JP2013117685A - Camera module, electronic device, and method of manufacturing camera module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a camera module in which a high degree of parallelization of a lens surface of an optical lens and an image pickup surface of an image pickup device can be achieved reliably, a method of manufacturing the same, and an electronic device equipped with such a camera module.SOLUTION: A camera module 10 includes a wiring board 11, an image pickup device 13 mounted on a surface of the wiring board 11, and a lens unit 12 provided on the surface of the wiring board 11 and including an optical lens 14 and a lens holding member 15 that holds the optical lens 14 at a position above the image pickup device 13. The lens holding member 15 is fixedly adhered to the surface of the wiring board 11 by an adhesive sheet 16 made up of a fiber substrate sheet and a thermoset resin sheet laminated thereon.

Description

  The present invention relates to a camera module, an electronic device, and a camera module manufacturing method.

  In recent years, camera modules using image sensors such as CCDs and CMOS image sensors have been miniaturized and have been widely installed in small electronic devices such as mobile phones and personal computers. Recently, there is an increasing demand for downsizing, weight reduction, and high functionality of such electronic devices themselves, and accordingly, further downsizing and weight reduction of camera modules are required.

  As such a small and light camera module, a lens barrel that holds an optical lens so as to surround the image sensor is arranged directly or via a frame-shaped attachment member on a wiring board on which the image sensor is mounted. A lens barrel or a frame-like attachment member is known to be bonded and fixed on a wiring board using a liquid thermosetting adhesive (see, for example, Patent Document 1).

  In the camera module, when the lens barrel or the frame-shaped attachment member is bonded and fixed on the wiring board, the lens surface of the optical lens held in the lens barrel (a plane perpendicular to the optical axis passing through the center of the optical lens) and If the parallelism of the imaging surface of the image sensor is low, distortion occurs in the image of the subject that reaches the image sensor via the optical lens.

  However, the liquid thermosetting adhesive used for fixing the lens barrel or the frame-shaped attachment member tends to have a gradient in thickness due to its fluidity. That is, the lens barrel or the frame-shaped attachment member is easily fixed with being inclined with respect to the wiring board. For this reason, the parallelism of the lens surface of an optical lens and the image pick-up surface of an image pick-up element was high, and there existed a problem that the camera module which can obtain a favorable image without distortion could not be manufactured stably.

Japanese Patent Laid-Open No. 2005-101306

  The present invention has been made to solve the above-described problems of the prior art, and in manufacturing, the parallelism between the lens surface of the optical lens and the imaging surface of the imaging device can be stably increased, and for that purpose, the size is small. It is an object of the present invention to provide a camera module that does not lose its weight and weight, a method of manufacturing such a camera module, and an electronic device including such a camera module.

  A camera module according to an aspect of the present invention includes a wiring board, an imaging device mounted on one surface of the wiring board, an optical lens disposed on the one surface of the wiring board, and the optical lens. A lens unit having a lens holding member that is held above the imaging element, and the lens holding member is formed by bonding a thermosetting resin sheet to a sheet-like fiber base material on the one surface of the wiring board. It is characterized by being bonded and fixed by an adhesive sheet.

  An electronic apparatus according to another aspect of the present invention includes the camera module.

  Furthermore, a method for manufacturing a camera module according to another aspect of the present invention includes: a wiring board; an imaging device mounted on one surface of the wiring board; and an optical lens disposed on the one surface of the wiring board. And a lens unit having a lens holding member that holds the optical lens system above the imaging device, wherein the lens unit is mounted on the one surface of the wiring board. The lens holding member is bonded by an adhesive sheet in which a thermosetting resin sheet is bonded to a sheet-like fiber base material.

  According to the present invention, the camera module can stably increase the parallelism of the lens surface of the optical lens and the image pickup surface of the image pickup device during manufacture, and the size and weight are not impaired thereby. And an electronic device including such a camera module.

It is sectional drawing which shows schematic structure of the camera module of one Embodiment of this invention. It is sectional drawing which shows an example of the adhesive sheet used for the camera module of one Embodiment of this invention. It is an external view which shows an example of the electronic device with which the camera module of this invention was integrated. It is sectional drawing which shows schematic structure of the camera module of other embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described. Although the description will be made based on the drawings, the drawings are provided for illustration only, and the present invention is not limited to the drawings.

  FIG. 1 is a cross-sectional view showing a camera module according to an embodiment of the present invention.

  As shown in FIG. 1, the camera module 10 of the present embodiment includes a wiring board 11, a lens unit 12, and an image sensor 13.

  The lens unit 12 includes an optical lens 14 and a lens barrel 15 that is a holding member that holds the optical lens 14, and the bottom surface of the lens barrel 15 is attached to one of the wiring boards 11 via an adhesive sheet 16 to be described later. It is fixed by adhering to the surface.

  The imaging element 13 is an electronic component that converts the light incident through the optical lens 14 into an electrical signal and outputs the electrical signal, and is, for example, a CCD or a CMOS. The image sensor 13 is disposed on the same surface as the surface on which the lens unit 12 is disposed on one surface of the wiring substrate 11 so that the optical lens 14 is positioned above the surface.

  As the wiring substrate 11 on which the lens unit 12 and the image sensor 13 are arranged, a flexible wiring substrate based on polyimide, an organic substrate using glass cloth, or the like is used.

  In addition, the camera module 10 is disposed on an optical filter 17 such as a near-infrared cut filter that blocks light in the infrared region outside visible light from light incident on the image sensor 13, or on the wiring board 11, and is converted by the image sensor 13. The signal processing device 18 that inputs the output electric signal and performs predetermined processing, and although not shown, the shutter that opens and closes the opening of the optical path of the optical lens 14, its driving device, the optical lens 14, or A diaphragm or the like for adjusting the amount of light entering the image sensor 13 is provided.

  Examples of the optical filter 17 other than the near-infrared cut filter include a low-pass filter, an ND filter, a color tone filter, and an optical amplification filter. All of these optical filters 17 are usually disposed between the optical lens 14 and the image sensor 13 along the optical axis of the optical lens 14. In the present embodiment, as the optical filter 17, a near-infrared cut filter is disposed between the optical lens 14 and the image sensor 13 and held by the lens barrel 15.

Here, the adhesive sheet 16 used for bonding the lens barrel 15 and the wiring substrate 11 will be described.
As shown in FIG. 2, the adhesive sheet 16 has a structure in which a thermosetting resin sheet 22 is bonded to a sheet-like fiber base material 21.

  As a material of the sheet-like fiber base material 21, for example, glass cloth, glass nonwoven fabric, aramid nonwoven fabric, liquid crystal polymer nonwoven fabric, or the like is used. The thickness of the sheet-like fiber base material 21 is preferably 30 to 200 μm, and more preferably 50 to 150 μm. When the thickness of the sheet-like fiber base material 21 is less than 30 μm, the handleability (handling property) is lowered. On the other hand, when the thickness exceeds 200 μm, when the thermosetting resin sheet 22 is melted, the resin is not sufficiently impregnated to the whole or back surface of the sheet-like fiber base material 21 and a desired adhesive force cannot be obtained. There is a fear. Specific examples of the sheet-like fiber base material include, for example, glass cloth A1080 (thickness 50 μm) manufactured by Arisawa Manufacturing Co., Ltd. as a glass cloth base material. Examples of the glass nonwoven fabric substrate include glass nonwoven fabric EPM-4015 (thickness 150 μm) manufactured by Japan Vilene Co., Ltd.

  Further, the thermosetting resin sheet 22 bonded to the sheet-like fiber base material 21 retains a sheet-like shape at room temperature, but melts when heated to a certain temperature or higher, for example, 30 ° C. or higher. And the sheet | seat which consists of a thermosetting resin hardened | cured by subsequent hardening process is used.

  The thermosetting resin sheet preferably has a melting start temperature of 30 ° C. or higher, and the melt viscosity of the thermosetting resin at 100 ° C. before the curing treatment is 15 Pa · s or lower. When the melting start temperature is less than 30 ° C., the handling property (handling property) itself or after being bonded to the sheet-like fiber base material 21 is lowered, and the camera module is assembled or the camera module is assembled. May cause problems. In addition, if the melt viscosity at 100 ° C. before the curing process is more than 15 Pa · s, the fluidity becomes insufficient, the thickness accuracy of the adhesive layer is lowered, and the positional accuracy of each member after assembling the camera module is improved. It becomes difficult to make. In particular, the parallelism between the lens surface of the optical lens and the imaging surface of the image sensor becomes poor.

  However, if the melting start temperature of the thermosetting resin sheet is too high, the imaging element may malfunction, so the melting start temperature of the thermosetting resin sheet is more preferably 30 ° C. or more and 70 ° C. or less. Preferably, the temperature is 35 ° C. or higher and 65 ° C. or lower. In addition, if the melt viscosity of the thermosetting resin sheet at 100 ° C. before the curing process is too low, the fluidity becomes too large and a gradient occurs in the thickness of the adhesive layer as in the conventional case, so that the lens barrel 15 It is more preferably 0.5 Pa · s or more, and even more preferably 0.7 Pa · s or more and 15.0 Pa · s or less, because it is easy to be inclined and fixed with respect to the wiring substrate 11.

  Further, in the thermosetting resin sheet, the gel time of the thermosetting resin at 100 ° C. is preferably 10 minutes or more and 90 minutes or less, more preferably 10 minutes or more and 80 minutes or less, and more preferably 10 minutes or more and 70 minutes or less. Is more preferable. If the gel time of the thermosetting resin sheet at 100 ° C. is less than 10 minutes, voids are likely to occur in the cured product. If the gel time exceeds 90 minutes, the thickness accuracy of the adhesive layer is lowered, and it is difficult to improve the positional accuracy of each member after the camera module is assembled. In particular, the parallelism between the lens surface of the optical lens and the imaging surface of the image sensor becomes poor.

Here, the melting start temperature, melt viscosity, and gel time of the thermosetting resin sheet will be described.
[Melting start temperature] The temperature at which the thermosetting resin sheet starts to change into a liquid state. Specifically, it can be measured by the following method.
A thermosetting resin sheet (2 mm × 1 mm × 1 mm) was placed on a hot plate with a built-in thermocouple, and the thermosetting resin sheet began to change into a liquid state by heating the hot plate at a rate of 2 ° C./min. The temperature is measured with a thermocouple.
[Melt viscosity] Measured with a rheometer. Specifically, it can be measured by the following method.
A sample for measurement is produced by punching a thermosetting resin sheet having a thickness of 50 μm into a circle having a diameter of 20 mm. About this sheet, the viscosity after 3 minutes is measured with a rheometer using a parallel plate having a diameter of 25 mm under the conditions of a temperature of 100 ° C., a maximum strain of 50%, and an angular velocity of 50 rad / s.
[Gel time] Time until the thermosetting resin sheet is in a gel state. Specifically, it can be measured by the following method.
In accordance with the test tube method of JIS C 2105, the time until the thermosetting resin sheet becomes a gel state is measured in an oil bath at 100 ° C.

  The kind of thermosetting resin which comprises a thermosetting resin sheet is not specifically limited, One kind of conventionally known thermosetting resins, such as an epoxy resin, an acrylic resin, a urethane resin, a melamine resin, a phenol resin, etc. Alternatively, two or more kinds can be mixed and used.

  In addition to the resin component and the curing agent component as the base, the thermosetting resin is inorganic within the range that does not impair the effects of the present invention for the purpose of adjusting the melt viscosity, improving the adhesive strength, and improving the sheet handling property. A filler such as a filler may be blended.

  Examples of the inorganic filler include silica, alumina, mica, mica, silicate, barium sulfate, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, magnesium oxide, calcium oxide, and titanium oxide. Can be mentioned. These inorganic fillers may be used alone or in combination of two or more.

  The thermosetting resin may further contain various additives such as a curing accelerator and a coupling agent as long as the effects of the present invention are not impaired. By incorporating a curing accelerator, rapid curing is possible. Moreover, adhesive force can be improved by mix | blending a coupling agent.

  The thermosetting resin sheet is a varnish-like thermosetting resin composition obtained by mixing and kneading the above-described thermosetting resin and a filler and other various additives added in an organic solvent. Can be manufactured by removing the base film after applying it on the base film, heating and drying. Mixing and kneading can be carried out by appropriately combining dispersers such as ordinary stirrers, three rolls, and ball mills. Moreover, although the heat drying in the case of using an organic solvent is not specifically limited, Usually, it is implemented by heating at the temperature of 60 to 200 degreeC for 0.1 to 90 minutes.

  The base film on which the thermosetting resin composition prepared in a varnish shape is applied is not particularly limited. For example, polyester film, polypropylene film, polyethylene terephthalate film, polyimide film, polyetherimide film, polyether naphthalate Film, methylpentene film, etc. are used

  The organic solvent used in preparing the varnish may be any one that can uniformly dissolve or disperse each component, and a known organic solvent can be used. Specific examples of such a solvent include ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, toluene, xylene, and the like. These organic solvents may be used individually by 1 type, and may use 2 or more types together.

  In addition, as mentioned above, it can also manufacture by mixing and kneading each component, without using an organic solvent, and shape | molding in a sheet form.

  The thickness of the thermosetting resin sheet 22 constituting the adhesive sheet 16 is preferably 30 to 500 μm, and more preferably 30 to 300 μm. If the thickness of the thermosetting resin sheet 22 is less than 30 μm, the handleability (handling property) may be reduced, and if it exceeds 500 μm, the request for downsizing of the camera module may not be sufficiently met. There is.

  The adhesive sheet 16 is prepared by using the thermosetting resin sheet 22 produced as described above on one side of the sheet-like fiber base material 21 with a thermal laminator or the like, usually at a temperature of 30 ° C. to 180 ° C., 0.1 Pa. It can be produced by bonding at a pressure of s to 0.5 Pa · s. In some cases, the thermosetting resin sheet 22 may be bonded to both surfaces of the sheet-like fiber base material 21. When bonding to both surfaces, it is preferable that the total thickness does not exceed 700 μm.

In the present invention, from the viewpoint of increasing the thickness accuracy of the adhesive layer, in particular, from the viewpoint of increasing the parallelism between the lens surface of the optical lens and the imaging surface of the imaging device, the adhesive sheet 16 is an adhesive sheet that is obtained by the following formula. It is preferable that the increase rate (R) of the area (S ₁ ) of 16 after the adhesion treatment with respect to the area (S ₂ ) before the adhesion treatment is 1.0% or less, and more preferably 0.5% or less. preferable.
_{R (%) = {(S} 1 -S 2) / S 1} × 100

The area (S ₁ ) after the adhesion treatment of the adhesive sheet 16 and the area (S ₂ ) before the adhesion treatment are determined by image analysis using, for example, a super-resolution digital microscope VHX-2000 (trade name) manufactured by KEYENCE. Can be measured.

  In addition, by setting the increase rate (R) to 1.0% or less, it is possible to suppress the sticking of the adhesive layer from the bottom surface of the lens barrel 15 and reduce the dirt caused by the resin sticking out to other members. Have.

  The camera module 10 of this embodiment can be manufactured as follows using the adhesive sheet 16 as described above, for example.

  First, the image sensor 13 and the signal processing device 18 are mounted on one surface of the wiring board 11. Next, the adhesive sheet 16 is placed on the wiring substrate 11 on the thermosetting resin sheet 22 side so as to surround the image pickup device 13 at a predetermined position on one surface of the wiring substrate 11 and the same surface as the surface on which the image pickup device 13 is mounted. The lens barrel 15 mounted with the optical lens 14 and the like previously held thereon is placed thereon. For the adhesive sheet 16, the adhesive sheet produced by the above-described method is previously punched into a shape corresponding to the bottom surface of the lens barrel 15.

In this state, these are put into a heating chamber and heated. As the temperature rises, the thermosetting resin sheet 22 constituting the adhesive sheet 16 melts and penetrates into the sheet-like fiber base material 21, and the sheet-like fiber substrate is interposed between the wiring substrate 11 and the lens barrel 15. A layer of thermosetting resin impregnated in the material 21 is formed. When the temperature further increases, the thermosetting resin layer is thermoset, and the lens barrel 15 is bonded and fixed to the wiring board 11.
Thereafter, the camera module 10 as shown in FIG. 1 is completed by taking out from the heating chamber.

  In such a manufacturing method, since the lens barrel 15 is bonded to the mounting surface of the imaging element 13 of the wiring board 11 using the adhesive sheet 16 in which the thermosetting resin sheet 22 is bonded to the sheet-like fiber base material 21, Unlike the conventional case where a liquid thermosetting adhesive is applied and adhered, the heated and melted resin does not flow and the thickness of the adhesive layer is not uniform. That is, in the above-described method, the flow of the heat-cured thermosetting resin is limited by the sheet-like fiber base material 21, and further, when such a sheet-like fiber base material 21 exists, when the thermosetting resin flows The uniformity of the gap between the wiring board 11 and the bottom surface of the lens barrel 15 is maintained. Therefore, an adhesive layer having a uniform thickness is formed, and the lens barrel 15 can be bonded and fixed without causing an inclination with respect to the wiring board 11. Thereby, the camera module 10 in which the parallelism between the lens surface of the optical lens 14 and the imaging surface of the imaging device 13 is high and a good image can be obtained can be manufactured with high yield.

  In the present invention, the parallelism (P) between the lens surface of the optical lens 14 and the imaging surface of the imaging element 13 is preferably 5 μm or less. The parallelism (P) is more preferably 3 μm or less, and particularly preferably 0 μm, that is, it is particularly preferable that the lens surface of the optical lens 14 and the imaging surface of the image sensor 13 are substantially parallel.

  The parallelism (P) between the lens surface of the optical lens 14 and the image pickup surface of the image pickup device 13 here is a value measured and calculated by the following method. That is, the height of the upper end surface of the lens barrel 15 from the wiring board 11 is measured at a regular interval along the outer periphery of the lens barrel 15 using, for example, a three-dimensional measuring machine (model UPMC550) manufactured by Carl Zeiss. It is a value obtained by measuring at more than 10 points, preferably at 10 or more points, obtaining the difference between the maximum value and the minimum value, and dividing the value by 2.

  FIG. 3 is an external view showing a mobile phone as an example of the electronic apparatus 100 in which the camera module 10 of this embodiment is incorporated.

 As shown in FIG. 3, the cellular phone 100 includes first and second casings 32 and 33 that are connected to each other by a hinge portion 31 so as to be opened and closed. A liquid crystal display panel 301 is provided on the first housing 32, and operation switches 302 such as numeric keys and function keys are provided on the inner surface of the second housing 33. The camera module 10 is incorporated in the end of the first housing 32, and an image captured by the camera module 10 is displayed on the liquid crystal display panel 301.

 In the present embodiment, when the lens barrel 15 that holds the optical lens 14 and the like is bonded to the wiring substrate 11 on which the imaging element 13 is mounted, the bonding is performed by bonding the thermosetting resin sheet 22 to the sheet-like fiber base material 21. Since the sheet 16 is used, there is a risk that the lens barrel 15 is attached to the mounting surface of the imaging element 13 of the wiring board 11 with an inclination as in the case of using a conventional liquid thermosetting resin adhesive. Absent. Therefore, it is possible to stably manufacture a camera module in which a parallelism between the lens surface of the optical lens 14 and the imaging surface of the imaging device 13 is high and a good image without distortion can be captured. Moreover, since the adhesion by the adhesive sheet 16 is performed by a thermosetting resin that is heated and melted and impregnated into the sheet-like fiber base material 21, the camera module 10 and the electronic device 100 incorporating the camera module 10 can be downsized. The weight reduction is not impaired.

  In the camera module 10 shown in FIG. 1, only one optical lens 14 is held and arranged on the lens barrel 15, but a plurality of optical lenses 14 may be provided. A protective cover such as a cover glass for protecting the image sensor 13 may be disposed above the image sensor 13.

  In the embodiment described above, the lens barrel 15 that holds the optical lens 14 and the like is directly bonded and fixed to the wiring board 11 on which the imaging element 13 is mounted. For example, the camera shown in FIG. A structure in which the lens barrel 15 is attached via a cylindrical attachment member 41 like the module 20 may be used. In this case, the cylindrical attachment member 41 is bonded and fixed by the adhesive sheet 16 in which the thermosetting resin sheet 22 is bonded to the sheet-like fiber base material 21, and the lens barrel 15 is fixed to the cylindrical attachment member 41. The As shown in the figure, the cylindrical attachment member 41 and the lens barrel 15 are fixed by screwing with a fixing screw 42, screwing, bonding, and the lens barrel 15 and the cylindrical attachment member 41 are both made of metal. In such a case, a method such as soldering can be used. In the case of fixing by bonding, in the same manner as fixing the cylindrical mounting member 41 to the wiring substrate 11, in order to maintain high parallelism between the lens surface of the optical lens 14 and the imaging surface of the imaging element 13, a sheet-like fiber base material is used. It is preferable to use an adhesive sheet 16 in which a thermosetting resin sheet is bonded together. In FIG. 4, the same reference numerals are given to portions common to FIG. 1, and reference numeral 43 indicates a protective cover held by a cylindrical mounting member 41 in order to protect the image sensor 13. ing.

  The embodiment of the present invention has been described above, but the present invention is not limited to the description of the embodiment described above, and can be appropriately changed without departing from the gist of the present invention. Not too long.

EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples at all. The measurement of the melting start temperature, melt viscosity (100 ° C.), gel time (100 ° C.), and parallelism (P) of the lens surface of the optical lens and the imaging surface of the imaging device are as follows. It is measured by the method shown.
[Melting start temperature]
A sample sheet for measurement of 2 mm × 1 mm × 1 mm was prepared, this sheet was placed on a hot plate with a built-in thermocouple, and the hot plate was heated at a heating rate of 2 ° C./min, and the sheet began to change into a liquid state. The temperature was measured with a thermocouple.
[Melt viscosity]
A circular measurement sample sheet having a thickness of 50 μm and a diameter of 20 mm was prepared, and a parallel plate having a diameter of 25 mm was used for this sheet by a rheometer (ARES) manufactured by Rheometric Scientific, with a temperature of 100 ° C. and a maximum strain of 50%. The viscosity after 3 minutes was measured under the condition of an angular velocity of 50 rad / s.
[Geltime]
Based on the test tube method of JIS C 2105, the time until the thermosetting resin sheet became a gel state in an oil bath at 100 ° C. was measured.
[Parallelity between optical lens lens surface and imaging element imaging surface (P)]
The height of the upper end surface of the lens barrel from the wiring board is measured at a total of 10 points at equal intervals along the outer periphery of the lens barrel using a three-dimensional measuring machine (model UPMC550) manufactured by Carl Zeiss, A value obtained by dividing the difference between the minimum values by 2 was obtained and used as the parallelism between the optical lens lens surface and the imaging element imaging surface.

(Example)
An epoxy resin, a curing agent for epoxy resin, and silica powder were mixed and kneaded, formed into a sheet having a thickness of 50 μm by a roll, and then bonded to a glass nonwoven fabric having a thickness of 120 μm to prepare an adhesive sheet having a thickness of 150 μm. The melting point of the epoxy resin sheet was 35 ° C., the melt viscosity at 100 ° C. was 10 Pa · s, and the gel time at 100 ° C. was 40 minutes.
After punching the obtained adhesive sheet into a required shape, it is placed at a predetermined position on the wiring board on which the image sensor is mounted, with the glass nonwoven fabric side facing the wiring board, and a mirror holding an optical lens thereon After placing the tube, it was placed in a heating chamber and heat-bonded at 100 ° C. for 1 hour to produce a camera module.
With respect to the manufactured camera module, the parallelism (P) between the lens surface of the optical lens and the imaging surface of the imaging device was measured and found to be 3 μm. This camera module worked without problems.

(Comparative example)
A camera module was produced in the same manner as in the example except that a commercially available liquid thermosetting adhesive (Ajinomoto Fine Techno Co., Ltd., trade name AE-330) was used instead of the adhesive sheet. The thermosetting adhesive was applied on the wiring board so as to have a thickness of 150 μm, and was cured by heating at 100 ° C. for 1 hour.
About the manufactured camera module, it was 20 micrometers when the parallelism (P) of the lens surface of an optical lens and the imaging surface of an image pick-up element was measured like the Example.

  DESCRIPTION OF SYMBOLS 10, 20 ... Camera module, 11 ... Wiring board, 12 ... Lens unit, 13 ... Imaging element, 14 ... Optical lens, 15 ... Lens barrel, 16 ... Adhesive sheet, 17 ... Optical filter, 21 ... Sheet-like fiber base material, 22 ... thermosetting resin sheet, 41 ... cylindrical mounting member, 100 ... electronic equipment.

Claims (8)

A wiring board;
An image sensor mounted on one surface of the wiring board;
A lens unit that is disposed on the one surface of the wiring board and includes an optical lens and a lens holding member that holds the optical lens above the imaging device;
The camera module, wherein the lens holding member is bonded and fixed to the one surface of the wiring substrate by an adhesive sheet in which a thermosetting resin sheet is bonded to a sheet-like fiber base material.   The thermosetting resin sheet has a melting start temperature of 30 ° C. or more, a melt viscosity at 100 ° C. of 15 Pa · s or less, and a gel time at 100 ° C. of 10 minutes or more and 90 minutes or less. The camera module according to claim 1.   3. The camera module according to claim 1, wherein the sheet-like fiber base material has a thickness of 30 μm to 200 μm, and the thermosetting resin sheet has a thickness of 30 μm to 500 μm. The increase rate (R) of the area (S ₁ ) after the adhesion treatment of the adhesive sheet, which is obtained by the following formula, with respect to the area (S ₂ ) before the adhesion treatment is 1.0% or less. The camera module according to claim 1.
_{R (%) = {(S} 1 -S 2) / S 1} × 100   The said thermosetting resin is at least 1 sort (s) selected from the group which consists of an epoxy resin, an acrylic resin, a urethane resin, a melamine resin, and a phenol resin, The any one of Claim 1 thru | or 3 characterized by the above-mentioned. The camera module.   6. The camera module according to claim 1, wherein the parallelism between the lens surface of the optical lens and the imaging surface of the imaging element is 5 μm or more.   An electronic apparatus comprising the camera module according to claim 1. A wiring board;
An image sensor mounted on one surface of the wiring board;
A method of manufacturing a camera module, comprising: a lens unit that is disposed on the one surface of the wiring board and includes an optical lens and a lens holding member that holds the optical lens above the imaging element.
A method for manufacturing a camera module, wherein the wiring board and the holding member of the lens unit are bonded by an adhesive sheet in which a thermosetting resin sheet is bonded to a sheet-like fiber base material.

Images