JP2012234021A - Proximity exposure apparatus, method for aligning proximity exposure apparatus, and method for manufacturing display panel substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten a tact time by quickly moving alignment marks of a substrate and an image acquisition device to positions relatively suited to an image recognition for each shot and quickly positioning a mask and the substrate.SOLUTION: In a first substrate, the position of a chuck after the alignment of the substrate and the position of each image acquisition device are stored for each shot as registered positions of the shot. In a second or later substrate, the chuck and each image acquisition device are moved for each shot to the registered positions of the shot by a stage and each moving mechanism so as to bring alignment marks of the mask and of the substrate into view of each image acquisition device. Based on the positions of the alignment marks of the mask and the positions of the alignment marks of the substrate detected by an image processing device, the chuck is moved by the stage so as to align the substrate.

Description

  The present invention relates to a proximity exposure apparatus that exposes a substrate using a proximity method in manufacturing a display panel substrate such as a liquid crystal display device, an alignment method for the proximity exposure apparatus, and a display panel substrate using the same. In particular, a proximity exposure apparatus that acquires an image of an alignment mark of a mask and a substrate by an image acquisition apparatus such as a CCD camera and aligns the mask and the substrate, and an alignment method for the proximity exposure apparatus And a method of manufacturing a display panel substrate using them.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  For example, in manufacturing a color filter substrate of a liquid crystal display device, a new pattern is exposed on a base pattern formed on a substrate, such as when a colored pattern is exposed on a black matrix formed on the substrate. In this case, it is necessary to accurately align the mask and the substrate so that the newly exposed pattern does not deviate from the base pattern. Conventionally, in the proximity method mainly used for exposure of a large substrate, a plurality of alignment marks are provided on the mask and the base pattern of the substrate, respectively, and the mask alignment mark and the alignment mark of the substrate are detected by an image acquisition device such as a CCD camera. Images were acquired, the positions of both were detected by image recognition, and the mask and substrate were aligned. As such a proximity exposure apparatus, there is one described in Patent Document 1.

  In recent years, in the manufacture of various substrates for display panels, a relatively large substrate is prepared in order to cope with an increase in size and a variety of sizes, and one or a plurality of substrates can be selected from one substrate depending on the size of the display panel. Manufactures display panel substrates. In this case, in the proximity method, if one surface of the substrate is to be exposed at once, a mask having the same size as the substrate is required, and the cost of the expensive mask is further increased. In view of this, the mainstream method is to use a mask that is relatively smaller than the substrate, move the substrate stepwise in the XY directions, and divide and expose one surface of the substrate into a plurality of shots.

JP 2007-256581 A

  When the substrate is moved stepwise in the X and Y directions and one surface of the substrate is divided into a plurality of shots for exposure, alignment between the mask and the substrate is performed for each shot. In the alignment of the mask and the substrate for each shot, in order to detect the position of the alignment mark on the mask and the position of the alignment mark on the substrate with high accuracy, an image acquisition device such as a CCD camera that acquires an image of the alignment mark is used. It is necessary to move to a position where an image suitable for image recognition can be acquired by a moving mechanism such as a ball screw and a motor.

  Since the position of the alignment mark on the substrate varies from shot to shot when the base pattern is formed, the position at which the image acquisition apparatus can acquire an image suitable for image recognition varies from shot to shot. In addition, if a high-magnification lens is used to increase the detection accuracy of the alignment mark position, the field of view of the image acquisition device is narrowed, and even if the image acquisition device is placed at the same position for each shot, the alignment mark on the substrate There are cases where it does not fall within the field of view of the image acquisition device. Therefore, it takes time to put the alignment mark of the mask and the substrate in the field of view of the image acquisition device for each shot, and to move the image acquisition device to a position where an image suitable for image recognition can be acquired. There was a problem of becoming longer.

  The problem of the present invention is that when the substrate is stepwise moved in the XY directions and one surface of the substrate is divided into a plurality of shots for exposure, the substrate alignment mark and the image acquisition device are relatively recognized for each shot. It is to move quickly to a suitable position, quickly align the mask and the substrate, and shorten the tact time. Another object of the present invention is to manufacture a display panel substrate with high throughput.

  The proximity exposure apparatus of the present invention includes a mask holder that holds a mask, a chuck that supports a substrate, and a stage that moves the chuck, and the chuck is moved by the stage to perform step movement of the substrate in the XY directions. In the proximity exposure apparatus that divides and exposes one surface of the substrate into a plurality of shots, a plurality of image acquisition devices that acquire images of a plurality of alignment marks provided on the mask and the substrate and output image signals, and A plurality of moving mechanisms for moving the image acquisition device, an image processing device for processing the image signal output by each image acquisition device to detect the position of the alignment mark, and a stage and each moving mechanism for each shot Move each image acquisition device to put the mask and substrate alignment marks in the field of view of each image acquisition device. And a control means for aligning the substrate by moving the chuck based on the position of the alignment mark on the mask and the position of the alignment mark on the substrate detected by the apparatus. For each shot, the position of the chuck after alignment of the substrate and the position of each image acquisition device are stored as registration positions for that shot, and the second and subsequent substrates are chucked by the stage and each moving mechanism for each shot. And each image acquisition apparatus is moved to the registration position about the shot, and the mask and the alignment mark of a board | substrate are put into the visual field of each image acquisition apparatus.

  Further, the proximity exposure apparatus alignment method of the present invention includes a mask holder for holding a mask, a chuck for supporting the substrate, and a stage for moving the chuck, and the chuck is moved by the stage in the XY direction of the substrate. Is a proximity exposure apparatus alignment method that performs exposure by dividing one surface of a substrate into a plurality of shots, acquiring images of a plurality of alignment marks provided on a mask and a substrate, and outputting an image signal. Provided are a plurality of image acquisition devices to output, a plurality of moving mechanisms for moving each image acquisition device, and an image processing device for processing the image signal output by each image acquisition device to detect the position of the alignment mark. On the first substrate, for each shot, the chuck and each image acquisition device are moved by the stage and each moving mechanism, and the mask is moved. The alignment mark of the substrate and the substrate is placed in the field of view of each image acquisition device, and the chuck is moved by the stage based on the position of the alignment mark of the mask detected by the image processing device and the position of the alignment mark of the substrate, thereby aligning the substrate. The position of the chuck after alignment of the substrate and the position of each image acquisition device are stored as registration positions for the shot, and in the second and subsequent substrates, for each shot, the chuck and each moving mechanism are stored by the stage and each moving mechanism. Move the image acquisition device to the registration position for that shot, put the mask and substrate alignment marks into the field of view of each image acquisition device, and the position of the mask alignment mark and the position of the substrate alignment mark detected by the image processing device The chuck is moved by the stage based on the substrate And it performs the alignment.

  On the first substrate, for each shot, the chuck and each image acquisition device are moved by the stage and each moving mechanism, the mask and the alignment mark of the substrate are placed in the field of view of each image acquisition device, and the image processing device detects Based on the position of the alignment mark on the mask and the position of the alignment mark on the substrate, the chuck is moved by the stage to align the substrate. When the alignment of the substrate is completed for each shot, the alignment mark on the substrate and each image acquisition device are relatively in a position suitable for image recognition. In the first substrate, for each shot, the position of the chuck after alignment of the substrate and the position of each image acquisition device are stored as registered positions for that shot, and in the second and subsequent substrates, for each shot, The chuck and each image acquisition device are moved to the registration position for the shot by the stage and each moving mechanism, and the alignment mark of the mask and the substrate is put in the field of view of each image acquisition device. Each time, the alignment mark of the substrate and the image acquisition device are quickly moved to a position relatively suitable for image recognition. Therefore, the alignment between the mask and the substrate is performed quickly, and the tact time is shortened.

  Furthermore, the proximity exposure apparatus of the present invention is equipped with a temperature adjustment device for adjusting the temperature of the substrate by mounting the substrate before being transferred to the chuck, and the substrate is transferred to the temperature adjustment device, and is transferred from the temperature adjustment device to the chuck. And a control means for storing the registration position for each shot on the first substrate, and then not exposing the shot. After storing the registration positions for all shots, the first substrate is returned to the temperature control device, and then the control means performs the same procedure for each shot for the first substrate as for the second and subsequent substrates. Alignment and exposure are performed.

  In addition, the alignment method of the proximity exposure apparatus of the present invention includes a temperature adjustment device that adjusts the temperature of the substrate by mounting the substrate before being transferred to the chuck, and transfers the substrate to the temperature adjustment device. A substrate transport device for transporting to the chuck is provided, and the registration position for each shot is stored for each shot in the first substrate, and then the registration positions for all shots are stored without performing exposure of that shot. Thereafter, the first substrate is returned to the temperature control device by the substrate transport device, and the first substrate is aligned and exposed in the same procedure as the second and subsequent substrates.

  In the first substrate, since it takes time to align the substrate with respect to each shot, when the exposure of the shot is performed after the alignment of the substrate, the temperature of the substrate at the time of exposure differs from the second and subsequent substrates, The exposure accuracy of the pattern is lowered, and a useless substrate that cannot be used as a product is generated. In the first substrate, for each shot, the registered position for the shot is stored, then the shot is not exposed, the registered positions for all shots are stored, and then the first substrate is transferred by the substrate transfer device. Is returned to the temperature control device, and the first substrate is aligned and exposed in the same procedure as the second and subsequent substrates, so the first substrate is the same as the second and subsequent substrates. Exposure is performed under temperature conditions, and a useless substrate that cannot be used as a product is not generated.

  Furthermore, the proximity exposure apparatus alignment method of the present invention restarts the supply of the second and subsequent substrates to the substrate transport apparatus after returning the first substrate to the temperature control apparatus by the substrate transport apparatus. is there. After the substrate supply is resumed, the substrate is transferred from the temperature adjustment device to the chuck in order from the first substrate, and the substrate is exposed by a first-in first-out (FIFO) method.

  The method for producing a display panel substrate according to the present invention exposes a substrate using any one of the above-described proximity exposure apparatuses, or alternatively uses the alignment method of any one of the above-described proximity exposure apparatuses to mask and the substrate. And the substrate is exposed. Since the alignment between the mask and the substrate is performed quickly and the tact time is shortened, the display panel substrate is manufactured with high throughput.

  According to the proximity exposure apparatus and the alignment method of the proximity exposure apparatus of the present invention, the position of the chuck after the alignment of the substrate and the position of each image acquisition apparatus are shot for each shot on the first substrate. In the second and subsequent substrates, for each shot, the stage and each moving mechanism move the chuck and each image acquisition device to the registration position for that shot, and the mask and substrate alignment marks By entering the field of view of each image acquisition device, the substrate alignment mark and the image acquisition device can be quickly moved to a position suitable for image recognition for each shot in the second and subsequent substrates. . Therefore, the alignment between the mask and the substrate can be performed quickly, and the tact time can be shortened.

  Furthermore, according to the proximity exposure apparatus and the alignment method of the proximity exposure apparatus of the present invention, after the registration position for each shot is stored for each shot on the first substrate, the shot is not exposed. After storing the registration positions for all shots, the substrate transfer device returns the first substrate to the temperature control device, and the first substrate is aligned with each shot in the same procedure as the second and subsequent substrates. By performing the exposure, the first substrate is also exposed under the same temperature condition as the second and subsequent substrates, and it is possible to prevent the generation of useless substrates that cannot be used as products.

  Furthermore, according to the alignment method of the proximity exposure apparatus of the present invention, after the first substrate is returned to the temperature control device by the substrate transport device, the supply of the second and subsequent substrates to the substrate transport device is resumed. Thus, the substrate can be transferred from the temperature control device to the chuck in order from the first substrate, and the substrate can be exposed by a first-in first-out (FIFO) method.

  According to the method for manufacturing a display panel substrate of the present invention, the alignment between the mask and the substrate can be performed quickly and the tact time can be shortened, so that the display panel substrate can be manufactured with high throughput. .

It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. 1 is a side view of a proximity exposure apparatus according to an embodiment of the present invention. It is a top view which shows the state which loaded the board | substrate to the chuck | zipper. It is a side view which shows the state which loaded the board | substrate to the chuck | zipper. It is a side view which shows the state which moved the chuck | zipper to the exposure position. It is a figure which shows the alignment mark of a mask. It is a figure which shows the alignment mark of a board | substrate. FIG. 8A is a top view of the camera unit moving mechanism and the focus adjusting mechanism, and FIG. 8B is a side view thereof. It is a block diagram of an image processing device and a main control device. It is a flowchart which shows the alignment method by one embodiment of this invention. It is a flowchart which shows the alignment method by one embodiment of this invention. It is a flowchart of the alignment operation of step 309. It is a flowchart of alignment operation of step 407. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. FIG. 2 is a side view of the proximity exposure apparatus according to the embodiment of the present invention. The proximity exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck support base 9, a chuck 10, a mask holder 20, a substrate transfer robot 30, and a temperature adjustment apparatus 40. , A table 41, an image processing device 50, a camera unit 51, a camera unit moving mechanism, a focus adjustment mechanism, a stage drive circuit 60, a main control device 70, a display device 71, and an input device 72. In FIG. 1, the camera unit moving mechanism and the focus adjusting mechanism are omitted. In FIG. 2, the image processing device 50, the camera unit moving mechanism, the focus adjusting mechanism, the stage driving circuit 60, the main control device 70, the display device 71, and the input device 72 are omitted. In addition to these, the proximity exposure apparatus includes an irradiation optical system that irradiates exposure light, a gap sensor, a Z-tilt mechanism, a temperature control unit that manages temperature in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 is in a load / unload position where the substrate 1 is loaded and unloaded. At the load / unload position, the substrate transport robot 30 loads the substrate 1 into the chuck 10 and unloads the substrate 1 from the chuck 10. A base pattern is formed on the surface of the substrate 1, and a photoresist is applied on the base pattern.

  A temperature adjusting device 40 for adjusting the temperature of the substrate 1 before being transferred to the chuck 10 is provided in front of the base 3. In FIG. 2, the temperature adjustment device 40 is supported by a table 41. In FIG. 1, a substrate transfer robot 30 is disposed beside the temperature adjustment device 40. The substrate transfer robot 30 transfers the substrate 1 from the transfer line (not shown) to the temperature adjustment device 40. Then, when the chuck 10 is in the load / unload position, the substrate transport robot 30 transports the exposed substrate 1 from the chuck 10 to a transport line (not shown), and transports the substrate 1 from the temperature adjustment device 40 to the chuck 10. To do.

  Inside the temperature adjusting device 40, a plurality of push-up pins (not shown) are accommodated. The temperature adjustment device 40 raises the push-up pin to receive the substrate 1 from the handling arm 31 of the substrate transfer robot 30 and lowers the push-up pin to bring the substrate 1 into contact with the temperature adjustment surface. Further, the temperature adjustment device 40 raises the push-up pin to lift the substrate 1 from the temperature adjustment surface, and the handling arm 31 of the substrate transfer robot 30 receives the substrate 1 from the tip of the push-up pin.

  Similarly, a plurality of push-up pins (not shown) are accommodated in the chuck 10. The chuck 10 raises the push-up pin to receive the substrate 1 from the handling arm 31 of the substrate transport robot 30, and lowers the push-up pin to bring the substrate 1 into contact with the surface. The chuck 10 raises the push-up pin to lift the substrate 1 from the surface, and the handling arm 31 of the substrate transfer robot 30 receives the substrate 1 from the tip of the push-up pin.

  FIG. 3 is a top view showing a state in which the substrate is loaded on the chuck. FIG. 4 is a side view showing a state in which the substrate is loaded on the chuck. In FIG. 3, the image processing device 50, the camera unit moving mechanism, the focus adjusting mechanism, the stage driving circuit 60, the main control device 70, the display device 71, and the input device 72 are omitted. In FIG. 4, the substrate transfer robot 30, the temperature adjustment device 40, the table 41, the image processing device 50, the camera unit moving mechanism, the focus adjustment mechanism, the stage drive circuit 60, the main control device 70, the display device 71, and the input device 72 is omitted.

  FIG. 5 is a side view showing a state where the chuck is moved to the exposure position. In FIG. 5, the substrate transfer robot 30, the temperature adjustment device 40, the table 41, the image processing device 50, the camera unit moving mechanism, the focus adjustment mechanism, the stage drive circuit 60, the main control device 70, the display device 71, and the input device 72 is omitted. A mask holder 20 for holding the mask 2 is installed above the exposure position. In FIG. 3, the mask holder 20 is provided with an opening 20a through which exposure light passes. The mask holder 20 vacuum-sucks the peripheral portion of the mask 2 by a suction groove (not shown) provided around the opening 20a. And hold. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. At the time of exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate 1, whereby the pattern of the mask 2 is transferred to the surface of the substrate 1 and a pattern is formed on the substrate 1.

  4 and 5, the chuck 10 is mounted on the θ stage 8 via the chuck support 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves along the X guide 4 in the X direction (the lateral direction in FIGS. 4 and 5). The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves along the Y guide 6 in the Y direction (the depth direction in FIGS. 4 and 5). The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support 9 is mounted on the θ stage 8 and supports the back surface of the chuck 10 at a plurality of locations. The X stage 5, Y stage 7, and θ stage 8 are provided with drive mechanisms (not shown) such as ball screws and motors, linear motors, etc., and each drive mechanism is driven by a stage drive circuit 60 of FIG. The

  The chuck 10 is moved between the load / unload position and the exposure position by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. At the load / unload position, the substrate 1 mounted on the chuck 10 is pre-aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Is done. At the exposure position, the X stage 5 is moved in the X direction and the Y stage 7 is moved in the Y direction, whereby the substrate 1 mounted on the chuck 10 is stepped in the XY direction. Further, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction (vertical direction in FIG. 5) by a Z-tilt mechanism (not shown). Then, the substrate 1 is aligned by the movement of the X stage 5 in the X direction, the movement of the Y stage 7 in the Y direction, and the rotation of the θ stage 8 in the θ direction. In FIG. 1, the main controller 70 controls the stage drive circuit 60 to move the X stage 5 in the X direction, move the Y stage 7 in the Y direction, and rotate the θ stage 8 in the θ direction. .

  In the present embodiment, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction. However, the chuck support base 9 is provided with a Z-tilt mechanism, The gap between the mask 2 and the substrate 1 may be adjusted by moving and tilting the chuck 10 in the Z direction.

  FIG. 6 is a diagram showing alignment marks on the mask. On the surface (lower surface) of the mask 2 facing the substrate 1, alignment marks 2a are provided at four locations. FIG. 7 is a diagram showing alignment marks on the substrate. FIG. 7 shows an example in which exposure is performed by dividing one surface of the substrate 1 into four exposure regions divided by broken lines. A base pattern is formed in each exposure region on the surface of the substrate 1. In the base pattern, alignment marks 1a are provided at positions corresponding to the positions of the alignment marks 2a of the mask 2, respectively. The positions of the alignment marks 1a and 2a vary depending on the size of the exposure area of the substrate 1.

  In FIG. 5, four camera units 51 are installed above the mask 2. Each camera unit 51 is moved to a predetermined position directly above the alignment marks 1a and 2a by a camera unit moving mechanism (not shown) according to the positions of the alignment marks 1a and 2a.

  FIG. 8A is a top view of the camera unit moving mechanism and the focus adjusting mechanism, and FIG. 8B is a side view thereof. The camera unit moving mechanism includes a Y guide 54, a Y stage 55, an X guide 56, an X stage 57, ribs 58 and 59, motors 81 and 86, shaft couplings 82 and 87, bearings 83 and 88, ball screws 84a and 89a, and nuts. 84b and 89b, and the Z base 90 are comprised. The focus adjustment mechanism includes a Z guide 91, a Z stage 92, a rib 93, a mounting base 94, a motor base 95, a motor 96, a shaft coupling 97, a bearing 98, a ball screw 99a, and a nut 99b. .

  A top frame 53 on which a camera unit moving mechanism is installed is provided above the exposure position, and an opening 53 a is formed in the top frame 53. A Y guide 54 is provided on the top surface of the top frame 53, and a Y stage 55 is mounted on the Y guide 54. Further, a motor 81 is installed on the upper surface of the top frame 53, and the motor 81 is driven by the main controller 70 of FIG. A rotation shaft of the motor 81 is connected to a ball screw 84 a by a shaft coupling 82, and the ball screw 84 a is rotatably supported by a bearing 83. A nut 84 b that is moved by a ball screw 84 a is attached to the lower surface of the Y stage 55, and the Y stage 55 is moved in the Y direction along the Y guide 54 by the rotation of the motor 81.

  An X guide 56 is provided on the upper surface of the Y stage 55, and an X stage 57 is mounted on the X guide 56. Further, a motor 86 is installed on the upper surface of the Y stage 55, and the motor 86 is driven by the main controller 70 of FIG. A rotation shaft of the motor 86 is connected to a ball screw 89 a by a shaft coupling 87, and the ball screw 89 a is rotatably supported by a bearing 88. A nut 89 b that is moved by a ball screw 89 a is attached to the lower surface of the X stage 57, and the X stage 57 is moved in the X direction along the X guide 56 by the rotation of the motor 86. A Z base 90 is attached to the side surface of the X stage 57 by ribs 58 and 59, and the Z base 90 is inserted into the opening 53 a of the top frame 53.

  A Z guide 91 is provided on the Z base 90, and a Z stage 92 is mounted on the Z guide 91. A motor 96 is installed on a motor base 95 attached to the Z base 90, and the motor 96 is driven by the main controller 70 in FIG. A rotation shaft of the motor 96 is connected to a ball screw 99a by a shaft coupling 97, and the ball screw 99a is rotatably supported by a bearing 98. A nut 99 b that is moved by a ball screw 99 a is attached to the Z stage 92, and the Z stage 92 is moved in the Z direction along the Z guide 91 by the rotation of the motor 96. A mounting base 94 is attached to the Z stage 92 by ribs 93, and the camera unit 51 is attached to the mounting base 94. The camera unit 51 includes a CCD camera 51a and a lens 51b.

  The camera unit 51 is moved in the XY direction by the movement of the X stage 57 in the X direction and the movement of the Y stage 55 in the Y direction. 1 controls the motors 81 and 86 to move each camera unit 51 to a predetermined position. Further, the camera unit 51 is moved in the Z direction by the movement of the Z stage 92 in the Z direction. The main controller 70 controls the motor 96 to move each camera unit 51 in the Z direction so that the focus of each camera unit 51 is aligned with the lower surface of the mask 2 and the surface of the substrate 1.

  The CCD camera 51a of each camera unit 51 acquires an image of the lower surface of the mask 2 and an image of the surface of the substrate 1, and outputs image signals to the image processing device 50 and the display device 71 of FIG. In FIG. 1, the display device 71 displays an image acquired by the CCD camera 51 a of each camera unit 51.

  FIG. 9 is a block diagram of the image processing apparatus and the main control apparatus. The image processing apparatus 50 includes a control unit 50a, a calculation processing unit 50b, an image memory 50c, and a calculation memory 50d. In the arithmetic memory 50d, images of the alignment marks 1a and 2a serving as a reference for image recognition are registered in advance. The image memory 50c stores the image signal output from the CCD camera 51a of each camera unit 51. The arithmetic processing unit 50b processes the image signal stored in the image memory 50c, images of the alignment marks 1a and 2a acquired by the CCD camera 51a of each camera unit 51, and the alignment mark 1a registered in the arithmetic memory 50d. , 2a are compared with each other to perform image recognition and detect the positions of the recognized alignment marks 1a, 2a. The control unit 50a sets a determination condition when the arithmetic processing unit 50b performs image recognition. The determination condition includes an allowable threshold value for determining the degree of coincidence between the image recognition target image and a pre-registered image, and a contrast threshold value for determining the contrast of the image recognition target image. The success or failure of image recognition is determined using both.

  In FIG. 9, the main control device 70 includes an image processing control unit 70 a that controls the image processing device 50, a camera unit control unit 70 b that controls the camera unit moving mechanism and the focus adjustment mechanism, and a stage that controls the stage drive circuit 60. A control unit 70c and a memory 70d are included. In FIG. 9, motors 81 and 86 of one camera unit moving mechanism and motor 96 of one focus adjusting mechanism are shown, and motors 81 and 86 of the other three camera unit moving mechanisms and other The motors 96 of the three focus adjustment mechanisms are omitted.

  Hereinafter, an alignment method for a proximity exposure apparatus according to an embodiment of the present invention will be described. 10 and 11 are flowcharts showing an alignment method according to an embodiment of the present invention. In FIG. 10, first, the first substrate is supplied from the transfer line to the substrate transfer robot 30 (step 301), and then the supply of the second and subsequent substrates from the transfer line to the substrate transfer robot 30 is stopped ( Step 302). The substrate transfer robot 30 transfers the first substrate from the transfer line to the temperature adjustment device 40, and the temperature adjustment device 40 mounts the first substrate and adjusts the temperature of the substrate (step 303). After adjusting the substrate temperature by the temperature adjusting device 40, the substrate transfer robot 30 transfers the first substrate from the temperature adjusting device 40 to the chuck 10 (step 304).

  Subsequently, the stage controller 70c of the main controller 70 drives the X stage 5, Y stage 7 and θ stage 8 by the stage drive circuit 60, moves the chuck 10 in the XY direction at the load / unload position, and the θ direction. And the substrate 1 is pre-aligned (step 305). Next, the stage controller 70c drives the X stage 5 and the Y stage 7 by the stage drive circuit 60, moves the chuck 10 to the exposure position, and moves the substrate 1 to the position where the first shot of the exposure position is performed. (Step 306). The camera unit controller 70b of the main controller 70 drives the motors 81 and 86 of each camera unit moving mechanism to move each camera unit 51 above the alignment mark 2a of the mask 2. (Step 307).

  Subsequently, the main controller 70 moves and tilts the mask holder 20 in the Z direction by the Z-tilt mechanism to perform gap alignment between the mask 2 and the substrate 1 (step 308). Next, main controller 70 performs alignment of substrate 1 with respect to the first shot (step 309). FIG. 12 is a flowchart of the alignment operation in step 309. FIG. 12 shows an example in which the operator manually instructs the movement of the chuck 10 and each camera unit 51 when the mask 2 and the alignment marks 2a, 1a on the substrate 1 are placed in the field of view of the CCD camera 51a of each camera unit 51. Show.

  In FIG. 12, first, the camera unit controller 70b drives the motor 96 of the focus adjustment mechanism to focus each camera unit 51 on the lower surface of the mask 2 (step 501). The operator looks at the image displayed on the display device 71 and determines whether or not the alignment mark 2a of the mask 2 is within the field of view of the CCD camera 51a of each camera unit 51 (step 502). If the alignment mark 2a of the mask 2 is not within the field of view of the CCD camera 51a, the operator instructs the movement of the camera unit 51 through the input device 72 (step 503). The camera unit controller 70b moves the camera unit 51 by driving the motors 81 and 86 of the camera unit moving mechanism in accordance with an instruction from the operator (step 504). Steps 502 to 504 are repeated until the alignment mark 2a of the mask 2 enters the field of view of the CCD camera 51a of each camera unit 51.

  Subsequently, the camera unit control unit 70b drives the motor 96 of the focus adjustment mechanism to focus each camera unit 51 on the surface of the substrate 1 (step 505). The operator looks at the image displayed on the display device 71 and determines whether or not the alignment mark 1a of the substrate 1 is within the field of view of the CCD camera 51a of each camera unit 51 (step 506). When the alignment mark 1a of the substrate 1 is not within the field of view of the CCD camera 51a, the operator instructs the movement of the chuck 10 by the input device 72 (step 507). The stage controller 70c moves the chuck 10 by driving the X stage 5 and the Y stage 7 by the stage driving circuit 60 in accordance with an instruction from the operator (step 508). Steps 506 to 508 are repeated until the alignment mark 1a of the substrate 1 enters the field of view of the CCD camera 51a of each camera unit 51.

  In step 506, when the alignment mark 1a of the substrate 1 is within the field of view of the CCD camera 51a of each camera unit 51, the camera unit control unit 70b drives the motor 96 of the focus adjustment mechanism to focus the camera unit 51. Is aligned with the lower surface of the mask 2 (step 511). Each camera unit 51 acquires an image of the alignment mark 2a of the mask 2, and the arithmetic processing unit 50b of the image processing device 50 recognizes the image of the alignment mark 2a of the mask 2 and detects the position of the alignment mark 2a of the mask 2. (Step 512). Next, the camera unit controller 70b drives the motor 96 of the focus adjustment mechanism to focus each camera unit 51 on the surface of the substrate 1 (step 513). Each camera unit 51 acquires an image of the alignment mark 1a on the substrate 1, and the arithmetic processing unit 50b performs image recognition of the alignment mark 1a on the substrate 1 and position detection of the alignment mark 1a on the substrate 1 (step 514). ).

  The image processing control unit 70a of the main controller 70 determines the position of the mask 2 and the substrate 1 from the positions of the plurality of alignment marks 2a of the mask 2 and the positions of the plurality of alignment marks 1a of the substrate 1 detected by the arithmetic processing unit 50b. The amount of deviation is detected (step 515), and it is determined whether or not the amount of positional deviation between the two is below a predetermined value (step 516). When the amount of positional deviation between the mask 2 and the substrate 1 is not less than or equal to the predetermined value, the stage control unit 70c is based on the amount of positional deviation between the mask 2 and the substrate 1 detected by the image processing control unit 70a. 7 and the rotation amount of the θ stage 8 are calculated (step 517). Then, the stage control unit 70c controls the stage driving circuit 60 to move the X stage 5 and the Y stage 7 by the calculated movement amount and to rotate the θ stage 8 by the calculated rotation amount (step 518). Return to step 514.

  In step 516, when the amount of positional deviation between the mask 2 and the substrate 1 is not more than a predetermined value, the main controller 70 ends the alignment of the substrate 1. When the alignment of the substrate 1 is completed, the alignment mark 1a of the substrate 1 and each camera unit 51 are relatively in positions suitable for image recognition.

  In FIG. 10, after alignment of the substrate 1 (step 309), the stage control unit 70c and the camera unit control unit 70b store the position of the chuck 10 and the position of each camera unit 51 after alignment of the substrate 1 in the memory 70d. Is stored as a registered position (step 310). Subsequently, main controller 70 determines whether or not registration positions have been stored for all shots (step 311). If storage of registered positions has not been completed for all shots, the main controller 70 widens the gap between the mask 2 and the substrate 1 by the Z-tilt mechanism, and then the X stage 5 and the Y stage 7 by the stage drive circuit 60. Is driven to perform step movement of the substrate 1 in the XY directions (step 312), and the substrate 1 is moved to a position where the next shot is performed. Then, the process returns to step 308, and steps 308 to 312 are repeated until the storage of registered positions for all shots is completed.

  In step 311, when storage of registered positions is completed for all shots, main controller 70 widens the gap between mask 2 and substrate 1 using the Z-tilt mechanism, and then uses stage drive circuit 60 to set X stage 5 and Y. The stage 7 is driven to move the chuck 10 to the load / unload position (step 313). Then, the substrate transfer robot 30 returns the first substrate from the chuck 10 to the temperature adjustment device 40, and the temperature adjustment device 40 mounts the first substrate and adjusts the temperature of the substrate (step 314). After returning the first substrate from the chuck 10 to the temperature control device 40, the supply of the second and subsequent substrates from the transfer line to the substrate transfer robot 30 is resumed (step 315).

  After restarting the supply of the substrate, in FIG. 11, the substrate transfer robot 30 transfers the substrate from the transfer line to the temperature adjustment device 40, and the temperature adjustment device 40 mounts the substrate and adjusts the temperature of the substrate (step). 401). However, for the first substrate, this step is unnecessary because the substrate has already been returned from the chuck 10 to the temperature adjustment device 40 in step 314 of FIG. 10 to adjust the temperature of the substrate. After adjusting the temperature of the substrate by the temperature adjustment device 40, the substrate transfer robot 30 transfers the substrate from the temperature adjustment device 40 to the chuck 10 (step 402).

  Subsequently, the stage controller 70c of the main controller 70 drives the X stage 5, Y stage 7 and θ stage 8 by the stage drive circuit 60, moves the chuck 10 in the XY direction at the load / unload position, and the θ direction. And the substrate 1 is pre-aligned (step 403). Next, the stage control unit 70c drives the X stage 5 and the Y stage 7 by the stage driving circuit 60, and moves the chuck 10 to the registration position for the first shot stored in the memory 70d (step 404). ). The camera unit control unit 70b of the main controller 70 drives the motors 81 and 86 of the camera unit moving mechanisms to move the camera units 51 to the registration positions for the first shot stored in the memory 70d. Move (step 405).

  Subsequently, main controller 70 moves and tilts mask holder 20 in the Z direction by the Z-tilt mechanism to perform gap alignment between mask 2 and substrate 1 (step 406). Next, main controller 70 performs alignment of substrate 1 with respect to the first shot (step 407). FIG. 13 is a flowchart of the alignment operation in step 407. In step 404 and step 405 of FIG. 11, when the chuck 10 and each camera unit 51 are moved to the registration position for the shot, the alignment mark 1a of the substrate 1 and the camera unit 51 are relatively suitable for image recognition. The mask 2 and the alignment marks 2 a and 1 a of the substrate 1 are in the field of view of each camera unit 51.

  In FIG. 13, the camera unit controller 70b drives the motor 96 of the focus adjustment mechanism to focus each camera unit 51 on the lower surface of the mask 2 (step 611). Each camera unit 51 acquires an image of the alignment mark 2a of the mask 2, and the arithmetic processing unit 50b of the image processing device 50 recognizes the image of the alignment mark 2a of the mask 2 and detects the position of the alignment mark 2a of the mask 2. (Step 612). Next, the camera unit controller 70b drives the motor 96 of the focus adjustment mechanism to focus each camera unit 51 on the surface of the substrate 1 (step 613). Each camera unit 51 acquires an image of the alignment mark 1a on the substrate 1, and the arithmetic processing unit 50b performs image recognition of the alignment mark 1a on the substrate 1 and position detection of the alignment mark 1a on the substrate 1 (step 614). ).

  The image processing control unit 70a of the main controller 70 determines the position of the mask 2 and the substrate 1 from the positions of the plurality of alignment marks 2a of the mask 2 and the positions of the plurality of alignment marks 1a of the substrate 1 detected by the arithmetic processing unit 50b. The amount of deviation is detected (step 615), and it is determined whether or not the amount of positional deviation between the two is below a predetermined value (step 616). When the amount of positional deviation between the mask 2 and the substrate 1 is not less than or equal to the predetermined value, the stage control unit 70c is based on the amount of positional deviation between the mask 2 and the substrate 1 detected by the image processing control unit 70a. 7 and the rotation amount of the θ stage 8 are calculated (step 617). Then, the stage control unit 70c controls the stage drive circuit 60 to move the X stage 5 and the Y stage 7 by the calculated movement amount, and rotates the θ stage 8 by the calculated rotation amount (step 618). Return to step 614. In step 616, when the amount of positional deviation between the mask 2 and the substrate 1 is not more than a predetermined value, the main controller 70 ends the alignment of the substrate 1.

  In step 404 and step 405 in FIG. 11, the chuck 10 and each camera unit 51 are moved to the registration position for the shot by the X stage 5 and Y stage 7 and each camera unit moving mechanism, and the mask 2 and the substrate 1 are aligned. Since the marks 2a and 1a are put in the field of view of each camera unit 51, in the alignment of the substrate 1 (step 407), the alignment mark 1a on the substrate 1 and the camera unit 51 are relatively suitable for image recognition for each shot. Moves quickly to position. Therefore, the alignment between the mask 2 and the substrate 1 is performed quickly, and the tact time is shortened.

  Note that, if the steps 404 and 405 are performed in parallel, the tact time is further shortened. However, the present invention is not limited to this, and the steps 404 and 405 may be performed in order.

  In FIG. 11, after alignment of the substrate 1 (step 407), the camera unit controller 70 b drives the motors 81 and 86 of each camera unit moving mechanism so that each camera unit 51 is located outside the opening 20 a of the mask holder 20. Move to the retreat position (step 408). Then, main controller 70 performs exposure of the shot (step 409), and determines whether exposure of all shots is completed (step 410). When exposure of all shots has not been completed, the main controller 70 widens the gap between the mask 2 and the substrate 1 by the Z-tilt mechanism, and then drives the X stage 5 and the Y stage 7 by the stage drive circuit 60. Then, the substrate 1 is moved stepwise in the X and Y directions (step 411), and the substrate 1 is moved to the position where the next shot is performed. Then, the process returns to step 404, and steps 404 to 411 are repeated until exposure of all shots is completed.

  In step 410, when exposure of all shots is completed, the main controller 70 widens the gap between the mask 2 and the substrate 1 by the Z-tilt mechanism, and then moves the X stage 5 and Y stage 7 by the stage drive circuit 60. The chuck 10 is driven to move the chuck 10 to the load / unload position (step 412). Then, the substrate transport robot 30 unloads the exposed substrate from the chuck 10 to the transport line (step 413).

  In the first substrate shown in FIG. 10, since alignment of the substrate with respect to each shot (step 309) takes time, if the shot is exposed after the alignment of the substrate, the second and subsequent substrates are not exposed. As a result, the exposure accuracy of the pattern is lowered, and a useless substrate that cannot be used as a product is generated. In the first substrate, for each shot, the registered position for the shot is stored, then the shot is not exposed, and the registered positions for all shots are stored. The substrate is returned to the temperature control device 40 (step 314), and as shown in FIG. 11, each shot is aligned and exposed in the same procedure as the second and subsequent substrates as shown in FIG. For the second substrate, exposure is performed under the same temperature conditions as those for the second and subsequent substrates, and a useless substrate that cannot be used as a product does not occur.

  Also, after the first substrate is supplied to the substrate transfer robot 30, the supply of the second and subsequent substrates to the substrate transfer robot 30 is stopped (step 302), and the substrate transfer robot 30 moves the first substrate. After returning to the temperature control device 40, the supply of the second and subsequent substrates to the substrate transfer robot 30 is resumed (step 315), and thus the substrate supply from the temperature control device 40 to the chuck 10 is resumed. Are sequentially carried out from the first substrate, and the substrate is exposed by a first-in first-out (FIFO) method.

  In the embodiment described above, in the alignment of the substrate 1 (steps 309 and 407), after acquiring the image of the alignment mark 2a of the mask 2, the image of the alignment mark 1a of the substrate 1 is acquired. After acquiring the image of the alignment mark 1a on the substrate 1, the image of the alignment mark 2a on the mask 2 may be acquired.

  According to the embodiment described above, the position of the chuck 10 after alignment of the substrate and the position of each camera unit 51 are stored as registered positions for the shot for each shot on the first substrate. In each subsequent substrate, the X stage 5 and Y stage 7 and the camera unit moving mechanism move the chuck 10 and each camera unit 51 to the registration position for the shot for each shot. By placing the alignment marks 2a and 1a in the field of view of each camera unit 51, in the second and subsequent substrates, the alignment mark 1a of the substrate 1 and the camera unit 51 are relatively suitable for image recognition for each shot. Can move quickly. Therefore, the alignment between the mask 2 and the substrate 1 can be performed quickly, and the tact time can be shortened.

  Further, in the first substrate, for each shot, the registered position for the shot is stored, then the shot is not exposed, and the registered positions for all the shots are stored. The first substrate is returned to the temperature control device 40, and the first substrate is also subjected to alignment and exposure for each shot in the same procedure as the second and subsequent substrates. By performing exposure under the same temperature conditions as the subsequent substrates, it is possible to prevent the generation of useless substrates that cannot be used as products.

  Further, after the first substrate is supplied to the substrate transfer robot 30, the supply of the second and subsequent substrates to the substrate transfer robot 30 is stopped, and the substrate transfer robot 30 moves the first substrate to the temperature control device 40. After returning to the first position, the second and subsequent substrates are resumed from being supplied to the substrate transfer robot 30, whereby the substrate is transferred from the temperature adjustment device 40 to the chuck 10 in order from the first substrate, and the first-in first-out ( The substrate can be exposed by a FIFO method.

  By exposing the substrate using the proximity exposure apparatus of the present invention, or by aligning the mask and the substrate using the alignment method of the proximity exposure apparatus of the present invention, Since the alignment between the mask and the substrate can be performed quickly and the tact time can be shortened, the display panel substrate can be manufactured with high throughput.

  For example, FIG. 14 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 15 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 14, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 15, in the exposure process of the colored pattern forming process (step 202), the proxy of the present invention. The alignment method of the proximity exposure apparatus or proximity exposure apparatus of the present invention can be applied.

DESCRIPTION OF SYMBOLS 1 Board | substrate 1a, 2a Alignment mark 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Chuck support stand 10 Chuck 20 Mask holder 30 Substrate conveyance robot 31 Handling arm 40 Temperature control device 41 stand 50 Image Processing device 50a Control unit 50b Arithmetic processing unit 50c Image memory 50d Arithmetic memory 51 Camera unit 51a CCD camera 51b Lens 53 Top frame 54 Y guide 55 Y stage 56 X guide 57 X stage 58, 59 Rib 60 Stage drive circuit 70 Main controller 70a Image processing control unit 70b Camera unit control unit 70c Stage control unit 70d Memory 71 Display device 72 Input device 81, 86, 96 Motor 82, 87, 97 Shaft coupling 83, 88, 98 Bearing 84a, 89a, 99a Ball screw 84b, 89b, 99b Nut 90 Z base 91 Z guide 92 Z stage 93 Rib 94 Mounting base 95 Motor stand

Claims (7)

A mask holder that holds a mask, a chuck that supports the substrate, and a stage that moves the chuck, and the chuck is moved by the stage to perform step movement of the substrate in the XY directions. In proximity exposure equipment that divides and exposes shots,
A plurality of image acquisition devices for acquiring images of a plurality of alignment marks provided on the mask and the substrate and outputting image signals;
A plurality of moving mechanisms for moving each image acquisition device;
An image processing device that processes the image signal output by each image acquisition device and detects the position of the alignment mark;
For each shot, the chuck and each image acquisition device are moved by the stage and each moving mechanism, the mask and substrate alignment marks are placed in the field of view of each image acquisition device, and the mask alignment mark detected by the image processing device And a control means for aligning the substrate by moving the chuck by the stage based on the position of the substrate and the position of the alignment mark on the substrate,
The control means stores, for each shot, the position of the chuck after alignment of the substrate and the position of each image acquisition device as a registered position for the shot on the first substrate, and the second and subsequent substrates. In each shot, the stage and each moving mechanism move the chuck and each image acquisition device to a registration position for the shot, and put the mask and substrate alignment marks in the field of view of each image acquisition device. Proximity exposure equipment. A temperature adjusting device for adjusting the temperature of the substrate by mounting the substrate before being transferred to the chuck;
A substrate transport device that transports the substrate to the temperature control device and transports the substrate from the temperature control device to the chuck;
In the first substrate, for each shot, the control means stores the registration position for the shot, and then does not expose the shot.
The substrate transfer device returns the first substrate to the temperature adjustment device after the control means stores the registration positions for all shots,
2. The proximity exposure apparatus according to claim 1, wherein the control unit performs alignment and exposure of each shot on the first substrate in the same procedure as the second and subsequent substrates. A mask holder for holding the mask, a chuck for supporting the substrate, and a stage for moving the chuck are provided. The chuck is moved by the stage to perform step movement of the substrate in the XY directions so that one surface of the substrate is made into a plurality of shots. An alignment method for a proximity exposure apparatus that performs exposure separately.
A plurality of image acquisition devices that acquire images of a plurality of alignment marks provided on the mask and the substrate and output image signals, a plurality of movement mechanisms that move each image acquisition device, and each image acquisition device output Provided with an image processing device that processes the image signal and detects the position of the alignment mark,
On the first substrate, for each shot, the chuck and each image acquisition device are moved by the stage and each moving mechanism, the mask and the alignment mark of the substrate are placed in the field of view of each image acquisition device, and the image processing device detects Based on the position of the alignment mark on the mask and the position of the alignment mark on the substrate, the chuck is moved by the stage, the substrate is aligned, and the position of the chuck after alignment of the substrate and the position of each image acquisition device are shot. As the registered location of
In the second and subsequent substrates, for each shot, the stage and each moving mechanism move the chuck and each image acquisition device to the registration position for that shot, and the mask and substrate alignment marks are in the field of view of each image acquisition device. An alignment method for a proximity exposure apparatus, wherein the alignment of the substrate is performed by moving the chuck by a stage based on the position of the alignment mark on the mask and the position of the alignment mark on the substrate detected by the image processing apparatus. A temperature adjustment device for adjusting the temperature of the substrate by mounting the substrate before being transferred to the chuck, and a substrate transfer device for transferring the substrate to the temperature adjustment device and transferring it from the temperature adjustment device to the chuck,
In the first substrate, for each shot, after storing the registered position for that shot, the shot is not exposed,
After storing the registration positions for all shots, the substrate transfer device returns the first substrate to the temperature control device,
4. The proximity exposure apparatus alignment method according to claim 3, wherein the alignment and exposure of each shot are performed on the first substrate in the same procedure as the second and subsequent substrates.   5. The proximity exposure apparatus according to claim 4, wherein after the first substrate is returned to the temperature control device by the substrate transport device, the supply of the second and subsequent substrates to the substrate transport device is resumed. Alignment method.   A method for manufacturing a display panel substrate, comprising: exposing a substrate using the proximity exposure apparatus according to claim 1.   6. A display panel substrate, wherein the alignment of the proximity exposure apparatus according to any one of claims 3 to 5 is used to align the mask and the substrate, thereby exposing the substrate. Manufacturing method.

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