JP2013016660A - Manufacturing method of package for electronic device, electronic device, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a package for an electronic device which achieves the cost reduction and easily realizes high quality hermetic sealing, an electronic device having the package for the electronic device manufactured using the manufacturing method, and a highly reliable electronic apparatus including the electronic device.SOLUTION: A manufacturing method of a package 3 of the invention includes: a first joining process where portions of a base member 61 and a lid member 63 to be joined are partially joined by seam welding when the base member 61 is joined to the lid member 63 while forming an internal space, in which electronic components are housed, between the base member 61 and the lid member 63; and a second joining process where the rest of the portions of the base member 61 and the lid member 63 to be joined is joined by energy line welding.

Description

  The present invention relates to a method for manufacturing an electronic device package, an electronic device, and an electronic apparatus.

As an electronic device in which an electronic component is housed in a package, for example, a piezoelectric device as described in Patent Document 1 is known.
The piezoelectric device described in Patent Document 1 includes a piezoelectric vibrating piece that is an electronic component, and a package that houses the piezoelectric vibrating piece. The package of this piezoelectric device has a package body having a recess and a lid that covers the opening of the recess of the package body.
Conventionally, as described in Patent Document 1, such a package has a through hole formed in the package body, and after joining the package body and the lid, the through hole is Au- It is formed by closing with a sealing material made of a metal such as a Ge alloy. Thereby, unnecessary gas generated at the time of joining the package body and the lid can be removed from the package, and a hermetically sealed package can be obtained.
However, since such a package manufacturing method uses the sealing material as described above, there is a problem that a material cost is increased correspondingly, resulting in an increase in cost.

JP 2004-289238 A

  An object of the present invention is to provide an electronic device package manufacturing method capable of reducing the cost and realizing high-quality hermetic sealing, and an electronic device having an electronic device package manufactured using the manufacturing method. And to provide a highly reliable electronic apparatus including such an electronic device.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
[Application Example 1]
The method for manufacturing an electronic device package according to the present invention includes an electronic device package that joins the base member and the lid member while forming an internal space in which an electronic component is accommodated between the base member and the lid member. A manufacturing method comprising:
Joining the base member and the lid member,
A first joining step of joining a part of the joining part of the base member and the lid member by seam welding;
It has the 2nd joining process which joins the remainder of the joining plan site | part of the said base member and the said cover member by energy beam welding, It is characterized by the above-mentioned.

According to such a method for manufacturing an electronic device package, a gap can be locally formed between the base member and the lid member after seam welding (after the first joining step). Therefore, this gap is sealed by energy beam welding (second joining step) under reduced pressure or in an inert gas atmosphere, thereby removing the gas generated during seam welding from the inside of the package and providing a high-quality hermetic seal. Can be realized.
Moreover, since the conventional through-hole and sealing material are not required, cost reduction can be achieved.

[Application Example 2]
In the electronic device package manufacturing method of the present invention, the outline of the lid member in plan view intersects with the pair of first sides extending in the first direction and the first direction. A shape having a pair of second sides extending along a second direction;
In the first joining step, seam welding is performed on a portion along each side except for at least one corner portion of the outline of the lid member in plan view, among the planned joining portions,
In the second joining step, it is preferable that a portion corresponding to the at least one corner portion of the planned joining portions is subjected to energy beam welding.
Accordingly, it is possible to relatively easily join a part of the planned joining portion between the base member and the lid member by seam welding and join the remaining part of the joining planned site by energy beam welding.

[Application Example 3]
In the method for manufacturing an electronic device package according to the present invention, each chamfered portion of the outline of the lid member in plan view is subjected to R chamfering,
The seam welding performed in the first joining step uses a roller electrode that rotates around an axis,
D <(1-1 / √2) R, where d is the overlapping length of the roller electrode and the lid member in the axial direction during seam welding and R is the radius of curvature of the R chamfer. It is preferable to satisfy the relationship.
Thereby, a gap can be locally formed between the base member and the lid member after seam welding.

[Application Example 4]
In the method for manufacturing an electronic device package of the present invention, the lid member has a recess for storing the electronic component, and a flange is formed on an outer peripheral portion of the opening of the recess,
It is preferable to satisfy the relationship m <(1-1 / √2) R where m is the flange width.
Thereby, a gap can be locally formed between the base member and the lid member after seam welding simply and reliably.

[Application Example 5]
In the method for manufacturing an electronic device package of the present invention, C corners are applied to each corner of the outline of the lid member in plan view.
The seam welding performed in the first joining step uses a roller electrode that rotates around an axis,
It is preferable to satisfy the relationship d <C / 2, where d is the overlapping length in the axial direction of the roller electrode and the lid member during seam welding and C is the chamfer dimension of the C chamfer. .
Thereby, a gap can be locally formed between the base member and the lid member after seam welding.

[Application Example 6]
In the method for manufacturing an electronic device package of the present invention, the lid member has a recess for storing the electronic component, and a flange is formed on an outer peripheral portion of the opening of the recess,
It is preferable to satisfy the relationship m <C / 2, where m is the flange width.
Thereby, a gap can be locally formed between the base member and the lid member after seam welding simply and reliably.

[Application Example 7]
In the manufacturing method of the package for electronic devices of this invention, it is preferable that the said 2nd joining process performs the said energy beam welding under reduced pressure or inert gas atmosphere.
Thereby, the gas generated by seam welding can be removed from the package, and the package can be hermetically sealed.
[Application Example 8]
In the electronic device package manufacturing method of the present invention, the lid member is joined to the base member via a joining member made of a metal material,
It is preferable that the lid member is contoured so as to overlap the joining member in plan view.
Thereby, the inside of a package can be airtightly sealed by joining a base member and a cover member irrespective of the constituent material of a base member.

[Application Example 9]
An electronic device of the present invention includes an electronic device package manufactured using the manufacturing method of the present invention,
And an electronic component housed in the electronic device package.
According to such an electronic device, it is possible to reduce the cost and realize high-quality hermetic sealing.
[Application Example 10]
An electronic apparatus according to the present invention includes the electronic device according to the present invention.
According to such an electronic device, the cost can be reduced and the reliability can be improved.

It is a typical sectional view showing a schematic structure of a sensor device (electronic device) concerning a 1st embodiment of the present invention. It is a top view of the sensor device shown in FIG. It is a perspective view which shows the supporting member with which the sensor module (electronic component module) of the sensor device shown in FIG. 1 was equipped. It is a top view of the sensor element (electronic component) with which the sensor module of the sensor device shown in FIG. 1 was equipped. It is a top view of the package of the sensor device shown in FIG. FIG. 6 is a partially enlarged plan view of the package shown in FIG. 5. It is a figure explaining the 1st joining process in the manufacturing method (manufacturing method of a sensor device) of the package for electronic devices concerning a 1st embodiment of the present invention. It is a figure explaining the seam welding used for the 1st joining process shown in FIG. It is the elements on larger scale of FIG. It is the elements on larger scale of the package after the 1st joining process shown in FIG. It is a figure explaining the 2nd joining process in the manufacturing method (manufacturing method of a sensor device) of the package for electronic devices concerning a 1st embodiment of the present invention. It is the elements on larger scale of the package of the sensor device (electronic device) concerning a 2nd embodiment of the present invention. It is the elements on larger scale of the package after the 1st joining process in the manufacturing method (sensor device manufacturing method) of the package for electronic devices which concerns on 2nd Embodiment of this invention. It is the elements on larger scale of the package of the sensor device (electronic device) concerning a 3rd embodiment of the present invention. It is the elements on larger scale of the package after the 1st joining process in the manufacturing method (sensor device manufacturing method) of the package for electronic devices which concerns on 3rd Embodiment of this invention. It is the elements on larger scale of the package of the sensor device (electronic device) which concerns on 4th Embodiment of this invention. It is the elements on larger scale of the package after the 1st joining process in the manufacturing method (sensor device manufacturing method) of the package for electronic devices which concerns on 4th Embodiment of this invention. 1 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied.

Hereinafter, an electronic device package, an electronic device, and an electronic apparatus of the present invention will be described in detail based on embodiments shown in the accompanying drawings. Hereinafter, a case where the electronic device of the present invention is applied to a sensor device will be described as an example.
<First Embodiment>
First, a first embodiment of the present invention will be described.

1 is a schematic cross-sectional view showing a schematic configuration of a sensor device (electronic device) according to a first embodiment of the present invention, FIG. 2 is a plan view of the sensor device shown in FIG. 1, and FIG. FIG. 4 is a perspective view showing a support member provided in a sensor module (electronic component module) of the sensor device shown in FIG. 4, and FIG. 4 is a plan view of a sensor element (electronic component) provided in the sensor module of the sensor device shown in FIG. 5 is a plan view of the package of the sensor device shown in FIG. 1, and FIG. 6 is a partially enlarged plan view of the package shown in FIG.
In the following, for convenience of explanation, the upper side in FIG. 1 is referred to as “upper” and the lower side is referred to as “lower”. For convenience of explanation, FIGS. 1 to 3, 5, and 6 illustrate the x axis, the y axis, and the z axis as three axes orthogonal to each other, and a direction parallel to the x axis is referred to as an “x axis direction”. The direction parallel to the y-axis is referred to as “y-axis direction”, and the direction parallel to the z-axis (vertical direction) is referred to as “z-axis direction”.

(Electronic device)
A sensor device (electronic device) 1 shown in FIG. 1 is a gyro sensor that detects angular velocities around three axes of an x-axis, a y-axis, and a z-axis that are orthogonal to each other.
Such a sensor device 1 can be used for, for example, camera shake correction of an imaging device, posture detection of a vehicle or the like in a mobile navigation system using a GPS (Global Positioning System) satellite signal, posture control, and the like.
As shown in FIG. 1, the sensor device 1 includes a sensor module 2 and a package 3 that houses the sensor module 2.

Hereinafter, each part which comprises the sensor device 1 is demonstrated sequentially.
(Sensor module 2)
As shown in FIGS. 1 and 2, the sensor module 2 includes a support member 10, a sensor unit 101 that detects an angular velocity around the z axis, a sensor unit 102 that detects an angular velocity around the x axis, and a sensor unit 102 around the y axis. And a sensor unit 103 that detects angular velocity.

The sensor units 101, 102, and 103 each include an IC chip 20 and a sensor element 30 (sensor element piece). The sensor unit 101 includes a flexible wiring board 41, the sensor unit 102 includes a flexible wiring board 42, and the sensor unit 103 includes a flexible wiring board 43.
As described above, the sensor module 2 includes the support member 10, the three IC chips 20, the three sensor elements 30, and the three flexible wiring boards 41, 42, and 43.

[Supporting member 10]
The support member 10 has a function of supporting the three sensor units 101, 102, and 103.
As shown in FIG. 3, the support member 10 includes a first support surface 11 orthogonal to the z-axis, a second support surface 12 orthogonal to the x-axis, and a third support surface 13 orthogonal to the y-axis. And have.

  Here, the angle θ1 formed by the first support surface 11 and the second support surface 12, the angle θ2 formed by the second support surface 12 and the third support surface 13, and the first support surface 11 The angles θ3 formed with the third support surface 13 are each 90 degrees (right angle). The angles θ1 to θ3 may not be strictly 90 degrees, and a slight error (about 0 degrees to 2 degrees) is allowed in a range that does not affect the sensing function of the sensor module 2.

The constituent material of the support member 10 is not particularly limited, but for example, a metal such as structural steel, stainless steel, copper, brass, phosphor bronze, Yohaku can be suitably used.
Further, when the support member 10 is made of a metal as described above, the support member 10 can be formed by bending a metal plate made of the metal. Note that the shape of the support member 10 is not limited to that illustrated in FIG. 3, and may be configured by a block body such as a rectangular parallelepiped, a polygonal column, or a polygonal pyramid.

[IC chip 20]
The IC chip 20 shown in FIGS. 1 and 2 has a function of driving the sensor element 30 and a function of detecting a signal from the sensor element 30.
The IC chip 20 has a plate shape, one surface of which forms an active surface, and the other surface which forms an inactive surface.

  The non-active surface of the IC chip 20 is bonded to the first support surface 11 of the support member 10 described above with an insulating adhesive (not shown). Similarly, the inactive surface of the IC chip 20 of the sensor unit 102 is bonded to the second support surface 12 of the support member 10 with an insulating adhesive (not shown). Further, the non-active surface of the IC chip 20 of the sensor unit 103 is bonded to the third support surface 13 of the support member 10 with an insulating adhesive (not shown).

On the other hand, although not shown, an integrated circuit including a drive circuit that drives the sensor element 30 and a detection circuit that detects a signal from the sensor element 30 is formed on the active surface of the IC chip 20.
Although not shown, a connection terminal and an external connection terminal electrically connected to the integrated circuit described above are provided on the active surface side of the IC chip 20 of the sensor unit 101.

The connection terminal of the IC chip 20 is a protruding electrode formed in a bump shape using, for example, a solder ball, a gold wire, an aluminum wire, or the like. Such connection terminals are electrically and mechanically connected to the sensor element 30. Thereby, the integrated circuit of the IC chip 20 is electrically connected to the sensor element 30.
The connection terminal also has a function of fixing and supporting the sensor element 30 with respect to the IC chip 20. Here, since the connection terminal is a protruding electrode, it also functions as a spacer that forms a gap between the sensor element 30 and the IC chip 20. Thereby, it is possible to secure a space that allows the drive vibration and the detection vibration of the sensor element 30.

  The external connection terminals of the IC chip 20 are projecting electrodes formed in a bump shape using, for example, solder balls, gold wires, aluminum wires, or the like. The external connection terminals are electrically connected to the flexible wiring board 41 in the sensor unit 101, the flexible wiring board 42 in the sensor unit 102, and the flexible wiring board 43 in the sensor unit 103. Thereby, the integrated circuit of the IC chip 20 of each sensor unit 101, 102, 103 is electrically connected to the flexible wiring boards 41, 42, 43.

[Sensor element 30]
The sensor element 30 is a gyro sensor element that detects an angular velocity around one axis.
The sensor element 30 is composed of quartz whose main part (base material) is a piezoelectric material.

The quartz crystal has an X axis (electric axis), a Y axis (mechanical axis), and a Z axis (optical axis) that are orthogonal to each other. The sensor element 30 has a plate shape having a plate surface parallel to the X axis and the Y axis of quartz. Further, the sensor element 30 has a Z axis of quartz along the thickness direction thereof. The thickness of such a sensor element 30 is appropriately set according to the oscillation frequency (resonance frequency), the outer size, the workability, and the like.
Further, the X-axis, Y-axis, and Z-axis orientations of the quartz crystal in the sensor element 30 can allow an error when cutting out from the quartz crystal within a certain range (0 to 7 degrees).
The sensor element 30 is formed by etching (wet etching or dry etching) using photolithography technology.

As shown in FIG. 4, the sensor element 30 has a so-called double T-type structure.
The sensor element 30 includes a base 31, a pair of detection vibrating arms 32a and 32b extending from the base 31 along the Y axis, and a pair of connecting arms 33a extending from the base 31 along the X axis. 33b, a pair of drive vibrating arms 34a and 34b extending along the Y axis from the tip of the connecting arm 33a, and a pair of driving arms extending along the Y axis from the tip of the connecting portion 33b Vibrating arms 35a and 35b are provided.

  The sensor element 30 includes a support portion 38a extending along the X axis on the opposite side of the base 31 and the pair of connecting arms 33a and 33b with respect to the detection vibrating arm 32a and the driving vibrating arms 34a and 35a. A support portion 38b extending along the X axis on the opposite side of the base 31 and the pair of connecting arms 33a, 33b with respect to the detection vibration arm 32b and the drive vibration arms 34b, 35b, and a support portion 38a And a pair of support arms 36 a and 36 b that connect the base 31 and a pair of support arms 37 a and 37 b that connect the support 38 b and the base 31.

Further, the sensor element 30 includes detection electrodes (not shown) provided on the detection vibrating arms 32a and 32b, and drive electrodes (shown in the drawing) provided on the driving vibration arms 34a, 34b, 35a and 35b, respectively. (Not shown) and a plurality of connection electrodes 39 provided on one surface of the support portions 38a and 38b and electrically connected to the detection electrodes and the drive electrodes.
Such a sensor element 30 is mounted on the active surface of the IC chip 20 described above so as to overlap the IC chip 20 in a plan view.

Here, the sensor element 30 is mounted on the IC chip 20 by electrically and mechanically connecting the connection electrode 39 to each connection terminal of the IC chip 20.
Further, the sensor element 30 is installed such that its plate surface is along (approximately parallel to) the plate surface of the IC chip 20. Thereby, in the sensor unit 101, the plate surface of the sensor element 30 is orthogonal to the z-axis. In the sensor unit 102, the plate surface of the sensor element 30 is orthogonal to the x axis. In the sensor unit 103, the plate surface of the sensor element 30 is orthogonal to the y axis.

  In the sensor element 30 configured as described above, a driving signal is applied from the integrated circuit (driving circuit) of the IC chip 20 to the connection electrode 39 (driving electrode), whereby the driving vibrating arm 34a and the driving vibrating arm 35a. Bending vibration (driving vibration) such that the driving vibration arm 34b and the driving vibration arm 35b approach and separate from each other in the same direction as the bending vibration. )

  If the angular velocity ω around the normal line passing through the center of gravity G is applied to the sensor element 30 in a state where the drive vibrating arms 34a, 34b, 35a, 35b are driven to vibrate in this way, the drive vibrating arms 34a, 34b, 35a are applied. , 35b has Coriolis force. As a result, the base 31 is rotated and rotated around the normal line (detection axis) passing through the center of gravity G while bending the connecting arms 33a and 33b, and accordingly, the bending vibration (detection vibration) of the detection vibrating arms 32a and 32b. ) Is excited.

The angular velocity ω applied to the sensor element 30 can be obtained by detecting the charge generated in the detection electrode due to the detection vibration of the detection vibrating arms 32a and 32b.
Specifically, the sensor element 30 of the sensor unit 101 can detect the angular velocity around the z axis because the plate surface is orthogonal to the z axis. The sensor element 30 of the sensor unit 102 can detect the angular velocity around the x axis because the plate surface is orthogonal to the x axis. Further, the sensor element 30 of the sensor unit 103 can detect the angular velocity around the y axis because the plate surface thereof is orthogonal to the y axis.

[Flexible wiring boards 41, 42, 43]
The flexible wiring boards 41, 42, and 43 shown in FIGS. 1 and 2, respectively, are, for example, a base layer (not shown) mainly composed of a flexible resin such as polyimide, and wiring bonded to the base layer. And a pattern layer (not shown).
The flexible wiring board 41 is attached (bonded) to an external connection terminal (not shown) of the IC chip 20 having one end portion of the wiring pattern layer supported by the first support surface 11. The other end is electrically connected to an internal terminal 71 of the package 3 to be described later. Similarly, the flexible wiring board 42 is attached (bonded) to an external connection terminal (not shown) of the IC chip 20 with one end of the wiring pattern layer supported by the second support surface 12. The other end of the layer is electrically connected to an internal terminal 72 of the package 3 described later. The flexible wiring board 43 is attached (bonded) to an external connection terminal (not shown) of the IC chip 20 supported on the third support surface 13 at one end of the wiring pattern layer. The other end is electrically connected to an internal terminal 73 of the package 3 to be described later.

According to the sensor module 2 configured as described above, the angular velocities around the x-axis, the y-axis, and the z-axis can be detected.
Such a sensor module 2 can be provided in the package 3 to provide the sensor device 1 capable of detecting the respective angular velocities around the x axis, the y axis, and the z axis.

  In addition, the sensor module 2 has a considerably smaller mounting space than a combination of three sensor devices that detect angular velocities around one axis (that is, three sensor devices are individually incorporated in a device). Therefore, it is possible to reduce the size of a device in which the sensor device 1 is incorporated, and to increase the degree of freedom in arrangement, design, and the like when incorporated in the device.

Further, the sensor module 2 can be reduced in cost because the number of packages can be reduced as compared with a combination of three sensor devices that detect angular velocities around one axis.
Further, the sensor module 2 can improve the shock resistance because the mounting posture can be originally stable as compared with a combination of three sensor devices that detect angular velocity around one axis. It becomes possible.

  In addition, since the orthogonality of the detection axes of the three sensor elements 30 is determined by the processing accuracy of the support member 10 (accuracy of angles θ1, θ2, and θ3), the sensor module 2 has mounting accuracy in a device in which the sensor device 1 is incorporated. The orthogonality of the three detection axes does not depend on (accuracy of the package mounting angle), and the detection accuracy can be easily increased. On the other hand, when three sensor devices that detect angular velocities around one axis are combined, it is difficult to increase the detection accuracy because the orthogonality of the three detection axes depends on the mounting accuracy of each sensor device.

(Package 3)
As shown in FIGS. 1 and 5, the package 3 includes a flat base member 61 and a lid member 63 (cap) having a recess 62.
In the present embodiment, the base member 61 has a rectangular shape in plan view as viewed from the z-axis direction (hereinafter also simply referred to as “plan view”).
The base member 61 is made of, for example, an aluminum oxide sintered body, crystal, glass, or the like.

As shown in FIG. 1, the upper surface 65 of the base member 61 (the surface on the side covered with the lid member 63) is connected to the first support surface 11 of the support member 10 described above by a bonding member 51 such as an adhesive. The back surface 14 on the opposite side is joined. Thereby, the sensor module 2 is supported and fixed to the base member 61.
In addition, internal terminals 71, 72, and 73 are provided on the upper surface 65 of the base member 61. The internal terminals 71, 72, 73 are connected to the flexible wiring boards 41, 42 of the sensor module 2 via conductive bonding members (not shown) such as a conductive adhesive, an anisotropic conductive film, and solder. , 43 are electrically connected.

On the other hand, on the lower surface 66 of the base member 61 (the bottom surface of the package 3 and the surface along the upper surface 65), a plurality of external terminals used when the sensor device 1 is mounted on a device (external device). 74 is provided.
The plurality of external terminals 74 are electrically connected to the internal terminals 71, 72, 73 described above via internal wiring (not shown). Thereby, each sensor unit 101,102,103 of the sensor module 2 and the some external terminal 74 are electrically connected.

Such internal terminals 71, 72, 73 and external terminals 74 are each a metal film in which a film of nickel (Ni), gold (Au) or the like is laminated on a metallized layer of tungsten (W) or the like by plating or the like. Consists of.
A lid member 63 is provided on the upper surface 65 of the base member 61 to which the sensor module 2 is attached in this manner so as to cover the sensor module 2.

The lid member 63 has a recess 62 that opens to the base member 61 side. Thus, an internal space in which the sensor module 2 is stored is formed between the base member 61 and the base member 61.
A flange 67 is formed on the outer periphery of the opening of the recess 62 of the lid member 63.
The flange 67 has an annular shape in plan view. Further, the flange 67 has a rectangular outer contour in plan view. Here, the “rectangular shape” is a concept including not only a geometrically accurate rectangular shape but also a shape in which at least one corner of the rectangular shape is lost by R chamfering or C chamfering. .

Here, the outline of the lid member 63 in plan view, that is, the outer outline of the flange 67 in plan view, is a pair of first 67a, 67b parallel to the x-axis direction (first direction) and y A pair of second sides 67c and 67d parallel to the axial direction (second direction intersecting the first direction). In this embodiment, each corner of the outline of the lid member 63 in plan view is rounded off.
The lid member 63 is made of, for example, the same material as the base member 61, or a metal such as Kovar, 42 alloy, stainless steel, or the like.

The flange 67 of the lid member 63 is hermetically joined to the upper surface 65 of the base member 61. Thereby, the inside of the package 3 is hermetically sealed.
In the present embodiment, the flange 67 and the base member 61 are joined via a joining member 64 made of metal. Specifically, the joining member 64 is joined to the upper surface 65 of the base member 61 by brazing, and seam welding and energy beam welding (laser welding, electron beam) to be described later to the flange 67 of the lid member 63. For example, welding).
When the base member 61 is made of a metal that can be diffusion bonded to the flange 67 by seam welding and energy beam welding, the bonding member 64 can be omitted. In this case, the flange 67 of the lid member 63 is directly joined to the upper surface 65 of the base member 61 by seam welding and energy beam welding.

The joining member 64 has a quadrangular annular shape along the flange 67 of the lid member 63. Here, the lid member 63 is contoured so as to overlap the joining member 64 in plan view. As a result, the base member 61 and the lid member 63 can be joined to hermetically seal the inside of the package 3 regardless of the constituent material of the base member 61. In the present embodiment, the flange 67 is provided so as to be positioned between the outer contour and the inner contour of the joining member 64 in plan view.
The joining member 64 is diffusion joined to the flange 67 by seam welding and energy beam welding.

  More specifically, as shown in FIG. 5, the joint portion 90 between the lid member 63 and the joint member 64 includes a pair of weld portions 91 and 92 (first weld portion) extending in the x-axis direction. , A pair of welds 93 and 94 (second welds) extending in the y-axis direction, and four welds 95 to 98 provided locally corresponding to the four corners of the lid member 63. (Third welded portion). Thereby, this junction part 90 is formed over the perimeter along the external shape (contour) of the cover member 63 by planar view.

  In FIG. 5, for convenience of explanation, the formation regions of the welded portions 91 to 98 are indicated by hatching for easy viewing. In fact, in the joint portion 90 between the lid member 63 and the joining member 64, since the lid member 63 and the joining member 64 are diffused from each other, the boundary between the lid member 63 and the joining member 64 is not clear. 1 and 5 show the boundary between the lid member 63 and the joining member 64 for convenience of explanation. The same applies to the other embodiments and drawings.

Each of the welded portions 91 to 94 is formed by joining the lid member 63 and the joining member 64 by seam welding along each side in the plan view of the flange 67 in a plan view. . Specifically, the pair of welded portions 91 and 92 are obtained by joining the base member 61 and the lid member 63 by seam welding along the pair of first sides 67a and 67b described above. The pair of welded portions 93 and 94 are formed by joining the base member 61 and the lid member 63 by seam welding along the pair of second sides 67c and 67d described above. By such two pairs of welded portions 91 to 94, the main portion of the outer peripheral portion of the lid member 63 in plan view and the joining member 64 are airtightly joined.
Here, the welded portions 91 to 94 are formed except for each corner portion in plan view of the flange 67 and are separated from each other.

  On the other hand, each welded portion 95 to 98 has a spot shape in plan view, and the lid member 63 and the joining member 64 are joined by energy beam welding corresponding to each corner portion in the plan view of the flange 67. It is formed. By such four welded portions 95 to 98, a portion other than the main portion of the outer peripheral portion of the lid member 63 in plan view (that is, a portion where the two pairs of welded portions 91 to 94 are not formed) is joined. The member 64 is airtightly joined. In addition, the gap formed locally between the base member 61 and the lid member 63 after seam welding can be easily and reliably closed under reduced pressure or an inert gas atmosphere.

  Here, the welded portion 95 is formed so as to fill between the two adjacent welded portions 91 and 93, and a part of the formation region overlaps with a part of the formation region of the welded portions 91 and 93. Yes. Similarly, a part of the formation region of the welded portion 96 overlaps with a part of the formation region of the welded portions 91 and 94. Further, a part of the formation region of the welded portion 97 overlaps with a part of the formation region of the welded portions 92 and 94. Further, a part of the formation region of the welded portion 98 overlaps with a part of the formation region of the welded portions 92 and 93.

  Hereinafter, based on FIG. 6, the two adjacent welded portions 91 and 93 and the welded portion 95 formed so as to fill the space between the two welded portions 91 and 93 will be described in detail. Note that the relationship between the welded portions 91 and 94 and the welded portion 96, the relationship between the welded portions 92 and 94 and the welded portion 97, and the relationship between the welded portions 92 and 93 and the welded portion 98 are as follows. Since it is the same as the relationship with the welding part 95, the description is abbreviate | omitted.

In plan view, the welded portion 91 and the welded portion 93 do not overlap each other, and the region A1 in which the welded portion 91 is extended in the x-axis direction (first direction) and the welded portion 93 in the y-axis direction (second A region A3 that overlaps with the region A2 extended in the direction of () is located outside the outline of the lid member 63.
Thereby, a gap (gap 69 shown in FIG. 10) can be locally formed between the base member 61 and the lid member 63 after seam welding for forming the welded portions 91 to 94. Therefore, by closing the gap by welding under reduced pressure or in an inert gas atmosphere, the gas generated during seam welding can be removed from the package 3 to achieve high-quality hermetic sealing.

In this embodiment, when the width of the flange 67 (that is, the length protruding from the outer periphery of the main body portion of the lid member 63) is m and the width of the welded portions 91 and 93 is W, respectively, the relationship of W <m is established. Fulfill.
Further, the corner portion 68 of the flange 67 is rounded as described above, and satisfies the relationship of W <(1-1 / √2) R, where R is the radius of curvature.

Due to such a relationship between W and R, the outline of the flange 67 exists inside the region A3 in plan view. That is, the region A3 exists outside the outline of the flange 67, that is, the outline of the lid member 63, in plan view.
Thereby, the welding part 91 and the welding part 93 are formed so that it may not mutually overlap. Therefore, in a state where the welded portion 95 is not formed, a gap that communicates the inside and outside of the package 3 can be formed between the corner portion 68 of the lid member 63 and the joining member 64.

The constituent material of the joining member 64 may be any metal that can be diffusion joined to the flange 67 by seam welding and energy beam welding, and is not particularly limited. For example, a brazing material can be suitably used.
It is preferable that the inside of the package 3 configured as described above is held in a reduced pressure state so that vibrations of the sensor elements 30 of the sensor units 101, 102, and 103 are not inhibited.

(Method for manufacturing electronic device package)
Next, the manufacturing method of the electronic device package of the present invention will be described by taking the case of manufacturing the above-described manufacturing method of the package 3 (sensor device 1) as an example.
FIG. 7 is a view for explaining a first joining step in the electronic device package manufacturing method (sensor device manufacturing method) according to the first embodiment of the present invention, and FIG. 8 is the first joint shown in FIG. FIG. 9 is a partially enlarged view of FIG. 8, FIG. 10 is a partially enlarged plan view of the package after the first joining step shown in FIG. 7, and FIG. It is a figure explaining the 2nd joining process in the manufacturing method (manufacturing method of a sensor device) of the package for electronic devices concerning a 1st embodiment.
The manufacturing method of the package 3 (the manufacturing method of the sensor device 1) includes: [1] a first joining step in which a part of a joint planned portion of the base member 61 and the lid member 63 is joined by seam welding; [2] base A second joining step of joining the remaining portion of the planned joining portion of the member 61 and the lid member 63 by energy beam welding.

Hereafter, each process of the manufacturing method of the package 3 is demonstrated in detail sequentially.
[1] First joining step 1-1
First, as shown in FIG. 7A, a base member 61 and a lid member 63 are prepared, and the lid member 63 is overlaid on the upper surface 65 side of the base member 61.

At this time, the joining member 64 is previously joined to the upper surface 65 of the base member 61 by brazing. Although not shown, the sensor module 2 described above is attached to the surface of the base member 61 on the side where the joining member 64 is provided, that is, the upper surface 65.
Then, the lid member 63 is placed on the upper surface 65 side of the base member 61 in a state where the flange 67 of the lid member 63 is in contact with the joining member 64.

1-2
Next, as shown in FIG. 7B, the flange 67 and the joining member 64 are joined together by a seam welding along a pair of sides parallel to each other in a plan view of the flange 67. 91 and 92 are formed.
For such seam welding (seam joining), for example, a welding machine 300 as shown in FIG. 8 is used.

The welding machine 300 includes a pair of roller electrodes 301 and 302 and a power supply device 303 electrically connected to the pair of roller electrodes 301 and 302.
The pair of roller electrodes 301 and 302 are provided so as to be rotatable around the axis a around the central axis.
The pair of roller electrodes 301 and 302 are separated from each other in a direction parallel to the axis a.

The pair of roller electrodes 301 and 302 has a tapered shape in which the outer diameter gradually increases from the inside toward the outside at a taper angle θ4.
The taper angle θ4 is not particularly limited, but is preferably 5 ° or more and 25 ° or less, and more preferably 10 ° or more and 20 ° or less. Thereby, the contact state between the roller electrodes 301 and 302 and the flange 67 can be stabilized, and as a result, poor welding can be prevented.

The pair of roller electrodes 301 and 302 is in pressure contact with the flange 67 of the lid member 63 from the side opposite to the base member 61 by a pressure mechanism (not shown). The pair of roller electrodes 301 and 302 travel at a predetermined speed along a pair of sides parallel to each other in a plan view of the flange 67 while rotating around the axis a.
At this time, the power supply device 303 causes a current to flow between the roller electrode 301 and the roller electrode 302 via the lid member 63 and the joining member 64. Thereby, the joining member 64 is melted by Joule heat, and the flange 67 of the lid member 63 and the joining member 64 are joined.

Here, when the overlapping length of the roller electrodes 301 and 302 and the flange 67 in the direction parallel to the axis a is d, the width of the flange 67 is m, and the width of the welds 91 and 92 is W, respectively, The relationship of W ≦ d <m is satisfied (see FIG. 9).
In addition, each corner portion in plan view of the flange 67 is rounded as described above, and satisfies the relationship d <(1-1 / √2) R, where R is the radius of curvature.
With such a relationship between d and R, the relationship of W <(1-1 / √2) R is satisfied for each welded portion 91 and 92.

1-3
Next, as shown in FIG. 7C, the flange 67 and the joining member 64 are joined by seam welding along the remaining pair of sides parallel to each other in a plan view of the flange 67, thereby making a pair of weldings. Portions 93 and 94 are formed.
Such seam welding can be performed in the same manner as the formation of the pair of welds 91 and 92 described above.

Here, as with the pair of welded portions 91 and 92 described above, the overlapping lengths of the roller electrodes 301 and 302 and the flange 67 in the direction parallel to the axis a are d, the width of the flange 67 is m, and welding is performed. When the widths of the portions 93 and 94 are each W, the relationship of W ≦ d <m is satisfied (see FIG. 10).
In addition, each corner portion in plan view of the flange 67 is rounded as described above, and satisfies the relationship d <(1-1 / √2) R, where R is the radius of curvature.
With such a relationship between d and R, the relationship of W <(1-1 / √2) R is satisfied for each welded portion 93, 94.

As described above, the welded portions 91 to 94 are formed with the pair of welded portions 91 and 92 and the pair of welded portions 93 and 94 so as to satisfy the relationship of W <(1-1 / √2) R. Thus, the welded portions 91 to 94 are formed so as not to overlap each other, and a portion (gap) that is not seam welded is formed at each corner portion 68 of the flange 67.
More specifically, the welded portions 91 and 93 will be described as a representative. As shown in FIG. 10, in a plan view, a region A1 in which the welded portion 91 extends along the x-axis direction and the welded portion 93 in the y-axis direction. The region A3 that overlaps with the region A2 extended along the outer edge of the flange 67 exists outside the contour of the outer side of the flange 67, that is, the contour of the lid member 63.
Therefore, the welded portion 91 and the welded portion 93 do not overlap each other, and a gap 69 that communicates the inside and outside of the package 3 is formed between the corner portion 68 of the lid member 63 and the joining member 64.

[2] Second joining step 2-1.
Next, as shown in FIG. 11 (a), three of the four corners 68 of the flange 67 are joined to the joining member 64 by energy beam welding, so that the three welds 96 to 96 are joined. 98 is formed. Thereby, in the three corners 68, the gap 69 described above is closed by welding.

Such energy beam welding is performed, for example, by irradiating the three corners 68 with energy rays such as laser light and electron beam.
Such energy beam welding may be one that continuously oscillates an energy beam or one that pulsates.
Moreover, the atmosphere at the time of performing this energy beam welding is not specifically limited, Any of atmospheric pressure, pressure reduction, and inert gas atmosphere may be sufficient.
Further, the spot diameter of the energy beam on the corner portion 68 at the time of such energy beam welding is not particularly limited as long as the gap 69 can be closed by welding, but is not less than the width of the gap 69 and not more than the width of the flange 67. Is preferred.

2-2
Next, as shown in FIG. 11 (b), the remaining one of the four corners 68 of the flange 67 and the joining member 64 are joined by energy beam welding, so that the weld 95 is formed. Form. Thereby, in the remaining one corner 68, the gap 69 described above is closed by welding.

Such energy beam welding can be performed by the same method as the energy beam welding in the above-described step 2-1.
In addition, the energy beam welding in this step is preferably performed under reduced pressure or in an inert gas atmosphere. Thereby, the inside of the obtained package 3 can be hermetically sealed in a reduced pressure state or an inert gas sealed state. Further, it is possible to prevent the gas generated during the seam welding described above from remaining in the obtained package 3.

  According to the manufacturing method of the package 3 as described above, since the hermetic sealing is performed by performing the local energy beam welding after the seam welding, the gas generated during the seam welding or before the energy beam welding is packaged. 3 can be removed. Moreover, since energy beam welding is local, it can prevent or suppress that the gas generated at the time of energy beam welding remains in the package 3. Therefore, the package 3 hermetically sealed with high quality can be obtained.

  Further, in the first joining step, seam welding is performed on the portions along the sides except for the corners of the outline of the lid member 63 in a plan view, among the planned joining parts of the base member 61 and the lid member 63. In the second joining step, the portion corresponding to the at least one corner portion among the planned joining portions is subjected to energy beam welding, so that the joining planned portion between the base member 61 and the lid member 63 can be relatively easily obtained. A part can be joined by seam welding, and the remainder of the part to be joined can be joined by energy beam welding.

In addition, there is no need to form a through hole in the base member 61 or the lid member 63 before the base member 61 and the lid member 63 are joined, and a sealing material that closes the through hole is unnecessary. The manufacturing process is simplified and the material cost can be reduced. For this reason, the cost of the package 3 can be reduced, and consequently the cost of the sensor device 1 can be reduced.
Further, since the above-described through holes and sealing materials are unnecessary, the degree of freedom of arrangement of electronic components, wiring, electrodes, etc. in the package 3 is increased. Further, the package 3 can be downsized.
According to the package 3 and the sensor device 1 according to the first embodiment as described above, the cost can be reduced and high-quality hermetic sealing can be realized.

Second Embodiment
Next, a second embodiment of the present invention will be described.
FIG. 12 is a partially enlarged plan view of a package of a sensor device (electronic device) according to the second embodiment of the present invention, and FIG. 13 is a method for manufacturing a package for an electronic device (sensor device) according to the second embodiment of the present invention. It is the elements on larger scale of the package after the 1st joining process in (manufacturing method).

The sensor device according to the present embodiment is the same as the sensor device according to the first embodiment described above except that the configuration of the flange of the package is different.
In the following description, the sensor device according to the second embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted. In FIG. 12 and FIG. 13, the same reference numerals are given to the same configurations as those in the above-described embodiment.

As shown in FIG. 12, the sensor device 1A according to the present embodiment includes a package 3A.
The package 3A includes a flat base member 61 and a lid member 63A (cap) having a recess 62.
A flange 67A is formed on the outer periphery of the opening of the recess 62 of the lid member 63A.
C corner chamfering is applied to each corner 68A of the outline of the lid member 63A in plan view.

The flange 67 </ b> A and the base member 61 are joined via the joining member 64.
More specifically, as shown in FIG. 12, the joint portion 90A between the lid member 63A and the joint member 64 includes a welded portion 91A extending in the x-axis direction and a welded portion 93A extending in the y-axis direction. , And a welded portion 95A provided locally corresponding to the corner portion 68A of the lid member 63A. Although not shown, the joining portion 90A is formed over the entire circumference along the outer shape (outline) of the lid member 63A in plan view.
Each welding part 91A, 93A is formed by joining the lid member 63A and the joining member 64 by seam welding.

On the other hand, the welded portion 95A is formed by joining the lid member 63A and the joining member 64 by energy beam welding.
When the width of the flange 67A (that is, the length protruding from the outer periphery of the main body portion of the lid member 63A) is m and the widths of the welded portions 91A and 93A are W, the relationship of W <m is satisfied.
Further, the corner portion 68A of the flange 67A is chamfered as described above, but when the chamfer dimension is C, the relationship of W <C / 2 is satisfied.

Due to the relationship between W and C, in a plan view, a region A3 in which a region A1 in which the welded portion 91A is extended along the x-axis direction and a region A2 in which the welded portion 93A is extended in the y-axis direction overlap. Exists outside the outline of the lid member 63A.
Thus, the welded portion 91A and the welded portion 93A are formed so as not to overlap each other. Therefore, in a state where the welded portion 95A is not formed, a gap 69A that communicates the inside and outside of the package 3A can be formed between the corner portion 68A of the lid member 63A and the joining member 64 as shown in FIG.

The relationship between W and C as described above is realized by satisfying the relationship of d <C / 2, where d is the overlapping length in the axial direction between the roller electrode and the lid member 63A during seam welding. Can do.
Even with the package 3A and the sensor device 1A according to the second embodiment as described above, it is possible to reduce the cost and realize high-quality hermetic sealing.

<Third Embodiment>
Next, a third embodiment of the present invention will be described.
14 is a partially enlarged plan view of a package of a sensor device (electronic device) according to a third embodiment of the present invention, and FIG. 15 is a method for manufacturing a package for an electronic device (sensor device) according to the third embodiment of the present invention. It is the elements on larger scale of the package after the 1st joining process in (manufacturing method).

The sensor device according to the present embodiment is the same as the sensor device according to the first embodiment described above except that the configuration of the flange of the package is different.
In the following description, the sensor device according to the third embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted. 14 and 15, the same reference numerals are given to the same configurations as those in the above-described embodiment.

As shown in FIG. 14, the sensor device 1B of the present embodiment includes a package 3B.
The package 3B includes a flat base member 61 and a lid member 63B (cap) having a recess 62.
A flange 67B is formed on the outer periphery of the opening of the recess 62 of the lid member 63B.
Each corner 68B of the outline of the lid member 63B in plan view is rounded.
The flange 67 </ b> B and the base member 61 are joined via the joining member 64.

Specifically, as shown in FIG. 14, the joint portion 90B between the lid member 63B and the joint member 64 includes a welded portion 91B extending in the x-axis direction and a welded portion 93B extending in the y-axis direction. The welded portion 95B is provided locally corresponding to the corner portion 68B of the lid member 63B. Although not illustrated, the joining portion 90B is formed over the entire circumference along the outer shape (outline) of the lid member 63B in a plan view.
Each welded part 91B, 93B is formed by joining the lid member 63B and the joining member 64 by seam welding.

On the other hand, the welded portion 95B is formed by joining the lid member 63B and the joining member 64 by energy beam welding.
When the width of the flange 67B (that is, the length protruding from the outer periphery of the main body of the lid member 63B) is m and the width of the welded portions 91B and 93B is W, the relationship of W ≦ m is satisfied. FIG. 14 illustrates a case where the relationship of W = m is satisfied.

Further, the corner portion 68B of the flange 67B is rounded as described above, and satisfies the relationship m <(1-1 / √2) R where the radius of curvature is R.
Even if the relationship of W = m is satisfied by such a relationship of W and R, the region A1 in which the welded portion 91B is extended along the x-axis direction and the welded portion 93B are extended in the y-axis direction in plan view. A region A3 that overlaps with the region A2 extending along the outer side exists outside the outline of the lid member 63B.

Thereby, the welding part 91B and the welding part 93B are formed so that it may not mutually overlap. Therefore, in a state where the welded portion 95B is not formed, a gap 69B that communicates the inside and outside of the package 3B can be formed between the corner portion 68B of the lid member 63B and the joining member 64 as shown in FIG.
In particular, by satisfying the relationship of m <(1-1 / √2) R, even when the roller electrode is in contact with the outer peripheral portion of the main body of the lid member 63B during seam welding, Even if the overlapping length (d) with the lid member 63B is maximized, the gap 69B can be formed. Therefore, the gap 69B can be formed easily and reliably.
With the package 3B and the sensor device 1B according to the third embodiment as described above, it is possible to reduce costs and realize high-quality hermetic sealing.

<Fourth embodiment>
Next, a fourth embodiment of the present invention will be described.
16 is a partially enlarged plan view of a package of a sensor device (electronic device) according to a fourth embodiment of the present invention, and FIG. 17 is a method for manufacturing a package for an electronic device (sensor device) according to the fourth embodiment of the present invention. It is the elements on larger scale of the package after the 1st joining process in (manufacturing method).

The sensor device according to the present embodiment is the same as the sensor device according to the first embodiment described above except that the configuration of the flange of the package is different.
In the following description, the sensor device according to the fourth embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted. In FIGS. 16 and 17, the same reference numerals are given to the same configurations as those in the above-described embodiment.

As shown in FIG. 16, the sensor device 1C of the present embodiment includes a package 3C.
The package 3 </ b> C includes a flat base member 61 and a lid member 63 </ b> C (cap) having a recess 62.
A flange 67C is formed on the outer periphery of the opening of the recess 62 of the lid member 63C.
Each corner portion 68C of the outline of the lid member 63C in plan view is chamfered.

The flange 67 </ b> C and the base member 61 are joined via the joining member 64.
Specifically, as shown in FIG. 16, the joint portion 90 </ b> C between the lid member 63 </ b> C and the joint member 64 includes a welded portion 91 </ b> C extending in the x-axis direction and a welded portion 93 </ b> C extending in the y-axis direction. The welded portion 95C is provided locally corresponding to the corner portion 68C of the lid member 63C. Although not shown, the joining portion 90C is formed over the entire circumference along the outer shape (outline) of the lid member 63C in plan view.
Each welding part 91C, 93C is formed by joining the lid member 63C and the joining member 64 by seam welding.

On the other hand, the welded portion 95C is formed by joining the lid member 63C and the joining member 64 by energy beam welding.
When the width of the flange 67C (that is, the length protruding from the outer periphery of the main body of the lid member 63C) is m and the widths of the welded portions 91C and 93C are W, the relationship of W ≦ m is satisfied. Note that FIG. 16 illustrates a case where the relationship of W = m is satisfied.

Further, the corner portion 68C of the flange 67C is chamfered as described above, and satisfies the relationship of m <C / 2 when the chamfered dimension is C.
Even if the relationship of W = m is satisfied by such a relationship of W and C, the region A1 in which the welded portion 91C is extended along the x-axis direction and the welded portion 93C in the y-axis direction in plan view An area A3 that overlaps with the area A2 extending along the line A2 exists outside the outline of the lid member 63C.

Accordingly, the welded portion 91C and the welded portion 93C are formed so as not to overlap each other. Therefore, in a state where the welded portion 95C is not formed, a gap 69C that communicates the inside and outside of the package 3C can be formed between the corner portion 68C of the lid member 63C and the joining member 64 as shown in FIG.
In particular, by satisfying the relationship of m <C / 2, even when the roller electrode is in contact with the outer peripheral portion of the main body of the lid member 63C during seam welding, that is, the roller electrode and the lid member 63C overlap. Even if the length (d) is maximized, the gap 69C can be formed. Therefore, the gap 69C can be formed easily and reliably.

Even with the package 3C and the sensor device 1C according to the fourth embodiment as described above, it is possible to reduce the cost and realize high-quality hermetic sealing.
The sensor device of each embodiment as described above can be used by being incorporated in various electronic devices.
According to such an electronic device, the cost can be reduced and the reliability can be improved.

(Electronics)
Here, an example of an electronic apparatus including the electronic device of the present invention will be described in detail with reference to FIGS.
FIG. 18 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied.

In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 100. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably.
Such a personal computer 1100 incorporates the aforementioned sensor device 1 that functions as a gyro sensor.

FIG. 19 is a perspective view showing a configuration of a mobile phone (including PHS) to which the electronic apparatus of the invention is applied.
In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and the display unit 100 is disposed between the operation buttons 1202 and the earpiece 1204.
Such a cellular phone 1200 incorporates the above-described sensor device 1 that functions as a gyro sensor.

FIG. 20 is a perspective view showing the configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, connection with an external device is also simply shown.
Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

A display unit is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to display based on an imaging signal from the CCD. The display unit is a finder that displays an object as an electronic image. Function.
A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308.
In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.

Such a digital still camera 1300 incorporates the above-described sensor device 1 that functions as a gyro sensor.
In addition to the personal computer (mobile personal computer) shown in FIG. 18, the mobile phone shown in FIG. 19, and the digital still camera shown in FIG. Detection device, pointing device, head mounted display, ink jet type ejection device (for example, ink jet printer), laptop personal computer, television, video camera, video tape recorder, navigation device, pager, electronic notebook (including communication function), Electronic dictionary, calculator, electronic game device, game controller, word processor, workstation, video phone, crime prevention TV monitor, electronic binoculars, POS terminal, medical device (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measurement device) Ultrasonic diagnostic apparatus, an electronic endoscope), a fish finder, various measurement devices, gauges (e.g., vehicle, aircraft, ship instruments), can be applied to a flight simulator or the like.

As mentioned above, although the manufacturing method of the package for electronic devices of this invention, the electronic device, and the electronic device were demonstrated based on embodiment of illustration, this invention is not limited to these.
In the electronic device and the electronic apparatus of the present invention, the configuration of each part can be replaced with any configuration that exhibits the same function, and any configuration can be added.

Moreover, you may make it combine the arbitrary structures of each embodiment mentioned above with the electronic device and electronic device of this invention.
Moreover, in the manufacturing method of the package for electronic devices of this invention, arbitrary processes can be added.
In the above-described embodiment, the case where the main part (base material) of the sensor element 30 is made of quartz has been described as an example. However, the present invention is not limited to this, and the main part (base material) of the sensor element 30 is not limited thereto. For example, lithium tantalate (LiTaO ₃ ), lithium tetraborate (Li ₂ B4O ₇ ), lithium niobate (LiNbO ₃ ), lead zirconate titanate (PZT), zinc oxide (ZnO), aluminum nitride (AlN) ) Or a semiconductor such as silicon (Si).

In addition to the double T type as described above, various gyro elements such as a bipod tuning fork, a tripod tuning fork, an H type tuning fork, a comb tooth type, an orthogonal type, and a prismatic type can be used as the sensor element 30. is there.
The sensor element 30 may be a gyro sensor element other than the vibration type.
In addition to the piezoelectric type using the piezoelectric effect of the piezoelectric body, the vibration driving method and the detecting method of the sensor element 30 are based on the electrostatic type using a Coulomba, the Lorentz type using magnetic force, etc. It may be.

Further, the detection axis of the sensor element may be an axis parallel to the main surface of the sensor element in addition to an axis orthogonal to the main surface (plate surface) of the sensor element.
In the above-described embodiment, the vibration gyro element is taken as an example of the sensor element of the sensor module. However, the present invention is not limited to this, for example, an acceleration sensing element that reacts to acceleration, a pressure sensing element that reacts to pressure, A weight sensing element that reacts to weight may be used. That is, the electronic device of the present invention is not limited to a gyro sensor, and may be, for example, an acceleration sensor, a pressure sensor, a weight sensor, or the like.

Moreover, as an electronic component of the electronic device of this invention, not only a sensor element but various active fixtures and various passive components can be used. Further, the number of electronic components housed in the electronic device package is arbitrary.
In the above-described embodiment, the configuration in which the electronic component is fixed and supported on the package via the support member has been described as an example. However, the configuration in which the support member is omitted and the electronic component is directly fixed and supported on the package. It may be.
In the above-described embodiment, the configuration in which the electronic component and the package are electrically connected via the flexible wiring board has been described as an example. However, the electrical connection between the electronic component and the package is not limited to this, For example, connection through a bonding wire, connection by face-down mounting, or the like may be used.

  1 sensor device 1A sensor device 1B sensor device 1C sensor device 2 sensor module 3 package 3A package 3B package 3C package 10 support member 11 1 support surface 12 second support surface 13 third support surface 14 back surface 20 IC chip 30 sensor element 31 base 32a detection vibration arm 32b detection Vibration arm 33a ... Connection arm 33b ... Connection part 34a ... Drive vibration arm 34b ... Drive vibration arm 35a ... Drive vibration arm 35b ... Drive vibration arm 36a, 36b ... Support arm 37a, 37b Support arm 38a Support part 38b Support part 39 Connection electrode 41 Flexible wiring board 42 Kibible wiring board 43 ... Flexible wiring board 51 ... Bonding member 61 ... Base member 62 ... Recess 63 ... Lid member 63A ... Lid member 63B ... Lid member 63C ... Lid member 64 ... Junction member 65 Upper surface 66 ... Lower surface 67 ... Flange 67A ... Flange 67B ... Flange 67C ... Flange 67a, 67b ... First side 67c, 67d ... Second side 68 ... Corner 68A ... Corner 68B ... Corner 68C ... Corner 69 ... Clearance 69A ... Clearance 69B ... Clearance 69C ... Clearance 71 ... Internal terminal 72 ... Internal terminal 73 ... Internal terminal 74 ... External terminal 90 ... Joining Part 90A ... Joining part 90B ... Joining part 90C ... Joining part 91 ... Welding part 91A ... Welding part 91B ... Welding part 91C ... Welding part 92 ... welded part 93 ... welded part 93A ... welded part 93B ... welded part 93C ... welded part 94 ... welded part 95 ... welded part 95A ... welded part 95B ... welded part 95C ... welded part 96 ... ... welded part 97 ... welded part 98 ... welded part 100 ... display part 101 ... sensor unit 102 ... sensor unit 103 ... sensor unit 300 ... welder 301 ... roller electrode 302 ... roller electrode 303 ... Power supply unit 1100 Personal computer 1102 Keyboard 1104 Main unit 1106 Display unit 1200 Mobile phone 1202 Operation button 1204 Earpiece 1206 Transmission mouth 1300 Digital still camera 1302 ... Case 1304 ... Light-receiving unit 1306 ... Shutter button 1308 ... Memory 1312 ... Video signal output terminal 1314 ... I / O terminal 1430 ... Television monitor 1440 ... Personal computer a ... Axis A1 ... Area A2 ... Area A3 ... Area G ... Center of gravity θ1 ... Angle θ2 ... Angle θ3 ... Angle θ4 ... Taper angle ω ... Angular velocity

Claims (10)

A method for manufacturing an electronic device package that joins the base member and the lid member while forming an internal space in which an electronic component is housed between the base member and the lid member,
Joining the base member and the lid member,
A first joining step of joining a part of the joining part of the base member and the lid member by seam welding;
A method for manufacturing a package for an electronic device, comprising: a second joining step of joining the remaining part of the base member and the lid member to be joined by energy beam welding. The outline of the lid member in plan view has a pair of first sides extending along a first direction and a pair extending along a second direction intersecting the first direction. A shape having a second side of
In the first joining step, seam welding is performed on a portion along each side except for at least one corner portion of the outline of the lid member in plan view, among the planned joining portions,
2. The method for manufacturing an electronic device package according to claim 1, wherein, in the second joining step, energy beam welding is performed on a portion corresponding to the at least one corner portion of the joint portions to be joined. R corner chamfering is applied to each corner of the outline of the lid member in plan view,
The seam welding performed in the first joining step uses a roller electrode that rotates around an axis,
D <(1-1 / √2) R, where d is the overlapping length of the roller electrode and the lid member in the axial direction during seam welding and R is the radius of curvature of the R chamfer. The manufacturing method of the package for electronic devices of Claim 1 or 2 which satisfy | fills a relationship. The lid member has a recess for storing the electronic component, and a flange is formed on the outer periphery of the opening of the recess,
The manufacturing method of the package for electronic devices of Claim 3 satisfy | filling the relationship of m <(1-1 / (root) 2) R when the width | variety of the said flange is set to m. Each corner of the outline of the lid member in plan view is chamfered,
The seam welding performed in the first joining step uses a roller electrode that rotates around an axis,
2. The relationship of d <C / 2 is satisfied, where d is the overlap length in the axial direction of the roller electrode and the lid member during seam welding, and C is the chamfer dimension of the C chamfer. Or the manufacturing method of the package for electronic devices of 2. The lid member has a recess for storing the electronic component, and a flange is formed on the outer periphery of the opening of the recess,
The manufacturing method of the package for electronic devices of Claim 5 which satisfy | fills the relationship of m <C / 2 when the width | variety of the said flange is set to m.   The method of manufacturing a package for an electronic device according to any one of claims 1 to 6, wherein in the second joining step, the energy beam welding is performed under reduced pressure or in an inert gas atmosphere. The lid member is joined to the base member via a joining member made of a metal material,
The method of manufacturing a package for an electronic device according to claim 1, wherein the lid member is contoured so as to overlap the joining member in a plan view. An electronic device package manufactured using the manufacturing method according to claim 1;
An electronic device comprising: an electronic component housed in the electronic device package.   An electronic apparatus comprising the electronic device according to claim 9.

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