JP2014006478A - Electro-optic module and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electro-optic module and an electronic apparatus capable of preventing a short circuit in a vicinity of an edge of an element substrate of an electrooptical panel between electric wiring of a flexible wiring board and a conductive layer of an element substrate when the flexible wiring board is connected to the element substrate, and also preventing a poor connection between the element substrate and the flexible wiring board.SOLUTION: In an electro-optic module 10, a first projection 72 of an emission side parting member 70 (first holding member) makes contact with a first surface 90a of a flexible wiring board 90 at a position alienated from a side face 514 of an element substrate 51 and bends the flexible wiring board 90 so that the flexible wiring board 90 is alienated from element substrate 51. A second projection 62 of a frame 60 (second holding member) makes contact with the flexible wiring board 90 from a side of a second face 90b of the flexible wiring board 90 at a position between an edge closer to the side face 514 of a connection part 95 that connects a first terminal 402 and a second terminal 902, and a position at which the first projection 72 of the emission side parting member 70 makes contact with the flexible wiring board 90.

Description

  The present invention relates to an electro-optic module in which a flexible wiring board is connected to an electro-optic panel, and an electronic apparatus including the electro-optic module.

  When displaying an image in an electronic device, light modulated by an electro-optical panel such as a liquid crystal panel or an organic electroluminescence panel is used. Among such electro-optical panels, for example, a liquid crystal panel includes an element substrate 51, a counter substrate 52 facing one side of the element substrate 51, and a gap between the element substrate 51 and the counter substrate 52, as shown in FIG. The first terminal 402 is formed on the protruding portion 515 protruding from the counter substrate 52 of the element substrate 51. When the electro-optical panel 40 is mounted on an electronic device as the electro-optical module 10, the second terminal 902 of the flexible wiring substrate 90 is connected to the first terminal 402 of the element substrate 51 by an anisotropic conductive material or the like. The substrate 90 is pulled out from the side surface 514 of the element substrate 51 (see Patent Document 1).

  In Patent Document 1, since a silicon substrate is used as the element substrate 51, the first terminal 402 is used for the purpose of preventing a short circuit between the edge of the element substrate 51 made of a silicon substrate and the flexible wiring substrate 90. It has been proposed that the distance between the second terminal 902 and the second terminal 902 be smaller than the distance between the second terminal 902 and the element substrate 51.

  In such an element substrate 51, a conductive layer 403 connected to the first terminal 402 or the like may extend to the side surface 514 of the element substrate 51 on the lower layer side or the same layer of the first terminal 402. That is, when manufacturing a large substrate, the conductive layer 403 connected to the first terminal 402 or the like may extend outward from a region cut out as the element substrate 51. In such a case, the large substrate is cut. Thus, when the element substrate 51 is obtained, the conductive layer 403 extends to the side surface 514 of the element substrate 51.

JP 2009-128779 A

  In the case of the above configuration, as shown in FIG. 14A, the conductive layer 403 may be exposed on the side surface 514 of the element substrate 51 in a deformed state of burr, and the exposed portion 403a breaks through the solder resist and is flexible. There is a problem of short-circuiting with the wiring of the wiring board 90. In addition, as illustrated in FIG. 14B, an insulating film 518 may be formed on the surface of the conductive layer 403. However, even in such a case, when the insulating film 518 is peeled off near the side surface 514 of the element substrate 51 when the large substrate is cut, the conductive layer 403 is exposed in a state where the conductive layer 403 is deformed into a burr on one side of the element substrate 51. However, there is a problem that the exposed portion 403a breaks through the solder resist and short-circuits with the wiring of the flexible wiring board 90.

  Further, when the flexible wiring board 90 is mounted on the element substrate 51, if the flexible wiring board 90 hits the edge of the element substrate 51, the solder resist may be damaged, and the wiring of the flexible wiring board 90 may be exposed. In such a case, as shown in FIGS. 14A and 14B, when the exposed portion 403a of the conductive layer 403 is generated, the exposed portion 403a and the wiring of the flexible wiring board 90 are short-circuited.

  Therefore, the present inventor proposes bending the flexible wiring board 90 in a direction away from the element substrate 51. However, if the flexible wiring board 90 is bent in a direction away from the element substrate 51, the first terminal 402 and the second terminal There is a possibility that an excessive force is applied to the connection portion with the terminal 902 to cause a connection failure.

  In view of the above problems, the problem of the present invention is that when the flexible wiring board is connected to the element substrate of the electro-optical panel, the wiring on the flexible wiring board side and the conductive layer on the element board side in the vicinity of the edge of the element substrate It is an object of the present invention to provide an electro-optic module that can prevent a short circuit and a poor connection between an element substrate and a flexible wiring board, and an electronic device including the electro-optic module.

  In order to solve the above-described problems, an electro-optic module according to the present invention includes an element substrate that holds an electro-optic material on one side and has a first terminal between the image display region and the side on the one side. An electro-optical panel provided; and a second terminal electrically connected to the first terminal on a first surface facing the element substrate, the lead terminal being pulled out of the electro-optical panel from the second terminal The flexible wiring board and the flexible wiring board in contact with the first surface of the flexible wiring board at a position spaced apart from the side surface of the element substrate in a direction of drawing the flexible wiring board from the electro-optic panel in plan view A first holding member that bends the substrate away from the element substrate; and an edge on the side of the side of the connecting portion between the first terminal and the second terminal in the pull-out direction; A second holding member in contact with the flexible wiring board from a second surface side opposite to the first surface of the flexible wiring board between the first holding member and a position in contact with the flexible wiring board. It is characterized by.

  In the present invention, the first holding member is bent so as to be in contact with the first surface of the flexible wiring board at a position separated from the side surface of the element substrate and to be separated from the element substrate. For this reason, even if the conductive layer is exposed on the side surface of the element substrate or in the vicinity of the side surface, the exposed portion of the conductive layer on the element substrate side and the wiring of the flexible wiring substrate can be prevented from being short-circuited. Further, the second holding member is located on the second surface side of the flexible wiring board between the edge on the side surface of the connecting portion between the first terminal and the second terminal and the position where the first holding member contacts the flexible wiring board. Is in contact with the flexible wiring board, and the flexible wiring board is bent starting from a portion where the second holding member and the flexible wiring board are in contact. For this reason, since an excessive force is not applied to the connection portion between the first terminal and the second terminal, it is possible to prevent the occurrence of connection failure at the connection portion between the first terminal and the second terminal. Therefore, the reliability of the electro-optic module can be improved. Moreover, since the flexible wiring board is bent into a predetermined shape by the first holding member and the second holding member, a forming process for bending the flexible wiring board in advance is not required. Therefore, the production cost of the electro-optic module can be reduced.

  In this invention, it is preferable that the said 2nd holding member is in contact with the said flexible wiring board by the said connection part side from the said side surface in the said pull-out direction. According to such a configuration, the flexible wiring board can be reliably separated from the vicinity of the side surface of the element substrate. Therefore, even if the conductive layer is exposed near the side surface or the side surface of the element substrate, the conductive layer on the element substrate side is exposed. It is possible to reliably prevent the portion and the flexible wiring board from being short-circuited.

  In the present invention, the first holding member includes a first plate-like portion facing the first surface of the flexible wiring board, and a first protrusion protruding from the first plate-like portion toward the flexible wiring board. A configuration in which the first convex portion is in contact with the flexible wiring board can be employed.

  In the present invention, the second holding member includes a second plate-like portion facing the second surface of the flexible wiring board, and a second convex portion protruding from the second plate-like portion toward the flexible wiring board. A configuration in which the second convex portion is in contact with the flexible wiring board can be employed.

  In this invention, it is preferable that the front-end | tip part of the said 2nd convex part is contact | abutting to the said 2nd surface of the said flexible wiring board.

  In this case, it is preferable that the height position of the tip portion of the second convex portion from the element substrate is lower than the height position from the element substrate of the portion overlapping the second terminal on the second surface. According to such a configuration, the flexible wiring board is bent starting from a position close to one surface of the element substrate, so that an excessive force is not applied to the connection portion between the first terminal and the second terminal. Therefore, it is possible to prevent the occurrence of connection failure at the connection portion between the first terminal and the second terminal.

  In this invention, you may employ | adopt the structure which the said 2nd convex part fits in the penetration part which penetrates the said flexible wiring board, and is in contact with the inner edge of the said penetration part.

  In the present invention, the first holding member overlaps the electro-optical panel on the other surface side opposite to the one surface side of the element substrate, and the second holding member is on the one surface side of the element substrate. It is preferable that the electro-optical panel is held between the first holding member and the electro-optical panel. According to such a configuration, a part of the members (the first holding member and the second holding member) that hold the electro-optical panel is used, and the short circuit near the side surface of the flexible wiring board and the element board, and the element board and the flexible board are flexible. Since connection failure with the wiring board can be prevented, there is no need to add another member.

  The present invention is effective when applied to the case where the first terminal and the second terminal are electrically connected via an anisotropic conductive material. If the first terminal and the second terminal are electrically connected via an anisotropic conductive material, a connection failure is likely to occur when a large force is applied. Can be prevented.

  In the present invention, the electro-optical panel includes a counter substrate facing the one surface side of the element substrate, and the first terminal is formed in a protruding portion protruding outward from the counter substrate in the element substrate. A configuration can be adopted.

  The electro-optic module according to the present invention can be used in various electronic devices. When the projection display device is configured as an electronic device, the electronic device includes a light source unit that emits light supplied to the electro-optic module, and a projection optical system that projects light modulated by the electro-optic module. ,have.

It is explanatory drawing of the projection type display apparatus as an example of the electronic device to which this invention is applied. It is explanatory drawing which shows the structure of the optical unit used for the projection type display apparatus to which this invention is applied. It is explanatory drawing which shows the detailed structure of the optical unit used for the projection type display apparatus to which this invention is applied. It is explanatory drawing of the electro-optical panel used for the electro-optical module to which this invention is applied. FIG. 3 is a perspective view of the electro-optic module according to Embodiment 1 of the present invention when viewed from the light emitting side. 1 is a cross-sectional view of an electro-optic module according to Embodiment 1 of the present invention. FIG. 3 is a plan view of the electro-optic module according to Embodiment 1 of the present invention on the side where a flexible wiring board is connected. FIG. 6 is a YZ cross-sectional view of an electro-optic module according to Modification 1 of Embodiment 1 of the present invention. FIG. 10 is a plan view of a side where a flexible wiring board is connected in an electro-optic module according to a second modification of the first embodiment of the present invention. It is explanatory drawing of the electro-optic module which concerns on Embodiment 2 of this invention. FIG. 6 is a plan view of a side to which a flexible wiring board is connected in an electro-optic module according to a second embodiment of the present invention. FIG. 6 is a YZ cross-sectional view of an electro-optic module according to Modification 1 of Embodiment 2 of the present invention. It is explanatory drawing which shows the other structural example of the 1st convex part of the electro-optic module to which this invention is applied, and a 2nd convex part. It is explanatory drawing of the electro-optic module which concerns on the reference example of this invention.

  Embodiments of the present invention will be described with reference to the drawings. In the following description, as an electronic apparatus to which the present invention is applied, a projection display device using an electro-optic module including a transmissive electro-optic panel (transmissive liquid crystal panel) as a light valve will be described. In the drawings referred to in the following description, the scales are different for each layer and each member so that each layer and each member have a size that can be recognized on the drawing.

[Embodiment 1]
(Projection type display device (electronic equipment) as a whole)
FIG. 1 is an explanatory diagram of a projection display device as an example of an electronic apparatus to which the present invention is applied, and FIGS. 1A and 1B show a planar configuration of a main part of the projection display device. It is explanatory drawing and explanatory drawing when a main part is seen from the side. FIG. 2 is an explanatory diagram showing the configuration of the optical unit used in the projection display device to which the present invention is applied.

  In the projection display device 1 shown in FIG. 1, a power supply unit 7 is disposed on the rear end side inside the exterior case 2, and a light source lamp unit 8 (light source unit) and a power supply unit 7 are adjacent to each other on the front side of the device. An optical unit 9 is arranged. Further, the base end side of the projection lens unit 6 is located in the center of the front side of the optical unit 9 inside the exterior case 2. On one side of the optical unit 9, an interface board 11 on which an input / output interface circuit is mounted is arranged in the front-rear direction of the apparatus, and a video board 12 on which a video signal processing circuit is mounted is parallel to the interface board 11. Has been placed. On the upper side of the light source lamp unit 8 and the optical unit 9, a control board 13 for device drive control is disposed, and speakers 14R and 14L are disposed on the left and right corners on the front end side of the device.

  Above and below the optical unit 9, intake fans 15A and 15B for cooling the inside of the apparatus are arranged. Further, an exhaust fan 16 is disposed on the side of the apparatus that is the back side of the light source lamp unit 8. Further, an auxiliary cooling fan 17 for sucking the cooling airflow from the intake fan 15A into the power supply unit 7 is disposed at a position facing the ends of the interface board 11 and the video board 12. Among these fans, the intake fan 15B functions as a cooling fan (cooling device) for the electro-optical panel 40 described later.

  In FIG. 2, each optical element (element) constituting the optical unit 9 includes an upper light guide 21 or a lower light guide 22 made of a metal such as Mg or Al, including the prism unit 20 constituting the color light combining means. Is supported by The upper light guide 21 and the lower light guide 22 are fixed to the upper case 3 and the lower case 4 with fixing screws.

(Detailed configuration of the optical unit 9)
FIG. 3 is an explanatory diagram showing a detailed configuration of the optical unit used in the projection display device to which the present invention is applied. As shown in FIG. 3, the optical unit 9 includes a light source lamp 805, an illumination optical system 923 having integrator lenses 921 and 922 that are uniform illumination optical elements, and a light beam W emitted from the illumination optical system 923 as red light. Color light separation optical system 924 that separates the light beams R, G, and B of green, blue. The optical unit 9 includes three transmissive electro-optical panels 40 (R), 40 (G), and 40 (B) as electro-optical panels (light valves) that modulate light beams of each color, and modulated colors. It has a prism unit 20 as a color light combining optical system for combining light beams, and a projection lens unit 6 for enlarging and projecting the combined light beams on the projection surface. In addition, a relay optical system 927 that guides the electro-optical panel 40 (B) corresponding to the blue light beam B out of the color light beams separated by the color light separation optical system 924 is provided.

  The illumination optical system 923 further includes a reflection mirror 931 so that the optical axis 1a of light emitted from the light source lamp 805 is bent at a right angle toward the front of the apparatus. The integrator lenses 921 and 922 are disposed so as to be orthogonal to each other with the reflection mirror 931 interposed therebetween.

  The color light separation optical system 924 includes a blue-green reflecting dichroic mirror 941, a green reflecting dichroic mirror 942, and a reflecting mirror 943. First, in the blue-green reflective dichroic mirror 941, the blue light beam B and the green light beam G included in the light beam W that has passed through the illumination optical system 923 are reflected at right angles to the green reflecting dichroic mirror 942 side. Head. The red light beam R passes through the blue-green reflecting dichroic mirror 941, is reflected at a right angle by the rear reflecting mirror 943, and is emitted from the red light beam emitting portion 944 to the color light combining optical system side. Next, in the green reflection dichroic mirror 942, only the green light beam G is reflected at right angles out of the blue and green light beams B and G reflected by the blue-green reflection dichroic mirror 941, and the color is emitted from the emission portion 945 of the green light beam. The light is emitted to the side of the photosynthetic optical system. The blue light beam B that has passed through the green reflecting dichroic mirror 942 is emitted from the blue light beam emitting portion 946 to the relay optical system 927 side. In this embodiment, the distances from the light beam emitting portion of the illumination optical system 923 to the color light beam emitting portions 944, 945, and 946 in the color light separation optical system 924 are all set to be substantially equal.

  Condensing lenses 951 and 952 are arranged on the emission side of the emission portions 944 and 945 of the red light beam and the green light beam of the color light separation optical system 924, respectively. Therefore, the red light beam and the green light beam emitted from each light emitting part are incident on these condenser lenses 951 and 952 and are collimated.

  The collimated red and green light beams R and G are incident on the electro-optical panels 40 (R) and 40 (G) after their polarization directions are aligned by the polarizing plates 160 (R) and 160 (G). Modulated and image information corresponding to each color light is added. That is, the electro-optical panels 40 (R) and 40 (G) are switching-controlled by an image signal corresponding to image information by a driving unit (not shown), thereby modulating each color light passing therethrough. Is called. As such driving means, known means can be used as they are.

  On the other hand, the blue light beam B is guided to the corresponding electro-optical panel 40 (B) through the relay optical system 927 and further aligned in the polarization direction by the polarizing plate 160 (B). Modulation is performed according to the image information. The relay optical system 927 is disposed on the front side of the condensing lens 974, the incident-side reflecting mirror 971, the emitting-side reflecting mirror 972, the intermediate lens 973 disposed between these mirrors, and the electro-optical panel 40 (B). Condensing lens 953 is comprised. As for the length of the optical path of each color beam, that is, the distance from the light source lamp 805 to each liquid crystal panel, the blue beam B is the longest, and the light amount loss of this beam is the greatest. However, the light loss can be suppressed by interposing the relay optical system 927.

  Each color light beam modulated through each electro-optical panel 40 (R), 40 (G), 40 (B) is incident on the polarizing plate 161 (R), 161 (G), 161 (B). The transmitted light is incident on the prism unit 20 (cross dichroic prism) and synthesized. The synthesized color image is enlarged and projected onto a projection surface 1b such as a screen at a predetermined position via a projection lens unit 6 having a projection lens system.

(Configuration of electro-optical panel 40)
FIG. 4 is an explanatory view of an electro-optical panel 40 used in an electro-optical module to which the present invention is applied. FIGS. 4 (a) and 4 (b) each show the electro-optical panel 40 together with each component on the side of a counter substrate. It is the top view seen from and HH 'sectional drawing.

  In FIG. 4 and FIG. 5 described later, the traveling direction of the light source light is indicated by an arrow L11, and the traveling direction of the display light after the light source light is modulated by the electro-optical panel 40 is indicated by an arrow L12. The flow of cooling air (cooling gas) supplied to the electro-optical panel 40 by the illustrated intake fan 15B or the like is indicated by an arrow A. In the following description, one of the in-plane directions of the electro-optic panel 40 and the electro-optic module 10 is the X-axis direction, the other is the Y-axis direction, and intersects the X-axis direction and the Y-axis direction. Let the direction be the Z-axis direction. In the drawings referred to below, one side in the X-axis direction (side on which the flexible wiring board 90 is provided) is the X1 side, the other side is the X2 side, and one side in the Y-axis direction is the Y1 side. The other side is the Y2 side, one side in the Z-axis direction (the side on which the light source light is incident) is the Z1 side, and the other side (the side on which the display light is emitted) is the Z2 side.

  In the projection display device 1 described with reference to FIGS. 1 to 3, when the electro-optical panels 40 (R), 40 (G), and 40 (B) are mounted on the optical unit 9, the electro-optical panel 40 ( R), 40 (G), and 40 (B) are mounted as electro-optic modules 10 (R), 10 (G), and 10 (B), which will be described later. The electro-optic modules 40 (R), 40 (G), and 40 (B) have the same configuration, and the electro-optic module includes the electro-optic panels 40 (R), 40 (G), and 40 (B). 10 (R), 10 (G), and 10 (B) have the same configuration for red (R), green (G), and blue (B). Therefore, in the following description, for the electro-optical panels 40 (R), 40 (G), 40 (B), the electro-optical modules 10 (R), 10 (G), 10 (B), etc., the corresponding colors are used. It demonstrates without attaching | subjecting (R) (G) (B) which shows.

  As shown in FIG. 4, in the electro-optical panel 40, a light-transmitting element substrate 51 and a light-transmitting counter substrate 52 are bonded together with a sealing material 407 with a predetermined gap. The element substrate 51 and the counter substrate 52 are made of quartz glass, heat-resistant glass, or the like. In this embodiment, the element substrate 51 and the counter substrate 52 are made of quartz glass. In this embodiment, the electro-optical panel 40 is a liquid crystal panel, and a liquid crystal layer 450 as an electro-optical material layer is held in a region surrounded by a sealant 407 between the element substrate 51 and the counter substrate 52. The sealing material 407 is provided in a frame shape along the outer edge of the counter substrate 52. The sealing material 407 is a photo-curing adhesive, a thermosetting adhesive, or an adhesive having both photo-curing and thermosetting, and the distance between the two substrates is set to a predetermined value. Gap materials such as glass fiber or glass beads are blended. Here, a part of the sealing material 407 is interrupted, and the liquid crystal injection port 407a is formed by the interrupted part. The liquid crystal injection port 407a is sealed with a sealing material 406 after the liquid crystal material is injected.

  In this embodiment, the element substrate 51 has a quadrangular shape in plan view, and includes side surfaces 511, 512, 513, and 514 each having four sides. Similarly to the element substrate 51, the counter substrate 52 is quadrangular in a plan view, and includes side surfaces 521, 522, 523, and 524 having four sides. At substantially the center of the electro-optical panel 40, an image display area 40a for emitting modulated light is provided as a square area. Corresponding to this shape, the sealing material 407 is also provided in a substantially square shape, and a rectangular frame-shaped peripheral region 40c is provided between the inner peripheral edge of the sealing material 407 and the outer peripheral edge of the image display region 40a.

  In this embodiment, the element substrate 51 is larger in size than the counter substrate 52, and the four side surfaces 511, 512, 513, and 514 of the element substrate 51 protrude outward from the side surfaces 521, 522, 523, and 524 of the counter substrate 52. Yes. Therefore, a step portion is formed around the counter substrate 52 by the element substrate 51 and the side surfaces 521, 522, 523, and 524 of the counter substrate 52, and the element substrate 51 is exposed from the counter substrate 52 in the step portion. Is in a state.

  Of the first surface 51a (one surface) and the second surface 51b (the other surface) of the element substrate 51, the first surface 51a facing the counter substrate 52 has a light-transmitting pixel electrode 405a in the image display region 40a. In addition, pixels including pixel transistors (switching elements / not shown) corresponding to the pixel electrodes 405a are formed in a matrix, and an alignment film 416 is formed on the upper side of the pixel electrodes 405a. Further, on the first surface 51a of the element substrate 51, a dummy pixel electrode 405b formed simultaneously with the pixel electrode 405a is formed in the peripheral region 40c. For the dummy pixel electrode 405b, a configuration in which the dummy pixel transistor is electrically connected, a configuration in which the dummy pixel transistor is not provided, and a configuration in which the dummy pixel electrode is directly electrically connected to the wiring, or a floating state in which no potential is applied The structure which exists in is adopted.

  In the element substrate 51, the side surface 514 located on one side Y1 in the Y-axis direction protrudes from the side surface 524 of the counter substrate 52, and the surface (first surface 51a) of the protruding portion 515 on the counter substrate 52 side includes: A data line driving circuit 401 and a plurality of first terminals 402 are formed along the side surface 514. A scanning line driving circuit 404 is formed on the element substrate 51 along the side surfaces 511 and 512. Accordingly, on the first surface 51 a of the element substrate 51, a plurality of first terminals 402 are formed between the image display region 40 a and the side surface 514. In plan view, the side surface 514 located on one side Y1 in the Y-axis direction of the element substrate 51 protrudes from the side surface 524 of the counter substrate 52 to be larger than the other side surfaces 511, 512, and 513.

  In addition, a flexible wiring substrate 90 is connected to the element substrate 51. Of the first surface 90 a and the second surface 90 b of the flexible wiring board 90, the second terminal 902 is formed on the first surface 90 a facing the element substrate 51 at a position overlapping the first terminal 402 in plan view. The first terminal 402 and the second terminal 902 are electrically connected. Accordingly, various potentials and various signals are input to the element substrate 51 via the flexible wiring substrate 90. Various methods can be employed for connection between the first terminal 402 and the second terminal 902. In this embodiment, the first terminal 402 and the second terminal 902 are connected by an anisotropic conductive material. ing.

  Of the first surface 52a and the second surface 52b of the counter substrate 52, a transparent common electrode 421 is formed on the first surface 52a facing the element substrate 51, and an alignment film is formed on the common electrode 421. 426 is formed. The common electrode 421 is formed over substantially the entire surface of the counter substrate 52 or across a plurality of pixels as a plurality of strip-like electrodes. In this embodiment, the common electrode 421 is formed over the entire surface of the counter substrate 52. In addition, a light shielding layer 408 is formed on the first surface 52 a of the counter substrate 52 on the lower layer side of the common electrode 421. In this embodiment, the light shielding layer 408 is formed in a frame shape extending along the outer peripheral edge of the image display region 40 a, and the image display region 40 a is defined by the inner edge of the light shielding layer 408. Note that the light shielding layer 408 may be formed as a black matrix or a black stripe in a region overlapping with a region sandwiched between adjacent pixel electrodes 405 a in the counter substrate 52.

  On the element substrate 51, an inter-substrate conduction electrode 409 is formed in a region overlapping the corner portion of the counter substrate 52 outside the sealing material 407 to establish electrical continuity between the element substrate 51 and the counter substrate 52. ing. An inter-substrate conducting material 409a containing conductive particles is disposed between the inter-substrate conducting electrode 409 and the counter substrate 52. The common electrode 421 of the counter substrate 52 is connected to the inter-substrate conducting material 409a and the inter-substrate conducting material. It is electrically connected to the element substrate 51 side through the common electrode 409. For this reason, a common potential is applied to the common electrode 421 from the element substrate 51 side. The sealing material 407 is provided along the outer peripheral edge of the counter substrate 52 with substantially the same width dimension.

  In the electro-optical panel 40 having such a configuration, in this embodiment, since the pixel electrode 405a and the common electrode 421 are formed of a light-transmitting conductive film such as an ITO film, the electro-optical panel 40 is a transmissive liquid crystal panel. In the case of such a transmissive liquid crystal panel (electro-optical panel 40), light incident from one of the element substrate 51 and the counter substrate 52 is modulated while being transmitted through the other substrate and emitted. . In this embodiment, light (indicated by an arrow L11) incident from the counter substrate 52 is transmitted through the element substrate 51 and emitted as modulated light (indicated by an arrow L12). For this reason, the counter substrate 52 is disposed on one side Z1 in the Z-axis direction, and the element substrate 51 is disposed on the other side Z2 in the Z-axis direction. Note that when the common electrode 421 is formed using a light-transmitting conductive film and the pixel electrode 405a is formed using a reflective conductive film, a reflective liquid crystal panel can be formed. In the case of a reflective liquid crystal panel, light incident from the counter substrate 52 side is modulated while being reflected and emitted by the element substrate 51 side. Since the electro-optical panel 40 of this embodiment is used as a light valve in the above-described projection display device (liquid crystal projector), no color filter is formed. However, when the electro-optical panel 40 is used as a direct-view color display device of an electronic device such as a mobile computer or a mobile phone, a color filter is formed on the counter substrate 52.

(Overall configuration of electro-optic module 10)
FIG. 5 is a perspective view of the electro-optic module according to Embodiment 1 of the present invention when viewed from the light emitting side. 6 is a cross-sectional view of the electro-optical module according to Embodiment 1 of the present invention. FIGS. 6A and 6B are a YZ cross-sectional view of the electro-optical module, and a flexible wiring board 90 and an element substrate 51. FIG. It is YZ sectional drawing which expands and shows a mode that the connection part vicinity was expanded. In FIG. 6B, the first light transmitting plate 56, the second light transmitting plate 57, the incident side parting member 80, and the like are not shown.

  When the electro-optical panel 40 described with reference to FIG. 4 is mounted on the projection display device 1 and the optical unit 9 described with reference to FIGS. 1 to 3, the flexible wiring board 90 is mounted on the electro-optical panel 40. As shown in FIG. 5 and FIG. 6A, the electro-optic panel 10 is held by the frame 60 (second holding member) for the purpose of reinforcement and the like. Further, in the electro-optic module 10 of the present embodiment, in addition to the electro-optic panel 40 and the frame 60, the exit-side parting member 70 (first holding member) and the incident-side parting member 80 are used. In this embodiment, as will be described later with reference to FIG. 6B, the exit-side parting member 70 is used as a “first holding member” in the present invention, and the frame 60 is a “second holding member” in the present invention. Are used to prevent a short circuit between the flexible wiring board 90 and the element substrate 51.

  As shown in FIG. 4B, FIG. 5 and FIG. 6A, in this embodiment, when the electro-optic module 10 is configured using the electro-optic panel 40, the element substrate 51 of the electro-optic panel 40 is used. A first translucent plate 56 is affixed to the second surface 51b (outer surface / surface opposite to the counter substrate 52 of the element substrate 51) with an adhesive or the like, and the second surface 52b of the counter substrate 52 (element of the outer surface / counter substrate 52) A second light transmissive plate 57 is attached to the surface opposite to the substrate 51 with an adhesive or the like. The first translucent plate 56 and the second translucent plate 57 are each configured as dust-proof glass, and dust and the like are disposed on the outer surface (second surface 51b) of the element substrate 51 and the outer surface (second surface 52b) of the counter substrate 52. Prevents from adhering to. For this reason, even if dust adheres to the electro-optical panel 40, the dust is separated from the electro-optical material layer 450. Therefore, in the projection type display apparatus 1 described with reference to FIG. 1 and the like, dust is in a defocused state, so that it is possible to suppress the dust from being projected as an image on the projected image. Quartz glass, heat-resistant glass, or the like is used for the first light-transmitting plate 56 and the second light-transmitting plate 57. In this embodiment, the first light-transmitting plate 56 and the second light-transmitting plate 57 include the element substrate 51. Similarly to the counter substrate 52, quartz glass is used, and the thickness thereof is 1.1 to 1.2 mm.

  The first light transmissive plate 56 is provided so as to overlap at least the image display region 40 a of the electro-optical panel 40 with a part of the second surface 51 b of the element substrate 51 exposed. More specifically, the first light transmissive plate 56 has a quadrangular shape smaller than the element substrate 51 in plan view, and the second surface 51b of the element substrate 51 is exposed around the first light transmissive plate 56. Is in a state. The second light transmissive plate 57 is provided so as to overlap at least the image display region 40 a of the electro-optical panel 40 with a part of the second surface 52 b of the counter substrate 52 exposed. More specifically, the second light transmissive plate 57 is a quadrangle that is substantially the same size as the first light transmissive plate 56 in plan view, and is smaller in size than the counter substrate 52. Therefore, the second surface 52 b of the counter substrate 52 is exposed around the second light transmitting plate 57.

(Configuration of frame 60)
As shown in FIGS. 5 and 6A, the frame 60 is a rectangular frame-shaped resin member or metal member having a rectangular opening at the center, and a frame that houses the electro-optical panel 40 inside. A portion 65 is provided. The connecting portions (corner portions) of the frame portion 65 are prismatic connecting portions 651, 652, 653, 654, and the electro-optic module 10 is fixed by screwing at the connecting portions 651, 652, 653, 654, or the like. 1 is fixed to a predetermined position of the projection display device 1 shown in FIG. In this embodiment, the frame 60 is a metal member such as aluminum and has a higher thermal conductivity than the element substrate 51 and the counter substrate 52.

  In the frame portion 65 of the frame 60, the inner side surface other than the portion on the one side Y <b> 1 in the Y-axis direction where the protruding portion 515 of the element substrate 51 is located has the first light transmitting plate 56 and the second light transmitting plate on the electro-optical panel 40. It has a multi-stage structure corresponding to the shape of the end portion with 57 attached. On the other hand, in the frame portion 65, the portion where the protruding portion 515 of the element substrate 51 is located is a plate-like portion 64 that faces the second surface 90 b of the flexible wiring substrate 90, and the side surface 514 of the element substrate 51. Is not covered. In other words, when the electro-optical panel 40 side is the upper surface and the opposite side is the lower surface of the frame portion 65 of the frame 60, the Y1 direction portion on the one side Y1 is compared with other than the Y axis direction portion on the one side Y1. And the top surface is low. For this reason, the flexible wiring board 90 can be pulled out of the frame 60.

(Configuration of incident-side parting member 80 on the incident side)
On the light incident side (one side Z1 in the Z-axis direction) with respect to the frame 60, a plate-shaped incident-side parting member 80 made of a metal plate or a resin plate is disposed so as to overlap. In this embodiment, the incident side parting member 80 is made of metal. The incident-side parting member 80 includes a rectangular end plate portion 87 that overlaps the frame 60 on the light incident side, and the end plate portion 87 has an opening 88 that overlaps the opening portion of the frame 60. . The opening 88 is smaller than the opening of the frame 60, and the end plate part 87 protrudes inside the opening on the entire circumference of the opening. For this reason, the end plate part 87 of the incident side parting member 80 functions as a parting part that restricts a range in which light enters the electro-optical panel 40. The incident-side parting member 80 includes side plate portions 81 on both sides in the X-axis direction, and an engagement hole 810 is formed in each of the two side plate portions 81. On the other hand, in the frame portion 65 of the frame 60, a protrusion 617 that fits in each of the two engagement holes 810 is formed on the outer surface that overlaps the side plate portion 81. Therefore, the incident-side parting member 80 is connected to the frame 60 by the side plate portion 81 engaging with the protrusion 617 of the frame 60, and is integrated with the frame 60. As a result, a panel housing portion 66 having the end plate portion 87 of the incident-side parting member 80 as a bottom portion is formed inside the frame 60, and the first light transmitting plate 56 and the second light transmitting light are formed in the panel housing portion 66. The electro-optical panel 40 to which the plate 57 is attached is accommodated.

(Configuration of exit side parting member 70)
In the present embodiment, the first light transmissive plate 56 has a quadrangular shape that is smaller than the element substrate 51. Therefore, in this embodiment, the exit-side parting member 70 is provided on the second surface 51 b side of the element substrate 51, and the exit-side parting member 70 is the first light transmitting portion of the second surface 51 b of the element substrate 51. A frame portion 75 that overlaps on the other side Z2 in the Z-axis direction is provided at a portion exposed from the plate 56. In this embodiment, the exit-side parting member 70 is made of a material having a higher thermal conductivity than the first light transmitting plate 56 and the electro-optical panel 40 (the element substrate 51 and the counter substrate 52). More specifically, the exit side parting member 70 is made of a metal such as aluminum or copper. Accordingly, the exit-side parting member 70 functions as a heat radiating member that holds the electro-optical panel 40 with the frame 60 and releases heat generated in the electro-optical panel 40 to the frame 60.

  The exit-side parting member 70 includes an inner peripheral thin plate portion 77 (plate-shaped portion) that protrudes inward from the inner edge of the frame portion 75, and the inner peripheral thin plate portion 77 is the first light transmitting plate 56. In FIG. 4, the surface of the electro-optical panel 40 is overlapped with the surface opposite to the side where the electro-optical panel 40 is located. Here, an opening 78 is formed in the inner peripheral thin plate portion 77 in a region overlapping the image display region 40a of the electro-optic panel 40, and the inner peripheral thin plate portion 77 functions as a parting part on the emission side. . Therefore, the surface of the exit side parting member 70 is blackened.

  In the frame part 75 of the exit side parting member 70, a part other than the part on the one side Y <b> 1 in the Y-axis direction where the protruding part 515 of the element substrate 51 is located overlaps the frame part 65 of the frame 60. On the other hand, a portion of the frame portion 65 where the protruding portion 515 of the element substrate 51 is located has a gap for drawing the flexible wiring board 90 to the outside of the frame 60 between the plate-like portion 64 of the frame 60. It is composed.

(Structure around flexible wiring board 90)
FIG. 7 is a plan view of the electro-optic module 10 according to Embodiment 1 of the present invention on the side where the flexible wiring board 90 is connected.

  As shown in FIG. 6B, the electro-optic module 10 of the present embodiment is formed on the one end Y <b> 1 in the Y-axis direction at the end of the first surface 51 a of the element substrate 51 (the end of the protruding portion 515). The first terminal 402 and the second terminal 902 formed on the first surface 90a of the flexible wiring board 90 are connected by an anisotropic conductive material (not shown). A region other than the region where the second terminals 902 and the like are formed in the flexible wiring substrate 90 is covered with a solder resist (not shown). Further, the flexible wiring board 90 is pulled out from the second terminal 902 to the outside of the electro-optical panel 40, and is further pulled out to the one side Y1 in the Y-axis direction through the space between the frame 60 and the emission side parting member 70. Yes.

  In this embodiment, the second terminal 902 has a larger dimension in the pull-out direction of the flexible wiring board 90 than the first terminal 402. In this embodiment, the connection portion 95 between the first terminal 402 and the second terminal 902 is the first terminal 402. This corresponds to a region where the terminal 402 is formed. That is, the connection portion 95 between the first terminal 402 and the second terminal 902 corresponds to a region where the first terminal 402 and the second terminal 902 overlap in plan view.

  Here, in the element substrate 51, the conductive layer 403 connected to the first terminal 402 and the like extends to the side surface 514 of the element substrate 51 on the lower layer side of the first terminal 402. That is, the element substrate 51 is a substrate obtained by cutting a large substrate into a single product size. In the large substrate, the conductive layer 403 connected to the first terminal 402 and the like extends from the region cut out as the element substrate 51 to the outside. ing. For this reason, when the large substrate is cut to obtain the element substrate 51, the conductive layer 403 extends to the side surface 514 of the element substrate 51. In the element substrate 51, the surface of the conductive layer 403 is covered with an insulating film 518, and the first terminal 402 is electrically connected to the conductive layer 403 through a contact hole formed in the insulating film 518. FIG. 6B shows a form in which the first terminal 402 protrudes from the surface of the insulating film 518, but the surface of the first terminal 402 is in a position recessed from the surface of the insulating film 518. Alternatively, the surface of the first terminal 402 may be at the same height as the surface of the insulating film 518.

  In the electro-optic module 10 configured as described above, the plate-like portion 74 of the exit-side parting member 70 has an element toward the direction in which the flexible wiring substrate 90 is drawn from the electro-optic panel 40 (one side Y1 in the Y-axis direction). A first convex portion 72 projecting toward the flexible wiring substrate 90 is formed at a position separated from the side surface 514 of the substrate 51, and a tip portion 720 of the first convex portion 72 is formed on the first surface 90 a of the flexible wiring substrate 90. Is in contact with Here, the front end portion 720 of the first convex portion 72 is located closer to the frame 60 than the first surface 51 a of the element substrate 51. For this reason, the leading end portion 720 of the first convex portion 72 causes the lead-out portion 91 located outside the element substrate 51 in the flexible wiring substrate 90 to float from the element substrate 51 as indicated by an arrow Z3. For this reason, the lead-out portion 91 of the flexible wiring board 90 is bent so as to be separated from the element substrate 51, and the first surface 90 a of the flexible wiring substrate 90 is connected to the first surface 51 a and the side surface 514 of the element substrate 51. It is separated from the edge 514a (corner).

  Further, the plate-like portion 64 of the frame 60 has an edge on the side surface 514 side of the connecting portion between the first terminal 402 and the second terminal 902 in the drawing direction of the flexible wiring board 90 (one side Y1 in the Y-axis direction). A second convex portion 62 that protrudes toward the flexible wiring substrate 90 is formed between the first convex portion 72 of the exit-side parting member 70 and a position that contacts the flexible wiring substrate 90. Here, the front end portion 620 of the second convex portion 62 is located closer to the outgoing side parting member 70 than the front end portion 720 of the first convex portion 72 of the outgoing side parting member 70, and as indicated by the arrow Z4, The tip 620 of the second convex portion 62 is in contact with the second surface 90 b of the flexible wiring board 90 and presses the flexible wiring board 90 toward the element substrate 51. In other words, the distance from the plane on the basis of the surface on the exit side parting member 70 side of the element substrate 51 is closer to the tip portion 620 of the second convex portion 62 than to the tip portion 720 of the first convex portion 72. Yes. For this reason, the corner part 621 located on the drawing direction side (one side Y1 in the Y-axis direction) of the flexible wiring board 90 among the tip part 620 of the second convex part 62 is such that the flexible wiring board 90 is the exit-side parting member 70. The starting point when bent by the first protrusion 72 is defined. In this embodiment, the height position of the tip 620 of the second convex portion 62 from the element substrate 51 is the height position from the element substrate 51 of the portion that overlaps the second terminal 902 on the second surface 90 b of the flexible wiring board 90. Is at the same or slightly higher position.

  In this embodiment, the corner portion 621 of the tip 620 of the second convex portion 62 has a connection portion 95 between the first terminal 402 and the second terminal 902 in the drawing direction of the flexible wiring board 90 (one side Y1 in the Y-axis direction). Among the 48 between the edge on the side surface 514 side and the position where the first convex portion 72 of the exit-side parting member 70 contacts the flexible wiring substrate 90, it contacts the flexible wiring substrate 90 inside the side surface 514. That is, the corner portion 621 of the distal end portion 620 of the second convex portion 62 is a side surface of the connection portion 95 between the first terminal 402 and the second terminal 902 in the drawing direction of the flexible wiring board 90 (one side Y1 in the Y-axis direction). The flexible printed circuit board 90 is in contact with 49 between the edge on the 514 side and the side surface 514. In this embodiment, since the anisotropic conductive material is not formed up to the edge 514a of the element substrate 51, the flexible wiring board 90 is easily bent starting from the inside of the edge 514a of the element substrate 51. However, even when the anisotropic conductive material is formed up to the edge 514a of the element substrate 51, when the flexible wiring substrate 90 is bent, the resin portion of the anisotropic conductive material is deformed, and the flexible wiring substrate 90 is The board 51 is bent starting from the inner side of the edge 514a. Even when the anisotropic conductive material is formed up to the edge 514a of the element substrate 51, when the flexible wiring board 90 is bent, the anisotropic conductive material is peeled off in the vicinity of the edge 514a of the element substrate 51. The flexible wiring board 90 is bent starting from the inside of the edge 514a of the element substrate 51.

  As shown in FIG. 7, in the present embodiment, the first convex portion 72 is a rib-shaped convex portion extending in the X-axis direction, and is in contact with the entire width direction (X-axis direction) of the flexible wiring board 90. . Similarly to the first convex portion 72, the second convex portion 62 is a rib-shaped convex portion extending in the X-axis direction, and is in contact with the entire width direction (X-axis direction) of the flexible wiring board 90. In the form shown in FIG. 7, the lengths of the first protrusions 72 and the second protrusions 62 are set larger than the width direction (X-axis direction) of the flexible wiring board 90, but the first protrusions The length dimension of the portion 72 and the second protrusion 62 may be the same as the width direction (X-axis direction) of the flexible wiring board 90 or may be smaller than the width direction (X-axis direction) of the flexible wiring board 90. With this configuration, the entire width direction (X-axis direction) of the flexible wiring board 90 can be floated from the element substrate 51.

(Main effects of this form)
As described above, in the electro-optic module 10 according to the present embodiment, the first convex portion 72 of the exit-side parting member 70 (first holding member) is located away from the side surface 514 of the element substrate 51. The flexible wiring board 90 is bent so as to be in contact with the first surface 90 a and away from the element substrate 51. Therefore, as described with reference to FIG. 14, even if the conductive layer 403 is exposed near the side surface 514 or the side surface 514 of the element substrate 51, the exposed portion of the conductive layer 403 breaks through the solder resist and the flexible wiring substrate. It is possible to prevent a short circuit with the wiring formed in 90.

  That is, as described with reference to FIGS. 14A and 14B, when the conductive layer 403 is exposed in the state of being deformed in the shape of burrs on the side surface 514 of the element substrate 51 or in the vicinity of the side surface 514, the exposed portion 403a may break through the solder resist and short-circuit with the wiring of the flexible wiring board 90. Further, when the flexible wiring board 90 is mounted on the element substrate 51, the solder resist is damaged by the flexible wiring board 90 hitting the edge 514a of the element substrate 51, and the wiring of the flexible wiring board 90 is exposed. 14 (a) and 14 (b), when the exposed portion 403a of the conductive layer 403 is generated, the exposed portion 403a and the wiring of the flexible wiring board 90 may be short-circuited. However, in this embodiment, since the flexible wiring substrate 90 is separated from the edge 514a of the element substrate 51, it is possible to prevent the conductive layer 403 of the element substrate 51 and the wiring of the flexible wiring substrate 90 from being short-circuited.

  Further, the second convex portion 62 of the frame 60 (second holding member) includes an end edge on the side surface 514 side of the connecting portion 95 between the first terminal 402 and the second terminal 902 and the first convex portion of the emission side parting member 70. 72 is in contact with the flexible wiring board 90 from the second surface 90b side of the flexible wiring board 90 between the position where 72 contacts the flexible wiring board 90, and the flexible wiring board 90 is connected to the second convex portion 62 of the frame 60 and the flexible wiring board. The bend starts at the portion where the substrate 90 comes into contact. For this reason, since excessive force is not applied to the connection portion 95 between the first terminal 402 and the second terminal 902, it is possible to prevent the occurrence of connection failure at the connection portion between the first terminal 402 and the second terminal 902. it can. Therefore, the reliability of the electro-optic module 10 can be improved.

  In addition, in the present embodiment, the flexible wiring board 90 is bent into a predetermined shape by the first convex portion 72 and the second convex portion 62, so that forming processing for bending the flexible wiring substrate 90 in advance is not required. Therefore, the production cost of the electro-optic module 10 can be reduced.

  Further, the second convex portion 62 of the frame 60 (second holding member) is in contact with the flexible wiring substrate 90 on the connection portion 95 side from the side surface 514 in the drawing direction of the flexible wiring substrate 90. For this reason, since the flexible wiring board 90 can be reliably separated from the vicinity of the side surface 514 of the element substrate 51, even if the conductive layer 403 is exposed near the side surface 514 of the element substrate 51 or the side surface 514, the element substrate 51 side It is possible to reliably prevent the exposed portion of the conductive layer 403 and the flexible wiring board 90 from being short-circuited.

  In particular, in this embodiment, since the first terminal 402 and the second terminal 902 are electrically connected via an anisotropic conductive material, poor connection is likely to occur when a large force is applied. Therefore, the occurrence of such a connection failure can be prevented.

  The exit-side parting member 70 overlaps the electro-optical panel 40 on the second surface 51b side of the element substrate 51, and the frame 60 overlaps the electro-optical panel 40 on the first surface 51a side of the element substrate 51. The electro-optical panel 40 is held between the member 70. For this reason, in this embodiment, the flexible wiring board 90 is utilized by utilizing a part (the first convex portion 72 and the second convex portion 62) of the members (the emission side parting member 70 and the frame 60) that hold the electro-optical panel 40. In addition, it is possible to prevent a short circuit in the vicinity of the side surface 514 of the element substrate 51 and a connection failure between the element substrate 51 and the flexible wiring substrate 90, and there is no need to add another member.

[Variation 1 of Embodiment 1]
FIG. 8 is a YZ cross-sectional view of the electro-optic module 10 according to the first modification of the first embodiment of the present invention. FIGS. 8A and 8B are diagrams between the flexible wiring board 90 and the element substrate 51. It is explanatory drawing which shows a mode that the mold resin was provided, and explanatory drawing which shows an example of the method of apply | coating mold resin between the flexible wiring board 90 and the element substrate 51. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 8A, in this embodiment as well, in the same manner as in the first embodiment, the first convex portion 72 of the exit-side parting member 70 (first holding member) is located away from the side surface 514 of the element substrate 51. The flexible wiring board 90 is bent so as to be in contact with the first surface 90 a of the flexible wiring board 90 and away from the element substrate 51. In addition, the second convex portion 62 of the frame 60 (second holding member) includes an end edge on the side surface 514 side of the connection portion between the first terminal 402 and the second terminal 902 and the first convex portion 72 of the exit side parting member 70. Is in contact with the second surface 90b of the flexible wiring board 90 between the position where it contacts the flexible wiring board 90, and the flexible wiring board 90 has a portion where the second convex portion 62 of the frame 60 and the flexible wiring board 90 are in contact with each other. It is bent at the starting point.

  In this embodiment, between the element substrate 51 and the lead-out portion 91 of the flexible wiring board 90, the molding resin R1 extends from the first surface 51a and the side surface 514 of the element substrate 51 to the first surface 90a of the flexible wiring board 90. Is provided, and a connection portion between the first terminal 402 and the second terminal 902 is protected. A mold resin R2 is provided between the element substrate 51 and the distal end portion of the flexible wiring substrate 90 so as to straddle the first surface 51a of the element substrate 51 and the second surface 90b of the distal end portion of the flexible wiring substrate 90. Thus, the connection portion between the first terminal 402 and the second terminal 902 is protected. For this reason, since excessive force is not applied to the connection portion 95 between the first terminal 402 and the second terminal 902, it is possible to prevent the occurrence of connection failure at the connection portion between the first terminal 402 and the second terminal 902. it can.

  Here, the mold resin R1 and the mold resin R2 may use either the same type of resin or different types of resin. In providing the mold resin R1 and the mold resin R2, for example, after applying the mold resins R1 and R2 between the element substrate 51 and the flexible wiring substrate 90, the electro-optic module 10 is assembled, and then the mold resin R1 , R2 is cured.

  Further, as shown in FIG. 8B, the mold resin R <b> 1 is applied to the inside of the first convex portion 72 of the emission side parting member 70, while the plate-like portion 64 and the second convex portion 62 of the frame 60 are interposed. After applying the mold resin R2, the electro-optic module 10 may be assembled, and then the mold resins R1 and R2 may be cured. According to this method, the mold resin R1 applied to the exit-side parting member 70 and the mold resin R2 applied to the frame 60 are transferred to the electro-optical panel 40 side. Therefore, when applying the mold resins R1 and R2, flexible wiring There is an advantage that the substrate 90 does not get in the way.

[Modification 2 of Embodiment 1]
FIG. 9 is a plan view of the electro-optic module 10 according to the second modification of the first embodiment of the present invention on the side where the flexible wiring board 90 is connected, and FIGS. 9A, 9B, and 9C. ) Is an explanatory diagram of modification 2, an explanatory diagram of another modification 2, and an explanatory diagram of still another modification 2.

  In the first embodiment, as described with reference to FIG. 7, the first convex portion 72 and the second convex portion 62 are each composed of one rib-shaped convex portion extending in the X-axis direction. In this embodiment, at least one of the first convex portion 72 and the second convex portion 62 is composed of a plurality of convex portions that are separated in the X-axis direction.

  More specifically, in the form shown in FIG. 9A, the first convex portion 72 is composed of one rib-shaped convex portion extending in the X-axis direction, and the second convex portion 62 is separated in the X-axis direction. A plurality of convex portions. In the present embodiment, the second convex portion 62 includes three convex portions located at both ends and the center in the width direction (X-axis direction) of the flexible wiring substrate 90.

  In the form shown in FIG. 9B, the second convex portion 62 is composed of one rib-shaped convex portion extending in the X-axis direction, and the first convex portion 72 is composed of a plurality of convex portions separated in the X-axis direction. Become. In the present embodiment, the first convex portion 72 includes three convex portions located at both ends and the center in the width direction (X-axis direction) of the flexible wiring board 90.

  In the form shown in FIG. 9C, the first convex portion 72 and the second convex portion 62 are each composed of a plurality of convex portions that are separated in the X-axis direction. In the present embodiment, each of the first protrusion 72 and the second protrusion 62 includes three protrusions located at both ends and the center in the width direction (X-axis direction) of the flexible wiring board 90.

  In addition, although it is preferable to provide the 1st convex part 72 and the 2nd convex part 62 in the same position in the X-axis direction, the 1st convex part 72 and the 2nd convex part 62 have shifted | deviated in the X-axis direction. Also good.

  Here, it is preferable that the second convex portion 62 is disposed at a position that overlaps at least both ends of the flexible wiring board 90 in the width direction (X-axis direction). According to such a configuration, the flexible wiring board 90 can be reliably floated from the element substrate 51 over the entire width direction.

[Modification 3 of Embodiment 1]
In the first embodiment, the height position of the tip 620 of the second protrusion 62 from the element substrate 51 is the height from the element substrate 51 at the portion of the second surface 90 b of the flexible wiring substrate 90 that overlaps the second terminal 902. The height position from the element substrate 51 of the tip portion 620 of the second convex portion 62 overlaps the second terminal 902 on the second surface 90 b of the flexible wiring substrate 90. You may make it a position lower than the height position from the element substrate 51 of a part.

  According to such a configuration, the flexible wiring board 90 bends at a position close to the first surface 51a of the element substrate 51, so that an excessive force is applied to the connection portion between the first terminal 402 and the second terminal 902. Don't join. Therefore, it is possible to prevent the occurrence of connection failure at the connection portion between the first terminal 402 and the second terminal 902.

[Embodiment 2]
10A and 10B are explanatory diagrams of the electro-optic module 10 according to Embodiment 2 of the present invention. FIGS. 10A and 10B are a YZ cross-sectional view during assembly of the electro-optic module 10 and the electro-optic module. FIG. FIG. 11 is a plan view of the electro-optic module 10 according to the second embodiment of the present invention on the side to which the flexible wiring board 90 is connected. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted. Further, in FIG. 10, illustration of the first light transmitting plate 56, the second light transmitting plate 57, the incident side parting member 80 and the like is omitted.

  As shown in FIG. 10, also in the electro-optic module 10 of the present embodiment, the end portion of the first surface 51a of the element substrate 51 (the end portion of the projecting portion 515) is arranged on one side Y1 in the Y-axis direction, as in the first embodiment. ) And the second terminal 902 formed on the first surface 90a of the flexible wiring board 90 are connected by an anisotropic conductive material (not shown). In the electro-optic module 10 configured as described above, the plate-like portion 74 of the exit-side parting member 70 has an element toward the direction in which the flexible wiring substrate 90 is drawn from the electro-optic panel 40 (one side Y1 in the Y-axis direction). A first convex portion 72 projecting toward the flexible wiring substrate 90 is formed at a position separated from the side surface 514 of the substrate 51, and a tip portion 720 of the first convex portion 72 is formed on the first surface 90 a of the flexible wiring substrate 90. Is in contact with For this reason, the leading end portion 720 of the first convex portion 72 lifts the lead-out portion 91 of the flexible wiring board 90 from the element substrate 51. For this reason, the first surface 90 a of the lead-out portion 91 of the flexible wiring substrate 90 is separated from the edge 514 a (corner) where the first surface 51 a and the side surface 514 of the element substrate 51 are connected.

  Further, the plate-like portion 64 of the frame 60 has an edge on the side surface 514 side of the connecting portion between the first terminal 402 and the second terminal 902 in the drawing direction of the flexible wiring board 90 (one side Y1 in the Y-axis direction). A second convex portion 62 that protrudes toward the flexible wiring substrate 90 is formed between the first convex portion 72 of the exit-side parting member 70 and a position that contacts the flexible wiring substrate 90. The tip 620 of the second convex portion 62 is in contact with the flexible wiring board 90 from the second surface 90b side.

  Here, a penetration part 98 is formed in the flexible wiring board 90 at a position overlapping the second protrusion 62, and the second protrusion 62 fits into the penetration part 98 and is in contact with the inner edge of the penetration part 98. . For this reason, the flexible wiring board 90 is in a state of being hooked on the surface of the second convex portion 62 on the other side Y2 in the Y-axis direction. The starting point when bent by one convex portion 72 is defined.

  In the present embodiment, as shown in FIG. 11, the first convex portion 72 is a rib-shaped convex portion extending in the X-axis direction, and is in contact with the entire width direction (X-axis direction) of the flexible wiring board 90. . On the other hand, the 2nd convex part 62 and the penetration part 98 are provided in the several place spaced apart in a X-axis direction so that the wiring etc. which are formed in the flexible wiring board 90 may be avoided. In the present embodiment, the second convex portion 62 and the through portion 98 are provided at two positions located at both ends in the width direction (X-axis direction) of the flexible wiring board 90. When there is a region where no wiring is formed at the central position in the width direction of the flexible wiring substrate 90, the through portion 98 may be provided in the region.

  In addition, about the 1st convex part 72, it comprised with the several convex part spaced apart in the width direction (X-axis direction) of the flexible wiring board 90, as demonstrated with reference to FIG.9 (b), (c). May be.

  As described above, in the electro-optic module 10 according to the present embodiment, the first convex portion 72 of the exit-side parting member 70 (first holding member) is located away from the side surface 514 of the element substrate 51. The flexible wiring board 90 is bent so as to be in contact with the first surface 90 a and away from the element substrate 51. For this reason, even if the conductive layer 403 is exposed near the side surface 514 or the side surface 514 of the element substrate 51, it is possible to prevent the exposed portion of the conductive layer 403 and the flexible wiring substrate 90 from being short-circuited. Further, the second convex portion 62 of the frame 60 (second holding member) includes an end edge on the side surface 514 side of the connecting portion 95 between the first terminal 402 and the second terminal 902 and the first convex portion of the emission side parting member 70. Between 72 and the position which contacts the flexible wiring board 90, the flexible wiring board 90 is contacted from the 2nd surface 90b side of the flexible wiring board 90, and the starting point at the time of the flexible wiring board 90 bending is prescribed | regulated. For this reason, since excessive force is not applied to the connection portion 95 between the first terminal 402 and the second terminal 902, it is possible to prevent the occurrence of connection failure at the connection portion between the first terminal 402 and the second terminal 902. it can. Therefore, the same effects as those of the first embodiment can be obtained, such as the reliability of the electro-optic module 10 being improved.

[Modification of Embodiment 2]
12 is a YZ cross-sectional view of the electro-optic module 10 according to the first modification of the second embodiment of the present invention. FIGS. 12A and 12B are views between the flexible wiring board 90 and the element substrate 51. FIG. It is explanatory drawing which shows a mode that the mold resin was provided, and explanatory drawing which shows an example of the method of apply | coating mold resin between the flexible wiring board 90 and the element substrate 51. Since the basic configuration of this embodiment is the same as that of Embodiments 1 and 2, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 12A, in this embodiment as well, the first convex portion 72 of the exit-side parting member 70 (first holding member) is located away from the side surface 514 of the element substrate 51, as in the first embodiment. The flexible wiring board 90 is bent so as to be in contact with the first surface 90 a of the flexible wiring board 90 and away from the element substrate 51. Further, the second convex portion 62 of the frame 60 (second holding member) fits into the through portion 98 of the flexible wiring board 90 and defines the starting point when the flexible wiring board 90 is bent.

  In this embodiment, as in the first modification of the first embodiment, between the element substrate 51 and the lead-out portion 91 of the flexible wiring substrate 90, the first wiring 51 a and the side surface 514 of the element substrate 51 are connected to the flexible wiring substrate 90. Mold resin R1 is provided so as to straddle the first surface 90a, and the connection portion between the first terminal 402 and the second terminal 902 is protected. A mold resin R2 is provided between the element substrate 51 and the distal end portion of the flexible wiring substrate 90 so as to straddle the first surface 51a of the element substrate 51 and the second surface 90b of the distal end portion of the flexible wiring substrate 90. Thus, the connection portion between the first terminal 402 and the second terminal 902 is protected. For this reason, since excessive force is not applied to the connection portion 95 between the first terminal 402 and the second terminal 902, it is possible to prevent the occurrence of connection failure at the connection portion between the first terminal 402 and the second terminal 902. it can.

  Here, the mold resin R1 and the mold resin R2 may use either the same type of resin or different types of resin. In providing the mold resin R1 and the mold resin R2, for example, after applying the mold resins R1 and R2 between the element substrate 51 and the flexible wiring substrate 90, the electro-optic module 10 is assembled, and then the mold resin R1 , R2 is cured.

  Further, as shown in FIG. 12B, the mold resin R <b> 1 is applied to the inside of the first convex portion 72 of the emission side parting member 70, while the plate-like portion 64 of the frame 60 and the second convex portion 62 are interposed. After applying the mold resin R2, the electro-optic module 10 may be assembled, and then the mold resins R1 and R2 may be cured. According to this method, the mold resin R1 applied to the exit-side parting member 70 and the mold resin R2 applied to the frame 60 are transferred to the electro-optical panel 40 side. Therefore, when applying the mold resins R1 and R2, flexible wiring There is an advantage that the substrate 90 does not get in the way.

[Another configuration example of the first convex portion 72 and the second convex portion 62]
FIG. 13 is an explanatory diagram illustrating another configuration example of the first convex portion 72 and the second convex portion 62 of the electro-optic module 10 to which the present invention is applied.

  In the first and second embodiments, the first projection 72 is formed on the thick exit-side parting member 70 and the second projection 62 is formed on the thick frame 60. However, the first projection is formed on the thin plate material. When forming the part 72 or the 2nd convex part 62, as shown to Fig.13 (a), the edge of the board | plate material 19 is bent, and the 1st convex part 72 or the 2nd convex part 62 is formed, for example.

  Further, when it is desired to provide the tip portions 620 and 720 on the inner side of the edge of the plate material 19 in the first convex portion 72 or the second convex portion 62, for example, as shown in FIG. The first convex portion 72 or the second convex portion 62 is formed by being bent obliquely. Further, as shown in FIG. 13C, the first protrusion 72 or the second protrusion 62 may be formed by cutting and raising the plate material 19. Moreover, as shown in FIG.13 (d), the board | plate material 19 may be drawn and a square-shaped convex part may be formed, and the 1st convex part 72 or the 2nd convex part 62 may be formed with this convex part. . Moreover, as shown in FIG.13 (e), the board | plate material 19 may be drawn and the convex part of a cross-sectional triangle may be formed, and the 1st convex part 72 or the 2nd convex part 62 may be formed with this convex part. .

[Other forms of electro-optic module]
In the above embodiment, the first convex portion 72 and the second convex portion 62 are provided on the members (the emission-side parting member 70 and the frame 60) that hold the electro-optical panel 40, and the flexible wiring board 90 is bent into a predetermined shape. The flexible wiring board 90 may be bent into a predetermined shape by the first holding member and the second holding member that are separate from the member that holds the electro-optical panel 40.

  In the above-described embodiment, the electro-optical module 10 including the transmissive electro-optical panel 40 is illustrated, but the present invention may be applied to the electro-optical module 10 including the reflective electro-optical panel 40.

  In the said embodiment, although the front projection type display apparatus which projects from the direction which observes a projected image as a projection type display apparatus was illustrated, the rear projection type display apparatus which projects from the opposite side to the direction which observes a projected image The present invention may be applied to a projection display device used for the above.

  In the above embodiment, the liquid crystal panel has been described as an example of the electro-optical panel. However, the present invention is not limited to this, and the organic electroluminescence display panel, plasma display panel, FED (Field Emission Display) panel, SED The present invention may be applied to an electro-optic module using a (Surface-Conduction Electron-Emitter Display) panel, an LED (light emitting diode) display panel, an electrophoretic display panel, or the like.

[Other electronic devices]
The electro-optic module to which the present invention is applied includes a mobile phone, a personal digital assistant (PDA), a finder monitor such as a digital camera, a liquid crystal television, in addition to the electronic device (projection display device). It may also be used as a direct-view display device in an electronic device such as a car navigation device, a videophone, a POS terminal, or a device provided with a touch panel.

DESCRIPTION OF SYMBOLS 1 ... Projection type display apparatus 10 ... Electro-optic module 40 ... Electro-optical panel (liquid crystal panel) 40a ... Image display area 51 ... Element substrate 51a ... First surface of element substrate (one ), 51b... Second surface of the element substrate, 52.. Counter substrate, 56 .. first light transmitting plate, 57 .. second light transmitting plate, 60 .. frame (second holding member), 62.・ Second convex part, 70 ..Exit-side parting member (first holding member), 72 ..First convex part, 450 ..Electro-optical material layer (liquid crystal layer), 90 ..Flexible wiring board, 90 a First surface of flexible wiring board, 90b .. Second surface of flexible wiring board, 91 .. Pull-out part of flexible wiring board, 95 .. Connection part, 98 .. Penetration part, 402 .. First terminal, 514. -Side face of element substrate, 620,-tip of second convex part, 7 0 ... distal end of the first convex portion, 902 ... second terminal

Claims (12)

An electro-optical panel that includes an element substrate that holds an electro-optical material on one side and has a first terminal between the image display region and the side on the one side;
A flexible wiring board comprising a second terminal electrically connected to the first terminal on the first surface facing the element substrate, and drawn out of the electro-optic panel from the second terminal;
The flexible wiring board is in contact with the first surface of the flexible wiring board at a position spaced apart from the side surface of the element board in a direction of drawing the flexible wiring board from the electro-optical panel in plan view. A first holding member bent away from the first holding member;
In the pull-out direction, the first side of the flexible wiring board between the edge of the side of the connecting portion of the first terminal and the second terminal and the position where the first holding member is in contact with the flexible wiring board. A second holding member in contact with the flexible wiring board from the second surface side opposite to the first surface;
An electro-optic module comprising:   2. The electro-optic module according to claim 1, wherein the second holding member is in contact with the flexible wiring board on the connection portion side from the side surface in the pull-out direction. The first holding member includes a first plate-like portion facing the first surface of the flexible wiring board, and a first protrusion protruding from the first plate-like portion toward the flexible wiring board. ,
The electro-optic module according to claim 2, wherein the first convex portion is in contact with the flexible wiring board. The second holding member includes a second plate-like portion facing the second surface of the flexible wiring board, and a second convex portion protruding from the second plate-like portion toward the flexible wiring board. ,
The electro-optic module according to claim 2, wherein the second convex portion is in contact with the flexible wiring board.   The electro-optic module according to claim 4, wherein a tip end portion of the second convex portion is in contact with the second surface of the flexible wiring board.   The height position of the tip portion of the second convex portion from the element substrate is lower than the height position from the element substrate of a portion overlapping the second terminal on the second surface. 6. The electro-optic module according to 5.   5. The electro-optic module according to claim 4, wherein the second convex portion is fitted into a penetrating portion that penetrates the flexible wiring board and is in contact with an inner edge of the penetrating portion. The first holding member overlaps the electro-optical panel on the other surface side opposite to the one surface side of the element substrate,
2. The second holding member overlaps the electro-optical panel on the one surface side of the element substrate, and holds the electro-optical panel between the first holding member and the first holding member. The electro-optic module according to any one of items 7 to 7.   The electro-optic module according to claim 1, wherein the first terminal and the second terminal are electrically connected via an anisotropic conductive material. The electro-optical panel includes a counter substrate facing the one surface side of the element substrate,
10. The electro-optic module according to claim 1, wherein the first terminal is formed in a protruding portion that protrudes outward from the counter substrate in the element substrate.   An electronic apparatus comprising the electro-optic module according to claim 1. A light source unit that emits light supplied to the electro-optic module;
A projection optical system for projecting light modulated by the electro-optic module;
The electronic apparatus according to claim 11, comprising:

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