JP2014071060A - Distance measuring module, and method for manufacturing distance measuring module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a distance measuring module with no individual difference in base line length capable of being manufactured at a high yield, and to provide a method for manufacturing the distance measuring module.SOLUTION: A distance measuring module for measuring a distance from a difference of the images output from a plurality of image capturing devices which is cut off from a semiconductor wafer in a state where three or more image capturing devices are linked together includes: at least two image capturing devices for outputting images; an electrode position conversion substrate arranged between the at least two image capturing devices; and an image capturing device fixing substrate for fixing the plurality of image capturing devices. The electrode position conversion substrate includes: a plurality of first electrodes wire-bonded with a plurality of image capturing device electrodes arranged on two image capturing devices side on an outer periphery of the two image capturing devices side; a plurality of second electrodes wire-bonded with a plurality of fixed substrate electrodes arranged on the image capturing device fixing substrate on an outer periphery of the image capturing device fixing substrate side; and a plurality of electrode wires connecting the plurality of first electrodes and the plurality of second electrodes, respectively.

Description

  The present invention relates to a distance measuring module and a method for manufacturing a distance measuring module.

  Conventionally, two cameras separated by a certain distance are used, and the distance to the object is measured by calculating from the parallax in the output image from each camera and the distance (baseline length) between the two cameras. Digital cameras equipped with a distance device are already known.

  FIG. 5 is an explanatory diagram showing the basic principle of distance measurement by the distance measuring optical system of this type of distance measuring device. In this type of stereo distance measuring device, distance measurement to the subject is performed based on the triangulation method. Is going.

  In FIG. 5, 101 is a subject, 102 is a distance measuring device, and symbol A ′ is a distance from the subject 101 to the distance measuring device 102 (more precisely, a distance from the subject 101 to a principal point of a distance measuring lens described later). It is. The distance measuring device 102 includes a first distance measuring optical system 103 and a second distance measuring optical system 104.

  The first distance measuring optical system 103 includes a distance measuring lens 103A and a distance measuring image receiving element 103B, and the second distance measuring optical system 104 includes a distance measuring lens 104A and a distance measuring image receiving element 104B. Consists of. The first distance measuring optical system 103 and the second distance measuring optical system 104 are fixedly disposed on a fixed base (stage) 105. As shown in FIG. 6, the distance measuring image receiving elements 103B and 104B are composed of a large number of pixels arranged vertically at a predetermined pitch interval.

  The optical axis O1 of the first distance measuring optical system 103 and the optical axis O2 of the second distance measuring optical system 104 are parallel to each other, and the distance between the optical axis O1 and the optical axis O2 is referred to as a base line length. The base line length is indicated by the symbol D.

  Here, a case where the subject 101 is measured using the distance measuring device 102, that is, a case where the subject 101 is imaged using the first distance measuring optical system 103 and the second distance measuring optical system 104 is considered.

  The image forming light beam P1 from the subject 101 is focused on the image receiving pixel 103C of the distance measuring image receiving element 103B through the distance measuring lens 103A of the first distance measuring optical system 103. The image forming light beam P2 from the subject 101 is focused on the image receiving pixel 104C of the distance measuring image receiving element 104B through the distance measuring lens 104A of the second distance measuring optical system 104. The images formed on the image receiving pixels 103C and 104C are photoelectrically converted and input to the next ranging arithmetic circuit.

  Since the same point 101A of the subject 101 has parallax, the image receiving positions of the image receiving pixel 103C in the distance measuring image receiving element 103B and the image receiving pixel 104C in the distance measuring image receiving element 104B are different. The parallax occurs as a shift in the vertical direction with respect to both optical axes O1 and O2 in a plane including the optical axes O1 and O2.

  Here, the focal length of both the distance measuring lenses 103A and 104A is f, the distance A ′ is much larger than the focal length f of the distance measuring lenses 103A and 104A, and mathematically there is a relationship of A ′ >> f. In some cases, the following relational expression [1] holds.

          A ′ = D × (f / Δ) [1]

  Since the base line length D and the focal length f of both the distance measuring lenses 103A and 104A are known, the distance from the subject 101 to the distance measuring device 102 can be obtained by obtaining the parallax Δ from the relational expression of the above equation [1]. A ′ can be calculated.

  The parallax Δ is obtained by calculating the positions of the image receiving pixels 103C and 104C as shown in FIGS. 6A and 6B. In FIG. 6A and FIG. 6B, the ◯ marks indicate images of the same point 101A of the subject 1 formed at the positions of the image receiving pixels 103C and 104C, respectively. It should be noted that the round mark of the broken line in the ranging image receiving element 104B virtually shows the image of the subject formed on the ranging image receiving element 103B. The parallax Δ is a lateral shift amount ΔY1 from the center O of the pixel of the ranging image receiving element 103B to the receiving pixel 103C, and a lateral direction from the center O of the pixel of the ranging image receiving element 104B to the receiving pixel 104C. Is obtained as the sum of the deviation amount ΔY2. As described above, the method for calculating the distance A ′ from the parallax Δ between the two images is the triangulation method.

  Here, FIG. 7 shows a conventional method of manufacturing a general image sensor (image sensor package). A flow diagram is shown on the left side of the figure, and a schematic diagram showing the state of the chip in each flow is shown on the right side. First, a sensor chip 110 is prepared in which a plurality of electrode pads 112 are arranged on the imaging region 111 in the center of the chip and on the four outer peripheral sides on the same surface of the imaging region 111 (step S101). Then, the protective glass 113 is adhered on the imaging region 111 of the sensor chip 110 (step S102). Further, in the die bonding process, the sensor chip 110 having the protective glass 113 bonded on the imaging region 111 is bonded to the interposer substrate 114 (step S103).

  Next, in the wire bonding process, the electrode 112 disposed on the sensor chip 110 and the electrode 115 on the interposer substrate 114 are connected by the metal wire 116 (step S104). Thereafter, in the wire sealing step, the thermosetting resin 117 is used to protect the metal wire 116 used for connection (step S105). Through the above steps, an image sensor package in which the image sensor can be connected to the circuit board by the reflow process can be obtained.

  Note that solder balls may be formed on the back surface of the interposer substrate 114 after the wire sealing step (step S105). However, in practice, the process up to the step of adhering the protective glass 113 on the imaging region 111 of the sensor chip 110 described above is performed in the sensor wafer state, and then the above-described die bonding process (step The process proceeds to S103). Further, most of the above-described die bonding process (step S103) to the wire sealing process (step S105) are made in a sheet form in which a plurality of interposer substrates 114 are connected.

  In addition, FIG. 8 shows a method for manufacturing an imaging element having a through electrode. Similarly to FIG. 7, a flow diagram is shown on the left side of the drawing, and a schematic diagram showing the state of the chip in each flow diagram is shown on the right side. First, the sensor circuit 2101 is collectively formed on the silicon wafer 210 (step S201). Next, the support glass 211 is affixed to the sensor light-receiving surface formed on the silicon wafer 210 (step S202). Then, the back surface of the silicon wafer 210 is polished (step S203). The broken line portion in the figure represents the wafer back surface portion that has been polished and disappeared. Further, using a known technique such as reactive ion etching (RIE) or laser drilling, the back surface of the silicon wafer 210 to the electrode is drilled as indicated by an arrow H in the drawing (step S204). ).

  Thereafter, in the backside wiring process, the electrode 212 is drawn to the backside of the silicon wafer 210 using a known technique such as lithography and electrode film formation (step S205). Further, solder balls 213 are arranged on the back surface of the silicon wafer 210 (step S206). Finally, dicing is performed as indicated by an arrow G in the drawing (step S207), thereby obtaining sensor modules 220a, 220b, and 220c that are separated into pieces.

  By the way, the above-described baseline length is used for measuring the distance from the camera to the object. Therefore, in order to measure an accurate distance, it is desirable that the baseline length does not vary. Therefore, when assembling the distance measuring device, when the distance measuring image sensor manufactured by the manufacturing method as described above is arranged on the substrate, the positional deviation and angle deviation of each distance measuring image sensor are corrected. Work to do.

  With respect to the above, Patent Document 1 discloses three or more imaging elements arranged from among a plurality of imaging elements formed on a semiconductor wafer for the purpose of accurately arranging a plurality of ranging imaging elements at predetermined positions. A configuration of a distance measuring device that performs a distance measuring process using an image sensor that is cut out integrally with a semiconductor wafer is disclosed.

  In the distance measuring apparatus according to Patent Document 1, as shown in FIG. 9, the image pickup device substrate 311 and the three distance measurement image pickup devices 311a, 311b, and 311c are well-known on the semiconductor wafer 400 as shown in FIG. Among the plurality of image pickup elements formed by the semiconductor process, three image pickup elements 410 arranged in a line (see the hatched portion) are integrally cut with the semiconductor wafer 400 and used.

  Since the plurality of imaging elements 410 on the semiconductor wafer 400 are patterned using a mask, the three separated imaging elements 311 for distance measurement are aligned with high accuracy, and further, three distance measuring elements are used. The pixel matrices of the image pickup devices 311a, 311b, and 311c are parallel. Further, since the surface of the semiconductor wafer 300 is an accurate plane, the normal lines of the three distance measuring imaging elements 311a, 311b, and 311c are necessarily parallel.

  Thus, the distance measuring image sensors 311a, 311b, and 311c are accurately arranged at predetermined positions without performing work for correcting the positional deviation and the angle deviation of the distance measuring image sensors 311a, 311b, and 311c. At the same time, since the light receiving surfaces of the distance measuring image sensors 311a, 311b, and 311c can be arranged so that there is no angular deviation (tilt), the distance to the subject can be measured stably and accurately.

  However, the conventional method for manufacturing an image sensor as described above has the following problems. First, the general method for manufacturing an image sensor shown in FIG. 7 is developed. For example, when the image sensor is cut in triplicate as shown in FIG. 9, a so-called wire in which the wire passes over the wire. There are problems that multi-stage bonding of the bonds occurs, making it difficult to route wiring by wire bonding of adjacent electrodes, and that the length of the electrode wires and the angle between the electrodes are increased.

  Further, when a plurality of through silicon via imaging devices as shown in FIG. 8 are cut out in series, there is a problem that the yield of the through electrode forming process is not high at present. When using it as a single image sensor instead of a plurality, it is only necessary to select a non-defective product. However, when cutting out a plurality of images, a good product that includes the through-electrode process is required at both ends. Become. However, a stereo camera in which the conventional image sensor that has undergone through electrode processing is cut in triplicate and the base line length is fixed by a semiconductor process is likely to cause defects in the through electrode portion, and the yield is not sufficient. There's a problem.

  The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a ranging module that can be manufactured with a high yield without any individual difference in baseline length, and a method for manufacturing the ranging module. And

  In order to solve the above-described problems, the distance measuring module of the present invention is a distance measuring module that measures the distance from the difference between images output from a plurality of imaging elements cut out from a semiconductor wafer in a state where three or more are connected. An electrode position conversion board comprising: at least two image sensors for outputting an image; an electrode position conversion board disposed between the at least two image sensors; and an image sensor fixing board for fixing a plurality of image sensors. Are arranged on the outer periphery on the two image sensor side, on the image sensor fixed substrate on the outer periphery on the image sensor fixed substrate side, on the outer periphery on the image sensor fixed substrate side, and on the image sensor fixed substrate side. A plurality of fixed substrate electrodes arranged, a plurality of second electrodes wire-bonded, and a plurality of electrode lines respectively connecting the plurality of first electrodes and the plurality of second electrodes.

  In order to solve the above problems, the distance measuring module manufacturing method of the present invention measures the distance from the difference between images output from a plurality of imaging elements cut out from a semiconductor wafer in a state where three or more are connected. A method for manufacturing a ranging module, the step of cutting out a plurality of image sensors from a semiconductor wafer, and protecting the image areas in the image areas of at least two image sensors that output an image among the plurality of image sensors A step of attaching a protection member and a plurality of electrode lines for connecting a plurality of first electrodes and a plurality of second electrodes arranged on the outer periphery to an image pickup element positioned between at least two image pickup elements that output an image A step of attaching an electrode position conversion board, a step of fixing a plurality of image pickup elements each having a protective member and an electrode position conversion board attached thereto to an image pickup element fixing board, and an electrode position conversion base Wire bonding a plurality of first electrodes arranged on the outer periphery of the two image pickup devices and a plurality of image pickup device electrodes arranged on the two image pickup devices, and an image sensor fixing substrate side of the electrode position conversion substrate A plurality of second electrodes disposed on the outer periphery of the substrate and a plurality of fixed substrate electrodes disposed on the imaging element process substrate.

  According to the present invention, a ranging module having no individual difference in the baseline length can be manufactured with a high yield.

It is a schematic block diagram of the ranging module of embodiment of this invention. It is a flowchart which shows the procedure of the manufacturing method of the ranging module of embodiment of this invention. It is explanatory drawing about the wire bonding process in the manufacturing method of the ranging module of embodiment of this invention. It is explanatory drawing showing the height relationship of the protective glass and metal wire in the ranging module of embodiment of this invention. It is explanatory drawing for demonstrating the principle of the triangulation method by the conventional stereo distance measuring device. It is explanatory drawing of the parallax detection method by the conventional stereo distance measuring device. It is a flowchart which shows the procedure of the manufacturing method of the conventional image pick-up element. It is a flowchart which shows the procedure of the manufacturing method of the image pick-up element which has the conventional penetration electrode. It is a schematic block diagram of the conventional image pick-up element cut by 3 series. It is a top view which shows the some image pick-up element formed on the semiconductor wafer.

  A stereo distance measuring module according to an embodiment of the present invention will be described below with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the part which is the same or it corresponds, The duplication description is simplified thru | or abbreviate | omitted suitably. Briefly describing the contents of the present invention, in order to obtain two image sensors having a certain distance to be used in a distance measuring device such as a stereo camera, in three or more image sensors arranged side by side from a semiconductor wafer. The chips at both ends are used as image pickup elements, and an electrode position conversion substrate is disposed on the center chip to ensure a certain distance between the image pickup elements.

  A schematic configuration of the distance measuring module 1 according to the embodiment of the present invention will be described with reference to FIG. As shown in FIG. 1A, a triple sensor die 11 in which sensor dies 11a, 11b, and 11c are connected for at least three chips is used in the distance measuring module 1 of the present embodiment. The sensor die 11b provided at the center of the triple sensor die 11 does not output an image, and the electrode position conversion substrate 30 is provided on the chip. Further, on both sides of the triple sensor die 11, a sensor die 11a and a sensor die 11c used for image output as a triple stereo camera are provided. And the protective glass 20 as a protection member which protects an imaging area | region is provided in the center part of the sensor die 11a and the sensor die 11c, and the several electrode pad 13 is provided in the outer periphery four sides on the same surface as the imaging area | region of the sensor die 11a and the sensor die 11c. Provided.

  Next, details of the electrode position conversion substrate 30 of the distance measuring module 1 of the present embodiment will be described with reference to FIG. A plurality of electrode pads 31 are formed on the outer periphery 4 sides of the upper surface portion of the electrode position conversion substrate 30 so as to be connected to the electrode located on the sensor die 11b side among the electrodes 13 of the sensor dies 11a and 11c at both ends. In the present embodiment, among the plurality of electrode pads 31 arranged on the four outer sides of the upper surface of the electrode position conversion substrate 30, the electrode pads 31 arranged on two adjacent sides are formed on the electrode position conversion substrate 30. A plurality of sets of electrode pairs are formed by being connected by a plurality of printed wirings 32 serving as electrode lines.

  In the present invention, of the electrode pads 31 arranged on the four outer sides of the electrode position conversion substrate, the electrode pad arranged on the sensor die 11a and sensor die 11c side is used as the first electrode, and is arranged on the package substrate side described later. The electrode pad to be used as the second electrode.

  Prior to the specific description, first, for convenience, the four outer sides of the electrode position conversion substrate 30 are referred to as an upper side U, a right side R, a lower side L, and a left side F in the clockwise direction from the upper side. Four electrode pads 31a, 31b, 31c, 31d are arranged on the upper side U, four electrode pads 31e, 31f, 31g, 31h are arranged on the right side R, and four electrodes are arranged on the lower side L. Pads 31i, 31j, 31k, 31l are arranged, and on the left side F, electrode pads 31m, 31n, 31o, 31p are also arranged.

  In addition, eight L-shaped printed wirings 32 having different lengths are provided on the electrode position conversion substrate 30 without crossing each other. These printed wirings 32 connect individual electrode pads arranged on two adjacent sides as described above to form one set of electrode pairs. The electrode position conversion board | substrate 30 is a board | substrate which literally converts the position of the electrode arranged on a certain side into the position of the electrode arranged on the other side.

  Specifically, the electrode pad 31a disposed on the left side of the upper side U is connected to the electrode pad 31p disposed on the upper side of the left side F by the printed wiring 32a to form a set of electrode pairs. Further, the electrode pad 31b disposed on the left side near the center of the upper side U is connected to the electrode pad 31o disposed on the upper side near the center of the left side F by the printed wiring 32b to form a pair of electrodes.

  The electrode pad 31d disposed on the right side of the upper side U is connected to the electrode pad 31e disposed on the upper side of the right side R by the printed wiring 32c to form a set of electrode pairs. Further, the electrode pad 31c disposed on the right side near the center of the upper side U is connected to the electrode pad 31f disposed on the upper side near the center of the right side R by the printed wiring 32d to form one set of electrode pairs.

  The electrode pad 31l arranged on the left side of the lower side L is connected to the electrode pad 31m arranged on the lower side of the left side F by the printed wiring 32g to form a set of electrode pairs. The electrode pad 31k disposed on the left side near the center of the lower side L is connected to the electrode pad 31n disposed on the lower side near the center of the left side F by the printed wiring 32h to form a pair of electrodes.

  Furthermore, the electrode pad 31i disposed on the right side of the lower side L is connected to the electrode pad 31h disposed on the lower side of the right side F by the printed wiring 32e to form a set of electrode pairs. The electrode pad 31j arranged on the right side near the center of the lower side L is connected to the electrode pad 31g arranged on the lower side near the center of the right side F by the printed wiring 32f to form a set of electrode pairs.

  In addition, this invention is not limited to the number of each electrode pad formed on the electrode position conversion board | substrate 30 mentioned above, and the number and aspect of printed wiring. In the present embodiment, the shape of the printed wiring is L-shaped or inverted L-shaped, but if the two electrode pads can be connected to form a pair of electrodes, for example, the printed wiring is curved. May be formed.

  Further, in the present invention, as long as the printed wirings connecting the two electrode pads are formed so as not to overlap on the same surface of the substrate, they are arranged on two adjacent sides as in this embodiment. It is not limited to the aspect which connects the nearest electrode pads. For example, in the above example, the electrode pad 31b arranged on the left side near the center of the upper side U and the electrode pad 31g arranged on the lower side near the center of the right side R may be connected by printed wiring. Good. In the present embodiment, the wiring for connecting the electrode pads to each other is described as a printed wiring. However, if the electrode wires are wired on the same surface of the substrate, for example, the wires are embedded in the substrate, the printed wiring is used. It is not limited.

  Next, a method for manufacturing the distance measuring module 1 of the present embodiment will be described with reference to FIG. First, as in the prior art, a triple sensor die 11 cut from a semiconductor wafer by dicing is prepared (step S1). Then, the protective glass 20 is attached to the imaging regions 12 of the sensor dies 11a and 11c arranged on both sides of the triple sensor die 11 by a known attachment means (step S2). Moreover, the electrode position conversion board | substrate 30 is attached with the well-known attachment means on the sensor die 11b distribute | arranged to the center of the triple sensor die 11 (step S2).

  Then, as in the prior art, the triple sensor die 11 on which the protective glass 20 and the electrode position conversion substrate 30 are mounted is fixed on a package substrate 40 as an imaging element fixing substrate in a die bonding process (step S3). Further, using the conventional technique, each electrode pad in the triple sensor die 11 and each electrode pad 41 arranged on the outer periphery of the package substrate 40 are connected by wire bonding using the metal wire 42 (step S4). Then, in the wire sealing step as in the prior art, the metal wire 42 connected by the thermosetting resin 43 is protected (step S5). In the present invention, the member used for protecting the metal wire 42 is not limited to the thermosetting resin 43.

  Here, in the method of manufacturing the distance measuring module 1 of the present embodiment, the wire bonding process in step S4 described above is different from the conventional one, and the characteristic points will be described in detail below with reference to FIG. Schematically, in the present embodiment, the present invention is characterized in that the electrode position conversion substrate 30 disposed on the center sensor die 11b of the triple sensor die 11 is connected by wire bonding.

  FIG. 3 shows each electrode 31 disposed on the electrode position conversion substrate 30, each electrode 13 disposed near the center of the sensor die 11a and the sensor die 11c, and each electrode 41 disposed near the outer periphery center of the package substrate 40. FIG. 3 is an enlarged view of a triple sensor die 11 fixed to a package substrate 40 for showing in detail a state in which a wire is connected by a metal wire 42;

  First, the electrode 31a to the electrode 31d disposed on the upper side U of the electrode position conversion substrate 30 and the electrode 41a to the electrode 41d disposed on the upper side in the drawing near the center of the outer periphery of the package substrate 40 are formed from the metal wire 42a to the metal. Each wire is connected by a wire 42d. Then, the electrode 31i to the electrode 31l disposed on the lower side L of the electrode position conversion substrate 30 and the electrode 41e to the electrode 41h disposed on the lower side in the drawing near the center of the outer periphery of the package substrate 40 are formed from the metal wire 42i. Each is connected by a metal wire 42l.

  Further, the electrodes 31e to 31h disposed on the right side R of the electrode position conversion substrate 30 and the electrodes 13a to 13d disposed near the electrode position conversion substrate 30 of the sensor die 11c are respectively connected by the metal wires 42e to 42h. Connected. Furthermore, the electrode 31m to the electrode 31p disposed on the left side F of the electrode position conversion substrate 30 and the electrode 13e to the electrode 13h disposed near the electrode position conversion substrate 30 of the sensor die 11a are respectively connected by the metal wire 42m to the metal wire 42p. Connected.

  And as above-mentioned, with the printed wiring formed on the electrode position conversion board | substrate 30, each electrode pad distribute | arranged to two adjacent sides of the electrode position conversion board | substrate 30 is connected, and one electrode pair is formed. Therefore, for example, the electrode 42a disposed on the package substrate 40 and the electrode 13h disposed on the sensor die 11a are composed of the electrode 31a and the electrode 31p on the electrode position conversion substrate 30 connected by the printed wiring 32a. The connection is made through one set of electrode pairs.

  The wire connection between the electrodes 13 arranged on the outer periphery other than the side of the sensor die 11a and the sensor die 11c on the electrode position conversion substrate 30 side and the electrodes 41 arranged on the outer periphery of the package substrate 40 is the same as in the prior art. Since there is, explanation is omitted.

  Further, in the wire sealing step, the electrodes disposed on the left and right sides of the electrode position conversion substrate 30, the sensor die 11 a, and the sensor die are arranged so that the height of the thermosetting resin used for sealing matches the surface of the protective glass 20. It is desirable that the height of the metal wire 42 that connects each electrode arranged near the electrode position conversion substrate 30 of 11c be lower than the upper surface of the protective glass 20 (see FIG. 4). Furthermore, it is more desirable that the height of the metal wire 42 is at least 50 μm lower than the upper surface of the protective glass 20.

  Conventionally, in order not to have the electrode position conversion substrate as in the present embodiment, the electrode on the package substrate 40 and the electrode on the sensor die must be directly wire bonded, and thereby the wire bond as described above. There are problems that it becomes difficult to handle wiring by wire bonding of adjacent electrodes, and that the length of the electrode wires and the angle between the electrodes become large due to the multi-stage stacking.

  On the other hand, according to the above-described configuration of the present embodiment, the electrode pairs formed on the electrode position conversion substrate 30 are, for example, as if the electrodes 13h of the sensor die 11a face the electrodes 41a of the package substrate 40. Since the position is converted or, more precisely, the connection route is detoured by printed wiring, it is possible to solve the above-described problem of wiring by wire bonding.

  Also, this embodiment is configured by cutting out a triple sensor die from a semiconductor wafer while diverting a conventional wire bond electrode connection instead of a conventional through-electrode type imaging device. Therefore, the ranging module can be manufactured with a high yield. In addition, the chip-to-chip pitch specified in the wafer process is used so that the solid line length difference is zero. For example, a distance measuring device to which the distance measuring module according to the present embodiment is applied from a camera. When used for measuring the distance to the object, there is no error and it is possible to measure an accurate distance.

DESCRIPTION OF SYMBOLS 1 Distance measurement module 11 Triple sensor die 11a, 11b, 11c Sensor die 12 Imaging area 13, 31, 41 Electrode pad 20 Protective glass 30 Electrode position conversion board 32 Printed wiring 40 Package board 42 Metal wire 43 Thermosetting resin

JP 2012-7906 A

Claims (7)

A distance measuring module that measures a distance from a difference between images output from a plurality of imaging elements cut out from a semiconductor wafer in a state where three or more are connected.
At least two image sensors for outputting images;
An electrode position conversion substrate disposed between the at least two imaging elements;
An image sensor fixing substrate for fixing the plurality of image sensors;
The electrode position conversion board includes a plurality of first electrodes wire-bonded to a plurality of imaging element electrodes arranged on the two imaging elements on an outer periphery on the two imaging element sides, and an imaging element fixing substrate side. On the outer periphery, a plurality of second electrodes wire-bonded to a plurality of fixed substrate electrodes disposed on the imaging element fixed substrate, and a plurality of electrodes respectively connecting the plurality of first electrodes and the plurality of second electrodes A distance measuring module comprising a line.   The distance measuring module according to claim 1, wherein the electrode line is formed on the same surface of the electrode position conversion substrate. A protective member for protecting an imaging region of the at least two imaging elements;
The distance measuring module according to claim 1, wherein a height of the wire used for the wire bonding is lower than an upper surface of the protective member. A method for manufacturing a distance measuring module for measuring a distance from a difference between images output from a plurality of imaging elements cut out from a semiconductor wafer in a state where three or more are connected,
Cutting out the plurality of imaging elements from the semiconductor wafer;
Attaching a protective member that protects the imaging area to the imaging area of at least two imaging elements that output an image among the plurality of imaging elements;
An electrode position conversion board having a plurality of electrode wires connecting the plurality of first electrodes and the plurality of second electrodes arranged on the outer periphery is attached to the image pickup element positioned between at least two image pickup elements that output the image. Process,
Fixing the plurality of imaging devices to which the protection member and the electrode position conversion substrate are attached to an imaging device fixing substrate;
Wire bonding the plurality of first electrodes disposed on the outer periphery of the electrode position conversion substrate on the two image sensor side and the plurality of image sensor electrodes disposed on the two image sensors;
A step of wire-bonding a plurality of second electrodes disposed on the outer periphery of the electrode position conversion substrate on the imaging element fixed substrate side and a plurality of fixed substrate electrodes disposed on the imaging element process substrate. A method for manufacturing a distance measuring module.   The method of manufacturing a distance measuring module according to claim 4, wherein the electrode line is formed on the same surface of the electrode position conversion substrate.   6. The method for manufacturing a distance measuring module according to claim 4, wherein the wire bonding is performed such that a height of the wire used in the wire bonding step is lower than an upper surface of the protective member.   The method for manufacturing a ranging module according to claim 4, further comprising a step of sealing a wire used for the wire bonding.

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