JP2013243053A - Connection structure for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection structure for an electronic component capable of preventing unsteadiness of a bus bar to a housing without increasing the size of the bus bar.SOLUTION: An LED unit 11 comprises: a semiconductor light-emitting element 29; a pair of bus bars 13 connected to the semiconductor light-emitting element 29; a core member 15 held between the pair of bus bars 13; a housing 17 having a bus bar housing chamber 25 to which the semiconductor light-emitting element 29, the pair of bus bars 13, and the core member 15 are mounted; and a thermal contraction tube 59 fixing the core member 15 and the pair of bus bars 13 by being wound around the outer periphery of the pair of bus bars 13 holding the core member 15, and arranged in a gap between the bus bar housing chamber 25 and the bus bar 13.

Description

  The present invention relates to a connection structure for electronic components.

  Patent Document 1 discloses a connection structure for an electronic component that obtains high reliability by reliably performing electrical connection of the electronic component. As shown in FIG. 12, in this electronic component connection structure, a pair of bus bars 501 and 503 are assembled in a housing and a semiconductor light emitting element (LED) 505 as a light source is assembled. The bus bars 501 and 503 having a flat plate shape and divided into two include an electric wire connection portion 507, a Zener diode connection portion 509, a resistor connection portion 511, and an LED connection portion 513. The resistor connection portion 511 is provided with press contact blades 515 and 515 in each of the bus bars 501 and 503 divided into two. In the Zener diode connection portion 509, a single press contact blade 517 is provided on one bus bar 501, and a single press contact blade 519 is provided on the other bus bar 503.

  The zener diode 521 is configured such that one lead portion 523 is electrically connected to one bus bar 501 and the other lead portion 525 is electrically connected to the other bus bar 503, so that a pair of bus bars 501, 503 is connected in parallel and protects the LED from sudden high voltage applied to the circuit due to static electricity in the direction in which the forward electromotive force flows in the diode from destruction, and prevents energization in the direction in which the counter electromotive force flows in the diode. It also serves to protect the LED from destruction.

JP 2007-149762 A

  However, in the electronic component connection structure described above, a pair of bus bars 501 and 503 that are bent and formed by sheet metal processing are assembled in a housing formed of a resin material. Therefore, molding tolerances due to resin molding, processing tolerances due to sheet metal processing, and assembly tolerances are accumulated, and there is a risk of rattling in the bus bars 501 and 503 mounted in the housing. On the other hand, if the bus bars 501 and 503 themselves are provided with a spring structure that absorbs rattling, the bus bars 501 and 503 become large, and there is a problem that the entire unit becomes large.

  The present invention has been made in view of the above situation, and an object of the present invention is to provide a connection structure for an electronic component that can prevent rattling of the bus bar relative to the housing without increasing the size of the bus bar.

The above object of the present invention is achieved by the following configuration.
(1) An electronic component, a pair of bus bars that are conductively connected to the electronic component, an insulating spacing member that is sandwiched between the pair of bus bars, the electronic component, the pair of bus bars, and the spacing A housing having a bus bar housing chamber to which the holding member is mounted, and the space holding member and the pair of bus bars are fixed by being wound around an outer periphery of the pair of bus bars sandwiching the space holding member. An electronic component connection structure comprising: a tightening member disposed in a gap between the storage chamber and the bus bar.

  According to the connection structure of the electronic component having the configuration (1), the gap holding member is sandwiched between the pair of bus bars and is tightened by the fastening members wound around the outer periphery of the bus bar. (Fixed). Thereby, the variation in the separation distance between the bus bars is suppressed only by the forming tolerance of the spacing member. In addition, the pair of bus bars having the tightening member wound around the outer periphery is mounted in the bus bar housing chamber of the housing, whereby the tightening member is disposed in the gap between the bus bar and the housing. As a result, the backlash of the bus bar with respect to the housing, which has conventionally occurred due to the gap with the bus bar housing chamber, is reduced or eliminated by the intervention of the tightening member.

(2) An electronic component connection structure according to (1), wherein the fastening member is a heat shrinkable tube.

  According to the connection structure of the electronic component having the configuration (2) above, the tightening member becomes a heat shrinkable tube, so that the mounting work on the outer periphery of the bus bar can be performed as compared with a tightening member such as a rubber tube that needs to be expanded. It becomes easy. Further, the diameter reduction work can be easily realized by heating.

(3) The electronic component connection structure according to (1) or (2) above, wherein the contact spring piece of one of the bus bars and the contact spring piece of the other bus bar are sandwiched by sandwiching the interval holding member. An electronic component connection structure, wherein the contact spring pieces are arranged to face each other, and a pair of contact portions provided on both side surfaces of the electronic component are conductively connected to the contact spring pieces.

  According to the electronic component connection structure having the configuration (3), the pair of bus bars are fixed with the interval holding member interposed therebetween, and the distance between the pair of bus bars is set with high accuracy. By setting the separation distance between the pair of bus bars with high accuracy, reliable connection of each contact spring piece to the contact portion provided on both side surfaces of the electronic component is realized. Thereby, the electrical contact reliability of a bus bar and an electronic component is improved.

  According to the electronic component connection structure of the present invention, it is possible to prevent rattling of the bus bar relative to the housing without increasing the size of the bus bar.

  The present invention has been briefly described above. Further, the details of the present invention will be further clarified by reading through a mode for carrying out the invention described below (hereinafter referred to as “embodiment”) with reference to the accompanying drawings. .

It is a disassembled perspective view of the LED unit which concerns on the connection structure of the electronic component of one Embodiment of this invention. It is an enlarged view of a pair of bus bar shown in FIG. (A) is a perspective view of a semiconductor light emitting element, (b) is a perspective view of a Zener diode. It is a cross-sectional view in the electronic component mounting part of a pair of bus bar of the state which mounted | wore the electronic component. It is a figure explaining the electronic component assembly | attachment process of the LED unit which pinches | interposes a space | interval holding member between a pair of bus bars. (A) is a top view before heat shrinkable tube diameter reduction, (b) is a top view after heat shrinkable tube diameter reduction. It is a figure explaining the bus-bar assembly | attachment process which inserts into a housing a pair of bus-bar fixed to the space | interval holding member with the heat contraction tube. It is a perspective view which shows the state with which a pair of bus bar was mounted | worn with the housing. It is a figure explaining the electric wire holder assembly | attachment process which inserts an electric wire holder in a housing. It is a top view of the housing by which the heat contraction tube was arrange | positioned in the clearance gap with a bus-bar. It is a whole perspective view of the LED unit with which the electric wire holder was assembled | attached. It is a principal part perspective view of the connection structure of the conventional electronic component.

Embodiments according to the present invention will be described below with reference to the drawings.
As shown in FIG. 1, the LED unit 11 according to the electronic component connection structure of the present embodiment is sandwiched between the electronic component 30, the pair of bus bars 13 that are conductively connected to the electronic component 30, and the pair of bus bars 13. An insulating core member (spacing member) 15, an electronic component 30, a pair of bus bars 13, a housing 17 having a bus bar accommodating chamber 25 in which the core member 15 is mounted, and a pair of sandwiching the core member 15 The core member 15 and the pair of bus bars 13 are fixed by being wound around the outer periphery of the bus bar 13, and a heat shrinkable tube (tightening member) 59 disposed in a gap between the bus bar accommodating chamber 25 and the bus bar 13, and a lens cover 19.

  As shown in FIG. 2, each bus bar 13 has an upper terminal portion 21 and a lower terminal portion 23 formed at one end, and a bus bar insertion opening 27 on the upper surface of the housing in a bus bar housing chamber 25 of the housing 17 formed in a rectangular parallelepiped shape. Since they are housed from each other, they are spaced apart and arranged in parallel.

  The bus bar 13 includes an upper terminal portion 21 and a lower terminal portion 23 so that a semiconductor light emitting element 29 and a Zener diode 31 which are a plurality of types of electronic components 30 can be connected, but the LED unit 11 according to the present embodiment. However, the present invention is not limited to this, and the terminal portion may have a single-stage configuration or a multi-stage configuration with three or more stages.

  As shown in FIG. 3A and FIG. 4, the semiconductor light emitting element 29 is an electronic component in which a pair of light emitting element contact portions (contact portions) 35 are provided on both side surfaces 33. The semiconductor light emitting element 29 is formed and fixed in an L shape continuous from both side surfaces 33 to the element lower surface 37. The light emitting element contact portions 35 fixed to the both side surfaces 33 are inclined in a C shape with respect to the both side surfaces 33. As shown in FIG. 3B, the Zener diode 31 is an electronic component for surface mounting in which a pair of diode contact portions 39 are provided on one surface (the upper surface in the drawing).

  On the upper terminal portion 21 of the bus bar 13, a pair of opposed upper contact spring pieces (contact spring pieces) 41 and 43 are formed that can elastically contact the light emitting element contact portions 35 provided on both side surfaces 33 of the semiconductor light emitting element 29. Is done. On the other hand, the lower terminal portion 23 is formed with a pair of lower contact spring pieces 45, 47 that can elastically contact a pair of diode contact portions 39 provided on the upper surface of the Zener diode 31. The lower terminal portion 23 is formed with component seat portions 49 and 51 that sandwich the Zener diode 31 by the lower contact spring pieces 45 and 47 facing each other.

  Between the pair of bus bars 13, a core member 15 that is an insulating spacing member is sandwiched. As shown in FIG. 5, the core member 15 is formed into an inverted T shape having a bottom plate portion 53 and an upright plate portion 55 by an insulating resin material. In the core member 15, the bottom plate portion 53 is in contact with the bottom side of the housing 17, and the upright plate portion 55 is sandwiched between the main body rear side walls 57 of the pair of bus bars 13.

  A heat-shrinkable tube 59 that is a tightening member is wound around the outer periphery of the pair of bus bars 13 that sandwich the core member 15. The heat shrinkable tube 59 fixes the core member 15 and the pair of bus bars 13 by being reduced in diameter. Further, the heat-shrinkable tube 59 in which the core member 15 and the pair of bus bars 13 are fixed is disposed in the gap between the bus bar accommodating chamber 25 and the bus bar 13 when mounted in the housing 17.

  As shown in FIG. 4, in this embodiment, the adjacent inner upper contact spring pieces 41, 43 in the upper terminal portions 21 of the two bus bars 13 arranged in parallel are arranged between the two bus bars. Conductive connection is made with a pair of light emitting element contact portions 35 provided on both side surfaces 33 of the light emitting element 29. Further, adjacent lower contact spring pieces 45 and 47 in the lower terminal portion 23 of the two bus bars 13 arranged in parallel are connected to one of the Zener diodes 31 positioned below the semiconductor light emitting element 29 between the two bus bars. And a pair of diode contact portions 39 provided on the surface.

  A pressure contact blade 63 is provided at the rear end of the bus bar 13 for electrically contacting the covered conductor 61 (see FIG. 9) with the slit conductor. The press contact blade 63 protrudes outside the housing 17 in a state where the bus bar 13 is mounted on the housing 17. In the present embodiment, the side where the press contact blade 63 of the bus bar 13 protrudes from the housing 17 is referred to as “rear”, and the opposite side is referred to as “front”. A rear abutting piece 65 and a main body rear side wall 57 are successively provided at the front portion of the press contact blade 63.

  The press contact blade 63, the main body rear side wall 57, the upper terminal portion 21, and the lower terminal portion 23 are integrally punched out by sheet metal processing and then bent into the shape shown in FIG. The terminal portion of the bus bar 13 is formed in a U-shape so that a pair of main body rear side walls 57 are parallel to each other, and an upper contact spring piece 41, a lower contact spring piece 45, and an upper contact spring are formed on each of the main body rear side walls 57. The piece 43 and the lower contact spring piece 47 are stamped and formed. The main body of the bus bar 13 is formed by being bent in a U-shape, and the upper terminal portion 21 and the lower terminal portion 23 are formed by punching on a pair of opposing rear body side walls 57, so that a large number of electric contact portions are formed. This makes it possible to manufacture the elastic contact structure easily and compactly.

In this embodiment, the pitch between the contacts of the semiconductor light emitting element 29 and the pitch between the contacts of the Zener diode 31 are different, and the contact arrangement directions of the light emitting element contact portion 35 and the diode contact portion 39 are also different. That is, the two electronic components have different configurations between contact pitches and contact structures. In the LED unit 11 of this embodiment, two types of electronic components having such different contact structures can be simultaneously mounted.
That is, as shown in FIG. 4, the adjacent inner upper contact spring pieces 41 and 43 in the upper terminal portion 21 of the pair of bus bars 13 arranged in parallel are in elastic contact with the pair of light emitting element contact portions 35, and the outer upper step. The contact spring pieces 43 and 41 are in elastic contact with the inner wall 67 (see FIG. 1) of the bus bar housing chamber 25 in the housing 17. Further, the adjacent lower contact spring pieces 45, 47 adjacent to each other in the lower terminal portion 23 of the pair of bus bars 13 arranged in parallel elastically contact the pair of diode contact portions 39 provided on one surface of the Zener diode 31. Further, adjacent inner component seats 49 and 51 are brought into contact with the other surface of the Zener diode 31.

  In the LED unit 11 of the present embodiment, as shown in FIG. 4, the Zener diode 31 is the left of the four lower contact spring pieces 45, 47 of the lower terminal portion 23 of the pair of bus bars 13 arranged in parallel. To the second lower contact spring piece 45 from the left side and the third lower contact spring piece 47 from the left side. In contrast, the first lower contact spring piece 47 from the left side and the third lower contact spring piece 47 from the left side are conductively connected, or the second lower contact spring piece 45 from the left side and the fourth lower contact from the left side. It can also be connected to the spring piece 45, or can be conductively connected to the first lower contact spring piece 47 from the left side and the fourth lower contact spring piece 45 from the left side. In this way, the Zener diode 31 can be connected to one having a different pitch between contacts or one having different contact positions.

Next, an assembly process of the LED unit 11 having the above configuration will be described with reference to FIGS.
In order to assemble the LED unit 11, a pair of bus bars 13 is attached to the housing 17. In order to attach the bus bar 13 to the housing 17, first, as shown in FIG. 5, the core member 15 is sandwiched between the pair of bus bars 13. As shown in FIG. 6A, the heat shrinkable tube 59 is disposed on the outer periphery of the pair of bus bars 13 that sandwich the core member 15. The heat-shrinkable tube 59 disposed on the outer periphery of the bus bar 13 is reduced in diameter by heating with a dryer or the like as shown in FIG. In the present embodiment, the tightening member is the heat shrinkable tube 59, so that the mounting work on the outer periphery of the bus bar becomes easier as compared with, for example, a rubber tube that needs to be expanded in diameter. Further, the diameter reduction work can be easily realized by heating.

  A bus bar housing chamber 25 shown in FIG. 7 is formed in the housing 17, and the rear end of the bus bar housing chamber 25 is a rear wall 68. The pair of bus bars 13 sandwiched between the core members 15 and fixed by the heat shrinkable tube 59 are mounted in the bus bar accommodating chamber 25. As shown in FIG. 8, the bus bar 13 mounted in the bus bar accommodating chamber 25 sandwiches the rear wall 68 between the rear abutting piece 65 and the main body rear side wall 57 (see FIG. 1), and is prevented from dropping from the housing 17. Installed.

  An LED mounting opening 71 and a diode mounting opening 73 are formed on the front surface of the housing 17 in two upper and lower stages. The semiconductor light emitting element 29 is inserted into the LED mounting opening 71 with the light emitting element contact portions 35 on both side surfaces. The Zener diode 31 is inserted into the diode mounting opening 73 with the diode contact portion 39 facing upward. As a result, the respective light emitting element contact portions 35 and the diode contact portions 39 are electrically connected to the upper contact spring pieces 41 and 43 and the lower contact spring pieces 45 and 47 as shown in FIG.

  At this time, the semiconductor light emitting element 29 is inserted while expanding the bulging portions 42 of the upper contact spring pieces 41, 43 facing the both side surfaces 33. At this time, the upper contact spring pieces 41 and the upper contact spring pieces 43 of the upper terminal portions 21 are in contact with each other at the tip portions, so that the two inner upper contact spring pieces 41 and the upper contact spring pieces 43 that are spread out are used. Presses the outer two upper contact spring pieces 43 and the upper contact spring pieces 41 against the inner wall 67 of the bus bar housing chamber 25. Accordingly, the inner two upper contact spring pieces 41, 43 receive reaction forces in a direction approaching each other from the inner wall 67 of the bus bar housing chamber 25. As a result, the semiconductor light emitting element 29 is elastically sandwiched between the inner side walls 67 of the bus bar housing chamber 25 by means of both side surfaces 33 via the two upper contact spring pieces 41 and 43 on the inner side. Is positioned in the center.

  Moreover, since the semiconductor light emitting element 29 is elastically clamped by the inner side wall 67 of the bus bar accommodating chamber 25 in the housing 17 via the two inner upper contact spring pieces 41 and 43, an appropriate contact load can be obtained. . Therefore, in the semiconductor light emitting element 29 in which the pair of light emitting element contact portions 35 are provided on the both side surfaces 33, the pair of upper contact spring pieces 41 and the upper contact spring pieces 43 are elastically contacted from the direction sandwiching the both side surfaces 33. Stable conduction with the bus bar 13 becomes possible.

  The housing 17 in which the semiconductor light emitting element 29 and the Zener diode 31 are mounted is mounted on the lens cover 19. As shown in FIG. 9, a housing insertion opening 75 is formed on the rear end surface of the lens cover 19. In the housing 17 inserted into the lens cover 19, the press contact blade 63 protrudes rearward inside the lens cover 19.

  An electric wire holder 69 is inserted into the lens cover 19 fitted with the housing 17 from the housing insertion opening 75. U-shaped wire holding grooves 77 are formed in two places on the outer surface of the three sides of the wire holder 69. In each electric wire holding groove 77, a covered electric wire 61 is bent and attached in a U-shape. A horizontal press contact blade entrance slit 79 is formed on the front surface of the wire holder 69 across the wire holding grooves 77. Thereby, when the electric wire holder 69 is inserted into the lens cover 19, the press contact blade 63 of the bus bar 13 protruding rearward inside the lens cover 19 enters the press contact blade entry slit 79, and the press contact blade 63 and the electric wire 61 conductors are conductively connected.

  The electric wire holder 69 inserted into the lens cover 19 is engaged with a locking hole 81 formed in the side portion of the lens cover 19 with a locking claw 83 projecting from the side surface. And the detachment | leave with the electric wire holder 69 itself is controlled. As shown in FIG. 11, the housing 17 and the electric wire holder 69 are attached to the lens cover 19, whereby the assembly of the LED unit 11 is completed.

  In the LED unit 11 of the present embodiment, four types of Zener diodes 31 having different pitches, outer shapes, sizes, and the like between the contacts can be connected to the lower terminal portion 23 between the pair of bus bars 13 arranged in parallel. And a pair of bus bar 13 arranged in parallel can be made into the same shape, and a bus bar shape can be made into one kind.

  As described above, in the LED unit 11, as shown in FIG. 10, the core member 15 is sandwiched between the pair of bus bars 13, and is fastened by the heat shrink tube 59 in which the heat shrink tube 59 is wound around the outer periphery of the bus bar 13. Thus, the pair of bus bars 13 is fixed (clamped) to the core member 15. Thereby, the variation in the separation distance between the bus bars 13 is suppressed only by the forming tolerance of the core member 15. In addition, the pair of bus bars 13 having the heat shrink tube 59 wound around the outer periphery is mounted in the bus bar housing chamber 25 of the housing 17, so that the heat shrink tube 59 is disposed in the gap between the bus bar 13 and the housing 17. . Thereby, the backlash of the bus bar 13 with respect to the housing, which has conventionally occurred due to the gap with the bus bar accommodating chamber, is reduced or eliminated by the intervention of the heat shrinkable tube 59.

  Further, by sandwiching the core member 15, the upper contact spring piece 41 of one bus bar 13 and the upper contact spring piece 43 of the other bus bar 13 are arranged to face each other. A pair of light emitting element contact portions 35 provided on both side surfaces 33 of the element 29 are conductively connected. In the LED unit 11, the pair of bus bars 13 are fixed with the core member 15 interposed therebetween, whereby the distance between the pair of bus bars 13 is set with high accuracy. As a result, as shown in FIG. 4, reliable conduction connection of the upper contact spring pieces 41 and 43 to the light emitting element contact portions 35 provided on both side surfaces 33 of the semiconductor light emitting element 29 is realized. Thereby, the electrical contact reliability between the bus bar 13 and the semiconductor light emitting element 29 is enhanced.

Therefore, according to the LED unit 11 according to the present embodiment, rattling of the bus bar 13 with respect to the housing 17 can be prevented without increasing the size of the bus bar 13.
Note that the light emitting unit 10 of the present invention is not limited to the above-described embodiment, and can be appropriately modified and improved. In addition, the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

11 ... LED unit 13 ... bus bar 15 ... core member (interval holding member)
17 ... Housing 25 ... Bus bar accommodating chamber 29 ... Semiconductor light emitting element (electronic component)
33 ... Both sides 35 ... Light emitting element contact part (contact part)
41 ... Upper contact spring piece (contact spring piece)
43 ... Upper contact spring piece (contact spring piece)
59 ... Heat-shrinkable tube (tightening member)

Claims (3)

Electronic components,
A pair of bus bars that are conductively connected to the electronic components;
An insulating spacing member sandwiched between the pair of bus bars;
A housing having a bus bar housing chamber in which the electronic component, the pair of bus bars, and the spacing member are mounted;
A fastening member that is wound around an outer periphery of the pair of bus bars that sandwich the gap holding member to fix the gap holding member and the pair of bus bars and is disposed in a gap between the bus bar housing chamber and the bus bar. When,
An electronic component connection structure comprising:   The electronic component connection structure according to claim 1, wherein the tightening member is a heat shrinkable tube. A contact spring piece of one bus bar and a contact spring piece of the other bus bar are arranged to face each other by sandwiching the interval holding member,
The electronic component connection structure according to claim 1, wherein a pair of contact portions provided on both side surfaces of the electronic component are conductively connected to the contact spring pieces.

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