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JP2015126500A - Piezoelectric acoustic element and piezoelectric loudspeaker - Google Patents

Piezoelectric acoustic element and piezoelectric loudspeaker Download PDF

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JP2015126500A
JP2015126500A JP2013271717A JP2013271717A JP2015126500A JP 2015126500 A JP2015126500 A JP 2015126500A JP 2013271717 A JP2013271717 A JP 2013271717A JP 2013271717 A JP2013271717 A JP 2013271717A JP 2015126500 A JP2015126500 A JP 2015126500A
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piezoelectric
piezoelectric elements
acoustic element
elements
support
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JP6010525B2 (en
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茂雄 石井
Shigeo Ishii
茂雄 石井
嘉幸 渡部
Yoshiyuki Watabe
嘉幸 渡部
幸弘 松井
Yukihiro Matsui
幸弘 松井
浜田 浩
Hiroshi Hamada
浩 浜田
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Taiyo Yuden Co Ltd
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Taiyo Yuden Co Ltd
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Priority to PCT/JP2014/066528 priority patent/WO2015098150A1/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/04Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
    • H10N30/045Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047Membrane type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/40Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
    • H04R1/403Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers loud-speakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/40Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
    • H04R2201/4012D or 3D arrays of transducers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric acoustic element and a piezoelectric loudspeaker that utilize a piezoelectric element, that are small in size, light in weight, thin, and low in power consumption, and that have good sound pressure characteristics.SOLUTION: A piezoelectric loudspeaker 60 comprises a piezoelectric acoustic element 10 in a housing 62. In the piezoelectric acoustic element 10, a plurality of piezoelectric elements 20-50 are arranged in a matrix on one principal surface 12A of a supporting body 12 with flexibility. A deformation amount of the supporting body 12 is increased while suppressing a deformation amount of the piezoelectric elements 20-50 by deformation of a supporting body part among the piezoelectric elements 20-50. The piezoelectric elements 20-50 are a bimorph type and are polarized so as to be displaced in a lamination direction at the same phase. Substantially cross-shaped wiring is provided among the piezoelectric elements 20-50, and wiring is provided around the piezoelectric elements 20-50, and the rigidity is increased to stabilize the displacement and the sound quality. The circumferential edge of the piezoelectric acoustic element 10 is pressed by a metal frame 80 and a resin frame 82, and thereby, the piezoelectric acoustic element 10 is supported by the housing 62.

Description

本発明は、圧電素子を利用した圧電音響素子及び圧電スピーカに関し、更に具体的には、中域音圧特性の改善に関するものである。   The present invention relates to a piezoelectric acoustic element and a piezoelectric speaker using a piezoelectric element, and more specifically to improvement of mid-range sound pressure characteristics.

電磁気型スピーカとして一般的なダイナミックスピーカは、背面気室の影響を強く受け、消費電力の増加,厚みが厚い傾向,磁気の影響が多い等の不都合がある。これに対し、圧電素子を音響素子に用いることで、小型化・薄型化・軽量化等を図った圧電式のスピーカが開発されている。例えば、下記特許文献1には、金属振動板と圧電体と枠体とを有する圧電スピーカにおいて、前記金属振動板は、前記圧電体が両面に貼り合わされ圧電振動子を構成する振動板部と、前記枠体に取り付けられる枠体取付部と、前記振動板部と前記枠体取付部とを複数のスリット状の穴を介して弾性的に支持する複数の撓み腕部とを備えることが開示されている。また、下記特許文献2には、圧電素子と弾性部材とを有して空気中の疎密現象により可聴音に復調される変調された超音波を出力する複数の圧電振動子と、複数の前記圧電振動子を上下方向に複数段に配置するとともに各段の前記圧電振動子を平面形状で重複させて配置する支持体と、を有する発振装置が開示されている。   A dynamic speaker generally used as an electromagnetic speaker is strongly affected by a back air chamber, and has disadvantages such as an increase in power consumption, a tendency to be thick, and a large influence of magnetism. On the other hand, a piezoelectric speaker has been developed that uses a piezoelectric element as an acoustic element to reduce the size, thickness, weight, and the like. For example, in Patent Document 1 below, in a piezoelectric speaker having a metal diaphragm, a piezoelectric body, and a frame body, the metal diaphragm includes a diaphragm portion in which the piezoelectric body is bonded to both surfaces to form a piezoelectric vibrator, Disclosed is a frame body attachment portion attached to the frame body, and a plurality of flexure arm portions that elastically support the diaphragm portion and the frame body attachment portion via a plurality of slit-shaped holes. ing. Patent Document 2 listed below includes a plurality of piezoelectric vibrators that have a piezoelectric element and an elastic member and output modulated ultrasonic waves that are demodulated to an audible sound due to a density phenomenon in the air, and a plurality of the piezoelectric elements. There is disclosed an oscillation device having a support body in which vibrators are arranged in a plurality of stages in the vertical direction and the piezoelectric vibrators of each stage are arranged in a planar shape so as to overlap each other.

特開2006−287968号公報JP 2006-287968 A 特開2012−100054号公報JP 2012-100054 A

ところで、前記特許文献1に記載の技術では、金属振動板に圧電体を貼り合わせた構造となっている。このため、音圧を高くするためにセラミック圧電素子を大きくして圧電素子の変形量を大きくした場合、セラミック圧電素子にクラックが発生するおそれがある。また、前記特許文献2に記載の技術では、複数の圧電素子を高さ方向に配置しているため、セラミック圧電素子のばらつきや、高さ方向に差があると、個々のセラミック圧電素子で発生した音が干渉して、音質劣化につながるおそれがある。   By the way, the technique described in Patent Document 1 has a structure in which a piezoelectric body is bonded to a metal diaphragm. For this reason, when the ceramic piezoelectric element is enlarged and the deformation amount of the piezoelectric element is increased in order to increase the sound pressure, there is a possibility that a crack is generated in the ceramic piezoelectric element. In the technique described in Patent Document 2, since a plurality of piezoelectric elements are arranged in the height direction, variations in the ceramic piezoelectric elements and differences in the height direction occur in individual ceramic piezoelectric elements. Sound may interfere with the sound quality.

本発明は、以上のような点に着目したもので、圧電素子を利用し、小型,軽量,薄型,低消費電力であって、音圧特性の良好な圧電音響素子及び圧電スピーカを提供することを、その目的とする。   The present invention focuses on the above points, and provides a piezoelectric acoustic element and a piezoelectric speaker that use a piezoelectric element and are small, light, thin, and have low power consumption and good sound pressure characteristics. Is the purpose.

本発明の圧電音響素子は、複数の圧電素子を、屈曲性を有する支持体の一方の主面にマトリックス状に配置したことを特徴とする。主要な形態の一つは、前記複数の圧電素子の周囲に、樹脂層を形成したことを特徴とする。他の形態は、前記複数の圧電素子を接続する金属線を、前記複数の圧電素子の間と、前記複数の圧電素子の周囲に配線したことを特徴とする。更に他の形態は、前記圧電素子が4つであって、前記圧電素子の間に配線される金属線が略十字状であることを特徴とする。更に他の形態は、前記圧電素子がバイモルフ型であって、該圧電素子は、前記支持体上で隣接する他の圧電素子と、分極方向が異なることを特徴とする。   The piezoelectric acoustic element of the present invention is characterized in that a plurality of piezoelectric elements are arranged in a matrix on one main surface of a flexible support. One of the main forms is characterized in that a resin layer is formed around the plurality of piezoelectric elements. Another embodiment is characterized in that metal wires connecting the plurality of piezoelectric elements are wired between the plurality of piezoelectric elements and around the plurality of piezoelectric elements. Yet another embodiment is characterized in that the number of the piezoelectric elements is four and the metal wires wired between the piezoelectric elements are substantially cross-shaped. Yet another embodiment is characterized in that the piezoelectric element is a bimorph type, and the piezoelectric element has a polarization direction different from that of another piezoelectric element adjacent on the support.

本発明の圧電スピーカが、前記いずれかの圧電音響素子と、該圧電音響素子の外周を支持し、前記圧電素子が配置されていない側の支持体の主面側に放音孔を有する筐体と、前記圧電素子が配置されている側の支持体の主面と前記筐体の蓋部の間に配置されており、前記圧電音響素子の外周を筐体に対して押さえる枠体と、を備えたことを特徴とする。主要な形態の一つは、前記枠体が、前記圧電音響素子側に配置される金属製の枠と、該金属製の枠と前記筐体の蓋部の間に配置される樹脂製の枠と、からなることを特徴とする。本発明の前記及び他の目的,特徴,利点は、以下の詳細な説明及び添付図面から明瞭になろう。   A piezoelectric speaker according to the present invention has one of the piezoelectric acoustic elements and a casing that supports the outer periphery of the piezoelectric acoustic element and has a sound emitting hole on a main surface side of a support on which the piezoelectric element is not disposed. And a frame body that is disposed between the main surface of the support on the side where the piezoelectric element is disposed and the lid portion of the housing, and presses the outer periphery of the piezoelectric acoustic element against the housing. It is characterized by having. One of the main forms is that the frame is made of a metal frame disposed on the piezoelectric acoustic element side, and a resin frame disposed between the metal frame and the lid of the housing. It is characterized by comprising. The above and other objects, features and advantages of the present invention will become apparent from the following detailed description and the accompanying drawings.

本発明によれば、複数の圧電素子を、屈曲性を有する支持体の一方の主面にマトリックス状に配置することで、前記複数の圧電素子間の支持体部分の変形により、圧電素子の変形量を抑えたまま、支持体の変形量を大きくすることとした。このため、音圧が高く音質の劣化が抑制され、クラックのおそれがない音響特性の良好な、軽量・薄型・低消費電力の音圧音響素子及び圧電スピーカが得られる。   According to the present invention, by arranging a plurality of piezoelectric elements in a matrix on one main surface of a flexible support, deformation of the piezoelectric elements is caused by deformation of the support portion between the plurality of piezoelectric elements. The amount of deformation of the support was increased while the amount was suppressed. For this reason, a sound pressure acoustic element and a piezoelectric speaker with high sound pressure, suppressed deterioration in sound quality, good acoustic characteristics and no risk of cracking, and having a light weight, a thin shape, and low power consumption can be obtained.

本発明の圧電音響素子の基本構造と比較例を示す図であり、(A-1)は本発明の平面図,(A-2)は前記(A-1)の変形時の断面図,(B-1)は比較例の平面図,(B-2)は前記(B-1)の変形時の断面図である。It is a figure which shows the basic structure and comparative example of the piezoelectric acoustic element of this invention, (A-1) is a top view of this invention, (A-2) is sectional drawing at the time of the deformation | transformation of said (A-1), ( B-1) is a plan view of a comparative example, and (B-2) is a cross-sectional view at the time of deformation of (B-1). 本発明の実施例1の圧電スピーカを示す図であり、(A)は外観斜視図,(B)は分解斜視図である。It is a figure which shows the piezoelectric speaker of Example 1 of this invention, (A) is an external appearance perspective view, (B) is an exploded perspective view. 前記実施例1の圧電音響素子の配線を示す平面図である。FIG. 3 is a plan view showing wiring of the piezoelectric acoustic element of Example 1. 前記図3を#B−#B線に沿って切断し矢印方向に見た断面図である。It is sectional drawing which cut | disconnected said FIG. 3 along the # B- # B line | wire and looked at the arrow direction. バイモルフ型圧電素子の表面電極形状と分極時の電圧印加の接続例であり、(A-1)及び(A-2)は4層構造の例を示し、(B-1)及び(B-2)は6層構造の例を示す図である。It is a connection example of the surface electrode shape of a bimorph type piezoelectric element and voltage application at the time of polarization, (A-1) and (A-2) show examples of a four-layer structure, and (B-1) and (B-2 ) Is a diagram showing an example of a six-layer structure. 前記実施例1におけるカバーフィルムの有無による音圧レベルの周波数特性を示すグラフである。It is a graph which shows the frequency characteristic of the sound pressure level by the presence or absence of the cover film in the said Example 1. FIG.

以下、本発明を実施するための最良の形態を、実施例に基づいて詳細に説明する。   Hereinafter, the best mode for carrying out the present invention will be described in detail based on examples.

最初に、図1を参照しながら、本発明の圧電音響素子の基本的な構造について説明する。図1(A-1)は、本発明の圧電音響素子の基本構造の平面図,図1(A-2)は前記(A-1)を#A−#A線に沿って切断し矢印方向に見た変形時の断面図である。図1(B-1)は、比較例の圧電音響素子の平面図,図1(B-2)は前記(B-1)を#A´−#A´線に沿って切断し矢印方向に見た変形時の断面図である。図1(A-1)に示すように、本発明の圧電音響素子10は、屈曲性を有する支持体12の一方の主面12A上に、複数の圧電素子20,30,40,50をマトリックス状に配置した構造(縦2列横2行の4つ圧電素子が配置)となっている。前記支持体12としては、例えば、ポリイミド樹脂が用いられる。前記圧電素子20〜50は、例えば、両面テープ14(図4参照)などにより支持体主面12Aに貼り付けられる。本実施例では、前記圧電素子20〜50として、バイモルフ型の圧電素子を用いている。また、前記圧電素子20〜50は、略正方形とし、変形時のひずみによる音質の低下を防止している。   First, the basic structure of the piezoelectric acoustic element of the present invention will be described with reference to FIG. 1A-1 is a plan view of the basic structure of the piezoelectric acoustic element of the present invention, and FIG. 1A-2 is a cross-sectional view taken along line # A- # A in FIG. It is sectional drawing at the time of the deformation | transformation seen in FIG. 1 (B-1) is a plan view of a piezoelectric acoustic element of a comparative example, and FIG. 1 (B-2) is a diagram (B-1) cut along line #A ′-# A ′ in the direction of the arrow. It is sectional drawing at the time of the deformation | transformation seen. As shown in FIG. 1 (A-1), the piezoelectric acoustic element 10 of the present invention has a matrix of a plurality of piezoelectric elements 20, 30, 40, 50 on one main surface 12A of a support 12 having flexibility. The structure is such that four piezoelectric elements in two vertical columns and two horizontal rows are arranged. For example, a polyimide resin is used as the support 12. The piezoelectric elements 20 to 50 are attached to the support main surface 12A with, for example, a double-sided tape 14 (see FIG. 4). In this embodiment, bimorph type piezoelectric elements are used as the piezoelectric elements 20 to 50. The piezoelectric elements 20 to 50 are substantially square to prevent deterioration in sound quality due to distortion during deformation.

一方、図1(B-1)に示す比較例の圧電音響素子200は、屈曲性を有する支持体202の一方の主面202A上に、一つのバイモルフ型の圧電素子204を設けている。このような構造の圧電音響素子200では、音圧を高くするために圧電素子204を大きくし、その変形量を大きくした場合、図1(B-2)に示すように、圧電素子204にクラック206が発生するおそれがある。これに対し、本発明の圧電音響素子10では、図1(A-1)に示すように、複数の圧電素子20〜50がそれぞれ適宜の間隔をおいてマトリックス状に配置されている。このため、図1(A-2)に示すように、複数の圧電素子20〜50間の支持体部分の変形により、圧電素子20〜50自体の変形量を抑えながら、支持体12の変形量を大きくすることができる。その結果、音圧を高くしても、音質の劣化が抑制され、クラックのおそれがない音響特性の良好な、軽量・薄型・低消費電力の圧電音響素子が得られる。   On the other hand, the piezoelectric acoustic element 200 of the comparative example shown in FIG. 1B-1 is provided with one bimorph type piezoelectric element 204 on one main surface 202A of a support 202 having flexibility. In the piezoelectric acoustic element 200 having such a structure, when the piezoelectric element 204 is enlarged in order to increase the sound pressure and the deformation is increased, the piezoelectric element 204 is cracked as shown in FIG. 206 may occur. On the other hand, in the piezoelectric acoustic element 10 of the present invention, as shown in FIG. 1 (A-1), the plurality of piezoelectric elements 20 to 50 are arranged in a matrix at appropriate intervals. For this reason, as shown in FIG. 1 (A-2), the deformation of the support 12 while suppressing the deformation of the piezoelectric elements 20 to 50 itself due to the deformation of the support between the plurality of piezoelectric elements 20 to 50. Can be increased. As a result, it is possible to obtain a lightweight, thin, and low power consumption piezoelectric acoustic element that has excellent acoustic characteristics, with no deterioration in sound quality even when the sound pressure is increased, and no risk of cracking.

次に、図2〜図6を参照しながら、本発明の圧電音響素子を用いた圧電スピーカの具体的な構造について説明する。図2は、本実施例のスピーカを示す図であり、(A)は外観斜視図,(B)は分解斜視図である。図3は、圧電音響素子の表面電極形状と配線を示す平面図,図4は、前記図3を#B−#B線に沿って切断し矢印方向に見た断面図である。図5は、バイモルフ型圧電素子の表面電極形状と分極時の電圧印加の例であり、(A-1)及び(A-2)は4層構造の例を示し、(B-1)及び(B-2)は6層構造の例を示す図である。図6は、カバーフィルムの有無による音圧レベルの周波数特性を示すグラフである。   Next, a specific structure of a piezoelectric speaker using the piezoelectric acoustic element of the present invention will be described with reference to FIGS. 2A and 2B are diagrams showing the speaker of this embodiment, in which FIG. 2A is an external perspective view, and FIG. 2B is an exploded perspective view. FIG. 3 is a plan view showing the surface electrode shape and wiring of the piezoelectric acoustic element, and FIG. 4 is a cross-sectional view of FIG. 3 taken along line # B- # B and viewed in the direction of the arrow. FIG. 5 is an example of the surface electrode shape of a bimorph piezoelectric element and voltage application during polarization. (A-1) and (A-2) show an example of a four-layer structure, and (B-1) and (B B-2) is a diagram showing an example of a six-layer structure. FIG. 6 is a graph showing the frequency characteristics of the sound pressure level with and without the cover film.

図2(A)及び(B)に示すように、本実施例の圧電スピーカ60は、筐体62の内部に、上述した基本構造の圧電音響素子10を収納した構造となっている。前記筐体62は、図2(B)に示すように、ケース本体64と蓋70により構成されており、例えば、PPS(ポリフェニレンサルファイド)樹脂等により形成されている。前記筐体62の寸法は、例えば、70×60×9mmである。前記ケース本体64は、底面64Aに、複数の放音孔66を有している。また、前記ケース本体64の内側には、前記圧電音響素子10を支持するための受部68が形成されている。前記ケース64の底面64Aに、放音孔66を保護するためのメッシュシート72を両面テープ74等により貼り合わせたのち、前記受部68に両面テープ76で前記圧電音響素子10を貼り合わせる。このとき、前記圧電素子20〜50が設けられていない側の主面12Bが、前記放音孔66側となるように貼り合わせる。また、前記両面テープ76としては、例えば、防水性の発泡両面テープが用いられる。   As shown in FIGS. 2A and 2B, the piezoelectric speaker 60 of the present embodiment has a structure in which the piezoelectric acoustic element 10 having the basic structure described above is housed in a housing 62. As shown in FIG. 2B, the casing 62 is composed of a case main body 64 and a lid 70, and is formed of, for example, PPS (polyphenylene sulfide) resin. The dimension of the housing 62 is, for example, 70 × 60 × 9 mm. The case main body 64 has a plurality of sound emitting holes 66 on the bottom surface 64A. A receiving portion 68 for supporting the piezoelectric acoustic element 10 is formed inside the case main body 64. After the mesh sheet 72 for protecting the sound emission hole 66 is bonded to the bottom surface 64A of the case 64 with a double-sided tape 74 or the like, the piezoelectric acoustic element 10 is bonded to the receiving portion 68 with the double-sided tape 76. At this time, bonding is performed so that the main surface 12B on the side where the piezoelectric elements 20 to 50 are not provided is on the sound emission hole 66 side. As the double-sided tape 76, for example, a waterproof foam double-sided tape is used.

次に、前記圧電音響素子10の周囲をケース本体64に対して隙間なく押え付けるための金属枠80を、両面テープ78を用いて貼り付ける。更に、その上から樹脂枠82で圧電音響素子10を抑え、図示しない接着剤を用いて蓋70を貼り合わせる。前記金属枠80及び樹脂枠82によって前記圧電音響素子10を筐体62に抑えつけることにより、圧電音響素子10の周縁の形状が維持される。   Next, a metal frame 80 for pressing the periphery of the piezoelectric acoustic element 10 against the case main body 64 without a gap is attached using a double-sided tape 78. Further, the piezoelectric acoustic element 10 is suppressed by the resin frame 82 from above, and the lid 70 is bonded using an adhesive (not shown). The shape of the periphery of the piezoelectric acoustic element 10 is maintained by holding the piezoelectric acoustic element 10 to the casing 62 by the metal frame 80 and the resin frame 82.

図3には、前記圧電音響素子10の圧電素子20〜50の表面電極形状と配線形状の一例が示されている。本実施例では、圧電素子20〜50として、圧電層と電極層が交互に積層された積層型のバイモルフ圧電素子を用いている。圧電素子20を例に挙げて説明すると、圧電素子20は、図4に示すように、圧電層22と電極層24が交互に複数積層された構造となっており、最上層の表面電極24Aは、3つのパターン26A〜26Cに分割形成されている。3つに分けて形成しているのは、分極時の電圧印加のためであり、圧電スピーカとして使用する際には、2つのパターン(図示の例では、パターン26B,26C)を導電性ペースト27により接続する。分極の際の電圧の印加については後述する。   FIG. 3 shows an example of the surface electrode shape and the wiring shape of the piezoelectric elements 20 to 50 of the piezoelectric acoustic element 10. In the present embodiment, as the piezoelectric elements 20 to 50, stacked bimorph piezoelectric elements in which piezoelectric layers and electrode layers are alternately stacked are used. The piezoelectric element 20 will be described as an example. As shown in FIG. 4, the piezoelectric element 20 has a structure in which a plurality of piezoelectric layers 22 and electrode layers 24 are alternately stacked. The pattern is divided into three patterns 26A to 26C. The three portions are formed for voltage application during polarization. When used as a piezoelectric speaker, two patterns (in the example shown, patterns 26B and 26C) are formed into a conductive paste 27. Connect with. The application of voltage at the time of polarization will be described later.

他の圧電素子30,40,50も同様の構成となっており、圧電素子30は、圧電層32と電極層34が交互に積層され、最上層の表面電極34Aは、3つのパターン36A〜36Cのうち、パターン36B,36Cが導電性ペースト27により導通している。圧電素子40は、圧電層42と電極層44が交互に積層され、最上層の表面電極44Aは、3つのパターン46A〜46Cのうち、パターン46B,46Cが導電性ペースト27により導通している。また、圧電素子50は、圧電層52と電極層54が交互に積層され、最上層の表面電極54Aは、3つのパターン56A〜56Cのうち、パターン56B,56Cが導電性ペースト27により導通している。前記圧電素子20〜50は、例えば、13.6×17.6mm程度の寸法である。   The other piezoelectric elements 30, 40, and 50 have the same configuration. The piezoelectric element 30 has the piezoelectric layers 32 and the electrode layers 34 alternately stacked, and the uppermost surface electrode 34A has three patterns 36A to 36C. Among them, the patterns 36 </ b> B and 36 </ b> C are electrically connected by the conductive paste 27. In the piezoelectric element 40, the piezoelectric layers 42 and the electrode layers 44 are alternately stacked, and the uppermost surface electrode 44 </ b> A has the patterns 46 </ b> B and 46 </ b> C conducted by the conductive paste 27 among the three patterns 46 </ b> A to 46 </ b> C. In the piezoelectric element 50, the piezoelectric layers 52 and the electrode layers 54 are alternately stacked, and the uppermost surface electrode 54A is such that the patterns 56B and 56C among the three patterns 56A to 56C are electrically connected by the conductive paste 27. Yes. The piezoelectric elements 20 to 50 have dimensions of about 13.6 × 17.6 mm, for example.

このような表面電極形状を有する圧電素子20〜50を支持体12の主面12A上にマトリックス状に配置することにより、圧電素子20〜50間に十字状の空間が生ずる。本実施例では、前記十字状の空間に、圧電素子20〜50の電極間を接続するための略十字状の配線90を形成するとともに、前記圧電素子20〜50の周囲を囲むように配線100を形成している。前記配線90,100は、例えば、銅箔等のパターンにより形成されている。前記支持体12の剛性が低いため、金属の配線を圧電素子20〜50の間と周囲に設けることで、剛性を上げて変位を安定させることにより、音質を安定させることができる。   By arranging the piezoelectric elements 20 to 50 having such a surface electrode shape in a matrix on the main surface 12A of the support 12, a cross-shaped space is formed between the piezoelectric elements 20 to 50. In the present embodiment, a substantially cross-shaped wiring 90 for connecting the electrodes of the piezoelectric elements 20 to 50 is formed in the cross-shaped space, and the wiring 100 is surrounded so as to surround the piezoelectric elements 20 to 50. Is forming. The wirings 90 and 100 are formed by a pattern such as a copper foil, for example. Since the rigidity of the support 12 is low, the sound quality can be stabilized by increasing the rigidity and stabilizing the displacement by providing metal wiring between and between the piezoelectric elements 20 to 50.

前記略十字状の配線90のうち、圧電素子20と30の間及び圧電素子40と50の間に形成された配線の両端には、引出部92,94が形成されている。前記引出部92の一方の端部92Aは、導電性ペースト96により圧電素子20のパターン26Bに接続され、他方の端部92Bは、導電性ペースト96により圧電素子30のパターン36Aに接続されている。また、前記引出部94の一方の端部94Aは、導電性ペースト96により圧電素子50のパターン56Bに接続され、他方の端部94Bは、導電性ペースト96により圧電素子40のパターン46Aに接続されている。   In the substantially cross-shaped wiring 90, lead portions 92 and 94 are formed at both ends of the wiring formed between the piezoelectric elements 20 and 30 and between the piezoelectric elements 40 and 50. One end 92 A of the lead-out portion 92 is connected to the pattern 26 B of the piezoelectric element 20 by the conductive paste 96, and the other end 92 B is connected to the pattern 36 A of the piezoelectric element 30 by the conductive paste 96. . One end 94A of the lead-out portion 94 is connected to the pattern 56B of the piezoelectric element 50 by the conductive paste 96, and the other end 94B is connected to the pattern 46A of the piezoelectric element 40 by the conductive paste 96. ing.

また、前記圧電素子20〜50の周囲に設けられた配線100の適宜位置には引出部102A〜102Dが設けられており、引出部102Aは導電性ペースト104により圧電素子20のパターン26Aに接続されている。また、引出部102Bは導電性ペースト104により圧電素子30のパターン36Bに接続され、引出部102Cは導電性ペースト104により圧電素子40のパターン46Bに接続され、引出部102Dは導電性ペースト104により圧電素子50のパターン56Aに接続されている。前記配線90及び100は、それぞれ接続部98,106によって端子ターミナル108A,108Bに接続される。これらの接続部は絶縁テープ109により覆われる。また、前記配線90,100の上には、前記圧電素子20〜50の周囲を囲むように、カバーフィルム120が設けられている。該カバーフィルム120としては、例えば、PETフィルムが用いられ、図示しない両面テープにより圧電音響素子10の支持体主面12A側に貼り合わせられる。前記カバーフィルム120を設けることにより、カバーフィルム120の変形が支持体12の変形をさら促し音圧が上がるという効果が得られる。   Further, lead portions 102A to 102D are provided at appropriate positions of the wiring 100 provided around the piezoelectric elements 20 to 50, and the lead portion 102A is connected to the pattern 26A of the piezoelectric element 20 by the conductive paste 104. ing. The lead portion 102B is connected to the pattern 36B of the piezoelectric element 30 by the conductive paste 104, the lead portion 102C is connected to the pattern 46B of the piezoelectric element 40 by the conductive paste 104, and the lead portion 102D is piezoelectric by the conductive paste 104. It is connected to the pattern 56A of the element 50. The wirings 90 and 100 are connected to terminal terminals 108A and 108B by connection portions 98 and 106, respectively. These connecting portions are covered with an insulating tape 109. A cover film 120 is provided on the wirings 90 and 100 so as to surround the periphery of the piezoelectric elements 20 to 50. As the cover film 120, for example, a PET film is used, and is bonded to the support main surface 12A side of the piezoelectric acoustic element 10 with a double-sided tape (not shown). By providing the cover film 120, the deformation of the cover film 120 further promotes the deformation of the support 12 and the sound pressure is increased.

以上のような形状の配線90,100による電極の接続を実現するために、圧電素子20〜50の振動方向(変形方向)が、積層方向において同一方向となるように、分極方向を設定する。図5には分極時の電極の接続の一例が示されている。まず、図5(A-1)及び(A-2)に示す4層構造の場合について説明する。圧電素子150は、図5(A-2)に示すように、4層の圧電層152A〜152Dと電極層154〜162が交互に積層した構造となっている。   In order to realize the connection of the electrodes by the wirings 90 and 100 having the shapes as described above, the polarization direction is set so that the vibration directions (deformation directions) of the piezoelectric elements 20 to 50 are the same in the stacking direction. FIG. 5 shows an example of electrode connection during polarization. First, the case of the four-layer structure shown in FIGS. 5A-1 and 5A-2 will be described. As shown in FIG. 5 (A-2), the piezoelectric element 150 has a structure in which four piezoelectric layers 152A to 152D and electrode layers 154 to 162 are alternately stacked.

最上層の電極層(表面電極)154は、3つのパターン154A〜154Cに形成されており、図示の例では、パターン154Aをプラス側電極、パターン154Bをマイナス側電極、パターン154Cをコモン電極としている。そして、これらのパターン154A〜154Cには、内部の電極層がスルーホール等により適宜接続されている。例えば、パターン154Aと電極層156を接続し、パターン154Bと電極層160を接続し、パターン154Cと電極層158,162を接続するという具合である。そして、図5(A-2)に示すように分極用の電圧を印加することで分極処理が行われる。プラス側とマイナス側の接続を逆にすることにより、分極方向を逆にすることができる。分極終了後、2つのパターンを接続し、一つの電極とする。   The uppermost electrode layer (surface electrode) 154 is formed in three patterns 154A to 154C. In the illustrated example, the pattern 154A is a plus side electrode, the pattern 154B is a minus side electrode, and the pattern 154C is a common electrode. . The internal electrode layers are appropriately connected to these patterns 154A to 154C through through holes or the like. For example, the pattern 154A and the electrode layer 156 are connected, the pattern 154B and the electrode layer 160 are connected, and the pattern 154C and the electrode layers 158 and 162 are connected. Then, as shown in FIG. 5 (A-2), the polarization process is performed by applying a voltage for polarization. By reversing the connection on the plus side and the minus side, the polarization direction can be reversed. After the polarization is completed, the two patterns are connected to form one electrode.

次に、6層構造の場合について説明すると、圧電素子180は、図5(B-2)に示すように、6層の圧電層182A〜182Fと電極層184〜196が交互に積層した構造となっている。最上層は、3つのパターン184A〜184Cが形成されており、図示の例では、パターン184Aをプラス側電極、パターン184Bをマイナス側電極、パターン184Cをコモン電極としている。そして、これらのパターン184A〜184Cには、内部の電極層がスルーホール等により適宜接続されている。例えば、パターン184Aと電極層188を接続し、パターン184Bと電極層192,196を接続し、パターン184Cと電極層186,190,194を接続するという具合である。そして、図5(B-2)に示すように電圧を印加することで分極処理が行われる。この場合も、4層構造の場合と同様、プラス側とマイナス側の接続を逆にすることにより、分極方向を逆にすることができる。つまり、本実施例の積層型のバイモルフ圧電素子は、3つの電極を有し、分極後に2つの電極を接続することにより、2つの引出部を有する構造となっている。   Next, the case of a six-layer structure will be described. The piezoelectric element 180 has a structure in which six piezoelectric layers 182A to 182F and electrode layers 184 to 196 are alternately stacked as shown in FIG. It has become. In the uppermost layer, three patterns 184A to 184C are formed. In the illustrated example, the pattern 184A is a positive electrode, the pattern 184B is a negative electrode, and the pattern 184C is a common electrode. The internal electrode layers are appropriately connected to these patterns 184A to 184C through through holes or the like. For example, the pattern 184A and the electrode layer 188 are connected, the pattern 184B and the electrode layers 192 and 196 are connected, and the pattern 184C and the electrode layers 186, 190, and 194 are connected. Then, a polarization process is performed by applying a voltage as shown in FIG. In this case as well, as in the case of the four-layer structure, the polarization direction can be reversed by reversing the connection on the plus side and the minus side. That is, the laminated bimorph piezoelectric element of this example has three electrodes, and has a structure having two lead portions by connecting the two electrodes after polarization.

このように分極処理を施した圧電素子を、例えば、隣接する圧電素子20,30の分極方向が逆になり、隣接する圧電素子40,50の分極方向が逆になり、かつ、隣接する圧電素子30,40の分極方向が同じになり、隣接する圧電素子10,50の分極方向が同じになるように配置する。そして、端子に接続されたリード線110,112を介して電圧をかけると圧電音響素子10が、複数の圧電素子20〜50がいずれも同じ位相で積層方向に屈曲変位する。なお、図5に示した積層数や表面電極の形状は一例であって、適宜変更可能である。このように、同一構造の圧電素子を用いることができるため、圧電素子間の変位量、位相を同じにでき、発生した音が干渉して、効率よく音波を発生できる。そのため、音質劣化を抑え、安定した音にすることができる。   In the piezoelectric element subjected to the polarization treatment in this way, for example, the polarization directions of the adjacent piezoelectric elements 20 and 30 are reversed, the polarization directions of the adjacent piezoelectric elements 40 and 50 are reversed, and the adjacent piezoelectric elements. 30 and 40 are arranged so that the polarization directions are the same, and the polarization directions of adjacent piezoelectric elements 10 and 50 are the same. When a voltage is applied via the lead wires 110 and 112 connected to the terminals, the piezoelectric acoustic element 10 is bent and displaced in the stacking direction in the plurality of piezoelectric elements 20 to 50 with the same phase. Note that the number of stacked layers and the shape of the surface electrode shown in FIG. 5 are examples, and can be changed as appropriate. In this way, since piezoelectric elements having the same structure can be used, the displacement amount and phase between the piezoelectric elements can be made the same, and the generated sound interferes to efficiently generate sound waves. Therefore, sound quality deterioration can be suppressed and a stable sound can be obtained.

図6には、前記カバーフィルム120の有無による音圧レベルの周波数特性を示すグラフが示されている。同図において、横軸は周波数[Hz]、縦軸は音圧レベル(SPL)[dB]である。カバーフィルム120がない場合(「樹脂層なし」)であっても、700Hz〜2.5kHz付近の周波数帯を高音圧に制御できることが分かる。更に、同図に示すように、カバーフィルム120を設けることにより(「樹脂層あり」)、カバーフィルム120がない場合よりも、1kHz付近で音圧が上がっているのが分かる。これは、カバーフィルム120によって、圧電音響素子10の周辺が良好に固定されるようになり、圧電素子20〜50の変形が効果的に音圧に変換されるためと考えられる。以上の結果から、本実施例の圧電スピーカ60は、13.6×17.6mmのサイズの圧電素子20〜50を4枚使用し、接続パターン(配線90,100),圧電素子20〜50の配置に加え、必要に応じてカバーフィルム120を用いて最適化することにより、700Hz〜2.5kHz付近の周波数帯を高音圧に制御することができ、軽量・薄型・低消費電極の圧電スピーカ60を実現することができる。   FIG. 6 shows a graph showing the frequency characteristics of the sound pressure level with and without the cover film 120. In the figure, the horizontal axis represents frequency [Hz] and the vertical axis represents sound pressure level (SPL) [dB]. It can be seen that even if there is no cover film 120 (“no resin layer”), the frequency band near 700 Hz to 2.5 kHz can be controlled to a high sound pressure. Furthermore, as shown in the figure, it can be seen that by providing the cover film 120 (“with resin layer”), the sound pressure is increased in the vicinity of 1 kHz as compared with the case without the cover film 120. This is considered to be because the periphery of the piezoelectric acoustic element 10 is satisfactorily fixed by the cover film 120, and the deformation of the piezoelectric elements 20 to 50 is effectively converted into sound pressure. From the above results, the piezoelectric speaker 60 of the present embodiment uses four piezoelectric elements 20 to 50 having a size of 13.6 × 17.6 mm, and the connection patterns (wirings 90 and 100) and the piezoelectric elements 20 to 50 are used. In addition to the arrangement, by optimizing with the use of the cover film 120 as necessary, the frequency band in the vicinity of 700 Hz to 2.5 kHz can be controlled to a high sound pressure, and the piezoelectric speaker 60 is light, thin, and has low consumption electrodes. Can be realized.

このように、実施例1によれば、次のような効果がある。
(1)複数の圧電素子20〜50を、屈曲性を有する支持体12の一方の主面12Aにマトリックス状に配置することで、前記複数の圧電素子20〜50間の支持体部分の変形により、圧電素子20〜50の変形量を抑えたまま、支持体12の変形量を大きくすることとした。このため、音圧を高くしてもクラックの発生を防止し、音質の劣化が抑制され、音響特性の良好な、軽量・薄型・低消費電力の圧電音響素子10及び圧電スピーカ60が得られる。
(2)圧電素子20〜50を略正方形としたので、長方形等とくらべて円形に近くなり、変形時のひずみを抑制し、音質の低下を防止することができる。
Thus, according to the first embodiment, there are the following effects.
(1) By disposing the plurality of piezoelectric elements 20 to 50 in a matrix on one main surface 12A of the support body 12 having flexibility, the support body portion between the plurality of piezoelectric elements 20 to 50 is deformed. The deformation amount of the support 12 is increased while the deformation amount of the piezoelectric elements 20 to 50 is suppressed. For this reason, even if the sound pressure is increased, the occurrence of cracks is prevented, the deterioration of sound quality is suppressed, and the piezoelectric acoustic element 10 and the piezoelectric speaker 60 that are lightweight, thin, and have low power consumption with good acoustic characteristics can be obtained.
(2) Since the piezoelectric elements 20 to 50 are substantially square, they are closer to a circle than a rectangle or the like, so that distortion during deformation can be suppressed and deterioration of sound quality can be prevented.

(3)圧電素子20〜50の電極を接続する配線90,100を、圧電素子20〜50の間に略十字状に設けるとともに、圧電素子20〜50の周囲に設けることとしたので、剛性が向上して変位が安定し、音質の安定を図ることができる。
(4)圧電素子20〜50が、いずれも同じ位相で積層方向に屈曲変位するように分極方向を設定することとしたので、前記配線90,100による接続を実現でき、余分な配線をなくすことができる。このため、余分な配線部分と他の部分の剛性が異なることによる音質の低下を防止することができる。
(5)前記配線90,100が、支持体12の一方の主面12A側にのみ配線されているため、防水構造として適しているとともに、配線自体が容易となる。
(3) Since the wires 90 and 100 for connecting the electrodes of the piezoelectric elements 20 to 50 are provided in a substantially cross shape between the piezoelectric elements 20 to 50 and around the piezoelectric elements 20 to 50, rigidity is improved. This improves the displacement and stabilizes the sound quality.
(4) Since the polarization directions are set so that the piezoelectric elements 20 to 50 are bent and displaced in the laminating direction at the same phase, the connection by the wirings 90 and 100 can be realized, and unnecessary wiring is eliminated. Can do. For this reason, it is possible to prevent deterioration in sound quality due to the difference in rigidity between the extra wiring portion and other portions.
(5) Since the wirings 90 and 100 are wired only on the one main surface 12A side of the support body 12, they are suitable as a waterproof structure and the wiring itself is easy.

(6)圧電素子20〜50としてバイモルフ型圧電素子を使用しているため、素子単品で変形することができる。
(7)前記圧電素子20〜50の周囲にカバーフィルム120を設けることで、支持体12の変形を更に促し、音圧が向上する。
(8)圧電音響素子10を、金属枠80と樹脂枠82を用いて筐体62に押え付けるため、圧電音響素子10の周縁の形状を良好に固定して支持することができる。
(9)前記圧電音響素子10を筐体62に取り付けるにあたり、両面テープ等を用いるため、圧電スピーカ60の製造工程を簡略化することができる。
(6) Since bimorph type piezoelectric elements are used as the piezoelectric elements 20 to 50, the element can be deformed as a single element.
(7) By providing the cover film 120 around the piezoelectric elements 20 to 50, the support 12 is further deformed and the sound pressure is improved.
(8) Since the piezoelectric acoustic element 10 is pressed against the casing 62 using the metal frame 80 and the resin frame 82, the shape of the periphery of the piezoelectric acoustic element 10 can be fixed and supported well.
(9) Since the double-sided tape or the like is used to attach the piezoelectric acoustic element 10 to the housing 62, the manufacturing process of the piezoelectric speaker 60 can be simplified.

なお、本発明は、上述した実施例に限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々変更を加え得ることができる。例えば、以下のものも含まれる。
(1)前記実施例で示した圧電素子20〜50の寸法や形状は一例であり、円形にするなど、必要に応じて適宜変更してよい。また、前記実施例では4つの圧電素子20〜50を用いたが、圧電素子数は必要に応じて増減してよい。
(2)前記実施例では、圧電素子20〜50として、積層構造のバイモルフ型の圧電素子を用いたが、これも一例であり、圧電素子はユニモルフ型であってもよいし、積層構造ではなく単層構造であってもよい。
(3)前記実施例で示した分極方向や印加電圧も一例であり、圧電素子の振動方向が同一方向になるように、圧電素子の分極方向や印加電圧を適宜設定してよい。例えば、前記図3に示した電極パターンにおいて、隣接する全ての圧電素子間で分極方向が逆になるように設定してもよい。例えば、圧電素子20,40の最も大きいパターン26A,46Aにプラス電圧を印加し、圧電素子30,50の最も大きいパターン36A,56Aにマイナス電圧を印加するように、分極方向と配線パターンを設定するなどである。
(4)前記実施例で示した材料も一例であり、同様の効果を奏するものであれば、公知の各種の材料を使用してよい。
(5)前記実施例で示した筐体62の放音孔66の位置や数も一例であり、必要に応じて適宜変更・増減可能である。
(6)前記実施例は、車載用の小型スピーカ等に適した例であるが、本発明は、他の公知の各種の音響機器に利用する圧電音響素子として適用可能である。
In addition, this invention is not limited to the Example mentioned above, A various change can be added in the range which does not deviate from the summary of this invention. For example, the following are also included.
(1) The dimensions and shapes of the piezoelectric elements 20 to 50 shown in the above embodiments are merely examples, and may be appropriately changed as necessary, such as a circular shape. Moreover, although the four piezoelectric elements 20-50 were used in the said Example, you may increase / decrease the number of piezoelectric elements as needed.
(2) In the above embodiment, a bimorph type piezoelectric element having a laminated structure is used as the piezoelectric elements 20 to 50. However, this is also an example, and the piezoelectric element may be a unimorph type or not a laminated structure. It may be a single layer structure.
(3) The polarization direction and applied voltage shown in the above embodiment are also examples, and the polarization direction and applied voltage of the piezoelectric element may be set as appropriate so that the vibration direction of the piezoelectric element is the same. For example, in the electrode pattern shown in FIG. 3, the polarization direction may be set to be reversed between all adjacent piezoelectric elements. For example, the polarization direction and the wiring pattern are set so that a positive voltage is applied to the largest patterns 26A and 46A of the piezoelectric elements 20 and 40, and a negative voltage is applied to the largest patterns 36A and 56A of the piezoelectric elements 30 and 50. Etc.
(4) The materials shown in the above embodiments are also examples, and various known materials may be used as long as the same effects can be obtained.
(5) The position and number of the sound emission holes 66 of the housing 62 shown in the above embodiment are also examples, and can be changed or increased or decreased as necessary.
(6) The above-described embodiment is an example suitable for a vehicle-mounted small speaker or the like, but the present invention can be applied as a piezoelectric acoustic element used for various other known acoustic devices.

本発明によれば、複数の圧電素子を、屈曲性を有する支持体の一方の主面にマトリックス状に配置することで、前記複数の圧電素子間の支持体部分の変形により、圧電素子の変形量を抑えたまま、支持体の変形量を大きくすることとした。このため、音圧が高く音質の劣化が抑制され、クラックのおそれがなく、良好な音響特性が得られ、軽量・薄型・低消費電力にできるので、圧電音響素子の用途に適用できる。特に、車載関係の音響用途(例えば、ハイブリット車接近警報スピーカ,ヘッドレス応用スピーカユニット等)に好適である。   According to the present invention, by arranging a plurality of piezoelectric elements in a matrix on one main surface of a flexible support, deformation of the piezoelectric elements is caused by deformation of the support portion between the plurality of piezoelectric elements. The amount of deformation of the support was increased while the amount was suppressed. For this reason, the sound pressure is high, deterioration of the sound quality is suppressed, there is no fear of cracking, good acoustic characteristics can be obtained, and the weight, thickness, and power consumption can be reduced. In particular, it is suitable for vehicle-related acoustic applications (for example, hybrid vehicle approach warning speakers, headless application speaker units, etc.).

10:圧電音響素子
12:支持体
12A,12B:主面
14:両面テープ
20,30,40,50:圧電素子
22,32,42,52:圧電層
24,34,44,54:電極層
24A,34A,44A,54A:表面電極
26A〜26C,36A〜36C,46A〜46C,56A〜56C:パターン
27:導電性ペースト
60:圧電スピーカ
62:筐体
64:ケース本体
64A:底面
66:放音孔
68:受部
70:蓋
72:メッシュシート
74,76,78:両面テープ
80:金属枠
82:樹脂枠
90:配線
92,94:引出部
92A,92B,94A,94B:端部
96,104:導電性ペースト
98,106:接続部
100:配線
102A〜102D:引出部
108A,108B:端子ターミナル
109:絶縁テープ
110,112:リード線
120:カバーフィルム
150:圧電素子
152A〜152D:圧電層
154〜162:電極層
154A〜154C:パターン
180:圧電素子
182A〜182F:圧電層
184〜196:電極層
184A〜184C:電極パターン
200:圧電音響素子
202:支持体
202A:主面
204:圧電素子
206:クラック
10: Piezoelectric acoustic element 12: Support body 12A, 12B: Main surface 14: Double-sided tape 20, 30, 40, 50: Piezoelectric element 22, 32, 42, 52: Piezoelectric layer 24, 34, 44, 54: Electrode layer 24A , 34A, 44A, 54A: surface electrodes 26A-26C, 36A-36C, 46A-46C, 56A-56C: pattern 27: conductive paste 60: piezoelectric speaker 62: housing 64: case main body 64A: bottom surface 66: sound emission Hole 68: Receiving portion 70: Cover 72: Mesh sheet 74, 76, 78: Double-sided tape 80: Metal frame 82: Resin frame 90: Wiring 92, 94: Lead-out portion 92A, 92B, 94A, 94B: End portion 96, 104 : Conductive paste 98, 106: Connection part 100: Wiring 102A-102D: Lead-out part 108A, 108B: Terminal terminal 109: Insulating tape 110, 112: lead wire 120: cover film 150: piezoelectric elements 152A to 152D: piezoelectric layers 154 to 162: electrode layers 154A to 154C: pattern 180: piezoelectric elements 182A to 182F: piezoelectric layers 184 to 196: electrode layers 184A to 184C : Electrode pattern 200: Piezoelectric acoustic element 202: Support body 202A: Main surface 204: Piezoelectric element 206: Crack

Claims (7)

複数の圧電素子を、屈曲性を有する支持体の一方の主面にマトリックス状に配置したことを特徴とする圧電音響素子。   A piezoelectric acoustic element comprising a plurality of piezoelectric elements arranged in a matrix on one main surface of a flexible support. 前記複数の圧電素子の周囲に、樹脂層を形成したことを特徴とする請求項1記載の圧電音響素子。   The piezoelectric acoustic element according to claim 1, wherein a resin layer is formed around the plurality of piezoelectric elements. 前記複数の圧電素子を接続する金属線を、
前記複数の圧電素子の間と、前記複数の圧電素子の周囲に配線したことを特徴とする請求項1又は2記載の圧電音響素子。
A metal wire connecting the plurality of piezoelectric elements,
3. The piezoelectric acoustic element according to claim 1, wherein wiring is performed between the plurality of piezoelectric elements and around the plurality of piezoelectric elements.
前記圧電素子が4つであって、
前記圧電素子の間に配線される金属線が略十字状であることを特徴とする請求項3記載の圧電音響素子。
There are four piezoelectric elements,
4. The piezoelectric acoustic element according to claim 3, wherein the metal wire wired between the piezoelectric elements has a substantially cross shape.
前記圧電素子がバイモルフ型であって、
該圧電素子は、前記支持体上で隣接する他の圧電素子と、分極方向が異なることを特徴とする請求項4記載の圧電音響素子。
The piezoelectric element is a bimorph type,
5. The piezoelectric acoustic element according to claim 4, wherein the piezoelectric element has a polarization direction different from that of another piezoelectric element adjacent on the support.
請求項1〜5のいずれか一項に記載の圧電音響素子と、
該圧電音響素子の外周を支持し、前記圧電素子が配置されていない側の支持体の主面側に放音孔を有する筐体と、
前記圧電素子が配置されている側の支持体の主面と前記筐体の蓋部の間に配置されており、前記圧電音響素子の外周を筐体に対して押さえる枠体と、
を備えたことを特徴とする圧電スピーカ。
The piezoelectric acoustic element according to any one of claims 1 to 5,
A housing that supports the outer periphery of the piezoelectric acoustic element and has a sound emitting hole on the main surface side of the support on the side where the piezoelectric element is not disposed;
A frame that is disposed between the main surface of the support on the side where the piezoelectric element is disposed and the lid of the casing, and holds the outer periphery of the piezoelectric acoustic element against the casing;
A piezoelectric speaker characterized by comprising:
前記枠体が、
前記圧電音響素子側に配置される金属製の枠と、
該金属製の枠と前記筐体の蓋部の間に配置される樹脂製の枠と、
からなることを特徴とする請求項6記載の圧電スピーカ。
The frame is
A metal frame disposed on the piezoelectric acoustic element side;
A resin frame disposed between the metal frame and the lid of the housing;
The piezoelectric speaker according to claim 6, comprising:
JP2013271717A 2013-12-27 2013-12-27 Piezoelectric acoustic element and piezoelectric speaker Expired - Fee Related JP6010525B2 (en)

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