JP2015011491A - Input device and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an input device capable of realizing the narrowing down of a frame and also capable of improving the effect of shielding by a conductor layer.SOLUTION: An input device 10 according to the present invention has a base substance 30, an electrode 31 provided on the base substance 30, a leader wiring 36 connected to the electrode 31, and a conductor layer 50, the input device 10 being characterized in that the leader wiring 36 and the conductor layer 50 are arranged on the same surface of the base substance 30 adjacent to each other with a space therebetween, and the thickness of the conductor layer 50 is greater than the thickness of the leader wiring 36.

Description

  The present invention relates to an input device for detecting input position information and a method for manufacturing the same, and more particularly to an input device provided with a conductor layer and a method for manufacturing the same.

  In electronic devices such as smartphones, mobile phones, and personal computers, a translucent input device is disposed on the surface of a display device (liquid crystal display or the like). Patent Document 1 discloses an input device that is less affected by electromagnetic noise entering from the outside by providing a conductor layer as such an input device.

  FIG. 9 is a partially enlarged sectional view of the input device of the first conventional example described in Patent Document 1. As shown in FIG. 9, a first conventional input device 110 includes a translucent base material 130, a plurality of first electrodes 131 and a plurality of second electrodes formed on the base material 130 (FIG. 9). 9 shows only a connecting portion 134 for connecting a plurality of second electrodes). In addition, a lead wire 136 is connected to the first electrode 131 and the plurality of second electrodes, and the lead wire 136 is formed in the non-input region 116 of the base material 130.

  In the input device 110 of the first conventional example, a capacitance is formed between the first electrode 131 and the second electrode (not shown). During an input operation, when an operator brings a detected object such as a finger into contact with the input region 115 of the input device 110 or approaches it without bringing it into contact, the first electrode 131 and the second electrode Based on this, the input position information can be detected.

  Since the detected input position information is transmitted to an external circuit (not shown) through the lead wiring 136, if electromagnetic noise enters from outside and superimposes on the lead wiring 136, it is confused with the input position information, A malfunction occurs. As shown in FIG. 9, in the input device 110 of the first conventional example, the conductor layer 150 is disposed so as to overlap the lead-out wiring 136 via the interlayer insulating layer 135. Thereby, the electromagnetic noise which invades from the outside of the input operation side can be shielded.

JP 2011-028535 A Special table 2012-530992 gazette

  As shown in FIG. 9, the conductor layer 150 is formed at a position overlapping the lead wiring 136 via the interlayer insulating layer 135 and is continuous from the upper surface 135 a to the side surface 135 b and the surface of the base material 130 of the interlayer insulating layer 135. Is formed. The conductor layer 150 is routed around the surface of the substrate 130 and connected to an external circuit (not shown). As a result, the potential of the conductor layer 150 can be controlled to a predetermined value, and the capacitance formed between the conductor layer 150 and the lead-out wiring 136 can be controlled.

  However, as shown in FIG. 9, since the interlayer insulating layer 135 is provided to cover the unevenness formed by the lead wiring 136 and the electrode 131, a pinhole may occur when the interlayer insulating layer 135 is formed. When the conductor layer 150 and the lead-out wiring 136 are conducted through the pinhole, the noise that has entered the conductor layer 150 is transmitted to the lead-out wiring 136, which causes a problem that the shielding effect of the conductor layer 150 cannot be obtained.

  Further, the thickness of the conductor layer 150 on the side surface 135b of the interlayer insulating layer 135 is formed thinner than the thickness of the conductor layer 150 on the upper surface 135a of the interlayer insulating layer 135 and the surface of the base material 130. Therefore, the conductor layer 150 may be disconnected due to a step between the interlayer insulating layer 135 and the base material 130. When disconnection occurs, the potential of the conductor layer 150 cannot be controlled, and the capacitance between the conductor layer 150 and the lead-out wiring 136 is likely to fluctuate. As a result, a decrease in detection sensitivity or erroneous detection may occur.

  Patent Document 2 describes a capacitive sensor capable of detecting the approach or position of an operator's finger or the like. FIG. 10 shows an input device of a second conventional example described in Patent Document 2, FIG. 10 (a) is a partially enlarged plan view showing an electrode configuration, and FIG. 10 (b) is shown in FIG. It is a partial expanded sectional view when it cut | disconnects by the XX line of a) and it looked at from the arrow direction.

  As shown in FIGS. 10A and 10B, sensor electrodes 231 and 232 and a plurality of lead wires 236 are formed on one surface of the base material 230. In addition, the conductor layer 250 is formed on the same surface as the surface on which the sensor electrodes 231 and 232 and the plurality of lead wires 236 are formed, and the conductor layer 250 and the lead wires 236 are arranged with a space therebetween. As shown in FIG. 10B, the input device 210 is used by being overlapped with a display device 270 such as a liquid crystal display, and the lead-out wiring 236 and the conductor layer 250 are not input so that the image of the display device 270 cannot be visually recognized. A region 216 is formed.

  According to this, since the conductor layer 250 is formed on the same surface as the lead-out wiring 236 and the sensor electrodes 231, 232, there is a problem of disconnection of the conductor layer 150 in the input device 110 of the first conventional example, and interlayer insulation. There is no problem that the conductor layer 150 and the lead-out wiring 136 are electrically connected through the pinhole of the layer 135.

  However, as shown in FIG. 10B, the conductor layer 250 is formed with the same thickness as the lead wiring 236, and the upper portion of the lead wiring 236 is not covered with the conductor layer 250. Therefore, it is difficult to sufficiently obtain the effect of shielding the electromagnetic noise entering from the outside or the effect of shielding the influence of the lead wiring 136 on the sensor electrodes 231 and 232 by the conductor layer 250. Therefore, as shown in FIG. 10A, it is necessary to improve the shielding effect by forming the conductor layer 250 wider than the width of the lead wiring 236. Therefore, in the input device 210 of the second conventional example, the area of the non-input region 216 of the input device 210 becomes large, and there is a problem that it is difficult to narrow the frame.

  An object of the present invention is to solve the above-described problems and provide an input device capable of realizing a narrow frame and improving a shielding effect by a conductor layer.

  The input device of the present invention includes a base material, an electrode provided on the base material, a lead wire connected to the electrode, and a conductor layer. The lead wire and the conductor layer include the base The conductor layers are arranged adjacent to each other with a gap on the same surface, and the thickness of the conductor layer is larger than the thickness of the lead-out wiring.

  According to this, the lead-out wiring and the conductor layer are arranged adjacent to each other with an interval on the same surface of the base material. Therefore, since the conductor layer is not provided at the step portion between the interlayer insulating layer and the base material as in the first conventional input device, the conductor layer is disconnected at the step portion between the interlayer insulating layer and the base material. Absent. In addition, since the conductor layer is not provided so as to overlap the lead wiring via the interlayer insulating layer, the lead wiring and the conductor layer can be prevented from conducting through the pin hole of the insulating layer.

  Since the lead-out wiring and the conductor layer are arranged adjacent to each other with a space on the same surface of the substrate, electromagnetic noise entering from the side of the lead-out wiring is shielded. And since the thickness of the conductor layer is thicker than the thickness of the lead-out wiring, the electromagnetic noise entering from the oblique direction above the lead-out wiring can be effectively shielded by the portion of the conductor layer formed thicker than the lead-out wiring. it can. Therefore, the shielding effect of the conductor layer can be improved without increasing the plane area of the conductor layer, and a narrow frame of the input device can be realized.

  Therefore, according to the input device of the present invention, it is possible to realize a narrow frame and improve the shielding effect by the conductor layer.

  In the input device of the present invention, the conductor layer has a laminated structure of a first conductor layer and a second conductor layer, and the first conductor layer has the same thickness as the lead-out wiring. It is preferable that the second conductive layer is provided on the base material, and the second conductive layer is provided on the first conductive layer. According to this, by providing the second conductor layer as a raised layer, the thickness of the conductor layer can be reliably increased, and electromagnetic noise entering from the outside can be shielded by the second conductor layer. it can.

  In the input device according to the aspect of the invention, the lead-out wiring includes a base layer made of the same material as the electrode, and a metal layer laminated on the base layer, and the first conductor layer includes the lead-out wiring. It is preferable to have the same laminated structure. According to this, a 1st conductor layer can be formed in the same process as extraction wiring, and manufacturing cost can be reduced.

  In the input device of the present invention, the electrode is disposed in the input region of the base material, a plurality of the lead wires are disposed in a non-input region outside the input region, and the conductor layer is formed of the plurality of lead wires. It is preferable to arrange in the non-input area outside. According to this, the electromagnetic noise which invades from the side of the input device can be effectively shielded.

  In the input device according to the aspect of the invention, it is preferable that the plurality of lead wires are arranged adjacent to each other with a space therebetween, and the conductor layer is arranged between the lead wires adjacent to each other. is there. According to this, electromagnetic noise between adjacent lead wires can be shielded by the conductor layer, and malfunctions and erroneous detection due to interference between the lead wires can be prevented. Further, by controlling the conductor layer to a predetermined potential, the capacitance formed between the lead-out wiring and the conductor layer can be controlled to a predetermined value. Therefore, it is possible to prevent malfunction or erroneous detection due to a capacitance change between the lead wires or between the lead wires and the detection target (for example, a finger).

  In the input device according to the aspect of the invention, it is preferable that the conductor layer is disposed between the plurality of lead wires and the electrode. According to this, since the space between the lead wire and the electrode is shielded by the conductor layer, the capacitance between the electrodes in the input region is prevented from changing due to the influence of the signal transmitted through the lead wire, It is possible to prevent malfunctions and detection errors.

  A method for manufacturing an input device according to the present invention is a method for manufacturing an input device having a base material, an electrode provided on the base material, a lead-out wiring connected to the electrode, and a conductor layer. Forming the lead-out wiring and the first conductor layer adjacent to each other on the same surface of the material, and providing a second conductor layer on the first conductor layer; Forming a conductor layer comprising one conductor layer and the second conductor layer, wherein the conductor layer is formed thicker than the lead wiring. According to this, the first conductor layer and the lead wiring can be formed in the same process, and the manufacturing cost can be reduced. Further, by providing the second conductor layer on the first conductor layer, the conductor layer can be formed thicker than the lead-out wiring, and the electromagnetic waves entering from the outside can be obtained without increasing the plane area of the conductor layer. The shielding effect against noise can be improved.

  According to the input device and the manufacturing method of the present invention, it is possible to realize a narrow frame and improve the shielding effect by the conductor layer.

It is a disassembled perspective view of the input device in the embodiment of the present invention. It is a top view of the input device of this embodiment. It is sectional drawing when it cut | disconnects by the III-III line | wire of FIG. It is a partial enlarged plan view which expands and shows a conductor layer and extraction wiring which constitute an input device of this embodiment. It is a partial expanded sectional view when it cut | disconnects by the VV line | wire of FIG. 4, and it sees from the arrow direction. It is a partial expanded sectional view which shows the 1st modification of this embodiment. It is a partial expanded sectional view which shows the 2nd modification of this embodiment. It is process drawing for demonstrating the manufacturing method of the input device of this invention. It is a partial expanded sectional view which shows the input device of the 1st prior art example. (A) The partial expanded sectional view in the input device of the 2nd prior art example, (b) It is a partially expanded sectional view when cut | disconnected by the XX line of Fig.10 (a) and seeing from the arrow direction.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. In addition, the dimension of each drawing is changed and shown suitably.

<Input device>
FIG. 1 is an exploded perspective view showing the input device of the present embodiment. As shown in FIG. 1, the input device 10 of this embodiment includes a base material 30 and a surface panel 21, and the base material 30 and the surface panel 21 are bonded together via an adhesive layer 24. The base material 30 is a film sensor capable of detecting an input position, and the front panel 21 is disposed on the input operation side (Z1 direction in FIG. 1) of the base material 30. The operator can perform an input operation in a state in which a detection target such as a finger is brought into contact with the input surface 21a of the front panel 21 or close to the input surface 21a.

  The front panel 21 is formed in a flat plate shape using a translucent glass material or a resin material. As shown in FIG. 1, a colored decorative layer 22 is provided on the back surface (the surface in the Z2 direction of FIG. 1) of the front panel 21, and the decorative layer 22 has a frame shape at the outer peripheral portion of the front panel 21. Is provided. An area divided by the decoration layer 22 and surrounded by the decoration layer 22 is an input area 15 for performing an input operation. Further, a region that overlaps the decoration layer 22 outside the input region 15 is a non-input region 16.

  The front panel 21 is not limited to a flat plate shape as shown in FIG. 1, and may have a three-dimensional surface shape with a curved surface, or a part of the casing of the electronic device may be the front panel 21. . The decorative layer 22 may be prepared directly on the front panel 21, or a separate decorative film provided with the decorative layer 22 may be prepared and bonded to the front panel 21.

  FIG. 2 is a plan view of the input device of this embodiment, and is a plan view showing each electrode, lead-out wiring, and conductor layer formed on the substrate. FIG. 3 is a cross-sectional view of the input device when the input device shown in FIG. 1 is assembled and cut along the line III-III in FIG.

  As shown in FIGS. 2 and 3, the input device 10 of this embodiment includes a base material 30, a first electrode 31 and a second electrode 32 provided on the base material 30, a first electrode 31, and And a lead-out wiring 36 connected to the second electrode 32. Further, the base material 30 is provided with a conductor layer 50 on the same surface as the surface on which the lead wirings 36 are formed.

  As shown in FIG. 2, the first electrode 31 and the second electrode 32 are rhombic pad electrodes, and are formed in the input region 15 of the substrate 30. The first electrodes 31 are arranged at intervals in the X1-X2 direction, and the first electrodes 31 adjacent in the X1-X2 direction are connected to each other by a bridge portion 33. The plurality of connected first electrodes 31 extend in the X1-X2 direction, and a plurality of first electrodes 31 are arranged at intervals in the Y1-Y2 direction. The second electrodes 32 are arranged at intervals in the Y1-Y2 direction, and the second electrodes 32 adjacent to each other in the Y1-Y2 direction are connected to each other by a narrow connecting portion 34. The plurality of connected second electrodes 32 extend in the Y1-Y2 direction, and a plurality of second electrodes 32 are arranged at intervals in the X1-X2 direction.

  As shown in FIG. 2, the plurality of connected first electrodes 31 and the plurality of connected second electrodes 32 are formed so as to cross each other. Further, as shown in FIG. 3, a bridge portion insulating layer 35 is provided so as to cover the connecting portion 34 at a portion where the connecting portion 34 and the bridge portion 33 intersect, and the connecting portion 34 and the bridge portion insulating layer 35 are provided. A bridge portion 33 is formed across the bridge. As shown in FIG. 3, the first electrodes 31 arranged so as to sandwich the connecting portion 34 in the X1-X2 direction are connected by a bridge portion 33.

  As shown in FIG. 2 and FIG. 3, the first electrode 31 and the second electrode 32 are formed in a state of being insulated from each other, and are electrostatically connected between the first electrode 31 and the second electrode 32. A capacitance is formed. When the operator performs an input operation, the first electrode 31 and the second electrode are brought into contact with a detection target such as a finger or the like, without touching the input region 15 on the surface of the front panel 21. The electrostatic capacity between the electrodes 32 and 32 and the electrostatic capacity formed between the electrodes 31 and 32 and the detection target are combined. Input position information is detected based on this capacitance change. The electrode pattern for detecting the input position information is not limited to that shown in FIG. 2, and may be an electrode pattern in which the bridge portion 33 is not provided, for example.

  As shown in FIG. 2, the plurality of lead wires 36 connected to the first electrode 31 and the second electrode 32 are formed in the non-input region 16 of the base material 30. The plurality of lead wirings 36 are routed through the non-input area 16 of the base material 30 and connected to the connection terminals 17 for connection to an external circuit (not shown). The signal of the input position information detected during the input operation is transmitted to the external circuit via the lead wiring 36.

In this embodiment, the base material 30 is formed using a film-like resin material, and is made of polycarbonate resin (PC), polyethylene terephthalate resin (PET), polyethylene naphthalate resin (PEN), cyclic polyolefin (COP), A translucent resin material such as polymethyl methacrylate resin (PMMA) is used. The first electrode 31, the second electrode 32, and the connecting portion 34 are formed using a transparent conductive material such as ITO (Indium Tin Oxide), SnO ₂ , ZnO, and the like by a thin film method such as sputtering or vapor deposition. It is formed. The bridge portion 33 can be made of a metal material such as Cu, Ag, or Au, an alloy such as CuNi or AgPd, or a conductive oxide material such as ITO. For the lead-out wiring 36 and the connection terminal 17, a metal material such as Cu, Ag, Au, or a conductive oxide material such as ITO can be used.

  As shown in FIGS. 2 and 3, a plurality of conductor layers 50 are provided in the non-input region 16 of the base material 30, and the conductor layers 50 are arranged adjacent to the lead-out wiring 36 with a gap. The conductor layer 50 shields electromagnetic noise entering from the outside. As shown in FIG. 2, each of the plurality of conductor layers 50 is connected to the connection terminal 17 in the same manner as the lead wiring 36. Thereby, the conductor layer 50 is connected to an external circuit (not shown), and the potential of the conductor layer 50 is controlled to a predetermined value. Next, a detailed configuration of the conductor layer 50 will be described.

  FIG. 4 is a partially enlarged plan view showing the conductor layer and the lead wiring constituting the input device of this embodiment in an enlarged manner. In FIG. 4, the conductor layer 50 is indicated by hatching. FIG. 5 is a partially enlarged cross-sectional view taken along the line V-V in FIG. 4 and viewed from the arrow direction.

  As shown in FIGS. 4 and 5, the conductor layer 50 and the lead wiring 36 are formed on the same surface of the base material 30, and the conductor layer 50 is arranged adjacent to the lead wiring 36 with a space therebetween. Has been. As shown in FIG. 5, the conductor layer 50 is formed thicker than the lead wiring 36. For example, the conductor layer 50 has a thickness about twice that of the lead wiring 36. doing.

  As shown in FIG. 5, by providing the conductor layer 50, the lead-out wiring 36 and the conductor layer 50 are arranged adjacent to each other with a space on the same surface of the base material 30. The electromagnetic noise which invades from the side of is blocked. In addition, electromagnetic noise that enters from the upper oblique direction of the lead wiring 36 can be effectively shielded by the portion of the conductor layer 50 (second conductor layer 52) formed thicker than the lead wiring 36. Therefore, the shielding effect of the conductor layer 50 can be improved without increasing the plane area of the conductor layer 50, and the narrowing of the input device 10 can be realized.

  Further, unlike the input device 110 of the first conventional example shown in FIG. 9, the conductor layer 150 is not provided at the step portion between the interlayer insulating layer 135 and the base material 130, so that the interlayer insulating layer 135 and the base material 130 are not provided. There is no disconnection of the conductor layer 150 at the step portion. In addition, since the conductor layer 150 is not provided so as to overlap the lead wiring 136 via the interlayer insulating layer 135, it is possible to prevent the lead wiring 136 and the conductor layer 150 from conducting through the pinhole of the interlayer insulating layer 135. .

  Therefore, according to the input device 10 of the present embodiment, it is possible to realize a narrow frame and improve the shielding effect by the conductor layer 50.

  As shown in FIG. 4, the first electrode 31 and the second electrode 32 (not shown in FIG. 4) are arranged in the input region 15 of the base material 30, and the first electrode 31 and the second electrode 32. The lead-out wiring 36 connected to is arranged in the non-input area 16 outside the input area 15. As shown in FIG. 4, the plurality of lead-out wirings 36 are arranged in parallel at intervals.

  As shown in FIGS. 4 and 5, the conductor layer 50 is also provided with a plurality of conductor layers 50 a to 50 d. The conductor layer 50a is disposed in the non-input area 16 outside the plurality of lead wires 36, and effectively shields electromagnetic noise incident from the side of the input device 10 (X1 direction in FIGS. 4 and 5). can do.

  Further, as shown in FIGS. 4 and 5, the conductor layers 50 b and 50 c are disposed between the adjacent lead wires 36. The plurality of conductor layers 50b and 50c can shield electromagnetic noise between the adjacent lead wires 36, thereby preventing malfunctions and erroneous detection due to interference between the lead wires 36.

  As shown in FIG. 4, the conductor layers 50 b to 50 d are formed in the non-input region 16 between the first electrode 31 and the extraction wiring 36, and the second electrode 32 is not shown in FIG. 4. A conductor layer 50 is also formed in the non-input region 16 between the lead wire 36 and the lead-out wiring 36. According to this, since the space between the lead wire 36 and each electrode 31, 32 is shielded by the conductor layer 50, the electrostatic capacitance between each electrode 31, 32 in the input region 15 due to the influence of the signal transmitted through the lead wire 36. It is possible to prevent malfunction and erroneous detection by preventing the capacitance from changing.

  As shown in FIG. 2, the plurality of conductor layers 50 are connected to the connection terminals 17 and connected to an external circuit (not shown). Thereby, the conductor layer 50 can be controlled to a predetermined potential, and the capacitance formed between the lead-out wiring 36 and the conductor layer 50 can be controlled to a predetermined value.

  In the present embodiment, as shown in FIG. 5, since the thickness of each of the conductor layers 50 a to 50 d is formed thicker, the conductor layer 50 is more conductive than the case where the conductor layer 50 is formed to the same thickness as the lead-out wiring 36. The effective facing area between the layer 50 and the lead wiring 36 is increased. Therefore, it becomes easy to control the electrostatic capacitance between the lead-out wiring 36 and the conductor layer 50 to a predetermined value, and between the lead-out wirings 36 or between the lead-out wiring 36 and the detected object (for example, a finger). It is possible to prevent malfunctions and erroneous detections due to capacitance changes during the period.

  As shown in FIG. 5, the conductor layer 50 has a laminated structure of a first conductor layer 51 and a second conductor layer 52. The first conductor layer 51 has the same thickness as the lead wiring 36 and is provided on the base material 30, and the second conductor layer 52 is provided on the first conductor layer 51. The lead wiring 36 is made of the same material as the first electrode 31 and the second electrode 32, and a wiring base layer 37 formed continuously from the first electrode 31 or the second electrode 32, and the wiring base layer 37. And a wiring metal layer 38 laminated thereon. The first conductor layer 51 has a laminated structure of a conductor base layer 51 a made of the same material as the wiring base layer 37 of the lead-out wiring 36 and a conductor metal layer 51 b made of the same material as the wiring metal layer 38. That is, the first conductor layer 51 is made of the same material as the lead wiring 36 and has the same laminated structure.

  According to this, the 1st conductor layer 51 can be formed in the same process as the lead-out wiring 36, and manufacturing cost can be reduced. Further, by providing the second conductor layer 52 as a raised layer, the thickness of the conductor layer 50 can be surely increased, and electromagnetic noise that enters from the oblique direction above the lead-out wiring 36 is prevented from being generated by the second conductor layer. It can be shielded by 52. In the present embodiment, electromagnetic noise can be effectively shielded by forming the second conductor layer 52 with a thickness equal to or greater than that of the first conductor layer 51.

  In the present embodiment, a transparent conductive material such as ITO is used for the wiring base layer 37 and the conductor base layer 51a. The wiring metal layer 38, the conductor metal layer 51b, and the second conductor layer 52 can be made of a metal material such as Cu, Ag, or Au, or an alloy material such as CuNi or AgPd. It is also possible to stack a plurality of layers using different materials.

  FIG. 6 is a partial enlarged cross-sectional view showing a first modification of the input device of this embodiment. The input device 11 of this modification is different in that the conductor layer 50 is formed as a single layer. According to this modification, the conductor layer 50 can be formed in a separate process from the first electrode 31, the second electrode 32 (not shown), and the lead-out wiring 36. Therefore, for example, after the lead wiring 36 and the like are formed by a thin film process and a photolithography method, they can be formed by a printing method such as inkjet printing. By forming by the printing method, it is easier to form the conductor layer 50 thicker than when the conductor layer 50 is formed by the thin film method. For example, the conductor layer 50 can be formed to a thickness of about 1 μm to 10 μm.

  FIG. 7 is a partially enlarged cross-sectional view showing a second modification of the input device of this embodiment. In the input device 12 of this modification, it is preferable that the lead wiring 36 is formed so as to be covered with the wiring insulating layer 39. In this modification, conductor layers 50b and 50c are provided so as to fill between adjacent wiring insulating layers 39. In this way, the wiring insulation layer 39 ensures electrical insulation between the lead-out wiring 36 and the conductor layer 50, and the lead-out wiring 36 can be protected from the external environment. Even when the wiring insulating layer 39 is provided, since the conductor layer 50 is not provided at a position overlapping the lead wiring 36, insulation between the lead wiring 36 and the conductor layer 50 can be ensured. Further, by forming the conductor layer 50 so as to fill the space between the wiring insulating layers 39, it is easy to form the conductor layer 50 thick.

<Manufacturing method of input device>
FIG. 8 is a process diagram for explaining the manufacturing method of the input device of the present invention. Each of FIGS. 8A to 8E is a partially enlarged cross-sectional view showing the same portion as FIG. In the process of FIG. 8A, the transparent conductive layer 61 and the first metal layer 62 are laminated in this order over the input region 15 and the non-input region 16 of the base material 30. A transparent conductive material such as ITO is used as the transparent conductive layer 61, and a metal material such as Cu or an alloy material such as CuNi is used as the first metal layer 62, respectively, by a thin film method.

  8B, the wiring metal layer 38 and the conductor metal layer 51b are left, and the other first metal layer 62 is removed by etching. Thereafter, the transparent conductive layer 61 is removed by etching to form the wiring base layer 37 and the conductor base layer 51a, and at the same time, the first electrode 31 and the second electrode 32 (not shown) are formed. Thereby, the lead-out wiring 36 and the first conductor layer 51 are formed in the same process.

  Next, in FIG. 8C, a wiring insulating layer 39 is formed so as to cover the lead wiring 36 and expose the first conductor layer 51. A resin material such as an acrylic resin or a novolac resin can be used for the wiring insulating layer 39.

  8D, the second metal layer 63 is laminated on the entire surface so as to cover the first conductor layer 51, the lead wiring 36, the wiring insulating layer 39, and the like. Thereafter, in the step of FIG. 8E, the second metal layer 63 is removed by etching to form the second conductor layer 52. Thereby, the conductor layer 50 having a laminated structure of the first conductor layer 51 and the second conductor layer 52 is formed, and the conductor layer 50 can be formed thicker than the lead wiring 36.

  According to the method for manufacturing the input device 13 of the present embodiment, the second conductor layer 52 can be laminated on the first conductor layer 51 so that the thickness of the conductor layer 50 can be made thicker than the lead wiring 36. . Thereby, the shielding effect with respect to the electromagnetic noise which penetrate | invades from the outside can be improved by providing the 2nd conductor layer 52, suppressing the increase in the area of the non-input area | region 16. FIG.

  Further, according to the method for manufacturing the input device 13 of the present embodiment, for example, the second portion which is thicker than the lead wiring 36 compared to the process of forming the lead wiring 36 and the conductor layer 50 in separate steps. It is only necessary to add a step of forming the conductor layer 52, and the manufacturing cost can be reduced.

10, 11, 12, 13 Input device 15 Input region 16 Non-input region 17 Connection terminal 21 Front panel 30 Base material 31 First electrode 32 Second electrode 33 Bridge portion 34 Connecting portion 35 Bridge portion insulating layer 36 Lead wiring 37 Wiring underlayer 38 Wiring metal layer 39 Wiring insulating layer 50, 50a to 50d Conductor layer 51 First conductor layer 51a Conductor underlayer 51b Conductor metal layer 52 Second conductor layer 61 Transparent conductive layer 62 First metal layer 63 First 2 metal layers

Claims (7)

A substrate, an electrode provided on the substrate, a lead-out wiring connected to the electrode, and a conductor layer;
The lead-out wiring and the conductor layer are arranged adjacent to each other with a space on the same surface of the base material, and the thickness of the conductor layer is larger than the thickness of the lead-out wiring. An input device.   The conductor layer has a laminated structure of a first conductor layer and a second conductor layer, and the first conductor layer has the same thickness as the lead-out wiring and is provided on the base material. The input device according to claim 1, wherein the second conductor layer is provided on the first conductor layer.   The lead wiring has a base layer made of the same material as the electrode, and a metal layer stacked on the base layer, and the first conductor layer has the same stacked structure as the lead wiring. The input device according to claim 2, wherein The electrodes are arranged in the input area of the base material, and a plurality of the lead wires are arranged in a non-input area outside the input area,
4. The input device according to claim 1, wherein the conductor layer is arranged in the non-input region outside a plurality of the lead wires. 5.   The plurality of lead wires are arranged adjacent to each other with a space therebetween, and the conductor layer is arranged between the lead wires adjacent to each other. 5. The input device according to any one of 4.   The input device according to claim 1, wherein the conductor layer is disposed between the plurality of lead wires and the electrode. A manufacturing method of an input device having a base material, an electrode provided on the base material, a lead-out wiring connected to the electrode, and a conductor layer,
Forming the lead-out wiring and the first conductor layer adjacent to each other on the same surface of the base material with a space therebetween;
Providing a second conductor layer on the first conductor layer to form the conductor layer composed of the first conductor layer and the second conductor layer;
A method of manufacturing an input device, wherein the conductor layer is formed thicker than the lead wiring.

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