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JP2013162121A - Integrated multilayer type lighting device - Google Patents

Integrated multilayer type lighting device Download PDF

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Publication number
JP2013162121A
JP2013162121A JP2012114525A JP2012114525A JP2013162121A JP 2013162121 A JP2013162121 A JP 2013162121A JP 2012114525 A JP2012114525 A JP 2012114525A JP 2012114525 A JP2012114525 A JP 2012114525A JP 2013162121 A JP2013162121 A JP 2013162121A
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Japan
Prior art keywords
light emitting
lighting device
integrated multilayer
chamber
integrated
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JP2012114525A
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Japanese (ja)
Inventor
Jon-Fwu Hwu
仲孚 胡
Yong-Fu Wu
永富 呉
Kui-Chiang Liu
奎江 劉
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Gem Weltronics TWN Corp
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Gem Weltronics TWN Corp
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Publication of JP2013162121A publication Critical patent/JP2013162121A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an integrated multilayer type lighting device.SOLUTION: An integrated multilayer type lighting device includes a base, a light emitting element, and a lead frame. The base can be integrally molded and the light emitting element can be directly placed therein using an appropriate molding method. The base has a chamber in which a light emitting unit is placed. The base is made of a metallic material, and directly absorbs thermal energy which is generated when the light emitting unit emits light to speedily conduct the energy to an external environmental space, by an excellent thermal conduction efficiency of the metallic material. Thereby, the amount of usage of a package material is significantly reduced and a manufacturing step can be simplified.

Description

本発明は一種の照明装置に係り、特に一種の、一体化多層式照明装置に関する。   The present invention relates to a type of lighting device, and more particularly to a type of integrated multilayer lighting device.

ＬＥＤの発光原理は半導体固有の特性を利用しており、それはそれまでの白熱灯管の放電、発熱発光原理とは異なり、電流を順方向に半導体のｐｎ接合に流入させる時に光線を発射できる。ゆえに、ＬＥＤは冷光源（ｃｏｌｄ ｌｉｇｈｔ）と称される。ＬＥＤは高い耐久性、長寿命、軽量でコンパクト、少ない電力消費量、及び水銀等の有害物質を含有しない等の長所を有するため、広く照明設備産業中に応用されており、且つそれは通常、ＬＥＤアレイパッケージ方式で電子看板、交通信号等の商業領域に応用される。   The light emission principle of the LED uses the characteristic peculiar to the semiconductor, which is different from the discharge and exothermic light emission principle of the incandescent lamp tube so far, and can emit a light beam when the current flows in the forward direction into the pn junction of the semiconductor. Therefore, the LED is referred to as a cold light. LEDs have advantages such as high durability, long life, lightweight and compact, low power consumption, and contain no harmful substances such as mercury, so they are widely applied in the lighting equipment industry, and they are usually LED The array package system is applied to commercial areas such as electronic signage and traffic signals.

特許文献１には、一種の多層式アレイ型発光ダイオードのパッケージ構造が記載され、それは、金属基板、パッケージモジュールブロック、リードフレーム及びカバーを包含する。該金属基板は該パッケージ構造の最下層に設けられ、該パッケージモジュールブロックは、それぞれ該金属基板と該リードフレームを封止して一体に組み合わせるのに用いられ、該金属基板上にアレイ配列の発光ダイオードチップが取り付けられ、且つ金属基板は金属材質とされ、発光ダイオードと該リードフレームが並びに電気的接続を形成し、該カバーは該パッケージモジュールブロックの中に被覆される。   Patent document 1 describes a package structure of a kind of multilayer array type light emitting diode, which includes a metal substrate, a package module block, a lead frame, and a cover. The metal substrate is provided in the lowermost layer of the package structure, and the package module block is used to seal and combine the metal substrate and the lead frame, respectively. A diode chip is attached, and the metal substrate is made of a metal material. The light emitting diode and the lead frame form an electrical connection as well, and the cover is covered in the package module block.

台湾実用新案公告Ｍ３８７３７５号Taiwan Utility Model Notice M387375

しかし、周知の技術の欠点は、各発光ダイオードがパッケージされる時に、パッケージ材料を使用してパッケージモジュールブロックを製造され、パッケージ材料のほとんどはプラスチック樹脂で製造され得るが、一般にプラスチック樹脂の放熱能力は金属材料に遥かに及ばず、放熱能力の不足が厳重に発光ダイオードの使用寿命及び発光性能に影響を与え得るほか、金属基板及びパッケージモジュールブロックは一度の一体成形により形成することはできず、製造ステップが煩瑣となることである。このため、上述の欠点に対して改良を加え、大幅に熱伝導効率を高めると共にパッケージ材料の使用を減らすことが必要である。   However, the disadvantage of the known technology is that when each light emitting diode is packaged, the package material is used to manufacture the package module block, and most of the package material can be made of plastic resin, but generally the heat dissipation capability of plastic resin Is far from the metal material, the shortage of heat dissipation capability can severely affect the service life and light emitting performance of the light emitting diode, and the metal substrate and package module block can not be formed by one integral molding, Manufacturing steps are cumbersome. For this reason, it is necessary to improve the above-mentioned drawbacks, greatly increase the heat transfer efficiency, and reduce the use of the packaging material.

本発明は、一種の一体化多層式照明装置を提供し、それは、ベース、複数の発光素子、二つのリードフレームを包含し、該ベースは中心体及び複数の放熱フィンを包含する。該中心体の上部にチャンバが形成され、該チャンバの底面は発光面とされ、該チャンバの内壁面は反射面とされる。そのうち、該中心体を貫通するように中空の二つの管道が設けられている。複数の発光素子は、該発光面の上に設置され、これら発光素子相互の間はワイヤボンディングで接続され、電気的接続を構成する。二つのリードフレームは、それぞれ該二つの管道の中に設置され、並びにこれら発光素子とワイヤボンディングにより接合されて、電気的接続を構成し、そのうち一つの管道中に少なくとも一つの密封体があり、該少なくとも一つの密封体は一つのリードフレームを固定し並びに該管道を封鎖するのに用いられる。   The present invention provides a kind of integrated multilayer lighting device, which includes a base, a plurality of light emitting elements, and two lead frames, and the base includes a center body and a plurality of heat dissipating fins. A chamber is formed above the central body, the bottom surface of the chamber is a light emitting surface, and the inner wall surface of the chamber is a reflecting surface. Among them, two hollow pipe passages are provided so as to penetrate the central body. The plurality of light emitting elements are installed on the light emitting surface, and the light emitting elements are connected to each other by wire bonding to form an electrical connection. The two lead frames are respectively installed in the two conduits, and are joined to the light emitting elements by wire bonding to form an electrical connection, of which at least one sealing body is in one conduit, The at least one seal is used to secure one lead frame and to seal the conduit.

そのうち、該ベースは一体成形可能で、適宜成形方式を利用して該ベースの内部に発光ユニットが設置され得る。詳細に述べると、ベースのチャンバは発光ユニットを直接その中に設置するのに供され得て、特に、ベース全体は金属材料で製造され、金属材料の優れた熱伝導効率により、発光素子が発光する時に発生する熱エネルギーを直接吸収し並びにスピーディーに外部環境空間に伝導し、これにより更にパッケージモジュールブロックを設置する必要なく、パッケージ材料の用量を大幅に減らし、また、製造ステップを簡易化できる。   Among them, the base can be integrally formed, and a light emitting unit can be installed inside the base using an appropriate molding method. In detail, the base chamber can be used to install the light emitting unit directly in it, especially the whole base is made of metal material, and the excellent heat conduction efficiency of the metal material makes the light emitting device emit light. The heat energy generated during the heat absorption is directly absorbed and rapidly transferred to the external environment space, so that it is not necessary to install a package module block, and the dose of the package material can be greatly reduced and the manufacturing steps can be simplified.

本発明のある実施例では、カバーで該チャンバの上が被覆され、並びに該中心体と密封接合され、すなわち、チャンバが封鎖され、これによりチャンバが密閉空間を形成し、これにより水気或いは微粒子がチャンバ中に進入不能となり、これにより発光素子及び光学素子の変質劣化が防止される。   In one embodiment of the present invention, a cover is coated over the chamber and is hermetically bonded to the central body, i.e., the chamber is sealed, thereby forming a sealed space, whereby moisture or particulates are collected. It becomes impossible to enter the chamber, thereby preventing deterioration of the light emitting element and the optical element.

さらに、発光面及び反射面の間に構成される相対夾角は２０−７０度の間のいずれかの角度とされ、反射面の発光面に対する設置角度を決定することで、上述の配置関係により、発光素子の投射可能な発光角度範囲が制御される。   Furthermore, the relative depression angle formed between the light emitting surface and the reflecting surface is any angle between 20-70 degrees, and by determining the installation angle of the reflecting surface with respect to the light emitting surface, The light emission angle range in which the light emitting element can project is controlled.

本発明の一体化多層式照明装置は、ベース、発光素子及びリードフレームを包含し、そのうち、ベースは一体成形可能で、適当な成形方式を利用して発光ユニットを直接内部に設置したベースとされ得て、該ベースは発光ユニットを設置するチャンバを有し、金属材料で製造され、金属材料の優れた熱伝導効率により、直接発光素子が発光する時に発生する熱エネルギーを吸収し並びにスピーディーに外部環境空間に伝導し、これによりパッケージ材料の用量を大幅に減らし、並びに製造ステップを簡易化できる。   The integrated multilayer lighting device of the present invention includes a base, a light emitting element, and a lead frame. Among them, the base can be integrally formed, and a light emitting unit is directly installed inside using an appropriate forming method. The base has a chamber in which the light emitting unit is installed, and is made of a metal material. Due to the excellent heat conduction efficiency of the metal material, the base directly absorbs the heat energy generated when the light emitting element emits light, and speedily externally. Conducted to the environmental space, which can greatly reduce the dose of packaging material and simplify the manufacturing steps.

本発明の一体化多層式照明装置の立体図である。It is a three-dimensional view of the integrated multilayer lighting device of the present invention. 本発明の一体化多層式照明装置の断面図である。It is sectional drawing of the integrated multilayer illuminating device of this invention. 本発明の一体化多層式照明装置の第１実施例表示図である。It is a 1st Example display figure of the integrated multilayer illuminating device of this invention.

本発明の技術内容、構造特徴、達成する目的を詳細に説明するため、以下に実施例を挙げ並びに図面を組み合わせて説明する。   In order to describe in detail the technical contents, structural features, and objects to be achieved of the present invention, examples will be described below in combination with the drawings.

図１を参照されたい。図１は本発明の一体化多層式照明装置の立体図である。図２は本発明の一体化多層式照明装置の断面図である。本発明は一種の一体化多層式照明装置に係り、それは、ベース１、複数の発光素子３及び二つのリードフレーム５を包含する。   Please refer to FIG. FIG. 1 is a three-dimensional view of the integrated multilayer lighting device of the present invention. FIG. 2 is a cross-sectional view of the integrated multilayer lighting device of the present invention. The present invention relates to a kind of integrated multilayer lighting device, which includes a base 1, a plurality of light emitting elements 3 and two lead frames 5.

ベース１は中心体１１と複数の放熱フィン１３で構成されている。中心体１１及び放熱フィン１３の材質はアルミニウムである。該中心体１１の上部にはチャンバが形成されている。該チャンバの底面は発光面１１１とされる。該チャンバの内壁面は反射面１１３とされる。そのうち、該中心体１１を貫通するように、中空の二つの管道１１５が設けられ、チャンバはパンチプレス、ミリング或いはその他の周知の方法で形成可能である。   The base 1 includes a center body 11 and a plurality of heat radiation fins 13. The material of the central body 11 and the radiation fin 13 is aluminum. A chamber is formed above the central body 11. The bottom surface of the chamber is a light emitting surface 111. The inner wall surface of the chamber is a reflecting surface 113. Among them, two hollow pipe passages 115 are provided so as to penetrate the central body 11, and the chamber can be formed by a punch press, milling or other well-known methods.

放熱フィン１３は中心体１１を中心として外向きに輻射状に配列設置され、隣り合う放熱フィン１３の間にはギャップが設けられている。そのうち、放熱フィン１３の外端に、外向きに分岐構造１３１が延設され、分岐構造１３１の設置により放熱フィン１３の放熱面積が増加される。また、放熱フィン１３の両側面が高低起伏状を呈し、上述の起伏状は略波形或いは鋸歯状を呈し、放熱フィン１３の両側面が高低起伏状を呈する時、両側面が平坦表面を呈するのと比較すると、放熱フィン１３の両側面が高低起伏状を呈する時の表面積は多く増加する。言い換えると、放熱フィン１３はさらに多くの熱エネルギー放出面積を有し、これにより、ベースの放熱能力を大幅にアップする。そのうち、中心体１１及び放熱フィン１３は実心アルミニウム材で製造される。   The radiating fins 13 are arranged radially outwardly with the central body 11 as a center, and a gap is provided between adjacent radiating fins 13. Among them, the branch structure 131 is extended outwardly at the outer end of the radiation fin 13, and the radiation area of the radiation fin 13 is increased by the installation of the branch structure 131. Moreover, when the both sides | surfaces of the radiation fin 13 exhibit high and low undulation shape, the above-mentioned undulation shape exhibits a substantially waveform or sawtooth shape, and both the side surfaces of the radiation fin 13 exhibit high and low undulation shape, both side surfaces exhibit a flat surface. As compared with the above, the surface area when both side surfaces of the heat radiating fins 13 are undulating is increased. In other words, the heat dissipating fins 13 have a larger heat energy discharge area, thereby greatly increasing the heat dissipating capacity of the base. Among them, the central body 11 and the heat radiating fins 13 are made of real aluminum material.

そのうち、放熱フィン１３の外縁にさらに固定部材１３３を設置可能で、該固定部材１３３の両側壁面もまた高低起伏状を呈し、固定部材１３３の上下側にそれぞれ内向きに突出する固定部１３３ａが設けられ、該固定部１３３ａは物品或いはその他の部品、たとえば、拡散器（ｄｉｆｆｕｓｅｒ）或いはケースと結合するのに用いられる。   Among them, a fixing member 133 can be further installed on the outer edge of the radiating fin 13, and both side wall surfaces of the fixing member 133 also have a high and low undulation shape, and fixing portions 133 a that protrude inward are provided on the upper and lower sides of the fixing member 133. The fixing part 133a is used for coupling with an article or other parts, for example, a diffuser or a case.

発光素子３はいずれも該発光面１１１の上に設置され、発光素子３相互の間は金属導線４がワイヤボンディングされることで電気的接続を構成し、そのうち、発光素子３はアレイ配列方式で該発光面１１１の上に配置され、発光素子３は発光ダイオードチップ或いはその他の適当な発光素子とされ得る。   All the light emitting elements 3 are installed on the light emitting surface 111, and the metal conductive wires 4 are wire-bonded between the light emitting elements 3 to form an electrical connection. Among these, the light emitting elements 3 are arranged in an array arrangement system. Arranged on the light emitting surface 111, the light emitting element 3 can be a light emitting diode chip or other suitable light emitting element.

本発明の好ましい実施例によると、発光面１１１と反射面１１３の上に電気メッキにより光線反射効果を高めるクロム層（図示せず）が形成され、且つ発光面１１１の上のクロム層の上方にさらに電気メッキにより銀層（図示せず）が形成されてもよい。銀層は発光ダイオードチップの実装（ＬＥＤ ｄｉｅ ａｔｔａｃｈｉｎｇ）に便利である。   According to a preferred embodiment of the present invention, a chromium layer (not shown) for enhancing the light reflection effect is formed on the light emitting surface 111 and the reflecting surface 113 by electroplating, and above the chromium layer on the light emitting surface 111. Furthermore, a silver layer (not shown) may be formed by electroplating. The silver layer is convenient for mounting a light-emitting diode chip (LED die attaching).

本発明の実施例において、反射面１１３上にさらに反射カバー（図示せず）が設置されてもよく、反射カバーは発光素子３の発射する光線を受け取り外部空間に反射するのに用いられる。さらに、発光面１１１と反射面１１３の間に形成される相対夾角閘は２０−７０度の間のそのうちの一つの角度が選択され得て、反射面１１３の発光面１１１に対する設置角度が決定されることで、上述の配置関係により、発光素子３の投射する発光角度範囲が制御される。   In the embodiment of the present invention, a reflective cover (not shown) may be further provided on the reflective surface 113, and the reflective cover is used to receive the light emitted from the light emitting element 3 and reflect it to the external space. Further, the relative depression angle 間 に formed between the light emitting surface 111 and the reflecting surface 113 can be selected as one angle between 20-70 degrees, and the installation angle of the reflecting surface 113 with respect to the light emitting surface 111 is determined. Thereby, the light emission angle range which the light emitting element 3 projects is controlled by the above-mentioned arrangement relationship.

図２を参照されたい。二つのリードフレーム５はそれぞれ管道１１５中に設置され、並びに発光素子３の間は導線４がワイヤボンディングされることで接続されて電気的接続を構成し、好ましくは、リードフレーム５の両端部がさらに銀メッキされ、リードフレーム５に発光素子３がワイヤボンディングにより接続される。   Please refer to FIG. The two lead frames 5 are respectively installed in the conduit 115, and the light emitting elements 3 are connected to each other by wire bonding of the conductive wires 4 to form an electrical connection. Preferably, both ends of the lead frame 5 are connected to each other. Further, silver plating is performed, and the light emitting element 3 is connected to the lead frame 5 by wire bonding.

そのうち、管道１１５中には密封体６があり、図２の実施例において、管道１１５の上下部分にそれぞれ密封体６が充填されて、管道１１５が封じられる。密封体６はリードフレーム５を固定し及びリードフレーム５を中心体１１において絶縁するほか、管道１１５を封じて水気のチャンバ中への進入を防止する。そのうち、二つのリードフレーム５と発光素子３は金線でワイヤボンディングされる。   Among them, there is a sealing body 6 in the pipe line 115, and in the embodiment of FIG. The sealing body 6 fixes the lead frame 5 and insulates the lead frame 5 from the central body 11, and also seals the conduit 115 to prevent water from entering the chamber. Among them, the two lead frames 5 and the light emitting element 3 are wire-bonded with gold wires.

密封体６の材質は、ガラス、セラミック及びエポキシ樹脂の少なくとも一つとされる。そのうち、密封体６の形成は、高温環境中で液体状のガラス、セラミック、エポキシ樹脂を充填し、液体状のガラス、セラミック、エポキシ樹脂を凝固させることで密封体６を形成する。   The material of the sealing body 6 is at least one of glass, ceramic, and epoxy resin. Among them, the sealing body 6 is formed by filling liquid glass, ceramic, and epoxy resin in a high temperature environment and solidifying the liquid glass, ceramic, and epoxy resin.

図３を参照されたい。それは本発明の一体化多層式照明装置の第１実施例表示図である。本発明の一体化多層式照明装置はさらに蛍光層７を設置してもよく、蛍光層７は発光素子３を被覆し、発光素子３の光線がいずれも蛍光層７を通過し得る時、蛍光層７と混光作用を発生する。本発明の一体化多層式照明装置はさらにカバー８を設置してもよい。カバー８はチャンバの上を被覆し、並びに中心体１１と密封接合されてチャンバを封鎖する。そのうち、カバーの形式は球形状及び平面状の少なくとも一つとされ、カバーの材質はガラス及びシリコーン樹脂の少なくとも一つとされる。   Please refer to FIG. 1 is a display diagram of a first embodiment of an integrated multilayer lighting device of the present invention. The integrated multilayer illuminating device of the present invention may further include a fluorescent layer 7 that covers the light emitting element 3, and when all of the light from the light emitting element 3 can pass through the fluorescent layer 7, the fluorescent layer 7 It produces a light mixing effect with the layer 7. The integrated multilayer lighting device of the present invention may further be provided with a cover 8. The cover 8 covers the top of the chamber and is hermetically bonded to the central body 11 to seal the chamber. Among them, the type of the cover is at least one of a spherical shape and a planar shape, and the material of the cover is at least one of glass and silicone resin.

以上述べたことは、本発明の実施例にすぎず、本発明の実施の範囲を限定するものではなく、本発明の特許請求の範囲に基づきなし得る同等の変化と修飾は、いずれも本発明の権利のカバーする範囲内に属するものとする。   The above description is only an example of the present invention, and does not limit the scope of the present invention. Any equivalent changes and modifications that can be made based on the scope of the claims of the present invention are all described in the present invention. Shall belong to the scope covered by the rights.

１ ベース
１１ 中心体
１１１ 発光面
１１３ 反射面
１１５ 管道
１３ 放熱フィン
１３１ 分岐構造
１３３ 固定部材
１３３ａ 固定部
３ 発光素子
４ 金属導線
５ リードフレーム
６ 密封体
７ 蛍光層
８ カバー
閘 夾角 DESCRIPTION OF SYMBOLS 1 Base 11 Central body 111 Light emission surface 113 Reflection surface 115 Pipe line 13 Radiation fin 131 Branch structure 133 Fixing member 133a Fixing part 3 Light emitting element 4 Metal conducting wire 5 Lead frame 6 Sealing body 7 Fluorescent layer 8 Cover angle

本発明の実施例において、反射面１１３上にさらに反射カバー（図示せず）が設置されてもよく、反射カバーは発光素子３の発射する光線を受け取り外部空間に反射するのに用いられる。さらに、発光面１１１と反射面１１３の間に形成される相対夾角θは２０−７０度の間のそのうちの一つの角度が選択され得て、反射面１１３の発光面１１１に対する設置角度が決定されることで、上述の配置関係により、発光素子３の投射する発光角度範囲が制御される。 In the embodiment of the present invention, a reflective cover (not shown) may be further provided on the reflective surface 113, and the reflective cover is used to receive the light emitted from the light emitting element 3 and reflect it to the external space. Further, the relative depression angle θ formed between the light emitting surface 111 and the reflecting surface 113 can be selected from one of 20-70 degrees, and the installation angle of the reflecting surface 113 with respect to the light emitting surface 111 is determined. Thereby, the light emission angle range which the light emitting element 3 projects is controlled by the above-mentioned arrangement relationship.

１ ベース
１１ 中心体
１１１ 発光面
１１３ 反射面
１１５ 管道
１３ 放熱フィン
１３１ 分岐構造
１３３ 固定部材
１３３ａ 固定部
３ 発光素子
４ 金属導線
５ リードフレーム
６ 密封体
７ 蛍光層
８ カバー
θ 夾角 DESCRIPTION OF SYMBOLS 1 Base 11 Central body 111 Light emission surface 113 Reflection surface 115 Pipe line 13 Radiation fin 131 Branch structure 133 Fixing member 133a Fixing part 3 Light emitting element 4 Metal conducting wire 5 Lead frame 6 Sealing body 7 Fluorescent layer 8 Cover
θ夾

Claims (16)

一体化多層式照明装置において、
ベースであって、中心体及び複数の放熱フィンを包含し、該中心体の上部にチャンバが形成され、該チャンバの底面が発光面とされ、該チャンバの内壁面は反射面とされ、そのうち、該中心体を貫通するように中空の二つの管道が設けられた、上記ベースと、
複数の発光素子であって、該発光面の上に設置され、これら発光素子相互の間はワイヤボンディングで接続され、電気的接続を構成する、上記複数の発光素子と、
二つのリードフレームであって、それぞれが該管道の中に設置され、並びにこれら発光素子とワイヤボンディングにより接合されて、電気的接続を構成し、そのうち一つの該管道中に少なくとも一つの密封体が設けられ、該密封体は該リードフレームを固定し並びに該管道を封鎖する、上記二つのリードフレームと、
を包含することを特徴とする、一体化多層式照明装置。 In an integrated multilayer lighting device,
A base including a central body and a plurality of heat dissipating fins, a chamber is formed at an upper portion of the central body, a bottom surface of the chamber is a light emitting surface, and an inner wall surface of the chamber is a reflective surface, The base provided with two hollow conduits so as to penetrate the central body;
A plurality of light-emitting elements, which are installed on the light-emitting surface, and are connected by wire bonding between the light-emitting elements to form an electrical connection;
Two lead frames, each of which is installed in the conduit and joined to the light emitting element by wire bonding to form an electrical connection, and at least one sealing body is formed in one of the conduits. The two lead frames, wherein the sealing body fixes the lead frame and seals the conduit;
An integrated multilayer illuminating device comprising: 請求項１記載の一体化多層式照明装置において、該中心体と該放熱フィンの材質はアルミニウムとされることを特徴とする、一体化多層式照明装置。   2. The integrated multilayer lighting device according to claim 1, wherein a material of the central body and the radiation fin is aluminum. 請求項１記載の一体化多層式照明装置において、該チャンバはパンチプレス及びミリングの少なくとも一方により形成されることを特徴とする、一体化多層式照明装置。   2. The integrated multilayer illumination device according to claim 1, wherein the chamber is formed by at least one of a punch press and milling. 請求項１記載の一体化多層式照明装置において、これら発光素子はアレイ配列方式で該発光面の上に配置されることを特徴とする、一体化多層式照明装置。   2. The integrated multilayer illumination device according to claim 1, wherein the light emitting elements are arranged on the light emitting surface in an array arrangement manner. 請求項１記載の一体化多層式照明装置において、これら発光素子は発光ダイオードとされることを特徴とする、一体化多層式照明装置。   2. The integrated multilayer lighting device according to claim 1, wherein the light emitting elements are light emitting diodes. 請求項１記載の一体化多層式照明装置において、該発光面と該反射面の上に電気メッキによりクロム層が形成されることを特徴とする、一体化多層式照明装置。   2. The integrated multilayer lighting device according to claim 1, wherein a chromium layer is formed on the light emitting surface and the reflecting surface by electroplating. 請求項６記載の一体化多層式照明装置において、該発光面の上の該クロム層の上方にさらに電気メッキにより銀層が形成されることを特徴とする、一体化多層式照明装置。   7. The integrated multilayer lighting device according to claim 6, wherein a silver layer is further formed by electroplating above the chromium layer on the light emitting surface. 請求項１記載の一体化多層式照明装置において、これら二つのリードフレームとこれら発光素子が金線を用いたワイヤボンディングにより接続されることを特徴とする、一体化多層式照明装置。   2. The integrated multilayer illumination device according to claim 1, wherein the two lead frames and the light emitting elements are connected by wire bonding using a gold wire. 請求項１記載の一体化多層式照明装置において、該密封体の材料がガラス、セラミック及びエポキシ樹脂の少なくとも一つとされることを特徴とする、一体化多層式照明装置。   2. The integrated multilayer lighting device according to claim 1, wherein the material of the sealing body is at least one of glass, ceramic and epoxy resin. 請求項１記載の一体化多層式照明装置において、該リードフレームの両端部に銀メッキがされることを特徴とする、一体化多層式照明装置。   2. The integrated multilayer lighting device according to claim 1, wherein both ends of the lead frame are silver-plated. 請求項１記載の一体化多層式照明装置において、反射カバーをさらに包含し、該反射カバーは該反射面の上に設置されることを特徴とする、一体化多層式照明装置。   2. The integrated multilayer lighting device according to claim 1, further comprising a reflective cover, wherein the reflective cover is installed on the reflective surface. 請求項１０記載の一体化多層式照明装置において、該発光面と該反射面の間に構成される夾角が２０−７０度の間とされることを特徴とする、一体化多層式照明装置。   11. The integrated multilayer lighting device according to claim 10, wherein a depression angle formed between the light emitting surface and the reflecting surface is between 20 and 70 degrees. 請求項１記載の一体化多層式照明装置において、蛍光層をさらに包含し、該蛍光層はこれら発光素子を被覆することを特徴とする、一体化多層式照明装置。   2. The integrated multilayer lighting device according to claim 1, further comprising a fluorescent layer, and the fluorescent layer covers these light emitting elements. 請求項１記載の一体化多層式照明装置において、カバーを包含し、該カバーは該チャンバの上の被覆し、並びに該中心体と密封接合されて該チャンバを封鎖することを特徴とする、一体化多層式照明装置。   The integrated multi-layer lighting device according to claim 1, comprising a cover, the cover covering the chamber and sealingly joined to the central body to seal the chamber. Multi-layer lighting system. 請求項１４記載の一体化多層式照明装置において、該カバーが球形状又は平面状の少なくともいずれかとされることを特徴とする、一体化多層式照明装置。   15. The integrated multilayer lighting device according to claim 14, wherein the cover is at least one of a spherical shape and a planar shape. 請求項１４記載の一体化多層式照明装置において、該カバーの材質がガラス及びシリコーン樹脂の少なくとも一方とされることを特徴とする、一体化多層式照明装置。   15. The integrated multilayer lighting device according to claim 14, wherein the cover is made of at least one of glass and silicone resin.
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