JP2012227236A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device which sufficiently performs cleaning of a suction nozzle and a coating nozzle while achieving compactification of the entire device.SOLUTION: A component mounting device has a sheet member 73 and a sheet member forward movement mechanism (taking-up reel drive mechanism 72a) moving the sheet member 73 in the horizontal direction. The component mounting device includes a nozzle cleaner 70 cleaning an attachment nozzle 17a by causing the sheet member forward movement mechanism to move the sheet member 73 forward with the attachment nozzle 17a pressed against the sheet member 73 from above.

Description

  The present invention relates to a component mounting apparatus that sucks a component supplied from a component supply unit by a suction nozzle and mounts the component on a substrate.

  The component mounting apparatus includes a substrate transport positioning unit that transports and positions a substrate, a component supply unit that supplies components, and a mounting head that includes a suction nozzle. The mounting head includes components supplied by the component supply unit. After being picked up by the suction nozzle, the operation of mounting the component on the substrate positioned by the substrate transfer positioning unit is repeatedly executed.

  In the component mounting apparatus having such a configuration, if dust or the like adheres to the lower end of the suction nozzle, a component suction error or the like is likely to occur. Therefore, a nozzle cleaner for cleaning the suction nozzle is provided (for example, Patent Document 1). ). This nozzle cleaner has a polishing member that is reciprocally movable in the horizontal direction. The suction nozzle is moved in the horizontal direction while the suction nozzle is pressed against the polishing member, and the polishing member (that is, the nozzle cleaner itself) is sucked. The suction nozzle is cleaned by reciprocating in a direction perpendicular to the moving direction of the nozzle and moving the suction nozzle and the polishing member relative to each other.

JP 2006-13466 A

  However, as in the conventional case, when the suction nozzle and the coating nozzle (hereinafter, collectively referred to as a nozzle) are cleaned, a space for the movement is required to move the nozzle and the polishing member in the horizontal direction. There is a problem that the overall compactness may be hindered by the provision of the nozzle cleaner in the apparatus. In addition, in order to reduce the overall size of the component mounting apparatus, it is also possible to eliminate the mechanism for moving the polishing member and the nozzle relative to each other in contact, and to clean the nozzle by simply pressing the nozzle against the polishing member from above. However, in this case, there has been a problem that the dust attached to the nozzle cannot be sufficiently cleaned.

  Accordingly, an object of the present invention is to provide a component mounting apparatus capable of sufficiently cleaning the suction nozzle and the application nozzle while reducing the overall size.

  The component mounting apparatus according to claim 1, the substrate transport positioning unit that transports and positions the substrate, the component supply unit that supplies the component, and the component supplied by the component supply unit are sucked by the suction nozzle to transport the substrate. A mounting head for mounting on the substrate positioned by the positioning unit, a sheet member and a sheet member advancing mechanism for advancing the sheet member in the horizontal direction, and the sheet member in the state in which the suction nozzle is pressed from above And a nozzle cleaner that cleans the suction nozzle by being advanced by a member advancing mechanism.

  The component mounting apparatus according to claim 2 is the component mounting apparatus according to claim 1, wherein an adhesive that adheres the component to the substrate is applied onto the substrate from the application nozzle when the component is mounted on the substrate. The nozzle cleaner includes a head and cleans the application nozzle by advancing the sheet member by the sheet member advancing mechanism in a state where the application nozzle is pressed from above on the sheet member.

  According to a third aspect of the present invention, there is provided a component mounting apparatus, comprising: a substrate conveyance positioning unit that conveys and positions a substrate; a component supply unit that supplies components; The mounting head for mounting on the substrate positioned by the positioning unit, the application head for applying an adhesive on the substrate from the application nozzle to adhere the component to the substrate when mounting the component on the substrate, the sheet member and the sheet member horizontally And a nozzle cleaner that cleans the application nozzle by advancing the sheet member with the sheet member advancement mechanism while the application nozzle is pressed against the sheet member from above.

  A component mounting apparatus according to a fourth aspect is the component mounting apparatus according to any one of the first to third aspects, wherein the traveling direction of the sheet member in the nozzle cleaner is parallel to the substrate conveyance direction by the substrate conveyance positioning unit. Yes, the nozzle cleaner is provided adjacent to the substrate transfer positioning portion.

  In the present invention, the nozzle cleaner has a sheet member and a sheet member advancing mechanism that advances the sheet member in the horizontal direction, and the sheet member is placed in a state where the suction nozzle (or application nozzle) is pressed from above onto the sheet member. The suction nozzle (coating nozzle) is cleaned by advancing with the advancing mechanism, and there is no need to move the nozzle cleaner itself when cleaning the suction nozzle (coating nozzle). Since it is not necessary to move, the suction nozzle (coating nozzle) can be sufficiently cleaned while making the whole compact.

The perspective view of the component mounting apparatus in one embodiment of this invention The principal part front view of the component mounting apparatus in one embodiment of this invention (A) (b) The partial perspective view of the component mounting apparatus in one embodiment of this invention The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention The perspective view of the nozzle cleaner with which the component mounting apparatus in one embodiment of this invention is provided (A) (b) Operation | movement explanatory drawing of the nozzle cleaner in one embodiment of this invention

  1 and 2, the component mounting apparatus 1 repeatedly performs an operation of mounting a component (chip) 3 on a substrate 2, and performs substrate conveyance positioning for carrying and positioning the substrate 2 on a base 11. Adhering to the substrate conveyance path 12 as a part, the component supply stage 13 as a component supply part for supplying the component 3, the relay stage 14 on which the component 3 is temporarily placed, and the substrate 2 positioned by the substrate conveyance path 12 A coating head 15 for applying the agent, a pickup head 16 for picking up (sucking) the component 3 from the component supply stage 13 and placing it on the relay stage 14, and a substrate transport path for sucking the component 3 placed on the relay stage 14 12 and a mounting head 17 that mounts the component 3 at a target mounting position on the substrate 2 on which the adhesive is applied by the coating head 15.

  In FIG. 2, a mounting table 21 is erected on a base 11 by a table column 20, and a substrate holding stage 23 is placed on the mounting table 21 via a substrate holding stage moving mechanism 22 composed of an XY table. The substrate holding stage 23 can be moved in the horizontal plane by the operation of the substrate holding stage moving mechanism 22.

  The substrate transport path 12 is provided on the substrate holding stage 23 so as to extend in the left-right direction (X-axis direction) of the base 11, and when the substrate holding stage moving mechanism 22 is operated, the substrate transport path 12 is connected to the substrate holding stage 23. Move together in the horizontal plane.

  A head movement guide 24 is provided above the base 11 so as to extend in the front-rear direction of the base 11 (the Y-axis direction, and the right side of each of FIGS. 1 and 2 is the front). The head 15 and the mounting head 17 are provided on the head movement guide 24 so as to be movable in the Y-axis direction. As shown in FIGS. 1 and 2, the mounting head 17 is provided on the head moving guide 24 in a state of being positioned in front of the coating head 15.

  In FIG. 2, a component supply stage moving mechanism 25 is provided in the front area of the base 11, and the component supply stage 13 is moved in the horizontal plane by the component supply stage moving mechanism 25. 1 and 2, the component supply stage 13 holds the periphery of the sheet-like member 26, and a semiconductor wafer 27 is attached to the upper surface of the sheet-like member 26. The component 3 is formed by cutting a semiconductor wafer 27, and an ejector 28 that pushes each component 3 upward from below is provided below the semiconductor wafer 27.

  1 and 2, a guide frame 30 extending in the left-right direction (X-axis direction) of the base 11 is located in the front area 21a of the mounting table 21 (that is, the area between the substrate transport path 12 and the component supply stage 13). Is provided. As shown in FIGS. 3A and 3B, a rail 31 extending in the left-right direction of the base 11 along the guide frame 30 is provided on the upper surface of the guide frame 30. 32 is engaged and is movable (slidable) in the X-axis direction. A moving table 33 is provided on the upper surface of the slider 32, and the relay stage 14 is attached to the upper surface of the moving table 33.

  3A and 3B, the guide frame 30 supports both ends of a feed screw 34 extending in the left-right direction of the base 11 along the guide frame 30, and the feed screw 34 includes a moving table 33. A nut portion 35 (FIG. 2) provided on the lower surface is screwed. Therefore, when the feed screw 34 is rotationally driven around the X axis by the table moving motor 36 attached to the guide frame 30, the moving table 33 (that is, the relay stage 14) moves along the rail 31 in the X axis direction. As shown in FIGS. 3A and 3B, on the moving table 33, in addition to the relay stage 14, a component recognition camera 37 and a tool holding member 38 with the imaging surface 37a facing upward are provided. .

  In FIG. 1, a pickup head holding arm 42 that can be moved in the Y-axis direction and the Z-axis direction by a pickup head moving mechanism 41 is provided below the head movement guide 24. The pickup head 16 holds the pickup head. It is provided at the tip of the arm 42. A pickup nozzle 16a composed of a suction nozzle is attached to the pickup head 16 (see also FIG. 2).

  1 and 2, a front moving plate 51 and a rear moving plate 53 are provided on the head moving guide 24 so as to be movable on the head moving guide 24 (that is, in the Y-axis direction). The mounting head 17 is attached to a mounting head lifting plate 52 that can be moved up and down with respect to the front moving plate 51, and the coating head 15 is mounted on a coating head lifting plate 54 that is movable up and down with respect to the rear moving plate 53. .

  1 and 2, a mounting nozzle 17a composed of a suction nozzle is detachably attached to the mounting head 17 in a state of extending downward, and the replacement mounting nozzle 17a is attached to the tool holding member 38 described above. Is held (FIGS. 3A and 3B).

  1 and 2, the coating head 15 is provided with a coating nozzle 15a extending downward. An adhesive (not shown) for adhering the component 3 to the substrate 2 when the component 3 is mounted on the substrate 2 is stored in the coating head 15, and the adhesive is discharged from the lower end of the coating nozzle 15a.

  In FIG. 2, when the component supply stage 13 is moved by the component supply stage moving mechanism 25, the pickup head 16 is moved by the pickup nozzle 16a in the plane in which the semiconductor wafer 27 held by the component supply stage 13 moves. A pickup point P1, which is a point for picking up (sucking) the component 3 supplied to the component supply stage 13, is determined. On the movement track in the X-axis direction of the relay stage 14, the mounting head 17 is mounted with a mounting nozzle. 17a defines a relay point P2, which is a point at which the component 3 placed on the relay stage 14 is picked up by the pickup head 16. In addition, when the substrate holding stage 23 is moved by the substrate holding stage moving mechanism 22, the coating head 15 is placed on the substrate 2 by the coating nozzle 15 a in the plane in which the substrate 2 held by the substrate holding stage 23 moves. A mounting point P3, which is a point at which the mounting head 17 mounts the component 3 on the substrate 2 by the mounting nozzle 17a, is determined. These pickup point P1, relay point P2, and mounting point P3 are each defined as fixed points on the coordinate system with reference to the base 11.

  1 and 2, above the head movement guide 24, the component supply stage camera 61, the relay stage camera 62, and the substrate holding stage camera 63 are arranged in such a manner that the imaging surface faces downward in order from the front of the base 11. Is provided. As shown in FIG. 2, the optical axis L1 of the component supply stage camera 61 passes through the pickup point P1 set on the component supply stage 13, and the optical axis L2 of the relay stage camera 62 is set on the relay stage 14. Passing through relay point P2. The optical axis L3 of the substrate holding stage camera 63 passes through the mounting point P3 set on the substrate holding stage 23.

  In FIG. 1 and FIG. 2, in addition to removing dust and the like adhering to the mounting nozzle 17a, which is a suction nozzle, on the side surface of the substrate conveyance path 12, the adhesive fouling adhering to the lower end of the application nozzle 15a included in the application head 15 is removed. Nozzle cleaner 70 is provided for removing water.

  5, 6A, and 6B, the nozzle cleaner 70 includes a take-up reel 71 and a take-up reel 72 that are mounted side by side in the X-axis direction on the side surface of the substrate holding stage 23. Is driven to rotate by a take-up reel drive mechanism 72a. A sheet member 73 is stretched between the supply reel 71 and the take-up reel 72, the supply reel 71 extends the sheet member 73, and the take-up reel 72 takes up the sheet member 73. A backup member 74 having a flat upper surface is provided below the horizontal posture portion 73 a of the sheet member 73 between the supply reel 71 and the take-up reel 72 in a state of being urged upward by the urging member 75.

  Thus, in this embodiment, the supply reel 71, the take-up reel 72, and the take-up reel drive mechanism 72a function as a sheet member advance mechanism that advances the sheet member 73 in the horizontal direction (here, the X-axis direction). Further, the traveling direction (X-axis direction) of the sheet member 73 in the nozzle cleaner 70 is parallel to the transport direction of the substrate 2 by the substrate transport path 12, and the nozzle cleaner 70 is provided adjacent to the substrate transport path 12. It has become.

  When the take-up reel 72 of the nozzle cleaner 70 is rotationally driven to take up the sheet member 73 (arrow A1 shown in FIG. 6B), the feed reel 71 is rotated by the tension of the sheet member 73 (FIG. 6B). ), The sheet member 73 is fed out from the feeding reel 71. In this way, the nozzle cleaner 70 can advance the sheet member 73 in a fixed direction (here, the X-axis direction) (arrow B shown in FIG. 6B), and the mounting nozzle 17a (or the application nozzle 15a). ) Is pressed from above on the horizontal posture portion 73a of the sheet member 73 on the backup member 74 (arrow C shown in FIG. 6A), and in this state, the take-up reel 72 is rotated to drive the sheet member 73. As it advances, the sheet member 73 moves relative to the mounting nozzle 17a (or application nozzle 15a), and the dust adhered to the lower end of the mounting nozzle 17a (or the adhesive fouling attached to the lower end of the application nozzle 15a). Is removed (FIG. 6B).

  The substrate 2 is transported and positioned by the control device 80 (FIG. 4) provided in the component mounting apparatus 1 by controlling the operation of the substrate transport path 12 (FIG. 4). The moving operation is performed when the control device 80 controls the operation of the substrate holding stage moving mechanism 22 to move the substrate holding stage 23 (FIG. 4).

  The supply operation of the component 3 by the component supply stage 13 is performed when the control device 80 controls the operation of the component supply stage moving mechanism 25 to move the component supply stage 13 in the horizontal plane (FIG. 4).

  The movement operation of the relay stage 14 in the X-axis direction is performed when the control device 80 controls the operation of the table moving motor 36 and moves the moving table 33 along the rail 31 (FIG. 3A). FIG. 3B or FIG. 3B → FIG. 3A).

  The movement operation of the pickup head 16 in the Y-axis direction is performed by the control device 80 controlling the operation of the pickup head moving mechanism 41 to move the pickup head 16 in the Y-axis direction and the Z-axis direction (FIG. 4). The pick-up head 16 picks up the component 3 through the pick-up nozzle 16a and releases it by the control device 80 controlling the operation of a pick-up head pick-up mechanism 81 (FIG. 4) including an actuator (not shown).

  The movement operation of the mounting head 17 in the Y-axis direction is performed by controlling the operation of the mounting head horizontal moving mechanism 82 (FIG. 4) in which the control device 80 uses a linear motor composed of the head moving guide 24 and the front moving plate 51 as an actuator. The mounting head 17 is moved up and down with respect to the head moving guide 24 in the horizontal direction (Y-axis direction), and the mounting head 17 is moved up and down by a mounting head lifting mechanism including an actuator (not shown). 83 (FIGS. 1, 2 and 4) is performed to raise and lower the mounting head elevating plate 52 with respect to the front moving plate 51. Further, the component 3 is attracted and released by the mounting head 17 when the control device 80 controls the operation of the mounting head suction mechanism 84 (FIG. 4) including an actuator (not shown).

  The movement operation of the coating head 15 in the Y-axis direction is performed by controlling the operation of the coating head horizontal movement mechanism 85 (FIG. 4) in which the control device 80 uses a linear motor composed of the head movement guide 24 and the backward movement plate 53 as an actuator. Then, the back moving plate 53 is moved in the horizontal direction (Y-axis direction) with respect to the head moving guide 24, and the lifting and lowering operation of the coating head 15 is performed by the control device 80, which is a coating head lifting mechanism including an actuator (not shown). 86 (FIGS. 1, 2, and 4) is performed to raise and lower the coating head raising / lowering plate 54 with respect to the backward movement plate 53. In addition, the adhesive application operation by the application head 15 is performed by the control device 80 controlling the operation of an adhesive discharge mechanism 87 (FIG. 4) including an actuator (not shown).

  In the operation of pushing up the component 3 on the component supply stage 13 located at the pickup point P1, the controller 80 controls the ejector drive mechanism 88 (FIG. 4) including an actuator (not shown) to move the ejector 28 upward. Made by letting.

  Imaging operation of the region including the pick-up point P1 by the component supply stage camera 61, imaging operation of the region including the relay point P2 by the relay stage camera 62, imaging operation of the region including the mounting point P3 by the substrate holding stage camera 63, and the component recognition camera The control of the imaging operation of the region immediately above by 37 is performed by the control device 80 (FIG. 4). The image data obtained by the imaging operations of the component supply stage camera 61, the relay stage camera 62, the substrate holding stage camera 63, and the component recognition camera 37 is input to the control device 80 (FIG. 4).

  The advance operation of the sheet member 73 in the nozzle cleaner 70 is performed when the control device 80 controls the operation of a take-up reel drive mechanism 72a as a sheet member advance mechanism of the nozzle cleaner 70 to rotate the take-up reel 72 ( FIG. 4).

  Next, in the component mounting apparatus 1, a procedure for mounting the component 3 on the component supply stage 13 on the substrate 2 held on the substrate holding stage 23 will be described.

  In FIG. 2, the control device 80 first controls the operation of a wafer transfer mechanism (not shown) to hold the semiconductor wafer 27 cut into a plurality of components 3 on the component supply stage 13 and controls the operation of the substrate transfer path 12. Then, the substrate 2 to be mounted with the component 3 is held on the substrate holding stage 23 (preparation step).

  When the preparation process is completed, the control device 80 moves the relay stage 14 in the X-axis direction to position a predetermined position on the relay stage 14 (for example, the center position of the relay stage 14) at the relay point P2 (relay stage alignment). Process).

  When the relay stage alignment process is completed, the controller 80 moves the semiconductor wafer 27 on the component supply stage 13 in the horizontal plane direction, and mounts it on the substrate 2 while referring to an image captured by the component supply stage camera 61. The target component 3 is positioned at the pickup point P1 (component positioning step), the substrate 2 on the substrate holding stage 23 is moved in the horizontal plane, and an image captured by the substrate holding stage camera 63 is referred to. Meanwhile, the target mounting position on the substrate 2 is positioned at the mounting point P3 (substrate positioning step).

  When the component positioning step and the substrate positioning step are completed, the control device 80 positions the pickup head 16 at the pickup point P1 and sucks the component 3 to the pickup nozzle 16a (pickup step; arrow D1 shown in FIG. 2). ). In this pickup process, the control device 80 operates the ejector 28 so that the component 3 is easily attracted to the pickup nozzle 16a so that the component 3 is lifted up from below by the ejector 28. To do.

  When the pick-up process is completed, the control device 80 moves the pick-up head 16 picking up the part 3 from the pick-up point P1 to the relay point P2 and transfers the part 3 to the relay stage 14 (part-transfer process, FIG. 2). Arrow D2). The pickup head 16 having the component 3 transferred to the relay stage 14 is moved to the pickup point P1 in order to perform the next pickup process.

  When the component transfer process is completed, the control device 80 refers to the image of the relay stage 14 picked up by the relay stage camera 62 while referring to the position shift of the component 3 transferred on the relay stage 14 from the relay point P2. Calculate (positional deviation calculating step). Here, when the amount of deviation of the component 3 from the relay point P2 in the X-axis direction is obtained, the control device 80 moves the moving table 33 in the X-axis direction, and the amount of deviation in the X-axis direction is corrected. (X-axis direction position correction step).

  When the X-axis direction position correction process is completed, the control device 80 positions the mounting head 17 above the relay point P2, and mounts the component 3 placed at the relay point P2 in the above-described component transfer process on the mounting nozzle 17a. To adsorb the component 3 (component adsorbing step, arrow D3 shown in FIG. 2). At this time, the position in the Y-axis direction of the mounting head 17 above the relay point P2 is adjusted so that the amount of deviation in the Y-axis direction from the relay point P2 of the component 3 obtained in the positional deviation calculation step is corrected.

  At substantially the same time as the mounting head pickup process, the control device 80 moves the coating head 15 from the standby position (the rear end region of the head movement guide 24; see the position of the coating head 15 shown in FIG. 2) to the mounting point P3. The adhesive is applied to the mounting point P3 (that is, the target mounting position on the substrate 2) by the coating head 15 (adhesive coating step; arrow D4 shown in FIG. 2).

  When the adhesive application process is completed, the control device 80 retracts the application head 15 from the mounting point P3 to the standby position (application head retracting process). Immediately after the coating head retracting process is finished, the control device 80 moves the mounting head 17 from the relay point P2 to above the mounting point P3, and the component 3 sucked by the mounting nozzle 17a in the component suction step is mounted on the mounting point P3. (Part mounting step; arrow D5 shown in FIG. 2). As a result, the component 3 supplied to the pickup point P1 on the component supply stage 13 is mounted at the target mounting position on the substrate 2 via the relay stage 14.

  In this way, the mounting head 17 adsorbs the component 3 supplied by the component supply stage 13 as the component supply unit by the mounting nozzle 17a (via the relay stage 14) and positions it by the substrate transport path 12 as the substrate transport positioning unit. It is to be mounted on the substrate 2 that has been made.

  When one component 3 is mounted at the target mounting position on the substrate 2 in this manner, the subsequent process (the relay stage alignment process → the component alignment process / the substrate alignment process → → Repeat the component mounting process.

  In the component mounting step, when the component 3 picked up from the relay point P2 by the mounting head 17 passes above the component recognition camera 37, the control device 80 temporarily stops the movement of the mounting head 17 for mounting. The component 3 adsorbed by the nozzle 17a is stopped in the region immediately above the component recognition camera 37 (in the imaging field of view), and the component recognition camera 37 images (recognizes) the component 3 to obtain position information of the component 3. Obtain. As a result, the control device 80 can calculate the suction displacement of the component 3 with respect to the mounting nozzle 17a, and the movement amount of the mounting head 17 is adjusted so that the suction displacement is corrected when the component 3 is mounted on the substrate 2. By adjusting, the component 3 can be accurately mounted at the target mounting position on the substrate 2.

  If it is necessary to replace the mounting nozzle 17a in accordance with the shape of the component 3 to be mounted on the substrate 2 during the mounting of the component or the like, the table moving motor 36 is operated from the control device 80 to move the moving table 33. Is moved in the X-axis direction so that the replacement mounting nozzle 17a is positioned at a position suitable for replacement.

  When the control device 80 detects that the accumulated usage time of the mounting nozzle 17a (or the coating nozzle 15a) exceeds a predetermined threshold by counting the number of produced mounting boards on which the component 3 is mounted, etc. The mounting nozzle 17a (or the coating nozzle 15a) is cleaned by the nozzle cleaner 70. In cleaning the mounting nozzle 17a (coating nozzle 15a), first, the operation control of the substrate holding stage moving mechanism 22 is performed, and the horizontal posture portion 73a of the sheet member 73 of the nozzle cleaner 70 is positioned immediately below the mounting point P3.

  When the control device 80 positions the horizontal posture portion 73a of the sheet member 73 directly below the mounting point P3, the control device 80 presses the mounting nozzle 17a (application nozzle 15a) from above on the horizontal posture portion 73a of the sheet member 73 (FIG. 6 ( The arrow C) shown in a) and the operation control of the take-up reel drive mechanism 72a are performed to advance the sheet member 73 in the horizontal direction (X-axis direction) (arrow B shown in FIG. 6B). As a result, the mounting nozzle 17a (coating nozzle 15a) and the sheet member 73 move relative to each other, and dust adhering to the mounting nozzle 17a (or adhesive wrinkles adhering to the coating nozzle 15a) is removed (FIG. 6 ( b)).

  As described above, in the component mounting apparatus 1 according to the present embodiment, the nozzle cleaner 70 includes the sheet member 73 and the take-up reel drive mechanism 72a as the sheet member advance mechanism that advances the sheet member 73 in the horizontal direction. The mounting nozzle 17a (or the coating nozzle 15a) is cleaned by advancing the sheet member 73 by the take-up reel drive mechanism 72a while the suction nozzle (or the coating nozzle 15a) is pressed from above onto the head 73. Since the nozzle cleaner itself does not need to be moved when the mounting nozzle 17a (coating nozzle 15a) is cleaned, and the mounting nozzle 17a (coating nozzle 15a) does not need to be moved, the overall size can be reduced. , Clearing of the mounting nozzle 17a (coating nozzle 15a) Training can be fully carried out. The nozzle cleaner 70 may be dedicated to the mounting nozzle 17a or the coating nozzle 15a, or may be shared if it can be shared by the mounting nozzle 17a and the coating nozzle 15a.

  Here, as shown in FIGS. 6 (a) and 6 (b), a cylindrical recess 15b opened downward is provided at the lower end of the application nozzle 15a, and the adhesive extends in the vertical direction inside the application nozzle 15a. If the lower end of the passage 15c is opened in the recess 15b and the lower end of the adhesive passage 15c cannot be cleaned only by bringing the lower end of the coating nozzle 15a into contact with the sheet member 73, the backup member 74 On the upper surface, a cylindrical projection 74a having a shape that enters the recess 15b from below is formed, and a part of the horizontal posture portion 73a of the sheet member 73 is lifted by the projection 74a of the backup member 74, so that the adhesive passage 15c What is necessary is just to make it contact with a lower end, and, thereby, the wrinkles of the adhesive adhering to the lower end of the application nozzle 15a can be removed reliably.

  As described above, in the case where the protrusion 74a of the backup member 74 is configured to enter the recess 15b at the lower end of the coating nozzle 15a from below, the coating nozzle 15a cannot be moved relative to the backup member 74 ( If the relative movement is made, the protrusion 74a and the inner wall of the recess 15b interfere with each other), so that the sheet member 73 is moved to the sheet member 73 with the application nozzle 15a pressed against the sheet member 73 from above (the take-up reel). The above-described configuration for cleaning the coating nozzle 15a by being advanced by the drive mechanism 72a) is very effective.

  In the component mounting apparatus 1 according to the present embodiment, the traveling direction of the sheet member 73 in the nozzle cleaner 70 is parallel to the transport direction (X-axis direction) of the substrate 2 through the substrate transport path 12, and the nozzle cleaner 70 transports the substrate. Since it is provided adjacent to the path 12, a large space is not required for installing the nozzle cleaner 70, and the component mounting apparatus 1 as a whole can be made compact from this aspect as well.

  Provided is a component mounting apparatus capable of sufficiently cleaning an adsorption nozzle and a coating nozzle while reducing the overall size.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 3 Components 12 Board | substrate conveyance path (board | substrate conveyance positioning part)
13 Component supply stage (component supply unit)
15 coating head 15a coating nozzle 17 mounting head 17a mounting nozzle (adsorption nozzle)
70 Nozzle cleaner 72a Take-up reel drive mechanism (sheet member advancing mechanism)
73 Sheet member

Claims (4)

A substrate transfer positioning unit for transferring and positioning the substrate;
A component supply unit for supplying components;
A mounting head for mounting the component supplied by the component supply unit on the substrate positioned by the substrate transfer positioning unit by sucking the component by the suction nozzle;
The sheet member has a sheet member advancing mechanism for advancing the sheet member in the horizontal direction, and the adsorption nozzle is cleaned by advancing the sheet member with the sheet member advancing mechanism in a state where the adsorption nozzle is pressed from above on the sheet member. A component mounting apparatus comprising a nozzle cleaner.   An application head that applies adhesive onto the substrate from the application nozzle to attach the component to the substrate when the component is mounted on the substrate is provided.The nozzle cleaner holds the sheet member in a state where the application nozzle is pressed from above. The component mounting apparatus according to claim 1, wherein the coating nozzle is cleaned by being advanced by a sheet member advancing mechanism. A substrate transfer positioning unit for transferring and positioning the substrate;
A component supply unit for supplying components;
A mounting head for mounting the component supplied by the component supply unit on the substrate positioned by the substrate transfer positioning unit by sucking the component by the suction nozzle;
An application head for applying an adhesive on the substrate from an application nozzle to attach the component to the substrate when mounting the component on the substrate;
A sheet member and a sheet member advancing mechanism for advancing the sheet member in the horizontal direction, and the coating nozzle is cleaned by advancing the sheet member with the sheet member advancing mechanism in a state where the application nozzle is pressed from above on the sheet member. A component mounting apparatus comprising a nozzle cleaner.   4. The moving direction of the sheet member in the nozzle cleaner is parallel to the substrate conveyance direction by the substrate conveyance positioning unit, and the nozzle cleaner is provided adjacent to the substrate conveyance positioning unit. A component mounting apparatus according to the above.

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