JP2014072409A - Component inspection method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To determine the state of an electronic component, before being sucked by a suction nozzle, easily and at a high speed.SOLUTION: A component inspection method includes an image acquisition step for acquiring an image including a current suction position and a previous suction position, when sucking a component housed in the component housing section of a carrier tape by means of a suction nozzle and transferring the component to a predetermined component mounting position, first comparison step for comparing the brightness of the first window of an image including the current suction position with a preset first threshold, and first determination step for determining whether a component in the component housing section is showing the front side or not.

Description

  The present invention relates to a component inspection method and apparatus for determining a state of an electronic component before being sucked by a suction nozzle provided in the surface mounting device when the electronic component is mounted on a substrate using the surface mounting device.

  Conventionally, a surface mounting apparatus for mounting electronic components on a substrate has been used. The surface mounting apparatus sucks an electronic component held on a carrier tape stored in a parts feeder by a suction nozzle, moves the suction nozzle to a component mounting position on a substrate, and mounts the electronic component at the component mounting position.

  When mounting electronic components on a substrate using such a surface mount device, the electronic component mounting state (pre-adsorption state) held on the carrier tape is inspected as a method for inspecting the mounting state of the electronic component. There is a way to do it. The state before the electronic component is sucked includes a state in which the component is in a correct position (normal), a state in which the front and back of the component are reversed (reversed front and back), and a state in which there is no component at the suction position (no component).

  The conventional surface mounting apparatus performs the sucking and mounting operations if the pre-suction state of the electronic component currently mounted is normal. In addition, when the state before the suction of the electronic component currently mounted is reversed, the conventional surface mounting apparatus performs the suction and mounting operations while maintaining the state. In other words, the conventional surface mounting apparatus mounts the inverted parts on the substrate, which causes defective products.

  In addition, if the conventional surface mounting apparatus is in a state before suction, there is no part suction, and the suction operation (retry operation) is performed again by detecting the air suction pressure of the suction nozzle or the part non-suction state using a laser or the like. . The conventional surface mounting apparatus issues a suction error for the first time when suction cannot be performed even if the retry operation is repeated a plurality of times.

  Further, in the conventional surface mounting apparatus, since the user performs a part cueing operation when setting the carrier tape, the larger the number of parts feeders used, the greater the burden on the user.

  In addition, the conventional surface mounting apparatus detects the joint (splicing) of two carrier tapes from the state where there are no continuous parts, and counts the remaining number of parts set in the tape feeder. The retry operation will occur.

  As a related technique, the following Patent Document 1 discloses mounting of a component by performing imaging at least once for each of the component suction operation and the component mounting operation by the suction nozzle and storing the acquired image in a database. A mounting part inspection method for checking the state is described. In the mounted component inspection method described in Patent Document 1, when the mounted state of the component is bad, the cause of the failure can be confirmed.

  However, in the mounting component inspection method described in Patent Document 1, if there is a defect after component mounting, the image of the suction operation and mounting operation stored in the database of the component in which the defect has occurred is accessed and confirmed by the user or the like Since the analysis is performed and the real-time inspection for each mounting point is not performed, the cause of the failure cannot be dealt with immediately.

  Patent Document 2 below describes a pick-and-place machine that inspects a suction operation by acquiring an image of one or a plurality of component suction positions related to the suction operation and identifying when an error occurs. In the pick and place machine described in Patent Literature 2, the operator or the machine can take corrective action by detecting and displaying error information.

  However, in Patent Document 2, it is possible to generate information on the direction, position, size, and presence of a part using at least one image before and after suction using an image analysis technique such as a known edge detection and placement algorithm. Although described as being possible, the implementation means using known edge detection and placement algorithms are not clarified. Further, in Patent Document 2, there is a description that the above-described information is generated or aided by using a shake detection technique. However, the Fourier transform analysis and the automatic which are cited as examples of the shake detection technique are described. Both correlation techniques recognize the part itself. For this reason, teaching is necessary, and processing is heavy and takes time, so it is considered that the pick-and-place machine described in Patent Document 2 cannot perform inspection in real time. In order to perform high-speed inspection, for example, a powerful CPU may be used to handle complicated processing, but this leads to an increase in cost.

JP 2008-098411 A Special table 2008-516453 gazette

  The present invention has been made in view of the above, and an object of the present invention is to provide a component inspection method and apparatus that can easily and quickly determine the state of an electronic component before being sucked by a suction nozzle.

  In order to solve the above-described problems and achieve the object, the component inspection method of the present invention is a method in which a component stored in a component storage portion of a carrier tape is sucked by a suction nozzle and transferred to a predetermined component mounting position. An image acquisition step for acquiring an image including the current suction position and the previous suction position, a luminance of a first window including the current suction position in the image, and a preset first Whether the component in the component storage unit is a table or the component in the component storage unit is not a table based on the comparison result in the first comparison step for comparing the threshold value and the first comparison step And a first determination step for determining.

  As a preferable aspect of the present invention, when it is determined in the first determination step that the component in the component storage unit is not a table, the luminance of the first window and the previous one of the images are included. Based on the comparison result in the second comparison step for comparing the second threshold value calculated based on the brightness of the second window including the suction position and the second comparison step, the component in the component storage unit. It is preferable to further include a second determination step for determining whether the component is the back side or whether the component is stored in the component storage unit.

  As a preferable aspect of the present invention, when it is determined in the second determination step that the component is not stored in the component storage unit, the image data of the first window is stored and stored as an evaluation value. A storage step, wherein the second comparison step determines the brightness of the first window and the accumulated storage when it is determined in the first determination step that the component in the component storage unit is not a table. It is preferable to compare the reference value calculated based on the evaluation value accumulated and stored in the step.

  As a preferred aspect of the present invention, when it is determined in the second determination step that the component is not stored in the component storage unit, a first delivery step of feeding the carrier tape one frame, A component cueing step for cueing a component by repeating the image acquisition step, the first comparison step, the first determination step, and the first delivery step until the component appears at a suction position. It is preferable to provide.

  As a preferred aspect of the present invention, the axial position of the suction nozzle feeds out the carrier tape when it is determined in the second determination step that the component is not stored in the component storage section. If possible, it is preferable to further include a second feeding step of feeding the carrier tape by one frame.

  As a preferred aspect of the present invention, when it is determined in the second determination step that the component in the component storage unit is reversed, the suction operation is performed on the component and the sucked component is discarded. Preferably, the method further includes the step of:

  The component inspection apparatus of the present invention is an apparatus for inspecting a component when the component stored in the component storage portion of the carrier tape is sucked by the suction nozzle and transferred to a predetermined component mounting position. An imaging device that captures an image including a position and a previous suction position, and the brightness of a first window that includes the current suction position in the image and a preset first threshold value are compared. And a table determination processing unit that determines whether the component in the component storage unit is a table or whether the component in the component storage unit is a table.

  According to the present invention, it is possible to easily and quickly determine the state of the electronic component before being sucked by the suction nozzle.

FIG. 1 is a perspective view showing a surface mounting apparatus according to an embodiment of the present invention. FIG. 2 is an enlarged perspective view of the transfer head. FIG. 3 is a front view of the imaging apparatus. FIG. 4 is a diagram illustrating an example of an electronic component suction position image captured by the imaging device. FIG. 5 is a top view showing a winding end portion of the carrier tape. FIG. 6 is a block diagram showing a configuration of the electronic component inspection apparatus according to the embodiment of the present invention. FIG. 7-1 is a diagram illustrating a surface of a suction target component. FIG. 7B is a diagram illustrating the back surface of the suction target component. FIG. 8 is a flowchart showing the pre-adsorption inspection operation of the pre-adsorption inspection apparatus. FIG. 9 is a diagram illustrating an example of the pre-adsorption image captured by the imaging apparatus. FIG. 10 is a diagram illustrating the relationship between the suction position luminance average and the threshold value. FIG. 11 is a flowchart showing the component cueing operation of the pre-suction inspection device. FIG. 12 is a diagram illustrating an example of an image of a winding end portion of a carrier tape. FIG. 13 is a flowchart showing the carrier tape feed control operation of the main controller. FIG. 14A is a diagram illustrating an image of a table of electronic components. FIG. 14B is a diagram of an image of an empty component storage unit in which electronic components are not stored. FIG. 14C is a diagram illustrating an image of the back of the electronic component.

  DESCRIPTION OF EMBODIMENTS Embodiments of a pre-part adsorption inspection method and apparatus according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment.

  FIG. 1 is a perspective view showing a surface mounting apparatus according to the present embodiment. As shown in FIG. 1, a conveyance path 2 is disposed at the center of the base 1 so as to extend in a horizontal first direction (X-axis direction). The transport path 2 transports the substrate 3 and holds and positions the substrate 3 on the transport path 2. That is, the transport path 2 also serves as a substrate holding unit. On the both sides of the transport path 2 in the horizontal direction (Y-axis direction) perpendicular to the X-axis direction, electronic component supply units 4 are arranged. Each supply unit 4 has a plurality of parts feeders 5 arranged in the X-axis direction. The parts feeder 5 accommodates a carrier tape holding electronic components such that the tape length direction is the Y-axis direction or the direction opposite to the Y-axis direction. The parts feeder 5 sequentially supplies electronic components by sending the carrier tape in the tape length direction, that is, the Y-axis direction or the direction opposite to the Y-axis direction.

  A substantially U-shaped Y-axis table 8 </ b> A is disposed so as to straddle one end of the transport path 2 in the vertical direction above the one end of the transport path 2 (Z-axis direction). A substantially U-shaped Y-axis table 8 </ b> B is disposed above the other end of the transport path 2 in the vertical direction (Z-axis direction) so as to straddle the other end of the transport path 2. An X-axis table 6 extending in the X direction is installed between the Y-axis tables 8A and 8B. The X-axis table 6 is constructed with both ends supported by Y-axis tables 8A and 8B. The X axis table 6 is movable in the Y direction by the Y axis tables 8A and 8B.

  A transfer head 7 for transferring electronic components from the supply unit 4 to the substrate 3 is mounted on the lower surface in the vertical direction of the X-axis table 6. The transfer head 7 can be moved in the X-axis direction by the X-axis table 6. Therefore, the transfer head 7 can be moved horizontally (XY plane) by the X-axis table 6 and the Y-axis tables 8A and 8B. That is, the X-axis table 6 and the Y-axis tables 8A and 8B are moving means.

  FIG. 2 is an enlarged perspective view of the transfer head 7. In this embodiment, the transfer head 7 has four suction nozzles, but the present invention is not limited to this. The transfer head 7 includes one base member 52 and four holders 54.

  The base member 52 includes a vertical member 52a extending in the XZ plane direction, and four horizontal members 52b arranged in the X-axis direction at the upper end of the vertical member 52a. Each horizontal member 52b extends in the XY plane direction. In each horizontal member 52b, the Z-axis motor 13 that moves the holder 54 up and down is arranged so that its output shaft is directed downward in the vertical direction.

  Each holder 54 includes first to third horizontal members 54a to 54c extending in the XY plane direction, and a vertical member 54d extending in the XZ plane direction and connecting the first to third horizontal members 54a to 54c. And having. In the first horizontal member 54a, a θ-axis motor 12 that rotates the nozzle shaft 11 in the θ-direction (a direction that rotates around the Z-axis) is disposed so that its output shaft is directed downward in the vertical direction. Holes 54e and 54f are formed in the second and third horizontal members 54b and 54c, respectively. The nozzle shaft 11 is provided so as to penetrate the holes 54e and 54f.

  At the lower end of the nozzle shaft 11, a suction nozzle 10 for sucking electronic components is detachably provided. The lower end portion of the suction nozzle 10 is provided with a suction hole for sucking air. The suction nozzle 10 sucks air from the suction hole to suck the electronic component from the parts feeder 5 and transfers it onto the substrate 3. The upper end portion of the nozzle shaft 11 is coupled to the output shaft of the θ-axis motor 12, and the nozzle shaft 11 can rotate in the θ direction (direction around the Z axis) independently by rotating the θ-axis motor 12. It is.

  A recess 52c is formed on the side surface of the vertical member 52a of the base member 52 on the Y-axis direction side so as to extend in the vertical direction. The concave portion 52c engages with a convex portion 54g formed so as to extend in the vertical direction on the side surface opposite to the Y-axis direction of the vertical member 54d of the holder 54. The output shaft of the Z-axis motor 13 is connected to the holder 54 via a ball screw 56. Therefore, the holder 54 and the nozzle shaft 11 can be moved up and down independently by rotating the output shaft of the Z-axis motor 13.

  Referring again to FIG. 1, a camera 9 is disposed on the movement path of the transfer head 7 between the conveyance path 2 and the supply unit 4. The camera 9 images the transfer head 7 and thus the suction nozzle 10 from below. When the camera 9 captures an image of the transfer head 7 holding the electronic component, it is possible to identify the electronic component and detect a displacement. In addition, the transfer head 7 includes an imaging device 14 that images the suction position of the suction nozzle 10.

  FIG. 3 is a front view of the imaging device 14. The imaging device 14 attached to the transfer head 7 includes one or more cameras 15. The imaging device 14 includes one camera 15 for one nozzle or a plurality of nozzles in order to image the suction position of the suction nozzle 10 at the component level. When the suction positions of all the suction nozzles 10 can be imaged with one camera 15, the suction positions of all the suction nozzles 10 may be collectively imaged with one camera 15.

  FIG. 4 is a diagram illustrating an example of an image of the electronic component suction position imaged by the imaging device 14. The imaging device 14 acquires an image obtained by capturing the electronic component suction position as shown in FIG. 4 from obliquely upward, depending on the positional relationship between the imaging device 14 and the parts feeder 5. In FIG. 4, the carrier tape 16 in which an electronic component is stored is imaged at the center of an image 58. The carrier tape 16 has various materials and colors depending on the component type, but here, a paper tape is taken as an example. An arrow 50 in FIG. 4 indicates the tape length direction of the carrier tape 16.

  In FIG. 4, the image 58 captures two component storage portions 19 a and 19 b on the carrier tape 16. The component storage unit 19a stores the chip component 17 that is currently attracted and mounted. The suction position 18 of the chip component 17 is located substantially at the center of the chip component 17. The component storage unit 19b is a place where a chip component that has already been mounted immediately before is stored, and is currently empty. The component storage unit before the component storage unit 19a in which the chip component 17 that is currently mounted is stored is in an empty state if the suction and mounting are completed normally. A feed hole 20 is formed in the carrier tape 16, and the parts feeder 5 sends the carrier tape 16 to the suction position of the next part using the feed hole 20.

  FIG. 5 is a top view showing a winding end portion of the carrier tape 16 similar to FIG. Here, the inner end portion of the carrier tape 16 wound on the reel of the parts feeder 5 starts to be wound, and the outer end portion that is applied to the parts feeder 5 and mounted first is called a winding end. An arrow 50 in FIG. 5 indicates the tape length direction of the carrier tape 16. As shown in FIG. 5, a plurality of empty component storage portions 19 c to 19 g are provided at the end of winding of the carrier tape 16. Therefore, in order to start mounting the chip component, first, it is determined that the component storage portions 19c to 19g are empty, and the component storage portion 19h of the chip component storage start point is set at the suction position of the suction nozzle 10. The part cueing work is performed.

  FIG. 6 is a block diagram showing a configuration of an electronic component inspection apparatus according to an embodiment of the present invention. As shown in FIG. 6, the inspection device 60 includes an imaging device 14 that images the suction position, a main control device 20 that controls the entire device, and a pre-suction inspection device 30 that performs pre-suction inspection of electronic components. Prepare. The main control unit 20 includes a main CPU 21 that executes various processes.

  The pre-suction inspection device 30 includes a pre-suction image storage unit 31 that is a rewritable memory that stores a pre-suction image captured by the imaging device 14, and a pre-suction state determination processing unit that determines a pre-suction state of the electronic component. 32, a determination result storage unit 33 that is a rewritable memory for storing a determination result by the pre-adsorption state determination processing unit 32, and a pre-adsorption inspection result processing unit that performs processing based on the determination result stored in the determination result storage unit 33 34.

  The pre-suction state determination processing unit 32 includes a suction position reference processing unit 32-1, a feature amount calculation processing unit 32-2, a table determination processing unit 32-3, a component pocket reference processing unit 32-4, and no components. The determination processing unit 32-5 and the componentless parameter storage processing unit 32-6 are provided. Pre-sucking state determination processing unit 32, suction position reference processing unit 32-1, feature amount calculation processing unit 32-2, table determination processing unit 32-3, component pocket reference processing unit 32-4, and no component determination processing unit 32- 5. The component-less parameter storage processing unit 32-6 and the pre-adsorption test result processing unit 34 can be realized by a CPU (Central Processing Unit) and software (program), or can be realized by a hard-wired circuit. it can. The software (program) may be recorded on a recording medium such as a magnetic disk, an optical disk, or a semiconductor memory, or may be downloaded via a LAN (Local Area Network) or the Internet.

  Upon receiving an imaging start command signal from the main control device 20, the imaging device 14 captures a pre-adsorption image. The pre-suction inspection device 30 stores the pre-suction image at the component level from the imaging device 14 in the pre-suction image storage unit 31. The adsorption position reference processing unit 32-1 of the pre-adsorption state determination processing unit 32 sets a window at the adsorption position using the feature amount obtained from the pre-adsorption image. The feature amount calculation processing unit 32-2 calculates the image feature amount in the window. The table determination processing unit 32-3 compares the feature value of the suction position with a table determination feature value that is set as a preset parameter. If the electronic component is determined to be a table, “normal” is set as the pre-suction state. The result is stored in the determination result storage unit 33.

  When the table determination processing unit 32-3 determines that the electronic component is not a table, the component pocket reference processing unit 32-4 is a component pocket (component) that is a suction position (existing in the component storage unit) of the previous component. A window is set in the storage unit, and the feature amount calculation processing unit 32-2 calculates an image feature amount in the window. The component absence determination processing unit 32-5 compares the feature amount of the suction position with the feature amount of the component pocket (component storage unit), and determines that there is no component pocket (component storage unit). If it is determined that it is not a (component storage unit), “front-back inversion” is stored in the determination result storage unit 33 as a pre-suction state. The pre-adsorption inspection result processing unit 34 uses this determination result to output the inspection result to the main controller 20. The no-component parameter storage processing unit 32-6 accumulates and stores the feature amount of the data determined as “no component” by the no-component determination processing unit 32-5 as an evaluation value.

  Here, the component to be sucked in the pre-suction inspection operation of the pre-suction inspection device 30 will be described. FIG. 7A is a diagram illustrating the surface of the suction target component, and FIG. 7B is a diagram illustrating the back surface of the suction target component. Here, a chip part 40 having a body part 41 with a black surface and electrode parts 42 formed at both ends of the body part 41 as shown in FIG. As shown in FIG. 7B, the back surface of the chip component 40 has a body portion 41 that is white.

  FIG. 8 is a flowchart showing the pre-adsorption inspection operation of the pre-adsorption inspection device 30. Hereinafter, the pre-adsorption inspection operation of the pre-adsorption inspection device 30 will be described with reference to FIG.

  First, in step S1, the suction position reference processing unit 32-1 acquires an image captured by the imaging device 14, and sets a first window at the suction position of the suction nozzle (corresponding to an image acquisition step).

  FIG. 9 is a diagram illustrating an example of the pre-adsorption image captured by the imaging device 14. The suction position reference processing unit 32-1 refers to the pre-suction image 45 of the chip component 40 as shown in FIG. 9, and sets the first window at the suction position of the suction nozzle calculated from the relationship between the imaging positions. The pre-adsorption image 45 includes at least a component pocket (component storage unit) 18a in which the chip component 40 currently mounted is stored and a component pocket (component storage) in which the previous chip component is stored. Part) 18b. Here, for easy understanding, the background of the pre-adsorption image 45 is white of a paper tape (carrier tape). An arrow 50 in FIG. 9 indicates the tape length direction. Since the chip component stored in the component pocket (component storage unit) 18b has already been mounted, the component pocket (component storage unit) 18b is empty.

  The suction position reference processing unit 32-1 sets the window size of the first window to a size excluding the electrode portion 42 so that the window covers only the body portion 41 of the chip component 40, for example, a preset component size The width and height are set to one third of the length. The parameters (width and height) may be variable depending on the part type. Further, the suction position reference processing unit 32-1 may recognize the body portion 41 by an image processing operation such as edge extraction and set the first window in the region. The first window determined in this way is referred to as a suction position window 43.

  Next, in step S2, the feature amount calculation processing unit 32-2 refers to the luminance value of each pixel of the suction position window 43 set in step S1, and calculates an average value thereof. This average value is used as the suction position luminance average, and is used as an evaluation value of the target part before suction.

  Next, in step S3, the table determination processing unit 32-3 compares the suction position luminance average calculated in step S2 with a table determination threshold that is a preset parameter (in the first comparison step). Correspondence).

  FIG. 10 is a diagram illustrating the relationship between the suction position luminance average and the threshold value. In FIG. 10, the first threshold value is a table determination threshold value that is a parameter set in advance with reference to the luminance value of the surface of the body part 41 of the chip part 40 obtained under the same illumination conditions. The second threshold value is a threshold value (upper limit value for determining whether there is no component) in which a luminance value of a component pocket (component storage unit), which will be described later, is used as a reference value and the reference value has a certain width on the higher side. The table determination processing unit 32-3 compares the suction position luminance average calculated in step S2 with the table determination threshold value that is a parameter set in advance in step S3, so that the suction position luminance average is a table. Whether it is (normal) or not (abnormal) is determined.

  If the suction position luminance average is not more than the table determination threshold value and the determination result is a table (Yes) in step S4, the table determination processing unit 32-3 proceeds to step S5 and sucks the chip component 40 to be inspected. The previous state is determined as “normal” (corresponding to the first determination step).

  On the other hand, if the determination result is not a table in Step S4 (No), the table determination processing unit 32-3 proceeds to Step S6.

  In step S6, the component pocket reference processing unit 32-4 refers to the same pre-suction image 45 as in step S1, and sets a second window in the component pocket (component storage unit) 18b. The component pocket reference processing unit 32-4 uses the center position of the component pocket (component storage unit) 18b as the suction position of the chip component 40, the positional relationship between the imaging device 14 and the imaging target, and the component storage interval as a parameter of the component data. It can be calculated from the known parameters. The component pocket reference processing unit 32-4 sets a second window having the same size as the suction position window 43 at the calculated center position. Similarly to the suction position window 43, the component pocket reference processing unit 32-4 recognizes the component pocket (component storage unit) 18b by an image processing operation such as edge extraction and displays the second window in the area. May be set. The second window set in this way is referred to as a front suction position window 44 (see FIG. 9).

  In step S7, the component pocket reference processing unit 32-4 refers to the luminance value of each pixel of the front suction position window 44 set in step S6, and calculates an average value thereof. This average value is defined as the component pocket luminance average.

  In step S8, the component absence reference processing unit 32-5 compares the suction position luminance average with the component pocket luminance average (second comparison step) in step S8, and in step S4. It is determined whether the chip component 40 determined not to be front is “inverted” or “no component” (second determination step). The component absence determination processing unit 32-5 determines that “there is no component” if the average suction position luminance calculated in step S2 is near the component pocket luminance average calculated in step S7. It is determined that Specifically, as illustrated in FIG. 10, the component absence determination processing unit 32-5 has a suction position calculated in step S <b> 2 within a range in which a table determination threshold is set as the lower limit and an upper limit value of the component absence determination is set as the upper limit. If the average brightness is included, it is determined that there is no component, and if the average suction position luminance is not included in the above range, it is determined that the front / back is reversed. The upper limit value for the no-component determination may be variable by user input. For example, the maximum value after smoothing the region where the component pocket luminance average is calculated (using a spatial filter) may be used. good.

  As described above, the no-component parameter storage processing unit 32-6 accumulates and stores the feature amount of data determined as “no component” by the no-component determination processing unit 32-5 as an evaluation value. (Corresponding to accumulation and storage step). Therefore, the component absence determination processing unit 32-5 uses a reference value calculated (for example, arithmetic average) based on the accumulated and stored evaluation value as a value to be compared with the suction position luminance average. The suction position luminance average may be compared (corresponding to the second comparison step). Thereby, the component absence determination processing unit 32-5 can determine “no component” with higher accuracy as the operating time of the pre-suction inspection device 30 becomes longer.

  If the component absence determination processing unit 32-5 determines that the suction position luminance average is near the component pocket luminance average in step S8, that is, if it is determined that the suction position luminance average is within the above range (Yes), step In S9, the pre-suction state of the chip component 40 to be inspected is determined as “no component”. On the other hand, if the component absence determination processing unit 32-5 determines in step S8 that the suction position luminance average is not near the component pocket luminance average, that is, if it is determined that the suction position luminance average is not within the above range (No). In step S10, the state before suction of the chip component 40 to be inspected is determined as “reversing front and back”.

  When the component absence determination processing unit 32-5 determines that the state before suction of the chip component 40 to be inspected is “inverted front / back”, the main control device 20 sucks and discards the chip component 40 to be inspected. It is assumed that the transfer head 7 is controlled as described above. By doing in this way, the premise that the part pocket (part storing part) immediately before the inspection object is empty is maintained.

  According to the pre-suction inspection device 30 according to the present embodiment, the electronic component at the suction position is a table (normal) by comparing the suction position luminance average with a table determination threshold that is a preset parameter. Or it is not a table (abnormal). Thereby, the pre-adsorption inspection apparatus 30 can perform real-time inspection with high speed and a small amount of memory.

  Further, according to the pre-suction inspection device 30, when the electronic component at the suction position is not a table (abnormal), the suction position luminance average and the component pocket luminance average calculated based on the luminance of the previous component pocket By comparing,, it can be determined whether the electronic component at the suction position is the reverse side (reverse side) or no component. In this manner, the pre-suction inspection device 30 can perform real-time inspection with a small amount of memory at high speed by referring to the image of the previous part pocket part, which is a part having no part in the same image. .

  Further, the pre-suction inspection device 30 prevents the occurrence of defective products (substrates on which the electronic components are mounted with the back side) by determining the state of reversing the electronic parts in the inspection of the state of the parts before suction. Can do.

  Further, the pre-suction inspection device 30 can generate a suction error by determining the absence of parts in the inspection of the part state before suction, and can eliminate a waste suction retry operation. In particular, it is effective in splicing detection for determining the joint between two tapes by creating a state in which there are no parts continuously.

  Further, the pre-suction inspection device 30 can also perform component cueing. As shown in FIG. 5 described above, a plurality of empty component storage portions 19c to 19g are provided at the end of winding of the carrier tape 16. Therefore, in order to start mounting the chip component, first, it is determined that the component storage portions 19c to 19g are empty, and the component storage portion 19h of the chip component storage start point is set at the suction position of the suction nozzle 10. It is necessary to find the parts.

  FIG. 11 is a flowchart showing a component cueing operation of the pre-suction inspection device 30. Hereinafter, the component cueing operation of the pre-suction inspection device 30 will be described with reference to FIG. Note that the pre-suction inspection apparatus 30 may perform the component cueing operation shown in FIG. 11 simultaneously on a plurality of parts feeders.

  First, in step S21, the imaging device 14 acquires an image of a winding end portion (see FIG. 5) of the carrier tape 16.

  FIG. 12 is a diagram illustrating an example of an image of a winding end portion of the carrier tape 16. An arrow 50 in FIG. 12 indicates the tape length direction. It is assumed that the image 46 shows at least the component storage portion 18d at the mounting target position and the previous component storage portion 18c. In addition, since the part cueing is an operation of sending the tape to the head where the parts of the carrier tape 16 are housed, both parts (part housing parts 18c and 18d) are in an empty state when the part cueing is started. This will be described on the assumption.

  Next, in step S22, the component pocket reference processing unit 32-4 refers to the image 46 acquired in step S21 and sets a window in the previous component storage unit 18c. The component pocket reference processing unit 32-4 sets the center position of the previous component storage unit 18c, the suction position with respect to the component storage unit 18d at the mounting target position, the positional relationship between the imaging device 14 and the imaging target, and the component data It can be calculated from a known parameter called a component storage interval as a parameter. As the window size, for example, a preset component size value is used, and both the width and the height are set to one third. The parameters (width and height) may be variable depending on the part type. Alternatively, the component storage unit 18c may be recognized by an image processing operation such as edge extraction, and a window may be set in the area. The window determined in this way is set as the previous part storage section window 47.

  Next, in step S23, the feature amount calculation processing unit 32-2 refers to the luminance value of each pixel of the previous component storage unit window 47 set in step S22, and calculates an average value thereof. This average value is set as the average brightness of the previous component storage unit, and is an evaluation value indicating the empty component storage unit.

  Next, in step S24, the suction position reference processing unit 32-1 refers to the image 46 as in step S22, and sets a window in the component storage unit 18d at the mounting target position. The suction position reference processing unit 32-1 sets the window to the same size as step S22 with the suction position as the center. The window determined here is set as a target component storage unit window 48.

  Next, in step S25, the feature amount calculation processing unit 32-2 refers to the luminance value of each pixel of the target component storage unit window 48 set in step S24, and calculates an average value thereof. This average value is used as the target component storage unit luminance average, and the evaluation value indicates the state of the component storage unit at the mounting target position.

  Next, in step S26, the table determination processing unit 32-3 compares the previous component storage unit luminance average obtained in steps S23 and S25 with the target component storage unit luminance average, and stores the previous component storage. It is determined whether the average brightness of the part and the average brightness of the target component storage part are the same values. Specifically, the table determination processing unit 32-3 determines whether or not the target component storage unit luminance average is included in a range having a certain width value above and below the previous component storage unit luminance average. Find out. When the target component storage unit luminance average is included in the above range, it can be said that the target component storage unit luminance average and the previous component storage unit luminance average are values in the same vicinity. This constant width may be variable by user input.

  If the table determination processing unit 32-3 determines in step S27 that the comparison result in step S26 is a value in the vicinity of the target component storage unit luminance average and the previous component storage unit luminance average (Yes), Proceed to step S28. In step S28, the table determination processing unit 32-3 determines that the state of the component storage unit 18d at the mounting target position is “no component”, and the main controller 20 sends out the carrier tape 16 by one frame (first frame). 1 corresponding to the sending step).

  Next, in step S29, the component-less parameter storage processing unit 32-6 stores the evaluation value indicating the “component-free” state of the component storage unit as a reference value parameter. As a parameter, for example, an average value or a median value from accumulated evaluation values may be used. By acquiring parameters from a plurality of “no parts” states in advance, for example, when a part remains in the previous part storage part 19c of the image 46, the previous part is mounted. An error can be issued, and the component to be mounted can be inspected by comparison with a parameter.

  If the table determination processing unit 32-3 determines in step S27 that the comparison result in step S26 is not the same value as the target component storage unit luminance average and the previous component storage unit luminance average (No). Proceed to step S30. In step S30, the table determination processing unit 32-3 determines that the state of the component storage unit 18d at the mounting target position is “parts present”.

  In the part cueing operation, the pre-suction inspection device 30 repeats the process shown in FIG. 11 until the “parts present” state appears (corresponding to the part cueing step). Therefore, when the pre-adsorption inspection device 30 starts the comparative inspection from the component storage portions 19c and 19d in the carrier tape 16 shown in FIG. 5, the comparative inspection of the component storage portions 19d and 19e is performed next and proceed in the same manner. In the comparative inspection of the component storage units 19g and 19h, the “parts present” state of the component storage unit 19h is detected for the first time, and the component cueing operation is completed.

  According to the pre-suction inspection device 30 according to the present embodiment, the user's burden can be reduced by automatically performing component cueing. Further, the pre-adsorption inspection device 30 can shorten the time required for the preparation process by simultaneously performing component cueing on a plurality of parts feeders.

  Further, the main controller 20 can perform carrier tape feed control using the determination results of the pre-suction inspection operation and the component cueing operation.

  FIG. 13 is a flowchart showing the carrier tape feed control operation of the main controller 20. Hereinafter, the carrier tape feed control operation of the main controller 20 will be described with reference to FIG.

  First, in step S41, the main control device 20 causes the imaging device 14 to capture an image that captures the pre-suction state of the component. Next, in step S42, the main control device 20 determines whether the state before the component suction is “normal”, “front-back inversion”, or “no component”. For example, the main controller 20 may perform a pre-adsorption inspection shown in FIG.

  Next, in step S43, the main control device 20 receives the determination result in step S42, and determines that there is a part (Yes), the process proceeds to step S44. In step S44, the main controller 20 checks the determination result as to whether or not the pre-suction state of the component is “normal”. If the main controller 20 determines that it is “normal” (Yes), the process proceeds to step S45. In step S45, the main controller 20 performs the suction operation and is completed.

  In step S44, the main controller 20 checks the determination result of whether the pre-suction state of the component is “normal”. If the main controller 20 determines that the state is not “normal” (No), the main control device 20 proceeds to step S46. In step S46, the main controller 20 performs an adsorption operation. At this time, since the state before the suction of the component is “inversion of front and back”, the main controller 20 discards the sucked component in step S47 and is completed.

  On the other hand, when the main control device 20 determines in step S43 that the determination result in step S42 is that there is no component, that is, the “no component” state (No), the main control device 20 proceeds to step S48. In step S <b> 48, the main control device 20 checks the Z position indicating how the nozzle shaft 11 is lowered by the Z-axis motor 13. In step S49, the main controller 20 determines whether the carrier tape can be fed by the parts feeder 5 at the current Z position of the nozzle shaft 11, and determines that the carrier tape can be fed by the parts feeder 5 (Yes). ), The process proceeds to step S50, and if it is determined that the carrier tape cannot be sent by the parts feeder 5 (No), the process proceeds to step S53.

  If the main controller 20 determines in step S49 that the parts feeder 5 is not capable of feeding the carrier tape (No), in step S53, the main controller 20 causes the nozzle shaft 11 to continue to descend by the Z-axis motor 13 to perform the suction operation. Then, the process proceeds to step S50.

  If it is determined that the carrier tape can be sent by the parts feeder 5 (Yes) or if the suction operation is performed in Step S53, the main controller 20 sends the one-frame carrier tape to the next component storage unit in Step S50 ( Corresponding to the second delivery step). In step S51, the main control device 20 counts the number of times that feeder feeding is necessary due to the “no parts” determination (step S43) as the number of retries. In step S52, if the number of retries exceeds the upper limit number that can be changed by the user (Yes), the main controller 20 ends the component inspection and the suction operation. If not (No), the main control device 20 proceeds to step S41. The previous image is captured. Splicing can also be detected by setting the number of consecutive empty component storage portions that are marks of splicing as the upper limit of the number of retries.

  As described above, the main control device 20 can perform the component suction operation with high operation efficiency by controlling the feeding operation of the carrier tape using the inspection result of the component state before the suction.

  Note that the pre-suction inspection device 30 may acquire a feature amount as an evaluation value of the component state from the pre-suction image including the normal state of the electronic component and the state where the component storage unit is empty at the same time.

  FIG. 14-1 is a diagram illustrating an image of a table of electronic components, FIG. 14-2 is a diagram illustrating an image of an empty component storage unit in which electronic components are not stored, and FIG. It is a figure which shows the image of the back of an electronic component.

  For example, when the pre-adsorption inspection apparatus 30 looks at the luminance pattern in the direction of the dotted arrow 51 in FIG. 14A in the chip component 40 illustrated in FIG. 14A, the chip component 40 is a table (normal). Therefore, a luminance pattern of white → black → white can be acquired as a feature amount. On the other hand, the pre-suction inspection device 30 can acquire the empty component storage portion in FIG. 14C, when the luminance pattern is viewed in the direction of the dotted arrow 51 in FIG. 14C, the chip component 40 is reverse (inverted). Therefore, a brightness pattern of white → white → white can be acquired as a feature amount. In this way, the pre-suction inspection device 30 may acquire the feature amount in the “front / reverse inversion” state in addition to “normal” and “no parts” and use it for the determination of the pre-suction state. Thereby, the pre-adsorption inspection apparatus 30 can determine the pre-adsorption state with high accuracy.

DESCRIPTION OF SYMBOLS 1 Base 2 Carriage path 3 Board | substrate 4 Supply part 5 Parts feeder 6 X-axis table 7 Transfer head 8A, 8B Y-axis table 9 Camera 10 Adsorption nozzle 11 Nozzle shaft 12 (theta) axis motor 13 Z-axis motor 14 Imaging device 16 Carrier tape 17, 40 Chip components 18a to 18d, 19a to 19i Component storage unit 20 Main control device 30 Pre-adsorption inspection device 31 Pre-adsorption image storage unit 32 Pre-adsorption state determination processing unit 32-1 Adsorption position reference processing unit 32-2 Feature amount Calculation processing unit 32-3 Table determination processing unit 32-4 Parts pocket reference processing unit 32-5 No-parts determination processing unit 32-6 No-parts parameter storage processing unit 33 Determination result storage unit 34 Pre-adsorption test result processing unit 60 Inspection device

Claims (7)

When the parts stored in the part storage part of the carrier tape are sucked by the suction nozzle and transferred to a predetermined part mounting position,
An image acquisition step of acquiring an image including the current suction position and the previous suction position;
A first comparison step of comparing the brightness of the first window including the current suction position in the image with a preset first threshold;
A first determination step of determining whether the component in the component storage unit is a table or the component in the component storage unit is not a table based on a comparison result in the first comparison step;
A part inspection method comprising: When it is determined in the first determination step that the component in the component storage unit is not a table, the second window includes the luminance of the first window and the previous suction position of the image. A second comparison step for comparing the second threshold value calculated based on the brightness of
A second determination step for determining whether the component in the component storage unit is the back side or whether the component is not stored in the component storage unit based on the comparison result in the second comparison step;
The component inspection method according to claim 1, further comprising: A storage step of storing and storing the image data of the first window as an evaluation value when it is determined in the second determination step that the component is not stored in the component storage unit;
In the second comparison step, when it is determined in the first determination step that the component in the component storage unit is not a table, the luminance of the first window and the storage and storage in the storage and storage step are stored. The reference value calculated based on the evaluation value is compared with the component inspection method according to claim 2. A first feeding step of feeding the carrier tape one frame when it is determined in the second determination step that the component is not stored in the component storage unit;
A component cueing step for cueing a component by repeating the image acquisition step, the first comparison step, the first determination step, and the first delivery step until the component appears at the current suction position; ,
A component inspection method according to claim 2.   If it is determined in the second determination step that the component is not stored in the component storage section, the carrier tape can be sent out if the position of the suction nozzle in the axial direction can be sent out. The part inspection method according to claim 2, further comprising a second delivery step of delivering one frame.   The method includes a step of performing a suction operation on the component and discarding the sucked component when the component in the component storage unit is determined to be upside down in the second determination step. The component inspection method described. A device that inspects a component when the component stored in the component storage portion of the carrier tape is sucked by a suction nozzle and transferred to a predetermined component mounting position,
An imaging device that captures an image including the current suction position and the previous suction position;
The brightness of the first window including the current suction position in the image is compared with a preset first threshold, and the component in the component storage unit is a table or the component storage A table determination processing unit for determining whether the component in the unit is not a table;
A component inspection apparatus comprising:

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