JP2013089786A - Electronic component pickup device and electronic component pickup method, and electronic component mounting device and electronic component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component pickup device and method and an electronic component mounting device and method, capable of obtaining stable mounting accuracy with a simple structure, for electronic components including a flexible region such as a flexible board.SOLUTION: An electronic component pickup device mounts a module board 6 formed by connecting a rigid board 15 with a flexible board 16 on a tray member 20 provided with a first support part 20a and a second support part 20b different in height from each other, places the module board 6 being pressed to the tray member 20 and held by a pressing member 23 on a tray placing part 24, vacuum-sucks the module board 6 through vacuum holes 24b to allow the tray member 20 to suck and hold the module board 6 and then removes the pressing member 23, and allows a mounting head 10 to vacuum-suck the module board 6 and releases the sucking and holding by the tray member 20 to take out the module board 6.

Description

  The present invention relates to an electronic component pickup device and pickup method for taking out an electronic component including a flexible region such as a flexible substrate from a component supply unit, and an electronic component mounting apparatus and electronic component mounting method for mounting the electronic component on a wiring board. Is.

  Since a flexible flexible substrate has a high degree of freedom in shape change, it is widely used as a connection means for connecting a module substrate inside a housing of a limited size. The end portion of the flexible board is a connection region in which a component connection terminal row is formed. When connecting the module board to the wiring board, the flexible board is bent to be connected to the already mounted portion of the wiring board. Interference can be avoided. For taking out the module substrate including the flexible substrate from the component supply unit and mounting the module substrate on the substrate, the module substrate is sucked and held by a mounting head having two suction portions having different relative height positions. (For example, refer to Patent Document 1). Thereby, the one end part in which the component connection terminal row is formed can be held at a height different from that of the other end part, and interference with the already mounted portion of the wiring board is prevented.

JP 2008-192895 A

  However, in the above-described prior art, the equipment structure is complicated due to the configuration in which the height difference is provided between the end portion where the component connection terminal row is formed and the other portion of the module substrate. In addition, there is a problem that misalignment tends to occur at the connection position with the wiring board. That is, in the patent document example, prior to suction holding by the mounting head, a dedicated drive mechanism is required to bend the flexible substrate so that one end portion has a different height from the other end portion, which complicates the equipment structure. Was inevitable.

  In addition, the flexible substrate is likely to be misaligned during the suction holding operation of taking out the module substrate with the flexible substrate bent, and the positioning accuracy between the component connection terminal array and the wiring substrate is not ensured, so that the mounting accuracy is stable. It was difficult to get. As described above, in the prior art, it is difficult to obtain a stable mounting accuracy with a simple mechanism for picking up an electronic component that targets an electronic component including a flexible region such as a flexible substrate and mounting the electronic component on a wiring board. There was a problem of being.

  Accordingly, the present invention is directed to an electronic component pickup apparatus and pickup method, an electronic component mounting apparatus, and an electronic component capable of obtaining stable mounting accuracy with a simple mechanism for an electronic component including a flexible region such as a flexible substrate. The purpose is to provide an implementation method.

  The electronic component pickup device of the present invention includes a flexible region in at least a part thereof, the relative height position of one end side and the other end side can be changed, and the component side connection terminal row is provided on the one end side. An electronic component pick-up device for taking out an electronic component that is formed and supplied while being mounted on a tray member from a tray member mounted on a tray mounting portion of a component supply portion by vacuum suction with a pickup head A tray member that is mounted in a state where the electronic component is positioned in a horizontal direction, and is detachably mounted on the electronic component that is mounted on the tray member and presses the electronic component against the tray member. A holding member that is sandwiched and removed from above the electronic component prior to vacuum suction by the pickup head, and a tray portion that is provided on the tray mounting portion and on which the electronic component is mounted A component suction unit that vacuum-sucks the electronic component through a tray member in a state where the electronic component is placed, and a control unit that controls the component suction unit and the pickup head, and the tray member includes the one end of the electronic component. A first support portion that supports the side from below, and a height difference between the first connection portion row and the other end side that is formed at different heights relative to the first support portion. A second support part that supports the other end side from below; an opening in the first support part and the second support part that is provided through the tray member and placed on the tray placement part; The pickup head has a first suction portion that vacuum-sucks the one end side of the electronic component; and a height difference from the one end side. Vacuum suction the other end at different positions A second suction portion, and the control portion controls the component suction means and the pickup head to vacuum-suck the electronic component mounted on the tray member through the suction hole and the through hole, After the pressing member is removed, the electronic component is sucked and held by the pickup head and the vacuum suction by the component sucking means is released, and then the pickup head is lifted to take out the electronic component held by suction.

  The electronic component pick-up method of the present invention includes a flexible region at least partially, the relative height position of one end side and the other end side can be changed, and the component side connection terminal row is provided on the one end side. An electronic component pick-up method for taking out an electronic component that is formed and supplied while being mounted on a tray member from a tray member mounted on a tray mounting portion of a component supply portion by vacuum suction using a pickup head The tray member is formed at a different height with respect to the first support portion and the first support portion for supporting the one end side of the electronic component from below, and between the component side connection terminal row and the other end side. A second support part that supports the other end side from below so as to form a height difference between the first support part and the second support part, and is provided through the tray member. Placed on the tray placement section A through hole communicating with the suction hole of the tray mounting portion in the state, and the pickup head includes a first suction portion that vacuum-sucks the one end side of the electronic component, and the height difference from the one end side. A second suction part that vacuum-sucks the other end side at a different height, and at least the second support of the first support part and the second support part from below the electronic component A component mounting step of mounting the electronic component in a state of being horizontally positioned on the tray member by supporting the other end side from below by a portion, and pressing the electronic component on the electronic component mounted on the tray member A pressing member mounting step for mounting the member and pressing and holding the electronic component against the tray member, and a tray mounting step for mounting the tray member on which the pressing member is mounted on the tray mounting portion And the tray A component suction step in which the electronic component is vacuum-sucked through a tray member by a component suction means provided in the mounting portion; a pressing member removal step in which the pressing member is removed from the tray member in which the electronic component is vacuum-sucked; and the pickup A head lowering step in which the head is lowered with respect to the tray member that has vacuum-adsorbed the electronic component to bring the first suction portion into contact with the one end side, and the second suction portion comes into contact with the other end side; A component suction step of vacuum-sucking and holding an electronic component by the pickup head by vacuum suction from the first suction portion and the second suction portion, and releasing the vacuum suction of the electronic component by the component suction means; and the pickup head And picking up the electronic component picked up and held.

  The electronic component mounting apparatus of the present invention includes a flexible region at least in part, the relative height position of one end side and the other end side can be changed, and a component side connection terminal row is formed on the one end side. The electronic component supplied in a state where it is mounted on the tray member is taken out by vacuum suction from the tray member mounted on the tray mounting portion of the component supply portion by the pickup head, and is mounted on the substrate holding portion by the mounting head. An electronic component mounting apparatus for mounting on a wiring board that is positioned and held, wherein the electronic component is mounted in a state where the electronic component is positioned in a horizontal direction, and detachable on the electronic component mounted on the tray member A holding member that is placed on the electronic component and pressed against the tray member to be removed and removed from the electronic component prior to removal by vacuum suction, and the tray mounting A component suction means for vacuum-sucking the electronic component through the tray member in a state where the tray member provided with the electronic component is mounted, and a head moving mechanism for moving the pickup head and the mounting head; A control unit that controls the component suction means, a head moving mechanism, a pickup head, and a mounting head, and the tray member includes a first support unit that supports the one end side of the electronic component from below, and a first support unit. A second support portion configured to support the other end side from below so as to form a height difference between the component-side connection terminal row and the other end side, which are formed at different heights; A through hole that opens to the first support part and the second support part and penetrates the tray member and communicates with the suction hole of the component suction means in a state of being placed on the tray placement part, The pick The up head and the mounting head include a first suction part that vacuum-sucks the one end side of the electronic component, and a second suction that vacuum-sucks the other end side at a position that differs in height from the one end side by the height difference. And the control unit controls the component suction means, the head moving mechanism, the pickup head, and the mounting head, whereby the electronic component mounted on the tray member is evacuated through the suction hole and the through hole. Then, after removing the pressing member, the electronic component is sucked and held by the pickup head and the vacuum suction by the component sucking means is released. Then, the electronic component sucked and held by the pickup head is taken out, and the mounting head Transfer to the wiring board positioned and held by the board holding part, and form the component side connection terminal row on the wiring board. Connect to the formed board side connection terminal row.

  The electronic component mounting method of the present invention includes a flexible region at least partially, the relative height position of one end side and the other end side can be changed, and the component side connection terminal row is formed on the one end side. The electronic component supplied in a state where it is mounted on the tray member is taken out by vacuum suction from the tray member mounted on the tray mounting portion of the component supply portion with a pickup head, and is mounted on the substrate holding portion by the mounting head. An electronic component mounting method for mounting on a wiring board that is positioned and held, wherein the tray member has a first support portion that supports the one end side of the electronic component from below and a height different from the first support portion. A second support part configured to support the other end side from below so as to form a height difference between the component side connection terminal row and the other end side; and the first support part and the second support part. Open the support to the tray A through hole communicating with a suction hole of the tray mounting portion in a state of being provided through the material and mounted on the tray mounting portion, and the pickup head and the mounting head are on one end side of the electronic component A first suction part for vacuum suction, and a second suction part for vacuum suction of the other end side at a position different in height from the one end side by the height difference, the first support part, The electronic component is mounted on the tray member while being horizontally positioned by supporting the other end side from below with at least the second support portion of the support portion from below the electronic component. A component mounting step, a pressing member mounting step of mounting a pressing member on the electronic component mounted on the tray member, pressing the electronic component against the tray member, and holding the electronic component, and the pressing member mounted Placed A tray mounting step of mounting the member on the tray mounting portion, a component suction step of vacuum-sucking the electronic component via the tray member by a component suction means provided on the tray mounting portion, and the electronic A pressing member removing step for removing the pressing member from the tray member that vacuum-sucks the component, and the pickup head is lowered with respect to the tray member that vacuum-sucks the electronic component, thereby bringing the first suction part into contact with the one end side And a head lowering step for bringing the second suction part into contact with the other end side, and vacuum suction from the first suction part and the second suction part to hold and hold the electronic component by the pickup head, A component suction step for releasing the vacuum suction of the electronic component by the component suction means, and the electronic component that is lifted and held by lifting the pickup head A component pick-up step for picking up the component, a component transfer step for transferring the picked-out electronic component to the wiring substrate positioned and held by the substrate holding portion by the mounting head, and lowering the mounting head to move the component-side connection terminal row And a component connecting step of connecting to the board side connection terminal row formed on the wiring board.

  According to the present invention, in the pickup of an electronic component in which the electronic component that is partially attached and includes a flexible region and is supplied to the tray member is picked up by the pickup head, the first support portion and the second support portion having different heights are used. After mounting the electronic component on the tray member provided with the support portion in a state of being positioned in the horizontal direction, the pressing member is placed on the electronic component, and the electronic component is pressed against the tray member and sandwiched. As a result, the electronic component is mounted on the tray mounting portion while being supported from below so that a height difference is generated between the one end side and the other end side of the electronic component, and the electronic component is sucked and held by the tray member. Then, after removing the pressing member, a first suction portion that vacuum-sucks one end side of the electronic component, and a second suction portion that vacuum-sucks the other end side at a position that differs in height by the height difference between the one end side and the tray member, The By adopting the structure for taking out an electronic component by a pickup head which may be a target electronic component comprising a flexible region such as a flexible substrate to obtain a stable mounting accuracy with a simple mechanism.

The perspective view of the electronic component mounting apparatus of Embodiment 1 of this invention Configuration explanatory diagram of a wiring board and an electronic component which are work targets of the electronic component mounting apparatus according to the first embodiment of the present invention. Explanatory drawing of the holding | maintenance form of the electronic component by the tray member in the electronic component mounting apparatus of Embodiment 1 of this invention Sectional drawing which shows the structure of the mounting head used for the electronic component mounting apparatus of Embodiment 1 of this invention. The block diagram which shows the structure of the control system of the electronic component mounting apparatus of Embodiment 1 of this invention Process explanatory drawing of the electronic component mounting method of Embodiment 1 of this invention Process explanatory drawing of the electronic component mounting method of Embodiment 1 of this invention Process explanatory drawing of the electronic component mounting method of Embodiment 1 of this invention Explanatory drawing of the holding | maintenance form of the electronic component by the tray member in the electronic component mounting apparatus of Embodiment 2 of this invention Process explanatory drawing of the electronic component mounting method of Embodiment 2 of this invention Process explanatory drawing of the electronic component mounting method of Embodiment 2 of this invention Process explanatory drawing of the electronic component mounting method of Embodiment 2 of this invention

(Embodiment 1)
First, the configuration of the electronic component mounting apparatus 1 will be described with reference to FIG. The electronic component mounting apparatus 1 is an electronic component that includes a flexible region at least partially, such as a module substrate in which a flexible substrate and a rigid substrate are connected in advance, and is supplied in a state of being mounted on a tray member. It has a function of being picked up by vacuum pick-up from a component supply unit by a pickup head and mounted on a wiring board positioned and held by a board holding unit by a mounting head.

  In FIG. 1, an electronic component mounting apparatus 1 has a configuration in which a component mounting mechanism is disposed above a component supply unit 2 and a substrate holding unit 3 that are arranged in series in the X direction. The component mounting mechanism includes a head lifting mechanism 9 that moves the mounting head 10 up and down (arrow a) and a moving table 8 that moves the head lifting mechanism 9 in the X direction (arrow b). The module board 6 (electronic component) taken out from the board is mounted on the wiring board 12 positioned and held by the board holding unit 3. That is, in the first embodiment, the mounting head 10 also serves as a pickup head that takes out the module substrate 6 from the component supply unit 2.

  The component supply unit 2 includes an XY table mechanism in which a Y-axis table 2Y and an X-axis table 2X are stacked, and a holding table 4 is mounted on the X-axis table 2X. Mounted on the holding table 4 is a tray holder 5 for storing a plurality of tray members on which the module substrate 6 is mounted in a regular arrangement in a lattice shape. By driving the Y-axis table 2Y and the X-axis table 2X, the tray holder 5 moves horizontally in the Y direction and the X direction (arrows c and d) and moves to the pickup position by the mounting head 10. The first camera 7 is disposed above the pickup position with the imaging direction facing downward, and the module substrate 6 to be picked up is recognized by recognizing the imaging result of the first camera 7.

  The substrate holding unit 3 includes an XY table mechanism in which a Y-axis table 3Y and an X-axis table 3X are stacked, and a substrate holder 11 is mounted on the X-axis table 3X. The board holder 11 holds a wiring board 12 on which the module board 6 is mounted. By driving the Y-axis table 3Y and the X-axis table 3X, the wiring board 12 moves in the Y direction and the X direction (arrows e and f). Move horizontally. A second camera 13 is provided on the lower surface of the moving table 8 so as to be movable back and forth (arrow g) with respect to the upper side of the substrate holding unit 3. By moving the second camera 13 between the mounting head 10 and the wiring board 12 in a state where the mounting head 10 holding the module substrate 6 by suction is positioned above the wiring board 12 held by the board holder 11. The module substrate 6 and the wiring substrate 12 that are attracted and held by the mounting head 10 can be simultaneously imaged to recognize their positions.

  Next, with reference to FIG. 2, the module board 6 and the wiring board 12 which are electronic components used as the work object of the electronic component mounting apparatus 1 are demonstrated. The module substrate 6 is configured by connecting a flexible flexible substrate 16 such as a thin resin substrate to an end portion of a surface 15a of a rigid substrate 15 such as a glass epoxy substrate, and at least a portion of the module substrate 6 has a flexible region. It is a form that includes. With this configuration, the flexible substrate 16 can be bent to change the relative height positions of the one end side E1 and the other end side E2 of the module substrate 6. The rigid substrate 15 and the flexible substrate 16 have already mounted components 17, 18, 19 such as connector components and chip components mounted in the previous process, and the flexible substrate 16 corresponding to the one end E 1 of the module substrate 6. A component-side connection terminal row 16c connected to the board-side connection terminal row 12a formed at a predetermined position of the wiring board 12 is formed on the back surface 16b. When the module substrate 6 is mounted on the wiring substrate 12, the flexible substrate 16 is bent so that the relative height positions of the one end E 1 and the other end E 2 of the module substrate 6 are mounted on the wiring substrate 12. Adjust according to.

  Next, a method for arranging the module substrates 6 on the tray holder 5 in the component supply unit 2 will be described with reference to FIG. As shown in FIG. 3A, the module substrate 6 is first mounted on the rectangular tray member 20 from above (arrow h) in plan view. Next, the module substrate 6 is similarly held in a state of being pressed and clamped from above (arrow i) by a pressing member 23 provided in a rectangular shape in plan view and detachable from the tray member 20. In the first embodiment, the module substrate 6 is mounted on the tray member 20 with the component-side connection terminal row 16c on the lower surface side, and the mounting head 10 also serving as a pickup head has the component-side connection terminal row 16c on the lower surface side. The module substrate 6 with the posture is taken out directly from the tray member 20.

  The tray member 20 is formed at a height different from the first support portion 20a for supporting the one end E1 of the module substrate 6 from below and a height difference H1 with respect to the first support portion 20a. A second support portion 20b that supports the other end side E2 side from below is provided so that a height difference is generated between the row 16c and the other end side E2. A clearance space 20c is provided between the first support portion 20a and the second support portion 20b to prevent interference with the module substrate 6 and the already mounted component 17. The first support portion 20a and the second support portion 20b are provided with through holes 20d and 20e, respectively, penetrating the tray member 20. Further, a positioning pin 21 protrudes from the second support portion 20b. When the positioning pin 21 is fitted into a positioning hole 15c provided in the rigid board 15 of the module board 6, the module board 6 is moved in the horizontal direction. Positioning is performed. That is, the module substrate 6 is mounted on the tray member 20 in a state of being positioned in the horizontal direction.

  A lower surface of the pressing member 23 is provided with a first pressing surface 23a for pressing the module substrate 6, a second pressing surface 23b, and an abutting surface 23c that contacts the tray member 20. An escape space 23e for preventing interference with the module substrate 6 and the already mounted component 18 is provided in the middle of the two pressing surfaces 23b. The first pressing surface 23a contacts the surface 16a of the flexible substrate 16 and presses the flexible substrate 16 on the one end side E1 against the first support portion 20a. The second pressing surface 23b contacts the surface 15a of the rigid substrate 15 and presses the rigid substrate 15 against the second support portion 20b. The contact surface 23c is provided with an alignment hole 23d penetrating in the vertical direction. By fitting the alignment pin 22 implanted in the tray member 20 into the alignment hole 23d, the pressing member 23 is It is aligned with respect to the tray member 20.

  Here, the positional relationship of the first pressing surface 23a, the second pressing surface 23b, and the contact surface 23c in the height direction is such that the second pressing surface is in a state where the contact surface 23c is in direct contact with the first support portion 20a. The second pressing surface 23b is set to be higher than the contact surface 23c by the thickness of the rigid substrate 15 so that 23b is in close contact with the surface 15a of the rigid substrate 15, and the first pressing surface 23a is At a position lower than the second pressing surface 23b by a height difference H2 so that the flexible substrate 16 on the one end side E1 of the module substrate 6 is in close contact with the surface 16a of the flexible substrate 16 in a state where the flexible substrate 16 is in contact with the first support portion 20a. Is set.

  That is, the pressing member 23 is detachably mounted on the module substrate 6 mounted on the tray member 20, and presses and holds the module substrate 6 against the tray member 20. The tray member 20 and the pressing member 23 sandwiching the module substrate 6 in this way are in a state in which the lower surface of the tray member 20 is brought into contact with the placement surface 24a on the tray placement portion 24 shown in FIG. It is mounted with. A plurality of tray mounting portions 24 are provided in a lattice arrangement on the tray holder 5 shown in FIG. 1. Each tray mounting portion 24 has two tray mounting portions 24 at positions corresponding to the through holes 20 d and 20 e in the tray member 20. A suction hole 24b is provided. The suction hole 24b is connected to the first vacuum suction part 25, and vacuum suction is performed from the suction hole 24b by operating the first vacuum suction part 25.

  As shown in FIG. 3C, in the state where the tray member 20 that sandwiches the module substrate 6 with the pressing member 23 is placed on the tray placement portion 24, through holes 20d provided in the tray member 20, 20e communicates with a suction hole 24b that constitutes a component suction means described below. Then, by operating the first vacuum suction part 25 in this state, vacuum suction is performed from the through holes 20d and 20e through the suction hole 24b, whereby the rigid substrate 15 and the flexible substrate 16 are respectively connected to the first support part 20a and the first support part 20a. 2 It hold | maintains by the vacuum suction to the support part 20b. The module substrate 6 housed in the tray holder 5 of the component supply unit 2 in this way is taken out by vacuum suction by the mounting head 10. Prior to the removal by vacuum suction, the pressing member 23 is removed from above the module substrate 6. Removed.

  In the above-described configuration, the first vacuum suction unit 25 and the suction hole 24b are provided in the tray mounting unit 24 arranged in the tray holder 5, and the tray member 20 to which the module substrate 6 is mounted is mounted. The module substrate 6 is a component suction unit that vacuum-sucks the module substrate 6 via the tray member 20. In the first embodiment, it is assumed that the above operation is performed manually by an operator. However, a part or all of these operations are automatically performed by a transfer robot mechanism or the like. May be.

  Next, the configuration and function of the mounting head 10 will be described with reference to FIG. 4, the mounting head 10 is mounted with a mounting block 31, a nozzle holder 32, and a first suction nozzle 33 in order from the top to the lower end of a lifting shaft 30 that is lifted and lowered by the head lifting mechanism 9 shown in FIG. The second suction nozzle 34 is disposed on the side surface of the block 31. The elevating shaft 30, the mounting block 31, and the nozzle holder 32 are each provided with two systems of first suction holes 30a, second suction holes 30b, first suction holes 31a, second suction holes 31b, first suction holes 32a, and second suction holes. A hole 32b is formed, and the first suction holes 30a, 31a, 32a and the second suction holes 30b, 31b, 32b communicate with each other. The mounting block 31 is fixed to the lifting shaft 30, and the nozzle holder 32 is screwed to the mounting block 31. The first suction nozzle 33 is sucked and held by the second suction hole 32b by operating the vacuum suction part and performing vacuum suction from the second suction hole 30b.

  The shaft portion 33a extending downward from the center of the first suction nozzle 33 is provided with a suction hole 33b extending vertically therethrough, and the suction hole 33b is second through the first suction holes 32a, 31a, 30a. A vacuum suction unit 35 is connected. Similarly, the suction hole 34 b provided in the second suction nozzle 34 is also connected to the second vacuum suction part 35. By operating the second vacuum suction unit 35, vacuum suction is performed from the suction holes 33b and 34b, and the suction target object can be sucked and held by the first suction unit 33c and the second suction unit 34c which are the respective suction surfaces. .

  Here, the first suction portion 33c and the second suction portion 34c suck the end portion of the flexible substrate 16 of the module substrate 6, and the second suction portion 34c sucks the flat portion of the rigid substrate 15 of the module substrate 6, respectively. The planar position of the two suction nozzles 34 is set, and the height positions of the first suction part 33c and the second suction part 34c are different by a height difference H3 when the module substrate 6 is held on the tray member 20. The shape is set as follows. That is, in the first embodiment, the mounting head 10 that also serves as the pickup head has a first suction portion 33c that vacuum-sucks one end side E1 of the module substrate 6, and a position that differs in height from the one end side E1 by a height difference H3. And the second suction part 34c that vacuum-sucks the other end E2.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 5, a control unit 40 is an arithmetic device, and controls each unit described below based on various programs and data stored in the storage unit 41. The storage unit 41 stores an operation program and mounting data necessary for executing a component pickup operation and a component mounting operation described below.

  The image recognition unit 42 recognizes the imaging results of the first camera 7 and the second camera 13, thereby recognizing the position of the module substrate 6 in the component supply unit 2, the wiring substrate 12 in the substrate holding unit 3, and the mounting head 10. The position of the held module substrate 6 is recognized. The control unit 40 controls the component moving unit 2, the first vacuum suction unit 25, the mounting head 10, the second vacuum suction unit 35, the head moving mechanism including the moving table 8 and the head lifting mechanism 9, and the substrate holding unit 3. Thus, the electronic component pick-up operation described below and the component mounting operation for mounting the taken-out electronic component on the wiring board 12 positioned and held by the board holding unit 3 are executed.

  Next, an electronic component pick-up operation and component mounting operation will be described with reference to FIGS. FIG. 6A shows a state in which the module substrate 6 is aligned for mounting on the tray member 20. Here, first, the module substrate 6 is held with the surface 16a and the surface 15a facing upward so that the component side connection terminal row 16c is on the lower surface side. The direction of the module substrate 6 is such that one end E1 and the other end E2 are positioned above the first support portion 20a and the second support portion 20b of the mounting head 10, respectively, and the positioning hole 15c of the rigid substrate 15 is the positioning pin 21. The module substrate 6 is aligned with the tray member 20 so as to be located immediately above the tray member 20.

  Next, as shown in FIG. 6B, the module substrate 6 is lowered with respect to the tray member 20, and the positioning pins 21 are fitted into the positioning holes 15c. Thus, the module substrate 6 is positioned in the horizontal direction with respect to the tray member 20. At this time, the module substrate 6 is supported from below by the tray member 20 when the rigid substrate 15 contacts the second support portion 20b, and the flexible substrate 16 is in a cantilevered support state above the first support portion 20a. When the rigidity of the flexible substrate 16 is lower than its own weight or the weight of the already mounted component, the flexible substrate 16 is in a cantilever state while being cantilevered, and the vicinity of the tip is in contact with the first support portion 20a for support. Is done. That is, here, of the support from the lower side of the module substrate 6 by the first support portion 20a and the second support portion 20b, at least the second support portion 20b supports the other end E2 from the lower side, whereby the module substrate 6 is fixed. The tray member 20 is mounted while being positioned in the horizontal direction (component mounting step).

  Thereafter, the pressing member 23 is placed on the module substrate 6 mounted on the tray member 20 while the alignment pin 22 is fitted into the alignment hole 23d, and the module substrate 6 is attached to the tray member 20. Pressing and clamping (pressing member placement step). 6C, the flexible substrate 16 is pressed against the first support portion 20a by the first pressing surface 23a, and the rigid substrate 15 is pressed against the second support portion 20b by the second pressing surface 23b. That is, the module substrate 6 is sandwiched between the tray member 20 and the pressing member 23 in a form in which a height difference H1 (see FIG. 3) occurs between the one end side E1 and the other end side E2. Next, the tray member 20 on which the pressing member 23 is placed and sandwiches the module substrate 6 is placed on the tray placing portion 24 (tray placing step).

  Then, the module substrate 6 is vacuum-sucked through the tray member 20 by the component suction means provided in the tray mounting portion 24 (component suction step). That is, the first vacuum suction unit 25 is operated, and the vacuum suction is performed from the through holes 20e and 20d through the suction holes 24b provided in the tray mounting unit 24 as shown in FIG. The substrate 16 is attracted and held on the first support portion 20a, and the rigid substrate 15 is attracted and held on the second support portion 20b.

  Thereafter, as shown in FIG. 7B, the pressing member 23 is removed from the tray member 20 on which the module substrate 6 is vacuum-adsorbed (pressing member removing step). At this time, since the vacuum suction by the component suction means continues, the module substrate 6 keeps the state held by the tray member 20 while maintaining the height difference between the rigid substrate 15 and the flexible substrate 16. . In this state, the module substrate 6 is picked up. That is, the mounting head 10 that functions as a pickup head is lowered with respect to the tray member 20 that has vacuum-sucked the module substrate 6 to bring the first suction portion 33c into contact with the one end E1 of the flexible substrate 16, and the second suction The part 34c is brought into contact with the other end E2 of the rigid substrate 15 (head lowering step).

  Then, the second vacuum suction unit 35 is operated, and the module substrate 6 is sucked and held by the mounting head 10 by vacuum suction from the first suction unit 33c and the second suction unit 34c, and the first vacuum suction unit 25 is operated. Stop and release the vacuum suction of the module substrate 6 by the component suction means (component suction step). As a result, the module substrate 6 is transferred from the tray member 20 to the mounting head 10. Next, the mounting head 10 is raised, and the module substrate 6 sucked and held is taken out from the component supply unit 2 as shown in FIG. 7C (component pickup process).

  Thereafter, the taken module board 6 is transferred to the wiring board 12 positioned and held by the board holding unit 3 by the mounting head 10 (component transfer process). Then, the mounting head 10 is lowered to connect the component side connection terminal row 16c formed on the flexible substrate 16 of the module substrate 6 to the substrate side connection terminal row 12a (see FIG. 2) formed on the wiring substrate 12 (component). Connection process).

  That is, in the electronic component mounting method by the electronic component mounting apparatus 1 shown in the first embodiment, the control unit 40 controls the mounting head 10 that also serves as the component suction unit, the head moving mechanism, and the pickup head described above. The work operation to be performed is executed. That is, the module substrate 6 mounted on the tray member 20 is vacuum-sucked through the through holes 20d and 20e and the suction holes 24b, and then the holding member 23 is removed, and then the module substrate 6 is suction-held by the mounting head 10 and component suction is performed. After the vacuum suction by the means is released, the module substrate 6 sucked and held in a state where the height difference between the rigid substrate 15 and the flexible substrate 16 is maintained by the mounting head 10 is taken out from the component supply unit 2, and the substrate holding unit The component side connection terminal row 16c of the module substrate 6 is connected to the board side connection terminal row 12a formed on the wiring board 12.

  In this electronic component mounting method, the mounting operation to the wiring board 12 is performed in a state in which the flexible board 16 is bent and the height difference between the rigid board 15 and the flexible board 16 is maintained. Even when there is an already mounted part on the module substrate 6, it is possible to newly mount the module board 6 while avoiding interference with the already mounted part. For example, as shown in FIG. 8A, even when the mounted component 19A is present on the lower surface of the rigid substrate 15 of the module substrate 6, interference between the mounted component 19A and the wiring substrate 12 can be avoided. it can. Further, as shown in FIG. 8B, even when the mounted component 19B exists at a position corresponding to the lower side of the rigid substrate 15 in the wiring board 12, the interference between the mounted component 19B and the rigid substrate 15 is prevented. Can be avoided.

  Further, as shown in FIG. 8C, in order to recognize the component side connection terminal row 16c of the flexible board 16 and the board side connection terminal row 12a of the wiring board 12, the second camera 13 is connected to the mounting head 10 in the first position. Even when the already mounted component 19C protrudes downward from the lower surface of the rigid substrate 15 when moving forward and backward between the one suction nozzle 33 and the wiring substrate 12, the second camera 13 and the already mounted component 19C Interference can be prevented.

  In the above-described configuration, a driving mechanism for bending the flexible substrate 16 is used in the configuration in which the module substrate 6 is sucked and held by the mounting head 10 in a state where the height difference between the rigid substrate 15 and the flexible substrate 16 is maintained. Instead, the flexible substrate 16 is bent by a simple mechanism that simply places the pressing member 23 on the module substrate 6 mounted on the tray member 20, thereby realizing a predetermined height difference. In the process of bending the flexible substrate 16 by the pressing member 23, the module substrate 6 is positioned in the horizontal direction with respect to the tray member 20 by the positioning means configured to fit the positioning pins 21 into the positioning holes 15c. It is possible to prevent the positional shift of the parts, such as the component side connection terminal row 16c, which is important for mounting accuracy, and to obtain stable mounting accuracy with a simple mechanism.

(Embodiment 2)
With reference to FIG. 9, the structure of the tray member 120 and the pressing member 123 used in the second embodiment will be described. Also in the second embodiment, as shown in FIG. 9A, the module substrate 6 is first mounted from above on the rectangular tray member 120 in a plan view, and then similarly in a plan view in a rectangular shape. Thus, it is held in a state where it is pressed and clamped from above by a pressing member 123 detachably provided to the tray member 120.

  In the second embodiment, the module substrate 6 is mounted on the tray member 120 with the component-side connection terminal row 16c on the upper surface side, and is taken out from the component supply unit 2 by the pickup head 110 (see FIG. 11A). It is. The pickup head 110 reciprocates between an upper part of the component supply unit 2 shown in FIG. 1 and a delivery position to the mounting head 10, and is disposed so as to be turned upside down by an upside down mechanism (not shown). With this configuration, after taking out the module substrate 6 with the component-side connection terminal row 16c on the upper surface side from the tray member 120, the pickup head 110 is turned upside down so that the component-side connection terminal row 16c is on the lower surface side. The module substrate 6 can be transferred to the mounting head 10.

  The tray member 120 is formed to have a first support portion 120a that supports the one end E1 of the module substrate 6 from below, and a height that differs from the first support portion 120a by a height difference H1. A second support portion 120b that supports the other end E2 side from below is provided so that a height difference is generated between 16c and the other end E2. Between the first support part 120a and the second support part 120b and between the second support parts 120b, there is an escape space 120c for preventing interference with the module substrate 6, the mounted component 19 and the like.

  The first support portion 120a is provided with a through hole 120d through the tray member 120, and the escape space 120c has a through hole 120e that passes through the tray member 120. Further, a positioning pin 21 protrudes from the second support portion 120b, and the positioning pin 121 is fitted into a positioning hole 15c provided in the rigid board 15 of the module board 6 so that the module board 6 can be moved in the horizontal direction. Positioning is performed. That is, the module substrate 6 is mounted on the tray member 120 in a state where the module substrate 6 is positioned in the horizontal direction.

  A first pressing surface 123 a and a second pressing surface 123 b for pressing the module substrate 6 are provided on the lower surface of the pressing member 123. The first pressing surface 123a abuts on the back surface 16b and presses the flexible substrate 16 on one end side E1 against the first support portion 120a. The second pressing surface 123b contacts the surface 15a and presses the rigid substrate 15 against the second support part 120b. Here, the positional relationship in the height direction between the first pressing surface 123a and the second pressing surface 123b is such that the flexible substrate 16 on the one end side E1 is pressed against the first support portion 120a by the first pressing surface 123a. The first pressing surface 123a is set at a position higher than the second pressing surface 123b by a height difference H2 so that the two pressing surfaces 123b are in close contact with the back surface 15b of the rigid substrate 15.

  That is, the pressing member 123 is detachably mounted on the module substrate 6 mounted on the tray member 120 and presses and holds the module substrate 6 against the tray member 120. The tray member 120 and the pressing member 123 sandwiching the module substrate 6 in this way are in a state in which the lower surface of the tray member 120 is in contact with the placement surface 24a on the tray placement portion 24 shown in FIG. 9B. It is mounted with. The tray placing portion 24 is the same as that shown in the first embodiment, and two suction holes 24b are provided at positions corresponding to the through holes 120d and 120e in the tray member 120. The suction hole 24b is connected to the first vacuum suction part 25, and vacuum suction is performed from the suction hole 24b by operating the first vacuum suction part 25.

  In a state where the tray member 120 that sandwiches the module substrate 6 with the pressing member 123 is placed on the tray placing portion 24, the through holes 120d and 120e communicate with the suction holes 24b that constitute the component suction means. Then, by operating the first vacuum suction part 25 in this state, vacuum suction is performed from the through holes 120d and 120e through the suction hole 24b, whereby the flexible substrate 16 and the rigid substrate 15 are respectively connected to the first support part 120a, The second support 120b is held by vacuum suction. Also in the second embodiment, the pressing member 123 is removed from the module substrate 6 prior to removal by vacuum pickup by the pickup head 110.

  Next, the configuration and function of the pickup head 110 will be described. In FIG. 11A, the pickup head 110 is provided with a first suction portion 110a and a second suction portion 110b corresponding to the planar arrangement of the first support portion 120a and the second support portion 120b in the tray member 120. In addition, suction holes 110c and 110d are opened in the first suction part 110a and the second suction part 110b, respectively. The suction holes 110c and 110d communicate with the suction hole 110e. The vacuum suction part (not shown) is operated to perform vacuum suction from the suction hole 110e, whereby the module substrate 6 mounted on the tray member 120 is flexible. The substrate 16 can be sucked and held by the first suction portion 110a, and the rigid substrate 15 can be sucked and held by the second suction portion 110b.

  Next, the electronic component pick-up operation and component mounting operation will be described with reference to FIGS. FIG. 10A shows a state in which the module substrate 6 is aligned for mounting on the tray member 120. Here, first, the module substrate 6 is set with the back surface 16b and the back surface 15b facing upward so that the component side connection terminal row 16c is on the upper surface side. The direction of the module substrate 6 is such that one end E1 and the other end E2 are positioned above the first support part 120a and the second support part 120b of the tray member 120, respectively, and the positioning hole 15c of the rigid board 15 is the positioning pin 121. The module substrate 6 is aligned with the tray member 120 so as to be located immediately above the tray member 120.

  Next, the module substrate 6 is lowered with respect to the tray member 120, and the positioning pins 121 are fitted into the positioning holes 15c to position the module substrate 6 with respect to the tray member 120 in the horizontal direction. At this time, the module substrate 6 is further pushed down in a state where the flexible substrate 16 is in contact with the first support portion 120a, so that the flexible substrate 16 is supported from below by the tray member 120 in a bent state. That is, here, the module substrate 6 is horizontally positioned on the tray member 120 by supporting the one end E1 and the other end E2 of the module substrate 6 from below by the first support portion 120a and the second support portion 120b. Install in a state (component mounting process).

  Thereafter, as shown in FIG. 10B, a pressing member 123 is placed on the module substrate 6 mounted on the tray member 120, and the module substrate 6 is pressed against the tray member 120 to be sandwiched ( Holding member mounting step). As a result, the flexible substrate 16 is pressed against the first support portion 120a by the first pressing surface 123a, and the rigid substrate 15 is pressed against the second support portion 120b by the second pressing surface 123b, and the module substrate 6 has one end E1 and the other end. It is sandwiched between the tray member 120 and the pressing member 123 in a form in which a height difference H1 occurs between the side E2. Next, the tray member 120 on which the pressing member 123 is placed and sandwiches the module substrate 6 is placed on the tray placing portion 24 (tray placing step).

  Then, the module substrate 6 is vacuum-sucked via the tray member 120 by the component suction means provided in the tray mounting portion 24 (component suction step). That is, the first vacuum suction unit 25 is operated and the vacuum suction is performed from the through holes 120e and 120d through the suction holes 24b provided in the tray mounting unit 24 as shown in FIG. The substrate 16 is sucked and held on the first support portion 120a, and the rigid substrate 15 is sucked and held on the second support portion 120b. Thereafter, as shown in FIG. 10D, the pressing member 123 is removed from the tray member 120 that has vacuum-sucked the module substrate 6 (pressing member removing step). At this time, since the vacuum suction by the component suction means is continued, the module substrate 6 keeps being held by the tray member 120 while maintaining the height difference between the rigid substrate 15 and the flexible substrate 16. . In this state, the module substrate 6 is picked up.

  That is, as shown in FIG. 11A, the pick-up head 110 is moved down by aligning the module substrate 6 with respect to the tray member 120 that has vacuum-sucked the module substrate 6, and the first suction portion 110a is moved to one end E1 of the flexible substrate 16. And the second suction part 110b is brought into contact with the other end E2 of the rigid substrate 15 (head lowering step). Then, by vacuum suction from the suction hole 110e, the module substrate 6 is sucked and held by the pickup head 110, and the operation of the first vacuum suction portion 25 is stopped to release the vacuum suction of the module substrate 6 by the component suction means ( Component adsorption process). As a result, the module substrate 6 is transferred from the tray member 120 to the pickup head 110. Next, the pick-up head 110 is raised, and the module substrate 6 sucked and held is taken out from the component supply unit 2 as shown in FIG. 11B (component pick-up process).

  Thereafter, as shown in FIG. 11C, the pickup head 110 from which the module substrate 6 has been taken out is moved to the delivery position to the mounting head 10 and turned upside down. As a result, the module substrate 6 is held by the pickup head 110 in such a posture that the front surface 16a and the front surface 15a face upward, that is, the component-side connection terminal row 16c faces downward. In this state, the module substrate 6 is transferred to the mounting head 10. That is, as shown in FIG. 12A, the mounting head 10 is moved to the delivery position, and the mounting head 10 is positioned above the pickup head 110 that holds the module substrate 6 by suction. Then, the first suction part 33c and the second suction part 34c are aligned with the first suction part 110a and the second suction part 110b, the mounting head 10 is lowered with respect to the pickup head 110, and the first suction part 33c is flexible. While making it contact | abut to the one end side E1 of the board | substrate 16, the 2nd adsorption | suction part 34c is made to contact | abut to the other end side E2 of the rigid board | substrate 15 (head lowering process).

  Then, the second vacuum suction unit 35 is operated in the same manner as in the first embodiment, and vacuum suction is performed from the first suction unit 33c and the second suction unit 34c, and the module substrate 6 is sucked and held by the mounting head 10, and suction is performed. The vacuum suction from the hole 110e is stopped to release the vacuum suction of the module substrate 6 (component suction step). As a result, the module substrate 6 is delivered from the pickup head 110 to the mounting head 10. Next, the mounting head 10 is raised, and the module substrate 6 sucked and held is taken out from the component supply unit 2 as shown in FIG. 12B (component pickup process).

  Thereafter, the taken module board 6 is transferred to the wiring board 12 positioned and held by the board holding unit 3 by the mounting head 10 (component transfer process). Then, the mounting head 10 is lowered to connect the component side connection terminal row 16c formed on the flexible substrate 16 of the module substrate 6 to the substrate side connection terminal row 12a (see FIG. 2) formed on the wiring substrate 12 (component). Connection process).

  That is, in the electronic component mounting method by the electronic component mounting apparatus 1 shown in the second embodiment, the control unit 40 controls the above-described component suction unit, head moving mechanism, pickup head 110, and mounting head 10 to perform the following operations. The action is executed. That is, the module substrate 6 mounted on the tray member 20 with the component-side connection terminal row 16c on the upper surface side is vacuum-sucked through the through holes 20d and 20e and the suction holes 24b, and then the pressing member 23 is removed and then the module is removed. The substrate 6 is sucked and held by the pickup head 110 and the vacuum suction by the component sucking means is released, and the module substrate 6 in a state where the height difference between the rigid substrate 15 and the flexible substrate 16 is maintained is picked up by the pickup head 110. Remove from member 120.

  Then, the module substrate 6 in a posture in which the component-side connection terminal row 16c is turned to the lower surface side by turning the pickup head 110 upside down is delivered to the mounting head 10, and the delivered module substrate 6 is positioned and held on the substrate holding part 3 by the mounting head 10. Then, the component side connection terminal row 16 c of the module substrate 6 is connected to the board side connection terminal row 12 a formed on the wiring board 12. Also by the configuration shown in the second embodiment, the same effect as in the first embodiment is obtained.

  The electronic component pickup apparatus and pickup method, electronic component mounting apparatus, and electronic component mounting method according to the present invention obtain a stable mounting accuracy with a simple mechanism for an electronic component including a flexible region such as a flexible substrate. Therefore, it can be used in the field of mounting a board module having an already mounted component on a wiring board.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Component supply part 3 Board holding part 5 Tray holder 6 Module board 8 Moving table 9 Head raising / lowering mechanism 10 Mounting head 12 Wiring board 12a Board side connection terminal row | line | column 15 Rigid board | substrate 16 Flexible board 16c Component side connection terminal row | line | column 17, 18, 19 Mounted component 20, 120 Tray member 20a, 120a First support portion 20b, 120b Second support portion 20d, 20e, 120d, 120e, Through hole 23, 123 Press member 23a, 123a First press surface 23b , 123b Second holding surface 24 Tray mounting portion 24b Suction hole 33 First suction nozzle 33c First suction portion 34 Second suction nozzle 34c Second suction portion

Claims (7)

In a state in which at least a part includes a flexible region, the relative height position between the one end side and the other end side can be changed, and the component side connection terminal row is formed on the one end side and attached to the tray member. An electronic component pickup device for taking out an electronic component to be supplied by vacuum suction from the tray member placed on a tray placement portion of a component supply portion by a pickup head,
A tray member that is mounted in a state where the electronic component is positioned in a horizontal direction, and is detachably mounted on the electronic component that is mounted on the tray member, and the electronic component is pressed against the tray member and sandwiched. The electronic component is placed in a tray with the pressing member removed from above the electronic component prior to vacuum suction by the pickup head and the tray member provided on the tray mounting portion and having the electronic component mounted thereon. Component suction means for vacuum suction via a member, and a control unit for controlling the component suction means and the pickup head,
The tray member is formed at a different height with respect to the first support portion and the first support portion for supporting the one end side of the electronic component from below, and between the component side connection terminal row and the other end side. A second support part that supports the other end side from below so as to form a height difference; and the tray that is provided through the tray member by opening in the first support part and the second support part. A through-hole communicating with the suction hole of the component suction means in a state of being placed on the placement portion;
The pickup head includes a first suction part that vacuum-sucks the one end side of the electronic component, and a second suction part that vacuum-sucks the other end side at a position that differs in height from the one end side by the height difference; Have
The control unit controls the component suction means and the pickup head to vacuum-suck the electronic component mounted on the tray member through the suction hole and the through hole, and then removes the pressing member and then the pickup. A pickup apparatus for an electronic component, wherein the electronic component is sucked and held by a head, the vacuum suction by the component sucking means is released, and then the pick-up head is lifted to take out the electronic component held by suction. In a state in which at least a part includes a flexible region, the relative height position between the one end side and the other end side can be changed, and the component side connection terminal row is formed on the one end side and attached to the tray member. A method for picking up an electronic component to be picked up by taking out the electronic component by vacuum suction using a pickup head from the tray member placed on the tray placement portion of the component supply portion,
The tray member is formed at a different height with respect to the first support portion and the first support portion for supporting the one end side of the electronic component from below, and between the component side connection terminal row and the other end side. A second support part that supports the other end side from below so as to form a height difference; and the tray that is provided through the tray member by opening in the first support part and the second support part. A through hole communicating with the suction hole of the tray mounting portion in a state of being mounted on the mounting portion;
The pickup head includes a first suction part that vacuum-sucks the one end side of the electronic component, and a second suction part that vacuum-sucks the other end side at a position that differs in height from the one end side by the height difference; Have
Of the support from the lower side of the electronic component by the first support portion and the second support portion, the electronic component is horizontally mounted on the tray member by supporting the other end side from below by at least the second support portion. Component mounting process for mounting in a state positioned in the direction;
A pressing member mounting step of mounting a pressing member on the electronic component mounted on the tray member and pressing and holding the electronic component against the tray member;
A tray placing step of placing the tray member on which the pressing member is placed on the tray placing portion;
A component suction step in which the electronic component is vacuum-sucked via a tray member by a component suction means provided in the tray mounting portion;
A pressing member removing step of removing the pressing member from the tray member that has vacuum-adsorbed the electronic component;
A head lowering step in which the pickup head is lowered with respect to the tray member that has vacuum-adsorbed the electronic component to bring the first suction portion into contact with the one end side and the second suction portion into contact with the other end side. When,
A component suction step of vacuum-sucking and holding the electronic component by the pickup head by vacuum suction from the first suction portion and the second suction portion, and releasing the vacuum suction of the electronic component by the component suction means;
A method of picking up an electronic component, comprising: picking up the electronic component that is picked up and held by raising the pickup head. In a state in which at least a part includes a flexible region, the relative height position between the one end side and the other end side can be changed, and the component side connection terminal row is formed on the one end side and attached to the tray member. The supplied electronic component is taken out by vacuum suction from the tray member mounted on the tray mounting portion of the component supply portion by a pickup head, and mounted on the wiring board positioned and held by the substrate holding portion by the mounting head. An electronic component mounting apparatus,
A tray member that is mounted in a state where the electronic component is positioned in a horizontal direction, and is detachably mounted on the electronic component that is mounted on the tray member, and the electronic component is pressed against the tray member and sandwiched. The electronic component is removed from the electronic component prior to the vacuum suction, and the electronic component is mounted on the tray mounting portion with the electronic component mounted tray member. Component suction means for vacuum suction via, a head moving mechanism for moving the pickup head and the mounting head, and a control unit for controlling the component suction means, head movement mechanism, pickup head and mounting head,
The tray member is formed at a different height with respect to the first support portion and the first support portion that supports the one end side of the electronic component from below, and between the component side connection terminal row and the other end side. A second support part that supports the other end side from below so as to form a height difference between the first support part and the second support part, and the tray member is provided through the tray member. A through-hole communicating with the suction hole of the component suction means in a state of being placed on the placement portion;
The pickup head and the mounting head include a first suction part that vacuum-sucks the one end side of the electronic component, and a second suction-suction of the other end side at a position that differs in height from the one end side by the height difference. An adsorbing part,
The control unit controls the component suction means, the head moving mechanism, the pickup head, and the mounting head, thereby vacuum-sucking the electronic component mounted on the tray member through the suction hole and the through hole, and then pressing the pressing member. After removing the member, the electronic component is sucked and held by the pickup head and the vacuum suction by the component sucking means is released, and then the electronic component sucked and held by the pickup head is taken out and positioned on the substrate holding portion by the mounting head An electronic component mounting apparatus, wherein the electronic component mounting apparatus transfers to a held wiring board and connects the component side connection terminal row to a board side connection terminal row formed on the wiring board.   The electronic component is mounted on the tray member in a posture with the component side connection terminal row on the lower surface side, and the mounting head that also serves as the pickup head trays the electronic component in a posture with the component side connection terminal row on the lower surface side. 4. The electronic component mounting apparatus according to claim 3, wherein the electronic component mounting apparatus is removed from the member.   The electronic component includes a head reversing mechanism that is mounted on the tray member in a posture with the component-side connection terminal row on the upper surface side, and that reverses the pickup head that has been taken out by vacuum suction of the electronic component from the tray member, 4. The electronic component mounting apparatus according to claim 3, wherein the pickup head delivers an electronic component in a posture in which the component-side connection terminal row is on a lower surface side by upside down to the mounting head. In a state in which at least a part includes a flexible region, the relative height position between the one end side and the other end side can be changed, and the component side connection terminal row is formed on the one end side and attached to the tray member. The supplied electronic component is taken out by vacuum suction from the tray member placed on the tray placement portion of the component supply portion by the pickup head, and mounted on the wiring board positioned and held by the substrate holding portion by the mounting head. An electronic component mounting method,
The tray member is formed at a different height with respect to the first support portion and the first support portion for supporting the one end side of the electronic component from below, and between the component side connection terminal row and the other end side. A second support part that supports the other end side from below so as to form a height difference; and the tray that is provided through the tray member by opening in the first support part and the second support part. Having a through hole communicating with the suction hole of the tray mounting portion in a state of being mounted on the mounting portion;
The pickup head and the mounting head include a first suction part that vacuum-sucks the one end side of the electronic component, and a second suction-suction of the other end side at a position that differs in height from the one end side by the height difference. An adsorbing part,
Of the support from the lower side of the electronic component by the first support portion and the second support portion, the electronic component is horizontally mounted on the tray member by supporting the other end side from below by at least the second support portion. Component mounting process for mounting in a state positioned in the direction;
A pressing member mounting step of mounting a pressing member on the electronic component mounted on the tray member and pressing and holding the electronic component against the tray member;
A tray placing step of placing the tray member on which the pressing member is placed on the tray placing portion;
A component suction step in which the electronic component is vacuum-sucked via a tray member by a component suction means provided in the tray mounting portion;
A pressing member removing step of removing the pressing member from the tray member that has vacuum-adsorbed the electronic component;
A head lowering step in which the pickup head is lowered with respect to the tray member that has vacuum-adsorbed the electronic component to bring the first suction portion into contact with the one end side and the second suction portion into contact with the other end side. When,
A component suction step of vacuum-sucking and holding the electronic component by the pickup head by vacuum suction from the first suction portion and the second suction portion, and releasing the vacuum suction of the electronic component by the component suction means;
A component pick-up process for raising the pick-up head and taking out the electronic component held by suction;
A component transfer step of transferring the taken-out electronic component to the wiring substrate positioned and held in the substrate holding portion by the mounting head;
A component connecting step of lowering the mounting head to connect the component side connection terminal row to the board side connection terminal row formed on the wiring board.   The electronic component is a module substrate in which a component-side connection terminal row is formed on the one end side of a flexible substrate as the flexible region, and a plurality of board-side connection terminal rows formed in parallel with the wiring board. An electronic component mounting method comprising: mounting a plurality of module boards on the wiring board in a state where the other end sides are vertically stacked by sequentially connecting the component side connection terminal rows.

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