JP2014162055A - Resin sealing mold and resin sealing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin sealing mold capable of obtaining a resin sealing type semiconductor device having no resin filling defects even if the width and length of a lead frame are made high, and a resin sealing method.SOLUTION: In the resin sealing mold composed of: a resin feed part made of a plurality of vertically drivable pots 10 to be plunged and a cull 11 provided at the upper part of the pots; a runner 12 fed with a resin from the resin feed part; and a cavity 17 connected to the runner and fed with the resin from the runner, both the edges of the runner are provided with the pots.

Description

  The present invention relates to a resin sealing mold and a resin sealing method, and more particularly to a method for manufacturing a semiconductor device including a mold mold and a lead frame suitable for improving production efficiency and product quality.

  FIG. 9 shows a plan view of a conventional resin-sealed mold. A pot 10 for pressing and supplying mold resin is provided in the mold, runners 12 that are independent from each other are provided in a plurality of pots, and a plurality of cavities 17 are provided so as to branch from these runners. An electrical component to be molded, for example, a semiconductor chip 20 is disposed therein, and a molding resin is pressed and supplied from the pot 10 to the plurality of cavities 17. (For example, refer to Patent Document 1). Furthermore, as shown in FIG. 10, as a measure for equalizing the pressure in the mold flow path, a technique of providing a communication path 15 between pots is also disclosed. (For example, refer to Patent Document 2).

JP-A-62-122136 JP 2002-28947 A

  There is a tendency to arrange a large number of semiconductor chips in a lead frame for the purpose of reducing the cost of semiconductor devices in recent years. For this purpose, the width and length of the lead frame are increased to ensure the number of semiconductor chips to be taken per lead frame. However, when the runner 12 is extended in accordance with the width of the lead frame, various problems occur at the end.

  The problem when the lead frame is enlarged will be described with reference to FIGS. FIG. 7 shows the change in the content of the filler contained in the resin when resin filling is performed using two types of resins A and B having different filler contents, and the distance from the center of the kull is too much 40 mm. It can be seen that the filler content rapidly increases. In this case, the resin content increases due to an increase in the filler content, the marking depth at the time of laser marking becomes shallow, and a mark defect may occur. FIG. 8 shows the results of investigating the particle size (median diameter) of the filler. In the sealing resin A, the particle size tends to be somewhat smaller at a distance of 60 mm from the center of the cull. The sealing resin B tends to have a small particle diameter from a distance of about 20 mm, which may cause a defect that leads to poor resin filling.

  This invention makes it a subject to provide the resin sealing metal mold | die and the resin sealing method which can solve the said malfunction.

In order to solve the above problems, the following means were used.
First, a plurality of pots that can be driven up and down, and a resin supply part that is formed on the top of the pot, a runner that is supplied with resin from the resin supply part, and connected to the runner from the runner A resin-sealed mold comprising a cavity to which resin is supplied, wherein the resin-sealed mold has the resin supply portions at both ends of the runner.

In addition, a resin-sealed mold characterized in that a dummy cavity is provided connected to the center of the runner that is equidistant from the resin supply portions at both ends.
Further, a resin-sealing mold characterized in that a resin removal hole is provided in the center of the runner that is equidistant from the resin supply portions at both ends.

  In addition, a plurality of pots that can be driven up and down, a resin supply unit that includes a cull provided on the top of the pot, a runner that is supplied with resin from the resin supply unit, and a connection to the runner from the runner A resin sealing method using a resin sealing mold including a cavity to which resin is supplied, the step of preparing a resin sealing mold having the resin supply portions at both ends of the runner, and the resin sealing A step of setting a lead frame on which a semiconductor chip in a mold is mounted and a solid resin; a step of dissolving the solid resin and supplying the solid resin from the resin supply unit to the runner and the cavity; A resin sealing method comprising: a sealing step; and a step of taking out the resin-sealed lead frame from the resin sealing mold. It was.

Further, in the step of preparing the resin sealing mold, the runner has the resin supply portions at both ends of the runner, and is provided with a dummy cavity connected to the center of the runner that is equidistant from the resin supply portions at both ends. The resin sealing method is characterized in that a resin sealing mold is prepared.
Further, in the step of preparing the resin sealing mold, the runner has the resin supply portions at both ends of the runner, and a resin removal hole is provided at the center of the runner that is equidistant from the resin supply portions at both ends. A resin sealing method is characterized by preparing a resin sealing mold.

  By using the above means, it is possible to obtain a resin-encapsulated semiconductor device that does not have defective resin filling even when the width and length of the lead frame are increased.

It is sectional drawing and a top view which show the structure of the resin sealing metal mold | die which concerns on embodiment of this invention. It is a manufacturing process flowchart which shows the resin sealing method which concerns on embodiment of this invention. It is manufacturing process sectional drawing which shows the resin sealing method which concerns on embodiment of this invention. It is manufacturing process sectional drawing which shows the resin sealing method which concerns on embodiment of this invention following FIG. FIG. 5 is a manufacturing process cross-sectional view and a plan view illustrating the resin sealing method according to the embodiment of the present invention, following FIG. 4. FIG. 6 is a manufacturing process cross-sectional view and a plan view showing the resin sealing method according to the embodiment of the present invention, following FIG. 5. It is a figure which shows the tendency of filler content. It is a figure which shows a filler particle size distribution. It is a top view which shows the conventional resin sealing metal mold | die. It is a top view which shows the conventional resin sealing metal mold | die.

Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings.
FIG. 1 is a view showing a configuration of a resin-sealed mold according to an embodiment of the present invention. Fig.1 (a) is sectional drawing, FIG.1 (b) is a top view of the resin sealing metal mold | die which concerns on the 1st Embodiment of this invention. FIG. 1A is a cross-sectional view taken along the line AA in FIG. Moreover, FIG.1 (c) is a top view of the resin sealing metal mold | die which concerns on the 2nd Embodiment of this invention.

  As shown in FIG. 1A, the mold includes an upper mold 2 and a lower mold 3 which are paired up and down, and is mounted on a resin sealing device. The lower mold 3 includes a groove called a pot 10 and a plunger 19 that can drive the pot 10 in the vertical direction. In the figure, the pellet-shaped solid resin 1 is placed on the plunger 19 of the pot 10, and the lead frame 21 is placed between the pots 10. A concave cull 11 is provided so as to correspond to the pot 10 of the upper mold 2. A plurality of runners 12 and gates 13 having a predetermined space are formed between the upper mold 2 and the lower mold 3. The runner 12 communicates with the cal 11. At both ends of the runner 12, a plurality of pots 10, a plunger 19 that is driven in the vertical direction in the pot 10, and a plurality of resin supply portions that are formed on the top thereof are arranged. Here, the plurality of plungers 19 arranged at both ends of the runner 12 are driven up and down by the same drive system so that the same pressure is applied to the plurality of plungers 19.

  As shown in FIG. 1 (b), a plurality of runners 12 are provided and communicated between the two pots 10, and cavities 17 are branched from the individual runners 12. The cavity 17 houses a semiconductor chip 20 mounted on a lead frame and connected to a terminal by a wire. Incidentally, the resin removal hole 6 shown by a small dot near the center of the runner 12 is a minute hole with a pressure valve, and a small amount of resin is discharged when a predetermined pressure is reached. This configuration prevents resin filling failure and may be provided as necessary.

  The embodiment shown in FIG. 1C differs from FIG. 1B in that a dummy cavity 31 is used instead of the cavity 20 near the center of the runner 12. The melted resin that flows into the runner from the resin supply section including the pot 10 and the cal 11 disposed at both ends of the runner 12 merges in the vicinity of the center of the runner 12, but there is a possibility that a resin filling defect may occur at the junction. In addition, the occurrence of defects is prevented by arranging the dummy cavities 31.

  As described above, with the above configuration, the width and length of the lead frame increase, and even if the resin flow path of the runner or the like becomes long, it is possible to prevent a resin filling failure and one lead frame. More resin-encapsulated semiconductor devices can be obtained.

Next, a resin sealing method using the resin sealing mold 4 configured as described above will be described in detail with reference to FIGS.
FIG. 2 is a manufacturing process flowchart showing the resin sealing method according to the embodiment of the present invention. 3 to 6 are manufacturing process cross-sectional views illustrating the resin sealing method according to the embodiment of the present invention.
FIG. 2 shows a series of resin molding steps. First, a lead frame and a solid resin are set in a mold, and then the upper and lower molds are clamped, and then the resin is dissolved, and a resin-encapsulated semiconductor device is formed by pressing and holding for a predetermined time. Can do.

The resin molding process will be described in detail with reference to FIG.
First, as shown in FIG. 3, the lead frame 21 on which a semiconductor chip (not shown) is mounted is set in the cavity 17 of the lower mold 3, and the pellet-shaped solid resin 1 is placed in the pot 10 of the lower mold 3. set. Here, although the upper mold is not shown, it is disposed above the lower mold 3 with a predetermined distance.

  Next, as shown in FIG. 4, the lower mold 3 is raised, and the lower mold 3 is fitted to the upper mold 2 to perform mold clamping. At this time, the upper mold 2 and the lower mold 3 are in partial contact while securing the runner 12. The plunger 19 below the solid resin 1 is in a lowered position.

  Next, the plunger 19 in the pot portion 10 is pushed upward to inject the heat-dissolved resin 5 into the cal 11. At this time, the plurality of plungers 19 positioned at both ends of the runner 12 are simultaneously pushed up with the same pressure. As a result, the resin is evenly supplied from the pots 10 at both ends. FIG. 5 is a diagram in the middle of resin injection. By how the plunger 19 is pushed up and down, how the molten resin 5 enters the resin flow path 14 is adjusted. FIG.5 (b) is a top view and shows the case of the resin sealing metal mold | die which concerns on the 2nd Embodiment of this invention shown in FIG.1 (c). It is a figure at the time of the melted resin 5 not being injected up to the dummy cavity 31 near the center of the runner 12.

  Further, when the plunger 19 is pushed up and reaches a predetermined position, as shown in FIG. 6, the melted resin 5 that has flowed from the resin supply unit joins in the dummy cavity 31, and the filling is almost completed by reaching the corners. At this time, the lead frame 21 on which the semiconductor chip 20 is mounted is in a state of being resin-sealed with the molten resin 5. When pressurized and held for a predetermined time in this state, the dissolved resin 5 filled in each space such as the cavity 17, the dummy cavity 31, and the cal 11 is polymerized and cured. Thereafter, the lower die 3 is lowered downward to open the die, and the lower die 3 is pushed upward by the push pin of the lower die 3 to take out the lead frame sealed with the molded resin.

  As described above, according to the resin sealing method according to the present embodiment, the molten resin flowing in from both directions of the lead frame is merged in the dummy cavity 31 to obtain a resin-sealed semiconductor device with stable quality. Can do.

  Further, as described above, according to the resin sealing mold of the present invention and the resin sealing method using the same, the width and length of the lead frame are increased and the resin flow path of the runner and the like is increased. However, the substantial resin flow distance can be kept short, and more resin-encapsulated semiconductor devices can be obtained from one lead frame.

  In addition, this invention is not limited to embodiment mentioned above, The various deformation | transformation based on the technical idea of this invention is possible. For example, in this embodiment, the plunger is provided in the lower mold, but the plunger may be provided in the upper mold, or a through-gate mold structure may be used instead of the hammer gate system. You may apply to.

DESCRIPTION OF SYMBOLS 1 Solid resin 2 Upper die 3 Lower die 4 Resin sealing die 5 Molten resin 6 Resin hole 10 Pot 11 Cull 12 Runner 13 Gate 14 Resin flow path 15 Communication path 17 Cavity 19 Plunger 20 Semiconductor chip 21 Lead frame 31 Dummy cavity

Claims (6)

A plurality of pots having plungers that can be driven up and down, and a resin supply unit comprising a cull provided on top of the pots;
A runner to which resin is supplied from the resin supply unit;
A cavity connected to the runner and supplied with resin from the runner;
A resin-sealed mold comprising:
A resin-sealed mold having the resin supply portions at both ends of the runner.   The resin-sealed mold according to claim 1, wherein a dummy cavity is provided connected to the center of the runner that is equidistant from the resin supply portions at both ends.   The resin-sealed mold according to claim 1, wherein a resin removal hole is provided at the center of the runner that is equidistant from the resin supply portions at both ends. A plurality of pots that can be driven up and down, and a resin supply unit that is provided at the top of the pot, a runner that is supplied with resin from the resin supply unit, and a resin that is connected to the runner and receives resin from the runner A resin sealing method using a resin sealing mold comprising a cavity to be supplied,
Preparing a resin sealing mold having the resin supply part at both ends of the runner;
A step of setting a lead frame on which a semiconductor chip in the resin-sealed mold is mounted and a solid resin;
Dissolving the solid resin and supplying the runner and the cavity from the resin supply unit;
A step of resin-sealing the lead frame;
Removing the resin-encapsulated lead frame from the resin-encapsulated mold;
A resin sealing method comprising:   In the step of preparing the resin-sealed mold, the resin having the resin supply portion at both ends of the runner and connected to the center of the runner that is equidistant from the resin supply portions at both ends The resin sealing method according to claim 4, wherein a sealing mold is prepared.   In the step of preparing the resin sealing mold, a resin seal having the resin supply portions at both ends of the runner and having a resin removal hole at the center of the runner that is equidistant from the resin supply portions at both ends. The resin sealing method according to claim 4, wherein a stationary die is prepared.

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