JP2015048424A5 - - Google Patents
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- JP2015048424A5 JP2015048424A5 JP2013181648A JP2013181648A JP2015048424A5 JP 2015048424 A5 JP2015048424 A5 JP 2015048424A5 JP 2013181648 A JP2013181648 A JP 2013181648A JP 2013181648 A JP2013181648 A JP 2013181648A JP 2015048424 A5 JP2015048424 A5 JP 2015048424A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- polyamide resin
- composition according
- mass
- polyamide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004952 Polyamide Substances 0.000 claims description 32
- 229920002647 polyamide Polymers 0.000 claims description 32
- 239000011528 polyamide (building material) Substances 0.000 claims description 32
- 239000011342 resin composition Substances 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000005749 Copper compound Substances 0.000 claims description 8
- 150000001880 copper compounds Chemical class 0.000 claims description 8
- 239000003365 glass fiber Substances 0.000 claims description 8
- 150000002366 halogen compounds Chemical class 0.000 claims description 8
- -1 copper halide Chemical class 0.000 claims description 7
- 239000000314 lubricant Substances 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 6
- 239000004594 Masterbatch (MB) Substances 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000004581 coalescence Methods 0.000 claims description 2
- 239000003086 colorant Substances 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 238000002425 crystallisation Methods 0.000 claims description 2
- 230000005712 crystallization Effects 0.000 claims description 2
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 2
- 238000000113 differential scanning calorimetry Methods 0.000 claims description 2
- 239000000194 fatty acid Substances 0.000 claims description 2
- 150000004665 fatty acids Chemical class 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 239000011256 inorganic filler Substances 0.000 claims description 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 238000004513 sizing Methods 0.000 claims description 2
- 239000011780 sodium chloride Substances 0.000 claims description 2
- 230000032683 aging Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Description
〔１〕
（Ａ）ポリアミド６１０樹脂：１００質量部と、
（Ｂ）ガラス繊維：１〜２００質量部と、
（Ｃ）ガラス繊維以外の無機充填材：０．１〜１０質量部と、
（Ｄ）滑剤：０．０１〜１０質量部と、
を、含有するポリアミド樹脂組成物。
〔２〕
前記（Ｄ）滑剤の融点が１１０〜１５０℃である、前記〔１〕に記載のポリアミド樹脂
組成物。
〔３〕
前記（Ｄ）滑剤が、金属含有量が３．５〜１１．５質量％の高級脂肪酸金属塩である、
前記〔１〕又は〔２〕に記載のポリアミド樹脂組成物。
〔４〕
ＪＩＳ Ｋ７１２１に従った示差走査熱量測定（但し、冷却速度を２０℃／分として冷
却する。）により得られる、前記ポリアミド樹脂組成物中の前記（Ａ）ポリアミド６１０
樹脂の補外結晶化開始温度（Ｔic）が、２００℃以上である、〔１〕乃至〔３〕のいずれ
か一に記載のポリアミド樹脂組成物。
〔５〕
前記（Ａ）ポリアミド６１０樹脂の、９８％硫酸中で測定した相対粘度が、２．０〜３
．０である、前記〔１〕乃至〔４〕のいずれか一に記載のポリアミド樹脂組成物。
〔６〕
前記（Ｂ）ガラス繊維が、カルボン酸無水物含有不飽和ビニル単量体と、当該カルボン
酸無水物含有不飽和ビニル単量体を除く不飽和ビニル単量体を、重合単位として具備する
共重合体を含む集束剤により処理されているガラス繊維である、前記〔１〕乃至〔５〕の
いずれか一に記載のポリアミド樹脂組成物。
〔７〕
（Ｅ）銅化合物及びハロゲン化合物（ただし、ハロゲン化銅を除く。）：０．００２〜
２質量部を、さらに含む、前記〔１〕乃至〔６〕のいずれか一に記載のポリアミド樹脂組
成物。
〔８〕
前記（Ｅ）銅化合物及びハロゲン化合物（ただし、ハロゲン化銅を除く。）中のハロゲン元素の含有量ｘと、銅元素の含有量ｙとのモル比ｘ／ｙが、２／１〜５０／１である、前記〔７〕に記載のポリアミド樹脂組成物。
〔９〕
前記（Ｅ）銅化合物及びハロゲン化合物（ただし、ハロゲン化銅を除く。）が、ポリアミドマスターバッチの形態で添加される、前記〔７〕又は〔８〕に記載のポリアミド樹脂組成物。
〔１０〕
（Ｆ）着色剤：０．０１〜５質量部をさらに含む、前記〔１〕乃至〔９〕のいずれか一
に記載のポリアミド樹脂組成物。
〔１１〕
前記〔１〕乃至〔１０〕のいずれか一に記載のポリアミド樹脂組成物を含む成形品。
[1]
(A) Polyamide 610 resin: 100 parts by mass;
(B) Glass fiber: 1 to 200 parts by mass;
(C) Inorganic filler other than glass fiber: 0.1 to 10 parts by mass;
(D) Lubricant: 0.01 to 10 parts by mass;
A polyamide resin composition.
[2]
The polyamide resin composition according to the above [1], wherein the melting point of the (D) lubricant is 110 to 150 ° C.
[3]
The (D) lubricant is a higher fatty acid metal salt having a metal content of 3.5 to 11.5% by mass,
The polyamide resin composition according to [1] or [2].
[4]
The (A) polyamide 610 in the polyamide resin composition obtained by differential scanning calorimetry according to JIS K7121 (provided cooling is performed at a cooling rate of 20 ° C./min).
The polyamide resin composition according to any one of [1] to [3], wherein an extrapolated crystallization start temperature (T ic ) of the resin is 200 ° C. or higher.
[5]
The relative viscosity of the (A) polyamide 610 resin measured in 98% sulfuric acid is 2.0-3.
. The polyamide resin composition according to any one of [1] to [4], which is 0.
[6]
Copolymer comprising the (B) glass fiber having a carboxylic acid anhydride-containing unsaturated vinyl monomer and an unsaturated vinyl monomer excluding the carboxylic acid anhydride-containing unsaturated vinyl monomer as polymerized units. The polyamide resin composition according to any one of the above [1] to [5], which is a glass fiber treated with a sizing agent containing coalescence.
[7]
(E) Copper compound and halogen compound (excluding copper halide): 0.002
The polyamide resin composition according to any one of [1] to [6], further including 2 parts by mass.
[8]
The (E) a copper compound and a halogen compound (excluding. Copper halide) and the content x of the halogen element in that the molar ratio x / y between the content y of copper element, 2 / 1-50 / The polyamide resin composition according to [7], which is 1.
[9]
The (E) a copper compound and a halogen compound (excluding a copper halide.) Is added in the form of a polyamide masterbatch, polyamide resin composition according to the above [7] or [8].
[10]
(F) Colorant: The polyamide resin composition according to any one of [1] to [9], further including 0.01 to 5 parts by mass.
[11]
A molded article comprising the polyamide resin composition according to any one of [1] to [10].
前記（Ｅ）銅化合物及びハロゲン化合物（ただし、ハロゲン化銅を除く。）は、マスターバッチの形態で添加されることが好ましい。
前記（Ｅ）銅化合物及びハロゲン化合物をマスターバッチの形態で添加することにより
、（Ｅ）成分の分散性が向上し、耐熱エージング特性の向上、腐食の防止、銅析出を一層
抑制できる。
The (E) a copper compound and a halogen compound (excluding a copper halide.) Is preferably added in the form of a masterbatch.
By adding the (E) copper compound and the halogen compound in the form of a masterbatch, the dispersibility of the (E) component is improved, heat aging characteristics are improved, corrosion is prevented, and copper precipitation can be further suppressed.
Claims (11)
（Ｂ）ガラス繊維：１〜２００質量部と、
（Ｃ）ガラス繊維以外の無機充填材：０．１〜１０質量部と、
（Ｄ）滑剤：０．０１〜１０質量部と、
を、含有するポリアミド樹脂組成物。 (A) Polyamide 610 resin: 100 parts by mass;
(B) Glass fiber: 1 to 200 parts by mass;
(C) Inorganic filler other than glass fiber: 0.1 to 10 parts by mass;
(D) Lubricant: 0.01 to 10 parts by mass;
A polyamide resin composition.
成物。 The polyamide resin composition according to claim 1, wherein the melting point of the (D) lubricant is 110 to 150 ° C.
請求項１又は２に記載のポリアミド樹脂組成物。 The (D) lubricant is a higher fatty acid metal salt having a metal content of 3.5 to 11.5% by mass,
The polyamide resin composition according to claim 1 or 2.
却する。）により得られる、前記ポリアミド樹脂組成物中の前記（Ａ）ポリアミド６１０
樹脂の補外結晶化開始温度（Ｔic）が、２００℃以上である、請求項１乃至３のいずれか
一項に記載のポリアミド樹脂組成物。 The (A) polyamide 610 in the polyamide resin composition obtained by differential scanning calorimetry according to JIS K7121 (provided cooling is performed at a cooling rate of 20 ° C./min).
The polyamide resin composition according to any one of claims 1 to 3, wherein an extrapolated crystallization start temperature (T ic ) of the resin is 200 ° C or higher.
．０である、請求項１乃至４のいずれか一項に記載のポリアミド樹脂組成物。 The relative viscosity of the (A) polyamide 610 resin measured in 98% sulfuric acid is 2.0-3.
. The polyamide resin composition according to any one of claims 1 to 4, which is 0.
酸無水物含有不飽和ビニル単量体を除く不飽和ビニル単量体を、重合単位として具備する
共重合体を含む集束剤により処理されているガラス繊維である、請求項１乃至５のいずれ
か一項に記載のポリアミド樹脂組成物。 Copolymer comprising the (B) glass fiber having a carboxylic acid anhydride-containing unsaturated vinyl monomer and an unsaturated vinyl monomer excluding the carboxylic acid anhydride-containing unsaturated vinyl monomer as polymerized units. The polyamide resin composition according to any one of claims 1 to 5, which is a glass fiber treated with a sizing agent containing coalescence.
２質量部を、さらに含む、請求項１乃至６のいずれか一項に記載のポリアミド樹脂組成物
。 (E) Copper compound and halogen compound (excluding copper halide): 0.002
The polyamide resin composition according to any one of claims 1 to 6, further comprising 2 parts by mass.
載のポリアミド樹脂組成物。 (F) Colorant: The polyamide resin composition as described in any one of Claims 1 thru | or 9 which further contains 0.01-5 mass parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013181648A JP6195766B2 (en) | 2013-09-02 | 2013-09-02 | Polyamide resin composition and molded product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013181648A JP6195766B2 (en) | 2013-09-02 | 2013-09-02 | Polyamide resin composition and molded product |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015048424A JP2015048424A (en) | 2015-03-16 |
| JP2015048424A5 true JP2015048424A5 (en) | 2015-07-23 |
| JP6195766B2 JP6195766B2 (en) | 2017-09-13 |
Family
ID=52698707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013181648A Active JP6195766B2 (en) | 2013-09-02 | 2013-09-02 | Polyamide resin composition and molded product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6195766B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017039818A (en) * | 2015-08-18 | 2017-02-23 | 旭化成株式会社 | Polyamide resin composition, method for producing polyamide resin composition, and molded article |
| CN113474408A (en) * | 2019-02-25 | 2021-10-01 | 株式会社可乐丽 | Waterproof member, electronic device provided with same, waterproof method using insert molded body, and waterproof method for electronic device |
| JP7525290B2 (en) | 2020-04-20 | 2024-07-30 | 旭化成株式会社 | Polyamide resin composition and molded article |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4488563B2 (en) * | 1999-11-05 | 2010-06-23 | 旭化成ケミカルズ株式会社 | Reinforced polyamide resin composition with excellent moldability |
| JP2003238804A (en) * | 2002-02-21 | 2003-08-27 | Asahi Kasei Corp | Polyamide resin composition for furniture and its molded article |
| JP2005162821A (en) * | 2003-12-01 | 2005-06-23 | Asahi Kasei Chemicals Corp | Polyamide resin composition |
| DE102004051241A1 (en) * | 2004-10-20 | 2006-05-04 | Basf Ag | Flowable polyamides with hyperbranched polyesters / polycarbonates |
| US8474518B2 (en) * | 2007-03-19 | 2013-07-02 | Denso Corporation | Automobile cooling system component |
| EP2121820B1 (en) * | 2007-03-19 | 2010-11-17 | E. I. Du Pont de Nemours and Company | Polyamide resin compositions |
| JP2009120692A (en) * | 2007-11-14 | 2009-06-04 | Nissan Motor Co Ltd | Resin composition and its manufacturing method |
| TWI417329B (en) * | 2008-07-18 | 2013-12-01 | Ticona Llc | Flame retardant polymer composition |
| JP5482186B2 (en) * | 2009-02-26 | 2014-04-23 | 東レ株式会社 | Method for producing polyamide masterbatch and method for producing polyamide resin composition |
| JP2010269995A (en) * | 2009-04-22 | 2010-12-02 | Asahi Kasei Chemicals Corp | Glass fiber sizing agent and glass fiber-reinforced thermoplastic resin composition |
| JP5844627B2 (en) * | 2011-12-06 | 2016-01-20 | 旭化成ケミカルズ株式会社 | Polyamide resin composition and molded product |
-
2013
- 2013-09-02 JP JP2013181648A patent/JP6195766B2/en active Active
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