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JP2013158943A5 - - Google Patents

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Publication number
JP2013158943A5
JP2013158943A5 JP2012020663A JP2012020663A JP2013158943A5 JP 2013158943 A5 JP2013158943 A5 JP 2013158943A5 JP 2012020663 A JP2012020663 A JP 2012020663A JP 2012020663 A JP2012020663 A JP 2012020663A JP 2013158943 A5 JP2013158943 A5 JP 2013158943A5
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JP
Japan
Prior art keywords
resin
substrate
molding
sealing
contact area
Prior art date
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Granted
Application number
JP2012020663A
Other languages
English (en)
Japanese (ja)
Other versions
JP5723800B2 (ja
JP2013158943A (ja
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Publication date
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Priority claimed from JP2012020663A external-priority patent/JP5723800B2/ja
Priority to JP2012020663A priority Critical patent/JP5723800B2/ja
Priority to TW102100216A priority patent/TWI527273B/zh
Priority to KR1020130004818A priority patent/KR101432423B1/ko
Priority to MYPI2013000198A priority patent/MY173863A/en
Priority to CN201310022344.8A priority patent/CN103247739B/zh
Publication of JP2013158943A publication Critical patent/JP2013158943A/ja
Publication of JP2013158943A5 publication Critical patent/JP2013158943A5/ja
Publication of JP5723800B2 publication Critical patent/JP5723800B2/ja
Application granted granted Critical
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Anticipated expiration legal-status Critical

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JP2012020663A 2012-02-02 2012-02-02 半導体チップの圧縮樹脂封止成形方法及び装置 Active JP5723800B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012020663A JP5723800B2 (ja) 2012-02-02 2012-02-02 半導体チップの圧縮樹脂封止成形方法及び装置
TW102100216A TWI527273B (zh) 2012-02-02 2013-01-04 Method and apparatus for sealing resin sealing of semiconductor wafer and apparatus for preventing edge of resin
KR1020130004818A KR101432423B1 (ko) 2012-02-02 2013-01-16 반도체 칩의 압축 수지 밀봉 성형 방법 및 장치와 수지 버어 방지용 테이프
MYPI2013000198A MY173863A (en) 2012-02-02 2013-01-18 Resin sealing compression molding method and apparatus for semiconductor chips, and resin burr prevention tape
CN201310022344.8A CN103247739B (zh) 2012-02-02 2013-01-22 半导体芯片的压缩树脂密封成型方法和装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012020663A JP5723800B2 (ja) 2012-02-02 2012-02-02 半導体チップの圧縮樹脂封止成形方法及び装置

Publications (3)

Publication Number Publication Date
JP2013158943A JP2013158943A (ja) 2013-08-19
JP2013158943A5 true JP2013158943A5 (ko) 2014-12-11
JP5723800B2 JP5723800B2 (ja) 2015-05-27

Family

ID=49171612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012020663A Active JP5723800B2 (ja) 2012-02-02 2012-02-02 半導体チップの圧縮樹脂封止成形方法及び装置

Country Status (1)

Country Link
JP (1) JP5723800B2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6525580B2 (ja) * 2014-12-24 2019-06-05 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008205149A (ja) * 2007-02-20 2008-09-04 Towa Corp 発光体の形成方法及び金型
JP2008207450A (ja) * 2007-02-27 2008-09-11 Towa Corp 発光素子の圧縮成形方法

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