JP2013054618A - Method for manufacturing conductive sheet, conductive sheet manufactured using the same method, touch panel, display device, and program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing conductive sheets capable of reducing a sense of granular noise caused by a pattern, and significantly improving visibility of an object to be observed, a conductive sheet manufactured using the same method, a touch panel, a display device, and a program.SOLUTION: Image data Img representing a pattern of a mesh pattern 20 is created based on a plurality of positions (seed points SD) selected from a plane domain 100. An evaluation value EVP formed so as to quantify noise characteristics of the mesh pattern is computed based on the image data Img. From output image data ImgOut determined based on the evaluation value EVP and prescribed evaluation conditions, first image data representing a pattern in one main surface side of a transparent substrate 12 is cut out and second image data representing a pattern in the other main surface side of the transparent substrate 12 is cut out.

Description

  The present invention relates to a method for manufacturing a conductive sheet, a conductive sheet manufactured using this method, a touch panel and a display device, and a program.

  Recently, electronic devices incorporating touch panels are becoming widespread. Many touch panels are mounted on devices having a small-size screen such as a mobile phone or a PDA (Personal Digital Assistant). In the future, it is expected to be incorporated in devices having a large screen such as a PC (Personal Computer) display.

  In the conventional touch panel electrode, indium tin oxide (ITO) is mainly used from the viewpoint of translucency. It is known that the electrical resistance per unit area of ITO is relatively higher than that of metal or the like. That is, in the case of ITO, as the screen size (total area of the touch panel) increases, the surface resistance of the entire electrode increases. As a result, the current transmission speed between the electrodes becomes slow, and the problem that the time (ie, the response speed) from the touch to the touch panel until the contact position is detected becomes obvious.

  Therefore, various techniques for reducing the surface resistance by forming a large number of lattices with fine wires (metal fine wires) made of a metal having low electric resistance and constituting electrodes have been proposed (see Patent Documents 1 to 3).

  By the way, when the same mesh shape is regularly arranged, there is an inconvenience that moire (interference fringes) easily occurs in relation to each pixel constituting the display screen. Therefore, by arranging each mesh shape regularly or irregularly, various techniques for suppressing the noise granularity (also referred to as rough feeling) in combination with moire and improving the visibility of the observation object are various. Proposed.

  For example, Patent Document 4 discloses an image display device that affixes an electromagnetic wave shield film having a conductive portion and an opening and a moire suppression film having a moire suppression portion. Thereby, a local increase in the integral amount of transmitted light can be suppressed, and the integral amount can be made almost constant throughout the film. That is, the mesh pattern formed by the combination of the conductive portion and the opening portion disappears as if, and moire is less likely to occur.

  In Patent Document 5, two-dimensional power spectra are calculated for image data representing a pixel array pattern and an electromagnetic wave shield pattern, respectively, and the electromagnetic wave difference is exceeded so that the difference in spatial frequency corresponding to these peaks exceeds a predetermined value. An apparatus and method for determining the shape of a shield pattern is disclosed. Thereby, generation | occurrence | production of a moire can be suppressed and an increase in surface resistivity and deterioration of transparency can also be avoided.

International Publication No. 1995/27334 Pamphlet International Publication No. 1997/18508 Pamphlet JP 2003-099185 A JP 2009-94467 A ([0063], FIG. 1, FIG. 10A, FIG. 10B, etc.) JP 2009-117683 A ([0014], [0024], etc.)

  The present invention has been made in connection with the technical ideas disclosed in Patent Documents 4 and 5, and can reduce noise granularity caused by a pattern and greatly improve the visibility of an observation object. It is an object to provide a conductive sheet manufacturing method that can be improved, a conductive sheet manufactured by using this method, a touch panel, a display device, and a program.

  The conductive sheet manufacturing method according to the present invention includes a selection step of selecting a plurality of positions from a predetermined two-dimensional image region, and creating image data representing a pattern of a mesh pattern based on the selected plurality of positions. A creation step for calculating, based on the created image data, a calculation step for calculating an evaluation value quantified with respect to a noise characteristic of the mesh pattern, and one based on the calculated evaluation value and a predetermined evaluation condition. A determination step of determining the image data as output image data; and cutting out first image data representing a pattern on one main surface side of the substrate from the determined output image data; and the other main surface of the substrate An image cut-out step of cutting out second image data representing a pattern on the side, and one main surface of the base based on the cut-out first image data In addition, the mesh pattern is formed on the substrate in plan view by forming the wire on the other main surface side of the base based on the cut-out second image data. And an output step of obtaining a conductive sheet.

  Image data representing the pattern of a mesh pattern is created based on a plurality of positions selected from a predetermined two-dimensional image region, and an evaluation value quantified for noise characteristics of the mesh pattern is calculated based on the image data Since one image data is determined as output image data based on the evaluation value and a predetermined evaluation condition, the shape of the mesh pattern having noise characteristics that satisfy the predetermined evaluation condition can be determined. In other words, the noise feeling can be reduced by appropriately controlling the noise characteristics of the mesh pattern. Since the first image data representing the pattern on one main surface and the second image data representing the pattern on the other main surface are cut out from the same output image data, the wire material is output and formed in two layers. Even if it exists, the visibility of a mesh pattern can be maintained by planar view.

  Further, in the case where a pattern material forming a structural pattern having a pattern different from the pattern of the mesh pattern is visually recognized by being superimposed on the conductive sheet, the visual information of the pattern material related to the visibility of the structural pattern is input. 1 input step, and the 1st estimation step which estimates the image information of the said structure pattern based on the visual recognition information of the said pattern material input, The image information of the said structure pattern estimated in the said creation step is further provided Preferably, the image data representing the pattern in which the structural pattern is superimposed on the mesh pattern is created. As a result, the noise characteristics can be optimized in consideration of the actual usage mode including the structural pattern, that is, whether or not moire (fringing interference) is generated. In particular, moire generated by the mesh pattern and the structure pattern can be suppressed.

  Further, the visual information of the pattern material includes at least one of the type, color value, light transmittance or light reflectance of the pattern material, or the arrangement position, unit shape or unit size of the structural pattern. It is preferable. As a result, the noise characteristics can be optimized in consideration of the actual usage including the structural pattern. In particular, moire generated by the mesh pattern and the structure pattern can be suppressed.

  Furthermore, the pattern material is preferably a black matrix.

  In addition, a second input step of inputting the visual information of the wire and / or the substrate related to the visibility of the mesh pattern, and an image of the mesh pattern based on the input visual information of the wire and / or the substrate A second estimating step for estimating information, and the creating step preferably creates the image data based on the estimated image information of the mesh pattern.

  Furthermore, the evaluation value is preferably an evaluation value representing granularity.

  Further, the evaluation value is preferably RMS granularity.

  Furthermore, the evaluation value is preferably an RMS granularity corrected by a human visual response characteristic function.

  Furthermore, it is preferable that the human visual response characteristic function is a Dooley show function.

  Further, the corrected RMS granularity is an RMS granularity calculated using new image data obtained by applying a filtering process corresponding to the human visual response characteristic function to the image data. Preferably there is.

  Further, the method further includes an update step of updating a part of the plurality of positions to another position based on the evaluation value, and sequentially repeating the update step, the creation step, and the calculation step, The output image data is preferably determined.

  Further, it is preferable that in the updating step, a part of the plurality of positions is updated to another position by using a simulated annealing method.

  Furthermore, in the creation step, it is preferable to create image data representing a mesh pattern in which different mesh shapes are arranged without gaps.

  Furthermore, the mesh shape is preferably a polygonal shape.

  Furthermore, it is preferable that each mesh shape is determined from the plurality of positions according to a Voronoi diagram.

  Furthermore, regarding the histogram of the number of vertices in the mesh shape, the ratio of polygons having the highest number of vertices is preferably 40 to 70%.

  The conductive sheet according to the present invention is a conductive sheet manufactured using any one of the manufacturing methods described above, and is a base and a first conductive portion formed on one main surface of the base and made of a plurality of fine metal wires. And a second conductive part formed on the other main surface of the base and made of a plurality of fine metal wires, and combining the first conductive part and the second conductive part, the mesh in plan view A pattern is formed.

  Preferably, the first conductive part has a plurality of first conductive patterns arranged in one direction and each having a plurality of first sensing parts connected thereto.

  Furthermore, the mesh pattern preferably has a repeated shape.

  Furthermore, it is preferable that each of the first conductive patterns is formed to be inclined by a predetermined angle with respect to the arrangement direction of the repetitive shape.

  Furthermore, it is preferable that the size of the repetitive shape is larger than the size of each of the first sensing units.

  Further, the first dummy electrode portion is formed of a plurality of fine metal wires formed on the one main surface and electrically insulated from the first conductive portion, and the first dummy electrode portion is adjacent to the first dummy electrode portion. It is preferable that a plurality of first dummy patterns arranged in a gap between one conductive pattern are provided, and the wiring density of the first dummy pattern is equal to the wiring density of the first conductive pattern.

  Furthermore, a first protective layer that covers the first conductive portion provided on the one main surface and a second protective layer that covers the second conductive portion provided on the other main surface. It is preferable that the relative refractive index of the base with respect to the first protective layer and / or the relative refractive index of the base with respect to the second protective layer is 0.86 to 1.15.

  The touch panel according to the present invention includes any one of the conductive sheets described above and a detection control unit that detects a contact position or a proximity position from the main surface side of the conductive sheet.

  The display device according to the present invention includes any one of the conductive sheets described above, a detection control unit that detects a contact position or a proximity position from the main surface side of the conductive sheet, and an image on the display screen based on the display signal. The conductive sheet is arranged on the display screen with the opposite surface of the main surface facing the display portion.

  A program according to the present invention is a program for creating image data for forming an output of a wire on a substrate, wherein the computer selects a plurality of positions from a predetermined two-dimensional image area, An image data creation unit for creating image data representing a pattern of a mesh pattern based on the plurality of positions selected by the position selection unit, based on the image data created by the image data creation unit, Data for determining one image data as output image data based on the evaluation value calculated by the evaluation value calculation unit and a predetermined evaluation condition, and an evaluation value calculation unit that calculates an evaluation value quantified for noise characteristics A first unit representing a pattern on one main surface side of the base body from the output image data determined by the determination unit and the data determination unit. With cut out image data, characterized in that to function as the image cutout unit for cutting out the second image data representing the pattern of the other main surface side of the substrate.

  According to the method for manufacturing a conductive sheet according to the present invention, the conductive sheet manufactured using this method, the touch panel and the display device, and the program, based on a plurality of positions selected from a predetermined two-dimensional image region. Image data representing the pattern of the mesh pattern is created, an evaluation value quantified with respect to the noise characteristics of the mesh pattern is calculated based on the image data, and one piece of the image data based on the evaluation value and a predetermined evaluation condition Is determined as the output image data, the shape of the mesh pattern having noise characteristics satisfying the predetermined evaluation condition can be determined. In other words, the noise feeling can be reduced by appropriately controlling the noise characteristics of the mesh pattern. Since the first image data representing the pattern on one main surface and the second image data representing the pattern on the other main surface are cut out from the same output image data, the wire material is output and formed in two layers. Even if it exists, the visibility of a mesh pattern can be maintained by planar view.

It is a schematic plan view showing an example of the electrically conductive sheet which concerns on this Embodiment. FIG. 2 is a partially omitted cross-sectional view of the conductive sheet of FIG. 1. It is a schematic explanatory drawing showing the pixel arrangement | sequence of a display unit. It is a schematic sectional drawing of the display apparatus incorporating the electrically conductive sheet of FIG. FIG. 5A is a plan view illustrating a pattern example of the first stacked unit illustrated in FIG. 2. FIG. 5B is a plan view illustrating a pattern example of the second stacked unit illustrated in FIG. 2. It is the elements on larger scale of the 1st sensor part of Drawing 5A. It is the elements on larger scale of the 2nd sensor part of Drawing 5B. It is a schematic plan view of the electroconductive sheet in the state which combined the 1st electroconductive part and the 2nd electroconductive part. It is a schematic block diagram of a manufacturing apparatus for manufacturing a conductive sheet. FIG. 10 is a functional block diagram of a mesh pattern evaluation unit and a data update instruction unit of FIG. 9. It is a figure which shows the 1st setting screen for setting image data creation conditions. It is a figure which shows the 2nd setting screen for setting image data creation conditions. It is a flowchart about operation | movement of the manufacturing apparatus of FIG. FIG. 14A is a schematic explanatory diagram visualizing image data representing a mesh pattern. FIG. 14B is a distribution diagram of a two-dimensional power spectrum obtained by performing FFT on the image data of FIG. 14A. 14C is a cross-sectional view taken along line XIVC-XIVC of the two-dimensional power spectrum distribution shown in FIG. 14B. It is a graph of a Dooley-Shaw function (observation distance 300mm). It is a flowchart explaining the production method of the image data for output. It is a graph showing an example of the relationship between the arrangement | positioning density of a seed point, and the whole transmittance | permeability. FIG. 18A is a schematic explanatory diagram illustrating a result of selecting eight points from one plane area. FIG. 18B is a schematic explanatory diagram illustrating a result of determining the wiring shape according to the Voronoi diagram. FIG. 18C is a schematic explanatory diagram illustrating a result of determining the wiring shape according to the Delaunay triangulation method. FIG. 19A is an explanatory diagram illustrating the definition of a pixel address in image data. FIG. 19B is an explanatory diagram illustrating the definition of pixel values in image data. FIG. 20A is a schematic diagram of an initial position of a seed point. FIG. 20B is a Voronoi diagram based on the seed point of FIG. 20A. It is a schematic explanatory drawing which shows the determination method of the pattern (wiring shape) in the edge part of a unit area | region. It is a schematic explanatory drawing which shows the result of having arrange | positioned unit image data regularly and producing image data. It is a detailed flowchart of step S27 shown in FIG. FIG. 24A is an explanatory diagram illustrating a positional relationship between the first seed point, the second seed point, and the candidate point in the image region. FIG. 24B is an explanatory diagram of a result of updating the position of the seed point by exchanging the second seed point and the candidate point. It is a histogram of the number of vertices in a suitable mesh shape. FIG. 26A is a schematic explanatory diagram visualized by superimposing a black matrix on output image data. 26B to 26D are graphs obtained by extracting the R component, the G component, and the B component of the color value from the image data of FIG. 26A and calculating the two-dimensional power spectrum. FIG. 27A is a schematic explanatory diagram in which a human visual response characteristic is applied to the output image data of FIG. 26A and visualized. FIGS. 27B to 27D are graphs in which the two-dimensional power spectrum is calculated by extracting the R component, G component, and B component of the color value from the image data of FIG. 27A. FIG. 28A is a schematic explanatory diagram illustrating a result of cutting out each first conductive pattern and each first dummy pattern. FIG. 28B is a schematic explanatory diagram illustrating a result of cutting out each second conductive pattern. FIG. 29A is a schematic explanatory diagram illustrating a path of parallel light irradiated toward a metal thin wire. FIG. 29B is a schematic explanatory diagram showing a path of obliquely incident light irradiated toward a thin metal wire. FIG. 29C is a graph showing the intensity distribution of transmitted light in FIG. 29B. FIG. 30A is a schematic explanatory diagram showing a path of obliquely incident light irradiated toward a fine metal wire in the configuration according to the present invention. FIG. 30B is a graph showing the intensity distribution of transmitted light in FIG. 30A. FIG. 31A is a schematic plan view of a first sensor unit according to a reference example. FIG. 31B is a schematic explanatory diagram illustrating a path of external light incident on the first sensor unit in FIG. 31A. FIG. 31C is a graph showing the intensity distribution of reflected light in the first sensor unit of FIG. 31A. FIG. 32A is a schematic explanatory diagram of the first sensor unit according to the present embodiment. 32B is a schematic explanatory diagram illustrating a path of external light incident on the first sensor unit in FIG. 32A. FIG. 32C is a graph showing the intensity distribution of the reflected light in the first sensor unit of FIG. 32A. It is a flowchart which shows the manufacturing method of the electrically conductive sheet which concerns on this Embodiment. FIG. 34A is a cross-sectional view showing a part of the produced photosensitive material with some parts omitted. FIG. 34B is a schematic explanatory diagram showing double-sided simultaneous exposure on a photosensitive material. It is a schematic explanatory drawing which shows the execution state of a 1st exposure process and a 2nd exposure process. It is a schematic sectional drawing of the touchscreen which concerns on a 1st modification. FIG. 37A is a partially enlarged plan view of the first sensor unit shown in FIG. 36. FIG. 37B is a partially enlarged plan view of the second sensor unit shown in FIG. 36. FIG. 37 is a partially omitted front view of the touch panel shown in FIG. 36. FIG. 39A is a partially enlarged plan view of a first sensor unit according to a second modification. FIG. 39B is a partially enlarged plan view of the second sensor unit according to the second modification. It is a partially-omission sectional view of a conductive sheet according to a third modification. It is a partially-omission sectional view of a conductive sheet according to a fourth modification. It is a schematic plan view of the electroconductive sheet which concerns on a 5th modification. It is explanatory drawing showing the result of the sensory evaluation which concerns on a present Example.

  Hereinafter, the conductive sheet according to the present invention will be described in detail with reference to the accompanying drawings by giving preferred embodiments in relation to a touch panel and a display device incorporating the conductive sheet. Moreover, the manufacturing method of the electrically conductive sheet which concerns on this invention is demonstrated in detail in relation to the manufacturing apparatus which implements this. In the present specification, “˜” indicating a numerical range is used as a meaning including numerical values described before and after the numerical value as a lower limit value and an upper limit value.

[This embodiment]
As shown in FIGS. 1 and 2, the conductive sheet 10 according to the present embodiment has a transparent substrate 12 (substrate). The transparent base 12 having an insulating property and high translucency is made of a material such as resin, glass, or silicon. Examples of the resin include PET (Polyethylene Terephthalate), PMMA (Polymethyl methacrylate), PP (polypropylene), PS (polystyrene) and the like.

  A first conductive portion 14a and a first dummy electrode portion 15a are formed on one main surface of the transparent substrate 12 (the arrow s1 direction side in FIG. 2). The first conductive portion 14a and the first dummy electrode portion 15a are metal thin wires {hereinafter referred to as metal thin wires 16]. Moreover, it may describe as the metal fine wire 16p, 16q, 16r, 16s). } And a mesh pattern 20 with openings 18. The fine metal wire 16 is made of, for example, a gold (Au), silver (Ag), or copper (Cu) wire.

  The line width of the fine metal wire 16 can be selected from 30 μm or less. When the conductive sheet 10 is applied to a touch panel, the line width of the fine metal wire 16 is preferably 0.1 μm or more and 15 μm or less, more preferably 1 μm or more and 9 μm or less, and further preferably 2 μm or more and 7 μm or less.

  Specifically, the first conductive portion 14a and the first dummy electrode portion 15a have a mesh pattern 20 in which different mesh shapes 22 are arranged without gaps. In other words, the mesh pattern 20 is a random pattern in which each mesh shape 22 has no regularity (unification). For example, in the mesh pattern 20, the hatched mesh shape 22 is a quadrilateral shape, a metal thin line 16p that connects the vertex C1 and the vertex C2 with a straight line, a metal thin line 16q that connects the vertex C2 and the vertex C3 with a straight line, and the vertex The thin metal wire 16r connects C3 and the vertex C4 with a straight line, and the fine metal wire 16s connects the vertex C4 and the vertex C1 with a straight line. As understood from this figure, each mesh shape 22 is a polygonal shape having at least three sides.

  Hereinafter, the “polygon” in the present specification includes not only a geometrically perfect polygon but also a “substantial polygon” in which a slight change is made to the perfect polygon. And Examples of minor changes include the addition of minute point elements / line elements as compared to the mesh shape 22, partial defects of each side (metal thin line 16) constituting the mesh shape 22, and the like.

  Here, the first dummy electrode portion 15a is arranged to be separated from the first conductive portion 14a by a predetermined interval. That is, the first dummy electrode portion 15a is in a state of being electrically insulated from the first conductive portion 14a.

  A first protective layer 26a is bonded to substantially the entire surface of the first conductive portion 14a and the first dummy electrode portion 15a through the first adhesive layer 24a so as to cover the fine metal wires 16. Examples of the material of the first adhesive layer 24a include a wet laminate adhesive, a dry laminate adhesive, and a hot melt adhesive.

  Similar to the transparent substrate 12, the first protective layer 26a is made of a highly translucent material containing resin, glass, and silicon. The refractive index n1 of the first protective layer 26a is equal to or close to the refractive index n0 of the transparent substrate 12. In this case, the relative refractive index nr1 of the transparent substrate 12 with respect to the first protective layer 26a is a value close to 1.

  Here, the refractive index in this specification means a refractive index in light having a wavelength of 589.3 nm (sodium D-line). For example, in the case of resin, ISO 14782: 1999 (corresponding to JIS K 7105) is an international standard. Defined by The relative refractive index nr1 of the transparent substrate 12 with respect to the first protective layer 26a is defined by nr1 = (n1 / n0). Here, the relative refractive index nr1 may be in the range of 0.86 to 1.15, more preferably 0.91 to 1.08.

  Hereinafter, each part (the first conductive part 14a, the first dummy electrode part 15a, the first adhesive layer 24a, and the first protective layer 26a) formed on one main surface (the arrow s1 direction side in FIG. 2) of the transparent substrate 12 will be described. May be collectively referred to as a first stacked portion 28a.

  By the way, a second conductive portion 14b is formed on the other main surface of the transparent substrate 12 (arrow s2 direction side in FIG. 2). Similar to the first conductive portion 14a, the second conductive portion 14b has a mesh pattern 20 formed by the fine metal wires 16 and the openings 18. The transparent substrate 12 is made of an insulating material, and the second conductive portion 14b is in a state of being electrically insulated from the first conductive portion 14a and the first dummy electrode portion 15a.

  The second protective layer 26b is bonded to the substantially entire surface of the second conductive portion 14b via the second adhesive layer 24b so as to cover the fine metal wires 16. The material of the second adhesive layer 24b may be the same as or different from the first adhesive layer 24a. The material of the second protective layer 26b may be the same as or different from that of the first protective layer 26a.

  The refractive index n2 of the second protective layer 26b is equal to or close to the refractive index n0 of the transparent substrate 12. In this case, the relative refractive index nr2 of the transparent substrate 12 with respect to the second protective layer 26b is a value close to 1. Here, the definitions of the refractive index and the relative refractive index are as described above. The relative refractive index nr2 of the transparent substrate 12 with respect to the second protective layer 26b is defined by nr2 = (n2 / n0). Here, the relative refractive index nr2 may be in the range of 0.86 to 1.15, more preferably 0.91 to 1.08.

  Hereinafter, the respective parts (including the second conductive part 14b, the second adhesive layer 24b, and the second protective layer 26b) formed on the other main surface (in the direction of the arrow s2 in FIG. 2) of the transparent substrate 12 are collectively referred to. It may be called the 2nd lamination part 28b.

  For example, the conductive sheet 10 is applied to a touch panel of the display unit 30 (display unit). The display unit 30 may be configured by a liquid crystal panel, a plasma panel, an organic EL (Electro-Luminescence) panel, an inorganic EL panel, or the like.

  As shown in FIG. 3 with some parts omitted, the display unit 30 is configured by a plurality of pixels 32 arranged in a matrix. One pixel 32 includes three subpixels (a red subpixel 32r, a green subpixel 32g, and a blue subpixel 32b) arranged in the horizontal direction. One sub-pixel has a rectangular shape that is vertically long in the vertical direction. The horizontal arrangement pitch of pixels 32 (horizontal pixel pitch Ph) and the vertical arrangement pitch of pixels 32 (vertical pixel pitch Pv) are substantially the same. That is, the shape (see the shaded area 36) formed by one pixel 32 and the black matrix 34 (pattern material) surrounding the one pixel 32 is a square. Also, the aspect ratio of one pixel 32 is not 1, but the length in the horizontal direction (horizontal)> the length in the vertical direction (vertical). When the conductive sheet 10 is arranged on the display panel of the display unit 30 having the above-described pixel arrangement, there is almost no interference of spatial frequency between the arrangement period of the pixels 32 and the thin metal wires 16 formed at random, and moire. The occurrence of is suppressed.

  Next, a display device 40 incorporating the conductive sheet 10 according to the present embodiment will be described with reference to FIGS. Here, a projected capacitive touch panel will be described as an example.

  As shown in FIG. 4, the display device 40 includes a display unit 30 (see FIG. 3) that can display a color image and / or a monochrome image, and a touch panel that detects a contact position from the input surface 42 (arrow Z1 direction side). 44 and a housing 46 that accommodates the display unit 30 and the touch panel 44. The user can access the touch panel 44 through a large opening provided on one surface of the housing 46 (arrow Z1 direction side).

  In addition to the above-described conductive sheet 10 (see FIGS. 1 and 2), the touch panel 44 is electrically connected to the conductive sheet 10 via a cable 50 and a cover member 48 stacked on one surface (arrow Z1 direction side) of the conductive sheet 10. Connected flexible substrate 52 and detection control unit 54 disposed on flexible substrate 52.

  The conductive sheet 10 is bonded to one surface of the display unit 30 (arrow Z1 direction side) via an adhesive layer 56. The conductive sheet 10 is disposed on the display screen with the other main surface side (second conductive portion 14b side) facing the display unit 30.

  The cover member 48 functions as the input surface 42 by covering one surface of the conductive sheet 10. Further, by preventing direct contact with the contact body 58 (for example, a finger or a stylus pen), it is possible to suppress the generation of scratches and the adhesion of dust, and the conductivity of the conductive sheet 10 can be stabilized. it can.

  The material of the cover member 48 may be glass or a resin film, for example. You may make it closely_contact | adhere to the one surface (arrow Z1 direction side) of the electrically conductive sheet 10 in the state which coat | covered the one surface (arrow Z2 direction side) of the cover member 48 with a silicon oxide etc. In order to prevent damage due to rubbing or the like, the conductive sheet 10 and the cover member 48 may be bonded together.

  The flexible substrate 52 is an electronic substrate having flexibility. In this example, it is fixed to the inner wall of the side surface of the housing 46, but the arrangement position may be variously changed. The detection control unit 54 captures a change in capacitance between the contact body 58 and the conductive sheet 10 when the contact body 58 that is a conductor contacts (or approaches) the input surface 42, and detects the contact position ( Or an electronic circuit for detecting a proximity position).

  As shown in FIG. 5A, the first sensor portion disposed on the display area of the display unit 30 (see FIGS. 3 and 4) on one main surface of the conductive sheet 10 in a plan view in the direction of the arrow Z <b> 2. 60a and a first terminal wiring portion 62a (a so-called frame) disposed in the outer peripheral area of the display area are provided.

  The outer shape of the conductive sheet 10 has a rectangular shape in plan view, and the outer shape of the first sensor unit 60a also has a rectangular shape. In the first terminal wiring portion 62a, a plurality of first terminals 64a are arranged in the arrow Y direction at the peripheral portion on one side parallel to the arrow Y direction of the conductive sheet 10 at the central portion in the length direction. Yes. A plurality of first connection portions 66a are arranged in a substantially single line along one side of the first sensor unit 60a (a side parallel to the arrow Y direction in this example). The first terminal wiring pattern 68a derived from each first connection portion 66a is routed toward the first terminal 64a in the outer peripheral area of the display area, and is electrically connected to the corresponding first terminal 64a. Has been.

  The part corresponding to the first sensor unit 60a has two or more first conductive patterns 70a (mesh patterns) formed by a plurality of fine metal wires 16 (see FIG. 1). The first conductive patterns 70a extend in the arrow X direction (first direction) and are arranged in the arrow Y direction (second direction) orthogonal to the arrow X direction. Each of the first conductive patterns 70a is configured by connecting two or more first sensing units 72a in series in the arrow X direction. Each of the first sensing parts 72a whose outline is approximately rhombus has the same outline shape. A first connection portion 74a that electrically connects the first sensing portions 72a is formed between the adjacent first sensing portions 72a. More specifically, the apex angle portion of one first sensing unit 72a is connected to the other first sensing unit 72a adjacent in the arrow X direction of the one first sensing unit 72a via the first connection unit 74a. Connected to the apex.

  On one end side of each first conductive pattern 70a, the first connection part 74a is not formed at the open end of the first sensing part 72a. On the other end side of each first conductive pattern 70a, a first connection part 66a is provided at the end of the first sensing part 72a. Each first conductive pattern 70a is electrically connected to the first terminal wiring pattern 68a via each first connection portion 66a.

  The part corresponding to the first sensor unit 60a has two or more first dummy patterns 76a (mesh patterns) formed by a plurality of fine metal wires 16 (see FIG. 1). Each first dummy pattern 76a is arranged in a first gap 75a (see FIG. 6) between adjacent first conductive patterns 70a. The first dummy pattern 76a, whose outline is roughly rhombus-shaped, is arranged apart from each first conductive pattern 70a (the first sensing part 72a and the first connection part 74a) by a predetermined distance. This interval (width) is extremely small compared to the length of one side of the first sensing unit 72a. Therefore, the thin metal wires 16 are wired on the first sensor portion 60a over the entire surface with a substantially uniform density.

  For convenience of explanation, in FIG. 6, each mesh shape is shown in detail in only one first dummy pattern 76 a (the center right portion of the drawing). In the other first dummy patterns 76a, the outlines are indicated by broken lines, and the internal shapes thereof are omitted.

  As shown in FIG. 6, each first sensing unit 72a and each first dummy pattern 76a are configured by combining two or more first mesh elements 78a. The shape of the first mesh element 78a is a polygonal shape having at least three sides, similar to the mesh shape 22 (see FIG. 1) described above. The first connection part 74a that connects the adjacent first sensing parts 72a is composed of at least one first mesh element 78a.

  The first mesh elements 78a constituting the peripheral portions of the first sensing portions 72a and the first dummy patterns 76a may be closed spaces or open spaces in terms of topology (topology). Good. The same applies to the first connection portion 74a.

  In addition, between the first conductive patterns 70a adjacent to each other, a first insulating portion 80a that is electrically insulated is disposed.

  Here, the wiring density of the first dummy pattern 76a is equal to the wiring density of the first conductive pattern 70a (the first sensing unit 72a and the first connection unit 74a). In this case, the light reflectance in the planar region of the first dummy pattern 76a matches the light reflectance in the planar region of the first conductive pattern 70a. This is because when the line width of the fine metal wire 16 is constant, there is a high correlation between the wiring density and the light reflectance.

In this specification, “the wiring density is equal” is a concept that includes not only the case where the wiring density is completely equal but also the case where the wiring density is substantially equal (density ratio is approximately in the range of 0.8 to 1.2). is there. That is, it is sufficient that the difference in light reflectance is such that it cannot be detected by human (observer) vision. Moreover, the measurement area of the wiring density of the fine metal wires 16 may be 1 mm ² or more in consideration of measurement accuracy and the like.

  Further, the separation distance between each first conductive pattern 70a and each first dummy pattern 76a may be constant (including a case where it is substantially constant) regardless of the position. This is preferable because the wiring density of the fine metal wires 16 approaches uniformly.

  Furthermore, the coverage (arrangement ratio) of the first dummy pattern 76a with respect to the first gap portion 75a is preferably in the range of approximately 30 to 95%, and more preferably in the range of 70 to 95%.

  Further, the outline of each first dummy pattern 76a may take various shapes including a triangle, a rectangle, a circle, and the like. For example, the contour of each first dummy pattern 76a may have the same or similar shape as the contour shape of each first sensing unit 72a (in the example of FIG. 5A, a roughly diamond shape).

  On the other hand, as shown in FIG. 5B, the second main surface of the conductive sheet 10 is disposed in the display area of the display unit 30 (see FIGS. 3 and 4) in a plan view toward the arrow Z1 direction. A sensor part 60b and a second terminal wiring part 62b (so-called frame) arranged in the outer peripheral area of the display area are provided.

  The outer shape of the conductive sheet 10 has a rectangular shape in plan view, and the outer shape of the second sensor unit 60b also has a rectangular shape. In the second terminal wiring portion 62b, a plurality of second terminals 64b are arranged in the arrow Y direction at the peripheral portion on one side parallel to the arrow Y direction of the conductive sheet 10 at the central portion in the length direction. Yes. A plurality of second connection portions 66b (for example, odd-numbered second connection portions 66b) are arranged in a substantially single row along one side (the side parallel to the arrow X direction in this example) of the second sensor unit 60b. Yes. A plurality of second connection portions 66b (for example, even-numbered second connection portions 66b) are arranged in approximately one row along the other side of the second sensor unit 60b (side opposite to the one side). The second terminal wiring pattern 68b derived from each second connection portion 66b is routed toward the second terminal 64b in the outer peripheral area of the display area, and is electrically connected to the corresponding second terminal 64b. Has been.

  A portion corresponding to the second sensor unit 60b has two or more second conductive patterns 70b (mesh patterns) formed of a plurality of fine metal wires 16 (see FIG. 1). The second conductive patterns 70b extend in the arrow Y direction (second direction) and are arranged in the arrow X direction (first direction) orthogonal to the arrow Y direction. Each of the second conductive patterns 70b is configured by connecting two or more second sensing units 72b in series in the arrow Y direction. The second sensing parts 72b whose outlines are approximately diamond-shaped have the same outline shape. A second connection portion 74b that electrically connects the second sensing portions 72b is formed between the adjacent second sensing portions 72b. More specifically, the apex angle portion of one second sensing unit 72b is connected to the other second sensing unit 72b adjacent in the arrow Y direction of the one second sensing unit 72b via the second connection unit 74b. Connected to the apex.

  On one end side of each second conductive pattern 70b, the second connection part 74b is not formed at the open end of the second sensing part 72b. On the other end side of each second conductive pattern 70b, a second connection portion 66b is provided at the end of the second sensing portion 72b. Each second conductive pattern 70b is electrically connected to the second terminal wiring pattern 68b via each second connection portion 66b.

  In addition, regarding the 2nd sensor part 60b, unlike the 1st sensor part 60a (refer FIG. 5A and FIG. 6), the dummy pattern is not distribute | arranged to the 2nd clearance gap part 75b of 2nd adjacent conductive patterns 70b.

  As shown in FIG. 7, each second sensing unit 72b is configured by combining two or more second mesh elements 78b. The shape of the second mesh element 78b is a polygonal shape having at least three sides, like the mesh shape 22 (see FIG. 1) described above. The second connection part 74b that connects the adjacent second sensing parts 72b is composed of at least one second mesh element 78b.

  Note that the second mesh element 78b constituting the peripheral edge of each second sensing unit 72b may be a closed space or an open space in terms of topology (topology). The same applies to the second connection portion 74b.

  In addition, between the adjacent second conductive patterns 70b, electrically insulated second insulating portions 80b are respectively disposed.

  As shown in FIG. 8, in the plan view of the conductive sheet 10, a gap (a part of the first gap portion 75a) between the first conductive pattern 70a and the first dummy pattern 76a formed on one surface (arrow Z2 direction side) is formed. The second conductive pattern 70b formed on the other surface (arrow Z2 direction side) is arranged so as to be buried. Moreover, in the plane area | region where the outline of the 1st conductive pattern 70a and the outline of the 2nd conductive pattern 70b overlap, the position of both the metal fine wires 16 completely corresponds. Furthermore, in the plane area where the outline of the 1st dummy pattern 76a and the outline of the 2nd conductive pattern 70b overlap, the position of both the metal fine wires 16 completely corresponds. As a result, in the plan view of the conductive sheet 10, a large number of polygons 82 (mesh shape) are spread.

  The length of one side of the first sensing unit 72a (and the second sensing unit 72b) is preferably 3 to 10 mm, and more preferably 4 to 6 mm. If the length of one side is less than the above lower limit value, when the conductive sheet 10 is applied to a touch panel, the capacitance of the first sensing unit 72a (and the second sensing unit 72b) at the time of detection is reduced, so that the detection failure Is likely to become. On the other hand, when the upper limit is exceeded, the detection accuracy of the contact position may be lowered. From the same viewpoint, the average length of one side of the polygon 82 (the first mesh element 78a and the second mesh element 78b) is preferably 100 to 400 μm, more preferably 150 to 300 μm, as described above. Preferably, it is 210-250 micrometers or less most preferably. When one side of the polygon 82 is within the above range, it is possible to keep transparency even better, and when attached to the front surface of the display unit 30, the display can be visually recognized without a sense of incongruity.

  Returning to FIG. 6, the width w1 of the first connection portion 74a is preferably 0.2 to 1.0 mm, and more preferably 0.4 to 0.8 mm. When w1 is less than the lower limit value described above, the number of wires connecting each first sensing unit 72a decreases, and thus the interelectrode resistance increases. On the other hand, when w1 exceeds the above upper limit value, the amount of noise increases because the overlapping area with the second sensing unit 72b increases. The width of the second connection portion 74b (see FIG. 7) is the same as the width w1.

  The separation width w2 between the first sensing unit 72a and the second sensing unit 72b is preferably 0.1 to 0.6 mm, and more preferably 0.2 to 0.5 mm. When w2 is less than the above lower limit value, the amount of signal decreases because the amount of change in capacitance associated with the contact (or proximity) of the contact body 58 decreases. On the other hand, when w2 exceeds the above-described upper limit value, the density of the first sensing unit 72a is lowered, so that the resolution of the sensor is lowered.

  FIG. 9 is a schematic block diagram of a manufacturing apparatus 310 for manufacturing the conductive sheet 10 according to the present embodiment.

  The manufacturing apparatus 310 generates image data Img (including output image data ImgOut) representing a pattern (wiring shape) corresponding to the mesh pattern 20, and an output for generation created by the image generation apparatus 312. In order to embody the pattern represented by the image data ImgOut, a first light source 148a that exposes one main surface 144a of the conductive sheet (photosensitive material 140; see FIG. 34A) under the manufacturing process to be exposed, and an output image Based on the data ImgOut, a second light source 148b that irradiates and exposes the other main surface of the photosensitive material 140 with the second light 144b, and various conditions for creating the image data Img (visualization of the mesh pattern 20 and a structure pattern to be described later) Including the information) to the image generation device 312 and a GUI for assisting the input operation by the input unit 320 Basically comprises an image or a display unit 322 for displaying the stored output image data ImgOut like.

  The image generation device 312 generates image data Img, output image data ImgOut, position data SPd of candidate points SP, and position data SDd of seed points SD, and generates random numbers by generating pseudo-random numbers. A random number generation unit 326 that performs the initial position selection unit 328 that selects an initial position of the seed point SD from a predetermined two-dimensional image region using the random number value generated by the random number generation unit 326, and the random value And the update candidate position determination unit 330 for determining the position of the candidate point SP (excluding the position of the seed point SD) from the two-dimensional image region, and the first image data and the second from the output image data ImgOut. An image cutout unit 332 that cuts out image data (described later) and a display control unit 334 that performs control to display various images on the display unit 322 are provided.

  The seed point SD includes a first seed point SDN that is not an update target and a second seed point SDS that is an update target. In other words, the position data SDd of the seed point SD is composed of the position data SDNd of the first seed point SDN and the position data SDSd of the second seed point SDS.

  Note that a control unit (not shown) constituted by a CPU or the like can realize all control related to this image processing by reading and executing a program recorded in a recording medium (ROM or storage unit 324 (not shown)). .

  The image generation apparatus 312 includes an image information estimation unit 336 that estimates image information according to the mesh pattern 20 and the structure pattern based on visual information (details will be described later) input from the input unit 320, and an image information estimation unit. An image data creation unit 338 for creating image data Img representing a pattern corresponding to the mesh pattern 20 or the structure pattern based on the image information supplied from 336 and the position of the seed point SD supplied from the storage unit 324; Based on the image data Img created by the data creation unit 338, a mesh pattern evaluation unit 340 that calculates an evaluation value EVP for evaluating the pattern of the mesh shape 22, and an evaluation value EVP calculated by the mesh pattern evaluation unit 340 Data update instruction for instructing update / non-update of data such as seed point SD and evaluation value EVP based on Further comprising a 342, a.

  FIG. 10 is a detailed functional block diagram of the mesh pattern evaluation unit 340 and the data update instruction unit 342 shown in FIG.

  The mesh pattern evaluation unit 340 performs two-dimensional spectrum data (hereinafter simply referred to as “spectrum Spc”) by performing Fourier transform, for example, FFT (Fast Fourier Transformation) on the image data Img supplied from the image data creation unit 338. An FFT calculation unit 400 to be acquired and an evaluation value calculation unit 402 for calculating an evaluation value EVP based on the spectrum Spc supplied from the FFT calculation unit 400 are provided.

  The data update instruction unit 342 includes a counter 408 that counts the number of evaluations by the mesh pattern evaluation unit 340, a pseudo temperature management unit 410 that manages a value of a pseudo temperature T used in a pseudo annealing method, which will be described later, and a mesh pattern evaluation unit 340. An update probability calculation unit 412 that calculates an update probability of the seed point SD based on the supplied evaluation value EVP and the pseudo temperature T supplied from the pseudo temperature management unit 410, and the update probability supplied from the update probability calculation unit 412 In accordance with the notification from the position update determination unit 414 that determines whether the position data SDd of the seed point SD is updated or not, and the pseudo temperature management unit 410, one image data Img is determined as output image data ImgOut. And an output image data determination unit 416.

  FIG. 11 is a diagram showing a first setting screen for setting image data creation conditions.

  The setting screen 420 includes a left pull-down menu 422, a left display column 424, a right pull-down menu 426, a right display column 428, and seven text boxes 430, 432, 434, 436 in order from the top. , 438, 440, 442 and buttons 444, 446 displayed as [Cancel] and [Next].

  On the left part of the pull-down menus 422 and 426, a character string “kind” is displayed. By a predetermined operation of the input unit 320 (for example, a mouse), a selection column (not shown) is also displayed below the pull-down menus 422 and 426, and items in the selection column can be selected freely.

The display column 424 includes five columns 448a, 448b, 448c, 448d, and 448e. On the left side of these, “light transmittance”, “light reflectance”, “color value L ^* ”, Character strings “color value a ^* ” and “color value b ^* ” are respectively displayed.

Similar to the display column 424, the display column 428 includes five columns 450a, 450b, 450c, 450d, and 450e. On the left side of these, the “light transmittance”, “light reflectance”, Character strings “color value L ^* ”, “color value a ^* ”, and “color value b ^* ” are displayed.

  “Total transmittance” is displayed on the left side of the text box 430, and “%” is displayed on the right side thereof. “Film thickness” is displayed on the left side of the text box 432, and “μm” is displayed on the right side thereof. “Wiring width” is displayed on the left side of the text box 434, and “μm” is displayed on the right side thereof. “Wiring thickness” is displayed on the left side of the text box 436, and “μm” is displayed on the right side thereof. “Pattern size H” is displayed on the left side of the text box 438 and “mm” is displayed on the right side thereof. “Pattern size V” is displayed on the left side of the text box 440 and “mm” is displayed on the right side thereof. “Image resolution” is displayed on the left side of the text box 442, and “dpi” is displayed on the right side thereof.

  In any of the seven text boxes 430, 432, 434, 436, 438, 440, 442, arithmetic numbers can be input by a predetermined operation of the input unit 320 (for example, a keyboard).

  FIG. 12 is a diagram showing a second setting screen for setting image data creation conditions.

  The setting screen 460 includes two radio buttons 462a and 462b, six text boxes 464, 466, 468, 470, 472, and 474, a matrix-like image 476, and [Return] and [ Buttons 478, 480, and 482 displayed as [SET] and [CANCEL].

  Character strings “Yes” and “No” are displayed on the right side of the radio buttons 462a and 462b, respectively. A character string “matrix presence / absence” is displayed on the left side of the radio button 462a.

  In the left part of each of the text boxes 464, 466, 468, 470, 472, 474, “average number of samples at the overlapping position”, “density”, “dimension”, “a”, “b”, “c” and “ Each character string “d” is displayed. In the right part of the text boxes 464, 466, 468, 470, 472, 474, character strings “times”, “D”, “μm”, “μm”, “μm” and “μm” are respectively displayed. It is displayed. Here, any of the text boxes 464, 466, 468, 470, 472, and 474 can be used to input arithmetic numbers by a predetermined operation of the input unit 320 (for example, a keyboard).

  The matrix-like image 476 is an image simulating the shape of the black matrix 34 (see FIG. 3), and is provided with four openings 484 and a window frame 486.

  Basically, the operation of the manufacturing apparatus 310 configured as described above, particularly the operation of the image generation apparatus 312 will be described with reference to the flowchart of FIG.

  First, various conditions necessary for creating image data Img (including output image data ImgOut) representing a pattern corresponding to the mesh pattern 20 are input (step S1).

  The worker inputs an appropriate numerical value or the like via the setting screen 420 (see FIG. 11) displayed on the display unit 322. Thereby, the visual information regarding the visibility of the mesh pattern 20 can be input. Here, the visual information of the mesh pattern 20 is various information that contributes to the shape and optical density of the mesh pattern 20, and the visual information of the wire material (metal thin wire 16) and the visual information of the film material (transparent substrate 12) are included. included. The visual information of the wire includes, for example, at least one of the type, color value, light transmittance, or light reflectance of the wire, or the cross-sectional shape or thickness of the thin metal wire 16. The visual information of the film material includes, for example, at least one of the film material type, color value, light transmittance, light reflectance, and film thickness of the transparent substrate 12.

The operator selects one type of wire (metal thin wire 16) using the pull-down menu 422 for the conductive sheet 10 to be manufactured. In the example of FIG. 11, “silver (Ag)” is selected. When one type of wire is selected, the display field 424 is immediately updated, and a known numerical value corresponding to the physical property of the wire is newly displayed. In the columns 448a to 448e, the light transmittance (unit:%), light reflectance (unit:%) of silver having a thickness of 100 μm, color value L ^* , color value a ^* , color value b ^* (CIELAB) Is displayed.

Further, the operator selects one type of film material (transparent substrate 12) using the pull-down menu 426 for the conductive sheet 10 to be manufactured. In the example of FIG. 11, “PET film” is selected. When one type of film material is selected, the display field 428 is immediately updated, and a known numerical value corresponding to the physical property of the film material is newly displayed. In columns 450 to 450e, the light transmittance (unit:%), light reflectance (unit:%), color value L ^* , color value a ^* , color value b ^* (CIELAB) of a PET film having a thickness of 1 mm are included. ) Is displayed.

  It should be noted that each physical property value may be directly input from the display columns 424 and 428 by selecting the “manual input” item (not shown) of the pull-down menus 422 and 426.

  Further, the operator inputs various conditions of the mesh pattern 20 using the text box 430 or the like regarding the conductive sheet 10 to be manufactured.

  The input values of the text boxes 430, 432, 434, and 436 are the total light transmittance (unit:%), the film thickness of the transparent substrate 12 (unit: μm), the line width of the thin metal wire 16 (unit: μm), and the metal Each corresponds to the thickness (unit: μm) of the thin wire 16.

  The input values in the text boxes 438, 440, and 442 correspond to the horizontal size of the mesh pattern 20, the vertical size of the mesh pattern 20, and the image resolution (pixel size) of the output image data ImgOut.

  The operator clicks the [Next] button 446 after completing the input operation on the setting screen 420. Then, the display control unit 334 changes the setting screen 420 displayed on the display unit 322 to the setting screen 460 shown in FIG.

  The worker inputs an appropriate numerical value or the like via the setting screen 460 displayed on the display unit 322. Thereby, the visual information related to the visibility of the black matrix 34 can be input. Here, the visual information of the black matrix 34 is various information that contributes to the shape and optical density of the black matrix 34, and includes visual information of the pattern material. The visual information of the pattern material includes, for example, at least one of the type of the pattern material, the color value, the light transmittance or the light reflectance, or the arrangement position, unit shape, or unit size of the structural pattern.

  The operator inputs various conditions of the black matrix 34 using the text box 464 and the like regarding the black matrix 34 to be superimposed.

  The input of the radio buttons 462a and 462b corresponds to whether to generate output image data ImgOut that represents a pattern in which the black matrix 34 is superimposed on the mesh pattern 20. In the case of “present” (radio button 462a), the black matrix 34 is superimposed, and in the case of “none” (radio button 462b), the black matrix 34 is not superimposed.

  The input value in the text box 464 corresponds to the number of trials in which the arrangement position of the black matrix 34 is randomly determined and the image data Img is created and evaluated. For example, when this value is set to 5 times, five image data Img in which the positional relationship between the mesh pattern 20 and the black matrix 34 is determined at random are created, and the average value of the respective evaluation values EVP is used to create a mesh. The pattern is evaluated.

  The input values of the text boxes 466, 468, 470, and 472 are the optical density (unit: D) of the black matrix 34, the vertical size (unit: μm) of the pixel 32, the horizontal size of the pixel 32 (unit: μm), and the black matrix. This corresponds to the width (unit: μm) of the horizontal grid lines 34 and the width (unit: μm) of the vertical grid lines of the black matrix 34, respectively.

  The image information estimation unit 336 estimates image information corresponding to the mesh pattern 20 in response to the click operation of the “set” button 480 by the operator. This image information is referred to when creating image data Img (including output image data ImgOut).

  For example, the number of pixels in the horizontal direction of the output image data ImgOut is set based on the vertical size of the mesh pattern 20 (input value of the text box 438) and the image resolution of the output image data ImgOut (input value of the text box 442). The number of pixels corresponding to the line width of the thin metal wire 16 can be calculated based on the wiring width (input value of the text box 434) and the image resolution.

  Further, the light transmittance of the single metal wire 16 can be estimated based on the light transmittance of the wire (display value in the column 448a) and the thickness of the wiring (input value in the text box 436). In addition to this, based on the light transmittance of the film material (display value in the column 450a) and the film thickness (input value in the text box 432), the light transmission in the state where the thin metal wires 16 are laminated on the transparent substrate 12. Rate can be estimated.

  Furthermore, the light transmittance of the wire (displayed in the column 448a), the light transmittance of the film material (displayed in the column 450a), the overall transmittance (input value of the text box 430), and the width of the wiring (text box 434). The number of openings 18 and the number of seed points SD can be estimated based on the input value). Note that the number of seed points SD may be estimated in accordance with an algorithm for determining the area of the opening 18.

  Further, the optical density of the black matrix 34 (text box 466), the horizontal size of the pixel 32 (text box 468), the vertical size of the pixel 32 (text box 470), and the width of the horizontal grid line of the black matrix 34 (text) Based on the box 472) and the width of the vertical lattice lines of the black matrix 34 (text box 474), the pattern (shape / optical density) of the mesh pattern 20 when the black matrix 34 is superimposed can be estimated.

  Next, output image data ImgOut for forming the mesh pattern 20 is created (step S2).

  Prior to the description of the generation method of the output image data ImgOut, the evaluation method of the image data Img will be described first. In the present embodiment, evaluation is performed based on an evaluation value EVP obtained by quantifying noise characteristics (for example, granular noise).

  As an example of evaluating the noise characteristics, a predetermined region range of the image data Img may be defined, and RMS (Root Mean Square) may be obtained for the pixel values in the region range. In the present embodiment, human visual response characteristics are taken into account for evaluation, and a further improved evaluation value EVP is used.

  FIG. 14A is a schematic explanatory diagram in which image data Img representing the mesh pattern 20 is visualized. Hereinafter, the image data Img will be described as an example.

  First, FFT is applied to the image data Img shown in FIG. 14A. Thereby, about the shape of the mesh pattern 20, it can grasp | ascertain not as a partial shape but as the whole tendency (spatial frequency distribution).

  FIG. 14B is a distribution diagram of a spectrum Spc obtained by performing FFT on the image data Img of FIG. 14A. Here, the horizontal axis of the distribution diagram indicates the spatial frequency in the X-axis direction, and the vertical axis indicates the spatial frequency in the Y-axis direction. Further, the intensity level (spectrum value) decreases as the display density for each spatial frequency band decreases, and the intensity level increases as the display density increases. In the example of this figure, the distribution of this spectrum Spc is isotropic and has two circular peaks.

  14C is a cross-sectional view taken along the line XIVC-XIVC of the distribution of the spectrum Spc shown in FIG. 14B. Since the spectrum Spc is isotropic, FIG. 14C corresponds to the radial distribution for all angular directions. As can be understood from this figure, the intensity level in the low spatial frequency band and the high spatial frequency band is reduced, and a so-called bandpass type characteristic is obtained in which the intensity level is increased only in the intermediate spatial frequency band. That is, it can be said that the image data Img shown in FIG. 14A represents a pattern having the characteristics of “green noise” according to technical terms in the field of image engineering.

  FIG. 15 is a graph showing an example of human standard visual response characteristics.

  In the present embodiment, a Dooley-Shaw function at an observation distance of 300 mm is used as a standard human visual response characteristic under a clear vision state. The Dooley show function is a type of VTF (Visual Transfer Function) and is a representative function that imitates the standard visual response characteristics of humans. Specifically, this corresponds to the square value of the contrast ratio characteristic of luminance. The horizontal axis of the graph is the spatial frequency (unit: cycle / mm), and the vertical axis is the VTF value (unit is dimensionless).

  If the observation distance is 300 mm, the VTF value is constant (equal to 1) in the range of 0 to 1.0 cycle / mm, and the VTF value tends to gradually decrease as the spatial frequency increases. That is, this function functions as a low-pass filter that cuts off the medium to high spatial frequency band.

  Note that the actual human visual response characteristic has a value smaller than 1 in the vicinity of 0 cycle / mm, which is a so-called band-pass filter characteristic. However, in the present embodiment, as illustrated in FIG. 15, the contribution to the evaluation value EVP is increased by setting the VTF value to 1 even in an extremely low spatial frequency band. Thereby, the effect which suppresses the periodicity resulting from the repeating arrangement | positioning of the mesh pattern 20 is acquired.

  The evaluation value EVP is calculated by the following equation (1) when the value of the spectrum Spc is F (Ux, Uy).

  According to Wiener-Khintchene's theorem, the value obtained by integrating the spectrum Spc over the entire spatial frequency band coincides with the square value of RMS. A value obtained by multiplying the spectrum Spc by VTF and integrating the new spectrum Spc in the entire spatial frequency band is an evaluation index that substantially matches human visual characteristics. This evaluation value EVP can be said to be RMS corrected by human visual response characteristics. Similar to normal RMS, the evaluation value EVP always takes a value of 0 or more, and the closer to 0, the better the noise characteristics.

  Further, by applying inverse Fourier transform (for example, IFFT) to the VTF shown in FIG. 15, a mask in the real space corresponding to the VTF is calculated, and the mask is applied to the image data Img to be evaluated. Then, a convolution operation may be performed to obtain RMS for new image data Img. Thereby, the operation result equivalent to the said method using (1) Formula can be obtained.

  Needless to say, the calculation formula of the evaluation value EVP can be variously changed according to the target level (allowable range) for determining the mesh pattern 20 and the evaluation function.

  Hereinafter, a specific method for determining the output image data ImgOut based on the evaluation value EVP will be described. For example, it is possible to use a method of sequentially repeating creation of a dot pattern composed of a plurality of seed points SD, creation of image data Img based on the plurality of seed points SD, and evaluation using the evaluation value EVP. Here, the algorithm for determining the positions of the plurality of seed points SD can employ various optimization methods. For example, as an optimization problem for determining a dot pattern, various search algorithms such as a structural algorithm and a sequential improvement algorithm can be used. Specific examples include a neural network, a genetic algorithm, a simulated annealing method, a void and cluster method, and the like.

  In the present embodiment, with respect to the method of optimizing the mesh pattern 20 by the simulated annealing method (hereinafter referred to as the SA method), mainly refer to the flowchart of FIG. 16 and the functional block diagrams of FIG. 9 and FIG. While explaining. The SA method is a probabilistic search algorithm that imitates the “annealing method” in which robust iron is obtained by hitting iron in a high temperature state.

  First, the initial position selection unit 328 selects the initial position of the seed point SD (step S21).

  Prior to selection of the initial position, the random number generation unit 326 generates a random value using a pseudo-random number generation algorithm. Here, various algorithms such as Mersenne Twister, SFMT (SIMD-oriented Fast Mersenne Twister), and Xorshift method may be used as a pseudo-random number generation algorithm. Then, the initial position selection unit 328 uses the random number value supplied from the random number generation unit 326 to randomly determine the initial position of the seed point SD. Here, the initial position selection unit 328 selects the initial position of the seed point SD as the address of the pixel on the image data Img, and sets the seed points SD at positions that do not overlap each other.

  Note that the initial position selection unit 328 determines the range of the two-dimensional image region in advance based on the number of pixels in the vertical and horizontal directions of the image data Img supplied from the image information estimation unit 336. Further, the initial position selection unit 328 acquires the number of seed points SD from the image information estimation unit 336 in advance, and determines the number.

  FIG. 17 is a graph showing an example of the relationship between the arrangement density of the seed points SD and the overall transmittance of the mesh pattern 20. This figure shows that the covering area of the wiring increases as the arrangement density increases, and as a result, the overall transmittance of the mesh pattern 20 decreases.

  This graph characteristic varies depending on the light transmittance of the film material (indicated by the column 450a in FIG. 11), the width of the wiring (input value in the text box 434 in FIG. 11), and the region determination algorithm (for example, Voronoi diagram). . Therefore, characteristic data corresponding to each parameter such as the wiring width may be stored in advance in the storage unit 324 in various data formats such as functions and tables.

  Alternatively, the correspondence between the arrangement density of the seed points SD and the electric resistance value of the mesh pattern 20 may be acquired in advance, and the number of seed points SD may be determined based on a specified value of the electric resistance value. This is because the electrical resistance value is one parameter representing the conductivity of the first conductive portion 14a and the second conductive portion 14b, and is indispensable for the design of the mesh pattern 20.

  Note that the initial position selection unit 328 may select the initial position of the seed point SD without using a random value. For example, the initial position can be determined with reference to data acquired from an external device including a scanner and a storage device (not shown). This data may be, for example, predetermined binary image data, specifically, halftone dot data for printing.

  Next, the image data creation unit 338 creates image data ImgInit as initial data (step S22). The image data creation unit 338 displays an image representing a pattern corresponding to the mesh pattern 20 based on the number and position data SDd of the seed points SD supplied from the storage unit 324 and the image information supplied from the image information estimation unit 336. Data ImgInit (initial data) is created.

  The algorithm for determining each mesh shape 22 from a plurality of seed points SD can take various methods. Hereinafter, it demonstrates in detail, referring FIG. 18A-FIG. 18C.

As shown in FIG. 18A, for example, assume that _eight points P _{1 to} P ₈ are randomly selected in a square planar region 100 (two-dimensional image region).

FIG. 18B is a schematic explanatory diagram showing the result of partitioning each region according to the Voronoi diagram (Voronoi division method). Accordingly, eight regions V _{1 to} V ₈ that respectively surround the eight points P _{1 to} P ₈ are defined. Here, the Euclidean distance is used as the distance function, but various functions may be used. As can be understood from the figure, the point P _i is the closest point at any point in the region V _i (i = 1 to 8).

FIG. 18C is a schematic explanatory diagram showing the result of partitioning each area according to the Delaunay diagram (Delaunay triangulation method). The Delaunay triangulation method is a method of defining a triangular region by connecting adjacent points among the points P _{1 to} P ₈ . As a result, the same number of regions V _{1 to} V ₈ as the number of points P _{1 to} P ₈ can be determined.

  By the way, before creating image data Img (including initial image data ImgInit), pixel address and pixel value definitions are determined in advance.

  FIG. 19A is an explanatory diagram illustrating the definition of a pixel address in the image data Img. For example, the pixel size is 10 μm, and the number of vertical and horizontal pixels of the image data is 8192. For convenience of FFT calculation processing described later, it is set to be a power of 2 (for example, 2 to the 13th power). At this time, the entire image area of the image data Img corresponds to a rectangular area of about 82 mm square.

FIG. 19B is an explanatory diagram illustrating the definition of pixel values in the image data Img. For example, the number of gradations per pixel is 8 bits (256 gradations). The optical density 0 corresponds to the pixel value 0 (minimum value), and the optical density 4.5 corresponds to the pixel value 255 (maximum value). In the intermediate pixel values 1 to 254, values are determined so as to have a linear relationship with the optical density. Here, it is needless to say that the optical density may be not only the transmission density but also the reflection density, and can be appropriately selected according to the use mode of the conductive sheet 10 and the like. In addition to the optical density, each pixel value can be defined in the same manner as described above even for tristimulus values XYZ, color values RGB, L ^* a ^* b ^* , and the like.

In this way, the image data creation unit 338 creates an image corresponding to the mesh pattern 20 based on the data definition of the image data Img and the image information estimated by the image information estimation unit 336 (see the description of step S1). Data ImgInit is created (step S22). The image data creation unit 338 determines the initial state of the mesh pattern 20 shown in FIG. 20B using a Voronoi diagram based on the initial position of the seed point SD (see FIG. 20A). Here, it is assumed that the image data Img (including image data ImgInit) is image data including each data of four channels of an optical density OD, a color value L ^* , a color value a ^* , and a color value b ^* .

  By the way, when the size of the image data Img is extremely large, the amount of calculation processing for optimization becomes enormous, so that the processing capability and processing time of the image generation device 312 are required. In addition, since the size of the image data Img (output image data ImgOut) increases, a memory capacity for storing the image data Img is also required. Therefore, it is effective to regularly arrange unit image data ImgE satisfying a predetermined boundary condition so that the image data Img has a repeated shape. Hereinafter, the specific method will be described in detail with reference to FIGS. 21 and 22.

  FIG. 21 is a schematic explanatory diagram illustrating a method for determining a pattern at the end of the unit region 90. FIG. 22 is a schematic explanatory diagram showing the result of regularly arranging unit image data ImgE to create image data Img.

As shown in FIG. 21, in a substantially square unit region 90, points P ₁₁ to P ₁₄ are respectively arranged at the upper right corner, upper left corner, lower left corner, and lower right corner. For convenience of explanation, only four points P ₁₁ to P ₁₄ existing in the unit region 90 are shown, and other points are omitted.

To the right of the unit region 90, a virtual region 92 (shown by a broken line) having the same size as the unit region 90 is disposed adjacently. On the virtual region 92, so as to correspond to the position of the point P ₁₂ of the unit region 90, the virtual point P ₂₂ is disposed. A virtual region 94 (shown by a broken line) having the same size as that of the unit region 90 is disposed adjacent to the upper right of the unit region 90. On the virtual region 94, so as to correspond to the position of the point P ₁₃ of the unit region 90, the virtual point P ₂₃ is disposed. Further, above the unit region 90, a virtual region 96 (shown by a broken line) having the same size as the unit region 90 is disposed adjacently. On the virtual region 96 so as to correspond to the position of the point P ₁₄ of the unit region 90, the virtual point P ₂₄ is disposed.

  Hereinafter, the image data creation unit 338 determines the pattern (wiring shape) in the upper right corner of the unit region 90 according to the Voronoi diagram (division method) under this condition.

In relation to the point P ₁₁ and the virtual point P _22, 1 single division line 97 a distance from both the point is a set of points equal it is determined. Also, in relation to the point P ₁₁ and the virtual point P _24, 1 single division line 98 a distance from both the point is a set of points equal it is determined. Furthermore, in relation to the virtual point P ₂₄ and the virtual point P _22, 1 single division line 99 a distance from both the point is a set of points equal it is determined. A pattern in the upper right corner of the unit region 90 is defined by the partition lines 97 to 99. Similarly, a pattern is defined over the entire end of the unit region 90. Hereinafter, the image data in the unit region 90 created in this way is referred to as unit image data ImgE.

  As shown in FIG. 22, the unit image data ImgE is regularly arranged in the same direction and in the vertical direction and the horizontal direction, so that the image data Img is created in the plane region 100. Since the pattern is determined in accordance with the boundary condition shown in FIG. 21, the unit image data ImgE can be connected seamlessly between the upper end and the lower end and between the right end and the left end of the unit image data ImgE.

  With this configuration, the unit image data ImgE can be reduced in size, and the amount of calculation processing and the data size can be reduced. In addition, moire caused by inconsistencies in the joints does not occur. The shape of the unit region 90 is not limited to the square shown in FIG. 21 and FIG. 22, and any type can be used as long as it can be arranged without gaps, such as a rectangle, a triangle, and a hexagon.

  Next, the image data creation unit 338 creates image data ImgInit ′ based on the image data ImgInit created in step S22 and the image information estimated by the image information estimation unit 336 (see the description of step S1). (Step S23). Here, the image data ImgInit ′ is image data representing a pattern in which the black matrix 34 as a structural pattern is superimposed on the mesh pattern 20. If the black matrix 34 is not superimposed by selecting the radio button 462b (see FIG. 12), the image data ImgInit is directly copied to the image data ImgInit ', and the process proceeds to the next step (S24).

  When the data definition of the pixel value of the image data ImgInit is transmission density, the transmission density of each pixel corresponding to the arrangement position of the black matrix 34 (input value of the text box 466 in FIG. 12) is added, and the image data ImgInit 'Can be created. If the data definition of the pixel value of the image data ImgInit is reflection density, the image data is replaced with the reflection density of each pixel corresponding to the arrangement position of the black matrix 34 (the input value of the text box 466 in the figure). Data ImgInit ′ can be created.

  Next, the mesh pattern evaluation unit 340 calculates an evaluation value EVPInit (step S24). In the SA method, the evaluation value EVP plays a role as a cost function.

  Specifically, the FFT operation unit 400 illustrated in FIG. 10 performs FFT on the image data ImgInit ′. Then, evaluation value calculation unit 402 calculates evaluation value EVP based on spectrum Spc supplied from FFT operation unit 400.

In the image data Img, the evaluation values EVP (L ^* ), EVP (a ^* ), and EVP (b ^* ) described above are respectively applied to the channels of the color value L ^* , the color value a ^* , and the color value b ^*. Calculate {refer to equation (1)}. Then, an evaluation value EVP is obtained by performing a product-sum operation using a predetermined weight coefficient.

The optical density OD may be used instead of the color value L ^* , the color value a ^* , and the color value b ^* . Regarding the evaluation value EVP, the type of observation mode, specifically, whether the auxiliary light source is dominant in transmitted light, dominant in reflected light, or mixed light of transmitted and reflected light. Accordingly, it is possible to appropriately select a calculation method that is more suitable for human visibility.

  Further, it goes without saying that the calculation formula of the evaluation value EVP can be variously changed according to the target level (allowable range) for determining the mesh pattern 20 and the evaluation function.

  Thus, the mesh pattern evaluation unit 340 calculates the evaluation value EVPInit (step S24).

  Next, the storage unit 324 temporarily stores the image data ImgInit created in step S22 and the evaluation value EVPInit calculated in step S24 (step S25). At the same time, an initial value nΔT (n is a natural number and ΔT is a positive real number) is substituted for the pseudo temperature T.

  Next, the counter 408 initializes a variable K (step S26). That is, 0 is substituted for K.

  Next, the image data ImgTemp is generated in a state where a part of the seed point SD (second seed point SDS) is replaced with the candidate point SP, and the evaluation value EVPTtemp is calculated. "Update" is determined (step S27). Step S27 will be described in more detail with reference to the functional block diagrams of FIGS. 9 and 10 and the flowchart of FIG.

First, the update candidate position determination unit 330 extracts candidate points SP from the predetermined plane region 100 and determines them (step S271). For example, the update candidate position determination unit 330 determines a position that does not overlap any position of the seed point SD using the random number value supplied from the random number generation unit 326. Note that the number of candidate points SP may be one or plural. In the example shown in FIG. 24A, there are two candidate points SP (point Q ₁ and point Q ₂ ) with respect to eight current seed points SD (points P _{1 to} P ₈ ).

Next, a part of the seed point SD and the candidate point SP are exchanged at random (step S272). The update candidate position determination unit 330 randomly associates each seed point SD to be exchanged (or updated) with each candidate point SP. In FIG. 24A, it is assumed that the point P ₁ and the point Q ₁ are associated with each other, and the point P ₃ and the point Q ₂ are associated with each other. As shown in FIG. 24B, the point P ₁ and the point Q ₁ are exchanged, and the point P ₃ and the point Q ₂ are exchanged. Here, the point P ₂ and the points P _{4 to} P ₈ that are not exchange (or update) targets are referred to as first seed points SDN, and the points P ₁ and P ₃ that are exchange (or update) targets are the second seed points SDS. That's it.

  Next, the image data creation unit 338 creates image data ImgTemp using the exchanged new seed point SD (see FIG. 24B) (step S273). Here, since the same method as in the case of step S22 (see FIG. 16) is used, the description is omitted. If the black matrix 34 is not superimposed by selecting the radio button 462b (see FIG. 12), the image data ImgTemp is directly copied to the image data ImgTemp ', and the process proceeds to the next step (S274).

  Next, the image data creation unit 338 creates image data ImgTemp ′ based on the image data ImgTemp created in step S273 and the image information estimated by the image information estimation unit 336 (see the description of step S1). (Step S274). At this time, since the same method as that in the case of step S23 (see FIG. 16) is used, the description is omitted.

  Next, the mesh pattern evaluation unit 340 calculates an evaluation value EVPTemp based on the image data ImgTemp '(step S275). At this time, since the same method as in the case of step S24 (see FIG. 16) is used, the description is omitted.

  Next, the update probability calculation unit 412 calculates the update probability Prob of the position of the seed point SD (step S276). Here, the “update of position” means that the seed point SD (that is, the first seed point SDN and the candidate point SP) obtained by provisional exchange in step S272 is determined as a new seed point SD. .

  Specifically, the probability of updating or not updating the seed point SD is calculated according to the metropolis standard. The update probability Prob is given by the following equation (2).

  Here, T represents a pseudo temperature, and as the absolute temperature (T = 0) is approached, the update rule of the seed point SD changes from stochastic to deterministic.

  Next, the position update determination unit 414 determines whether or not to update the position of the seed point SD according to the update probability Prob calculated by the update probability calculation unit 412 (step 277). For example, the determination may be made probabilistically using the random number value supplied from the random number generation unit 326.

  When updating the seed point SD, the storage unit 324 is instructed to “update”, and when not updated, the storage unit 324 is instructed (steps S278 and S279).

  In this way, step S27 is completed.

  Returning to FIG. 16, it is determined whether or not the seed point SD is to be updated in accordance with either “update” or “non-update” instructions (step S28). If the seed point SD is not updated, the process proceeds to the next step S30 without performing step S29.

  On the other hand, when updating the seed point SD, the storage unit 324 overwrites and updates the image data ImgTemp obtained in step S273 with respect to the currently stored image data Img (step S29). In addition, the storage unit 324 overwrites and updates the evaluation value EVPTemp obtained in step S275 with respect to the currently stored evaluation value EVP (step S29). Further, the storage unit 324 overwrites and updates the position data SPd of the candidate point SP obtained in step S271 with respect to the position data SDSd of the second seed point SDS currently stored (step S29). Thereafter, the process proceeds to the next Step S30.

  Next, the counter 408 adds 1 to the current value of K (step S30).

  Next, the counter 408 compares the magnitude relationship between the current value of K and a predetermined value of Kmax (step S31). If the value of K is smaller, the process returns to step S27, and thereafter steps S27 to S31 are repeated. In order to ensure sufficient convergence in this optimization calculation, for example, Kmax = 10000 can be set.

  In other cases, the pseudo temperature management unit 410 subtracts the pseudo temperature T by ΔT (step S32), and proceeds to the next step S33. The change amount of the pseudo temperature T may be not only the subtraction of ΔT but also a multiplication of a constant δ (0 <δ <1). In this case, the probability Prob (lower stage) shown in the equation (2) is subtracted by a certain value.

  Next, the pseudo temperature management unit 410 determines whether or not the current pseudo temperature T is equal to 0 (step S33). If T is not equal to 0, the process returns to step S26, and thereafter steps S26 to S33 are repeated.

  On the other hand, when T is equal to 0, the pseudo temperature management unit 410 notifies the output image data determination unit 416 that the evaluation by the SA method is completed. Then, the storage unit 324 overwrites and updates the output image data ImgOut with the content of the image data Img last updated in step S29 (step S34). In this way, the creation of the output image data ImgOut (step S2) ends.

  This output image data ImgOut may be the wiring shape of various electrodes such as an inorganic EL element, an organic EL element, or a solar cell in addition to the touch panel 44. In addition to electrodes, the present invention can also be applied to a transparent heating element (for example, a vehicle defroster) that generates heat when an electric current is passed, and an electromagnetic wave shielding material that blocks electromagnetic waves.

  By the way, the statistical characteristic in the suitable mesh pattern 20 is demonstrated in detail. FIG. 25 is a histogram of the number of vertices Nv of the preferred mesh shape 22. For example, two first sensing parts 72a are randomly extracted from a large number of first sensing parts 72a, and a histogram of the number of vertices Nv of the first mesh element 78a (polygon 82) in a square region having a side of 3 mm. Was created respectively.

  In the first data, the number of vertices Nv is in the range of 4 to 7, and the existence ratio is higher in the order of pentagon, hexagon, heptagon, and tetragon. In the second data, the number of vertices Nv is in the range of 4 to 8, and the existence ratio is higher in the order of hexagon, pentagon, heptagon, tetragon, and octagon.

  As features common to the first and second data, [1] the ratio of polygons having the highest number of vertices is 40 to 50%, and [2] many having the highest number of vertices. The sum of the ratio of the square and the ratio of the polygon having the second highest number of vertices is 70 to 85%, and [3] the histogram is a mountain shape having one peak. .

  Furthermore, according to the result of creating the histogram regarding a plurality of types of mesh patterns that can be sufficiently allowed from the viewpoint of moire and noise granularity, the ratio of polygons having the highest number of vertices is 40 to 70%. Yes, and / or the sum of the ratio of polygons having the highest number of vertices and the ratio of polygons having the second highest number of vertices may be 70 to 90%. I got the knowledge.

  For the operator to visually confirm, the obtained output image data ImgOut may be displayed on the display unit 322 to visualize the mesh pattern 20 in a pseudo manner. Hereinafter, an example of the result of actual visualization of the output image data ImgOut will be described.

  FIG. 26A is a schematic explanatory diagram in which the black matrix 34 is superimposed and visualized on the output image data ImgOut representing the pattern of the mesh pattern 20. In the drawing, the mesh pattern 20, the red subpixel 32r, the green subpixel 32g, the blue subpixel 32b, and the black matrix 34 are shown so as to be identifiable. 26B to 26D are graphs in which the spectrum Spc is calculated by extracting the R component, G component, and B component of the color value from the output image data ImgOut of FIG. 26A. As shown in FIGS. 26B to 26D, substantially the same spectrum Spc was obtained for each of the R, G, and B components. In both cases, noise peaks occur around the spatial frequency corresponding to the lattice spacing of the black matrix 34.

  On the other hand, FIG. 27A is a schematic explanatory diagram in which a human visual response characteristic is applied to the output image data ImgOut in FIG. 26A and visualized. By applying a human visual response characteristic, in other words, a low-pass filter (see FIG. 15), the fine structural contours of the mesh pattern 20 and the black matrix 34 are hardly visible as shown in FIG. 27A.

  27B to 27D are graphs in which the spectrum Spcv is calculated by extracting the R component, G component, and B component of the color value from the image data of FIG. 27A. Compared to FIG. 26A, the peak of the noise characteristic described above is shifted to the low spatial frequency side, and the area formed by the spectrum Spcv is reduced.

  If such a method is used, the noise characteristics of the mesh pattern 20 can be evaluated more appropriately to the human visual response characteristics.

  Returning to FIG. 13, finally, the image cutout unit 332 determines two or more first conductive patterns 70 a and two or more first conductive patterns 70 a from the wiring shape (pattern of the mesh pattern 20) of the planar region 100 represented by the output image data ImgOut. The first dummy pattern 76a and the two or more second conductive patterns 70b are cut out (step S3).

  FIG. 28A is a schematic explanatory diagram illustrating a result of cutting out each first conductive pattern 70a and each first dummy pattern 76a. FIG. 28B is a schematic explanatory diagram illustrating a result of cutting out each second conductive pattern 70b.

  A pattern on one main surface side (the arrow s1 direction side in FIG. 2) of the transparent base 12 is cut out from the flat region 100 shown in FIG. 28A except for the first region R1 (hatched region). First image data representing is generated. The first region R1 has a shape in which a plurality of frame-shaped rhombus frames are connected in the arrow X direction. That is, the first image data represents two or more first conductive patterns 70a and two or more first dummy patterns 76a (see FIG. 6 and the like), respectively.

  In addition, by cutting out only the second region R2 (hatched region) from the planar region 100 shown in FIG. 28B, the pattern on the other main surface side (the arrow s2 direction side in FIG. 2) of the transparent substrate 12. Second image data representing is generated. The second image data represents two or more second conductive patterns 70b (see FIG. 7 and the like). Note that the remaining region (the blank region in the planar region 100 shown in FIG. 28B) excluding the second region R2 corresponds to the position of each first conductive pattern 70a.

  In FIG. 28A and FIG. 28B, the planar region 100 is arranged in a state inclined by a predetermined angle (for example, θ = 45 °) as compared with FIG. That is, the angle θ formed by the arrangement direction of the unit image data ImgE and the extending direction of each first conductive pattern 70a (or each second conductive pattern 70b) is non-zero (0 ° <θ <90 °). Have been in a relationship. As described above, each first conductive pattern 70a (or each second conductive pattern 70b) is formed to be inclined by a predetermined angle θ with respect to the arrangement direction of the repetitive shape of the mesh pattern 20, so that each first sensing unit Generation of moire between 72a (or each second sensing unit 72b) and the repetitive shape can be suppressed. Needless to say, if moire does not occur, θ = 0 ° may be used. From the same viewpoint, it is preferable that the size of the repetitive shape is larger than the size of each first sensing unit 72a (or each first sensing unit 72b).

  The created first image data and second image data are used to form an output of the thin metal wire 16. For example, when the conductive sheet 10 is manufactured using double-sided batch exposure described later, the first image data and the second image data are used for producing a photomask pattern. Further, when the conductive sheet 10 is manufactured by printing including screen printing and inkjet printing, the first image data and the second image data are used as printing data.

  Next, the effect obtained by setting the relative refractive index nr1 of the transparent substrate 12 to the first protective layer 26a to a value close to 1 will be described in detail with reference to FIGS. 29A to 30B. For ease of understanding, a part of the configuration of the conductive sheet 10 is omitted, and only the transparent substrate 12, the first conductive portion 14a, and the first protective layer 26a are shown.

  As shown in FIG. 29A, the parallel light 102 irradiated from the display unit 30 (see FIG. 4) side enters the transparent substrate 12 and travels straight along the arrow Z1 direction. The parallel light 102 is reflected almost entirely in the direction of the arrow Z2 as the reflection component 106 at the first interface 104 between the transparent substrate 12 and the fine metal wire 16. That is, the difference in the amount of light transmitted through the conductive sheet 10 increases depending on the presence or absence of the thin metal wire 16 that is a non-translucent material. As a result, the shading according to the shape of the mesh pattern 20 becomes prominent, and moire tends to occur. On the other hand, in the case of a conductive sheet using a conductive material having high translucency (typically, ITO), the above-described influence is hardly received.

  Hereinafter, the optical phenomenon when the refractive index difference between the transparent substrate 12 and the first protective layer 26a is large, that is, when the relative refractive index nr1 is away from 1, will be described with reference to FIGS. 29B and 29C. .

  As shown in FIG. 29B, the light (obliquely incident light 108) that is slightly obliquely incident on the direction of the arrow Z1 enters the inside of the transparent substrate 12, and the first conductive portion 14a (opening 18) and the first protective layer Go straight to the second interface 110 with 26a. Then, due to the refraction phenomenon by the second interface 110, the oblique incident light 108 is transmitted with a part of the light (straight component 112) and the remaining light (reflective component 114). At this time, since the relative refractive index nr1 is away from 1, the interface transmittance decreases, and the light amount of the straight component 112 (or the reflection component 114) relatively decreases (or increases).

  For example, as shown in FIG. 29C, the amount of light I = Iw at the position corresponding to the opening 18 and the amount of light I = Ib at the position corresponding to the thin metal wire 16 are detected through the conductive sheet 10. To do. In this case, the optical density due to the fine metal wire 16 is represented by ΔD1 = −log (Ib / Iw) with reference to the amount of light detected at the opening 18.

  Next, an optical phenomenon when the difference in refractive index between the transparent substrate 12 and the first protective layer 26a is small, that is, when the relative refractive index nr1 is a value close to 1, will be described with reference to FIGS. 30A and 30B. To do.

  When the relative refractive index nr1 is a value close to 1, the interface transmittance approaches 1 (interface reflectivity is 0) so that it can be easily derived from optical considerations. Therefore, the light amount of the straight traveling component 116 (or the reflection component 118) relatively increases (or decreases) compared to the case of FIG. 29B. In other words, the amount of light that passes through the inside of the transparent substrate 12 without being scattered increases uniformly regardless of the position of the thin metal wire 16 made of a non-translucent material. Hereinafter, for convenience of explanation, it is assumed that the detected light amount is increased by ε (positive value).

  At this time, as shown in FIGS. 30A and 30B, the light amount of I = Iw + ε is detected at the position corresponding to the opening 18 and the light amount of I = Ib + ε is detected at the position corresponding to the thin metal wire 16. . The optical density caused by the thin metal wire 16 is expressed by ΔD2 = −log {(Ib + ε) / (Iw + ε)} with reference to the amount of light detected at the opening 18.

  When Iw> Ib ≧ 0 and ε> 0, since the inequality (Ib / Iw) <(Ib + ε) / (Iw + ε) is satisfied, the relationship ΔD1> ΔD2 always holds. That is, by setting the relative refractive index nr1 of the transparent substrate 12 and the first protective layer 26a to a value close to 1, the optical density contrast caused by the fine metal wires 16 can be reduced. Thereby, in the planar view of the display apparatus 40, the pattern of the metal fine wire 16 becomes difficult to be visually recognized by the user.

  The relationship between the transparent substrate 12 and the first protective layer 26a as well as the relationship between the transparent substrate 12 and the second protective layer 26b is the same as described above. The relative refractive indexes nr1 and nr2 are preferably 0.86 to 1.15, more preferably 0.91 to 1.08. In particular, if the first protective layer 26a and / or the second protective layer 26b are made of the same material as the transparent substrate 12, nr1 = 1 (nr2 = 1) is more preferable.

  Thus, since the relative refractive index nr1 of the transparent substrate 12 with respect to the first protective layer 26a and / or the relative refractive index nr2 of the transparent substrate 12 with respect to the second protective layer 26b is set to 0.86 to 1.15, the transparent substrate Of the light (obliquely incident light 108) that is slightly inclined with respect to the normal direction of 12 (direction of arrow Z1), the interface between the transparent substrate 12 and the first protective layer 26a and / or the transparent substrate 12 and the second The amount of light that travels straight at the interface with the protective layer 26b (the straight traveling component 116) relatively increases. That is, the amount of light that passes through the transparent substrate 12 without being scattered increases uniformly regardless of the position of the thin metal wire 16 made of a non-translucent material. Thereby, the contrast of the optical density resulting from the metal fine wire 16 can be reduced, and it becomes difficult to be visually recognized by an observer (user). In particular, the mesh pattern 20 in which different mesh shapes 22 are arranged without gaps is more effective because the occurrence of noise granularity can be suppressed. In addition, it cannot be overemphasized that the above-mentioned effect is acquired not only when each mesh shape 22 is a polygonal shape but with various shapes.

  Then, the effect obtained by providing the 1st dummy pattern 76a in the electrically conductive sheet 10 is demonstrated, referring FIG. 31A-FIG. 32C. Hereinafter, for ease of understanding, the configuration of the first protective layer 26a and the like will be omitted, and the optical phenomenon will be described on the assumption that the influence of the light refraction effect is slight.

  FIG. 31A is a schematic plan view of the first sensor unit 120 according to the reference example. The first sensor unit 120 includes only the first conductive pattern 70a, and has a form in which the first dummy pattern 76a (see FIGS. 5A and 6) is omitted.

  FIG. 31B is a schematic explanatory diagram illustrating a path of the external light 122 incident on the first sensor unit 120. This figure corresponds to a schematic sectional view in the vicinity of the boundary Bd of the first conductive pattern 70a shown in FIG. 31A.

  The position P1 corresponds to a position where the thin metal wire 16 does not exist in either the first conductive portion 14a or the second conductive portion 14b. The external light 122 irradiated from the outside of the display device 40 (see FIG. 4) is incident on the inside of the conductive sheet 10 and travels in a substantially parallel manner along the arrow Z2 direction. Then, almost all of the external light 122 is transmitted through the first interface 104 between the opening 18 and the transparent substrate 12 in the arrow Z2 direction. At this time, part of the transmitted light travels straight along the arrow Z2 direction as the straight traveling component 124, and the remaining part is scattered as the scattering component 126. Thereafter, the straight traveling component 124 is substantially entirely transmitted in the direction of the arrow Z2 at the third interface 128 between the transparent base 12 and the opening 18. A part of the transmitted light travels straight along the arrow Z2 direction as a straight traveling component 130, and a part of the remaining light scatters as a scattering component 132. As a result, most of the external light 122 irradiated to the position P1 is emitted toward the arrow Z2 direction side of the conductive sheet 10.

  The position P2 corresponds to a position where the fine metal wire 16 exists in the first conductive portion 14a and the fine metal wire 16 does not exist in the second conductive portion 14b. The external light 122 irradiated from the outside of the display device 40 (see FIG. 4) is almost entirely reflected in the direction of the arrow Z1 as the reflection component 134 on the surface of the first conductive portion 14a (the thin metal wire 16 which is a non-translucent material). Reflected.

  The position P3 corresponds to a position where the fine metal wire 16 does not exist in the first conductive portion 14a and the fine metal wire 16 exists in the second conductive portion 14b. The external light 122 irradiated from the outside of the display device 40 (see FIG. 4) is incident on the inside of the conductive sheet 10 and travels in a substantially parallel manner along the arrow Z2 direction. Then, substantially all of the external light 122 is transmitted through the first interface 104 in the arrow Z2 direction. At this time, part of the transmitted light travels straight along the arrow Z2 direction as the straight traveling component 124, and the remaining part is scattered as the scattering component 126. The straight component 124 is reflected almost entirely in the direction of the arrow Z1 as the reflective component 135 at the third interface 128 (the surface of the thin metal wire 16 that is a non-translucent material). Thereafter, the reflection component 135 travels straight inside the transparent substrate 12 along the arrow Z1 direction, and is substantially transmitted through the first interface 104 in the arrow Z1 direction. As a result, a part of the external light 122 irradiated to the position P3 is emitted to the outside (arrow Z1 direction side) of the conductive sheet 10 as the straight traveling component 136 (or the scattering component 137).

  Thus, it can be understood that the reflected light amount Ir (reflected light 134) at the position P2 is larger than the reflected light amount Ir (straight-ahead component 136) at the position P3. This is due to a difference in optical path length until reaching the position of the thin metal wire 16 (corresponding to a value twice the thickness of the transparent substrate 12).

  FIG. 31C is a graph showing the intensity distribution of reflected light in the first sensor unit 120 of FIG. 31A. The horizontal axis of the graph represents the position in the arrow X direction, and the vertical axis of the graph represents the intensity of reflected light (the amount of reflected light Ir). This reflected light amount Ir means the amount of light reflected on one surface side (arrow Z1 direction side) of the conductive sheet 10 when uniform external light 122 is incident regardless of the position in the arrow X direction.

  As a result, at a position where the first conductive pattern 70a does not exist in the first sensor unit 120, the reflected light amount Ir takes a minimum value (Ir = I1). Further, at a position where the first conductive pattern 70a exists in the first sensor unit 120, the reflected light amount Ir takes a maximum value (Ir = I2). That is, the reflected light amount Ir has a characteristic according to the regular arrangement of the first sensing units 72a, in other words, a periodic characteristic in which a minimum value (I1) and a maximum value (I2) are alternately repeated.

  On the other hand, in the case of a conductive sheet using a conductive material having high translucency (typically, ITO), the amount of reflected light Ir is substantially equal to 0 (I1 = I2 = 0). For this reason, there is almost no contrast (luminance difference) resulting from the presence or absence of the first conductive pattern 70a. That is, compared with the case where the fine metal wire 16 is applied to the first conductive pattern 70a, the above-described influence is hardly received.

  On the other hand, FIG. 32A is a schematic plan view of the first sensor unit 60a (see FIGS. 5A and 6) according to the present embodiment. The first sensor unit 60a includes a first conductive pattern 70a and a first dummy pattern 76a.

  FIG. 32B is a schematic explanatory diagram illustrating a path of the external light 122 incident on the first sensor unit 60a. This figure corresponds to a schematic cross-sectional view in the vicinity of the boundary Bd of the first conductive pattern 70a shown in FIG. 32A.

  The position Q1 corresponding to the position P1 is the same as that in FIG. The same applies to the position Q2 corresponding to the position P2.

  At a position Q3 corresponding to the position P3, the external light 122 irradiated from the outside of the display device 40 (see FIG. 4) is on the surface of the first dummy electrode portion 15a (the thin metal wire 16 that is a non-translucent material). Almost all of the reflected component 138 is reflected in the direction of the arrow Z1. That is, the conductive sheet 10 reflects the external light 122 to the same extent as the position Q2 regardless of the presence or absence of the thin metal wire 16 in the second conductive portion 14b.

  As a result, as shown in FIG. 32C, the reflected light amount Ir has a uniform characteristic of Ir = I2 regardless of the regular arrangement of the first sensing units 72a. Note that there is a tendency that the amount of reflected light Ir slightly decreases (ε) in the space between the first conductive portion 14a and the first dummy electrode portion 15a. By reducing the width of the separation portion, the shape of the first sensing portion 72a is further less visible.

  As described above, the wiring density of the first dummy patterns 76a arranged in the first gap portions 75a between the adjacent first conductive patterns 70a is equal to the wiring density of the first conductive patterns 70a, so that one main surface The light reflectance in the planar area of the first dummy pattern 76a with respect to the external light 122 from the side substantially matches the light reflectance in the planar area of the first conductive pattern 70a. That is, it is possible to make the intensity distribution of the reflected light (reflected components 134 and 138) uniform regardless of the regular arrangement of the first sensing units 72a. Thereby, even if it is the structure which formed the electrode which consists of the metal fine wire 16 on both surfaces of the transparent base | substrate 12, the visual recognition of the 1st sensing part 72a (or 2nd sensing part 72b) resulting from the external light 122 as a reflected light source is carried out. Can be suppressed.

  Next, as a method of forming the first conductive pattern 70a, the first dummy pattern 76a, and the second conductive pattern 70b (hereinafter, sometimes referred to as the first conductive pattern 70a or the like), for example, on the transparent substrate 12. A photosensitive material having an emulsion layer containing a photosensitive silver halide salt is exposed and developed to form a metallic silver portion and a light transmissive portion in the exposed portion and the unexposed portion, respectively. 70a or the like may be formed. In addition, you may make it carry | support a conductive metal to a metal silver part by giving a physical development and / or a plating process to a metal silver part further. Regarding the conductive sheet 10 shown in FIG. 2, the following manufacturing method can be preferably employed. That is, the photosensitive silver halide emulsion layer formed on both surfaces of the transparent substrate 12 is collectively exposed to form the first conductive pattern 70a and the first dummy pattern 76a on one main surface of the transparent substrate 12, A second conductive pattern 70 b is formed on the other main surface of the transparent substrate 12.

  A specific example of this manufacturing method will be described with reference to FIGS.

  First, in step S11 of FIG. 33, a long photosensitive material 140 is produced. As shown in FIG. 34A, the photosensitive material 140 includes a transparent substrate 12, a photosensitive silver halide emulsion layer (hereinafter referred to as a first photosensitive layer 142a) formed on one main surface of the transparent substrate 12, and a transparent substrate. A photosensitive silver halide emulsion layer (hereinafter referred to as a second photosensitive layer 142b) formed on the other main surface of the substrate 12;

  In step S12 of FIG. 33, the photosensitive material 140 is exposed. In this exposure process, the first photosensitive layer 142a is irradiated with light toward the transparent substrate 12 to expose the first photosensitive layer 142a along the first exposure pattern, and the second photosensitive layer 142b. On the other hand, a second exposure process is performed in which light is irradiated toward the transparent substrate 12 to expose the second photosensitive layer 142b along the second exposure pattern (double-sided simultaneous exposure). In the example of FIG. 34B, while the long photosensitive material 140 is conveyed in one direction, the first photosensitive layer 142a is irradiated with the first light 144a (parallel light) through the first photomask 146a and the second photosensitive material 140a is irradiated. The layer 142b is irradiated with the second light 144b (parallel light) through the second photomask 146b. The first light 144a is obtained by converting the light emitted from the first light source 148a into parallel light by the first collimator lens 150a, and the second light 144b is emitted from the second light source 148b. It is obtained by converting the light into parallel light by the second collimator lens 150b in the middle.

  In the example of FIG. 34B, the case where two light sources (the first light source 148a and the second light source 148b) are used is shown, but the light emitted from one light source is divided through the optical system to generate the first light. The first photosensitive layer 142a and the second photosensitive layer 142b may be irradiated as the 144a and the second light 144b.

  In step S13 of FIG. 33, the exposed photosensitive material 140 is developed. Since the exposure time and development time of the first photosensitive layer 142a and the second photosensitive layer 142b vary depending on the type of the first light source 148a and the second light source 148b, the type of the developer, and the like, the preferable numerical range is generally determined. However, the exposure time and the development time are adjusted so that the development rate becomes 100%.

  In the first exposure process of the manufacturing method according to the present embodiment, as shown in FIG. 35, a first photomask 146a is disposed in close contact with the first photosensitive layer 142a, for example, and the first photomask 146a. The first photosensitive layer 142a is exposed by irradiating the first light 144a from the first light source 148a disposed opposite to the first photomask 146a. The first photomask 146a includes a glass substrate made of transparent soda glass and a mask pattern (first exposure pattern 152a) formed on the glass substrate. Therefore, the first exposure process exposes a portion of the first photosensitive layer 142a along the first exposure pattern 152a formed on the first photomask 146a. A gap of about 2 to 10 μm may be provided between the first photosensitive layer 142a and the first photomask 146a.

  Similarly, in the second exposure process, for example, the second photomask 146b is disposed in close contact with the second photosensitive layer 142b, and the second photomask 146b from the second light source 148b disposed to face the second photomask 146b. The second photosensitive layer 142b is exposed by irradiating the second light 144b toward. Similarly to the first photomask 146a, the second photomask 146b includes a glass substrate formed of transparent soda glass and a mask pattern (second exposure pattern 152b) formed on the glass substrate. Yes. Accordingly, the second exposure process exposes a portion of the second photosensitive layer 142b along the second exposure pattern 152b formed on the second photomask 146b. In this case, a gap of about 2 to 10 μm may be provided between the second photosensitive layer 142b and the second photomask 146b.

  In the first exposure process and the second exposure process, the emission timing of the first light 144a from the first light source 148a and the emission timing of the second light 144b from the second light source 148b may be made simultaneously or different. Also good. At the same time, the first photosensitive layer 142a and the second photosensitive layer 142b can be exposed simultaneously by one exposure process, and the processing time can be shortened.

  Finally, in step S14 of FIG. 33, the photosensitive sheet 140 after the development process is subjected to a lamination process, whereby the conductive sheet 10 is completed. Specifically, the first protective layer 26a is formed on the first photosensitive layer 142a side, and the second protective layer 26b is formed on the second photosensitive layer 142b side. Thereby, it becomes protection of the 1st sensor part 60a and the 2nd sensor part 60b.

  Thus, by using the manufacturing method using the above-described double-sided batch exposure, the electrodes of the touch panel 44 can be easily formed, and the touch panel 44 can be made thin (low profile).

  The above-described example is a manufacturing method for forming the first conductive pattern 70a and the like using a photosensitive silver halide emulsion layer. Other manufacturing methods include the following manufacturing methods.

  For example, the photoresist film on the copper foil formed on the transparent substrate 12 is exposed and developed to form a resist pattern, and the copper foil exposed from the resist pattern is etched to form the first conductive pattern 70a and the like. You may make it form. Alternatively, the first conductive pattern 70a and the like may be formed by printing a paste containing metal fine particles on the transparent substrate 12 and performing metal plating on the paste. Alternatively, the first conductive pattern 70a and the like may be printed on the transparent substrate 12 by a screen printing plate or a gravure printing plate. Or you may make it form the 1st conductive pattern 70a etc. on the transparent base | substrate 12 with an inkjet.

  Subsequently, modified examples (first to fifth modified examples) of the conductive sheet 10 according to the present embodiment will be described with reference to FIGS. 36 to 42. In the modification, the same components as those of the present embodiment are denoted by the same reference numerals, detailed description thereof is omitted, and so forth.

[First Modification]
The touch panel 160 may be applied not to the capacitance method but to a resistance film method (further, a digital method or an analog method). Hereinafter, the structure and the principle of operation will be described with reference to FIGS.

  The digital resistive touch panel 160 is bonded to the lower panel 162, the upper panel 164 disposed opposite to the lower panel 162, and the peripheral portions of the lower panel 162 and the upper panel 164. A frame adhesive layer 166 that is electrically insulated, and an FPC 168 (Flexible Printed Circuits) sandwiched between the lower panel 162 and the upper panel 164 are provided.

  As shown in FIGS. 36 and 37A, the upper panel 164 includes a first transparent base 170a made of a flexible material (for example, resin) and a first surface formed on one main surface (arrow Z2 direction side). 1 sensor portion 172a and first terminal wiring portion 174a. The first sensor unit 172a has two or more first conductive patterns 176a formed by a plurality of fine metal wires 16, respectively. The strip-shaped first conductive patterns 176a extend in the arrow Y direction and are arranged at equal intervals in the arrow X direction. Each first conductive pattern 176a is electrically connected to the FPC 168 via the first terminal wiring portion 174a. Between each 1st conductive pattern 176a, the strip | belt-shaped 1st dummy pattern 178a is each arrange | positioned.

  As shown in FIG. 36 and FIG. 37B, the lower panel 162 includes a second transparent base 170b made of a highly rigid material (for example, glass) and a second main surface formed on one main surface (arrow Z1 direction side). The sensor unit 172b and the second terminal wiring unit 174b, and a large number of dot spacers 180 arranged at a predetermined interval on the second sensor unit 172b. The second sensor part 172b has two or more second conductive patterns 176b formed by a plurality of fine metal wires 16, respectively. The strip-shaped second conductive patterns 176b extend in the arrow X direction and are arranged at equal intervals in the arrow Y direction. Each second conductive pattern 176b is electrically connected to the FPC 168 via the second terminal wiring portion 174b. Between each second conductive pattern 176b, a strip-shaped second dummy pattern 178b is arranged.

  As shown in FIGS. 36 and 38, in a state where the upper panel 164 and the lower panel 162 are bonded together, the first sensor unit 172a is separated from the second sensor unit 172b by a predetermined interval via each dot spacer 180. It is arranged. The first conductive patterns 176a and the second conductive patterns 176b intersect to form a large number of substantially square overlapping regions 182. Further, dot spacers 180 are arranged at positions where the first dummy patterns 178a and the second dummy patterns 178b intersect. That is, the dot spacers 180 are arranged one by one at the four corners of each overlapping region 182.

  Next, the operation of the touch panel 160 will be described. Upon receiving a pressure from the input surface (the main surface on the arrow Z1 side of the first transparent substrate 170a), the flexible first transparent substrate 170a is bent into a concave shape. Then, a part of the first conductive pattern 176a comes into contact with a part of the second conductive pattern 176b at a part corresponding to one overlapping region 182 surrounded by the four dot spacers 180 closest to the pressing position. Under this state, a potential gradient is generated between the upper panel 164 and the lower panel 162 by applying a voltage via the FPC 168. That is, the input position in the arrow X direction (X axis) can be detected by reading the voltage from the upper panel 164 via the FPC 168. Similarly, by reading the voltage from the lower panel 162, the input position in the arrow Y direction (Y-axis) can be detected.

  Here, the width w3 of the first conductive pattern 176a (or the second conductive pattern 176b) may be variously set according to the resolution, and is preferably about 1 to 5 mm, for example. The width w4 of the first dummy pattern 178a (or second dummy pattern 178b) is in the range of 50 to 200 μm from the viewpoint of insulation with the first conductive pattern 176a (or second conductive pattern 176b) and sensitivity of the touch panel 160. preferable.

  When a part of the single hatching region (first conductive pattern 176a and second conductive pattern 176b) and the double hatching region (first dummy pattern 178a and second dummy pattern 178b) shown in FIGS. 37A and 37B are enlarged, FIG. The structure of the mesh pattern 20 shown in FIG. That is, it is preferable to determine a wiring shape that can simultaneously suppress generation of moire and reduce noise granularity in a state where the upper panel 164 and the lower panel 162 are overlapped.

[Second Modification]
The outline shape of the first conductive pattern 192a and / or the second conductive pattern 192b may be different from the present embodiment. Hereinafter, the first sensor unit 190a and the second sensor unit having a macroscopically lattice-like pattern in plan view without forming the first sensor unit 72a (see FIG. 5A) and the second sensor unit 72b (see FIG. 5B). The sensor unit 190b will be described with reference to FIGS. 39A and 39B.

  FIG. 39A is a partially enlarged view of the first sensor unit 190a (first conductive unit 14a, first dummy electrode unit 15a), and FIG. 39B shows the second sensor unit 190b (second conductive unit 14b, second dummy electrode unit 15b). FIG. For convenience of explanation, in FIGS. 39A and 39B, only the outline of the mesh pattern 20 formed by the plurality of fine metal wires 16 is represented by a single line. That is, when a part of each single line shown in FIGS. 39A and 39B is enlarged, the structure of the mesh pattern 20 shown in FIG. 1 appears.

  As shown in FIG. 39A, a portion corresponding to the first sensor unit 190a has two or more first conductive patterns 192a formed by a plurality of fine metal wires 16. The first conductive patterns 192a extend in the arrow Y direction and are arranged at equal intervals in the arrow X direction orthogonal to the arrow Y direction. Further, unlike the second conductive pattern 70b (see FIG. 5B), the first conductive pattern 192a has a substantially constant line width. A lattice-shaped first dummy pattern 194 is arranged between the first conductive patterns 192a. The first dummy pattern 194 includes four long line patterns 196 extending in the arrow Y direction and arranged at equal intervals, and a plurality of short line patterns 198 arranged so as to intersect the four long line patterns 196 respectively. Composed. Each of the short line patterns 198 has the same length, and is arranged in parallel at equal intervals in the direction of the arrow Y with four as repeating units.

  As shown in FIG. 39B, a portion corresponding to the second sensor portion 190b has two or more second conductive patterns 192b formed of a plurality of fine metal wires 16. The second conductive patterns 192b extend in the arrow X direction, and are arranged at equal intervals in the arrow Y direction orthogonal to the arrow X direction. Further, unlike the first conductive pattern 70a (see FIG. 5A), the second conductive pattern 192b has a substantially constant line width. A large number of linear second dummy patterns 200 extending in the direction of the arrow X are arranged between the second conductive patterns 192b. Each of the second dummy patterns 200 has the same length, and is arranged in parallel at equal intervals in the direction of the arrow Y with four as repeating units.

  That is, in a plan view, the pattern formed on the first sensor unit 190a (see FIG. 39A) and the second sensor unit 190b (see FIG. 39B) complement each other, so that the lattice shape with the lattice element 202 as a unit is obtained. Complete. Even if comprised in this way, the effect similar to this invention is acquired.

[Third Modification]
The conductive sheet 210 may be composed of two sheet members (a first sheet member 212a and a second sheet member 212b).

  As shown in FIG. 40, the conductive sheet 210 is configured by laminating a second sheet member 212b and a first sheet member 212a in order from below. The first sheet member 212a includes a first conductive portion 14a and a first dummy electrode portion 15a formed on one main surface (arrow s1 direction side) of the first transparent base 12a. The second sheet member 212b has a second conductive portion 14b formed on one main surface (arrow s1 direction side) of the second transparent base 12b. That is, the first conductive portion 14a and the like are formed on one main surface (arrow s1 direction side) of the first transparent substrate 12a, and the second main surface (arrow s2 direction side) of the first transparent substrate 12a is second. It can be said that this is a form in which the conductive portion 14b and the like are formed.

  Even if the conductive sheet 210 is configured in this manner, the same effects as those of the present embodiment can be obtained. Another layer may be interposed between the first sheet member 212a and the second sheet member 212b. Further, if the first conductive portion 14a and the second conductive portion 14b, or if the first dummy electrode portion 15a and the second conductive portion 14b are in an insulated state, they may be arranged to face each other.

[Fourth Modification]
The conductive sheet 220 may be provided with dummy electrode portions (the first dummy electrode portion 15a and the second dummy electrode portion 15b) not only on one side but also on both sides.

  As shown in FIG. 41, not only the second conductive portion 14b but also the second dummy electrode portion 15b is formed on the other main surface (arrow s2 direction side) of the transparent substrate 12. Here, the second dummy electrode portion 15b is arranged apart from the second conductive portion 14b by a predetermined interval. That is, the second dummy electrode portion 15b is in a state of being electrically insulated from the second conductive portion 14b.

  As described above, by providing the dummy electrode portions on both sides of the transparent substrate 12, when the conductive sheet 220 is incorporated into the display device 40 (see FIG. 4), the effects of the present invention can be obtained regardless of whether the conductive sheet 220 is placed on the front or back side. It is done. On the contrary, from the viewpoint of production cost, a form in which the dummy electrode portions are not provided on both surfaces of the transparent substrate 12 may be adopted.

[Fifth Modification]
The conductive sheet 230 may have an anisotropic (isotropic) mesh pattern 232.

  FIG. 42 is a partially enlarged plan view of the conductive sheet 230 having the mesh pattern 232 whose shape is optimized under the condition where the black matrix 34 (see FIG. 3) is superimposed.

  As can be understood from FIGS. 14A and 8, the pattern (each opening 18) of the mesh pattern 232 generally has a horizontally long shape as compared with the pattern of the mesh pattern 20. The grounds are presumed as follows.

  As shown in FIG. 3, the red sub-pixel 32r, the green sub-pixel 32g, and the blue sub-pixel 32b are arranged in the direction of the arrow X, so that one pixel 32 is partitioned into one-third regions, and the high space The noise granularity of the frequency component increases. On the other hand, in the arrow Y direction, only the spatial frequency component corresponding to the arrangement cycle of the black matrix 34 exists, and there is no other spatial frequency component, so the mesh pattern 232 is reduced so as to reduce the visibility of this arrangement cycle. Is determined. That is, each wiring extending in the arrow Y direction is determined so as to be as narrow as possible as compared to the arrow X direction and to be regularly arranged between the black matrices 34.

  As described above, the mesh pattern 232 can be optimized in consideration of the structure pattern including the black matrix 34. That is, the noise granularity is reduced by observation in an actual usage mode, and the visibility of the observation target is greatly improved. This is particularly effective when the actual usage of the conductive sheet 230 is known.

  Next, in the conductive sheet 10 according to the present embodiment, a manufacturing method using a silver halide photographic light-sensitive material that is a particularly preferable embodiment will be mainly described.

  The manufacturing method of the conductive sheet 10 according to the present embodiment includes the following three modes depending on the photosensitive material and the type of development processing.

(1) A mode in which a photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material.

(2) An embodiment in which a photosensitive silver halide black-and-white photosensitive material containing physical development nuclei in a silver halide emulsion layer is dissolved and physically developed to form a metallic silver portion on the photosensitive material.

(3) A photosensitive silver halide black-and-white photosensitive material containing no physical development nuclei and an image receiving sheet having a non-photosensitive layer containing physical development nuclei are overlapped and developed by diffusion transfer, and the metallic silver portion is non-photosensitive image-receiving sheet. Form formed on top.

  The aspect (1) is an integrated black-and-white development type, and a light-transmitting conductive film is formed on a photosensitive material. The resulting developed silver is chemically developed silver or heat developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament with a high specific surface.

  In the above aspect (2), the light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material by dissolving silver halide grains close to the physical development nucleus and depositing on the development nucleus in the exposed portion. A characteristic film is formed. This is also an integrated black-and-white development type. Although the development action is precipitation on the physical development nuclei, it is highly active, but developed silver is a sphere with a small specific surface.

  In the above aspect (3), the silver halide grains are dissolved and diffused in the unexposed area and deposited on the development nuclei on the image receiving sheet, whereby a light transmitting conductive film or the like is formed on the image receiving sheet. A conductive film is formed. This is a so-called separate type in which the image receiving sheet is peeled off from the photosensitive material.

  In either embodiment, either negative development processing or reversal development processing can be selected (in the case of the diffusion transfer method, negative development processing is possible by using an auto-positive type photosensitive material as the photosensitive material). .

  The chemical development, thermal development, dissolution physical development, and diffusion transfer development mentioned here have the same meanings as are commonly used in the industry, and are general textbooks of photographic chemistry such as Shinichi Kikuchi, “Photochemistry” (Kyoritsu Publishing) (Published in 1955), C.I. E. K. It is described in "The Theory of Photographic Processes, 4th ed." Edited by Mees (Mcmillan, 1977). Although this case is an invention related to liquid processing, a technique of applying a thermal development system as another development system can also be referred to. For example, the techniques described in Japanese Patent Application Laid-Open Nos. 2004-184893, 2004-334077, and 2005-010752, and Japanese Patent Application Nos. 2004-244080 and 2004-085655 can be applied. it can.

  Here, the configuration of each layer of the conductive sheet 10 according to the present embodiment will be described in detail below.

[Transparent substrate 12]
Examples of the transparent substrate 12 include a plastic film, a plastic plate, and a glass plate.

  Examples of the raw material for the plastic film and the plastic plate include polyethylene terephthalate (PET), polyesters including polyethylene naphthalate (PEN), polymethyl methacrylate (PMMA), polypropylene (PP), polystyrene (PS), and triacetyl cellulose. (TAC) or the like can be used.

  As the transparent substrate 12, a plastic film or a plastic plate having a melting point of about 290 ° C. or less is preferable, and PET is particularly preferable from the viewpoints of light transmittance, workability, and the like.

[Silver salt emulsion layer]
The silver salt emulsion layer to be the fine metal wires 16 of the first laminated portion 28a and the second laminated portion 28b contains additives such as a solvent and a dye in addition to the silver salt and the binder.

<1. Silver salt>
Examples of the silver salt used in the present embodiment include inorganic silver salts such as silver halide and organic silver salts such as silver acetate. In the present embodiment, it is preferable to use silver halide having excellent characteristics as an optical sensor.

Silver coating amount of silver salt emulsion layer (coating amount of silver salt) is preferably from 1 to 30 g / ^{m 2} in terms of silver, more preferably 1 to 25 g / ^{m 2,} more preferably 5 to 20 g / ^{m 2} . By setting the coated silver amount within the above range, a desired surface resistance can be obtained when the conductive sheet 10 is used.

<2. Binder>
Examples of the binder used in the present embodiment include gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), polysaccharides such as starch, cellulose and derivatives thereof, polyethylene oxide, polyvinylamine, chitosan, polylysine, and polyacryl. Examples include acid, polyalginic acid, polyhyaluronic acid, carboxycellulose and the like. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.

  The content of the binder contained in the silver salt emulsion layer of the present embodiment is not particularly limited, and can be appropriately determined within a range in which dispersibility and adhesion can be exhibited. The binder content in the silver salt emulsion layer is preferably ¼ or more, more preferably ½ or more in terms of the silver / binder volume ratio. The silver / binder volume ratio is preferably 100/1 or less, and more preferably 50/1 or less. The silver / binder volume ratio is more preferably 1/1 to 4/1. Most preferably, it is 1/1 to 3/1. By setting the silver / binder volume ratio in the silver salt emulsion layer within this range, even when the coating silver amount is adjusted, variation in the resistance value can be suppressed, and the conductive sheet 10 having a uniform surface resistance can be obtained. Note that the silver / binder volume ratio is obtained by converting the amount of silver halide / binder amount (weight ratio) of the raw material into the amount of silver / binder amount (weight ratio). / It can be determined by converting to the amount of binder (volume ratio).

<3. Solvent>
The solvent used for forming the silver salt emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethyl sulfoxide, etc. Sulphoxides such as, esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.

<4. Other additives>
There are no particular restrictions on the various additives used in the present embodiment, and known ones can be preferably used.

[First protective layer 26a, second protective layer 26b]
As the first protective layer 26 a and the second protective layer 26 b, a plastic film, a plastic plate, a glass plate, and the like can be used as in the transparent substrate 12. As raw materials for the plastic film and the plastic plate, for example, PET, PEN, PMMA, PP, PS, TAC and the like can be used.

  The thickness of the 1st protective layer 26a and the 2nd protective layer 26b does not have a restriction | limiting in particular, According to the objective, it can select suitably. For example, 5 to 100 μm is preferable, 8 to 50 μm is more preferable, and 10 to 30 μm is particularly preferable.

  Next, each step of the manufacturing method of the conductive sheet 10 will be described.

[exposure]
The present embodiment includes a case where the first conductive portion 14a, the second conductive portion 14b, the first dummy electrode portion 15a, and the like are applied by a printing method, but the first conductive portion 14a and the second conductive portion are other than the printing method. 14b and the first dummy electrode portion 15a are formed by exposure and development. That is, exposure is performed on a photosensitive material having a silver salt-containing layer provided on the transparent substrate 12 or a photosensitive material coated with a photopolymer for photolithography. The exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-rays. Furthermore, a light source having a wavelength distribution may be used for exposure, or a light source having a specific wavelength may be used.

[Development processing]
In this embodiment, after the emulsion layer is exposed, development processing is further performed. The development processing can be performed by a normal development processing technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like.

  The development processing in the present invention can include a fixing processing performed for the purpose of removing and stabilizing the silver salt in the unexposed portion. For the fixing process in the present invention, a fixing process technique used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.

  The light-sensitive material that has been subjected to development and fixing processing is preferably subjected to water washing treatment or stabilization treatment.

  The mass of the metallic silver part contained in the exposed part after the development treatment is preferably a content of 50% by mass or more with respect to the mass of silver contained in the exposed part before the exposure, and is 80% by mass or more. More preferably it is. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.

  The conductive sheet 10 is obtained through the above steps. The conductive sheet 10 after the development process may be further subjected to a calendar process, and can be adjusted to a desired surface resistance by the calendar process. The resulting conductive sheet 10 has a surface resistance of 0.1 to 300 ohm / sq. It is preferable that it exists in the range.

  The surface resistance varies depending on the use of the conductive sheet 10. For example, in the case of a touch panel application, 1 to 70 ohm / sq. It is preferable that it is 5-50 ohm / sq. More preferably, it is 5-30 ohm / sq. More preferably. In the case of electromagnetic wave shielding use, 10 ohm / sq. Or less, preferably 0.1 to 3 ohm / sq. It is more preferable that

[Physical development and plating]
In the present embodiment, for the purpose of improving the conductivity of the metallic silver portion formed by the exposure and development processing, physical development and / or plating treatment for supporting the conductive metal particles on the metallic silver portion is performed. May be. In the present invention, the conductive metal particles may be supported on the metallic silver portion by only one of physical development and plating treatment, or the conductive metal particles are supported on the metallic silver portion by combining physical development and plating treatment. Also good. In addition, the thing which performed the physical development and / or the plating process to the metal silver part is called "conductive metal part".

  “Physical development” in the present embodiment means that metal particles such as silver ions are reduced by a reducing agent on metal or metal compound nuclei to deposit metal particles. This physical phenomenon is used for instant B & W film, instant slide film, printing plate manufacturing, and the like, and the technology can be used in the present invention. Further, the physical development may be performed simultaneously with the development processing after exposure or separately after the development processing.

  In the present embodiment, the plating treatment can use electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating. For the electroless plating in the present embodiment, a known electroless plating technique can be used, for example, an electroless plating technique used in a printed wiring board or the like can be used. Plating is preferred.

  In the method for manufacturing the conductive sheet 10 according to the present embodiment, it is not always necessary to perform a process such as plating. This is because, in this production method, a desired surface resistance can be obtained by adjusting the amount of silver coated on the silver salt emulsion layer and the silver / binder volume ratio.

[Oxidation treatment]
In the present embodiment, it is preferable to subject the metallic silver portion after the development treatment and the conductive metal portion formed by physical development and / or plating treatment to oxidation treatment. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light transmissive portion, the metal can be removed and the light transmissive portion can be made approximately 100% transparent.

[Hardening after development]
It is preferable to perform a film hardening process by immersing the film in a hardener after the silver salt emulsion layer is developed. Examples of the hardener include dialdehydes such as glutaraldehyde, adipaldehyde, 2,3-dihydroxy-1,4-dioxane, and those described in JP-A-2-141279 such as boric acid. it can.

  The conductive sheet 10 according to the present embodiment may be provided with a functional layer such as an antireflection layer or a hard coat layer.

[Calendar processing]
The developed silver metal portion may be smoothed by calendaring. This significantly increases the conductivity of the metallic silver part. The calendar process can be performed by a calendar roll. The calendar roll usually consists of a pair of rolls.

As a roll used for the calendar process, a plastic roll or a metal roll such as epoxy, polyimide, polyamide, polyimide amide or the like is used. In particular, when emulsion layers are provided on both sides, it is preferable to treat with metal rolls. When an emulsion layer is provided on one side, a combination of a metal roll and a plastic roll can be used from the viewpoint of preventing wrinkles. The upper limit of the linear pressure is 1960 N / cm (200 kgf / cm, converted to surface pressure) of 699.4 kgf / cm ² or more, more preferably 2940 N / cm (300 kgf / cm, converted to surface pressure, 935.8 kgf / cm ^2). ) That's it. The upper limit of the linear pressure is 6880 N / cm (700 kgf / cm) or less.

  The application temperature of the smoothing treatment represented by the calender roll is preferably 10 ° C. (no temperature control) to 100 ° C., and the more preferable temperature varies depending on the line density and shape of the metal mesh pattern and metal wiring pattern, and the binder type. , Approximately 10 ° C. (no temperature control) to 50 ° C.

[Lamination process]
In order to protect the first sensor unit 60a and the second sensor unit 60b, a protective layer may be formed on the silver salt emulsion layer. By providing the first adhesive layer 24a (or the second adhesive layer 24b) between the protective layer and the silver salt emulsion layer, the adhesiveness can be adjusted.

  Examples of the material of the first adhesive layer 24a and the second adhesive layer 24b include a wet laminate adhesive, a dry laminate adhesive, or a hot melt adhesive. In particular, a dry laminating adhesive having a wide variety of materials that can be bonded and having a high bonding speed is preferable. Specifically, an amino resin adhesive, a phenol resin adhesive, a chloroprene rubber adhesive, a nitrile rubber adhesive, an epoxy adhesive, a urethane adhesive, a reactive acrylic adhesive, or the like can be used as the dry laminate adhesive. . Among them, it is preferable to use OCA (Optical Clear Adhesive; registered trademark) manufactured by Sumitomo 3M Limited, which is an acrylic low acid value adhesive.

  The drying conditions are preferably 1 to 30 minutes under a temperature environment of 30 to 150 ° C. The drying temperature is particularly preferably 50 to 120 ° C.

  Further, in place of the above-described adhesive layer, the interlayer adhesive force can be adjusted by surface-treating at least one of the transparent substrate 12 and the protective layer. In order to increase the adhesive strength with the silver salt emulsion layer, for example, corona discharge treatment, flame treatment, ultraviolet irradiation treatment, high frequency irradiation treatment, glow discharge irradiation treatment, active plasma irradiation treatment, laser beam irradiation treatment, etc. may be performed. .

  In addition, this invention can be used in combination with the technique of the publication | presentation gazette and international publication pamphlet which are described in following Table 1 and Table 2 suitably. Notations such as “JP,” “Gazette” and “No. Pamphlet” are omitted.

  Hereinafter, the present invention will be described more specifically with reference to examples of the present invention. In addition, the material, usage-amount, ratio, processing content, processing procedure, etc. which are shown in the following Examples can be changed suitably unless it deviates from the meaning of this invention. Accordingly, the scope of the present invention should not be construed as being limited by the specific examples shown below.

  In this example, for the conductive sheets 10 according to Examples 1 to 7 and Reference Examples 1 and 2, the visibility (noise granularity) and the luminance change rate in the display device 40 incorporating them were evaluated.

<Examples 1 to 7, Reference Examples 1 and 2>
(Silver halide photosensitive material)
An emulsion containing 10.0 g of gelatin per 150 g of Ag in an aqueous medium and containing silver iodobromochloride grains having an average equivalent sphere diameter of 0.1 μm (I = 0.2 mol%, Br = 40 mol%) was prepared. .

In this emulsion, K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ were added so as to have a concentration of 10 ⁻⁷ (mol / mol silver), and silver bromide grains were doped with Rh ions and Ir ions. . After adding Na ₂ PdCl ₄ to this emulsion and further performing gold-sulfur sensitization using chloroauric acid and sodium thiosulfate, together with the gelatin hardener, the coating amount of silver was 10 g / m ^2. It was coated on a transparent substrate (here, polyethylene terephthalate (PET) having a refractive index n0 = 1.64). At this time, the volume ratio of Ag / gelatin was 2/1.

  The film was coated on a PET support having a width of 300 mm by 20 mm in a width of 250 mm, and both ends were cut off by 30 mm so as to leave a central portion of the coating width of 240 mm, thereby obtaining a roll-shaped silver halide photosensitive material.

(Create exposure pattern)
Using the SA method (see FIG. 16 and the like) described in the present embodiment, output image data ImgOut representing the mesh pattern 20 (see FIG. 1) in which the polygonal mesh shape 22 is spread is created.

The setting conditions of the mesh pattern 20 were an overall transmittance of 93%, a thickness of the transparent substrate 12 of 20 μm, a width of the fine metal wire 16 of 20 μm, and a thickness of the fine metal wire 16 of 10 μm. The size of the planar region 100 was 5 mm both vertically and horizontally, and the image resolution was 3500 dpi (dot per inch). The initial position of the seed point SD was randomly determined using a Mersenne twister, and each polygonal mesh shape 22 was determined according to a Voronoi diagram. The evaluation value EVP was calculated based on the color value L ^* , the color value a ^* , and the color value b ^* of the image data Img. Then, similarly to the case of FIG. 22, the output image data ImgOut is regularly arranged to form an exposure pattern having a repetitive shape.

  First, the radio button 462b is selected on the setting screen 460 of FIG. 12, the “presence / absence of matrix” is set to “none”, and output image data ImgOut is created. As a result, output image data ImgOut representing the mesh pattern 20 shown in FIG. 14A was obtained.

  On the other hand, the setting conditions of the black matrix 34 were an optical density of 4.5D, a vertical size and a horizontal size of the pixel 32 of 200 μm, and a vertical grid line width and a horizontal grid line width of 20 μm.

  Secondly, the radio button 462a is selected on the setting screen 460 of FIG. 12, the “presence / absence of matrix” is set to “present”, and output image data ImgOut is created. As a result, output image data ImgOut representing the mesh pattern 232 shown in FIG. 42 was obtained.

  Next, as shown in FIGS. 28A and 28B, by cutting out the output image data ImgOut, a first exposure pattern composed of a region excluding the first region R1 and a second exposure pattern composed of the second region R2 are respectively obtained. Created.

(exposure)
Exposure was performed on both sides of the transparent substrate 12 having an A4 size (210 mm × 297 mm). The exposure uses parallel light using a high-pressure mercury lamp as a light source through the photomask of the first exposure pattern (corresponding to the first conductive portion 14a side) and the second exposure pattern (corresponding to the second conductive portion 14b side). And exposed. In addition, in order to produce the conductive sheets 10 of Examples 1 to 6 and Reference Examples 1 and 2, exposure patterns corresponding to the mesh pattern 20 were used. Moreover, in order to produce the conductive sheet 10 of Example 7, an exposure pattern corresponding to the mesh pattern 232 was used.

(Development processing)
・ Developer 1L formulation Hydroquinone 20 g
Sodium sulfite 50 g
Potassium carbonate 40 g
Ethylenediamine tetraacetic acid 2 g
Potassium bromide 3 g
Polyethylene glycol 2000 1 g
Potassium hydroxide 4 g
Adjusted to pH 10.3 and formulated 1L fixer ammonium thiosulfate solution (75%) 300 ml
Ammonium sulfite monohydrate 25 g
1,3-diaminopropane tetraacetic acid 8 g
Acetic acid 5 g
Ammonia water (27%) 1 g
Adjusted to pH 6.2 Processed photosensitive material using the above processing agent using Fujifilm's automatic processor FG-710PTS Processing conditions: development 35 ° C. for 30 seconds, fixing 34 ° C. for 23 seconds, washed water (5 L / Min) for 20 seconds.

(Lamination process)
A first protective layer 26a and a second protective layer 26b made of the same material were attached to both surfaces of the developed photosensitive material. As will be described later, a protective film having a different refractive index n1 was used for each sample of the conductive sheet 10. Moreover, as the 1st contact bonding layer 24a and the 2nd protective layer 26b (refer FIG. 2), the commercially available adhesive tape (NSS50-1310; Shin-Tac Kasei Co., Ltd. make, thickness 50 micrometers) was used. And after sticking the 1st protective layer 26a and the 2nd protective layer 26b, in order to prevent generation | occurrence | production of a bubble, it heated for 20 minutes in 0.5 atmosphere and 40 degreeC environment, and performed the autoclave process.

  For convenience of evaluation, the first protective layer 26a in which a part of the sheet was cut out was used. That is, the difference between the case where the first protective layer 26a is formed (refractive index n1) and the case where the first protective layer 26a is not formed (air layer having a refractive index of 1.00) can be viewed at a time. Hereinafter, the display location corresponding to the cutout portion of the first protective layer 26a is referred to as A region, and the remaining display location is referred to as B region.

Example 1
A conductive sheet 10 according to Example 1 was manufactured using polychlorotrifluoroethylene (PCTTE) having a refractive index n1 = 1.42 as the first protective layer 26a. In this case, the relative refractive index nr1 is nr1 = (1.42 / 1.64) = 0.86.

(Example 2)
A conductive sheet 10 according to Example 2 was produced using polymethyl methacrylate (PMMA) having a refractive index n1 = 1.50 as the first protective layer 26a. In this case, the relative refractive index nr1 is nr1 = (1.50 / 1.64) = 0.91.

(Example 3, Example 7)
A conductive sheet 10 according to Example 3.7 was manufactured using polystyrene (PS) having a refractive index n1 = 1.60 as the first protective layer 26a. In this case, the relative refractive index nr1 is nr1 = (1.60 / 1.64) = 0.97.

Example 4
A conductive sheet 10 according to Example 4 was produced using polythiourethane (PTU) having a refractive index n1 = 1.70 as the first protective layer 26a. In this case, the relative refractive index nr1 is nr1 = (1.70 / 1.64) = 1.03.

(Example 5)
A conductive sheet 10 according to Example 5 was fabricated using high refractive index glass having a refractive index n1 = 1.78 as the first protective layer 26a. In this case, the relative refractive index nr1 is nr1 = (1.78 / 1.64) = 1.08.

(Example 6)
A conductive sheet 10 according to Example 6 was produced using an ultrahigh refractive index glass having a refractive index n1 = 1.90 as the first protective layer 26a. In this case, the relative refractive index nr1 is nr1 = (1.90 / 1.64) = 1.15.

(Reference Example 1)
A conductive sheet according to Reference Example 1 was prepared using tetrafluoroethylene (FEP) having a refractive index n1 = 1.34 as the first protective layer. In this case, the relative refractive index n12 is nr1 = (1.34 / 1.64) = 0.81.

(Reference Example 2)
A conductive sheet according to Reference Example 2 was prepared using an ultrahigh refractive index glass having a refractive index n1 = 1.98 as the first protective layer. In this case, the relative refractive index nr1 is nr1 = (1.98 / 1.64) = 1.20.

[Evaluation]
Each sample according to Examples 1 to 7 and Reference Examples 1 and 2 was pasted on the display screen of the display unit 30. As the display unit 30, a commercially available color liquid crystal display (screen size 11.6 type, 1366 × 768 dots, pixel pitch is about 192 μm in both vertical and horizontal directions) was used.

(Noise granularity)
Under the condition that the display unit 30 is controlled to display white (maximum luminance), the three researchers conducted sensory evaluations of noise granularity (roughness). In the evaluation this time, the noise noise feeling due to the mesh shape 22 and the color noise feeling due to the sub-pixel structure are comprehensively taken into account and converted into a numerical value. The observation distance from the display screen was set to 300 mm, and the room illuminance was set to 300 lx.

  In this sensory evaluation, a comparative observation was performed on the visual recognition result in the A region (display region where the first protective layer 26a is not formed). Specifically, with respect to the A area, 5 points when the noise granularity in the B area is remarkably improved, 4 points when the noise is improved, 3 points when there is no change, 2 points when the noise is deteriorated, When it deteriorated remarkably, it set to 1 point, respectively. And the average value of the score by each researcher was made into the evaluation value of a noise granular feeling.

(Brightness change rate)
The luminance on the display screen was measured in a state where the display unit 30 was controlled to display white (maximum luminance). As the luminance meter, LS-100 (manufactured by Konica Minolta) was used. The measurement distance from the display screen was set to 300 mm, the measurement angle was set to 2 °, and the room illuminance was set to 1 lx or less.

When the luminance in the A area is La [cd / m ² ] and the luminance in the B area is Lb [cd / m ² ], the luminance change rate (unit:%) is 100 × (Lb−La) / La. Calculated. In consideration of in-plane uniformity, the measurement position in the B region was set near the boundary of the A region.

[result]
(Noise granularity)
[1] Regarding the visibility between different patterns, in both Examples 3 and 7, the noise sensation did not become obvious, it was at a level that could be sufficiently put into practical use as a transparent electrode, and the translucency was also good. In particular, it was confirmed that Example 7 was less noticeable than Example 3.

  Furthermore, when a transparent plate was used instead of the liquid crystal panel and the light was observed through the backlight and the same visual evaluation was performed, it was confirmed that Example 3 was less noticeable than Example 7. confirmed. That is, it was proved that the patterns of the mesh patterns 20 and 232 were optimized according to the visual recognition mode of the conductive sheet 10, specifically, the presence or absence of a color filter such as the red subpixel 32r and the black matrix 34.

  [2] As shown in FIG. 43, the evaluation values of Examples 1 to 6 and Reference Examples 1 and 2 all exceed 3, and the effect of reducing noise granularity can be obtained by eliminating the air layer. It was. Among them, the evaluation values for Examples 1 to 6 all exceeded 4, and a remarkable effect was observed as compared with Reference Examples 1 and 2. That is, when the relative refractive index nr1 satisfies the relationship of 0.86 ≦ nr1 ≦ 1.15, it was concluded that noise granularity can be suppressed.

(Rate change rate)
As shown in Table 3, the luminance change rate of each of Examples 1 to 6 and Reference Examples 1 and 2 is a positive value, and the luminance on the display screen is improved by eliminating the air layer (air gap). .

  Among them, the rate of change in luminance for each of Examples 2 to 5 exceeded 20%, and compared to Examples 1 and 6, etc., a difference that was visually identifiable was observed. That is, when the relative refractive index nr1 satisfies the relationship of 0.91 ≦ nr1 ≦ 1.08, it was possible to further improve the display luminance.

[Supplemental explanation]
In addition to the examples described above, the following findings were obtained as a result of various changes in the production conditions of the conductive sheet 10 and similar evaluations.

(1) The material of the transparent substrate 12 is not limited to PET, and similar experimental results were obtained regardless of the material within the range satisfying the relationship of the above-described relative refractive indexes nr1 and nr2. Further, even when the second protective layer 26b is made of a material different from that of the first protective layer 26a, the same is true as long as the above relationship is satisfied.

(2) The effect of reducing the noise granularity was obtained by setting one of the relative refractive indexes nr1 and nr2 to 0.86 or more and 1.15 or less. And the remarkable reduction effect was acquired by making both relative refractive index nr1 and nr2 into 0.86 or more and 1.15 or less.

(3) By setting one of the relative refractive indexes nr1 and nr2 to 0.91 or more and 1.08 or less, an effect of improving the amount of light radiated to the outside through the display screen, that is, display luminance was obtained. . And the remarkable reduction effect was acquired by making both relative refractive index nr1 and nr2 into 0.91 or more and 1.08 or less.

(4) Even when the conductive sheet 10 was arranged in a state where the front and back sides were reversed, an evaluation result substantially similar to the above was obtained.

  In addition, this invention is not limited to embodiment mentioned above, Of course, it can change freely in the range which does not deviate from the main point of this invention.

  The pattern material is not limited to the black matrix 34, and it goes without saying that the present invention can be applied to various structural pattern shapes according to various uses.

10, 210, 220, 230 ... conductive sheet 12 ... transparent substrate 12a, 170a ... first transparent substrate 12b, 170b ... second transparent substrate 14a ... first conductive portion 14b ... second conductive portion 16 (p, q, r, s) ... fine metal wire 18 ... opening 20, 232 ... mesh pattern 22 ... mesh shape 26a ... first protective layer 26b ... second protective layer 28a ... first laminated part 28b ... second laminated part 30 ... display unit 32 ... pixel 40 ... Display device 44, 160 ... Touch panel 70a, 176a, 192a ... 1st conductive pattern 70b, 176b, 192b ... 2nd conductive pattern 72a ... 1st sensing part 72b ... 2nd sensing part 78a ... 1st mesh element 78b ... 1st 2 mesh elements 82 ... polygon 90 ... unit area 100 ... plane area 310 ... manufacturing apparatus 312 ... image generation apparatus 328 ... initial position selection unit 30 ... update candidate position determination unit 332 ... image cutting unit 336 ... image information estimation unit 338 ... image data generating unit 402 ... evaluation value calculation section 416 ... output image data determining section

Claims (26)

A selection step of selecting a plurality of positions from a predetermined two-dimensional image region;
A creation step of creating image data representing a pattern of the mesh pattern based on the selected plurality of positions;
A calculation step for calculating an evaluation value quantified for noise characteristics of the mesh pattern based on the created image data;
A determining step of determining one piece of the image data as output image data based on the calculated evaluation value and a predetermined evaluation condition;
An image cut-out step of cutting out first image data representing a pattern on one main surface side of the substrate from the determined output image data and cutting out second image data representing a pattern on the other main surface side of the substrate When,
A wire is output on one main surface side of the base based on the cut out first image data, and a wire is output on the other main surface side of the base based on the cut out second image data. An output step of obtaining a conductive sheet in which the mesh pattern is formed on the substrate in plan view. In the manufacturing method of Claim 1,
First input for inputting visual information of the pattern material related to the visibility of the structural pattern when a pattern material forming a structural pattern having a pattern different from the pattern of the mesh pattern is visually recognized by being superimposed on the conductive sheet Steps,
A first estimation step of estimating image information of the structural pattern based on the input visual recognition information of the pattern material, and
In the creating step, the image data representing a pattern in which the structural pattern is superimposed on the mesh pattern is created based on the estimated image information of the structural pattern. In the manufacturing method of Claim 2,
The visual information of the pattern material includes at least one of the type, color value, light transmittance or light reflectance of the pattern material, or the arrangement position, unit shape or unit size of the structural pattern. A method for producing a conductive sheet. In the manufacturing method of Claim 2 or 3,
The method for producing a conductive sheet, wherein the pattern material is a black matrix. In the manufacturing method of any one of Claims 1-4,
A second input step of inputting visual information of the wire and / or the substrate related to the visibility of the mesh pattern;
A second estimation step of estimating image information of the mesh pattern based on the input visual information of the wire and / or the base body, and
In the creating step, the image data is created based on the estimated image information of the mesh pattern. In the manufacturing method of any one of Claims 1-5,
The said evaluation value is an evaluation value showing granularity, The manufacturing method of the electrically conductive sheet characterized by the above-mentioned. In the manufacturing method of Claim 6,
The said evaluation value is RMS granularity, The manufacturing method of the electrically conductive sheet characterized by the above-mentioned. In the manufacturing method of Claim 6,
The evaluation value is an RMS granularity corrected by a human visual response characteristic function. The manufacturing method according to claim 8, wherein
The method of manufacturing a conductive sheet, wherein the human visual response characteristic function is a Dooley show function. In the manufacturing method of Claim 8 or 9,
The corrected RMS granularity is an RMS granularity calculated using new image data obtained by applying a filtering process corresponding to the human visual response characteristic function to the image data. The manufacturing method of the electrically conductive sheet characterized by these. In the manufacturing method of any one of Claims 1-10,
An update step of updating each of the plurality of positions to another position based on the evaluation value is further provided,
The method for producing a conductive sheet, wherein the updating step, the creating step, and the calculating step are sequentially repeated, and the output image data is determined by the determining step. The manufacturing method according to claim 11, wherein
In the update step, a part of the plurality of positions is updated to another position by using a simulated annealing method, respectively. In the manufacturing method of any one of Claims 1-12,
In the creating step, image data representing a mesh pattern in which different mesh shapes are arranged without gaps is created. The manufacturing method according to claim 13, wherein
The method for manufacturing a conductive sheet, wherein the mesh shape is a polygonal shape. The manufacturing method according to claim 14, wherein
Each mesh shape is determined from the plurality of positions according to a Voronoi diagram. The manufacturing method according to claim 14 or 15,
Regarding the histogram of the number of vertices in the mesh shape, the ratio of polygons having the highest number of vertices is 40 to 70%. It is the electrically conductive sheet manufactured using the manufacturing method of any one of Claims 1-16,
A substrate;
A first conductive portion formed on one main surface side of the base body and made of a plurality of fine metal wires;
A second conductive portion formed on the other main surface side of the base body and made of a plurality of fine metal wires;
Have
By combining the first conductive part and the second conductive part, the mesh pattern is formed in a plan view. The conductive sheet according to claim 17,
The conductive sheet includes a plurality of first conductive patterns arranged in one direction, each having a plurality of first conductive patterns connected to the plurality of first sensing units. The conductive sheet according to claim 18, wherein
The conductive sheet is characterized in that the mesh pattern has a repeated shape. The conductive sheet according to claim 19,
Each of the first conductive patterns is formed to be inclined by a predetermined angle with respect to the arrangement direction of the repetitive shape. The conductive sheet according to claim 19 or 20,
The conductive sheet is characterized in that a size of the repetitive shape is larger than a size of each of the first sensing parts. In the conductive sheet according to any one of claims 18 to 21,
A first dummy electrode portion formed of a plurality of thin metal wires formed on the one main surface and electrically insulated from the first conductive portion;
The first dummy electrode portion has a plurality of first dummy patterns arranged in a gap portion between the adjacent first conductive patterns,
The conductive sheet, wherein a wiring density of the first dummy pattern is equal to a wiring density of the first conductive pattern. In the electrically conductive sheet of any one of Claims 17-22,
A first protective layer provided on the one main surface and covering the first conductive portion;
A second protective layer provided on the other main surface and covering the second conductive portion;
Further comprising
The conductive sheet according to claim 1, wherein a relative refractive index of the substrate with respect to the first protective layer and / or a relative refractive index of the substrate with respect to the second protective layer is 0.86 to 1.15. The conductive sheet according to any one of claims 17 to 23,
A touch panel comprising: a detection control unit configured to detect a contact position or a proximity position from the main surface side of the conductive sheet. The conductive sheet according to any one of claims 17 to 23,
A detection control unit for detecting a contact position or a proximity position from the main surface side of the conductive sheet;
A display unit for displaying an image on a display screen based on a display signal,
The display device, wherein the conductive sheet is arranged on the display screen with a surface opposite to the main surface facing the display unit. A program for creating image data for outputting and forming a wire on a substrate,
Computer
A position selection unit for selecting a plurality of positions from a predetermined two-dimensional image region;
An image data creation unit that creates image data representing a pattern of a mesh pattern based on the plurality of positions selected by the position selection unit;
Based on the image data created by the image data creation unit, an evaluation value calculation unit that calculates an evaluation value quantified for the noise characteristics of the mesh pattern,
A data determining unit that determines one piece of the image data as output image data based on the evaluation value calculated by the evaluation value calculating unit and a predetermined evaluation condition;
A first image data representing a pattern on one principal surface side of the substrate is cut out from the output image data determined by the data determination unit, and a second image representing a pattern on the other principal surface side of the substrate. A program that functions as an image cutout unit that cuts out data.

Images