JP2013225702A - Connection method between terminals, and connection terminal manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection method between opposite terminals of electronic members, and a connection terminal manufacturing method.SOLUTION: The opposite terminals are electrically connected using a patterned conductive connection material including a resin composition layer and a metal foil pattern layer composed of a solder foil or a tin foil arrayed to have an identical pattern to at least a portion of a pattern formed by each end face of a plurality of terminals. Also, each connection terminal is manufactured using a patterned conductive connection material including a resin composition layer and a metal foil pattern layer composed of a solder foil or a tin foil arrayed to have an identical pattern to at least a portion of a pattern formed by each end face of a plurality of electrodes.

Description

The present invention relates to a method for electrically connecting electronic members to each other in electrical and electronic components. More specifically, the present invention relates to a method for electrically connecting opposing terminals, and a method for manufacturing a connection terminal.

In recent years, with the demand for higher functionality and miniaturization of electronic devices, the pitch between connection terminals in electronic materials is becoming increasingly narrow. Along with this, the connection between terminals in a fine wiring circuit has also been advanced. As a connection method between terminals, for example, flip chip connection in which a large number of terminals are connected together using an anisotropic conductive adhesive or an anisotropic conductive film when an IC chip is electrically connected to a circuit board. Technology is known. An anisotropic conductive adhesive or anisotropic conductive film is a film or paste in which conductive particles are dispersed in an adhesive mainly composed of a thermosetting resin (for example, JP-A-61-276873). Patent Document 1) and JP-A 2004-2004
260131 (patent document 2)). By arranging this between the electronic members to be connected and thermocompression bonding, a large number of opposing terminals can be connected together, and insulation between adjacent terminals is ensured by the resin in the adhesive. Make it possible.

However, it is difficult to control the aggregation of the conductive particles. (1) The conductive particles and the terminals, or the conductive particles are not sufficiently in contact with each other, and a part between the facing terminals is not conductive, 2)
In some cases, the conductive particles remain in the resin (insulating region) other than between the opposing terminals (conducting region) to cause a leakage current, so that sufficient insulation between adjacent terminals cannot be ensured. For this reason, it is difficult for conventional anisotropic conductive adhesives and anisotropic conductive films to cope with further narrow pitches between terminals.

Conventionally, when connecting terminals are formed on electrodes of an electronic member, the solder paste is printed on a substrate provided with metal pads, and the solder paste is heated and melted using a solder reflow apparatus or the like. However, in this method, when the connection terminals are arranged at a narrow pitch, the manufacturing cost of the mask used when printing the solder paste is high. In addition, there are cases where it is difficult to print the solder paste in a desired size, and there is a problem that a small-sized connection terminal cannot be formed. There is also a method in which solder balls are mounted on the connection terminals and the solder balls are heated and melted using a solder reflow device or the like. However, when manufacturing small size connection terminals, the manufacturing cost of the solder balls is increased, and the small diameter is also required. It was technically difficult to manufacture the solder balls.

JP-A 61-276873 JP 2004-260131 A

Under such circumstances, it is required to provide a method for electrically connecting terminals that enables both good electrical connection between connection terminals and high insulation reliability between adjacent terminals.
Moreover, provision of the method of manufacturing a connection terminal by the simple method on the electrode of an electronic member is calculated | required.

In order to solve the above-mentioned problems, the present inventors diligently studied, and as a result of using solder foil or tin foil instead of conductive particles in the conductive connection material, aggregation between terminals of solder or tin is facilitated, It has been found that solder or tin can be suppressed from remaining in the resin. Furthermore, this inventor discovered that the quantity of the molten metal which aggregates on each terminal surface can be controlled by dividing metal foil. If the metal foil is formed in a pattern so as to have a pattern similar to the pattern formed by each end face of the plurality of terminals, the electrical connection between the terminals and the formation of the connection terminals can be more reliably performed. Moreover, it discovered that manufacture of a connecting terminal could be performed more simply by utilizing this method, and came to complete this invention.

That is, this invention provides the connection method between the terminals using the conductive connection material shown below, the manufacturing method of a connection terminal, etc.
[1] A patterned conductive connection including a resin composition layer and a metal foil pattern layer in which solder foil or tin foil is arranged so as to have the same pattern as at least a part of a pattern formed by each end face of a plurality of terminals A method of electrically connecting opposing terminals using a material,
An arrangement step of disposing the patterned conductive connecting material between the facing terminals so that at least a part of a pattern formed by each end face of the plurality of terminals and a pattern of the metal foil pattern layer overlap;
A heating step of heating the patterned conductive connecting material so that curing of the resin composition constituting the resin composition layer is not completed at a temperature equal to or higher than the melting point of the solder foil or tin foil constituting the metal foil pattern layer;
A curing step of curing the resin composition.
[2] The method according to [1], wherein in the arranging step, the patterned conductive connecting material prepared in advance is arranged between the opposing terminals.
[3] The method according to [2], wherein the pattern of the metal foil pattern layer is formed by a plating method, a sputtering method, or a vapor deposition method.
[4] In the arranging step, after the conductive connecting material including the resin composition layer and the metal foil layer made of solder foil or tin foil is arranged on one terminal surface, the solder foil or tin foil is divided and the metal foil is separated. By forming a pattern layer and overlaying the other terminal surface on the metal group foil pattern layer,
The method according to [1], wherein the patterned conductive connection material is disposed between the opposing terminals.
[5] The method according to [4], wherein the cutting of the solder foil or tin foil is performed by laser irradiation or physical cutting.
[6] The resin composition includes a compound having a flux function, [1] to [1]
[5] The method according to any one of [5].
[7] The method according to any one of [1] to [6], wherein the patterned conductive connecting material includes a laminated structure including a resin composition layer / metal foil layer / resin composition layer.
[8] The method according to any one of [1] to [6], wherein the patterned conductive connection material includes a laminated structure composed of a resin composition layer / metal foil layer.

[9] A patterned conductive connection including a resin composition layer and a metal foil pattern layer in which solder foil or tin foil is arranged so as to have the same pattern as at least a part of a pattern formed by each end face of a plurality of electrodes A method of manufacturing a connection terminal using a material,
An arrangement step of disposing the patterned conductive connecting material on the electrode of the electronic member so that at least a part of a pattern formed by each end face of the plurality of electrodes and a pattern of the metal foil pattern layer overlap;
A heating step of heating the patterned conductive connecting material so that curing of the resin composition constituting the resin composition layer is not completed at a temperature equal to or higher than the melting point of the solder foil or tin foil constituting the metal foil pattern layer; Including methods.
[10] The method according to [9], wherein in the arranging step, the patterned conductive connecting material prepared in advance is arranged on the electrode of the electronic member.
[11] The method according to [10], wherein the pattern of the metal foil pattern layer is formed by a plating method, a sputtering method, or a vapor deposition method.
[12] In the arranging step, after the conductive connecting material including the resin composition layer and the metal foil layer made of solder foil or tin foil is arranged on the electrode surface of the electronic member, the solder foil or tin foil is divided and the metal is separated. The method according to [9], wherein the patterned conductive connection material is disposed on the electrode of the electronic member by forming a foil pattern layer.
[13] The method according to [12], wherein in the arranging step, the solder foil or the tin foil is divided by laser irradiation or physical cutting.
[14] The resin composition includes a compound having a flux function, [9] to [9]
[13] The method according to any one of [13].
[15] The method according to any one of [9] to [14], wherein the patterned conductive connecting material includes a laminated structure including a resin composition layer / metal foil layer / resin composition layer.
[16] The method according to any one of [9] to [14], wherein the patterned conductive connecting material includes a laminated structure including a resin composition layer / metal foil layer.

[17] A patterned conductive connection including a resin composition layer and a metal foil pattern layer in which solder foil or tin foil is arranged so as to have the same pattern as at least a part of a pattern formed by each end face of a plurality of terminals material.
[18] An electrical / electronic component in which electronic members are electrically connected using the method according to any one of [1] to [8].
[19] An electrical or electronic component in which a connection terminal is formed on an electrode using the method according to any one of [9] to [16].

According to the present invention, the use of the metal foil in the conductive connection material makes it easy for the molten solder or tin to agglomerate and suppress the metal from remaining in the resin. Therefore, good electrical connection and high insulation reliability Can be obtained.
Further, according to the present invention, by dividing the metal foil into a pattern, the amount of molten metal aggregated on the terminal surface can be controlled, and electrical connection between the terminals can be more reliably performed.
According to a preferred aspect of the present invention, a large number of terminals in a fine wiring circuit such as a semiconductor device can be connected together.
Further, according to the present invention, by dividing the metal foil into a pattern, the amount of molten metal aggregated on the electrode surface can be controlled, and the connection terminal can be more reliably formed. According to a preferred aspect of the present invention, the connection terminals can be manufactured collectively by a simple method regardless of the size of the connection terminals.

It is a schematic perspective view for demonstrating the connection method between the terminals of this invention. It is a schematic process drawing for demonstrating the connection method of the 1st embodiment of the present invention. It is a schematic process diagram for demonstrating the connection method of the 2nd embodiment of this invention. It is a schematic perspective view for demonstrating the manufacturing method of the connecting terminal of this invention. It is a schematic process drawing for demonstrating the manufacturing method of the connection terminal of the 3rd embodiment of this invention. It is a schematic process drawing for demonstrating the manufacturing method of the connection terminal of the 4th embodiment of this invention. It is a plane schematic diagram which shows an example of the pattern shape of a metal foil pattern layer. It is the image which image | photographed the metal foil pattern layer obtained in Example 2 with the digital microscope. It is the photograph which image | photographed the cross section of the laminated body obtained by each Example and the comparative example with the scanning electron microscope.

Hereinafter, a method for electrically connecting terminals facing each other according to the present invention, a method for manufacturing a connection terminal, and the like will be described in detail.

1. Method for electrically connecting opposite terminals Method for electrically connecting opposite terminals of the present invention (hereinafter referred to as “connection method of the present invention”).
) Is a patterned conductive connection including a resin composition layer and a metal foil pattern layer in which solder foil or tin foil is arranged so as to have the same pattern as at least a part of a pattern formed by each end face of a plurality of terminals A method of electrically connecting opposing terminals using a material, wherein at least a part of a pattern formed by each end face of the plurality of terminals overlaps with a pattern of the metal foil pattern layer. The placement step of arranging the patterned conductive connection material between the opposing terminals, and curing of the resin composition constituting the resin composition layer at a temperature equal to or higher than the melting point of the solder foil or tin foil constituting the metal foil pattern layer A heating step of heating the patterned conductive connecting material so as not to be completed and a curing step of curing the resin composition are included.

In the connection method of the present invention, the metal component contained in the conductive connection material is used in the form of a metal foil. Therefore, when the metal foil is heated and melted, the molten metal easily aggregates, and the metal hardly remains in the resin. There is an advantage that the insulation between adjacent terminals can be secured and the generation of leakage current can be suppressed. Further, in the present invention, since the metal foil is divided so as to have the same pattern as at least a part of the pattern formed by each end face of the plurality of terminals, only the surface of a part of the terminals due to the wettability of the molten metal. Concentration of the molten metal can be avoided. Moreover,
Since it is arranged so that at least a part of the pattern formed by each end face of the plurality of terminals and the pattern of the metal foil pattern layer overlap each other, the required amount corresponding to the surface area of the terminals is equal to each terminal surface. Molten metal is distributed, and electrical connection between the terminals can be more reliably performed. Further, according to a preferred aspect of the present invention, since the metal foil is divided, it is possible to secure a release route for moisture absorbed in the resin composition when the patterned conductive connection material is stored for a long period of time. It is also possible to produce an effect that the formation of voids in the cured resin can be suppressed.

In the present invention, the phrase “the solder foil or the tin foil is arranged so as to have the same pattern as at least a part of the pattern formed by each end face of the plurality of terminals” is formed by arranging the solder foil or the tin foil. This means that the metal foil pattern coincides with at least a part of the pattern formed by each end face of the plurality of terminals. Here, the phrase “at least a part” is used to express that there may be a part where both patterns do not match. For example, the metal foil pattern layer may partially include a pattern different from the pattern formed by each end surface of the plurality of terminals, or a portion having a pattern similar to the pattern formed by each end surface of the plurality of terminals. However, the size of each terminal and the size of the corresponding solder foil or tin foil do not necessarily have to match. The phrase “at least part” in “so that at least part of the pattern formed by each end face of the plurality of terminals and the pattern of the metal foil pattern layer overlap” is also used with the same intention. That is, the pattern formed by the end faces of the plurality of terminals and the pattern formed by arranging the solder foil or the tin foil may be at least partially overlapped and does not need to be completely overlapped. When both patterns are “overlapping”, the patterns need not be in physical contact, and a layer such as a resin composition layer may be interposed between the patterns.

In the present invention, the area occupied by the pattern formed by the end faces of the plurality of terminals and the pattern of the metal foil pattern layer is 10 with respect to the total area of the patterns formed by the end faces of the plurality of terminals. % Or more is preferable, 20% or more is more preferable, 30% or more is more preferable, and it is particularly preferable that both patterns are completely matched.
The ratio (y / x) of the number (y) of solder foils or tin foils divided into a pattern with respect to the total number of terminals (x) on one terminal arrangement surface between the opposing terminals is preferably 0.5 or more. , 0
. 6 or more is more preferable, 0.7 or more is more preferable, and 1 is particularly preferable.

In the present invention, the patterned conductive connection material may be prepared in advance before being disposed between the opposing terminals, or a conductive connection material including a resin composition layer and a metal foil layer made of solder foil or tin foil. After arranging on one terminal arrangement surface, it may be produced by dividing the metal foil layer into a pattern by laser treatment or physical cutting.

In the present invention, the metal foil pattern layer used for the patterned conductive connecting material is arranged so that the solder foil or the tin foil has the same pattern as at least a part of the pattern formed by each end face of the plurality of terminals. The shape of the pattern is not particularly limited, but a certain shape may be repeatedly formed in a pattern shape, or the shape may be irregular. Moreover, a regular shape and an irregular shape may be mixed. FIG. 7 is a schematic plan view showing an example of the pattern shape of the metal foil pattern layer. A metal foil pattern layer 110 having various shapes is formed on the resin composition layer 120. For example, a dotted pattern (a), a striped pattern (b), a polka dot pattern (c), a rectangular pattern (d), a checkered pattern (e), a frame shape (f), a lattice pattern (g ) Or multiple frame shapes (h). These are examples, and these shapes can be combined or deformed according to the purpose and application.

For example, in one embodiment of the present invention, when a peripheral type adherend is connected such that the terminal to be connected is arranged at the periphery of the connection surface of the adherend, the metal remains between the adjacent terminals. From the viewpoint of avoiding this, it is preferable to form the metal foil pattern layer in a peripheral type. Moreover, when connecting a full grid type adherend, it is preferable to form the metal foil pattern layer so that the solder foil or the tin foil is arranged in accordance with the position of the terminal.

The patterned conductive connecting material used in the present invention is a metal foil in which solder foil or tin foil is arranged so as to have the same pattern as the resin composition layer and at least a part of the pattern formed by each end face of the plurality of terminals. It consists of a pattern layer. The form is a laminated body having a multilayer structure composed of a resin composition layer and a metal foil pattern layer, and each of the resin composition layer and the metal foil pattern layer may be a single layer or a plurality of layers. The laminated structure of the conductive connection material is not particularly limited, and is a two-layer structure of a resin composition layer and a metal foil pattern layer (resin composition layer / metal foil pattern layer).
Alternatively, it may be a three-layer structure including a plurality of either or both of the resin composition layer and the metal foil pattern layer, or a multilayer structure of more than that. In addition, when using two or more resin composition layers or metal foil pattern layers, the composition of each layer may be the same or different.

In one embodiment of the present invention, from the viewpoint of reducing the surface oxide film of the metal foil pattern layer with a compound having a flux function, the upper and lower layers of the metal foil pattern layer are preferably resin composition layers. For example, a three-layer structure (resin composition layer / metal foil pattern layer / resin composition layer) is preferable.
In this case, the thickness of the resin composition layer on both sides of the metal foil pattern layer may be the same or different. The thickness of the resin composition layer may be appropriately adjusted depending on the conductor thickness of the terminal to be connected.

The resin composition layer and metal foil pattern layer contained in the patterned conductive connection material, and the method for producing the patterned conductive connection material will be described in detail later.

Hereinafter, each process of the connection method of this invention is demonstrated, referring drawings. FIG. 1 is a schematic perspective view for explaining an example of the connection method of the present invention. Here, a case where a semiconductor chip is mounted on a substrate is illustrated. As shown in FIG. 1, in the connection method of the present invention,
Terminals 11 provided on the substrate 10 and terminals provided on the substrate 20 such as a semiconductor chip (
(Not shown) is electrically connected using the patterned conductive connecting material 100 including the resin composition layer 120 and the metal foil pattern layer 110. In FIG. 1, the metal foil pattern layer is illustrated for explanation, but the metal foil pattern layer does not have to be exposed on the surface, and may be sandwiched between the resin composition layers 110 or the substrate 10. You may arrange | position facing.

In the connection method of the present invention, the patterned conductive connection material may be prepared in advance and then disposed between the terminals. Alternatively, the patterned conductive connection material may be prepared by dividing the metal foil on one terminal arrangement surface. Also good. The former case will be referred to as a first embodiment, and the latter case will be referred to as a second embodiment. Each aspect will be described.

(A) First Embodiment First, a first embodiment of the present invention will be described.
In the first embodiment of the present invention, the opposing terminals are connected using a patterned conductive connecting material prepared in advance. FIG. 2 is a schematic process diagram for explaining the first embodiment. Hereinafter, FIG.
Each process will be described with reference to FIG.

(1) Arrangement Step In the arrangement step, the patterned conductive connection material is arranged between the facing terminals so that at least a part of the pattern formed by each end face of the plurality of terminals overlaps the pattern of the metal foil pattern layer. To do. As shown in FIG. 2A, the substrate 10 provided with the terminal 11 and the substrate 20 provided with the terminal 21 are aligned so that the terminal 11 and the terminal 21 face each other, and between these terminals. The patterned conductive connecting material 100 including the metal foil pattern layer 110 and the resin composition layer 120 prepared in advance is aligned and disposed. As illustrated, the resin composition may be filled in the gaps between the metal foils of the metal foil pattern layer.
For example, by using a flip chip bonder or the like, at least a part of the pattern formed by each end face of the plurality of terminals is aligned with the pattern of the metal foil pattern layer, and the patterned conductive connection material is applied to the substrate. Deploy. Next, the terminal 11 and the terminal 21 are aligned so as to face each other, and the patterned conductive connecting material can be disposed between the facing terminals.

The patterned conductive connection material 100 may be previously disposed on one side of the substrate 10 or the substrate 20 or on both the substrate 10 and the substrate 20. Further, the surfaces of the terminals 11 and 21 may be subjected to treatments such as washing, polishing, plating, and surface activation as necessary in order to improve electrical connection.

(2) Heating step In the heating step, the patterned conductive connecting material 1 arranged between the terminals facing each other in the arranging step.
00 is heated above the melting point of the solder foil or tin foil constituting the metal foil pattern layer 110 so that the curing of the resin composition constituting the resin composition layer 120 is not completed.

By heating the patterned conductive connecting material 100 at a melting point or higher of the solder foil or tin foil constituting the metal foil pattern layer 110, the metal foil pattern layer 110 is melted, and the molten solder or tin is softened. You can move through 120.

In a preferred embodiment of the present invention, when the resin composition 120 includes a compound having a flux function, the compound is activated by heating, and the surface oxide film of the metal foil and the terminal can be removed. Aggregation due to bonding and electrical connection due to metal bonding between the molten metal and the terminal are further promoted.

As shown in FIG. 2 (b), the resin composition layer 120 is softened by heating at a temperature lower than the melting point of the solder foil or tin foil constituting the metal foil pattern layer 110 in advance, and the shortest separation between the terminals facing each other. The distance may be adjusted. By adjusting the shortest distance between the terminals facing each other at a temperature lower than the melting point of the solder foil or tin foil, the distance moved between the resin compositions when the solder foil or tin foil is melted can be shortened. The electrical connection between the terminals to be performed can be made more reliable.

In the heating step, the solder foil or tin foil constituting the metal foil pattern layer 110 is melted as shown in FIG. When the molten metal agglomerates between the opposing terminals, a conductive region 110a is formed,
Terminal 11 and terminal 21 are electrically connected. On the other hand, the insulating region 120a is formed by filling the resin composition around the conductive region 110a. Thereby, the insulation between adjacent terminals is ensured and a short circuit between adjacent terminals can be prevented.

In the heating step, the patterned conductive connection material is heated so that the cured resin composition does not complete so that the molten metal can flow in the resin. For example, by adjusting the heating time, for example, by shortening the heating time, adjustment is made so that the solder or tin can move in the curable resin, that is, “the curing of the resin composition is not completed”.

The heating temperature can be appropriately selected depending on the metal foil used and the composition of the resin composition, but is preferably 100 ° C or higher, more preferably 130 ° C or higher, particularly preferably 140 ° C or higher, and most preferably 150 ° C or higher. . In order to prevent thermal degradation of the substrate or the like to be connected, the heating temperature is preferably 260 ° C. or lower, more preferably 250 ° C. or lower, and particularly preferably 240 ° C. or lower.

In the heating step, heating may be performed by applying pressure so as to reduce the distance between the opposing terminals.
For example, the distance between the terminals facing each other can be controlled to be constant by heating and pressurizing the substrate 10 and 20 in a direction facing the substrates using means such as a known thermocompression bonding apparatus. It is possible to improve electrical connection reliability. Furthermore, when applying pressure or heating, an ultrasonic wave or an electric field may be applied, or special heating such as laser or electromagnetic induction may be applied.

(3) Curing step In the curing step, the insulating region 120a formed in the heating step is fixed by curing the resin composition. By fixing the insulating region in this way, the conductive region 110a surrounded by the insulating region can be fixed, and the thermal stability of the electrical connection between the opposing terminals is ensured. .

In the present invention, it is preferable to cure the resin composition at a temperature lower than the melting point of the metal foil. By doing so, it can suppress that the electroconductive area | region formed at the heating process deform | transforms largely, and can improve the connection reliability between terminals.

Curing of the resin composition can be performed by heating the conductive connecting material. The curing temperature of the conductive connecting material can be appropriately set according to the composition of the resin composition,
The temperature is preferably at least 5 ° C lower than the heating temperature in the heating step, and particularly preferably at least 10 ° C lower. Specifically, it is preferably 100 ° C. or higher, more preferably 120 ° C. or higher, particularly preferably 130 ° C. or higher, and most preferably 150 ° C. or higher. Moreover, it is preferable that it is 300 degrees C or less, It is more preferable that it is 260 degrees C or less, It is especially preferable that it is 250 degrees C or less, 2
Most preferably, it is 40 degrees C or less. When the curing temperature is within the above range, the conductive connecting material is not thermally decomposed, and the resin composition can be sufficiently cured.

(B) Second Embodiment Next, a second embodiment of the present invention will be described.
In the second embodiment of the present invention, the patterned conductive connecting material is produced by dividing the metal foil on one terminal arrangement surface. FIG. 3 is a schematic process diagram for explaining the second embodiment. Hereinafter, each step will be described with reference to FIG.

(1) Arrangement Step In the arrangement step, the conductive connection material 200 including the resin composition layer 120 and the metal foil layer 130 made of solder foil or tin foil is arranged on one terminal arrangement surface, and then the solder foil or tin foil is divided. Then, the metal foil pattern layer 110 is formed, and the other terminal array surface is overlaid on the metal foil pattern layer 110, whereby the patterned conductive connection material 100 is disposed between the opposing terminals. The conductive connecting material 200 has the same configuration as that of the patterned conductive connecting material except that the conductive connecting material 200 has a metal foil layer 130 instead of the metal foil pattern layer 110.

As shown in FIG. 3A, first, a substrate 10 in which one terminal 11 between terminals facing a conductive connecting material 200 including a resin composition layer 120 and a metal foil layer 130 made of solder foil or tin foil is arranged. Place on top. At this time, the conductive connection material 200 may be thermocompression bonded to the substrate 10 in advance using an apparatus such as a roll laminator or a press. Further, the surface of the terminal 11 may be subjected to treatments such as cleaning, polishing, plating, and surface activation as necessary.

Next, as shown in FIG. 3B, the solder foil or tin foil is divided into a pattern so as to overlap at least part of the pattern formed by each end face of the plurality of terminals by laser irradiation or physical cutting. Then, the metal foil pattern layer 110 is formed. When the metal foil layer 130 is divided by laser irradiation, for example, a laser processing machine such as a UV-YAG laser or a carbon dioxide gas laser is used to irradiate a laser between adjacent terminals and divide the metal foil into a pattern. . Examples of physical cutting include cutting using a Thomson blade or the like. Laser irradiation is preferable because a fine pattern can be formed.

Note that a part of the substrate may be burned by laser irradiation, and the circuit may be damaged. However, this can be prevented by adjusting the laser irradiation conditions and the thickness of the resin composition, or forming a protective layer such as a resist on the circuit.

After forming the metal foil pattern layer 110 as described above, as shown in FIG. 3C, the substrate 20 having the other terminal 21 arranged on the metal foil pattern layer 110 is connected to the terminal 11 and the terminal 21.
The patterned conductive connecting material 100 is disposed between the terminals facing each other by aligning them so as to face each other.

(2) Heating step In the heating step, the patterned conductive connecting material 1 arranged between the terminals facing each other in the arranging step.
00 is heated above the melting point of the solder foil or tin foil constituting the metal foil pattern layer 110 so that the curing of the resin composition constituting the resin composition layer 120 is not completed.
As in the first embodiment, by heating the patterned conductive connecting material 100 at a melting point or higher of the solder foil or tin foil constituting the metal foil pattern layer 110, the metal foil pattern layer 110 is melted,
The molten solder or tin can move in the softened resin composition layer 120. As a result, as shown in FIG. 3 (d), the solder foil or tin foil constituting the metal foil pattern layer is melted,
The molten metal agglomerates between the opposing terminals to form a conductive region 110a, and the terminal 11 and the terminal 21 are electrically connected. On the other hand, the insulating region 120a is formed by filling the resin composition around the conductive region 110a. Thereby, the insulation between adjacent terminals is ensured and a short circuit between adjacent terminals can be prevented.

The heating conditions and preferred embodiments in the heating step are the same as those in the first embodiment, and can be carried out in the same manner as in the first embodiment.

(3) Curing step In the curing step, the insulating region 120a formed in the heating step is fixed by curing the resin composition. By fixing the insulating region in this way, the conductive region 110a surrounded by the insulating region can be fixed, and the thermal stability of the electrical connection between the opposing terminals is ensured. .

The curing conditions and preferred embodiments in the curing step are the same as those in the first embodiment, and can be carried out in the same manner as in the first embodiment.

As described above, the terminals facing each other can be connected. In addition, although the 1st embodiment and the 2nd embodiment were demonstrated separately, these can also be combined. For example, in the arranging step, a conductive connecting material including a metal foil on which a pattern is formed in advance may be arranged on one terminal arrangement surface and further divided to form a fine pattern. Alternatively, the patterned conductive connection material may be arranged on one terminal arrangement surface, and the non-patterned conductive connection material may be arranged on the other terminal arrangement surface.

The connection method of the present invention is useful, for example, when connecting terminals formed on a semiconductor wafer, a semiconductor chip, a rigid substrate, a flexible substrate, and other electrical and electronic components.

2. Next, a method for manufacturing a connection terminal according to the present invention will be described.
The method for producing a connection terminal of the present invention includes: a resin composition layer; and a metal foil pattern layer in which solder foil or tin foil is arranged so as to have the same pattern as at least a part of a pattern formed by each end face of a plurality of electrodes The connection terminal is manufactured using a patterned conductive connection material including: at least a part of a pattern formed by each end face of the plurality of electrodes and a pattern of the metal foil pattern layer overlapping each other. The resin composition that constitutes the resin composition layer at an arrangement step of disposing the patterned conductive connecting material on the electrode of the electronic member and a temperature equal to or higher than the melting point of the solder foil or tin foil constituting the metal foil pattern layer Heating the patterned conductive connecting material so that the curing of is not completed.

In the manufacturing method of the present invention, the metal component contained in the conductive connection material is used in the form of a metal foil. Therefore, when the metal foil is heated and melted, the molten metal easily aggregates, and the connection terminal is more reliably manufactured. be able to. Further, it is difficult for the metal to remain in the resin, and the leakage current can be suppressed when the terminals are connected using the obtained connection terminals.

Further, in the present invention, the metal foil is divided so as to have the same pattern as at least a part of the pattern formed by each end face of the plurality of electrodes. Concentration of the molten metal can be avoided. Furthermore, since it arrange | positions so that the pattern which at least one part of each end surface of several electrodes forms and the pattern which a metal foil pattern layer has may overlap, according to each electrode surface equally or according to the electrode surface area The required amount of molten metal is distributed, and the connection terminal can be manufactured more reliably. According to a preferred aspect of the present invention, the connection terminals can be manufactured collectively by a simple method regardless of the size of the connection terminals. Further, according to a preferred aspect of the present invention, since the metal foil is divided, it is possible to secure a release route for moisture absorbed in the resin composition when the conductive connection material is stored for a long period of time, Void formation in the cured resin can be suppressed.

In the method for manufacturing a connection terminal of the present invention, the patterned conductive connection material is such that solder foil or tin foil is arranged so as to have the same pattern as at least a part of the pattern formed by each end face of the plurality of electrodes. Thus, the same one as described in the connection method of the present invention can be used.

For example, in one embodiment of the present invention, when a peripheral type adherend is connected such that the electrode is disposed in the periphery of the connection surface of the adherend, from the viewpoint of not leaving metal between adjacent electrodes. The metal foil pattern layer is preferably formed in a peripheral type. Moreover, when connecting a full grid type adherend, it is preferable to form the metal foil pattern layer so that the solder foil or the tin foil is arranged in accordance with the position of the terminal.

In the present invention, the occupation ratio of the area formed by matching the pattern formed by each end face of the plurality of electrodes and the pattern of the metal foil pattern layer is 10 with respect to the total area of the pattern formed by each end face of the plurality of electrodes. % Or more is preferable, 20% or more is more preferable, 30% or more is more preferable, and it is particularly preferable that the two patterns are completely matched.
Further, the ratio (y / x) of the number (y) of solder foils or tin foils divided into a pattern with respect to the total number of electrodes (x) is preferably 0.5 or more, more preferably 0.6 or more, and 7 or more are more preferable, and 1 is particularly preferable.

The patterned conductive connecting material may be prepared in advance before being placed on the electrode of the electronic member, or the conductive connecting material including the resin composition layer and the metal foil layer made of solder foil or tin foil may be used as the electronic member. It may be produced by dividing the metal foil layer into a pattern by laser treatment or physical cutting after being disposed on the electrode.

Hereinafter, each process of the manufacturing method of the connection terminal of this invention is demonstrated, referring drawings. FIG. 4 is a schematic perspective view for explaining an example of the manufacturing method of the connection terminal of the present invention. As shown in FIG. 4, in the manufacturing method of the connection terminal of the present invention, the resin composition layer 120 and the metal foil pattern layer 110 are formed on the surface on which the electrodes 31 provided on the substrate 30 of the electronic member are arranged. A patterned conductive connecting material 100 is disposed. A connection terminal is manufactured by heating this. In FIG. 4, the metal foil pattern layer is illustrated for explanation, but the metal foil pattern layer does not have to be exposed on the surface, and may be sandwiched between the resin composition layers 120 or the electrode 3.
1 may be disposed opposite to the main body 1.

In the manufacturing method of the connection terminal of the present invention, the patterned conductive connection material may be prepared in advance and then disposed on the electrode of the electronic member, or the metal foil may be divided on the electrode arrangement surface to form the patterned conductive connection material. May be produced. The former case is the third embodiment, the latter case is the fourth embodiment,
Each aspect will be described.

(C) Third Embodiment In the third embodiment of the present invention, a connection terminal is manufactured using a patterned conductive connection material prepared in advance. FIG. 5 is a schematic process diagram for explaining the third embodiment. Hereinafter, each step will be described with reference to FIG.

(1) Arrangement Step In the arrangement step, the patterned conductive connection material is placed on the electrode of the electronic member so that at least a part of the pattern formed by each end face of the plurality of terminals overlaps the pattern of the metal foil pattern layer. Deploy. As shown in FIG. 5 (a), a patterned conductive connecting material 100 including a metal foil pattern layer 110 and a resin composition layer 120 prepared in advance on a substrate 30 provided with terminals 31 is connected to a plurality of terminals. At least a part of the pattern formed by each end face and the pattern of the metal foil pattern layer 110 are aligned and arranged so as to overlap each other. As illustrated, the resin composition may be filled in the gaps between the metal foils of the metal foil pattern layer 110.
For example, using a flip chip bonder or the like, alignment can be performed so that at least a part of the pattern formed by each end face of the plurality of terminals overlaps the pattern of the metal foil pattern layer.

The surface of the electrode 31 may be subjected to treatments such as cleaning, polishing, plating, and surface activation as necessary in order to improve electrical connection.

(2) Heating process Next, in the heating process, the patterned conductive connecting material 1 disposed on the electrode 31 of the electronic member.
00 is heated above the melting point of the solder foil or tin foil constituting the metal foil pattern layer 110 so that the curing of the resin composition constituting the resin composition layer 120 is not completed.

By heating the patterned conductive connecting material 100 at a melting point or higher of the solder foil or tin foil constituting the metal foil pattern layer 110, the metal foil pattern layer 110 is melted, and the molten solder or tin is softened. You can move through 120.

In a preferred embodiment of the present invention, when the resin composition 120 includes a compound having a flux function, the compound is activated by heating, and the surface oxide film of the metal foil and the terminal can be removed. Aggregation due to bonding and electrical connection due to metal bonding between the molten metal and the electrode are further promoted.

In addition, as shown in FIG.5 (b), you may soften the resin composition layer 120 by heating at the temperature below melting | fusing point of the solder foil or tin foil which comprises the metal foil pattern layer 110 previously. By heating at a temperature lower than the melting point of the solder foil or tin foil, the distance that the molten solder foil or tin foil moves between the resin compositions can be shortened, and the connection terminal can be more reliably manufactured.

In the heating step, the metal foil pattern layer 110 is heated to a temperature equal to or higher than the melting point of the solder foil or tin foil, so that the solder foil or tin foil constituting the metal foil pattern layer 110 is melted as shown in FIG. The connection terminal 140 is formed by agglomeration of the molten metal on the electrode. On the other hand, the resin region is filled around the connection terminal 140 to form the insulating region 120a.
Thereby, when connecting with the terminal of another electronic member, the insulation between adjacent terminals is ensured, and the short circuit between adjacent connection terminals can be prevented.

In the heating process, the patterned conductive connecting material 100 is heated so that the cured resin composition does not complete so that the molten metal can flow in the resin. For example, by adjusting the heating time, for example, by shortening the heating time, adjustment is made so that the solder or tin can move in the curable resin, that is, “the curing of the resin composition is not completed”.

The heating temperature can be appropriately selected depending on the metal foil used and the composition of the resin composition, but is preferably 100 ° C or higher, more preferably 130 ° C or higher, particularly preferably 140 ° C or higher, and most preferably 150 ° C or higher. . In order to prevent thermal degradation of the substrate or the like to be connected, the heating temperature is preferably 260 ° C. or lower, more preferably 250 ° C. or lower, and particularly preferably 240 ° C. or lower.

(D) Fourth Embodiment Next, a fourth embodiment of the present invention will be described.
In the fourth embodiment of the present invention, the patterned conductive connecting material is produced by dividing the metal foil on the electrode of the electronic member. FIG. 6 is a schematic process diagram for explaining the fourth embodiment. Hereinafter, FIG.
Each process will be described with reference to FIG.

(1) Arrangement Step In the arrangement step, the conductive connection material 200 including the resin composition layer 120 and the metal foil layer 130 made of solder foil or tin foil is arranged on the substrate 30 on which the electrodes 31 of the electronic members are arranged, and then soldered. The metal foil pattern layer 110 is formed by dividing the foil or the tin foil, and at least a part of the pattern formed by each end face of the plurality of electrodes and the pattern of the metal foil pattern layer 110 are aligned and arranged. To do. The conductive connecting material 200 has the same configuration as the patterned conductive connecting material 100 except that the metal connecting layer 100 has a metal foil layer instead of the metal foil pattern layer 110.

As shown in FIG. 6A, first, a conductive connecting material 200 including a resin composition layer 120 and a metal foil layer 130 made of solder foil or tin foil is placed on a substrate 30 on which electrodes 31 of electronic members are arranged. .

As shown in FIG. 6B, the conductive connection material 200 may be preliminarily thermocompression bonded to the substrate 30 using an apparatus such as a roll laminator or a press. Further, the surface of the electrode 31 may be subjected to treatments such as cleaning, polishing, plating, and surface activation as necessary.

Next, as shown in FIG. 6C, the solder foil or the tin foil is divided into a pattern so as to overlap at least part of the pattern formed by each end face of the plurality of terminals by laser irradiation or physical cutting. Then, the metal foil pattern layer 110 is formed. When the metal foil layer 130 is divided by laser irradiation, for example, a laser processing machine such as a UV-YAG laser or a carbon dioxide gas laser is used to irradiate a laser between adjacent terminals and divide the metal foil into a pattern. . Examples of physical cutting include cutting using a Thomson blade or the like. Laser irradiation is preferable because a fine pattern can be formed. In this way, the patterned conductive connecting material 100 can be disposed on the substrate 30 on which the electrodes 31 of the electronic member are arranged.

Note that a part of the substrate may be burned by laser irradiation, and the circuit may be damaged. However, this can be prevented by adjusting the laser irradiation conditions and the thickness of the resin composition, or forming a protective layer such as a resist on the circuit.

(2) Heating process Next, in the heating process, the patterned conductive connecting material 100 disposed on the substrate 30 in the placing process is not less than the melting point of the solder foil or tin foil constituting the metal foil pattern layer 110 and the resin composition layer. It heats so that hardening of the resin composition which comprises 120 may not be completed.

As in the third embodiment, by heating the patterned conductive connection material 100 at a melting point or higher of the solder foil or tin foil constituting the metal foil pattern layer 110, the metal foil pattern layer 110 is melted,
The molten solder or tin can move in the softened resin composition layer 120. As a result, as shown in FIG. 6D, the solder foil or tin foil constituting the metal foil pattern layer 110 is melted, and the molten metal aggregates on the electrode, whereby the connection terminal 140 is formed. On the other hand, the resin region is filled around the connection terminal 140 to form the insulating region 120a. Thereby, when connecting with the terminal of another electronic member, the insulation between adjacent terminals is ensured, and the short circuit between adjacent terminals can be prevented.

The heating conditions and preferred aspects in the heating step are the same as in the third embodiment, and can be implemented in the same manner as in the third embodiment.

The connection terminal can be manufactured as described above. In addition, although 3rd embodiment and 4th embodiment were demonstrated separately, these can also be combined. For example, in the arranging step, a conductive connecting material including a metal foil having a pattern formed thereon is arranged on the electrode of the electronic member,
It may be further divided to form a fine pattern.

By using the connection terminals obtained in the present invention, the electrodes of the other electronic members and the connection terminals are opposed to each other, and the electronic members are electrically connected to each other by being heated and cured at a melting point of solder or tin constituting the connection terminals. Can be connected to. The method for manufacturing a connection terminal according to the present invention is useful, for example, when manufacturing a connection terminal on an electrode of a semiconductor wafer, a semiconductor chip, a rigid substrate, a flexible substrate, or other electrical and electronic components.

3. Patterned Conductive Connection Material The patterned conductive connection material used in the connection method and connection terminal manufacturing method of the present invention will be described below.

(1) Resin composition The resin composition constituting the resin composition layer of the patterned conductive connecting material used in the present invention is:
A curable resin composition that is cured by heating or irradiation with actinic radiation is preferred. Above all,
A thermosetting resin composition is preferred in that it is excellent in mechanical properties such as linear expansion coefficient and elastic modulus after curing.

The resin composition used in the present invention may be in a liquid or solid form at room temperature. Here, “liquid state at room temperature” means a state having no fixed form at room temperature (25 ° C.). Paste forms are also included in liquid form.

In addition to the curable resin, the resin composition used in the present invention includes a film-forming resin, a curing agent, a curing accelerator, a compound having a flux function, a silane coupling agent, and the like as necessary. Hereinafter, each component will be described.

(I) Curable resin The curable resin used by this invention will not be specifically limited if normally used as an adhesive agent component for semiconductor device manufacture. For example, epoxy resin, phenoxy resin, silicone resin, oxetane resin, phenol resin, (meth) acrylate resin, polyester resin (unsaturated polyester resin), diallyl phthalate resin, maleimide resin, polyimide resin (polyimide precursor resin), bismaleimide -Triazine resin etc. are mentioned. In particular, the use of a thermosetting resin containing at least one selected from the group consisting of epoxy resins, (meth) acrylate resins, phenoxy resins, polyester resins, polyimide resins, silicone resins, maleimide resins, and bismaleimide-triazine resins. preferable. Especially, it is preferable to use an epoxy resin from a viewpoint that it is excellent in sclerosis | hardenability and preservability, the heat resistance of a hardened | cured material, moisture resistance, and chemical resistance. These curable resins may be used alone or in combination of two or more.

Content of curable resin can be suitably set according to the form of a resin composition.
For example, when the resin composition is liquid, the content of the curable resin is preferably 10% by weight or more, more preferably 15% by weight or more, and still more preferably 20% by weight or more based on the total weight of the resin composition. More preferably 25% by weight or more, still more preferably 30% by weight or more.
5% by weight or more is particularly preferable. Further, it is preferably less than 100% by weight, more preferably 95% by weight or less, still more preferably 90% by weight or less, and even more preferably 75% by weight or less,
It is still more preferably 65% by weight or less, particularly preferably 55% by weight or less.
When the resin composition is solid, the content of the curable resin is based on the total weight of the resin composition.
It is preferably 5% by weight or more, more preferably 10% by weight or more, further preferably 15% by weight or more, and particularly preferably 20% by weight or more. Moreover, 90 weight% or less is preferable, 85 weight% or less is more preferable, 80 weight% or less is further more preferable, 75 weight% or less is still more preferable, 65 weight% or less is still more preferable, 55 weight% or less is especially preferable.
When the content of the curable resin is within the above range, the electrical connection strength and the mechanical adhesive strength between the terminals can be sufficiently secured.

In the present invention, any epoxy resin that is liquid at room temperature and solid at room temperature may be used.
An epoxy resin that is liquid at room temperature and an epoxy resin that is solid at room temperature may be used in combination. When the resin composition is liquid, it is preferable to use a liquid epoxy resin at room temperature, and when the resin composition is solid, any of liquid and solid epoxy resins may be used, When using a solid epoxy resin, it is preferable to use a film-forming resin in combination as appropriate.

Preferred examples of the epoxy resin that is liquid at room temperature (25 ° C.) include bisphenol A type epoxy resins and bisphenol F type epoxy resins. A bisphenol A type epoxy resin and a bisphenol F type epoxy resin may be used in combination.
The epoxy equivalent of the liquid epoxy resin at room temperature is preferably 150 to 300 g / eq.
60 to 250 g / eq is more preferable, and 170 to 220 g / eq is particularly preferable. If the epoxy equivalent is less than the above lower limit, the shrinkage of the cured product tends to increase, and warping may occur. On the other hand, when the upper limit is exceeded, when a film-forming resin is used in combination, the reactivity with a film-forming resin, particularly a polyimide resin, tends to decrease.

Examples of solid epoxy resins at room temperature (25 ° C.) include bisphenol A type epoxy resins, bisphenol S type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, glycidyl amine type epoxy resins, and glycidyl ester type epoxies. Resin, trifunctional epoxy resin, tetrafunctional epoxy resin, etc. are mentioned. Among these, solid trifunctional epoxy resin, cresol novolac type epoxy resin and the like are preferable. These epoxy resins may be used alone or in combination of two or more.
The epoxy equivalent of the epoxy resin solid at room temperature is preferably 150 to 3000 g / eq, more preferably 160 to 2500 g / eq, and particularly preferably 170 to 2000 g / eq.
The softening point of a solid epoxy resin at room temperature is preferably 40 to 120 ° C, and 50 to 110 ° C.
Is more preferable, and 60 to 100 ° C. is particularly preferable. When the softening point is within the above range, tackiness can be suppressed and handling can be easily performed.

(Ii) Film-forming resin When a solid resin composition is used, it is preferable to use the curable resin and the film-forming resin in combination. The film-forming resin used in the present invention is not particularly limited as long as it is soluble in an organic solvent and has film-forming properties alone. Either a thermoplastic resin or a thermosetting resin can be used, and these can be used in combination. Specifically, as the film-forming resin, (meth) acrylic resin, phenoxy resin, polyester resin (saturated polyester resin), polyurethane resin, polyimide resin, polyamideimide resin, siloxane-modified polyimide resin, polybutadiene resin, polypropylene resin,
Styrene-butadiene-styrene copolymer, styrene-ethylene-butylene-styrene copolymer, polyacetal resin, polyvinyl butyral resin, polyvinyl acetal resin,
Examples include butyl rubber, chloroprene rubber, polyamide resin, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-acrylic acid copolymer, acrylonitrile-butadiene-styrene copolymer, polyvinyl acetate, and nylon. Above all, (meta)
Acrylic resins, phenoxy resins, polyester resins and polyimide resins are preferred. A film-forming resin may be used alone or in combination of two or more.

In this specification, “(meth) acrylic resin” refers to a polymer of (meth) acrylic acid and its derivatives, or a copolymer of (meth) acrylic acid and its derivatives and other monomers. Means. When expressed as “(meth) acrylic acid” or the like, it means “acrylic acid or methacrylic acid” or the like.

Examples of the (meth) acrylic resin used in the present invention include polyacrylic acid, polymethacrylic acid, polymethyl acrylate, polyethyl acrylate, polybutyl acrylate,
Polyacrylates such as 2-ethylhexyl polyacrylate, polymethacrylates such as polymethyl methacrylate, polyethyl methacrylate, polybutyl methacrylate, polyacrylonitrile, polymethacrylonitrile, polyacrylamide, butyl acrylate Ethyl acrylate-acrylonitrile copolymer, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-acrylic acid copolymer, acrylonitrile-
Butadiene-styrene copolymer, acrylonitrile-styrene copolymer, methyl methacrylate-styrene copolymer, methyl methacrylate-acrylonitrile copolymer, methyl methacrylate-α-methylstyrene copolymer, butyl acrylate-acrylic acid Ethyl-acrylonitrile-2-hydroxyethyl methacrylate-methacrylic acid copolymer, butyl acrylate-ethyl acrylate-acrylonitrile-2-hydroxyethyl methacrylate-
Acrylic acid copolymer, butyl acrylate-acrylonitrile-2-hydroxyethyl methacrylate copolymer, butyl acrylate-acrylonitrile-acrylic acid copolymer, butyl acrylate-ethyl acrylate-acrylonitrile copolymer, ethyl acrylate- Examples include acrylonitrile-N, N-dimethylacrylamide copolymer. Of these, butyl acrylate-ethyl acrylate-acrylonitrile copolymer and ethyl acrylate-acrylonitrile-N, N-dimethylacrylamide are preferable. These (meth) acrylic resins may be used alone or in combination of two or more.

The skeleton of the phenoxy resin used in the present invention is not particularly limited, but bisphenol A
Preferred types include bisphenol F type and biphenyl type.

The polyimide resin used in the present invention is not particularly limited as long as it is a resin having an imide bond in a repeating unit. For example, what is obtained by making diamine and acid dianhydride react, heating the obtained polyamic acid, and carrying out dehydration ring closure is mentioned.

Examples of the diamine include 3,3′-dimethyl-4,4′diaminodiphenyl, 4
, 6-Dimethyl-m-phenylenediamine, aromatic diamine such as 2,5-dimethyl-p-phenylenediamine, 1,3-bis (3-aminopropyl) -1,1,3,3-tetramethyldisiloxane And siloxane diamines. A diamine may be used individually by 1 type, or may use 2 or more types together.

Examples of the acid dianhydride include 3,3,4,4′-biphenyltetracarboxylic acid, pyromellitic dianhydride, 4,4′-oxydiphthalic dianhydride, and the like. An acid dianhydride may be used individually by 1 type, or may use 2 or more types together.

The polyimide resin may be soluble or insoluble in a solvent, but is preferably a solvent-soluble one because it can be easily varnished when mixed with other components and has excellent handleability. In particular, a siloxane-modified polyimide resin is preferably used because it can be dissolved in various organic solvents.

The film-forming resin used in the present invention has a weight average molecular weight of 8,000 to 1,000,
000 is preferred, 8,500 to 950,000 is more preferred, 9,000 to 900,
000 is more preferable. When the weight average molecular weight of the film-forming resin is in the above range,
The film-forming property can be improved, and the fluidity of the conductive connecting material before curing can be suppressed. The weight average molecular weight of the film-forming resin can be measured by GPC (gel permeation chromatography).

In the present invention, commercially available products can be used as such film-forming resins. Furthermore, in a range that does not impair the effect of the present invention, a plasticizer, a stabilizer,
You may use what mix | blended various additives, such as an inorganic filler, an antistatic agent, antioxidant, and a pigment.

In the patterned conductive connecting material used in the present invention, the content of the film-forming resin can be appropriately set according to the form of the curable resin composition to be used.
For example, in the case of a solid resin composition, the content of the film-forming resin is preferably 5% by weight or more and preferably 10% by weight or more with respect to the total weight of the resin composition. More preferably, it is particularly preferably 15% by weight or more. Further, it is preferably 50% by weight or less, more preferably 45% by weight or less, and particularly preferably 40% by weight or less. When the content of the film-forming resin is within the above range, the fluidity of the resin composition before melting can be suppressed, and the patterned conductive connecting material can be easily handled.

(Iii) Curing Agent Preferred examples of the curing agent used in the present invention include phenols, acid anhydrides, and amine compounds. A hardening | curing agent can be suitably selected according to the kind etc. of curable resin.
For example, when an epoxy resin is used as the curable resin, good reactivity with the epoxy resin, low dimensional change during curing, and appropriate physical properties after curing (for example, heat resistance, moisture resistance, etc.) are obtained. Phenols are preferably used as the curing agent, and bifunctional or higher functional phenols are more preferable in terms of excellent physical properties after curing of the curable resin. Also, such a curing agent is 1
One species may be used alone, or two or more species may be used in combination.

Examples of phenols include bisphenol A, tetramethylbisphenol A,
Examples include diallyl bisphenol A, biphenol, bisphenol F, diallyl bisphenol F, trisphenol, tetrakisphenol, phenol novolac resin, and cresol novolac resin. Of these, phenol novolac resins and cresol novolac resins are preferable because they have good reactivity with epoxy resins and excellent physical properties after curing.

When the content of the curing agent has a functional group that functions as a curing agent when the compound having a flux function described below and the type of the curable resin or the curing agent to be used have a functional group, the content should be selected as appropriate. Can do.
For example, when an epoxy resin is used as the curable resin, the content of the curing agent is preferably 0.1 to 50% by weight, more preferably 0.2 to 40% by weight, based on the total weight of the resin composition,
0.5 to 30% by weight is particularly preferred. When the content of the curing agent is within the above range, the reliability of the electrical connection between the terminals and the mechanical strength can be sufficiently ensured.

(Iv) Curing accelerator As the curing accelerator used in the present invention, imidazole, 2-methylimidazole, 2
-Undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-
2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl- 2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl (1 ')]-ethyl-s
-Triazine, 2,4-diamino-6- [2'-undecylimidazolyl (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4-methylimidazolyl (1 ')]-Ethyl-s-triazine, 2,4-diamino-6- [2'-methylimidazolyl (1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct 2-isocyanuric acid adduct of 2-methylimidazole, 2-phenyl-4,5-dihydroxydimethylimidazole, 2-phenyl-4-methyl-5-
Examples include imidazole compounds such as hydroxymethylimidazole.

Content of a hardening accelerator can be suitably set according to the kind of hardening accelerator to be used.
For example, when an imidazole compound is used, the content of the imidazole compound is preferably 0.001% by weight or more, more preferably 0.003% by weight or more, more preferably 0.005% by weight based on the total weight of the resin composition. A weight percent or more is particularly preferred. Moreover, 1.0 weight% or less is preferable, 0.7 weight% or less is more preferable, and 0.5 weight% or less is especially preferable. When the content of the imidazole compound is less than the lower limit, the effect as a curing accelerator is not sufficiently exhibited, and the curable resin composition may not be sufficiently cured. On the other hand, when the content of the imidazole compound exceeds the above upper limit, the solder or tin does not sufficiently move to the terminal surface before the curing of the resin composition is completed, and the solder or tin remains in the insulating region and the insulating property is sufficient. May not be secured. Also,
The storage stability of the conductive connection material may be reduced.

(V) Compound having a flux function The compound having a flux function used in a preferred embodiment of the present invention has a function of reducing a metal oxide film such as a surface oxide film of a terminal and a metal foil. For example, the compound having a flux function is preferably a compound having a phenolic hydroxyl group and / or a carboxyl group. Examples of the compound having a phenolic hydroxyl group include phenol, o-cresol, 2,6-xylenol, p-cresol, m-cresol, o-ethylphenol, 2,4-xylenol, 2,5-xylenol, m- Ethylphenol,
2,3-xylenol, meditol, 3,5-xylenol, p-tert-butylphenol, catechol, p-tert-amylphenol, resorcinol, p-octylphenol, p-phenylphenol, bisphenol F, bisphenol AF, biphenol, diallyl bisphenol Monomers containing phenolic hydroxyl groups such as F, diallyl bisphenol A, trisphenol, tetrakisphenol, resins containing phenolic hydroxyl groups such as phenol novolac resins, o-cresol novolac resins, bisphenol F novolac resins, bisphenol A novolac resins Is mentioned.

Examples of the compound having a carboxyl group include aliphatic acid anhydrides, alicyclic acid anhydrides,
Aromatic acid anhydrides, aliphatic carboxylic acids, aromatic carboxylic acids and the like can be mentioned. Examples of the aliphatic acid anhydride include succinic anhydride, polyadipic acid anhydride, polyazeline acid anhydride, and polysebacic acid anhydride. Examples of the alicyclic acid anhydride include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylhymic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride,
And methylcyclohexene dicarboxylic acid anhydride. Examples of the aromatic acid anhydride include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimellitate, and glycerol tris trimellitate.

Examples of the aliphatic carboxylic acid include formic acid, acetic acid, propionic acid, butyric acid, valeric acid, pivalic acid, caproic acid, caprylic acid, lauric acid, myristic acid, palmitic acid, stearic acid,
Examples include acrylic acid, methacrylic acid, crotonic acid, oleic acid, fumaric acid, maleic acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, sebacic acid, dodecanedioic acid, and pimelic acid. Among them, the following formula (1):
_{HOOC- (CH 2) n -COOH (} 1)
[In Formula (1), n is an integer of 1-20. ]
Are preferable, and adipic acid, sebacic acid, and dodecanedioic acid are more preferable.

The structure of the aromatic carboxylic acid is not particularly limited, but a compound represented by the following formula (2) or (3) is preferable.
[Wherein, R ^{1 to} R ⁵ are each independently a monovalent organic group, and at least one of R ^{1 to} R ⁵ is a hydroxyl group. ]
[Wherein, R ^{6 to} R ²⁰ are each independently a monovalent organic group, and at least one of R ^{6 to} R ²⁰ is a hydroxyl group or a carboxyl group. ]

Aromatic carboxylic acids include benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, hemimellitic acid, trimellitic acid, trimesic acid, merophanic acid, platnic acid, pyromellitic acid, meritic acid, xylylic acid, hemelitonic acid, mesitylene Acid, prenylic acid, toluic acid, cinnamic acid, salicylic acid, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, 3,5-dihydroxybenzoic acid, gallic acid (3,4,5-trihydroxybenzoic acid),
4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2-naphthoic acid, 3,5-
Examples thereof include naphthoic acid derivatives such as 2-dihydroxy-2-naphthoic acid; phenolphthaline; diphenolic acid and the like.

Among these, in the present invention, a compound that not only has a flux function but also acts as a curing agent for the curable resin is preferable. That is, it is preferable to use a compound that has a function of reducing the surface oxide film of metal such as a metal foil and a terminal and has a functional group capable of reacting with a curable resin. The functional group is appropriately selected depending on the type of curable resin. For example, when an epoxy resin is used as the curable resin, the functional group is preferably a functional group capable of reacting with an epoxy group such as a carboxyl group, a hydroxyl group, and an amino group. A compound having a flux function acts as a curing agent to reduce metal surface oxide films such as metal foils and terminals to increase the wettability of the metal surface and facilitate the formation of a conductive region, as well as conductivity. After forming the region, the elastic modulus or Tg of the resin can be increased by adding to the curable resin. In addition, the flux functioning compound acts as a curing agent, eliminating the need for flux cleaning.
There exists an advantage that generation | occurrence | production of the ion migration by a flux component remaining can be suppressed.

The compound having such a flux function preferably has at least one carboxyl group. For example, when an epoxy resin is used as the curable resin, examples of the compound include aliphatic dicarboxylic acids or compounds having a carboxyl group and a phenolic hydroxyl group.
Preferred examples of the aliphatic dicarboxylic acid include compounds in which two carboxyl groups are bonded to an aliphatic hydrocarbon group. The aliphatic hydrocarbon group may be saturated or unsaturated acyclic, or may be saturated or unsaturated cyclic. Further, when the aliphatic hydrocarbon group is acyclic, it may be linear or branched.

As such aliphatic dicarboxylic acid, the compound whose n is an integer of 1-20 in the said Formula (1) is mentioned preferably. When n in the formula (1) is within the above range, the balance between the flux function, the outgas at the time of adhesion, the elastic modulus after the conductive connecting material is cured, and the glass transition temperature becomes good. In particular, n is preferably 3 or more because an increase in the elastic modulus after curing of the conductive connecting material can be suppressed and the adhesion to the adherend can be improved. In addition, n is preferably 10 or less because it is possible to suppress a decrease in elastic modulus and further improve connection reliability.

Examples of the aliphatic dicarboxylic acid represented by the formula (1) include glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecane. Examples include diacid, octadecanedioic acid, nonadecanedioic acid, and eicosanedioic acid. Among these, adipic acid, suberic acid, sebacic acid and dodencandioic acid are preferable, and sebacic acid is particularly preferable.

Examples of the compound having a carboxyl group and a phenolic hydroxyl group include salicylic acid, 2
, 3-Dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-
Benzoic acid derivatives such as dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, 3,4-dihydroxybenzoic acid, gallic acid (3,4,5-trihydroxybenzoic acid);
Examples thereof include naphthoic acid derivatives such as dihydroxy-2-naphthoic acid and 3,5-dihydroxy-2-naphthoic acid; phenolphthaline; diphenolic acid and the like. Of these, phenolphthaline, gentisic acid, 2,4-dihydroxybenzoic acid, and 2,6-dihydroxybenzoic acid are preferable, and phenolphthalin and gentisic acid are particularly preferable.

A compound having a flux function may be used alone or in combination of two or more. Moreover, since any compound easily absorbs moisture and causes voids, it is preferable to dry the compound having a flux function in advance before use.

Content of the compound which has a flux function can be suitably set according to the form of the resin composition to be used.
For example, when the resin composition is liquid, the content of the compound having a flux function is preferably 1% by weight or more, more preferably 2% by weight or more, and more preferably 3% by weight or more based on the total weight of the resin composition. Is particularly preferred. Moreover, 50 weight% or less is preferable, 40 weight% or less is more preferable, 30 weight% or less is further more preferable, and 25 weight% or less is especially preferable.
In the case of a solid resin composition, the content of the compound having a flux function is preferably 1% by weight or more, more preferably 2% by weight or more, and more preferably 3% by weight with respect to the total weight of the resin composition.
The above is particularly preferable. Moreover, 50 weight% or less is preferable, 40 weight% or less is more preferable, 30 weight% or less is further more preferable, and 25 weight% or less is especially preferable.
When the content of the compound having the flux function is within the above range, the metal foil and the surface oxide film of the terminal can be removed to such an extent that they can be electrically joined. Furthermore, the elastic modulus or Tg of the resin can be increased by efficiently adding to the resin during curing. Moreover, generation | occurrence | production of the ion migration resulting from the compound which has an unreacted flux function can be suppressed.

(Vi) Silane coupling agent As the silane coupling agent used in the present invention, an epoxy silane coupling agent,
Examples include aromatic-containing aminosilane coupling agents. By adding a silane coupling agent, the adhesion between the bonding member and the patterned conductive connecting material can be increased.
A silane coupling agent may be used individually by 1 type, and may use 2 or more types together.

Content of a silane coupling agent can be suitably selected according to types, such as a joining member and curable resin. For example, the content of the silane coupling agent is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, based on the total weight of the curable resin composition.
1 wt% or more is particularly preferable, 2 wt% or less is preferable, 1.5 wt% or less is more preferable, and 1 wt% or less is particularly preferable.

The resin composition used in the present invention includes plasticizers, stabilizers, tackifiers, lubricants, antioxidants, fillers such as inorganic fillers, antistatic agents, pigments, etc., as long as the effects of the present invention are not impaired. May be blended.

In the present invention, the resin composition can be prepared by mixing and dispersing the above components. The mixing method and dispersion method of each component are not specifically limited, It can mix and disperse | distribute by a conventionally well-known method.

Moreover, in this invention, you may mix the said each component in a solvent or under absence of solvent, and may prepare a liquid resin composition. The solvent used at this time is not particularly limited as long as it is inert to each component. For example, acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), diisobutyl ketone (DIBK), cyclohexanone,
Ketones such as diacetone alcohol (DAA); aromatic hydrocarbons such as benzene, xylene and toluene, methyl alcohol, ethyl alcohol, isopropyl alcohol, n
-Alcohols such as butyl alcohol, cellosolves such as methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl cellosolve acetate, ethyl cellosolve acetate, N-methyl-2-pyrrolidone (NMP), tetrahydrofuran (THF), dimethylformamide (DMF), Examples thereof include dibasic acid ester (DBE), ethyl 3-ethoxypropionate (EEP), dimethyl carbonate (DMC) and the like. Moreover, it is preferable that the usage-amount of a solvent is an quantity from which the solid content concentration of the component mixed with the solvent will be 10 to 60 weight%.

In a preferred embodiment of the present invention, the compound having 10 to 90% by weight of the epoxy resin, 0.1 to 50% by weight of the curing agent, 5 to 50% by weight of the film-forming resin, and a flux function with respect to the total weight of the resin composition. Those containing 1 to 50% by weight are more preferable. The epoxy resin is 20 to 80% by weight, the curing agent is 0.2 to 40% by weight, the film-forming resin is 10 to 45% by weight, and the compound having a flux function is 2 to 40% by weight with respect to the total weight of the resin composition. More preferably, those containing The epoxy resin is 35 to 55% by weight, the curing agent is 0.5 to 30% by weight, the film-forming resin is 15 to 40% by weight, and the compound having a flux function is 3 to 25% by weight with respect to the total weight of the resin composition. Those containing are particularly preferred.

Each thickness of the resin composition layer in the patterned conductive connection material is not particularly limited,
1 μm or more is preferable, 3 μm or more is more preferable, and 5 μm or more is particularly preferable. Also,
The thickness of the resin composition layer is preferably 200 μm or less, more preferably 150 μm or less,
Particularly preferred is 00 μm or less. When the thickness of the resin composition layer is within the above range, the gap between adjacent terminals can be sufficiently filled with the resin composition, and after the resin composition is cured, the mechanical adhesive strength after solidification and the opposite are opposed. A sufficient electrical connection between the terminals can be ensured, and the connection terminals can be manufactured.

When the patterned conductive connecting material includes a plurality of resin composition layers, the composition of each resin composition layer may be the same, or may be different depending on the type of resin component used, the difference in formulation, and the like. The physical properties such as melt viscosity and softening temperature of the resin composition layer may be the same or different. For example, a liquid resin composition layer and a solid resin composition layer may be used in combination.

(2) Metal foil pattern layer A metal foil pattern layer is a layer comprised with the metal foil chosen from solder foil or tin foil. The metal foil layer should just be formed in at least one part of the resin composition layer by planar view, and may be formed in the whole surface of the resin composition layer. The shape of the metal foil pattern layer is as already described.

The metal foil constituting the metal foil pattern layer is not particularly limited as long as it has a surface oxide film that can be removed by the reducing action of the compound having a flux function, but tin (Sn), lead (Pb
), Silver (Ag), bismuth (Bi), indium (In), zinc (Zn), nickel (N
i) an alloy of at least two or more metals selected from the group consisting of antimony (Sb), iron (Fe), aluminum (Al), gold (Au), germanium (Ge) and copper (Cu), or tin It is preferable to consist of a single substance.

Among these, considering the melting temperature and mechanical properties, the metal foil is an Sn-Pb alloy,
Sn-Bi alloy, Sn-Ag-Cu alloy, Sn-In alloy, S
A solder foil made of an alloy containing Sn such as an n-Ag alloy is more preferable. When using an Sn-Pb alloy, the content of tin is preferably 30% by weight or more and less than 100% by weight, and 35% by weight.
It is more preferably less than 100% by weight and particularly preferably 40% by weight or more. Moreover, less than 100 weight% is preferable. In the case of lead-free solder, the tin content is 15 wt% or more and 100
Less than wt% is preferable, 20 wt% or more and less than 100 wt% is more preferable, and 25 wt% or more and less than 100 wt% is particularly preferable. For example, Sn-Pb alloys include Sn63-P
b (melting point 183 ° C.), as lead-free solder, Sn-3.0Ag-0.5Cu (melting point 21
7 ° C), Sn-3.5Ag (melting point 221 ° C), Sn-58Bi (melting point 139 ° C), Sn-
9.0Zn (melting point 199 ° C.), Sn-3.5Ag-0.5Bi-3.0In (melting point 193
C.), Au-20Sn (melting point: 280 [deg.] C.), and the like.

The metal foil may be appropriately selected according to the heat resistance of the electronic member or semiconductor device to be connected. For example, in the connection between terminals in a semiconductor device, the melting point is 330 ° C. or lower (more preferably 300 ° C. or lower, particularly preferably 280 ° C. or lower, more preferably, in order to prevent the members of the semiconductor device from being damaged by thermal history. It is preferable to use a metal foil that is 260 ° C. or lower. In order to ensure the heat resistance of the semiconductor device after the connection between terminals, the melting point is 100.
It is preferable to use a metal foil having a temperature of at least ° C (more preferably at least 110 ° C, particularly preferably at least 120 ° C). In addition, melting | fusing point of metal foil can be measured with a differential scanning calorimeter (DSC).

The thickness of the metal foil pattern layer can be appropriately selected according to the gap between the terminals facing each other, the separation distance between adjacent terminals, and the like. For example, in the case of connection between connection terminals such as a semiconductor chip, a substrate, and a semiconductor wafer in a semiconductor device, the thickness of the metal foil pattern layer is 0.5 μm.
m or more, preferably 3 μm or more, more preferably 5 μm or more, and 10
0 μm or less is preferable, 50 μm or less is more preferable, and 20 μm or less is particularly preferable. When the thickness of the metal foil is less than the lower limit, unconnected terminals tend to increase due to lack of solder or tin, while when the upper limit is exceeded, bridging occurs between adjacent terminals due to excessive solder or tin,
It tends to be short-circuited easily.

The method for producing the metal foil pattern layer includes a case where the metal foil is patterned in advance (first / third embodiment) and a case where the metal foil is divided and patterned on the resin composition layer (second / fourth). Embodiment)
And different.
When the metal foil is patterned in advance, as a method for producing the metal foil pattern layer, for example, a method of punching the metal foil into a predetermined pattern, a method of forming a predetermined pattern by etching, a shielding plate, a mask, etc. The method of forming by using a vapor deposition method, a sputtering method, a plating method, etc. is mentioned by using. The method for producing the metal foil pattern layer is known to those skilled in the art in the circuit board field and will not be described in detail. For example, JP 2006-498
No. 92, JP-A-2002-173767, and JP-A-2002-26491 can be used for preparation.

On the other hand, when the metal foil is divided on the resin composition layer, as a method for producing the metal foil pattern layer, for example, the conductive connection material is previously thermocompression bonded to the substrate using an apparatus such as a roll laminator or a press. And a method of forming a predetermined pattern by laser irradiation or physical cutting.

The content of the metal foil pattern layer is preferably 5% by weight or more, more preferably 20% by weight or more, and particularly preferably 30% by weight or more based on the total weight of the patterned conductive connecting material. Also,
The amount is preferably less than 100% by weight, more preferably 80% by weight or less, and particularly preferably 70% by weight or less. When the content of the metal foil pattern layer is less than the above lower limit, unconnected terminals may increase due to insufficient solder or tin. On the other hand, if the content of the metal foil pattern layer exceeds the above upper limit, bridging is likely to occur between adjacent terminals due to excessive solder or tin.

Alternatively, the content of the metal foil pattern layer may be defined as a volume ratio with respect to the patterned conductive connection material. For example, the content of the metal foil pattern layer is preferably 1% by volume or more, more preferably 5% by volume or more, and particularly preferably 10% by volume or more with respect to the patterned conductive connecting material. Moreover, 90 volume% or less is preferable, 80 volume% or less is more preferable, and 70 volume% or less is especially preferable. When the content of the metal foil pattern layer is less than the above lower limit, unconnected terminals may increase due to insufficient solder or tin. On the other hand, if the content of the metal foil pattern layer exceeds the above upper limit, bridging is likely to occur between adjacent terminals due to excessive solder or tin.

The form of the patterned conductive connection material can be appropriately selected according to the form of the resin composition. For example, when the resin composition is in a liquid state, the resin composition is applied onto a release substrate such as a polyester sheet, dried at a predetermined temperature for the purpose of semi-curing (B-stage), etc., and then formed into a metal foil. A film-like material obtained by bonding pattern layers can be used as a patterned conductive connecting material. When the resin composition is solid, a varnish of the resin composition dissolved in an organic solvent is applied onto a release substrate such as a polyester sheet and dried at a predetermined temperature, and then a metal foil pattern layer is laminated, or What was formed in the film form using methods, such as vapor deposition, can be provided as a patterned conductive connection material.

In addition, the patterned conductive connecting material and the metal foil pattern layer used therefor may be embossed to enhance contact with the terminal or electrode.

The thickness of the patterned conductive connection material is not particularly limited, but is preferably 1 μm or more, and 3 μm
m or more, more preferably 5 μm or more, and preferably 200 μm or less,
150 μm or less is more preferable, and 100 μm or less is particularly preferable. When the thickness of the patterned conductive connection material is within the above range, the resin composition can be sufficiently filled in the gap between adjacent terminals. In addition, the mechanical adhesive strength after the resin component is cured or solidified and the electrical connection between the opposing terminals can be sufficiently ensured. In addition, it is possible to manufacture connection terminals according to the purpose and application.

When the resin composition used in the present invention is liquid at 25 ° C., for example, it is applied onto a release substrate such as a polyester sheet, and dried and formed into a film for the purpose of semi-curing (B-stage) at a predetermined temperature. A film-shaped resin composition is produced. Next, a patterned conductive connecting material can be produced by preparing two resin compositions formed on a release substrate and laminating with a hot roll with a metal foil pattern layer interposed therebetween. When it is necessary to control the thickness of the resin composition, a method in which the liquid resin composition applied on the release substrate is passed through a bar coater having a certain gap or a method in which the liquid resin composition is sprayed with a spray coater or the like is used. Can be produced.

When the resin composition used in the present invention is solid at 25 ° C., for example, a patterned conductive connecting material can be produced as follows. First, a varnish of a resin composition dissolved in an organic solvent is applied on a release substrate such as a polyester sheet, dried at a predetermined temperature to form a film, and a film-like resin composition is produced. Next, when the resin composition is arranged above and below the metal foil pattern layer by preparing two sheets of the resin composition formed on the release substrate and laminating with a hot roll with the metal foil pattern layer sandwiched therebetween, A three-layer patterned conductive connecting material comprising a resin composition layer / metal foil pattern layer / resin composition layer can be produced. Moreover, the two-layer patterned conductive connection material which consists of a resin composition layer / metal foil pattern layer can be produced by arrange | positioning a resin composition on the single side | surface of a metal foil pattern layer by the above-mentioned lamination system.

Also, a metal foil is disposed on the release substrate, the metal foil is half-cut with a mold from the metal foil side, and the metal foil pattern layer is prepared by removing the excess metal foil, and the film-like resin composition Objects may be laminated with a hot roll. When the resin composition layer is provided on both surfaces of the metal foil pattern layer, the release substrate is peeled off, and the film-shaped resin composition is formed on the surface of the metal foil pattern layer opposite to the surface on which the resin composition layer is formed. What is necessary is just to laminate a physical layer further.

The conductive connection material used in the present invention has the same configuration as the patterned conductive connection material except that it has a metal foil layer instead of the metal foil pattern layer, and is produced by the same method. Can do.

EXAMPLES Hereinafter, although this invention is demonstrated based on an Example, this invention is not restrict | limited to the following Example.

[Example 1]
In Example 1, as described in Embodiment 1 of the present invention, a patterned conductive connection material was manufactured in advance, and was placed between opposing terminals to perform inter-terminal connection.

(1) Production of Curable Resin Composition Layer Each component shown in Table 1 was dissolved in methyl ethyl ketone (MEK) to obtain a resin composition varnish having a resin solid content of 40% by weight. The obtained varnish was applied to a polyester sheet using a comma coater and dried at 90 ° C. for 5 minutes to obtain a curable resin composition layer having a film thickness of 30 μm.

(2) Production of patterned conductive connecting material After forming the solder foil A shown in Table 1 on the obtained film-like curable resin composition layer by vapor deposition, a photosensitive resist (Asahi Kasei Co., Ltd.) used for circuit formation is formed. "AQ-2075" manufactured by KK
Then, after exposure and development, etching was performed and the photosensitive resist was peeled off to form a 5 μm thick solder foil pattern layer on the curable resin composition layer.
Next, a film-like curable resin composition layer is placed on the surface opposite to the surface on which the curable resin composition layer is formed on the solder foil pattern layer, at 60 ° C., 0.3 MPa, 0.3 m / min. In the condition of min,
Laminated to produce a patterned conductive connecting material having a thickness of 65 μm.

(3) Inter-terminal connection Next, inter-terminal connection was performed using the obtained patterned conductive connection material. As a base material, it has a thickness of 0.35 mm, a circuit layer (copper circuit, thickness 12 μm), and is formed by applying Ni / Au plating (thickness 3 μm) on the copper circuit (terminal diameter 50 μm, center of adjacent terminals) Two semiconductor chips having a distance of 100 μm were prepared.
The patterned conductive connecting material obtained on one semiconductor chip is aligned using a flip chip bonder (“DB200” manufactured by Kajitani Industry Co., Ltd.) so that the patterns of the terminals and the solder foil overlap. The semiconductor chip with the patterned conductive connection material was obtained by pressure bonding under the conditions shown in Table 1.
Next, using a flip chip bonder (“DB200” manufactured by Kasuya Kogyo Co., Ltd.), the other semiconductor chip and the obtained semiconductor chip with the patterned conductive connection material face each other. Then, thermocompression bonding (gap between substrates: 30 μm) was performed under the conditions shown in Table 1, and the terminals were connected. Then, it heated at 180 degreeC for 1 hour, the curable resin composition was hardened, and the laminated body was obtained.

[Example 2]
A curable resin composition layer was prepared in the same manner as in Example 1, and the obtained curable resin composition layer having a thickness of 30 μm was formed on both surfaces of the 5 μm-thick solder foil A shown in Table 1 at 60 ° C. 3 MPa, 0.
A conductive connecting material having a thickness of 65 μm was manufactured by laminating under the condition of 3 m / min.
The obtained conductive connection material was pressure-bonded onto the semiconductor chip in the same manner as in Example 1 to obtain a semiconductor chip with a conductive connection material.
Next, using a UV-YAG laser processing machine ("ML605LDX" manufactured by Mitsubishi Electric Corporation), the solder foil between adjacent terminals is divided under the processing conditions of a tip output of 0.2 mJ and a shot number of 5 shots, and the solder foil Was patterned to form a metal foil pattern layer. When the obtained metal foil pattern layer was observed with a digital microscope (“KH-7700” manufactured by Hilox Co., Ltd.), the solder foil was neatly divided into a rectangular pattern as shown in FIG.
Next, the other semiconductor chip is disposed in the same manner as in Example 1 on the obtained semiconductor chip with a conductive connecting material so that the patterns of the terminals and the solder foil overlap, and thermocompression bonding is performed. The laminate was obtained by heating at 180 ° C. for 1 hour to cure the curable resin composition.

[Reference Example 1]
A curable resin composition layer was prepared in the same manner as in Example 1, and the obtained curable resin composition layer having a thickness of 30 μm was formed on both surfaces of the solder foil A shown in Table 1 at 60 ° C., 0.3 MPa, 0 .3m / min
Then, a conductive connection material having a thickness of 65 μm was manufactured by lamination. Furthermore, the connection between terminals was performed by the method described in “(3) Connection between terminals” in Example 1 using the obtained conductive connection material.

[Comparative Example 1]
A varnish of a curable resin composition was prepared in the same manner as in Example 1. The resulting varnish was blended with 2% by volume of conductive particles (AU-205, average particle size 5 μm, plastic core, Ni / Au plating, manufactured by Sekisui Chemical Co., Ltd.) and dispersed uniformly. Was applied to a polyester sheet and dried at 90 ° C. for 5 minutes to produce a conductive connecting material. further,
By the method described in Example 1, “(3) Inter-terminal connection”, inter-terminal connection was performed using the obtained conductive connection material.

In the laminates obtained in the examples, reference examples, and comparative examples, the connection resistance between the opposing terminals, the conduction path forming ability, and the presence or absence of solder particles remaining in a region other than the conduction path were evaluated by the methods described later.

[1] Connection resistance Connection resistance is the resistance between the terminals facing each other in the laminate, using the 4-terminal method (resistance meter: Iwasaki Tsushinki (
12 points were measured by “Digital Multimeter VOA7510” manufactured by Co., Ltd., measurement probe: “Pin type lead 9771” manufactured by Hioki Electric Co., Ltd.). When the average value is less than 30 mΩ, “A”
The case of 30 mΩ or more was determined as “B”.

[2] Conductive path forming property A cross section between terminals of 10 pairs of terminals facing each other in a laminate is shown by a scanning electron microscope (
SEM) (“JSM-7401F” manufactured by JEOL Ltd.) When all of the 10 sets have a cylindrical conductive path formed by solder, “A” indicates that a single set of conductive paths is formed. “B” when there is a terminal that is not present, and “C” when it is in short contact with an adjacent terminal.
Was determined.

[3] Presence / absence of residual solder A cross section of the laminate was scanned with a scanning electron microscope (SEM) (manufactured by JEOL Ltd., model number “JSM-74”.
01F ") and the case where all the solder contributes to the formation of a conduction path between the opposing terminals is
A ", resin (insulating region) other than between terminals (conducting region) facing each other without contributing to the formation of a conductive path
The case where the solder remained was determined as “B”.

Table 1 shows the results of the above [1] to [3].

The resin composition components and solder foils in Table 1 were as shown below.
Epoxy resin: bisphenol A type epoxy resin, “EP” manufactured by Dainippon Ink & Chemicals, Inc.
ICLON-840S ", epoxy equivalent 185 g / eq
Curing agent: phenol novolac, “PR-53647” manufactured by Sumitomo Bakelite Co., Ltd.
Film-forming resin: modified biphenol type phenoxy resin, “YX-6654” manufactured by Japan Epoxy Resin Co., Ltd., weight average molecular weight 39,000
Compound having flux function: Sebacic acid, “Sebacic acid” manufactured by Tokyo Chemical Industry Co., Ltd.
Silane coupling agent: 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, “KBM-303” manufactured by Shin-Etsu Chemical Co., Ltd.
Imidazole compound: 2-phenyl-4-methylimidazole, manufactured by Shikoku Kasei Kogyo Co., Ltd.
Curesol 2P4MZ "
Solder foil A: Sn / Ag / Cu = 96.5 / 3.0 / 0.5 (melting point: 217 ° C.), thickness 5 μ
m
Conductive particles A: Plastic core, Ni / Au plating, average particle size 5 μm, Sekisui Chemical Co., Ltd. (
"AU-205" manufactured by KK

As shown in Table 1, in this embodiment, as in Reference Example 1, by using a metal foil layer as the conductive component of the conductive connection material, good electrical connection can be obtained, and solder is present in the insulating region. It was confirmed that it did not remain.
On the other hand, Comparative Example 1 using conventional conductive particles as the conductive component is inferior in connection resistance to the Examples and Reference Examples, and the conductive particles may remain in the resin composition layer. confirmed.

[4] Sectional Structure of Laminate Next, the sectional structures of the laminates obtained in Examples 1 and 2 and Reference Example 1 were scanned using a scanning electron microscope (
SEM) (manufactured by JEOL Ltd., model number “JSM-7401F”). FIG. 9 is a photograph of the cross-sectional structure of the laminate obtained in each example and reference example. As shown in FIG. 9, in the laminates obtained in Examples 1 and 2, the amount of solder agglomerated on the terminal surface between the opposing terminals was almost uniform, whereas that obtained in Reference Example 1 was obtained. In the laminated body, although there was no problem in connectivity, it was found that the amount of solder aggregated on the terminal surface between the terminals facing each other varied.

From the above results, it was found that good electrical connection and insulation reliability can be achieved at a high level by using a metal foil layer as the conductive component of the conductive connection material. It was also found that the amount of metal aggregated on the terminal surface between the opposing terminals can be controlled by using a metal foil divided into a pattern as the conductive component of the conductive connecting material. According to the present invention, by patterning the metal foil layer, electrical connection between the terminals can be more reliably performed.

The connection method between terminals of the present invention is useful for electrically connecting electronic members in electrical and electronic components. Moreover, the manufacturing method of the connection terminal of this invention is used suitably when manufacturing a connection terminal on the electrode of an electronic member. The present invention is useful when connecting terminals in a semiconductor wafer, a semiconductor chip, a rigid substrate, a flexible substrate, and other electrical and electronic components.

10, 20, 30 Substrate 11, 21 Terminal 31 Electrode 100 Patterned conductive connecting material 110 Metal foil pattern layer 120 Resin composition layer 110a Conductive region 120a Insulating region 130 Metal foil 140 Connecting terminal 200 Conductive connecting material

Claims (6)

  A patterned conductive connecting material comprising a resin composition layer and a metal foil pattern layer in which solder foil or tin foil is arranged so as to have the same pattern as at least a part of a pattern formed by each end face of a plurality of terminals.   The patterned conductive connection material according to claim 1, wherein the patterned conductive connection material includes a laminated structure composed of a resin composition layer / metal foil pattern layer.   The patterned conductive connection material according to claim 1, wherein the patterned conductive connection material includes a laminated structure composed of a resin composition layer / metal foil pattern layer / resin composition layer.   The patterned conductive connection material according to claim 1, wherein the thickness of the metal foil pattern layer is 0.5 μm or more and 20 μm or less.   The patterned conductive connecting material according to claim 1, wherein the resin composition contains a compound having a flux function.   Including 35 to 55% by weight of epoxy resin, 0.5 to 30% by weight of curing agent, 15 to 40% by weight of film-forming resin and 3 to 25% by weight of compound having a flux function based on the total weight of the resin composition. The patterned conductive connection material according to claim 1, which is a waste.