JP2014011200A - Exposure device, exposure method, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device that reduces the occurrence of exposure failures.SOLUTION: An exposure device exposes a substrate with exposure light through a first liquid in a first immersion space. The exposure device includes: an optical member having an emission surface that emits exposure light; a first member that is arranged in at least part of the surroundings of an optical path of the exposure light and that forms the first immersion space of the first liquid; and a second member that is arranged on an outer side of the first member with respect to the optical path and that forms a second immersion space of a second liquid away from the first immersion space.

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method.

  As an exposure apparatus used in a photolithography process, for example, an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in the following patent document is known.

US Patent Application Publication No. 2009/0046261

  In the immersion exposure apparatus, if the liquid flows into an undesired space, an exposure failure may occur. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through the first liquid in the first immersion space, the optical member having an exit surface from which the exposure light is emitted; A first member disposed at least part of the periphery of the optical path of the exposure light and forming a first liquid immersion space for the first liquid; and disposed outside the first member with respect to the optical path, from the first liquid immersion space. An exposure apparatus is provided that includes a second member that can form a second immersion space for the second liquid.

  According to the second aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through a liquid, the optical member having an exit surface from which the exposure light is emitted, and a lower surface of the substrate are releasably held. A substrate holding unit, a first member having a first upper surface disposed in a part of the periphery of the upper surface of the substrate in a state where the substrate is held by the substrate holding unit, and the substrate is held by the substrate holding unit A second member having a second upper surface disposed in a part of the periphery of the upper surface of the substrate in the state, and moving the first member in a direction intersecting the optical axis of the optical member to A first adjustment device capable of adjusting the size of the first gap, and a second adjustment capable of adjusting the size of the second gap between the upper surface and the second upper surface of the substrate by moving the second member in a direction intersecting the optical axis. And an exposure apparatus comprising the apparatus.

  According to a third aspect of the present invention, there is provided a device manufacturing method comprising: exposing a substrate using the exposure apparatus according to any one of the first and second aspects; and developing the exposed substrate. Is provided.

  According to a fourth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a first liquid in a first immersion space, the optical path of exposure light being emitted from an exit surface of an optical member. Forming a first immersion space for the first liquid with a first member disposed at least at a part of the periphery, and a second member disposed outside the first member with respect to the optical path, Forming a second immersion space for the second liquid away from the space; forming a second immersion space between the second member and the first object; and An exposure method is provided that includes forming a second immersion space between adjacent second objects via a gap and changing the dimension of the gap.

  According to a fifth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, wherein an immersion space is formed with the liquid on the exit surface side of the optical member from which the exposure light is emitted. Holding the lower surface of the substrate releasably by the substrate holding unit, exposing the substrate held by the substrate holding unit via the liquid in the immersion space, and the substrate held by the substrate holding unit The first member having the first upper surface arranged at a part of the periphery of the upper surface is moved in a direction intersecting the optical axis of the optical member to adjust the size of the first gap between the upper surface of the substrate and the first upper surface. And moving the second member having the second upper surface disposed in a part of the periphery of the upper surface of the substrate held by the substrate holding unit in a direction intersecting the optical axis of the optical member, Adjusting the dimension of the second gap between the upper surface and the second upper surface.

  According to a sixth aspect of the present invention, there is provided a device manufacturing method comprising: exposing a substrate using the exposure method according to any one of the fourth and fifth aspects; and developing the exposed substrate. Is provided.

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.

It is a figure which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is a figure which shows an example of the liquid immersion member which concerns on 1st Embodiment. It is a figure which shows an example of the liquid immersion member which concerns on 1st Embodiment. It is a figure which shows an example of the liquid immersion member which concerns on 1st Embodiment. It is a figure which shows an example of the liquid immersion member which concerns on 1st Embodiment. It is a figure which shows an example of the liquid immersion member which concerns on 1st Embodiment. It is a figure which shows an example of the substrate stage and measurement stage which concern on 1st Embodiment. It is a figure for demonstrating an example of the exposure method which concerns on 1st Embodiment. It is a figure which shows an example of the substrate stage which concerns on 1st Embodiment. It is a figure which shows an example of the substrate stage which concerns on 1st Embodiment. It is a figure which shows an example of the 1st, 2nd object which concerns on 1st Embodiment. It is a figure which shows an example of the 1st, 2nd object which concerns on 1st Embodiment. It is a figure which shows an example of the 1st, 2nd object which concerns on 2nd Embodiment. It is a figure which shows an example of the 1st, 2nd object which concerns on 2nd Embodiment. It is a figure which shows an example of the 1st, 2nd object which concerns on 3rd Embodiment. It is a figure which shows an example of the 1st, 2nd object which concerns on 3rd Embodiment. It is a figure which shows an example of the 2nd member which concerns on 4th Embodiment. It is a figure which shows an example of the 2nd member which concerns on 4th Embodiment. It is a figure which shows an example of the substrate stage which concerns on 5th Embodiment. It is a figure which shows an example of the 1st, 2nd object which concerns on 5th Embodiment. It is a figure which shows an example of the 1st, 2nd object which concerns on 5th Embodiment. It is a figure which shows an example of the 1st, 2nd object which concerns on 5th Embodiment. It is a figure which shows an example of the substrate stage which concerns on 6th Embodiment. It is a figure which shows an example of the substrate stage which concerns on 6th Embodiment. It is a figure which shows an example of the exposure method which concerns on 6th Embodiment. It is a figure which shows an example of the exposure method which concerns on 6th Embodiment. It is a figure which shows an example of the substrate stage which concerns on 6th Embodiment. It is a figure which shows an example of a substrate stage. It is a flowchart which shows an example of a device manufacturing method.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the present embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, the immersion space LS1 is formed so that the optical path K of the exposure light EL irradiated to the substrate P is filled with the liquid LQ. The immersion space refers to a portion (space, region) filled with liquid. The substrate P is exposed with the exposure light EL through the liquid LQ in the immersion space LS1. In the present embodiment, water (pure water) is used as the liquid LQ.

  Further, the exposure apparatus EX of the present embodiment is an exposure apparatus provided with a substrate stage and a measurement stage as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113.

  In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and exposure light EL without holding the substrate P. A movable measuring stage 3 mounted with a measuring member (measuring instrument) C, a mask stage 1, a substrate stage 2, a measuring system 4 for measuring positions of the measuring stage 3, and a mask M illuminated with exposure light EL An illumination system IL, a projection optical system PL that projects an image of the pattern of the mask M illuminated by the exposure light EL onto the substrate P, a liquid immersion member 5 that forms liquid immersion spaces LS1 and LS2, and the entire exposure apparatus EX And a storage device 7 connected to the control device 6 and storing various information relating to exposure.

  The exposure apparatus EX includes a chamber apparatus 11 that adjusts the environment (at least one of temperature, humidity, pressure, and cleanness) of the space CS in which the exposure light EL travels. The chamber apparatus 11 includes a gas supply unit 11S that supplies a gas Fr whose temperature and humidity are adjusted to the space CS. In the space CS, at least the projection optical system PL, the liquid immersion member 5, the substrate stage 2, and the measurement stage 3 are arranged. In the present embodiment, the mask stage 1 and at least a part of the illumination system IL are also arranged in the space CS.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). The substrate P may include a photosensitive film and a film different from the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 8G of the base member 8 including the illumination region IR while holding the mask M. In the present embodiment, the guide surface 8G and the XY plane are substantially parallel. The mask stage 1 is moved by the operation of a drive system including a planar motor as disclosed in US Pat. No. 6,452,292, for example. In the present embodiment, the mask stage 1 can move in six directions on the guide surface 8G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. In the present embodiment, the projection optical system PL is a reduction system. The projection magnification of the projection optical system PL may be, for example, 1/4, 1/5, or 1/8. The projection optical system PL may be a unity magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, or a catadioptric system that includes both a reflective optical element and a refractive optical element. The projection optical system PL may form an inverted image or an erect image.

  The projection optical system PL includes a terminal optical element 13 having an emission surface 12 from which the exposure light EL is emitted. The exit surface 12 emits the exposure light EL toward the image plane of the projection optical system PL. The last optical element 13 is an optical element closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. The projection region PR includes a position where the exposure light EL emitted from the emission surface 12 can be irradiated. In the present embodiment, the emission surface 12 faces the −Z direction. The exit surface 12 is parallel to the XY plane. The exit surface 12 facing the −Z direction may be a convex surface or a concave surface. In addition, the emission surface 12 may be inclined with respect to the XY plane, or may include a curved surface. In the present embodiment, the optical axis of the last optical element 13 is parallel to the Z axis. In the present embodiment, the exposure light EL emitted from the emission surface 12 travels in the −Z direction.

  The substrate stage 2 is movable in an XY plane including a position (projection region PR) where the exposure light EL from the emission surface 12 can be irradiated while holding the substrate P. The measurement stage 3 is movable in an XY plane including a position (projection region PR) where the exposure light EL from the emission surface 12 can be irradiated with the measurement member (measuring instrument) C mounted. Each of the substrate stage 2 and the measurement stage 3 is movable on the guide surface 9G of the base member 9. In the present embodiment, the guide surface 9G and the XY plane are substantially parallel.

  The substrate stage 2 and the measurement stage 3 are moved by operation of a drive system including a planar motor as disclosed in, for example, US Pat. No. 6,452,292. Each of the substrate stage 2 and the measurement stage 3 can move in six directions on the guide surface 9G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system.

  The substrate stage 2 can release the substrate P as disclosed in, for example, US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and US Patent Application Publication No. 2007/0288121. And a cover member T1 and a scale member (measuring member) T2 disposed around the substrate P held by the first holding unit 14.

  The measurement system 4 includes an encoder system that measures the position of the substrate stage 2 using a scale member T2 of the substrate stage 2 as disclosed in, for example, US Patent Application Publication No. 2007/0288121. The measurement system 4 includes an interferometer system.

  When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 6 determines the mask stage 1 (mask M) and the substrate stage 2 (substrate P) based on the measurement result of the measurement system 4. And position control of the measurement stage 3 (measurement member C).

  Next, the liquid immersion member 5 according to this embodiment will be described. FIG. 2 is a side view showing an example of the liquid immersion member 5 according to the present embodiment, and FIG. 3 is a view of the liquid immersion member 5 as viewed from the lower side (−Z side).

  The liquid immersion member 5 is in relation to the first member 21 disposed at least at a part of the periphery of the terminal optical element 13 and the optical path K of the exposure light EL emitted from the emission surface 12 (the optical axis of the terminal optical element 13). And a second member 22 disposed outside the first member 21. The first member 21 forms an immersion space LS1 for the liquid LQ. The second member 22 can be separated from the immersion space LS1 to form an immersion space LS2 for the liquid LQ. The immersion space LS1 is formed in at least a part of the first space SP1 below the first member 21. The immersion space LS2 is formed in at least a part of the second space SP2 below the second member 22.

  The first member 21 has a lower surface 23. The second member 22 has a lower surface 24. The lower surface 23 and the lower surface 24 can be opposed to an object that can move below the last optical element 13. An object that can move below the last optical element 13 can face the exit surface 12. The object can be arranged in the projection region PR. The object can move in the XY plane including the projection region PR. The object is movable below the first member 21. The object is movable below the second member 22.

  In the present embodiment, the object is at least the substrate stage 2 (cover member T1, scale member T2), the substrate P held on the substrate stage 2 (first holding unit 14), and the measurement stage 3 (measurement member C). Including one.

  In the following description, the object that can move below the last optical element 13 is the substrate P. As described above, the object movable below the last optical element 13 may be at least one of the substrate stage 2 and the measurement stage 3, or an object different from the substrate P, the substrate stage 2, and the measurement stage 3. But you can.

  The first member 21 forms an immersion space LS1 for the liquid LQ so that the optical path K of the exposure light EL on the emission surface 12 side is filled with the liquid LQ. The immersion space LS1 is formed so that the optical path K between the emission surface 12 and the upper surface of the substrate P (object) is filled with the liquid LQ.

  The first member 21 forms an immersion space LS1 for the liquid LQ in at least a part of the optical path space SPK including the optical path K on the emission surface 12 side and the first space SP1 on the lower surface 23 side. The last optical element 13 and the first member 21 can hold the liquid LQ between the substrate P (object). The immersion space LS1 is formed by the liquid LQ held between the terminal optical element 13 and the first member 21 and the substrate P. The optical path of the exposure light EL between the last optical element 13 and the substrate P is maintained by holding the liquid LQ between the emission surface 12 and the lower surface 23 on the one side and the upper surface of the substrate P (object) on the other side. The immersion space LS1 is formed so that K is filled with the liquid LQ.

  In the exposure of the substrate P, the immersion space LS1 is formed so that the optical path K of the exposure light EL irradiated to the substrate P is filled with the liquid LQ. When the substrate P is irradiated with the exposure light EL, the immersion space LS1 is formed so that only a partial region of the surface of the substrate P including the projection region PR is covered with the liquid LQ.

  In the present embodiment, at least a part of the interface (meniscus, edge) LG1 of the liquid LQ in the immersion space LS1 is formed between the lower surface 23 and the upper surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method. The outside of the immersion space LS1 (the outside of the interface LG1) is a gas space.

  In the present embodiment, the first member 21 is an annular member. In the present embodiment, a part of the first member 21 is disposed around the last optical element 13. In addition, a part of the first member 21 is disposed around the optical path K of the exposure light EL between the terminal optical element 13 and the substrate P.

  The first member 21 may not be an annular member. For example, the first member 21 may be disposed in a part of the periphery of the terminal optical element 13 and the optical path K. The first member 21 may not be disposed at least at a part of the periphery of the last optical element 13. For example, the first member 21 may be disposed at least part of the periphery of the optical path K between the exit surface 12 and the substrate P and may not be disposed around the terminal optical element 13. The first member 21 may not be disposed at least at a part of the periphery of the optical path K between the emission surface 12 and the substrate P. For example, the first member 21 may be disposed at least at a part of the periphery of the terminal optical element 13 and may not be disposed around the optical path K between the exit surface 12 and the object.

  The first member 21 includes a supply port 31 for supplying the liquid LQ for forming the immersion space LS1, and a recovery port 32 for recovering at least a part of the liquid LQ in the immersion space LS1.

  FIG. 4 is a cross-sectional view of the first member 21 showing the vicinity of the supply port 31. The supply port 31 is disposed so as to face the optical path space SPK (optical path K). The supply port 31 is connected to a liquid supply device 34 that can supply the liquid LQ via a supply flow path 33 formed inside the first member 21. The supply port 31 supplies the liquid LQ from the liquid supply device 34 to the optical path space SPK (optical path K) on the exit surface 12 side.

  The first member 21 has a hole (opening) 20 that the injection surface 12 faces. The exposure light EL emitted from the emission surface 12 can pass through the opening 20 and irradiate the substrate P. At least a part of the liquid LQ supplied from the supply port 31 to the optical path space SPK is supplied onto the substrate P (on the object) through the opening 20. Further, at least a part of the liquid LQ supplied from the supply port 31 to the optical path space SPK is supplied to the first space SP1 through the opening 20. In the present embodiment, the liquid LQ is supplied from the opening 20 to the first space SP1 below the first member 21.

  The liquid supply device 34 includes a liquid adjustment system. The liquid supply device 34 includes, for example, a supply amount adjusting unit 34A that can adjust the supply amount (liquid supply amount per unit time) of the liquid LQ supplied from the supply port 31, and a temperature that adjusts the temperature of the supplied liquid LQ. It has the adjustment part 34B and the temperature sensor 34C which detects the temperature of the liquid LQ to supply. The supply amount adjustment unit 34A includes a mass flow controller. The temperature adjustment unit 34B includes a heating device that can heat the liquid LQ and a cooling device that can cool the liquid LQ.

  A plurality of supply ports 31 may be arranged around the optical path K. As shown in FIG. 2, in the present embodiment, the supply port 31 is arranged on one side (+ X side) and the other side (−X side) with respect to the optical path K. As shown in FIG. 2, in this embodiment, a liquid supply device 34 is connected to each of the supply port 31 on one side and the supply port 31 on the other side. The temperature of the liquid LQ supplied from the supply port 31 on one side and the temperature of the liquid LQ supplied from the supply port 31 on the other side may be substantially equal or different. The supply amount of the liquid LQ supplied from the supply port 31 on one side and the supply amount of the liquid LQ supplied from the supply port 31 on the other side may be substantially equal or different.

  FIG. 5 is a cross-sectional view of the first member 21 showing the vicinity of the recovery port 32. The collection port 32 is disposed so as to face the first space SP1. The substrate P (object) can face the recovery port 32. The recovery port 32 is connected to a liquid recovery device 36 that can recover (suction) the liquid LQ via a recovery flow path 35 formed inside the first member 21. The recovery port 32 can recover (suction) at least part of the liquid LQ in the first space SP1 between the first member 21 and the substrate P. The liquid LQ that has flowed into the recovery channel 35 from the recovery port 32 is recovered by the liquid recovery device 36.

  The liquid recovery device 36 can connect the recovery port 32 to the vacuum system BS. The liquid recovery device 36 includes a storage portion 36A that stores the liquid LQ recovered from the recovery port 32, and a pressure adjustment unit 36B that can adjust the suction force of the recovery port 32. The accommodating portion 36A includes a tank. The pressure adjustment unit 36B includes a pressure adjustment valve and the like.

  In the present embodiment, the first member 21 includes a porous member 37. The porous member 37 has a plurality of holes (openings or pores) through which the liquid LQ can flow. The porous member 37 includes, for example, a mesh filter. The mesh filter is a porous member in which a large number of small holes are formed in a mesh shape.

  In the present embodiment, the porous member 37 is a plate-like member. The porous member 37 has a plurality of holes formed so as to connect the lower surface 37B to which the substrate P can face, the upper surface 37A facing the recovery flow path 35 formed in the first member 21, and the upper surface 37A and the lower surface 37B. And have. In the present embodiment, the recovery port 32 includes a hole of the porous member 37. The liquid LQ recovered through the hole (recovery port 32) of the porous member 37 flows through the recovery channel 35.

  In the present embodiment, both the liquid LQ and the gas in the first space SP1 are recovered (sucked) from the porous member 37 (recovery port 32). Note that only the liquid LQ may be substantially recovered through the porous member 37, and the recovery of the gas may be limited. For example, the pressure (first space SP1) on the lower surface 37B side of the porous member 37 so that the liquid LQ on the substrate P (object) passes through the hole of the porous member 37 and flows into the recovery flow path 35 and does not pass the gas. ) And the pressure on the upper surface 37A side (pressure of the recovery flow path 35) may be adjusted. An example of a technique for recovering only the liquid through the porous member is disclosed in, for example, US Pat. No. 7,292,313.

  The porous member 37 may not be provided.

  In the present embodiment, the liquid LQ is recovered from the recovery port 32 in parallel with the supply of the liquid LQ from the supply port 31, so that the terminal optical element 13 and the first member 21 on one side and the other An immersion space LS1 for the liquid LQ is formed between the substrate P on the side. The immersion space LS1 is formed by the liquid LQ supplied from the supply port 31.

  The lower surface 23 is disposed around the opening 20. In the present embodiment, at least a part of the lower surface 23 is substantially parallel to the XY plane. Note that at least a part of the lower surface 23 may be inclined with respect to the XY plane, or may include a curved surface.

  The lower surface 23 includes a lower surface 23B that is disposed around the opening 20 and cannot collect the liquid LQ, and a lower surface 37B of the porous member 37 that is disposed around the lower surface 23B and can collect the liquid LQ. The liquid LQ cannot pass through the lower surface 23B. The lower surface 23B can hold the liquid LQ with the substrate P.

  In the present embodiment, the lower surface 37 </ b> B capable of collecting the liquid LQ is disposed at the peripheral edge of the lower surface 23. In the XY plane parallel to the lower surface 23 (the upper surface of the substrate P), the lower surface 37B is annular. The lower surface 23B that cannot recover the liquid LQ is disposed inside the lower surface 37B. In the present embodiment, the interface LG1 is disposed between the lower surface 37B and the upper surface of the substrate P.

  A plurality of lower surfaces 37B (collection ports 32) that can collect the liquid LQ may be arranged around the optical path K (opening 20).

  The second member 22 is a member different from the first member 21. The second member 22 is separated from the first member 21. The second member 22 is disposed at a part of the periphery of the first member 21.

  The second member 22 can form an immersion space LS2 for the liquid LQ in at least a part of the second space SP2 below the second member 22. The second space SP2 is a space on the lower surface 24 side. The immersion space LS2 is formed apart from the immersion space LS1. The immersion space LS2 is formed between the lower surface 24 and the upper surface of the substrate P (object). The second member 22 can hold the liquid LQ with the substrate P (object). The immersion space LS2 is formed by the liquid LQ that is held between the second member 22 and the substrate P. Liquid immersion space LS2 is formed by holding liquid LQ between lower surface 24 on one side and the upper surface of substrate P (object) on the other side.

  In the present embodiment, at least a part of the interface (meniscus, edge) LG2 of the liquid LQ in the immersion space LS2 is formed between the lower surface 24 and the upper surface of the substrate P. The outside of the immersion space LS2 (the outside of the interface LG2) is a gas space.

  The immersion space LS2 is smaller than the immersion space LS1. The size of the immersion space includes the volume of the liquid that forms the immersion space. The size of the immersion space includes the weight of the liquid that forms the immersion space. The size of the immersion space includes, for example, the area of the immersion space in a plane parallel to the surface (upper surface) of the substrate P (in the XY plane). The size of the immersion space includes, for example, the dimension of the immersion space in a predetermined direction (for example, the X-axis direction or the Y-axis direction) in a plane (in the XY plane) parallel to the surface (upper surface) of the substrate P. .

  That is, in the plane parallel to the surface (upper surface) of the substrate P (in the XY plane), the immersion space LS2 is smaller than the immersion space LS1. The volume (weight) of the liquid LQ that forms the immersion space LS2 is smaller than the volume (weight) of the liquid LQ that forms the immersion space LS1. The dimension of the immersion space LS2 in the XY plane is smaller than the dimension of the immersion space LS1.

  In the present embodiment, two second members 22 are arranged in the space around the first member 21. In the present embodiment, the second member 22 is disposed on one side (+ X side) and the other side (−X side) of the first member 21 with respect to the X-axis direction. The immersion space LS2 is formed on one side (+ X side) and the other side (−X side) of the immersion space LS1 with respect to the X-axis direction.

  In the following description, the second member 22 disposed on the + X side of the first member 21 is appropriately referred to as a second member 221, and the second member 22 disposed on the −X side of the first member 21 is appropriately included. , Referred to as a second member 222.

  The second member 22 may be disposed only on one side (+ X side) of the first member 21 or may be disposed only on the other side (−X side). The immersion space LS2 may be disposed only on one side (+ X side) of the immersion space LS1, or may be disposed only on the other side (−X side).

  In the present embodiment, at least a part of the lower surface 24 is substantially parallel to the XY plane. Note that at least a part of the lower surface 24 may be inclined with respect to the XY plane, or may include a curved surface.

  In the present embodiment, the position (height) of the lower surface 23 and the position (height) of the lower surface 24 in the Z-axis direction are substantially equal. That is, the distance between the lower surface 23 and the upper surface of the substrate P (object) and the distance between the lower surface 24 and the upper surface of the substrate P (object) are substantially equal.

  Note that the lower surface 24 may be disposed at a position lower than the lower surface 23. That is, the distance between the lower surface 24 and the upper surface of the substrate P (object) may be smaller than the distance between the lower surface 23 and the upper surface of the substrate P (object). Note that the lower surface 24 may be disposed at a position higher than the lower surface 23. That is, the distance between the lower surface 25 and the upper surface of the substrate P (object) may be larger than the distance between the lower surface 24 and the upper surface of the substrate P (object).

  FIG. 6 is a partial cross-sectional view showing an example of the second member 22. The second member 22 includes a supply port 41 for supplying the liquid LQ for forming the immersion space LS2, and a recovery port 42 for recovering at least a part of the liquid LQ in the immersion space LS2.

    In the present embodiment, the supply port 41 is disposed so as to face the second space SP <b> 2 below the second member 22. The substrate P (object) can face the supply port 41. The supply port 41 is disposed on at least a part of the lower surface 24 of the second member 22. The supply port 41 can supply the liquid LQ to the second space SP2.

    In the present embodiment, the recovery port 42 is disposed so as to face the second space SP <b> 2 below the second member 22. The substrate P (object) can face the recovery port 42. The collection port 42 is disposed on at least a part of the lower surface 24 of the second member 22. The recovery port 42 can recover at least a part of the liquid LQ in the second space SP2. The recovery port 42 can recover the gas in the second space SP2. In the present embodiment, the recovery port 42 recovers the liquid LQ together with the gas. At least a portion of the fluid (one or both of the liquid LQ and gas) in the second space SP2 is recovered from the recovery port 42.

  In the present embodiment, at least a part of the recovery port 42 is disposed between the first member 21 and the supply port 41. In addition, at least a part of the recovery port 42 is disposed outside the supply port 41 with respect to the optical path K (first member 21). In the present embodiment, the collection port 42 is disposed so as to surround the supply port 41. In a plane parallel to the lower surface 24 (in the XY plane), the recovery port 42 is annular.

  A plurality of recovery ports 42 may be arranged around the supply port 41. That is, the plurality of recovery ports 42 may be discretely arranged around the supply port 41.

  The supply port 41 is connected to a liquid supply device 44 that can supply the liquid LQ via a supply flow path 43 formed inside the second member 22. The supply port 41 supplies the liquid LQ from the liquid supply device 44 to the second space SP2.

  The liquid supply device 44 includes a liquid adjustment system. The liquid supply device 44 includes, for example, a supply amount adjusting unit 44A that can adjust the supply amount (liquid supply amount per unit time) of the liquid LQ supplied from the supply port 41, and a temperature that adjusts the temperature of the supplied liquid LQ. It has the adjustment part 44B and the temperature sensor 44C which detects the temperature of the liquid LQ to supply. The supply amount adjusting unit 44A includes a mass flow controller. The temperature adjustment unit 44B includes a heating device that can heat the liquid LQ and a cooling device that can cool the liquid LQ.

  As shown in FIG. 2, in the present embodiment, the liquid supply device 44 is connected to each of the second member 221 on one side and the second member 222 on the other side. In the present embodiment, the temperature of the liquid LQ supplied from the supply port 41 of the second member 221 on one side and the temperature of the liquid LQ supplied from the supply port 41 of the second member 222 on the other side are substantially equal. May be equal to or different from each other. The supply amount of the liquid LQ supplied from the supply port 41 of the second member 221 on one side is substantially equal to the supply amount of the liquid LQ supplied from the supply port 41 of the second member 22 on the other side. It may be different or different.

  The recovery port 42 is connected to a liquid recovery device 46 capable of recovering (suctioning) the liquid LQ (gas) via a recovery channel 45 formed inside the second member 22. The recovery port 42 can recover (suck) at least a part of the liquid LQ in the second space SP2 between the second member 22 and the substrate P. The liquid LQ recovered from the second space SP2 below the second member 22 flows through the recovery channel 45. The liquid LQ that has flowed into the recovery channel 45 from the recovery port 42 is recovered by the liquid recovery device 46.

  The liquid recovery device 46 can connect the recovery port 42 to the vacuum system BS. The liquid recovery device 46 includes a storage portion 46A that stores the liquid LQ recovered from the recovery port 42, and a pressure adjustment unit 46B that can adjust the suction force of the recovery port 42. The accommodating portion 46A includes a tank. The pressure adjustment unit 46B includes a pressure adjustment valve and the like.

  The suction force of the recovery port 42 depends on the difference between the pressure of the recovery channel 45 and the pressure of the second space SP2. The suction force of the recovery port 42 is determined by the pressure difference between the recovery flow path 45 and the second space SP2. In the present embodiment, the pressure adjusting unit 46B can adjust the pressure of the recovery flow path 45. The chamber device 11 can adjust the pressure in the second space SP2.

  As shown in FIG. 2, in the present embodiment, a liquid recovery device 46 is connected to each of the second member 221 on one side and the second member 222 on the other side. In the present embodiment, the recovery force (suction force) of the recovery port 41 of the second member 221 on one side and the recovery force (suction force) of the recovery port 42 of the second member 222 on the other side are substantially equal. It may be different or different.

  In the present embodiment, the liquid LQ is recovered from the recovery port 42 in parallel with the supply of the liquid LQ from the supply port 41, whereby the second member 22 on one side and the substrate P on the other side In the meantime, an immersion space LS2 is formed with the liquid LQ. The immersion space LS2 is formed by the liquid LQ supplied from the supply port 41.

  FIG. 7 is a plan view showing an example of the substrate stage 2 and the measurement stage 3. The substrate P is held by the first holding unit 14 so that the surface (upper surface) of the substrate P and the XY plane are substantially parallel. The upper surface of the cover member T1 and the upper surface of the scale member T2 are substantially parallel to the XY plane. In the present embodiment, the upper surface of the substrate P held by the first holding unit 14, the upper surface of the cover member T1, and the upper surface of the scale member T2 are disposed in substantially the same plane. Note that the upper surface of the substrate P held by the first holding unit 14 and one or both of the upper surface of the cover member T1 and the scale member T2 may not be arranged in the same plane. One or both of the upper surface of the cover member T1 and the upper surface of the scale member T2 may be inclined with respect to the upper surface of the substrate P, or one or both of the upper surface of the cover member T1 and the upper surface of the scale member T2 have a curved surface. May be included.

  The cover member T1 is disposed around the substrate P. The cover member T1 is adjacent to the substrate P through the gap Ga. A gap Ga is provided between the substrate P and the cover member T1.

  The scale member T2 is disposed around the cover member T1. The scale member T2 is adjacent to the cover member T1 through the gap Gb. A gap Gb is formed between the cover member T1 and the scale member T2.

  In the present embodiment, as disclosed in, for example, U.S. Patent Application Publication No. 2006/0023186 and U.S. Patent Application Publication No. 2007/0127006, it is formed below the terminal optical element 13 and the first member 21. The upper surface of the substrate stage 2 (the upper surface of the scale member T2) and the upper surface of the measurement stage 3 are brought close to or in contact with each other so that the immersion space LS1 moves from one to the other on the substrate stage 2 and the measurement stage 3. In this state, the substrate stage 2 and the measurement stage 3 are movable in the XY plane with respect to the terminal optical element 13 and the first member 21.

  In the following description, the substrate stage 2 and the measurement stage 3 are placed on the XY plane with respect to the last optical element 13 and the first member 21 in a state where the upper surface of the substrate stage 2 and the upper surface of the measurement stage 3 are close to or in contact with each other. The operation of moving in a synchronized manner is appropriately referred to as a scrum moving operation.

  In the present embodiment, as shown in FIG. 7, in the scram moving operation, the + Y side edge of the upper surface of the substrate stage 2 and the + Y side edge of the upper surface of the measurement stage 3 approach or come into contact with each other.

  By the scram moving operation, the immersion space LS1 formed below the last optical element 13 and the first member 21 moves from one side to the other on the substrate stage 2 and the measurement stage 3. The immersion space LS2 formed below the second member 22 moves from one to the other on the substrate stage 2 and the measurement stage 3.

  In the scram moving operation, the substrate stage 2 is adjacent to the measurement stage 3 through the gap Gc. In the scram moving operation, a gap Gc is provided between the substrate stage 2 and the measurement stage 3.

  The upper surface of the measurement stage 3 is arranged around the measurement member C. The upper surface of the measurement stage 3 is adjacent to the measurement member C through the gap Gd. A gap Gd is formed between the measurement stage 3 and the measurement member C.

  Next, a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  At a substrate exchange position away from the liquid immersion member 5, a process of loading (loading) the unexposed substrate P into the substrate stage 2 (first holding unit 14) is performed. When the substrate P is held by the first holding unit 14, after the substrate P is unloaded from the first holding unit 14, the substrate P before exposure is carried into the first holding unit 14 ( Loaded). In addition, the measurement stage 3 is disposed so as to face the last optical element 13 and the liquid immersion member 5 in at least a part of the period in which the substrate stage 2 is separated from the liquid immersion member 5. The control device 6 supplies the liquid LQ from the supply port 31 and recovers the liquid LQ from the recovery port 32 to form the immersion space LS1 on the measurement stage 3. Further, the control device 6 supplies the liquid LQ from the supply port 41 and recovers the liquid LQ from the recovery port 42 to form the immersion space LS <b> 2 on the measurement stage 3.

  At least a part of one or both of the upper surface of the measurement stage 3 and the upper surface of the measurement member C is in contact with the liquid LQ in the immersion space LS1. At least a part of one or both of the upper surface of the measurement stage 3 and the upper surface of the measurement member C is in contact with the liquid LQ in the immersion space LS2.

  After the substrate P before exposure is loaded onto the substrate stage 2 and the measurement process using the measurement stage 3 is completed, the control device 6 causes the last optical element 13 and the liquid immersion member 5 to face the substrate stage 2 (substrate P). Then, the substrate stage 2 is moved. The scram movement operation is executed so that the terminal optical element 13 and the liquid immersion member 5 and the measurement stage 3 are changed from the facing state to the state in which the terminal optical element 13 and the liquid immersion member 5 and the substrate stage 2 are facing each other. The The recovery of the liquid LQ from the recovery port 32 is performed in parallel with the supply of the liquid LQ from the supply port 31 with the last optical element 13 and the liquid immersion member 5 facing the substrate stage 2 (substrate P). Thus, an immersion space LS1 is formed between the last optical element 13 and the first member 21 and the substrate stage 2 (substrate P) so that the optical path K of the exposure light EL on the exit surface 12 side is filled with the liquid LQ. The Further, by collecting the liquid LQ from the collection port 42 in parallel with the supply of the liquid LQ from the supply port 41, the immersion space LS2 between the second member 22 and the substrate stage 2 (substrate P). Is formed.

  At least a part of one or both of the upper surface of the substrate stage 2 and the upper surface of the substrate P is in contact with the liquid LQ in the immersion space LS1. Further, at least a part of one or both of the upper surface of the substrate stage 2 and the upper surface of the substrate P is in contact with the liquid LQ in the immersion space LS2. The upper surface of the substrate stage 2 includes the upper surface of the scale member T1 and the upper surface of the cover member T2.

  The control device 6 starts the exposure process for the substrate P. The control device 6 emits the exposure light EL from the illumination system IL in a state where the immersion space LS1 is formed on the substrate P and the immersion space LS2 is formed on at least one of the substrate P and the substrate stage 2. To do. The illumination system IL illuminates the mask M with the exposure light EL. The exposure light EL from the mask M is irradiated onto the substrate P through the projection optical system PL and the liquid LQ in the immersion space LS1 between the emission surface 12 and the substrate P. Accordingly, the substrate P is exposed with the exposure light EL emitted from the emission surface 12 through the liquid LQ in the immersion space LS1, and the pattern image of the mask M is projected onto the substrate P.

    The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 6 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS1 on the substrate P while moving the mask M in the Y-axis direction.

  In a state where the immersion space LS1 is formed, the substrate P (object) moves in the XY plane, whereby a part of the liquid LQ in the immersion space LS1 is separated from the immersion space LS1, and the first space. There is a possibility of movement (outflow) to the outside of SP1. In the present embodiment, the immersion space LS2 is formed in a part of the periphery of the first space SP1. Therefore, the liquid LQ that has moved to the outside of the first space SP1 is captured in the immersion space LS2. The liquid LQ captured in the immersion space LS2 is recovered from the recovery port 42 together with the liquid LQ in the immersion space LS2.

  In the present embodiment, the immersion space LS2 is smaller than the immersion space LS1. Therefore, when the substrate P (object) moves in a state where the immersion spaces LS1 and LS2 are formed, a part of the liquid LQ in the immersion space LS2 is separated from the immersion space LS2 and outside the second space SP2. (Moving out) is suppressed. In other words, since the immersion space LS2 is smaller than the immersion space LS1, a part of the liquid LQ in the immersion space LS2 flows out from the second space SP2, and a part of the liquid LQ in the immersion space LS1 It is suppressed from flowing out of the first space SP1.

  FIG. 8 is a diagram illustrating an example of the substrate P held on the substrate stage 2. In the present embodiment, a plurality of shot areas S, which are exposure target areas, are arranged in a matrix on the substrate P. The control device 6 sequentially exposes the plurality of shot regions S of the substrate P held on the substrate stage 2 (first holding unit 14) with the exposure light EL through the liquid LQ in the immersion space LS1. Each of the plurality of shot areas S is exposed while moving the substrate P in the Y-axis direction with respect to the exposure light EL (projection area PR).

  For example, in order to expose the first shot region S of the substrate P, the control device 6 causes the substrate P (first shot region S) to be projected onto the projection optical system PL in the state where the immersion spaces LS1 and LS2 are formed. While moving in the Y-axis direction with respect to the projection region PR, in synchronization with the movement of the substrate P in the Y-axis direction, while moving the mask M in the Y-axis direction with respect to the illumination region IR of the illumination system IL, The first shot region S is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS1 on the substrate P. As a result, an image of the pattern of the mask M is projected onto the first shot area S of the substrate P, and the first shot area S is exposed with the exposure light EL emitted from the emission surface 12. After the exposure of the first shot region S is completed, the control device 6 starts the exposure of the next second shot region S, and the substrate P in a state where the immersion spaces LS1 and LS2 are formed. Is moved in a direction intersecting the X axis in the XY plane (for example, the X axis direction or a direction inclined with respect to the X axis and Y axis directions in the XY plane), and the second shot area S is moved to the exposure start position. Move to. Thereafter, the control device 6 starts exposure of the second shot region S.

  The control device 6 performs shots on the position (projection region PR) irradiated with the exposure light EL from the emission surface 12 in the state where the immersion spaces LS1 and LS2 are formed on the substrate P (substrate stage 2). The operation of exposing the shot area while moving the area in the Y-axis direction, and the next shot in the state where the immersion spaces LS1 and LS2 are formed on the substrate P (substrate stage 2) after the exposure of the shot area The substrate P is placed in a direction crossing the Y-axis direction in the XY plane (X-axis direction, a direction inclined with respect to the X-axis and Y-axis directions in the XY plane, etc.) so that the region is arranged at the exposure start position. The plurality of shot areas of the substrate P are sequentially exposed by repeating the moving operation.

  In the following description, in order to expose the shot area, the position (in which the exposure light EL from the emission surface 12 is irradiated) in the state where the immersion spaces LS1 and LS2 are formed on the substrate P (substrate stage 2) ( The operation of moving the substrate P (shot region) in the Y-axis direction with respect to the projection region PR) is appropriately referred to as a scan movement operation. In addition, after the exposure of a certain shot area, in order to expose the next shot area, the next shot area is at the exposure start position in the state where the immersion spaces LS1 and LS2 are formed on the substrate P (substrate stage 2). The operation of moving the substrate P in the direction crossing the Y-axis direction in the XY plane as appropriate is referred to as a step movement operation as appropriate.

  The plurality of shot regions S of the substrate P are sequentially exposed by repeating the scan movement operation and the step movement operation.

  The scan movement operation is a constant speed movement exclusively in the Y-axis direction. The step movement operation includes non-constant speed movement (acceleration / deceleration movement). For example, the step movement operation between two shot areas adjacent in the X-axis direction includes non-constant speed movement (acceleration / deceleration movement) in the Y-axis direction and non-constant speed movement (acceleration / deceleration movement) in the X-axis direction.

  In the present embodiment, the control device 6 moves the substrate stage 2 so that the projection region PR of the projection optical system PL and the substrate P relatively move along a movement locus indicated by an arrow Sr in FIG. The projection area PR is irradiated with the exposure light EL while moving, and the plurality of shot areas S of the substrate P are sequentially exposed with the exposure light EL via the liquid LQ.

  After the exposure of the plurality of shot regions S of the substrate P is completed, the substrate stage 2 holding the substrate P after the exposure moves to the substrate exchange position. The measurement stage 3 is disposed so as to face the terminal optical element 13 and the liquid immersion member 5. The scram moving operation is executed so that the terminal optical element 13 and the liquid immersion member 5 and the substrate stage 2 are changed from the facing state to the state in which the terminal optical element 13 and the liquid immersion member 5 and the measurement stage 3 are facing each other. The

  Thereafter, the same processing is repeated to sequentially expose the plurality of substrates P.

  In at least a part of the exposure time (including the scan movement operation and the step movement operation), the scram movement operation, and the measurement process, the immersion spaces LS1 and LS2 are on the upper surface of the substrate P (only the upper surface of the substrate P). In some cases). The immersion spaces LS1 and LS2 may be formed on the gap Ga between the substrate P and the cover member T1 (so as to straddle the substrate P and the cover member T1). Further, the immersion spaces LS1 and LS2 may be formed on the upper surface of the cover member T1 (only on the upper surface of the cover member T1). Moreover, the immersion spaces LS1 and LS2 may be formed on the gap Gb between the cover member T1 and the scale member T2 (so as to straddle the cover member T1 and the scale member T2). Further, the immersion spaces LS1 and LS2 may be formed on the upper surface of the scale member T2 (only on the upper surface of the scale member T2). Further, the immersion spaces LS1 and LS2 may be formed on the gap Gc between the substrate stage 2 and the measurement stage 3 (so as to straddle the substrate stage 2 and the measurement stage 3). The immersion spaces LS1 and LS2 may be formed on the upper surface of the measurement stage 3 (only on the upper surface of the measurement stage 3). The immersion spaces LS1 and LS2 may be formed on the upper surface of the measurement member C (only on the upper surface of the measurement member C). Moreover, the immersion spaces LS1 and LS2 may be formed on the gap Gd between the measurement stage 3 and the measurement member C (so as to straddle the measurement stage 3 and the measurement member C).

  In the following description, the gaps Ga, Gb, Gc, and Gd are collectively referred to as a gap G as appropriate. One of the two objects forming the gap G is appropriately referred to as a first object B1, and the other object is appropriately referred to as a second object B2. The second object B2 is adjacent to the first object B1 through the gap G. The gap G is formed between the first object B1 and the second object B2.

  In the present embodiment, when the first object B1 is the substrate P (or the cover member T1), the second object B2 is the cover member T1 (or the substrate P). When the first object B1 is the cover member T1 (or scale member T2), the second object B2 is the scale member T2 (or cover member T1). When the first object B1 is the substrate stage 2 (or measurement stage 3), the second object B2 is the measurement stage 3 (or substrate stage 2). When the first object B1 is the measurement member C (or measurement stage 3), the second object B2 is the measurement stage 3 (or measurement member C).

  In the following description, the cover member T1 and the scale member T2 are appropriately referred to as an upper surface member T. The gap Ga is formed between the substrate P and the upper surface member T.

  In the present embodiment, the immersion space LS <b> 2 can be formed between the first object B <b> 1 and the second member 22. Further, the immersion space LS2 can be formed between the second object B2 and the second member 22 adjacent to the first object B1 via the gap G. In the present embodiment, the size of the gap G can be changed.

  FIG. 9 shows an example of a state in which the dimension of the gap Ga is changed in the gap G (Ga, Gb, Gc, Gd). As shown in FIGS. 9A, 9B, and 9C, in the present embodiment, the upper surface member T is movable in a direction that intersects the optical axis of the terminal optical element 13. That is, the upper surface member T is movable in the XY plane. As the upper surface member T moves in the XY plane, the dimension of the gap Ga between the substrate P and the upper surface member T changes. The upper surface member T moves in the XY plane so as not to contact the substrate P.

  In the present embodiment, the substrate stage 2 includes a driving device 50 that can move the upper surface member T in the XY plane. FIG. 10 shows an example of the driving device 50. The driving device 50 includes a support member 51 that supports the lower surface of the upper surface member T, a first actuator 50X that can move the support member 51 in the X-axis direction, and a second actuator 50Y that can move the support member 51 in the Y-axis direction. And a third actuator 50Z that can move the support member 51 in the Z-axis direction. The first, second, and third actuators 50X, 50Y, and 50Z include, for example, piezo elements.

  In the present embodiment, the drive device 50 includes a plurality of support members 51 so as to be connected to each of a plurality of portions (for example, three locations) on the lower surface of the upper surface member T. The first, second, and third actuators 50X, 50Y, and 50Z are connected to the plurality of support members 51, respectively. The control device 6 can move the upper surface member T at least in the XY plane by controlling the first, second, and third actuators 50X, 50Y, and 50Z. In the present embodiment, the driving device 50 can move the upper surface member T in six directions of X axis, Y axis, Z axis, θX, θY, and θZ.

  11 and 12 show an example of the operation of the first object B1 and the second object B2. 11 and 12 show an example in which the first object B1 is the upper surface member T and the second object B2 is the substrate P. FIG.

  The first object B1 and the second object B2 are in the XY plane with respect to the second member 22 such that the immersion space LS2 moves from the first object B1 (upper surface member T) to the second object B2 (substrate P). During at least a part of the movement period, the control device 6 controls the driving device 50 to change the size of the gap G (gap Ga).

  In the present embodiment, the first object B1 and the second object are in a first state in which the immersion space LS2 is not formed on the gap G and in a second state in which the immersion space LS2 is formed on the gap G. The dimension of the gap G between the object B2 is different.

  For example, as shown in FIG. 11, in the first state where the entire immersion space LS2 is formed on the first object B1 and the immersion space LS2 is not formed on the gap G, the dimension of the gap G is The first value g1.

  As shown in FIG. 12, in the second state in which the immersion space LS2 is formed on the gap G, the dimension of the gap G is the second value g2. The dimension g2 of the gap G in the second state is smaller than the dimension g1 of the gap G in the first state.

  In the example shown in FIGS. 11 and 12, the first state in which the immersion space LS2 is not formed on the gap G is the state in which the entire immersion space LS2 is formed on the first object B1. It was decided. The first state includes a state where there is no liquid LQ in the immersion space LS2 in the second space SP2. The first state includes a state in which the immersion space LS2 is formed on the object that does not form the gap G. For example, when the gap G (gap Ga) is formed between the cover member T1 and the substrate P, in the first state, the immersion space LS2 is formed on the scale member T2 (or measurement stage 3). Includes state.

  In the present embodiment, the control device 6 reduces the size of the gap G when the immersion space LS2 passes over the gap G. When the immersion space LS2 passes over the gap G and the immersion space LS2 is disposed on the second object B2, the control device 6 may increase the size of the gap G. For example, the dimension of the gap G may be changed from the second value g2 to the first value g1.

  Note that the first object B1 and the second object B2 are moved relative to the second member 22 so that the immersion space LS2 moves from the second object B2 (substrate P) to the first object B1 (upper surface member T). The control device 6 may control the driving device 50 to change the size of the gap G (gap Ga) even during at least a part of the period of movement in the XY plane.

  The case where the first object B1 is the upper surface member T and the second object B2 is the substrate P has been described as an example with reference to FIGS. As described above, the first object B1 and the second object B2 may be the cover member T1 and the scale member T2, the substrate stage 2 and the measurement stage 3, or the measurement stage 3 and the measurement member C.

  In the present embodiment, the size of the gap G in the second state where the immersion space LS2 is formed on the gap G is the size of the gap G in the first state where the immersion space LS2 is not formed on the gap G. Therefore, the liquid LQ in the immersion space LS2 above the gap G is prevented from flowing into the space below the gap G. In addition, it is possible to prevent the liquid LQ in the immersion space LS2 from being caught by the edge portion that forms the gap G and the phenomenon that the immersion space LS2 is extended (so-called pinning phenomenon). Therefore, the liquid LQ in the immersion space LS2 can pass through the gap G smoothly.

  The dimension of the gap G in the second state where the immersion space LS2 is formed on the gap G is made larger than the dimension of the gap G in the first state where the immersion space LS2 is not formed on the gap G. May be. As a result, the liquid LQ in the immersion space LS2 above the gap G flows smoothly into the space below the gap G. For example, when the liquid LQ flows in the space below the gap G, the member present in the space below the gap G and the liquid LQ come into contact with each other. Thereby, the temperature of the member is adjusted with the liquid LQ. Further, when the member comes into contact with the liquid LQ, the member is cleaned with the liquid LQ.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  13 and 14 show an example of the operation of the first object B1 and the second object B2. 13 and 14 show an example in which the first object B1 is the upper surface member T and the second object B2 is the substrate P. FIG.

  The first object B1 and the second object B2 are in the XY plane with respect to the second member 22 such that the immersion space LS2 moves from the first object B1 (upper surface member T) to the second object B2 (substrate P). The control device 6 controls the driving device 50 to change the size of the gap G (gap Ga) based on the moving conditions of the first object B1 and the second object B2 when moving inside.

  The movement condition includes a movement speed. For example, the first object B1 and the second object B2 are in a predetermined direction in the XY plane so that the immersion space LS2 passes over the gap G (gap Ga) (−X direction in the examples shown in FIGS. 13 and 14). When the first object B1 and the second object B2 move at a second speed V2 that is slower than the first speed V1 in a predetermined direction. The dimension of the gap G between B2 is different.

  For example, as shown in FIG. 13, the dimension of the gap G when the first object B1 and the second object B2 move at the first speed V1 is a third value g3.

  As shown in FIG. 14, the dimension of the gap G when the first object B1 and the second object B2 move at the second speed V2 that is slower than the first speed V1 is the fourth value g4. The dimension g3 of the gap G at the first speed V1 is smaller than the dimension g4 of the gap G at the second speed V2.

  In the present embodiment, the size of the gap G when the first object B1 and the second object B2 move at the first speed V1 is the same as that when the first object B1 and the second object B2 move at the second speed V2. Since it is smaller than the dimension of the gap G, the liquid LQ in the immersion space LS2 on the gap G is prevented from flowing into the space below the gap G. That is, when the first and second objects B1 and B2 move at high speed, the liquid LQ is suppressed from flowing into the space below the gap G by reducing the size of the gap G. In addition, it is possible to prevent the liquid LQ in the immersion space LS2 from being caught by the edge portion that forms the gap G and the phenomenon that the immersion space LS2 is extended (so-called pinning phenomenon). Therefore, the liquid LQ in the immersion space LS2 can pass through the gap G smoothly.

  The dimension of the gap G when the first object B1 and the second object B2 move at the first speed V1, and the dimension of the gap G when the first object B1 and the second object B2 move at the second speed V2. May be larger. As a result, the liquid LQ in the immersion space LS2 above the gap G flows smoothly into the space below the gap G. For example, when the liquid LQ flows in the space below the gap G, the member present in the space below the gap G and the liquid LQ come into contact with each other. Thereby, the temperature of the member is adjusted with the liquid LQ. Further, when the member comes into contact with the liquid LQ, the member is cleaned with the liquid LQ.

  Note that the above-described movement condition may include acceleration. That is, the dimension of the gap G (gap Ga) may be changed based on the acceleration of the first object B1 and the second object B2.

  For example, the first object B1 and the second object B2 are in a predetermined direction in the XY plane so that the immersion space LS2 passes over the gap G (gap Ga) (−X direction in the examples shown in FIGS. 13 and 14). The first object B1 and the second object when the first object B1 and the second object B2 move at a second acceleration Ac2 smaller than the second acceleration Ac1 in a predetermined direction. The dimension of the gap G between B2 may be different.

  As shown in FIG. 13, the dimension of the gap G when the first object B1 and the second object B2 move at the first acceleration Ac1 may be the third value g3.

  As shown in FIG. 14, a fourth dimension in which the dimension of the gap G when the first object B1 and the second object B2 move at the second acceleration Ac2 smaller than the first acceleration Ac1 is larger than the third value g3. The value is g4.

  The size of the gap G when the first object B1 and the second object B2 move at the first acceleration Ac1 is larger than the size of the gap G when the first object B1 and the second object B2 move at the second acceleration Ac2. Since it is small, the liquid LQ in the immersion space LS2 above the gap G is suppressed from flowing into the space below the gap G. That is, when the first and second objects B1 and B2 move at a high acceleration, the liquid LQ is suppressed from flowing into the space below the gap G by reducing the size of the gap G. In addition, it is possible to prevent the liquid LQ in the immersion space LS2 from being caught by the edge portion that forms the gap G and the phenomenon that the immersion space LS2 is extended (so-called pinning phenomenon). Therefore, the liquid LQ in the immersion space LS2 can pass through the gap G smoothly.

  The size of the gap G when the first object B1 and the second object B2 move at the first acceleration Ac1, and the size of the gap G when the first object B1 and the second object B2 move at the second acceleration Ac2. May be larger. As a result, the liquid LQ in the immersion space LS2 above the gap G flows smoothly into the space below the gap G. For example, when the liquid LQ flows in the space below the gap G, the member present in the space below the gap G and the liquid LQ come into contact with each other. Thereby, the temperature of the member is adjusted with the liquid LQ. Further, when the member comes into contact with the liquid LQ, the member is cleaned with the liquid LQ.

  Note that the first object B1 and the second object B2 are moved relative to the second member 22 so that the immersion space LS2 moves from the second object B2 (substrate P) to the first object B1 (upper surface member T). The control device 6 may control the driving device 50 to change the size of the gap G (gap Ga) even during at least a part of the period of movement in the XY plane.

  The case where the first object B1 is the upper surface member T and the second object B2 is the substrate P has been described as an example with reference to FIGS. As described above, the first object B1 and the second object B2 may be the cover member T1 and the scale member T2, the substrate stage 2 and the measurement stage 3, or the measurement stage 3 and the measurement member C.

  In addition, this embodiment and the above-mentioned 1st Embodiment can be combined. For example, the dimension of the gap G is changed depending on whether or not the immersion space LS2 is formed on the gap G, and the dimension of the gap G is determined based on the moving conditions of the first object B1 and the second object B2. May be changed.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  15 and 16 show an example of the operation of the first object B1 and the second object B2. 15 and 16 show an example in which the first object B1 is the upper surface member T and the second object B2 is the substrate P.

  In the present embodiment, the gap G (in the state where the immersion space LS1 is formed on the gap G (gap Ga) and the state where the immersion space LS2 is formed on the gap G (gap Ga). The dimensions of the gap Ga) are different.

  For example, the immersion space LS1 moves from the first object B1 (upper surface member T) to the second object B2 (substrate P), and the immersion space LS2 moves from the first object B1 (upper surface member T) to the second object. In a period in which the first object B1 and the second object B2 move in the XY plane with respect to the first and second members 21 and 22 so as to move onto B2 (substrate P), the liquid immersion space LS1 has a gap G. The dimension of the gap G (gap Ga) differs between the state formed on (gap Ga) and the state where the immersion space LS2 is formed on the gap G (gap Ga).

  For example, as shown in FIG. 15, the dimension of the gap G when the immersion space LS1 is formed on the gap G is the fifth value g5.

  As shown in FIG. 16, the dimension of the gap G when the immersion space LS2 is formed on the gap G is a sixth value g6. The dimension g6 of the gap G when the immersion space LS2 is formed on the gap G is smaller than the dimension g5 of the gap G when the immersion space LS1 is formed on the gap G.

  The dimension g5 of the gap G when the immersion space LS1 is formed on the gap G is different from the dimension g7 of the gap G when the immersion space LS1 is not formed on the gap G. The state in which the immersion space LS1 is not formed on the gap G is the immersion space in the period in which the first object B1 and the second object B2 move in the XY plane with respect to the first and second members 21 and 22. This includes a state in which the immersion space LS2 is disposed on the gap G after LS1 passes over the gap G.

  That is, the state changes from the state where the immersion space LS1 is formed on the gap G to the state where the immersion space LS2 is formed on the gap G through the state where the immersion spaces LS1, LS2 are not formed on the gap G. Thus, when the first object B1 and the second object B2 move in the XY plane with respect to the first and second members 21 and 22, the dimension of the gap G has the fifth value g5 and the seventh value g7. , And the sixth value g6. Of the dimensions g5, g6, and g7, the dimension g5 is the largest, the dimension g7 is the second largest after the dimension g5, and the dimension g6 is the smallest. The dimension g5 may be the largest, the dimension g6 may be the second largest after the dimension g5, and the dimension g7 may be the smallest. The dimension g7 may be the largest, the dimension g5 may be the second largest after the dimension g7, and the dimension g6 may be the smallest.

  In the present embodiment, the dimension g6 of the gap G when the immersion space LS2 is formed on the gap G is the dimension g5 of the gap G when the immersion space LS1 is formed on the gap G. Therefore, the liquid LQ in the immersion space LS2 above the gap G is prevented from flowing into the space below the gap G. In addition, it is possible to prevent the liquid LQ in the immersion space LS2 from being caught by the edge portion that forms the gap G and the phenomenon that the immersion space LS2 is extended (so-called pinning phenomenon). Therefore, the liquid LQ in the immersion space LS2 can pass through the gap G smoothly.

  The immersion space LS1 moves from the second object B2 (substrate P) to the first object B1 (upper surface member T), and the immersion space LS2 moves from the second object B2 (substrate P) to the first object B1. In the period in which the first object B1 and the second object B2 move in the XY plane with respect to the first and second members 21 and 22 so as to move upward (the upper surface member T), the immersion space LS1 has the gap G. The dimension of the gap G (gap Ga) may be different between the state formed on (gap Ga) and the state where the immersion space LS2 is formed on the gap G (gap Ga).

  Note that the dimension of the gap G when the immersion space LS2 is formed on the gap G may be larger than the dimension of the gap G when the immersion space LS1 is formed on the gap G. .

  The case where the first object B1 is the upper surface member T and the second object B2 is the substrate P has been described as an example with reference to FIGS. As described above, the first object B1 and the second object B2 may be the cover member T1 and the scale member T2, the substrate stage 2 and the measurement stage 3, or the measurement stage 3 and the measurement member C.

  In each of the above-described embodiments, when one of the first object B1 and the second object B2 is the substrate P, the substrate P is moved without moving the upper surface member T, and the gap G (gap Ga) is increased. The size may be changed, or both the upper surface member T and the substrate P may be moved to change the size of the gap G (gap Ga).

  Note that this embodiment can be combined with the first and second embodiments described above. For example, the dimension of the gap G is changed depending on whether or not the immersion space LS2 is formed on the gap G, and the dimension of the gap G is determined based on the moving conditions of the first object B1 and the second object B2. And the dimension of the gap G may be changed between when the immersion space LS1 is formed on the gap G and when the immersion space LS2 is formed.

<Fourth embodiment>
Next, a fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  17 and 18 show an example of the operation of the second member 22. In the present embodiment, at least one of the first object B1 and the second object B2 in the state where the immersion space LS2 is formed on the gap G and the state where the immersion space LS2 is not formed on the gap G. The distance between one side and the second member 22 in the direction parallel to the optical axis of the last optical element 13 (Z-axis direction) is different.

  For example, as shown in FIG. 17, the distance in the Z-axis direction between the first object B1 (second object B2) and the second member 22 in a state where the immersion space LS2 is not formed on the gap G is , Value w1.

  As shown in FIG. 18, the distance in the Z-axis direction between the first object B1 (second object B2) and the second member 22 in a state where the immersion space LS2 is formed on the gap G is a value. w2. The distance w2 in the state where the immersion space LS2 is formed on the gap G is smaller than the distance w1 in the state where the immersion space LS2 is not formed on the gap G.

  In the present embodiment, the second member 22 is movable in the Z-axis direction. In the present embodiment, a driving device 52 that can move the second member 22 at least in the Z-axis direction is provided. The driving device 52 is capable of moving the second member 22 in six directions of X axis, Y axis, Z axis, θX, θY, and θZ.

  In the present embodiment, the distance w2 when the immersion space LS2 is formed on the gap G is smaller than the distance w1 when the immersion space LS1 is not formed on the gap G. Liquid LQ leakage from the immersion space LS2 is suppressed, and droplets of the liquid LQ and the like are suppressed from remaining on the first object B1 or the second object B2.

  Note that the distance in the Z-axis direction between the second member 22 and the first object B1 (second object B2) in a state where the immersion space LS2 is formed on the gap G is such that the immersion space LS2 is on the gap G. It may be larger than the distance in the Z-axis direction between the second member 22 and the first object B1 (second object B2) in a state where the second member 22 is not formed.

  The immersion space LS1 moves from the second object B2 (substrate P) to the first object B1 (upper surface member T), and the immersion space LS2 moves from the second object B2 (substrate P) to the first object B1. In the period in which the first object B1 and the second object B2 move in the XY plane with respect to the first and second members 21 and 22 so as to move upward (the upper surface member T), the immersion space LS1 has the gap G. The dimension of the gap G (gap Ga) may be different between the state formed on (gap Ga) and the state where the immersion space LS2 is formed on the gap G (gap Ga).

  In addition, this embodiment and the above-mentioned 1st-3rd embodiment can be combined suitably. For example, when the immersion space LS2 is formed on the gap G by combining the first embodiment and the fourth embodiment, the size of the gap G is changed, and the second member 22 and the first member in the Z-axis direction are changed. The distance from at least one of the object B1 and the second object B2 may be changed.

  Further, for example, by combining the second embodiment and the fourth embodiment, the size of the gap G is changed based on the moving conditions of the first object B1 and the second object B2, and the immersion space is placed on the gap G. In a state where LS2 is formed, the distance between the second member 22 and at least one of the first object B1 and the second object B2 in the Z-axis direction may be changed.

  In addition, for example, by combining the third embodiment and the fourth embodiment, the dimension of the gap G is changed when the immersion space LS1 is formed on the gap G and when the immersion space LS2 is formed. In addition, in the state where the immersion space LS2 is formed on the gap G, the distance between the second member 22 and at least one of the first object B1 and the second object B2 in the Z-axis direction may be changed.

  Of course, all of the first to fourth embodiments can be combined, or a part of the first to fourth embodiments can be combined.

<Fifth Embodiment>
Next, a fifth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 19 shows an example of the substrate stage 250 according to the present embodiment. The substrate stage 250 includes a first holding unit 14 that holds the substrate P in a releasable manner, and a second holding unit 15 that holds the upper surface member T in a releasable manner.

  In the present embodiment, the second holding unit 15 is movable in the XY plane on the base member 250 </ b> B of the substrate stage 250. The substrate stage 250 includes a driving device 53 that can move the second holding unit 15 relative to the base member 250B. The driving device 53 includes, for example, a boil coil motor, and can move the second holding unit 15 in six directions of X axis, Y axis, Z axis, θX, θY, and θZ. As the second holding portion 15 moves, the upper surface member T held by the second holding portion 15 also moves in six directions of X axis, Y axis, Z axis, θX, θY, and θZ.

  The control device 6 controls the driving device 53 to move the upper surface member T held by the second holding unit 15 in the XY plane, thereby causing a gap Ga (gap G) between the upper surface member T and the substrate P. The dimensions can be changed.

  The first holding part 14 has a peripheral wall part having an upper surface that can be opposed to the lower surface of the substrate P, a plurality of pin-like support parts arranged inside the peripheral wall part, and a suction port arranged inside the peripheral wall part. Have The first holding unit 14 includes a so-called pin chuck mechanism (vacuum chuck mechanism).

  The second holding portion 15 includes a peripheral wall portion having an upper surface that can be opposed to the lower surface of the upper surface member T, a plurality of pin-shaped support portions arranged inside the peripheral wall portion, and a suction port arranged inside the peripheral wall portion. And have. The second holding unit 15 includes a so-called pin chuck mechanism (vacuum chuck mechanism).

  In the present embodiment, the substrate stage 250 has a suction port 54 that sucks the fluid in the lower space US of the gap G. In the present embodiment, the lower space US includes a space surrounded by the peripheral wall portion of the first holding portion 14, the peripheral wall portion of the second holding portion 15, and the base member 250 </ b> B of the substrate stage 250. The suction port 54 is connected to a suction device 56 including a vacuum system via a suction channel 55. The suction port 54 can suck the fluid (one or both of liquid and gas) in the lower space US.

  20 and 21 schematically show an example of the operation of the supply port 41, the recovery port 42, and the suction port 54 of the second member 22. In the present embodiment, the suction conditions from the suction port 54 are different between the state in which the immersion space LS2 is formed on the gap G and the state in which the immersion space LS2 is not formed on the gap G.

  The suction condition includes the exhaust amount from the suction port 54. The suction condition includes the suction force of the suction port 54. The suction force of the suction port 54 depends on the difference between the pressure of the suction channel 55 and the pressure of the lower space US. The suction force of the suction port 54 is determined by the pressure difference between the suction channel 55 and the lower space US. In the present embodiment, the pressure adjusting unit included in the suction device 56 can adjust the pressure of the suction channel 55. The lower space US is connected to the second space SP2 through the gap G. The chamber device 11 can adjust the pressure in the second space SP2.

  For example, as shown in FIG. 20, in the state where the immersion space LS2 is not formed on the gap G, the suction port 54 has a first suction force (first exhaust amount) F1 and fluid in the lower space US. Aspirate.

  As shown in FIG. 21, in the state where the immersion space LS2 is formed on the gap G, the suction port 54 sucks the fluid in the lower space US with the second suction force (second exhaust amount) F2. To do. The second suction force F2 is stronger than the first suction force F1. The second displacement is larger than the first displacement.

  In the present embodiment, the suction force of the suction port 54 in a state where the immersion space LS2 is formed on the gap G is the suction force of the suction port 54 in a state where the immersion space LS2 is not formed on the gap G. Stronger than suction. Thereby, even if the immersion space LS2 formed on the gap G moves away from the gap G, the liquid LQ is suppressed from remaining between the first object B1 and the second object B2. Moreover, the outflow of the liquid LQ is also suppressed.

  Note that the suction force of the suction port 54 when the immersion space LS2 is formed on the gap G is greater than the suction force of the suction port 54 when the immersion space LS2 is not formed on the gap G. It may be weak. Note that the exhaust amount from the suction port 54 when the immersion space LS2 is formed on the gap G is the exhaust amount from the suction port 54 when the immersion space LS2 is not formed on the gap G. May be smaller.

  Note that the suction condition may include a suction time from the suction port 54. For example, the suction time from the suction port 54 when the liquid immersion space LS2 is formed on the gap G, and the suction time from the suction port 54 when the liquid immersion space LS2 is not formed on the gap G And may be different. Also, a plurality of suction ports 54 are provided in the lower space US, and the fluid is sucked from the first number of suction ports 54 among the plurality of suction ports 54 in a state where the immersion space LS2 is formed on the gap G, In a state where the immersion space LS2 is not formed on the gap G, fluid may be sucked from the second number of suction ports 54 different from the first number among the plurality of suction ports 54.

  The supply conditions of the liquid LQ from the supply port 41 of the second member 22 in a state where the immersion space LS2 is formed on the gap G and in a state where the immersion space LS2 is not formed on the gap G. May be different.

  The supply condition of the liquid LQ from the supply port 41 includes the supply amount of the liquid LQ from the supply port 41. In the present embodiment, the supply amount of the liquid LQ from the supply port 41 in a state where the immersion space LS2 is formed on the gap G is the same as that in the state where the immersion space LS2 is not formed on the gap G. Less than the supply amount of the liquid LQ from the supply port 41.

  The supply amount of the liquid LQ from the supply port 41 in a state where the immersion space LS2 is formed on the gap G is from the supply port 41 in a state where the immersion space LS2 is not formed on the gap G. It may be larger than the supply amount of the liquid LQ.

  The supply condition of the liquid LQ from the supply port 41 may include the supply time of the liquid LQ from the supply port 41. The supply time of the liquid LQ from the supply port 41 in the state where the immersion space LS2 is formed on the gap G is the liquid from the supply port 41 in the state where the immersion space LS2 is not formed on the gap G. It may be different from the LQ supply time.

  When a plurality of supply ports 41 are provided, the supply condition of the liquid LQ from the supply port 41 may include one or both of the position and number of the supply ports 41 that supply the liquid LQ. In a state where the immersion space LS2 is formed on the gap G, the liquid LQ is supplied from the first number of supply ports 41 among the plurality of supply ports 41, and the immersion space LS2 is formed on the gap G. In this state, the liquid LQ may be supplied from a second number of supply ports 41 different from the first number among the plurality of supply ports 41.

  Note that the fluid (liquid and gas) from the recovery port 42 of the second member 22 in a state where the immersion space LS2 is formed on the gap G and a state where the immersion space LS2 is not formed on the gap G. The collection conditions (suction conditions) of one or both of the above may be different.

  The fluid recovery condition (suction condition) from the recovery port 42 includes the exhaust amount from the recovery port 42. Further, the recovery condition (suction condition) of the fluid from the recovery port 42 includes the recovery force (suction force) of the recovery port 42.

  In the present embodiment, the suction force from the recovery port 42 in the state where the immersion space LS2 is formed on the gap G is the recovery port 42 in the state where the immersion space LS2 is not formed on the gap G. It is weaker than the suction force from.

  The suction force from the recovery port 42 when the immersion space LS2 is formed on the gap G is the suction force from the recovery port 42 when the immersion space LS2 is not formed on the gap G. May be stronger.

  As described above, the suction force of the recovery port 42 depends on the difference between the pressure of the recovery flow path 45 and the pressure of the second space SP2.

  Note that the recovery condition from the recovery port 42 may include a recovery time from the recovery port 42. The recovery time from the recovery port 42 when the immersion space LS2 is formed on the gap G is different from the recovery time from the recovery port 42 when the immersion space LS2 is not formed on the gap G. May be.

  When a plurality of recovery ports 42 are provided, the recovery conditions from the recovery ports 42 may include one or both of the position and number of the recovery ports 42 that recover the fluid. In the state where the immersion space LS2 is formed on the gap G, the fluid is recovered from the first number of recovery ports 42 among the plurality of recovery ports 42, and the immersion space LS2 is formed on the gap G. In the absence, the fluid may be recovered from the second number of recovery ports 42 different from the first number among the plurality of recovery ports 42.

  Note that this embodiment and at least one of the first to fourth embodiments described above can be combined. In the present embodiment, since the dimension of the gap Ga (gap G) can be adjusted by the driving device 53, it can be combined with at least one of the first to fourth embodiments described above. Also in the present embodiment, the second member 22 can be moved in the Z-axis direction.

  In the present embodiment, the upper surface member T may not move in the XY plane. The driving device 53 may be omitted.

  20 and 21, the case where the first object B1 is the upper surface member T and the second object B2 is the substrate P has been described as an example. As described above, the first object B1 and the second object B2 may be the cover member T1 and the scale member T2, the substrate stage 2 and the measurement stage 3, or the measurement stage 3 and the measurement member C. A suction port for sucking fluid in the space below the gap Gb between the cover member T1 and the scale member T2 may be provided. A suction port for sucking fluid in a space below the gap Gc between the substrate stage 2 and the measurement stage 3 may be provided. A suction port for sucking fluid in the space below the gap Gd between the measurement stage 3 and the measurement member C may be provided.

  In the present embodiment, there may be no suction port for sucking the fluid in the space below the gap. Even if the liquid LQ supply condition from the supply port 41 is different between the state in which the immersion space LS2 is formed on the gap G2 and the state in which the liquid immersion space LS2 is not formed, the outflow and the remaining of the liquid LQ are suppressed. . In addition, the outflow or the remaining of the liquid LQ is suppressed even when the recovery conditions of the fluid from the recovery port 42 are different between the state where the immersion space LS2 is formed on the gap G2 and the state where it is not formed. The

  As shown in FIG. 22, a supply port 57 capable of supplying the liquid LQ may be provided in the space below the gap G. The supply port 57 may be disposed in at least a part of the first object B1, or may be disposed in at least a part of the second object B2.

<Sixth Embodiment>
Next, a sixth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In the present embodiment, the second member 22 may be omitted. The immersion space LS2 may not be formed.

  23 and 24 are schematic views showing an example of the substrate stage 260 according to this embodiment. The substrate stage 260 is disposed at a part of the periphery of the upper surface of the substrate P in a state where the lower surface of the substrate P is releasably held and the substrate P is held by the first holding unit 14. Each of the plurality of members Ta to Th is moved in an XY plane intersecting the optical axis of the last optical element 13 and a plurality of members Ta, Tb, Tc, Td, Te, Tf, Tg, Th each having an upper surface. An adjustment device 58 that can adjust the size of the gap between the upper surface of the substrate P and the upper surfaces of the members Ta to Th is provided.

  The adjusting device 58 includes the driving device 50 described with reference to FIG. The driving device 50 is disposed on each of the lower surfaces of the plurality of members Ta to Th. The control device 6 can control each of the plurality of members Ta to Th in the XY plane by controlling the driving device 50 arranged on the lower surface of each of the plurality of members Ta to Th.

  FIG. 23 shows a state where the members Ta to Th are separated from the substrate P (first holding portion 14). In the state shown in FIG. 23, at least one of carrying in (loading) the substrate P to the first holding unit 14 and carrying out (unloading) the substrate P from the first holding unit 14 is performed.

  FIG. 24 shows a state where the members Ta to Th are approaching the substrate P (first holding unit 14). In the state shown in FIG. 24, for example, the substrate P held by the first holding unit 14 is exposed through the liquid LQ in the immersion space LS1.

  As shown in FIG. 23 and FIG. 24, the substrate P and the members Ta to at least one of loading (loading) the substrate P into the first holding unit 14 and unloading (unloading) the substrate P from the first holding unit 14. The members Ta to Th are moved so that the dimension of the gap with Th is larger than the dimension of the gap between the substrate P and the members Ta to Th in the exposure of the substrate P held by the first holding unit 14. .

  In the present embodiment, the gap between the substrate P and the members Ta to Th in at least one of the loading (loading) of the substrate P into the first holding unit 14 and the unloading (unloading) of the substrate P from the first holding unit 14. Therefore, the substrate P is smoothly loaded (loaded) and unloaded (unloaded). Further, since the size of the gap between the substrate P and the members Ta to Th is reduced in the exposure of the substrate P, the liquid LQ in the immersion space LS1 is suppressed from flowing into the space below the gap.

  As described in the above embodiment, the first holding unit 14 (substrate stage 260) that holds the substrate P moves in the XY plane, so that it is formed on the exit surface 12 side of the last optical element 13. When the immersion space LS1 of the liquid LQ is changed from one of the first state not formed on the gap between the substrate P and the members Ta to Th to the other of the second state formed on the gap, the second state The members Ta to Th may be moved so that the dimension of the gap at is smaller than the dimension of the gap in the first state.

  25A and 25B, a shot region Sa of the substrate P adjacent to the gap G1 between the substrate P and the member Tf is formed on the exit surface 12 side of the last optical element 13. The dimension of the gap G1 when exposed through the liquid LQ in the immersion space LS1 is larger than the dimension of the gap G1 when exposed to the shot area Sb opposite to the shot area Sa with respect to the center of the substrate P. The member Tf may be moved so as to be smaller. The shot area Sb is adjacent to the gap G2. The member Tb is moved so that the size of the gap G2 when the shot region Sb is exposed through the liquid LQ in the immersion space LS1 is smaller than the size of the gap G2 when the shot region Sa is exposed. May be.

  In addition, the shot region Sb of the substrate P adjacent to the gap G2 between the substrate P and the member Tb is exposed through the liquid LQ in the immersion space LS1 formed on the exit surface 12 side of the last optical element 13. The member Tb may be moved so that the dimension of the gap G2 is smaller than the dimension of the gap G2 in a state where the shot area Sa opposite to the shot area Sb is exposed with respect to the center of the substrate P. The shot area Sa is adjacent to the gap G1. The member Tf is moved so that the dimension of the gap G1 when the shot area Sa is exposed through the liquid LQ in the immersion space LS1 is smaller than the dimension of the gap G1 when the shot area Sb is exposed. May be.

  FIG. 25A shows a state in which the shot area Sa is exposed through the liquid LQ. FIG. 25B shows a state where the shot area Sb is exposed via the liquid LQ.

  As shown in FIGS. 26A and 26B, the dimension of the gap in the state where the liquid LQ is supplied from above the gap between the substrate P and the member Ta (Tb to Th) is the same as the liquid LQ. The member Ta (Tb to Th) may be moved so as to be smaller than the dimension of the gap in a state where the supply is not performed. FIG. 26A shows a state where the liquid LQ is not supplied from above the gap. FIG. 26B shows a state where the liquid LQ is supplied from above the gap.

  Note that, like the substrate stage 270 shown in FIG. 27, the members Tb, Td, Tf, and Th may be moved, and the positions of the members Ta, Tc, Te, and Tg may be substantially fixed.

  In each embodiment described above, the liquid LQ for forming the immersion space LS1 and the liquid LQ for forming the immersion space LS2 may be of the same type (physical properties). For example, both the liquid LQ for forming the immersion space LS1 and the liquid LQ for forming the immersion space LS2 may be pure water. The liquid LQ for forming the immersion space LS1 and the liquid LQ for forming the immersion space LS2 may be of different types (physical properties).

  In the present embodiment, the liquid LQ for forming the immersion space LS1 and the liquid LQ for forming the immersion space LS2 may have the same or different cleanliness.

  As described above, the control device 6 includes a computer system including a CPU and the like. The control device 6 includes an interface capable of executing communication between the computer system and an external device. The storage device 7 includes a memory such as a RAM, and a recording medium such as a hard disk and a CD-ROM. The storage device 7 is installed with an operating system (OS) that controls the computer system, and stores a program for controlling the exposure apparatus EX.

  Note that an input device capable of inputting an input signal may be connected to the control device 6. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from an external device. Further, a display device such as a liquid crystal display may be provided.

  Various information including programs recorded in the storage device 7 can be read by the control device (computer system) 6. In the storage device 7, a liquid that exposes the substrate with the exposure light to the control device 6 through the first liquid filled in the optical path of the exposure light between the emission surface of the optical member from which the exposure light is emitted and the substrate. A program for executing control of the immersion exposure apparatus is recorded.

  The program recorded in the storage device 7 is a first member arranged in at least a part of the periphery of the optical path of the exposure light emitted from the exit surface of the optical member according to the above-described embodiment. Forming a first liquid immersion space of one liquid and a second member disposed outside the first member with respect to the optical path, away from the first liquid immersion space, and a second liquid immersion space of the second liquid Forming a second immersion space between the second member and the first object, and a second object adjacent to the second member and the first object through a gap. Forming the two immersion space and changing the size of the gap may be performed.

  Further, according to the above-described embodiment, the program recorded in the storage device 7 causes the control device 6 to form a liquid immersion space on the exit surface side of the optical member from which the exposure light is emitted, Holding the lower surface in a releasable manner by the substrate holding unit, exposing the substrate held by the substrate holding unit through the liquid in the immersion space, and surrounding the upper surface of the substrate held by the substrate holding unit Moving a first member having a first upper surface disposed in part in a direction intersecting the optical axis of the optical member to adjust the size of the first gap between the upper surface of the substrate and the first upper surface; The second member having the second upper surface disposed at a part of the periphery of the upper surface of the substrate held by the substrate holding unit is moved in a direction intersecting the optical axis of the optical member, and the upper surface of the substrate and the second member Adjusting the dimension of the second gap with respect to the top surface.

  When the program stored in the storage device 7 is read into the control device 6, various devices of the exposure apparatus EX such as the substrate stage 2, the measurement stage 3, and the liquid immersion member 5 cooperate to form a liquid immersion space. In the state where is formed, various processes such as immersion exposure of the substrate P are executed.

  In each of the above-described embodiments, the optical path K on the exit surface 12 side (image surface side) of the terminal optical element 13 of the projection optical system PL is filled with the liquid LQ. As disclosed in Japanese Patent Publication No. 2004/019128, the optical path on the incident side (object surface side) of the last optical element 13 may be a projection optical system filled with the liquid LQ.

  In each of the above-described embodiments, the liquid LQ is water, but a liquid other than water may be used. The liquid LQ is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms a film such as a photosensitive material (photoresist) that forms the surface of the projection optical system PL or the substrate P. A stable material is preferred. For example, the liquid LQ may be a fluorinated liquid such as hydrofluoroether (HFE), perfluorinated polyether (PFPE), or fomblin oil. Further, the liquid LQ may be various fluids such as a supercritical fluid.

  In each of the above-described embodiments, the substrate P includes a semiconductor wafer for manufacturing a semiconductor device. For example, the substrate P is used in a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an exposure apparatus. A mask or reticle master (synthetic quartz, silicon wafer) or the like may also be included.

  In each of the above-described embodiments, the exposure apparatus EX is a step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously. However, for example, a step-and-repeat projection exposure apparatus (stepper) that performs batch exposure of the pattern of the mask M while the mask M and the substrate P are stationary and sequentially moves the substrate P stepwise may be used.

  In addition, the exposure apparatus EX transfers a reduced image of the first pattern onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary in the step-and-repeat exposure. Thereafter, with the second pattern and the substrate P substantially stationary, an exposure apparatus (stitch method) that collectively exposes a reduced image of the second pattern on the substrate P by partially overlapping the first pattern using a projection optical system. (Batch exposure apparatus). Further, the stitch type exposure apparatus may be a step-and-stitch type exposure apparatus in which at least two patterns are partially overlapped and transferred on the substrate P, and the substrate P is sequentially moved.

  Further, the exposure apparatus EX combines two mask patterns as disclosed in, for example, US Pat. No. 6,611,316 on the substrate via the projection optical system, and 1 on the substrate by one scanning exposure. An exposure apparatus that double-exposes two shot areas almost simultaneously may be used. Further, the exposure apparatus EX may be a proximity type exposure apparatus, a mirror projection aligner, or the like.

  In each of the embodiments described above, the exposure apparatus EX is a twin stage type having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796 and the like. The exposure apparatus may be used. For example, as shown in FIG. 28, when the exposure apparatus EX includes two substrate stages 2001 and 2002, an object that can be arranged to face the emission surface 12 is one substrate stage and one substrate stage. At least one of the substrate held by the first holding unit, the other substrate stage, and the substrate held by the first holding unit of the other substrate stage. The gap is formed between one substrate stage 2001 and the other substrate stage 2002. A suction port that sucks the fluid in the space below the gap may be arranged.

  The exposure apparatus EX may be an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The exposure apparatus EX may be an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an imaging element ( CCD), micromachine, MEMS, DNA chip, or an exposure apparatus for manufacturing a reticle or mask.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. A variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed, as disclosed in No. 6778257 It may be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  In each of the above embodiments, the exposure apparatus EX includes the projection optical system PL. However, the components described in the above embodiments are applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. May be. For example, an exposure apparatus and an exposure method for forming an immersion space between an optical member such as a lens and a substrate and irradiating the substrate with exposure light via the optical member are described in the above embodiments. Elements may be applied.

  The exposure apparatus EX exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P as disclosed in, for example, International Publication No. 2001/035168. A lithography system).

  The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including the above-described components so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. After the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 29, a microdevice such as a semiconductor device includes a step 201 for performing a function / performance design of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to the above-described embodiment, It is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 3 ... Measurement stage, 5 ... Liquid immersion member, 6 ... Control apparatus, 7 ... Memory | storage device, 12 ... Ejection surface, 13 ... Terminal optical element, 21 ... 1st member, 22 ... 2nd member, 50 DESCRIPTION OF SYMBOLS ... Drive device, C ... Measuring member, EL ... Exposure light, EX ... Exposure apparatus, IL ... Illumination system, K ... Optical path, LQ ... Liquid, LS1 ... Immersion space, LS2 ... Immersion space, P ... Substrate, S ... Shot area, SP1 ... first space, SP2 ... second space, T1 ... cover member, T2 ... scale member.

Claims (41)

An exposure apparatus that exposes a substrate with exposure light through a first liquid in a first immersion space,
An optical member having an exit surface from which the exposure light is emitted;
A first member that is disposed at least in part around the optical path of the exposure light and that forms the first immersion space of the first liquid;
An exposure apparatus comprising: a second member that is disposed outside the first member with respect to the optical path, and is capable of forming a second immersion space for the second liquid away from the first immersion space. The second immersion space can be formed between the first object and the second member,
The second immersion space can be formed between the second member and the second object adjacent to the first object via a gap,
The exposure apparatus according to claim 1, wherein a dimension of the gap is changeable.   The first object and the second object are optical axes of the optical member with respect to the second member so that the second immersion space moves from one to the other on the first object and the second object. The exposure apparatus according to claim 2, wherein a dimension of the gap is changed in at least a part of a period of movement in a direction crossing the line.   The first object and the second object in a first state in which the second immersion space is not formed on the gap and in a second state in which the second immersion space is formed on the gap. The exposure apparatus according to claim 2, wherein the size of the gap between the two is different.   The exposure apparatus according to claim 4, wherein a dimension of the gap in the second state is smaller than a dimension of the gap in the first state.   The first object and the second object are optical axes of the optical member with respect to the second member so that the second immersion space moves from one to the other on the first object and the second object. The exposure apparatus according to any one of claims 2 to 5, wherein a size of the gap is changed based on a moving condition of the first object and the second object when moving in a direction intersecting with the first object.   The exposure apparatus according to claim 6, wherein the movement condition includes a movement speed.   The size of the gap when the first object and the second object move at a first speed is the same as that when the first object and the second object move at a second speed that is slower than the first speed. The exposure apparatus according to claim 7, wherein the exposure apparatus is smaller than the size of the gap.   The exposure apparatus according to claim 6, wherein the movement condition includes acceleration.   The size of the gap when the first object and the second object move at a first acceleration is the same as that when the first object and the second object move at a second acceleration smaller than the first acceleration. The exposure apparatus according to claim 9, wherein the exposure apparatus is smaller than the size of the gap.   The dimension of the gap is different between the state in which the first immersion space is formed on the gap and the state in which the second immersion space is formed on the gap. An exposure apparatus according to claim 1.   The size of the gap when the second immersion space is formed on the gap is smaller than the size of the gap when the first immersion space is formed on the gap. Item 12. The exposure apparatus according to Item 11.   The dimension of the gap in a state where the first immersion space is formed on the gap is different from the dimension of the gap in a state where the first immersion space is not formed on the gap. The exposure apparatus according to 11 or 12.   The exposure apparatus according to any one of claims 2 to 13, further comprising a suction port for sucking a fluid in a space below the gap.   The suction condition from the suction port is different between a state in which the second liquid immersion space is formed on the gap and a state in which the second liquid immersion space is not formed on the gap. The exposure apparatus described.   The exposure apparatus according to claim 15, wherein the suction condition includes an exhaust amount from the suction port. The second member has a second supply port for supplying the second liquid, and a second recovery port for recovering the second liquid,
17. The second immersion space is formed by performing liquid recovery from the second recovery port in parallel with liquid supply from the second supply port. Exposure equipment.   The supply condition from the second supply port differs between a state where the second immersion space is formed on the gap and a state where the second immersion space is not formed on the gap. 18. An exposure apparatus according to item 17.   The exposure apparatus according to claim 18, wherein the supply condition includes a supply amount of the second liquid from the second supply port.   The recovery condition from the second recovery port differs between a state in which the second liquid immersion space is formed on the gap and a state in which the second liquid immersion space is not formed on the gap. The exposure apparatus according to any one of 17 to 19.   21. The exposure apparatus according to claim 20, wherein the collection condition includes an exhaust amount from the second collection port.   At least one of the first object and the second object in a state in which the second immersion space is formed on the gap and a state in which the second immersion space is not formed on the gap; The exposure apparatus according to any one of claims 2 to 21, wherein a distance between the second member and a direction parallel to the optical axis of the optical member is different.   23. The distance in a state where the second immersion space is formed on the gap is smaller than the distance in a state where the second immersion space is not formed on the gap. Exposure equipment.   The exposure apparatus according to claim 22 or 23, wherein the second member is movable in a direction parallel to the optical axis. A driving device capable of moving one or both of the first object and the second object in a direction intersecting the optical axis of the optical member;
The exposure apparatus according to any one of claims 2 to 24, wherein the size of the gap can be changed by moving one or both of the first object and the second object using the driving device.   26. At least a part of one or both of the upper surface of the first object and the upper surface of the second object is in contact with the first liquid in the first immersion space. Exposure device. The first object includes the substrate;
27. The exposure apparatus according to claim 2, wherein the second object includes a member disposed around the substrate. The first object includes a measurement member;
The exposure apparatus according to any one of claims 2 to 26, wherein the second object includes a member adjacent to the measurement member via the gap. The first member has a first supply port for supplying the first liquid, and a first recovery port for recovering the first liquid,
29. The first immersion space is formed by performing liquid recovery from the first recovery port in parallel with liquid supply from the first supply port. Exposure equipment.   The exposure apparatus according to any one of claims 1 to 29, wherein the first liquid and the second liquid are pure water. An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member having an exit surface from which the exposure light is emitted;
A substrate holding portion for releasably holding the lower surface of the substrate;
A first member having a first upper surface disposed in a part of the periphery of the upper surface of the substrate in a state where the substrate is held by the substrate holding unit;
A second member having a second upper surface disposed in a part of the periphery of the upper surface of the substrate in a state where the substrate is held by the substrate holding unit;
A first adjusting device capable of adjusting the size of the first gap between the upper surface of the substrate and the first upper surface by moving the first member in a direction intersecting the optical axis of the optical member;
An exposure apparatus comprising: a second adjustment device capable of adjusting a dimension of a second gap between the upper surface of the substrate and the second upper surface by moving the second member in a direction intersecting the optical axis.   32. The exposure apparatus according to claim 31, wherein each of the first and second adjustment devices is capable of moving the first and second members in a direction parallel to the optical axis.   The size of the first gap in at least one of the loading of the substrate into the substrate holding unit and the unloading of the substrate from the substrate holding unit is the first gap in the exposure of the substrate held in the substrate holding unit. The exposure apparatus according to claim 31 or 32, wherein the first member is moved so as to be larger than a dimension of the first member. The liquid immersion space formed on the emission surface side of the optical member is not formed on the first gap by moving the substrate holding unit that holds the substrate in a direction intersecting the optical axis. Changing from one of the first state and the second state formed on the first gap to the other;
35. The method according to claim 31, wherein the first member is moved so that a dimension of the first gap in the first state is smaller than a dimension of the first gap in the second state. The exposure apparatus described.   The size of the first gap in a state where the first shot region of the substrate adjacent to the first gap is exposed through the liquid in the immersion space formed on the emission surface side of the optical member is the substrate. The first member is moved so as to be smaller than a dimension of the first gap in a state where the second shot area opposite to the first shot area is exposed with respect to the center of the first shot area. 34. The exposure apparatus according to any one of 34. The second shot region is adjacent to the second gap;
The dimension of the second gap when the second shot area is exposed through the liquid in the immersion space is smaller than the dimension of the second gap when the first shot area is exposed. 36. The exposure apparatus according to claim 35, wherein the second member is moved.   The first member is moved so that the dimension of the first gap when the liquid is supplied from above the first gap is smaller than the dimension of the first gap when the liquid is not supplied. The exposure apparatus according to any one of claims 31 to 36. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 37;
Developing the exposed substrate. A device manufacturing method. An exposure method for exposing a substrate with exposure light through a first liquid in a first immersion space,
Forming the first liquid immersion space of the first liquid with a first member arranged at least part of the periphery of the optical path of the exposure light emitted from the emission surface of the optical member;
Forming a second immersion space for the second liquid away from the first immersion space with a second member arranged outside the first member with respect to the optical path;
Forming the second immersion space between the second member and the first object;
Forming the second immersion space between the second member and a second object adjacent to the first object via a gap;
Changing the dimension of the gap. An exposure method for exposing a substrate with exposure light through a liquid,
Forming an immersion space with the liquid on the exit surface side of the optical member from which the exposure light is emitted;
Holding the lower surface of the substrate so as to be releasable by the substrate holding portion;
Exposing the substrate held by the substrate holding part via the liquid in the immersion space;
A first member having a first upper surface disposed at a part of the periphery of the upper surface of the substrate held by the substrate holding unit is moved in a direction intersecting the optical axis of the optical member, and Adjusting the size of the first gap between the upper surface and the first upper surface;
A second member having a second upper surface arranged at a part of the periphery of the upper surface of the substrate held by the substrate holding part is moved in a direction intersecting the optical axis of the optical member, and Adjusting the dimension of the second gap between the upper surface and the second upper surface. Exposing the substrate using the exposure method of claim 39 or 40;
Developing the exposed substrate. A device manufacturing method.

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