JP2014010953A - Connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem of a connector held between two connection objects in parallel with each other, and connecting the two connection objects electrically that since an insulating frame is molded integrally of an insulating resin, it must be remade when the type of the connection objects changes, and to provide a connector capable of reducing the manufacturing cost that increases because a mold must be made anew.SOLUTION: Since a connector 1 includes a plurality of insulating frames 3, and the insulating frames can be arranged two-dimensionally depending on the arrangement of terminals of connection objects, such as an IC package and a printed circuit board, it is not required to remake the mold of the insulating frames, even if the arrangement of terminals of the connection objects is changed.

Description

  The present invention relates to a connector.

  Conventionally, as shown in FIGS. 28 and 29, a connector 911 having a plurality of contact units 921 and a flat insulating frame 931 for holding the plurality of contact units 921 is known (Patent Document 1 below). reference). 28 and 29 correspond to FIGS. 2 and 7 of Patent Document 1 below, respectively. However, the reference numerals in the figure have been changed, and some of the reference numerals have been deleted.

  As illustrated in FIG. 28, the contact unit 921 includes a prismatic elastic body 923 and a plurality of conductive contacts 925 formed on the surface of the elastic body 923.

  A plurality of slits 932 and 933 are formed in the insulating frame 931 as shown in FIG. Ribs 932 a extending in the vertical direction Y are formed between the slits 932, and ribs 933 a extending in the horizontal direction X are formed between the slits 933. The contact unit 921 is inserted into the slits 932 and 933 and is held by the ribs 932a and 933a.

  As shown in FIG. 29, the insulating frame 931 is divided into 18 first blocks A and 18 second blocks B except for the outer peripheral portion 934 thereof. The first block A and the second block B are alternately arranged along the vertical direction Y and the horizontal direction X.

  The first block A and the second block B are areas of the same size. In the first block A, four slits 932 extending in the vertical direction Y are arranged in the horizontal direction X. In the second block B, four slits 933 extending in the horizontal direction X are arranged in the vertical direction Y.

  The connector 911 is sandwiched between two parallel connection objects (not shown) and electrically connects the two connection objects.

JP 2009-259486 A (paragraphs 0031, 0039, 0040, 0052, 0069-0071, FIG. 2, FIG. 7, etc.)

  Since the above-described insulating frame 931 is integrally formed of an insulating resin, when the type of the connection object changes (for example, when the arrangement shape of the terminal portions of the connection object changes), the insulating frame 931 must be remade. No. To that end, a new mold must be made, which has contributed to an increase in connector manufacturing costs.

  This invention is made in view of such a situation, The subject is providing the connector which can implement | achieve cost reduction.

  In order to solve the above-mentioned problem, the invention according to claim 1 is arranged between a first connection object and a second connection object opposite to the first connection object, and the first connection is performed. In a connector for electrically connecting an object and the second connection object, a plurality of insulating frames that are two-dimensionally arranged and connected, and held by the insulating frame, the first connection object And a plurality of contact members for conducting the second connection object.

  According to a second aspect of the present invention, in the connector according to the first aspect, the insulating frame has a rectangular frame portion, and the concavity and convexity portion for connecting the adjacent frame portions so as to be separable is the frame. It is provided in the part.

  According to a third aspect of the present invention, in the connector according to the second aspect, the connecting uneven portions are respectively provided on two outer surfaces parallel to each other among the four outer surfaces of the frame portion, and the two outer surfaces. The convex portion of the connecting concave-convex portion on one of the outer surfaces and the convex portion of the concave portion for connecting on the other outer surface are shifted by a predetermined pitch in a direction parallel to the two outer surfaces. Features.

  According to a fourth aspect of the present invention, in the connector according to the second aspect, the connection irregularities are provided on the four outer surfaces of the frame portion, and one of the four outer surfaces parallel to each other. The convex portion of the connecting concave-convex portion on the outer side surface of the outer peripheral surface and the convex portion of the concave portion for connecting on the other outer side surface are shifted by a predetermined pitch in a direction parallel to the parallel outer side surface.

  The invention according to claim 5 is the connector according to any one of claims 2 to 4, wherein the contact member is provided so as to penetrate the insulating elastic body and the insulating elastic body in the longitudinal direction thereof. A holding member for holding both end portions of the core member, wherein both end portions of the core member protrude from both ends of the insulating elastic body, the insulating frame is provided on the frame portion, and It is characterized by having.

  A sixth aspect of the present invention is the connector according to the fifth aspect, wherein the holding portion is a recess that accepts both end portions of the core member.

  A seventh aspect of the present invention is the connector according to any one of the first to sixth aspects, further comprising a holder for holding the plurality of insulating frames connected in a two-dimensional array. .

  The invention according to claim 8 is the connector according to claim 7, characterized in that the holder has an uneven portion for positioning that can be fitted to the uneven portion for connection.

  The invention according to claim 9 is the connector according to claim 7 or 8, wherein the thickness dimension of the holder is larger than the thickness dimension of the frame portion of the insulating frame, and the first connection is formed above the holder. A guide surface for guiding an object into the holder is formed.

  According to a tenth aspect of the present invention, in the connector according to the seventh or eighth aspect, the thickness dimension of the holder and the thickness dimension of the frame portion of the insulating frame are substantially equal.

  According to this invention, it is possible to provide a connector capable of realizing cost reduction.

FIG. 1 is a perspective view of a connector according to a first embodiment of the present invention. 2 is a perspective view of the connector shown in FIG. 1 as viewed obliquely from below. FIG. 3 is an exploded perspective view of the connector shown in FIG. FIG. 4 is a plan view showing a state in which a plurality of insulating frames holding contact members are connected in a square shape. FIG. 5 is a perspective view of an insulating frame holding a contact member. 6A is a front view of the insulating frame shown in FIG. 6B is a plan view of the insulating frame shown in FIG. 6C is a bottom view of the insulating frame shown in FIG. 6D is a side view of the insulating frame shown in FIG. FIG. 7 is a perspective view of an insulating frame not holding a contact member. FIG. 8A is a perspective view of the contact member shown in FIG. 8B is a side view of the contact member shown in FIG. FIG. 9 is a perspective view showing a state before the connector is arranged on the printed board. FIG. 10 is a perspective view showing a state before the IC package is inserted into the connector arranged on the printed circuit board. FIG. 11 is a perspective view showing a state where an IC package is inserted into a connector arranged on a printed circuit board. FIG. 12 is a cross-sectional view showing a state in which the printed board, the connector, and the IC package shown in FIG. 11 are sandwiched between a metal plate and a heat sink. FIG. 13 is a plan view showing a state in which a plurality of insulating frames not holding contact members are connected in a square shape. FIG. 14 is a plan view showing a state in which only the core material of the contact member is held in each of the plurality of insulating frames shown in FIG. FIG. 15 is a plan view showing a first modification in which a plurality of insulating frames holding contact members are connected in a square frame shape. FIG. 16 is a plan view showing a second modification, in which a plurality of insulating frames holding contact members are connected in a rectangular shape. FIG. 17 is a plan view showing a third modification in which a plurality of insulating frames holding contact members are connected in a cross shape. FIG. 18 is a perspective view of a connector according to a second embodiment of the present invention. FIG. 19 is a side view of the connector shown in FIG. FIG. 20A shows a third embodiment of the present invention, and is a front view of an insulating frame holding a contact member. 20B is a plan view of the insulating frame shown in FIG. 20A. 20C is a bottom view of the insulating frame and the contact member shown in FIG. 20A. 20D is a side view of the insulating frame shown in FIG. 20A. FIG. 21 is a perspective view of an insulating frame holding a contact member. FIG. 22 is a perspective view of an insulating frame not holding a contact member. FIG. 23 is a plan view showing a state in which the insulating frames shown in FIG. 20A are connected in a square shape. FIG. 24A is a plan view showing a state in which the insulating frames shown in FIG. 20A are connected in a square shape, and shows a state in which the direction of the insulating frame located at the center and the direction of the insulating frame located around it are different. FIG. FIG. 24B is a partially enlarged perspective view of the assembly of the insulating frames shown in FIG. 24A, and shows a state where the direction of the insulating frame located at the center and the direction of the insulating frame located around it are different. It is. FIG. 25 is a plan view showing a fourth modification, in which the insulating frame shown in FIG. 20A holding the contact member is connected in a square frame shape. FIG. 26 is a plan view showing a fifth modification, in which the insulating frame shown in FIG. 20A holding the contact member is connected in a rectangular shape. FIG. 27 is a plan view showing a sixth modification, in which a plurality of insulating frames holding contact members are connected in a cross shape. FIG. 28 is a perspective view of a contact unit of a conventional connector. FIG. 29 is a plan view of an insulating frame of a conventional connector.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, the connector of 1st Embodiment of this invention is demonstrated based on FIGS.

  As shown in FIGS. 1, 2, and 3, the connector 1 includes 25 insulating frames 3, 250 contact members 5, and one holder 7. The connector 1 is disposed between the printed circuit board (second connection object) 21 and the IC package (first connection object) 22, and electrically connects the printed circuit board 21 and the IC package 22 (FIG. 12). reference). In the case of this embodiment, the number of cores of the connector 1 (the number of conductive films 53 of the contact member 5 described later) is 2500.

  As shown in FIGS. 5, 6 </ b> A to 6 </ b> D, and FIG. 7, each insulating frame 3 has one frame portion 31, 20 recesses (holding portions) 32, and a pair of connection uneven portions 33. The frame part 31 is a square. Ten concave portions 32 are provided at equal intervals on one of two parallel inner side surfaces 31a of four inner side surfaces 31a (see FIG. 7) of the frame portion 31, and ten concave portions 32 are equally spaced on the other side. Is provided. The connecting uneven portion 33 is provided on each of two parallel outer surfaces 31b of the four outer surfaces 31b of the frame portion 31 (see FIGS. 6B and 6C). The connecting uneven portion 33 has a plurality of convex portions 33a. The convex portion 33a of the connecting uneven portion 33 on one outer surface 31b of the two outer surfaces 31b and the convex portion 33a of the connecting uneven portion 33 on the other outer surface 31b have a predetermined pitch in the lateral direction X of the connector 1. Deviation (half pitch). By pressing the protrusions 33a between the adjacent protrusions 33a of other insulating frames 3, the insulating frames 3 can be connected to each other in a separable manner. The shapes and sizes of the plurality of insulating frames 3 are the same. As a material of the insulating frame 3, for example, there is a synthetic resin.

  As shown in FIGS. 5 and 6A to 6D, a plurality of contact members 5 are held by the insulating frame 3. The contact member 5 makes the printed circuit board 21 and the IC package 22 conductive. In this embodiment, ten contact members 5 are held by one insulating frame 3. As shown in FIGS. 8A and 8B, each contact member 5 includes one insulating elastic body 51, one core member 52, and ten conductive films 53. The insulating elastic body 51 has a substantially long plate shape, and its cross-sectional shape is substantially D-shaped. Examples of the material of the insulating elastic body 51 include silicon rubber and gel. The insulating elastic body 51 is formed around the core material 52 by, for example, an outsert molding method. As another method of manufacturing the insulating elastic body 51, there is a method of forming the insulating elastic body 51 by pressing or laser processing after the insulating elastic body is formed into a sheet shape.

  The core member 52 has a long plate shape and is embedded in the insulating elastic body 51 so as to penetrate in the longitudinal direction. Both end portions 52 a of the core material 52 protrude from both ends of the insulating elastic body 51. Both end portions 52a of the core material 52 are pressed into the concave portions 32 of the insulating frame 3 and held. Instead of press-fitting both end portions 52a of the core material 52 into the recess 32, the both end portions 52a may be bonded to the recess 32, or both end portions 52a may be laser welded to the recess 32. As another holding method of the both end portions 52a of the core member 52, the both end portions 52a may be inserted into the recesses 32 and then the openings of the recesses 32 may be closed with an adhesive tape (not shown). Examples of the material of the core material 52 include metal.

  Ten conductive films 53 are provided on one insulating elastic body 51 at equal intervals along the longitudinal direction thereof. Each conductive film 53 reaches from the upper surface of the insulating elastic body 51 to the lower surface of the insulating elastic body 51 through the front surface of the insulating elastic body 51 (see FIG. 8B). The conductive film 53 is directly formed on the surface of the insulating elastic body 51 by, for example, plating or sputtering. As another example, a film in which the conductive film 53 is patterned (for example, a polyimide film having a thickness of several μm) may be attached to the insulating elastic body 51. The positions of both ends in the longitudinal direction of the conductive film 53 are such that when the insulating elastic body 51 is elastically deformed, the insulating elastic body 51 does not contact the conductive film 53 of another adjacent contact member 5. It is located in front of the rear surface (the surface on the right side of the insulating elastic body 51 of the contact member 5 in FIG. 8B) (leftward toward the contact member 5 in FIG. 8B). The insulating elastic body 51 is provided with cuts 51a at equal intervals (see FIG. 8A). The cuts 51 a are located between the conductive films 53.

  As shown in FIG. 3 and FIG. 4, five rows are formed by connecting the five insulating frames 3 along the longitudinal direction Y of the connector 1 by the connecting uneven portion 33, and each row of the connector 1. They are arranged along the lateral direction X and connected by an adhesive. FIG. 4 shows a state in which 25 insulating frames 3 are connected in a square shape.

  The holder 7 is a square frame (see FIG. 3). The holder 7 holds 25 insulating frames 3 arranged two-dimensionally. The thickness dimension of the holder 7 (dimension in the height direction Z of the connector 1) is larger than the thickness dimension (dimension in the height direction Z of the connector 1) of the frame portion 31 of the insulating frame 3. A guide surface 71 is formed on the upper part of the inner surface of the holder 7. The guide surface 71 is a tapered surface that guides the IC package 22 into the holder 7. A positioning uneven portion 72 is provided at the lower part of two parallel inner surfaces of the four inner surfaces of the holder 7 (in FIG. 3, only the positioning uneven portion 72 formed on one inner surface is provided. appear). The convex portion 33a of the connecting concave and convex portion 33 of the insulating frame 3 is fitted and adhered to the concave portion 72a of the positioning concave and convex portion 72. As a result, the insulating frame 3 is positioned and fixed with respect to the holder 7. Instead of adhering the connecting uneven portion 33 to the positioning uneven portion 72, the protruding portion 33a of the connecting uneven portion 33 is laser welded to the positioning uneven portion 72, or the connecting uneven portion 33 is positioned using an adhesive tape. It may be fixed to the recess 72a of the uneven portion 72 for use. Note that if the protrusion 33 a of the connecting uneven portion 33 of the insulating frame 3 is press-fitted into the recess 72 a of the positioning uneven portion 72 of the holder 7, the protrusion 33 a of the connecting uneven portion 33 is pressed into the recess of the positioning uneven portion 72. There is no need to bond to 72a.

  Next, the usage method of the connector 1 is demonstrated based on FIGS.

  First, as shown in FIGS. 9 and 10, the connector 1 is disposed on a printed circuit board 21 disposed on a metal plate 23 (see FIG. 12). At this time, the positioning pins 73 of the connector 1 are inserted into the positioning holes 21 b of the printed circuit board 21. As a result, the connector 1 is positioned on the printed circuit board 21, and the lower end portion of the conductive film 53 of the contact member 5 of the connector 1 contacts the terminal portion (second terminal portion) 21 a of the printed circuit board 21.

  Next, as shown in FIG. 11, the IC package 22 is inserted into the holder 7 of the connector 1. The IC package 22 is guided into the holder 7 by the guide surface 71. As a result, the upper end portion of the conductive film 53 of the contact member 5 of the connector 1 comes into contact with a terminal portion (first terminal portion) (not shown) of the IC package 22.

  Thereafter, as shown in FIG. 12, a heat sink 24 is arranged on the IC package 22, and bolts 25 are passed through holes 24c formed in the plate-like portion 24a of the heat sink 24 and holes 21c formed in the printed circuit board 21. The tip of the bolt 25 is screwed into a screw hole 23 a formed in the metal plate 23. As a result, the metal plate 23, the printed circuit board 21, the connector 1, the IC package 22, and the heat sink 24 are integrally connected, and the contact member 5 of the connector 1 is sandwiched between the printed circuit board 21 and the IC package 22 and compressed. The terminal portion 21 a of the printed circuit board 21 and the terminal portion of the IC package 22 are electrically connected via the film 53.

  The heat generated in the IC package 22 is dissipated through the fins 24b of the heat sink 24.

  When the connector 1 of this embodiment is used as a socket of an inspection device (not shown), a pneumatic cylinder (not shown) may be used instead of the bolt 25 to pressurize from above.

  According to this embodiment, the connector 1 includes a plurality of insulating frames 3, and the insulating frames 3 are two-dimensionally arranged and connected according to the arrangement of the terminal portions of the connection objects of the IC package 22 and the printed board 21. Therefore, even if the arrangement of the terminal portions of the connection object is changed, it is not necessary to remake the mold of the insulating frame 3. Therefore, the manufacturing cost of the connector can be reduced.

  Further, a connector (not shown) having the same number of cores as the connector 1 of this embodiment is provided with one insulating frame (not shown) and a plurality of contact members (not shown) held by the insulating frame. If it comprises, since the core material of a contact member becomes long and it becomes easy to bend, contact reliability becomes low. On the other hand, in the connector 1 of this embodiment, a plurality of insulating frames 3 are two-dimensionally arranged and connected, and each insulating frame 3 accommodates a plurality of contact members 5, and a core member 52 of the contact member 5. Since both end portions 52a are held in the recesses 32 of the frame portion 31 of the insulating frame 3, the core material 52 is short and hardly bent, and the strength of the insulating frame 3 (strength of the connector 1) is high. Further, in this embodiment, as shown in FIGS. 13 and 14, the plurality of insulating frames 3 are arranged and connected in a lattice shape, so that the strength of the connector 1 is further increased.

  Furthermore, the cuts 51 a of the insulating elastic body 51 cause each conductive film 53 to bend independently without being affected by the adjacent conductive film 53, so that variations in the heights of the terminal portions of the printed circuit board 21 and the IC package 22 are caused. It can be absorbed reliably and the contact reliability is increased.

  In the first embodiment, each contact member 5 is held in the insulating frame 3 by press-fitting both end portions 52a of the core member 52 of each contact member 5 into the recess 32 of the insulating frame 3, so that the ribs The contact members 5 can be disposed adjacent to each other without using 932a and 933a (see FIG. 29), and the pitch of the contact members 5 can be reduced.

  In the first embodiment, the projections 33a of the coupling irregularities 33 formed on one outer surface 31b of the two outer surfaces 31b parallel to each other and the coupling irregularities formed on the other outer surface 31b. Although the convex portion 33a of the portion 33 is shifted by almost a half pitch, it is not always necessary to do so.

  Next, a first modification will be described based on FIG.

  Hereinafter, only the difference from the above-described first embodiment (the shape of the two-dimensional array of the insulating frame 3) will be described. Except for the arrangement shape of the insulating frames 3, the first modified example and the first embodiment are the same. The description of the configuration common to the first embodiment is omitted.

  The plurality of insulating frames 3 of the first modification are arranged in a square frame shape.

  The connector 1 of the first embodiment is used when the terminal portions of the connection objects such as the IC package 22 and the printed circuit board 21 are arranged in a square shape (not shown), whereas the connector 1 of the first modification example is used. The connector is used when terminal portions of connection objects such as the IC package 22 and the printed circuit board 21 are arranged in a square frame shape (not shown).

  In order to arrange the plurality of insulating frames 3 as shown in FIG. 15, first, five insulating frames 3 are connected along the vertical direction Y by the connecting concave and convex portions 33 to form two vertical rows. .

  Next, the three insulating frames 3 are connected along the horizontal direction X with an adhesive to form two horizontal rows.

  Thereafter, the first insulating frames 3 and the fifth insulating frames 3 in each vertical row are connected to each other through the horizontal row. The connection between the vertical row and the horizontal row is made by an adhesive.

  Finally, 16 insulating frames 3 connected in a square frame shape are mounted on the holder 7 (see FIG. 3).

  Through the above steps, the arrangement structure of the insulating frames 3 shown in FIG. 15 is completed. The number of cores of the connector having the arrangement shape of the insulating frame 3 is 1600 cores.

  Next, a second modification will be described based on FIG.

  Hereinafter, only the difference from the above-described first embodiment (the shape of the two-dimensional array of the insulating frame 3) will be described. Except for the arrangement shape of the insulating frames 3, the second modified example and the first embodiment are the same. The description of the configuration common to the first embodiment is omitted.

  The plurality of insulating frames 3 of the second modified example are arranged in a vertically long rectangular shape.

  The connector 1 of the first embodiment is used when the terminal portions of the connection objects such as the IC package 22 and the printed circuit board 21 are arranged in a square shape, whereas the connector of the second modified example is the IC package 22. It is used when the terminal portions of the connection objects such as the printed circuit board 21 and the like are arranged in a vertically long rectangular shape (not shown).

  In order to arrange the plurality of insulating frames 3 as shown in FIG. 16, first, five insulating frames 3 are connected along the vertical direction Y by the connecting irregularities 33 to form four vertical rows. .

  Next, the four vertical rows are connected along the horizontal direction X by an adhesive.

  Finally, 20 insulating frames 3 connected in a vertically long rectangular shape are mounted on the holder 7.

  The arrangement shape of the insulating frames 3 shown in FIG. 16 is completed through the above steps. The number of cores of the connector having the arrangement shape of the insulating frame 3 is 2000 cores.

  Next, a third modification will be described based on FIG.

  Hereinafter, only the difference from the above-described first embodiment (the shape of the two-dimensional array of the insulating frame 3) will be described. Except for the arrangement shape of the insulating frames 3, the third modified example and the first embodiment are the same. The description of the configuration common to the first embodiment is omitted.

  The plurality of insulating frames 3 of the third modification are arranged in a substantially cross shape.

  The connector 1 of the first embodiment is used when the terminal portions of the connection objects such as the IC package 22 and the printed circuit board 21 are arranged in a square shape, whereas the connector of the third modified example is the IC package 22. This is used when the terminal portions of the connection object such as the printed circuit board 21 or the like are arranged in a substantially cross shape (not shown).

  In order to arrange the plurality of insulating frames 3 as shown in FIG. 17, first, five insulating frames 3 are connected along the vertical direction Y by the connecting projections and recesses 33 to form three vertical rows. At the same time, the four insulating frames 3 are connected along the vertical direction Y by the connecting uneven portion 33 to form two vertical rows.

  Next, three vertical rows (rows composed of five insulating frames 3) are connected along the horizontal direction X with an adhesive.

  Thereafter, two vertical columns (a column composed of four insulating frames 3) are respectively connected to both sides of the three vertical columns by an adhesive.

  Finally, the 23 connected insulating frames 3 are attached to the holder 7.

  Through the above steps, the arrangement shape of the insulating frames 3 shown in FIG. 17 is completed. The number of cores of the connector having the arrangement shape of the insulating frame 3 is 2300 cores.

  According to each of the above-described modifications, the same effect as that of the first embodiment can be obtained.

  Next, a connector according to a second embodiment of the present invention will be described with reference to FIGS.

  Portions common to the above-described first embodiment are denoted by the same reference numerals and description thereof is omitted. Hereinafter, only the main differences from the first embodiment will be described.

  The connector 1 of the first embodiment is a connector that connects the printed circuit board 21 and the IC package 22, while the connector 201 of the second embodiment is a connector that connects the printed circuit boards. In this embodiment, the first connection object and the second connection object are both printed boards.

  As shown in FIGS. 18 and 19, the thickness (dimension in the height direction Z) of the holder 207 of the connector 201 is substantially the same as the thickness (dimension in the height direction Z) of the frame portion 31 of the insulating frame 3. is there. Further, positioning pins 273 for the printed circuit board are provided on the upper surface and the lower surface of the holder 207, respectively.

  According to 2nd Embodiment, there exists an effect similar to 1st Embodiment.

  Next, a connector according to a third embodiment of the present invention will be described with reference to FIGS.

  Portions common to the above-described first embodiment are denoted by the same reference numerals and description thereof is omitted. Hereinafter, only the main differences from the first embodiment will be described.

  The shape of the insulating frame 303 of the connector of the third embodiment is different from the shape of the insulating frame 3 of the connector 1 of the first embodiment, and the shape of the holder (not shown) of the connector of the third embodiment is the first. It differs from the shape of the holder 7 of the connector 1 of embodiment.

  As shown in FIGS. 20 to 23, each insulating frame 303 has one frame portion 331, 20 recess portions (holding portions) 32, and two pairs of connection uneven portions 333. The frame part 331 is a square frame. Of the two pairs of coupling irregularities 333, the pair of coupling irregularities 333 are provided on the two outer surfaces 331b parallel to each other of the four outer surfaces 331b of the frame portion 331, and another pair of coupling irregularities. The part 333 is provided on each of the remaining two outer side surfaces 331b of the four frame parts 331 of the frame part 331 that are parallel to each other. The connecting uneven portion 333 has a plurality of convex portions 333a. The convex portion 333a of the connecting uneven portion 333 on one outer surface 331b of the two outer surfaces 331b parallel to each other and the convex portion 333a of the connecting uneven portion 333 on the other outer surface 331b are predetermined in the lateral X direction. The pitch (half pitch) is off. The insulating frames 303 can be detachably connected along the vertical direction Y and the horizontal direction X by press-fitting the protruding portions 333 a between the protruding portions 333 a of other adjacent insulating frames 303.

  As shown in FIG. 23, five insulating frames 303 are connected along the vertical direction Y by connecting uneven portions 333 to form five rows. The five rows are arranged along the horizontal direction X and are connected by the connecting uneven portion 333. FIG. 23 shows a state in which 25 insulating frames 303 are connected in a square shape. The number of cores of this array-shaped connector is 2500.

  In addition, a guide surface (not shown) for guiding the IC package 22 into the holder is provided at the upper part of the four inner side surfaces of the holder of the connector of the third embodiment, and a connecting uneven portion is provided at the lower part of the four inner side surfaces. An uneven portion for positioning (not shown) to which 333 can be fitted is provided.

  The convex portion 33a of the connecting concave and convex portion 333 of the insulating frame 303 is fitted and adhered to the concave portion (not shown) of the positioning concave and convex portion.

  In the third embodiment, a holder of the same type as the holder 7 (a holder for electrically connecting the IC package 22 and the printed board 21) employed in the first embodiment is employed. Instead of this, a holder of the same type as the holder 207 (a holder for electrically connecting the printed boards) employed in the second embodiment may be employed.

  Further, in the third embodiment, since the connecting uneven portions 333 are formed on all the outer surfaces 331b of the frame portion 331, the insulating frames 303 can be connected to each other by changing the arrangement direction of the contact members 5. . In the aggregate of the insulating frames 303 shown in FIG. 24A, the arrangement direction of the contact members 5 held by the nine insulating frames 303 located at the center portion thereof and the 16 insulating frames 303 surrounding the nine insulating frames 303 are arranged. The arrangement direction of the contact members 5 held by the insulating frame 303 differs by 90 degrees (see FIG. 24B). FIG. 24B is a partially enlarged perspective view of the assembly of 25 insulating frames 303 shown in FIG. 24A and shows two insulating frames 303 that are adjacent along the lateral direction X. In FIG. 24B, one insulating frame 303 of two adjacent insulating frames 303 is nine insulating frames arranged at the center of the assembly of 25 insulating frames 303 shown in FIG. 24A. One of 303 is an insulating frame 303. The other insulating frame 303 of the two adjacent insulating frames 303 is insulated from one of the 16 insulating frames 303 positioned at the periphery of the nine insulating frames 303 positioned at the center. This is a sex frame 303.

  According to the third embodiment, the same effects as those of the first embodiment can be obtained, and the insulating frame 303 can be easily connected and separated, so that the connector is a terminal of an object to be connected such as the IC package 22 or the printed circuit board 21. It can be used as a connector of various connection objects having different arrangements of parts.

  In the third embodiment described above, the convex portion 333a of the connecting concave / convex portion 333 formed on one outer surface 331b of the two outer surfaces 331b parallel to each other and the convex portion 333a formed on the other outer surface 331b. Are shifted by almost a half pitch, but this is not necessarily required.

  Next, a fourth modification will be described based on FIG.

  Only the difference from the third embodiment described above (the shape of the two-dimensional array of the insulating frame 303) will be described below. Except for the arrangement shape of the insulating frames 303, the fourth modification and the third embodiment are the same. Descriptions of configurations common to the above-described embodiments are omitted.

  The plurality of insulating frames 303 of the fourth modified example are arranged in a square frame shape.

  The connector of the third embodiment is used when the terminal portions of the connection objects such as the IC package 22 and the printed circuit board 21 are arranged in a square shape, whereas the connector of the fourth modified example is the IC package 22 or This is used when the terminal portions of the connection object such as the printed circuit board 21 are arranged in a square frame shape.

  In order to arrange the plurality of insulating frames 303 as shown in FIG. 25, first, the five insulating frames 303 are connected along the vertical direction Y by the connecting uneven portion 333, and two vertical columns are formed. create.

  Next, the three insulating frames 303 are connected along the horizontal direction X by the connecting uneven portions 333 to form two horizontal rows.

  Thereafter, the first insulating frames 303 and the fifth insulating frames 303 in each vertical row are connected to each other through the horizontal rows by the connecting uneven portions 333. The connection between the vertical row and the horizontal row is not made by an adhesive.

  Finally, 16 insulating frames 303 connected in a square frame shape are mounted on a holder (not shown) (the same holder as in the third embodiment).

  Through the above steps, the arrangement shape of the insulating frames 303 shown in FIG. 25 is completed. The number of cores of the connector having the arrangement shape of the insulating frame 303 is 1600 cores.

  Next, a fifth modification will be described based on FIG.

  Only the difference from the third embodiment described above (the shape of the two-dimensional array of the insulating frame 303) will be described below. Except for the arrangement shape of the insulating frames 303, the fifth modification and the third embodiment are the same. Descriptions of configurations common to the above-described embodiments are omitted.

  The plurality of insulating frames 303 of the fifth modified example are arranged in a vertically long rectangular shape.

  The connector 1 of the third embodiment is used when the terminal portions of the connection objects such as the IC package 22 and the printed circuit board 21 are arranged in a square shape, whereas the connector of the fifth modified example is the IC package 22. It is used when the terminal portions of the connection objects such as the printed circuit board 21 and the like are arranged in a vertically long rectangular shape (not shown).

  In order to arrange a plurality of insulating frames 303 as shown in FIG. 26, first, four insulating frames 303 are connected along the vertical direction Y by connecting uneven portions 333 to form three vertical rows. .

  Next, the three vertical rows are connected along the horizontal direction X by the connecting uneven portion 333.

  Thereafter, three dummy insulating frames 303 are connected along the horizontal direction X by the connecting uneven portion 333 to form one horizontal row, and this horizontal row is placed on the three vertical rows or Connect to the bottom. The contact member 5 is not held by the three dummy insulating frames 303.

  Finally, 15 insulating frames 303 connected in a vertically long rectangular shape are attached to a holder (not shown) (the same holder as in the third embodiment).

  Through the above steps, the arrangement shape of the insulating frames 303 shown in FIG. 26 is completed. The number of cores of the connector having the arrangement shape of the insulating frame 303 is 1200 cores.

  Next, a sixth modification will be described based on FIG.

  Only the difference from the third embodiment described above (the shape of the two-dimensional array of the insulating frame 303) will be described below. Except for the arrangement shape of the insulating frames 303, the sixth modification and the third embodiment are the same. Descriptions of configurations common to the above-described embodiments are omitted.

  The plurality of insulating frames 303 of the sixth modified example are arranged in a substantially cross shape.

  The connector of the third embodiment is used when the terminal portions of the connection objects such as the IC package 22 and the printed circuit board 21 are arranged in a square shape, whereas the connector of the sixth modified example is the IC package 22 or This is used when the terminal portions of the connection object such as the printed circuit board 21 are arranged in a substantially cross shape (not shown).

  In order to arrange a plurality of insulating frames 303 as shown in FIG. 27, first, five insulating frames 303 are connected along the vertical direction Y by connecting uneven portions 333 to form three vertical rows. At the same time, the four insulating frames 303 are connected along the vertical direction Y by the connecting uneven portions 333 to form two vertical rows.

  Next, three vertical rows (rows composed of five insulating frames 303) are connected along the horizontal direction X by the connecting uneven portion 333.

  Thereafter, the two vertical rows (rows composed of four insulating frames 303) are connected to both sides of the three vertical rows by the connecting uneven portion 333.

  Finally, the 23 connected insulating frames 303 are attached to a holder (not shown) (the same holder as that of the third embodiment).

  Through the above steps, the array shape of the insulating frames 303 shown in FIG. 27 is formed. The number of cores of the connector having the arrangement shape of the insulating frame 303 is 2300 cores.

  In the above-described embodiment and modification, the contact member 5 is composed of one insulating elastic body 51, one core member 52, and ten conductive films 53, and the surface of the insulating elastic body 51 is formed. The conductive film 53 is formed directly or via a film, but instead of the contact member 5, for example, a contact constituted by a plurality of conductive elastic bodies and a single core material penetrating the conductive elastic bodies. A member (not shown) may be employed.

  In the above-described embodiments and modifications, the holders 7 and 207 are employed as one of the components of the connectors 1 and 201. However, the holders 7 and 207 are not necessarily indispensable elements for the configuration of the connectors 1 and 201.

  Further, in the first embodiment, the first, second, and third modified examples, the holder 7 is adopted as a common holder, and in the third embodiment, the fourth, fifth, and sixth modified examples, the holder (not shown). Is used as a common holder, but a dedicated holder (not shown) may be adopted for each modification.

  Moreover, in the above-described embodiment and modification, the connecting uneven portions 33 and 333 are provided on the outer surface of the frame portions 31 and 331 of the insulating frame 31 and 331. However, the connecting uneven portions 33 and 333 are necessarily required. is not. For example, the frame portions 31 and 331 may be connected to each other by using an adhesive without providing the connecting uneven portions 33 and 333 on the outer surface.

  1, 201: Connector, 3,303: Insulating frame, 31, 331: Frame portion, 31a: Inner side surface, 31b, 331b: Outer side surface, 32: Recess (holding portion), 33, 333: Convex / concave portion 33a, 333a: convex portion, 5: contact member, 51: insulating elastic body, 51a: notch, 52: core material, 52a: both ends, 53: conductive film, 7,207: holder, 71: guide surface, 72 : Uneven part for positioning, 72a: concave part, 73, 273: positioning pin, 21: printed circuit board (second connection object), 21a: terminal part (second terminal part), 21b: positioning hole, 21c: hole 22: IC package (first connection object), 23: metal plate, 23a: screw hole, 24: heat sink, 24a: plate-like portion, 24b: fin, 24c: hole, 25: bolt, X: lateral direction , Y: vertical direction, Z Height direction.

Claims (10)

It arrange | positions between the 1st connection target object and the 2nd connection target object opposite to this 1st connection target object, and electrically connects the said 1st connection target object and the said 2nd connection target object. In the connector to be connected,
A plurality of insulating frames connected in a two-dimensional array; and
A plurality of contact members that are held by the insulating frame and that electrically connect the first terminal portion formed on the first connection object and the second terminal portion formed on the second connection object; A connector characterized by comprising: The insulating frame has a rectangular frame portion;
The connector according to claim 1, wherein an uneven portion for connection that connects adjacent frame portions so as to be separable is provided on the frame portion. The connecting uneven portions are respectively provided on two outer surfaces parallel to each other among the four outer surfaces of the frame portion,
The convex portion of the connecting concave / convex portion on one outer surface of the two outer surfaces and the convex portion of the concave connecting portion on the other outer surface have a predetermined pitch in a direction parallel to the two outer surfaces. The connector according to claim 2, wherein the connector is displaced. The connecting irregularities are respectively provided on the four outer surfaces of the frame,
Of the four outer surfaces, a convex portion of the connecting concave / convex portion on one outer surface parallel to each other and a convex portion of the concave connecting portion on the other outer surface are parallel to the parallel outer surface. The connector according to claim 2, wherein the connector is shifted by a predetermined pitch in any direction. The contact member has an insulating elastic body, and a core material provided in the insulating elastic body so as to penetrate in the longitudinal direction thereof,
Both ends of the core member protrude from both ends of the insulating elastic body,
The connector according to any one of claims 2 to 4, wherein the insulating frame includes a holding portion that is provided on the frame portion and holds both end portions of the core member. The connector according to claim 5, wherein the holding portion is a recess that accepts both end portions of the core member. The connector according to claim 1, further comprising a holder that holds the plurality of insulating frames that are two-dimensionally arranged and connected. The connector according to claim 7, wherein the holder has a positioning concavo-convex portion that can be fitted to the connecting concavo-convex portion. A thickness dimension of the holder is larger than a thickness dimension of the frame portion of the insulating frame;
The connector according to claim 7 or 8, wherein a guide surface for guiding the first connection object into the holder is formed on an upper portion of the holder. The connector according to claim 7 or 8, wherein a thickness dimension of the holder and a thickness dimension of the frame portion of the insulating frame are substantially equal.

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