JP2014154761A - Thermoelectric conversion module - Google Patents

Abstract

In a thermoelectric conversion module configured by alternately arranging a n-type thermoelectric material and a p-type thermoelectric material on a substrate in a plane, it is possible to generate power using various heat sources and generate a temperature difference in various objects. And
A thermoelectric conversion module (1) includes a thermoelectric conversion element (11) configured by alternately arranging n-type thermoelectric elements (12) and p-type thermoelectric elements (13) in a plane, and a plurality of protrusions (23, 24) are provided. It has the low temperature side outer layer member 21 and the high temperature side outer layer member 22 provided, and the convex portions 23 and 24 correspond to the low temperature connection portion 17 and the high temperature connection portion 16 between the n-type thermoelectric element 12 and the p-type thermoelectric element 13. Thermally connected to the location.
[Selection] Figure 1

Description

  The present invention relates to a thermoelectric conversion module in which n-type thermoelectric materials and p-type thermoelectric materials are alternately arranged in a plane.

  Conventionally, in a thermoelectric conversion module, an n-type thermoelectric material and a p-type thermoelectric material are alternately formed in a plane so as to be connected in series to form a thermoelectric conversion element. It is known that power is generated using a temperature gradient in the in-plane direction of the substrate, which is covered with a film-like substrate made of a resin such as (see, for example, Patent Document 1). In the configuration of Patent Document 1, since the flexibility of the substrate and the thin film thermoelectric conversion element makes it possible to deal with curved surfaces and the like, the thermoelectric conversion module can be installed in various places and a thin film process or a printing process is used. There is an advantage that it can be formed easily.

JP 2006-186255 A

However, in the conventional thermoelectric conversion module, a material such as copper having a high thermal conductivity is provided on a part of the surface of the resin substrate, and heat is transmitted to the thermoelectric conversion element through the high thermal conductivity portion. Therefore, most of the resin substrate is exposed to the outside. For this reason, there existed a subject that the heat source and cold heat source which can be utilized were limited. For example, the conventional thermoelectric conversion module can recover heat from a solid heat source that directly contacts only a portion having high thermal conductivity. However, when a liquid or gas is used as a heat source, the fluid heat source directly contacts the substrate, the substrate and the thermoelectric conversion element deteriorate due to the fluid passing through the resin substrate, or the heat source contacts the entire substrate. This makes it difficult to form a temperature gradient.
Moreover, in the said conventional thermoelectric conversion module, when using a thermoelectric conversion module as a temperature difference generator (Peltier device), it was difficult to generate a temperature difference with respect to a liquid or gas.

  The present invention has been made in view of the above-described circumstances, and uses various heat sources in a thermoelectric conversion module configured by alternately arranging n-type thermoelectric materials and p-type thermoelectric materials on a substrate in a plane. The purpose is to enable power generation and to generate temperature differences in various objects.

In order to achieve the above object, the present invention is a thermoelectric conversion module including a thermoelectric conversion element configured by alternately arranging n-type thermoelectric materials and p-type thermoelectric materials, and is provided with a plurality of convex portions. It has an outer layer member, The convex part is thermally connected to the position corresponding to the connection part of the n type thermoelectric material and the p type thermoelectric material, It is characterized by the above-mentioned.
According to the present invention, the thermoelectric conversion module has an outer layer member provided with a plurality of convex portions, and the convex portions are thermally located at positions corresponding to the connection portions between the n-type thermoelectric material and the p-type thermoelectric material. It is connected. Therefore, heat can be recovered from the heat source by the outer layer member, and this heat can be reliably transmitted to the thermoelectric conversion element via the convex portion, and a structure in which the heat source and the thermoelectric conversion element side are not in direct contact can be realized. For this reason, for example, even when a fluid is used as a heat source, it is possible to recover heat and generate electric power without directly contacting the thermoelectric conversion element side and the fluid. Further, when the thermoelectric conversion module receives radiant heat from a heat source, the radiant heat can be efficiently recovered by the outer layer member. Furthermore, since the radiant heat from the heat source to the thermoelectric conversion element side can be shielded by the outer layer member, heat transfer not through the outer layer member can be suppressed, and a large temperature gradient can be formed in the thermoelectric conversion element. Thereby, even if the heat source is a fluid, power can be generated without any problem, and heat can be efficiently recovered from various heat sources to generate power. Further, by passing a current through the thermoelectric material, it can be used as a temperature difference generator (Peltier element) applicable to various heat source shapes.

In the above configuration, the thermoelectric conversion element is sandwiched between a pair of substrates, the convex portion has higher thermal conductivity than the substrate, and the convex portion is connected to the connection portion on the surface of the substrate. It is good also as a structure thermally connected to the corresponding position.
In this case, the thermoelectric conversion element is sandwiched between the pair of substrates, the convex portion has higher thermal conductivity than the substrate, and the convex portion is thermally located at a position corresponding to the connecting portion on the surface of the substrate. Since they are connected, the contact of the fluid heat medium to the resin substrate and the thermoelectric conversion element can be prevented, and a large temperature gradient can be formed in the thermoelectric conversion element by the convex portion.
In the above configuration, the outer layer member and the thermoelectric conversion element may be insulated from each other by the convex portion.
In this case, since the outer layer member and the thermoelectric conversion element can be insulated by the convex portion, a resin sheet or the like for insulating the thermoelectric conversion element is not necessary, and the structure can be simplified.

In the above configuration, a pair of the outer layer members are provided on both sides of the thermoelectric conversion element so as to constitute the outermost layer, one outer layer member is a high temperature side outer layer member, and the other outer layer member is a low temperature side outer layer member. It is good also as a structure which is formed and the said convex part of the said high temperature side outer layer member and the said convex part of the said low temperature side outer layer member are thermally connected to the position corresponding to the said different connection part, respectively.
In this case, a pair of outer layer members are provided on both sides of the thermoelectric conversion element so as to constitute the outermost layer, one outer layer member forms a high temperature side outer layer member, and the other outer layer member forms a low temperature side outer layer member. Since the convex portion of the outer layer member and the convex portion of the low temperature side outer layer member are thermally connected to positions corresponding to different connecting portions, a larger temperature gradient can be formed in the thermoelectric conversion element.

The said structure WHEREIN: The said convex part of the said high temperature side outer layer member and the said convex part of the said low temperature side outer layer member are good also as a structure which has respectively different thermal conductivity.
In this case, in addition to the above-described effects, there is an advantage that a design allowable range such as a module thickness can be widened by using different thermal conductive materials.
Further, in the above configuration, a space portion may be formed between the plurality of convex portions.
In this case, since the heat propagated from the external heat source between the plurality of convex portions can be insulated by the space portion, a large temperature gradient can be formed by the thermoelectric conversion element.

The said structure WHEREIN: It is good also as a structure which provides the material whose heat conductivity is lower than the said convex part in the said space part.
In this case, since a material having lower thermal conductivity than the convex portion is provided in the space portion, heat can be prevented from being transmitted from the outer layer member to the thermoelectric conversion element on the space portion side, and a large temperature gradient is generated by the thermoelectric conversion element. Can be formed.
Moreover, the said structure WHEREIN: The said board | substrate is good also as a structure which is a sheet | seat provided with insulation.
In this case, the flexibility and insulation of the thermoelectric conversion module can be ensured by using the sheet as the substrate. Further, since the outer layer member can prevent the heat source from coming into contact with the substrate, the problem of durability when the sheet is used for the substrate can be solved.
Further, the convex portion may be formed separately from the outer layer member.
In this case, in the above configuration, the exterior member and the convex portion may be configured using different materials. By using an insulating material between the convex portions and the convex portions, there is an advantage that the substrate can be eliminated.
In this case, since the convex portion is a separate body, the thermal conductivity of the convex portion can be freely set according to the required characteristics of the thermoelectric conversion module.
The outer layer member may have a black surface.
In this case, the outer layer member can recover the radiant heat from the heat medium more efficiently and generate electric power.

  According to the present invention, in a thermoelectric conversion module configured by alternately arranging a n-type thermoelectric material and a p-type thermoelectric material on a substrate in a plane, power generation efficiently recovering heat from various heat sources, and temperature difference Generation can take place.

It is a figure which shows the structure of the thermoelectric conversion module which concerns on the 1st Embodiment of this invention. It is sectional drawing of a thermoelectric conversion module. It is sectional drawing which shows the modification of 1st Embodiment. It is sectional drawing of the thermoelectric conversion module in 2nd Embodiment. It is sectional drawing of the thermoelectric conversion module in 3rd Embodiment. It is sectional drawing of the thermoelectric conversion module in 4th Embodiment. It is sectional drawing which shows the reference example of a thermoelectric conversion module.

Embodiments of the present invention will be described below with reference to the drawings.
[First Embodiment]
FIG. 1 is a perspective view showing the structure of the thermoelectric conversion module according to the first embodiment of the present invention, and shows a partially broken section for the sake of convenience of understanding.
As shown in FIG. 1, the thermoelectric conversion module 1 is a sheet-like flexible power generation module in which thermoelectric conversion elements 11 are arranged in a plane on a flexible substrate portion 10, and the temperature generated in the in-plane direction of the flexible substrate portion 10. Power is generated by the difference.

  The flexible substrate unit 10 includes a pair of a low temperature side substrate 14 and a high temperature side substrate 15 that respectively cover the thermoelectric conversion elements 11 from both sides. The low temperature side substrate 14 covers one surface of the thermoelectric conversion element 11, the high temperature side substrate 15 covers the other surface, and the thermoelectric conversion element 11 is sandwiched between the low temperature side substrate 14 and the high temperature side substrate 15. . The low temperature side substrate 14 and the high temperature side substrate 15 are made of an insulating and flexible film (sheet). For example, materials for the low temperature side substrate 14 and the high temperature side substrate 15 are polyimide, kapton, polycarbonate, polyethylene, polyethylene terephthalate (PET), polysulfone (PSF), polyethersulfone (PES), and polyether ethyl ketone (PEEK). Polyphenylene sulfite (PPS), polysilazane, flexible glass and the like can be used. An appropriate material may be selected from these materials depending on the operating temperature of the thermoelectric conversion element 11, the operating environment, and the like. Here, a polyimide film is used.

The thermoelectric conversion element 11 is formed by alternately connecting a plurality of n-type thermoelectric elements 12 (n-type thermoelectric material) and p-type thermoelectric elements 13 (p-type thermoelectric material) in series. Specifically, the thermoelectric conversion element 11 is formed by alternately forming strip-shaped n-type thermoelectric elements 12 and p-type thermoelectric elements 13 on the low temperature side substrate 14 in a straight line. The film width, length, and thickness of the n-type thermoelectric element 12 and the p-type thermoelectric element 13 are appropriately selected depending on material characteristics and the like. In the illustrated embodiment, they are substantially the same. The arrangement pattern of the n-type thermoelectric elements 12 and the p-type thermoelectric elements 13 includes a plurality of folded portions (in order that the n-type thermoelectric elements 12 and the p-type thermoelectric elements 13 can be arranged at high density in the plane of the flexible substrate portion 10 ( (Not shown).
Electrodes of the thermoelectric conversion element 11 are formed at both ends of the arrangement of the n-type thermoelectric element 12 and the p-type thermoelectric element 13. One electrode (not shown) is connected to the end of the n-type thermoelectric element 12, and the other electrode (not shown) is connected to the end of the p-type thermoelectric element 13.

For example, chromel is used as the material of the n-type thermoelectric element 12, and constantan is used as the material of the p-type thermoelectric element 13.
Other thermoelectric materials include, for example, BiTe materials, PbTe materials, Si-Ge materials, silicide materials, skutterudite materials, transition metal oxide materials, zinc antimony materials, boron compounds, clathrate Compounds, cluster solids, zinc oxide-based materials, carbon nanotubes, and the like can be used. Examples of BiTe-based materials include BiTe, SbTe, BiSe, and these compounds. Examples of PbTe-based materials include PbTe, SnTe, AgSbTe, GeTe, and compounds thereof. Examples of the Si—Ge material include Si, Ge, and SiGe. Examples of the silicide material include FeSi, MnSi, CrSi and the like. Examples of the skutterudite-based material include compounds represented by MX ₃ and RM ₄ X ₁₂ . Here, M is Co, Rh, or Ir, X is As, P, or Sb, and R represents La, Yb, or Ce. Examples of transition metal oxide materials include NaCoO, CaCoO, ZnInO, SrTiO, BiSrCoO, PbSrCoO, CaBiCoO, BaBiCoO, and the like. An example of the zinc antimony material is AnSb. Examples of the boron compound include CeB, BaB, SrB, CaB, MgB, VB, NiB, CuB, and LiB. Examples of clathrate compounds include BaGaAlSi and BaGaAlGe. Examples of cluster solids include B clusters, Si clusters, C clusters, AlRe, AlReSi, and the like. An example of the zinc oxide-based material is ZnO.

After the thermoelectric conversion element 11 is formed, the surface of the thermoelectric conversion element 11 on the side opposite to the low temperature side substrate 14 is coated with the high temperature side substrate 15, so that a pair of insulating sheets (low temperature side substrate 14, high temperature side substrate 15 is formed). A module in which a planar thermoelectric conversion element 11 is sandwiched in a flexible substrate portion 10 made of Here, the thermoelectric conversion element 11 is formed on the low temperature side substrate 14. However, the present invention is not limited to this, and the thermoelectric conversion element 11 is formed on the high temperature side substrate 15 and then the low temperature side substrate 14 is thermoelectrically converted. The element 11 may be covered. Moreover, you may provide the thermoelectric conversion element 11 by methods other than film-forming.
In the flexible substrate part 10, the connection parts of the n-type thermoelectric element 12 and the p-type thermoelectric element 13 are arranged at a substantially equal pitch, and by forming a temperature difference between each pair of adjacent connection parts, the thermoelectric Power generation is possible. That is, from the viewpoint of thermoelectric power generation, the thermoelectric conversion element 11 disposed in the flexible substrate portion 10 has a high temperature connection portion 16 to be heated and a low temperature connection portion 17 to be lowered at a substantially equal pitch. Are formed alternately.

A pair of low temperature connection portions 17 are located on both sides of one high temperature connection portion 16. In the p-type thermoelectric element 13, a current flows from the high temperature connection portion 16 to the low temperature connection portion 17. Then, a current flows from the low temperature connection portion 17 to the high temperature connection portion 16, and as a whole, the current flows from the right side to the left side in FIG.
In the first embodiment, the n-type thermoelectric element 12 and the p-type thermoelectric element 13 are directly joined to each other at the low-temperature connection portion 17 and the high-temperature connection portion 16, but the low-temperature connection portion 17 and / or the high-temperature connection portion. A conductive material such as copper may be provided on 16 and the n-type thermoelectric element 12 and the p-type thermoelectric element 13 may be connected via this conductive material.

FIG. 2 is a cross-sectional view of the thermoelectric conversion module 1.
As shown in FIGS. 1 and 2, the thermoelectric conversion module 1 includes an outer layer member 20 that covers both surfaces of the flexible substrate unit 10. The outer layer member 20 includes a low temperature side outer layer member 21 that covers the low temperature side substrate 14 and a high temperature side outer layer member 22 that covers the high temperature connection portion 16. The thermoelectric conversion module 1 generates a temperature difference in the in-plane direction in the thermoelectric conversion element 11 by generating a temperature difference between the low temperature side outer layer member 21 and the high temperature side outer layer member 22, and generates power. Therefore, a cold heat source is disposed on the low temperature side outer layer member 21 side, and a heat source is disposed on the high temperature side outer layer member 22 side. These heat sources and cold heat sources may themselves generate heat and cold. However, the heat medium that propagates the cold from the cold heat source and the heat medium that propagates the heat from the heat source are respectively connected to the low temperature side. You may arrange | position to the outer layer member 21 side and the high temperature side outer layer member 22 side. That is, electric power can be generated by bringing the low temperature side outer layer member 21 and the high temperature side outer layer member 22 into contact with a heat medium. These heat media may be solid or fluid. For example, the surface of a pipe through which a high-temperature or low-temperature fluid flows can be used as a heat medium, and water, air, or the like can be used as a heat medium. As a matter of course, it is sufficient that the heat medium on the low temperature side outer layer member 21 side and the heat medium on the high temperature side outer layer member 22 side have a relative temperature difference, and the absolute temperature of each heat medium is It is not limited. In the present embodiment, as an example, a case will be described in which a gas or liquid heat medium is in contact with the low temperature side outer layer member 21 and hot water is in contact with the high temperature side outer layer member 22 as a heat medium.

The low temperature side outer layer member 21 has a plurality of protrusions 23 protruding toward the low temperature side substrate 14 on the inner surface side. The outer surface 21a of the low temperature side outer layer member 21 is a heat medium contact surface that contacts an external heat medium.
Each convex portion 23 is formed to transmit heat transferred from the external heat medium to the outer surface 21 a to the low temperature connection portion 17, and at a pitch substantially equal to the pitch of the arrangement of the low temperature connection portions 17, the low temperature connection It is formed at a position corresponding to the portion 17 and arranged in a straight line.
The tip of the convex portion 23 is a connection surface 23a that is in close contact with the low temperature side outer layer member 21, and the connection surface 23a is a flat surface.

The high temperature side outer layer member 22 has a plurality of convex portions 24 protruding toward the high temperature side substrate 15 on the inner surface side. The outer surface 22a of the high temperature side outer layer member 22 is a heat medium contact surface that contacts an external heat medium. The outer surface 22a of the high temperature side outer layer member 22 is provided with a heat medium having a temperature higher than that of the heat medium on the low temperature side outer layer member 21 side. Each convex portion 24 transmits the heat transferred from the hot water to the outer surface 22 a to the high temperature connection portion 16. Each convex part 24 is formed at a position corresponding to the high temperature connection part 16 at a pitch substantially equal to the pitch of the arrangement of the high temperature connection parts 16, and is arranged in a straight line.
The tip of the convex portion 24 is a flat connection surface 24 a that is in close contact with or in contact with the high temperature connection portion 16.

The low temperature side outer layer member 21 and the high temperature side outer layer member 22 are thin plate-shaped or foil-shaped members formed using a material having higher thermal conductivity than the resin-made low temperature side substrate 14 and high temperature side substrate 15. In this embodiment, the example which comprised the low temperature side outer layer member 21 and the high temperature side outer layer member 22 as copper foil is shown. The low temperature side outer layer member 21 and the high temperature side outer layer member 22 can also be configured using, for example, a metal other than copper, such as aluminum, or a metal compound thereof, ceramics, high thermal conductive resin, or the like. The convex portion 23 and each convex portion 24 are formed integrally with the low temperature side outer layer member 21 and the high temperature side outer layer member 22 by, for example, etching. In the first embodiment, the low temperature side outer layer member 21 and the convex portion 23 are made of the same material, and the high temperature side outer layer member 22 and the convex portion 24 are made of the same material.
Here, as an example, the plate thickness of the low temperature side outer layer member 21 and the high temperature side outer layer member 22 excluding the convex portions 23 and 24 is 35 μm, the height of the convex portions 23 and 24 is 35 μm, and the convex portions 23 and 24. The length in the arrangement direction is 200 μm. As an example, the n-type thermoelectric element 12 and the p-type thermoelectric element 13 have a thickness of 2 μm and a length of 200 μm, respectively, and the low-temperature side substrate 14 and the high-temperature side substrate 15 have a thickness of 25 μm.

The low temperature side outer layer member 21 is covered with the low temperature side substrate 14 so that each convex portion 23 overlaps each low temperature connection portion 17. Between each convex part 23, it is a recessed part, and when the low temperature side outer layer member 21 is coat | covered, the space part 25 will be formed between each convex part 23 inside the low temperature side outer layer member 21. FIG. Each space portion 25 is disposed at a position overlapping each high temperature connection portion 16.
The cold heat transmitted from the low-temperature-side heat medium to the outer surface 21a of the low-temperature-side outer layer member 21 is transmitted to the low-temperature connection portion 17 via the convex portion 23 and the low-temperature substrate 14 directly below the connection surface 23a. On the other hand, the cold of the low temperature side outer layer member 21 hardly propagates through the space 25. Therefore, cooling of the high temperature connection part 16 by the low temperature side heat medium is suppressed.

The high temperature side outer layer member 22 is covered with the high temperature side substrate 15 such that each convex portion 24 overlaps each high temperature connection portion 16. Between each convex part 24, it is a recessed part, and when the high temperature side outer layer member 22 is coat | covered, the space part 26 will be formed between each convex part 24 inside the high temperature side outer layer member 22. FIG. Each space part 26 is arranged at a position overlapping each low temperature connection part 17.
The heat of warm water transmitted to the outer surface 22a of the high temperature side outer layer member 22 is transmitted to the high temperature connection portion 16 via the high temperature side outer layer member 22 directly below the convex portion 24 and the connection surface 24a. On the other hand, the heat of the high temperature side outer layer member 22 hardly propagates through the space portion 26. Therefore, it is suppressed that the low temperature connection part 17 is heated by the heat of the hot water which is a heat medium.

  Thus, since the convex portions 23 and 24 and the space portions 25 and 26 are provided on the low temperature side outer layer member 21 and the high temperature side outer layer member 22, respectively, only the low temperature connection portion 17 is connected to the low temperature side without cooling the high temperature connection portion 16 as much as possible. It is possible to cool only the high temperature connection portion 16 with the high temperature side heat medium (warm water) without heating the low temperature connection portion 17 as much as possible. For this reason, a big temperature gradient can be formed in the surface direction of the thermoelectric conversion element 11, and it can generate electric power efficiently.

  In the first embodiment, the flexible substrate portion 10 is covered with the high temperature side outer layer member 22 and the low temperature side outer layer member 21, and the thermoelectric conversion element 11 is formed via the high temperature side outer layer member 22 and the low temperature side outer layer member 21. A structure for transferring heat was adopted. For this reason, since the heat medium does not directly contact the low temperature side substrate 14 or the high temperature side substrate 15, it is possible to prevent the heat medium from affecting the durability of the high temperature side substrate 15 and the low temperature side substrate 14. For example, when the high temperature side substrate 15 is composed of a polyimide film, it is relatively susceptible to the thermoelectric material due to moisture transmitted through the film, but the heat medium is configured not to contact the high temperature side substrate 15. Heat can be directly recovered from water-based fluids such as hot water, and power can be generated efficiently. The same applies to the low temperature side substrate 14. As described above, since the environment resistance is improved by covering the flexible substrate portion 10 with the high temperature side outer layer member 22 and the low temperature side outer layer member 21, the thermoelectric conversion module 1 can be installed at various installation locations to generate electric power.

Further, the entire surface of the high temperature side outer layer member 22 and the low temperature side outer layer member 21 can contact the heat medium. For this reason, for example, as in the configuration described in Patent Document 1, heat can be efficiently recovered as compared with a configuration in which a material having high thermal conductivity is disposed only on a part of the surface of the substrate. Therefore, a high temperature gradient can be formed in the thermoelectric conversion element 11, and the power generation efficiency is good. Furthermore, by coloring the outer surface 22a of the high temperature side outer layer member 22 in black, the radiant heat of the outer heat medium can be recovered more effectively.
Further, since the flexible substrate portion 10 is covered with the high temperature side outer layer member 22 and the low temperature side outer layer member 21, the radiant heat of the heat medium outside the outer layer member 20 can be shielded by the high temperature side outer layer member 22 and the low temperature side outer layer member 21. It can prevent that the temperature gradient of the thermoelectric conversion element 11 falls by radiant heat. For this reason, power generation efficiency is good.
Moreover, the rigidity of the thermoelectric conversion module 1 can be ensured by the high temperature side outer layer member 22 and the low temperature side outer layer member 21, and the thickness of the low temperature side substrate 14 and the high temperature side substrate 15 can be reduced accordingly. Loss of heat transfer generated in the high temperature side substrate 15 can be reduced. For this reason, power generation efficiency is good.

  As described above, according to the first embodiment to which the present invention is applied, the thermoelectric conversion module 1 has an outer layer member provided with a plurality of convex portions, and the convex portions are formed of an n-type thermoelectric material. It is thermally connected to a position corresponding to the connection portion with the p-type thermoelectric material. For this reason, the heat of the external heat medium can be recovered by the low temperature side outer layer member 21 and the high temperature side outer layer member 22, and this heat can be transferred to the thermoelectric conversion element 11 via the convex portions 23 and 24. The structure which the board | substrate 14, the high temperature side board | substrate 15, and the thermoelectric conversion element 11 do not contact directly is implement | achieved. For this reason, even if it is a case where fluid is used as a heat carrier (heat source) like the above-mentioned example, it can collect heat and generate electricity, without making a heat medium and the thermoelectric conversion element 11 side contact directly. Moreover, when the thermoelectric conversion module 1 receives radiant heat from a heat medium, radiant heat is collect | recovered by the low temperature side outer layer member 21 or the high temperature side outer layer member 22, and the radiant heat to the thermoelectric conversion element 11 side is shielded. For this reason, the heat transfer which does not go through the low temperature side outer layer member 21 and the high temperature side outer layer member 22 can be suppressed, and a large temperature gradient can be formed in the thermoelectric conversion element 11. Therefore, even if the heat medium is fluid, power can be generated without any problem, and heat can be efficiently recovered from various heat sources to generate power.

  Further, the thermoelectric conversion element 11 is sandwiched between a pair of the low temperature side substrate 14 and the high temperature side substrate 15, and the convex portions 23 and 24 have higher thermal conductivity than the low temperature side substrate 14 and the high temperature side substrate 15, and Since the convex portions 23 and 24 are thermally connected to positions corresponding to the low temperature connection portion 17 and the high temperature connection portion 16 on the surfaces of the low temperature side substrate 14 and the high temperature side substrate 15, the resin low temperature side substrate 14 and The contact of the fluid heat medium to the high temperature side substrate 15 and the thermoelectric conversion element 11 can be prevented, and a large temperature gradient can be formed in the thermoelectric conversion element by the convex portions 23 and 24.

The low temperature side outer layer member 21 and the high temperature side outer layer member 22 are provided as a pair on both sides of the thermoelectric conversion element 11 so as to constitute the outermost layer of the thermoelectric conversion module 1, and the thermoelectric conversion element 11 is a pair of low temperature side outer layer members. 21 and the high temperature side outer layer member 22. The convex portion 24 of the high temperature side outer layer member 22 and the convex portion 23 of the low temperature side outer layer member 21 are thermally connected to different positions corresponding to the high temperature connection portion 16 and the low temperature connection portion 17, respectively. Contact of the heat medium to the low temperature side substrate 14 and the high temperature side substrate 15 can be prevented, and a large temperature gradient can be formed in the thermoelectric conversion element 11.
Space portions 25 and 26 are formed between the plurality of convex portions 23 and 24, and heat from the heat medium outside the low temperature side outer layer member 21 and the high temperature side outer layer member 22 is transmitted by the space portions 25 and 26. Since heat insulation can be performed, a large temperature gradient can be formed in the thermoelectric conversion element 11.

Further, the low temperature side outer layer member 21 and the high temperature side outer layer member 22 can prevent the fluid heat medium from contacting the low temperature side substrate 14 and the high temperature side substrate 15, and the low temperature side substrate 14 and the high temperature side substrate made of resin such as polyimide. Since 15 can be used for the substrate, the flexibility and insulation of the thermoelectric conversion module 1 can be ensured.
Further, the convex portions 23 and 24 are integrally formed with the low temperature side outer layer member 21 and the high temperature side outer layer member 22, and a joint portion between the convex portions 23 and 24 and the low temperature side outer layer member 21 and the high temperature side outer layer member 22 is formed. Since the heat transfer loss can be suppressed without being present, a large temperature gradient can be formed in the thermoelectric conversion element 11.
Further, by coloring the outer surface 22a of the high temperature side outer layer member 22 in black, the radiant heat of the outer heat medium can be more effectively recovered to heat the high temperature connection portion 16, and the power generation efficiency can be improved.

In addition, the said 1st Embodiment shows the one aspect | mode which applied this invention, Comprising: This invention is not limited to the said embodiment.
In the first embodiment, the low temperature side substrate 14 and the high temperature side substrate 15 are both covered with the low temperature side outer layer member 21 and the high temperature side outer layer member 22, respectively. The present invention is not limited to this, and it is sufficient that at least one of the low temperature side substrate 14 and the high temperature side substrate 15 is covered with the outer layer member. For example, only the high temperature side outer layer member 22 may be provided without providing the low temperature side outer layer member 21, and the low temperature side substrate 14 may be provided with only the convex portion disposed so as to overlap the low temperature connection portion 17.
In the first embodiment, the convex portions 23 and 24 are described as being integrally formed on the low temperature side outer layer member 21 and the high temperature side outer layer member 22 by etching, but the convex portions 23 and 24 are described. May be formed by other manufacturing methods. For example, the low temperature side outer layer member 21 integrally provided with the convex portions 23 and the high temperature side outer layer member 22 integrally provided with the convex portions 24 are formed by rolling or pressing one outer layer member. Also good.

Further, in the first embodiment, the space portions 25 and 26 are filled with a heat insulating material such as a resin having a lower thermal conductivity than the convex portions 23 and 24 to insulate the heat of the heat medium, and the thermoelectric conversion element. 11 may be configured to generate a large temperature gradient.
Furthermore, you may comprise the outer-layer members 21 and 22 and the convex parts 23 and 24 using a different material. For example, by forming the convex portions 23 and 24 using an insulating high thermal conductive resin and filling the space portions 25 and 26 with an insulating heat insulating material, it is possible to configure without the flexible substrate portion 10. . In this case, in addition to the effects according to the above-described embodiment, it is possible to efficiently transmit the heat of the outer layer portion to the thermoelectric conversion element 11, so that a large temperature gradient can be generated in the thermoelectric conversion element 11.
Alternatively, a metal coating layer thinner than the convex portions 23 and 24 may be formed on the surfaces of the low temperature side substrate 14 and the high temperature side substrate 15 in the space portions 25 and 26 by vapor deposition or the like. By providing this metal coating layer, the influence of radiant heat propagating to the low temperature connection portion 17 and the high temperature connection portion 16 through the space portions 25 and 26 can be further suppressed. Thereby, a larger temperature gradient can be generated in the thermoelectric conversion element 11.
In the first embodiment, the low temperature side outer layer member 21 and the high temperature side outer layer member 22 may be made of materials having different thermal conductivities. That is, the low temperature side outer layer member 21 including the convex portion 23 and the high temperature side outer layer member 22 including the convex portion 24 may have different thermal conductivities. In this case, in addition to the effects according to the above-described embodiment, there is an advantage that the material of the convex portion can be selected in accordance with the mechanical strength and the thermal expansion coefficient required for the element. Specific examples of the low temperature side outer layer member 21 and the high temperature side outer layer member 22 in this case include a configuration using copper and aluminum.

In the first embodiment, the space 25 between the convex portions 23 and 23 and the space 26 between the convex portions 24 and 24 are both rectangular rectangular. The cross-sectional shapes of the spaces 25 and 26 do not have to be rectangular. For example, the corners of the spaces 25 and 26 may be curved surfaces. Further, as shown in FIG. 3, the entire bottom surfaces of the spaces 25 and 26 may be curved (so-called R-shaped) bottom surface portions 28. In the case of such a configuration, it can be expected that the strength of the convex portions 23 and 24 is further increased.
The thermoelectric conversion module 1 can also be used as a temperature difference generator (Peltier element) by passing a current through the thermoelectric conversion element 11. Since the thermoelectric conversion module 1 of the first embodiment includes the outer layer member 20 and has high environmental resistance, a temperature difference can be formed in various objects including liquid and gas. Further, the heat medium can be brought into contact with the entire surface of the outer layer member 20, and a temperature difference can be formed efficiently. Since the thermoelectric conversion module 1 is flexible, it can be installed on various objects. For example, by providing the thermoelectric conversion module 1 in an automobile passenger seat, the passenger seat can be heated and cooled.

[Second Embodiment]
Hereinafter, a second embodiment to which the present invention is applied will be described with reference to FIG. In the second embodiment, parts that are configured in the same manner as in the first embodiment are given the same reference numerals, and descriptions thereof are omitted.
In the first embodiment, the convex portions 23 and 24 have been described as being integrally formed on the low temperature side outer layer member 21 and the high temperature side outer layer member 22 by etching, but the second embodiment is The point from which the convex parts 123 and 124 are provided separately differs from the said 1st Embodiment.

FIG. 4 is a cross-sectional view of the thermoelectric conversion module 101 according to the second embodiment.
As shown in FIG. 4, the thermoelectric conversion module 101 includes a thermoelectric conversion element 11, a flexible substrate unit 10, and an outer layer member 120 that covers both surfaces of the flexible substrate unit 10.
The outer layer member 120 includes a low temperature side outer layer member 121 that covers the low temperature side substrate 14 and a high temperature side outer layer member 122 that covers the high temperature connection portion 16.
The low temperature side outer layer member 121 includes a flat foil portion 121 a and a plurality of convex portions 123 provided on the foil portion 121 a corresponding to each low temperature connection portion 17.
The high temperature side outer layer member 122 includes a flat foil portion 122 a and a plurality of convex portions 124 provided on the foil portion 122 a corresponding to the high temperature connection portions 16.
The foil portions 121a and 122a are thin plate-like or foil-like members formed using a material having a higher thermal conductivity than the resin-made low-temperature side substrate 14 and the high-temperature side substrate 15. Examples of the material used for the foil portions 121a and 122a include other metals or metal compounds such as copper and aluminum foil, ceramics, and high thermal conductive resins. The convex portions 123 and 124 are thin plate-like or foil-like members formed using a material having a higher thermal conductivity than the resin-made flexible substrate portion 10. Examples of the material used for the convex portions 123 and 124 include other metals or metal compounds such as copper and aluminum foil, ceramics, and high thermal conductive resin.

The convex portions 123 and 124 are provided on the low temperature side substrate 14 and the high temperature side substrate 15 separately from the foil portions 121a and 122a, respectively. For example, the convex portions 123 and 124 are formed in a convex shape by bonding a metal foil such as a copper foil to each of the low temperature side substrate 14 and the high temperature side substrate 15 and etching the metal foil. The foil portions 121a and 122a are bonded to the convex portions 123 and 124 thus formed, and bonded by brazing, diffusion bonding using metal particles, or the like, so that the low temperature side outer layer member 121 and The high temperature side outer layer member 122 can be realized.
In the second embodiment, since the convex portions 123 and 124 are separate from the foil portions 121a and 122a, the thermal conductivity of the convex portions 123 and 124 can be freely set according to the required characteristics of the thermoelectric conversion module 101. it can. That is, the convex portions 123 and 124 can be made of a material different from that of the foil portions 121a and 122a, respectively.
Furthermore, the convex part 123 and the convex part 124 can be made of materials having different thermal conductivities. Specifically, there is an example in which aluminum is used for the low temperature side convex portion 123 and copper is used for the high temperature side convex portion 124. In this case, in addition to the effects according to the above-described embodiment, there is an advantage that the amount of elongation accompanying thermal expansion at the high temperature side convex portion and the low temperature side convex portion can be made closer.

In addition, the said 2nd Embodiment shows the one aspect | mode which applied this invention, Comprising: This invention is not limited to the said embodiment.
In the second embodiment, an example in which convex portions 123 and 124 are formed on the low temperature side substrate 14 and the high temperature side substrate 15 by etching and the foil portions 121a and 122a are bonded to the convex portions 123 and 124 will be described. However, the present invention is not limited to this. For example, the convex portions 123 and 124 may be formed on the foil portions 121a and 122a by a processing method such as plating, thermal spraying, and vapor deposition, and the convex portions may be in close contact with the low temperature side substrate 14 and the high temperature side substrate 15. . Alternatively, the convex portions 123 and 124 are formed on the low temperature side substrate 14 and the high temperature side substrate 15, and then insert casting is performed using a material in which a high thermal conductive resin or the like is melted, so that the convex portions 123 and 124 are integrated. May be.
The thermoelectric conversion module 101 can also be used as a temperature difference generating device (Peltier element) by passing a current through the thermoelectric conversion element 11.

[Third Embodiment]
Hereinafter, a third embodiment to which the present invention is applied will be described with reference to FIG. In the third embodiment, parts that are configured in the same manner as in the first embodiment are given the same reference numerals, and descriptions thereof are omitted.
In the second embodiment, the convex portions 123 and 124 are bonded to the flat surfaces of the inner surfaces of the foil portions 121a and 122a. However, in the third embodiment, the convex portions 223 and 224 are bonded to each other. The second embodiment is different from the second embodiment in that it engages with concave portions 221b and 222b formed in the foil portions 221a and 222a.

FIG. 5 is a cross-sectional view of the thermoelectric conversion module 201 according to the third embodiment.
As shown in FIG. 5, the thermoelectric conversion module 201 includes the thermoelectric conversion element 11, the flexible substrate unit 10, and an outer layer member 220 that covers both surfaces of the flexible substrate unit 10.
The outer layer member 220 includes a low temperature side outer layer member 221 that covers the low temperature side substrate 14 and a high temperature side outer layer member 222 that covers the high temperature connection portion 16.
The low temperature side outer layer member 221 includes a flat foil portion 221 a and a plurality of convex portions 223 provided on the foil portion 221 a corresponding to each low temperature connection portion 17.
The high temperature side outer layer member 222 has a flat foil portion 222 a and a plurality of convex portions 224 provided on the foil portion 222 a corresponding to each high temperature connection portion 16.
The foil portions 221 a and 222 a and the convex portions 223 and 224 are formed using a material having a higher thermal conductivity than the resin-made low-temperature side substrate 14 and the high-temperature side substrate 15. Specific examples of the material include other metals or metal compounds such as copper and aluminum foil, ceramics, and high thermal conductive resins. In the present embodiment, an example in which copper foil is used for the foil portions 221a and 222a and copper is used for the convex portions 223 and 224 is shown.

The convex portions 223 and 224 can be formed on the surfaces of the low temperature side substrate 14 and the high temperature side substrate 15 by the same method as the convex portions 123 and 124 described in the second embodiment.
On the other hand, a concave portion 221b is formed on the surface of the foil portion 221a on the low temperature side substrate 14 side. When the foil part 221a is joined to the convex part 223, the convex part 223 fits into the concave part 221b. Similarly, a concave portion 222b is formed on the surface of the foil portion 222a on the high temperature side substrate 15, and when the foil portion 222a is joined and integrated with the convex portion 224, the convex portion 224 fits into the concave portion 222b. Only a part of the tip of the convex portions 223 and 224 enters the pressing portions 221b and 222b, respectively. Since the other portions separate the foil portions 221a and 222a from the flexible substrate portion 10, the spaces 25 and 26 are secured.
Examples of the method for joining the convex portions 223 and 224 and the foil portions 221a and 222a include brazing, diffusion bonding using metal particles, and adhesion.
Thus, by engaging the convex portions 223 and 224 with the concave portions 221b and 222b, the convex portions 223 and 224 can be more firmly joined to the foil portions 221a and 222a.

The third embodiment shows one aspect to which the present invention is applied, and the present invention is not limited to the above-described embodiment.
For example, in the third embodiment, the convex portions 223 and 224 provided in advance on the low temperature side substrate 14 and the high temperature side substrate 15 are joined to the foil portions 221a and 222a in which the concave portions 221b and 222b are formed. Explained. The present invention is not limited to this. For example, the foil portions 221a and 222a may be formed and integrated with the convex portions 223 and 224 by insert casting using a high thermal conductive resin. In this case, it is not necessary to form the recesses 221b and 222b in advance.
The thermoelectric conversion module 201 can also be used as a temperature difference generator (Peltier element) by passing a current through the thermoelectric conversion element 11.

[Fourth Embodiment]
The fourth embodiment to which the present invention is applied will be described below with reference to FIG. In the fourth embodiment, parts that are configured in the same manner as in the first embodiment are given the same reference numerals, and descriptions thereof are omitted.
In the first embodiment, the thermoelectric conversion element 11 is covered from both sides by a pair of resin-made low-temperature side substrate 14 and high-temperature side substrate 15, but the fourth embodiment is a low-temperature side substrate. 14 and the high temperature side substrate 15 are not provided, and the thermoelectric conversion element 11 is different from the first embodiment in that the thermoelectric conversion element 11 is covered with the low temperature side outer layer member 321 and the high temperature side outer layer member 322.

FIG. 6 is a cross-sectional view of the thermoelectric conversion module 301 according to the fourth embodiment.
As shown in FIG. 6, the thermoelectric conversion module 301 includes the thermoelectric conversion element 11 and an outer layer member 320 that covers both surfaces of the thermoelectric conversion element 11.
The outer layer member 320 includes a pair of a low temperature side outer layer member 321 that covers one surface of the thermoelectric conversion element 11 and a high temperature side outer layer member 322 that covers the other surface of the thermoelectric conversion element 11.
The low temperature side outer layer member 321 has a flat foil portion 321 a and a plurality of convex portions 323 provided on the foil portion 321 a corresponding to each low temperature connection portion 17.
The high temperature side outer layer member 322 includes a flat foil portion 322 a and a plurality of convex portions 324 provided on the foil portion 322 a corresponding to each high temperature connection portion 16.
The low temperature side outer layer member 321 is provided on the low temperature heat medium side, and the high temperature side outer layer member 322 is provided on the high temperature heat medium side.

  The foil portions 321a and 322a are flexible thin plate-like or foil-like members formed using a material having high thermal conductivity. The material used for the foil portions 321a and 322a is copper in the fourth embodiment, but other metals or metal compounds such as aluminum foil, ceramics, high thermal conductive resin, etc. can also be used. . In addition, the convex portions 323 and 324 are thin plate-like or foil-like members formed using a material having insulating properties and high thermal conductivity. The material used for the convex portions 323 and 324 is an insulating resin in the fourth embodiment, but may be a material obtained by mixing and solidifying a resin and ceramics such as alumina.

Each convex part 323,324 is provided in foil part 321a, 322a as a separate body from foil part 321a, 322a, respectively. The low temperature side outer layer member 321 covers the thermoelectric conversion element 11 so that each convex portion 323 is connected to each low temperature connection portion 17. The high temperature side outer layer member 322 covers the thermoelectric conversion element 11 so that each convex portion 324 is connected to each low temperature connection portion 16. A space portion 25 is formed between the convex portions 323. A space portion 26 is formed between the convex portions 324. Here, the convex portion 323 and the convex portion 324 may be made of materials having different thermal conductivities.
The space portions 25 and 26 are filled with a heat insulating material 330 such as a resin having a lower thermal conductivity than the convex portions 323 and 324 and having an insulating property. With this configuration, the thermoelectric conversion element 11 corresponding to the space portions 25 and 26 can be reliably insulated from the foil portions 321a and 322a, and the heat of the portions facing the space portions 25 and 26 in the foil portions 321a and 322a can be obtained. Transmission to the thermoelectric conversion element 11 can be suppressed, and a large temperature gradient can be formed in the thermoelectric conversion element 11.

According to the fourth embodiment, since the thermoelectric conversion element 11 is directly covered by the low temperature side outer layer member 321 and the high temperature side outer layer member 322 that have the convex portions 323 and 324 having insulation and high thermal conductivity, The foil portions 321a and 322a and the thermoelectric conversion element 11 are insulated by the convex portions 323 and 324, and heat can be efficiently transmitted to the low temperature connection portion 17 and the high temperature connection portion 16. For this reason, it is not necessary to provide the low temperature side substrate 14 and the high temperature side substrate 15 made of a resin such as polyimide described in the first embodiment, and the thermoelectric conversion module 301 that can handle various heat media is provided. It can be realized with a simple structure.
Further, since the thermal resistance is lowered by the amount not provided with the low temperature side substrate 14 and the high temperature side substrate 15, the heat of the outside heat medium can be efficiently transmitted to the thermoelectric conversion element 11, and the power generation efficiency is good.
The thermoelectric conversion module 301 can also be used as a temperature difference generator (Peltier element) by passing a current through the thermoelectric conversion element 11.

FIG. 7 is a cross-sectional view showing a reference example of the thermoelectric conversion module 102.
The thermoelectric conversion module 102 shown in FIG. 7 is not provided with the foil portion 122a (FIG. 4) of the high temperature side outer layer member 122 in the thermoelectric conversion module 101, but in the concave portions between the convex portions 124 on the surface of the high temperature side substrate 15. The metal coating layer 130 thinner than the convex portion 124 is formed by vapor deposition or the like. By providing the metal coating layer 130, it is possible to suppress the influence of the radiant heat from the heat medium on the high temperature side on the low temperature connection portion 17, so that a large temperature gradient can be generated in the thermoelectric conversion element 11, and the power generation efficiency is good. . Moreover, since the surface of the resin-made high temperature side substrate 15 is covered with the metal coating layer 130 and is not exposed to the outside, the durability of the high temperature side substrate 15 is improved.

1, 101, 201, 301 Thermoelectric conversion module 10 Flexible substrate part 11 Thermoelectric conversion element 12 n-type thermoelectric element (n-type thermoelectric material)
13 p-type thermoelectric element (p-type thermoelectric material)
14 Low temperature side substrate (substrate)
15 High temperature side substrate (substrate)
16 High temperature connection (connection)
17 Low temperature connection (connection)
21, 121, 221, 321 Low temperature side outer layer member (outer layer member)
22, 122, 222, 322 High temperature outer layer member (outer layer member)
22a Outer surface (surface)
23, 24, 123, 124, 223, 224, 323, 324 Convex part 25, 26 Space part

Claims (10)

A thermoelectric conversion module comprising thermoelectric conversion elements configured by alternately arranging n-type thermoelectric materials and p-type thermoelectric materials,
Having an outer layer member provided with a plurality of convex portions,
The convex portion is thermally connected to a position corresponding to a connection portion between the n-type thermoelectric material and the p-type thermoelectric material.   The thermoelectric conversion element is sandwiched between a pair of substrates, the convex portion has higher thermal conductivity than the substrate, and the convex portion is at a position corresponding to the connecting portion on the surface of the substrate. The thermoelectric conversion module according to claim 1, wherein the thermoelectric conversion module is thermally connected.   The thermoelectric conversion module according to claim 1, wherein the outer layer member and the thermoelectric conversion element are insulated by the convex portion. A pair of the outer layer members are provided on both sides of the thermoelectric conversion element to constitute the outermost layer,
One outer layer member forms a high temperature side outer layer member, and the other outer layer member forms a low temperature side outer layer member,
The said convex part of the said high temperature side outer layer member and the said convex part of the said low temperature side outer layer member are thermally connected to the position corresponding to the said different connection part, respectively. The thermoelectric conversion module according to any one of the above.   The thermoelectric conversion module according to claim 4, wherein the convex portion of the high temperature side outer layer member and the convex portion of the low temperature side outer layer member have different thermal conductivities.   The thermoelectric conversion module according to claim 1, wherein a space portion is formed between the plurality of convex portions.   The thermoelectric conversion module according to claim 6, wherein a material having lower thermal conductivity than the convex portion is provided in the space portion.   The thermoelectric conversion module according to claim 2, wherein the substrate is an insulating sheet.   The thermoelectric conversion module according to any one of claims 1 to 8, wherein the convex portion is formed separately from the outer layer member.   The thermoelectric conversion module according to claim 1, wherein a surface of the outer layer member is black.

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