JP2014162206A - Scribing wheel, holder unit, scribe apparatus and method of producing scribing wheel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a scribing wheel which is used to form a scribe line on a brittle material substrate harder than general amorphous glass substrates, e.g. ceramic, and is improved in the abrasion resistance of the tip part, a holder unit for the scribing wheel, a scribing apparatus using them and a method of producing a scribing wheel.SOLUTION: A scribing wheel 40 is used to divide a brittle material substrate harder than amorphous glass substrates and is formed with a member composed of polycrystalline CVD diamond. In dividing a brittle material substrate, the scribing wheel does not cause detachment of a binder, unlike PCD-made scribing wheels, leading to high abrasion resistance of a tip part 43 and a long lifetime.

Description

  The present invention relates to a scribing wheel, a holder unit, a scribing device, and a scribing wheel manufacturing method used for forming a scribe line on the surface of a brittle material substrate. More specifically, the present invention relates to a scribing wheel and a holder unit suitable for forming a scribe line on the surface of a brittle material substrate such as a ceramic substrate, a sapphire substrate, or a silicon substrate that is harder than a general amorphous glass substrate. The present invention relates to a scribing device and a method for manufacturing a scribing wheel.

  A method using a scribing wheel is known when an amorphous glass substrate used for a liquid crystal panel or the like is divided. This is because the scribing wheel is pressed and rolled onto the glass substrate to form a scribe line on the substrate surface, thereby causing a crack in the vertical direction from the substrate surface (scribing process), and then applying stress to the substrate to apply the vertical In this method, cracks are grown to the back surface of the substrate (break process), and the glass substrate is divided.

  As this scribing wheel, for example, a scribe cutter described in Patent Document 1 is known. The main part of the scribe cutter is formed of sintered diamond (hereinafter referred to as PCD). This PCD is prepared by using a mixture of diamond particles and a binder (such as cobalt) and sintering under high temperature and high pressure.

  Incidentally, as a method of dividing a ceramic substrate such as alumina that is harder than a glass substrate, dicing performed by cutting a semiconductor wafer is known. However, dicing has the following problems. (1) Since the machining speed is generally slow, the tact time (required time) is long and the productivity is extremely low. (2) Since the thickness of the dicing saw becomes chips, material loss is inevitable. (3) Chipping is likely to occur on the cut surface. (4) Since it is necessary to use washing water, a drying process is required. (5) The process of sticking to a dicing tape and peeling is required. (6) The blade life is short and the running cost is high.

  Therefore, even when a ceramic substrate such as alumina that is harder than the glass substrate is divided, it is attempted to use a scribing wheel in the same manner as the division of the glass substrate.

JP-A-11-171574

  However, when the ceramic substrate was cut using the PCD scribing wheel disclosed in Patent Document 1, the cutting edge portion was more heavily worn than the glass substrate, and the life of the cutting edge portion of the scribing wheel was extremely long. There was a problem that it became shorter.

  As a result of examining this reason, when scribing using a PCD scribing wheel, the bonding material between the diamond particles falls off first, and the diamond particles remaining due to the dropping of the binding material also easily fall off, It became clear that the wear of the blade edge portion became severe because they were easily chipped from each other.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a scribing wheel, a holder unit, a scribing device, and a scribing wheel manufacturing method with improved wear resistance of a cutting edge when a brittle material substrate is divided.

  In order to achieve the above object, the scribing wheel of the present invention is a scribing wheel for cutting a brittle material substrate, and is characterized by being formed of a member made of polycrystalline CVD diamond.

  According to the scribing wheel of the present invention, since the scribing wheel is formed of polycrystalline CVD diamond, a binder such as PCD is not included. Therefore, particularly when a brittle material substrate such as ceramic harder than a glass substrate is cut, a binder such as a PCD scribing wheel does not fall off, so the blade portion has high wear resistance and a long life. It will be a thing.

  The holder unit of the present invention is characterized by having a scribing wheel formed of a member made of polycrystalline CVD diamond and a holder for rotatably holding the scribing wheel.

  According to the holder unit of the present invention, when a brittle material substrate such as ceramic that is harder than a glass substrate is cut, the holder unit holds a scribing wheel that has a longer life than those made of PCD.

  The scribing apparatus of the present invention is characterized by comprising a holder unit that rotatably holds a scribing wheel formed of a member made of polycrystalline CVD diamond.

  According to the scribing device of the present invention, since the life of the scribing wheel is longer than that made of PCD, when the brittle material substrate such as ceramic harder than the glass substrate is divided, the number of replacement of the holder unit can be reduced. become able to.

  The scribing wheel manufacturing method for dividing a brittle material substrate according to the present invention includes a step of forming a disc-shaped member made of polycrystalline CVD diamond, and a blade portion is formed on a circumferential portion of the disc-shaped member. A process.

  According to the method for manufacturing a scribing wheel of the present invention, when a brittle material substrate such as ceramic harder than a glass substrate is cut, a scribing wheel with high wear resistance of the blade portion and a long life can be provided. .

It is a schematic diagram of a scribing device in an embodiment. It is a front view of the holder joint which the scribe device in an embodiment has. It is a perspective view of the holder unit in an embodiment. It is a partially expanded view of the holder unit in the embodiment. It is a side view of the scribing wheel in an embodiment. It is the graph which showed transition of the travel distance and load in scribing using the scribing wheel in an embodiment. It is the graph which showed transition of the travel distance and load in the scribe using the scribing wheel made from PCD. It is the front photograph and side photograph of the ridgeline of the scribing wheel in an embodiment. Fig.9 (a) is a side view of the scribing wheel in other embodiment, FIG.9 (b) is an enlarged view of the scribing wheel in other embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment shown below shows an example for embodying the technical idea of the present invention, and is not intended to specify the present invention to this embodiment. The invention is also applicable to other embodiments within the scope of the claims.

[Embodiment 1]
A schematic diagram of a scribing apparatus 10 according to the embodiment is shown in FIG. The scribing apparatus 10 includes a moving table 11. The moving table 11 is screwed with the ball screw 13 and can be moved in the y-axis direction along the pair of guide rails 12a and 12b by rotating the ball screw 13 by driving the motor 14. ing.

  A motor 15 is installed on the upper surface of the movable table 11. This motor 15 is for rotating the table 16 located in the upper part on an xy plane and positioning it at a predetermined angle. The brittle material substrate 17 is placed on the table 16 and held by a vacuum suction means (not shown). The brittle material substrate 17 to be scribed is a ceramic substrate made of low-temperature fired ceramics or high-temperature fired ceramics, a silicon substrate, a sapphire substrate, or the like, and is an amorphous glass generally used for a liquid crystal panel substrate or the like. It is a brittle material substrate harder than the substrate.

  The scribing apparatus 10 includes two CCD cameras 18 that image the alignment marks formed on the surface of the brittle material substrate 17 above the brittle material substrate 17. And in the scribe device 10, the bridge 19 is constructed by the support | pillars 20a and 20b along the x-axis direction so that the movable stand 11 and the table 16 of the upper part may be straddled.

  A guide 22 is attached to the bridge 19, and a scribe head 21 is movably installed along the guide 22 along the x-axis direction. A holder unit 30 is attached to the scribe head 21 via a holder joint 23.

  FIG. 2 is a front view of the holder joint 23 to which the holder unit 30 is attached. FIG. 3 is a perspective view of the holder unit 30. 4 is an enlarged view of a part of the side surface of the holder unit 30 observed from the direction A in FIG.

  The holder joint 23 has a substantially cylindrical shape, and includes a rotation shaft portion 23a and a joint portion 23b. In a state where the holder joint 23 is attached to the scribe head 21, two bearings 24a and 24b for rotatably holding the holder joint 23 are provided on the rotary shaft portion 23a via a cylindrical spacer 24c. It is attached. FIG. 2 shows a front view of the holder joint 23 and also shows a sectional view of the bearings 24a and 24b and the spacer 24c attached to the rotary shaft portion 23a.

  The cylindrical joint portion 23b is provided with an internal space 26 having a circular opening 25 on the lower end side. A magnet 27 is embedded in the upper portion of the internal space 26. A holder unit 30 that is detachable by a magnet 27 is inserted into the internal space 26 and attached.

  The holder unit 30 is a unit in which a holder 30a, a scribing wheel 40, and a pin 50 are integrated. As shown in FIG. 3, the holder 30a has a substantially cylindrical shape and is made of a magnetic metal. And the attaching part 31 for positioning is provided in the upper part of the holder 30a. The attachment portion 31 is formed by cutting out the upper portion of the holder 30a, and includes an inclined portion 31a and a flat portion 31b.

  Then, the attachment portion 31 side of the holder 30 a is inserted into the internal space 26 through the opening 25. At that time, the upper end side of the holder a30 is attracted by the magnet 27, and the inclined portion 31a of the mounting portion 31 comes into contact with the parallel pin 28 passing through the internal space 26, whereby the holder unit 30 is positioned and fixed with respect to the holder joint 23. . Further, when removing the holder unit 30 from the holder joint 23, it can be easily removed by pulling the holder 30a downward.

  A holding groove 32 formed by cutting out the holder 30a is provided below the holder 30a. The support portions 33a and 33b are located below the holder 30a that is notched to provide the holding groove 32 with the holding groove 32 interposed therebetween. A scribing wheel 40 is rotatably disposed in the holding groove 32. The support portions 33a and 33b are respectively formed with support holes 34a and 34b for supporting the pins 50 for holding the scribing wheel 40 freely during rotation.

  Then, as shown in FIG. 4, the pin 50 is passed through the pin hole 42 of the scribing wheel 40, and the scribing wheel 40 is rotated with respect to the holder 30a by installing both ends of the pin 50 in the support holes 34a and 34b. It can be attached freely. The support hole 34a has a stepped portion inside, and the hole diameter of the opening on the holding groove 32 side is larger than the hole diameter of the opening on the other side.

  Next, the details of the scribing wheel 40 will be described. FIG. 5 is a side view of the scribing wheel 40 attached to the tip of the holder 30a.

  The scribing wheel 40 is formed of a base material 41. The base material 41 is formed with a pin hole 42 for penetrating the pin 50 substantially at the center of the base material 41, and is formed by cutting both ends of the circumferential portion of the base material 41. A blade portion 43 is formed.

  The base material 41 is a disk-shaped member made of polycrystalline CVD diamond having conductivity, as will be described later. The pin hole 42 is formed by cutting the substantial center of the base material 41 into a circle.

  The blade portion 43 includes a ridge line 44 formed by cutting both ends of the circumferential portion of the disk-shaped base material 41, and inclined surfaces 45 on both sides of the ridge line 44.

  The dimensions of the scribing wheel 40 will be described. The outer diameter of the scribing wheel 40 is 1.0 to 10.0 mm, preferably 1.0 to 5.0 mm, and more preferably 1.0 to 3.0 mm. When the outer diameter of the scribing wheel 40 is smaller than 1.0 mm, the handleability of the scribing wheel 40 is lowered. On the other hand, when the outer diameter of the scribing wheel 40 is larger than 10.0 mm, the vertical crack at the time of scribing may not be formed deeply with respect to the brittle material substrate 17. And in this embodiment, the scribing wheel 40 whose outer diameter is 2.0 mm is used.

  The thickness of the scribing wheel 40 is 0.4 to 1.2 mm, preferably 0.4 to 1.1 mm. When the thickness of the scribing wheel 40 is smaller than 0.4 mm, workability and handleability may deteriorate. On the other hand, when the thickness of the scribing wheel 40 is greater than 1.2 mm, the material for the scribing wheel 40 and the cost for manufacturing increase. In this embodiment, a scribing wheel 40 having a thickness of 0.5 mm is used. Note that the width of the holding groove 32 of the holder 30a (the distance between the support portion 33a and the support portion 33b) is slightly larger than the thickness of the scribing wheel 40.

  The hole diameter of the pin hole 42 of the scribing wheel 40 is 0.8 mm in this embodiment.

  The cutting edge angle of the blade portion 43 is usually an obtuse angle, and is in the range of 90 to 160 °, preferably 90 to 140 °. In this embodiment, a 120 ° scribing wheel 40 is used.

  A method for manufacturing the scribing wheel 40 will be described. First, the base material 41 is obtained by growing a polycrystalline diamond film on the surface of a disk-shaped mother substrate by a chemical vapor deposition method (CVD method). Manufactured by peeling.

  More specifically, pretreatment is performed to facilitate the formation of diamond nuclei on the surface of the mother substrate. Examples of the pre-processing include a scratching process, a bias process, and a seeding process. And after performing a pre-processing, while arrange | positioning a mother board | substrate in a chamber, raising the surface temperature of a mother base material to 800 to 1000 degreeC, sending mixed gas into a chamber and producing a chemical reaction, A diamond film is formed on the surface. At this time, as the mixed gas, a mixture of methane gas and hydrogen gas can be used.

  The chemical reaction is performed using heat or plasma. In this embodiment, the diamond film is formed until the thickness of the diamond film is approximately 0.5 to 1.5 mm. Further, the film formation is performed so that the diamond particle diameter at this time is 60 to 80 μm. This particle size is very large compared to the diamond particle size (0.5 to 2.0 μm) in a general PCD scribing hole.

  In this embodiment, conductivity is imparted to the base material 41 by doping boron or phosphorus during film formation. Thus, by providing the base material 41 with electrical conductivity, electric discharge machining can be performed during the formation of the blade 43 described later. In addition, although the electrical conductivity of the base material 41 depends on the doping amount, increasing the electrical conductivity makes it easier to stabilize the electric discharge during electric discharge machining, lowering the electric discharge machining condition value, and increasing the electric discharge machining efficiency. You can do it. In addition, since the entire base material 41 is made of polycrystalline CVD diamond having conductivity, there is almost no variation in electrical resistivity, so that more uniform and precise processing can be performed.

  Next, the base material 41 is peeled from the mother substrate, and the peeled disk-shaped base material 41 is subjected to electric discharge machining to form the inclined surface 45 on the circumferential portion of the base material 41. Specific examples of this electric discharge machining include wire cut electric discharge machining and sculpting electric discharge machining. The electric discharge machining is performed by immersing the base material 41 in a liquid such as water or oil as a dielectric conductor.

  And finally, the blade part 43 is formed by grind | polishing the surface of the inclined surface 45 with a grindstone, and the scribing wheel 40 is completed. In addition, it is preferable to perform in this grinding | polishing process in several grinding | polishing processes like rough grinding | polishing and final grinding | polishing using the grindstone from which the magnitude | size of particle | grains differs. In particular, in this embodiment, since the particle diameter of the diamond particles is large, if the diamond particles are chipped during polishing, the finish of the ridge line 44 and the inclined surface 45 becomes rough. However, the diamond particles can be prevented from being chipped by a plurality of polishing processes, and the finish of the ridgeline 44 and the inclined surface 45 can be improved.

  The pin hole 42 is formed by first forming a hole with a laser and performing a finishing process by wire-cut electric discharge machining. Further, in the present embodiment, the disc-shaped base material 41 is produced using the disc-shaped mother substrate and the scribing wheel 40 is manufactured. For example, the rectangular mother substrate is used to produce a rectangular shape. The scribing wheel 40 may be manufactured by creating the base material 41 having a shape and cutting the rectangular base material 41 into a disc shape.

  The scribing wheel 40 manufactured in this way does not contain a binder such as cobalt between the diamond particles, unlike the conventionally known PCD scribing wheel. Therefore, when the brittle material substrate 17 is scribed, the binding material does not fall off like the PCD scribing wheel. Therefore, the scribing wheel 40 has a high wear resistance of the blade portion 43 and has a long life. Become.

  This point will be specifically described by actually comparing the scribing wheel 40 of this embodiment and the PCD scribing wheel.

  The PCD scribing wheel used for comparison is composed of fine diamond particles (particle size is 0.5 to 2.0 μm), additives (ultrafine carbides such as tungsten, titanium, niobium, and tantalum), bonding PCD is manufactured by mixing materials (iron group elements such as cobalt, nickel, iron, etc.) and sintering the mixture under high temperature and ultrahigh pressure at which diamond is thermodynamically stable. A disk having a radius of was cut out and the peripheral edge of this disk was shaved. The PCD scribing wheel has an outer diameter of 2.0 mm, a thickness of 0.65 mm, a pin hole diameter of 0.8 mm, and a blade edge angle of 120 °.

  First, the scribing wheel 40 and the PCD scribing wheel were each attached to the same scribing device, and a brittle material substrate harder than an amorphous glass substrate was cut.

  The scribing device used is a scribing device (model name: MS500) manufactured by Samsung Diamond Industrial Co., Ltd.

The cutting conditions are as follows.
Brittle material substrate for evaluation: Alumina substrate ... manufactured by Kyocera Corporation (material code: A476T)
Brittle material substrate thickness: 0.635mm
Cutting speed: 100mm / sec
Cutting method: inner-inner cutting (cutting by scribing from the inside of one side of the board to the inside of the other side)
Scribe load: Set to maintain a vertical crack of 100 μm (however, the maximum load this time was 0.40 MPa)

  The reason why the scribe load is set so that the vertical crack of 100 μm can be maintained is that it becomes difficult to break the substrate when the crack becomes 100 μm or less. In addition, when a scribe load is set so that a vertical crack of 100 μm can be maintained, this scribe load usually changes gradually. This is because as the scribing wheel continues, the cutting edge of the scribing wheel will wear, and the amount of cracks will gradually become shallower if the scribe load remains constant. Therefore, in order to maintain the amount of cracks, the scribe load is gradually increased according to the degree of wear of the cutting edge of the scribing wheel.

  FIG. 6 and FIG. 7 show the results of dividing the brittle material substrate using the scribing wheel 40 of this embodiment and the PCD scribing wheel under the above conditions. FIG. 6 is a graph showing the transition of the travel distance and load of the scribing wheel 40. FIG. 7 is a graph showing the transition of the travel distance and load of the PCD scribing wheel.

  6 and 7, the horizontal axis indicates the travel distance (m), the vertical axis indicates the scribe load (MPa), and the numerical values in the graph are set so that the amount of vertical cracks is 100 μm. The actual measured value (μm) of the vertical crack (in the case) is shown. Moreover, FIG. 6 has shown the value from 0 m to 100 m as a travel distance so that it may mention later. FIG. 7 shows the amount of scribe load and cracks at intervals of 5 m for travel distances of 0 m to 100 m, and 100 m to shows the amount of scribe loads and cracks at intervals of 10 m. Moreover, the initial value (travel distance 0 m) of the scribe load when performing 100 μm scribing is 0.12 MPa for the scribing wheel 40 of this embodiment and 0.14 MPa for the PCD scribing wheel.

  As shown in FIG. 7, in the case of a PCD scribing wheel, the scribe load exceeded 0.30 MPa when the travel distance was 100 m, and the scribe load reached the maximum load of 0.40 MPa when the travel distance reached 150 m (note that The actual measured value of the vertical crack at this time was 99.5 μm).

  On the other hand, as shown in FIG. 6, in the case of the scribing hole 40 of the present embodiment, the measurement is made only up to a travel distance of 100 m, but when the travel distance is 100 m, the scribe load is 0.12 MPa and the travel distance is 0 m. No change was observed (the actual measured value of the vertical crack at this time was 119.9 μm). Therefore, it is considered that the scribing wheel 40 of the present embodiment can further scribe even if it exceeds 100 m.

  Thus, in scribing against a brittle material substrate, the scribing wheel 40 made of polycrystalline CVD diamond has a much higher wear resistance than the PCD scribing wheel.

  Then, next, it observed about the blade part 43 of the scribing wheel 40, and compared with the blade part of the scribing wheel made from PCD. FIG. 8 is a front photograph and a side photograph of the ridgeline 44 when the scribing wheel 40 of the present embodiment is traveling distances 0 m, 50 m, and 100 m.

  As shown in FIG. 8, the scribing wheel 40 had somewhat small chips on the ridge line 44 at a travel distance of 0 m. However, when compared with the PCD scribing wheel, this chipping was comparable to the chipping observed on the ridge line of the PCD scribing wheel. Further, a slight step or gap was observed on the inclined surface 45 of the scribing wheel 40. As compared with the PCD scribing wheel, the inclined surface 45 of the scribing wheel 40 was somewhat rougher than the inclined surface of the PCD scribing wheel. This is because the polycrystalline CVD diamond constituting the scribing wheel 44 has a particle diameter of 60 to 80 μm, which is considerably larger than the particle diameter (0.5 to 2.0 μm) of the PCD scribing wheel.

  When the travel distance was 50 m, the scribing wheel 40 of the present embodiment had a large chip on the ridge 44 compared to the initial state, and was somewhat worn. However, there was no significant change from the initial state, and this degree of chipping or wear was not so large as to significantly affect the scribe against the brittle material substrate.

  On the other hand, when the PCD scribing wheel was confirmed, the ridgeline of the PCD scribing wheel was remarkably worn, and the tip of the blade portion that became the ridgeline was a flat surface. Therefore, the PCD scribing wheel has significantly deteriorated in the brittle material substrate. This is because, as described above, in the PCD scribing wheel, the bonding material between the diamond particles drops off, and the diamond particles are easily chipped, and wear progresses.

  Even when the travel distance reached 100 m, no significant change was observed with respect to the scribing wheel 40 of the present embodiment. In addition, the ridge line 44 is chipped. However, the ridge line 44 is notched, so that the ridge line 44 is uneven, and the unevenness penetrates deeply into the hard brittle material substrate, so that cracks are efficiently formed. It was.

  On the other hand, when the PCD scribing wheel was confirmed, the ridgeline of the PCD scribing wheel was further worn and the width of the flat surface was widened, so that the biting into the brittle material substrate was further deteriorated. Accordingly, in order to form a predetermined crack with the PCD scribing wheel, the scribe load must be increased, and the result shown in FIG. 7 is obtained.

  Thus, since the scribing wheel 40 of this embodiment is formed of polycrystalline CVD diamond, no binder is present between the diamond particles. Therefore, when the brittle material substrate is divided, particularly when the brittle material substrate such as ceramic harder than the glass substrate is divided, rapid wear due to dropping of the binding material such as the PCD scribing wheel does not occur. The scribing wheel 40 has high wear resistance of the blade portion 43 and has a long life.

  In addition, since the scribing wheel 40 is a large particle of CVD polycrystalline diamond having a particle diameter of 60 to 80 [mu] m, the ridge line 44 has large irregularities even when wear progresses, so that it can penetrate deeply into the brittle material substrate. Therefore, as a result, the period during which the scribing wheel 40 can be used becomes longer. In addition, since the scribing wheel 40 of the present embodiment has conductivity, electric discharge machining can be used in forming the blade portion 43, and machining of high-hardness polycrystalline CVD diamond can be easily performed.

  In addition, since the scribing wheel 40 and the pin 50 of this embodiment are consumables, periodic replacement is required. In the present embodiment, the holder unit 30 is attached to the scribe head 21 via the holder joint 23. Therefore, since the holder unit 30 can be easily attached and detached, when replacing the consumables, the consumables and the holder 30a are handled as an integrated holder unit 30 without intentionally removing the consumables from the holder 30a. Since it can be replaced, the replacement work becomes very easy. Further, the scribing wheel 40 of this embodiment can also be used in a scribing device in which the holder is directly fixed to the scribing head without using the holder joint 23. In this case, the scribing wheel 40 of the present embodiment, which is a consumable item, is removed from the holder and replaced.

[Embodiment 2]
FIG. 9A is a side view of a scribing wheel 40A different from the scribing wheel 40 of the first embodiment. FIG. 9B is an enlarged view of the B region of the scribing wheel 40A of FIG. The same components as those of the scribing wheel 40 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The scribing wheel 40A is formed of a base material 41a. And in the base material 41a, the pin hole 42 for penetrating the pin 50 is formed in the approximate center of the base material 41a, and the both ends of the circumferential part of the base material 41a are cut and formed. A blade portion 43a is formed.

  Similar to the scribing wheel 40, the base material 41a is a disk-shaped member made of polycrystalline CVD diamond having conductivity.

  The blade portion 43a includes a ridge line 44a formed by cutting both ends of the circumferential portion of the disk-shaped base material 41a, and inclined surfaces 45a on both sides of the ridge line 44a.

  The scribing wheel 40A is different from the scribing wheel 40 in that a plurality of grooves 46 are provided at the tip of the blade portion 43a at an equal pitch. In the scribing wheel 40 in which the groove 46 is provided at the tip of the blade portion 43a, the protruding ridge 44a and the groove 46 alternately approach the substrate so that the ridge 44a intermittently hits the substrate. become. As a result, the scribe line is formed while impacting the hitting point on the substrate, so that the depth of the vertical crack extending along the scribe line is much deeper than that of the scribing wheel without a groove.

  Further, the pressure contact load is intensively applied to the ridge line 44a, and this also increases the depth of the vertical crack. For this reason, the scribing wheel 40A with the groove 46 has higher permeability than the scribing wheel without the groove.

  And since the scribing wheel 40A with the groove | channel 46 is also formed with the polycrystalline CVD diamond, the binder does not exist between diamond particles. Therefore, when a brittle material substrate such as a ceramic harder than a glass substrate is cut, the scribing wheel 40 has a wear resistance of the blade portion because there is no abrupt wear due to the dropping of the binding material such as a PCD scribing wheel. High performance and long life. In particular, since the wear resistance of the ridge line 44a is increased, the scribing wheel 40A can maintain high permeability for a longer time.

  In addition, the groove | channel 46 of 40 A of scribing wheels is formed by making a disk-shaped grindstone contact | abut so that it may orthogonally cross with respect to the ridgeline 44a. At this time, the grindstone is retracted every time one groove 46 is formed. Then, after the scribing wheel 40A is rotated by a rotation angle corresponding to a predetermined pitch, the next groove 46 is formed by contacting the grindstone again. In this way, the ridge 44a portion and the groove 46 are alternately provided at the same pitch at the tip of the scribing wheel 40A. Moreover, the groove | channel 46 may be a groove | channel like a triangle shape besides the curved groove | channel as shown in FIG. Further, it may be processed by laser from the scribing wheel 40A.

[Modification]
In the scribing wheel of Embodiment 1 or Embodiment 2, the blade portion is formed on the circumferential portion of the disk-shaped base material, and this blade portion is formed by scraping both ends of the circumferential portion of the base material, It has slopes on both sides of this ridgeline. In addition to such a blade part, a scribing wheel in which only one end side of the circumferential part is shaved and a blade part having a ridge line and one inclined surface is formed (the cross-sectional shape of the scribing wheel becomes trapezoidal) Also good. Moreover, the scribing wheel in which the blade part in which the angles of the inclined surfaces on both sides of the ridge line are different may be formed.

  As described above, when dividing a brittle material substrate such as a ceramic substrate, a sapphire substrate, or a silicon substrate that is harder than an amorphous glass substrate used for a liquid crystal panel substrate or the like, polycrystalline CVD diamond By using the scribing wheel formed in (1), the wear resistance of the blade portion is higher than that of the PCD scribing wheel, and the service life is longer.

  In the present embodiment, the scribing device 10 is provided with two CCD cameras 18 that image the alignment marks of the brittle material substrate 17 or a moving table that rotates a table on which the brittle material substrate 17 is placed. 11 is shown. However, the present invention is not limited to such a scribing device 10, and a brittle material is provided by attaching a holder that rotatably holds the scribing wheel to the tip of the handle, and moving the user with the handle. Even a so-called manual scribing apparatus that divides the substrate 17 is applicable.

DESCRIPTION OF SYMBOLS 10 ... Scribing device 11 ... Moving stand 12a, 12b ... Guide rail 13 ... Hall screw 14, 15 ... Motor 16 ... Table 17 ... Brittle material substrate 18 ... CCD camera 19 ... Bridge 20a, 20b ... Post 21 ... Scribe head 22 ... Guide 23 ... Holder joint 23a ... Rotating shaft part 23b ... Joint parts 24a, 24b ... Bearing 24c ... Spacer 25 ... Opening 26 ... Internal space 27 ... Magnet 28 ... Parallel pin 30 ... Holder unit 30a ... Holder 31 ... Mounting part 31a ... Inclined part 31b ... Flat part 32 ... Holding groove 33a, 33b ... Support part 34a, 34b ... Support hole 40, 40A ... Scribing wheel 41, 41a ... Base material 42 ... Pin hole 43, 43a ... Blade part 44, 44a ... Ridge line 45, 45a ... Inclined surface 46 ... groove 50 ... pin

Claims (9)

A scribing wheel for dividing a brittle material substrate,
A scribing wheel formed of a member made of polycrystalline CVD diamond.   The scribing wheel according to claim 1, wherein the polycrystalline CVD diamond has an average particle diameter of 60 to 80 μm.   The scribing wheel according to claim 1, wherein the polycrystalline CVD diamond has conductivity.   The scribing wheel according to any one of claims 1 to 3, wherein a groove is formed at a tip of a blade portion formed by cutting a circumferential portion of the disc member.   A holder unit comprising: the scribing wheel according to claim 1; and a holder that rotatably holds the scribing wheel.   A scribing apparatus comprising the holder unit according to claim 5. A scribing wheel manufacturing method for dividing a brittle material substrate,
Forming a disk-shaped member made of polycrystalline CVD diamond;
Forming a blade portion on a circumferential portion of the disk-shaped member;
A method of manufacturing a scribing wheel, comprising:   8. The method of manufacturing a scribing wheel according to claim 7, wherein the step of forming the disc-shaped member is a step of forming a disc-shaped member made of the polycrystalline CVD diamond having conductivity.   The method of manufacturing a scribing wheel according to claim 8, wherein the step of forming the blade portion includes electric discharge machining.