JP2013201352A - Manufacturing method and connection method of connected body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To save a space for a substrate and perform alignment adjustment between connection terminals accurately in a short time.SOLUTION: First connection terminals 28 are formed in a light-transmissive substrate 22, light-reflective second connection terminals 18 which are to be connected to the first connection terminals 28 and has an area larger than the first connection terminals 28 are formed on a connection target 12. The light-transmissive substrate 22 is arranged on the connection target 12, the first connection terminals 28 are placed above the second connection terminal 18, light is radiated from the light-transmissive substrate 22 side, alignment of the light-transmissive substrate 22 and the connection target 12 is performed such that reflected light from the second connection terminals 18 passes through the periphery of the first connection terminals 28, and the aligned light-transmissive substrate 22 and connection target 12 are connected.

Description

  The present invention relates to a method of manufacturing a connection body in which a substrate having optical transparency is connected to an object to be connected, and a method of connecting the substrate having optical transparency to the object to be connected, and particularly to connection with the substrate having optical transparency. The present invention relates to alignment adjustment of both connection terminals with an object.

  Conventionally, when connecting a rigid substrate such as a glass substrate or a glass epoxy substrate and a flexible substrate, or connecting flexible substrates to each other, anisotropic conductive material in which conductive particles are dispersed in an insulating adhesive composition An adhesive is used. When connecting the connection terminal of the flexible substrate and the connection terminal of the rigid substrate, an anisotropic conductive adhesive is disposed between the regions where the connection terminals of both the substrates are formed, and heat-pressed. Then, the insulating adhesive composition exhibits fluidity and is discharged from between the connection terminal of the flexible substrate and the connection terminal of the rigid substrate, and the conductive particles in the anisotropic conductive adhesive are between the connection terminals. It is pinched and crushed.

  As a result, the connection terminal of the flexible substrate and the connection terminal of the rigid substrate are electrically connected via the conductive particles, and the insulating adhesive composition is cured in this state. The conductive particles that are not between the connection terminals are dispersed in the insulating adhesive composition, and maintain an electrically insulated state. Thereby, electrical conduction is achieved only between the connection terminal of the flexible substrate and the connection terminal of the rigid substrate.

JP 2004-128324 A

  Here, in recent years, with the miniaturization and high performance of electronic devices, the fine pitches of terminal electrodes of electronic components and wiring electrodes of substrates have been promoted. A good conduction resistance value is obtained when substrates having terminal electrodes formed at a fine pitch, or substrates having terminal electrodes formed at a fine pitch and an electronic component are connected via an anisotropic conductive film. For this purpose, the connection terminals need to be accurately connected in a wide area. For this reason, highly accurate alignment (alignment adjustment) between the substrates or between the substrate and the electronic component is required.

  For this type of alignment adjustment, a method of mechanically aligning using an alignment mark has been generally used. However, in order to install the alignment mark, it is necessary to secure an installation area on the substrate, and there is a problem in that the degree of freedom of design is hindered particularly on a substrate that is required to be reduced in size and space.

  In addition, in the case where a large number of products are produced in small quantities, for example, between substrates or substrates and electronic components, since the merit of automation is small, manual alignment adjustment may be performed. For example, when connecting a flexible substrate to a rigid substrate such as a glass substrate, first, an anisotropic conductive film is temporarily pasted on a terminal region where a plurality of connection terminals of the glass substrate are formed. Next, the flexible substrate was opposed to the terminal region, and the X direction, the Y direction, and the inclination θ direction of both substrates were adjusted manually so that the connection terminal of the glass substrate and the connection terminal of the flexible substrate overlapped. Thereafter, the flexible substrate is pressed onto the glass substrate and temporarily fixed.

  However, it is difficult to accurately adjust the alignment between the connection terminals, and particularly when the fine pitch of the wiring electrodes is advanced, considerable skill and time are required.

  Accordingly, an object of the present invention is to provide a connection body manufacturing method and a connection method that can save space on a substrate and can accurately perform alignment adjustment between connection terminals in a short time.

  In order to solve the above-described problem, a connection body manufacturing method according to the present invention is a connection body manufacturing method in which a light-transmitting substrate is connected to a connection object, wherein the light-transmitting substrate is a first connection. A terminal is formed, and the connection object is formed with a light-reflective second connection terminal that is connected to the first connection terminal and has a larger area than the first connection terminal. A substrate is placed on the connection object, the first connection terminal is overlaid on the second connection terminal, light is irradiated from the light-transmitting substrate side, and reflected light from the second connection terminal Aligns the light-transmitting substrate and the connection object so that the light is transmitted from the periphery of the first connection terminal, and connects the aligned light-transmitting substrate and the connection object. It is.

  Further, the connection method according to the present invention is a connection method between a light transmissive substrate and a connection object to be connected to the light transmissive substrate, wherein the light transmissive substrate has a first connection terminal formed thereon, The connection object is formed with a light-reflective second connection terminal that is connected to the first connection terminal and has a larger area than the first connection terminal, and the light-transmitting substrate is connected to the connection object. The first connection terminal is placed on the second connection terminal, the light is irradiated from the light transmitting substrate side, and the reflected light from the second connection terminal is reflected on the first connection terminal. The light transmissive substrate and the connection object are aligned so as to be transmitted from the periphery of the terminal, and the aligned light transmissive substrate and the connection object are connected.

  According to the present invention, in the connection between the connection object and the light transmissive substrate, the surface of the second connection terminal is covered with a reflective material, and the first connection terminal formed on the light transmissive substrate is used. In addition, by irradiating light from the upper side of the light transmissive substrate, the reflected light from the second connection terminal is transmitted and observed from both sides of the first connection terminal. Therefore, according to the present invention, it is possible to save the space of the connection object and the light-transmitting substrate without separately using an alignment mark, and the first connection terminal and the second connection terminal have the same width. Compared to the case, the alignment adjustment between the connection object and the light-transmitting substrate can be performed quickly and accurately.

It is sectional drawing which shows the liquid crystal display panel which becomes an example of the connection body to which this invention was applied. It is a perspective view which shows the structure which carries out ACF connection of the terminal part of a transparent substrate, and the connection terminal of a flexible substrate. It is a top view which shows the connection method to which this invention was applied. It is a top view which shows the other connection method to which this invention was applied. It is a top view which shows the other connection method to which this invention was applied. It is a top view which shows the other connection method to which this invention was applied. It is a top view which shows a comparative example. It is a top view which shows a comparative example.

  Hereinafter, a connection body manufacturing method and a connection method to which the present invention is applied will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

[LCD panel]
A method for manufacturing a connection body to which the present invention is applied is a method for manufacturing a connection body in which a light-transmitting substrate is connected to a connection object, such as a television, a PC monitor, a mobile phone, a portable game machine, and a tablet. The present invention can be used for manufacturing a liquid crystal display panel serving as various display means such as a terminal or a vehicle-mounted monitor. In such a liquid crystal display panel, so-called FOG (film on glass) that directly mounts a flexible substrate on which a liquid crystal driving circuit is formed on the substrate of the liquid crystal display panel is adopted from the viewpoints of fine pitch, light weight and thinning. Has been.

  As shown in FIG. 1, the liquid crystal display panel 10 has two transparent substrates 11, 12 made of a glass substrate or the like arranged opposite to each other, and these transparent substrates 11, 12 are bonded to each other by a frame-shaped seal 13. In the liquid crystal display panel 10, the liquid crystal 14 is sealed in a space surrounded by the transparent substrates 11 and 12 to form a panel display unit 15.

  The transparent substrates 11 and 12 have a pair of striped transparent electrodes 16 and 17 made of ITO (indium tin oxide) or the like on both inner surfaces facing each other so as to intersect each other. The transparent electrodes 16 and 17 are configured such that a pixel as a minimum unit of liquid crystal display is configured by the intersection of the transparent electrodes 16 and 17.

  Of the transparent substrates 11 and 12, one transparent substrate 12 is formed to have a larger planar dimension than the other transparent substrate 11, and a liquid crystal driving edge is formed on the edge 12a of the formed transparent substrate 12. A COG mounting portion 21 on which an electronic component 19 such as an IC is mounted is provided, and an FOG mounting portion 23 on which a flexible substrate 22 on which a liquid crystal driving circuit is formed is mounted near the outside of the COG mounting portion 21. ing.

  Note that the liquid crystal driving IC and the liquid crystal driving circuit can perform predetermined liquid crystal display by selectively changing the alignment of the liquid crystal by selectively applying the liquid crystal driving voltage to the pixels. ing.

  Each mounting part 21, 23 is formed with a terminal part 18 of the transparent electrode 17. A metal plating layer 20 such as gold plating is formed on the surface of the terminal portion 18 and has light reflectivity. Moreover, as shown in FIG. 2, the terminal part 18 is formed in, for example, a substantially rectangular shape, and a plurality of terminal parts 18 are formed in a direction orthogonal to the longitudinal direction.

  The terminal portion 18 is connected to an electronic component 19 such as a liquid crystal driving IC and a flexible substrate 22 using the anisotropic conductive film 1 as a conductive adhesive. The anisotropic conductive film 1 contains conductive particles, and the electrode of the electronic component 19 or the flexible substrate 22 and the terminal portion 18 of the transparent electrode 17 formed on the edge portion 12a of the transparent substrate 12 are electrically conductive. Electrical connection is made through particles. The anisotropic conductive film 1 is a thermosetting / thermoplastic or ultraviolet curable adhesive, which is fluidized by thermocompression bonding with a heating and pressing head 40 described later, so that the conductive particles are connected to the terminal portions 18. It is crushed between the electronic component 19 and each electrode of the flexible substrate 22 and cured in a state where the conductive particles are crushed by heating or ultraviolet irradiation. Thereby, the anisotropic conductive film 1 electrically and mechanically connects the transparent substrate 12 to the electronic component 19 and the flexible substrate 22.

  Further, an alignment film 24 subjected to a predetermined rubbing process is formed on both the transparent electrodes 16 and 17, and the initial alignment of liquid crystal molecules is regulated by the alignment film 24. In addition, a pair of polarizing plates 25 and 26 are disposed outside the transparent substrates 11 and 12, and these polarizing plates 25 and 26 allow transmitted light from a light source (not shown) such as a backlight to be transmitted. The vibration direction is regulated.

[Flexible substrate]
The flexible substrate 22 connected to the terminal portion 18 of the transparent substrate 12 is connected to the terminal portion 18 as shown in FIG. 2 on a substrate 27 having flexibility such as polyimide and having light transmission properties. A plurality of connection terminals 28 are arranged. The connection terminal 28 is formed, for example, by patterning a copper foil or the like and appropriately performing a plating coating process such as nickel gold plating. Like the terminal portion 18, the connection terminal 28 is formed in, for example, a substantially rectangular shape and orthogonal to the longitudinal direction. A plurality of arrays are formed in the direction of the direction.

  In the flexible substrate 22, the connection terminals 28 are connected to the terminal portions 18 of the transparent substrate 12 through the anisotropic conductive film 1. At this time, the flexible substrate 22 overlaps the connection terminal 28 on the terminal portion 18, irradiates light from the upper side, and the reflected light transmitted through the flexible substrate 22 and reflected by the terminal portion 18 of the transparent substrate 12 is connected to the connection terminal. Alignment adjustment with the transparent substrate 12 is performed so that it may permeate | transmit from the circumference | surroundings of 28. FIG.

  For this reason, the terminal part 18 of the transparent substrate 12 connected via the anisotropic conductive film 1 and the connection terminal 28 of the flexible substrate 22 are formed such that the terminal part 18 has a larger area than the connection terminal 28. . As shown in FIG. 2, when the terminal portion 18 and the connection terminal 28 are each formed in a rectangular shape, the terminal portion 18 is formed wider than the connection terminal 28. Thereby, the flexible substrate 22 can adjust the alignment with the transparent substrate 12 by allowing the reflected light of the terminal portion 18 to be uniformly transmitted from both sides in the width direction of the connection terminal 28 superimposed on the terminal portion 18. You can see that

  As described above, in the connection between the transparent substrate 12 and the flexible substrate 22, the surface of the terminal portion 18 is covered with a reflective material, and the area is larger than the connection terminal 28 formed on the flexible substrate 22 having optical transparency. By irradiating light from the upper side of the flexible substrate 22, reflected light from the terminal portion 18 is transmitted and observed from both sides of the connection terminal 28. Therefore, according to this connection, the space of the transparent substrate 12 and the flexible substrate 22 is reduced without using alignment marks, and the flexible substrate 22 is compared with the case where the terminal portion and the connection terminal have the same width. And the transparent substrate 12 can be quickly and accurately adjusted.

  The connection terminal 28 of the flexible substrate 22 is formed to have a width of 10% to 80% of the width of the terminal portion 18. If the width of the connection terminal 28 is narrower than 10% of the width of the terminal portion 18, it is difficult to visually recognize the connection terminal 28, and if the width of the connection terminal 28 is larger than 80% of the width of the terminal portion 18, It is difficult to visually recognize the reflected light, and it is impossible to adjust the alignment between the flexible substrate 22 and the transparent substrate 12 quickly and accurately.

  3 to 6 show a state where alignment adjustment of the transparent substrate 12 and the flexible substrate 22 is performed. 3 to 6, the light-transmitting flexible substrate 22 is not shown for convenience, and only the connection terminal 28 is shown on the terminal portion 18.

  As shown in FIG. 3, when a plurality of the terminal portions 18 and the connection terminals 28 are arranged in the direction orthogonal to the longitudinal direction, the transparent substrate 12 and the flexible substrate 22 are one side in the arrangement direction among these terminals. Alternatively, a plurality of terminal portions 18 and connection terminals 28 formed on both sides in the arrangement direction are used as alignment adjustment terminals. Thereby, the transparent substrate 12 and the flexible substrate 22 can perform alignment adjustment quickly and accurately as compared with the case where the terminal portion and the connection terminal are formed with the same width.

  The transparent substrate 12 and the flexible substrate 22 are formed by using the terminal portions 18 and the connection terminals 28 formed on one side in the arrangement direction of the terminal portions 18 and the connection terminals 28 or on both sides in the arrangement direction as terminals for alignment adjustment. The alignment can be adjusted over the entire region where the terminal portions 18 and the connection terminals 28 are formed, and a wide connection area can be secured for all the terminal portions 18 and the connection terminals 28.

  In addition, the transparent substrate 12 and the flexible substrate 22 include a plurality of terminal portions 18 and connection terminals 28 formed on one side in the arrangement direction of the terminal portions 18 and connection terminals 28 or on both sides in the arrangement direction as alignment adjustment terminals. By doing so, it becomes possible to perform alignment adjustment in consideration of the tendency of the formation error of each pattern of the terminal portion 18 and the connection terminal 28. That is, the tendency of the pattern error can be understood from the balance of the reflected light from both sides of the plurality of terminal portions 18, and the connection area of all the terminal portions 18 and the connection terminals 28 can be more reliably increased by taking the tendency of the pattern error into consideration. Widely secured.

  Here, as shown in FIG. 3, the flexible substrate 22 has a plurality of connection terminals 28 arranged in the same area. In addition, the transparent substrate 12 and the flexible substrate 22 are electrically connected to each other with the plurality of terminal portions 18 and connection terminals 28 formed on one side or both sides of the plurality of arranged terminal portions 18 and connection terminals 28. The conductive terminals 18a and 28a, and the alignment adjustment terminals 18b and 28b of the transparent substrate 12 and the flexible substrate 22 are also used. In addition, the transparent substrate 12 and the flexible substrate 22 have the other terminal portions 18 and the connection terminals 28 as conduction terminals 28a.

  The transparent substrate 12 and the flexible substrate 22 can save space without using alignment marks, since the terminal portions 18 and the connection terminals 28 serve as both conductive terminals and alignment adjustment terminals.

  The transparent substrate 12 and the flexible substrate 22 include a plurality of terminal portions 18 and connection terminals 28 formed on one side or both sides of the plurality of arranged terminal portions 18 and connection terminals 28, and dedicated terminals for alignment adjustment. 18b and 28b may be used.

  In addition, the transparent substrate 12 and the flexible substrate 22 include only the terminal portions 18 and the connection terminals 28 provided at one or both ends of the plurality of arranged terminal portions 18 and connection terminals 28, and the dedicated terminals 18 b and 18 b for alignment adjustment. 28b, or conductive terminals 18a and 28a and alignment adjusting terminals 18b and 28b.

  As shown in FIG. 4, the transparent substrate 12 has an area of the plurality of terminal portions 18 formed on one side or both sides of the plurality of arranged terminal portions 18 from the area of the connection terminals 28 of the flexible substrate 22. The area of the other terminal portion 18 may be the same as that of the connection terminal 28. At this time, in the transparent substrate 12 and the flexible substrate 22, the plurality of terminal portions 18 and connection terminals 28 formed on one side or both sides serve as conduction terminals 18 a and 28 a and alignment adjustment terminals 18 b and 28 b. Further, in the transparent substrate 12 and the flexible substrate 22, the other terminal portions 18 and connection terminals 28 having the same area are set as conduction terminals 18 a and 28 a.

  The transparent substrate 12 and the flexible substrate 22 can improve the electrical conduction reliability between the terminal portion 18 and the connection terminal 28 by setting the conduction terminals 18a and 28a to the same area. Further, since the transparent substrate 12 and the flexible substrate 22 all have the same area of the connection terminal 28, even when the connection terminal 28a is also used as the alignment adjustment terminal 28b, the electrical conduction reliability with the terminal portion 18 is ensured. There is no loss of sex.

  In the configuration shown in FIG. 4, the transparent substrate 12 and the flexible substrate 22 include the terminal portions 18 and the connection terminals 28 formed on one side or both sides of the plurality of arranged terminal portions 18 and connection terminals 28. Dedicated terminals 18b and 28b for alignment adjustment may be used.

  Further, in the configuration shown in FIG. 4, the transparent substrate 12 and the flexible substrate 22 include only the terminal portions 18 and the connection terminals 28 provided at one or both ends of the plurality of arranged terminal portions 18 and connection terminals 28. The dedicated terminals 18b and 28b for alignment adjustment may be used, or the conductive terminals 18a and 28a and the alignment adjustment terminals 18b and 28b may be used.

  Further, as shown in FIG. 5, the transparent substrate 12 may have a plurality of arranged terminal portions 18 all having the same area. At this time, in the flexible substrate 22, the area of the plurality of connection terminals 28 formed on one side or both sides of the plurality of connection terminals 28 is larger than the area of the other connection terminals 28 having the same area as the terminal portion 18. Is also made smaller. In the transparent substrate 12 and the flexible substrate 22, a plurality of terminal portions 18 and connection terminals 28 formed on one side or both sides serve as conduction terminals 18 a and 28 a and alignment adjustment terminals 18 b and 28 b. Further, in the transparent substrate 12 and the flexible substrate 22, the other terminal portions 18 and connection terminals 28 having the same area are set as conduction terminals 18 a and 28 a.

  The transparent substrate 12 and the flexible substrate 22 can improve the electrical conduction reliability between the terminal portion 18 and the connection terminal 28 by setting the conduction terminals 18a and 28a to the same area.

  In the configuration shown in FIG. 5, the transparent substrate 12 and the flexible substrate 22 include the terminal portions 18 and connection terminals 28 formed on one side or both sides of the plurality of arranged terminal portions 18 and connection terminals 28. Dedicated terminals 18b and 28b for alignment adjustment may be used.

  Further, in the configuration shown in FIG. 5, the transparent substrate 12 and the flexible substrate 22 include only the terminal portions 18 and the connection terminals 28 provided at one or both ends of the plurality of arranged terminal portions 18 and connection terminals 28. The dedicated terminals 18b and 28b for alignment adjustment may be used, or the conductive terminals 18a and 28a and the alignment adjustment terminals 18b and 28b may be used.

  Further, as shown in FIG. 6, all the terminal portions 18 provided at one end or both ends of the terminal portion 18 of the transparent substrate 12 have the same area, and are provided at one end or both ends of the connection terminal 28 of the flexible substrate 22. Only the connection terminal 28 provided may be smaller than the area of the other connection terminal 28 having the same area as the terminal portion 18.

  At this time, the plurality of arranged terminal portions 18 and connection terminals 28 have the terminal portions 18 and connection terminals 28 provided at one or both ends as dedicated terminals 18b and 28b for alignment adjustment, and other terminal portions having the same area. Reference numeral 18 and the connection terminal 28 are conductive terminals 18a and 28a.

  Also in the configuration shown in FIG. 6, the transparent substrate 12 and the flexible substrate 22 can improve the electrical conduction reliability between the terminal portion 18 and the connection terminal 28 by making the conduction terminals 18 a and 28 a have the same area. it can.

  In the transparent substrate 12 and the flexible substrate 22, the terminal portions 18 and the connection terminals 28 provided at one end or both ends may be used as the conduction terminals 18a and 28a and the dedicated terminals 18b and 28b for alignment adjustment.

  3 to 6, the transparent substrate 12 and the flexible substrate 22 are provided as dedicated terminals 18b and 28b for alignment adjustment among the plurality of arranged terminal portions 18 and connection terminals 28. You may form the formation pitch of the terminal part 18 and the connection terminal 28 of the side or both sides narrower than the formation pitch of the other terminal part 18 and the connection terminal 28. FIG.

  As a result, the transparent substrate 12 and the flexible substrate 22 can save the space for forming the terminal portions 18 and the connection terminals 28. Moreover, since the terminal part 18 and the connection terminal 28 which were made into the exclusive terminals 18b and 28b for alignment adjustment do not have the problem of the short circuit between the terminal parts 18 by the electroconductive particle of the anisotropic conductive film 1, or between the connection terminals 28. Further, it is possible to reduce the pitch as long as alignment adjustment is not hindered.

  Further, the transparent substrate 12 and the flexible substrate 22 have a plurality of terminal portions 18 and connection terminals 28 used for alignment adjustment arranged in a direction orthogonal to the longitudinal direction, respectively, and as shown in FIGS. An orthogonal terminal portion 29 extending in the arrangement direction may be formed on the terminal portion 18 on one or both ends, and an orthogonal terminal portion 30 may be formed on the connection terminal 28 in the same manner.

  The orthogonal terminal portion 29 forms a part of the transparent electrode 17 and is formed at the same time as the terminal portion 18 in the same process and has light reflectivity. Further, the orthogonal terminal portion 30 is formed simultaneously with the connection terminal 28 in the same process. These orthogonal terminal portions 29 and 30 are for adjusting the inclination θ in the in-plane direction between the transparent substrate 12 and the flexible substrate 22, and have a similar shape, for example, a rectangular shape. Further, the orthogonal terminal portion 29 formed in the terminal portion 18 has a larger area than the orthogonal terminal portion 30 formed in the connection terminal 28.

  Similar to the terminal portion 18 and the connection terminal 28, the orthogonal terminal portions 29 and 30 are overlapped and irradiated with light from the flexible substrate 22 side, whereby reflected light from the orthogonal terminal portion 29 is reflected by the orthogonal terminal portion 30. The alignment with the transparent substrate 12 is adjusted so as to transmit evenly from the periphery of the substrate. Thereby, the transparent substrate 12 and the flexible substrate 22 can adjust the alignment of the inclination θ in the in-plane direction of the transparent substrate 12 and the flexible substrate 22.

  Further, the orthogonal terminal portions 29 and 30 are formed in the terminal portion 18 and the connection terminal 28 at the end portions on one side or both sides of the terminal portion 18 and the connection terminal 28 arranged in a plurality, so that all the terminal portions are formed. 18 and the inclination of the connection terminal 28 can be adjusted.

[Others]
In addition, although the liquid crystal display panel 10 was demonstrated to the example as a connection body above, this invention is applicable to manufacture of all the connection bodies to which a transparent substrate is connected. In the above description, the transparent substrate 12 and the flexible substrate 22 are connected by the anisotropic conductive film 1. However, the adhesive may be in the form of a film or a paste, and the insulating material does not contain conductive particles. An adhesive may be used.

  Next, examples of the present invention will be described. In this example, a flexible substrate (FPC) was superposed on a rigid wiring substrate (PWB) via an ACF to perform alignment adjustment, and then FPC was connected by hot pressing, and the number of particles captured was measured.

  PWB used glass epoxy base material FR-4 grade: MCL-E-67. This PWB has a thickness of 1.1 mm and is formed with a gold-plated Cu wiring having a thickness of 35 μm at a pitch of 200 μm (L / S = 1/1).

  As the FPC, NFX-2ABEPFE (25T) was used. In this FPC, a gold-plated Cu wiring having a thickness of 12 μm is formed on a polyimide substrate having a thickness of 25 μm at a pitch of 200 μm (L / S = 1/1).

  The adhesive used for the connection between the FPC and the PWB is ACF: DP3342MS manufactured by Sony Chemical & Information Device Corporation. This ACF contains gold / nickel plating resin particles having an average particle diameter of 10 μm.

  In the example and the comparative example, after the ACF was temporarily pasted on the PWB wiring pattern, the FPC alignment was adjusted and temporarily mounted on the PWB. For alignment adjustment, light was irradiated from the FPC side. The light source used was SZX-LGR66: manufactured by Olympus Corporation, and the light source intensity was the maximum intensity of the light source. The distance from the light source to the FPC is 10 cm. The alignment adjustment between the terminal portion of the PWB and the connection terminal of the FPC was performed using an Olympus Corporation stereo microscope SZX7 (magnification 100 times).

  After the alignment adjustment, the FPC was connected onto the PWB using a heating and pressing head. The heat and pressure conditions using ACF are 130 ° C., 2 MPa, and 6 seconds. The heating and pressing head is provided with a silicon rubber having a thickness of 0.2 mm as a buffer material.

  In the first embodiment, in the configuration shown in FIG. 3, each of the three terminal portions and the connection terminals formed on both sides are used as both a conduction terminal and an alignment adjustment terminal, and the other terminal portions and the connection terminals are conduction terminals. It was. And each three terminal part and connection terminal which were formed in both sides were observed with the microscope, and alignment adjustment was performed.

  In Example 2, in the configuration shown in FIG. 6, terminal portions and connection terminals formed at both ends were used as alignment adjustment terminals, and other terminal portions and connection terminals were used as conduction terminals. And the terminal part and connection terminal which were formed in the both ends were observed with the microscope, and alignment adjustment was performed.

  In Example 3, in the configuration shown in FIG. 5, terminal portions and connection terminals formed at both ends were used as alignment adjustment terminals, and other terminal portions and connection terminals were used as conduction terminals. And the terminal part and connection terminal which were formed in the both ends were observed with the microscope, and alignment adjustment was performed.

  In Example 4, in the configuration shown in FIG. 4, each of the three terminal portions and the connection terminals formed on both sides are used as the conduction terminal and the alignment adjustment terminal, and the other terminal portions and the connection terminals are the conduction terminals. It was. And each three terminal part and connection terminal which were formed in both sides were observed with the microscope, and alignment adjustment was performed.

  In Comparative Example 1, in the configuration shown in FIG. 7, the terminal portions 18 and the connection terminals 28 formed at both ends are used as alignment adjustment terminals 18b and 28b, and the other terminal portions 18 and the connection terminals 28 are connected as conduction terminals 18a and 28a. did. In FIG. 7, the terminal portions 18 formed on the PWB and the connection terminals 28 formed on the FPC are all formed to have the same width. And the terminal part 18b and the connection terminal 28b which were formed in both ends were observed with the microscope, and alignment adjustment was performed.

  In Comparative Example 2, in the configuration shown in FIG. 8, the terminal portions 18 and the connection terminals 28 formed at both ends are used as alignment adjustment terminals 18b and 28b, and the other terminal portions 18 and the connection terminals 28 are connected as conduction terminals 18a and 28a. did. In FIG. 8, the connection terminals 28 formed in the FPC are formed wider than the terminal portions 18 formed in the PWB. And the terminal part 18b and the connection terminal 28b which were formed in both ends were observed with the microscope, and alignment adjustment was performed.

  For these examples and comparative examples, the visibility of the PWB wiring, the alignment workability, and the number of particles trapped when the FPCs were stacked were measured. The visibility of the PWB wiring when the FPCs were stacked was evaluated as “◯” when the PWB wiring was easy to see through the FPC when light was applied from the FPC side and “×” when it was difficult to see. Alignment workability is when the difference between the terminal part and the connection terminal can be adjusted with an accuracy of 20% or less in less than 5 seconds, and when it takes 5 seconds or more, or the difference between the terminal part and the connection terminal. X was 21% or more. The number of particles captured was peeled off from the PWB after the FPC was pressure-bonded, and the number of conductive particles on the terminal portion was counted with an optical microscope. In addition, 20 or more conductive particles per terminal were rated as ◎, and 10 to 19 conductive particles per terminal were rated as ◯. In Table 1, when both the visibility of the PWB wiring and the alignment workability are ◯, and the number of particles trapped on the conductive terminal is ◎, it is determined as ◎, and either the visibility of the PWB wiring or the alignment workability is determined. On the other hand, the case of x was judged as x, and the others were judged as o. The results are shown in Table 1.

  As shown in Table 1, in Examples 1 to 4, all evaluation items of the visibility of the PWB wiring, the alignment workability, and the number of particles trapped were good. On the other hand, in Comparative Example 1 and Comparative Example 2, since the terminal portion formed in the PWB and the connection terminal formed in the FPC are all the same width or the connection terminal is formed wide, the visibility of the PWB wiring and The alignment workability was poor.

DESCRIPTION OF SYMBOLS 1 Anisotropic conductive film, 10 Liquid crystal display panel, 11 Transparent substrate, 12 Transparent substrate, 13 Seal, 14 Liquid crystal, 15 Panel display part, 16 Transparent electrode, 17 Transparent electrode, 18 Terminal part, 18a Conductive terminal, 18b Alignment adjustment Terminal, 19 electronic component, 20 metal plating layer, 21 COG mounting part, 22 flexible substrate, 23 FOG mounting part, 24 alignment film, 25 polarizing film, 26 polarizing film, 28 connecting terminal, 28a conduction terminal, 28b for alignment adjustment Terminal, 29 orthogonal terminal part, 30 orthogonal terminal part

Claims (16)

In the manufacturing method of the connection body in which the light transmissive substrate is connected to the connection object,
The light transmitting substrate has a first connection terminal formed thereon,
The connection object is formed with a light-reflective second connection terminal that is connected to the first connection terminal and has a larger area than the first connection terminal.
The light transmissive substrate is disposed on the connection object, the first connection terminal is overlaid on the second connection terminal,
Position alignment of the light transmissive substrate and the connection object so that light is irradiated from the light transmissive substrate side and reflected light from the second connection terminal is transmitted from the periphery of the first connection terminal. And
The manufacturing method of the connection body which connects the said optically transparent board | substrate and the said connection target object which were aligned. The light transmitting substrate has a plurality of the first connection terminals arranged,
The connection object manufacturing method according to claim 1, wherein the connection object includes a plurality of the second connection terminals.   Among the first and second connection terminals arranged in a plurality, the first and second connection terminals formed on one side or both sides in the arrangement direction are irradiated with light to perform alignment. Item 3. A method for manufacturing a connection body according to Item 2.   The method for manufacturing a connection body according to claim 3, wherein a plurality of the first connection terminals arranged on the light-transmitting substrate have the same area.   5. The connection body manufacturing method according to claim 4, wherein in the light transmissive substrate, the first connection terminal formed on one side or both sides serves also as a conduction terminal and an alignment terminal for the connection object. Method.   5. The method for manufacturing a connection body according to claim 4, wherein the first connection terminal formed on one side or both sides of the light-transmitting substrate is a terminal for alignment with the connection object.   In the connection object, the area of the second connection terminal connected to the first connection terminal provided on one side or both sides of the light-transmitting substrate is the same area as the first connection terminal. The manufacturing method of the connection body of Claim 4 larger than the area of the other 2nd connection terminal.   The connection object includes a second connection terminal connected to the first connection terminal provided on one side or both sides of the light transmissive substrate, and a terminal for alignment with a conduction terminal with the light transmissive substrate. 8. The method of manufacturing a connection body according to claim 7, wherein another second connection terminal having the same area as the first connection terminal is used as a conduction terminal with the light-transmitting substrate.   The connection object includes a second connection terminal connected to the first connection terminal provided on one side or both sides of the light-transmitting substrate as an alignment terminal with the light-transmitting substrate, The method for manufacturing a connection body according to claim 7, wherein another second connection terminal having the same area as the first connection terminal is used as a conduction terminal with the light transmissive substrate.   The light-transmitting substrate has an area of the first connection terminal formed on one side or both sides of the plurality of the first connection terminals arranged in the same area as the second connection terminal. The manufacturing method of the connection body of Claim 3 smaller than the area of the said 1st connection terminal.   11. The connection body manufacturing method according to claim 10, wherein in the light transmissive substrate, the first connection terminal formed on one side or both sides serves also as a conduction terminal and an alignment terminal for the connection object. Method.   The method of manufacturing a connection body according to claim 10, wherein the first connection terminal formed on one side or both sides of the light-transmitting substrate is a terminal for alignment with the connection object.   The manufacturing method of the connection body according to claim 12, wherein a pitch between the first connection terminals formed on one side or both sides of the light-transmitting substrate is narrower than a pitch between other first connection terminals. The first and second connection terminals have a rectangular shape,
Among the first and second connection terminals arranged in a plurality, the first and second connection terminals formed on one side or both sides are also formed with orthogonal terminal portions in a direction perpendicular to the longitudinal direction. The manufacturing method of the connection body of any one of Claims 2-13 currently performed.   The first and second connection terminals are connected via a conductive adhesive containing conductive particles in a binder or an insulating adhesive containing no conductive particles in a binder. The manufacturing method of the connection body of any one of Claims 14. In the method of connecting the light transmissive substrate and the connection object connected to the light transmissive substrate,
The light transmitting substrate has a first connection terminal formed thereon,
The connection object is formed with a light-reflective second connection terminal that is connected to the first connection terminal and has a larger area than the first connection terminal.
The light transmissive substrate is disposed on the connection object, the first connection terminal is overlaid on the second connection terminal,
Position alignment of the light transmissive substrate and the connection object so that light is irradiated from the light transmissive substrate side and reflected light from the second connection terminal is transmitted from the periphery of the first connection terminal. And
A connection method for connecting the aligned optically transparent substrate and the connection object.

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