JP2014087972A - Manufacturing method for liquid discharge head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a liquid discharge head that can accurately regulate the height of a sealant coating an electrical connection between an element substrate and an electrical connection substrate.SOLUTION: The manufacturing method for a liquid discharge head comprising: an element substrate comprising a connection terminal electrically connected to an energy generating element; an electric wiring substrate comprising a lead wiring electrically connected to the connection terminal; and a sealing portion for protecting an electrical connection between the element substrate and the electric wiring substrate, performs the steps of: arranging a light-curing resin composition on the electric connection; curing the surface portion of the light-curing resin composition by first light irradiation; pressing a height control member to the light-curing resin composition to adjust the height of the light-curing resin composition; curing the light-curing resin composition by second light irradiation to form a sealing portion.

Description

  The present invention relates to a method for manufacturing a liquid discharge head, and preferably to a method for manufacturing an ink jet recording head.

  A liquid discharge head such as an ink jet recording head is known to include an element substrate provided with a discharge port group for discharging a liquid typified by ink and an energy generating element provided corresponding to each discharge port. It has been. In addition, the liquid discharge head is provided with a contact portion for receiving an electric signal and electric power used for driving the energy generating element from the main body of the ink jet recording apparatus. For the connection between the contact portion and the element substrate, an electric wiring member having flexibility is generally used.

  In the ink jet recording head, the electrical connection portion between the element substrate and the electric wiring substrate is covered with a sealant to protect it from blade wiping when the ink droplets near the ink discharge port are removed and collision with the recording medium. It has been broken.

  More specifically, the support member, which is a part of the casing of the liquid discharge head, and the element substrate are joined by applying an adhesive to the support member and then aligning the element substrate. The electrical wiring substrate and the element substrate are electrically connected by joining inner leads exposed from the electrical wiring substrate to connection terminals provided on the element substrate. And this electrical junction part is covered and protected by the sealing agent.

  Since the upper portion of the sealant is the highest convex portion on the head surface, it becomes a factor that regulates the distance between the recording medium and the head. For this reason, when the tolerance variation in the standard of the sealant height increases, the distance between the papers is increased beyond the necessary distance. As a result, the landing accuracy is lowered and the print quality is lowered. On the other hand, when the height accuracy after curing of the sealant is improved, the inter-paper distance can be set to an appropriate distance, and the print quality of the ink jet recording head can be improved. As a result, it is possible to cope with the technical problem of forming a high-definition image by increasing the discharge frequency and flying finer droplets.

  As a method for controlling the height of the sealant, Patent Document 1 discloses a method of stopping the flow of the sealant by providing irregularities on the nozzle plate or the electrical connection substrate.

JP-A-8-048042

  However, in the prior art, the height tolerance increases due to the variation in the viscosity of the material, the influence of temperature and humidity, the assembly accuracy of the component dimensions, and the like, and it may be insufficient to shorten the distance between the sheets.

  In addition, since there are predetermined irregularities in the region where the sealant is disposed, it takes time to dispose the sealant in a flow, and there are cases where the manufacturing tact cannot be increased.

  In view of the above, an object of the present invention is to provide a method for manufacturing a liquid discharge head that can accurately define the height of a sealing agent that covers an electrical connection portion between an element substrate and an electrical connection substrate.

The present invention
An element substrate including an energy generating element that generates energy used for discharging a liquid and a connection terminal electrically connected to the energy generating element, and a lead wiring electrically connected to the connection terminal A liquid discharge head manufacturing method comprising: an electrical wiring board comprising: a sealing portion that protects an electrical connection portion between the element substrate and the electrical wiring board;
Disposing a photocurable resin composition on the electrical connection part;
Curing the surface portion of the photocurable resin composition by first light irradiation;
A step of pressing a height control member against the photocurable resin composition to adjust the height of the photocurable resin composition;
Curing the photocurable resin composition by second light irradiation to form the sealing portion;
A method for manufacturing a liquid discharge head, comprising:

  According to the present invention, it is possible to provide a method of manufacturing a liquid discharge head that can accurately define the height of the sealing agent that covers the electrical connection portion between the element substrate and the electrical connection substrate.

  Preferably, in the present invention, by using the photocurable resin composition in the electrical connection portion to form the sealing portion with a high accuracy height, variation in height tolerance is reduced, and the inter-paper distance is reduced. Can be small. In addition, the quality of the liquid discharge head is improved by controlling the height better, and the tact time is shortened by using the photocuring reaction. As a result, it is possible to provide a liquid discharge head that has excellent print quality, high performance, and low price.

It is a typical perspective view explaining the structural example of the inkjet recording head manufactured by this embodiment. It is a model top view of the A section of FIG. FIG. 3 is a cross-sectional view taken along the line AA in FIG. 2, and is a conceptual diagram for explaining the manufacturing method of Example 1. It is a conceptual diagram for demonstrating the manufacturing method of Example 2 which presses and light-irradiates a photocurable resin composition using a height control member and light source device. It is a conceptual diagram for demonstrating the manufacturing method of Example 3 which removes an unhardened part. 6 is a schematic diagram showing a manufacturing flow of a manufacturing method of Example 4. FIG. It is a typical perspective view which shows the structural example of a liquid discharge head. It is a typical top view which shows the structural example of an element substrate. It is an enlarged schematic diagram for demonstrating the electrical connection part of an element substrate and an electrical wiring board.

  Hereinafter, the configuration requirements of this embodiment will be described.

  7 and 8 are diagrams illustrating a configuration example of the liquid discharge head manufactured according to the embodiment of the present invention. FIG. 7A shows a perspective view of the liquid discharge head 100, and FIG. 7B is an exploded perspective view showing each part of the liquid discharge head 100 in FIG. 7A in an exploded manner. FIG. 8A is a plan view showing the surface side on which the discharge port 104 of the element substrate 101 constituting the liquid discharge head 100 is formed, and FIG. 8B shows the ink supply port 105 of the element substrate 101. It is a bottom view which shows the formed back surface side.

  As shown in FIG. 7A, the liquid ejection head 100 includes an element substrate 101, an electric wiring substrate 102, and an ink storage unit 103. The injected ink is held inside the ink containing portion 103. Then, the ink is guided to the element substrate 101 through the ink supply channel 106 communicated with the ink containing portion 103, and the ink is ejected from the ejection port 104 provided in the element substrate 101. In the present embodiment, the liquid discharge head 100 and the ink storage unit 103 are described as an integrated type. Applicable.

  As shown in FIG. 9, the substrate 117 constituting the element substrate 101 has an ink supply port 105 formed of a long groove-like through-hole, and communicates with the ink supply channel 106. Electrothermal conversion elements (not shown) are provided on both sides of the ink supply port 105 as energy generating elements that generate energy used to eject ink. In addition, wiring for supplying electric power and electric signals to the electrothermal transducer is formed on the substrate 117. Further, a plurality of connection terminals 107 for receiving electric signals and electric power from the electric wiring board 102 are arranged on the other end portion of the element substrate 101 opposite to the one end portion of the substrate 117. The nozzle plate 116 stacked on the substrate 117 is formed with discharge ports 104 corresponding to a plurality of electrothermal conversion elements. A flow path (not shown) that connects the ejection port 104 and the ink supply port 105 is formed between the nozzle plate 116 and the substrate 117.

  The electric wiring substrate 102 is a wiring member for transmitting an electric signal and electric power for discharging ink from the recording apparatus main body to the element substrate 101, and has flexibility. The electrical wiring substrate 102 is formed with contact portions 108, electrical wiring (not shown) sandwiched between resin films, and inner leads 109 that are lead wirings exposed from the end surfaces of the resin film. As an example of such an electric wiring board 102 having flexibility, a TAB (Tape Automated Bonding) type tape can be cited. The contact portion 108 is composed of a plurality of contact pads. When the liquid ejection head 100 is mounted on the recording apparatus main body, the contact section 108 comes into contact with a connector pin (not shown) on the recording apparatus main body side to be electrically connected. The The electrical wiring formed on the electrical wiring board connects the contact portion 108 and the inner lead 109. The inner lead 109 is electrically connected to the connection terminal 107 provided on the edge of the element substrate 101 by bonding. In addition, after the inner lead 109 and the connection terminal 107 of the element substrate 101 are connected, an encapsulant that is a resin material is used to cover and protect an electrical connection portion including these connection terminals from a liquid such as ink. The sealing part 110 is formed using.

  The support member 111, which is a part of the casing of the liquid discharge head 100, and the element substrate 101 are joined by applying an adhesive to the support member 111 and then aligning the element substrate 101. In addition, the electric wiring member 102 is bonded and fixed to the support member 111 with an adhesive different from the adhesive used when the element substrate is bonded.

  The support member 111 can be formed by resin molding. The support member 111 can be formed in a shape in which the portion where the element substrate 101 is disposed is recessed from the portion where the surrounding electric wiring substrate 102 is bonded and fixed. This is because the inner leads 109 of the electric wiring substrate 102 and the connection terminals 107 of the element substrate 101 are made substantially the same height to improve the reliability of the electric junction between them.

  In the manufacturing method of the present embodiment, first, as shown in FIG. 3 (a), after the photocurable resin composition is arranged in the electrical connection portion, the surface portion of the photocurable resin composition is irradiated by the first light irradiation. Is cured. Next, as shown in FIG. 3B, the height control member is pressed against the photocurable resin composition to adjust the height of the photocurable resin composition. And as shown in FIG.3 (c), a photocurable resin composition is hardened by 2nd light irradiation, and a sealing part is formed.

  Hereinafter, each component of this embodiment will be described.

  The light source of the irradiation apparatus used in the present embodiment is not particularly limited as long as it excites the active species of the photocurable resin composition as a sealant to promote the curing reaction. Examples of the photocurable resin composition include a radical polymerization type acrylic resin composition and an ion polymerization type epoxy resin composition, and these resin compositions are cured using an ultraviolet irradiation device. Can do. Examples of the light source include a low-pressure mercury lamp (185 to 254 nm), a high-pressure mercury UV lamp (365 nm), a metal halide UV lamp (200 to 400 nm), an excimer lamp, and an ultrahigh-pressure UV lamp. The light source can be appropriately selected in consideration of the reaction initiation wavelength of the photocurable resin composition. Moreover, you may use the UV-LED light source with little calorific value of a light emission part.

  The sealant used in the present embodiment is made of a photocurable resin composition. As the photocurable resin composition, it is preferable to use a resin composition that is cured by an ion polymerization reaction mechanism from the viewpoint of adhesion in a short time. As a sealant that cures by an ion polymerization reaction mechanism, for example, a UV cationic epoxy adhesive can be preferably used, and among UV cationic epoxy adhesives, a delayed curing type UV cationic epoxy adhesive can be more preferably used. .

  The connection between the element substrate (chip) and the electric wiring substrate (for example, TAB) is performed as follows, for example. First, gold plating bumps are provided on electrode pads provided on the element substrate by film formation, photolithography, plating processes, and the like. Thereafter, the gold-plated bump and the TAB inner lead are joined together by heat and load.

  When the element substrate and the electric wiring tape are connected, lead forming can be performed to prevent edge touch between the inner leads of the element substrate and the electric wiring tape. The lead forming is performed by changing the height of the element substrate and the electric wiring tape with a gang bonder to perform inner lead bonding (ILB) and deforming the inner lead. Usually, ILB is performed so that the discharge surface of the element substrate and the polyimide surface of TAB are in the same direction. The element substrate is bonded so that leakage from the ink supply port of the tank case serving as the support member does not occur.

  In addition, the electrical wiring tape is the same as the element substrate on the cover film surface side that protects the copper foil surface so that short circuit and corrosion do not occur on the copper foil surface of the electrical wiring tape due to the outflow of ink attached to the discharge surface, etc. To the tank case.

  Thereafter, the gap between the element substrate and the electric wiring tape is sealed with a sealant. In the present embodiment, in addition to the gap between the element substrate periphery and the electric wiring tape, the upper portion of the electrode portion can be covered. Further, for example, using a pressure dispenser, the photocurable resin composition can be discharged and disposed on the electrical connection portion.

  In this embodiment, after arrange | positioning a photocurable resin composition in an electrical connection part, low energy light irradiation (1st light irradiation) is performed to a photocurable resin composition, and a surface part is hardened. As a result, the surface portion of the photocurable resin composition can be in a state of low or no viscosity, and the height of the resin composition can be controlled even when the height control member is pressed against the photocurable resin composition. It becomes difficult to adhere to the member. As a result, it is possible to design a continuous manufacturing process.

  In this embodiment, the 1st light irradiation which hardens the surface part of a resin composition can be performed by giving 10 to 20% of the light irradiation amount which the whole apply | coated thickness hardens | cures.

  The surface portion of the resin composition is, for example, in the range of 0.1 to 10 μm and preferably in the range of 0.5 to 5 μm from the surface of the resin composition.

  Since there is an electrical wiring (lead) in the application part of the resin composition, the application amount of the resin composition is determined in consideration of the pressure on the electrical wiring when pressing the height control member and the curing shrinkage at the time of curing. It is desirable to set. Further, it is desirable to determine the curing state in consideration of the linear expansion coefficient of the electrical wiring and the dynamic viscoelastic behavior of the material.

  After adjusting the height of the resin composition by pressing the height control member against the resin composition after the first light irradiation, the resin composition is further cured by the second light irradiation to thereby seal the sealing portion. Form.

  The second light irradiation can be performed by giving 80 to 90% of the light irradiation amount that the entire applied thickness is cured.

  The height of the sealing portion is, for example, in the range of 80 to 500 μm from the surface of the electric wiring board, and preferably in the range of 100 to 300 μm.

  The shape of the sealing portion is preferably a shape with rounded corners and widened hems in order to cope with wiper blade wiping during recovery. In order to reduce the distance from a recording medium such as paper, the upper portion of the sealing portion is preferably flat.

  For application of the photocurable resin composition, for example, a dispenser capable of applying a liquid composition can be used.

  The pressure-type liquid supply member is a tank member that supplies ink liquid to the support member and the recording element substrate, and the material thereof is a material that does not swell, dissolve, elute organic or inorganic substances in contact with the ink liquid. Any organic or inorganic material can be used. A thermoplastic resin is preferably used in view of the price of raw materials and ease of processing, and general-purpose resins such as polypropylene and modified PPE can be mainly used as a tank material. In order to increase the mechanical strength, silica, alumina, carbon, or the like may be used as a filler.

  The height control member used in the present embodiment is a member for adjusting the photocurable resin composition to an arbitrary height, and the shape of the member can be determined according to need. The material of the height control member is not particularly limited, and can be used regardless of whether it is an inorganic material or an organic material.

  Moreover, it is preferable to form the height control member using a material transparent to the first light irradiation or the second light irradiation. If such a height control member is used, the second light irradiation can be performed in a state where the height control member is pressed against the photocurable resin composition (see FIG. 6). In addition, a transparent height control member can be disposed on the extension of the light source that emits light, and the light irradiation device and the height control member can be integrally formed. By using this height control member and light irradiation device, the sealant curing process can be completed by synchronizing the vertical movement of the device and the conveyance of the head, so the configuration of the device is simplified and the device cost is reduced. There is an advantage that it can be lowered.

  The surface of the height control member, that is, the surface in contact with the resin composition is preferably subjected to a liquid repelling treatment so that the uncured product of the photocurable resin composition does not adhere to and accumulate on the workpiece or the jig over time. For example, it is preferable to provide a liquid repellent layer by applying a water or oil repellent transparent resin to the height control member. As the resin constituting the liquid repellent layer, for example, a perfluorosilicon resin or a perfluoro resin can be used.

  Moreover, light irradiation can be performed in the state which pressed the height control member against the resin composition by using a transparent member with respect to the wavelength of irradiation light for the height control member. Further, the cured shape of the sealant can be controlled by adjusting the amount of light and providing a refractive index distribution on the height control member. For example, the height control member is distributed as a refractive index distribution of the light diffusion system so that the refractive index continuously decreases toward the outside as compared to the center of the height control member. The shape is maintained by irradiating light to the part where the base is drawn. The cured product can be shaped to have a skirt. The shape having a skirt is effective in increasing the adhesion area by increasing the adhesion area.

  At the time of continuous production, as shown in FIG. 6, the height control member is formed into a transparent sheet, and the second light irradiation is performed in a state where the sheet-shaped height control member is pressed against the resin composition whose surface portion is cured. May be.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, an inkjet recording head will be described as an example of application of the present invention.

  In the conventional method, generally, as a curing mechanism, thermosetting, ultraviolet curing, heat, ultraviolet combined use, moisture curing, or the like is used. However, since a lot of plastic is used for the head member, the curing temperature cannot be set too high. For example, when a thermosetting sealant is used, the curing time becomes long, and the recording element substrate and the ink supply member may be deformed due to thermal expansion during curing. When the recording element substrate or ink supply member deformed due to thermal expansion is returned to room temperature, the recording element substrate contracts and stress deformation may occur through the sealant.

  Therefore, in the present embodiment, the sealant is preferably a resin composition that is cured by an ionic polymerization reaction mechanism. By using a resin composition that is cured by an ion polymerization reaction mechanism, adhesion in a short time is possible, and thermal expansion of the ink supply member and the silicon substrate due to transfer of heat of the sealant can be reduced. From such a viewpoint, a delayed curing type UV cationic epoxy adhesive is more preferably used as a sealant.

  Sealants that cure by an ionic polymerization reaction mechanism are roughly classified into those based on cationic polymerization and those based on anionic polymerization, depending on the type of ionic reaction. Examples of the sealant that is cured by an anionic polymerization reaction include a cyanoacrylate instantaneous adhesive that starts the reaction with a small amount of water, amine, or the like attached to the surface of the adherend. As a sealant that cures by a cationic polymerization reaction, a curable material is known in which a photoacid generator receives light energy to generate an acid to polymerize epoxy, oxetane, vinyl ether, or the like.

  The ionic polymerization reaction will be described by taking a monosulfonium salt and an epoxy monomer as photocationic polymerization initiators as examples. The photoacid generator is an ionic sulfonium salt-based onium salt composed of a cation portion and an anion portion. The photoacid generator is decomposed by irradiation with ultraviolet light, and the anion portion becomes an acid generation source. Next, hydrogen is extracted from the solvent or the acid generator itself to generate an acid. The acid is coordinated to the epoxy and is subjected to the attack of the next epoxy to generate an oxonium cation, and sequential ring-opening polymerization of the oxonium cation and the epoxy proceeds.

  Depending on the type of the head, the depth of the device hole may be increased due to the height relationship between the element substrate and the electric wiring substrate, which may exceed the curable thickness of the sealant. In this case, before the element substrate and the electric wiring board are attached, the element composition and the electric wiring board can be mounted after the adhesive composition is disposed in the lower layer separately from the sealing agent. Subsequently, after the photocurable resin composition is applied between the element substrate and the electrical wiring substrate, a sealing portion is formed by performing first light irradiation, height adjustment by pressing, and second light irradiation. To do. In this case, different materials may be used for the adhesive composition and the photocurable resin, as long as the materials are less likely to be inhibited by curing inhibition or ink contact, and the same materials may be used.

  If the coating amount, height shift amount during pressing, light irradiation range and material viscosity are set appropriately, there will be almost no uncured part, but there is a possibility that an uncured part will occur if the height shift amount is large. is there. In this case, the quality problem in a post process can be prevented by removing the uncured portion. As a method of removing, there are a method of wiping with a wiping material and a method of scraping with a tool having a sharp portion, and any method can easily remove the uncured portion.

Example 1
Examples will be described below.

  In this embodiment, the configuration of the ink jet recording head shown in FIG. 1 is adopted. The ink jet recording head shown in FIG. 1 includes an element substrate 1, a lead wire 2, an electric wiring tape 3, and a head CRG (Bk) 10. An adhesive composition is applied and cured in a width of 6 mm × 1 mm and a thickness of 0.5 mm as a lower layer 7 of the sealing portion in the device hole portion corresponding to the lower part of the electric wiring (lead) of the head CRG (Bk) 10. After the element substrate is attached to the device hole of the head CRG (Bk) 10, the element substrate 1 and the electric wiring tape 3 are electrically connected to each other through the lead wires via the electric wiring tape 3 as shown in the schematic diagram of FIG. Connect to.

  Next, a UV cationic epoxy adhesive (viscosity: 3500 mPa · s) as a sealant was applied to the planned application site 13 using a dispenser. That is, the sealing agent which consists of a photocurable resin composition was arrange | positioned in the electrical connection part of an element substrate and an electrical wiring board.

Then, the UV light source 4 irradiated UV light 200mJ / cm < ² > on the coating surface. The surface portion of the sealant was cured by this first light irradiation.

  Thereafter, the height of the sealant is measured from the surface of the electric wiring tape using the height control member 9 whose bottom surface is an elliptical pressing surface, and the pressing surface is subjected to a liquid repellent treatment with a fluorine-based resin. Was pressed to 0.3 mm. When the predetermined height was reached, the height control member 9 was quickly released.

Thereafter, the sealant was cured by irradiation with UV light at 600 mJ / cm ² (second light irradiation).

  In this embodiment, the black ink jet recording head has been described. However, the present invention is not limited to this, and can be applied to a color ink jet recording head.

(Example 2)
In this example, the same process as in Example 1 was performed until the sealant was applied to the head, and a member made of a transparent resin as a height control member was disposed at the tip of the UV light source, and the height control member and light irradiation. Using the device 12, the height of the sealant was adjusted and cured.

The UV irradiation amount in the first light irradiation was 250 mJ / cm ² , and the UV irradiation amount in the second light irradiation was 700 mJ / cm ^2, and the same cured state as in Example 1 was obtained. The reason why the irradiation amount is increased as compared with Example 1 is that there is a light loss corresponding to the optical path length of the height control member (transparent resin). By making the height control member a part of the light source, the light irradiating unit becomes a simple mechanism that moves only in the vertical direction, and the apparatus can be simplified.

(Example 3)
In this example, the same procedure as in Example 1 was performed until the sealant was applied to the head, and irradiation was performed with a UV light source having a narrower irradiation range than in Examples 1-2. As shown in FIG. 5A, the uncured portion (photo-curable resin composition 6) remaining in the periphery was scraped off with a PP resin scrubber 15 having a tip of 1 mm. FIG. 5B shows a head cross-sectional portion after removal of the uncured portion and a cured product of the photocurable resin composition. Since the delayed curable sealant gradually undergoes a curing reaction after irradiation and becomes difficult to remove, it is preferable to remove the uncured portion immediately after irradiation. As shown in FIG. 5, the shape of the cured product can be arbitrarily formed by selecting the irradiation characteristics (focus type, collimating type, etc.) of the light source and the irradiation range. The sealing portion having a diverging shape from the upper surface to the lower surface shown in FIG. 5 can widen the contact surface to improve adhesion, and can accurately make dimensions in the width and depth directions.

(Example 4)
In this example, the same procedure as in Example 1 was performed until the UV cationic epoxy adhesive was applied and the first light irradiation was performed. Then, height adjustment and 2nd light irradiation were performed using the apparatus as shown in FIG. The height control member is a transparent resin film 14 wound around a roll, and a transparent liquid repellent treatment layer is provided on the surface side of the transparent resin film 14 where the sealant comes into contact. The head CRG is mounted on a jig and flows in the direction of the arrow shown in the figure, and the roll and the head CRG move in conjunction with each other so that the surface to which the sealant hits becomes a new film surface using a continuous film pressing mechanism. To do.

  After applying the sealant, the first light irradiation is performed to cure the surface portion of the sealant. Thereafter, the film surface is pressed against the sealant to adjust the thickness of the sealant to a predetermined height. Simultaneously or after this height adjustment, light is irradiated from the upper light source to complete the curing of the sealant.

  By using a roll-up film as the height control member, the clean surface constantly comes into contact with the sealant to prevent contamination, and the quality is stabilized. Further, if a cleaning mechanism is provided on the winding side, the frequency of pressing film replacement can be reduced.

(Example 5)
In this example, the same process as in Example 1 was performed until the sealant was applied to the head. Using a height control member / light irradiation device 12 with a refractive index distribution attached to the tip of the UV light source with a transparent resin as a height control member, the height of the sealant is adjusted and cured. It was.

  The refractive index distribution is given to the height control member such that the light is diffused from the upper surface to the lower surface of the sealant. For example, inorganic or organic fine particles that do not lose transparency with respect to the wavelength of irradiation light are added to the height control member such that the addition rate decreases continuously from the center of the height control member toward the outside. Alternatively, two types of monomers having different refractive indexes are polymerized so that the refractive index continuously decreases from the center of the height control member toward the outside. By controlling the viscosity and thixotropy of the sealant and setting the irradiation area to be a slightly larger area than the sealant, both the optimization of the shape of the cured product and the reduction of the amount of energy used are satisfied. It becomes possible to do. Further, if the material contains a perfluoro polymer as a low refractive index component, it becomes a low surface free energy surface, and the liquid repellent treatment of the height control member becomes unnecessary.

1 Element substrate (chip)
2 Electrical wiring (lead)
3 Electric wiring board (TAB)
4 Light source 5 Light
6 Photocurable resin composition 7 Adhesive (lower layer of sealing part)
8 Element substrate 9 Height control member 10 Head CRG (Bk)
11 Sealing part (cured product of photocurable resin composition)
DESCRIPTION OF SYMBOLS 12 Height control member and light irradiation apparatus 13 Sealant application | coating area | region 14 Continuous type film press mechanism 15 Scrater 16 Tank case 100 Liquid discharge head 101 Element board | substrate 102 Electric wiring board 103 Ink accommodating part 104 Ejection port 105 Ink supply port 106 Ink supply Flow path 107 Connection terminal 108 Contact portion 109 Inner lead 110 Sealing portion 111 Support member 116 Nozzle plate 117 Substrate

Claims (8)

An element substrate including an energy generating element that generates energy used for discharging a liquid and a connection terminal electrically connected to the energy generating element, and a lead wiring electrically connected to the connection terminal A liquid discharge head manufacturing method comprising: an electrical wiring board comprising: a sealing portion that protects an electrical connection portion between the element substrate and the electrical wiring board;
Disposing a photocurable resin composition on the electrical connection part;
Curing the surface portion of the photocurable resin composition by first light irradiation;
A step of pressing a height control member against the photocurable resin composition to adjust the height of the photocurable resin composition;
Curing the photocurable resin composition by second light irradiation to form the sealing portion;
A method of manufacturing a liquid discharge head, comprising:   The method of manufacturing a liquid ejection head according to claim 1, wherein a liquid repellent layer is provided on a surface of the height control member that contacts the photocurable resin composition.   3. The method of manufacturing a liquid ejection head according to claim 1, wherein the height control member is made of a material transparent to the irradiation light of the first light irradiation and the second light irradiation.   Using the light source used for the first light irradiation and the second light irradiation and the height control member and the light irradiation device in which the height control member is integrally attached, the first light irradiation, the photo-curing type The method of manufacturing a liquid ejection head according to claim 3, wherein the height adjustment of the resin composition and the second light irradiation are performed.   5. The liquid ejection head according to claim 3, wherein the second light irradiation is performed via the height control member in a state where the height control member is pressed against the photocurable resin composition. Method.   The liquid ejection according to claim 1, wherein ultraviolet rays are used for the first light irradiation and the second light irradiation, and the photocurable resin composition is a delayed curing UV cationic epoxy adhesive. Manufacturing method of the head.   The method of manufacturing a liquid ejection head according to claim 1, wherein a refractive index distribution is given to the height control member.   The method of manufacturing a liquid ejection head according to claim 1, further comprising a step of removing an uncured portion of the photocurable resin composition after performing the second light irradiation.

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