JP2015046303A - Lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamp having good heat radiation characteristics compared to a conventional lamp.SOLUTION: A lamp 1 includes: a base 40 where a light emitting module 50, on which LEDs 52 are mounted, is disposed; a lighting circuit unit 30; a housing 10 which is thermally coupled to the lighting circuit unit 30 and houses the lighting circuit unit 30; and heat radiation fins 45 thermally coupled to the LEDs 52. First outer air circulates in gaps 46 between the respective heat radiation fins 45. A through hole 44, an opening part 53, and an opening 62 are respectively provided at the base 40, the light emitting module 50, and a translucent cover 60 so as to take in second outer air into the atmosphere of the housing 10.

Description

  The present invention relates to a lamp using a semiconductor light emitting element such as an LED (Light Emitting Device).

In recent years, a lamp using a semiconductor light emitting element such as an LED as a light source has been widely used as a lamp excellent in power saving (for example, Patent Document 1).
A lamp 1100 disclosed in Patent Document 1 is shown in a partial cross-sectional view of FIG. The lamp 1100 includes a light emitting module 1110 having LEDs, a lighting circuit unit 1120, and a cylindrical housing 1130 that houses the lighting circuit unit 1120. A plurality of plate-shaped heat radiation fins 1140 are provided radially around the axis of the lamp 1100 on the outer peripheral surface of the housing 1130. The light emitting module 1110 and the lighting circuit unit 1120 are disposed so as to be thermally coupled to the housing 1130. A base 1150 is formed at the end of the housing 1130.

  Usually, the lamp 1100 is mounted with a base 1150 attached to a socket of a lighting fixture provided on the ceiling of the building material, and the main emission direction is directed in the vertical direction (downward in FIG. 12). When the lamp 1100 is turned on, the air around the lamp 1100 is warmed by heat generated by driving each of the light emitting module 1110 and the lighting circuit unit 1120. As a result, an upward air flow is generated around the lamp 1100. This air flows through the gap between the adjacent radiating fins 1140. Thereby, the heat of each radiating fin 1140 is radiated to the outside air. The radiating fin 1140 has an air rectifying action. For this reason, when the heat radiation fin 1140 is used as the heat radiation means, new air can be smoothly fed into the gap between the heat radiation fins 1140 and the air after heat radiation can be quickly exhausted.

JP 2011-258372 A

In order to extend the life of the lamp using the semiconductor light emitting element as described above, it is important to more efficiently dissipate heat generated by driving the semiconductor light emitting element and the lighting circuit unit. For this reason, it is desired that the lamp has good heat dissipation characteristics.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a lamp having better heat dissipation characteristics than before.

  In order to solve the above-described problem, a lamp according to an aspect of the present invention includes a substrate, a plurality of semiconductor light emitting elements mounted on the substrate, a plate shape, a first region on a first main surface, and the A second region adjacent to the first region, wherein the substrate is disposed in the second region, and disposed on a second principal surface opposite to the first principal surface of the base. A housing, a lighting circuit unit that is housed in the housing and lights each of the semiconductor light emitting elements, and a plurality of radiating fins that are erected at positions that do not interfere with the housing on the second main surface of the base. The first region of the base has a through hole that exposes a part of the housing to the first main surface side of the base, and the outside air that reaches the housing from the outside through the through hole It is set as the structure which has this flow path.

Here, as another aspect of the present invention, the second region is annular, and the substrate is an annular substrate disposed over the entire circumference of the second region, and the opening of the substrate is a through hole in the base. It can also be set as the structure communicated with.
In another aspect of the present invention, the plurality of semiconductor light emitting elements may be configured to surround the opening of the substrate.

In another aspect of the present invention, the peripheral shape of the opening of the substrate and the peripheral shape of the through hole of the base are both circular, and the inner diameter of the opening of the substrate is larger than the inner diameter of the through hole, When the base is viewed in plan, the entire periphery of the through hole of the base may be exposed inside the opening of the substrate.
In another aspect of the present invention, the shape of the casing viewed from a direction perpendicular to the first main surface of the base is circular, and the inner diameter of the through hole of the base is equal to the outer diameter of the casing. It can also be set as 1/10 or more and 1/4 or less.

Further, in another aspect of the present invention, the housing has a plurality of ribs protruding from the base side, and is joined to the base at the top of each rib, and between each rib, A space communicating with the gap exists, and the through hole of the base may be configured to communicate with the space together with the opening of the substrate.
Moreover, in another aspect of the present invention, on the second main surface, the housing is disposed inward from the periphery of the base, and the heat radiating fins are disposed so as to surround the outer periphery of the housing. It can also be configured.

In another aspect of the present invention, the base may have a translucent cover that is arranged so that the through hole of the base communicates with the outside air and covers the substrate.
Moreover, in another aspect of this invention, it can also be set as the structure by which each said radiation fin is radially formed toward the periphery from the inner side of the 2nd main surface of the said base.
In another aspect of the present invention, the base may be configured using a metal member, and the housing may be configured using an electrically insulating member.

In another aspect of the present invention, the base and the casing can be integrally formed using an electrical insulating member.
In another aspect of the present invention, the housing may have a base for supplying power to the semiconductor light emitting elements from the outside via the lighting circuit unit.

  In the lamp according to one aspect of the present invention, heat generated by driving each semiconductor light emitting element is transferred to each heat radiating fin through the base. The heat of each radiation fin is radiated to the outside air flowing through the gap between each radiation fin. On the other hand, heat generated by driving the lighting circuit unit is transferred to the housing. Here, a part of the casing is exposed to the outside on the first main surface side of the base through a through hole existing in the base. Therefore, the heat generated by driving the lighting circuit unit is radiated to the outside air taken in through the through hole through the housing.

As described above, in the lamp according to one aspect of the present invention, each heat of the semiconductor light emitting element and the lighting circuit unit is dissipated to the outside air passing through different flow paths. For this reason, each of the semiconductor light emitting element and the lighting circuit unit can be efficiently radiated.
As a result, it is possible to provide a lamp having better heat dissipation characteristics than conventional ones.

FIG. 2 is an external configuration diagram of the lamp 1 according to the first embodiment when viewed from obliquely above. FIG. 2 is an external configuration diagram of the lamp 1 according to the first embodiment when viewed from obliquely below. Exploded view showing the internal structure of the lamp 1 External configuration diagram of the base 40 and the light emitting module 50 as viewed from obliquely above External configuration view of base 40 as viewed from diagonally below External configuration diagram of translucent cover 60 viewed from the back side Schematic diagram for explaining conventional problems Schematic cross-sectional view for explaining the effect produced by the lamp 1 Schematic diagram for explaining the effect produced by the lamp 1 The front view which shows the structure of 50 A of light emitting modules of Embodiment 2. FIG. The front view which shows the structure of the light emitting module 50B of Embodiment 3. FIG. External configuration diagram of a conventional lamp 1100

<Embodiment 1>
Hereinafter, a lamp according to Embodiment 1 of the present invention will be described with reference to the drawings.
(Configuration of lamp 1)
As shown in FIGS. 1 and 2, the lamp 1 has a bulb shape.
As shown in FIG. 3, the lamp 1 includes a housing 10, an elastic member 20, a lighting circuit unit 30, a base 40, a heat radiating fin 45, a light emitting module 50, and a translucent cover 60. Yes. The lamp 1 can be used by attaching the base 11 of the housing 10 to a socket of a lighting fixture.

Next, the lamp 1 will be described for each component.
[Case 10]
As shown in FIG. 3, the housing 10 includes a base 11, a circuit storage unit 12, and a lid 13. The housing 10 has a cylindrical shape as a whole.
The base 11 is a component for connecting the lamp 1 to a socket of a lighting fixture. In addition, the base 11 supplies the lighting circuit unit 30 with AC power from an external commercial power source. The base 11 includes a male screw-shaped shell 111 and an eyelet 112 that is electrically insulated from the shell 111. The shell 111 and the eyelet 112 are each made of a conductive member such as a metal material. The shape of the base 11 can be set to, for example, the E26 standard or the E39 standard in accordance with the standard of the socket of the lighting fixture.

  The circuit storage unit 12 stores the lighting circuit unit 30 therein. The circuit storage unit 12 is a cylindrical body. A plurality of ribs (not shown) are erected in the circuit housing portion 12. A substrate 31 of the lighting circuit unit 30 is sandwiched between the ribs. Thereby, the lighting circuit unit 30 and the circuit housing part 12 are thermally coupled. An engagement hole 120 that can be engaged with the engagement claw 134 of the lid 13 is provided on the outer periphery of the circuit housing portion 12. The base 11 is disposed at one end in the longitudinal direction of the circuit housing portion 12.

The lid 13 is attached to the other longitudinal end of the circuit storage unit 12. Accordingly, the lid 13 seals the inside of the circuit storage unit 12. The lid 13 includes a disk-shaped base 130 and a plurality of ribs 131.
Each rib 131 is erected on the surface of the lid 13. As a result, each rib 131 protrudes toward the base 40 in the housing 10. Specifically, each rib 131 is erected along the peripheral edge of the surface of the base 130. A gap 132 exists between adjacent ribs 131. Thereby, in the lamp 1, a space P communicating with the gap 46 of the heat radiating fin 45 through the gap 132 exists between the lid 13 and the base 40. An insertion hole 133 that exposes the wiring 33 of the lighting circuit unit 30 to the outside is provided in the center of the base 130. An engagement claw 134 that is engaged with the engagement hole 120 of the circuit storage portion 12 is extended around the base 130. The lid 13 is attached to the circuit storage portion 12 using the engagement claw 134 and the engagement hole 120. As a result, the circuit housing portion 12 and the lid 13 are thermally coupled.

  The rib 131 is a part for joining the housing 10 to the base 40. An adhesive member is disposed on the top of the rib 131 facing the base 40. By this adhesive member, the rib 131 and the second main surface 40Y (see FIG. 3) of the base 40 are joined. A well-known thing can be used as an adhesive member. When a low thermal conductive adhesive member is used, heat transfer between the housing 10 and the base 40 can be suppressed. Alternatively, the rib 131 and the base 40 may be coupled using a screwing method.

The circuit housing part 12 and the lid 13 are both made of an electrically insulating member such as a resin material.
[Elastic member 20]
The elastic member 20 covers the periphery of the base 11 when the base 11 is attached to the socket of the lighting fixture. This prevents moisture, dust and the like from adhering to the periphery of the base 11 from the outside. The elastic member 20 is a flexible annular member. The elastic member 20 is comprised with a flexible resin material, an elastomer material, etc. as an example. The elastic member 20 is attached to the outer periphery of the housing 10. In the lamp 1, the elastic member 20 is densely mounted over the entire outer periphery of the circuit housing portion 12.

[Lighting circuit unit 30]
The lighting circuit unit 30 converts AC power supplied from the outside through the base 11 into DC power. Further, the lighting circuit unit 30 supplies DC power to each LED 52 of the light emitting module 50 to light it. As shown in FIG. 3, the lighting circuit unit 30 includes a substrate 31, a plurality of electronic components 32 mounted on the substrate 31, and a plurality of wirings 33 connected to the substrate 31.

The electronic component 32 includes an element such as an electrolytic capacitor.
Each wiring 33 has a connector 33A at one end. The connector 33A is connected to the socket 53 (see FIG. 4) of the light emitting module 50. By connecting the connector 33 </ b> A to the socket 53, the lighting circuit unit 30 is electrically connected to each LED 52 via each wiring 33. Further, the lighting circuit unit 30 has a wiring (not shown) connected to the substrate 31. This wiring is electrically connected to the shell 111 and the eyelet 112 of the base 11 respectively.

[Base 40]
The base 40 is a component on which the light emitting module 50 is disposed. Further, the base 40 transfers heat generated by the LEDs 52 of the light emitting module 50 to the heat radiating fins 45. As shown in FIGS. 4 and 5, the base 40 includes a flat plate portion 41, an outer rib 42, and an inner rib 43. As an example, the base 40 is formed using a good heat conductive material, for example, a metal material such as aluminum, an aluminum alloy, or a magnesium alloy.

The flat plate portion 41 has a disk shape and is formed in a size that allows the light emitting module 50 to be placed thereon. The flat plate portion 41 has a first main surface 40X that faces the light emitting module 50, and a second main surface 40Y that faces the housing 10 and the heat radiating fins 45 and is located on the opposite side of the first main surface 40X. As shown in FIGS. 3 to 5, a circular through hole 44 is provided in the center of the flat plate portion 41. Specifically, the base 40 in a first main surface 40X, a first region A _1, adjacent to the first region A ₁ (here surrounded by the first region A ₁ as an example) and a second region A ₂ Have A through hole 44 is provided in the first region A ₁ . The second region A ₂ (the upper surface of the flat plate portion 41) is annular. In the lamp 1 over the entire circumference of the second region A _2, the substrate 51 of the light emitting module 50 is arranged.

The outer rib 42 is erected from the first main surface 40 </ b> X along the outer side (periphery) of the flat plate portion 41.
The inner rib 43 is erected from the first main surface 40 </ b> X along the inner side of the flat plate portion 41 (periphery of the through hole 44) in the same manner as the outer rib 42. The outer rib 42 and the inner rib 43 surround the first main surface 40X of the base 40.
The through hole 44 is provided so as to expose a part of the housing 10 (specifically, the surface of the base 130) through the opening 53 of the light emitting module 50 (see FIGS. 1 and 3). As a specific shape, the through hole 44 has a circular peripheral shape. Further, as shown in FIG. 3, the inner diameter D ₁ of the through hole 44 is set slightly smaller than the outer diameter D ₂ of the lid 13 of the housing 10. In the lamp 1, the through hole 44 functions as a part of a flow path that sends outside air around the housing 10.

The inner diameter D ₁ of the through hole 44 can be adjusted as appropriate. It is desirable that the inner diameter D ₁ of the through hole 44 be in a range where both the efficiency of taking in outside air and the securing of the area of the light emitting module 50 can be achieved. In the lamp 1, the shape of the housing 10 viewed from a direction perpendicular to the surface of the first main surface 40X of the base 40 is circular (FIG. 3). In this case, for example, the inner diameter D ₁ of the through hole 44 can be in a range of 1/10 to 1/4 of the outer diameter D ₂ of the housing 10. Thus, by making the inner diameter D ₁ of the through hole 44 sufficiently larger than the outer diameter D ₂ of the housing 10, even when the lamp 1 is disposed at an inclination from the vertical direction, it is relatively abundant. Outside air can be taken into the through hole 44 from the vertical direction.

[Heat radiation fin 45]
The heat radiation fins 45 mainly radiate heat generated by driving the LEDs 52 to the outside air. As an example, the radiating fin 45 is configured integrally with the base 40. In other words, a plurality of the radiating fins 45 are erected on the second main surface 40Y of the base 40 so as to be in contact with the outside air at intervals from each other (FIG. 5). Each radiating fin 45 is a plate, and the length in the direction perpendicular to the surface of the second main surface 40Y (the lamp axis direction) is a height H. In addition, each of the radiating fins 45 has a width W in a direction parallel to both main surfaces and along the surface of the second main surface 40Y. Furthermore, each radiating fin 45 has a thickness D as a distance between both main surfaces. Specifically, the heat radiating fins 45 are spaced from each other and are radiated from the inner side of the second main surface 40Y (here, the center of the surface along the second main surface 40Y) toward the periphery. The gap 46 communicates with the through hole 44 and the opening 53.

  Note that the housing 10 is disposed in the region B on the inner side of the periphery of the base 40 on the second main surface 40Y. At this time, the heat radiation fin 45 is erected so as to surround the outer periphery of the housing 10 at a position where it does not interfere with the housing 10 on the base 40. The separation of the radiating fins 45 and the housing 10 in this way is a device for suppressing the formation of a heat transfer path between each radiating fin 45 and the housing 10. Moreover, the envelope volume of the lamp | ramp 1 can be designed comparatively compact by arrange | positioning both the radiation fin 45 and the housing | casing 10 on the 2nd main surface 40Y.

It should be noted that the width W of the radiating fin 45 may be secured relatively short, or the thickness D of the radiating fin 45 may be made relatively thin. By performing any one of these measures, the gap 46 is widened, and the outside air existing around the lamp 1 can be abundantly taken into the gap 46.
[Light Emitting Module 50]
As shown in FIGS. 3 and 4, the light emitting module 50 includes a substrate 51, an LED 52, and a socket 53.

A plurality of LEDs 52 are arranged on the substrate 51. The substrate 51 includes a metal substrate, an insulating layer stacked on the metal substrate, and a wiring pattern (both not shown) formed on the insulating layer. The metal substrate transfers heat generated by driving the LED 52 to the base 40 side. The insulating layer insulates the metal substrate from the wiring pattern.
The substrate 51 is an annular substrate. An opening 53 exists inside the substrate 51. Each LED 52 is mounted on the upper surface 51 </ b> X of the substrate 51. The lower surface 51Y of the substrate 51 is disposed so as to be in close contact with the second region A ₂ (the upper surface of the flat plate portion 41) of the first main surface 40X of the base 40. The contour shape of the substrate 51 is circular according to the shape of the flat plate portion 41 of the base 40. The substrate 51 has a screw hole (not shown) penetrating in the thickness direction. The substrate 51 is fixed to the flat plate portion 41 by screwing screws inserted into the respective screw holes into the flat plate portion 41.

The LED 52 is a light source of the lamp 1. The LED 52 is an SMD (Surface Mount Device) type. The LED 52 is an example of a semiconductor light emitting element. The LED 52 includes an element body, a mortar-shaped reflecting member surrounding the element body, and a sealing body filled in the reflecting member.
In the lamp 1, a plurality of LEDs 52 are divided into a plurality of groups and mounted on each substrate 51. As a specific example, in the light emitting module 50, a total of 48 LEDs 52 surround the opening 53 and are arranged to form a double annular element array. Thereby, when the lamp 1 is driven, a wide light distribution is obtained.

The opening 53 is arranged to communicate with the through hole 44 of the base 40 in the lamp 1. Thereby, outside air is circulated from the center of the substrate 51 to the through hole 44 of the base 40. The peripheral shape of the opening 53 is circular like the peripheral shape of the through hole 44. The inner diameter D ₃ of the opening 53 is set to a value (D ₃ > D ₁ ) that is slightly larger than the outer diameter D ₁ of the inner rib 43 of the base 40. Therefore, in the lamp 1, when the base 40 is viewed in plan, the entire circumference of the through hole 44 can be exposed inside the opening 53 (FIG. 1). This is a device for efficiently circulating outside air through the through hole 44. An inner rib 43 can be inserted into the periphery of the opening 53. As described above, the lamp 1 has a flow path of outside air from the outside to the housing 10 by the opening 53 and the through hole 44.

The socket 53 is a component that electrically connects the connector 33 </ b> A of the wiring 33 of the lighting circuit unit 30. The socket 53 is mounted on the wiring pattern of the substrate 51 like the LED 52.
[Translucent cover 60]
The translucent cover 60 covers the light emitting module 50. Further, the translucent cover 60 transmits the light emitted from each LED 52 when the lamp 1 is driven. As shown in FIG. 3 and FIG. 6, the translucent cover 60 is formed in a bowl shape as a whole. The translucent cover 60 has a cylindrical portion 61 erected on the light emitting module 50 side at the center of the concave surface (back surface) facing the light emitting module 50. The internal space of the cylindrical portion 61 communicates with the outside through the opening 62.

The cylindrical portion 61 is disposed with respect to the base 40 so that one end in the longitudinal direction thereof is in contact with the top of the inner rib 43. The opening 62 communicates with the opening 53 and the through hole 44 in a state where the lamp 1 is assembled. The inner diameter D ₄ of the opening 62 is set to be equal to or greater than the inner diameter D ₁ of the through hole 44 (FIG. 3). Thereby, the inside of the through hole 44 is exposed to the outside without being closed by the translucent cover 60.

The translucent cover 60 is formed using, for example, an acrylic resin such as polymethyl methacrylate (PMMA), a transparent resin material such as polyethylene terephthalate (PET), polycarbonate (PC), or silicon resin, or a glass material. The The translucent cover 60 is joined to the top of the outer rib 42 of the base 40 with an adhesive, for example.
As described above, the lamp 1 includes a substrate 51, a plurality of semiconductor light emitting element mounted on the substrate 51 (LED 52), a plate-like, and the first region A ₁ on the first main surface 40X, first A base 40 having a second region A ₂ surrounding the region A ₁ , the substrate 51 being disposed in the second region A ₂ , a housing 10 disposed on the second main surface 40Y of the base 40, and a housing 10, a lighting circuit unit 30 that lights each semiconductor light emitting element (LED 52), and a plurality of radiating fins 45 erected at positions that do not interfere with the housing 10 on the second main surface 40 </ b> Y of the base 40. provided, in the first area a ₁ of the base 40, the outside air reaching there is a through hole 44 which exposes a portion of the housing 10 to the first principal face 40X side, from the outside through the through hole 44 in the housing 10 It is set as the structure which has the following flow path.

(Driving of lamp 1)
When driving the lamp 1, the user previously attaches the base 11 of the lamp 1 to the socket of the lighting fixture. The user operates the power supply device and supplies AC power to the lamp 1 through the socket of the lighting fixture. Thereby, the lighting circuit unit 30 of the lamp 1 converts AC power into DC power. When the lighting circuit unit 30 supplies DC power to each LED 52, each LED 52 is lit. The light emitted from each LED 52 enters the translucent cover 60. Incident light is emitted from the translucent cover 60 to the outside and used as illumination light.

Here, in the lamp 1, the following various effects can be expected.
[Heat dissipation effect produced by the lamp 1]
First, a comparative example lamp that does not have the through hole 44 will be described, and then the heat dissipation effect produced by the lamp 1 will be described.
(I) Comparative lamp without the through hole 44 A comparative lamp without the through hole 44 will be described with reference to FIG. A lamp 1100 shown in the figure has the same configuration as the lamp 1100 described above with reference to FIG.

  When the lamp 1100 is arranged facing downward and is lit, the outside air around the lamp 1100 is heated by the heat generated by the lamp 1100 and becomes an ascending current. This ascending airflow flows through the gap between adjacent radiating fins 1140. In the lamp 1100, heat generated by driving the lighting circuit unit 1120 and heat generated by driving the light emitting module 1110 are both transferred to the radiation fins 1140. Accordingly, the heat of the heat radiating fins 1140 is exchanged with the rising airflow flowing through the gap between the adjacent radiating fins 1140.

  In the lamp 1100, heat generated by driving the lighting circuit unit 1120 and heat generated by driving the light emitting module 1110 are concentrated on the radiation fin 1140. Therefore, the lamp 1100 may be overheated unless a relatively large amount of heat is radiated from the rising airflow flowing through the gap between the adjacent radiating fins 1140. Further, in the lamp 1100, the light emitting module 1110, the lighting circuit unit 1120, and the heat radiation fin 1140 are thermally coupled. Therefore, if the heat generation amounts of the light emitting module 1110 and the lighting circuit unit 1120 are different, the higher temperature side is the heat radiation fin. There is also a risk of heating the low temperature side via 1140.

Furthermore, since the lighting circuit unit 1120 is located behind the lamp 1100 with respect to the heat radiating fin 1140, heat tends to be trapped inside the lamp 1100. For this reason, it may be difficult to radiate the heat of the lighting circuit unit 1120 to the outside air.
In addition, when the lamp 1100 is arranged so as to be inclined with respect to the vertical direction, it is difficult for the ascending air current to flow between the radiating fins 1140 located above. For this reason, the problem that the heat dissipation characteristic of the lamp 1100 deteriorates may occur.

(Ii)
The effect of the lamp 1 will be described with reference to FIG. In the figure, for the sake of explanation, the structural portion other than the housing 10 is shown in cross section.
When the lamp 1 is turned on as shown in FIG. 8, a part of the ascending airflow generated around the lamp 1 circulates through the gap 46 of the radiating fin 45 (hereinafter, this air is referred to as “first outside air”). Called). The heat generated by driving the LED 52 is radiated from the radiation fin 45 to the first outside air.

On the other hand, a part of the rising airflow generated around the substrate 51 is taken into the lamp 1 from the opening 62 and the through hole 44 (hereinafter, this air is referred to as “second outside air”). The heat generated by driving the lighting circuit unit 30 is radiated from the surface of the housing 10 (mainly the lid 13 and the circuit housing portion 12) to the second outside air.
Thus, in the lamp 1, the first outside air and the second outside air enter the lamp 1 through different flow paths. Therefore, in the lamp 1, the LED 52 and the lighting circuit unit 30 can be radiated efficiently and individually. For this reason, even if it is a case where each heat_generation | fever temperature of LED52 and the lighting circuit unit 30 differs, each can heat-radiate, preventing heating the other. Further, since the through hole 44 communicates with the gap 46 of the radiating fin 45, the second outside air is exhausted to the outside with the first outside air more quickly than the gap 46.

A part of heat generated by driving each LED 52 located near the center of the base 40 is transferred to the second outside air taken in from the through hole 44 through the flat plate portion 41. Thereby, each LED 52 located in the vicinity of the center of the base, which has conventionally been difficult to dissipate heat, can be efficiently dissipated.
(Iii)
FIG. 9 schematically shows the effect obtained when the first main surface 40X of the base 40 is directed obliquely downward.

  In the lamp 1, a through hole 44 that communicates with the opening 62 is provided. As described above, the inner diameter of the through hole 44 exposed to the outside air is set to a sufficiently wide value with respect to the outer diameter of the lid 13 of the housing 10. Therefore, even when the lamp 1 is inclined with the first main surface 40X directed obliquely downward, the second outside air of the rising airflow is relatively abundant through the opening 62 and the through hole 44. It can be fed well up around the housing 10. Therefore, the heat generated by driving the lighting circuit unit 30 can be efficiently exchanged with the second outside air via the housing 10, and an excellent heat dissipation effect can be expected (see arrows in FIG. 8).

As a result, the lamp 1 having better heat dissipation characteristics than the conventional one can be provided.
In the following, another embodiment of the present invention will be described with respect to differences from the first embodiment.
<Embodiment 2>
A light emitting module 50A in the lamp of the second embodiment is shown in FIG.

The difference between the lamp of the second embodiment and the lamp 1 of the first embodiment is that the light emitting module 50A has a rectangular opening 53A. On the other hand, the base 40 is provided with an inner rib (not shown) having a rectangular cross section that can be inserted into the opening 53A.
In the lamp of the second embodiment having such a configuration, the same effect as that of the lamp 1 of the first embodiment can be expected. Furthermore, by rotating the inner rib of the base through the insertion opening 53A, the rotation of the light emitting module 50A with respect to the base 40 can be restricted. For this reason, the positioning of the light emitting module 50A with respect to the base 40 can be performed more reliably.
<Embodiment 3>
The configuration of the light emitting module 50B in the lamp of Embodiment 3 is shown in FIG.

  The lamp of the third embodiment is different from the lamp 1 of the first embodiment in that the substrate 51B of the light emitting module 50B has a plurality of sub-substrates 51a to 51d. A plurality of LEDs 52 and a socket 54 are mounted on each of the sub-boards 51a to 51d. On the other hand, a plurality of wirings 33 (not shown) are connected to the lighting circuit unit 30. A connector 33A attached to the tip of each wiring 33 is connected to each socket 54.

In the lamp of the third embodiment having the above configuration, the same effect as that of the lamp 1 of the first embodiment can be expected. Moreover, it is also possible to suppress the formation of a heat transfer path between the adjacent sub-boards 51a to 51d by arranging the plurality of sub-boards 51a to 51d apart from each other on the base 40.
In FIG. 11, each of the sub-boards 51 a to 51 d is formed in a fan shape and is formed as an annular board 51 B as a whole, but the shape of each of the sub-boards 51 a to 51 d is not limited to this. For example, the shape of each of the sub-boards 51a to 51d can be a rectangular shape. Further, sub-boards 51a to 51d having different shapes may be used.
<Other matters>
The peripheral shape of the opening 53 of the light emitting module is not limited to the same shape as the through hole 44. As an example, the peripheral shape of the opening 53 can be any of a polygonal shape, a slit shape, a curved shape, and a linear shape.

The semiconductor light emitting device used in the present invention is not limited to the LED 52. For example, either a laser diode (LD) or an organic EL element (OLED) may be used.
The light emitting modules 50, 50A, and 50B are circular in overall shape, but the present invention is not limited to this. For example, it may be any one of a polygonal shape, an elliptical shape, and a rectangular shape.
The total number of LEDs 52 in the light emitting module 50 is not limited to the number shown in each drawing, and may be other numbers.

A heat conductive member such as a heat conductive sheet or a heat conductive grease may be interposed between the light emitting module 50 and the base 40.
The heat dissipating means in the lamp of the present invention preferably has heat dissipating fins. Compared to the heat radiating means including pins and protrusions, the heat radiating portion including the heat radiating fin exhibits a good air rectifying action. This is preferable because air can smoothly flow through the gaps between adjacent radiating fins.

The radiating fins 45 do not have to be formed integrally with the base 40, and may be formed of separate members.
The LEDs 52 in the light emitting module 50 are desirably arranged in an annular shape. By adopting such an arrangement of the LEDs 52, it is possible to prevent a deviation in light distribution characteristics during lighting.

  In the lamp 1 of the first embodiment, the base 40 is made of a metal material having excellent heat dissipation. Moreover, the case where the housing | casing 10 was comprised with the resin material which is excellent in insulation was shown. However, the material of the base 40 and the housing 10 is not limited to this. For example, both the base 40 and the housing 10 can be made of a material excellent in heat dissipation and insulation. As such a material, a material obtained by mixing a carbon material such as carbon fiber or an inorganic material such as ceramic into a resin material can be exemplified. When such a material is used, the base 40 and the housing 10 can be configured as an integral member by injection molding or the like.

In each of the above embodiments, each LED 52 is disposed so as to surround the entire circumference of the through hole 44. The present invention is not limited to this, and each LED 52 may be arranged so as to surround a part of the through hole 44.
A reflective film (reflector) having reflection characteristics with respect to visible light may be formed on the side surface of the cylindrical portion 61. Thereby, the emitted light of each LED52 which hits the side surface of the cylindrical part 61 is reflected, and a wider range of light distribution can be realized. The reflective film can be formed as a vapor deposition film using a metal material, for example.

DESCRIPTION OF SYMBOLS 1, 1100 Lamp 10, 1130 Case 11, 1150 Base 12, 12A Circuit storage part 13 Lid 20 Elastic member 30, 30a-30d Lighting circuit unit 40 Base 40X Base first main surface 40Y Base second main surface 41 Flat plate Part 42 Outer rib 43 Inner rib 44 Opening 45, 1140 Radiation fin 46 Radiation fin gap 50, 50A, 50B, 1110 Light emitting module 51 Substrate 51X Upper surface 51Y Lower surface 52 LED (semiconductor light emitting element)
53 Through-hole 54 Socket 60 Translucent cover 61 Cylindrical portion 62 Opening portion 130 Base 131 Lid of lid 132 Gap of rib of lid

Claims (12)

A substrate,
A plurality of semiconductor light emitting devices mounted on the substrate;
A base having a first region on the first main surface and a second region adjacent to the first region, and the substrate disposed on the second region;
A housing disposed on a second main surface located on the opposite side of the first main surface of the base;
A lighting circuit unit that is housed in the housing and lights each of the semiconductor light emitting elements,
A plurality of heat dissipating fins erected at positions that do not interfere with the housing on the second main surface of the base;
In the first region of the base, there is a through hole that exposes a part of the housing to the first main surface side of the base, and circulation of outside air from the outside to the housing through the through hole A lamp characterized by having a road. The second region is annular;
The substrate is an annular substrate disposed over the entire circumference of the second region;
The lamp according to claim 1, wherein the opening of the substrate communicates with the through hole of the base. The lamp according to claim 2, wherein the plurality of semiconductor light emitting elements surround an opening of the substrate. Both the peripheral shape of the opening of the substrate and the peripheral shape of the through hole of the base are circular,
The inner diameter of the opening of the substrate is larger than the inner diameter of the through-hole,
The lamp according to claim 2 or 3, wherein when the base is viewed in plan, the entire circumference of the through hole of the base is exposed inside the opening of the substrate. The shape of the housing viewed from a direction perpendicular to the first main surface of the base is circular,
The lamp according to claim 4, wherein an inner diameter of the through hole of the base is 1/10 or more and 1/4 or less of an outer diameter of the housing. The housing has a plurality of ribs protruding from the base side, and is joined to the base at the top of each rib,
There is a space that communicates with the gaps between the radiating fins between the ribs,
The lamp according to claim 2, wherein the through-hole of the base communicates with the space together with the opening of the substrate. In the second main surface, the housing is disposed inward from the periphery of the base,
The lamp according to any one of claims 1 to 6, wherein each of the heat dissipating fins is disposed so as to surround an outer periphery of the casing. The lamp according to claim 1, further comprising: a translucent cover that is arranged so that the through hole of the base communicates with outside air and covers the substrate. The lamp according to any one of claims 1 to 8, wherein each of the heat dissipating fins is formed radially from the inside to the periphery of the second main surface of the base. The base is configured using a metal member,
The said housing | casing is comprised using the electrically insulating member. The lamp | ramp in any one of Claims 1-9 characterized by the above-mentioned. The lamp according to any one of claims 1 to 9, wherein the base and the casing are integrally formed using an electrical insulating member. The lamp according to any one of claims 1 to 11, wherein the casing has a base for supplying power to each of the semiconductor light emitting elements from the outside via the lighting circuit unit.

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