JP2015018966A - Imprint apparatus and imprint method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint method or the like, by which a material constituted in a prescribed component ratio can be stably supplied.SOLUTION: An imprint apparatus 100 includes a discharge unit 50 for supplying a resist 2 accommodated in a main tank to an inkjet head 30. In the imprint apparatus, a predetermined gas is supplied to maintain or adjust the resist 2 to a preliminarily prescribed component ratio; and then the resist is supplied to the inkjet head 30.

Description

  The present invention relates to an imprint apparatus and an imprint method.

  In recent years, a pattern forming technique using an imprint method has attracted attention as a fine pattern forming technique that replaces the photolithography technique. The imprint method is a pattern formation technique that uses a mold material (mold) having a fine concavo-convex structure and transfers the concavo-convex structure to the imprint material to transfer the fine structure at an equal magnification. For example, in an imprint method using a photocurable resin composition as an imprint material, a photocurable resin composition is supplied to the surface of a transfer substrate, and a mold having an uneven pattern and a photocurable resin on the surface of the transfer substrate Contact with the composition, pressurize as necessary, fill the concavo-convex pattern with the photocurable resin composition, and in this state irradiate light to cure the photocurable resin composition to form a resin layer Thereafter, by separating the mold from the resin layer, a pattern structure having an uneven structure in which the unevenness provided in the mold is inverted is formed.

  Further, as an imprint apparatus for executing the above imprint method, there is an apparatus that applies a resist to a transfer substrate using an ink jet method (see Patent Document 1). Here, the “resist” refers to the above-described imprint material.

  When applying the resist using the ink jet method, the main tank for storing the resist is detachable and replaceable in consideration of productivity, and the resist is sent from the main tank to the sub tank, and the resist is transferred from the sub tank to the ink jet head. May be supplied.

  By the way, in imprinting, in order to obtain stable ejection by an inkjet head, it is preferable that no foreign matter exists in the resist to be ejected. In addition, in lithography by imprinting, if foreign matter exists in the resist discharged from the ink jet head, it leads to defects in lithography, and therefore it is preferable that no foreign matter exists in the discharged resist.

Japanese Patent No. 4792028

  However, there is no problem if the resist stored in the sub-tank is immediately supplied to the ink jet head and used, but it is in a state of waiting for a predetermined time before actually using a predetermined amount of resist. When this time is a long time, a part of the components volatilizes from the resist, and as a result, there arises a problem that a resist different from the assumed component ratio is discharged from the ink jet head.

  In some cases, a filter capable of removing fine foreign matter may be provided in a communication path that connects the main tank in which the resist is accommodated and the inkjet head. The resist that has passed through the filter and is cleaned is stored in the sub tank. However, when a foreign substance contained in the resist is removed by providing a filter on the communication path, the resist that can pass through the filter per unit time is in a standby state in the sub-tank as the foreign substance to be removed becomes smaller. When this time is a long time, a part of the components volatilizes from the resist, and as a result, there arises a problem that a resist different from the assumed component ratio is discharged from the ink jet head.

  Further, for example, when the resist includes a component in which a solid material is dissolved, there may be a problem that the solid component dissolved by volatilization is solidified again and becomes a foreign substance.

  Accordingly, the present invention has been made with the above problem as an example of the problem, and provides an imprint apparatus and an imprint method capable of stably supplying a material configured with a component ratio defined for an inkjet head. is there.

  In order to solve the above problems, the present invention employs the following configuration.

  That is, the imprint apparatus (100) according to claim 1 uses a discharge unit (50) for discharging the resist (2) to the transfer substrate (51) and a mold material (55) on which the concave / convex pattern (55a) is formed. A transfer unit (60) for transferring the uneven pattern onto the transfer substrate by molding the resist, and the discharge unit includes a main tank (4) for storing the resist, A sub tank (21) capable of storing the resist supplied from the main tank, a gas supply unit (G) for supplying a gas for suppressing volatilization of the resist to the sub tank, and the resist supplied from the sub tank. And an inkjet head (30) that discharges water.

  Moreover, the imprint apparatus according to claim 2 is the imprint apparatus according to claim 1, wherein the discharge unit is a filter unit (10) for removing foreign substances contained in the resist supplied from the main tank. Is further provided.

  The imprint apparatus according to claim 3 is the imprint apparatus according to claim 1 or 2, wherein the gas is a gas obtained by volatilizing at least one component contained in the resist. It is characterized by.

  The imprint apparatus according to claim 4 is the imprint apparatus according to any one of claims 1 to 3, wherein the discharge unit is a stirring unit that stirs the resist stored in the sub tank. 26).

  The imprint method according to claim 5 is an imprint method in which a resist discharged from an ink jet head is molded using a mold material on which a concavo-convex pattern is formed, and the imprint method before discharging from the ink jet head is performed. A gas for suppressing volatilization of the resist is supplied to a sub tank capable of storing the resist, and the resist in the sub tank is supplied to the inkjet head.

  According to the present invention, a resist composed of a predetermined component ratio can be discharged from an ink jet head.

It is a schematic diagram which shows the imprint apparatus which concerns on one Embodiment of this invention. It is a schematic diagram which shows the concept of the ink supply system in a discharge unit. It is a schematic diagram which shows the other Example of a filter unit. It is a schematic diagram which shows the concept of another ink supply system. It is a schematic diagram which shows the concept of another ink supply system. It is a schematic diagram which shows the concept of another ink supply system. It is process sectional drawing which shows the imprint method which concerns on one Embodiment of this invention.

  Hereinafter, the best embodiment of the present invention will be described with reference to the drawings.

<Imprint device>
(First embodiment)
As shown in FIG. 1, an imprint apparatus 100 according to an embodiment of the present invention includes a discharge unit 50 that discharges droplets of a resist 2 onto a transfer substrate 51, and a mold material (hereinafter, “ A transfer unit 60 for forming the resist 2 using a mold 55 and transferring the uneven pattern 55a onto the transfer substrate 51. Since the discharge unit 50 will be described in detail later, a part of the illustration is omitted for convenience of explanation.

  The transfer unit 60 includes a stage 62 that holds the transfer substrate 51 and can move in the horizontal direction, a holding body 64 that holds the mold 55 opposite to the transfer substrate 51, and an arrow in FIG. The mold 55 is brought into contact with the resist 2 supplied to the transfer substrate 51, the moving unit (not shown) for separating the mold 55 from the resist 2, and the transfer substrate 51 supplied with droplets of the resist 2 on the surface. And an irradiation unit 70 for irradiating light L that hardens the resist 2 when contacting 55.

  Then, the mold 55 is attached to the transfer substrate 51 on which the droplets of the resist 2 are arranged, which is obtained by the stage 62 moving below the discharge unit 50 and appropriately discharging the resist 2 from the discharge unit 50. The resist 2 is filled between the mold 55 and the transfer substrate 51 by using a capillary force or the like. In this state, the resist 2 is irradiated with light L from the mold side by the irradiation unit 70, so that the resist 2 is cured and molded, and the uneven pattern 55 a is transferred to the transfer substrate 51. The transfer substrate 51 is taken out by separating the mold 55 after the resist 2 is molded.

  The transfer unit of the imprint apparatus 100 can employ a general mechanism, and detailed description of each component is omitted. The imprint apparatus 100 according to the present embodiment is configured to use a transparent member for the mold 55 and provide the irradiation unit 70 on the mold side to irradiate the resist 2 with the light L. However, the imprint apparatus 100 is transparent to the transfer substrate 51. Using a member, the irradiation unit 70 may be provided on the transfer substrate side to irradiate the resist 2 with the light L.

  Further, in the imprint apparatus 100, the transfer substrate 51 and the stage 62 do not move as described above, but the mold unit including the discharge unit 50 and the holding body 64 may move.

  On the other hand, as shown in FIG. 1, the ejection unit 50 includes an inkjet head 30, and droplets of the resist 2 are ejected from the nozzles 31 of the inkjet head 30 onto the surface of the transfer substrate 51.

  As shown in FIG. 2, the discharge unit 50 includes a main tank 4 that accommodates the resist 2 disposed upstream, and a filter unit 10 that removes foreign substances contained in the resist 2 fed from the main tank 4. A sub tank 21 that temporarily stores the resist 2 cleaned by the filter unit 10, a gas supply device G that supplies a gas for component adjustment to the resist 2 stored in the sub tank 21, and a supply from the sub tank 21 And an inkjet head 30 for discharging the resist 2 to be discharged.

  In addition, this filter unit 10 is not essential and is provided as needed. That is, the resist 2 supplied to the main tank 4 has been cleaned in advance, and in particular, it may be removed if it is not necessary to clean it in the communication path connecting the main tank 4 and the inkjet head 30.

  In the discharge unit 50, the resist 2 in the main tank 4 located upstream is sent to the inkjet head 30 located downstream.

  Here, for example, a photocurable resin composition is used for the resist 2, and the resist 2 is cured by irradiating a predetermined light L.

  The discharge unit 50 of the present embodiment maintains the component ratio of the resist 2 by supplying a predetermined gas to the resist 2 stored in the sub-tank 21 after removing the foreign matter contained in the resist 2 by the filter unit 10. Alternatively, after the adjustment, the resist 2 adjusted to the specified component ratio is supplied to the inkjet head 30.

  The inkjet head 30 includes a nozzle 31 for discharging the resist 2, and the discharge amount of the resist 2 from the nozzle 31 is controlled by a control unit (not shown). In addition, since the structure of the inkjet head 30 is conventionally well-known, the detailed description shall be abbreviate | omitted.

  Hereinafter, each component of the discharge unit 50 will be described.

  The main tank 4 has a case that is sealed in order to prevent, for example, volatilization of components contained in the resist 2 and mixing of foreign substances, and the resist 2 is accommodated in this case. A first flow path 6 communicating with the filter unit 10 is attached to the main tank 4, and a pump P 1 for sending the resist 2 from the main tank 4 to the filter unit 10 is attached to the first flow path 6. Is provided. The first flow path 6 is formed by a tubular member such as a tube, and the resist 2 flows through the tube by the action of the pump P <b> 1 and is sent out to the filter unit 10. The resist 2 may be sent out by air pressure instead of the pump P1.

  The filter unit 10 includes a filter 10a corresponding to one or a plurality of uses for the purpose of removing at least one of ions, particles, and dissolved gas.

  A second flow path 7 formed of a tubular member such as a tube communicating with the sub tank 21 is attached to the filter unit 10, and the resist 2 that has been cleaned by passing through the filter 10 a is removed by the action of the pump P 1. It flows through this tube and is supplied to the sub tank 21.

  For example, a cartridge-type filter formed in a mesh (mesh) shape is used as the filter 10a, and foreign matter contained in the resist 2 is captured by the mesh. The size and shape of the mesh are appropriately set according to the intended use.

  In such a filter 10a, the finer the mesh, the larger the pressure loss. For example, when the filtration accuracy of the filter 10a is about 10 nm, there is a possibility that the resist 2 supplied to the sub tank 21 is insufficient. Therefore, in such a case, it is preferable to arrange a plurality of filtration systems in parallel.

  At this time, it is preferable to perform piping so that the number of joint portions for paralleling the systems is minimized. Moreover, it is preferable that the internal diameter of piping is the same. This is to ensure that the resist 2 always flows in one direction inside the pipe, and to prevent the stay and backflow due to the flow resistance.

  For example, the sub tank 21 is sealed to prevent volatilization of components contained in the resist 2 and mixing of foreign substances, and includes a housing having a space 21a in which the resist 2 can be temporarily stored. The resist 2 that has been turned into a temporary state is stored. A third path 8 that communicates with the inkjet head 30 is attached to the sub tank 21, and a pump P 2 for sending the resist 2 from the sub tank 21 to the inkjet head 30 is provided in the third path 8. . The third path 8 is formed by an annular member such as a tube, and the resist 2 stored in the sub tank 21 flows through the tube by the action of the pump P2 along with the driving of the ink jet head 30 to the ink jet head 30. Sent out.

  Further, the imprint apparatus 100 according to the present embodiment starts filtering based on a discharge request from the inkjet head 30 in order to prevent the components in the resist 2 from aggregating due to staying. In particular, this filtering is started. When the resist 2 is not supplied to the space portion 21a of the sub tank 21 or when the total amount of the resist 2 is small, some components are volatilized from the resist 2 to the space portion 21a. There is a concern that the resist 2 having a different component ratio may be discharged from the inkjet head 30. Therefore, in this embodiment, the gas supply unit G that supplies the space 21a of the sub tank 21 with a volatilization suppression gas that reduces the vapor pressure of the resist 2 and suppresses volatilization of volatile components (for example, monomer components). By supplying a predetermined gas to the space portion 21a of the sub tank 21 and making the resist 2 components less likely to volatilize, the resist 2 having a different component ratio or containing foreign matter is discharged from the inkjet head 30. Is preventing.

  As shown in FIG. 2, the gas supply unit G includes a storage tank T that stores a predetermined gas, and can supply gas to the sub tank 21 via the supply path 23.

  This gas is a gas obtained by volatilizing at least one component contained in the resist 2 (hereinafter referred to as “volatile gas”). The volatile gas is preferably a gas obtained by volatilizing the most volatile component.

For the purpose of stabilization, an inert gas such as He, N ₂ , Ar, or a supply gas used during imprinting may be supplied together with the volatile gas. For example, by passing the gas through the liquid, a gas containing a volatile component of the liquid as a partial pressure can be obtained. However, if this gas is fed, the gas supply becomes simple.

  Moreover, oxygen may be included in the volatile gas for the purpose of preventing the aggregation of the resist 2 in the sub tank 21.

  The gas supplied to the sub tank 21 is appropriately selected from the above components or a gas containing a plurality of components selected from the above components.

  The sub tank 21 is provided with, for example, a sensor for detecting the liquid level of the resist 2, and the liquid level is kept substantially constant by driving the pump P1 when the level is lower than a predetermined liquid level position. Be drunk. This is because if the total amount of the resist 2 is too small, the resist 2 tends to stay and cause aggregation.

  In the imprint apparatus 100 according to the present embodiment, as shown in FIG. 2, the head surface 30 a of the inkjet head 30 is disposed higher than the liquid level A of the resist 2 in the sub tank 21. The negative pressure acts on the resist in the ink jet head 30 by utilizing the water head difference h between the head surface 30a and the head surface 30a. The negative pressure prevents the resist from leaking out of the ink jet head 30.

  It is not essential to provide a pump that plays a role of supplying the resist 2 to the inkjet head 30 between the inkjet head 30 and the sub tank 21. For example, the present invention is applied to a case where a sufficient water head difference h cannot be obtained, a case where the resist 2 is supplied to the ink jet head 30 or a suck back for reliably preventing the resist 2 from leaking. It will be. The same applies to the following embodiments.

  Further, in order to improve cleanliness, the filter unit 10 may include a circulation path 11 for supplying the resist 2 that has passed through the filter 10a to the filter 10a again, as shown in FIG. The circulation path 11 is formed of a tubular member such as a tube, and communicates with the valve 12 in the middle of the second path 7. When the resist 2 is again passed through the filter 10a, the valve 12 blocks the path that communicates with the sub tank 21. When the resist 2 that has passed through the filter 10a is supplied to the sub tank 21, the valve 12 returns to the filter 10a. Block the route.

  However, when connecting and shutting off the pipes by operating these valves 12 and the like, it is preferable that the inside of each pipe is filled with a liquid such as the resist 2 or the cleaning liquid of the resist 2. This is in order to avoid a solid matter caused by the liquid remaining in the pipe due to drying and being included in the resist 2 when the pipe is used again. This can be said for all the contacts with the resist 2 such as the piping of the present embodiment. Therefore, it is preferable to have a valve capable of sealing the liquid, and a sensor for confirming the remaining liquid may be provided as necessary.

  According to such an imprint apparatus 100, even when the ratio of components constituting the resist 2 can change due to volatilization of some components in the sub tank 21, the resist 2 can be supplied by supplying a predetermined gas. Is maintained or adjusted to the prescribed component ratio, the inkjet head 30 can be supplied with the resist 2 configured with the assumed component ratio.

  In the above description, a pump is used to transport the resist 2. However, other methods such as a method of sending out the resist 2 by pressurizing the liquid surface by air pressure or the like can be considered. For example, in this embodiment, a gas for suppressing volatilization (for component adjustment) is sent to the sub tank 21 so that the resist 2 is not easily volatilized. The resist 2 may be sent to 30 or the same method may be used for the main tank 4. Thereby, even if it is a case where the resist 2 is transported by air pressure without using a pump, it becomes possible to suppress the change of a component. The same applies to the following embodiments.

(Second Embodiment)
Next, an embodiment in which the stirring unit 26 is provided in the first embodiment will be described with reference to FIG. This embodiment is different from the first embodiment only in the presence or absence of the stirring unit 26, and the other configurations are basically the same. Therefore, only the agitation unit 26 will be described, the same parts shown in the above embodiment are indicated by the same reference numerals, and the description thereof is also omitted.

  As shown in FIG. 4, the imprint apparatus 100 according to the present embodiment includes a stirring unit 26 that stirs the resist 2 stored in the sub tank 21 in order to prevent agglomerates from being generated in the resist 2 due to staying or the like. It has.

  The stirring unit 26 includes, for example, a stirring member 27 that is provided in the sub tank 21 and functions as a screw, and a drive device M that rotationally drives the stirring member 27.

  For the stirring member 27, for example, a member called a stirrer that is driven by a blade connected to a shaft attached to the driving device M or an electromagnetic force is used. Moreover, it is preferable that the rotation speed of the stirring member 27 is appropriately set so that the flow rate is as high as possible and the stirred resist does not foam. For example, the rotation speed of the stirring member 27 may be controlled to 50 to 500 rpm.

  In this way, in the imprint apparatus 100 according to the present embodiment, after the foreign matters contained in the resist 2 are removed by the filter unit 10, the resist 2 stored in the sub tank 21 is stirred in the sub tank 21 by the stirring unit 26. This prevents agglomerates from occurring in the resist 2 in the sub tank 21 due to retention or the like.

(Third embodiment)
Next, an embodiment in which the stirring unit 26 is changed will be described with reference to FIG. The present embodiment is different from the second embodiment only in the stirring unit 26, and the other configurations are basically the same. Therefore, only differences from the agitation unit 26 will be described, and the same parts shown in the above embodiment will be denoted by the same reference numerals, and description thereof will also be omitted.

  The stirring unit 26 stirs the resist 2 in the sub-tank 21, whereas the stirring unit 26 </ b> A of this embodiment sends the resist 2 in the sub-tank 21 to the outside and then returns it to the sub-tank 21 again. Different.

  As shown in FIG. 5, the stirring unit 26 </ b> A according to the present embodiment includes a circulation path 22 that sends the resist 2 in the sub tank 21 to the outside and returns it to the sub tank 21 again. The circulation path 22 is communicated with the third path 8 via the valve 29 on the way. The valve 29 shuts off the supply of the resist 2 to the ink jet head 30 when circulating the resist 2 in the sub tank 21, and the sub tank 21 when supplying the resist 2 in the sub tank 21 to the ink jet head 30. Block the route back to

  The circulation path 22 is provided with a pump P2 for sending out the resist 2 in the sub tank 21. The circulation path 22 is formed by a tubular member such as a tube, and the resist 2 flows in the tube and is sent out to the ink jet head 30 by the action of the pump P2, or in the sub tank 21 through the tube. Returned to.

  Further, the flow rate of the resist 2 flowing through the circulation path 22 is preferably as high as possible so as not to pulsate, and is appropriately controlled within a range of, for example, 10 to 100 mm / sec.

  Further, the viscosity of the resist 2 is preferably low so that the viscosity of the resist 2 can respond to the flow rate and the pressure loss can be minimized. For example, the viscosity is appropriately set in the range of 4 to 15 cps, and more preferably, The range is 4 to 10 cps.

  In this way, in the imprint apparatus 100 according to the present embodiment, after the foreign matters contained in the resist 2 are removed by the filter unit 10, the resist 2 stored in the sub tank 21 is circulated and stirred by the stirring unit 26. Thus, aggregates are prevented from occurring in the resist 2 in the sub tank 21 due to retention or the like.

(Fourth embodiment)
Next, an embodiment showing another aspect of the discharge unit 50 will be described with reference to FIG. This embodiment is different from the above-described embodiment only in the positional relationship between the ink jet head 30 and the sub tank 21, and the other configurations are basically the same. Therefore, only differences from the above-described discharge unit 50 will be described, and the same parts shown in the above embodiment will be denoted by the same reference numerals, and description thereof will also be omitted.

  First, the head management and the principle of the inkjet discharge unit 50 will be described.

  In the discharge unit 50 of the above embodiment, the head surface 30a of the inkjet head 30 is set higher than the liquid surface A of the sub tank 21, and the water head difference h between the liquid surface A and the head surface 30a is used. Resist leakage from the inkjet head 30 is prevented. The same effect can be obtained when the head surface 30a of the inkjet head is set to the same height as the liquid surface A of the sub tank 21.

  On the other hand, when the head surface 30a of the inkjet head 30 is at a position lower than the liquid surface A of the sub tank 21 as in the discharge unit 50A of the present embodiment shown in FIG. 6, the liquid surface A and the head surface 30a Since the resist leaks from the ink jet head 30 due to the water head difference h, it is necessary to control the pressure in the ink chamber of the ink jet head to a negative pressure. Therefore, in this embodiment, the negative pressure is controlled in the sub tank 21.

  That is, a pump P3 for controlling the inside of the housing to a negative pressure is attached to the sub tank 21, and the pressure in the housing is always controlled to a negative pressure by driving the pump P3.

  According to the discharge unit 50 </ b> A of the present embodiment configured as described above, leakage of the resist 2 from the ink jet head 30 can be prevented.

  As described above, the discharge units 50 and 50A of the present embodiment are volatile gases in which at least one component contained in the resist 2 is volatilized in the sub tank 21 communicating with the inkjet head 30 via the third path 8. Is provided in the inkjet head 30 by supplying the volatile gas into the sub tank 21 and maintaining or adjusting the component ratio of the resist 2. The resist 2 thus prepared is supplied.

  In addition, this invention is not limited to the said embodiment, A various change is possible within the range of the summary of this invention. For example, in this embodiment, a pump is used for sending out the resist, but it may be sent by air pressure. Further, in the present embodiment, as described in the second and third embodiments, the resist 2 after passing through the filter unit 10 is prevented by the stirring units 26 and 26A so as to prevent the resist 2 from aggregating due to stagnation. However, the resist 2 before passing through the filter unit 10 may be further stirred. In this case, a storage tank may be provided in the first path 6 that connects the main tank 4 and the filter unit 10, and a stirring unit 26 may be provided in the storage tank. Furthermore, the first to fourth embodiments can be appropriately combined.

<Imprint method>
An imprint method according to an embodiment of the present invention will be described with reference to FIG.

  The imprint method of the present embodiment is preferably executed by using the imprint apparatus 100 described above.

  First, the resist 2 cleaned on the transfer substrate 51 is supplied from the nozzle 31 of the inkjet head 30 (FIG. 7A). As described in the above-described embodiment, the resist 2 supplied to the transfer substrate 51 is supplied with a predetermined gas to the space portion 21a of the sub tank 21 by the gas supply unit G, and the component ratio of the resist 2 is defined in advance. Maintained or adjusted to the desired component ratio.

  Next, the mold 55 is brought close to the transfer substrate 51, the mold 55 having the concavo-convex pattern 55 a formed thereon is brought into contact with the resist 2, and the resist 2 is filled between the transfer substrate 51 and the mold 55. If necessary, after bringing the mold 55 into contact with the resist 2, a pressure may be applied to the resist 2 by further applying a force to the mold 55 (FIG. 7B).

  Next, the resist 2 is cured by irradiating the resist 2 with light L that cures the resist 2 using the irradiation unit 70 while maintaining the position of the mold 55 with respect to the transfer substrate 51 (FIG. 7C). .

  Next, the mold 55 is separated from the transfer substrate 51, and the resin pattern 2A is formed on the transfer substrate 51 (FIG. 7D).

  Then, if necessary, the remaining film 2a of the resin pattern 2A is removed by etching or the like (FIG. 7E). If necessary, the transfer substrate 51 may be further processed based on the resin pattern 2A to produce a replica mold, a magnetic recording medium, a semiconductor device, or the like. Further, when it is only desired to obtain a concavo-convex structure with the cured resist 2, it is not always necessary to remove the remaining film 2a. For example, it can be applied to anti-counterfeiting processing for the purpose of manufacturing optical members such as antireflection films and holograms, and forming random structures.

  According to the imprint method of this embodiment according to such an embodiment of the present invention, even in a situation where the ratio of components constituting the resist 2 can change due to volatilization of some components in the sub tank 21, Since the resist 2 is maintained or adjusted to a predetermined component ratio by supplying a predetermined gas, the ink-jet head 30 is supplied with the resist 2 configured with the assumed component ratio. The resin pattern 2 </ b> A can be formed with the resist 2 configured with the component ratio.

G gas supply unit 2 resist 4 main tank 10 filter unit 21 sub tank 26 agitation unit 30 inkjet head 50 discharge unit 51 transfer substrate 55 mold 60 transfer unit 100 imprint apparatus

Claims (5)

A discharge unit for discharging the resist onto the transfer substrate;
In an imprint apparatus comprising: a transfer unit that transfers the concavo-convex pattern onto the transfer substrate by molding the resist using a mold material on which the concavo-convex pattern is formed.
The discharge unit is
A main tank containing the resist;
A sub-tank capable of storing the resist supplied from the main tank;
A gas supply unit for supplying a gas for suppressing volatilization of the resist to the sub tank;
An inkjet head for discharging the resist supplied from the sub tank;
An imprint apparatus comprising:   The imprint apparatus according to claim 1, wherein the discharge unit further includes a filter unit that removes foreign matters contained in the resist supplied from the main tank.   The imprint apparatus according to claim 1, wherein the gas is a gas obtained by volatilizing at least one component contained in the resist.   4. The imprint apparatus according to claim 1, wherein the discharge unit further includes a stirring unit that stirs the resist stored in the sub tank. 5. An imprint method for molding a resist discharged from an inkjet head using a mold material on which an uneven pattern is formed,
A gas for suppressing volatilization of the resist is supplied to a sub tank capable of storing the resist before being discharged from the ink jet head, and the resist in the sub tank is supplied to the ink jet head. How to print.

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