JP2013055130A - Jumper resistor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jumper resistor which can be surface-mounted and has an extremely low resistance.SOLUTION: The jumper resistor comprises a metal resistive element 1. The metal resistive element 1 includes a planar metal body 1a and a pair of electrodes 1b provided on a front surface or a rear surface of the metal body 1a. The pair of electrodes 1b are provided apart from each other. The metal body 1a and the electrodes 1b are constituted of the same kind of metal material and are continuously and integrally formed. The metal resistive element 1 is configured to have a resistance value of 1 mΩ or lower.

Description

  The present invention relates to a jumper resistor.

  Conventionally, a jumper element is used in a printed circuit board or the like. The jumper element is also called a zero ohm resistor or the like, but actually has a slight resistance value. One of the roles of the jumper element is to provide a land in advance and short-circuit the jumper element until it is time to replace the resistor or the like when a resistor or the like may be attached in the future.

  In addition, wiring is formed in a complicated manner on the printed circuit board, and there is a case where another wiring has to be provided in a direction perpendicular to the wiring. In such a case, a jumper element is used.

  Jumper elements include leaded linear jumper resistors, but wiring with this type of jumper resistor may lack power or current capacity, and solder by inserting wires into lands on the printed circuit board Since the connection by is necessary, mounting was troublesome.

JP 2009-43883 A

  Therefore, it is conceivable to change the lead linear jumper resistor to a surface mount type jumper resistor. In this case, for example, as shown in Patent Document 1, there is a thick film type surface mount jumper resistor, but the maximum resistance value is as high as 20 mΩ to 100 mΩ, and particularly when a large current is applied, power loss and voltage There was a drop problem.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a jumper resistor that can be surface-mounted and has an extremely low resistance.

  In order to achieve the above object, a jumper resistor according to the present invention is a metal resistor including a flat metal body and a plurality of electrodes arranged at intervals on the front or back surface of the metal body. The main feature is that the resistance of the metallic resistor is 1 mΩ or less.

  The jumper resistor of the present invention is composed of a metal resistor including a flat metal body and a plurality of electrodes arranged at intervals on the front or back surface of the metal body, and the resistance of the metal resistor is Since it is 1 mΩ or less, surface mounting is possible and the mountability is excellent, and power loss and voltage drop due to a jumper resistor can be extremely reduced.

It is a figure which shows the structural example of the jumper resistor in which the metal body and the electrode were integrally formed. It is a figure which shows the structural example of the jumper resistor in which the metal body and the electrode were integrally formed. It is a figure which shows the structural example of the jumper resistor in which the metal body and the electrode were integrally formed. It is a figure which shows the structural example of the jumper resistor in which the metal body and the electrode were formed with different metal materials. It is a figure which shows the manufacturing process of the jumper resistor of FIG. It is a figure which shows the structural example of a bridge type jumper resistor. It is a figure which shows the structural example of the jumper resistor which molded the metal resistor of FIG. It is a figure which shows the structural example of the jumper resistor which molded the metal resistor of FIG. It is a figure which shows the example of a shape of metal resistors. It is a figure which shows the structural example of the metal resistors from which the formation position of an electrode differs.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. The drawings are schematic, and there may be a case where portions having different dimensional relationships and ratios are included between the drawings.

  A configuration example of the jumper resistor of the present invention is shown in FIG. The jumper resistor is made of a metal resistor 1. The metal resistor 1 includes a flat metal body 1a and a pair of electrodes 1b provided on the front or back surface of the metal body 1a. The pair of electrodes 1b are provided apart from each other in the longitudinal direction of the metal body 1a. The metal body 1a and the electrode 1b are made of the same kind of metal material, and the metal body 1a and the electrode 1b are formed continuously and integrally without a seam. Here, the resistance value of the metal resistor 1 is configured to be 1 mΩ or less, more preferably 0.5 mΩ or less.

  Moreover, although the shape of the metal body 1a is illustrated as a rectangular parallelepiped in the drawing, it is not limited to this, and it may be a flat plate shape having a flat surface. For example, the shape shown in FIG. 9 may be used. FIG. 9A shows that the metal resistor 100 is composed of a metal body 100a and a pair of electrodes 100b. The metal body 100a has a flat plate shape, but is formed in an I shape in plan view. FIG. 9B shows that the metal resistor 110 is composed of a metal body 110a and a pair of electrodes 110b. The metal body 110a has a flat plate shape, but has recesses at the four corners. As described above, since the metal resistor 1 has a flat surface made of the flat metal body 1a, it can correspond to automatic surface mounting.

  The metal resistor 1 is made of an alloy containing 90 wt% or more of Cu (copper). The Cu content is desirably 95 wt% to 99 wt%. Since Cu is a metal having a very small specific resistance, Cu is preferable as a material that brings the resistance value close to zero. On the other hand, other types of metals are added without making the copper component 100% from the viewpoint of strength, and the strength can be maintained by using an alloy. Furthermore, it is preferable from the viewpoint of electrical conductivity and mechanical strength that the Cu content is 96 wt% to 99 wt%. That is, sufficient mechanical strength can be provided while the resistance value is 1 mΩ or less. Thereby, the stamping property in press work etc. can be raised. Also, the shape of the finished product is less likely to be deformed by a stress such as an external load.

  When adding other types of metals to make an alloy, add one or more types of metal elements such as Sn (tin), Cr (chromium), Zn (zinc), Si (silicon), etc. Is preferred.

  The metal resistor 1 can be formed, for example, by cutting the central portion of a rectangular parallelepiped metal plate that is a raw material. Moreover, as another manufacturing method, it can also form by pressing (coining) the center part of a rectangular parallelepiped metal plate. Thereby, the metal resistor 1 is comprised in the U shape which has a hollow in the center part.

  Further, as shown in FIG. 2, a solder layer 2 for improving solderability may be laminated on the surface of the electrode 1b in order to cope with solder mounting. The solder layer 2 is formed by, for example, a plating process.

  Furthermore, as shown in FIG. 3, the insulating layer 3 may be formed in the recesses between the electrodes 1b. In this case, the inner end surface of each electrode 1b is in contact with both end surfaces of the insulating layer 3, and is provided so as to cover the entire region between the pair of electrodes 1b. The thickness of the insulating layer 3 is formed to be equal to or less than the thickness of each electrode 1b. The insulating layer 3 is made of resin or the like. The insulating layer 3 is formed by, for example, printing a thick film of epoxy resin on a solid film. When the insulating layer 3 is used to mount a pair of electrodes 1b across the wiring, a short circuit with the wiring can be prevented.

  The jumper resistor of FIG. 4 is configured by a metal resistor 10, and the metal resistor 10 has the same configuration as the metal resistor 1 of FIG. The metal resistor 10 includes a flat metal body 12 and a pair of electrodes 11 provided on the front or back surface of the metal body 12. Here, the metal resistor 1 is different from the metal resistor 1 in that the metal body 12 and the pair of electrodes 11 are made of different kinds of metal materials, and the metal body 12 and the electrode 11 have a joint, and are continuously It is not formed integrally.

  Moreover, although the shape of the metal body 12 is illustrated as a rectangular parallelepiped in the drawing, it is not limited to this, and it may be a flat plate shape having a flat surface. Similar to the description in FIG. 1, for example, the shape shown in FIG. The metal body 100 a in FIG. 9A corresponds to the metal body 12, and the pair of electrodes 100 b corresponds to the electrode 11. The metal body 110 a in FIG. 9B corresponds to the metal body 12, and the pair of electrodes 110 b corresponds to the electrode 11.

  The pair of electrodes 11 are provided apart from each other in the longitudinal direction of the metal body 12. The metal body 12 and the electrode 11 are made of different metal materials, but the same material is used for the metal material of the metal body 12 and the metal material of the metal resistor 1 described in FIG. For this reason, description of the metal material of the metal body 12 is abbreviate | omitted. Further, the resistance of the metallic resistor 10 is configured to be 1 mΩ or less, more preferably 0.5 mΩ or less.

  By the way, in FIG. 1, 4 etc., although the structure where the electrode was provided along the short side of the metal body was shown, it is not restricted to this. As shown in FIG. 10A, the electrode 1b may be formed along the long side direction of the metal body 1a. This improves the heat dissipation and increases the stress applied from the pair of electrodes. Further, as shown in FIG. 10B, the electrode 1b may be provided separately on one side of the square metal body 1a in plan view. In the structural example of FIG. 10, the reference numeral of FIG. 1 is used, but in FIG. 4, 1 a corresponds to the metal body 10 and 1 b corresponds to the electrode 11.

  On the other hand, when the specific resistance of the metal material of the electrode 11 is ρ1 (Ω · m) and the specific resistance of the metal material of the metal body 12 is ρ2 (Ω · m), each metal material has a relation of ρ1 ≦ ρ2. Is selected. For example, the electrode 11 is formed by applying Cu plating to the metal body 12.

  Regarding the formation of the electrode 11, there is a method shown in FIG. 5 other than plating. First, a metal plate 11A and a metal body 12 as raw materials for the electrode 11 are prepared, and as shown in FIG. 5A, the resistor 12 and the plate 11A are joined by rolling to form a clad material. Next, as shown in FIG. 5B, the central portion of the metal plate 11A is removed by chemical cutting such as etching or mechanical cutting, and the electrodes 11 at both ends are formed.

  Here, in the structure of FIG. 4, as shown in FIG. 3, an insulating layer may be formed so as to cover the entire region between the pair of spaced electrodes 11. In this case, the inner end surface of each electrode 11 is provided in contact with both end surfaces of the insulating layer. In addition, the insulating layer is formed to have a thickness equal to or less than the thickness of each electrode 11.

  Similarly to FIG. 2, a solder layer may be laminated on the surface of the electrode 11 of FIG.

  FIGS. 6A to 6D show structural examples of bridge-type jumper resistors. The jumper resistor of FIG. 6A is configured by a metal resistor 30. The metal resistor 30 is a rectangular parallelepiped plate member 31 and electrodes 34 and 35, both ends of the metal member 31, and each electrode. Step portions 32 and 33 provided between 34 and 35 are provided. The electrodes 34 and 35 are formed so as to protrude on the opposite side to the direction of the metal body 31. The metal body 31, the pair of stepped portions 32, 33, and the pair of electrode portions 34, 35 are all made of the same metal material, and all members are formed continuously and integrally. The heights of the left and right step portions 32 and the step portion 33 are the same.

  The jumper resistor of FIG. 6B is configured by a metal resistor 40. The metal resistor 40 is a rectangular parallelepiped plate member 41, electrodes 44 and 45, both ends of the metal member 41 and each electrode. Step portions 42 and 43 are provided so as to be inclined between 44 and 45. The electrodes 44 and 45 are formed so as to protrude on the opposite side to the direction of the metal body 41. The metal body 41, the pair of stepped portions 42, 43, and the pair of electrode portions 44, 45 are all made of the same metal material, and all members are formed continuously and integrally. The heights of the left and right step portions 42 and the step portion 43 are the same.

  The jumper resistor of FIG. 6C is configured by a metal resistor 50. The metal resistor 50 is a rectangular parallelepiped plate member 51, electrodes 54 and 55, both ends of the metal member 51, and each electrode. Step portions 52 and 53 provided between 54 and 55 are provided. The electrodes 54 and 55 are formed inward in the direction of the metal body 51. The metal body 51, the pair of stepped portions 52, 53, and the pair of electrode portions 54, 55 are all made of the same metal material, and all the members are formed continuously and integrally. The heights of the left and right step portions 52 and the step portion 53 are the same.

  The jumper resistor of FIG. 6D is configured by a metal resistor 60. The metal resistor 50 is a rectangular parallelepiped metal plate 61, electrodes 64 and 65, both ends of the metal body 61, and each electrode. 64 and 65 are provided with stepped portions 62 and 63 that are curved. The electrodes 64 and 65 are formed inward in the direction of the metal body 61. The metal body 61, the pair of stepped portions 62, 63, and the pair of electrode portions 64, 65 are all made of the same metal material, and all members are formed continuously and integrally. The heights of the left and right step portions 62 and the step portion 63 are the same.

  Each of the metal resistors 30, 40, 50, and 60 in FIGS. 6A to 6D can be formed by bending a single metal plate. The resistance values of the metal resistors 30, 40, 50, 60 are each configured to be 1 mΩ or less, more preferably 0.5 mΩ or less. Moreover, the metal material of each metal resistor 30, 40, 50, 60 is comprised with the alloy containing 90 wt% or more of Cu (copper). The Cu content is desirably 95 wt% to 99 wt%. Since Cu is a metal having a very low specific resistance, it is preferable as a material for bringing the resistance value close to zero. The metal bodies 31, 41, 51, 61 are not limited to a rectangular parallelepiped shape. By processing, it may be formed into a shape like the metal body of FIG.

  On the other hand, other types of metals are added without making the copper component 100% from the viewpoint of strength, and the strength can be maintained by using an alloy. Furthermore, it is preferable from the viewpoint of electrical conductivity and mechanical strength that the Cu content is 96 wt% to 99 wt%. That is, sufficient mechanical strength can be provided while the resistance value is 1 mΩ or less. Thereby, the stamping property in press work etc. can be raised. Also, the shape of the finished product is less likely to be deformed by a stress such as an external load.

  When adding other types of metals to make an alloy, add one or more types of metal elements such as Sn (tin), Cr (chromium), Zn (zinc), Si (silicon), etc. Is preferred.

  6A to 6D, a solder layer is provided on the surface on the mounting surface side of each electrode 34, 35, 44, 45, 54, 55, 64, 65. You may make it laminate.

  Next, the bridge-type jumper resistor shown in FIG. 6 can be configured as shown in FIGS.

  7A is a perspective view of the jumper resistor, and FIG. 7B is a cross-sectional view of FIG. 7A. A flat portion of the metal resistor 20 is molded with the resin 25. As shown in FIG. 7B, the metal resistor 20 includes a metal body 20a, a pair of stepped portions 20b, and a pair of electrode portions 20c. The metal body 20a, the pair of stepped portions 20b, and the pair of electrode portions 20c are all made of the same metal material, and all the members are formed continuously and integrally. Here, the metal resistor 20 corresponds to the metal resistor 50 of FIG. 6C, and corresponds to a structure in which this is molded with resin. The mold part is at least one part or all of the metal body 20a.

  8A is a perspective view of the jumper resistor, and FIG. 8B is a cross-sectional view of FIG. A flat portion of the metal resistor 21 is molded with the resin 25. As shown in FIG. 8B, the metal resistor 21 has a metal body 21a, a pair of step portions 21b, and a pair of electrode portions 21c. The metal body 21a, the pair of stepped portions 21b, and the pair of electrode portions 21c are all made of the same metal material, and all members are formed continuously and integrally. The metal resistor 21 corresponds to the metal resistor 40 of FIG. 6B and corresponds to a structure in which this is molded with resin. The mold part is at least one part or all of the metal body 21a.

  As shown in FIGS. 7 and 8, the entire jumper resistor is made strong by molding.

  Further, as described above, the jumper resistor has a flat surface made of a rectangular parallelepiped metal body, and therefore can cope with automatic surface mounting.

DESCRIPTION OF SYMBOLS 1 Metal resistor 1a Metal body 1b Electrode 2 Solder layer 3 Insulating layer 10 Metal resistor 11 Electrode 12 Metal body

Claims (12)

A flat metal body;
It is composed of a metal resistor provided with a plurality of electrodes arranged at intervals on the front surface or back surface of the metal body,
A jumper resistor having a resistance of the metal resistor of 1 mΩ or less.   The jumper resistor according to claim 1, wherein the metal body or the metal resistor is an alloy containing 90 wt% or more of copper.   The jumper resistor according to claim 2, wherein a range of copper contained in the metal body or the metal resistor is 95 wt% to 99 wt%.   The metal body or the metal resistor is added with one or more kinds of metal elements selected from Sn, Cr, Zn, and Si. The jumper resistor described.   The jumper resistor according to any one of claims 1 to 4, wherein the metal body and the plurality of electrodes are continuously and integrally formed.   6. The jumper resistor according to claim 5, wherein a solder layer is formed on the surfaces of the plurality of electrodes.   The jumper resistor according to claim 1, further comprising an insulating layer that covers a region between the plurality of electrodes, wherein the insulating layer has a thickness equal to or less than a thickness of each of the electrodes. .   The jumper resistor according to any one of claims 1 to 7, wherein the metal body and the plurality of electrodes are made of different metal materials.   The jumper resistor according to claim 8, wherein a specific resistance of the metal material constituting the plurality of electrodes is equal to or less than a specific resistance of the metal material constituting the metal body.   5. The metal resistor is further provided with a metal step portion that connects the metal body and the electrode. 6. Jumper resistor.   The jumper resistor according to claim 10, wherein the metal body, the electrode, and the stepped portion are continuously and integrally formed.   The jumper resistor according to claim 11, wherein at least a part of the metal body is molded with resin.

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