JP2013218157A - Exposure apparatus, exposure method, and substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure apparatus, an exposure method, and a substrate processing apparatus which are excellent in exposure accuracy.SOLUTION: An exposure apparatus irradiates a sheet-like substrate with exposure light via a mask. The exposure apparatus includes a movement device which moves the substrate to pass through an irradiation area of the exposure light, a stage movably provided and having a hold face for holding the substrate, and a drive device which drives the stage to move in the same direction as the substrate in synchronization with the substrate in at least the irradiation area.

Description

  The present invention relates to an exposure apparatus, an exposure method, and a substrate processing apparatus.

  As display elements that constitute display devices such as display devices, for example, liquid crystal display elements and organic electroluminescence (organic EL) elements are known. Currently, in these display elements, active elements (active devices) that form thin film transistors (TFTs) on the substrate surface corresponding to each pixel have become mainstream.

  In recent years, a technique for forming a display element on a flexible substrate (for example, a film member) has been proposed. As such a technique, for example, a technique called a roll-to-roll system (hereinafter simply referred to as “roll system”) is known (see, for example, Patent Document 1). In the roll method, the belt-shaped substrate wound around the substrate supply side supply roller is sent out, and the substrate is transported while being wound up by the substrate recovery side recovery roller.

  A gate electrode, a gate oxide film, a semiconductor film, a source / drain electrode, and the like constituting the TFT are formed by a plurality of processing apparatuses from when the substrate is sent out until it is wound. Thereafter, other components of the display element are sequentially formed on the substrate. For example, when an organic EL element is formed on a substrate, a light emitting layer, an anode, a cathode, an electric circuit, and the like are sequentially formed on the substrate. These components may be formed using, for example, a photolithography method using an exposure apparatus that exposes the substrate with exposure light through a mask, for example.

International Publication No. 2006/100868

  By the way, even in the roll method as described above, there is a demand for a technology that enables a display element to be manufactured with high accuracy on a belt-like substrate. For this reason, an exposure apparatus with excellent exposure accuracy is required.

  Accordingly, an aspect of the present invention is to provide an exposure apparatus, an exposure method, and a substrate processing apparatus that are excellent in exposure accuracy.

  According to the first aspect of the present invention, an exposure apparatus that irradiates a sheet-shaped substrate with exposure light through a mask, a moving apparatus that moves the substrate so as to pass through an exposure light irradiation region, and a movement An exposure apparatus is provided that includes a stage having a holding surface capable of holding the substrate and a drive device that drives the stage so as to move in the same direction as the substrate in synchronization with the substrate at least in the irradiation region. .

  According to a second aspect of the present invention, there is provided an exposure method for irradiating a sheet-like substrate with exposure light through a mask, the moving step of moving the substrate so as to pass through the exposure light irradiation region, and the substrate There is provided an exposure method including a driving step of driving a stage having a holding surface for holding the substrate so as to move in the same direction as the substrate in synchronization with the substrate at least in the irradiation region.

  According to a third aspect of the present invention, a substrate transport unit that transports a substrate and a substrate processing unit that processes the substrate, wherein the substrate processing unit includes the exposure apparatus according to the first aspect of the present invention. A processing device is provided.

  According to the aspect of the present invention, it is possible to provide an exposure apparatus, an exposure method, and a substrate processing apparatus that are excellent in exposure accuracy.

1 is a diagram showing a configuration of an exposure apparatus according to a first embodiment of the present invention. FIG. 2 is a view showing a configuration of a part of an exposure apparatus according to the present embodiment. FIG. 5 is a view showing a process of operation of the exposure apparatus according to the present embodiment. FIG. 5 is a view showing a process of operation of the exposure apparatus according to the present embodiment. FIG. 5 is a view showing a process of operation of the exposure apparatus according to the present embodiment. FIG. 5 is a view showing a process of operation of the exposure apparatus according to the present embodiment. FIG. 5 is a view showing a process of operation of the exposure apparatus according to the present embodiment. FIG. 5 is a view showing a process of operation of the exposure apparatus according to the present embodiment. The figure which shows the structure of the device manufacturing system which concerns on 2nd embodiment of this invention. The figure which shows the one part structure of the exposure apparatus which concerns on the modification of this invention. The figure which shows the one part structure of the exposure apparatus which concerns on the modification of this invention. The figure which shows the one part structure of the exposure apparatus which concerns on the modification of this invention. The figure which shows the one part structure of the exposure apparatus which concerns on the modification of this invention.

[First embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
1 and 2 are views showing the arrangement of the exposure apparatus EX according to this embodiment.
As shown in FIG. 1, the exposure apparatus EX includes an illumination unit IU, a mask stage MST, a projection optical system PL, a substrate stage SST, and a control device. The exposure apparatus EX projects an image of the pattern formed on the mask M by the exposure light ELI onto the sheet-like substrate S.

  In FIG. 1, the orthogonal coordinate system XYZ is set so that the pattern formation surface of the mask M is perpendicular to the XZ surface, and the width direction orthogonal to the transport direction (long direction) of the substrate S is set to the Y direction. Shall. The substrate S may be activated by modifying the surface in advance by a predetermined pretreatment, or may be formed with a fine partition structure (uneven structure) for precise patterning on the surface.

  As the substrate S, for example, a foil such as a resin film or stainless steel can be used. For example, the resin film is made of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, etc. Can be used.

  The substrate S preferably has a smaller coefficient of thermal expansion so that the dimensions do not change even when subjected to heat of about 200 ° C., for example. For example, an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like. The substrate S may be a single piece of ultrathin glass having a thickness of about 100 μm manufactured by a float process or the like, or a laminate in which the resin film or aluminum foil is bonded to the ultrathin glass.

  The dimension in the width direction (short direction) of the substrate S is, for example, about 1 m to 2 m, and the dimension in the length direction (long direction) is, for example, 10 m or more. Of course, this dimension is only an example and is not limited thereto. For example, the dimension in the Y direction of the substrate S may be 50 cm or less, or 2 m or more. Moreover, the dimension of the X direction of the board | substrate S may be 10 m or less.

  The substrate S is formed so as to have flexibility. Here, the term “flexibility” refers to the property that the substrate can be bent without being broken or broken even if a force of its own weight is applied to the substrate. In addition, flexibility includes a property of bending by a force of about its own weight. The flexibility varies depending on the material, size, thickness, environment such as temperature, etc. of the substrate. As the substrate S, a single strip-shaped substrate may be used, but a configuration in which a plurality of unit substrates are connected and formed in a strip shape may be used.

  The illumination unit IU illuminates the exposure light ELI on the mask M. In the present embodiment, a mask M on a flat plate is used as the mask M. On the pattern forming surface (object surface) Ma of the mask M, a predetermined pattern is formed. As the mask M, a transmissive mask that transmits the exposure light ELI from the illumination unit IU is used. However, the mask M is not limited to this, and a reflective mask that reflects the exposure light ELI from the illumination unit IU may be used. good.

  Mask stage MST is movable while holding mask M. The mask stage MST has a drive mechanism (not shown) that moves the mask M along the pattern formation surface Ma. When the mask stage MST moves the mask M, the exposure light ELI is scanned over the entire pattern.

  The projection optical system PL projects an image of the pattern formed on the mask M onto the substrate S. As the projection optical system PL, for example, an enlargement optical system that enlarges and projects a pattern image formed on the mask M (that is, an optical system having an enlargement magnification as a projection magnification) is used.

  The substrate stage SST transports the substrate S so as to pass through each projection area PA onto which a pattern image is projected by the projection optical system PL. FIG. 2 is a plan view showing the configuration of the substrate stage SST of the exposure apparatus EX. As shown in FIGS. 1 and 2, the substrate stage SST has a substrate support surface 60 that supports the substrate S and a suction hole 61 that sucks the substrate support surface 60. The substrate stage SST is provided to be movable in the X direction, the Y direction, and the Z direction by the drive unit ACT. For example, the substrate stage SST can move between the upstream position A1 and the downstream position A2 in the X direction. The upstream position A1 and the downstream position A2 are set so as to sandwich the projection area PA in the X direction. In addition, the drive unit ACT moves the substrate stage SST in the θX direction, the θY direction, and the θZ direction so that the substrate support surface 60 is parallel to the XY plane.

  The suction holes 61 are arranged so as to be arranged over almost the entire surface of the substrate support surface 60. The suction hole 61 is connected to a suction pump (not shown). The suction hole 61 adsorbs the substrate S to the substrate support surface 60.

  On both sides in the X direction of the substrate stage SST, there are rollers R1 to R6 for guiding the substrate S, respectively. The roller R1 and the roller R6 are connected to a drive unit (not shown) (eg, a motor) and are drive rollers that can be rotated by the operation of the drive unit. The substrate S is transported in the + X direction by the rollers R1 and R6.

  The roller R3 and the roller R4 have an elliptical XZ cross section, and are formed in a cylindrical shape or a column shape. The roller R3 and the roller R4 are arranged so that the height direction (axial direction) is parallel to the Y direction. The roller R3 and the roller R4 can rotate in the circumferential direction (θY direction) of the ellipse. The roller R3 and the roller R4 are in a state where the major axis direction of the ellipse is parallel to the XY plane (hereinafter referred to as the first state) and a state where the major axis direction is parallel to the Z direction (hereinafter referred to as the second state). The transport height of the substrate S is switched.

  The roller R2 and the roller R5 are tension rollers that are disposed between the roller R1 and the roller R3 and between the roller R4 and the roller R6, respectively, and apply tension to the substrate S. The roller R2 and the roller R5 are provided to be movable in the Z direction. A predetermined tension can be applied to the substrate S by moving the roller R2 and the roller R5 in the Z direction.

Next, an exposure operation using the exposure apparatus EX configured as described above will be described.
First, the substrate stage SST is arranged at the upstream position A1, the suction hole 61 is not sucked, and the substrate S is transported with the rollers R3 and R4 being in the second state. In this state, as shown in FIG. 3, the control unit sets the roller R4 in the second state to the first state and holds the roller R3 in the second state. By this operation, the support position of the substrate S by the roller R3 in the Z direction is arranged (higher) on the + Z side than the support position of the substrate S by the roller R4, so that the substrate S gradually moves in the + X direction. It will be in the state inclined to -Z side. After tilting the substrate S in this way, the control unit starts a suction operation in the suction hole 61.

  Next, the control unit switches the roller R3 in the second state to the first state. By this operation, the inclination of the substrate S is eliminated, and the substrate S is gradually supported on the substrate support surface 60 from the + X side to the −X side. At this time, since the suction operation is performed in the suction hole 61, the substrate S is adsorbed to the substrate support surface 60 as shown in FIG.

  After the substrate S is attracted to the substrate support surface 60, the control unit moves the roller R <b> 2 and the roller R <b> 5 in the −Z direction and applies tension to the substrate S. After applying tension to the substrate S, the controller uses the roller R1 and the roller R2 to transport the substrate S in the + X direction at a predetermined speed, and upstream the substrate stage SST at a speed equal to the transport speed of the substrate S. Move in the + X direction from the side position A1 toward the downstream position A2. By this operation, the substrate S is transported without changing the relative position in the X direction between the substrate S and the substrate support surface 60 in a state where the substrate S is attracted to the substrate support surface 60.

  Due to the transport of the substrate S, a predetermined region of the substrate S (a region where an exposure pattern is to be formed) reaches the projection region PA. At this time, the control unit irradiates the mask M with the exposure light ELI from the illumination unit IU. By this operation, the exposure light ELI through the mask M is irradiated onto the surface of the substrate S through the projection optical system PL, and the surface of the substrate S is exposed by the exposure light ELI. On the other hand, the control unit moves the mask M and the substrate S in the X direction in synchronization. With this operation, as shown in FIG. 5, the pattern formed on the mask M is gradually transferred from the + X side to the −X side of the substrate S, and an exposure pattern P is formed on the substrate S. Since the substrate S moves while being supported by the substrate support surface 60 while the substrate S is exposed, it is possible to prevent the substrate S from being deformed or wrinkles or the like from being formed. For this reason, the exposure pattern P is formed on the substrate S with stable exposure accuracy.

  After the exposure pattern P is formed on the substrate S, the control unit stops the substrate S and the substrate stage SST at the downstream position A2, and stops the suction operation by the suction hole 61. Thereafter, the control unit switches the roller R4 in the first state to the second state as shown in FIG. By this operation, the substrate S is gradually inclined to the −Z side in the −X direction and is separated from the substrate support surface 60.

  Thereafter, the control unit switches the roller R3 in the first state to the second state, for example, and completely separates the substrate S from the substrate support surface 60 as shown in FIG. After the substrate S is pulled away from the substrate support surface 60, the control unit transports the substrate S in the + X direction and moves the substrate stage SST from the downstream position A2 to the upstream position A1 in the −X direction. Since the substrate S and the substrate support surface 60 are separated from each other, no frictional force or the like is generated between the substrate S and the substrate support surface 60 due to the transfer of the substrate S and the movement of the substrate stage SST. Transport is possible.

  By repeating the above operation, a plurality of exposure patterns P are formed on the substrate S in the longitudinal direction.

  As described above, the exposure apparatus according to the present embodiment is an exposure apparatus EX that irradiates the sheet-like substrate S with the exposure light ELI through the mask M so as to pass through the projection area PA of the exposure light ELI. A moving device (roller R1 to roller R6) that moves the substrate S, a substrate stage SST that is movably provided and has a substrate support surface 60 that holds the substrate S, and a substrate that is synchronized with the substrate S at least in the projection area PA. Since the drive unit ACT that drives the substrate stage SST to move in the same direction as S is provided, the substrate S can be held in a flat state while the substrate S is exposed. Thereby, the exposure apparatus EX excellent in exposure accuracy can be obtained.

[Second Embodiment]
Next, a second embodiment of the present invention will be described.
In the present embodiment, a device manufacturing system including the exposure apparatus EX described in the first embodiment will be described. FIG. 9 is a diagram showing a partial configuration of the device manufacturing system (flexible display manufacturing line) of the present embodiment. Here, the flexible substrate S (sheet, film, etc.) drawn out from the supply roll FR1 passes through n processing devices U1, U2, U3, U4, U5,. The example until it winds up to FR2 is shown.

  In FIG. 9, the orthogonal coordinate system XYZ is set so that the front surface (or back surface) of the substrate S is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate S is set to the Y direction. Shall be. The substrate S may be activated by modifying the surface in advance by a predetermined pretreatment, or may be formed with a fine partition structure (uneven structure) for precise patterning on the surface.

  The substrate S wound around the supply roll FR1 is pulled out by the nipped drive roller DR1 and transported to the processing apparatus U1. The center of the substrate S in the Y direction (width direction) is controlled by the edge position controller EPC1. Servo control is performed so as to be within a range of about ± 10 μm to several tens μm with respect to the position.

  The processing device U1 continuously or selects a photosensitive functional liquid (photoresist, photosensitive coupling material, UV curable resin liquid, etc.) on the surface of the substrate S by a printing method with respect to the transport direction (long direction) of the substrate S. It is the coating device which coats automatically. In the processing apparatus U1, a coating mechanism including a pressure drum DR2 around which the substrate S is wound, a coating roller for uniformly coating the photosensitive functional liquid on the surface of the substrate S on the pressure drum DR2. Gp1, a drying mechanism Gp2 for rapidly removing the solvent or moisture contained in the photosensitive functional liquid applied to the substrate S, and the like are provided.

  The processing device U2 heats the substrate S conveyed from the processing device U1 to a predetermined temperature (for example, about several tens of degrees Celsius to 120 ° C.) to stably fix the photosensitive functional layer applied on the surface. It is a heating device. In the processing apparatus U2, a plurality of rollers and an air turn bar for returning and conveying the substrate S, a heating chamber HA1 for heating the loaded substrate S, and the temperature of the heated substrate S, A cooling chamber HA2 and a nipped drive roller DR3 are provided for lowering the temperature so as to match the environmental temperature of the post-process (processing device U3).

  The processing device U3 is an exposure device EX that irradiates the photosensitive functional layer of the substrate S conveyed from the processing device U2 with ultraviolet patterning light corresponding to the circuit pattern and wiring pattern for display. As the exposure apparatus EX, the exposure apparatus EX described in the first embodiment is used. In the processing apparatus U3, an edge position controller EPC that controls the center of the substrate S in the Y direction (width direction) to a fixed position, a nipped drive roller DR4, and the back surface of the substrate S that is conveyed in the X direction with a predetermined tension Are provided with a substrate transport device ST which is plane-supported by an air bearing layer, and two sets of drive rollers DR6 and DR7 for giving a predetermined slack (play) DL to the substrate S.

  The processing apparatus U4 of FIG. 9 is a wet processing apparatus that performs wet development processing, electroless plating processing, and the like on the photosensitive functional layer of the substrate S conveyed from the processing apparatus U3. In the processing apparatus U4, three processing tanks BT1, BT2, and BT3 layered in the Z direction, a plurality of rollers that fold and convey the substrate S, a nip driving roller DR8, and the like are provided.

  The processing device U5 is a heating and drying device that warms the substrate S transported from the processing device U4 and adjusts the moisture content of the substrate S wet by the wet process to a predetermined value, but the details are omitted. After that, the substrate S that has passed through several processing apparatuses and passed through the last processing apparatus Un of the series of processes is wound up on the collection roll FR2 via the nipped drive roller DR1. Also during the winding, the edge position controller EPC2 controls the Y of the drive roller DR1 and the recovery roll FR2 so that the center in the Y direction (width direction) of the substrate S or the substrate end in the Y direction does not vary in the Y direction. The relative position in the direction is successively corrected and controlled.

  The host controller 5 controls the operation of the processing devices U1 to Un constituting the production line, monitors the processing status and processing status of the processing devices U1 to Un, and the substrate S between the processing devices. It also monitors the conveyance status, and performs feedback correction and feedforward correction based on the results of prior and subsequent inspections and measurements.

  The board | substrate S used by this embodiment is foil (foil) etc. which consist of metals or alloys, such as a resin film and stainless steel, for example. The material of the resin film is, for example, one of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Or two or more.

  As the substrate S, it is desirable to select a substrate whose coefficient of thermal expansion is not remarkably large so that the amount of deformation caused by heat in various processing steps can be substantially ignored. The thermal expansion coefficient may be set smaller than a threshold corresponding to the process temperature or the like, for example, by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. The substrate S may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float process or the like, or a laminate in which the above resin film, foil, or the like is bonded to the ultrathin glass. It may be.

  The device manufacturing system 1 according to the present embodiment repeatedly or continuously executes various processes for manufacturing a device (display panel or the like) on the substrate S. The substrate S that has been subjected to various types of processing is divided (diced) for each device to form a plurality of devices. As for the dimension of the substrate S, for example, the dimension in the width direction (short Y direction) is about 10 cm to 2 m, and the length direction (long X direction) is 10 m or more.

  As described above, according to this embodiment, since the exposure apparatus EX excellent in exposure accuracy is mounted, the display element can be manufactured on the belt-like substrate S with high accuracy.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, in the above-described embodiment, the configuration in which the roller R2 and the roller R5 are used as the configuration for applying tension to the substrate S has been described as an example, but the configuration is not limited thereto.

  For example, as illustrated in FIG. 10, a suction unit 51 that sucks a portion of the substrate S between the roller R1 and the roller R3 and a suction unit 52 that sucks a portion between the roller R4 and the roller R6 are provided. It is also possible to have a configuration. In this configuration, the suction source of the suction part 51 and the suction part 52 may be shared with the suction source of the suction hole 61 of the substrate stage SST, or a separate suction source may be provided.

  Further, as shown in FIG. 11, the roller R5 may be arranged between the substrate stage SST and the roller R4. In this configuration, since tension can be applied to the substrate S supported by the substrate stage SST in the vicinity of the substrate stage SST, the state of the substrate S on the substrate support surface 60 can be made flatter. it can.

  Further, as shown in FIG. 12, a configuration in which a roller R <b> 6 that presses a portion of the substrate S supported by the substrate support surface 60 against the substrate support surface 60 may be provided. With this configuration, since the substrate S is directly pressed against the substrate support surface 60, the substrate S on the substrate support surface 60 can be made flatter.

  Further, as shown in FIG. 13, the clamp mechanism 53 and the clamp mechanism 54 that sandwich the substrate S may be provided on both sides of the substrate stage SST in the X direction. The clamp mechanism 53 and the clamp mechanism 54 have an insertion part 53a for inserting the substrate S and an insertion part 54a. The insertion part 53a and the insertion part 54a are inserted so as to penetrate the substrate S in the X direction. The clamp mechanism 53 and the clamp mechanism 54 can be rotated in the θY direction by the rotation mechanism 53b and the rotation mechanism 54b. The clamp mechanism 53 and the clamp mechanism 54 can extend the substrate S supported by the substrate support surface 60 in the X direction by rotating in the θY direction with the substrate S inserted in the insertion portion 53a and the insertion portion 54a. it can. For this reason, the board | substrate S arrange | positioned on the board | substrate support surface 60 can be made flatter.

  In the above-described embodiment, the configuration in which only one substrate stage SST is provided has been described as an example. However, the configuration is not limited thereto, and a configuration in which a plurality of substrate stages SST are provided may be used. . In this case, a plurality of substrate stages SST can be alternately configured to support and transport the substrate S.

EX ... exposure apparatus ELI ... exposure light S ... substrate PA ... projection area ACT ... driving unit A1 ... upstream position A2 ... downstream position R1-R6 ... roller U3 ... processing device SST ... substrate stage 51, 52 ... suction unit 53, 54 ... Clamp mechanism 53a, 54a ... Insertion part 53b, 54b ... Rotating mechanism 60 ... Substrate support surface 61 ... Suction hole

Claims (23)

An exposure apparatus that irradiates a sheet-like substrate with exposure light through a mask,
A moving device for moving the substrate so as to pass through the irradiation region of the exposure light;
A stage provided movably and having a holding surface for holding the substrate;
An exposure apparatus comprising: a driving device that drives the stage so as to move in the same direction as the substrate in synchronization with the substrate at least in the irradiation region. The exposure apparatus according to claim 1, wherein the moving device includes a moving mechanism that pushes the substrate toward the stage. The exposure apparatus according to claim 1, wherein the moving device includes a second moving mechanism that pulls the substrate in a direction parallel to a moving direction of the substrate. The exposure apparatus according to claim 1, wherein the moving device includes a third moving mechanism that tilts the substrate with respect to the holding surface. The exposure apparatus according to any one of claims 1 to 4, wherein the moving device includes a guide mechanism that guides the substrate to the stage. The exposure apparatus according to claim 5, wherein the guide mechanism includes a guide member provided on at least one of an upstream side and a downstream side of the stage in the moving direction of the substrate. The guide member has a guide portion provided so as to sandwich the front and back of the substrate,
The exposure apparatus according to claim 6, further comprising a rotation mechanism that rotates the guide member. The exposure apparatus according to any one of claims 1 to 7, wherein the holding surface is formed flat. The exposure apparatus according to any one of claims 1 to 8, wherein the stage includes a suction portion that is formed on the holding surface and sucks the substrate. A plurality of the stages are provided,
The exposure apparatus according to any one of claims 1 to 9, wherein the driving device drives each of the stages so that the plurality of stages move alternately in the irradiation region. The exposure apparatus according to any one of claims 1 to 10, wherein the driving apparatus drives the stage so that the stage that has passed through the irradiation region is returned to an original position. An exposure method for irradiating a sheet-like substrate with exposure light through a mask,
A moving step of moving the substrate so as to pass through the irradiation region of the exposure light;
A driving step of driving a stage having a holding surface for holding the substrate so as to move in the same direction as the substrate in synchronization with the substrate at least in the irradiation region. The exposure method according to claim 12, wherein the moving step includes pushing the substrate toward the stage. The exposure method according to claim 12 or 13, wherein the moving step includes pulling the substrate in a direction parallel to a moving direction of the substrate. The exposure method according to any one of claims 12 to 14, wherein the moving step includes tilting the substrate with respect to the holding surface. The exposure method according to any one of claims 12 to 15, wherein the moving step includes a guide step of guiding the substrate to the stage. The exposure method according to claim 16, wherein the guiding step includes guiding the substrate using a guide member provided on at least one of an upstream side and a downstream side of the stage in a moving direction of the substrate. The guiding process includes
Sandwiching the substrate by a guide portion provided on the guide member so as to sandwich the front and back of the substrate;
The exposure method according to claim 17, further comprising: rotating the guide member with the substrate sandwiched therebetween. The exposure method according to any one of claims 12 to 18, wherein the driving step includes holding the substrate by the holding surface formed flat. The exposure method according to any one of claims 12 to 19, wherein the driving step includes attracting the substrate to the holding surface. The exposure method according to any one of claims 12 to 20, wherein the driving step includes driving each of the stages so that a plurality of the stages are alternately moved in the irradiation region. . The exposure method according to any one of claims 12 to 21, wherein the driving step includes driving the stage so that the stage that has passed through the irradiation region is returned to an original position. A substrate transport section for transporting the substrate;
A substrate processing section for processing the substrate,
The said substrate processing part has an exposure apparatus as described in any one of Claims 1-11. A substrate processing apparatus.

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