JP2014031286A - Method for manufacturing glass substrate of cover glass for electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a glass substrate of cover glass for an electronic apparatus capable of simply fixing a blank laminate formed by laminating glass blanks for performing cutting processing, and easily cancelling fixation.SOLUTION: A method for manufacturing a glass substrate of cover glass for an electronic apparatus includes: a lamination step of forming a blank laminate 120 by laminating and adhering three or more glass blanks; and a cutting step of forming laminate blocks whose main surface has a small area by cutting the blank laminate 120. Surface roughness (Ra) of a processing table 150 is 0.1-25 μm. In the cutting step, while the blank laminate 120 is located on the processing table 150 for vacuum suction and is suction-fixed, cutting is performed.

Description

  The present invention relates to an electronic device including a cover glass for a portable device used as a cover member for a display screen of a portable device (portable electronic device) and a cover glass for a touch sensor used as a cover member for a touch sensor such as a pointing device. The present invention relates to a method for manufacturing a glass substrate of a cover glass for equipment.

  In mobile devices including smartphones, and mobile devices such as tablet terminals, slate PCs (Personal Computers), and PDAs (Personal Digital Assistants), a cover glass is arranged outside the display device to protect the display device such as a liquid crystal display. The In addition, in touch sensors (pointing devices) of stationary devices such as ATMs and ticket vending machines, a cover glass is arranged to protect the transparent conductive film (ITO: Indium-tin-oxide) for sensor substrates and touch panels. Is done.

  In general, a cover glass is manufactured by extracting a glass substrate having an arbitrary shape from a large single glass plate and processing the extracted glass substrate. As a method of extracting a glass substrate from a glass base plate, a method of processing by mechanical processing means is known (for example, Patent Document 1). In Cited Document 1, the stacked material plate glass (glass base plate) is fixed by a peelable fixing material to form a material glass block (base plate laminate), and this is cut by a disk cutter to reduce the area. It is described that a divided glass block (laminated block) is formed.

  When the base plate laminate is cut with a disk cutter, it is necessary to fix it to the processing table. As a method of fixing to a processing table, conventionally, it is bonded with a photocurable or thermosetting resin, a thermoplastic wax, or fixed by a vacuum adsorption method.

  Patent Document 2 describes that when a glass is cut, a protective glass plate and a glass block (glass plate) are stacked and fixed on the processing table using an adhesive. In the cited document 2, the adhesive is a low melting point wax, and is described as being fixed by alternately stacking glass plates and thin plate-like waxes, heating them in an oven and then slowly cooling them.

  Patent Document 3 describes fixing by a vacuum adsorption method in a coring cutting operation of cutting a glass disk from a glass plate (paragraphs 0011-0013). Specifically, an ultraviolet curable tape is attached to the back surface of the glass plate, and the glass plate is fixed to the adsorption table by suction air through the ultraviolet curable tape. In the cutting process, it is described that the cut-out glass disk is removed by sizing the ultraviolet-curing tape so that the tape is not cut, and irradiating the tape with ultraviolet light after the cutting to cure. Here, vacuum suction means that a workpiece (laminate) is suction-fixed to a processing table using negative pressure.

JP 2009-256125 A JP 2001-002436 A JP 2003-094301 A

  When performing the cutting process as described above, it is necessary to fix it to the processing table, but it is necessary to remove it after the cutting process. However, in a cover glass for an electronic device, it is necessary to further process an outer shape in a state of a laminated block after the large base plate laminate is cut into small laminated blocks.

  However, when the base plate laminate is fixed to the processing table with an adhesive as in the cited document 2, it is not possible to weaken the adhesive force by applying a solvent or heat to the processing table or performing a light irradiation treatment. This is because the adhesive force also decreases in the cut laminated blocks, and is peeled off when the outer shape is processed. It is conceivable that the laminated block is mechanically peeled off from the processing table using a spatula or the like, but this may not be adopted because the glass substrate is scratched or the laminated block is distorted. .

  When the vacuum suction method as in Patent Document 3 is used, there is a problem in that a liquid such as a coolant used for cutting processing enters between the ultraviolet curable tape and the processing table due to the suction force, thereby reducing the friction coefficient. is there. As a result, the laminated body and the processing table that are being cut are not sufficiently fixed, and a shift occurs during cutting, which makes cutting difficult.

  In addition, with the recent increase in demand for portable devices, the demand for cover glasses for electronic devices has also increased rapidly. Under such a background, the cover glass for electronic devices is required to reduce the production cost. In order to reduce production costs, simplification of processes and reduction of materials can be mentioned.

  In view of the above problems, the present invention provides a method for manufacturing a glass substrate of a cover glass for an electronic device that can be easily fixed by cutting a base plate laminate in which glass base plates are stacked and can be easily released. The purpose is to provide.

  In order to solve the above-described problems, a typical configuration of the present invention includes a laminating step of laminating a plurality of glass base plates to form a base plate laminate, and cutting the base plate laminate to obtain a main surface. In the method for manufacturing a glass substrate for a cover glass for electronic equipment, including a cutting step for forming a laminated block having a small area, in the cutting step, the base plate laminate is placed on a processing table for vacuum suction and sucked Cutting is performed in a fixed state.

  The processing table is divided into a plurality of sections corresponding to the cutting area, and the processing table is preferably provided with a plurality of suction holes per section. Thereby, the laminated body after cutting can be sucked stably.

  The processing table may be formed of a porous material, and the entire upper surface of the processing table may be an adsorbable region. In this case, since the entire upper surface of the processing table is an adsorbable region, the base plate laminate can be adsorbed and fixed corresponding to various sizes and shapes of the cover glass for electronic devices.

  It is preferable that the surface roughness (Ra) of the processing table is 0.1 to 25 μm. By setting the surface roughness of the processing table in the above range, the glass base plate laminate can be fixed and cut very easily and simply by placing it on the processing table and adsorbing it. . If the processing table is a mirror surface, coolant enters and becomes slippery. If the processing table is rougher than the above range, the degree of vacuum decreases and the frictional force decreases. If it is said range, since a contact area can be reduced and a vertical drag can be raised, maintaining a vacuum degree, it becomes possible to fix easily and reliably. Here, the surface roughness (Ra) is more preferably 1 μm or more in terms of the cost of manufacturing and maintaining the processing table, and the surface roughness can be further prevented by obtaining a high degree of vacuum. The thickness (Ra) is more preferably 10 μm or less.

  Moreover, since it fixes by vacuum suction, unlike the case where it fixes to a process table with an adhesive agent, it is not necessary to peel from a process table. Therefore, there is no possibility that the adhesion of the laminate itself is damaged by heat or a solvent, or the glass substrate in the lowermost layer of the laminate is damaged by peeling off with a spatula. Further, compared with the case of fixing using an ultraviolet curable tape and a vacuum adsorption method, the coolant does not enter and the frictional force does not decrease, so that there is no possibility that the dimensional accuracy is deteriorated due to deviation during cutting.

  Further, since the base plate laminate is simply placed on the processing table, a process of attaching an adhesive or an ultraviolet curable tape is not necessary, and the material cost can be reduced. Therefore, the production cost can be greatly reduced.

  In the laminating process, the adhesive that bonds the glass base plates together is a photocurable resin. In the laminating process, the thickness of the base laminate is equal to the thickness of the base laminate from both sides of the base laminate. It is preferable to cure the adhesive from both sides of the base laminate by irradiating both main surfaces with light so as to reach.

  According to the above configuration, since the curing of the adhesive can proceed equally from both sides of the base plate laminate, the stress due to strain during the shrinkage of the adhesive can be made uniform on both sides, Warpage and undulation can be reduced, and the base plate laminate can be formed flat. As a result, a decrease in the degree of vacuum (adsorption force) in vacuum adsorption can be prevented, and the base plate laminate can be more securely adsorbed and fixed. Moreover, the dimensional error in the upper and lower sides of the laminated block after the cutting step and the decrease in the perpendicularity of the end face of each glass substrate can be suppressed. In addition, when irradiating light, you may irradiate from both upper and lower sides with a base-plate laminated body placed flat, or you may irradiate from both right and left in the state which supported the base-plate laminated body upright.

  In the laminating process, glass plates and adhesives are alternately stacked on a rigid plate that transmits light, and a plate with the same light transmittance as the plate is placed on the laminated glass plate. You may irradiate with light.

  The said structure is a case where a glass base plate is mounted horizontally and laminated | stacked. According to the above-described configuration, the integrated light amounts on both sides can be easily matched, and the deformation can be further suppressed by the weight and rigidity, so that the strain can be further reduced.

  In the laminating process, two rigid plates that transmit light are arranged along both main surfaces of the base plate laminate, and the base plate laminate and the plates are placed upright, and the base plate is formed by the two plates. You may irradiate light, applying a pressure so that a laminated body may be pinched | interposed.

  The said structure is a case where a glass base plate is laminated | stacked in the state stood | rightened vertically. According to the above configuration, the integrated light amounts on both sides can be easily matched, and the deformation is mechanically suppressed by the pressure and rigidity, so that the strain can be further reduced.

  According to the present invention, there is provided a method for manufacturing a glass substrate of a cover glass for an electronic device that can be easily fixed by cutting a base plate laminate in which glass base plates are stacked and can be easily released. Can do.

It is a figure explaining the cover glass for electronic devices. It is a flowchart explaining the manufacturing method of the glass substrate of the cover glass for electronic devices. It is a figure explaining a lamination process. It is a figure explaining a cutting process. It is a figure explaining a process table. It is a figure explaining other embodiment.

  Exemplary embodiments of the present invention will be described below in detail with reference to the accompanying drawings. The dimensions, materials, and other specific numerical values shown in the embodiments are merely examples for facilitating understanding of the invention, and do not limit the present invention unless otherwise specified. In the present specification and drawings, elements having substantially the same function and configuration are denoted by the same reference numerals, and redundant description is omitted, and elements not directly related to the present invention are not illustrated. To do.

  FIG. 1 is an external perspective view illustrating a cover glass for an electronic device. The cover glass for an electronic device manufactured by the manufacturing method according to the present invention is a mobile phone including a smartphone, a mobile device such as a tablet terminal, a slate PC (Personal Computer), or a PDA (Personal Digital Assistant), or a pointing device, ATM. It can be used as a cover glass for a touch sensor of a stationary apparatus such as a ticket vending machine or an electronic guide board. In the present embodiment, the glass substrate 100 will be described with reference to a cover glass for a mobile phone (mobile device).

  As shown in FIG. 1, the outer peripheral portion 102 of the glass substrate 100 is generally rectangular. Further, the glass substrate 100 is provided with openings 104 for speakers, buttons, and microphones, for example. Although the thickness of the glass substrate 100 is not particularly limited, it is usually preferably 1 mm or less, preferably 0.7 mm or less, from the viewpoint of suppressing weight increase of various devices using cover glass and thinning the device. More preferably. In addition, it is preferable that the lower limit of plate thickness shall be 0.1 mm or more from a viewpoint of ensuring the mechanical strength of a glass substrate. The outer shape of the glass substrate 100 can be appropriately set according to the portable device to be incorporated.

  The glass substrate 100 is cut out from a large glass base plate 110 as described later. The glass base plate 110 is formed directly from molten glass into a sheet shape, or a glass body molded to a certain thickness is molded to a predetermined thickness, and the main surface is polished to a predetermined thickness. Things can be used. In particular, when the glass base plate 110 that is molded directly from molten glass into a sheet is used, it is preferable because the main surface of the glass base plate 110 has a surface state without microcracks. Examples of the method for directly forming a sheet from molten glass include a downdraw method and a float method.

  The glass base plate 110 is preferably made of aluminosilicate glass, soda lime glass, borosilicate glass, transparent crystallized glass, or the like. Among these, an aluminosilicate glass containing SiO2, Al2O3, Li2O and / or Na2O is preferable. Li2O is a component for exchanging Na + ions and Li + ions in chemical strengthening. Na2O is a component for exchanging K + ions and Na + ions in chemical strengthening. ZrO2 is useful for increasing the mechanical strength. However, even materials other than aluminosilicate glass may be used as long as they can be chemically strengthened (they should contain at least one of Li + ions and Na + ions).

  FIG. 2 is a flowchart for explaining a method for manufacturing a glass substrate of a cover glass for electronic equipment, FIG. 3 is a diagram for explaining a lamination process, and FIG. 4 is a diagram for explaining a cutting process. Hereinafter, the manufacturing method of the glass substrate of the cover glass for electronic devices is demonstrated along the flowchart of FIG. 2, referring FIG. 3 and FIG.

Steps 200 to 206 are steps for laminating the glass base plate 110.
First, a rigid plate 112 that transmits light is installed (step 200, FIG. 3A). The plate 112 preferably has a high light transmittance, and preferably has a light refractive index close to that of the glass base plate 110. Further, it is preferable that the plate 112 has such a rigidity that warp or the like does not occur due to a stress caused by strain at the time of shrinkage of the adhesive. For example, the plate 112 can be made of the same material as the glass base plate 110 and has a sufficient thickness to obtain rigidity.

  Next, a large-sized glass base plate 110 and an adhesive 114 are alternately stacked on the plate 112 to form a base-plate stack 120 (step 202, FIG. 3B). The number of laminated glass base plates 110 is three or more, for example, about 10 to 100. Note that the adhesive 114 is not applied between the plate 112 and the first glass base plate 110.

  The adhesive 114 is a photocurable resin that is solidified by irradiation with ultraviolet rays having a predetermined wavelength. As the ultraviolet curable resin, a resin that can easily peel off the glass base plate 110 bonded by hot water, an organic solvent, or heat is preferable. The adhesive 114 may be applied by a dropping method or by a spray method.

  After a predetermined number of glass base plates 110 are stacked, the second plate 116 is placed on the stacked glass base plate 110 (step 204, FIG. 3C). The adhesive 114 is not applied between the uppermost glass base plate 110 and the second plate 116, but simply placed. The second plate 116 has the same composition and the same thickness as the first plate 112.

  While sandwiched between the two plates 112 and 116, ultraviolet light sources 118 are arranged on both upper and lower sides thereof. Then, the adhesive 114 is cured by irradiating light (ultraviolet rays) from both sides of the base laminate 120 (for example, a direction perpendicular to both main surfaces of the laminate) (step 206, FIG. 3D). ).

  According to the above configuration, since the light reaches the both sides of the base plate laminate 120 with the same intensity, the adhesive 114 can be cured simultaneously from both sides of the base plate laminate 120. Therefore, the stress due to the strain at the time of shrinkage of the adhesive 114 becomes even on the front and back sides, and the warp and undulation of the base plate laminate 120 can be reduced. Therefore, it is possible to prevent a dimensional error above and below the laminated block after the cutting process and a decrease in the perpendicularity of the end face of each glass substrate.

  In addition, the second plate 116, which is the same as the base plate 112, is placed on the base plate laminate 120, rather than simply irradiating light from the upper and lower sides, thereby further preventing the occurrence of distortion. Can do. The second plate 116 has two roles. First, by irradiating light through the plates 112 and 116 both in the upper and lower directions, the integrated light amounts on both sides can be matched easily and reliably, and curing can proceed simultaneously from both sides. Second, since the second plate 116 mechanically suppresses deformation due to its weight and rigidity, distortion during curing can be prevented.

Steps 210 to 216 are cutting processes.
The base plate laminate 120 cured as described above is taken out between the plates 112 and 116 and placed on the processing table 150 for vacuum suction (step 210, FIG. 4A). A large number of suction holes 152 are provided in the processing table 150, and vacuum suction is performed with the lower surface of the base plate laminate 120 being set at a negative pressure. The suction hole 152 is connected to an ejector type vacuum pump 154. Since the vacuum pump 154 is an ejector type, it is possible to prevent a failure from occurring even when coolant enters during cutting.

  Then, suction is performed by the vacuum pump 154 to fix the base plate laminate 120 (step 212), and cutting is performed by the disc cutter 160 while supplying coolant (cutting fluid) to the cutting site (step 214, FIG. 4 (b)). )). Thereby, the base plate laminate 120 having a large area is divided into small portions, and a laminate block 130 having a small area is formed. When the suction by the vacuum pump 154 is stopped (step 216), the laminated block 130 can be easily picked up from the processing table 150 and recovered.

  The size of the laminated block 130 is slightly larger than the finally obtained glass substrate 100 (see FIG. 1). FIG. 4C shows a perspective view of the small piece laminated block 130 obtained by the cutting process. The laminated block 130 has a structure in which the glass substrate 100 and the adhesive 114 are alternately laminated.

  FIG. 5 is a diagram for explaining the processing table 150. In FIG. 5, the base-plate laminated body 120 is shown with the broken line. On the upper surface of the processing table 150, a groove 150a is formed along the cutting line of the base plate laminate 120, and the blade of the disk cutter 160 (diamond disk) is configured not to cut the processing table 150. .

  The processing table is divided into a plurality of grooves 150a so as to correspond to the cutting area, and a plurality of suction holes 152 are provided per section. That is, the suction hole 152 is disposed inside the region partitioned by the groove 150a. Thereby, even when the base plate laminate 120 is cut and divided into the laminate blocks 130, the outside air is not sucked, and the cut base plate laminate 120 can be stably sucked.

  Here, the surface roughness (Ra) of the processing table 150 is 0.1 to 25 μm. By setting the surface roughness of the processing table 150 in the above range, it is possible to fix and cut the base plate laminate 120 on the processing table 150 very simply and reliably by simply placing it on the processing table 150 and sucking it. it can. If the processing table 150 is a mirror surface, the coolant enters and becomes slippery. If the processing table 150 is rougher than the above range, the degree of vacuum (suction force) decreases and the frictional force decreases. That is, if it is in said range, since a contact area can be reduced and a normal force can be raised, maintaining a vacuum degree, it becomes possible to fix easily and reliably. Here, the surface roughness (Ra) of the processing table 150 is more preferably 1 to 10 μm.

  Moreover, since it fixes by vacuum suction, unlike the case where it fixes to the process table 150 with an adhesive agent, it is not necessary to peel from the process table 150. FIG. Therefore, there is no possibility that the adhesion of the laminate itself is damaged by heat or a solvent, or the glass substrate in the lowermost layer of the laminate is damaged by peeling off with a spatula. Further, compared with the case of fixing using an ultraviolet curable tape and a vacuum adsorption method, the coolant does not enter and the frictional force does not decrease, so that there is no possibility that the dimensional accuracy is deteriorated due to deviation during cutting.

  Further, since the base plate laminate 120 is simply placed on the processing table 150, a process of attaching an adhesive or an ultraviolet curable tape is not necessary, and the material cost can be reduced. Therefore, the production cost can be greatly reduced.

  The reason why a predetermined degree of vacuum can be obtained without bonding the base plate laminate 120 to the processing table 150 in this way is that the base plate laminate 120 is not distorted (warped) as described above. It depends on. If the base laminate 120 is distorted, a gap is generated between the base laminate 120 and the processing table 150, making it difficult to adsorb regardless of the surface roughness of the processing table 150. Because.

  In the shape processing step (step 220), the outer shape of the laminated block 130 is cut and polished by machining using a grinder or the like along the outer shape (designed shape) of the cover glass. In addition, the opening for the earpiece (speaker) and the button is formed by machining using a drill or the like.

  The peeling step (step 222) is a step of peeling the adhesive 114 of the laminated block 130 and separating the individual glass substrates 100. The peeling method in the peeling process depends on the characteristics of the protective material. For example, in the protective material made of an ultraviolet curable resin, there is a type of protective material that peels in an environment of warm water (80 to 90 degrees Celsius). . In such a case, the laminated block 130 can be peeled (separated) into each glass substrate 100 by immersing the laminated block 130 in a container containing warm water. In the case of peeling with a solvent, the glass substrate 100 can be peeled by immersing the laminated block 130 in a chemical solution layer of the solvent and swinging.

  In the chemical strengthening step (step 224), one or more alkali metals contained in the glass substrate 100 are ion-exchanged with the alkali metal of the molten salt to form a compressive stress layer on the surface layer portion of the glass substrate 100. To do. When the composition of the glass base plate 110 is an aluminosilicate glass as described above, the chemical strengthening treatment liquid is potassium nitrate or a mixed salt of potassium nitrate and sodium nitrate. Then, by immersing at a predetermined temperature (for example, 320 ° C. to 470 ° C.) for a predetermined time (for example, 3 to 600 minutes), Li + ions are replaced with Na + ions, and Na + ions are replaced with K + ions. Is given.

  The cleaning step (step 226) includes, for example, at least one of acid cleaning, alkali cleaning, rinse cleaning with pure water, and cleaning with IPA (isopropyl alcohol) performed in a state where the glass substrate 100 after chemical strengthening is placed on a pallet. Including.

[Other Embodiments]
FIG. 6 is a view for explaining another embodiment of the method for producing the glass substrate of the cover glass for electronic equipment according to the present invention. In the said embodiment, it demonstrated so that the plate 112 and the glass base plate 110 might be mounted horizontally and laminated | stacked in a lamination process. However, the present invention is not limited to the above example, and the base plate stack 120 is sandwiched between the two plates 112 and 116 in a state where the base plate stack 120 and the plates 112 and 116 are vertically arranged. You may laminate.

  Since the glass base plate 110 and the plates 112 and 116 are arranged upright as described above, the glass base plate 110 is dipped (immersed) in an adhesive tank as shown in FIG. An adhesive can be applied. The application of the adhesive by dipping can be automated (mechanized) more easily than the dropping type or the spraying type.

  In order to apply the adhesive 114 between the glass base plates 110 to be laminated, every other glass base plate 110 may be dipped. Further, since the glass base plate 110 and the plates 112 and 116 are not bonded, the glass base plates 110 at both ends are not dipped. By applying pressure with the two plates 112 and 116, the thickness of the adhesive can be made uniform.

  Then, as shown in FIG. 6B, ultraviolet light sources 118 are arranged on the left and right sides of the plate while pressure is applied by the two plates 112 and 116 on both sides. Then, the adhesive 114 is cured by irradiating light (ultraviolet rays) from both sides in the stacking direction of the base plate laminate 120.

  In the present embodiment, the two plates 112 and 116 have a role of matching the integrated light amounts on both sides and a role of mechanically reducing strain at the time of curing by pressure and rigidity. Therefore, also by such a structure, the distortion of the base-plate laminated body 120 can be reduced suitably.

[Example]
Examples of the present invention will be described below. As the composition of the glass base plate (and glass substrate), 64.5 wt% SiO 2, 8.0 wt% Al 2 O 3, 0.4 wt% LiO 2, 16.0 wt% Na 2 O, 1. A glass material containing 0% by weight of ZrO2 was used. The large-sized glass base plate used for the test had a long side of 450 mm, a short side of 415 mm, and a thickness of 0.5 mm.

  In the laminating process, the number of laminated base plate laminates was 20. A glass plate having a thickness of 20 mm and transmitting ultraviolet rays was used as the plate. A UV curable resin was used as a photocurable resin for bonding the glass base plates, and ultraviolet rays having a wavelength center of 360 nm (wavelength region 300 to 400 nm) were irradiated and cured at an intensity of 100 mW. In the cutting step, the base plate laminate was cut into a laminated block having a long side of 140 mm and an end side of 90 mm.

  Table 1 shows the results of examining the state of irradiation from both sides or one side when the base plate laminate is cured. Samples 1 and 2 were cured by irradiating ultraviolet rays from both sides in the stacking direction of the base plate laminate in a state where the second plate was placed on the base plate stack. In Samples 1 and 2, the number of stacked layers was different from 20 and 30, respectively. Samples 3 and 4 were cured by irradiating ultraviolet rays only from above without placing a second plate on the base plate laminate. In samples 3 and 4, the number of stacked layers was different from 20 and 30 respectively.

Table 1 shows the flatness of the base plate laminate after curing and the result of the possibility of vacuum suction. Here, the flatness was measured with a three-dimensional measuring machine (manufactured by Mitutoyo, Coordinating measuring machine, model FJ805) according to JIS B 0621. In addition, “impossibility of vacuum suction” was determined based on whether or not a deviation occurred when cutting with a disk cutter.

  As can be seen from Table 1, the samples 3 and 4 cured by single-sided irradiation cannot be vacuum-sucked, while the samples 1 and 2 cured by double-sided irradiation can be vacuum-sucked without any problem. It was. It can also be seen that Samples 1 and 2 have a flatness of about 1/10 that of Samples 3 and 4. Although the flatness decreases as the number of stacked layers increases, even when 30 sheets are cured by double-sided irradiation, the flatness of about 1/7 when 20 sheets are cured by single-sided irradiation is obtained. It can be understood why there is a clear difference in vacuum adsorption.

Table 2 shows the results of examining the occurrence of deviation of the base plate laminate and the degree of vacuum while changing the surface roughness (Ra) of the processing table. In producing the following Samples 11 to 16, all the base plate laminates prepared in Sample 1 were used. Referring to Table 2, it can be seen that the smaller the surface roughness is, the higher the degree of vacuum is (small value), and the larger the surface roughness is, the lower the degree of vacuum is (large value).

  Referring to samples 15 and 16 in Table 2, there is no deviation in sample 15, whereas there is a deviation in sample 16. This is because the degree of vacuum is greatly reduced at this time, so that the pressure by the atmosphere (vertical drag against the processing table) is reduced and the frictional force is reduced.

  On the other hand, when samples 11 and 12 are referred to, it can be seen that the sample 11 is misaligned although the degree of vacuum is higher. This is because the surface roughness is small and the processing table is a mirror surface, so there is no escape space for the coolant that has entered between the processing table and the base laminate, and the base laminate is in a floating state. This is because it became easier.

  From the above, by setting the surface roughness (Ra) of the processing table to 0.1 to 25 μm, it is extremely simple and reliable simply by placing and adsorbing the glass base plate laminate on the processing table. It was confirmed that it can be fixed and cut. Furthermore, the cost of manufacturing and maintaining a processing table having a surface roughness (Ra) of 1 μm can be significantly reduced as compared with a processing table having a surface roughness (Ra) of 0.05 μm. In this respect, the surface roughness (Ra) of the processing table is more preferably 1 μm or more. Further, in order to obtain a high degree of vacuum, it is more preferable that the surface roughness (Ra) of the processing table is 10 μm or less because the occurrence of deviation can be better prevented. As a result, the surface roughness (Ra) of the processing table is more preferably 0.1 to 10 um.

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.

  In the above embodiment, the processing table is divided into a plurality of sections corresponding to the cutting area as shown in FIG. However, the processing table is not limited to this example. For example, a processing table formed of a porous material (such as porous ceramics or porous resin) may be used. In this case, since the entire upper surface of the processing table is an adsorbable region, the base plate laminate can be adsorbed and fixed corresponding to various sizes and shapes of the cover glass for electronic devices.

  The present invention relates to an electronic device including a cover glass for a portable device used as a cover member for a display screen of a portable device (portable electronic device) and a cover glass for a touch sensor used as a cover member for a touch sensor such as a pointing device. It can utilize as a manufacturing method of the glass substrate of the cover glass for apparatuses.

DESCRIPTION OF SYMBOLS 100 ... Glass substrate, 102 ... Outer peripheral part, 104 ... Opening, 110 ... Glass base plate, 112 ... Plate, 114 ... Adhesive, 116 ... Plate, 118 ... Light source, 120 ... Base plate laminated body, 130 ... Laminated block, 150 ... Processing table, 150a ... Groove, 152 ... Suction hole, 154 ... Vacuum pump, 160 ... Disk cutter

Claims (7)

A laminating step of forming a base plate laminate in which a plurality of glass base plates are stacked and bonded;
In the manufacturing method of the glass substrate of the cover glass for electronic devices, including a cutting step of cutting the base plate laminate to form a laminated block having a small main surface area.
The method for producing a glass substrate of a cover glass for an electronic device, wherein the cutting step is performed in a state where the base plate laminate is placed on a processing table for vacuum suction and is fixed by suction. The processing table is divided into a plurality so as to correspond to the cutting area,
The method for producing a glass substrate for a cover glass for an electronic device according to claim 1, wherein the processing table is provided with a plurality of suction holes per section.   2. The method of manufacturing a glass substrate for a cover glass for an electronic device according to claim 1, wherein the processing table is made of a porous material, and the entire upper surface of the processing table is an adsorbable region.   The surface roughness (Ra) of the said processing table is 0.1-25 micrometers, The manufacturing method of the glass substrate of the cover glass for electronic devices of any one of Claim 1 to 3 characterized by the above-mentioned. The adhesive that bonds the glass base plates together in the laminating step is a photocurable resin,
In the laminating step, the adhesion is performed by irradiating light on both main surfaces so as to reach the thickness center region of the base plate laminate with equal strength from both sides in the stacking direction of the base plate laminate. The method for producing a glass substrate for a cover glass for an electronic device according to any one of claims 1 to 4, wherein the curing of the agent proceeds from both sides of the base plate laminate.   In the laminating step, the glass base plate and the adhesive are alternately arranged and laminated on the rigid plate that transmits light, and the plate having the same light transmittance as the plate is placed on the laminated glass base plate. 6. The method for producing a glass substrate of a cover glass for an electronic device according to claim 5, wherein the light is irradiated in a state where the glass substrate is in a wet state. In the lamination step,
Two rigid plates that transmit light are arranged along both main surfaces of the base plate laminate,
In a state where the base plate laminate and the plate are arranged upright,
6. The method of manufacturing a glass substrate for a cover glass for an electronic device according to claim 5, wherein light is applied while applying pressure so that the base plate laminate is sandwiched between the two plates.

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