JP2013026257A - Laminate type electronic component manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminate type electronic component manufacturing method which makes it possible to manufacture compact and high capacity electronic components free of variations in characteristics at low cost.SOLUTION: The laminate type electronic component manufacturing method comprises the steps of: forming an electrode paste film on a green sheet with a prescribed pattern; laminating green sheets to prepare a laminate 4a; bonding the laminate to an adhesive layer 34 of a support substrate 36; cutting the laminate, without cutting the support substrate, along a first direction intersecting the laminate directing at right angles to form terminal electrode connection faces 15a, 15b and cutting the laminate and the support substrate along a second direction intersecting the laminate and the first directions at right angles to form a gap face 16, thereby obtaining a rod-like body 38 which is integrated with the support substrate; arranging a plurality of rod-like bodies 38 so that the gap faces will be disposed on the same plane and applying a coating of ceramic paste 42 to the gap faces 16; and weakening the adhesive force of the adhesive layer to separate a laminate 2a and the support substrate 36.

Description

  The present invention relates to a method for manufacturing a multilayer electronic component.

  For example, when manufacturing a multilayer electronic component such as a multilayer ceramic capacitor, an electrode paste is printed in a predetermined pattern on a ceramic green sheet, and then the ceramic green sheet is stacked to manufacture a multilayer body. A process of cutting to size is required. However, in the conventional method, due to variations in electrode paste printing, stacking displacement, cutting displacement, etc., the area of the opposing region of the internal electrode layer that contributes to the capacitance of the capacitor tends to vary, resulting in variation in the capacitance of the capacitor. Have the problem of

  Therefore, after a green body having a belt-like electrode paste film formed thereon is laminated to produce a laminated body and the laminated body is cut to produce a laminated body chip, each laminated body chip has a predetermined direction. A technique for manufacturing an electronic component with small variations in capacitance by forming an insulating gap region so as to face each other is known (see Patent Document 1).

  However, the technique shown in Patent Document 1 has a problem that it takes time and labor costs because it is necessary to arrange the laminated chips that have been separated after being cut one by one in order.

JP 2010-267915 A

  The present invention has been made in view of such a situation, and an object of the present invention is to provide a method for manufacturing a multilayer electronic component capable of manufacturing a small and high-capacity electronic component at low cost with little variation in characteristics. It is to be.

In order to achieve the above object, a method for manufacturing a multilayer electronic component according to the present invention includes:
Forming an electrode paste film that becomes an internal electrode layer after firing in a predetermined pattern on the surface of the green sheet that becomes the ceramic layer after firing;
A step of preparing a laminate by laminating the green sheet on which the electrode paste film is formed;
Attaching the laminate to the adhesive layer of the support substrate;
Along the first direction perpendicular to the laminating direction of the ceramic layers, the support substrate is cut without cutting the laminated body to form a terminal electrode connection surface, and perpendicular to the laminating direction and the first direction. Cutting the laminate and the support substrate along a second direction to form a gap surface, and obtaining a rod-shaped body integrated with the support substrate;
Arranging the plurality of rod-shaped bodies so that the gap surfaces are arranged in the same plane, and applying a ceramic paste to the gap surfaces;
A step of weakening the adhesive force of the adhesive layer and separating the laminate and the support substrate.

  In the present invention, the gap surface is formed on the cut surface of the laminate by cutting the laminate and the support substrate along the second direction. That is, the end portions of the electrode paste film are aligned on the gap surface. Further, by cutting the laminated body along the first direction, the laminated body becomes individual chips (green chips before firing), but the support substrate is not cut along the first direction. A rod-like body in which individual chips are aligned can be obtained on the surface of a long rectangular support substrate via an adhesive layer.

  Next, a plurality of rod-shaped bodies are arranged so that the gap surfaces are arranged on the same plane. As described above, a large number of chips are arranged in the rod-shaped body via the support substrate. For this reason, the ceramic paste can be applied to the gap surfaces of the plurality of chips at a uniform thickness at a time. Thereafter, by weakening the adhesive force of the adhesive layer of the support substrate, the chip having the ceramic paste film formed on the gap surface can be separated (divided into individual pieces). For this reason, it is possible to greatly reduce the time and effort required to obtain individual chips. The portion coated with the ceramic paste described above becomes a gap region after firing.

  In addition, since the end portions of the electrode paste film are aligned on the gap surface, the thickness of the gap region can be reduced as compared with the conventional case. Therefore, the electronic component can be further downsized. Moreover, even if the size of the electronic component is reduced, the opposing area of the opposing internal electrode layers can be increased, and the capacitance can be improved.

  In the present invention, since the gap region is formed after the electrode paste film is exposed on the gap surface, the electrode paste film does not protrude from the gap region, and the gap region can be formed with a uniform thickness. Therefore, the protection effect of the internal electrode layer by the gap region is improved. For example, even if the terminal electrode connection surface of the chip after firing is plated as a terminal electrode, the plating solution does not enter the chip, and short circuit defects can be prevented. Further, the internal electrode can be effectively protected in the usage state of the electronic component.

  Preferably, the terminal electrode connection surface exposes connection ends of the electrode paste films to be connected to a pair of terminal electrodes, respectively, and the gap surface facing the second direction includes The laminate is cut so that the side edges of the electrode paste film are exposed.

  By cutting the laminate as described above, it is not necessary to consider cutting deviation at least on the gap surface. For example, only the connection end of the electrode paste film connected to one terminal electrode should be exposed on one terminal electrode connection surface, and the electrode paste connected to the other terminal electrode should be exposed on the other terminal electrode connection surface Since only the connection end of the film should be exposed, it is necessary to cut so as not to cause a cutting shift. On the other hand, on the gap surface, the laminate is cut so that the electrode paste film is exposed as described above, and then the gap region is formed.

  Preferably, the rod-shaped bodies are arranged on the surface of the alignment substrate so as to be in close contact with each other via the support substrate attached to the rod-shaped body.

  By arranging the rod-shaped bodies as described above, the ceramic paste can be applied to the gap surface at a time for the plurality of rod-shaped bodies, and a large number of chips can be manufactured efficiently. In addition, after the adhesive strength of the adhesive layer is weakened, the adjacent rod-like bodies are arranged via the support substrate, so that the chips can be separated into pieces automatically.

  Preferably, the ceramic paste is applied in a predetermined pattern by screen printing. Accordingly, the ceramic paste can be applied only to the gap surface of the multilayer body without applying the ceramic paste to the cut surface of the support substrate. Therefore, when the chips are separated after the adhesive strength of the adhesive layer is weakened, the chips can be separated without applying an external force or the like.

  After weakening the adhesive strength of the adhesive layer, an external force may be applied to the rod-shaped body to separate the laminate from the support substrate. Preferably, the adhesive layer is composed of an adhesive layer whose adhesive strength is reduced by heat, an adhesive layer whose adhesive strength is reduced by ultraviolet rays, a water-soluble adhesive layer, or the like.

  If the adhesive layer is an adhesive layer whose adhesive strength is reduced by heat, the support substrate can be peeled from the chip only by heating the laminate. Further, if the adhesive layer is an adhesive layer whose adhesive strength is reduced by ultraviolet rays, the support substrate can be peeled from the chip only by irradiating the ultraviolet rays. Further, if the adhesive layer is a water-soluble adhesive layer, the supporting substrate can be peeled from the chip only by water treatment. Moreover, what mixed the resin component which has these functions may be used, In this case, it becomes possible to reduce adhesive force simply by optimizing the combination of various conditions.

  Preferably, the method further includes a step of barrel polishing an element body obtained by separating the laminate from the support substrate. Thereby, the corner | angular part of a chip | tip can be grind | polished and it can prevent that a crack generate | occur | produces in a chip | tip at the time of a subsequent manufacturing process (binder removal and a baking process etc.) or a product use.

  The support substrate may be cut in advance along the second direction.

FIG. 1 is a sectional view of a multilayer ceramic capacitor manufactured by an electronic component manufacturing method according to an embodiment of the present invention. 2 is a cross-sectional view taken along the line II-II shown in FIG. FIG. 3 is a cross-sectional view illustrating a laminated body in which green sheets on which electrode paste is formed are laminated in one manufacturing process of the multilayer ceramic capacitor shown in FIG. FIG. 4 is a perspective view showing a process of attaching the laminate shown in FIG. 3 to the adhesive layer of the support substrate. FIG. 5 is a perspective view exaggerating the state in which the laminate is cut along the cutting line shown in FIG. FIG. 6 is a perspective view showing a state in which the respective rod-like bodies shown in FIG. 5 are arranged on the surface of the alignment substrate. FIG. 7 is a perspective view showing a state in which a ceramic paste is applied to one gap surface of the rod-like body shown in FIG. FIG. 8 is a perspective view showing a state in which a ceramic paste is applied to the other gap surface of the rod-like body shown in FIG. 9A is a cross-sectional view taken along the line IXA-IXA shown in FIG. 8, and FIG. 9B is a cross-sectional view showing a state after the pressure-sensitive adhesive force of the stick-shaped body shown in FIG. 9A is weakened. FIG. 9C is a schematic cross-sectional view showing a state in which the green chip is separated. FIG. 10 is a perspective view showing a state in which a ceramic paste is printed on one gap surface of the rod-like body shown in FIG. 6 by screen printing. 11A is a cross-sectional view of a rod-like body on which ceramic paste is printed by screen printing, and FIG. 11B is a state after the adhesive force of the stick-like layer of the rod-like body shown in FIG. 11A is weakened. FIG. 11C is a schematic cross-sectional view showing a state where the green chip is divided into pieces. FIG. 12 is a perspective view showing one process of manufacturing an electronic component in another embodiment of the present invention.

First Embodiment First, an overall configuration of a multilayer ceramic capacitor having a dielectric layer as a ceramic layer will be described as an embodiment of a multilayer electronic component manufactured by a method according to an embodiment of the present invention.

    As shown in FIG. 1, the multilayer ceramic capacitor 2 according to the present embodiment includes an element body 4, a first terminal electrode 6 formed outside the first terminal electrode connection surface 15 a of the element body 4, and an element body. 4 and the second terminal electrode 8 formed outside the second terminal electrode connection surface 15b. The first terminal electrode connection surface 15a and the second terminal electrode connection surface 15b face each other in the X-axis direction. The element body 4 includes a first internal electrode layer 12 and a second internal electrode layer 13, and the internal electrode layers 12 and 13 are interposed between the first inner dielectric layer 10 and the second inner dielectric layer 11. They are stacked alternately.

    The element body 4 has outer dielectric layers 14 on both end faces in the stacking direction (Z-axis direction). The connection ends 12 a of the first internal electrode layers 12 that are alternately stacked are exposed to the first terminal electrode connection surface 15 a of the element body 4 and are electrically connected to the first terminal electrode 6. The connection end 13 a of the other second internal electrode layer 13 that is alternately stacked is exposed at the second terminal electrode connection surface 15 b of the element body 4 and is electrically connected to the second terminal electrode 8.

  As shown in FIG. 2, the connection terminals 13a of the second internal electrode layers 13 are exposed at predetermined intervals in the Z-axis direction on the second terminal electrode connection surface 15b. The second internal electrode layers 13 are formed in a straight line along the Y-axis direction, and the side ends 13b are arranged in a line along the gap surface 16 substantially perpendicular to the Y-axis. A gap region 17 is formed on the outer side of each gap surface 16 in the Y-axis direction.

  The first terminal electrode connection surface 15a is the same as in FIG. 2, and the connection terminals 12a of the first internal electrode layer 12 are exposed at a predetermined interval in the Z-axis direction on the first terminal electrode connection surface 15a. Yes. The first internal electrode layers 12 are formed linearly along the Y-axis direction, and the side ends 12b are arranged in a line along the gap surface 16 that is substantially perpendicular to the Y-axis. A gap region 17 is formed on the outer side of each gap surface 16 in the Y-axis direction.

  The materials of the first and second inner dielectric layers 10 and 11, the outer dielectric layer 14 and the gap region 17 are not particularly limited, and for example, a dielectric material such as calcium titanate, strontium titanate and / or barium titanate. Consists of. The thickness of each inner dielectric layer 10, 11 is not particularly limited, but is generally 0.5 μm to several tens of μm. Further, the thickness of the outer layer portion composed of the outer dielectric layer 14 is not particularly limited, but is preferably in the range of 10 to 200 μm.

  The material of the first and second terminal electrodes 6 and 8 is not particularly limited, but is usually at least one of Ni, Pd, Ag, Au, Cu, Pt, Rh, Ru, Ir, Sn, Ti, or the like. Alloys can be used. Usually, Cu, Cu alloy, Ni, Ni alloy, etc., Ag, Ag—Pd alloy, etc. are used. Although the thickness of the terminal electrodes 6 and 8 is not particularly limited, for example, it can be about 5 to 30 μm.

  The shape and size of the multilayer ceramic capacitor 2 may be appropriately determined according to the purpose and application. The multilayer ceramic capacitor 2 is usually about 0.2 to 5.7 mm in length, 0.1 to 5.0 mm in width, and about 0.1 to 3.2 mm in thickness.

  Next, the manufacturing method of the multilayer ceramic capacitor 2 as one embodiment of the present invention will be described.

  First, the sheet laminate 4a shown in FIG. 3 is formed. In order to form the sheet laminate 4a, the first green sheet 10a on which the first internal electrode pattern 12c is formed and the second green sheet 11a on which the second internal electrode pattern 13c is formed are alternately laminated, The stacked body 4a is formed.

  The dielectric paste for forming the green sheets 10a and 11a is usually composed of an organic solvent-based paste or an aqueous paste obtained by kneading ceramic powder and an organic vehicle.

  The organic vehicle is obtained by dissolving a binder in an organic solvent. The binder used for the organic vehicle is not particularly limited, and may be appropriately selected from usual various binders such as ethyl cellulose and polyvinyl butyral.

  The internal electrode patterns 12c and 13c are formed on the surfaces of the green sheets 10a and 11a. The internal electrode paste for forming the internal electrode patterns 12c and 13c is composed of various conductive metals and alloys, or various oxides, organometallic compounds, resinates and the like that become conductive materials after firing, Prepare by kneading with vehicle. The internal electrode paste may contain a ceramic powder as a co-material as necessary. The common material has an effect of suppressing the sintering of the conductive powder in the firing process.

  The green sheets 10a and 11a are formed by a doctor blade method using the above-described dielectric paste. Further, in order to form the internal electrode patterns 12c and 13c on the respective surfaces of the green sheets 10a and 11a, screen printing or the like may be performed using the internal electrode paste.

  The first green sheet 10a in the sheet laminate 4a is the part that will eventually become the first inner dielectric layer 10 shown in FIG. 1, and the second green sheet 11a is finally the second green sheet shown in FIG. This is a portion that becomes the inner dielectric layer 11. Further, the first internal electrode pattern 12c is a portion that finally becomes the first internal electrode layer 12 shown in FIG. 1, and the second internal electrode pattern 13c is finally the second internal electrode shown in FIG. This is the portion that becomes the layer 13.

  In FIG. 3, for ease of illustration, the number of laminated internal electrode patterns 12 c and 13 c in the sheet laminate 4 a is small, but it can be freely set from several layers to several hundred layers.

  Note that green sheets 14a to be the outer dielectric layers 14 are stacked at both ends in the stacking direction Z of the sheet stack 4a. The thickness in the stacking direction Z of the sheet laminate 4a corresponds to the thickness of the element body 4 shown in FIG. 1 after firing.

  As shown in FIG. 3, in the sheet laminated body 4a, the first internal electrode pattern 12c and the second internal electrode pattern 13c are along the electrode longitudinal direction X (direction perpendicular to the stacking direction Z) of the patterns 12c and 13c. It is a rectangular repeating pattern that is shifted by a half pattern. The first internal electrode pattern 12c and the second internal electrode pattern 13c are continuously formed in the Y-axis direction perpendicular to the X-axis and the Z-axis.

  Next, as shown in FIG. 4, the sheet laminate 4 a is attached to the surface of the adhesive layer 34 of the support substrate 36 with one side in the lamination direction of the sheet laminate 4 a. The support substrate 36 includes a support film layer 32 and an adhesive layer 34. The material of the support film layer 32 is not particularly limited, but it is preferable to use PET or the like. The adhesive layer 34 is preferably composed of an adhesive layer whose adhesive strength is reduced by heat, an adhesive layer whose adhesive strength is reduced by ultraviolet rays, a water-soluble adhesive layer, or the like. The pressure-sensitive adhesive layer whose adhesive strength is reduced by heat is preferably composed of a thermally foamed resin. The pressure-sensitive adhesive layer whose adhesive strength is reduced by ultraviolet rays is preferably composed of a UV resin. The water-soluble adhesive layer is preferably composed of a water-soluble resin. Further, as the adhesive layer, a mixture of a plurality of resin components whose adhesive strength is reduced by the functions such as heat, ultraviolet rays, and water solubility may be used. In that case, by optimizing the combination of various conditions such as heating, ultraviolet irradiation, moisture application, etc., the adhesive strength can be reduced in a shorter time than when the adhesive strength of the adhesive layer having a single function is reduced. Is possible. In the present embodiment, the adhesive layer 34 is described as an adhesive layer whose adhesive force is reduced by heat.

  Next, as shown in FIG. 4, the sheet laminated body 4a is cut along a first cutting line 30x along the first direction (X-axis direction). Further, the sheet laminate 4a is cut along the second cutting line 30y along the second direction (Y-axis direction). The sheet laminate 4a may be cut along the second cutting line 30y, and then the sheet laminate 4a may be cut along the first cutting line 30x. The order is not limited. When cutting the sheet laminate 4a along the second cutting line 30y, the sheet laminate 4a is completely cut from the sheet laminate 4a to the support film layer 32 as shown in FIG. Then, as shown in FIG. 4, when cutting along the first cutting line 30x, as shown in FIG. 5, at least the sheet laminate 4a is cut completely, and the support film layer 32 is Avoid cutting.

  As a result of performing such cutting, as shown in FIG. 5, a rectangular parallelepiped rod-like body 38 that is long in the X-axis direction, in which each green chip 2 a is bonded to the support film layer 32 via the adhesive layer 34, A plurality can be obtained.

   Next, as shown in FIG. 6, a plurality of rod-like bodies 38 are brought into close contact with each other via the support substrate 36 on the surface 40 a of the print holding plate 40 so that the gap surface 16 is arranged on the same plane. The rod-shaped body group 38a is formed side by side. The rod-shaped body group 38a is configured by the green chips 2a being densely arranged in a matrix in the X-axis direction and the Z-axis direction. A support substrate 36 is interposed between the green chips 2a in the rod-shaped body group 38a.

  Next, as shown in FIG. 7, the ceramic slurry 42 that becomes the gap region 17 after firing is applied to the entire surface where the gap surfaces 16 are arranged, for example, by a doctor blade method. Next, after the coating film of the ceramic slurry 42 is dried, as shown in FIG. 8, the rod-shaped body group 38a is rotated by 180 ° as shown by an arrow in FIG. Place on top. Also at this time, the ceramic slurry 42 that becomes the gap region 17 after firing is applied to the entire plane on which the gap surfaces 16 are arranged, for example, by a doctor blade method. Thereafter, the coating film of the ceramic slurry 42 is dried. A state in which the ceramic slurry 42 is applied and dried on the gap surfaces on both sides is shown in FIG. 9 (A) in the section IXA-IXA in FIG.

  Next, the rod-shaped body group 38a is heated, and the adhesive layer (thermal foaming layer) 34 is removed as shown in FIG. Although heating temperature will not be specifically limited if it is the temperature which the adhesive force of the adhesion layer 34 falls, For example, it is preferable that it is 90-150 degreeC. Note that the adhesive layer 34 does not necessarily need to be completely removed, and it is sufficient that the adhesive layer 34 is easily peeled off by reducing the contact area between the green chip 2a and the support film layer 32. In the illustration of FIG. 9B, the adhesive layer 34 is completely removed. At this time, the dried coating film of the ceramic slurry 42 connects the individual green chips 2a.

  Next, a light external force is applied to the rod-shaped body group 38a, the connected parts are broken, and the green chip 2a is separated into individual pieces (FIG. 9C). Preferably, for example, barrel polishing is performed on the separated green chip 2a. Thereby, the corner | angular part of the green chip 2a is shaved and R is formed, and generation | occurrence | production of a crack etc. can be prevented. By forming R at the corners by barrel polishing, the corners of the green chip 2a can be polished and removed, and the chip is used during subsequent manufacturing processes (such as binder removal and firing) or during product use. It is possible to prevent cracks from occurring.

  After polishing, the binder removal process is performed, and then the green chip 2a is fired. The binder removal treatment and firing are performed under general conditions.

  The terminal electrode connection surfaces 15a and 15b of the capacitor element body obtained as described above are subjected to end surface polishing by, for example, barrel polishing or sand blasting, and a terminal electrode paste is applied and baked, and if necessary, plating is performed. Then, the first terminal electrode 6 and the second terminal electrode 8 shown in FIG. 1 are formed.

  The multilayer ceramic capacitor 2 of the present embodiment manufactured as described above is mounted on a printed circuit board by soldering or the like, and used for various electronic devices.

  In this embodiment, as shown in FIG. 4, the gap surface 16 is formed on the cut surface of the ceramic laminate 4a by cutting the ceramic laminate 4a and the support substrate 36 along the second direction (Y-axis direction). Is done. That is, the side edges 12 b and 13 b of the first internal electrode layer 12 and the second internal electrode layer 13 are aligned on the gap surface 16.

  Further, by cutting the ceramic laminate 4a along the first direction (X-axis direction), the ceramic laminate 4a becomes individual chips (green chips 2a before firing), but the support film layer 32 is the first Since it does not cut along the direction, a rod-like body 38 in which the individual green chips 2a are aligned via the adhesive layer 34 can be obtained on the surface of the rectangular support film layer 32 that is long in the X-axis direction.

  Next, as shown in FIG. 6, a plurality of rod-like bodies 38 are arranged so that the gap surface 16 is arranged on the same plane. As described above, a large number of green chips 2 a are arranged on the rod-shaped body 38 via the support substrate 36. Since the rod-shaped bodies 38 are arranged as described above, the ceramic paste 42 can be applied to the gap surfaces 16 of the plurality of green chips 2a at a uniform thickness at a time, and a large amount of the green chips 2a is efficiently manufactured. be able to.

  Thereafter, the adhesive force of the adhesive layer 34 of the support substrate 36 is weakened. After the adhesive strength of the adhesive layer 34 is weakened by heat, the adjacent rod-shaped bodies 38 are arranged via the support film layer 32, so that the green chip 2a can be automatically separated. it can. For this reason, it is possible to greatly reduce the time and effort required to obtain the individual green chips 2a. The portion coated with the ceramic paste 42 described above becomes the gap region 17 after firing.

  Further, since the side end portions 12b and 13b of the first internal electrode layer 12 and the second internal electrode layer 13 are aligned on the gap surface 16, the thickness WO in the Y-axis direction of the gap region 17 is conventionally (50 to 60 μm). Can be made thinner. In the present embodiment, the thickness of the gap region 17 (the thickness from the gap surface 16 to the outer surface in the Y-axis direction of the element body 4) WO can be set to WO = 1.0 to 30 μm. However, in consideration of moisture resistance and strength when used as an electronic component, the thickness after sintering is preferably set to 5.0 μm or more. In the present embodiment, the thickness WO of the gap region 17 in the Y-axis direction can be made uniform along the Z-axis direction. Therefore, the multilayer ceramic capacitor 2 can be further downsized. Further, even if the size of the multilayer ceramic capacitor 2 is reduced, the opposing area of the opposing internal electrode layers (the first internal electrode layer 12 and the second internal electrode layer 13) can be increased, and the capacitance is improved. be able to.

  In the present embodiment, the gap region 17 is formed after the electrode paste films (the first internal electrode pattern 12 c and the second internal electrode pattern 13 c) are exposed on the gap surface 16. Therefore, the electrode paste film (the first internal electrode pattern 12c and the second internal electrode pattern 13c) does not protrude from the gap region 17, and the gap region 17 can be formed with a uniform thickness. Therefore, the protective effect of the internal electrode layers (first internal electrode layer 12 and second internal electrode layer 13) by the gap region 17 is improved. For example, even if the first terminal electrode connection surface 15a and the second terminal electrode connection surface 15b of the fired chip are plated to form the first terminal electrode 6 and the second terminal electrode 8, the plating solution enters the chip. And short circuit failure can be prevented. Further, there is an effect of protecting the internal electrodes (the first internal electrode layer 12 and the second internal electrode layer 13) when the multilayer ceramic capacitor 2 is used.

  Further, by cutting the sheet laminate 4a as in the present embodiment, it is not necessary to consider at least the cutting deviation at the gap surface 16. For example, only the connection end 12a of the first internal electrode pattern 12c connected to the first terminal electrode 6 should be exposed on the first terminal electrode connection surface 15a, and the second terminal electrode connection surface 15b has a second Only the connection end 13b of the second internal electrode pattern 13c connected to the terminal electrode 8 should be exposed. Therefore, it is necessary to cut so as not to cause cutting deviation. On the other hand, on the gap surface 16, the sheet laminate 4a is cut so that the electrode paste films (the first internal electrode pattern 12c and the second internal electrode pattern 13c) are exposed as described above, and then the gap region is formed. Since they are formed, there is no problem even if a cutting deviation occurs.

  Moreover, since the adhesion layer 34 is a heat | fever foaming layer, the support film layer 32 can be peeled from the green chip 2a only by heating the sheet | seat laminated body 4a.

Second Embodiment A multilayer ceramic capacitor 2 is manufactured in the same manner as in the first embodiment except as described below.

  In this embodiment, as shown in FIG. 10, in the step of applying the ceramic slurry 42 to the gap surface 16 of the rod-shaped body group 38a, the ceramic paste 42 is printed in a predetermined pattern by screen printing. As shown in FIG. 10, the mesh 46 is arranged on the screen 44 at a predetermined interval along a direction orthogonal to the printing direction in a rectangular pattern that is long in the printing direction indicated by an arrow. The screen 44 on which such a mesh 46 is formed is arranged so that the mesh 46 and the gap surface 16 correspond to each other.

  Next, the ceramic slurry 42 is printed on the gap surface 16 of the rod-shaped body group 38a while sliding the squeegee 48 in the direction of the arrow in FIG. A cut surface of the rod-shaped body group 38a in a state where the ceramic slurry 42 is printed on the gap surface 16 is shown in FIG.

  In the present embodiment, the ceramic paste 42 is applied only to the gap surface 16 of the green chip 2 a without applying the ceramic paste 42 to the cut surface 36 a of the support substrate 36. And the rod-shaped body group 38a is heated, and as shown in FIG.11 (B) and FIG.11 (C), the adhesion layer (thermal foam sheet) 34 is removed. In the present embodiment, the dried ceramic slurry 42 does not connect the individual green chips 2a. Therefore, when the green chip 2a is singulated after the adhesive strength of the adhesive layer 34 is weakened, the green chip 2a can be singulated without applying an external force or the like.

   5 shows the result of cutting the sheet laminate 4a and the adhesive layer 34 along the second cutting line 30y, the adhesive layer 34 does not necessarily have to be cut. In the above-described embodiment, the sheet laminate 4a and the support substrate 36 are cut using the same cutting tool. However, when cutting along the first cutting line 30x, the sheet laminate 4a You may cut | disconnect the support film layer 32 using a separate cutting tool.

  Further, as shown in FIG. 12, the support substrate 36 may be cut in advance along the Y-axis direction at a predetermined interval (cut line 39). After attaching one side of the sheet laminate 4a in the stacking direction to the surface of the adhesive layer 34 of the strip-shaped support substrate 36, only the sheet laminate 4a is cut along the first cutting line 30x and the second cutting line 30y. You may do it. Moreover, the sheet | seat laminated body 4a may be separated into pieces previously.

  Moreover, when the ceramic paste 42 is applied to the gap surface 16 of the sheet laminated body 4a pressed in the laminating direction as in the above-described embodiment, the gap region 17 is compared with the ceramic layer constituting the sheet laminated body 4a after firing. The density of the ceramic layer tends to be low. This is because the ceramic layer constituting the sheet laminate 4a is pressed while the ceramic layer (ceramic slurry 42) in the gap region 17 is not pressed. Therefore, the sinterability of the ceramic paste 42 applied to the gap surface 16 is set to be the first green sheet 10a so that the interlayer ceramic layer and the ceramic layer in the gap region 17 have the same density after firing. The sinterability of the second green sheet 11a and the green sheet 14a may be higher.

  For example, the average particle size of the ceramic particles constituting the ceramic paste 42 is compared with the average particle size of the ceramic particles constituting the green chip 2a (the first green sheet 10a, the second green sheet 11a, and the outer green sheet 14a), An average particle size of 90% may be used. Further, for example, the composition of the ceramic grains constituting the ceramic paste 42 may be different from the composition of the ceramic grains constituting the green chip 2a. Further, for example, the density of ceramic grains in the ceramic paste 42 may be different from the density of ceramic grains in the green sheet paste constituting the green chip 2a.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to the embodiment mentioned above at all, and can be variously modified within the range which does not deviate from the summary of this invention.

  In the above-described embodiment, the multilayer ceramic capacitor is exemplified as the electronic component according to the present invention. However, the electronic component according to the present invention is not limited to the multilayer ceramic capacitor, and any electronic component having the above configuration can be used. good.

4a ... sheet laminate 6 ... first terminal electrode 8 ... second terminal electrode 10a ... first green sheet 11a ... second green sheet 14a ... outer green sheet 10 ... first inner dielectric layer 11 ... and second inner dielectric Layer 14 ... outer dielectric layer 12 ... first internal electrode layer 13 ... second internal electrode layer 12a, 13a ... connection end 12b, 13b ... side end 12c ... first internal electrode pattern 13c ... second internal electrode pattern 15a ... first 1 terminal electrode connection surface 15b ... 2nd terminal electrode connection surface 16 ... gap surface 34 ... adhesive layer 36 ... support substrate 38 ... rod-shaped body 40 ... alignment substrate 42 ... ceramic paste X ... first direction Y ... second direction

Claims (8)

Forming an electrode paste film that becomes an internal electrode layer after firing in a predetermined pattern on the surface of the green sheet that becomes the ceramic layer after firing;
A step of preparing a laminate by laminating the green sheet on which the electrode paste film is formed;
Attaching the laminate to the adhesive layer of the support substrate;
Along the first direction perpendicular to the laminating direction of the ceramic layers, the support substrate is cut without cutting the laminated body to form a terminal electrode connection surface, and perpendicular to the laminating direction and the first direction. Cutting the laminate and the support substrate along a second direction to form a gap surface, and obtaining a rod-shaped body integrated with the support substrate;
Arranging the plurality of rod-shaped bodies so that the gap surfaces are arranged in the same plane, and applying a ceramic paste to the gap surfaces;
A method for producing a multilayer electronic component, comprising: a step of weakening the adhesive force of the adhesive layer and separating the laminate and the support substrate.   Connection terminals of the electrode paste film to be connected to a pair of terminal electrodes are exposed on the terminal electrode connection surfaces, respectively, and the electrode paste is disposed on the gap surface facing along the second direction. The method for manufacturing a multilayer electronic component according to claim 1, wherein the multilayer body is cut so that a side end of the film is exposed.   3. The multilayer electronic component according to claim 1, wherein the rod-shaped bodies are arranged on the surface of the alignment substrate so as to be in close contact with each other via the support substrate attached to the rod-shaped body. Manufacturing method.   The method for manufacturing a multilayer electronic component according to claim 1, wherein the ceramic paste is applied in a predetermined pattern by screen printing.   The adhesive layer is composed of any one or a combination of an adhesive layer whose adhesive strength is reduced by heat, an adhesive layer whose adhesive strength is reduced by ultraviolet rays, or a water-soluble adhesive layer. The manufacturing method of the multilayer electronic component in any one of Claims 1-4.   6. The stacked electron according to claim 1, wherein after the adhesive strength of the adhesive layer is weakened, an external force is applied to the rod-shaped body to separate the stacked body and the support substrate. A manufacturing method for parts.   The method of manufacturing a multilayer electronic component according to claim 1, further comprising barrel-polishing an element body obtained by separating the multilayer body from the support substrate.   The method for manufacturing a multilayer electronic component according to claim 1, wherein the support substrate is cut in advance along the second direction.

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