JP2015159224A - sensor structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor structure which allows for fine routing of a lead frame, and compaction.SOLUTION: A sensor structure includes a plurality of lead frames 2-4 where the routing leads 2a-4a, connected with an IC chip 5 having a circuit for electrically processing the output signal from a sensor element, are formed integrally with the connector leads 2b-4b connected with an electric connector, and thinner than the connector leads 2b-4b, a package 6 exposing the connector leads 2b-4b from a first resin member sealing the routing leads 2a-4a, and a package housing body 7 exposing the tips of the connector leads 2b-4b from a second resin member covering the package 6.

Description

  The present invention relates to a sensor structure applied to, for example, a sensor device that detects a physical change of a sensor element.

  As an example of a sensor device that detects a physical change of a sensor element, a current sensor including a magnetic detection element that magnetically detects a current flowing through a bus bar has been proposed (for example, see Patent Document 1).

  The conventional current sensor described in Patent Document 1 has a semiconductor package that covers a magnetic detection element mounted on the base ends of a plurality of lead frames. The tip portions of the plurality of lead frames are formed as connector terminals protruding from the outer surface of the semiconductor package. The semiconductor package is covered with the housing surrounding the connector terminal.

JP 2009-156803 A

  Since the conventional current sensor described in Patent Document 1 uses a plurality of lead frames of the magnetic detection element as connector terminals, it is necessary to set the thickness of the lead frame to a dimension that matches the thickness of the connector terminals of the external connector. There is.

  However, the thickness dimension matched to the connector terminal increases the thickness of the lead frame, and restricts fine lead frame routing around the magnetic sensing element. On the other hand, as the thickness of the lead frame increases, the thickness of the semiconductor package also increases, and the physique of the housing that covers the semiconductor package increases. As a result, there is a limit to downsizing the current sensor.

  Accordingly, an object of the present invention is to provide a sensor structure that enables fine lead-out routing and enables miniaturization.

[1] In the present invention, the routing lead portion connected to the IC chip having a circuit for electrically processing the output signal from the sensor element is thinner than the connector lead portion in the connector lead portion connected to the electrical connector. A plurality of lead frames formed integrally with each other, a package in which the connector lead portion is exposed from a first resin member in which the routing lead portion is sealed, and a second resin member covering the package from the connector lead portion. And a package container with the tip portion exposed.

[2] The package container according to [1] is characterized in that it forms a connector housing in which the package is sealed by molding with the second resin member.

[3] The package housing body according to [1] is characterized in that it forms a connector housing having a housing space for inserting and fixing the package inside the second resin member.

  According to the present invention, a lead frame can be finely routed, and a sensor structure that can be miniaturized can be effectively obtained.

It is a perspective view showing typically a sensor device provided with a sensor structure concerning a 1st embodiment suitable for the present invention. It is principal part sectional drawing of the II-II arrow of FIG. It is a perspective view which shows typically the sensor apparatus provided with the sensor structure in 2nd Embodiment. It is principal part sectional drawing of the IV-IV line arrow of FIG. It is a perspective view which shows typically the sensor apparatus provided with the sensor structure in 3rd Embodiment.

  Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings.

[First Embodiment]
(Overall configuration of sensor device)
In FIG. 1, reference numeral 1 generally indicates a sensor device having a typical sensor structure according to the first embodiment. The sensor device 1 has three lead frames 2 to 4. A rectangular IC chip 5 is disposed at the center of one end where the lead frames 2 to 4 are converged.

  The IC chip 5 is not particularly limited, and is made of, for example, a semiconductor element in which peripheral circuit units that perform processing such as amplification on a detection signal output from the sensor element are integrated. This sensor element is a sensor element such as an acceleration sensor that detects acceleration, a magnetic sensor that detects a change in magnetic field, a current sensor that detects current, or an optical sensor that detects light.

  By mounting the IC chip 5 on the adhesive applied to the mounting surface of the three lead frames 2 to 4, the three lead frames 2 to 4 and the IC chip 5 are electrically connected by flip chip connection. ing. As this adhesive, for example, an insulating adhesive such as a silicon paste or a conductive adhesive such as a silver paste is used.

  As shown in FIGS. 1 and 2, the IC chip 5 is sealed by a rectangular parallelepiped package 6 that is a primary molded body molded by a mold resin that is a first resin member. On one side wall portion of the package 6, one longitudinal end portions of the three lead frames 2 to 4 are extended in parallel on the same surface. As a material of the mold resin, for example, a thermosetting resin such as an epoxy resin having excellent insulation, corrosion resistance, heat resistance, and the like is used.

  As shown in FIGS. 1 and 2, the entire surface of the package 6 except for one end in the longitudinal direction of the three lead frames 2 to 4 is a secondary molded body molded by a molding resin as a second resin member. It is sealed by a certain rectangular parallelepiped package container 7. The package 6 is covered with the package container 7 to ensure waterproofness and dustproofness. As a material of the package container 7, for example, a thermosetting resin such as an epoxy resin is used.

  As shown in FIGS. 1 and 2, the package housing 7 is formed as a connector housing. One side wall portion in the longitudinal direction of the package housing 7 opens a connection port 7a connected to an unillustrated counterpart electrical connector. The lead frames 2 to 4 exposed in the connection port 7a are connector terminals for outputting the detection result of the IC chip 5 to the outside. This connector terminal is connected to an external electrical connector to transmit the detection result of the IC chip 5 to a control device of an external device.

(Lead frame structure)
As shown in FIGS. 1 and 2, the main basic configuration of the sensor structure according to the first embodiment is more than connector lead portions 2b to 4b that meet a predetermined standard and connector lead portions 2b to 4b. The thin lead wires 2a to 4a are in the lead frames 2 to 4 formed integrally. Therefore, the sensor device 1 configured as described above shows one configuration example according to the first embodiment, and the shape and structure of the components are not limited to the illustrated example. .

  The lead frames 2 to 4 are made of a long and narrow plate material formed by punching a plurality of conductive substrate materials that can be taken into a long and narrow plate shape. As the material of the lead frames 2 to 4, for example, a conductive metal material such as aluminum, copper, or a copper alloy is used. The surface of the lead frames 2 to 4 may be plated with a metal material such as tin, nickel, gold or silver. The shape of the lead frames 2 to 4 may be, for example, a plate shape or a cylindrical shape.

  As shown in FIGS. 1 and 2, the lead frames 2 to 4 have connector lead portions 2 b to 4 b and differential lead thicknesses 2 a to 4 a that are thinner than the connector lead portions 2 b to 4 b. It is formed integrally with the shape. The lead thickness of the routing leads 2a to 4a is, for example, about 0.25 mm, and the thickness of the connector leads 2b to 4b is, for example, about 0.64 mm. Has been.

  As shown in FIGS. 1 and 2, the routing lead portions 2 a to 4 a are configured as conductive pattern portions connected to an IC chip 5 having a circuit for electrically processing a detection signal from a sensor element. One connector lead part 2b-4b is comprised as a connector terminal connected to an electrical connector.

  Steps 2c to 4c formed between the routing lead portions 2a to 4a and the connector lead portions 2b to 4b are arranged inside the package housing 7 as shown in FIGS. Only the tip end portions of the connector lead portions 2b to 4b protrude from the housing 7 to the outside. With this configuration, the mechanical strength of the lead frames 2 to 4 is increased.

  The lead frames 2 to 4 are multi-cavity frames that can be obtained in large numbers by arranging a large number of three lead frames on a rectangular flat plate-like outer frame. In accordance with a conventional method, conductive metal plates to be the lead frames 2 to 4 are punched out to a required outer shape by pressing, and the thinned lead portions 2a to 4a are manufactured by pressing or etching. Therefore, a large number of the three lead frames 2 to 4 arranged in a large number are taken in one manufacturing process.

(Effects of the first embodiment)
In addition to the above effects, the sensor structure configured as described above provides the following effects.

(1) By using the thin lead wires 2a to 4a inside the package 6, fine lead is possible and the degree of freedom of routing can be increased.
(2) Since the lead lead portions 2a to 4a are formed thin, the thickness of the package 6 can be reduced, and the physique of the package housing 7 that covers the package 6 can also be reduced. It becomes possible to reduce the size of the entire body.
(3) Since the lead frames 2 to 4 connected to the IC chip 5 can be used as connector terminals, the joining process between the lead leads 2a to 4a and the connector leads 2b to 4b can be eliminated. Thus, the reliability of the connection can be achieved, and the cost can be reduced.
(4) By reducing the thickness of the lead frames 2 to 4 inside the package 6, the thermal resistance of the lead frames 2 to 4 can be reduced, and the heat dissipation of the lead frames 2 to 4 is improved. Can do.
(5) Since the lead frames 2 to 4 can be configured as terminal structures for connectors or substrates, the number of components can be reduced.

[Second Embodiment]
Referring to FIGS. 3 and 4, these drawings illustrate a sensor device 1 having a sensor structure according to the second embodiment. In FIGS. 3 and 4, substantially the same members as those in the first embodiment are denoted by the same member names and symbols. Therefore, the detailed description regarding each member is abbreviate | omitted.

  In the first embodiment, the package container 7 integrated by insert molding in which the molding resin is injection molded using the package 6 in which the lead frames 2 to 4 and the IC chip 5 are sealed as an insert is illustrated. In the second embodiment, a configuration in which the package 6 and the package container 7 are formed separately is illustrated.

  As shown in FIGS. 3 and 4, the package housing 7 is formed with a housing space 8 for housing the package 6. In the accommodation space 8, an insertion opening 7 b for inserting the package 6 and a fixing hole 7 c for inserting and fixing the connector lead portions 2 b to 4 b of the lead frames 2 to 4 are formed in communication with each other. Is accommodated to form a sensor structure.

  On the other hand, the package 6 is formed with a cap 9 for closing the insertion opening 7b of the package housing 7 as shown in FIGS. The insertion opening 7 b of the package housing 7 is closed by the cap 9 in a state where the package 6 is housed in the housing space 8 of the package housing 7. The housing space 8 of the package housing 7 is a connector housing that covers the routing lead portions 2a to 4a of the lead frames 2 to 4, and the connector lead portions 2b to 4b of the lead frames 2 to 4 are connector terminals. .

  As a method for fixing the cap 9 of the package 6, for example, a snap-fit coupling structure to be fixed to the package container 7, a structure to be press-fitted to the package container 7, or a thermosetting adhesive is used to fix the cap 9 to the package container 7. Various fixing methods such as a structure can be adopted.

(Effect of the second embodiment)
In the sensor structure according to the second embodiment, in addition to obtaining the same effects as those of the first embodiment, the package housing 7 is lightened by the amount of the housing space 8, and the sensor device It becomes possible to achieve weight reduction of 1 whole.

[Third Embodiment]
Referring to FIG. 5, a sensor device 1 having a sensor structure according to a third embodiment is illustrated in the same figure. In FIG. 5, the substantially same members as those in the first embodiment are denoted by the same member names and reference numerals, and detailed description of each member is omitted.

  In FIG. 5, the IC chip 5 is mounted on the adhesive applied to the mounting surfaces of the three lead frames 2 to 4. The IC chip 5 and the lead frames 2 to 4 are electrically connected by bonding wires. In the third embodiment, the configuration other than the mounting method of the IC chip 5 has a configuration substantially similar to that of the first embodiment.

(Effect of the third embodiment)
Even in the third embodiment, the same effect as in the first embodiment can be obtained.

[Modification]
The lead frames 2 to 4 constituting the sensor structure according to each of the above embodiments may be appropriately selected in terms of the number of arrangement, the arrangement position, the arrangement form, and the like according to the configuration and purpose of use of the IC chip 5. Of course, the initial objectives of the present invention can be achieved.

  In addition, the sensor device 1 having the sensor structure according to each of the above embodiments can be applied to various sensor devices that detect physical changes such as magnetism, capacitance, current, and voltage. Of course.

  As is clear from the above description, typical embodiments, modifications, and illustrations according to the present invention have been illustrated. However, the above-described embodiments, modifications, and illustrations show the invention according to the claims. It is not limited. Therefore, it should be noted that not all the combinations of features described in the above-described embodiments, modifications, and illustrated examples are essential to the means for solving the problems of the invention.

DESCRIPTION OF SYMBOLS 1 ... Sensor apparatus, 2-4 ... Lead frame, 2a-4a ... Leading lead part, 2b-4b ... Connector lead part, 2c-4c ... Level | step difference, 5 ... IC chip, 6 ... Package, 7 ... Package container, 7a ... Connection port, 7b ... insertion opening, 7c ... fixing hole, 8 ... accommodating space, 9 ... cap

Claims (3)

A plurality of routing lead portions connected to an IC chip having a circuit for electrically processing an output signal from the sensor element are integrally formed with a connector lead portion connected to the electrical connector so as to be thinner than the connector lead portion. A lead frame;
A package in which the connector lead portion is exposed from the first resin member sealing the routing lead portion;
A package housing body in which a tip portion of the connector lead portion is exposed from a second resin member covering the package;
A sensor structure characterized by comprising:   The sensor structure according to claim 1, wherein the package container comprises a connector housing in which the package is sealed by molding with the second resin member.   The sensor structure according to claim 1, wherein the package housing comprises a connector housing having a housing space for inserting and fixing the package inside the second resin member.

Images