JP2015079954A - Lithography system and method for manufacturing article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lithography system in which a conveyance capacity for substrates is improved while suppressing increase of a space.SOLUTION: A lithography system includes: a storage for storing a plurality of substrates having a layer of an adhesive material; a plurality of lithographic apparatuses each performing a lithographic process of supplying a resist onto the adhesive material and patterning the supplied resist; a plurality of conveyance units respectively associated with the plurality of lithographic apparatuses; and a control unit that controls the plurality of conveyance units to convey substrates from the storage to each of the plurality of lithographic apparatuses. Transfer routes of the substrates conveyed by the plurality of conveyance units are set at different heights from one another, and at least a part of the transfer routes are regulated to be vertically overlapped.

Description

  The present invention relates to a lithography system including a plurality of lithographic apparatuses and a manufacturing method for manufacturing an article using the same.

  Conventionally, photolithography technology has been used to manufacture devices such as semiconductor devices. In the photolithography technique, a pattern of an original is transferred to a resist (photosensitive material) applied to a substrate by an exposure apparatus, and the resist is developed to form a resist pattern on the substrate. Using this resist pattern as a mask, the underlying layer is etched or ions are implanted into the substrate.

  As another technique for manufacturing a device such as a semiconductor device, an imprint technique in which an uncured resin is applied to a substrate and the original is pressed against the resin is cured. Patent Document 1 discloses a cluster imprint system that simultaneously performs imprint processing on a plurality of substrates using a plurality of imprint apparatuses in order to increase throughput. In Patent Document 1, a transport unit for transporting a substrate or the like is provided between the outside of the imprint apparatus and each imprint apparatus, and the transport unit includes a transport unit that holds and moves the substrate, a transport unit, and the like. A conveyance guide serving as a conveyance path for the unit.

JP 2011-210992 A

  In the case of performing imprint processing, before the imprint resist (resin) is applied onto the substrate by the imprint apparatus, an adhesive material film is formed by spin coating on the entire surface of the substrate on the resist application surface side. When spin-coating the adhesive material, the adhesive material is spin-coated collectively on one lot of substrates composed of a predetermined number of sheets. Further, one lot of substrates on which the adhesion material film is formed is transported to a plurality of imprint apparatuses constituting the cluster imprint system, and imprint processing is performed on the plurality of substrates in parallel.

  In the conventional cluster imprint system, it takes a long time from the time when the adhesive material is applied to the time when the plurality of substrates with the adhesive material applied are conveyed to the plurality of imprint apparatuses and the imprint process is started. Therefore, the situation where the adhesiveness between the board | substrate and resin by an adhesive material falls may generate | occur | produced.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a lithography system in which the substrate transport capability is improved while suppressing an increase in space.

  The present invention relates to a lithography system, a storage for storing a plurality of substrates having a layer of an adhesive material that improves adhesion to the resist, and a resist is supplied onto the adhesive material, and the supplied resist A plurality of lithography apparatuses each performing a lithography process for forming a pattern on the substrate, a plurality of transport units associated with each of the plurality of lithography apparatuses, and transporting the substrate from the storage to each of the plurality of lithography apparatuses And a control unit that controls the plurality of transfer units, and the movement paths of the substrates conveyed by the plurality of transfer units have different heights, and at least some of the movement paths are in the vertical direction. It is specified to overlap.

  ADVANTAGE OF THE INVENTION According to this invention, the lithography system which improved the conveyance capability of the board | substrate, suppressing the increase in space can be provided.

The figure explaining the structure of an imprint apparatus. The figure explaining arrangement | positioning of a dispenser. The figure explaining the sequence of an imprint process. The figure explaining a shot area. The figure explaining a cluster imprint system. The figure explaining a storage. The figure explaining conveyance of a board | substrate. The figure explaining conveyance of a board | substrate. The figure explaining conveyance of a board | substrate. The figure explaining conveyance of a board | substrate. The figure explaining conveyance of a board | substrate. The figure explaining conveyance of a board | substrate. The figure explaining conveyance of a board | substrate. The figure explaining conveyance of a board | substrate. The figure explaining conveyance of a board | substrate. The figure explaining conveyance of a board | substrate. The figure explaining carrying in of a board | substrate. The figure explaining carrying out of a board | substrate. The figure explaining conveyance of the board | substrate in 2nd Embodiment. The figure explaining the cluster imprint system in 3rd Embodiment. The figure explaining the structure of the imprint apparatus in 3rd Embodiment. The figure explaining conveyance of the board | substrate in 3rd Embodiment. The figure explaining conveyance of the board | substrate in 3rd Embodiment. The figure explaining carrying in of the board | substrate in 3rd Embodiment. The figure explaining the carrying-out of the board | substrate in 3rd Embodiment.

[First Embodiment]
The imprint apparatus used in the first embodiment of the present invention will be described with reference to FIGS. Here, as an example, an example in which a UV light curable imprint apparatus that cures a resin (also referred to as an imprint material or a resist) by irradiation with UV light (ultraviolet light) will be described. However, the present invention can also be applied to an imprint apparatus that cures a resin by irradiation with light in another wavelength range, or an imprint apparatus that cures a resin with other energy (for example, heat).

  The imprint apparatus 100 according to the present embodiment is configured to form patterns in a plurality of shot areas of a substrate by repeating imprint processing. Here, in one imprint process, a pattern is formed on the substrate by curing the resin while the original plate is pressed against the resin.

  By transferring the pattern of the original (mold, mold) 5 to the substrate (wafer) 1, an element pattern corresponding to the pattern of the original 5 is formed on the surface layer (pattern forming layer) of the substrate 1. The substrate stage 2 holds the substrate 1 and moves the substrate 1 in directions orthogonal to each other. The substrate stage 2 includes a fine movement stage 2a that holds the substrate and a coarse movement stage 2b that supports the fine movement stage 2a. The base frame 4 holds and positions the substrate stage 2. An uneven pattern is formed on the surface of the original 5. When the resin (resist) on the substrate 1 and the original 5 come into contact with each other, the pattern of the original 5 is transferred to the resin on the substrate 1. The drive unit 5 a performs an operation of bringing the original 5 into contact with the resin on the substrate 1 by driving the original 5 up and down.

  The ultraviolet light generation unit 6 passes through the original 5 and irradiates the resin with ultraviolet light 6a to cure the resin. The ultraviolet light generation unit 6 includes, for example, a light source such as a halogen lamp that generates i-line and g-line, and an optical system that condenses and shapes light generated by the light source. The dispenser 7 can apply a predetermined amount of resin onto the substrate 1 by discharging the resin as fine droplets. The tank 8 stores uncured resin and supplies the resin to the dispenser 7 through the pipe 9.

  As shown in FIG. 2, the moving mechanism 10 moves the dispenser 7 between a discharge position and a retracted position (maintenance position). The dispenser 7 is positioned at a discharge position during a normal discharge operation. When performing the maintenance, the dispenser 7 is moved to the retracted position (maintenance position), and the dispenser 7 is cleaned and replaced. The alignment scope 11 is a microscope that aligns the pattern positions of the original 5 and the substrate 1 after supplying (dispensing and applying) resin onto the substrate 1 with the dispenser 7. The alignment scope 11 measures how the alignment marks provided on the original plate 5 and the alignment marks on the substrate 1 are overlapped, thereby aligning the original plate 5 and the substrate 1 with each other. The surface plate 12 supports and fixes the dispenser 7, the ultraviolet light generator 6, and the like. Each unit of the imprint apparatus 100 is controlled by the control unit C.

  The imprint processing sequence will be described with reference to FIG. In step a, the substrate 1 is mounted on the substrate stage 2. In step b, the substrate 1 is started to move by the substrate stage 2 under the dispenser 7 that discharges the resin. In step c, a predetermined amount of resin is applied onto the substrate 1 by the dispenser 7. In step d, the original 5 is lowered by the drive unit 5a, and the original 5 and the alignment mark on the substrate are overlapped by the alignment scope 11 while the original 5 is in contact with the resin on the substrate 1, The relative position of both is adjusted.

  In step e, the original 5 is lowered in the direction of the substrate 1 by the drive unit 5a, and the original 5 is pressed against the resin on the substrate 1 to transfer the pattern. In step f, the ultraviolet light generator 6 irradiates the ultraviolet light 6a from above, and transmits the ultraviolet light 6a through the original 5 to irradiate the resin. At this stage, the uncured resin is cured. In step g, by increasing the distance between the original 5 and the substrate 1 (peeling the original 5 from the cured resin), a patterned resin layer is formed on the substrate 1 and the imprint process is completed. By performing the above steps ag, the imprinting process is repeated in the order of shot numbers 1, 2, 3,... For a plurality of shot areas formed on the substrate 1, as shown in FIG. .

  Next, details of a cluster-type imprint system constituted by a plurality of imprint apparatuses of the present embodiment will be described with reference to FIGS. The “cluster-type imprint system” is a system in which a plurality of imprint apparatuses are arranged adjacent to each other for the purpose of ensuring productivity and space saving, and each imprint apparatus manufactures articles such as devices at the same time. is there. As shown in FIG. 5, the cluster-type imprint system of this embodiment performs imprint processing in parallel on a plurality of substrates 1 in one lot using six imprint apparatuses 100 </ b> A to 100 </ b> F. . Before applying the resin with the imprint apparatuses 100 </ b> A to 100 </ b> F, the coating apparatus 101 has the adhesiveness between the resin and the substrate 1 and the spreadability of the resin on the upper surface of the substrate 1 on the entire upper surface of the substrate 1 on the resin coating surface side. In order to improve the above, an adhesion material film is formed by spin coating. The coating apparatus 101 may be any apparatus that forms a layer of an adhesive material on a substrate, and is not limited to the application of the adhesive material by spin coating. The adhesion material is, for example, a material containing a photoreactive material or a reactive functional group. The coating apparatus 101 forms a monomolecular film of an adhesive material made of, for example, a photoreactive material by forming an adhesive material film on the entire upper surface of the substrate 1 by spin coating. The spin coating of the adhesive material is performed collectively on a plurality of substrates 1 in one lot. In order not to deteriorate the adhesion due to the adhesion material and the spreadability of the resin, it is necessary to set the time from the application of the adhesion material to the ejection of the resin to the substrate within a predetermined target time. After the adhesion material film is collectively formed on the one lot of substrates 1 by the coating apparatus 101, the one lot of substrates 1 coated with the adhesion material is in the vicinity of the coating apparatus 101 as shown in FIG. Are stored in a storage (stocker) 13 installed in the storage.

  Next, a specific configuration in which the substrates 1 stored in the storage 13 are transported by the transport unit 14 in units of six sheets with respect to the six imprint apparatuses 100A to 100F having a cluster configuration. As shown in FIG. 7, each transport unit 14 that transports the substrate 1 between the storage 13 and each imprint apparatus 100 is provided with a hand member 14 c for transporting the substrate 1. The hand member 14c holds and transports the substrate 1 to each of the imprint apparatuses 100A to 100F. As shown in FIG. 8, the transport unit 14 includes a guide member 14a that moves the hand member 14c to each of the imprint apparatuses 100A to 100F, and a movable unit that holds the hand member 14c and is movable with respect to the guide member 14a. Mover) 14b. The guide member 14a defines a movement path of the hand member 14c, and at least a part of the guide member 14a is arranged to overlap in the vertical direction at different height positions. The movable portion 14b moves the substrate 1 held by the hand member 14c to the imprint apparatuses 100A to 100F along the guide member 14a. The transport unit 14 includes six transport units 14 in order to transport the substrate 1 to the imprint apparatuses 100A to 100F at the same time. The six hand members 14c move in the arrow direction shown in FIG. Next, the hand member 14c is moved in the direction of the arrow shown in FIG. 9B, and is carried out from the storage 13 while holding the six substrates 1.

  Details of conveyance of the substrate 1 by the conveyance unit 14 will be described with reference to FIGS. 10A to 10G. FIG. 10A shows a transport operation of the transport unit 14. 10A is a plan view, and FIG. 10B is a side view. The hand member 14c moves in the arrow direction shown in FIG. 10A (a), and can be rotated by approximately 90 degrees in the illustrated arrow direction when the substrate 1 is loaded into the imprint apparatuses 100A to 100C. FIG. 10B shows a transport operation of the hand member 14c that transports the substrate 1 to each of the imprint apparatuses 100D to 100F. The hand member 14c that transports the substrate 1 to the imprint apparatuses 100D to 100F is symmetrically transported with the hand member 14c that transports the substrate 1 to the imprint apparatuses 100D to 100F illustrated in FIG. I do. The hand member 14c that transports the substrate 1 to each of the imprint apparatuses 100D to 100F can also be rotated by approximately 90 degrees in the direction of the arrow in FIG.

  FIG. 10C shows details of the transport unit 14. As shown in (a) and (b) of FIG. 10C, the transport unit 14 includes a guide member 14a and a movable unit (movable element) 14b, and a permanent magnet (stator) 14d is moved in the moving direction on the guide member 14a. It is arranged. The movable part 14b is generally composed of a coil, and generates a driving force in the direction of the arrow in the figure by the interaction (Lorentz force, etc.) between the magnetic flux generated by the magnetic circuit formed by the permanent magnet 14d and the current excited by the coil. And move in the direction of the arrow shown in the figure. The movable part (movable element) 14b and the permanent magnet (stator) 14d constitute a drive mechanism that drives the hand member 14c. (C) of FIG. 10C is an enlarged view of a “(c)” portion in (a), and (d) is an enlarged view of a “(d)” portion in (b).

  With the above configuration, how the substrate 1 is carried into and out of the imprint apparatuses 100A to 100C by the transport unit 14 will be described with reference to FIGS. 10D to 10G. In FIG. 10D, the hand member 14c delivers the board | substrate 1 between the raising / lowering delivery parts 16 provided in the imprint apparatus 100A, when conveying the board | substrate 1 to the imprint apparatus 100A. Similarly, another hand member 14c delivers the substrate 1 by the delivery unit 16 provided in the imprint apparatus 100B, and still another hand member 14c provides the substrate 1 by the delivery part 16 provided in the imprint apparatus 100C. Deliver. The three hand members 14c that carry the substrate 1 into the imprint apparatuses 100A to 100C move along the guide members 14a located at different heights in the same region of the two-dimensional plane. Further, the three hand members 14c that carry the substrate 1 into the imprint apparatuses 100A to 100C deliver the substrate 1 at a height different from that of the transfer unit 16 having a different height in the imprint apparatuses 100A to 100C.

  The delivery unit 16 mounts the substrate 1 received from the hand member 14c on the substrate stage 2 of each of the imprint apparatuses 100A to 100C via the second delivery unit 17 (FIGS. 10E to 10G). An imprint process is performed on the substrate 1 mounted on the substrate stage 2 of each imprint apparatus 100.

  The hand member 14c for carrying the substrate 1 into the imprint apparatuses 100A to 100C and the hand member 14c for carrying the substrate 1 into the imprint apparatuses 100D to 100F are arranged on the opposite sides with respect to the region of the movement path. . The six hand members 14c move at different height positions. In addition, the six hand members 14 c take the substrates 1 in the storage 13 having different height positions. Therefore, as shown in FIG. 11, the six hand members 14c can transport the substrate 1 to the imprint apparatuses 100A to 100F substantially simultaneously along the movement path indicated by the arrows in the drawing.

  Next, a mode that the board | substrate 1 is carried out from each imprint apparatus 100A-100F using FIG. 12 is shown. The substrate 1 for which the imprint process has been completed in each imprint apparatus 100 is transferred from the substrate stage 2 to the hand member 14c via the second transfer unit 17 and the transfer unit 16 by a transfer operation opposite to that at the time of loading. . As described above, the height positions of the movement paths of the six hand members 14c are different from each other. Accordingly, the six hand members 14c can carry out the substrate 1 from the imprint apparatuses 100A to 100F associated with the substrate 1 substantially simultaneously along the movement path indicated by the arrows in the drawing.

  As described above, in the cluster type imprint system configured to perform the imprint process in parallel, in addition to the imprint process, the transport process of the substrate 1 with respect to each imprint apparatus 100 can be performed in parallel. As a result, the time from the end of the application of the adhesive material to the application of the resin can be kept within a predetermined target time, and a decrease in the adhesiveness of the adhesive layer and the spreadability of the resin can be suppressed. In addition, throughput can be improved.

[Second Embodiment]
In the first embodiment, corresponding to each of the imprint apparatuses 100 </ b> A to 100 </ b> F, the transport unit 14 that loads and unloads the substrate 1 with respect to only the imprint apparatus 100 is provided. In the second embodiment, in addition to the transport unit 14 associated with such an imprint apparatus, a second transport unit 18 that can transport the substrate 1 to the plurality of imprint apparatuses 100 is provided. Similarly to the transport unit 14, the second transport unit 18 includes a hand member 18c, a guide member 18a, and a movable unit 18b. FIG. 13 shows how the substrate is transported in the second embodiment. The hand member 18c is provided in the second transport unit 18 so that the substrate 1 can be transported to any of the imprint apparatuses 100A to 100F.

  As shown in FIG. 13, the second transport unit 18 is installed at a height different from the installation position of the transport unit 14 in the same area on the two-dimensional plane as the transport unit 14. Further, the delivery position of the substrate 1 between the hand member 18c and the delivery section 16 of each of the imprint apparatuses 100A to 100F is also set lower than the delivery position of the hand member 14c.

  When imprint processing is performed using the imprint apparatuses 100A to 100F, an imprint error occurs due to a defect in the imprint surface of the substrate 1 (such as foreign matter or adhesion material application failure) in one of the imprint apparatuses 100A to 100F. There are things to do. In such a case, the second transport unit 18 is used to immediately carry out the substrate 1 having a defective imprint surface from the corresponding imprint apparatus 100 and carry the replacement substrate 1 into the imprint apparatus 100. The number of installed hand members 18c that can transport the substrate 1 to any of the imprint apparatuses 100A to 100F can be two or more.

  In the present embodiment, the hand member 18c is provided so as to be able to transport the substrate 1 to any of the imprint apparatuses 100A to 100F. When there are two hand members 18c, one of them can transport the substrate 1 to the imprint apparatuses 100A to 100C, and the other can transport the substrate 1 to the imprint apparatuses 100D to 100F. Can be shared.

[Third Embodiment]
In the first embodiment and the second embodiment, the imprint apparatuses 100 </ b> A to 100 </ b> F have described the configuration in which one original plate 5 is arranged and imprint processing is performed on one substrate 1. In the third embodiment, each of the imprint apparatuses 100 </ b> A to 100 </ b> D has a configuration in which two masters 5 can be arranged and imprint processing is simultaneously performed on two substrates 1.

  As shown in FIG. 14, imprint processing is performed in parallel on a plurality of substrates 1 in one lot using four imprint apparatuses 100 </ b> A to 100 </ b> D. Here, in the imprint apparatuses 100A to 100D, two sets of the fine movement stage 2a and the coarse movement stage 2b each moving the substrate 1 are configured. The third embodiment is a cluster type imprint system in which four such imprint apparatuses are arranged. Similarly, two sets of driving units 5a for driving the original 5 are arranged in one imprint apparatus. Similarly, two sets of the dispenser 7 and the moving mechanism 10 that moves the dispenser 7 are configured in one imprint apparatus.

  As shown in FIG. 15, the original plate 5, the drive unit 5 a, the ultraviolet light generation unit 6, the dispenser 7, the tank 8, the pipe 9, the moving mechanism 10, and the alignment scope that are configured by two in one imprint apparatus 100A 11 is supported and fixed to a common surface plate 12. As shown in FIGS. 15A and 15B, two sets of the base frame 4 are independently configured for each of the fine movement stage 2a and the coarse movement stage 2b. However, as shown in FIG. 15C, a configuration in which the base frame 4 is shared can be implemented.

  Next, a specific configuration in which the substrates 1 stored in the storage 13 are transferred by the transfer unit 14 in units of 8 sheets to the four imprint apparatuses 100A to 100D having a cluster configuration. As shown in FIG. 16, each transport unit 14 that transports the substrate 1 between the storage 13 and the fine movement stage 2 of each imprint apparatus 100 is provided with a hand member 14 c for transporting the substrate 1. ing. The hand member 14c holds and transports the substrate 1 to the fine movement stage 2 of each of the imprint apparatuses 100a to 100d. As shown in FIG. 17, the transport unit 14 includes a guide member 14 a that moves the hand member 14 c to the imprint apparatuses 100 </ b> A to 100 </ b> D, and a movable unit that holds the hand member 14 c and is movable with respect to the guide member 14 a ( Mover) 14b. The guide member 14a defines the movement path of the hand member 14c. The movable portion 14b moves the substrate 1 held by the hand member 14c to the imprint apparatuses 100a to 100d along the guide member 14a. The transport unit 14 includes eight transport units 14 to transport the substrate 1 to the fine movement stage 2 of each imprint apparatus 100a to 100d at the same time. The method in which each of the eight hand members 14c carries the substrate 1 out of the storage 13 and carries it is the same as the method described in the first embodiment. The method in which each of the eight hand members 14c carries the substrate 1 into the imprint apparatuses 100a to 100d is also the same as the method described in the first embodiment.

  As shown in FIG. 18, with respect to each imprint apparatus 100A-100D, the board | substrate 1 is with respect to the some imprint position provided in each of the imprint apparatuses 100A-100D by the movement path | route shown by the arrow in a figure. Two pieces are conveyed by the hand member 14c. When the imprint processing is completed by the imprint operation, the substrates 1 conveyed to the imprint apparatuses 100A to 100D are unloaded from the imprint apparatuses 100A to 100D by two as shown in FIG. . Here, the hand member 14c holds the substrate 1 and can carry out two substrates 1 from each of the imprint apparatuses 100A to 100D along the movement path indicated by the arrows in the drawing.

  In the first embodiment and the second embodiment, the cluster type imprint system including a plurality of imprint apparatuses has been described. However, the present invention can be generalized to a cluster-type lithography system including a plurality of lithography apparatuses that perform a lithography process for forming a pattern on a resist applied to a substrate, such as an exposure apparatus and a charged particle beam drawing apparatus. it can.

[Product Manufacturing Method]
The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The manufacturing method may include a step of forming a latent image pattern on a substrate using a lithography apparatus such as the imprint apparatus 100 and a step of developing the substrate on which the latent image pattern is formed in the step. Further, the manufacturing method may include other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist peeling, dicing, bonding, packaging, etc.) for processing the substrate on which the pattern is formed. . The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

100: Imprint apparatus. 200: Exposure apparatus. 300: Measuring device. 400: Information processing apparatus. 11: Mold. 13: Substrate. 16: Correction mechanism.

Claims (13)

A lithography system comprising:
A storage for storing a plurality of substrates having a layer of an adhesive material that improves adhesion to the resist;
A plurality of lithography apparatuses for supplying a resist on the adhesion material and performing a lithography process for forming a pattern on the supplied resist;
A plurality of transport units associated with each of the plurality of lithographic apparatuses;
A control unit that controls the plurality of transfer units so as to transfer the substrate from the storage to each of the plurality of lithography apparatuses;
The movement paths of the substrate conveyed by the plurality of conveyance sections are different in height, and are defined such that at least a part of the movement paths overlaps in the vertical direction.
A lithography system characterized by that. The plurality of transport units each include a hand member that holds the substrate, a guide member that defines the movement path, and a drive mechanism that drives the hand member along the guide member.
The lithography system according to claim 1, wherein the guide members are installed so as to be positioned at different heights, and at least some of the guide members are installed so as to overlap in the vertical direction.   3. The lithography system according to claim 1, wherein each of the plurality of lithography apparatuses includes a transfer unit that can move up and down to transfer a substrate to and from a corresponding transfer unit.   4. The lithography system according to claim 1, further comprising an apparatus that is installed in the vicinity of the storage and forms the adhesion material layer on each of the plurality of substrates. 5.   The lithography system according to claim 1, wherein the plurality of lithographic apparatuses are arranged so as to surround the movement path.   The lithography system according to claim 1, wherein the control unit controls the plurality of lithography apparatuses so that the lithography processes performed by the plurality of lithography apparatuses are performed in parallel.   7. The control unit according to claim 1, wherein the control unit controls the plurality of transfer units so as to carry out the substrate from which the lithography process has been completed from the plurality of lithography apparatuses in parallel. The lithography system according to item. The drive mechanism is
A mover that holds the hand member and includes a coil;
A stator including a permanent magnet installed on the guide member;
The lithography system according to claim 2, further comprising:   The lithography system according to claim 8, wherein the hand member is rotatably held with respect to the movable element.   The lithography system according to any one of claims 1 to 9, wherein the adhesion material layer is a monomolecular film of a photoreactive material.   The apparatus further includes at least one second transport unit capable of transporting a substrate between two or more lithographic apparatuses of the plurality of lithographic apparatuses and the storage case, and the at least one second transport unit transports the substrate. The movement path of the substrate is different in height from the movement path of the substrate conveyed by the plurality of conveyance units, and is defined such that at least a part of the movement path overlaps in the vertical direction. The lithography system according to claim 1.   Each of the plurality of lithographic apparatuses supplies an imprint process in which a resist is supplied onto the adhesion material layer and the resist is cured in a state where the supplied resist and a pattern formed on a mold are in contact with each other. The lithography system according to claim 1, wherein the lithography system is an imprint apparatus. Forming a pattern on a substrate using the lithography system according to any one of claims 1 to 12,
A step of processing the substrate on which the pattern is formed in the step;
A method for producing an article comprising:

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