JP2012123207A - Exposure apparatus and exposure method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a through-put by shortening a tact time when scanning a substrate by linear exposure light passing through a mask and forming an alignment region on an oriented film on the substrate.SOLUTION: In an exposure light irradiation device 30, the linear exposure light formed by a line generator 34 is reflected by a plurality of reflection surfaces of a polygon mirror 36 and irradiates it to a light shielding plate 39 that is disposed between the polygon mirror 36 and a mask 2 and formed with an opening elongated in the direction of extending the linear exposure light. While repeatedly scanning a part of the region on the substrate 1 with the linear exposure light that is reflected by the plurality of reflection surfaces of the polygon mirror 36 that is rotated, passes though the opening of the light shielding plate 39 and transmits the mask 2, the exposure device moves a chuck 10, a mask holder 20 and the exposure light irradiation device 30 relatively to each other so as to move the scanning region of the substrate 1.

Description

  In the manufacture of a liquid crystal display device, the present invention is directed to an alignment film exposure apparatus and an exposure apparatus that irradiates an alignment film containing a polymer substance with linearly polarized exposure light to provide alignment characteristics that align the alignment direction of liquid crystals. More particularly, the present invention relates to an alignment film exposure apparatus and an exposure method for forming a plurality of different alignment regions on an alignment film on one substrate using a photomask (hereinafter referred to as “mask”).

  2. Description of the Related Art An active matrix liquid crystal display device is manufactured by enclosing liquid crystal between a TFT (Thin Film Transistor) substrate and a color filter substrate, and arranging the liquid crystal alignment direction on the surface of the TFT substrate and the color filter substrate. An alignment film is formed. The process of imparting alignment characteristics to align the alignment direction of the liquid crystal on the alignment film has been conventionally performed by a “rubbing method” in which the surface of the alignment film is rubbed with a cloth, but recently, an alignment film made of a polymer compound such as polyimide. In addition, a “photo-alignment method” has been developed in which linearly polarized ultraviolet light is irradiated onto an alignment film containing a polymer material such as a polymer.

  In the photo-alignment method, the substrate is scanned with a linearly polarized ultraviolet light obliquely applied to the alignment film and a plurality of linear exposure lights arranged at equal intervals, as a method of developing a pretilt angle in the alignment film. Then, there is a method of giving a temporal change to the contrast of the exposure light. The latter method can change the pretilt direction of the alignment characteristic imparted to the alignment film by changing the scanning direction of the substrate with the linear exposure light. In addition, the pretilt angle of the alignment characteristic imparted to the alignment film can be controlled by changing the number and period of exposure light contrast by changing the number of linear exposure light and the scanning speed. For example, Patent Document 1 discloses a technique for imparting alignment characteristics to a polymer film surface by exposing the polymer film surface through the slit plate while relatively moving the polymer film surface and the slit plate. Yes.

  In Patent Document 2, in order to increase the viewing angle of a liquid crystal display device, to improve display quality, and to improve contrast, in a pair of substrates sandwiching a liquid crystal layer, an alignment film on each substrate has a pretilt direction of about 180 °. Each of the substrates is divided into two different alignment regions, and the two substrates are bonded so that the boundary between the alignment regions on one substrate and the alignment region on the other substrate are substantially perpendicular to each other. A forming technique is disclosed.

JP 2003-295188 A JP-A-11-352486

  As described in Patent Document 2, when a plurality of different alignment regions are formed on an alignment film on a single substrate, it is necessary to perform exposure for each alignment region having a different pretilt direction. A mask that covers the other area is required. When a plurality of different alignment regions are formed on an alignment film on a single substrate using a mask, a method of scanning the substrate with a plurality of linear exposure lights arranged at equal intervals is used to form a linear plate such as a slit plate. Since it is necessary to physically move the apparatus for creating the exposure light, or the mask and the substrate, there is a limit in increasing the scanning speed, and there is a problem that the tact time becomes long.

  An object of the present invention is to shorten a tact time and improve throughput when a substrate is scanned with linear exposure light transmitted through a mask to form an alignment region in an alignment film on the substrate.

  An alignment film exposure apparatus of the present invention includes a chuck that supports a substrate, a mask holder that holds a mask, and an exposure light irradiation device that irradiates linearly polarized exposure light. Alignment film exposure that provides alignment characteristics that align the alignment direction of the liquid crystal in the alignment film applied to the substrate by irradiating the substrate with linearly polarized exposure light irradiated from the exposure light irradiation device through a mask. The apparatus includes a moving unit that relatively moves the chuck and the mask holder and the exposure light irradiation device, and the exposure light irradiation device generates a linear exposure light, and a line generated by the line generator. A polygon mirror having a plurality of reflecting surfaces for reflecting the exposure light in the form of a beam, and an elongated opening arranged in a direction in which the linear exposure light extends, arranged between the polygon mirror and the mask. A light plate, rotating a polygon mirror, reflected by a plurality of reflecting surfaces of the polygon mirror, passing through the opening of the light shielding plate, and repeating a partial area of the substrate with linear exposure light transmitted through the mask While scanning, the moving means shifts the chuck and mask holder relative to the exposure light irradiation device to move the scanning region of the substrate.

  In the alignment film exposure method of the present invention, the substrate is supported by a chuck, the mask is held by a mask holder, a minute gap is provided between the mask and the substrate, and the linearly polarized light irradiated from the exposure light irradiation apparatus is provided. Is an alignment film exposure method that irradiates the alignment light applied to the substrate with the alignment light applied to the alignment film by aligning the alignment direction of the liquid crystal with the alignment film applied to the substrate. To the light-shielding plate that forms a long and narrow opening in the direction in which the linear exposure light extends by reflecting the linear exposure light created by the above method with a plurality of reflecting surfaces of the polygon mirror and arranging it between the polygon mirror and the mask. Irradiate, rotate the polygon mirror, be reflected by the multiple reflecting surfaces of the polygon mirror, pass through the opening of the light shielding plate, and repeatedly run on a part of the substrate with linear exposure light that has passed through the mask While the chuck and the mask holder, and relatively moving the exposure light irradiation device is intended to move the scanning area of the substrate.

  The linear exposure light reflected by the plurality of reflecting surfaces of the rotating polygon mirror repeatedly scans a partial area of the substrate at a high speed, and in parallel, the chuck and mask holder and the exposure light. The scanning area of the substrate is moved by the relative movement with the irradiation device, so that the scanning of the substrate with the linear exposure light is rapidly performed over the entire width in the scanning direction of the substrate, and the tact time is shortened. And throughput is improved. Further, the scanning direction of the substrate by the linear exposure light can be changed by rotating the polygon mirror in the reverse direction. Further, the pretilt angle of the alignment characteristic imparted to the alignment film can be controlled by changing the number or rotation speed of the reflecting surfaces of the polygon mirror to adjust the number and period of changes in the contrast of the exposure light.

  Further, the alignment film exposure apparatus of the present invention is such that the exposure light irradiation apparatus irradiates the mask with the linear exposure light reflected by the plurality of reflecting surfaces of the polygon mirror substantially vertically to the mask through the opening of the light shielding plate. It is. In the alignment film exposure method of the present invention, linear exposure light reflected by a plurality of reflecting surfaces of a polygon mirror is irradiated to a mask substantially vertically through an opening of a light shielding plate. Since the exposure light is irradiated from the mask to the substrate substantially perpendicularly, the alignment region is formed with high accuracy without lowering the exposure accuracy.

  Alternatively, in the alignment film exposure apparatus of the present invention, the exposure light irradiation apparatus irradiates the mask with the linear exposure light reflected by the plurality of reflecting surfaces of the polygon mirror obliquely through the opening of the light shielding plate. is there. In the alignment film exposure method of the present invention, linear exposure light reflected by a plurality of reflecting surfaces of a polygon mirror is obliquely irradiated onto a mask through an opening of a light shielding plate. Since the exposure light is obliquely applied to the substrate through the mask, the pretilt angle is more effectively expressed.

  Further, in the alignment film exposure apparatus of the present invention, the exposure light irradiation apparatus includes a plurality of polygon mirrors, and each polygon mirror is reflected by a plurality of reflection surfaces of each polygon mirror and passes through the opening of the light shielding plate. The scanning area of the substrate by the linear exposure light that has passed through is arranged so as to be aligned in a direction orthogonal to the moving direction in accordance with the relative movement of the chuck and mask holder by the moving means and the exposure light irradiation device. Is. In the alignment film exposure method of the present invention, the exposure light irradiation apparatus is provided with a plurality of polygon mirrors, each polygon mirror is reflected by a plurality of reflection surfaces of each polygon mirror, passes through the opening of the light shielding plate, and is masked. The scanning region of the substrate by the linear exposure light that has passed through is arranged so as to be aligned in a direction orthogonal to the movement direction in accordance with the relative movement of the chuck and mask holder and the exposure light irradiation device. In a direction orthogonal to the moving direction, scanning of the substrate is performed in parallel with a plurality of linear exposure lights, the tact time is further shortened, and the throughput is further improved.

  Furthermore, the alignment film exposure apparatus of the present invention includes an exposure light irradiation device that includes a direction changing device that changes the direction of the polygon mirror, changes the rotation direction of the polygon mirror, and changes the direction of the polygon mirror by the direction changing device. Changing the scanning direction of the substrate with linear exposure light, and changing the relative movement direction of the chuck and mask holder with the exposure light irradiation device by the moving means, and the pretilt direction of the alignment characteristics to be applied to the alignment film Is to change. In the alignment film exposure method of the present invention, the exposure light irradiation device is provided with a direction changing device for changing the direction of the polygon mirror, the rotation direction of the polygon mirror is changed, and the direction of the polygon mirror is changed by the direction changing device. , Changing the scanning direction of the substrate by the linear exposure light and changing the relative movement direction of the chuck and the mask holder and the exposure light irradiation device to change the pretilt direction of the alignment characteristic to be applied to the alignment film. Is. Combining the scanning direction of the substrate with linear exposure light and the relative movement direction of the chuck and mask holder and the exposure light irradiation device forms three or more different alignment regions on the alignment film on one substrate. can do.

  According to the present invention, the polygon mirror is rotated, reflected by the plurality of reflecting surfaces of the polygon mirror, passed through the opening of the light shielding plate, and a part of the area of the substrate is formed by the linear exposure light transmitted through the mask. While repeatedly scanning, the substrate is scanned with the linear exposure light transmitted through the mask by moving the chuck and the mask holder and the exposure light irradiation device relative to each other and moving the scanning area of the substrate. When the alignment region is formed in the alignment film on the substrate, the tact time can be shortened and the throughput can be improved. Further, the scanning direction of the substrate by the linear exposure light can be changed by rotating the polygon mirror in the reverse direction. Further, the pretilt angle of the alignment characteristic imparted to the alignment film can be controlled by changing the number or rotation speed of the reflecting surfaces of the polygon mirror to adjust the number and period of changes in the contrast of the exposure light.

  Furthermore, according to the present invention, the linear exposure light reflected by the plurality of reflecting surfaces of the polygon mirror is irradiated almost perpendicularly to the mask through the opening of the light shielding plate, thereby reducing the exposure accuracy. The alignment region can be formed with high accuracy.

  Alternatively, according to the present invention, the linear exposure light reflected by the plurality of reflecting surfaces of the polygon mirror is obliquely applied to the mask through the opening of the light shielding plate, so that the exposure light is obliquely applied to the substrate through the mask. Irradiation allows the pretilt angle to be expressed more effectively.

  Further, according to the present invention, the exposure light irradiation device is provided with a plurality of polygon mirrors, and each polygon mirror is reflected by a plurality of reflecting surfaces of each polygon mirror, passes through the opening of the light shielding plate, and passes through the mask. The tact time is further shortened by arranging the scanning area of the substrate by the exposure light in a line so that it is aligned in a direction perpendicular to the moving direction in accordance with the relative movement of the chuck and mask holder and the exposure light irradiation device. Thus, the throughput can be further improved.

  Further, according to the present invention, the exposure light irradiation device is provided with a direction changing device for changing the direction of the polygon mirror, the direction of rotation of the polygon mirror is changed, and the direction of the polygon mirror is changed by the direction changing device. By changing the scanning direction of the substrate by exposure light and changing the relative movement direction of the chuck and mask holder and the exposure light irradiation device to change the pretilt direction of the alignment characteristics to be applied to the alignment film, 3 or more different alignment regions are formed on an alignment film on one substrate by combining the scanning direction of the substrate with the exposure light in the form of a beam and the relative movement direction of the chuck and mask holder and the exposure light irradiation device. be able to.

It is a figure which shows schematic structure of the aligner exposure apparatus by one embodiment of this invention. It is a figure explaining operation | movement of exposure light irradiation apparatus. It is a figure explaining operation | movement of exposure light irradiation apparatus. It is a figure explaining the exposure method of the alignment film by one embodiment of this invention. It is a figure explaining the exposure method of the alignment film by one embodiment of this invention. It is a figure explaining the exposure method of the alignment film by other embodiment of this invention. It is a figure explaining the exposure method of the alignment film by other embodiment of this invention. It is a figure which shows a part of exposure light irradiation apparatus of the exposure apparatus of the alignment film by other embodiment of this invention. It is a figure which shows the scanning area | region of the board | substrate in the aligner exposure apparatus shown in FIG. It is a figure which shows schematic structure of the aligner exposure apparatus by further another embodiment of this invention. It is a figure explaining operation | movement of the aligner exposure apparatus shown in FIG.

  FIG. 1 is a diagram showing a schematic configuration of an alignment film exposure apparatus according to an embodiment of the present invention. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck support base 9, a chuck 10, a mask holder 20, an exposure light irradiation device 30, a light source control device 40, The power supply 41, the optical system drive circuit 50, the moving device 51, the stage drive circuit 60, and the main control device 70 are configured. In addition to these, the exposure apparatus includes a substrate transfer robot that loads the substrate 1 into the chuck 10 and unloads the substrate 1 from the chuck 10, a temperature control unit that performs temperature management in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  In FIG. 1, the chuck 10 is at an exposure position where the alignment film of the substrate 1 is exposed. At a load / unload position away from the exposure position, the substrate 1 is carried into the chuck 10 by the substrate transfer robot (not shown), and the substrate 1 is carried out from the chuck 10. The loading of the substrate 1 onto the chuck 10 and the unloading of the substrate 1 from the chuck 10 are performed using a plurality of push-up pins provided on the chuck 10. The push-up pin is housed inside the chuck 10 and is lifted from the inside of the chuck 10 to receive the substrate 1 from the substrate transfer robot and unload the substrate 1 from the chuck 10 when loading the substrate 1 onto the chuck 10. In doing so, the substrate 1 is delivered to the substrate transfer robot. The chuck 10 supports the back surface of the substrate 1 by vacuum suction. On the surface of the substrate 1, an alignment film containing a polymer material such as a polymer (polymer) is applied.

  The chuck 10 is mounted on the θ stage 8 via the chuck support 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves along the X guide 4 in the X direction (the horizontal direction in FIG. 1). The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves along the Y guide 6 in the Y direction (the depth direction in FIG. 1). The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support 9 is mounted on the θ stage 8 and supports the chuck 10 at a plurality of locations. The X stage 5, Y stage 7, and θ stage 8 are provided with drive mechanisms (not shown) such as ball screws and motors, linear motors, etc., and each drive mechanism is driven by a stage drive circuit 60.

  The chuck 10 is moved between the load / unload position and the exposure position by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. At the load / unload position, the substrate 1 mounted on the chuck 10 is pre-aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Is done. At the exposure position, a mask holder 20 (to be described later) is moved and tilted in the Z direction (the vertical direction in FIG. 1) by a Z-tilt mechanism (not shown), so that the gap between the mask 2 and the substrate 1 is adjusted. Then, the mask 2 and the substrate 1 are aligned by the movement of the X stage 5 in the X direction, the movement of the Y stage 7 in the Y direction, and the rotation of the θ stage 8 in the θ direction. The main controller 70 controls the stage drive circuit 60 to move the X stage 5 in the X direction, move the Y stage 7 in the Y direction, and rotate the θ stage 8 in the θ direction.

  In the present embodiment, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction. However, the chuck support base 9 is provided with a Z-tilt mechanism, The gap between the mask 2 and the substrate 1 may be adjusted by moving and tilting the chuck 10 in the Z direction.

  A mask holder 20 for holding the mask 2 is installed above the exposure position. The mask holder 20 is provided with an opening through which exposure light passes, and a suction groove (not shown) is provided around the opening on the lower surface of the mask holder 20. The mask holder 20 vacuum-sucks the peripheral part of the mask 2 by a suction groove (not shown) and holds the mask 2 on its lower surface. By exposing the exposure light irradiated from the exposure light irradiation device 30 to the substrate 1 through the mask 2, the alignment film of the substrate 1 is exposed.

  The exposure light irradiation device 30 includes a lamp 31, a condensing mirror 32, an optical fiber 33, a line generator 34, a polarizer 35, a polygon mirror 36, a motor 37, a collimating lens 38, and a light shielding plate 39. As the lamp 31, a discharge type lamp in which high-pressure gas is enclosed in a bulb, such as a mercury lamp, a halogen lamp, a xenon lamp, or the like is used. A condensing mirror 32 that condenses the light generated from the lamp 31 is provided around the lamp 31. The light generated from the lamp 31 is collected by the condenser mirror 32 and enters the optical fiber 33.

  In place of the lamp 31, a light emitting diode (LED) or a laser light source may be used. In this case, the condensing mirror 32 becomes unnecessary, and light from the light emitting diode or the laser light source is directly incident on the optical fiber 33.

  The light emitted from the optical fiber 33 enters the line generator 34. The line generator 34 stretches the beam-like light emitted from the optical fiber 33 to create linear exposure light extending in the front side and the depth direction in FIG. The linear exposure light created by the line generator 34 passes through the polarizer 35 to become linearly polarized light, and is irradiated onto the polygon mirror 36. The polygon mirror 36 has a plurality of reflecting surfaces that reflect the linear exposure light created by the line generator 34 and is rotated by a motor 37. The linear exposure light reflected by the plurality of reflecting surfaces of the polygon mirror passes through the collimating lens 38 and becomes a parallel light beam.

  A light shielding plate 39 is disposed between the polygon mirror 36 and the mask 2 held by the mask holder 20. 2 and 3 are diagrams for explaining the operation of the exposure light irradiation apparatus. As shown in FIGS. 2 and 3, an elongated opening is formed between the two light shielding plates 39 in the direction in which the linear exposure light extends. The linear exposure light that has passed through the collimator lens 38 is irradiated to the light shielding plate 39, and the linear exposure light that has passed through the opening of the light shielding plate 39 is irradiated to the mask 2.

  In FIG. 2, when the polygon mirror 36 is rotated in the direction indicated by the arrow A, the linear exposure light 30 a reflected by the plurality of reflecting surfaces of the polygon mirror 36 and passing through the opening of the light shielding plate 39 is indicated by the arrow B. Move in the direction. Then, with the rotation of the polygon mirror 36, the reflection surface of the polygon mirror 36 is switched, and the movement of the linear exposure light 30a in the direction indicated by the arrow B is repeatedly performed at high speed. In FIG. 3, when the polygon mirror 36 is rotated in the direction indicated by the arrow C, the linear exposure light 30a reflected by the plurality of reflecting surfaces of the polygon mirror 36 and passing through the opening of the light shielding plate 39 is indicated by the arrow D. Move in the direction indicated by. As the polygon mirror 36 rotates, the reflection surface of the polygon mirror 36 is switched, and the linear exposure light 30a is repeatedly moved in the direction indicated by the arrow D at a high speed.

  In FIG. 1, the light source control device 40 controls the power supplied from the power source 41 to the lamp 31 under the control of the main control device 70 to adjust the illuminance of the exposure light. The moving device 51 moves the exposure light irradiation device 30 in the XY directions over the mask holder 20. The moving device 51 is provided with a drive mechanism (not shown) such as a ball screw and a motor or a linear motor, and the drive mechanism is driven by the optical system drive circuit 50. The optical system driving circuit 50 drives the driving mechanism of the moving device 51 and drives the motor 37 under the control of the main control device 70.

  4 and 5 are diagrams for explaining an alignment film exposure method according to an embodiment of the present invention. In FIG. 4, the exposure light irradiation device 30 rotates the polygon mirror 36 in the direction indicated by the arrow A by the motor 37. The linear exposure light reflected by the plurality of reflecting surfaces of the polygon mirror 36 and passing through the opening of the light shielding plate 39 is irradiated onto the mask 2 and a part of the substrate 1 is irradiated by the linear exposure light transmitted through the mask 2. These areas are repeatedly scanned. In parallel with this scanning, the moving device 51 moves the exposure light irradiation device 30 in the direction indicated by the arrow E, and moves the scanning region 30b of the substrate 1 by the linear exposure light in the scanning direction.

  In the case where an alignment region having an opposite pretilt direction is formed on the alignment film, the exposure light irradiation device 30 rotates the polygon mirror 36 in the direction indicated by the arrow C by the motor 37 in FIG. Then, the exposure light irradiation device 30 is moved in the direction indicated by the arrow F by the moving device 51. By a simple operation of rotating the polygon mirror 36 in the reverse direction, the scanning direction of the substrate 1 by the linear exposure light is changed.

  In the present embodiment, the exposure light irradiation device 30 is moved by the moving device 51, but instead of moving the exposure light irradiation device 30, the chuck 10 and the mask holder 20 are moved to move the chuck 10 and the mask. You may move the holder 20 and the exposure light irradiation apparatus 30 relatively.

  The linear exposure light reflected by the plurality of reflecting surfaces of the rotating polygon mirror 36 repeatedly scans a part of the substrate 1 at a high speed, and in parallel therewith, the chuck 10 and the mask holder 20. Since the scanning area of the substrate 1 is moved by the relative movement with the exposure light irradiation device 30, the scanning of the substrate 1 by the linear exposure light is quickly performed over the entire width of the substrate 1 in the scanning direction. The tact time is shortened and the throughput is improved. Further, the scanning direction of the substrate by the linear exposure light can be changed by rotating the polygon mirror 36 in the reverse direction. Furthermore, the number of reflection surfaces of the polygon mirror 36 or the rotation speed can be changed to adjust the number and period of changes in the contrast of the exposure light, thereby controlling the pretilt angle of the alignment characteristic imparted to the alignment film.

  In the present embodiment, the exposure light irradiation device 30 adjusts the position of the opening of the light shielding plate 39 and the width of the opening in the scanning direction so that the linear exposure light reflected by the plurality of reflecting surfaces of the polygon mirror 36 is adjusted. Is irradiated to the mask 2 almost vertically through the opening of the light shielding plate 39. Since the exposure light is irradiated from the mask 2 to the substrate 1 almost perpendicularly, the alignment region is formed with high accuracy without lowering the exposure accuracy.

  6 and 7 are diagrams illustrating an alignment film exposure method according to another embodiment of the present invention. In the present embodiment, the exposure light irradiation device 30 adjusts the position of the opening of the light shielding plate 39 and the width of the opening in the scanning direction so that the linear exposure light reflected by the plurality of reflecting surfaces of the polygon mirror 36 is adjusted. Is obliquely applied to the mask 2 through the opening of the light shielding plate 39. Since the exposure light is obliquely applied to the substrate 1 through the mask 2, the pretilt angle is more effectively expressed.

  FIG. 8 is a view showing a part of an exposure light irradiation apparatus of an alignment film exposure apparatus according to another embodiment of the present invention. In the present embodiment, the exposure light irradiation device 30 is provided with a plurality of line generators 34, polarizers 35, polygon mirrors 36, and collimating lenses 38. Each polygon mirror 36 is reflected by a plurality of reflecting surfaces of each polygon mirror 36, passes through the opening of the light shielding plate 39, and the scanning region 30 b of the substrate 1 by the linear exposure light transmitted through the mask 2 is moved by the moving device 51. With the relative movement of the chuck 10 and the mask holder 20 and the exposure light irradiation device 30 due to the above, they are arranged in a direction perpendicular to the moving direction.

  FIG. 9 is a view showing a scanning region of the substrate in the alignment film exposure apparatus shown in FIG. Each scanning region 30b shown by a solid line in FIG. 9 moves as shown by a broken line in FIG. 9 along with the relative movement of the chuck 10 and the mask holder 20 and the exposure light irradiation device 30 by the moving device 51. Line up in the direction perpendicular to the direction of movement. In the direction orthogonal to the moving direction, scanning of the substrate 1 is performed in parallel with a plurality of linear exposure lights, and the tact time is further shortened, thereby further improving the throughput. In FIG. 9, six scanning regions 30b are arranged in the Y direction, but the present invention is not limited to this. In FIG. 9, each scanning region 30b is overlapped by half in the Y direction, but the present invention is not limited to this.

  FIG. 10 is a diagram showing a schematic configuration of an alignment film exposure apparatus according to still another embodiment of the present invention. In the alignment film exposure apparatus of the present embodiment, the exposure light irradiation device 30 is provided with a direction changing device 52 that changes the orientation of the polygon mirror 36. The direction changing device 52 is provided with a rotating base on which the line generator 34, the polarizer 35 and the polygon mirror 36 are mounted, and a driving mechanism such as a ball screw and a motor for driving the rotating base. The optical system drive circuit 50 drives the drive mechanism of the direction changing device 52 under the control of the main control device 70.

  FIG. 11 is a view for explaining the operation of the alignment film exposure apparatus shown in FIG. The alignment film exposure apparatus according to the present embodiment forms four types of alignment regions having different pretilt directions by approximately 90 degrees on an alignment film on one substrate. In FIG. 11A, when the alignment region 1a is exposed, the other alignment regions 1b, 1c, 1d are covered with the mask 2. The exposure light irradiation device 30 changes the direction so that the moving direction of the linear exposure light 30a reflected by the plurality of reflecting surfaces of the polygon mirror 36 and passing through the opening of the light shielding plate 39 is the direction indicated by the arrow B1. The device 52 rotates the direction of the polygon mirror 36 by 45 degrees. Then, a part of the alignment region 1 a of the substrate 1 is repeatedly scanned with the linear exposure light reflected by the plurality of reflecting surfaces of the rotating polygon mirror 36 and passing through the opening of the light shielding plate 39 and passing through the mask 2. However, the exposure device 30 is moved in the direction indicated by the arrow E by the moving device 51. At this time, in the case where the pretilt direction is along the traveling direction of the exposure light according to the properties of the alignment film, the alignment region 1a is given an alignment characteristic in which the pretilt direction is on the lower right side of the drawing indicated by an arrow.

  In FIG. 11B, when the alignment region 1b is exposed, the other alignment regions 1a, 1c, and 1d are covered with the mask 2. The exposure light irradiation device 30 is arranged so that the moving direction of the linear exposure light 30a reflected by the plurality of reflecting surfaces of the polygon mirror 36 and passing through the opening of the light shielding plate 39 is the direction indicated by the arrow D1. Rotate 36 in the reverse direction. Then, a part of the alignment region 1b of the substrate 1 is repeatedly scanned with the linear exposure light that is reflected by the plurality of reflecting surfaces of the rotating polygon mirror 36, passes through the opening of the light shielding plate 39, and passes through the mask 2. However, the exposure device 30 is moved in the direction indicated by the arrow F by the moving device 51. At this time, when the pretilt direction is along the traveling direction of the exposure light according to the properties of the alignment film, the alignment region 1b is provided with an alignment characteristic in which the pretilt direction is on the upper left side of the drawing indicated by an arrow.

  In FIG. 11C, when the alignment region 1c is exposed, the other alignment regions 1a, 1b, and 1d are covered with the mask 2. The exposure light irradiation device 30 changes the direction so that the moving direction of the linear exposure light 30a reflected by the plurality of reflecting surfaces of the polygon mirror 36 and passing through the opening of the light shielding plate 39 is the direction indicated by the arrow B2. The device 52 rotates the direction of the polygon mirror 36 by 90 degrees. Then, a part of the alignment region 1c of the substrate 1 is repeatedly scanned with the linear exposure light that is reflected by the plurality of reflecting surfaces of the rotating polygon mirror 36, passes through the opening of the light shielding plate 39, and passes through the mask 2. However, the exposure device 30 is moved in the direction indicated by the arrow E by the moving device 51. At this time, in the case where the pretilt direction is along the traveling direction of the exposure light according to the properties of the alignment film, the alignment region 1c is given an alignment characteristic in which the pretilt direction is on the upper right side of the drawing indicated by an arrow.

  In FIG. 11D, when the alignment region 1d is exposed, the other alignment regions 1a, 1b, and 1c are covered with the mask 2. The exposure light irradiation device 30 is arranged so that the moving direction of the linear exposure light 30a reflected by the plurality of reflecting surfaces of the polygon mirror 36 and passing through the opening of the light shielding plate 39 is the direction indicated by the arrow D2. Rotate 36 in the reverse direction. Then, a part of the alignment region 1 d of the substrate 1 is repeatedly scanned with the linear exposure light reflected by the plurality of reflecting surfaces of the rotating polygon mirror 36 and passing through the opening of the light shielding plate 39 and transmitted through the mask 2. However, the exposure device 30 is moved in the direction indicated by the arrow F by the moving device 51. At this time, in the case where the pretilt direction is along the traveling direction of the exposure light according to the property of the alignment film, the alignment region 1d is provided with an alignment characteristic in which the pretilt direction is on the lower left side of the drawing indicated by an arrow.

  According to the embodiment described above, the polygon mirror 36 is rotated, reflected by the plurality of reflecting surfaces of the polygon mirror 36, passed through the opening of the light shielding plate 39, and by the linear exposure light transmitted through the mask 2. The mask 2 is moved by moving the chuck 10 and the mask holder 20 and the exposure light irradiation device 30 relative to each other while repeatedly scanning a partial area of the substrate 1 to move the scanning area of the substrate 1. When the substrate 1 is scanned with the transmitted linear exposure light to form the alignment region in the alignment film on the substrate 1, the tact time can be shortened and the throughput can be improved. Further, the scanning direction of the substrate 1 by the linear exposure light can be changed by rotating the polygon mirror 36 in the reverse direction. Furthermore, the number of reflection surfaces of the polygon mirror 36 or the rotation speed can be changed to adjust the number and period of changes in the contrast of the exposure light, thereby controlling the pretilt angle of the alignment characteristic imparted to the alignment film.

  Further, according to the embodiment shown in FIGS. 4 and 5, the linear exposure light reflected by the plurality of reflecting surfaces of the polygon mirror 36 is irradiated to the mask 2 almost vertically through the opening of the light shielding plate 39. By doing so, the alignment region can be formed with high accuracy without lowering the exposure accuracy.

  Alternatively, according to the embodiment shown in FIGS. 6 and 7, the linear exposure light reflected by the plurality of reflecting surfaces of the polygon mirror 36 is irradiated obliquely onto the mask 2 through the opening of the light shielding plate 39. Accordingly, the pretilt angle can be expressed more effectively by irradiating the exposure light obliquely to the substrate 1 through the mask 2.

  Further, according to the embodiment shown in FIGS. 8 and 9, the exposure light irradiation device 30 is provided with a plurality of polygon mirrors 36, and each polygon mirror 36 is reflected by a plurality of reflecting surfaces of each polygon mirror 36. The scanning region of the substrate 1 by the linear exposure light that has passed through the opening of the light shielding plate 39 and transmitted through the mask 2 moves in accordance with the relative movement of the chuck 10, the mask holder 20, and the exposure light irradiation device 30. By arranging them in a direction orthogonal to the direction, the tact time can be further shortened and the throughput can be further improved.

  Further, according to the embodiment shown in FIGS. 10 and 11, the exposure light irradiation device 30 is provided with the direction changing device 52 for changing the direction of the polygon mirror 36, the rotation direction of the polygon mirror 36 is changed, and the direction is changed. The direction of the polygon mirror 36 is changed by the device 52 to change the scanning direction of the substrate 1 by the linear exposure light, and the relative moving direction of the chuck 10 and the mask holder 20 and the exposure light irradiation device 30 is changed. Thus, by changing the pretilt direction of the alignment characteristic imparted to the alignment film, the scanning direction of the substrate 1 by the linear exposure light and the relative movement direction of the chuck 10, the mask holder 20, and the exposure light irradiation device 30 Can be combined to form four different alignment regions in an alignment film on one substrate.

DESCRIPTION OF SYMBOLS 1 Substrate 1a, 1b, 1c, 1d Orientation area | region 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Chuck support stand 10 Chuck 20 Mask holder 30 Exposure light irradiation apparatus 31 Lamp 32 Condensing mirror DESCRIPTION OF SYMBOLS 33 Optical fiber 34 Line generator 35 Polarizer 36 Polygon mirror 37 Motor 38 Collimating lens 39 Light-shielding plate 40 Light source control device 41 Power supply 50 Optical system drive circuit 51 Moving device 52 Direction change device 60 Stage drive circuit 70 Main control device

Claims (10)

A chuck that supports the substrate, a mask holder that holds the mask, and an exposure light irradiation device that irradiates linearly polarized exposure light. A minute gap is provided between the mask and the substrate, and the exposure light irradiation device In the alignment film exposure apparatus that irradiates the irradiated linearly polarized exposure light to the substrate through a mask and imparts alignment characteristics for adjusting the alignment direction of the liquid crystal to the alignment film applied to the substrate.
A moving means for relatively moving the chuck and the mask holder and the exposure light irradiation device;
The exposure light irradiation apparatus includes: a line generator that generates linear exposure light; a polygon mirror that has a plurality of reflecting surfaces that reflect the linear exposure light generated by the line generator; the polygon mirror and a mask; And a light shielding plate that forms an elongated opening in a direction in which linear exposure light extends,
The polygon mirror is rotated, and a portion of the substrate is repeatedly scanned with linear exposure light that is reflected by a plurality of reflecting surfaces of the polygon mirror, passes through the opening of the light shielding plate, and passes through the mask. However, the alignment film exposure apparatus is characterized in that the moving means moves the chuck, the mask holder, and the exposure light irradiation device relatively to move the scanning region of the substrate.   2. The exposure light irradiation device irradiates the mask with substantially linear exposure light reflected by a plurality of reflecting surfaces of the polygon mirror through an opening of the light shielding plate. Alignment film exposure apparatus.   2. The exposure light irradiation apparatus according to claim 1, wherein linear exposure light reflected by a plurality of reflecting surfaces of the polygon mirror is irradiated obliquely to a mask through an opening of the light shielding plate. Alignment film exposure apparatus. The exposure light irradiation device includes a plurality of the polygon mirrors,
Each polygon mirror is reflected by a plurality of reflecting surfaces of each polygon mirror, passes through the opening of the light shielding plate, and the scanning region of the substrate by the linear exposure light transmitted through the mask includes the chuck and the chuck by the moving unit. 4. The apparatus according to claim 1, wherein the mask holder and the exposure light irradiation device are arranged so as to be aligned in a direction orthogonal to a moving direction in accordance with a relative movement between the mask holder and the exposure light irradiation device. Alignment film exposure apparatus. The exposure light irradiation device includes a direction changing device that changes the direction of the polygon mirror,
The direction of rotation of the polygon mirror is changed, and the direction of the polygon mirror is changed by the direction changing device to change the scanning direction of the substrate by linear exposure light, and the chuck and the mask holder by the moving means 5. The pretilt direction of the alignment characteristic imparted to the alignment film is changed by changing a relative movement direction between the exposure light irradiation apparatus and the exposure light irradiation apparatus. 6. Alignment film exposure apparatus. The substrate is supported by the chuck, the mask is held by the mask holder, a minute gap is provided between the mask and the substrate, and the linearly polarized exposure light emitted from the exposure light irradiation device is irradiated to the substrate through the mask. , An alignment film exposure method for imparting alignment characteristics to align the alignment direction of the liquid crystal on the alignment film applied to the substrate,
In the exposure light irradiation device, the linear exposure light created by the line generator is reflected by a plurality of reflecting surfaces of the polygon mirror, and the linear exposure light extends between the polygon mirror and the mask. Irradiate the light-shielding plate that forms an elongated opening in the
Rotating the polygon mirror, reflected by the reflecting surfaces of the polygon mirror, passed through the opening of the light shielding plate, and chucked while repeatedly scanning a partial area of the substrate with linear exposure light that passed through the mask And a mask holder and an exposure light irradiation apparatus are moved relatively to move the scanning region of the substrate, and the alignment film exposure method.   7. The alignment film exposure method according to claim 6, wherein linear exposure light reflected by a plurality of reflection surfaces of the polygon mirror is irradiated to the mask substantially perpendicularly through the opening of the light shielding plate.   7. The alignment film exposure method according to claim 6, wherein linear exposure light reflected by a plurality of reflecting surfaces of the polygon mirror is obliquely irradiated to the mask through the opening of the light shielding plate. The exposure light irradiation device is provided with multiple polygon mirrors,
Each polygon mirror is reflected by a plurality of reflecting surfaces of each polygon mirror, passes through the opening of the light shielding plate, and the scanning region of the substrate by the linear exposure light transmitted through the mask is the chuck, the mask holder, and the exposure light irradiation device. 9. The alignment film exposure method according to claim 6, wherein the alignment film is arranged so as to be aligned in a direction orthogonal to the moving direction in accordance with relative movement. The exposure light irradiation device is provided with a direction changing device that changes the orientation of the polygon mirror,
The rotation direction of the polygon mirror is changed, the direction of the polygon mirror is changed by the direction changing device, the scanning direction of the substrate by the linear exposure light is changed, and the relative relationship between the chuck and the mask holder and the exposure light irradiation device is changed. 10. The alignment film exposure method according to claim 6, wherein the pre-tilt direction of the alignment characteristic imparted to the alignment film is changed by changing a different moving direction. 11.

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