JP2012234898A - Electronic circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit module the yield of manufacturing process of which can be enhanced.SOLUTION: In the electronic circuit module 15 having a substrate 2, a recess 5 formed in the surface of the substrate 2, a light-emitting element 16 arranged in the recess 5, and a fluorescent paint 17 filling the recess 5 to cover the light-emitting element 16, a protrusion 10 is provided on the surface of the substrate 2 so as to protrude from the surface of the substrate 2 toward the recess 5. With such a configuration, the yield of manufacturing process of the electronic circuit module can be enhanced.

Description

  The present invention relates to an electronic circuit module, and more particularly to an electronic circuit module using a light emitting element (for example, LED = Light Emitting Diode, light emitting diode).

  As a conventional electric circuit module, a substrate having a recess is used, and a light emitting element (for example, LED = Light Emitting Diode) is disposed in the recess of the substrate, and the entire recess is filled with phosphor paint. An electronic circuit module is described (for example, a similar technique is described in Patent Document 1).

JP 2009-272612 A

  In an electronic circuit module using a conventional substrate, in the manufacturing process, after filling the concave portion with the phosphor paint, the phosphor paint flows out from the inside of the concave portion to the outside of the concave portion due to surface tension after a lapse of several hours. The height of the phosphor coating from the light emitting surface will fluctuate. The wavelength of light emitted from the electronic circuit module depends on the height of the phosphor coating from the light emitting surface of the light emitting element, and if the height of the phosphor coating from the light emitting surface of the light emitting element fluctuates, The wavelength of the light output from the circuit module will fluctuate.

  That is, in the manufacturing process (phosphor paint application process) of an electronic circuit module using a conventional substrate, the phosphor paint flows out from the inside of the recess to the outside of the recess. As a result, there is a problem of reducing the yield in the manufacturing process of the electronic circuit module.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve this problem and improve the yield of the manufacturing process of the electronic circuit module.

  In order to achieve this object, the present invention covers a substrate portion, a recess formed in the surface of the substrate portion, a light emitting element disposed inside the recess, and the light emitting element in the recess. An electronic circuit module comprising: a phosphor coating material filled with a protrusion formed on the surface of the substrate portion from the surface of the substrate portion toward the recess. A circuit module was obtained.

  This achieves the intended purpose.

  As described above, the present invention provides a substrate portion, a recess formed on the surface of the substrate portion, a light emitting element disposed inside the recess, and a fluorescent material filled so as to cover the light emitting element in the recess. In the electronic circuit module having a body paint, an electronic circuit module characterized in that a protrusion formed from the surface of the substrate portion toward the recess is provided on the surface of the substrate portion. The yield of the manufacturing process of the electronic circuit module using the substrate can be improved.

  That is, in the present invention, a protrusion formed from the surface of the substrate portion toward the recess is provided on the surface of the substrate portion, whereby an electronic circuit module manufacturing process (particularly, the recess to the recess is formed). In the phosphor coating application step), the phosphor paint is prevented from leaking out (flowing out) from the inside of the recess, and at the same time, the height of the phosphor paint from the light emitting surface of the light emitting element is set. Can be constant. That is, the fluctuation of the wavelength and the amount of light output from the electronic circuit module due to the fluctuation of the height of the phosphor paint from the light emitting surface of the light emitting element can be reduced, and as a result, the electronic circuit The color (corresponding to the wavelength) and the amount of light output from the module can be made desired, and the yield of the manufacturing process of the ceramic multilayer substrate can be improved.

1A and 1B are cross-sectional views of a substrate according to Embodiment 1 of the present invention, in which FIG. 1A is a cross-sectional view, and FIG. 1B is an enlarged cross-sectional view of a region A in FIG. FIG. 2A is a cross-sectional view of an electronic circuit module when a conventional substrate is used, and FIG. 2B is a cross-sectional view of the electronic circuit module according to Embodiment 1 of the present invention. Sectional view of the electronic circuit module

Embodiments of the present invention will be described below in detail with reference to the drawings, but these embodiments do not limit the present invention.
(Embodiment 1)
First, the configuration of the substrate in the first embodiment of the present invention will be described.

  FIG. 1 shows a cross-sectional view of a substrate according to Embodiment 1 of the present invention. FIG. 1 (a) is a cross-sectional view, and FIG. 1 (b) is an enlarged cross-sectional view of a region A in FIG. Is shown.

  As shown in FIG. 1, the substrate 1 fires a plurality of (specifically, a total of six sheets as described later in this embodiment) ceramic green sheets (corresponding to green sheets 11a and 11b described later). The substrate portion 2 formed in this manner, the internal wiring portion 3 formed in the substrate portion 2, the via 4, the recess portion 5 provided on the surface of the substrate portion 2, and the recess portion 5. In addition, it has an external terminal 7 that is electrically connected to the internal wiring portion 3 and the via 4 and for connecting an electronic component 6 (shown in FIG. 2 described later).

  Further, as shown in FIGS. 1A and 1B, a first metal portion 8 is formed on the surface of the substrate portion 2, and a second metal portion 9 is formed on the surface of the first metal portion. Has been. Here, the second metal portion 9 has a protruding portion 10 formed from the surface of the substrate portion 2 toward the concave portion 5. The first metal portion 8 and the second metal portion 9 serve as external electrode portions and electronic circuit pattern wiring for mounting a desired electronic component (for example, an IC chip) on the substrate 1. .

  Here, in the present embodiment, the substrate portion 2 and the concave portion 5 formed on the surface thereof will be described again later. In both cases, the alumina powder is 55 wt% and the glass powder is 45 wt%. A glass-ceramic composition blended at a ratio of 2 to 5 so that a plurality of (at least two) green sheets having a sheet-like shape are laminated, pressed, and then fired at 900 [° C.]. Formed by. In the substrate portion 2 of the present embodiment, as shown in FIG. 1, three simple sheet-like green sheets 11a are formed, and a green sheet in which holes for forming the recesses 5 are previously formed. 11b was laminated and then fired.

In the present embodiment, the via 4 in the substrate unit 2 is formed with a hole in advance in the green sheet before firing, for example, by an NC punch press (Numerical Control punch press), and then the hole The conductive paste is filled, and the ceramic sheet is fired at the same time when the ceramic sheet is fired. In the present embodiment, a conductive paste containing silver (Ag) particles and a glass component was used.
Further, in the present embodiment, the internal wiring portion 3 inside the substrate portion 2 is formed by printing in a desired pattern in advance using a screen printing method on the green sheet before firing, and then the ceramic described above. It is formed by firing at the same time when firing the sheet. In the present embodiment, a conductive paste containing silver (Ag) particles and a glass component is used.

  In the present embodiment, the external terminals 7 of the substrate unit 2 are formed by printing in a desired pattern using a screen printing method on the green sheet before firing, and then firing the ceramic sheet. It is formed by firing at the same time. In the present embodiment, a conductive paste containing silver (Ag) particles and a glass component is used.

  In the present embodiment, the first metal layer 8 is printed on the green sheet before firing in a desired pattern using a screen printing method in advance, like the external terminal 7 described above. After the formation, the ceramic sheet is fired at the same time as firing. In the present embodiment, a conductive paste containing silver (Ag) particles and a glass component is used.

  In the present embodiment, the second metal layer 9 is formed of copper (Cu) by an electroplating method which is a kind of wet plating method, and its film thickness is 50 [um]. The thickness of the second metal layer 9 can be appropriately determined with a film thickness between 5 [um] and 100 [um]. In the present embodiment, the thickness of the second metal layer 9 is 25 [um]. Formed.

  That is, as shown in FIG. 1B, the protrusion 10 in the present embodiment has a thickness (height of 25 [um] from the surface of the substrate portion 2 toward the recess 5 in FIG. 1B. Equivalent to B).

  In the present embodiment, the second metal layer 9 is made of copper (Cu) formed by electroplating, but in addition to this, gold (Au) or silver ( Ag) can also be used.

  The above is the configuration of the substrate 1 in the present embodiment.

  Next, the configuration of the electronic circuit module in the present embodiment will be described.

  2 shows a cross-sectional view of the electronic circuit module, FIG. 2 (a) shows a cross-sectional view of the electronic circuit module when a conventional substrate is used, and FIG. 2 (b) shows the present invention. 1 is a cross-sectional view of an electronic circuit module when using a substrate according to Embodiment 1. FIG.

  2A and 2B, the light emitting element 16 is electrically connected (mounted) to the external terminal 7 in the recess 5. Further, after the light emitting element 16 and the external terminal 7 are electrically connected (after mounting), a phosphor coating 17 is applied in the recess 5 so as to cover the light emitting element 16.

  Here, as shown in FIG. 2A, when a conventional substrate is used, the phosphor coating 17 may leak (flow out) to the outside due to surface tension or the like after being applied to the recess 5. In particular, as in this embodiment, when the substrate portion 2 is a material formed by firing a glass-ceramic composition containing alumina powder and glass powder, this phenomenon appears remarkably. is there.

On the other hand, as shown in FIG. 2B, in the electronic circuit module 15 of the present embodiment, the protrusion 10 is formed, and after the phosphor paint 17 is applied to the recess 5, the phosphor paint 17 is exposed from the recess 5 to the outside. It is configured to prevent leakage (flowing out).
Next, the light output from the electronic circuit module 15 having the light emitting element 16 covered with the phosphor paint 17 will be described.

  The wavelength and amount of light emitted from the electronic circuit module 15 are the height of the phosphor paint 17 from the light emitting surface 18 of the light emitting element 16 (C in FIG. 2A and D in FIG. 2B). If the height of the phosphor coating 17 from the light emitting surface 18 of the light emitting element 16 varies, the wavelength of the light output from the electronic circuit module 15 varies.

  That is, as shown in FIG. 2A, when a conventional substrate is used in an electronic circuit module using the light emitting element 16 covered with the phosphor paint 17, after the phosphor paint 17 is applied to the recess 5, Since the phosphor paint 17 leaks out (flows out) from the concave portion 5, the height of the phosphor paint 17 from the light emitting surface 18 of the light emitting element 16 becomes low (corresponding to C in FIG. 2A). . As a result, the wavelength and the amount of light output from the electronic circuit module fluctuate, and there is a problem in that a desired color (corresponding to the wavelength) and the amount of light are not output.

  However, in the present embodiment, by providing the protrusion 10 formed on the surface of the substrate portion 2 from the surface of the substrate portion 2 toward the recess 5, the manufacturing process of the electronic circuit module 15 (particularly, the recess) 5), the phosphor paint 17 is prevented from leaking (flowing out) from the inside of the recess 5 to the outside, and at the same time, the phosphor paint 17 from the light emitting surface 18 of the light emitting element 16 is prevented. The height can be made constant.

  That is, in the present embodiment, it is possible to reduce fluctuations in the wavelength and amount of light output from the electronic circuit module 15 due to fluctuations in the height of the phosphor paint 17 from the light emitting surface 18 of the light emitting element 16. Therefore, as a result, the color (corresponding to the wavelength) and the amount of light output from the electronic circuit module 15 can be made desired, and the yield of the manufacturing process of the ceramic multilayer substrate can be improved. .

  The above is the description of the electronic circuit module 15 in the present embodiment.

  Since the substrate according to the present invention can improve the yield of the manufacturing process of the electronic circuit module, it is particularly used as a substrate for LEDs for backlights for liquid crystal screens of liquid crystal televisions and mobile phones that have recently been widely used. That is a great expectation.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Board | substrate part 3 Internal wiring part 4 Via 5 Recessed part 7 External terminal 8 1st metal part 9 2nd metal part 10 Protrusion part 11a, 11b Green sheet 15 Electronic circuit module 16 Light emitting element 17 Phosphor paint 18 Light emitting surface

Claims (3)

A substrate section;
A recess formed in the surface of the substrate portion;
A light emitting element disposed inside the recess;
A phosphor coating filled to cover the light emitting element of the recess;
In an electronic circuit module having
Providing a protrusion formed on the surface of the substrate portion from the surface of the substrate portion toward the recess,
An electronic circuit module characterized by the above. The protrusion is copper formed by electroplating;
The electronic circuit module according to claim 4. The substrate portion is formed by firing a plurality of ceramic green sheets;
The electronic circuit module according to claim 5.

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