JP2014072281A - Seal structure of through hole, wiring body for use therein, manufacturing method for wiring body and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a seal structure or the like of a through hole which can ensure a required waterproof performance easily.SOLUTION: A seal structure of a through hole provided in a housing of an electronic apparatus and through which a wiring member is inserted includes: a lid member covering the through hole; a frame member provided between the lid member and the housing and holding the wiring member between the lid member and itself while surrounding the through hole; a first adhesive layer provided between the lid member and the frame member and bonding these members while sealing around the wiring member; and a second adhesive layer provided between the frame member and the housing and bonding these members while surrounding the through hole. The first adhesive layer includes an extension extending inward from the inner edge of the frame member.

Description

  The present invention relates to a seal structure for a through hole. More specifically, the present invention relates to a seal structure for a through hole that is provided in a casing or the like of an electronic device and through which a wiring member is inserted.

  In order to seal a through-hole through which a wiring member is inserted in a casing of an electronic device such as a portable terminal with waterproofness, an FPC-integrated gasket described in Patent Document 1 is known. However, the FPC-integrated gasket is difficult to be disposed in a small gap such as a slide portion in a slide-type portable terminal or the like because the height of the entire gasket is increased. Further, the gasket is molded by a mold, and there is a problem that versatility is low and manufacturing cost is increased.

  In order to eliminate the inconvenience, as described in Patent Document 2, a lid member provided so as to cover the through-hole, and surrounding the through-hole in an annular shape, the lid member, the wiring member, and the housing There has been proposed a seal structure that includes an adhesive layer that adheres to each other.

Registered Utility Model No. 3127071 JP 2010-62285 A

  In the seal structure described in Patent Document 2, a flat wiring member is sandwiched between a housing outer surface around the through hole and a lid member provided so as to cover the through hole, The periphery of the wiring member is sealed so as to be surrounded by an adhesive layer that bonds the outer surface of the housing and the lid member.

  The adhesive layer for sealing the wiring member is composed of a housing side adhesive layer provided on the housing side and a lid member side adhesive layer provided on the lid member, and the wiring member is sandwiched between these adhesive layers. Then, an adhesion process is performed in which these members are heated and pressed, and the periphery of the wiring member is filled with an adhesive to form the seal structure.

  A thermosetting adhesive is used as the adhesive, and the adhesive layer is sandwiched between the lid member and the casing in the bonding process to flow and fills the periphery of the wiring member. Thus, a sealing structure having high sealing performance is formed. However, when the adhesive protrudes from the lid member in the bonding step, not only the appearance is deteriorated, but also a problem that it adheres to a jig for bonding, another wiring member, or the like is likely to occur.

  In order to avoid the inconvenience, the outer edge of each adhesive layer is set inside the outer edge of the lid member, and the inner edge is set outside the inner edge of the through-hole. The agent is bonded so as not to protrude from the outer edge of the lid member and the inner edge of the through hole.

  However, in the above structure, there is a possibility that the adhesive width of the adhesive layer between the lid member and the housing becomes small, and sufficient waterproofness cannot be ensured.

  The present invention solves the above-mentioned conventional problems, and provides a sealing structure for a through-hole that can easily ensure the required waterproof performance while ensuring the adhesion performance between the lid member, the wiring body and the housing. The task is to do.

  The invention of the present application is a sealing structure of a through-hole through which a wiring member is inserted, and is provided between a lid member that covers the through-hole, the lid member, and the housing. The wiring member is sandwiched between the lid member, the frame-shaped member surrounding the through-hole, and provided between the lid member and the frame-shaped member to join the members, and the wiring A first adhesive layer that seals the periphery of the member; and a second adhesive layer that is provided between the frame-shaped member and the housing and joins the members, and the first adhesive layer. Is configured to include an extension portion extending inward from the inner edge portion of the frame-shaped member.

  In the present invention, the periphery of the wiring member is sealed through the first adhesive layer between the lid member and the frame member. By adopting the above configuration, a wiring body in which the lid member and the frame-shaped member are attached in advance to a predetermined position of the wiring member is formed, and when the wiring member is inserted into the through hole, A seal structure can be formed by attaching the wiring body via a second adhesive layer provided between the periphery of the through hole and the frame-shaped member. For this reason, it becomes possible to form the said wiring body separately, the sealing performance around a wiring member can be improved, and a highly reliable sealing structure can be comprised.

  In the present invention, since the first adhesive layer extends inwardly from the inner edge of the through hole, that is, an extended portion that protrudes inward is formed. Adhesion width increases. Therefore, the adhesive strength and waterproof performance are increased. On the other hand, since the site | part where the said adhesive agent extends is inside a cover member and a housing | casing, even if an adhesive protrudes, it will hardly become a problem.

  Further, as in the prior art, by configuring the first adhesive layer so as not to extend outside the outer edge portions of the lid member and the frame-shaped member, the appearance may be deteriorated or the adhesive may be cured. It will not adhere to tools or other wiring members.

  The entire inner edge portion of each of the first adhesive layers can be extended from the inner edge portion of the through hole, or a required portion of the first adhesive layer is extended from the inner edge portion of the through hole. You can also

  For example, the first adhesive layer is configured not to extend inward from the inner edge portion of the frame-shaped member at a portion opposed to the portion sandwiching the wiring member with the through hole interposed therebetween. Can do. Thereby, when joining the said cover and the said frame-shaped member, a said 1st adhesive bond layer does not contact and adhere to the said wiring member, and manufacture of a wiring body becomes easy.

  Further, at the portion sandwiching the wiring member, the thickness of the adhesive layer is reduced, and the lid member, the wiring member, and the frame-shaped member must be bonded to each other to ensure waterproofness. For this reason, it is desirable to form the said extension part which extends the said 1st adhesive bond layer from the inner edge part of the said frame-shaped member. On the other hand, since the sufficient thickness of the adhesive layer can be ensured at a portion facing the portion sandwiching the wiring member with the through hole interposed therebetween, waterproofness can be easily ensured. On the other hand, when this portion of the adhesive layer extends to the inside of the lid member, the adhesive tends to adhere to the wiring member. For this reason, it is preferable that the first adhesive layer is configured not to extend inward from the inner edge portion of the through hole.

  The second adhesive layer is also preferably configured so as not to extend outside the outer edge portions of the frame-shaped member and the lid member. Thereby, it can prevent that the problem that the adhesive layer which protruded adheres to an adhesion jig or other wiring members arises.

  The material constituting the first adhesive layer is not particularly limited as long as it can seal the periphery of the wiring member and can extend to the inside of the frame-shaped member in the bonding step. Absent. For example, the first adhesive layer can be formed from a thermosetting resin. Moreover, a thermosetting resin and a thermoplastic resin can be mixed and a repairable adhesive agent can also be employ | adopted. Further, not only a liquid adhesive but also a sheet-like or film-like adhesive can be employed. When a sheet-like or film-like adhesive is employed, an adhesive layer extending inward from the inner edge of the through hole can be formed.

  As said thermosetting resin, 1 or 2 or more resin chosen from thermosetting resins, such as an epoxy resin, a phenol resin, an acrylic resin, a urethane resin, an alkyd resin, and an unsaturated polyester resin, is employable. The adhesive layer may be formed by mixing the thermosetting resin with one or more resins selected from thermoplastic resins such as polyvinyl alcohol resin, acrylic resin, phenoxy resin, and urethane resin. it can. When the above resin material is used, a hot press process is applied to apply the required temperature and pressure to deform or flow the adhesive layer and fill the periphery including the side of the wiring member formed in a stepped shape. can do.

  The form and material of the wiring member are not particularly limited. For example, an insulating base formed from polyimide resin, a wiring layer laminated on the insulating base and having a wiring pattern formed thereon, and an insulating coating layer laminated so as to cover the wiring layer The printed wiring board provided can be adopted. As the printed wiring board, a rigid printed wiring board or a flexible printed wiring board can be adopted. Moreover, the single-sided printed wiring board in which the said wiring pattern was formed in one side of an insulating base material, and the double-sided printed wiring board in which the said wiring pattern was formed in both surfaces of an insulating base material are employable. Furthermore, it can be applied to a flat wire harness or the like.

  The materials constituting the lid member and the frame member are not particularly limited. For example, a plate-like or sheet-like lid member and frame-like member formed from glass epoxy resin, epoxy resin, acrylic resin, polyimide resin, polyurethane resin, or the like can be employed.

  The second adhesive layer is preferably composed of a pressure-sensitive adhesive such as a preventive adhesive tape. Thereby, the seal structure of the through-hole through which wiring is inserted can be formed only by pressing the said wiring body around a through-hole.

  In the present invention, first, a wiring body including a lid member and a frame-shaped member is formed, and then the wiring body is attached to the housing via the second adhesive layer.

  In the manufacturing process of the wiring body, a lid member side adhesive layer laminating step in which a lid member side adhesive layer constituting the first adhesive layer is provided on the lid member, and the first adhesion to the frame member. A frame-shaped member-side adhesive layer stacking step for providing a frame-shaped member-side adhesive layer constituting the agent layer is performed. Next, an adhesion step is performed in which the wiring member is sandwiched between the lid member-side adhesive layer and the frame-shaped member-side adhesive layer, and the pressure is sandwiched between the lid member and the frame-shaped member. In this bonding step, the periphery of the wiring member is sealed by a first adhesive layer composed of the lid member side adhesive layer and the frame member side adhesive layer, and the lid member and the frame member are Are joined. Moreover, in this invention, the extension part by which the said 1st adhesive bond layer was extended inside the said frame-shaped member in this adhesion process is formed.

  The method for extending the first adhesive layer from the inner edge of the frame-shaped member to form the extended portion is not particularly limited. By adjusting the thickness of each adhesive layer and the pressing force in the bonding process, the first adhesive layer can be extended from the inner edge of the frame-shaped member to form the extended portion. .

  Further, in the lid member side adhesive layer laminating step, the lid member side adhesive layer is laminated and formed so that the inner edge portion of the lid member side adhesive layer is inside the inner edge portion of the frame-shaped member. Thereby, the said 1st adhesive bond layer can be extended from the inner edge part of the said frame-shaped member, and the said extension part can be formed.

  The adhesive layer can be extended over the entire area of the inner edge of the frame-like member, or can be extended at a required site that ensures waterproofness.

  For example, the inner edge portion of the first adhesive layer in the portion facing the through-hole with respect to the portion sandwiching the wiring member does not extend inward from the inner edge portion of the frame-shaped member. The lid member side adhesive layer laminating step and the frame member side adhesive layer laminating step can be performed. Specifically, the lid member-side adhesive layer and the frame-shaped member-side adhesive layer can be formed in a state where their inner edge portions are offset outward from the inner edge portion of the frame-shaped member. In the above configuration, even if the first adhesive layer is caused to flow in the bonding step, it can be prevented from extending from the frame-shaped member at the portion.

  When the first adhesive layer extends from the outer edge portions of the lid member and the frame-like member, not only the appearance deteriorates, but the adhesive may adhere to other wiring members and the like. For this reason, it is desirable that the first adhesive layer does not extend from the outer edge portions of the lid member and the frame-like member.

  For example, the lid member-side adhesive is such that the outer edge of the lid member-side adhesive layer and the outer edge of the frame-like member-side adhesive layer are inside the outer edge of the lid member and the frame-like member. The layer lamination step and the frame-shaped member side adhesive layer lamination step can be performed. With this configuration, even when the first adhesive layer is caused to flow in the bonding step, the first adhesive layer is configured not to extend from the outer edge portions of the lid member and the frame-shaped member. it can.

  Then, the 2nd adhesive bond layer lamination process which provides a 2nd adhesive bond layer on the opposite side to the side which provided the said frame-shaped member side adhesive bond layer in the said frame-shaped member is performed. The second adhesive layer laminating step can be performed, for example, by attaching a waterproof adhesive tape on which release paper is laminated to a frame-shaped member.

  The seal structure of the through-hole according to the present invention includes a wiring body attaching step for joining the frame-shaped member constituting the wiring body around the through-hole formed in the housing via a second adhesive layer. It is formed by doing. For example, when the wiring body including the waterproof adhesive tape is employed, the release paper is removed, and the frame-shaped member is attached so as to surround the through hole, thereby forming a through hole seal structure. Therefore, it is possible to form a highly waterproof seal structure very easily. The present invention can be applied to through holes having various forms and can be applied to through holes provided in various electronic devices.

  In the seal structure of the through-hole through which the wiring member is inserted, a seal structure having high sealing performance can be easily formed.

1 is an overall perspective view of a mobile terminal to which a seal structure according to the present invention is applied. It is a figure which shows the cross-section of the slide part of the portable terminal shown in FIG. FIG. 3 is a plan view of the seal structure shown in FIG. 2. It is sectional drawing which follows the IV-IV line in FIG. It is sectional drawing which follows the VV line in FIG. It is sectional drawing which follows the VI-VI line in FIG. It is a figure which shows the manufacturing method of the wiring body which concerns on this invention, and is a figure which shows the adhesion process which pinches | interposes a wiring member between a cover member and a frame-shaped member. It is sectional drawing which shows the 2nd adhesive bond layer lamination process which provides a 2nd adhesive bond layer in a wiring body. It is sectional drawing which shows the wiring body attachment process which joins a frame-shaped member so that the said through-hole may be enclosed.

  Embodiments of the present invention will be specifically described below with reference to the drawings. In the following embodiments, the present invention is applied to a seal structure of a slide type mobile phone which is a mobile terminal.

  The portable terminal 1 includes a display unit 3 for displaying various types of information, an input unit 4, and a slide unit 8. The display unit 3 is provided with a display device 6 using a liquid crystal display panel, a speaker, and the like. The input unit 4 is provided with input keys and a microphone. The slide unit 8 is configured by slidingly fitting an outer frame 8a provided on the display unit 3 side and an inner frame 8b provided on the input unit 4 side.

  As shown in FIG. 2, the display unit 3 is provided with a display unit casing 31 and a display unit substrate 35 as main members. The display unit substrate 35 includes a circuit or the like for sending a display signal to the display device 6. The display unit housing 31 includes a first housing 31a and a second housing 31b that are connected to each other. The first casing 31a is formed with a through hole 33 in which a seal structure is formed in the present invention.

  The input unit 4 is provided with an input unit housing 41 and an input key substrate 45 as main members. The input key board 45 includes a circuit for controlling a signal sent from the input key. The input unit housing 41 includes a first housing 41a and a second housing 41b that are connected to each other. And the through-hole 43 in which the seal structure based on this invention is formed is formed in the said 1st housing | casing 41a.

  A wiring member 21 for connecting the input key substrate 45 and the display unit substrate 35 is provided through the slide unit 8. The wiring member 21 in the present embodiment employs a flexible printed wiring board, and harness portions 25 a and 25 b are provided at both ends of the wiring member 21 to constitute the wiring body 20. Each harness part 25a, 25b is connected to each board | substrate 35, 45, and is comprised so that transmission / reception of a signal can be performed.

  Hereinafter, the seal structure 15a provided in the through hole 43 formed in the first housing 41a of the input unit 4 will be described. The seal structure 15b provided in the through hole 33 formed in the first housing 31a of the display unit 3 is configured in the same manner.

  3 to 6 show a seal structure 15a according to the present invention. FIG. 3 is a plan view of the seal structure 15a according to the present invention. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is a cross-sectional view taken along the line VV in FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. For ease of understanding, only the cut end face is shown in the cross-sectional view.

  As shown in FIGS. 3 and 4, the seal structure 15 a according to the embodiment is provided between the lid member 11 covering the through hole 43, the lid member 11, and the housing 41 a, and the wiring member 21. Between the lid member 11 and the frame-like member 50 surrounding the through-hole 43, and provided between the lid member 11 and the frame-like member 50 to join these members and the wiring A first adhesive layer 13 that seals the periphery of the member 21; and a second adhesive layer that is provided between the frame-shaped member and the housing to join the members and surround the through-hole 43. It is prepared for.

  In the present embodiment, the periphery of the wiring member 21 is sealed via the first adhesive layer 13 between the lid member 11 and the frame-shaped member 50. By adopting the above configuration, it is possible to form the wiring body 20 in which the lid member 11 and the frame-like member 50 are attached in advance at predetermined positions of the wiring member 21. Then, when the wiring member 21 is inserted into the through hole, the wiring body 20 is bonded through the second adhesive layer 60 provided between the periphery of the through hole 43 and the frame-shaped member 50. Thus, the seal structure 15a can be formed. For this reason, it becomes possible to form the said wiring body 20 separately, the sealing performance around the wiring member 21 can be improved, and a highly reliable sealing structure can be comprised. Further, the seal structure 15a can be formed very easily.

  In the present embodiment, an extending portion 70 is formed in which the first adhesive layer 13 extends inward from the inner edge portion of the frame-shaped member 50. For this reason, the adhesive width of the adhesive layer is increased by the extended portion. Therefore, the adhesive strength and waterproof performance are increased. On the other hand, since the extending portion 70 is inside the lid member 11 and the housing 41a, there is little problem even if the adhesive protrudes.

  The first adhesive layer 13 is configured not to extend from the outer periphery of the lid member 11 and the frame-shaped member 50. For this reason, there is no possibility that the appearance will deteriorate or the adhesive will adhere to other wiring members and the like.

  In the embodiment described above, the entire inner edge portion of the first adhesive layer 13 is extended from the inner edge portion of the frame-shaped member 50, but only a portion that ensures waterproofness can be extended. .

  For example, the first adhesive layer 13 can be configured not to extend from the inner edge portion of the through hole at least at a portion opposite to the portion sandwiching the wiring member 21. At the portion sandwiching the wiring member 21, the thickness of the adhesive layer is reduced. Therefore, the first adhesive layer is extended from the inner edge of the frame-shaped member 50 in order to secure the waterproof property by bonding the lid member 11, the wiring member 21 and the frame-shaped member 50 to each other. Is desirable. On the other hand, since the sufficient thickness of the adhesive layer can be ensured at a portion facing the portion sandwiching the wiring member 21 with the through hole interposed therebetween, waterproofness can be ensured. On the other hand, when the first adhesive layer in this portion is clamped and extends to the inside of the lid member 11, it is easy to come into contact with the wiring member. For this reason, the first adhesive layer 13 may be configured not to extend inward from the inner edge of the frame-shaped member 50 as necessary. Thereby, when joining the said cover member 11 and the said frame-shaped member 50, the said 1st adhesive bond layer 13 does not contact and adhere to the said wiring member 21, and manufacture of the wiring body 20 is carried out. It becomes easy.

  Since the second adhesive layer 60 is not extended outward from the frame-like member 50 and the lid member 11, the appearance of the seal structure is deteriorated, or the adhesive adheres to other wiring members and the like. There is no fear of doing.

  The wiring member 21 according to the present embodiment is not particularly limited. For example, as the wiring member 21, a printed wiring board configured to include an insulating base (not shown), a wiring layer on which a circuit pattern is formed, and an insulating coating layer formed so as to cover the wiring layer. Can be adopted. Moreover, not only a flexible printed wiring board but a rigid wiring board can also be employ | adopted as the said printed wiring board.

  7 to 9 show a method for forming the seal structure.

  The through-hole seal structure 15a according to the present embodiment forms the wiring body 20 with the lid member 11 and the frame-like member 50 attached in advance at a predetermined portion of the wiring member 21, and the lid member 11 and the wiring member 21 and the frame-shaped member 50 are attached by attaching a second adhesive layer 60 around a through-hole 43 provided in the housing 41a.

  In the present embodiment, first, the wiring body 20 including the lid member 11 and the frame-like member 50 is formed. As described above, the wiring body 20 has a frame shape that can be bonded so as to sandwich the lid member 11 covering the through hole 43 and the wiring member 21 between the lid member 11 and surround the through hole 43. A member 50 and a first adhesive layer 13 provided between the lid member 11 and the frame-like member 50 for joining the members 50 and sealing the periphery of the wiring member 21 are provided. Yes. The first adhesive layer 13 includes a lid member side adhesive layer 13 b provided on the lid member 11 and a frame member side adhesive layer 13 a provided on the frame member 50. The adhesive layers 13a and 13b are respectively formed in the lid member side adhesive layer laminating step and the frame-shaped member side adhesive layer laminating step.

  The material constituting the first adhesive layer 13 is particularly limited as long as it can seal the periphery of the wiring member 21 and can extend to the inside of the frame-like member 50 in the bonding step. There is nothing. For example, the first adhesive layer 13 can be formed from a thermosetting resin. Moreover, a thermosetting resin and a thermoplastic resin can be mixed and a repairable adhesive agent can also be employ | adopted. Further, not only a liquid adhesive but also a sheet-like or film-like adhesive can be employed. When a sheet-like or film-like adhesive is employed, the lid member-side adhesive layer 13b and the frame-like member-side adhesive layer 13a extending inward from the inner edge of the through hole 43 can be easily formed. .

  An adhesion step is performed in which the wiring member 21 is sandwiched between the lid member 11 and the frame-shaped member 50 and the lid-member-side adhesive layer 13b, the frame-shaped member-side adhesive layer 13a, and the wiring body 20 are heated and pressed. Thus, the lid member side adhesive layer 13b and the frame member side adhesive layer 13a are integrated to form the first adhesive layer 13, and the first adhesive layer 13 is It is caused to flow inward and outward between the member 11 and the frame-like member 50. As a result, the periphery of the wiring member 21 is sealed via the first adhesive layer 13, and the first adhesive layer 13 extends inward from the inner edge of the frame-shaped member 50. The extended portion 70 is formed. In addition, the wiring body 20 is formed in which the lid member 11 and the frame-like member 50 are attached to predetermined portions of the wiring member 21.

  As shown in FIG. 7, the inner edge portion of the lid member side adhesive layer 13b constituting the first adhesive layer 13 extends inward (offset) from the inner edge portion of the frame-like member 50, and is formed in a laminated manner. In addition, the inner edge portion of the frame-shaped member side adhesive layer 13 a is formed so as to coincide with the inner edge portion of the frame-shaped member 50. In the present embodiment, the inner edge portion of the lid member side adhesive layer 13b is set to be 0.1 mm to 1 mm, preferably 0.2 mm to 0.5 mm inside from the inner edge portion of the frame member 50.

  On the other hand, the outer edge portions of the lid member side adhesive layer 13b and the frame-like member side adhesive layer 13a are formed so as to be offset from the outer edge portions of the lid member 11 and the frame-like member 50. Yes. In the present embodiment, the outer edge portions of the lid member side adhesive layer 13b and the frame member side adhesive layer 13a are 0.1 mm to 1 mm, preferably 0, from the outer edge portions of the lid member 11 and the frame member 50. .2mm to 0.5mm inside.

  The lid member side adhesive layer 13b and the frame-like member side adhesive layer 13a are brought into contact with each other to sandwich the two adhesive layers 13a and 13b, and the frame-like member 50 is integrated. The first adhesive layer 13 is formed by flowing inward and outward. In the present embodiment, the inner edge portion of the lid member side adhesive layer 13b extends inward from the inner edge portion of the frame member 50, and the inner edge portion of the frame member side adhesive layer 13a is formed as described above. It is formed so as to coincide with the inner edge of the frame-shaped member 50. With this configuration, as shown in FIG. 8, in the bonding step, the inner portion of the first adhesive layer 13 is extended inward from the inner edge portion of the frame-shaped member 50, thereby forming an extended portion 70. Is done.

  The lid member 11 and the frame-shaped member 50 are bonded together in a state where the first adhesive layer 13 is extended inward from the inner edge of the frame-shaped member 50, that is, in a state of protruding to the inner side. Therefore, the adhesive width of the adhesive layer is increased accordingly. Accordingly, the adhesive strength and waterproof performance are increased accordingly. For this reason, the wiring member 21 can be reliably sealed between the lid member 11 and the frame-shaped member 50. Moreover, the waterproof property between the said cover member and the said frame-shaped member is securable.

  On the other hand, by forming the outer edge portions of the lid member side adhesive layer 13b and the frame-like member side adhesive layer 13a offset inward from the outer edge portions of the lid member 11 and the frame-like member 50, the bonding step The first adhesive layer 13 is configured not to extend outward from the outer edge portions of the lid member 11 and the frame-shaped member. For this reason, there is no possibility that the appearance will deteriorate or the adhesive will adhere to other wiring members and the like.

  The first adhesive layer 13 does not need to be extended over the entire inner edge portion of the frame-shaped member 50, and only a portion that ensures waterproofness can be extended.

  Next, as shown in FIG. 8, a second adhesive layer laminating step of providing a second adhesive layer on the side opposite to the side on which the frame-shaped member-side adhesive layer is provided in the frame-shaped member is performed. Is called.

  The said 2nd adhesive bond layer 60 which concerns on this embodiment is comprised from the waterproof adhesive tape, and is comprised so that an outer edge part and an inner edge part may each correspond to the outer edge part and inner edge part of the said frame-shaped member 50, respectively. Has been. The waterproof adhesive tape can be provided when the wiring body 20 is attached to the housing 41a, or can be attached to the wiring body 20 in advance. In this case, it is preferable to attach release paper to the housing joint surface side of the waterproof adhesive tape and remove the release paper before attaching the waterproof paper to the housing.

  The wiring body attaching step is performed by positioning the second adhesive layer 60 so as to surround the through-hole 43 and pressing the wiring body 20 against the housing 41a with a predetermined pressure. Thereby, the sealing structure 15a of the through-hole provided with high waterproof performance can be formed easily.

  In the present embodiment, since the first adhesive layer 13 and the second adhesive layer 60 are not extended outward from the frame-like member 50 and the lid member 11, the appearance of the seal structure is deteriorated. There is no fear that the adhesive will adhere to other wiring members or the like.

  Moreover, in this embodiment, since the circumference | surroundings of the said wiring member 21 can be reliably sealed by the 1st adhesive bond layer 13, the 2nd adhesive bond layer 60 is made into pressure sensitive adhesives, such as a waterproof adhesive tape. The required waterproof performance can be ensured even if formed by using.

  The scope of the present invention is not limited to the embodiment described above. The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined not by the above-mentioned meaning but by the scope of the claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

  It is possible to provide a through-hole sealing structure that can reliably seal the through-hole through which the wiring member is inserted.

DESCRIPTION OF SYMBOLS 11 Lid member 13 1st adhesive layer 15a Seal structure 21 Wiring member 41a Housing | casing 43 Through-hole 60 2nd adhesive layer 70 Extension part

Claims (17)

A seal structure of a through hole that is provided in a housing of an electronic device and through which a wiring member is inserted,
A lid member covering the through hole;
A frame-like member provided between the lid member and the housing, sandwiching the wiring member between the lid member and surrounding the through hole;
A first adhesive layer that is provided between the lid member and the frame-shaped member to join the members and seals the periphery of the wiring member;
A second adhesive layer that is provided between the frame-shaped member and the housing to join the members and surrounds the through-hole;
The first adhesive layer has a through-hole sealing structure including an extending portion extending inwardly from an inner edge portion of the frame-shaped member.   2. The through hole sealing structure according to claim 1, wherein the first adhesive layer is configured not to extend outside an outer edge portion of the lid member and the frame-shaped member.   The first adhesive layer is configured not to extend inward from the inner edge portion of the frame-shaped member at a portion facing the through-hole with respect to a portion sandwiching the wiring member. The seal structure of the through-hole of Claim 1 or Claim 2.   The through-hole seal structure according to any one of claims 1 to 3, wherein the first adhesive layer is formed of a thermosetting resin.   The through hole sealing structure according to any one of claims 1 to 4, wherein the second adhesive layer is formed of a pressure-sensitive adhesive.   The through-hole sealing structure according to claim 1, wherein the wiring member is a printed wiring board. A wiring body that includes a wiring member that is inserted into a through hole provided in a housing of an electronic device, and that seals the through hole,
A lid member covering the through hole;
A frame-shaped member that can be bonded so as to surround the through hole while sandwiching the wiring member with the lid member;
A first adhesive layer that is provided between the lid member and the frame-like member to join the members and seals the periphery of the wiring member;
The first adhesive layer includes an extended portion that extends inward from the inner edge of the frame-shaped member, and
The wiring body, wherein the lid member and the frame-shaped member are attached to a predetermined portion of the wiring member via the first adhesive layer.   The wiring body according to claim 7, wherein the first adhesive layer is configured not to extend outside the outer edge portions of the lid member and the frame-shaped member.   The first adhesive layer is configured not to extend inward from the inner edge portion of the frame-shaped member at a portion facing the through-hole with respect to a portion sandwiching the wiring member. The wiring body according to claim 7 or 8.   The wiring body according to any one of claims 7 to 9, wherein the first adhesive layer is formed of a thermosetting resin.   11. The apparatus according to claim 7, further comprising a second adhesive layer made of a pressure-sensitive adhesive on the side opposite to the side on which the first adhesive layer is provided in the frame-shaped member. Wiring body as described. It is a manufacturing method of the wiring object given in any 1 paragraph of Claims 7-10,
A lid member side adhesive layer laminating step of providing a lid member side adhesive layer constituting the first adhesive layer on the lid member;
A frame-shaped member-side adhesive layer stacking step of providing a frame-shaped member-side adhesive layer constituting the first adhesive layer on the frame-shaped member;
By sandwiching the wiring member between the lid member-side adhesive layer and the frame-shaped member-side adhesive layer and sandwiching pressure between the lid member and the frame-shaped member, the periphery of the wiring member is In addition to sealing, including an adhesion step of joining the lid member and the frame-shaped member,
The method for manufacturing a wiring body, wherein in the bonding step, the first adhesive layer is extended inside the frame-shaped member.   The manufacturing method of the wiring body according to claim 12, wherein the lid member side adhesive layer laminating step is performed such that an inner edge portion of the lid member side adhesive layer is located inside an inner edge portion of the frame-shaped member.   Lamination of the lid member side adhesive layer so that the outer edge of the lid member side adhesive layer and the outer edge of the frame member side adhesive layer are inside the outer edge of the lid member and frame member. The method for manufacturing a wiring body according to claim 12 or 13, wherein the step and the frame-shaped member side adhesive layer lamination step are performed.   The lid so that the inner edge portion of the first adhesive layer at a portion opposed to the portion sandwiching the wiring member across the through hole does not extend inward from the inner edge portion of the frame-shaped member. The method for manufacturing a wiring body according to any one of claims 12 to 14, wherein the member side adhesive layer laminating step, the frame-shaped member side adhesive layer laminating step, and the adhering step are performed.   Any one of Claims 12-15 including the 2nd adhesive bond layer lamination | stacking process which provides a 2nd adhesive bond layer on the opposite side to the side which provided the said frame-shaped member side adhesive bond layer in the said frame-shaped member. The manufacturing method of the wiring body of Claim 1. An electronic device comprising the through-hole sealing structure according to any one of claims 1 to 6.

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