JP2014103424A - Organic el display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL display which has a reduced optical loss and high efficiency and can be manufactured by an inexpensive method.SOLUTION: The organic EL display is formed by bonding together a sealing substrate and an organic EL element substrate which includes a substrate, a reflection electrode, an organic EL layer, a partition wall, a barrier layer, a transparent electrode, and a color conversion layer. The reflection electrode is composed of a plurality of partial electrodes. The organic EL layer is formed on the reflection electrode and is composed of a plurality portions separated by the partition wall. The transparent electrode is formed on the organic EL layer. The barrier layer covers the partition wall and the transparent electrode and has a recess at a position corresponding to the reflection electrode. The color conversion layer is formed in the recess.

Description

  The present invention mainly relates to an organic EL display.

  A panel unit of an organic EL display having a top emission structure typically has a configuration in which an organic EL element substrate (TFT substrate) and a color filter substrate are bonded together.

  An organic EL element substrate having a conventional structure includes, for example, a glass substrate, a TFT structure, a planarizing resin, an optional inorganic passivation film, an underlayer for improving adhesion, a reflective electrode, and a light emitting portion. An insulating film having an opening in a portion to be formed, an organic EL layer, a transparent electrode (including a translucent one), and a barrier layer covering the structure below the transparent electrode in the display region are included in this order. Here, the transparent electrode is connected to the wiring at the periphery of the organic EL element substrate.

  On the other hand, a color filter substrate having a conventional structure includes, for example, a glass substrate, a black matrix, a color filter, and an optionally provided color conversion layer in this order. As a method for forming a color filter and / or a color conversion layer, in addition to a conventional photolithographic method, a coating method such as an inkjet method is becoming widespread. When forming a plurality of types of color filters and / or color conversion layers using a coating method, it is common to selectively form each of the color filters and / or color conversion layers at desired positions using partition walls. It is.

  Finally, an organic EL display is obtained by bonding the organic EL element substrate and the color filter substrate while positioning the light emitting portion of the organic EL element substrate and the color filter of the color filter substrate to face each other. The bonding can be performed by, for example, a vacuum dropping bonding method generally used in manufacturing a liquid crystal display. For the purpose of transmitting light from the organic EL element substrate side to the color filter substrate side with high efficiency and maintaining mechanical strength, a filler such as an adhesive may be enclosed in the bonding gap. When it is desired to precisely control the bonding gap between the organic EL element substrate and the color filter substrate, a spacer can be provided on the color filter or the like. If the bonding gap is too wide, there is a concern about the problem of crosstalk in which light enters the adjacent pixels. On the other hand, when the bonding gap is too narrow, there are concerns about the influence of interference, mechanical contact between the organic EL element substrate and the color filter substrate in the display region, and the like. In particular, when the filler is sealed in the bonding gap, if the bonding gap is too narrow, there is a possibility that uneven spreading of the filler occurs.

  For example, when a color conversion layer is formed by a coating method using a bank, a partition wall having a desired shape is formed, and the process surface on which the partition wall is formed faces up, and an ink for forming a color conversion layer is applied using an inkjet device or the like. Then, a color conversion layer is formed. The color conversion forming ink is generally formed by dissolving or dispersing a color conversion material in a solvent. The ink droplet immediately after application has a shape that rises to the extent that it protrudes from the upper part of the partition wall. Thereafter, a flat layer is formed at the bottom of the partition wall by heating and drying the ink droplets. In a normal case, a color conversion layer having a desired film thickness can be obtained by repeating the application and heating and drying a plurality of times.

  In this case, the partition wall needs to have a height of about 3 to 7 μm in order to prevent leakage of ink droplets during application. Such a height is not negligible compared to a sub-pixel dimension of about 40-60 μm in a 200-150 ppi definition display, thereby preventing the incident from entering the color conversion layer of a given sub-pixel. Increasing the proportion of light emitted that dissipates in the direction can reduce efficiency. In addition, when the light scattered in the lateral direction enters the adjacent subpixels of different colors, the converted light from the color conversion layer of the adjacent subpixels is emitted, and the emitted light may exhibit an undesirable hue.

  In addition, since the thin organic EL layer has extremely low mechanical strength, in the organic EL display employing the above-described bonding structure, mechanical bonding strength in the display region cannot be expected at all. Therefore, in a large-screen bonded organic EL display, even if the bonding gap is filled with an adhesive and the entire display area is bonded, a heat shock or impact applied during use or a filler to be sealed is used. There is inherent concern about film peeling due to cure shrinkage when solidifying. Moreover, although the structure which makes a bonding gap hollow is proposed in various places from the beginning of an organic electroluminescent display, it cannot be overemphasized that it is disadvantageous for manufacture of a large screen display.

  In addition, in a top emission type organic EL display in which an organic EL layer is formed using a vapor deposition method, a barrier layer for protecting the organic EL layer is practically essential. However, when the filler is sealed in the bonding gap and the filler has a lower refractive index than that of the barrier layer, total reflection occurs at the barrier layer / filler interface, and sufficient light can be extracted. Inability to do so causes optical loss. For example, SiN generally used as a barrier layer has a refractive index of about 1.7 to 1.9. On the other hand, since there are very few types of resins having a refractive index higher than this, the selection range of the filler is narrowed, and the manufacturing method is restricted. In addition, such fillers are special materials and expensive, which increases production costs. Conversely, when the barrier layer is formed using SiO having a refractive index of about 1.5 in order to match the refractive index with a general resin, reflection at the interface between the barrier layer and the filler is reduced. This time, a large loss occurs in the light from the organic EL layer and the transparent electrode to the barrier layer. This is because the organic EL layer and the transparent electrode usually have a refractive index of about 2.

  As a solution to the optical loss caused by the filler enclosed in the bonding gap as described above, Japanese Patent Application Laid-Open No. 2006-32010 uses a forward tapered insulating film for separating the cathode as a partition. A structure has been proposed in which an organic EL layer, a transparent anode, and a protective layer are formed thereon, and a color filter and / or a color conversion layer is formed on the protective layer (see Patent Document 1). In this structure, the insulating film used as a bank and the organic EL layer of the light emitting portion are connected to the entire screen. Here, the insulating film formed of an organic material and extremely thick as compared with other layers contains a large amount of outgas such as moisture. In addition, since the film thickness is large, the amount of outgas that propagates through the insulating film increases. In a state where the insulating film and the organic EL layer are connected to the entire screen, the outgas easily propagates from the insulating film to the organic EL layer, and there is a possibility that a region called a dark spot or a dark area spreads in a short time. Furthermore, although Japanese Patent Laid-Open No. 2006-32010 does not disclose sealing by bonding the substrates, since mechanical sealing is necessary in practice, the mechanical strength due to the thin organic EL layer as described above is required. There is a shortage of concerns.

  In addition, outgas or solvent propagation through the protective layer must be considered. Even if measures are taken for the insulating film used as a bank (strengthening heat treatment conditions when forming the insulating film, or forming an insulating film with an inorganic material), the organic EL layer is continuous over the entire display area itself. There is a risk of causing widespread propagation of outgas entering through the protective layer. In particular, when a color conversion material is formed on a protective layer by a wet process such as an inkjet method to form the color conversion layer, damage to the organic EL layer due to components entering through the protective layer becomes significant. This is because in the formation of the color conversion layer by a wet process, it is essential to dilute the color conversion material to 1 to several percent using an organic solvent that is highly damaging to the organic EL layer. This situation is equivalent to applying a solvent on the organic EL layer and the protective layer, and a component that damages the organic EL layer from defects such as pinholes slightly present in the protective layer penetrates into the wide area of the display area. The possibility of dark areas is overwhelmingly increased.

  On the other hand, Japanese Unexamined Patent Application Publication No. 2008-78038 and the like propose an organic EL element substrate in which an organic EL layer or the like is separated into a plurality of parts using a partition wall (see Patent Document 2). The structure of Japanese Patent Application Laid-Open No. 2008-78038 uses a highly directional vapor deposition method to separate the organic EL layer by partition walls, and at the same time, exposes the auxiliary electrode formed on the substrate and has relatively good coverage ( That is, an object is to form a transparent electrode by a sputtering method having a low directivity and to connect the transparent electrode to the auxiliary electrode. In addition to this, when the organic EL layer itself is formed by inkjet or the like, it is well known to form orthogonal lattice shaped partition walls on the organic EL element substrate side. Alternatively, for example, if a transparent electrode made of a metal that is thin enough to transmit light is formed using a highly directional vapor deposition method similar to the organic EL layer, and the transparent electrode is separated into a plurality of lines by a partition, In addition to uniform control over the entire area, control for each line becomes possible. Accordingly, it can be easily considered that the partition wall is formed on the organic EL element substrate side in terms of control diversity. However, in an organic EL display in which such an organic EL element substrate is bonded to a color filter substrate having a color conversion layer, the height of the partition wall on the color filter side and the height of the partition wall on the organic EL element substrate side are simply the sum. Therefore, it is easily guessed that the optical loss further increases.

JP 2006-32010 JP JP 2008-78038 A Japanese Patent Laid-Open No. 2005-93398

  Accordingly, an object of the present invention is to provide an inexpensive organic EL display having a reduced optical loss and high efficiency in a color conversion type top emission organic EL display. Another object of the present invention is to provide a highly reliable large-screen organic EL display that increases the bonding strength of the display region and exhibits high resistance to heat shock and impact. Another object of the present invention is to provide an organic EL display that can be manufactured by an easy method by expanding the selectivity of the filler enclosed in the bonding gap.

  The organic EL display of the present invention is formed by laminating an organic EL element substrate including a substrate, a reflective electrode, an organic EL layer, a partition, a barrier layer, a transparent electrode and a color conversion layer, and a sealing substrate, and the reflective electrode Is composed of a plurality of partial electrodes, the organic EL layer is formed on the reflective electrode, and is composed of a plurality of portions separated by the partition walls, and the transparent electrode is formed on the organic EL layer, The barrier layer covers the partition wall and the transparent electrode, and has a recess at a position corresponding to the reflective electrode, and the color conversion layer is formed in the recess of the barrier layer. . Here, it is desirable that the refractive index of the color conversion layer is equal to or higher than the refractive index of the barrier layer. The sealing substrate may further include a color filter.

  In the organic EL display of the present invention, the partition may have a plurality of openings corresponding to the partial electrodes constituting the reflective electrode, and the organic EL layer may be formed in the plurality of openings. Here, an auxiliary wiring for a transparent electrode may be further included, and the auxiliary wiring may be connected to the transparent electrode in a region where the organic EL layer is not formed by the partition. Alternatively, the partition may be formed of a metal material, and the transparent electrode may be electrically connected to the partition.

  Furthermore, in the organic EL display of the present invention, the partition wall is composed of a plurality of stripe-shaped portions arranged in gaps between the plurality of partial electrodes constituting the reflective electrode and extending in one direction, and the organic EL layer is formed of the partition wall. It may be formed in the gap. Here, the transparent electrode may be composed of a plurality of stripe portions separated by the partition walls. When the transparent electrode is composed of a plurality of stripe-shaped portions, it is possible to individually control the applied voltage or measure the electrical characteristics for each of the plurality of stripe-shaped portions.

  The organic EL display of the present invention can realize a significant improvement in color conversion efficiency. The effect is that (a) in the present invention, the color conversion layer is formed on the barrier layer of the organic EL element substrate to eliminate the distance between the barrier layer and the color conversion layer. (B) a low refractive index between the barrier layer and the color conversion layer, and thus between the light emitting layer and the color conversion layer. The absence of this layer is due to a reduction in reflection loss at the interface of each layer.

  In the organic EL display of the present invention, almost no growth of defects called dark areas or dark spots was observed. One reason for this effect is considered to be that the barrier ribs were formed before the formation of the organic EL layer in the present invention, instead of forming the barrier ribs after the formation of the organic EL layer as in the conventional organic EL element substrate. This is because by forming the partition wall before the formation of the organic EL layer, it is possible to sufficiently take measures against outgas from the partition wall by heat treatment. Furthermore, another factor of this effect is that the organic EL layer is divided into a plurality of portions in the organic EL display of the present invention. This is because even if outgas (moisture or the like) enters the organic EL layer due to propagation from the partition wall, defects called dark areas or dark spots do not propagate in the entire display region.

  Furthermore, in the organic EL display of the present invention, since there is no bonding gap in the light path from the organic EL layer to the color conversion layer, a conventional material such as a normal adhesive is used as a material to be filled at the time of bonding. Can be used. Increasing the choice of filler materials allows for a simplified manufacturing process and / or reduced manufacturing costs due to lower material costs. In addition, in the organic EL display of the present invention, a structure (for example, auxiliary wiring, transparent electrode separation wiring, etc.) that requires a partition to be formed on the organic EL element substrate side in manufacturing can be used without newly forming a partition. Even when these structures are formed, the color conversion layer can be formed by a coating method. This is also advantageous for reducing the manufacturing cost of the organic EL display.

  In addition, in the organic EL display of the present invention, when the organic EL element substrate and the sealing substrate are bonded together, there is a portion to be bonded without interposing the organic EL layer in the entire display region. The mechanical strength is increased and the mechanical reliability is improved. In addition, securing the mechanical strength in the display area will lead to the production of a display with a very narrow frame by eliminating the outer peripheral seal portion in the future.

FIG. 1 is a top view showing an organic EL display of the present invention. FIG. 2A is a diagram showing a cross section taken along the cutting line IIA-IIA of the organic EL display according to the first embodiment of the present invention. FIG. 2B is a diagram showing a cross section taken along the cutting line IIB-IIB of the organic EL display according to the first embodiment of the present invention. FIG. 3A is a cross-sectional view showing an organic EL display according to a second embodiment of the present invention. FIG. 3B is a cross-sectional view showing an organic EL display according to the second embodiment of the present invention. FIG. 4A is a cross-sectional view showing an organic EL display according to a third embodiment of the present invention. FIG. 4B is a cross-sectional view showing an organic EL display according to a third embodiment of the present invention.

  FIG. 1 is a top view of the organic EL display of the present invention on the sealing substrate 210 side. FIG. 1 shows an example in which a black matrix 220 and three types of color filters 230 are formed on a sealing substrate 210. The organic EL display shown in FIG. 1 has three types of subpixels indicated by a red color filter 230R, a green color filter 230G, and a blue color filter 230B, and is adjacent to two green subpixels and two blue subpixels. A spacer 240 is arranged to do this.

  2A and 2B are sectional views of the organic EL display according to the first embodiment of the present invention. 2A is a cross-sectional view taken along the cutting line IIA-IIA shown in FIG. 1, and FIG. 2B is a cross-sectional view taken along the cutting line IIB-IIB shown in FIG.

  A patterned conductive layer 121 and an insulating layer 122 are formed on the TFT substrate 110 to form drive circuit wiring. As shown in FIG. 2B, the drive circuit wiring is covered with a protective layer 123 except for a contact hole for connecting the conductive layer 121 to the reflective electrode 142. Next, a planarization layer 131 is formed so as to cover the protective layer 123, and the upper surface of the planarization layer 131 is planarized. At this time, as shown in FIG. 2B, a contact hole for connecting the conductive layer 121 and the reflective electrode 142 is also formed in the planarization layer 131. The planarization layer 131 is formed using any resin material known in the art, and the contact hole can be formed by patterning by a photolithography method. Next, an inorganic passivation layer 132 for blocking outgas from the planarization layer 131 is formed. As shown in FIG. 2B, a contact hole for connecting the conductive layer 121 and the reflective electrode 142 is also formed in the inorganic passivation layer 132. In each contact hole, it is desirable to form the inorganic passivation layer 132 so as to completely cover the side surface of the planarization layer 131. As described above, the conductive layer 121 is electrically connected to the reflective electrode 142 in the contact hole formed in alignment with the protective layer 123, the planarization layer 131, and the inorganic passivation layer 132.

  Next, the base layer 141 for the reflective electrode is formed using a conductive oxide such as IZO or ITO. The underlayer 141 is a layer provided as necessary. However, in order to ensure adhesion between the reflective electrode 142 and the inorganic passivation layer 132, it is desirable to provide the base layer 141. In the case where the base layer 141 is present, the base layer 141 is connected to the conductive layer 121 (a part of the TFT element) on the bottom surface of the contact hole provided in the protective layer 123, the planarization layer 131, and the inorganic passivation layer 132. Subsequently, the reflective electrode 142 is formed on the base layer 141. The reflective electrode 142 may be a single layer film of a highly reflective metal material such as MoCr, CrB, Ag, Ag alloy, or Al alloy, or a highly conductive metal material and a transparent conductive oxide such as IZO or ITO. It may be a laminated film with a material. The transparent conductive oxide material is effective for protecting a highly reflective metal material and adjusting the optical distance in the resulting organic EL display. When the base layer 141 is not present, the reflective electrode 142 is directly connected to the conductive layer 121 (a part of the TFT element) on the bottom surface of the contact hole.

  In the present invention, the base layer 141 is divided into a plurality of portions, and each portion is formed at a position corresponding to the light emitting portion (subpixel in the configuration of FIGS. 1 to 2B). Therefore, the reflective electrode 142 is also composed of a plurality of partial electrodes formed at positions corresponding to the light emitting part.

  Subsequently, an insulating film 143a is formed so as to cover the shoulders of the partial electrodes constituting the reflective electrode 142. The insulating film 143a is formed of an inorganic material or an organic material (such as polyimide) that can perform sufficient degassing and drainage treatment. 2A and 2B show a structure in which the insulating film 143a is covered with an insulating film barrier layer 143b which may be optionally provided. The insulating film barrier layer 143b is preferably formed using an inorganic material. The insulating film barrier layer 143b is effective in preventing outgas such as moisture from entering the organic EL layer 160 and the like from the insulating film 143a, particularly when the insulating film 143a is formed of an organic material.

  Subsequently, a partition wall 150 is formed over the insulating film 143a and the insulating film barrier layer 143b. In the present embodiment, the partition 150 includes a plurality of stripe-shaped portions extending in the vertical direction (direction of the cutting line IIB-IIB) and a plurality of extending in the horizontal direction (direction of the cutting line IIA-IIA) orthogonal to the first direction. And a plurality of openings. In each of the openings of the partition 150, the partial electrodes constituting the reflective electrode 142 are exposed. The partition wall 150 is desirably used as a bank when the color conversion layer 190 is formed later, so that it preferably has a height from the surface of the reflective electrode 142 of 3 to 7 μm.

  The partition wall 150 may be formed using either an organic material or an inorganic material. Here, it is desirable to use an organic material from the viewpoint of easily increasing the film thickness and suppressing the manufacturing cost. In the case of using an organic material, it is necessary to sufficiently remove the moisture contained in the inside by a baking operation or the like and suppress the generation of outgas as much as possible. In the case of using an organic material, the partition wall 150 preferably has a reverse tapered cross section in order to divide the organic EL layer 160 formed by a vapor deposition method into a plurality of portions.

  An inorganic material that can be used for forming the partition wall 150 includes a metal. In the case where the partition wall 150 is formed using metal, the partition wall 150 can be formed using a plating method or the like in order to ensure the height from the surface of the reflective electrode 142. As described in Japanese Patent Application Laid-Open No. 2005-93398, when the partition wall 150 is formed using metal, the partition wall 150 may have a cross-sectional shape such as a reverse taper shape or a rectangular shape (see Patent Document 3). ). Metal materials that can be used to form the partition 150 include Cu, Al, Ag, Au, Ni, Mo, and Ti. The metal partition wall 150 functions as an auxiliary wiring for the transparent electrode 170 to be formed later, particularly when a light emitting part having a relatively small size is provided, and causes uneven brightness and power consumption due to a reduction in wiring resistance of the transparent electrode 170. It is effective in suppressing the increase of

  Subsequently, the organic EL layer 160 is laminated on the laminate in which the partition wall 150 is formed. The organic EL layer 160 includes at least an organic light emitting layer, and may further include one or more layers for facilitating injection and / or transport of electrons and / or holes. For each of the constituent layers of the organic EL layer 160, any material known in the prior art can be used.

  When the partition 150 has a reverse tapered cross-sectional shape, the organic EL layer 160 is formed on the upper surface of the reflective electrode 142 (including the upper surface of the insulating film barrier layer 143b around the reflective electrode 142) and the upper surface of the partition 150. Is done. Here, the organic EL layer 160 formed on the upper surface of the reflective electrode 142 is separated into a plurality of portions by the partition 150. In the present embodiment, the plurality of portions of the organic EL layer 160 are formed in one-to-one correspondence with the plurality of partial electrodes constituting the reflective electrode 142. In other words, the organic EL layer 160 is formed separately for each of a plurality of light emitting portions (subpixels). Further, each of the plurality of portions of the organic EL layer 160 formed on the upper surface of the reflective electrode 142 is not in contact with the side surface of the partition wall 150. The organic EL layer 160 formed on the upper surface of the reflective electrode 142 that participates in light emission does not come into contact with the partition wall 150, and the transparent electrode 170 (described later) interposed between the partition wall 150 prevents moisture from entering the partition wall 150. Can be blocked. In addition, even when moisture enters from the partition wall 150 and when a defect exists in the barrier layer 180 described later and moisture enters from the outside, the organic EL layer 160 is separated into a plurality of portions. The deterioration of the organic EL layer 160 occurs only in the portion where moisture enters, and the deterioration (that is, a region called a dark spot or a dark area) does not propagate to the entire organic EL layer 160. Similarly, even when a defect exists in the insulating film barrier layer 143b and outgas enters through the insulating film 143a, the deterioration does not propagate to the entire organic EL layer 160.

  Subsequently, the transparent electrode 170 is formed on the organic EL layer 160. The transparent electrode 170 in the present invention may be transparent or translucent. The transparent electrode 170 can be formed by depositing a transparent conductive oxide such as ITO or IZO by a sputtering method. The transparent electrode 170 is formed so as to cover the upper surface of the organic EL layer 160 and the upper surface and side surfaces of the partition wall 150. At this time, in order to reduce damage to the organic EL layer 160 due to sputtering, a highly transparent metal thin film (not shown) such as MgAg or Au may be formed before the deposition of the transparent conductive oxide. . When present, the metal thin film desirably has a thickness of about several nm.

  The transparent electrode 170 is connected to a power supply line or a GND wiring in a contact hole different from the contact hole for the light emitting part shown in FIG.

  Subsequently, a barrier layer 180 is formed so as to cover the structure below the transparent electrode 170. The barrier layer 180 is a layer for preventing moisture and gas from the outside from entering the organic EL layer 160. On the other hand, since the barrier layer 180 exists on the path for extracting light emitted from the organic EL layer 160, it is desirable to have a high transmittance. Further, from the viewpoint of preventing reflection at the interface between the barrier layer 180 and the transparent electrode 170 or the color conversion layer 190 and improving the light emission extraction efficiency of the organic EL layer 160, the barrier layer 180 is as high as the transparent electrode 170. It is desirable to have a refractive index. As the barrier layer 180, a single layer film or a laminated film of SiN or SiON can be used. The barrier layer 180 can be formed by sputtering, CVD, or the like. In order to pursue better coverage, it is desirable to form the barrier layer 180 by a CVD method. As a result, a barrier layer 180 is formed in which the gap between the partition walls 150 (that is, the position corresponding to the reflective electrode 142) is a recess.

  Next, a color conversion layer 190 including a plurality of portions is formed in the recesses of the barrier layer 180 formed due to the height of the partition wall 150. In other words, the color conversion layer 190 including a plurality of portions is formed using the partition wall 150 covered with the barrier layer 180 as a bank. FIG. 2A shows an example in which two types of color conversion layers 190 including a red conversion layer 190R and a green conversion layer 190G are formed. The color conversion layer 190 can be formed using a broad application method such as an inkjet method, a dispenser method, or a printing method. The color conversion layer 190 preferably has a refractive index equal to or higher than that of the barrier layer 180. By having such a refractive index, reflection at the interface between the barrier layer 180 and the color conversion layer 190 can be prevented, and the incident efficiency of the light emission of the organic EL layer 160 to the color conversion layer 190 can be improved.

  A protective layer (not shown) is provided on the color conversion layer 190 for the purpose of preventing deterioration of the color conversion layer 190 and elution of the color conversion material into the filler when the filler is sealed in the bonding gap. Further, it may be provided. The protective layer can be formed using an inorganic material or a resin.

  The organic EL display of this embodiment is obtained by bonding the sealing substrate 210 to the organic EL element substrate formed as described above. The sealing substrate 210 may be a plate-like member made of a transparent material, or may be one in which the color filter 230 and / or the black matrix 220 is formed on the plate-like member. 2A and 2B show an example in which the black matrix 220 and the color filter 230 including the red color filter 230R, the green color filter 230G, and the blue color filter 230B are provided on the sealing substrate 210. The sealing substrate 210 can be formed using a transparent material such as glass. The black matrix 220 and the color filter 230 can be formed using a commercially available flat panel display material.

  When the black matrix 220 is formed, the black matrix 220 is formed so as to have an opening at a position corresponding to the light emitting portion (corresponding to the position of the subpixel, the reflective electrode 142, etc.) of the organic EL element substrate. When the color filter 230 is formed, the color filter 230 is formed at a position corresponding to a desired light emitting portion (subpixel) of the organic EL element substrate. When forming both the black matrix 220 and the color filter 230, it is desirable to form the color filter 230 after forming the black matrix 220 first. In this case, the peripheral edge of the color filter 230 may be superimposed on the black matrix 220.

  When the organic EL element substrate and the sealing substrate 210 are bonded together, the spacer 240 may be formed on any substrate. When forming the spacer 240 on the organic EL element substrate, it is convenient to form the spacer 240 on the barrier layer 180 formed on the partition wall 150. In this case, it is not necessary to provide the spacer 240 on all of the partition walls 150. For example, as shown in FIGS. 1 to 2B, spacers are provided only at the positions where the stripe-shaped portions of the partition wall 150 adjacent to two green light emitting portions (subpixels) and two blue light emitting portions (subpixels) intersect. 240 can be provided. On the other hand, when providing the spacer 240 on the sealing substrate 210, it is preferable to provide the spacer 240 in a portion other than the light emission passage path of the organic EL layer 160. When the sealing substrate 210 provided with the black matrix 220 and / or the color filter 230 is used, the spacer 240 may be provided on the black matrix 220 or on the overlapping portion of the black matrix 220 and the color filter 230. Good.

  Following the formation of the spacer 240, the organic EL element substrate and the sealing substrate 210 are bonded together. When the color filter 230 and the black matrix 220 are provided on the sealing substrate 210 as shown in FIGS. 2A and 2B, the position of the light emitting portion of the organic EL element substrate and the position of the opening portion of the black matrix 220 on the sealing substrate 210 Paste them so that they match exactly. The bonding can be performed using, for example, a UV curable adhesive provided on the periphery of the organic EL element substrate or the sealing substrate 210 so as to surround the display region of the organic EL element substrate.

  A gas gap (atmospheric gas at the time of bonding) may be filled in a bonding gap formed between the organic EL element substrate and the sealing substrate 210 at the time of bonding. However, it is preferable to fill a liquid or solid having a refractive index of 1.3 or more in order to prevent the occurrence of interference fringes and a decrease in light extraction efficiency due to reflection at the interface adjacent to the bonding gap. . Furthermore, for the purpose of increasing the mechanical strength of the obtained organic EL display, it is more desirable to fill the bonding gap with a liquid adhesive or the like at the time of bonding, and to harden the solid after bonding. . A method of filling a liquid material at the time of bonding includes, for example, a vacuum drop bonding method.

  In the organic EL element substrate of the present embodiment, the organic EL layer 160 having low mechanical strength is not formed in the region where the partition wall 150 is formed. Therefore, when bonding is performed by filling the bonding gap with a liquid adhesive, the region where the partition wall 150 is formed contributes to the improvement of the adhesive strength with the sealing substrate 210. Therefore, in the organic EL display of the present invention, it is possible to ensure the mechanical strength of bonding in the display area, and to narrow the periphery of the display area called a “picture frame”. This may eliminate the need for a UV curable adhesive (so-called “peripheral seal portion”) provided on the peripheral edge of the substrate in the future.

  Sectional views of a second embodiment of the organic EL display of the present invention are shown in FIGS. 3A and 3B. The cross sections of FIGS. 3A and 3B correspond to the cross sections shown in FIGS. 2A and 2B, respectively. This embodiment has an auxiliary wiring 145 that is advantageous for expanding the dimensions of the organic EL display. The auxiliary wiring 145 is effective in suppressing the occurrence of luminance unevenness due to the wiring resistance of the transparent electrode 170 and the increase in power consumption. The structure below the inorganic passivation layer 132 of the organic EL display of this embodiment is the same as that of the first embodiment, and can be formed by the same method as described above.

  Next, simultaneously with the formation of the base layer 141 (if present) for the reflective electrode and the reflective electrode 142, the base layer 144 and the auxiliary wiring 145 for the auxiliary wiring are formed. That is, since the auxiliary wiring 145 is formed of a low-resistance metal material, it has a lower resistance than the transparent electrode 170 formed of a transparent conductive oxide. Each of the base layer 144 and the auxiliary wiring 145 includes a plurality of portions. Each of the plurality of portions is formed in the gap between the base layer 141 and the reflective electrode 142 forming the light emitting portion. The auxiliary wiring 145 is connected to a power supply line, a GND wiring, or the like in a contact hole different from the contact hole for the light emitting portion illustrated in FIG.

  Subsequently, an insulating film 143 is formed so as to cover the shoulders of the partial electrodes constituting the reflective electrode 142. In the present embodiment, an opening for connecting the auxiliary wiring 144 and the transparent electrode 170 is formed in the insulating film 143. Except for performing patterning so as to form the opening, the insulating film 143 can be formed using the same material and process as the insulating film 143a of the first embodiment. Also in this embodiment, the insulating film barrier layer may be formed on the condition that the opening of the insulating film 143 is not blocked.

  Subsequently, a partition wall 150 is formed over the insulating film 143. The partition 150 according to the present embodiment has a reverse taper-shaped cross-sectional shape, and is arranged so that the opening of the insulating film 143 on the rope-fitting wiring 145 is positioned below the upper surface of the partition 150. With such a cross-sectional shape and arrangement, an organic EL layer 160 described later can be formed so as not to block the opening of the insulating film 143.

  Subsequently, the organic EL layer 160 and the transparent electrode 170 are formed using the same method and material as in the first embodiment. Similar to the first embodiment, the organic EL layer 160 is formed by separating the light emitting units by the partition 150. Since the transparent electrode 170 is formed by a sputtering method having excellent coverage, the transparent electrode 170 is formed on the upper and side surfaces of the partition wall and the upper surface of the organic EL layer 160, and below the upper surface of the partition wall where the organic EL layer 160 is not formed. It is electrically connected to the auxiliary wiring 145. By connecting to the low resistance auxiliary wiring 145, the wiring resistance of the transparent electrode 170 can be reduced, and the occurrence of uneven brightness and the increase in power consumption can be suppressed.

  From the viewpoint of separation of the organic EL layer 160 and connection between the auxiliary wiring 145 and the transparent electrode 170, the partition wall 150 desirably has a height of about 1.5 to 3 μm. However, as in the first embodiment, in order to use the partition 150 as a bank for separating the color conversion layer 190, the partition 150 preferably has a height of 3 to 7 μm.

  The barrier layer 180 and the color conversion layer 190 can be formed by the same method and material as in the first embodiment. The sealing substrate 210 may also have the same material and configuration (color filter 230, black matrix 220, etc.) as in the first embodiment. Bonding with the sealing substrate 210 can also be performed by the same method as in the first embodiment.

  The organic EL display according to the present embodiment is suitable when the size of the light emitting part is relatively large because the area of the light emitting part is reduced by the presence of the auxiliary wiring 144. When the dimension of the light emitting portion is relatively small, it is effective to form the metal partition 150 in the first embodiment and use the partition 150 as an auxiliary wiring.

  4A and 4B show cross-sectional views of a third embodiment of the organic EL display of the present invention. 4A and 4B correspond to the cross sections shown in FIGS. 2A and 2B, respectively. In the present embodiment, the organic EL layer 160 composed of a plurality of parts separated for each light emitting section column (subpixel array), and the transparent electrode composed of a plurality of partial electrodes separated for each light emitting section array (subpixel array) 170. The transparent electrode 170 composed of a plurality of partial electrodes enables various controls such as current measurement for each light emitting section row and voltage control for each light emitting section row. The structure below the insulating film 143 of the organic EL display of this embodiment is the same as that of the second embodiment, and can be formed by the same method as described above. 4A and 4B show the configuration in which the insulating film barrier layer is not provided, the insulating film barrier layer can also be formed in this embodiment.

  The partition 150 in the present embodiment is composed of a plurality of stripe portions extending in one direction. Each of the striped portions of the partition wall 150 is disposed in the gap between the plurality of partial electrodes constituting the reflective electrode 142. 4A and 4B show an example of the partition wall 150 extending in the vertical direction (the direction of the cutting line IIB-IIB in FIG. 1). Except for the above points, the partition wall 150 can be formed by the same material and method as in the first embodiment.

  Subsequently, the organic EL layer 160 is formed using the same material and method as in the first embodiment. Similar to the first embodiment, the organic EL layer 160 is formed on the upper surface of the reflective electrode 142 and the upper surface of the partition wall 150. However, unlike the case of the first embodiment shown in FIG. 2B, in the present embodiment, as shown in FIG. 4B, an organic EL layer 160 composed of a plurality of stripe-like portions that are continuous in the light emitting part row is obtained.

  Subsequently, the transparent electrode 170 is formed using a translucent metal material such as MgAg or Au. The transparent electrode 170 of this embodiment has a film thickness of about 10 to 50 nm. A vapor deposition method is used to form the transparent electrode 170. The metal material film is formed on the reflective electrode 142 and the partition wall 150 on the upper surface of the organic EL layer 160. In this embodiment, the portion formed on the upper surface of the organic EL layer 160 functions as the transparent electrode 170, and the metal film 171 formed on the partition 150 is separated from the transparent electrode 170 and does not function as an electrode. Therefore, as shown in FIG. 4B, the transparent electrode 170 is composed of a plurality of stripe-shaped partial electrodes extending in the same direction as the partition wall 150. Each of the plurality of partial electrodes constituting the transparent electrode 170 is connected to a power supply line, a GND wiring, or the like in a contact hole different from the contact hole for the light emitting part shown in FIG. .

  From the viewpoint of separation of the organic EL layer 160 and the transparent electrode 170 into striped portions, the partition wall 150 desirably has a height of about 1.5 to 3 μm. However, as in the first embodiment, in order to use the partition 150 as a bank for separating the color conversion layer 190, the partition 150 preferably has a height of 3 to 7 μm.

  The barrier layer 180 and the color conversion layer 190 can be formed by the same method and material as in the first embodiment. The sealing substrate 210 may also have the same material and configuration (color filter 230, black matrix 220, etc.) as in the first embodiment. Bonding with the sealing substrate 210 can also be performed by the same method as in the first embodiment.

  In the present embodiment, since the transparent electrode 170 is separated into a plurality of partial electrodes for each light emitting section row, it is possible to measure a current for each light emitting section row. In addition, it is possible to perform more various controls of the organic EL display, such as controlling the voltage for each light emitting unit row.

<Example 1>
This example is an example of the organic EL display according to the first embodiment of the present invention. The organic EL display of this embodiment has a nominal size of 3 inches, and each pixel has a size of 60 μm × 180 μm × RGB. Further, a color filter substrate in which a black matrix 220 and three kinds of color filters 230 are formed on a sealing substrate 210 was used.

  A conductive layer 121 (including switching elements and wiring), an insulating layer 122, and a protective layer 123 of a plurality of display portions were formed on non-alkali glass (Asahi Glass, AN-100) of 200 mm × 200 mm × 0.7 mm. . Subsequently, a planarization layer 131 was formed on the protective layer 123. The planarization layer 131 was patterned by a photolithographic method to form a contact hole having a dimension of 20 μm square for connecting the conductive layer 121 and the reflective electrode 142 for each subpixel (light emitting portion).

Subsequently, a 300 nm-thickness SiO ₂ film was formed on the entire surface by sputtering. Next, by using dry etching, an opening smaller than the bottom surface was formed on the bottom surface of each contact hole, and an inorganic passivation layer 132 was obtained. As a result, the planarization layer 131 was completely covered with the inorganic passivation layer 132, and at the same time, the conductive layer 121 was exposed on the bottom surface of the contact hole.

  Subsequently, an IZO film having a thickness of 50 nm was formed by RF-planar magnetron sputtering in an Ar atmosphere. Next, a resist agent “OFRP-800” (manufactured by Tokyo Ohka Kogyo Co., Ltd.) is applied, exposed and developed to form a pattern, and the IZO film is wet-etched using the pattern as a mask to separate a plurality of subpixels. An underlayer 141 composed of the portion was formed. Each portion constituting the base layer 141 was connected to the conductive layer 121 through a contact hole formed in the planarization layer 131 and the inorganic passivation layer 132. Subsequently, an Ag alloy film having a thickness of 200 nm was formed using a sputtering method so as to cover the base layer 141, and patterning was performed using the same process, so that a reflective electrode 142 composed of a plurality of portions was formed. Each of the plurality of portions constituting the reflective electrode 142 was disposed so as not to protrude from the base layer 141.

  Next, a novolak photosensitive resin film having a thickness of 1 μm was applied by using a spin coating method. Subsequently, by using a photolithographic method, patterning is performed to form an insulating film 143a so as to provide an opening on the reflective electrode 142 that is 2 to 4 μm wider in both vertical and horizontal directions than the light emitting portion dimension (about 36 μm × about 150 μm). did. The obtained insulating film 143a was baked at about 230 ° C., and outgas such as moisture was sufficiently discharged. Subsequently, a 300 nm-thickness SiN film was formed by CVD. The SiN film obtained by using the dry etching method was patterned to form the opening having the above-described light emitting portion dimensions, and the insulating film barrier layer 143b was formed. By this operation, the insulating film 143a was completely covered with the insulating film barrier layer 143b. In addition to the openings described above, the insulating film barrier layer 143b has openings for providing necessary electrical connection portions at the peripheral portions of the display areas of the plurality of display portions arranged on the substrate. Had.

  Next, a photosensitive resin (manufactured by Hitachi Chemical Co., Ltd., CR-600) is applied, and patterning is performed by a photolithographic method. The light emitting unit is composed of a plurality of stripe portions extending in the vertical direction and the horizontal direction. A partition wall 150 having an opening at a position corresponding to is formed. Each of the stripe-shaped portions of the partition wall 150 had a reverse tapered (reverse trapezoidal) cross section having an upper base of about 10 μm, a lower base of about 6 μm, and a height from the electrode surface of about 5 μm. The obtained partition 150 was baked at about 220 ° C., and outgas such as moisture was discharged. By this operation, a partition wall 150 having a lateral opening width of about 50 μm was obtained for a lateral subpixel pitch of 60 μm. The “lateral direction” in the present embodiment is the left-right direction in FIG. 2A.

  Then, the laminated body in which the partition 150 was formed was mounted | worn with the resistance heating vapor deposition apparatus. A buffer layer having a thickness of 1.5 nm made of Li is formed on the reflective electrode 142 and the upper surface of the partition wall 150 by an evaporation method using a mask having openings corresponding to display areas of a plurality of display portions arranged on the substrate. 20 nm thick electron transport layer made of tris (8-hydroxyquinolinato) aluminum (Alq3), 30 nm thick light emitting layer made of 4,4′-bis (2,2′-diphenylvinyl (biphenyl) (DPVBi) , 4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (α-NPD) 10 nm thick hole transport layer and copper phthalocyanine (CuPc) 100 nm thick A hole injection layer was formed in this order to obtain an organic EL layer 160. Furthermore, a film thickness of 5 nm made of MgAg was formed on the organic EL layer 160. Relieves damage layer (not shown) was formed. The organic EL layer 160 and relieves damage layer by a partition wall 150 is separated into each light-emitting section was not in contact with the side surface of the partition 150.

  Next, the laminated body in which the damage alleviating layer was formed was moved to the counter sputtering apparatus without breaking the vacuum. Through a mask having openings corresponding to a plurality of display portions arranged on the substrate, IZO having a thickness of 200 nm was deposited to obtain a transparent electrode 170. The IZO film was formed on the organic EL layer 160 including the upper surface of the partition wall 150 and on the side surface of the partition wall 150 to provide a transparent electrode 170 that functions as an integrated electrode in each of the display portions. The transparent electrode 170 was connected to the conductive layer 121 through a contact hole (not shown) at the periphery of the display area of each display part. Through the above operation, the organic EL layer 160 in each light-emitting portion is a layer formed of an inorganic material, and the reflective electrode 142 and the inorganic passivation layer 132 therebelow, the insulating film barrier layer 143b, and the transparent electrode 170. Besieged.

  Next, the laminated body in which the transparent electrode 170 was formed was moved to the CVD apparatus without breaking the vacuum. A barrier layer 180 was formed by depositing a 2 μm thick SiN film by CVD. The resulting barrier layer 180 had a refractive index of about 1.8.

  Subsequently, the laminate on which the barrier layer 180 was formed was placed in a multi-nozzle ink jet apparatus (landing accuracy ± 5 μm) installed in an environment having an oxygen concentration of 50 ppm or less and a moisture concentration of 50 ppm or less. After the alignment with the marker, the color conversion material ink was deposited on the barrier layer in the bank due to the partition wall 150. Ink adhesion was carried out under the condition that the ink droplets in flight became a sphere having a diameter of about 30 μm. In addition, 3 ink droplets were deposited in each bank. After ink droplets were attached to the entire substrate, the ink was dried by heating to 100 ° C. The ink adhesion and drying were repeated to form a red conversion layer 190R and a green conversion layer 190G having a film thickness of 0.5 μm to obtain an organic EL element substrate. In this process, a so-called “color mixing” phenomenon in which ink flows into a bank adjacent to a predetermined bank was not recognized.

  In this example, the ink for forming the red color conversion layer 190R is 1000 parts by weight of toluene and 50 parts by weight of a pigment mixture of coumarin 6 and DCM (molar ratio of coumarin 6 to DCM is 48: 2). It was a mixture of In addition, the ink for forming the green conversion layer 190G is a mixture of 1000 parts by weight of toluene and 50 parts by weight of a pigment mixture of coumarin 6 and DEQ (molar ratio of coumarin 6 and DEQ is 48: 2). there were.

  On the other hand, CK-7001 (available from FUJIFILM Corporation) is applied on a 200 mm × 200 mm × 0.7 mm non-alkali glass (Corning Eagle 2000) sealing substrate 210, and patterning is performed by a photolithographic method. As a result, a black matrix 220 having a film thickness of 1 μm was formed in the display areas of the plurality of display portions. The black matrix 220 has a structure in which a plurality of openings of 46 μm × 160 μm are arranged in the vertical direction and the horizontal direction. Here, the horizontal line width (interval between openings in the horizontal direction) was 14 μm, and the vertical line width (interval between openings in the vertical direction) was 20 μm.

  Subsequently, CR-7001, CG-7001 and CB-7001 (all available from FUJIFILM Corporation) were applied and patterned, and a red color filter 230R and a green color filter 230G having a film thickness of 1.5 μm, respectively. And the blue color filter 230B was formed. Each color filter 230 was composed of a plurality of stripe-like portions extending in the vertical direction.

  Next, photosensitive resin (manufactured by Hitachi Chemical Co., Ltd., CR-600 is applied, and two black matrix 220 openings provided with green color filters 230G and two black matrix 220 openings provided with blue color filters 230B. A cylindrical spacer 240 having a diameter of 20 μm and a height of 2 μm was formed on the lattice point of the black matrix 220 adjacent to the substrate to obtain a color filter substrate.

  The organic EL element substrate and the color filter substrate obtained as described above were moved into a bonding apparatus installed in an environment having an oxygen concentration of 5 ppm or less and a moisture concentration of 5 ppm or less. A color filter substrate is disposed with the surface on which the spacer 240 is formed facing upward, and an epoxy UV curing adhesive (manufactured by Nagase ChemteX, XNR-) is used on the outer periphery of the region corresponding to the plurality of display portions using a dispenser. 5516) was applied seamlessly. Next, using a mechanical lightweight valve (discharge accuracy within ± 5%), a lower viscosity thermosetting epoxy adhesive (refractive index of about 1.5) is applied to the center of the area corresponding to the multiple display parts. It was dripped.

  Next, the surface on which the color conversion layer 190 of the organic EL element substrate was formed was disposed facing downward and opposed to the color filter substrate coated with an adhesive. The inside of the apparatus was depressurized to about 10 Pa or less, and the two substrates were kept close to each other until the distance between the substrates was about 30 μm while maintaining them in parallel. With the UV curable adhesive in contact with the organic EL element substrate, both substrates were aligned by the alignment mechanism. Thereafter, a slight load was applied between both substrates while returning the internal pressure of the apparatus to atmospheric pressure. At this time, the thermosetting epoxy adhesive spreads from the central portion of the region corresponding to the plurality of display portions toward the peripheral portion. The approach of both substrates stopped when the tip of the spacer 240 contacted the partition wall 150 of the organic EL element substrate.

  Next, UV irradiation through a mask was performed from the color filter substrate side, UV light was examined only on the UV curable adhesive and temporarily cured, and the temporary bonded body was taken out from the bonding apparatus. When the temporarily bonded body was observed, the thermosetting epoxy adhesive was spread over the entire region corresponding to each display portion. Generation of bubbles in the region and protrusion of the outer periphery of the region from the UV curable adhesive were not observed.

  Next, the temporary bonding body was divided | segmented into the area | region corresponded to each display part using the automatic glass scriber and the break device. The divided display was heated to 80 ° C. for 1 hour in a heating furnace to cure the thermosetting epoxy adhesive, and then naturally cooled over 30 minutes. Finally, the barrier layer 180 on the IC connection pad which is a terminal part for connection with an external drive circuit was removed by a dry etching method to obtain a plurality of organic EL displays.

  In the organic EL display of the present example obtained as described above, a color conversion layer is provided on the color filter of the color filter substrate instead of the organic EL element substrate, and a special resin having a refractive index of 1.7 is bonded to the gap. Compared with the organic EL display having a conventional structure filled in, the efficiency was improved by about 30%. Since the thermosetting epoxy adhesive used for filling the bonding gap in this example is a general-purpose adhesive, the manufacturing cost could be reduced. Furthermore, when the organic EL display of this example was subjected to a high temperature storage test, no significant expansion of defects called dark areas or dark spots was observed. Further, the organic EL display of this example was subjected to a heat shock test, but no damage or the like occurred.

<Example 2>
This example is another example of the organic EL display according to the first embodiment of the present invention. The organic EL display of this embodiment has a nominal size of 3 inches, and each pixel has a size of 60 μm × 180 μm × RGB. Further, a color filter substrate in which a black matrix 220 and three kinds of color filters 230 are formed on a sealing substrate 210 was used.

  First, the layers below the inorganic passivation layer 132 were formed by the same procedure as in Example 1.

  Next, a partition wall 150 made of Cu was formed using a Cu plating method. The partition wall 150 is composed of a plurality of stripe-like portions extending in the vertical direction and the horizontal direction, and has openings at positions corresponding to the respective light emitting portions. Moreover, the stripe-shaped part which comprises the partition 150 had the rectangular cross-sectional shape which has a width | variety of about 10 micrometers, and a thickness of about 4 micrometers. The height of the partition 150 from the upper surface of the reflective electrode 142 was about 5 μm.

  Subsequently, the organic EL layer 160 was formed by the same procedure as in Example 1. The organic EL layer 160 was formed on the upper surface of the reflective electrode 142 and the upper surface of the partition 150, and was not formed on the side surface of the partition 150.

  Next, a transparent electrode 170 was formed by the same procedure as in Example 1. The transparent electrode 170 was continuously formed on the upper surface of the organic EL layer and the side surfaces and the upper surface of the partition wall 150, and was electrically connected to the partition wall 150 formed of Cu.

  Thereafter, the barrier layer 180 is formed, the color filter substrate is formed, the organic EL element substrate and the color filter substrate are bonded together, and the plurality of display portions are separated by the same procedure as in the first embodiment. Got a display.

  The organic EL display of this example also showed the same effect as the display of Example 1. In this embodiment, although the organic EL layer 160 and the bottom of the partition 150 are in contact with each other, there is no transmission of moisture from the partition 150 to the organic EL layer 160 because the partition 150 is made of metal. It is considered that the same effect as 1 was obtained. Moreover, since the wiring resistance of the transparent electrode 170 was reduced by the conductive partition wall 150 made of Cu, the luminance unevenness did not stand out.

<Example 3>
This example is an example of the organic EL display according to the second embodiment of the present invention. The organic EL display of this example has a nominal size of 6 inches, and each pixel has a size of 100 μm × 300 μm × RGB. Further, a color filter substrate in which a black matrix 220 and three kinds of color filters 230 are formed on a sealing substrate 210 was used.

  First, the layers below the inorganic passivation layer 132 were formed by the same procedure as in Example 1 except that the dimensions of each pixel were changed.

  Subsequently, the IZO film is formed by the sputtering method and the IZO film is patterned by the same procedure as in the first embodiment, and the base layer 141 composed of a plurality of parts separated for each sub-pixel and the sub-layer adjacent in the horizontal direction are formed. A base layer 144 for auxiliary wiring composed of a plurality of stripe portions having a width of 16 μm was formed in the gap between the pixels. The stripe-like portion of the base layer 144 for auxiliary wiring extends to the outer peripheral portion of the display portion along the sub-pixel columns arranged in the vertical direction, and is connected to a power supply line provided on the outer peripheral portion of the display portion.

  Next, an Ag alloy film having a thickness of 200 nm is formed using a sputtering method so as to cover the base layer 141, and is patterned using a similar process, so that the reflective electrode 142 including a plurality of portions and a plurality of stripes are formed. A part of auxiliary wiring 145 was formed. Each of the plurality of portions constituting the reflective electrode 142 was disposed so as not to protrude from the base layer 141. Similarly, each of the stripe portions of the auxiliary wiring 145 is arranged so as not to protrude from the base layer 144 for auxiliary wiring.

  Subsequently, a polyimide photosensitive resin film having a thickness of 1 μm was applied by using a spin coating method, and patterning by a photolithography method was performed, so that an insulating film 143 was formed. The insulating film 143 has an opening of 60 μm wide × 270 μm long on the reflective electrode 142 and a stripe-shaped opening extending in the vertical direction on the auxiliary wiring 145. The stacked body on which the insulating film 143 was formed was baked at about 250 ° C., and outgas such as moisture was sufficiently discharged.

  Next, a photosensitive resin (manufactured by Hitachi Chemical Co., Ltd., CR-600) is applied, and patterning is performed by a photolithographic method to form a plurality of stripe portions extending in the vertical direction and the horizontal direction. Formed. The partition 150 has an opening at a position corresponding to each light emitting portion. Each of the stripe portions of the partition wall 150 had a reverse tapered (reverse trapezoidal) cross section having an upper base of about 14 μm, a lower base of about 6 μm, and a height from the electrode surface of about 7 μm. Here, the opening provided in the insulating film 143 on the auxiliary wiring 145 was positioned below the upper surface of the partition wall 150. The obtained partition 150 was baked at about 220 ° C., and outgas such as moisture was discharged. By this operation, a partition wall 150 having a lateral opening width of about 86 μm was obtained for a lateral subpixel pitch of 100 μm.

  Subsequently, the organic EL layer 160 was formed by the same procedure as in Example 1. The organic EL layer 160 was separated for each light emitting portion by the partition 150 in the same manner as in Example 1. Further, the organic EL layer 160 did not contact the side surface of the partition wall 150 and did not completely block the opening of the insulating film 143 on the auxiliary wiring 145.

  Next, a transparent electrode 170 was formed by the same procedure as in Example 1. At this time, the transparent electrode 170 was formed along the side surface of the partition 150 in addition to the top surface of the organic EL layer 160 and the top surface of the partition 150, and connected to the auxiliary wiring 145 through the opening of the insulating film 143.

  Thereafter, the barrier layer 180 is formed, the color filter substrate is formed, the organic EL element substrate and the color filter substrate are bonded together, and the plurality of display portions are separated by the same procedure as in the first embodiment. Got a display.

  The organic EL display of this example also showed the same effect as the display of Example 1. In addition, the luminance unevenness did not stand out because the wiring resistance of the transparent electrode 170 was reduced by the auxiliary wiring 145 in spite of the enlargement of the display.

<Example 4>
This example is an example of the organic EL display according to the third embodiment of the present invention. The organic EL display of this embodiment has a nominal size of 3 inches, and each pixel has a size of 60 μm × 180 μm × RGB. Further, a color filter substrate in which a black matrix 220 and three kinds of color filters 230 are formed on a sealing substrate 210 was used.

  First, the layers below the inorganic passivation layer 132 were formed by the same procedure as in Example 1.

  Next, a photosensitive resin (manufactured by Hitachi Chemical Co., Ltd., CR-600) was applied, and patterning by a photolithographic method was performed to form a partition wall 150 including a plurality of stripe-shaped portions extending in the vertical direction. The stripe portion of the partition wall 150 was located in the gap between the light emitting portion rows extending in the vertical direction. Each of the stripe-shaped portions of the partition wall 150 had a reverse tapered (reverse trapezoidal) cross section having an upper base of about 10 μm, a lower base of about 6 μm, and a height from the electrode surface of about 5 μm. The obtained partition 150 was baked at about 220 ° C., and outgas such as moisture was discharged. By this operation, a partition wall 150 having a lateral opening width of about 50 μm was obtained for a lateral subpixel pitch of 60 μm.

  Subsequently, the organic EL layer 160 was formed by the same procedure as in Example 1. The organic EL layer 160 was formed on the upper surface of the reflective electrode 142 and the upper surface of the partition 150, and was not formed on the side surface of the partition 150. The organic EL layer 160 of this example was composed of a plurality of stripe portions extending in the vertical direction.

  Next, the stacked body on which the organic EL layer 160 was formed was moved to another chamber of a resistance heating vapor deposition apparatus to form an MgAg film having a thickness of about 30 nm. The MgAg film was located on the organic EL layer 160 and was separated into a transparent electrode 170 composed of a plurality of stripe-shaped portions extending in the vertical direction and an MgAg film 171 formed on the partition 150.

  Thereafter, the barrier layer 180 is formed, the color filter substrate is formed, the organic EL element substrate and the color filter substrate are bonded together, and the plurality of display portions are separated by the same procedure as in the first embodiment. Got a display.

  The organic EL display of this example also showed the same effect as the display of Example 1.

110 TFT substrate 121 Conductive layer 122 Insulating layer 123 Protective layer 131 Planarizing layer 132 Inorganic passivation layer 141 Base layer for reflective electrode 142 Reflective electrode 143, 143a Insulating film 143b Barrier layer for insulating film 144 Base layer for auxiliary wiring 145 Auxiliary wiring 150 Partition 160 Organic EL layer 170 Transparent electrode 171 Metal film 180 Barrier layer 190 (R, G) Color conversion layer 210 Sealing substrate 220 Black matrix 230 (R, G, B) Color filter 240 Spacer

Claims (10)

An organic EL element substrate including a substrate, a reflective electrode, an organic EL layer, a partition wall, a barrier layer, a transparent electrode and a color conversion layer;
An organic EL display formed by bonding a sealing substrate,
The reflective electrode is composed of a plurality of partial electrodes,
The organic EL layer is formed of a plurality of portions formed on the reflective electrode and separated by the partition wall,
The transparent electrode is formed on the organic EL layer,
The barrier layer covers the partition and the transparent electrode, and has a recess at a position corresponding to the reflective electrode,
The organic EL display, wherein the color conversion layer is formed in the recess.   The organic EL display according to claim 1, wherein a refractive index of the color conversion layer is equal to or higher than a refractive index of the barrier layer.   The organic EL display according to claim 1, wherein the sealing substrate further includes a color filter.   The said partition has a some opening part corresponding to each of the partial electrode which comprises the said reflective electrode, The organic electroluminescent layer is formed in these opening parts. Organic EL display.   The organic EL according to claim 4, further comprising an auxiliary wiring for a transparent electrode, wherein the auxiliary wiring is connected to the transparent electrode in a region where the organic EL layer is not formed by the partition. display.   The organic EL display according to claim 4, wherein the partition is made of a metal material, and the transparent electrode is electrically connected to the partition.   The partition wall is composed of a plurality of stripe-shaped portions arranged in a gap between the plurality of partial electrodes constituting the reflective electrode and extending in one direction, and the organic EL layer is formed in the gap between the partition walls. The organic EL display according to claim 1.   The organic EL display according to claim 7, wherein the transparent electrode includes a plurality of stripe portions separated by the partition walls.   9. The organic EL display according to claim 8, wherein the applied voltage is individually controlled for each of the plurality of striped portions of the transparent electrode.   The organic EL display according to claim 8, wherein electrical characteristics can be measured for each of the plurality of striped portions of the transparent electrode.

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