JP2014102884A - Electronic component and attachment structure for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a contact pin to be removably attached to an opening of an electronic substrate with ease, and to apply a larger current to the electronic substrate by increasing a contact surface between the opening of the electronic substrate and the contact pin.SOLUTION: A contact pin 110 is formed by a conductive member in such a plate shape that two principal surfaces 111 and 112 are opposed to each other, and inserted into a long rectangular opening 220 formed to an electronic substrate 200. A holding member 120 holds a root part 114 side of the contact pin 110. A curved part 113 is formed to the contact pin 110 so as to extend in a curved manner in a direction separated from a center surface M-M connecting between the root part 114 and a front end part 115 of the contact pin 110 between the two principal surfaces 111 and 112. In addition, the curved part 113 presses an inner wall of the opening 220 when the contact pin 110 is inserted into the opening 220.

Description

  The present invention relates to an electronic component and the like, for example, an electronic component and the like attached to an opening formed in an electronic substrate.

  In recent years, electronic components that are electrically connected to a printed wiring board using contact pins are known. In order to mount this electronic component on an electronic board (for example, a printed wiring board), the contact pin is inserted into an opening (through hole) formed in the electronic board and then soldered, and the contact pin is attached to the electronic board. .

  FIG. 5 is a diagram showing a configuration of an electronic component 300 related to the present invention. FIG. 5A is a front view of the electronic component 300. FIG. 5B is a side view of the electronic component 300 and is a view showing an arrow D in FIG. FIG.5 (c) is a bottom view of the electronic component 300, and is a figure which shows the arrow E of FIG.5 (a). FIG. 5D is a top view of the electronic component 300 and is a view showing an arrow F in FIG. 6 and 7 are diagrams showing a mounting structure of an electronic component 300 related to the present invention. 6 and 7, the electronic substrate 400 to which the electronic component 300 is attached is shown in a cross-sectional view.

  As illustrated in FIGS. 5A to 5D, the electronic component 300 includes a plurality of contact pins 310, a holding member 320, and mounting components 330a, 330b, and 330c. The electronic component 300 constitutes an on-board power source. For this reason, at least one of the mounting components 330 is a power supply element. Here, the mounting component 330a is a power supply element.

  As shown in FIGS. 6 and 7, the electronic component 300 is attached to the electronic substrate 400. The electronic substrate 400 includes a flat substrate 410, a plurality of openings 420, and a conductive layer 430. The plurality of openings 420 are formed in the base material 410 so as to correspond to the contact pins 310 of the electronic component 300. The conductive layer 430 is formed on both surfaces of the base material 410 by a metal stay such as a copper stay on the periphery of the opening 420 and the inner wall of the opening 420.

  To attach the electronic component 300 to the electronic substrate 400, first, the contact pins 310 of the electronic component 300 are inserted into the openings 420 of the electronic substrate 400, as shown in FIG. Next, as shown in FIG. 7, the contact pin 310 is fixed to the conductive layer 430 of the electronic substrate 400 with the solder 500.

  A technique related to the present invention is disclosed in Patent Document 1, for example. Patent Document 1 discloses a surface mount module having a pin having a press-fit pin structure. A pin having a press-fit pin structure is press-fitted into a through hole of a printed board.

JP-A-11-195678

  In the related art shown in FIGS. 5 to 7, it is necessary to apply a certain amount of heat to both the contact pin 310 and the conductive layer 430 of the electronic substrate 400 when performing soldering. However, a large amount of heat is absorbed on the conductive layer 430 side of the electronic substrate 400, and the solder 500 does not flow to the inside of the opening 420 of the electronic substrate 400, and soldering is performed only on the surface side of the base material 410. For this reason, the related technology shown in FIGS. 5 to 7 has a problem in that the electrical connection between the contact pin 310 and the conductive layer 430 of the electronic substrate 400 becomes insufficient, resulting in a connection failure. It was.

  Moreover, in the technique described in Patent Document 1, since it is a cylindrical press-fit pin, there are few places (contact points) where the press-fit pin contacts in the through hole, and a large electronic component such as an on-board power supply outputs. It cannot withstand the current.

  The present invention has been made in view of such circumstances, and the contact pin can be easily attached to and removed from the opening of the electronic board, and the contact surface between the opening of the electronic board and the contact pin. An electronic component that can flow a larger current to the electronic substrate is provided.

  The electronic component of the present invention is formed of a conductive member in a plate shape with two main surfaces facing each other, and holds a contact pin inserted into an elongated rectangular opening formed on the electronic substrate, and a base side of the contact pin The contact pin is formed in the contact pin so as to be curved in a direction away from a center plane connecting the root portion and the tip end portion of the contact pin between the two main surfaces, and the contact pin is formed in the opening portion. And a bending portion that presses the inner wall of the opening when inserted.

  The electronic component mounting structure is an electronic component mounting structure for mounting an electronic component on a substrate, the electronic substrate having an elongated rectangular opening, and the electronic component is formed in a plate shape with two main surfaces facing each other. A contact pin that is inserted into an elongated rectangular opening formed in the electronic substrate, a holding member that holds a base portion side of the contact pin, and a base portion and a tip end of the contact pin between the two main surfaces And a curved portion that is formed in the contact pin so as to be curvedly curved in a direction away from the center plane connecting the portions, and presses the inner wall of the opening when the contact pin is inserted into the opening. .

  According to the electronic component according to the present invention, the contact pin can be easily attached to and removed from the opening of the electronic substrate, and the contact surface between the opening of the electronic substrate and the contact pin is widened. A large current can flow to the electronic substrate.

It is a figure which shows the structure of the electronic component in embodiment of this invention. Fig.1 (a) is a front view of the electronic component in embodiment of this invention. FIG.1 (b) is a side view of the electronic component in embodiment of this invention, Comprising: It is a figure which shows the arrow A of Fig.1 (a). FIG.1 (c) is a bottom view of the electronic component in embodiment of this invention, Comprising: It is a figure which shows the arrow B of FIG.1 (a). FIG.1 (d) is a top view of the electronic component in embodiment of this invention, Comprising: It is a figure which shows the arrow C of Fig.1 (a). It is a figure which shows the attachment structure of the electronic component relevant to this invention. It is the enlarged view which shows the structure of a contact pin, Comprising: It is the figure which expanded the X section of Fig.1 (a). It is a figure which shows the attachment structure of the electronic component in embodiment of this invention. It is a figure which shows the attachment structure of the electronic component in embodiment of this invention. It is a figure which shows the attachment structure of the electronic component relevant to this invention. Fig.5 (a) is a front view of the electronic component relevant to this invention. FIG.5 (b) is a side view of the electronic component relevant to this invention, Comprising: It is a figure which shows the arrow D of Fig.5 (a). FIG.5 (c) is a bottom view of the electronic component relevant to this invention, Comprising: It is a figure which shows the arrow E of Fig.5 (a). FIG.5 (d) is a top view of the electronic component relevant to this invention, Comprising: It is a figure which shows the arrow F of Fig.5 (a). It is a figure which shows the attachment structure of the electronic component relevant to this invention. It is a figure which shows the attachment structure of the electronic component relevant to this invention.

  A configuration of electronic component 100 in the embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 shows a configuration of an electronic component 100 according to an embodiment of the present invention. FIG. 1A is a front view of the electronic component 100. FIG.1 (b) is a side view of the electronic component 100, and is a figure which shows the arrow A of FIG.1 (a). FIG.1 (c) is a bottom view of the electronic component 100, and is a figure which shows the arrow B of Fig.1 (a). FIG.1 (d) is a top view of the electronic component 100, and is a figure which shows the arrow C of Fig.1 (a). FIG. 2 is an enlarged view showing the configuration of the contact pin 110, and is an enlarged view of a portion X in FIG. 3 and 4 are diagrams showing a mounting structure of the electronic component 100. FIG.

  First, the configuration of the electronic component 100 will be described.

  As shown in FIGS. 1A to 1D, the electronic component 100 includes a contact pin 110, a holding member 120, and mounting components 130a to 130c. Here, a description will be given on the assumption that there are a plurality of contact pins 110, but at least one contact pin 110 is sufficient. The electronic component 100 constitutes an on-board power source. For this reason, at least one of the mounting components 130a to 130c is a power supply element. Here, the mounting component 130a is a power supply element. Note that the power supply element outputs a larger current compared to an element such as a resistor or a capacitor.

  As shown in FIGS. 1A to 1D, the contact pin 110 is formed in a plate shape, and is provided so that the main surface 111 and the main surface 112 face each other. The contact pin 110 is formed of a conductive member such as phosphor bronze, for example.

  As shown in FIGS. 1A and 2, the contact pin 110 is formed with a curved portion 113. The curved portion 113 is formed on the contact pin 110 so as to expand in a curved shape in a direction away from the center plane MM connecting the base portion 114 and the distal end portion 115 of the contact pin 110 between the main surface 111 and the main surface 112. ing. As shown in FIG. 4, the contact pin 110 is press-fitted into a long rectangular opening 220 formed in the electronic substrate 200 described later. The curved portion 113 presses the inner wall of the opening 210 when the contact pin 110 is press-fitted into the opening 220 of the electronic substrate 200.

  Further, as shown in FIG. 2, the bending portion 113 is formed in a direction connecting the contact pin root portion 114 and the tip end portion 115 from the central portion 113a of the bending portion 113 to both ends (the contact pin tip end portion 115 and the root portion). The distance from the center plane MM of the contact pin 110 is reduced toward the portion 114) side. As shown in FIG. 4, the central portion 113 a of the curved portion 113 is provided so as to be disposed in the opening 220 when the contact pin 110 is inserted into the opening 220.

  The bending portion 113 is formed of a member having both conductivity and elasticity. For example, a material such as phosphor bronze can be used as the material of the bending portion 113.

  Here, the bending portion 113 is formed integrally with the contact pin 110. However, the curved portion 113 may be configured separately from the contact pin 110 and then attached to the contact pin 110.

  The holding member 120 holds the base portion 114 of the contact pin. The holding member 120 is formed in a flat plate shape by glass epoxy resin, for example.

  The mounting components 130a to 130c are electronic elements. As described above, at least one of the mounting components 130a to 130c is a power supply element. Here, the mounting component 130a is a power supply element.

  The configuration of the electronic component 100 has been described above.

  Next, the configuration of the electronic substrate 200 to which the electronic component 100 is attached will be described.

  As shown in FIGS. 3 and 4, the electronic substrate 200 includes a base material 210, a plurality of openings 210, and a conductive layer 230.

  The substrate 210 is a plate-like member, and is formed of, for example, a glass epoxy resin.

  As shown in FIGS. 3 and 4, the contact pins 110 of the electronic component 100 are press-fitted into the plurality of openings 220. For this reason, the opening 220 is formed so as to correspond to the position where the contact pin 110 is disposed. The opening 220 is typically a through hole, but may be a hole that does not penetrate.

  The opening 220 is formed in a long rectangular shape corresponding to the shape of the contact pin 110.

  Specifically, the central portion 113a of the curved portion 113 of the contact pin 110 is opened in accordance with a cut surface (long rectangular outer shape) cut in a direction perpendicular to the center plane MM (see FIG. 2). The part 220 is formed in a long rectangular shape. In other words, the cross-section of the raised portion 113 of the contact pin 110 when cut in a direction substantially perpendicular to the center plane MM of the contact pin 110 is formed to correspond to the shape of the long rectangular opening 220. Has been.

  However, as described above, when the contact pin 110 is press-fitted into the opening 220 of the electronic substrate 200, the width of the short side of the opening 220 is set so that the bending portion 113 presses the inner wall of the opening 210. The width is set to be smaller than the width 113 (the outer dimension of the curved portion 113 in the direction perpendicular to the center plane MM in FIG. 2).

  Further, a conductive member (not shown) such as a copper alloy is applied to the inner wall of each opening 230 to form a conductive layer 230. 3 and 4, the conductive layer 230 is hatched. The conductive layer 230 is electrically connected to a pattern wiring (not shown) formed in the electronic substrate 200.

  The configuration of the electronic substrate 200 has been described above.

  Next, a method for attaching the electronic component 100 to the electronic substrate 200 will be described with reference to the drawings.

  First, a state before the electronic component 100 is attached to the electronic substrate 200 will be described with reference to FIG.

  As shown in FIG. 3, the central portion 113a in the longitudinal direction of the curved portion 113 (the direction along the center plane MM of the contact pin 110 (see FIG. 2)) is formed to rise. As described above, the conductive layer 230 is formed in the opening 220 of the electronic substrate 200 by applying a conductive member such as a copper alloy.

  The maximum width of the central portion 113 a of the bending portion 113 is larger than the inner width of the opening 220 of the electronic substrate 200. Further, as described above, since the bending portion 113 has elasticity, when the contact pin 110 is press-fitted into the opening 220, the central portion 113a of the bending portion 113 presses the inner wall of the opening 220 of the electronic substrate 200. Note that the mounting method in which the contact pin 110 is press-fitted and attached to the opening 220 is also referred to as press-fit mounting. In accordance with this, the contact pin 110 is also called a press-fit pin.

  Further, the central portion 113a of the bending portion 113 is formed such that the distance from the center plane MM of the contact pin 110 is larger than both end portions (contact pin root portion 114 and tip portion 115) side. . Specifically, the bending portion 113 is directed in the direction along the center plane MM of the contact pin 113 from the central portion 113a of the bending portion 113 toward both ends (the contact pin root portion 114 and the tip portion 115). Thus, the distance from the center plane MM of the contact pin 110 is reduced. In other words, the outer shape of the curved portion 113 is formed in a teardrop shape or a barrel shape.

  Next, a state after the electronic component 100 is attached to the electronic substrate 200 will be described with reference to FIG.

  As shown in FIG. 4, the contact pin 110 is inserted into the opening 220. At this time, a part or all of the curved portion 113 is provided so as to be disposed in a space sandwiched between both end portions in the plate thickness direction of the opening portion 210 (vertical direction in the plane of FIG. 4). That is, at least the central portion 113a of the curved portion 113 is located in the opening 220 (more specifically, between both ends in the plate thickness direction of the opening 220 when the contact pin 110 is inserted into the opening 220. In the space between the two).

  Next, a method for attaching the electronic component 100 to the electronic substrate 200 will be described with reference to FIGS.

  As shown in FIGS. 2 and 3, when inserting the contact pin 110 into the opening 220, first, the tip 115 of the contact pin 110 is inserted into the opening 220. At this time, a teardrop-shaped or barrel-shaped curved portion 113 is formed on the contact pin 110. For this reason, even if the tip 115 of the contact pin 111 is shifted from the center of the opening 220, the contact pin 111 is moved while moving the tip 115 of the contact pin toward the center of the opening 220. 110 can be inserted deeply and smoothly into the opening 220.

  Then, by further pressing the contact pin 110 into the opening 220, the central portion 113a of the bending portion 113 contacts the inner wall of the opening 220, and then gradually presses the inner wall of the opening 220 while elastically deforming. It becomes the state of 4. The state shown in FIG. 4 is obtained when the lower surface of the holding member 120 contacts the surface of the electronic substrate 200. That is, the lower surface of the holding member 120 serves as a stopper. In this way, the bending portion 113 extends in the direction along the central axis MM of the contact pin 113 from the central portion 113a of the bending portion 113 toward the tip end portion 115 of the contact pin 110. Since the distance from M is reduced, the contact pin 110 can be smoothly inserted into the through hole 210.

  In the state where the contact pin 110 is inserted into the opening 220, the maximum width of the central portion 113 a of the bending portion 113 is larger than the inner width of the opening 220. Elastic deformation occurs so as to be crushed by the inner wall of the portion 220. And the center part 113a of the curved part 113 presses the inner wall of the opening part 210 with the reaction force which is going to return to an original shape conversely. For this reason, the contact pin 110 is stably held in the opening 220 while being in contact with the inner wall of the opening 220. As a result, the contact pin 110 and the conductive layer 230 formed on the inner wall of the opening 220 are stably electrically connected.

  At this time, the contact pin 110 is formed in a plate shape, and the opening 220 is formed in a long rectangular shape corresponding to the shape of the contact pin 110. For this reason, compared with the case where a column-shaped contact pin is inserted in a cylindrical opening part, the contact surface between a contact pin and an electronic substrate can be enlarged. As a result, a larger current can flow from the electronic component 110 to the electronic substrate 200. As a result, for example, by using an electronic element for the mounting component 130a, it is possible to provide an electronic component that can cope with the case where the electronic component 100 is used as a power supply board.

  Further, in the state where the contact pin 110 is inserted into the opening 220, as shown in FIG. 4, the center portion 113 a that is the most raised among the curved portions 113 is between the both ends of the opening 220 in the plate thickness direction. Therefore, even after the contact pin 110 is inserted into the opening 220, the contact pin 110 can be smoothly removed from the opening 220.

  As described above, the electronic component 100 according to the embodiment of the present invention includes the contact pin 110, the holding member 120, and the curved portion 113.

  The contact pin 110 is formed of a conductive member in a plate shape in which the two main surfaces 111 and 112 face each other, and is inserted into a long rectangular opening 220 formed in the electronic substrate 200. The holding member 120 holds the base portion 114 side of the contact pin 110. The curved portion 113 is formed on the contact pin 110 so as to bend in a direction away from the center plane MM connecting the base portion 114 and the tip portion 115 of the contact pin 110 between the two main surfaces 111 and 112. Yes. Further, the bending portion 113 presses the inner wall of the opening 220 when the contact pin 110 is inserted into the opening 220.

  Thus, the curved portion 113 is formed on the contact pin 110 so as to spread in a curved shape in a direction away from the center plane MM of the contact pin 110. Therefore, when the contact pin 110 is inserted into the opening 220, the contact pin 110 can be smoothly inserted into the opening 220. Further, since the bending portion 113 is disposed in the opening 220 so as to press the inner wall of the opening 220, the contact pin 110 is inserted into the opening 220 even after the contact pin 110 is inserted into the opening 220. Can be removed smoothly. Further, as shown in FIGS. 5 to 7, it is not necessary to attach the electronic component 300 to the electronic substrate 400 by soldering. For this reason, according to the electronic component 100 of the present invention, the contact pin 110 can be attached to the opening 220 of the electronic board 220 so as to be easily inserted and removed. And since it is not necessary to perform soldering to attach the electronic component 100 of the present invention to the electronic substrate 200, problems such as poor connection due to insufficient solder, solder shorts, and cracks in the solder portion can be suppressed.

  The contact pin 110 is formed in a plate shape in which the two main surfaces 111 and 112 face each other, and the opening 220 of the electronic substrate 200 is formed in a long rectangular shape. As described above, the present invention employs a configuration in which the plate-like contact pin 110 is inserted into the long rectangular opening 220. For this reason, compared with the case where a column-shaped contact pin is inserted in a cylindrical opening part, the contact surface between a contact pin and an electronic substrate can be enlarged. As a result, a larger current can flow from the electronic component 110 to the electronic substrate 200.

  As described above, according to the electronic component 100 in the embodiment of the present invention, the contact pin 110 can be easily attached to and removed from the opening 220 of the electronic substrate 200, and the opening 220 of the electronic substrate 200 By enlarging the contact surface between the contact pins 110, a larger current can be supplied to the substrate.

  In the electronic component 100 according to the embodiment of the present invention, the bending portion 113 is connected to the both ends (contact pin 110) from the central portion 113a of the bending portion 113 in the direction connecting the base portion 114 and the tip portion 115 of the contact pin 110. Are formed such that the distance from the center plane MM of the contact pin 110 becomes smaller toward the root portion 114 and the tip portion 115) side. The central portion 113 a of the bending portion 113 is provided so as to be disposed in the opening 220 when the contact pin 110 is inserted into the opening 220.

  In this way, the bending portion 113 extends from the center plane MM of the contact pin 110 toward both ends from the central portion 113a of the bending portion 113 in the direction connecting the base portion 114 and the tip portion 115 of the contact pin 110. Therefore, the curved portion 113 has a teardrop shape or a barrel shape. Therefore, when the contact pin 110 is inserted into the opening 220, the contact pin 110 can be smoothly inserted into the opening 220. In particular, when a large number of contact pins 110 are provided in the electronic component 100, the tip portion 115 of the contact pin 110 is efficiently guided to the opening 220 while absorbing variations in the size of the tip portion 115 of the contact pin 110. Can do. In addition, since the central portion 113 a that is the most raised among the curved portions 113 is disposed in the opening 220 so as to press the inner wall of the opening 220, the contact pin 110 is inserted into the opening 220. In addition, the contact pin 110 can be removed from the opening 220.

  As described above, according to the electronic component 100 in the embodiment of the present invention, the curved portion 113 is formed on the contact pin 110 so that the central portion 113a of the curved portion 113 is most raised, and the central portion of the curved portion 113 is formed. 113 a is disposed in the opening 220. Thereby, the contact pin 110 can be attached to the electronic substrate 200 through the opening 220 so that it can be easily inserted and removed.

  In the electronic component 100 according to the embodiment of the present invention, the curved portion 113 is disposed inside the opening 220 over substantially the entire area between the two main surfaces of the electronic substrate 200. Thereby, by further widening the contact surface between the opening 220 of the electronic substrate 200 and the contact pin 110, a larger current can be supplied to the substrate.

  Moreover, in the electronic component 100 according to the embodiment of the present invention, the bending portion 113 is formed of an elastic member. Thereby, when the contact pin 110 is inserted into the opening 220, the inner wall of the opening 220 can be reliably pressed by the bending portion 113.

  In the electronic component 100 according to the embodiment of the present invention, the cross-section of the raised portion 113 of the contact pin 100 when cut in a direction substantially perpendicular to the center plane MM of the contact pin 110 is the shape of the opening 220. It is formed to correspond to.

  Thereby, the contact area between the curved portion 113 of the contact pin 110 and the inner wall of the opening 220 can be further increased. As a result, when the contact pin 110 is inserted into the opening 220, the inner wall of the opening 220 can be more reliably pressed by the curved portion 113. Further, when the conductive member is applied to the inner wall of the opening 220, the electrical connection between the conductive member applied to the inner wall of the through hole 210 and the contact pin 110 can be more reliably established. . As a result, a larger current can flow from the electronic component 110 to the electronic substrate 200.

  The electronic component 100 according to the embodiment of the present invention includes a power supply element attached to the holding member 120. Thereby, the electronic component 100 can be comprised as a power supply board. As described above, the present invention employs a configuration in which the plate-like contact pin 110 is inserted into the long rectangular opening 220. For this reason, the electronic component 100 of the present invention can widen the contact surface between the contact pin 110 and the electronic substrate 220 as compared with the case where the columnar contact pin is inserted into the cylindrical opening. A larger current can be passed from the electronic component 110 to the electronic substrate 200. Therefore, the present invention can also be applied to an electronic component that allows a large current to flow, such as a power supply board.

  The mounting structure for the electronic component 100 in the embodiment of the present invention is a structure for mounting the electronic component 100 to the electronic substrate 200. The electronic substrate 200 includes an opening 220 having a long rectangular shape. The electronic component 100 includes a contact pin 110, a holding member 120, and a bending portion 113. The contact pin 110 is formed of a conductive member in a plate shape in which the two main surfaces 111 and 112 face each other, and is inserted into a long rectangular opening 220 formed in the electronic substrate 200. The holding member 120 holds the base portion 114 side of the contact pin 110. The curved portion 113 is formed on the contact pin 110 so as to bend in a direction away from the center plane MM connecting the base portion 114 and the tip portion 115 of the contact pin 110 between the two main surfaces 111 and 112. Yes. Further, the bending portion 113 presses the inner wall of the opening 220 when the contact pin 110 is inserted into the opening 220.

  Even with such an electronic component 100 mounting structure, the same effects as described above can be obtained.

  The present invention has been described above based on the embodiment. The embodiment is an exemplification, and various modifications, increases / decreases, and combinations may be added to the above-described embodiments without departing from the gist of the present invention. It will be understood by those skilled in the art that modifications to which these changes, increases / decreases, and combinations are also within the scope of the present invention.

DESCRIPTION OF SYMBOLS 100 Electronic component 110 Contact pin 111 Main surface 112 Main surface 113 Curved part 113a Center part of curved part 114 Contact pin base part 115 Contact pin tip part 120 Holding member 130a Mounted part 130b Mounted part 130c Mounted part 200 Electronic substrate 210 Base Material 220 Opening 230 Conductive layer

Claims (7)

A contact pin that is formed of a conductive member in a plate shape with two main surfaces facing each other, and is inserted into an elongated rectangular opening formed on the electronic substrate;
A holding member that holds the base side of the contact pin;
When the contact pin is formed in the contact pin so as to extend in a curved shape in a direction away from the center plane connecting the root portion and the tip portion of the contact pin between the two main surfaces, and the contact pin is inserted into the opening And a bending portion that presses the inner wall of the opening. The curved portion is formed so that a distance from the center surface of the contact pin decreases in a direction connecting the root portion and the tip portion of the contact pin from the central portion toward the both end portions. ,
2. The electronic component according to claim 1, wherein a central portion of the curved portion is provided so as to be disposed in the opening when the contact pin is inserted into the opening.   The electronic component according to claim 2, wherein the curved portion is disposed in the opening over substantially the entire area between two main surfaces of the electronic substrate.   The electronic component according to claim 1, wherein the curved portion is formed of an elastic member.   The cross section of the raised portion of the contact pin when cut in a direction substantially perpendicular to the center plane of the contact pin is formed to correspond to the shape of the opening. The electronic component according to Item 1.   The electronic component of any one of Claims 1-5 provided with the power supply element attached to the said holding member. An electronic component mounting structure for mounting an electronic component on a board,
The electronic substrate is
With a long rectangular opening,
The electronic component is
A contact pin that is formed in a plate shape with two main surfaces facing each other, and is inserted into an elongated rectangular opening formed on the electronic substrate;
A holding member that holds the base side of the contact pin;
When the contact pin is formed in the contact pin so as to extend in a curved shape in a direction away from the center plane connecting the root portion and the tip portion of the contact pin between the two main surfaces, and the contact pin is inserted into the opening An electronic component mounting structure comprising: a curved portion that presses the inner wall of the opening.

Images