JP2014056796A - Inspection method for terminal crimped state and device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection method for a terminal crimped state and a device therefor that can stably inspect a defective with higher sensitivity and are suitable for inspection of a new defective generated in terminal crimping.SOLUTION: An inspection method for a terminal crimped state includes: an inspection condition setting step of calculating, as an inspection condition, a tolerance based upon a crimp force (CF) waveform of a nondefective sample and a CF waveform of a defective sample; a reference waveform acquisition step of averaging CF waveforms of nondefective samples as a reference waveform and calculating a CF value of the reference waveform; an inspection waveform acquisition step of acquiring a CF waveform in terminal crimping as an inspection waveform of an inspection object and calculating a CF value of the inspection waveform; and an acceptance determination step of determining whether the terminal crimping is accepted based upon the CF value of the reference waveform acquired in the reference waveform acquisition step and the CF value of the inspection waveform obtained in the inspection waveform acquisition step.

Description

  The present invention relates to a terminal crimping state inspection method and apparatus for inspecting a crimped state when a crimping terminal is attached to an electric wire by crimping.

  Conventionally, a method using a crimp force monitor is known as a method for detecting a terminal crimping failure such as “core wire breakage” or “insulator bite” during terminal crimping. For example, Patent Document 1 discloses a terminal crimping state determination method that can stably determine the quality of a crimped state, can detect even a fine defect, and can reduce the time required for the determination.

  In this terminal crimping state discriminating method, a reference waveform is generated based on a load value when a terminal fitting with a good crimping state is obtained, and this reference waveform is divided into a plurality of points to set singular points. In addition to integrating the reference partial waveform including the singular point among the divided areas, a characteristic waveform is generated based on the load value when obtaining the terminal fitting to be discriminated. Divide and integrate the partial waveform corresponding to the reference partial waveform. Thereafter, the integrated value of the reference partial waveform and the integrated value of the partial waveform are compared to determine the quality of the product to be determined.

  Further, it is known that the tolerance used for determining whether the terminal crimping state is good or not is calculated using a waveform of a defective product, or calculated in consideration of variations in the waveform of a good product.

JP 2002-352931 A

  However, due to recent improvements in crimping technology, there is a need for an inspection method that can inspect even conventional defective products with higher accuracy. In addition, it has become necessary to inspect defective products that have not been regarded as a problem so far.

  The present invention has been made to solve the above-mentioned problems, and the problem is that it is possible to stably inspect a defective product with higher sensitivity and to inspect a new defective product generated by terminal crimping. It is another object of the present invention to provide a terminal crimping inspection method and apparatus suitable for the above.

  In order to solve the above-mentioned problem, the terminal crimping state inspection method according to the present invention is a test condition setting in which a tolerance is calculated based on a crimp force waveform of a non-defective sample and a crimp force waveform of a defective sample and used as an inspection condition. A reference waveform acquisition step for calculating a crimp force value of the reference waveform by obtaining an average of the crimp force waveform of the step and the non-defective sample, and acquiring a crimp force waveform at the time of crimping the terminal to obtain an inspection waveform to be inspected A test waveform acquisition step for calculating a crimp force value of the test waveform, a crimp force value of the reference waveform acquired in the reference waveform acquisition step, and a crimp force value of the test waveform acquired in the test waveform acquisition step. A pass / fail determination step for determining pass / fail of terminal crimping is included.

  ADVANTAGE OF THE INVENTION According to this invention, a defective product can be test | inspected stably with higher sensitivity, and the inspection method of the terminal crimping state suitable for the inspection of the new defective product which generate | occur | produces by terminal crimping can be provided.

It is a perspective view which shows schematic structure of the crimp terminal used as a measuring object with the inspection method of the terminal crimping state which concerns on Example 1 of this invention, and an electric wire. It is a front view which shows the structure of the terminal crimping apparatus used with the inspection method of the terminal crimping state which concerns on Example 1. FIG. It is a side view which shows the structure of the terminal crimping apparatus used with the inspection method of the terminal crimping state which concerns on Example 1. FIG. It is a figure for demonstrating the engagement state of the ram and crimper holder of the terminal crimping apparatus used with the inspection method of the terminal crimping state which concerns on Example 1. FIG. It is a block diagram which shows the structure of the crimping | compression-bonding detection apparatus contained in the terminal crimping apparatus used with the inspection method of the terminal crimping state which concerns on Example 1. FIG. It is a flowchart which shows the setting process of the test conditions performed with the crimping | fitting defect detection apparatus of the terminal crimping apparatus used with the inspection method of the terminal crimping state which concerns on Example 1. FIG. It is a flowchart which shows the detail of the calculation process of the waveform of the difference of the quality goods and inferior goods performed by step S13 of FIG. It is a figure for demonstrating the operation | movement at the time of the insulator biting performed with the crimping | compression-bonding defect detection apparatus of the terminal crimping apparatus used with the inspection method of the terminal crimping state which concerns on Example 1. FIG. It is a figure for demonstrating the operation | movement at the time of the core wire breakage performed with the crimping | compression-bonding defect detection apparatus of the terminal crimping apparatus used with the inspection method of the terminal crimping state which concerns on Example 1. FIG. It is a figure for demonstrating the example of a position setting at the time of the test | inspection in the crimping | compression-bonding defect detection apparatus of the terminal crimping apparatus used with the inspection method of the terminal crimping state which concerns on Example 1. FIG. It is a flowchart which shows the reference | standard waveform acquisition process performed with the crimping | compression-bonding defect detection apparatus of the terminal crimping apparatus used with the inspection method of the terminal crimping state which concerns on Example 1. FIG. It is a flowchart which shows the test | inspection process performed with the crimping | compression-bonding defect detection apparatus of the terminal crimping apparatus used with the inspection method of the terminal crimping state which concerns on Example 1. FIG. It is a figure for demonstrating the waveform determination method performed with the crimping | compression-bonding defect detection apparatus of the terminal crimping apparatus used with the inspection method of the terminal crimping state which concerns on Example 1. FIG.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a terminal crimped state inspection method and apparatus according to the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is a perspective view illustrating a schematic configuration of a crimp terminal and an electric wire to be measured by the terminal crimping state inspection method according to the first embodiment of the present invention. In FIG. 1, the crimp terminal 51 is attached to the electric wire 61 by being crimped as a terminal.

  The electric wire 61 includes a conductive core wire 60 and an insulating covering portion 62 that covers the core wire 60. The core wire 60 is formed by twisting (bundling) a plurality of conductive wires, and has a round cross-sectional shape. The conducting wire constituting the core wire 60 is made of a conductive metal such as copper, copper alloy, aluminum, or aluminum alloy, for example. The covering portion 62 is made of an insulating synthetic resin. Before the crimp terminal 51 is attached, the electric wire 61 is in a state where a part of the end of the covering portion 62 is removed and a part of the core wire 60 is exposed.

  The crimp terminal 51 is formed by bending a conductive sheet metal. The crimp terminal 51 is a so-called female terminal in which an electrical contact portion 53 described later is formed in a cylindrical shape. The crimp terminal 51 includes an electric wire connecting portion 52 for connecting to the electric wire 61, an electric contact portion 53 for connecting to another terminal fitting, and a bottom wall 54 connecting the electric wire connecting portion 52 and the electric contact portion 53. I have.

  The electric wire connecting portion 52 includes a pair of electric wire crimping feet 55 and a pair of core wire crimping feet 50. The pair of electric wire caulking legs 55 is erected from both edges of the bottom wall 54. The electric wire crimping foot 55 is bent toward the bottom wall 54 to sandwich the electric wire 61 from above the covering portion 62 with the bottom wall 54. Thus, the pair of wire crimping feet 55 crimps the wire 61.

  The pair of core wire caulking feet 50 is erected from both edges of the bottom wall 54. The core wire crimping foot 50 is bent toward the bottom wall 54 to sandwich the exposed core wire 60 with the bottom wall 54. Thus, the pair of core wire crimping feet 50 crimps the core wire 60.

  Next, a terminal crimping device that bends the core wire crimping foot 50 and the wire crimping foot 55 toward the bottom wall 54 and crimps the crimp terminal 51 to the wire 61 will be described with reference to FIGS.

  As shown in the front view of FIG. 2, the terminal crimping device 200 has a frame 1. The frame 1 includes a substrate 2 and side plates 3 and 3 on both sides thereof. As shown in the side view of FIG. 3, a servo motor 4 having a speed reducer 5 is fixed behind the upper side plates 3 and 3. As shown in FIG. 2, a disc 7 having an eccentric pin (crank shaft) 8 is mounted on the output shaft 6 of the speed reducer 5, and a slide block 9 is pivotally attached to the eccentric pin 8. The slide block 9 is slidably mounted between seats 10 and 10a attached to the ram 11. The slide block 9 slides between the receiving seats 10 and 10 a in the left-right direction by the rotation of the disk 7. The ram 11 moves up and down together with the slide block 9.

  The ram 11 is attached to ram guides 12 and 12 provided on the inner surfaces of the side plates 3 and 3 so as to be slidable up and down. The disc 7, slide block 9, seats 10, 10a, ram 11, and ram guide 12 constitute a piston-crank mechanism. As shown in FIG. 4, the ram 11 has an engagement recess 13 at the lower end, and an engagement projection 16 of a crimper holder 15 to which a crimper 14 is attached is detachably attached to the engagement recess 13. Yes.

  As shown in FIG. 2, the anvil 17 faces the crimper 14. The anvil 17 is fixed to an anvil mounting base 24 on the substrate 2. As shown in FIG. 4, a pressure sensor 100 is provided between the ram 11 and the crimper holder 15. The pressure sensor 100 is connected to the crimping failure detection device 300. Then, the load in the vertical direction from the crimper 14 (hereinafter, this load value is referred to as “load value”) is detected by the crimping failure detection device 300 based on the output of the pressure sensor 100, and the detected load value is the crimping pressure. It is processed as a characteristic value in the process. This load forms a reaction force from the crimp terminal 51 during the crimping operation and a force applied to the crimp terminal 51.

  In FIG. 2, reference numeral 18 denotes a terminal supply apparatus having a known configuration. The terminal supply device 18 includes a terminal guide 19 that supports a chain-shaped crimp terminal 51 (not shown), a terminal retainer 20, a terminal feed arm 22 having a terminal feed claw 21 at the tip, and a swing link that advances and retracts the terminal feed arm 22. 23 and the like.

  The swing link 23 swings back and forth as the ram 11 descends and rises, and the terminal feed claws 21 feed the crimp terminals 51 onto the anvil 17 one by one. The anvil 17 can be easily adjusted, removed, and replaced with respect to the crimper 14 by operating the handle 25 of the anvil mounting base 24.

  The servo motor 4 performs forward and reverse rotations, and lowers and raises the ram 11, that is, the crimper 14 by the above-described piston-crank mechanism. The servo motor 4 is connected to a driver 32 (with a positioning function) that controls driving of the servo motor 4. Then, the crimping terminal 51 and the electric wire 61 arranged between the crimper 14 and the anvil 17 are crimped by the lowering and raising of the crimper 14 according to the rotation of the servo motor 4.

  Therefore, the upper stop position (top dead center position) and the lower stop position (bottom dead center position) of the ram 11 are determined by the forward / reverse rotation amount determined by the servo control of the servo motor 4. Thus, the bottom dead center position of the ram 11 is determined according to the servo control of the servo motor 4 and does not necessarily coincide with the bottom dead center position on the structure of the piston-crank mechanism that the ram 11 can reach. Therefore, the bottom dead center of the ram 11 determined according to the servo control of the servo motor 4 is referred to as “servo bottom dead center” in order to distinguish it from the structural bottom dead center that the ram 11 can reach. The lower dead center position of the ram 11 is indicated by a smaller value as the position in the terminal crimping apparatus 200 is lower (closer to the anvil 17), and is indicated as a larger value as the position is higher (farther from the anvil 17).

  Note that an input unit 33 is connected to the driver 32. The input unit 33 is used to input reference data such as the standard (or size) of the crimp terminal 51, the size of the corresponding electric wire 61, the crimp height, and the load (current) applied to the servo motor 4. Further, an encoder 31 is attached to an output shaft (not shown) of the servo motor 4, and the position of the crimper 14 is detected based on the rotation speed and fed back to the driver 32.

  Next, the crimping failure detection apparatus 300 will be described with reference to the block diagram shown in FIG. The crimping failure detection device 300 corresponds to the terminal crimped state inspection device of the present invention. The amplifier 41 amplifies the output of the pressure sensor 100, and the analog voltage signal output from the amplifier 41 is converted into digital voltage data. A D converter 42, an input unit 43, a CPU 44, a ROM 45, a RAM 46, a display unit 47, and a communication interface 48 are provided.

  The input unit 43, CPU 44, ROM 45, RAM 46, display unit 47, and communication interface 48 constitute a microcomputer. The CPU 44 performs control using the RAM 46 as a working area based on a control program stored in the ROM 45.

  Specifically, the load value data obtained by the pressure sensor 100 obtained by the A / D converter 42 is sampled as a characteristic value. In addition, the CPU 44 performs an inspection condition setting process, a reference waveform acquisition process, an inspection process for determining whether the crimping terminal 51 is in a crimped state based on the sampled characteristic values, and the detection result is displayed on the display unit 47. .

  When the crimp terminal 51 is crimped, a waveform indicating a characteristic value that is data of a load value obtained by the pressure sensor 100 is obtained. This waveform shows a change according to the passage of time of the load applied from the crimper 14 and the anvil 17 to the crimp terminal 51.

  Next, in the terminal crimping apparatus 200 according to the first embodiment, a flow chart of a process for discriminating the quality of the electric wire 61 to which the crimp terminal 51 is attached by crimping the crimp terminal 51 and the electric wire 61 is shown in a flowchart and an explanatory diagram. The description will be given with reference.

  First, the inspection condition setting process will be described with reference to the flowcharts shown in FIGS. This inspection condition setting process corresponds to “inspection condition setting step” and “inspection condition setting unit” of the present invention. In addition, each process demonstrated below is mainly performed in the crimping | compression-bonding defect detection apparatus 300. FIG.

  In the inspection condition setting process, first, a crimp force (hereinafter abbreviated as “CF”) waveform of a non-defective sample is acquired (step S11). That is, the crimping terminal 51 and the electric wire 61 are crimped by the terminal crimping device 200 to produce Na non-defective samples (in this case, Na is an integer of 2 or more), and the waveform at that time is acquired and stored in the RAM 46. .

  Next, CF waveforms of X types of defective samples are acquired (step S12). That is, by crimping the crimp terminal 51 and the electric wire 61 with the terminal crimping device 200, X types (X is a positive integer) of defective product samples are produced, and the waveform at that time is acquired and stored in the RAM 46. In this case, each of the X types of defective product samples includes Nx defective product samples (Nx in this case is an integer of 1 or more). Examples of defective products include, for example, an insulator bit or a broken core wire.

  Next, the waveform of the difference between the non-defective product and the defective product is calculated for each of the X types of defective products (step S13). That is, a waveform F of a difference between a waveform (for example, an average value ± 6σ) that takes into account the variation in the non-defective product waveform and a waveform that takes into account the variation in X types of defective products (one waveform when there is one defective product). (1) to F (X) are calculated.

  For example, when the defective product is an insulator bite, the difference between the non-defective product waveform and the defective product waveform as shown in FIG. 8A is calculated, and at time T (1) as shown in FIG. 8B. The maximum difference waveform is obtained. Similarly, when the defective product is disconnected, the difference between the non-defective product waveform and the defective product waveform as shown in FIG. 9A is calculated, and the maximum is obtained at time T (2) as shown in FIG. 9B. A difference waveform is obtained. This step S13 corresponds to the “crimp force waveform difference calculation step” and “crimp force waveform difference calculation unit” of the present invention.

  Here, the details of the calculation process of the waveform of the difference between the non-defective product and the defective product performed in step S13 will be described with reference to the flowchart shown in FIG.

  In the calculation process of the waveform of the difference between the non-defective product and the defective product, first, the variable n is initialized to “0” (step S21). Next, the variable n is incremented (+1) (step S22). Next, at the same time (tn: n = 1 to Nt (Nt in this case is the number of sample data of one waveform)) for the non-defective product and the defective product, the average value of CF and the deviation value σ are calculated (step S23).

  Next, it is checked whether or not a value obtained by subtracting the average of defective products from the average of non-defective products is greater than 0 (step S24). In step S24, if it is determined that the value obtained by subtracting the average of defective products from the average of non-defective products is greater than 0, the difference between good products and defective products is calculated according to the following equation (1) (step S25). Thereafter, the process proceeds to step S27.

(Difference between non-defective product and defective product) = [{(Average of good product) − (6σ of good product)} − {(Average of defective product) + (3σ of defective product)}] / (σ of good product) (1)
On the other hand, if it is determined in step S24 that the value obtained by subtracting the average of the defective products from the average of the non-defective products is not greater than 0, the difference between the good products and the defective products is calculated according to the following equation (2) (step S26). Thereafter, the process proceeds to step S27.

(Difference between non-defective products and defective products) = [{(average of defective products) − (3σ of defective products)} − {(average of non-defective products) + (6σ of non-defective products)}] / (σ of non-defective products) (2)
In addition to the calculation of the difference between the non-defective product and the defective product in steps S24 and S25,
(Difference between non-defective product and defective product) = | Average of non-defective product−Average of defective product | / 3 (σ of good product + σ of defective product) or the like can be used.

  In step S27, it is checked whether or not the variable n has become N. If it is determined in step S27 that the variable n is not N, the process returns to step S22 and the above-described process is repeated. On the other hand, if it is determined in step S27 that the variable n has become N, the calculation processing of the waveform of the difference between the non-defective product and the defective product is terminated. Thereafter, the process returns to step S14 in the flowchart shown in FIG.

  In step S14, times T (1) to T (X) when the difference waveforms F (1) to F (X) are maximum values are calculated (step S14). That is, the time when the difference between the non-defective product distribution and the defective product distribution is the largest, that is, the time when the waveform of the difference between the non-defective product and the defective product is the maximum value (or the peripheral section of the maximum value) is calculated. As shown, the time is set to positions T (1) to T (X) at the time of subsequent inspection. FIG. 10A shows an example in which the inspection position is set at a time point, and FIG. 10B shows an example in which the inspection position is set in a section. In addition, other sections include a section with a maximum value of the waveform difference, a section around the maximum value (for example, a section with a maximum value of ± 1 msec), a section with a waveform difference of 0 or more, and a section with 50% or more of the maximum value. Can be used. This step S14 corresponds to the “maximum value time calculation step” and the “maximum value time calculation unit” of the present invention.

  Next, the standard deviations σ (1) to σ (X) and the average values AVE (1) to AVE (X) of the CF at the time T (1) to T (X) of the non-defective samples are calculated (step S15). ). Next, tolerances D (1) to D (X) at times T (1) to T (X) are calculated (step S16). In this case, the value ratio of non-defective products of 6σ of the non-defective product values (or the average of the total in the non-defective section) at the times T (1) to T (X) calculated in step S14 as shown below ( %) Can be inspection tolerances D (1) to D (X).

D (1) = 6σ (1) / AVE (1)
D (2) = 6σ (2) / AVE (2)
...
D (X) = 6σ (X) / AVE (X)
Steps S15 and S16 correspond to “tolerance calculation step” and “tolerance calculation unit” of the present invention. In addition to the above, for example, “(good product average−defective product average) ½” or the like may be used as the tolerance calculation method. Thus, the inspection condition setting process ends.

  Next, a method for inspecting a crimp terminal will be described. First, reference waveform acquisition processing performed in the crimp terminal inspection will be described with reference to the flowchart shown in FIG. This reference waveform acquisition process corresponds to the “reference waveform acquisition step” and “reference waveform acquisition unit” of the present invention.

  In the reference waveform acquisition process, first, a CF waveform to be inspected is acquired (step S31). Next, CF waveforms of Nb (Nb in this case is an integer of 1 or more) non-defective samples are acquired (step S32). Next, a reference waveform is created by taking the average of Nb non-defective samples (step S33). Next, CF values B (1) to B (X) at times T (1) to T (X) of the reference waveform are calculated (step S34). Thereby, a reference waveform as shown by a solid line in FIG. 13 is obtained. Thereafter, production (terminal crimping) is performed (step S35). That is, in the terminal crimping apparatus 200, the crimp terminal 51 and the electric wire 61 are crimped.

  Next, the inspection process performed in the crimp terminal inspection will be described with reference to the flowchart shown in FIG. In this inspection process, first, a CF waveform to be inspected is acquired (step S41). The CF waveform acquired in step S41 is used as an inspection waveform.

  Next, CF values A (1) to A (X) at times T (1) to T (X) of the inspection waveform acquired in step S41 are calculated (step S42). Thereby, an inspection waveform as shown by a two-dot chain line in FIG. 13 is obtained. The processes in steps S41 and S42 correspond to the “inspection waveform acquisition step” and “inspection waveform acquisition unit” of the present invention.

  Next, the difference d {d (1) to d (X) between the CF value A {A (1) to A (X)} of the inspection waveform and the CF value B {B (1) to B (X)} of the reference waveform. )} Is calculated (step S43). Specifically, the following calculation is performed.

d (1) = | A (1) −B (1) | / B (1)
d (2) = | A (2) −B (2) | / B (2)
...
d (X) = | A (X) −B (X) | / B (X)
Next, it is checked whether or not the difference d {d (1) to d (X)} is smaller than the tolerance D {D (1) to D (X)} at all times (step S44). That is, it is examined whether d (1) <D (1), d (2) <D (2),..., D (X) <D (X) holds. The processes in steps S43 and S44 correspond to the “pass / fail determination step” and “pass / fail determination unit” of the present invention.

  In this step S44, if it is determined that the difference d is smaller than the tolerance D at all times, the inspection passes (OK) (step S45). Thereafter, the inspection process ends.

  On the other hand, if it is determined in step S44 that the difference d is greater than the tolerance D at at least one time, the inspection fails (NG) (step S46). Then, it is checked which number from 1 to X has failed (NG), and the type of defective product is displayed (step S47). Thereafter, the inspection process ends.

As described above, according to the terminal crimping apparatus according to the first embodiment,
(1) Compared with the conventional inspection method, it is possible to increase the detection sensitivity of defective products that have occurred conventionally.

(2) Regardless of the terminal type, the setting position and tolerance can be set regardless of the experience and knowledge of the operator.

(3) Even when a new type of defective product is found, it is possible to easily set the inspection as with other defective products regardless of the experience and knowledge of the operator.

  INDUSTRIAL APPLICABILITY The present invention can be applied to a terminal crimping apparatus that stably detects defective products generated by terminal crimping with higher sensitivity and is required to detect new defective products.

DESCRIPTION OF SYMBOLS 1 Frame 2 Board | substrate 3 Side plate 4 Servo motor 5 Reduction gear 6 Output shaft 7 Disc 8 Eccentric pin 9 Slide block 10 Seat 11 Ram 12 Ram guide 13 Engagement recessed part 14 Crimper 15 Crimper holder 16 Engagement convex part 17 Anvil 18 terminal Supply device 19 Terminal guide 21 Claw 22 Arm 23 Swing link 24 Anvil mounting base 25 Handle 31 Encoder 32 Driver 33 Input unit 41 Amplifier 42 A / D converter 43 Input unit 44 CPU
45 ROM
46 RAM
47 Display unit 48 Communication interface 50, 55 Caulking foot 51 Crimp terminal 52 Electric wire connection part 53 Electrical contact part 54 Bottom wall 60 Core wire 61 Electric wire 62 Covering part 100 Pressure sensor 200 Terminal crimping device 300 Crimping failure detection device

Claims (4)

An inspection condition setting step for calculating a tolerance based on the crimp force waveform of the non-defective sample and the crimp force waveform of the defective sample,
A reference waveform acquisition step of calculating a crimp force value of the reference waveform by taking an average of the crimp force waveforms of the non-defective samples,
Obtaining a crimp force waveform at the time of terminal crimping to obtain an inspection waveform to be inspected, and an inspection waveform obtaining step for calculating a crimp force value of the inspection waveform;
A pass / fail determination step of determining pass / fail of terminal crimping based on the crimp force value of the reference waveform acquired in the reference waveform acquisition step and the crimp force value of the inspection waveform obtained in the inspection waveform acquisition step;
A method for inspecting a terminal crimping state, comprising: The pass / fail determination step includes:
The difference between the crimp force value of the reference waveform acquired in the reference waveform acquisition step and the crimp force value of the inspection waveform acquired in the inspection waveform acquisition step is calculated, and the difference obtained by the calculation is the inspection 2. The terminal crimping according to claim 1, wherein if it is smaller than the tolerance set as the inspection condition in the condition setting step, it is determined as acceptable, and if the obtained difference is larger than the intersection, it is determined as unacceptable. State inspection method. The inspection condition setting step includes:
A crimp force waveform difference calculating step for calculating a difference between the crimp force waveform of the non-defective sample and the crimp force waveform of the defective sample;
A maximum time calculation step for calculating a time when the difference calculated in the crimp force waveform difference calculation step is a maximum value;
2. A tolerance calculation step of calculating a standard deviation and an average value of a crimp force waveform of a non-defective sample at a time calculated in the maximum time calculation step, and calculating a tolerance based on the standard deviation and the average value. 2. The inspection method of the terminal crimping state according to 2. An inspection condition setting unit that calculates a tolerance based on the crimp force waveform of the non-defective sample and the crimp force waveform of the defective sample,
A reference waveform acquisition unit that calculates a crimp force value of the reference waveform by taking an average of the crimp force waveforms of the non-defective samples;
An inspection waveform acquisition unit that acquires a crimp force waveform at the time of terminal crimping to obtain an inspection waveform to be inspected, and calculates a crimp force value of the inspection waveform;
A pass / fail determination unit that determines pass / fail of terminal crimping based on the crimp force value of the reference waveform acquired by the reference waveform acquisition unit and the crimp force value of the inspection waveform acquired by the inspection waveform acquisition unit;
A terminal crimping inspection apparatus characterized by comprising:

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