JP2015079889A - Wiring board and wiring board manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable wiring board and a wiring board manufacturing method.SOLUTION: A wiring board comprises: a substrate; a first rib part formed on one surface of the substrate; a second rib part which is formed on the first rib part and along a longer direction of the first rib part, and which has a width narrower than that of the first rib part; a third rib part which is formed on the one surface of the substrate and along the first rib part; a fourth rib part which is formed on the third rib part and along a longer direction of the third rib part, and which has a width narrower than that of the third rib part; and distribution lines each of which is composed of metal nano ink and formed between the first rib part and the second rib part, and the third rib part and the fourth rib part, and along the first rib part, the second rib part, the third rib part and the fourth rib part.

Description

  The present invention relates to a wiring board and a method for manufacturing the wiring board.

  Conventionally, there is a method for manufacturing a laminated substrate including a first substrate on which an electrode is formed and a second substrate on which a through hole is formed (see, for example, Patent Document 1). In this manufacturing method, the step of disposing an insulating member for forming a gap on at least one of the first substrate and the second substrate, and the electrode of the first substrate and the through hole of the second substrate are aligned, Disposing the second substrate on the first substrate with the insulating member interposed therebetween. The manufacturing method further includes a step of filling the inside of the through hole of the second substrate with an ink containing metal particles using an inkjet method, and the insulating member is formed on the first substrate. The ink spread is blocked.

  Further, in this manufacturing method, an insulating member for forming a gap may be disposed on both the first substrate and the second substrate.

JP 2007-012790 A

  By the way, even if an insulating member for forming a gap is formed on one or both of the first substrate and the second substrate by a conventional method of manufacturing a laminated substrate, for example, for alignment in the step of filling the ink When the deviation occurs, the ink straddles the insulating member, and there is a possibility that the spreading of the ink cannot be blocked. In such a case, the wiring formed from the ink may be connected to other wiring that is not originally intended, and the reliability may be reduced.

  Therefore, an object is to provide a highly reliable wiring board and a method for manufacturing the wiring board.

  The wiring board according to the embodiment of the present invention is formed along the longitudinal direction of the first hook part on the board, the first hook part formed on one surface of the board, and the first hook part. A second collar part narrower than the first collar part, a third collar part formed along the first collar part on one surface of the substrate, and an upper side of the third collar part Formed along the longitudinal direction of the third collar, and narrower than the third collar, the first collar, the second collar, the third collar, Between the fourth collar part, the first collar part, the second collar part, the third collar part, and the wiring formed from the metal nano ink along the fourth collar part are included.

  A highly reliable wiring board and a method for manufacturing the wiring board can be provided.

1 is a diagram showing a wiring board 100 according to a first embodiment. FIG. 3 is a diagram showing a procedure of manufacturing steps of the wiring board 100 of the first embodiment. It is a figure which shows the manufacturing process of the wiring board 100 of Embodiment 1 in steps. It is a figure which shows the manufacturing process of the wiring board 100 of Embodiment 1 in steps. It is a figure for demonstrating the difference between the wiring board for a comparison, and the wiring board 100 of Embodiment 1. FIG. It is a figure which shows the procedure of the manufacturing process of the wiring board 200 of Embodiment 2. FIG. It is a figure which shows the manufacturing process of the wiring board 200 of Embodiment 2 in steps. It is a figure which shows the manufacturing process of the wiring board 200 of Embodiment 2 in steps.

  Embodiments to which a wiring board and a method for manufacturing a wiring board according to the present invention are applied will be described below.

<Embodiment 1>
1A and 1B are diagrams showing a wiring board 100 according to Embodiment 1, in which FIG. 1A is a plan view and FIG. In FIG. 1, an XYZ coordinate system that is an orthogonal coordinate system is defined.

  The wiring substrate 100 includes a substrate 10, a lower bank 20, an upper bank 30, and wirings 41 and 42.

  The substrate 10 is a thin plate member formed of an insulating material, and can be formed of, for example, an epoxy resin, a polyimide resin, a polycarbonate resin, or the like. When an epoxy resin is used, a standard substrate such as FR (Flame Retardant type) 4 may be used as the substrate 10.

  In addition, since the wiring board 100 performs the process which bakes metal nanoink at the end of a manufacturing process, it is calculated | required that the board | substrate 10 has heat resistance which can endure a baking process. Further, the surface of the substrate 10 and the lower bank 20 are subjected to a surface treatment that increases the wettability with respect to the metal nano ink as compared with the upper bank 30. Here, the surface treatment for increasing the wettability with respect to the metal nano ink is synonymous with the surface treatment for increasing the hydrophilicity.

  The lower bank 20 is formed on the surface of the substrate 10 so as to surround a region in which the wirings 41 and 42 to be formed later on the surface of the substrate 10 are formed in a plan view.

  The lower bank 20 is provided to dam the metal nano ink applied to the surface of the substrate 10 by an ink jet method in order to form the wirings 41 and 42, and is a member such as a bank or a ridge. Here, the lower bank 20 is treated as an example of the lower heel part, but the lower bank 20 may be handled as a lower bank part.

  It is desirable that the thickness of the lower bank 20 is slightly larger than the thickness of the wirings 41 and 42. For example, when the thickness of the wirings 41 and 42 is 1 μm, the thickness of the lower bank 20 may be 2 μm or more.

  The lower bank 20 is required to have heat resistance that can withstand the firing process of the metal nanoink. The lower bank 20 may be formed of, for example, a polyimide resin or a polycarbonate resin. The lower bank 20 is formed, for example, by transferring a previously molded sheet-like member to the surface of the substrate 10.

  The lower bank 20 has lower bank portions 21 to 27. The lower bank portions 21, 24, and 27 extend in the Y-axis direction and are arranged in parallel to each other at equal intervals in the X-axis direction. The lower bank portions 21, 24, and 27 have the same width in the X-axis direction and length in the Y-axis direction. Further, the thicknesses of the lower bank portions 21, 24 and 27 are equal.

  The lower bank portion 22 is a portion that connects the Y bank negative direction side ends of the lower bank portions 21 and 24, and extends in the X axis direction. Similarly, the lower bank portion 23 is a portion connecting the ends of the lower bank portions 21 and 24 on the Y axis positive direction side, and extends in the X axis direction.

  The lower bank part 25 is a part that connects the Y bank negative direction side ends of the lower bank parts 24 and 27 and extends in the X axis direction. Similarly, the lower bank portion 26 is a portion that connects the Y bank positive direction side ends of the lower bank portions 24 and 27 and extends in the X axis direction.

  The lower bank portions 22 and 23 extend in the X-axis direction in parallel with each other, and the lower bank portions 25 and 26 extend in the X-axis direction in parallel with each other. The lower bank portions 22 and 25 extend on the same straight line in the X-axis direction, and the lower bank portions 23 and 26 extend on the same straight line in the X-axis direction.

  The lower bank portions 22, 23, 25, and 26 have the same width in the Y-axis direction and length in the X-axis direction. Further, the lower bank portions 22, 23, 25, and 26 have the same thickness, and the lower bank portions 21, 24, and 27 have the same thickness.

  The lower bank portions 21 to 27 have a trapezoidal cross section in the width direction. This cross-sectional shape is a trapezoid whose bottom is longer than the top.

  The lower bank 20 (lower bank portions 21 to 27) and the surface of the substrate 10 are subjected to a surface treatment that increases the wettability with respect to the metal nano ink more than the upper bank 30.

  The upper bank 30 is an example of an upper collar formed on the lower bank 20. The upper bank 30 is formed on the upper surface of the lower bank 20 so as to surround a region in which the wirings 41 and 42 to be formed later on the surface of the substrate 10 are formed in a plan view.

  The upper bank 30 is provided to dam the metal nano ink applied to the surface of the substrate 10 by an ink jet method in order to form the wirings 41 and 42, and is a member such as a bank or a ridge. Here, although the upper bank 30 is handled as an example of the upper collar, the upper bank 30 may be handled as an upper bank.

  The thickness of the upper bank 30 may be the same as that of the lower bank 20. Further, the upper bank 30 is required to have heat resistance that can withstand the firing process of the metal nano ink. The upper bank 30 may be formed of, for example, polyimide resin or polycarbonate resin. The upper bank 30 is formed, for example, by transferring a previously molded product to the upper surface of the lower bank 20.

  The upper bank 30 is not subjected to surface treatment for improving the wettability performed on the lower bank 20. Therefore, the upper bank 30 has lower wettability to the metal nano ink than the lower bank 20, and the contact angle of the metal nano ink attached to the surface of the upper bank 30 is larger than the contact angle of the metal nano ink attached to the surface of the lower bank 20. Also grows.

  The upper bank 30 has upper bank portions 31 to 37. The upper bank portions 31 to 37 are disposed on the upper surfaces of the lower bank portions 21 to 27, respectively.

  The upper bank portions 31, 34, and 37 extend in the Y-axis direction and are arranged in parallel to each other at equal intervals in the X-axis direction. The upper bank portions 31, 34, and 37 have the same width in the X-axis direction and length in the Y-axis direction. Further, the upper bank portions 31, 34 and 37 are equal in thickness.

  The upper bank portion 32 is a portion that connects the Y bank negative direction side end portions of the upper bank portions 31 and 34 and extends in the X axis direction. Similarly, the upper bank portion 33 is a portion connecting the Y bank positive direction side ends of the upper bank portions 31 and 34, and extends in the X axis direction.

  The upper bank portion 35 is a portion that connects the Y bank negative direction side ends of the upper bank portions 34 and 37 and extends in the X axis direction. Similarly, the upper bank portion 36 is a portion connecting the Y bank positive direction side end portions of the upper bank portions 34 and 37, and extends in the X axis direction.

  The upper bank portions 32 and 33 extend in the X-axis direction in parallel with each other, and the upper bank portions 35 and 36 extend in the X-axis direction in parallel with each other. The upper bank portions 32 and 35 extend on the same straight line in the X-axis direction, and the upper bank portions 33 and 36 extend on the same straight line in the X-axis direction.

  The upper bank portions 32, 33, 35, and 36 have the same width in the Y-axis direction and length in the X-axis direction. Further, the thicknesses of the upper bank portions 32, 33, 35, and 36 are equal, and the thicknesses of the upper bank portions 31, 34, and 37 are equal.

  The upper bank portions 31 to 37 have a trapezoidal cross section in the width direction. This cross-sectional shape is a trapezoid whose upper base is longer than the upper base. The widths of the upper bank portions 31 to 37 are about 1/3 of the widths of the lower bank portions 21 to 27, respectively. The upper banks 31 to 37 are arranged at the center portions in the width direction of the lower banks 21 to 27, respectively.

  The wirings 41 and 42 are formed in a rectangular area constructed by the lower bank parts 21, 22, 23, 24 and a rectangular area constructed by the lower bank parts 24, 25, 26, 27, respectively. Is done. The wirings 41 and 42 are wirings that are electrically insulated from each other by design.

  The wirings 41 and 42 are produced by firing metal nano ink applied to each region by an ink jet method. As a metal nanoink, for example, nanoparticles such as silver (Ag) or copper (Cu) are contained in an organic solvent, and the organic solvent can be removed by baking treatment. By removing the organic solvent, What is necessary is just to be able to form a silver or copper metal layer. For example, the metal nano ink of Ishihara Pharmaceutical Co., Ltd. can be used.

  The particle size of the metal particles contained in the metal nano ink is, for example, about 10 to several tens of nm. The line width of the wirings 41 and 42 formed by the inkjet method can be reduced to, for example, about several tens of μm to about 50 μm.

  Note that the lower bank portion 21 and the upper bank portion 31 that are adjacent to each other in the width direction (width in the X-axis direction) of the wiring 41 are examples of a first collar portion and a second collar portion, respectively. Further, the lower bank part 24 and the upper bank part 34 adjacent to each other in the width (X-axis direction width) direction of the wiring 41 are examples of a third hook part and a fourth hook part, respectively.

  Further, the lower bank portion 24 and the upper bank portion 34 adjacent to each other in the width direction (width in the X-axis direction) of the wiring 42 are examples of a first collar portion and a second collar portion, respectively. Further, the lower bank portion 27 and the upper bank portion 37 adjacent to each other in the width (X-axis direction width) direction of the wiring 42 are examples of a third collar portion and a fourth collar portion, respectively.

  FIG. 1 shows two straight lines 41 and 42 as an example. However, when the wiring board 100 is specifically designed, the lines 41 and 42 are formed in various patterns, and more. It will include the wiring. For this reason, the lower bank 20 and the upper bank 30 may be formed so as to surround various wirings included in the wiring substrate 100. For example, when there is a pad at the end of the wirings 41 and 42, the lower bank 20 and the upper bank 30 may be closed so as to surround the pad in plan view.

  The lower bank portions 21, 24, and 27 are closed at both ends by the lower bank portions 22, 23, 25, and 26, and the upper bank portions 31, 34, and 37 are the upper bank portions 32, 33, 35, and 36, respectively. Closed by.

  However, the end portions of the lower bank portions 21, 24, and 27 are not necessarily closed by the lower bank portions 22, 23, 25, and 26, and may be opened. Similarly, the end portions of the upper bank portions 31, 34, and 37 may not necessarily be closed by the upper bank portions 32, 33, 35, and 36, and may be opened.

  Further, FIG. 1 shows a form in which both sides of the wirings 41 and 42 are sandwiched between the lower bank parts 21, 24 and 27 and the upper bank parts 31, 34 and 37, but when the wirings 41 or 42 can be formed only on one side. The lower bank portion and the upper bank portion may be disposed only on one side of the wiring 41 or 42.

  Next, the procedure of the manufacturing method of the wiring board 100 of Embodiment 1 is demonstrated using FIG.

  FIG. 2 is a diagram illustrating a procedure of a manufacturing process of the wiring substrate 100 according to the first embodiment.

  First, the lower bank 20 is formed on the surface of the substrate 10 (step S1). The lower bank 20 is formed, for example, by transferring a previously molded one onto the surface of the substrate 10.

  Next, surface treatment for improving hydrophilicity is performed on the surface of the substrate 10 and the surface of the lower bank 20 (step S2). Examples of the surface treatment include a treatment in which the surfaces of the substrate 10 and the lower bank 20 are exposed to oxygen plasma.

  Next, the upper bank 30 is formed on the upper surface of the lower bank 20 (step S3). The upper bank 30 is formed, for example, by transferring a previously molded product to the upper surface of the lower bank 20.

  Next, metal nano-ink is applied to the region where the wirings 41 and 42 of the surface of the substrate 10 are to be formed by an inkjet method using an inkjet printer (step S4). The areas for forming the wirings 41 and 42 are rectangular areas constructed by the lower bank parts 21, 22, 23 and 24 and the upper bank parts 31, 32, 33 and 34, respectively, and the lower bank parts 24, 25, 26, 27 and upper bank sections 34, 35, 36, 37 are rectangular regions.

  In the process of step S4, the metal nano ink may be applied by inputting data representing the positions of these areas to the printer driver of the ink jet printer. Further, the ejection amount of the metal nano ink may be set based on the thickness of the metal nano ink to be applied to the surface of the substrate 10, the application speed by the ink jet method (the moving speed of the head of the ink jet printer), and the like.

  Finally, the metal nano ink applied to the surface of the substrate 10 is baked to remove the organic solvent contained in the metal nano ink, and the metal is baked (step S5). Thereby, the wirings 41 and 42 are formed from the metal nano ink.

  Next, the manufacturing method of the wiring substrate 100 of Embodiment 1 is demonstrated using FIG.3 and FIG.4.

  3 and 4 are diagrams showing steps of manufacturing the wiring substrate 100 according to the first embodiment. 3 and 4 show only the lower bank portions 21, 24 and 27 for the lower bank 20 and the upper bank for the upper bank 30 in order to show the manufacturing process in the cross section shown in FIG. Only the parts 31, 34, 37 are shown.

  First, as shown in FIG. 3A, the lower bank 20 (lower bank portions 21, 24, and 27) molded in advance is transferred to the surface of the substrate 10, so that the lower bank 20 (lower bank) is formed on the surface of the substrate 10. Part 21, 24, 27).

  Next, as shown in FIG. 3B, as a surface treatment for improving hydrophilicity on the surface of the substrate 10 and the surface of the lower bank 20 (lower bank parts 21, 24, 27), for example, Perform treatment to expose to oxygen plasma. In FIG. 3B, oxygen plasma is indicated by an arrow. The exposure to oxygen plasma may be performed by placing the substrate 10 on which the lower bank 20 is formed inside a chamber or the like under a predetermined reduced pressure and generating plasma using oxygen as a mother gas.

  Next, as shown in FIG. 3C, the upper bank 30 (upper bank portions 31, 34, 37) molded in advance is transferred to the upper surface of the lower bank 20 (lower bank portions 21, 24, 27). The upper bank 30 (upper bank units 31, 34, 37) is formed on the upper surface of the lower bank 20 (lower bank units 21, 24, 27).

  Next, as shown in FIG. 3D, a metal nano-ink 40 is applied to a region of the surface of the substrate 10 where the wirings 41 and 42 are formed by an inkjet method. This step may be performed using an ink jet printer capable of ejecting metal nano ink.

  In the cross section shown in FIG. 3D, the regions for forming the wirings 41 and 42 are the region sandwiched between the lower bank portions 21 and 24 and the upper bank portions 31 and 34, and the upper bank portions 24 and 27 and the upper banks, respectively. This is an area sandwiched between the bank portions 34 and 37.

  Here, due to the surface treatment in the process shown in FIG. 3B, the lower bank portions 21, 24, and 27 have higher wettability to the metal nano ink than the upper bank portions 31, 34, and 37. For this reason, as shown in FIG. 4A, even when the position where the ink jet printer ejects the metal nano ink is shifted, the metal nano ink 40 is sandwiched between the lower bank portions 21 and 24 and the upper bank portions 31 and 34. And a region sandwiched between the lower bank portions 24 and 27 and the upper bank portions 34 and 37.

  Therefore, the metal nano ink 40 is prevented from being applied across the upper bank 34, and as a result, the wirings 41 and 42 are prevented from being erroneously connected.

  As a result, as shown in FIG. 3D, the position where the metal nano ink 40 is applied is not shifted, and as shown in FIG. 4A, the position where the metal nano ink 40 is applied is shifted. In either case, as shown in FIG. 4B, the metal nano ink 41A, 42A for forming the wirings 41, 42 can be applied at the correct positions. The correct position here is a region sandwiched between the lower bank portions 21 and 24 and the upper bank portions 31 and 34, and a region sandwiched between the lower bank portions 24 and 27 and the upper bank portions 34 and 37. This is a position intended by design so that the wirings 41 and 42 are originally formed.

  Finally, by firing the metal nano inks 41A and 42A applied to the surface of the substrate 10, as shown in FIG. 4C, the organic solvent contained in the metal nano inks 41A and 42A is removed, and the metal is fired. Thereby, the wirings 41 and 42 are formed from the metal nano ink. The heights of the wirings 41 and 42 shown in FIG. 4C are slightly lower than the heights of the metal nano inks 41A and 42A shown in FIG. This is because the organic solvent is removed and baked.

  The ink jet printer used for the ink jet method may be, for example, either a continuous type or an on-demand type (piezo type or thermal type).

  As described above, the wiring substrate 100 according to the first embodiment includes a two-layer structure of the lower bank 20 and the upper bank 20 formed on the surface of the substrate 10, and wets the surface of the substrate 10 and the surface of the lower bank 20. Surface treatment to improve the properties.

  For this reason, even if a shift occurs in the application position in the step of applying the metal nano ink 40 (see FIG. 4A), the metal nano ink 40 can be prevented from being applied across the upper bank 30.

  Therefore, even if a shift occurs in the position where the metal nano ink 40 is applied in the manufacturing process, the connection between the wirings 41 and 42 is suppressed, and the wiring substrate 100 with high electrical reliability can be manufactured.

  Here, the difference between the comparative wiring board and the wiring board 100 of the first embodiment will be described with reference to FIG.

  FIG. 5 is a diagram for explaining a difference between the comparative wiring board and the wiring board 100 of the first embodiment.

  FIG. 5A is a diagram showing the wiring substrate 1 in which the lower bank 20 and the upper bank 30 are not formed on the surface of the substrate 10 and the surface treatment for improving the wettability is not performed. When the metal nano ink 40 is applied to the surface of the substrate 10 as in the wiring substrate 1, the metal nano ink wets and spreads, and it is difficult to obtain sufficient dimensional controllability to form the wirings 41 and 42. .

  Next, the bank 20A is formed on the surface of the substrate 10 as in the wiring substrate 2 shown in FIG. The cross section of the bank 20A is not trapezoidal but rectangular. The bank 20A has a configuration in which the cross-sectional shape of the lower bank 20 of the first embodiment is changed from a trapezoid to a rectangle.

  When the metal nano ink 40 is applied to the wiring board 2 on which such a bank 20A is formed, if the position where the metal nano ink 40 is applied is shifted as shown in FIG. 5C, the metal nano ink 40 straddles the bank 20A. There is a possibility that the metal nano ink 40A may be generated. In such a case, adjacent wirings that should not be connected in design are electrically connected to each other, so that the reliability of the wiring board 2 is lowered.

  In addition, even if the position where the metal nano ink 40 is applied is not shifted, if the wettability of the surface of the substrate 10 is not sufficiently high, the metal nano ink 40 applied to the surface of the substrate 10 includes bubbles 80. There is a fear. When the metal nano ink 40 in which the bubbles 80 are generated is baked, a thin portion is locally generated in the wiring, a section where the electric resistance is not constant is generated, and the characteristic impedance may be deviated from the design value.

  As described above, with the wiring boards 1 and 2 shown in FIGS. 5A and 5B, it is difficult to ensure sufficient reliability.

  On the other hand, the wiring substrate 100 according to the first embodiment includes a two-layer structure of the lower bank 20 and the upper bank 20, and improves the wettability between the surface of the substrate 10 and the surface of the lower bank 20, thereby Even if the position where the nano ink 40 is applied is displaced, the connection between the wirings 41 and 42 is suppressed, and the wiring substrate 100 with high electrical reliability can be manufactured.

  Moreover, since the cross section of the lower bank 20 and the upper bank 30 is a trapezoid whose lower base is longer than the upper base, the wiring substrate 100 of the first embodiment has a metal nano ink 40 when the metal nano ink 40 is applied by an ink jet method. 40 tends to drip diagonally downward, and a part of the metal nano ink 40 can be prevented from remaining in a state of straddling the wirings 41 and 42.

  As described above, according to the first embodiment, a highly reliable wiring board 100 can be provided.

  In the above description, the surface treatment for improving the wettability is performed on the surface of the substrate 10 and the surface of the lower bank 20. However, the surface treatment is performed only on the surface of the lower bank 20. Also good. In this case, for example, the surface treatment for improving the wettability may be performed on the lower bank 20 before the lower bank 20 is transferred to the substrate 10.

  In the above description, the surface treatment for improving the wettability is performed on the surface of the substrate 10 and the surface of the lower bank 20, but instead of or in addition to this, the upper bank 30 has wettability. You may perform the surface treatment to reduce. Examples of the surface treatment for reducing wettability include a treatment for applying a water-repellent chemical.

<Embodiment 2>
The wiring board 200 of the second embodiment is different in manufacturing method from the wiring board 100 of the first embodiment, but the configuration of the wiring board 200 is substantially the same as the configuration of the wiring board 100. For this reason, each component will be described using the same reference numerals as those in the first embodiment. The difference between the two is that the cross section of the lower bank 20 of the wiring board 200 of the second embodiment is not trapezoidal but rectangular.

  FIG. 6 is a diagram illustrating a procedure of a manufacturing process of the wiring board 200 according to the second embodiment.

  First, an insulating layer is formed on the entire surface of the substrate 10 (step S21). This insulating layer becomes the lower bank 20 by performing an etching process using a mask later. For this reason, the material of the insulating layer may be a polyimide resin or the like that constructs the lower bank 20.

  The polyimide resin layer may be formed, for example, by applying a polyimide varnish and imidizing it.

  Next, a mask is formed on the insulating layer (step S22). Since this mask is used to form the lower bank 20, it only needs to have the same shape as the lower bank 20 in plan view. The mask may be manufactured by forming a photoresist on the entire upper surface of the insulating layer, patterning the same shape as the lower bank 20 by exposure, and performing an etching process.

  Next, unnecessary portions of the insulating layer are removed using a mask (step S23). For example, when the insulating layer is a polyimide resin layer, unnecessary portions may be removed using, for example, a polyimide etching solution manufactured by Toray Engineering Co., Ltd. By step S23, the lower bank 20 is completed.

  Next, surface treatment for improving hydrophilicity is performed on the surface of the substrate 10 and the surface of the lower bank 20 (step S24). Examples of the surface treatment include a treatment in which the surfaces of the substrate 10 and the lower bank 20 are exposed to oxygen plasma.

  Hereinafter, the same processing as Steps S3 to S5 in Embodiment 1 may be performed in Steps S25 to S27.

  Next, the manufacturing method of the wiring board 200 of Embodiment 2 is demonstrated using FIG.7 and FIG.8.

  7 and 8 are diagrams showing steps of manufacturing the wiring substrate 200 according to the second embodiment. 7 and 8 show only the lower bank portions 21, 24, and 27 for the lower bank 20 and the upper bank for the upper bank 30 in order to show the manufacturing process in the cross section shown in FIG. Only the parts 31, 34, 37 are shown.

  First, as shown in FIG. 7A, an insulating layer 250 is formed over the entire surface of the substrate 10. Since the insulating layer 250 will be the lower bank 20 later, it may be a polyimide resin layer or the like that constructs the lower bank 20.

  Next, as illustrated in FIG. 7B, a mask 260 is formed over the insulating layer 250. Since the mask 260 is used to form the lower bank 20, it only needs to have the same shape as the lower bank 20 in plan view. The mask 260 may be manufactured by forming a photoresist on the entire top surface of the insulating layer 250, patterning the same shape as the lower bank 20 by exposure, and performing an etching process.

  Next, as shown in FIG. 7C, unnecessary portions of the insulating layer 250 are removed using a mask 260, whereby the lower bank 20 (lower bank portions 21, 24, 27) is completed. Thereafter, the mask 260A remaining on the lower bank 20 (lower bank portions 21, 24, 27) may be removed.

  Next, as shown in FIG. 7D, as a surface treatment for improving hydrophilicity on the surface of the substrate 10 and the surface of the lower bank 20 (lower bank portions 21, 24, 27), for example, Perform treatment to expose to oxygen plasma. In FIG. 7D, oxygen plasma is indicated by an arrow. The exposure to oxygen plasma may be performed by placing the substrate 10 on which the lower bank 20 is formed inside a chamber or the like under a predetermined reduced pressure and generating plasma using oxygen as a mother gas.

  Thereafter, as shown in FIGS. 8A to 8E, the same processes as those shown in FIGS. 3C, 4D, 4A, 4B, and 4C in the first embodiment are used. By performing this process, the upper bank 30 is formed, the metal nano ink 40 is applied, and the baking process is performed. Thereby, as shown in FIG. 8E, the wiring substrate 200 of the second embodiment is completed.

  As described above, the wiring board 200 according to the second embodiment includes a two-layer structure of the lower bank 20 and the upper bank 20 formed on the surface of the substrate 10, and wets the surface of the substrate 10 and the surface of the lower bank 20. Surface treatment to improve the properties.

  For this reason, even if a shift occurs in the application position in the process of applying the metal nano ink 40 (see FIG. 8C), it is possible to suppress the metal nano ink 40 from being applied across the upper bank 30.

  Therefore, even if the position where the metal nano-ink 40 is applied in the manufacturing process is shifted, the connection between the wirings 41 and 42 is suppressed, and the wiring board 200 with high electrical reliability can be manufactured.

The wiring board and the method for manufacturing the wiring board according to the exemplary embodiments of the present invention have been described above, but the present invention is not limited to the specifically disclosed embodiments, and is claimed. Various modifications and changes can be made without departing from the scope.
Regarding the above embodiment, the following additional notes are disclosed.
(Appendix 1)
A substrate,
A first flange formed on one surface of the substrate;
A second collar part formed on the first collar part along the longitudinal direction of the first collar part and having a width smaller than that of the first collar part;
A third flange formed on one surface of the substrate along the first flange;
A fourth collar part formed on the third collar part along the longitudinal direction of the third collar part, and having a narrower width than the third collar part;
Between the first collar part and the second collar part and the third collar part and the fourth collar part, the first collar part, the second collar part, the third collar part, and the first collar part A wiring formed from metal nano-ink along the four ribs, and
The wiring board in which the wettability of the metal nano-ink in the first and third collars is higher than the wettability of the metal nano-ink in the second and fourth collars.
(Appendix 2)
The wiring board according to appendix 1, wherein the first collar part and the third collar part are subjected to a surface treatment that increases the wettability of the metal nano-ink more than the second collar part and the fourth collar part.
(Appendix 3)
In addition to the first flange portion and the third flange portion, the surface treatment is also applied to a region between the first flange portion and the third flange portion of the one surface of the substrate. The wiring board according to appendix 2.
(Appendix 4)
The wiring board according to any one of appendices 1 to 3, wherein the wiring is formed by firing the metal nano ink formed by an inkjet method.
(Appendix 5)
Supplementary notes 1 to 4, wherein the second collar part and the fourth collar part are subjected to a surface treatment that lowers the wettability of the metal nano-ink than the first collar part and the third collar part. The wiring board according to any one of claims.
(Appendix 6)
The wiring board according to any one of appendices 1 to 5, wherein the second collar part and the fourth collar part are respectively formed in the center part in the width direction of the first collar part and the third collar part. .
(Appendix 7)
A substrate,
A first flange formed on one surface of the substrate;
A second collar part formed on the first collar part along the longitudinal direction of the first collar part and having a width smaller than that of the first collar part;
A wiring formed of metal nano-ink along the first collar and the second collar;
The wiring board in which the wettability of the metal nano-ink in the first collar is higher than the wettability of the metal nano-ink in the second collar.
(Appendix 8)
The wiring board according to appendix 7, wherein the first collar part is subjected to a surface treatment that increases wettability of the metal nano-ink more than the second collar part.
(Appendix 9)
The wiring board according to appendix 7 or 8, wherein the wiring is formed by firing the metal nano ink formed by an inkjet method.
(Appendix 10)
A third flange formed on one surface of the substrate along the first flange;
A fourth hook part formed on the third hook part along the longitudinal direction of the third hook part and having a width smaller than that of the third hook part;
The wiring is formed between the first and second collar parts, and the third and fourth collar parts,
The wiring board according to any one of appendices 7 to 9, wherein the wettability of the metal nano-ink in the third collar part is higher than the wettability of the metal nano-ink in the fourth collar part.
(Appendix 11)
Forming a first flange on one surface of the substrate;
Forming a second collar part narrower than the first collar part on the first collar part along the longitudinal direction of the first collar part;
Forming a third collar along the first collar on one surface of the substrate;
Forming a fourth collar part having a width narrower than that of the third collar part on the third collar part along the longitudinal direction of the third collar part;
Making the wettability of the metal nano-ink of the first and third collars higher than the wettability of the metal nano-ink of the second and fourth collars;
Between the first collar part and the second collar part and the third collar part and the fourth collar part, the first collar part, the second collar part, the third collar part, and the first collar part Forming a wiring from the metal nano ink along the four ribs.
(Appendix 12)
The step of making the wettability of the metal nano-ink of the first and third collars higher than the wettability of the metal nano-ink of the second and fourth collars includes the first collar The method for manufacturing a wiring board according to appendix 11, wherein the third collar part is subjected to a surface treatment that increases the wettability of the metal nano-ink more than the second collar part and the fourth collar part.
(Appendix 13)
A surface that increases the wettability of the metal nano-ink in the region between the first ridge and the third ridge in the one surface of the substrate as compared with the second ridge and the fourth ridge. The method for manufacturing a wiring board according to appendix 12, further comprising a step of performing a treatment.
(Appendix 14)
The step of forming the wiring from the metal nano ink,
Applying the metal nano ink by an inkjet method;
The method for manufacturing a wiring board according to any one of appendices 11 to 13, further comprising: forming the wiring by baking the applied metal nano ink.
(Appendix 15)
In the step of forming the first flange portion and the third flange portion, the sheet member for the first flange portion and the sheet member for the third flange portion are transferred to the one surface of the substrate, respectively. 15. The method for manufacturing a wiring board according to any one of appendices 11 to 14, which is a step to perform.
(Appendix 16)
Forming the first flange and the third flange,
Forming a material layer for the first collar and the third collar on the one surface of the substrate;
Forming a photoresist mask on the material layer;
The method of manufacturing a wiring board according to any one of appendices 11 to 15, further comprising: forming the first flange portion and the third flange portion by performing an etching process using the mask.
(Appendix 17)
The step of forming the second collar part and the fourth collar part includes the sheet member for the second collar part and the fourth collar part on the first collar part and the third collar part, respectively. The method for manufacturing a wiring board according to any one of appendices 11 to 16, which is a step of transferring the sheet-like member.
(Appendix 18)
Forming a first flange on one surface of the substrate;
Forming a second collar part narrower than the first collar part on the first collar part along the longitudinal direction of the first collar part;
Making the wettability of the metal nano-ink of the first collar part higher than the wettability of the metal nano-ink of the second collar part;
Forming a wiring from the metal nano ink along the first collar and the second collar.

DESCRIPTION OF SYMBOLS 100 Wiring board 10 Board | substrate 20 Lower bank 21-27 Lower bank part 30 Upper bank 31-37 Upper bank part 40 Metal nano ink 41, 42 Wiring 200 Wiring board

Claims (11)

A substrate,
A first flange formed on one surface of the substrate;
A second collar part formed on the first collar part along the longitudinal direction of the first collar part and having a width smaller than that of the first collar part;
A third flange formed on one surface of the substrate along the first flange;
A fourth collar part formed on the third collar part along the longitudinal direction of the third collar part, and having a narrower width than the third collar part;
Between the first collar part and the second collar part and the third collar part and the fourth collar part, the first collar part, the second collar part, the third collar part, and the first collar part A wiring formed from metal nano-ink along the four ribs, and
The wiring board in which the wettability of the metal nano-ink in the first and third collars is higher than the wettability of the metal nano-ink in the second and fourth collars.   The wiring board according to claim 1, wherein the first collar part and the third collar part are subjected to a surface treatment that increases wettability of the metal nano-ink more than the second collar part and the fourth collar part. .   In addition to the first flange portion and the third flange portion, the surface treatment is also applied to a region between the first flange portion and the third flange portion of the one surface of the substrate. The wiring board according to claim 2.   The wiring substrate according to claim 1, wherein the wiring is formed by firing the metal nano ink formed by an ink jet method.   The surface treatment which lowers the wettability of the said metal nano ink rather than the said 1st collar part and the said 3rd collar part is given to the said 2nd collar part and the said 4th collar part. The wiring board according to any one of the above.   6. The wiring according to claim 1, wherein the second collar part and the fourth collar part are respectively formed in the center part in the width direction of the first collar part and the third collar part. substrate. A substrate,
A first flange formed on one surface of the substrate;
A second collar part formed on the first collar part along the longitudinal direction of the first collar part and having a width smaller than that of the first collar part;
A wiring formed of metal nano-ink along the first collar and the second collar;
The wiring board in which the wettability of the metal nano-ink in the first collar is higher than the wettability of the metal nano-ink in the second collar. Forming a first flange on one surface of the substrate;
Forming a second collar part narrower than the first collar part on the first collar part along the longitudinal direction of the first collar part;
Forming a third collar along the first collar on one surface of the substrate;
Forming a fourth collar part having a width narrower than that of the third collar part on the third collar part along the longitudinal direction of the third collar part;
Making the wettability of the metal nano-ink of the first and third collars higher than the wettability of the metal nano-ink of the second and fourth collars;
Between the first collar part and the second collar part and the third collar part and the fourth collar part, the first collar part, the second collar part, the third collar part, and the first collar part Forming a wiring from the metal nano ink along the four ribs.   The step of making the wettability of the metal nano-ink of the first and third collars higher than the wettability of the metal nano-ink of the second and fourth collars includes the first collar 9. The method for manufacturing a wiring board according to claim 8, wherein the third collar part is subjected to a surface treatment for increasing the wettability of the metal nano-ink more than the second collar part and the fourth collar part.   A surface that increases the wettability of the metal nano-ink in the region between the first ridge and the third ridge in the one surface of the substrate as compared with the second ridge and the fourth ridge. The method for manufacturing a wiring board according to claim 9, further comprising a step of performing a treatment. The step of forming the wiring from the metal nano ink,
Applying the metal nano ink by an inkjet method;
The method of manufacturing a wiring board according to claim 8, further comprising: forming the wiring by baking the applied metal nano ink.

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