JP2015154030A - Transfer method of device and transfer apparatus of device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer method of a device capable of transferring a device (device chip) with high accuracy.SOLUTION: A transfer method of a device is constituted to include an imaging step of imaging a device (15) by imaging means (12) attached to pick-up means (6), and detecting a predetermined pattern (17), a pick-up step of picking up a device (23) by the pick-up means, and a mounting step of mounting a device, picked up by the pick-up means, at a predetermined position based on a predetermined pattern detected in the imaging step, after performing the pick-up step.

Description

  The present invention relates to a transfer method and a transfer apparatus for transferring a device (device chip) to an arbitrary position.

  In recent years, manufacture of a package called FOWLP (Fan-Out Wafer Level Package) in which a rewiring layer is formed outside a device chip using a wafer level rewiring technique has been started (for example, see Patent Document 1). FOWLP is advantageous in miniaturization as compared with a conventional package using wire bonding or the like because the device chip and the package substrate are connected by a thin wiring layer.

  For manufacturing FOWLP, for example, a process called a chip-first method is employed. In the chip first method, first, a pseudo wafer is formed by resin sealing device chips arranged at arbitrary intervals, and a wiring layer is provided on the pseudo wafer. Then, a plurality of packages can be obtained by dividing the pseudo wafer along the planned dividing line between the device chips.

  In addition, a process called RDL first (Redistribution Layer-first) method is adopted in which device chips are arranged on a support wafer provided with a wiring layer and sealed with resin, and then the support wafer is removed and divided into a plurality of packages. Sometimes. In this RDL first method, for example, device chips can be arranged avoiding defective portions of the wiring layer, which is advantageous in improving the yield as compared with the chip first method.

JP2013-58520A

  By the way, in the above-mentioned chip first method and RDL first method, it is necessary to arrange the device chips with high accuracy in order to surely connect to the wiring layer formed with high density. However, since the transfer equipment so far has determined the position of each device chip based on the outer peripheral edge, for example, the position after transferring the device chip (transfer position) is shifted by several tens of μm. It sometimes occurred.

  The present invention has been made in view of such problems, and an object thereof is to provide a device transfer method and a device transfer apparatus capable of transferring a device (device chip) with high accuracy. It is.

  According to the present invention, a device having a predetermined pattern is formed in each region partitioned by a plurality of intersecting scheduled lines, and the device is divided along the scheduled dividing lines and held by the holding means. A device transfer method for transferring a device from the holding means, wherein the device is imaged by an imaging means attached to a pickup means for picking up the device from the holding means, and the predetermined pattern is detected. A pickup step of picking up the device from the holding means by the pickup means; and after the pickup step, the pickup means picked up by the pickup means based on the predetermined pattern detected in the imaging step A mounting step of mounting the device at a predetermined position. Transfer method of vice is provided.

  In the present invention, it is preferable that the imaging step is performed during the pickup step.

  In addition, according to the present invention, a device having a predetermined pattern is formed in each region divided by a plurality of intersecting scheduled lines, and the device of the wafer divided along the scheduled partition lines is transferred. A device transfer apparatus, a holding means for holding a wafer divided along the division line, a pickup means for picking up the device from the wafer held by the holding means, and moving the pickup means A moving means for picking up the image, an image pickup means for picking up the device to be transferred and attached to the pickup means, a detection unit for detecting the predetermined pattern of the device based on a picked-up image picked up by the image pickup means, and the detection And a control means having a movement control section for controlling the movement of the pickup means based on the predetermined pattern detected by the section. Apparatus for transferring device is provided to symptoms.

  In the device transfer method and the device transfer apparatus according to the present invention, the image is picked up by the image pickup means attached to the pickup means, the predetermined pattern is detected, and the pickup means is moved based on the predetermined pattern. It is possible to appropriately determine the position of the device relative to the pickup means and transfer the device with high accuracy.

It is a perspective view showing the wafer of this embodiment typically. It is a figure which shows typically the transfer equipment of the device which concerns on this Embodiment. It is a bottom view showing typically an example of composition of a collet with which a device transfer device is provided. It is a partial cross section side view which shows typically the pick-up step and imaging step which concern on this Embodiment. It is a partial cross section side view which shows typically the mounting step which concerns on this Embodiment.

  Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing a wafer including a device chip (device) to be transferred. As shown in FIG. 1, the wafer 11 of the present embodiment is a plate-like object made of a material such as silicon or sapphire, and has a disk-like appearance.

  The front surface 11a of the wafer 11 is divided into a plurality of regions by division lines (streets) 13 arranged in a lattice pattern, and a device 15 such as an IC is formed in each region. Each of the devices 15 includes a characteristic pattern 17 including elements, wirings, and the like.

  A dicing tape 19 having a diameter larger than that of the wafer 11 is attached to the back surface 11 b side of the wafer 11. An annular frame 21 is fixed to the outer peripheral portion of the dicing tape 19. That is, the wafer 11 is supported by the annular frame 21 via the dicing tape 19.

  The wafer 11 is divided into a plurality of device chips 23 corresponding to each device 15 by a method such as cutting or laser ablation. In the device transfer method according to the present embodiment, the device chip 23 (device 15) is transferred to a predetermined position using a device transfer apparatus described below.

  FIG. 2 is a diagram schematically showing a device transfer apparatus according to the present embodiment. As shown in FIG. 2, the transfer device 2 includes a holding table (holding means) 4. The upper surface of the holding table 4 is a holding surface for sucking and holding the wafer 11, and is connected to a suction source (not shown) for the holding table through a suction path (not shown) formed inside the holding table 4. Has been.

  Above the holding table 4, a pickup mechanism (pickup means) 6 for picking up the device chip 23 (device 15) of the wafer 11 sucked and held by the holding table 4 is disposed.

  The pickup mechanism 6 includes a support arm 8 that supports each component. A collet 10 for sucking and holding the device chip 23 is provided at the lower end of the support arm 8. FIG. 3A is a bottom view schematically showing the collet 10 according to the present embodiment, and FIG. 3B is a bottom view schematically showing the collet 10 according to the modification.

  As shown in FIGS. 2 and 3A, the collet 10 of the present embodiment has a substantially rectangular parallelepiped appearance, and a rectangular opening 10b is formed at the center of the bottom surface (lower surface) 10a. ing. A camera (imaging means) 12 that images the device 15 of the device chip 23 is installed in the opening 10b.

  An annular suction port 10c surrounding the opening 10b is formed on the bottom surface (lower surface) 10a of the collet 10. The suction port 10 c is connected to a suction source 14 for the pickup mechanism 6 through a suction path (not shown) formed inside the collet 10. The device chip 23 is sucked and held in the collet 10 by the negative pressure of the suction source 14 acting on the suction port 10c.

  The shape and the like of the collet 10 can be arbitrarily changed as long as the device chip 23 can be appropriately sucked and held. For example, instead of the annular suction port 10c, a plurality of suction ports 10c surrounding the opening 10b may be formed as shown in FIG. It is also possible to change the position of the opening 10b where the camera 12 is installed.

  On the upper end side of the support arm 8, a moving mechanism (moving means) 16 for moving the pickup mechanism 6 in the horizontal direction and the vertical direction is provided. The moving mechanism 16 is connected together with the camera 12 to a control device (control means) 18 that controls each component of the transfer device 2.

  The control device 18 includes a detection unit 18 a that detects the pattern 17 of the device 15 based on a captured image captured by the camera 12. The detection unit 18a extracts, for example, a pattern 17 that matches a pattern (not shown) stored in advance from the captured image, and determines its position (coordinates).

  In addition, the control device 18 includes a movement control unit 18 b that controls the movement of the pickup mechanism 6. The movement control unit 18b calculates, for example, the amount of deviation of the device chip 23 with respect to the collet 10 based on the position (coordinates) of the pattern 17 detected by the detection unit 18a, and takes the amount of deviation into account to move the pickup mechanism 6 To decide. The movement mechanism 16 moves the pickup mechanism 6 by the above-described movement amount in accordance with an instruction from the movement control unit 18b.

  Thereby, for example, even when the position of the device chip 23 before transfer is shifted, the pickup mechanism 6 can be moved by a moving amount that cancels the shift, and the device chip 23 can be transferred with high accuracy.

  Next, a device transfer method performed using the transfer apparatus 2 described above will be described. In the device transfer method according to the present embodiment, first, a holding step of sucking and holding the wafer 11 on the holding table 4 is performed.

  In this holding step, the dicing tape 19 adhered to the back surface 11b side of the wafer 11 is brought into contact with the upper surface (holding surface) of the holding table 4 to apply a negative pressure of the suction source. As a result, the wafer 11 is sucked and held by the holding table 4 via the dicing tape 19, and the surface 11a side is exposed upward.

  After the holding step, a pickup step for picking up the device chip 23 (device 15) and an imaging step for detecting the characteristic pattern 17 by imaging the device 15 are performed. FIG. 4 is a partial cross-sectional side view schematically showing the pickup step and the imaging step.

  In the pickup step, first, the pickup mechanism 6 is moved in the horizontal direction to position the collet 10 above the device chip 23. Next, the pickup mechanism 6 is lowered to bring the bottom surface 10a of the collet 10 into contact with the surface of the device chip 23 (that is, the surface of the device 15).

  When the negative pressure of the suction source 14 is applied to the suction port 10c in this state, the device chip 23 is sucked and held by the collet 10. Thereafter, as shown in FIG. 4, the pickup mechanism 6 is raised to pick up (take up) the device chip 23 from the dicing tape 19.

  The imaging step can be performed during the pickup step. For example, after the device chip 23 is sucked and held by the collet 10, the device 15 is imaged by the camera 12 attached to the pickup mechanism 6. The captured image captured by the camera 12 is sent to the detection unit 18 a of the control device 18.

  The detection unit 18a extracts a pattern 17 that matches a prestored pattern (not shown) from the captured image, and calculates its position (coordinates). The calculated position of the pattern 17 is notified to the movement control unit 18b. If the imaging step is performed in the middle of the pickup step as in this embodiment, the time required to transfer the device chip 23 can be shortened.

  After the pick-up step, a placement step for placing the picked-up device chip 23 (device 15) in an arbitrary area is performed. FIG. 5 is a partial cross-sectional side view schematically showing the placing step. FIG. 5 shows a state in which the device chip 23 is placed on the wiring layer 33 provided on the support wafer 31.

  In this placement step, first, the pickup mechanism 6 is moved in the horizontal direction, and the device chip 23 (device 15) sucked and held by the collet 10 is positioned on the placement destination region.

  At this time, the movement control unit 18b calculates the amount of displacement of the device chip 23 with respect to the collet 10 based on the position of the pattern 17 notified from the detection unit 18a, and determines the amount of movement of the pickup mechanism 6 in consideration of the amount of displacement. decide. The movement mechanism 16 moves the pickup mechanism 6 in the horizontal direction by the above-described movement amount in accordance with an instruction from the movement control unit 18b.

  Subsequently, as shown in FIG. 5, the pickup mechanism 6 is lowered to bring the back surface of the device chip 23 into contact with the wiring layer 33, and the suction holding of the collet 10 is released. Thereafter, when the pickup mechanism 6 is raised, the device chip 23 remains on the wiring layer 33 and the transfer is completed.

  As described above, in the device transfer method and the device transfer apparatus according to the present embodiment, the device 15 is imaged by the camera (imaging means) 12 attached to the pickup mechanism (pickup means) 6 to obtain a predetermined value. Since the pattern 17 is detected and the pickup mechanism 6 is moved based on the pattern 17, the position of the device chip 23 (device 15) with respect to the pickup mechanism 6 is appropriately determined, and the device chip 23 (device 15) is highly accurate. Can be transferred.

  In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the device transfer method according to the above-described embodiment, the imaging step is performed in the middle of the pickup step, but the device transfer method according to the present invention is not limited to this.

  The imaging step may be performed at least until the horizontal movement of the pickup mechanism 6 is completed in the subsequent placement step. For example, the imaging step can be performed immediately after the placement step is started.

  Moreover, in the said embodiment, although the device transfer apparatus 2 provided with the one set of pick-up mechanism 6 is shown, the device transfer apparatus concerning this invention may be provided with the multiple sets of pick-up mechanism 6. FIG. . In this case, since a plurality of device chips 23 (devices 15) can be transferred simultaneously using a plurality of collets 10 and cameras 12, the time required to transfer all the device chips 23 can be shortened.

  Furthermore, in the device transfer method according to the above embodiment, the wafer 11 (device chip 23) attached to the dicing tape 19 is transferred. It is also possible to transfer a wafer fixed to the support member. Further, the transfer destination is not limited to the support wafer 31 (wiring layer 33).

  In addition, the configurations, methods, and the like according to the above-described embodiments can be changed as appropriate without departing from the scope of the object of the present invention.

11 Wafer 11a Front surface 11b Back surface 13 Scheduled line (street)
DESCRIPTION OF SYMBOLS 15 Device 17 Pattern 19 Dicing tape 21 Frame 23 Device chip 31 Support wafer 33 Wiring layer 2 Transfer apparatus 4 Holding table (holding means)
6 Pickup mechanism (pickup means)
8 Support arm 10 Collet 10a Bottom (bottom)
10b Opening 10c Suction port 12 Camera (imaging means)
14 Suction source 16 Moving mechanism (moving means)
18 Control device (control means)
18a detection unit 18b movement control unit

Claims (3)

A device having a predetermined pattern is formed in each region partitioned by a plurality of intersecting scheduled lines, and the device of the wafer which is divided along the scheduled dividing lines and held by the holding means is placed on the holding means. A method for transferring a device to be transferred from
An imaging step of imaging the device with imaging means attached to a pickup means for picking up the device from the holding means, and detecting the predetermined pattern;
A pickup step of picking up the device from the holding means by the pickup means;
A mounting step of mounting the device picked up by the pickup means at a predetermined position on the basis of the predetermined pattern detected in the imaging step after the pickup step is performed; Device transfer method.   2. The device transfer method according to claim 1, wherein the imaging step is performed during the pickup step. A device transfer apparatus for transferring a device having a predetermined pattern formed in each region divided by a plurality of intersecting division lines and transferring the devices divided along the division lines. ,
Holding means for holding the wafer divided along the division line,
Pick-up means for picking up the device from the wafer held by the holding means;
Moving means for moving the pickup means;
Imaging means attached to the pickup means for imaging the device to be transferred;
A detection unit that detects the predetermined pattern of the device based on a captured image captured by the imaging unit; and a movement control unit that controls movement of the pickup unit based on the predetermined pattern detected by the detection unit. A device transfer device, comprising:

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