of the control device 5 generates an image (third projection image) Im3 by superimposing the image (first projection image) Im1 and the image (second projection image) Im2. In this case, the image configuration unit 51 performs alignment so that the tapered portions Sa and the cylindrical portions Sb overlap each other between the images Im1 and Im2. Further, the image Im2 is aligned after being rotated by 180 °. A known method can be used for the alignment of the image Im1 and the image Im2. For example, when performing alignment, movement in the X or Y direction (parallel movement) within the alignment plane, rotation about the vertical direction with respect to the same plane, magnification in the X or Y direction, X direction And parameters such as the orthogonality in the Y direction may be used. Further, when positioning, image deformation by rigid body transformation or non-rigid body transformation may be applied, or affine transformation or non-affine transformation for a non-rigid body may be applied.

  Image alignment is performed by various algorithms based on the above parameters and the like. A known method is used as the algorithm. For example, an algorithm may be used that searches for a point where the difference sum or the least square sum of two images is minimized while operating the above-described parameters. In addition, a point image superposition method, a surface image superposition method, a pixel image superposition method, or the like may be used. The point image superimposing method is a method in which, for example, a reference point (marker) image is prepared in advance, such as a two-dimensional barcode, and these are combined. The surface image superimposing method is a method for searching for a point where the surfaces of two images are closest to each other, such as the Head and Hat method and the ICP method. Examples of the pixel image superimposing method include an SID (least square sum) method, a CC (correlation coefficient) method, and an RIU (image ratio uniformity) method. Note that, as preprocessing, spatial filter smoothing / sharpening, or binarization may be performed. Further, feature points may be extracted and their positions may be matched. In addition to a real image, a method for processing a differential image or a method for processing a histogram may be used. Alternatively, the image may be reduced and aligned, and the alignment may be repeated while returning to the original magnification. Further, the above-described alignment may be global alignment or local alignment.

  By superimposing the image Im1 and the image Im2, the high-luminance luminance portion of the image Im1 and the low-luminance luminance portion of the image Im2 overlap each other on the end surface Sc side of the tapered portion Sa. On the end surface Sd side of the cylindrical portion Sb, the low luminance portion of the image Im1 and the high luminance portion of the image Im2 overlap. Moreover, about the connection part of the taper part Sa and the cylindrical part Sb, the middle-intensity parts of the image Im1 and the image Im2 overlap. Therefore, by superimposing the image Im1 and the image Im2, in the image Im3, the luminance distribution from the end surface Sc side to the end surface Sd side is canceled.

  Thereafter, the control device 5 performs an operation based on the plurality of X-ray transmission data (images) Im3 synthesized by the image construction unit 51, reconstructs a tomographic image of the measurement object S, and the internal structure of the measurement object S The three-dimensional data (three-dimensional structure) is generated. Thereby, the internal structure of the measuring object S is calculated. Examples of the reconstruction method of the tomographic image of the measurement object include a back projection method, a filter-corrected back projection method, and a successive approximation method. The back projection method and the filtered back projection method are described in, for example, US Patent Application Publication No. 2002/0154728. The successive approximation method is described, for example, in US Patent Application Publication No. 2010/0220908.

  In the present embodiment, the measurement object S is a single substance, but may be a measurement substance composed of a plurality of elements. For example, a metal such as aluminum and an organic compound such as plastic may be used.

In this embodiment, one X-ray source 100 and one detector 4 are provided, but the present invention is not limited to this. For example, the X-ray source 100 and the detector 4 are arranged such that the axes connecting the emission point of the X-ray source 100 and the center of the detector 4 intersect each other, and the intersecting points are arranged on the measurement object of the stage. A plurality of sets may be provided. In this case, a plurality of detectors 4 can obtain detection results with different irradiation conditions.

  Note that the control device 5 is not limited to the case where the reconstructed image of the measurement object is generated at a time from the plurality of X-ray transmission data Im3 synthesized by the image reconstruction unit 51. For example, if a reconstructed image is generated using a part of the plurality of X-ray transmission data Im3 and a reconstructed image with sufficiently high accuracy is generated, the reconstructing process may be stopped at that time. If a reconstructed image with sufficiently high accuracy is not generated, the reconstructed image may be generated by sequentially using the X-ray transmission data Im3 for the reconstructing process. If the plurality of X-ray transmission data Im3 synthesized by the image reconstruction unit 51 is insufficient, Im1 and Im2 may be acquired by the control device 5 in order to create the X-ray transmission data Im3 sequentially. I do not care.

  In the present embodiment, the image Im1 and the image Im2 are changed by 180 ° with respect to the reference plane α, but the irradiation angle of the X-ray XL to the measurement object S is the same. For example, the measurement object S is placed on the stage device, and the measurement object is rotated once (360 °) to obtain 360 sheets. In this case, a projection image of the same angle is used when the object is rotated 180 ° with respect to the reference plane α and rotated once from the same posture of the measurement object. For example, in the image Im1 acquired at 0 ° and the image Im2 acquired at 0 °, the arrangement of the measurement object S with respect to the stage is merely changed by 180 °. Therefore, when the measured object is rotated once around the axis that is not the rotation target of the measured object and the projected image changes with 360 sheets, when the image Im1 and the image Im2 are overlapped, The external parts match. In this case, images having the same angle need not be used. For example, the 0 ° image Im1 and the 1 ° image Im2 may be used for superposition. Alternatively, the image Im2 at 0 ° may be estimated and used using the image Im2 at 359 ° and the image Im2 at 1 °. As a result, it is possible to shorten the time required to create an image to be created by overlapping. Further, instead of using the 0 ° image Im2, a 180 ° image Im2 or a 360 ° image Im2 may be used.

  Note that the determination of whether or not the image Im1 and the image Im2 have corresponding angles uses the encoder of the stage device, but is not limited thereto. For example, an optical camera for estimating the posture of the measurement object may be provided and an image of the optical camera may be used. Alternatively, an external appearance shape for each angle when the measurement object is rotated may be acquired, and it may be determined whether the angle is a corresponding angle based on the external appearance shape. Of course, the appearance shape of the image Im1 may be extracted, and the image Im2 obtained from the plurality of images Im2 corresponding to the extracted appearance shape may be selected.

  In the present embodiment, since the image Im3 is formed by superimposing the two images Im1 and Im2, the control device 5 obtains the images Im1 and Im2 so that the brightness of the image Im3 is appropriate. You may adjust the irradiation amount of the line XL. The adjustment of the irradiation amount of the X-ray XL includes, for example, changing the intensity of the X-ray XL by changing a current value flowing through the filament 39 or changing the irradiation time of the X-ray XL. For example, when acquiring the images Im1 and Im2, the irradiation time or intensity may be set to ½ of the normal X-ray XL irradiation time or intensity, respectively. At this time, it may be set to 1/2 or more with respect to the irradiation time or intensity of normal X-ray XL. For example, you may set to 2/3, 3/4, 3/5, 4/5, 5/6 with respect to the irradiation time or intensity | strength of normal X-ray XL. The normal irradiation time or intensity of X-ray XL is the irradiation time or intensity at which an image having a predetermined luminance can be obtained by one imaging. Further, it may be set to less than 1/2 with respect to the irradiation time or intensity of normal X-ray XL. For example, it may be set to 1/3, 1/4, 1/5, 2/5, or 1/6 with respect to the irradiation time or intensity of normal X-ray XL. Further, the irradiation amount of the X-ray XL when obtaining the images Im1 and Im2 may be different between the image Im1 and the image Im2. The luminance of the image Im3 may be a signal intensity representing the brightness at a predetermined position of the pixel for representing the image, or is information or a value depending on the X-ray intensity at the pixel saturated to represent the image? I don't mind.

In the present embodiment, the image Im1 and the image Im2 are displayed as images. However, the image Im1 and the image Im2 are X-rays that receive light emitted from the pixels of the detector in the control device 5, respectively. The intensity value of the signal corresponding to the intensity may be used. Therefore, the image Im1 and the image Im2 may not be stored as images in the control device 5.
Further, the image Im3 may not be stored as an image. Only the tomographic image of the measurement object S may be displayed.

  Thus, according to the present embodiment, the X-ray source 100 that emits X-rays, and the detector 4 that detects at least a part of the X-ray XL that is emitted from the X-ray source 100 and passes through the measurement object S, And the control device 5 that changes the X-ray XL conditions for the measurement object S and forms an image based on a plurality of detection results detected by the detector 4. Even if there is an intensity distribution along the predetermined direction, it is possible to obtain a measurement result as if the X-ray irradiated to the measuring object S was irradiated with an X-ray having a small intensity distribution along the predetermined direction. . This is because, by using a plurality of detection results obtained by changing the conditions of the X-ray XL, the X-ray XL having a small intensity distribution along a predetermined direction is detected by irradiating the measurement object S with the X-ray XL. can do. Thereby, the difference in the intensity of the X-rays irradiated according to the position of the measurement object is reduced. For this reason, a uniform projection image of the measurement object can be acquired. Furthermore, by using a uniform projection image, an image obtained by reconstruction becomes a uniform reconstruction image, and the shape and material of the measurement object can be specified with high accuracy. Thereby, it can suppress that the test | inspection precision of a measurement object falls.

<Modification>
A modification of the measurement object S will be described with reference to the drawings. In the following description, components that are the same as or equivalent to those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified. Further, in the modified example described below, the main part is illustrated, and other configurations are the same as those in the first embodiment described above.

  FIG. 8A is a diagram illustrating an example of the measurement object S1 according to the modification. As shown in FIG. 8A, the measurement object S1 has a cylindrical portion S1a. The cylindrical part S1a has a first end S1b and a second end S1c. In FIG. 8A, the first end S1b is located on the upper side (+ Y side) of the cylindrical part S1a, and the second end S1c is located on the lower side (−Y side) of the cylindrical part S1a. Yes.

  The first end S1b is formed in a spherical shape, and has a curved shape so as to protrude to the + Y side. The second end S1c is a circular plane. The measurement object S1 is placed with the second end S1c in contact with the stage 9. In this case, since the plane of the second end S1c and the plane of the stage 9 are brought into contact with each other, they are placed in a stable state.

  FIG. 8B is a diagram illustrating an example in which the measurement object S1 is inverted in the Y direction. As shown in FIG. 8B, the first end S1b of the columnar part S1a is located on the lower side (−Y side), and the second end S1c is located on the upper side (+ Y side). Since the stage 9 is a flat surface, it is difficult to place the measuring object S1 upright in the Y direction. Therefore, the measurement object S <b> 1 is placed on the stage 9 via the jig (holding unit) 61. The jig 61 can be placed on the stage 9 with the spherical first end S1b standing on the lower side.

  The jig 61 has a base 61a and a plurality of ribs 61b. The base 61a is formed on, for example, a flat plate, and the -Y side is formed flat. For this reason, the base 61 a is stably placed on the stage 9. The base 61a is not limited to a flat plate shape as long as the base 61a is stably placed on the stage 9. A plurality of ribs 61b are provided on the base 61a. The plurality of ribs 61b are arranged around the Y axis so as to surround the center of the base 61a when viewed in the Y direction, for example. The surface on the + Y side of each rib 61b is a curved surface corresponding to the shape of the first end S1b. The first end S1b is placed in contact with the curved surfaces of the plurality of ribs 61b.

  In the example shown in FIG. 8B, the measurement object S1 is stable because the first end S1b is supported via the jig 61 having a plurality of ribs 61b having a shape corresponding to the shape of the first end S1b. Supported. In addition, by setting it as the structure by which three or more ribs 61b are arrange | positioned, it becomes possible to support the measurement object S1 more stably. However, the shape of the rib 61b is not limited to the illustrated shape, and an arbitrary shape capable of supporting the spherical first end S1b can be used. For example, a plurality of pins may be arranged on the base 61a. Further, a plurality of pins that can protrude and immerse with respect to the upper surface of the stage 9 may be formed and used as a holding portion for the measurement object S1. At this time, the selection of the pins to be protruded and the amount of protrusion may be controlled by the control device 5.

  Further, the jig 61 may be fixed to the stage 9 or simply placed. The jig 61 may be formed so as to be removable from the stage 9. When the jig 61 is placed on the stage 9, as shown in FIG. 8A, when placing the measurement object S1 with the first end S1b on the upper side, the measurement object S1 is placed on the rib 61b of the jig 61. May be placed. The jig 61 may be formed of a material that takes into account the influence on the X-ray XL. For example, it may be formed of a material that hardly absorbs X-ray XL.

  FIG. 9A is a diagram illustrating another example of a holding unit that supports the measurement object S1. As shown in FIG. 9A, the measurement object S <b> 1 is placed on the placement surface 9 a of the stage 9. The measurement object S1 is disposed such that the second end S1c abuts on the placement surface 9a. A stage inversion driving unit (condition changing unit) AC1 is connected to the stage 9. The stage inversion driving unit AC1 rotates the stage 9 in the θX direction or the θZ direction with the X direction or the Z direction as an axis, for example. The rotational position of the stage 9 may be held by a holding mechanism (not shown) or the like. By this stage drive unit AC1, the stage 9 can be reversed from the state in which the placement surface 9a is directed in the + Y direction (upward) and changed to the state in which the placement surface 9a is directed in the −Y direction (downward). It is possible.

  A jig (holding portion) 62 is provided above the stage 9 (+ Y side). The jig 62 is disposed so as to face the placement surface 9a. The jig 62 is formed so as to be movable at least toward and away from the mounting surface 9a, and is moved by a driving device (not shown). The movement of the jig 62 may be controlled by the control device 5. By bringing the jig 62 close to the placement surface 9a, the measurement object S1 is pressed against and held by the placement surface 9a by the jig 62. When the stage 9 is reversed in the Y direction, the jig 62 is movable according to the posture of the stage 9 so as to maintain the state facing the placement surface 9a.

  The jig 62 may include an adjustment mechanism that adjusts the position relative to the stage 9 in the X direction and the Z direction. The jig 62 may be configured to press the measurement object S1 after being positioned at a position where it can be easily pressed against the measurement object S1 on the stage 9 by moving in the X direction and the Z direction. Moreover, the jig 62 can adjust the force pressed against the measurement object S1 by moving in the Y direction. For example, when the measurement object S1 has low rigidity, the measurement object S1 may be pressed with a force that does not deform the measurement object S1. The jig 62 may be configured to be inclined relative to the stage 9 in the θX direction, the θY direction, and the θZ direction. Thereby, the pressing position of the jig 62 can be adjusted according to the shape of the measurement object S1.

  Further, the surface on the −Y side of the jig 62 is formed flat, for example, but is not limited thereto. For example, a configuration in which the surface of the jig 62 that contacts the measurement object S1 on the −Y side has a curved or spherical concave portion so as to correspond to the shape of the first end S1b may be employed. Further, as the jig 62, a plurality of types may be prepared so that the shape of the surface to be brought into contact with the measurement unit S1 is different, and the jig 62 may be used depending on the shape of the first end S1b.

  FIG. 9B is a diagram showing an example in which the measurement object S1 is inverted in the Y direction from the state shown in FIG. 9A. As shown in FIG. 9 (b), the workpiece 9 is reversed while pressing the first end S1b with the jig 62 so that the second end S1c remains in contact with the mounting surface 9a. S1 can be reversed in the Y direction. In this case, since the first end S1b is pressed to the + Y side by the jig 62, a stable state can be maintained. By irradiating the X-ray XL with the measured object S1 inverted, an image can be acquired under the condition where the measured object S1 is inverted as described above. The procedure after acquiring the image is the same as described above. Thus, according to this modification, the measurement object S1 can be easily inverted.

  As shown in FIG. 9B, when the measurement object S1 is inverted by inverting the stage 9, the position of the optical axis AX2 of the X-ray XL may deviate from the measurement object S1. In this case, the stage device 9 may be driven in the X direction, the Y direction, or the like to adjust the position of the optical axis AX2 of the X-ray XL and the measured object S1. Further, instead of driving the stage 9, the position of the X-ray source 100 may be moved in the X direction, the Y direction, or the like to align the optical axis AX2 and the measurement object S1.

  9A and 9B, in addition to the jig 62, a clamp mechanism that holds the side surface of the cylindrical portion S1a of the measurement object S1 from at least one of the X direction and the Z direction. (Holding part) 63 may be provided. Thereby, since the force holding the measurement object S1 is increased, a more stable state can be maintained. Note that the clamp mechanism 63 may be used in place of the jig 62. The clamp mechanism 63 is driven by a drive mechanism (not shown) installed on the table 9. The operation of the clamp mechanism 63 may be controlled by the control device 5.

  The jigs 61 and 62 and the clamp mechanism 63 shown in FIGS. 8A and 8B and FIGS. 9A and 9B are examples of a holding unit for changing the conditions for imaging the measurement object S1. However, the measurement object S1 may be held using another holding mechanism. For example, the stage 9 and the measurement object 9 may be connected with a peelable adhesive or double-sided tape.

  FIG. 10 is a diagram showing an example of a specific configuration of the stage apparatus 3 applied to the X-ray apparatus 1 shown in FIG. As shown in FIG. 10, the stage apparatus 3 includes a stage 9 that can move while holding the measurement object S <b> 1, and a drive system 10 that moves the stage 9. The stage 9 includes a table 12 on which the measurement object S1 is placed, a first movable member 13 that movably supports the table 12, a second movable member 14 that movably supports the first movable member 13, and a second And a third movable member 15 that movably supports the movable member 14. For example, a jig 61 as shown in FIG. 8 may be provided on the upper surface of the table 12, or a jig 62 and a clamp mechanism 63 as shown in FIG. 9 may be provided.

  The table 12 can be rotated while holding the measurement object S1. The table 12 can be moved (rotated) in the θY direction. The first movable member 13 is movable in the X axis direction. When the first movable member 13 moves in the X-axis direction, the table 12 moves in the X-axis direction together with the first movable member 13. The second movable member 14 is movable in the Y axis direction. When the second movable member 14 moves in the Y-axis direction, the first movable member 13 and the table 12 move together with the second movable member 14 in the Y-axis direction. The third movable member 15 is movable in the Z-axis direction. When the third movable member 15 moves in the Z-axis direction, the second movable member 14, the first movable member 13, and the table 12 move in the Z-axis direction together with the third movable member 15.

  The drive system 10 includes a rotary drive device 16 that rotates the table 12 on the first movable member 13, a first drive device 17 that moves the first movable member 13 in the X-axis direction on the second movable member 14, 2 includes a second driving device 18 that moves the movable member 14 in the Y-axis direction, and a third driving device 19 that moves the third movable member 15 in the Z-axis direction.

  The second drive device 18 includes a screw shaft 20B disposed on a nut included in the second movable member 14, and an actuator 20 that rotates the screw shaft 20B. The screw shaft 20B is rotatably supported by bearings 21A and 21B. The screw shaft 20B is supported by the bearings 21A and 21B so that the axis of the screw shaft 20B and the Y axis are substantially parallel. The second drive device 18 includes a so-called ball screw drive mechanism.

  The third drive device 19 includes a screw shaft 23B disposed on a nut included in the third movable member 15, and an actuator 23 that rotates the screw shaft 23B. The screw shaft 23B is rotatably supported by bearings 24A and 24B. In the present embodiment, the screw shaft 23B is supported by the bearings 24A and 24B so that the axis of the screw shaft 23B and the Z-axis are substantially parallel. The third drive device 19 includes a so-called ball screw drive mechanism.

  The third movable member 15 includes a guide mechanism 25 that guides the second movable member 14 in the Y-axis direction. The guide mechanism 25 includes guide members 25A and 25B that are long in the Y-axis direction. At least a part of the second driving device 18 including the actuator 20 and the bearings 21 </ b> A and 21 </ b> B that support the screw shaft 20 </ b> B is supported by the third movable member 15. When the actuator 20 rotates the screw shaft 20B, the second movable member 14 moves in the Y-axis direction while being guided by the guide mechanism 25.

  As shown in FIG. 10, the X-ray apparatus 1 has a base member 26 fixed to the inner wall (inner surface) of the chamber member 6. The base member 26 has a guide mechanism 27 that guides the third movable member 15 in the Z-axis direction. The guide mechanism 27 includes guide members 27A and 27B that are long in the Z-axis direction. At least a part of the third drive device 19 including the actuator 23 and the bearings 24 </ b> A and 24 </ b> B that support the screw shaft 23 </ b> B is supported by the base member 26. When the actuator 23 rotates the screw shaft 23 </ b> B, the third movable member 15 moves in the Z-axis direction while being guided by the guide mechanism 27.

  Although not shown, in the present embodiment, the second movable member 14 has a guide mechanism that guides the first movable member 13 in the X-axis direction. The first driving device 17 includes a ball screw mechanism that can move the first movable member 13 in the X-axis direction. The rotation drive device 16 includes a motor that can move (rotate) the table 12 in the θY-axis direction.

  In the present embodiment, the measuring object S1 held on the table 12 can be moved by the drive system 10 in four directions including the X axis, the Y axis, the Z axis, and the θY direction. The drive system 10 may be provided with a stage inversion drive unit AC1 for rotating the stage 9 (or the table 12) as shown in FIG. The drive system 10 includes a ball screw drive mechanism, but may include, for example, a voice coil motor, a linear motor, or a planar motor. Moreover, the drive system 10 is not limited to the structure which combined the several movable member, You may move the table 12 with a robot hand or a manipulator.

  In addition, the X-ray apparatus 1 includes a measurement system 28 that measures the position of the stage 9. The measurement system 28 includes an encoder system. The measurement system 28 includes a rotary encoder 29 that measures the amount of rotation of the table 12 (position in the θY direction), a linear encoder 30 that measures the position of the first movable member 13 in the X-axis direction, and a second movable in the Y-axis direction. The linear encoder 31 that measures the position of the member 14 and the linear encoder 32 that measures the position of the third movable member 15 in the Z-axis direction are provided.

  The rotary encoder 29 measures the amount of rotation of the table 12 relative to the first movable member 13. The linear encoder 30 measures the position of the first movable member 13 with respect to the second movable member 14 (position in the X-axis direction). The linear encoder 31 measures the position of the second movable member 14 with respect to the third movable member 15 (position in the Y-axis direction). The linear encoder 32 measures the position of the third movable member 15 with respect to the base member 26 (position in the Z-axis direction).

  The rotary encoder 29 includes, for example, a scale member 29A disposed on the first movable member 13 and an encoder head 29B disposed on the table 12 and detecting the scale of the scale member 29A. The scale member 29 </ b> A is fixed to the first movable member 13. The encoder head 29B is fixed to the table 12. The encoder head 29B can measure the amount of rotation of the table 12 relative to the scale member 29A (first movable member 13).

  The linear encoder 30 includes, for example, a scale member 30A disposed on the second movable member 14, and an encoder head 30B disposed on the first movable member 13 and detecting the scale of the scale member 30A. The scale member 30 </ b> A is fixed to the second movable member 14. The encoder head 30 </ b> B is fixed to the first movable member 13. The encoder head 30B can measure the position of the first movable member 13 with respect to the scale member 30A (second movable member 14).

  The linear encoder 31 includes a scale member 31A disposed on the third movable member 15 and an encoder head 31B disposed on the second movable member 14 and detecting the scale of the scale member 31A. The scale member 31 </ b> A is fixed to the third movable member 15. The encoder head 31 </ b> B is fixed to the second movable member 14. The encoder head 31B can measure the position of the second movable member 14 with respect to the scale member 31A (third movable member 15).

  The linear encoder 32 includes a scale member 32A disposed on the base member 26 and an encoder head 32B disposed on the third movable member 15 and detecting the scale of the scale member 32A. The scale member 32 </ b> A is fixed to the base member 26. The encoder head 32 </ b> B is fixed to the third movable member 15. The encoder head 32B can measure the position of the third movable member 15 with respect to the scale member 32A (base member 26).

  By using such a stage device 3, the posture of the measuring object S1 can be stabilized. In the description of the stage device 3, the case where the measurement object S <b> 1 is placed has been described as an example. However, the present invention is not limited to this, and even when a measurement object having another shape is placed. The above explanation is possible. In this case, since the stage 9 can be driven by a driving method corresponding to the shape of the measurement object, the posture of the measurement object can be further stabilized.

Second Embodiment
Next, a second embodiment will be described.
FIG. 11 shows an X-ray source 100 and a drive unit (condition changing unit) AC2 in the X-ray apparatus 1A according to the second embodiment. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. Other configurations are the same as those in the first embodiment.

  As shown in FIG. 11, the X-ray source 100 is installed in the chamber member 6 so as to be rotatable in the θX direction around an axis parallel to the X direction, for example. The drive unit AC2 rotates the X-ray source 100 in the θX direction and holds the posture of the X-ray source 100 at a desired position. As the drive unit AC2, for example, a rotational force transmission mechanism using an electric motor or hydraulic pressure as a drive source is used. The drive unit AC2 is controlled by the control device 5.

  As shown in FIG. 11A, when the emission port 100a is disposed above (+ Y side) the X-ray source 100, the X-ray XL emitted from the emission port 100a is the X-ray XLA that travels to the + Y side. And an X-ray XLB traveling toward the -Y side. In this case, as in the first embodiment, the intensity of the X-ray XL increases from the X-ray XLA side (+ Y side) to the X-ray XLB (−Y side), and the X-ray XLA side (+ Y side) is more The radiation quality is harder than the X-ray XLB side (−Y side). The state of the X-ray source 100 shown in FIG. 11A is referred to as an upright state.

  On the other hand, as shown in FIG. 11B, when the emission port 100a is disposed below (−Y side) the X-ray source 100, the emission port is contrary to the case shown in FIG. The X-ray XLA emitted from 100a travels to the -Y side, and the X-ray XLB travels to the + Y side. For this reason, the X-ray XL emitted from the injection port 100a has a higher X-ray XL intensity from the -Y side to the + Y side, and the -Y side is harder in quality than the + Y side. The state of the X-ray source 100 shown in FIG. 11B is called an inverted state. That is, when the X-ray source 100 is upright and inverted, the intensity and quality of the X-ray XL are reversed in the Y direction.

  Therefore, an image acquired by irradiating the measuring object S1 with X-ray XL in the upright state shown in FIG. 11A and an X-ray XL irradiated on the measuring object S1 in the upright state shown in FIG. In the image acquired in this way, the luminance is reversed in the Y direction. At this time, the measurement object S1 does not change the arrangement, rotation, or the like during imaging in the upright state and imaging in the inverted state. However, the arrangement, rotation, and the like of the measurement object S1 may be changed between the imaging in the upright state and the imaging in the inverted state. Further, the irradiation amount (irradiation time and intensity) of the X-ray XL may be changed between the imaging in the upright state and the imaging in the inverted state. The point which superimposes each image of an erect state and an inverted state and synthesize | combines an image is the same as that of 1st Embodiment.

  As described above, according to the present embodiment, similarly to the first embodiment, the measurement object S1 can be inspected using the image in which the influence of the luminance distribution is reduced, so that the inspection accuracy of the measurement object is improved. Reduction can be suppressed. Further, since the X-ray source 100 is rotated using the drive unit AC2, it is not necessary to change the arrangement of the measurement object S1, and the existing stage apparatus can be used as it is.

<Third Embodiment>
Next, a third embodiment will be described.
FIG. 12 is a diagram showing a schematic configuration of an X-ray apparatus 1B according to the third embodiment. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  As shown in FIG. 12, the X-ray apparatus 1B includes an X-ray source 100, a reflective optical element (condition changing unit) 80, a stage 9, a detector 4, and a drive unit AC3. Other configurations are the same as those in the first embodiment.

  In the present embodiment, the X-ray source 100, the stage 9, and the detector 4 are installed in the chamber member 6 so as to be rotatable in the θX direction, for example, about an axis parallel to the X direction. The X-ray source 100, the stage 9, and the detector 4 are rotated in the θX direction by the drive unit AC3 from the arrangement shown in FIG. As shown in FIG. 12, the drive unit AC3 can adjust the tilt angle of the X-ray source 100, the tilt angle of the stage 9, and the tilt angle of the detector 4, respectively. The drive of the drive unit AC3 may be controlled by the control device 5.

  Each of the X-ray source 100, the stage 9, and the detector 4 changes from the arrangement shown in FIG. 1 to a preset angle as shown in FIG. 12, for example. Each angle is described with the clockwise direction in the θX direction in FIG. 12 as the + direction and the counterclockwise direction as the − direction. The X-ray source 100 is held by the drive unit AC3 by rotating the optical axis AX1 (see FIG. 3) of the electron optical system by an angle θ1 in the + θX direction from a posture parallel to the Y direction. Thereby, the exit port 100a of the X-ray source 100 is directed in a direction inclined by an angle θ1 in the + X direction with respect to the Z axis. Therefore, the optical axis AX3 of the emitted X-ray XL is a direction inclined by the angle θ1 in the + X direction with respect to the Z axis (the optical axis AX2 in the above embodiments).

  The reflective optical element 80 is formed in, for example, a flat plate shape, but is not limited thereto. The reflective optical element 80 has a reflective surface 81 that reflects X-rays. The reflecting surface 81 is directed in the + Y direction and is disposed in parallel to the XZ plane. The reflective surface 81 may be a curved surface. The reflecting surface 81 is formed in a planar shape from a metal such as gold or platinum, and is mirror-finished. In the reflection optical element 80, the reflection surface 81 is disposed on the optical axis AX3 of the X-ray XL emitted from the emission port 100a. Thereby, the X-ray XL can be reflected.

  When the X-ray source 100 is inclined at an angle θ1, the optical axis AX3 of the X-ray XL is incident on the reflecting surface 81 with an angle θ1. The reflection surface 81 made of metal or the like has a different reflectance depending on the size of the angle θ1. Therefore, the angle θ1 at which the X-ray source 100 is tilted may be set to an angle at which the X-ray XL can be efficiently reflected by the reflecting surface 81. Since the X-ray XL is reflected by the reflecting surface 81, the intensity and the line quality of the X-ray XL after reflection are opposite to the intensity and the line quality before reflection in the Y direction. Therefore, in the optical path from the exit port 100a until it enters the reflecting surface 81, the + Y side is the X-ray XLA and the -Y side is the X-ray XLB. On the other hand, in the optical path of the X-ray XL reflected by the reflecting surface 81 toward the measurement object S1, the -Y side becomes the X-ray XLA and the + Y side becomes the X-ray XLB.

  The stage 9 is held by the drive unit AC3 by rotating the angle θ2 in the −X direction with respect to the XZ plane from a posture parallel to the XZ plane. The measurement object S1 is placed on the placement surface 9a of the stage 9, and the measurement object S1 similarly rotates in the −X direction by an angle θ2. The stage 9 may be provided with a holding unit (not shown) that holds the measurement object S1, and the position and posture of the measurement object S1 may be stabilized even when the placement surface 9a is inclined. The angle θ2 of the stage 9 can be set to be parallel to the optical axis AX3 of the X-ray XL, for example. For example, when the optical axis AX3 of the X-ray XL is inclined by the angle θ1 with respect to the Z axis, the inclination angle θ2 of the stage 9 may be set equal to the angle θ1. Further, the position of the measuring object S1 may be adjusted by moving the stage 9 in the X direction, the Y direction, and the Z direction so that the measuring object S1 is irradiated with the X-ray XL. The control device 5 may adjust the position of the measurement object S1.

  The detector 4 is held by the drive unit AC3 by rotating the angle θ3 in the −X direction with respect to the XY plane from a posture parallel to the XY plane. As a result, the incident surface 33 of the detector 4 also rotates by an angle θ3 in the −X direction with respect to the XY plane. The inclination angle θ3 of the detector 4 can be set to be perpendicular to the optical axis AX3 of the X-ray XL, for example. For example, when the optical axis AX3 of the X-ray XL is inclined by the angle θ1 with respect to the Z axis, the inclination angle θ3 of the detector 4 may be set equal to the angle θ1. That is, the tilt angle θ2 of the stage 9 and the tilt angle θ3 of the detector 4 may be the same. In the above, the angles θ1, θ2, and θ3 are the same, but any one of them may be different or all may be different.

  Further, when the posture of the X-ray source 100 is a posture parallel to the Y direction, the posture of the stage 9 is a posture parallel to the XZ plane, and the posture of the detector 4 is a posture parallel to the XY plane, the first described above. It is the same as the positional relationship described in the embodiment. In this case, the X-ray XL emitted from the emission port 100a is directly reflected on the measurement object S1 without being reflected by the reflecting surface 81, and is detected by the detector 4. The intensity and quality of the X-ray XL are opposite in the Y direction when the X-ray XL is directly irradiated onto the measuring object S1 and when the X-ray XL is reflected by the reflecting surface 81 and irradiated.

  Therefore, an image obtained by directly irradiating the measurement object S1 with X-ray XL and an image obtained by irradiating the measurement object S1 with X-ray XL as shown in FIG. The luminance is reversed in the Y direction. The irradiation amount (irradiation time and intensity) of the X-ray XL may be changed depending on whether the measurement object S1 is directly irradiated with the X-ray XL or when the measurement object S1 is irradiated with the reflection surface 81. . For example, when the light is reflected by the reflecting surface 81, the intensity of the X-ray XL is weakened by the reflection, and therefore the irradiation time of the X-ray XL may be longer than that in the case of direct irradiation. The point which synthesize | combines an image by superimposing two images with luminance reversed in the Y direction is the same as in the first embodiment.

  As described above, according to the present embodiment, similarly to the first embodiment, the measurement object S1 can be inspected using the image in which the influence of the luminance distribution is reduced, so that the inspection accuracy of the measurement object is improved. Reduction can be suppressed. Further, by using the reflective optical element 80, a large movement that reverses the X-ray source 100 and the stage 9 is not required, and the intensity and quality of the X-ray XL can be easily reversed in the Y direction.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in above-described embodiment. Various modifications or improvements can be added to the above embodiment without departing from the spirit of the present invention. In addition, one or more of the requirements described in the above embodiments may be omitted. Such modifications, improvements, and omitted forms are also included in the technical scope of the present invention. In addition, the configurations of the above-described embodiments and modifications can be applied in appropriate combinations. In addition, as long as it is permitted by law, the disclosure of all published publications and US patents related to the X-ray apparatus and the like cited in the above embodiments and modifications are incorporated herein by reference.

  In each of the above-described embodiments, for example, when the measurement objects S and S1 are arranged on the stage 9, a case where the measurement object S or the like is placed on the stage 9 so that the longitudinal direction of the measurement object S coincides with the Y direction is taken as an example. However, the present invention is not limited to this. For example, you may arrange | position on the stage 9 so that the transversal direction of the measurement objects S and S1 may correspond to a Y direction. When the short direction of the measuring objects S and S1 is made coincident with the Y direction, the Y direction of the X-ray XL irradiated to the measuring objects S and S1 is compared with the case where the longitudinal direction is made coincident with the Y direction. The width becomes smaller. In each of the above-described embodiments, the Y direction is a direction in which the intensity and spectrum distribution of the X-ray XL is formed. Therefore, if the width in the Y direction of the X-ray XL is small, the influence of the intensity and spectrum distribution is small. Become. Thereby, the luminance distribution of the image obtained in the detector 4 can be reduced.

  In the second and third embodiments described above, the measurement object S1 is described as an example of the measurement object placed on the stage 9. However, the measurement object S1 is not limited to this, and FIG. Other measurement objects such as the measurement object S shown may be arranged on the stage 9.

  Further, in each of the above-described embodiments, two images inverted by 180 degrees in the Y direction are combined (that is, images acquired under two different conditions are combined), but the present invention is not limited to this. For example, the measurement objects S and S1 are rotated 90 degrees clockwise with respect to the reference plane α (see FIG. 6), and each measurement is performed four times, and the obtained four images are superimposed. Good. In this case, in the measurement result image, the luminance distribution can be canceled not only in the vertical direction but also in the horizontal direction. Overlaying four images is a combination of images acquired under four different conditions. Of course, different conditions are not limited to two or four, and the number of different conditions such as three, five, and six conditions is not limited.

  Further, in each of the above-described embodiments, the optical axis AX2 is made to coincide when the measurement objects S and S1 are irradiated with the X-ray XL condition changed. However, the present invention is not limited to this. For example, when irradiation is performed while changing the X-ray XL conditions, irradiation may be performed while the optical axis AX2 of the X-ray XL is shifted.

  Moreover, in the said embodiment, when changing X-ray conditions, it is not limited to reversing arrangement | positioning of measurement object S, S1 in a Y direction, For example, measurement object S, S1 is only tilted. Different conditions may be used.

  In each of the above-described embodiments, a configuration in which a reflective target is used as the target 40 has been described as an example. However, the present invention is not limited to this. For example, a transmission type target may be used. When X-rays are generated from a transmission type target, the intensity distribution of the generated X-rays is formed concentrically around the optical axis AX2. That is, the intensity of X-rays decreases from the optical axis AX2 toward the outside. On the other hand, when changing the X-ray condition, for example, using a reflective optical element, the intensity distribution is such that the intensity distribution is reversed, that is, the intensity increases from the optical axis AX2 to the outside. X-rays having the above may be formed and irradiated on the measuring objects S and S1. Further, as the target 40, a rotating target may be used in either a reflection type or a transmission type. Since the rotating target can change the position where electrons enter by rotating, the temperature of the target can be prevented from increasing by moving the heat generation position (X-ray generation region 45) accompanying the generation of X-rays.

  Further, in each of the above-described embodiments, for example, by adjusting the electron optical system 41 of the X-ray source 100, the X-ray intensity distribution and spectral distribution may be made closer to linear in the Y direction. In addition, for example, the shape of the surface (incident surface) 46 of the target 40 may be changed so that the intensity distribution and spectral distribution of the X-ray XL approach linearity. For example, the shape of the surface 46 into which electrons enter is not limited to a planar shape, and may be a curved surface such as a spherical surface.

  Further, in each of the above-described embodiments, the case where the entire images are overlapped with each other for each of the plurality of images acquired by changing the X-ray XL conditions is described as an example. Absent. For example, for at least one image, only a part of the other image may be overlapped with the other image.

  In each of the above embodiments, a cooling device may be provided on the target 40 or the like. As the cooling device, for example, a Peltier element, a pipe through which a temperature-controlled fluid is flowed, or the like may be provided on the target 40.

  In the X-ray apparatus 1 described above, the measurement objects S and S1 are not limited to industrial parts, and may be used as a medical X-ray apparatus for measuring a part or all of a living body such as a human body. .

  Further, in the X-ray apparatus 1 described above, the X-ray source 100 and the detector 4 and the detector 4 are fixed at predetermined positions in the chamber member 6, and an image obtained by scanning the measuring objects S and S1 by rotating the stage 9 is obtained. However, the scanning method is not limited to this. One of the X-ray source 100 and the like and the detector 4 may be fixed at a predetermined position, and the other may be movable. Further, both the X-ray source 100 and the like and the detector 4 may be movable.

Next, a structure manufacturing system including the X-ray apparatus 1 described above will be described.
FIG. 13 is a block diagram of the structure manufacturing system SYS. The structure manufacturing system SYS includes an X-ray device 1 as a measuring device, a molding device 120, a control device (inspection device) 130, and a repair device 140. In the present embodiment, the structure manufacturing system SYS creates a molded product such as an electronic part including an automobile door part, an engine part, a gear part, and a circuit board.

  The design device 110 creates design information related to the shape of the structure, and transmits the created design information to the molding device 120. In addition, the design device 110 stores the created design information in a coordinate storage unit 131 (to be described later) of the control device 130. Here, the design information is information indicating the coordinates of each position of the structure. The molding apparatus 120 produces the structure based on the design information input from the design apparatus 110. The molding process of the molding apparatus 120 includes casting, forging, cutting, or the like.

  The X-ray device (measuring device) 1 transmits information indicating the measured coordinates to the control device 130. The control device 130 includes a coordinate storage unit 131 and an inspection unit 132. As described above, design information is stored in the coordinate storage unit 131 by the design apparatus 110. The inspection unit 132 reads design information from the coordinate storage unit 131. The inspection unit 132 creates information (shape information) indicating the created structure from information indicating the coordinates received from the X-ray apparatus 1. The inspection unit 132 compares information (shape information) indicating coordinates received from the X-ray apparatus 1 with design information read from the coordinate storage unit 131. The inspection unit 132 determines whether or not the structure has been molded according to the design information based on the comparison result. In other words, the inspection unit 132 determines whether or not the created structure is a non-defective product. If the structure is not molded according to the design information, the inspection unit 132 determines whether or not the structure can be repaired. If repair is possible, the inspection unit 132 calculates a defective part and a repair amount based on the comparison result, and transmits information indicating the defective part and information indicating the repair amount to the repair device 140.

  The repair device 140 processes the defective portion of the structure based on the information indicating the defective portion received from the control device 130 and the information indicating the repair amount.

  FIG. 14 is a flowchart showing the flow of processing by the structure manufacturing system SYS. First, the design apparatus 110 creates design information related to the shape of the structure (step S101). Next, the molding apparatus 120 produces the structure based on the design information (step S102). Next, the X-ray apparatus 1 measures coordinates relating to the shape of the structure (step S103). Next, the inspection unit 132 of the control device 130 inspects whether or not the structure is created according to the design information by comparing the shape information of the structure created from the X-ray apparatus 1 and the design information. (Step S104).

  Next, the inspection unit 132 of the control device 130 determines whether or not the created structure is a non-defective product (step S105). If the created structure is a non-defective product (step S106: YES), the structure manufacturing system SYS ends the process. On the other hand, when the created structure is not a non-defective product (step S106: NO), the inspection unit 132 of the control device 130 determines whether the created structure can be repaired (step S107).

  When the created structure can be repaired (step S107: YES), the repair device 140 performs reworking of the structure (step S108) and returns to the process of step S103. On the other hand, when the created structure cannot be repaired (step S107 YES), the structure manufacturing system SYS ends the process. Above, the process of this flowchart is complete | finished.

  As described above, since the X-ray apparatus 1 in the above embodiment can accurately measure the coordinates of the structure, the structure manufacturing system SYS can determine whether or not the created structure is a non-defective product. it can. In addition, the structure manufacturing system SYS can reconstruct and repair the structure when the structure is not good.

  AC1 ... stage inversion drive unit (condition changing unit) AC2, AC3 ... drive unit AX1, AX2, AX3 ... optical axis D ... vertical direction Im1, Im2, Im3 ... image S, S1 ... measurement object XL ... X-ray α ... reference plane DESCRIPTION OF SYMBOLS 1, 1A, 1B ... X-ray apparatus 4 ... Detector (detection apparatus) 5 ... Control apparatus 40 ... Target 41 ... Electro-optical system 61, 62 ... Jig (holding part) 63 ... Clamp mechanism (holding part) 80 ... Reflection Optical element (condition changing unit) 100 ... X-ray source 110 ... Design device 120 ... Molding device 130 ... Control device (inspection device) SYS ... Structure manufacturing system

Claims (20)

An X-ray source emitting X-rays;
A detection device that detects at least part of the X-rays emitted from the X-ray source and passed through the measurement object;
A first projection image obtained on the measurement object under the first X-ray irradiation condition and a second projection image obtained on the measurement object under a second X-ray irradiation condition different from the first X-ray irradiation condition are used. And a control device for forming a third projection image.   The X-ray apparatus according to claim 1, wherein the third projection image is formed by superimposing the first projection image and the second projection image.   The control device forms a plurality of third projection images in which an irradiation angle of X-rays emitted from the X-ray source is changed with respect to the measurement object, and from the plurality of third projection images to be formed, The X-ray apparatus according to claim 1 or 2, which creates a reconstructed image. The X-ray source includes: an electron optical system that emits electrons; and a target that is disposed in the direction of emission of electrons from the electron optical system,
Creating the first projection image and the second projection image in which the arrangement of the measurement object is different from a reference plane including the optical axis of the electron optical system and the optical axis of the X-ray emitted from the target The X-ray apparatus according to any one of claims 1 to 3.   5. The X-ray apparatus according to claim 4, wherein the first projection image and the second projection image differ in the arrangement of the measurement object by 180 ° about the reference plane.   The X-ray apparatus according to claim 4, wherein the target is a reflective target.   The X-ray apparatus according to any one of claims 4 to 6, wherein the reference surface is set in a direction perpendicular to a placement surface on which the measurement object is placed.   The X-ray apparatus of any one of Claims 1-7 provided with the condition change part which changes the irradiation conditions of the X-ray with respect to the said measurement object.   The X-ray apparatus according to claim 8, wherein the condition changing unit is formed on at least one of a stage apparatus on which the measurement object is placed and the X-ray source.   The X-ray apparatus according to claim 9, wherein the condition changing unit formed in the stage device includes a holding unit that changes and holds the arrangement of the measurement object.   The X-ray apparatus according to claim 9 or 10, wherein the condition changing unit formed in the X-ray source includes a drive unit that changes the direction of the X-ray source.   The X-ray apparatus according to claim 9, wherein the condition changing unit includes a reflective optical element that reflects X-rays emitted from the X-ray source and irradiates the measurement object.   The X-ray according to any one of claims 1 to 12, wherein the control device varies the intensity of X-rays emitted from the X-ray source according to the first X-ray irradiation condition and the second X-ray irradiation condition. apparatus.   The X-ray device according to claim 13, wherein the control device adjusts the intensity of the X-ray from the X-ray source so that the image of the third projection image has a predetermined luminance. A control device for an X-ray device that forms an image using a detection result from a detection device that detects at least a part of the X-rays emitted from an X-ray source and passed through a measurement object,
A first projection image obtained on the measurement object under the first X-ray irradiation condition and a second projection image obtained on the measurement object under a second X-ray irradiation condition different from the first X-ray irradiation condition are used. And a control device for the X-ray apparatus for forming the third projection image. An image forming method for forming an image by detecting at least part of X-rays emitted from an X-ray source and passing through a measurement object,
A first projection image obtained with the first X-ray irradiation condition for the measurement object and a second projection image obtained with a second X-ray irradiation condition different from the first X-ray irradiation condition for the measurement object are used. And forming a third projection image. A design process for creating design information on the shape of the structure;
A molding step for creating the structure based on the design information;
A step of measuring the shape of the manufactured structure using the X-ray apparatus according to any one of claims 1 to 14,
A method for manufacturing a structure, comprising: an inspection process for comparing shape information obtained in the measurement process with the design information.   The method for manufacturing a structure according to claim 17, further comprising a repair process that is executed based on a comparison result of the inspection process and that performs reworking of the structure.   The method of manufacturing a structure according to claim 18, wherein the repairing step is a step of re-executing the forming step. A design device for creating design information on the shape of the structure;
A molding apparatus for producing the structure based on the design information;
The X-ray apparatus according to any one of claims 1 to 14, which measures the shape of the manufactured structure,
An inspection device for comparing shape information on the shape of the structure obtained by the X-ray device with the design information;
Structure manufacturing system including.