JP2012185472A - Radiation sensitive resin composition and method for forming resist pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition capable of forming a resist pattern which sufficiently satisfies MEEF, LWR and CDU and pattern collapse resistance properties, and to provide a method for forming the resist pattern using the radiation sensitive resin composition.SOLUTION: The radiation sensitive resin composition contains: [A] a polymer including a structural unit (I) expressed by formula (1) and a structural unit having an acid dissociable group; [B] a salt having photo-degradation properties expressed by formula (2); and [C] a radiation sensitive acid generator.

Description

  The present invention relates to a radiation-sensitive resin composition and a method for forming a resist pattern using the radiation-sensitive resin composition.

  In the field of microfabrication for manufacturing integrated circuit elements, etc., irradiation (exposure) of short wavelength radiation represented by KrF excimer laser (wavelength 248 nm), ArF excimer laser (wavelength 193 nm), etc. is performed in order to obtain a higher degree of integration. The lithography technology used is being developed. Resist materials suitable for these exposure light sources are required to have high sensitivity, high resolution, etc., and usually contain chemical components containing an acid-dissociable group and an acid generator that generates acid upon irradiation with radiation. An amplification type radiation sensitive resin composition is used (see Japanese Patent Application Laid-Open No. 59-45439).

  On the other hand, in recent years when further miniaturization of devices is progressing, techniques using X-rays, electron beams (EB), extreme ultraviolet rays (EUV), etc., which are shorter wavelengths than excimer lasers are also being studied. . However, when a finer resist pattern is formed using a conventional radiation-sensitive resin composition, it is appropriate that the acid diffusion distance (hereinafter also referred to as “diffusion length”) in the resist film is somewhat short. It is assumed that this is because the diffusion length is inappropriate, or is an index indicating the mask error tolerance. MEEF (Mask Error Enhancement Factor), LWR (Line Width Roughness), CDU (Critical Dimension Uniformity) However, the present situation is that the lithography characteristics such as the anti-epitaxial collapse property cannot be sufficiently satisfied.

  In view of such circumstances, the radiation-sensitive resin composition for forming a finer resist pattern has not only improved basic characteristics such as sensitivity and resolution, but also MEEF, LWR, CDU, and resistance to pattern collapse. Improvements are desired.

JP 59-45439 A

  The present invention has been made based on the circumstances as described above, and the object thereof is MEEF, LWR, CDU, a radiation-sensitive resin composition capable of forming a resist pattern having excellent pattern collapse resistance, and the radiation-sensitive resin composition. It is to provide a method for forming a resist pattern using a resin composition.

（式（１）中、
Ｒ^１は、水素原子、フッ素原子、メチル基又はトリフルオロメチル基である。
Ｒ^２は、単結合、炭素数１〜４の２価の鎖状炭化水素基、エーテル基、エステル基、カルボニル基又はこれらのうち２以上を組み合わせた２価の連結基である。但し、上記鎖状炭化水素基又は連結基が有する水素原子の一部又は全部は置換されていてもよい。
Ｒ^３は、スルトン構造を含む１価の基である。）

（式（２）中、
Ｑ^＋は、１価のオニウムカチオンである。
Ｙ⁻は、１価のスルホネートアニオン、カルボキシレートアニオン又はスルホンアミドアニオンである。但し、Ｙ⁻が、スルホネートアニオンである場合、スルホネート基がフッ素原子又はパーフルオロアルキル基が結合する炭素原子と直接結合する場合はない。） The invention made to solve the above problems is
[A] a polymer containing a structural unit (I) represented by the following formula (1) and a structural unit having an acid dissociable group (hereinafter also referred to as “[A] polymer”),
[B] A salt represented by the following formula (2) and having photodegradability (hereinafter also referred to as “[B] salt having photodegradability”), and [C] a radiation-sensitive acid generator (hereinafter, “ [C] Acid generator "
Is a radiation-sensitive resin composition.

(In the formula (1),
R ¹ is a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group.
R ² is a single bond, a divalent chain hydrocarbon group having 1 to 4 carbon atoms, an ether group, an ester group, a carbonyl group, or a divalent linking group in which two or more thereof are combined. However, one part or all part of the hydrogen atom which the said chain hydrocarbon group or a coupling group has may be substituted.
R ³ is a monovalent group containing a sultone structure. )

(In the formula (2),
Q ⁺ is a monovalent onium cation.
Y ⁻ is a monovalent sulfonate anion, a carboxylate anion or a sulfonamide anion. However, Y ^- is, if a sulfonate anion, not if sulfonate group is bonded directly with a fluorine atom or a carbon atom perfluoroalkyl group is attached. )

  The radiation-sensitive resin composition of the present invention contains a [C] acid generator, and an acid is generated from the [C] acid generator upon exposure. Here, the [A] polymer serving as the base resin of the radiation-sensitive resin composition contains the structural unit (I) having a specific structure together with the structural unit having an acid-dissociable group. It can be shortened and acid diffusion can be suppressed. Moreover, since the said radiation sensitive resin composition contains the salt which has [B] photodisintegration which functions as an acid diffusion controlling agent, it can suppress the spreading | diffusion of an acid more. By suppressing acid diffusion in this way, dissociation of the acid-dissociable group in the unexposed area is suppressed, and as a result, the radiation-sensitive resin composition is a resist excellent in MEEF, LWR, CDU, and pattern collapse resistance. A pattern can be formed.

（式（３）中、Ｒ^４は、酸素原子、硫黄原子、又は酸素原子若しくは硫黄原子を骨格鎖中に含んでいてもよい炭素数１〜５の２価の鎖状炭化水素基である。ａは、０〜２の整数である。Ｒ^５は、１価の有機基である。但し、Ｒ^５が複数ある場合、複数のＲ^５は同一でも異なっていてもよい。＊は、上記Ｒ^２と結合する部位を示す。） The monovalent group containing the sultone structure is preferably a group represented by the following formula (3).

(In Formula (3), R < ⁴ > is a C1-C5 bivalent chain hydrocarbon group which may contain the oxygen atom, the sulfur atom, or the oxygen atom or the sulfur atom in the frame chain. a is the .R ⁵ is an integer of 0 to 2, a monovalent organic group. However, ^{if R 5} there are a plurality, the plurality of ^{R 5} may be the same or different. * is the R ^The site | part couple | bonded with ² is shown.)

  [A] By making the monovalent group containing a sultone structure in the polymer into the specific structure, diffusion of the generated acid can be further suppressed. As a result, the radiation sensitive resin composition can form a resist pattern that is superior in MEEF, LWR, CDU, and resistance to pattern collapse.

R ² is a single bond, —CH ₂ COO — ** or —CH ₂ CH ₂ —O — ** (** represents a site bonded to R ³ ), R ⁴ is a methylene group, and a is 0 is preferred. By making the structural unit (I) such a specific structure, acid diffusion can be particularly suppressed. As a result, the radiation sensitive resin composition can form a resist pattern that is particularly excellent in MEEF, LWR, CDU, and resistance to pattern collapse.

R ² is preferably a single bond. By making the structural unit (I) such a specific structure, acid diffusion can be particularly suppressed. As a result, the radiation sensitive resin composition can form a resist pattern that is particularly excellent in MEEF, LWR, CDU, and resistance to pattern collapse.

（式（４）中、Ｒ^６〜Ｒ^８は、それぞれ独立して水素原子、ハロゲン原子、ヒドロキシル基、アミノ基、チオール基、有機スルホニル基（ＲＳＯ_２−）、炭素数１〜１０のアルキル基、炭素数３〜１２のシクロアルキル基又は炭素数１〜１０のアルコキシ基である。上記Ｒは、アルキル基、シクロアルキル基又はアリール基である。但し、上記Ｒ^６〜Ｒ^８のアルキル基、シクロアルキル基又はアルコキシ基が有する水素原子の一部又は全部は置換されていてもよい。） Q ⁺ is preferably a cation represented by the following formula (4).

(In the formula ^(4), R 6 ~R ⁸ each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a thiol group, an organic sulfonyl group _(RSO 2 -), alkyl group having 1 to 10 carbon atoms , A cycloalkyl group having 3 to 12 carbon atoms or an alkoxy group having 1 to 10 carbon atoms, wherein R is an alkyl group, a cycloalkyl group, or an aryl group, provided that the alkyl group having R ^{6 to} R ⁸ above, (Part or all of the hydrogen atoms of the cycloalkyl group or alkoxy group may be substituted.)

  [B] By making the salt having photodegradability into the above-mentioned specific structure, it functions more highly as an acid diffusion control agent, and the acid diffusion can be suppressed more synergistically. As a result, the radiation sensitive resin composition can form MEEF, LWR, CDU, and a resist pattern having excellent pattern collapse resistance.

The method for forming a resist pattern according to the present invention includes:
(1) A step of forming a resist film on a substrate using the radiation sensitive resin composition,
(2) a step of exposing the resist film; and (3) a step of developing the exposed resist film.

  According to the formation method, a resist pattern excellent in MEEF, LWR, CDU, and pattern collapse resistance can be formed using the radiation-sensitive resin composition. Therefore, even with radiation such as KrF excimer laser and ArF excimer laser, a fine pattern can be formed from the radiation-sensitive resin composition with high accuracy and stability, and further miniaturization is expected in the future. It can be suitably used for manufacturing semiconductor devices.

  The “radiation” in the “radiation sensitive resin composition” in the present specification is a concept including visible light, ultraviolet light, far ultraviolet light, X-rays, charged particle beams, EUV, and the like.

  The radiation-sensitive resin composition of the present invention includes MEEF, LWR, CDU and a radiation-sensitive resin composition capable of forming a resist pattern excellent in pattern collapse resistance, and formation of a resist pattern using the radiation-sensitive resin composition A method can be provided. Therefore, even with radiation such as KrF excimer laser, ArF excimer laser, EUV, etc., a fine pattern can be formed with high accuracy and stability from the radiation sensitive resin composition, and further miniaturization will progress in the future. It can be suitably used for expected semiconductor device manufacturing.

<Radiation sensitive resin composition>
The radiation-sensitive resin composition of the present invention contains [A] a polymer, [B] a salt having photodegradability, and a [C] acid generator. The radiation sensitive resin composition preferably contains a solvent. Furthermore, the said radiation sensitive resin composition may contain another arbitrary component, unless the effect of this invention is impaired. Hereinafter, each component will be described in detail.

<[A] polymer>
[A] Since the polymer has an acid-dissociable group, the acid-dissociable group is dissociated using the acid generated from the [C] acid generator upon exposure as a catalyst, and the dissolution rate in the developer is changed. Form.

  [A] The polymer contains the structural unit (I) represented by the above formula (1). Moreover, the [A] polymer may contain other structural units, such as structural unit (III) mentioned later, unless the effect of this invention is prevented. Hereinafter, each structural unit will be described in detail.

[Structural unit (I)]
The structural unit (I) is represented by the above formula (1). In said formula (1), R < ¹ > is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. R ² is a single bond, a divalent chain hydrocarbon group having 1 to 4 carbon atoms, an ether group, an ester group, a carbonyl group, or a divalent linking group in which two or more thereof are combined. However, one part or all part of the hydrogen atom which this coupling group has may be substituted. R ³ is a monovalent group containing a sultone structure. [A] Since the polymer contains the structural unit (I) having a specific structure, the acid diffusion length can be shortened and the acid diffusion can be suppressed.

Examples of the divalent chain hydrocarbon group having 1 to 4 carbon atoms represented by R ² include a methylene group, an ethanediyl group, and a propanediyl group.

The monovalent group containing the sultone structure represented by R ³ is preferably a group represented by the above formula (3). In said formula (3), R < ⁴ > is a C1-C5 bivalent chain hydrocarbon group which may contain the oxygen atom, the sulfur atom, or the oxygen atom or the sulfur atom in the frame chain. a is an integer of 0-2. R ⁵ is a monovalent organic group. However, if R ⁵ there are a plurality, the plurality of R ⁵ may be the same or different. * Indicates a site binding to said ^{R 2.}

  [A] By making the monovalent group containing a sultone structure in the polymer into the specific structure, diffusion of the generated acid can be further suppressed. As a result, the radiation sensitive resin composition can form a resist pattern that is more excellent in MEEF, LWR, CDU, and resistance to pattern collapse.

Examples of the divalent chain hydrocarbon group having 1 to 5 carbon atoms represented by R ⁴ include a methylene group and an ethylene group. Examples of the monovalent organic group represented by R ⁵ include a monovalent aromatic hydrocarbon group, a monovalent chain hydrocarbon group, a monovalent aliphatic cyclic hydrocarbon group, and the like.

  Specific examples of the structural unit (I) include structural units represented by the following formula.

Among these, as the structural unit (I), R ² is a single bond, —CH ₂ COO — ** or —CH ₂ CH ₂ —O — ** (** represents a site where R ³ is bonded. ), A structure in which R ⁴ is a methylene group and a is 0, and a structure in which R ² is a single bond, R ⁴ is a methylene group and a is 0 is more preferable. By making the structural unit (I) such a specific structure, acid diffusion can be particularly suppressed. As a result, the radiation sensitive resin composition can form a resist pattern that is particularly excellent in MEEF, LWR, CDU, and resistance to pattern collapse.

  [A] The content of the structural unit (I) in the polymer is preferably 10% by mole to 80% by mole, more preferably 20% by mole to 70% by mole with respect to all the structural units constituting the [A] polymer. More preferred. By making the content rate of structural unit (I) into the said range, the effect of this invention is played without fail. In addition, the [A] polymer may contain 2 or more types of structural units (I).

[Structural unit (II)]
[A] The polymer preferably has a structural unit represented by the following formula (hereinafter also referred to as “structural unit (II)”) as a structural unit having an acid-dissociable group.

In the above formula, R ⁹ is a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group. R ^{10 to} R ¹² are each independently a linear or branched alkyl group having 1 to 10 carbon atoms, or an optionally substituted aryl group having 6 to 14 carbon atoms. However, R ¹⁰ and R ¹¹ may form a divalent alicyclic hydrocarbon group having 3 to 20 carbon atoms together with the carbon atom bonded to each other.

Examples of the linear or branched alkyl group having 1 to 10 carbon atoms represented by R ^{10 to} R ¹² include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, a 1-butyl group, and i- Butyl group, sec-butyl group, tert-butyl group, n-pentyl group, i-pentyl group, sec-pentyl group, neo-pentyl group, tert-pentyl group, n-hexyl group, i-hexyl group, n- Examples include heptyl group, i-heptyl group, n-octyl group, i-octyl group, n-nonyl group, i-nonyl group, n-decyl group, i-decyl group and the like. Examples of the aryl group having 6 to 14 carbon atoms represented by R ^{10 to} R ¹² include a phenyl group, a naphthyl group, and an anthranyl group.

Examples of the divalent alicyclic hydrocarbon group having 3 to 20 carbon atoms that may be formed together with the carbon atom in which R ¹⁰ and R ¹¹ are bonded to each other include cyclopropane, cyclobutane, cyclopentane, Examples include groups in which two hydrogen atoms are removed from an alicyclic hydrocarbon such as cyclohexane, dicyclopentane, norbornane, tricyclodecane, tetracyclododecane, adamantane and the like.

  Specific examples of the structural unit (II) include structural units represented by the following formula.

In the above formula, R ⁹ is a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group.

Of these, R ⁹ is a methyl group, and together with the carbon atom to which R ¹⁰ and R ¹¹ are bonded to each other, a divalent alicyclic hydrocarbon group having 5 to 10 carbon atoms is formed, and R ¹² Is a linear or branched alkyl group having 1 to 4 carbon atoms or an optionally substituted aryl group having 6 to 10 carbon atoms as the structural unit (II).

  [A] The content of the structural unit (II) in the polymer is preferably 5 mol% to 60 mol%, and preferably 10 mol% to 50 mol%, based on all structural units constituting the [A] polymer. More preferred. By making the content rate of structural unit (II) into the said range, the lithography performance of the resist pattern obtained improves more. [A] The polymer may contain two or more structural units (II).

[Structural unit (III)]
[A] The polymer may contain a structural unit containing at least one structure selected from the group consisting of a lactone structure and a cyclic carbonate structure (hereinafter also referred to as “structural unit (III)”). [A] When a polymer contains structural unit (III), the adhesiveness of the resist film obtained from the said radiation sensitive resin composition improves.

  As structural unit (III), the structural unit represented, for example by a following formula is mentioned.

In the above formula, R ¹³ is a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group.

  [A] The content of the structural unit (III) in the polymer is preferably 0 mol% to 60 mol%, and preferably 5 mol% to 50 mol% with respect to all the structural units constituting the [A] polymer. More preferred. By making the content rate of structural unit (III) into the said range, the adhesiveness of the resist pattern obtained improves and pattern collapse resistance etc. can be improved. [A] The polymer may contain two or more kinds of structural units (III).

[Structural unit (IV)]
[A] The polymer may contain a structural unit having a hydrophilic functional group (hereinafter also referred to as “structural unit (IV)”). [A] When a polymer contains structural unit (IV), the lithography performance of a resist pattern can be improved more.

  Examples of the structural unit (IV) include structural units represented by the following formula.

In the above formula, R ¹⁴ is a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group.

  [A] The content of the structural unit (IV) in the polymer is preferably 0 mol% to 30 mol%, more preferably 5 mol% to 20 mol%, based on all structural units constituting the [A] polymer. preferable. [A] The polymer may contain two or more structural units (IV).

<[A] Polymer Synthesis Method>
[A] The polymer can be produced, for example, by polymerizing a monomer corresponding to each predetermined structural unit in a suitable solvent using a radical polymerization initiator. For example, a method of dropping a solution containing a monomer and a radical initiator into a reaction solvent or a solution containing the monomer to cause a polymerization reaction, a solution containing the monomer, and a solution containing the radical initiator Separately, a method of dropping a reaction solvent or a monomer-containing solution into a polymerization reaction, a plurality of types of solutions containing each monomer, and a solution containing a radical initiator, It is preferable to synthesize by a method such as a method of dropping it into a reaction solvent or a solution containing a monomer to cause a polymerization reaction.

  What is necessary is just to determine the reaction temperature in these methods suitably with initiator seed | species. Usually, it is 30 to 180 ° C, preferably 40 to 160 ° C, and more preferably 50 to 140 ° C. The dropping time varies depending on the reaction temperature, the type of initiator, the monomer to be reacted, etc., but is usually 30 minutes to 8 hours, preferably 45 minutes to 6 hours, and more preferably 1 hour to 5 hours. . Further, the total reaction time including the dropping time varies depending on the conditions similarly to the dropping time, but is usually 30 minutes to 8 hours, preferably 45 minutes to 7 hours, and more preferably 1 hour to 6 hours.

  Examples of the radical initiator used for the polymerization include azobisisobutyronitrile, 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile), and 2,2′-azobis (2-cyclopropyl). Propionitrile), 2,2′-azobis (2,4-dimethylvaleronitrile), 2,2′-azobis (2-methylpropionitrile), and the like. These initiators can be used alone or in admixture of two or more.

  The polymerization solvent is not limited as long as it is a solvent other than a solvent that inhibits polymerization (nitrobenzene having a polymerization inhibiting effect, mercapto compound having a chain transfer effect, etc.) and can dissolve the monomer. Examples of the polymerization solvent include alcohol solvents, ketone solvents, amide solvents, ester / lactone solvents, nitrile solvents, and mixed solvents thereof. These solvents can be used alone or in combination of two or more.

  The resin obtained by the polymerization reaction is preferably recovered by a reprecipitation method. That is, after completion of the polymerization reaction, the target resin is recovered as a powder by introducing the polymerization solution into a reprecipitation solvent. As the reprecipitation solvent, alcohols or alkanes can be used alone or in admixture of two or more. In addition to the reprecipitation method, the resin can be recovered by removing low-molecular components such as monomers and oligomers by a liquid separation operation, a column operation, an ultrafiltration operation, or the like.

  [A] The weight average molecular weight (Mw) in terms of polystyrene by gel permeation chromatography (GPC) of the polymer is not particularly limited, but is preferably 1,000 or more and 500,000 or less, more preferably 2,000 or more and 400,000 or less. preferable. In addition, when the Mw of the [A] polymer is less than 1,000, the heat resistance when used as a resist tends to decrease. On the other hand, when the Mw of the [A] polymer exceeds 500,000, the developability when used as a resist tends to be lowered.

  [A] The ratio (Mw / Mn) of Mw to the number average molecular weight (Mn) in terms of polystyrene by GPC of the polymer is usually from 1 to 5, preferably from 1 to 3, and preferably from 1 to 2.5. Is more preferable. By setting Mw / Mn in such a range, the photoresist film has excellent resolution performance.

  In addition, Mw and Mn of this specification use a GPC column (Tosoh, G2000HXL, G3000HXL, G4000HXL), flow rate of 1.0 ml / min, elution solvent tetrahydrofuran, column temperature of 40 ° C. It is a value measured by gel permeation chromatography (GPC) using monodisperse polystyrene as a standard under conditions.

<[B] Salt having photodegradability>
[B] The salt having photodegradability controls the diffusion phenomenon of the acid generated from the [C] acid generator upon exposure in the resist film and suppresses an undesirable chemical reaction in the unexposed area. is there. Therefore, since the radiation sensitive resin composition contains the [A] polymer containing the structural unit (I) having a specific structure and the [B] salt having photodegradability, the acid diffusion length is further shortened. It is possible to synergistically suppress acid diffusion. As a result, the radiation-sensitive resin composition can form MEEF, LWR, CDU and a resist pattern having excellent resistance to pattern collapse. In addition, the salt having photodegradability in the present invention is a salt that generates sulfonic acid, carboxylic acid, or sulfonamide upon irradiation with radiation, and when Y ⁻ is a sulfonate anion, the sulfonate group is a fluorine atom. Or the thing which is not directly bonded to the carbon atom to which the perfluoroalkyl group is bonded.

[B] The salt having photodegradability is a salt represented by the above formula (2). In the above formula (2), Q ⁺ is a monovalent onium cation. Y ⁻ is a monovalent sulfonate anion, a carboxylate anion or a sulfonamide anion. However, Y ^- is, if a sulfonate anion, not if sulfonate group is bonded directly with a fluorine atom or a carbon atom perfluoroalkyl group is attached.

Examples of the monovalent onium cation represented by Q ⁺ include the above formula (4) such as triphenylsulfonium cation, 4-cyclohexylphenyldiphenylsulfonium cation, 4-methanesulfonylphenyldiphenylsulfonium cation, and 4-cyclohexylsulfonylphenyldiphenylsulfonium cation. A sulfonium cation represented by:
Iodonium cations such as diphenyliodonium cation and bis (4-t-butylphenyl) iodonium cation;
1- (4-n-butoxynaphthalen-1-yl) tetrahydrothiophenium cation, 1- (6-n-butoxynaphthalen-2-yl) tetrahydrothiophenium cation, 1- (3,5-dimethyl-4 -Hydroxyphenyl) tetrahydrothiophenium cation such as tetrahydrothiophenium cation.

In formula (4), R ^{6 to} R ⁸ are each independently a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a thiol group, an organic sulfonyl group (RSO ₂ —), an alkyl group having 1 to 10 carbon atoms, A cycloalkyl group having 3 to 12 carbon atoms or an alkoxy group having 1 to 10 carbon atoms. R is an alkyl group, a cycloalkyl group or an aryl group. However, the above alkyl groups R ⁶ to R ^8, some or all of the hydrogen atoms having a cycloalkyl group or an alkoxy group may be substituted.

Examples of the halogen atom represented by R ^{6 to} R ⁸ include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

Examples of the alkyl group having 1 to 10 carbon atoms indicated R ⁶ to R ⁸ is, for example, a methyl group, an ethyl group, a propyl group, a butyl group.

Examples of the cycloalkyl group having 3 to 12 carbon atoms represented by R ^{6 to} R ⁸ include a cyclopentyl group, a cyclohexyl group, and a norbornyl group.

The alkoxy group having 1 to 10 carbon atoms R ⁶ to R ⁸ represents, for example, methoxy group, an ethoxy group, a propoxy group, a butoxy group and the like.

Examples of the alkyl group and cycloalkyl group represented by R include the same groups as those exemplified as the alkyl group and cycloalkyl group represented by R ^{6 to} R ⁸ above. Examples of the aryl group include a phenyl group and a naphthyl group. Group, anthranyl group and the like.

  Examples of preferable [B] salts having photodegradability include salts represented by the following formulas.

Among these, as Q ⁺ , a sulfonium cation is preferable, and a triphenylsulfonium cation represented by the above formula (4) is more preferable. Y ⁻ is preferably a monovalent carboxylate anion or a sulfonate anion. [B] By using the preferred salt as a salt having photodegradability, it functions more highly as an acid diffusion control agent, and it is possible to suppress acid diffusion more synergistically. As a result, MEEF, LWR, CDU and pattern collapse resistance are superior.

  These [B] salts having photodegradability may be used alone or in combination of two or more. The amount of the salt having [B] photodisintegration in the radiation sensitive resin composition is preferably 0.1 part by mass or more and 30 parts by mass or less, and 100 parts by mass with respect to 100 parts by mass of the [A] polymer. More preferred is 20 parts by weight or more and 20 parts by weight or less. [B] If the amount of the salt having photodegradability is less than 0.1 parts by mass, the effects of the present invention may not be fully exhibited, such as inconvenience that reduction of MEEF is not achieved. On the other hand, when it exceeds 30 parts by mass, shape deterioration due to a decrease in sensitivity of the radiation-sensitive resin composition and a decrease in resist transmittance may be observed.

<[C] acid generator>
[C] The acid generator is a compound that generates an acid by light that has passed through a mask in an exposure process, which is one process of forming a resist pattern. The [C] acid generator is contained in the radiation-sensitive resin composition in the form of a compound as described later (hereinafter, this aspect is also referred to as “[C] acid generator”). The aspect incorporated as a part may be sufficient as both of these aspects.

  [C] Examples of the acid generator include onium salt compounds, sulfonimide compounds, halogen-containing compounds, diazoketone compounds, and the like. Of these [C] acid generators, onium salt compounds are preferred.

  Examples of the onium salt compound include sulfonium salts (including tetrahydrothiophenium salts), iodonium salts, phosphonium salts, diazonium salts, pyridinium salts, and the like.

  Examples of the sulfonium salt include salts represented by the following formula (5).

In the above formula (5), R ¹⁵ is a monovalent organic group. R ¹⁶ and R ¹⁷ are each independently a hydrogen atom, a fluorine atom, or an alkyl group having 1 to 20 carbon atoms. However, some or all of the hydrogen atoms of the alkyl group may be substituted with fluorine atoms. Further, at least one of R ¹⁶ and R ¹⁷ is a fluorine atom or a perfluoroalkyl group. M ⁺ is a monovalent cation.

  Examples of the salt represented by the above formula (5) include triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium nonafluoro-n-butanesulfonate, triphenylsulfonium perfluoro-n-octanesulfonate, triphenylsulfonium 2-bicyclo [ 2.2.1] Hept-2-yl-1,1,2,2-tetrafluoroethanesulfonate, 4-cyclohexylphenyldiphenylsulfonium trifluoromethanesulfonate, 4-cyclohexylphenyldiphenylsulfonium nonafluoro-n-butanesulfonate, 4 -Cyclohexylphenyldiphenylsulfonium perfluoro-n-octanesulfonate, 4-cyclohexylphenyldiphenylsulfonium 2-bicyclo [2.2.1 Hept-2-yl-1,1,2,2-tetrafluoroethanesulfonate, 4-methanesulfonylphenyldiphenylsulfonium trifluoromethanesulfonate, 4-methanesulfonylphenyldiphenylsulfonium nonafluoro-n-butanesulfonate, 4-methanesulfonylphenyl Diphenylsulfonium perfluoro-n-octanesulfonate, 4-methanesulfonylphenyldiphenylsulfonium 2-bicyclo [2.2.1] hept-2-yl-1,1,2,2-tetrafluoroethanesulfonate, triphenylsulfonium 4 -(1-adamantanecarbonyloxy) -1,1,2,2-tetrafluorobutanesulfonate, triphenylsulfonium 1,1,2,2-tetrafluoro-6- (1-adamanta Karubonirokishi) - hexane-1-sulfonate, and the like. Of these, triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium nonafluoro-n-butanesulfonate, triphenylsulfonium 4- (1-adamantanecarbonyloxy) -1,1,2,2-tetrafluorobutanesulfonate and triphenylsulfonium Phenylsulfonium 1,1,2,2-tetrafluoro-6- (1-adamantane carbonyloxy) -hexane-1-sulfonate is preferred.

  Examples of the tetrahydrothiophenium salt include 1- (4-n-butoxynaphthalen-1-yl) tetrahydrothiophenium trifluoromethanesulfonate, 1- (4-n-butoxynaphthalen-1-yl) tetrahydrothiophenium nona. Fluoro-n-butanesulfonate, 1- (4-n-butoxynaphthalen-1-yl) tetrahydrothiophenium perfluoro-n-octanesulfonate, 1- (4-n-butoxynaphthalen-1-yl) tetrahydrothiophene Nitro 2-bicyclo [2.2.1] hept-2-yl-1,1,2,2-tetrafluoroethanesulfonate, 1- (6-n-butoxynaphthalen-2-yl) tetrahydrothiophenium trifluoromethane Sulfonate, 1- (6-n-butoxynaphthalene-2 Yl) tetrahydrothiophenium nonafluoro-n-butanesulfonate, 1- (6-n-butoxynaphthalen-2-yl) tetrahydrothiophenium perfluoro-n-octanesulfonate, 1- (6-n-butoxynaphthalene- 2-yl) tetrahydrothiophenium 2-bicyclo [2.2.1] hept-2-yl-1,1,2,2-tetrafluoroethanesulfonate, 1- (3,5-dimethyl-4-hydroxyphenyl) ) Tetrahydrothiophenium trifluoromethanesulfonate, 1- (3,5-dimethyl-4-hydroxyphenyl) tetrahydrothiophenium nonafluoro-n-butanesulfonate, 1- (3,5-dimethyl-4-hydroxyphenyl) tetrahydro Thiophenium perfluoro-n-octance Phonates, 1- (3,5-dimethyl-4-hydroxyphenyl) tetrahydrothiophenium 2-bicyclo [2.2.1] hept-2-yl-1,1,2,2-tetrafluoroethanesulfonate, etc. Can be mentioned. Of these tetrahydrothiophenium salts, 1- (4-n-butoxynaphthalen-1-yl) tetrahydrothiophenium nonafluoro-n-butanesulfonate, 1- (4-n-butoxynaphthalen-1-yl) Tetrahydrothiophenium perfluoro-n-octane sulfonate and 1- (3,5-dimethyl-4-hydroxyphenyl) tetrahydrothiophenium nonafluoro-n-butane sulfonate are preferred.

  Examples of the iodonium salt include diphenyliodonium trifluoromethanesulfonate, diphenyliodonium nonafluoro-n-butanesulfonate, diphenyliodonium perfluoro-n-octanesulfonate, diphenyliodonium 2-bicyclo [2.2.1] hept-2-yl- 1,1,2,2-tetrafluoroethanesulfonate, bis (4-t-butylphenyl) iodonium trifluoromethanesulfonate, bis (4-t-butylphenyl) iodonium nonafluoro-n-butanesulfonate, bis (4-t -Butylphenyl) iodonium perfluoro-n-octanesulfonate, bis (4-t-butylphenyl) iodonium 2-bicyclo [2.2.1] hept-2-yl-1,1,2,2-tetra Le Oro ethanesulfonate. Of these iodonium salts, bis (4-t-butylphenyl) iodonium nonafluoro-n-butanesulfonate is preferred.

  Examples of the sulfonimide compound include N- (trifluoromethanesulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (nonafluoro-n-butanesulfonyloxy) bicyclo [ 2.2.1] Hept-5-ene-2,3-dicarboximide, N- (perfluoro-n-octanesulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3- Dicarboximide, N- (2-bicyclo [2.2.1] hept-2-yl-1,1,2,2-tetrafluoroethanesulfonyloxy) bicyclo [2.2.1] hept-5-ene -2,3-dicarboximide and the like. Of these sulfonimide compounds, N- (trifluoromethanesulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide is preferred.

  Among these, as the [C] acid generator, a sulfonium salt, a tetrahydrothiophenium salt, and an iodonium salt are preferable, a sulfonium salt is more preferable, and a sulfonium salt represented by the above formula (5) is more preferable.

  These [C] acid generators may be used alone or in combination of two or more. [C] The amount used when the acid generator is an “agent” is, from the viewpoint of ensuring the sensitivity and developability of the resist film formed from the radiation-sensitive resin composition, [A] 100 mass of polymer. 0.01 parts by mass or more and 35 parts by mass or less are preferable, and 0.1 parts by mass or more and 30 parts by mass or less are more preferable.

<Solvent>
The radiation sensitive resin composition usually contains a solvent. Examples of the solvent include alcohol solvents, ketone solvents, amide solvents, ether solvents, ester solvents, and mixed solvents thereof. These solvents can be used alone or in combination of two or more.

Examples of alcohol solvents include methanol, ethanol, n-propanol, iso-propanol, n-butanol, iso-butanol, sec-butanol, tert-butanol, n-pentanol, iso-pentanol, 2-methylbutanol, sec-pentanol, tert-pentanol, 3-methoxybutanol, n-hexanol, 2-methylpentanol, sec-hexanol, 2-ethylbutanol, sec-heptanol, 3-heptanol, n-octanol, 2-ethylhexanol , Sec-octanol, n-nonyl alcohol, 2,6-dimethyl-4-heptanol, n-decanol, sec-undecyl alcohol, trimethylnonyl alcohol, sec-tetradecyl alcohol, sec -Monoalcohol solvents such as heptadecyl alcohol, furfuryl alcohol, phenol, cyclohexanol, methylcyclohexanol, 3,3,5-trimethylcyclohexanol, benzyl alcohol, diacetone alcohol;
Ethylene glycol, 1,2-propylene glycol, 1,3-butylene glycol, 2,4-pentanediol, 2-methyl-2,4-pentanediol, 2,5-hexanediol, 2,4-heptanediol, 2 -Polyhydric alcohol solvents such as ethyl-1,3-hexanediol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol;
Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monohexyl ether, ethylene glycol monophenyl ether, ethylene glycol mono-2-ethylbutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl Ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, dipropylene glycol Monomethyl ether, dipropylene glycol monoethyl ether, polyhydric alcohol partial ether solvents such as dipropylene glycol monopropyl ether.

  Examples of the ketone solvent include acetone, methyl ethyl ketone, methyl-n-propyl ketone, methyl-n-butyl ketone, diethyl ketone, methyl-iso-butyl ketone, methyl-n-pentyl ketone, ethyl-n-butyl ketone, methyl-n- Ketones such as hexyl ketone, di-iso-butyl ketone, trimethylnonanone, cyclopentanone, cyclohexanone, cycloheptanone, cyclooctanone, methylcyclohexanone, 2,4-pentanedione, acetonylacetone, diacetone alcohol, acetophenone A solvent is mentioned.

  Examples of the amide solvents include N, N′-dimethylimidazolidinone, N-methylformamide, N, N-dimethylformamide, N, N-diethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, N-methylpropionamide, N-methylpyrrolidone and the like can be mentioned.

  Examples of the ester solvents include diethyl carbonate, propylene carbonate, methyl acetate, ethyl acetate, γ-valerolactone, n-propyl acetate, iso-propyl acetate, n-butyl acetate, iso-butyl acetate, sec-butyl acetate, acetic acid. n-pentyl, sec-pentyl acetate, 3-methoxybutyl acetate, methyl pentyl acetate, 2-ethylbutyl acetate, 2-ethylhexyl acetate, benzyl acetate, cyclohexyl acetate, methyl cyclohexyl acetate, n-nonyl acetate, methyl acetoacetate, acetoacetate Ethyl acetate ethylene glycol monomethyl ether, acetate ethylene glycol monoethyl ether, acetate diethylene glycol monomethyl ether, acetate diethylene glycol monoethyl ether, acetate diethylene glycol mono-n-butyl Ether ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, glycol diacetate, methoxytriacetate Glycol, ethyl propionate, n-butyl propionate, iso-amyl propionate, diethyl oxalate, di-n-butyl oxalate, methyl lactate, ethyl lactate, n-butyl lactate, n-amyl lactate, diethyl malonate, Examples thereof include dimethyl phthalate and diethyl phthalate.

Examples of other solvents include n-pentane, iso-pentane, n-hexane, iso-hexane, n-heptane, iso-heptane, 2,2,4-trimethylpentane, n-octane, iso-octane, cyclohexane, Aliphatic hydrocarbon solvents such as methylcyclohexane;
Fragrances such as benzene, toluene, xylene, mesitylene, ethylbenzene, trimethylbenzene, methylethylbenzene, n-propylbenzene, iso-propylbenzene, diethylbenzene, iso-butylbenzene, triethylbenzene, di-iso-propylbenzene and n-amylnaphthalene Group hydrocarbon solvents;
And halogen-containing solvents such as dichloromethane, chloroform, chlorofluorocarbon, chlorobenzene, and dichlorobenzene.

  Of these solvents, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, ethyl lactate, and cyclohexanone are preferred.

<Other optional components>
The radiation-sensitive resin composition contains other optional components such as a fluorine atom-containing polymer, an uneven distribution accelerator, an alicyclic skeleton compound, a surfactant, and a sensitizer, as long as the effects of the present invention are not impaired. Can be contained. Hereinafter, these optional components will be described in detail. Such other optional components can be used alone or in admixture of two or more. Moreover, the compounding quantity of another arbitrary component can be suitably determined according to the objective.

[Fluorine atom-containing polymer]
The said radiation sensitive resin composition may contain the polymer whose fluorine atom content rate is higher than [A] polymer. When the radiation-sensitive resin composition contains a fluorine atom-containing polymer, when the resist film is formed, the distribution is near the resist film surface due to the oil-repellent characteristics of the fluorine atom-containing polymer in the film. Therefore, it is possible to prevent the acid generator, the acid diffusion control agent, and the like from being eluted into the immersion medium during immersion exposure. Further, due to the water-repellent characteristics of this fluorine atom-containing polymer, the advancing contact angle between the resist film and the immersion medium can be controlled within a desired range, and the occurrence of bubble defects can be suppressed. Furthermore, the receding contact angle between the resist film and the immersion medium is increased, and high-speed scanning exposure is possible without leaving water droplets. Thus, when the said radiation sensitive resin composition contains a fluorine atom containing polymer, the resist film suitable for an immersion exposure method can be formed.

  The fluorine-containing polymer is not particularly limited as long as it has fluorine atoms, but it is essential that the fluorine atom content (% by mass) is higher than that of the [A] polymer. [A] When the fluorine atom content is higher than that of the polymer, the degree of uneven distribution described above is further increased, and the properties such as water repellency and elution suppression of the resulting resist film are improved.

  The fluorine atom-containing polymer in the present invention is formed by polymerizing one or more monomers containing a fluorine atom in the structure.

  As a monomer that gives a polymer containing a fluorine atom in its structure, a monomer containing a fluorine atom in the main chain, a monomer containing a fluorine atom in the side chain, and a fluorine atom in the main chain and the side chain Monomer.

  Examples of monomers that give a polymer containing a fluorine atom in the main chain include α-fluoroacrylate compounds, α-trifluoromethyl acrylate compounds, β-fluoroacrylate compounds, β-trifluoromethyl acrylate compounds, α, β- Examples thereof include a fluoroacrylate compound, an α, β-trifluoromethyl acrylate compound, a compound in which hydrogen at one or more vinyl sites is substituted with fluorine or a trifluoromethyl group, and the like.

  As the monomer that gives a polymer containing a fluorine atom in the side chain, for example, the side chain of an alicyclic olefin compound such as norbornene is fluorine or a fluoroalkyl group or a derivative thereof, a fluoroalkyl group of acrylic acid or methacrylic acid, Examples of the ester compound of the derivative include a fluorine atom or a fluoroalkyl group in which the side chain of one or more olefins (site not including a double bond) or a derivative thereof is used.

  Examples of the monomer that gives a polymer containing fluorine atoms in the main chain and the side chain include α-fluoroacrylic acid, β-fluoroacrylic acid, α, β-fluoroacrylic acid, α-trifluoromethylacrylic acid, Ester compounds of fluoroalkyl groups such as β-trifluoromethylacrylic acid and α, β-trifluoromethylacrylic acid and derivatives thereof, and hydrogen in one or more kinds of vinyl sites are substituted with fluorine atoms or trifluoromethyl groups A compound in which the side chain of a compound is substituted with a fluorine atom or a fluoroalkyl group or a derivative thereof, and hydrogen bonded to a double bond of one or more alicyclic olefin compounds is substituted with a fluorine atom or a trifluoromethyl group. And the side chain is a fluoroalkyl group or a derivative thereof. In addition, this alicyclic olefin compound shows the compound in which a part of ring is a double bond.

  Examples of the structural unit possessed by the fluorine atom-containing polymer include structural units represented by the following formula (hereinafter also referred to as “structural unit (V)”).

In the above formula, R ¹⁸ is hydrogen, a methyl group or a trifluoromethyl group. X is a linking group. R ¹⁹ is a linear or branched alkyl group having 1 to 6 carbon atoms containing at least one fluorine atom, or a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms or a derivative thereof. .

  Examples of the linking group represented by X include a single bond, an oxygen atom, a sulfur atom, a carbonyloxy group, an oxycarbonyl group, an amide group, a sulfonylamide group, and a urethane group.

  Examples of the monomer that gives the structural unit (V) include 2- [1- (ethoxycarbonyl) -1,1-difluorobutyl] (meth) acrylic acid ester, trifluoromethyl (meth) acrylic acid ester, 2, 2,2-trifluoroethyl (meth) acrylic acid ester, perfluoroethyl (meth) acrylic acid ester, perfluoro n-propyl (meth) acrylic acid ester, perfluoro i-propyl (meth) acrylic acid ester, perfluoro n-butyl (meth) acrylic acid ester, perfluoro i-butyl (meth) acrylic acid ester, perfluoro t-butyl (meth) acrylic acid ester, 2- (1,1,1,3,3,3-hexa Fluoropropyl) (meth) acrylic acid ester, 1- (2,2,3,3,4,4,5,5-octaful Lopentyl) (meth) acrylic acid ester, perfluorocyclohexylmethyl (meth) acrylic acid ester, 1- (2,2,3,3,3-pentafluoropropyl) (meth) acrylic acid ester, 1- (3,3 , 4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl) (meth) acrylic acid ester, 1- (5-trifluoro) Methyl-3,3,4,4,5,6,6,6-octafluorohexyl) (meth) acrylic acid ester and the like.

  The fluorine atom-containing polymer may contain only one type of structural unit (V), or may contain two or more types. The content ratio of the structural unit (V) is usually 5 mol% or more, preferably 10 mol% or more, more preferably 15 mol% or more when all the structural units in the fluorine atom-containing polymer are 100 mol%. . If the content of the structural unit (V) is less than 5 mol%, a receding contact angle of 70 degrees or more may not be achieved, or elution of an acid generator or the like from the resist film may not be suppressed.

  In addition to the structural unit (V), the fluorine atom-containing polymer is a structural unit having an acid-dissociable group, a lactone skeleton, a hydroxyl group, a carboxyl, or the like, for example, in order to control the dissolution rate in the developer, In order to suppress the scattering of light due to, one or more “other structural units” such as a structural unit derived from an aromatic compound can be contained.

  As the other structural unit having an acid dissociable group, a structural unit similar to the structural unit exemplified in the structural unit (II) can be applied. As other structural units containing the lactone skeleton, structural units similar to the structural units exemplified in the structural unit (III) can be applied. As the other structural unit containing a hydroxyl group, a structural unit similar to the structural unit exemplified for the structural unit (IV) can be used.

  As a preferable monomer for generating another structural unit derived from the aromatic compound, for example, styrene, α-methylstyrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, 2-methoxystyrene, 3-methoxystyrene, 4-methoxystyrene, 4- (2-t-butoxycarbonylethyloxy) styrene 2-hydroxystyrene, 3-hydroxystyrene, 4-hydroxystyrene, 2-hydroxy-α-methylstyrene, 3-hydroxy -Α-methylstyrene, 4-hydroxy-α-methylstyrene, 2-methyl-3-hydroxystyrene, 4-methyl-3-hydroxystyrene, 5-methyl-3-hydroxystyrene, 2-methyl-4-hydroxystyrene 3-methyl-4-hydroxystyrene, 3,4-dihydro Cystyrene, 2,4,6-trihydroxystyrene, 4-t-butoxystyrene, 4-t-butoxy-α-methylstyrene, 4- (2-ethyl-2-propoxy) styrene, 4- (2-ethyl- 2-propoxy) -α-methylstyrene, 4- (1-ethoxyethoxy) styrene, 4- (1-ethoxyethoxy) -α-methylstyrene, phenyl (meth) acrylate, benzyl (meth) acrylate, acenaphthylene, 5-hydroxyacenaphthylene, 1-vinylnaphthalene, 2-vinylnaphthalene, 2-hydroxy-6-vinylnaphthalene, 1-naphthyl (meth) acrylate, 2-naphthyl (meth) acrylate, 1-naphthylmethyl (meth) acrylate 1-anthryl (meth) acrylate, 2-anthryl (meth) acrylate, 9- Anthryl (meth) acrylate, 9-anthrylmethyl (meth) acrylate, 1-vinylpyrene and the like can be mentioned.

  The content ratio of other structural units is usually 80 mol% or less, preferably 75 mol% or less, more preferably 70 mol% or less, assuming that all the structural units in the fluorine atom-containing polymer are 100 mol%. .

  The Mw of the fluorine atom-containing polymer is preferably 1,000 to 50,000, more preferably 1,000 to 30,000, and particularly preferably 1,000 to 10,000. When the Mw of the fluorine atom-containing polymer is less than 1,000, a sufficient advancing contact angle cannot be obtained. On the other hand, when Mw exceeds 50,000, the developability of the resist tends to decrease. The ratio (Mw / Mn) between Mw and Mn of the fluorine atom-containing polymer is usually 1 to 3, and preferably 1 to 2.5.

  As a content rate of the fluorine atom containing polymer in the said radiation sensitive composition, 0-50 mass parts is preferable with respect to 100 mass parts of [A] polymers, 0-20 mass parts is more preferable, 0.5 10 mass parts is especially preferable, and 1-8 mass parts is the most preferable. By making the content rate of the said fluorine atom containing polymer in the said radiation sensitive resin composition into the said range, the water repellency and elution suppression property of the resist film surface obtained can be improved more.

[Synthesis Method of Fluorine Atom-Containing Polymer]
The fluorine atom-containing polymer can be synthesized, for example, by polymerizing monomers corresponding to predetermined respective structural units in a suitable solvent using a radical polymerization initiator.

  Examples of the solvent used for the polymerization include the same solvents as those mentioned in the method for synthesizing the polymer [A].

  As reaction temperature in the said superposition | polymerization, 40 to 150 degreeC and 50 to 120 degreeC are preferable normally. The reaction time is usually preferably 1 hour to 48 hours and 1 hour to 24 hours.

[Uneven distribution promoter]
The radiation-sensitive resin composition can be blended with an uneven distribution accelerator when a resist pattern is formed using an immersion exposure method. Examples of the uneven distribution promoter include γ-butyrolactone and propylene carbonate.

[Alicyclic skeleton compound]
An alicyclic skeleton compound is a component that exhibits an action of further improving dry etching resistance, pattern shape, adhesion to a substrate, and the like. Examples of the alicyclic skeleton compound include adamantane derivatives such as 1-adamantanecarboxylic acid, 2-adamantanone, and 1-adamantanecarboxylic acid t-butyl; deoxycholic acid t-butyl, deoxycholic acid t-butoxycarbonylmethyl, Deoxycholic acid esters such as 2-ethoxyethyl deoxycholic acid; Lithocholic acid esters such as tert-butyl lithocholic acid, t-butoxycarbonylmethyl lithocholic acid, 2-ethoxyethyl lithocholic acid; 3- [2-hydroxy-2 , 2-bis (trifluoromethyl) ethyl] tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecane, 2-hydroxy-9-methoxycarbonyl-5-oxo-4-oxa-tricyclo [4.2.1.0 ^3,7 ] nonane, and the like.

[Surfactant]
Surfactants are components that have the effect of improving coatability, striation, developability, and the like. Examples of the surfactant include polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene n-octylphenyl ether, polyoxyethylene n-nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol diacrylate. In addition to nonionic surfactants such as stearate, the following trade names are KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), Polyflow No. 75, no. 95 (above, manufactured by Kyoeisha Chemical Co., Ltd.), F-top EF301, EF303, EF352 (above, manufactured by Tochem Products), MegaFac F171, F173 (above, manufactured by Dainippon Ink & Chemicals), Fluorad FC430, FC431 ( As above, manufactured by Sumitomo 3M, Asahi Guard AG710, Surflon S-382, SC-101, SC-102, SC-103, SC-104, SC-105, SC-106 (above, manufactured by Asahi Glass) ) And the like.

[Sensitizer]
The sensitizer absorbs radiation energy and transmits the energy to the [C] acid generator, thereby increasing the amount of acid produced. It has the effect of improving the “apparent sensitivity”. Examples of the sensitizer include carbazoles, acetophenones, benzophenones, naphthalenes, phenols, biacetyl, eosin, rose bengal, pyrenes, anthracenes, phenothiazines and the like.

<Method for preparing radiation-sensitive resin composition>
The radiation sensitive resin composition is prepared by, for example, mixing [A] polymer, [B] salt having photodegradability, [C] acid generator and other optional components in the above-mentioned solvent at a predetermined ratio. Can be prepared. The solvent is not particularly limited as long as it can dissolve or disperse the [A] polymer, [B] salt having photodegradability, [C] acid generator, and other optional components. The radiation-sensitive resin composition is usually dissolved in a solvent so that the total solid content concentration is 1% by mass to 30% by mass, preferably 1.5% by mass to 25% by mass. It is prepared by filtering with a filter of about 0.2 μm.

<Method for forming resist pattern>
The method for forming a resist pattern according to the present invention includes:
(1) A step of forming a resist film on a substrate using the radiation sensitive resin composition (hereinafter, also referred to as “step (1)”),
(2) a step of exposing the resist film (hereinafter also referred to as “step (2)”); and (3) a step of developing the exposed resist film (hereinafter also referred to as “step (3)”).
Have Hereinafter, each process is explained in full detail.

  According to the formation method, a resist pattern excellent in MEEF, LWR, CDU, and pattern collapse resistance can be formed using the radiation-sensitive resin composition. Therefore, even with radiation such as KrF excimer laser, ArF excimer laser, EUV, etc., a fine pattern can be formed with high accuracy and stability from the radiation sensitive resin composition, and further miniaturization will progress in the future. It can be suitably used for expected semiconductor device manufacturing.

[Step (1)]
In this step, the radiation-sensitive resin composition or a solution of the radiation-sensitive resin composition obtained by dissolving this in a solvent is applied to a silicon wafer by a coating means such as spin coating, cast coating, and roll coating. The radiation sensitivity is obtained by applying a predetermined film thickness on a substrate such as a wafer coated with silicon dioxide or an antireflection film, and prebaking (PB) at a temperature of usually about 70 to 160 ° C. in some cases. The solvent in the resin composition is volatilized to form a resist film.

[Step (2)]
In this step, the resist film formed in the step (1) is exposed by irradiation with radiation (in some cases through an immersion medium such as water). At this time, radiation is irradiated through a mask having a predetermined pattern. The radiation is appropriately selected from visible light, ultraviolet light, far ultraviolet light, X-rays, charged particle beams, EUV, etc. according to the line width of the target pattern. Among these, far ultraviolet rays represented by ArF excimer laser (wavelength 193 nm) and KrF excimer laser (wavelength 248 nm) are preferable, and light sources capable of forming finer patterns such as EUV (extreme ultraviolet ray, wavelength 13.5 nm) are preferred. Even if it exists, it can be used conveniently. Subsequently, it is preferable to perform post-exposure baking (PEB). This PEB makes it possible to smoothly proceed with elimination of the acid dissociable group of the [A] polymer. The heating condition of PEB can be appropriately selected depending on the composition of the radiation sensitive resin composition, but is usually about 50 ° C to 180 ° C.

[Step (3)]
In this step, a resist pattern is formed by developing the exposed resist film with a developer. After development, it is common to wash with water and dry. As the developer, for example, sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, ethylamine, n-propylamine, diethylamine, di-n-propylamine, triethylamine, methyldiethylamine, ethyl Dimethylamine, triethanolamine, tetramethylammonium hydroxide, pyrrole, piperidine, choline, 1,8-diazabicyclo- [5.4.0] -7-undecene, 1,5-diazabicyclo- [4.3.0] An aqueous alkaline solution in which at least one alkaline compound such as -5-nonene is dissolved is preferable.

  In the case of performing immersion exposure, before the step (2), in order to protect the direct contact between the immersion liquid and the resist film, an immersion liquid insoluble immersion protective film is formed on the resist film. It may be provided. As the protective film for immersion, a solvent-peeling protective film that peels off with a solvent before the step (3) (see, for example, JP-A-2006-227632), a developer that peels off simultaneously with the development in the step (3) Any of peelable protective films (for example, see International Publication No. 2005-069096, International Publication No. 2006-035790, etc.) may be used.

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples. The ¹³ C-NMR analysis was measured using JNM-EX270 (manufactured by JEOL).

  The structures of monomers used for the synthesis of [A] polymer, polymer for comparative example corresponding to [A] polymer, and fluorine atom-containing polymer described later are shown below.

<[A] Synthesis of polymer>
[Synthesis Example 1]
29.28 g (35 mol%) of the compound (M-1), 53.35 g (45 mol%) of the compound (M-3) and 5.97 g (10 mol%) of the compound (M-4) were converted into 2-butanone. A monomer solution dissolved in 200 g and further charged with 7.54 g of 2,2′-azobis (2-methylpropionitrile) was prepared. A 1,000 mL three-necked flask charged with 11.40 g (10 mol%) of the above compound (M-2) and 100 g of 2-butanone was purged with nitrogen for 30 minutes. After purging with nitrogen, the reaction vessel was stirred at 80 ° C. The monomer solution was added dropwise using a dropping funnel over 3 hours. The polymerization start was carried out for 6 hours with the start of dropping as the polymerization start time. After completion of the polymerization, the polymerization solution was cooled to 30 ° C. or less by water cooling, charged into 4,000 g of methanol, and the precipitated white powder was filtered off. The filtered white powder was dispersed in 400 g of methanol and washed in the form of a slurry, followed by filtration, followed by filtration twice, followed by vacuum drying at 50 ° C. for 17 hours to obtain a white powder copolymer (A- 1) was obtained. Mw of (A-1) is 5,500, Mw / Mn = 1.36, and as a result of ¹³ C-NMR analysis, compound (M-1), compound (M-2), compound (M-3) ) And the content of each structural unit derived from the compound (M-4) is 34.5 (structural unit (II)): 9.0 (structural unit (II)): 47.1 (structural unit (I) ): 9.4 (structural unit (IV)) (mol%).

[Synthesis Example 2]
26.14 g (35 mol%) of the above compound (M-1), 58.34 g (45 mol%) of the compound (M-5) and 5.33 g (10 mol%) of the compound (M-4) were converted into 2-butanone. A monomer solution was prepared by dissolving in 200 g and adding 6.73 g of 2,2′-azobis (2-methylpropionitrile). A 1,000 mL three-necked flask charged with 10.18 g (10 mol%) of the above compound (M-2) and 100 g of 2-butanone was purged with nitrogen for 30 minutes. After purging with nitrogen, the reaction vessel was stirred at 80 ° C. The monomer solution was added dropwise using a dropping funnel over 3 hours. The polymerization start was carried out for 6 hours with the start of dropping as the polymerization start time. After completion of the polymerization, the polymerization solution was cooled to 30 ° C. or less by water cooling, charged into 4,000 g of methanol, and the precipitated white powder was filtered off. The filtered white powder was dispersed in 400 g of methanol and washed in the form of a slurry, followed by filtration, followed by filtration twice, followed by vacuum drying at 50 ° C. for 17 hours to obtain a white powder copolymer (A- 2) was obtained. Mw of (A-2) is 5,300, Mw / Mn = 1.30, and as a result of ¹³ C-NMR analysis, compound (M-1), compound (M-2), compound (M-5) ) And the content of each structural unit derived from the compound (M-4) is 34.2 (structural unit (II)): 9.1 (structural unit (II)): 47.0 (structural unit (I) ): 9.7 (structural unit (IV)) (mol%).

[Synthesis Example 3]
Compound (M-1) 25.98 g (35 mol%), compound (M-8) 9.54 g (10 mol%), compound (M-6) 55.42 g (45 mol%) and compound (M- 7) A monomer solution was prepared by dissolving 9.05 g (10 mol%) in 200 g of 2-butanone and adding 6.70 g of 2,2′-azobis (2-methylpropionitrile). A 1,000 mL three-necked flask charged with 100 g of 2-butanone was purged with nitrogen for 30 minutes. After purging with nitrogen, the reactor was heated to 80 ° C. with stirring, and the monomer solution prepared in advance was added to the dropping funnel. Was added dropwise over 3 hours. The polymerization start was carried out for 6 hours with the start of dropping as the polymerization start time. After completion of the polymerization, the polymerization solution was cooled to 30 ° C. or less by water cooling, charged into 4,000 g of methanol, and the precipitated white powder was filtered off. The filtered white powder was dispersed in 400 g of methanol and washed in the form of a slurry, followed by filtration, followed by filtration twice, followed by vacuum drying at 50 ° C. for 17 hours to obtain a white powder copolymer (A- 3) was obtained. Mw of (A-3) is 5,300, Mw / Mn = 1.30, and as a result of ¹³ C-NMR analysis, compound (M-1), compound (M-8), compound (M-6) ) And the content of each structural unit derived from the compound (M-7) is 34.2 (structural unit (II)): 10.0 (structural unit (II)): 46.0 (structural unit (I)). ): 9.8 (structural unit (III)) (mol%).

[Synthesis Example 4]
31.63 g (35 mol%) of the above compound (M-1), 49.60 g (45 mol%) of the compound (M-7) and 6.45 g (10 mol%) of the compound (M-4) were converted into 2-butanone. A monomer solution was prepared by dissolving in 200 g and adding 8.14 g of 2,2′-azobis (2-methylpropionitrile). A 1,000 mL three-necked flask charged with 12.32 g (10 mol%) of the above compound (M-2) and 100 g of 2-butanone was purged with nitrogen for 30 minutes. After purging with nitrogen, the reaction kettle was stirred at 80 ° C. The monomer solution prepared in advance was added dropwise over 3 hours using a dropping funnel. The polymerization start was carried out for 6 hours with the start of dropping as the polymerization start time. After completion of the polymerization, the polymerization solution was cooled to 30 ° C. or less by water cooling, charged into 4,000 g of methanol, and the precipitated white powder was filtered off. The filtered white powder was dispersed in 400 g of methanol and washed in the form of a slurry, followed by filtration, followed by filtration twice, followed by vacuum drying at 50 ° C. for 17 hours to obtain a white powder copolymer (CA -1) was obtained. Mw of (CA-1) is 4,300, Mw / Mn = 1.30, and as a result of ¹³ C-NMR analysis, compound (M-1), compound (M-2), compound (M-7) And the content of each structural unit derived from the compound (M-4) is 35.6 (structural unit (II)): 8.9 (structural unit (II)): 46.2 (structural unit (III)): 9.3 (structural unit (IV)) (mol%).

[Synthesis Examples 5 to 7]
Polymers (A-4), (A-5) and (CA-2) were obtained in the same manner as in Synthesis Example 1 except that the types and amounts of monomers listed in Table 1 were used. . Table 2 shows the content of each structural unit, Mw, Mw / Mn ratio, and yield (%) of each polymer obtained.

<Synthesis of fluorine atom-containing polymer>
[Synthesis Example 8]
37.41 g (40 mol%) of the above compound (M-9) and 62.59 g (60 mol%) of the compound (M-10) were dissolved in 100 g of 2-butanone, and 2,2′-azobis (2-methyl) was further dissolved. A monomer solution charged with 4.79 g of propionitrile was prepared. A 1,000 mL three-necked flask charged with 100 g of 2-butanone was purged with nitrogen for 30 minutes. After purging with nitrogen, the reactor was heated to 80 ° C. with stirring, and the monomer solution prepared in advance was added to the dropping funnel. And added dropwise over 3 hours. The polymerization start was carried out for 6 hours with the start of dropping as the polymerization start time. After completion of the polymerization, 150 g of 2-butanone was removed from the polymerization solution under reduced pressure. After cooling to 30 ° C. or lower, the white powder deposited by adding it to a mixed solvent of 900 g of methanol and 100 g of ultrapure water was filtered off. The filtered white powder was dispersed in 100 g of methanol, washed in the form of a slurry, and then filtered again twice. The obtained white powder was vacuum-dried at 50 ° C. for 17 hours to obtain a copolymer (D-1) (78 g, yield 78%). Mw of (D-1) is 6,920, Mw / Mn = 1.593, and as a result of ¹³ C-NMR analysis, the content of each structural unit of compound (M-9) and compound (M-10) Was 40.8: 59.2 (mol%). The fluorine content was 9.6% by mass.

[Synthesis Example 9]
Compound (M-1) 35.8 g (70 mol%) and compound (M-14) 14.2 g (30 mol%) were dissolved in 100 g of 2-butanone, and dimethyl 2,2′-azobisisobutyrate was dissolved. A monomer solution was prepared by adding 2.34 g of rate. A 500 mL three-necked flask containing 20 g of 2-butanone was purged with nitrogen for 30 minutes, then heated to 80 ° C. with stirring, and the prepared monomer solution was added dropwise over 3 hours using a dropping funnel. The dripping start was set as the polymerization reaction start time, and the polymerization reaction was carried out for 6 hours. After completion of the polymerization reaction, the polymerization solution was cooled with water and cooled to 30 ° C. or lower. The reaction solution was transferred to a 1 L separatory funnel, and then the polymerization solution was uniformly diluted with 200 g of n-hexane, and 800 g of methanol was added and mixed. Next, 20 g of distilled water was added, and the mixture was further stirred and allowed to stand for 30 minutes. Thereafter, the lower layer was recovered, and a polymer (D-2) was obtained as a propylene glycol monomethyl ether solution (yield 60%). This polymer (D-2) had Mw of 6,000 and Mw / Mn of 1.45. Moreover, as a result of ¹³ C-NMR analysis, the polymer (D-2) has a content ratio of the structural unit derived from the compound (M-1): the structural unit derived from the compound (M-14) of 69:31 (mol%). ).

<Preparation of radiation-sensitive resin composition>
[Example 1]
[A] 100 parts by mass of copolymer (A-1) as a polymer, [B] 13 parts by mass of (B-1) described later as a salt having photodegradability, and [C] described later as an acid generator (C-1) 13 parts by mass, copolymer (D-1) 3 parts by mass as a fluorine atom-containing polymer, propylene glycol monomethyl ether (E-1) 1,980 parts by mass as a solvent, and cyclohexanone ( E-2) 848 parts by mass and 200 parts by mass of γ-butyrolactone (F-1) as an uneven distribution accelerator were added, and each component was mixed to obtain a uniform solution. Then, the positive radiation sensitive resin composition was prepared by filtering using a membrane filter with a pore diameter of 200 nm (solid content concentration of about 4%).

[Examples 2 to 10 and Comparative Examples 1 to 7]
A positive radiation-sensitive resin composition was prepared in the same manner as in Example 1 except that the types and amounts of each component shown in Table 3 and Table 4 were used. In Tables 3 and 4, “-” indicates that the corresponding component was not used.

  [B] component and [C] acid generator used for preparation of each Example and a comparative example are as follows.

<[B] Salt having photodegradability>
B-1: Triphenylsulfonium 2-hydroxysalicylate represented by the following formula B-2: Triphenylsulfonium camphorsulfonate represented by the following formula

b-1: tert-amyl 4-hydroxy-1-piperidinecarboxylate represented by the following formula

<[C] acid generator>
C-1: triphenylsulfonium 4- (1-adamantanecarbonyloxy) -1,1,2,2-tetrafluorobutanesulfonate represented by the following formula C-2: triphenylsulfonium 1 represented by the following formula , 1,2,2-Tetrafluoro-6- (1-adamantanecarbonyloxy) -hexane-1-sulfonate

<Formation of resist pattern>
[Pattern Forming Method 1]
Examples 1 to 3 and Comparative Examples 1 and 2 were each coated with a radiation-sensitive resin composition on a 12-inch silicon wafer on which a lower antireflection film (ARC66, manufactured by Nissan Chemical Industries) was formed. PB was performed for 60 seconds to form a resist film having a thickness of 75 nm. Next, this resist film was exposed through a mask pattern using an ArF excimer laser immersion exposure apparatus (NSR S610C, manufactured by NIKON) under the conditions of NA = 1.3, ratio = 0.800, and annular. After the exposure, PEB was performed for 60 seconds at the temperature shown in Table 3. Thereafter, the resist film was developed with a 2.38 mass% tetramethylammonium hydroxide aqueous solution, washed with water, and dried to form a positive resist pattern.

[Pattern Forming Method 2]
The radiation sensitive resin compositions of Examples 4 to 6 and Comparative Examples 3 to 5 were respectively applied on a 12-inch silicon wafer on which an underlayer antireflection film (ARC66, manufactured by Nissan Chemical Industries) was formed. PB was performed for 60 seconds to form a resist film having a thickness of 75 nm. Next, the composition for forming an upper layer film described in Example 1 of WO2008 / 047678 was spin-coated on the formed resist film, and a resist film having a thickness of 90 nm was formed by heating at 90 ° C. for 60 seconds. . This resist film was exposed through a mask pattern using an ArF excimer laser immersion exposure apparatus (NSR S610C, manufactured by NIKON) under the conditions of NA = 1.3, ratio = 0.800, and annular. After the exposure, PEB was performed for 60 seconds at the temperature shown in Table 3. Thereafter, the resist film was developed with a 2.38 mass% tetramethylammonium hydroxide aqueous solution, washed with water, and dried to form a positive resist pattern.

[Pattern Forming Method 3]
The radiation sensitive resin compositions of Examples 7 to 8 and Comparative Examples 6 to 7 were applied on a 12-inch silicon wafer on which a lower antireflection film (ARC66, manufactured by Nissan Chemical Industries) was formed, and the temperatures shown in Table 4 were applied. Then, PB was performed for 60 seconds to form a resist film having a thickness of 100 nm. Using this ArF excimer laser immersion exposure apparatus (NSR S610C, manufactured by NIKON) on this resist film, a pattern after reduction projection under the conditions of NA = 1.3, iNA = 1.27, ratio = 0.800, and Annular Was exposed through a pattern forming mask pattern having a pitch of 65 nm and a pitch of 95 nm. After the exposure, PEB was performed at the temperature shown in Table 4 for 60 seconds. Thereafter, the resist film was developed with a 2.38 mass% tetramethylammonium hydroxide aqueous solution, washed with water, and dried to form a positive resist pattern.

<Evaluation>
Various physical properties of the resist pattern formed as described above were evaluated as follows. The results are shown in Table 3 and Table 4.

[MEEF]
For Examples 1 to 6 and Comparative Examples 1 to 5, exposure is performed through a mask pattern having a target size of 50 nm 1 L / 1 S, and an exposure amount at which a line and space (LS) pattern having a line width of 50 nm is formed is optimally exposed. Amount (Eop). Next, an LS pattern with a pitch of 100 nm is formed by using the mask pattern with the line width target size of 46 nm, 48 nm, 50 nm, 52 nm, and 54 nm, respectively, and the line width formed on the resist film is measured by the SEM. (Hitachi, CG4000).
For Examples 7 to 10 and Comparative Examples 6 to 7, the exposure amount at which the portion exposed through the mask pattern for pattern formation with a 65 nm hole and a 95 nm pitch pattern after reduction projection forms a hole with a diameter of 55 nm is expressed as Eop. did. Next, in the above Eop, a mask pattern having a pattern hole diameter of 63 nm, 64 nm, 65 nm, 66 nm, and 67 nm is used to form a hole pattern, and the hole diameter formed in the resist film is measured by a length measuring SEM (manufactured by Hitachi). , CG4000).
At this time, the slope of the straight line when the target size (nm) was plotted on the horizontal axis and the line width (nm) formed on the resist film using each mask pattern was plotted on the vertical axis was calculated as MEEF. It is determined that the mask reproducibility is better as the value is closer to 1, and the mask creation cost can be reduced as the MEEF value is lower.

[LWR]
About Examples 1-6 and Comparative Examples 1-5, it exposed through the mask pattern whose target size is 50 nm1L / 1.8S, and the exposure amount by which the resist pattern with a line | wire width of 50 nm is formed was set to Eop. The 50nm 1L / 1.8S pattern obtained by the above Eop is observed from the upper part of the pattern with a length measurement SEM (Hitachi, CG4000), and the line width is observed at an arbitrary point at 10 points, and the measurement variation is expressed by 3 sigma. The value obtained was defined as LWR. The lower the LWR value, the better the pattern linearity.

[Minimum collapse dimension]
Examples 1 to 6 and Comparative Examples 1 to 5 were exposed while changing the exposure amount by 1 mJ through a mask pattern having a target size of 50 nm 1 L / 1.8 S. The line width of the pattern formed at an exposure amount 1 mJ smaller than the exposure amount at which the line collapse occurred was measured with a length measurement SEM (manufactured by Hitachi, Ltd., CG4000) to obtain the minimum collapse dimension. Note that the smaller the value, the higher the resistance to pattern collapse.

[CDU (nm)]
For Examples 7 to 10 and Comparative Examples 6 to 7, the exposure amount at which a portion exposed through a mask pattern for pattern formation of 65 nm holes and 95 nm pitches formed a reduced projection formed holes having a diameter of 55 nm was defined as Eop. . A total of 30 hole patterns with a diameter of 55 nm formed by the Eop were measured, and the value of 3σ of the average deviation of the 30 measured values was defined as CDU (nm). When CDU was 5.0 (nm) or less, it was evaluated as good.

[Resolution (nm)]
For Examples 7 to 10 and Comparative Examples 6 to 7, when the pattern after reduction projection was exposed through a mask pattern having a 65 nm hole and 95 nm pitch at an exposure amount equal to or less than Eop at the time of CDU evaluation, the exposure amount was reduced. The minimum dimension (nm) of the resultant hole pattern was defined as the resolution. When the resolution was 50 (nm) or less, it was evaluated as good.

  As is clear from the results shown in Table 1, it was found that the resist pattern formed from the radiation-sensitive resin composition was excellent in MEEF, LWR, CDU and resistance to pattern collapse. In this example, ArF is used as the exposure light source. However, even when a short wavelength radiation such as EUV is used, the obtained fine pattern has similar resist characteristics and has an equivalent evaluation. The result is considered to be obtained.

  The radiation-sensitive resin composition of the present invention includes MEEF, LWR, CDU and a radiation-sensitive resin composition capable of forming a resist pattern excellent in pattern collapse resistance, and formation of a resist pattern using the radiation-sensitive resin composition A method can be provided. Therefore, even with radiation such as KrF excimer laser, ArF excimer laser, EUV, etc., a fine pattern can be formed with high accuracy and stability from the radiation sensitive resin composition, and further miniaturization will progress in the future. It can be suitably used for expected semiconductor device manufacturing.

Claims (6)

[A] a polymer comprising a structural unit (I) represented by the following formula (1) and a structural unit having an acid dissociable group;
[B] A radiation-sensitive resin composition containing a salt having photodegradability, represented by the following formula (2), and [C] a radiation-sensitive acid generator.

(In the formula (1),
R ¹ is a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group.
R ² is a single bond, a divalent chain hydrocarbon group having 1 to 4 carbon atoms, an ether group, an ester group, a carbonyl group, or a divalent linking group in which two or more thereof are combined. However, one part or all part of the hydrogen atom which the said chain hydrocarbon group or a coupling group has may be substituted.
R ³ is a monovalent group containing a sultone structure. )

(In the formula (2),
Q ⁺ is a monovalent onium cation.
Y ⁻ is a monovalent sulfonate anion, a carboxylate anion or a sulfonamide anion. However, Y ^- is, if a sulfonate anion, not if sulfonate group is bonded directly with a fluorine atom or a carbon atom perfluoroalkyl group is attached. ) The radiation-sensitive resin composition according to claim 1, wherein the monovalent group containing the sultone structure is a group represented by the following formula (3).

(In formula (3),
R ⁴ is an oxygen atom, a sulfur atom, or a divalent chain hydrocarbon group having 1 to 5 carbon atoms that may contain an oxygen atom or a sulfur atom in the skeleton chain.
a is an integer of 0-2.
R ⁵ is a monovalent organic group. However, if R ⁵ there are a plurality, the plurality of R ⁵ may be the same or different.
* Indicates a site binding to said ^{R 2.} ) R ² is a single bond, —CH ₂ COO — ** or —CH ₂ CH ₂ —O — ** (** represents a site bonded to R ³ ), R ⁴ is a methylene group, and a is The radiation-sensitive resin composition according to claim 2, which is 0. The radiation sensitive resin composition according to claim 3, wherein R ² is a single bond. The radiation sensitive resin composition according to any one of claims 1 to 4, wherein the Q ⁺ is a cation represented by the following formula (4).

(In the formula ^(4), R 6 ~R ⁸ each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a thiol group, an organic sulfonyl group _(RSO 2 -), alkyl group having 1 to 10 carbon atoms , A cycloalkyl group having 3 to 12 carbon atoms or an alkoxy group having 1 to 10 carbon atoms, wherein R is an alkyl group, a cycloalkyl group, or an aryl group, provided that the alkyl group having R ^{6 to} R ⁸ above, (Part or all of the hydrogen atoms of the cycloalkyl group or alkoxy group may be substituted.) (1) A step of forming a resist film on a substrate using the radiation-sensitive resin composition according to any one of claims 1 to 5,
(2) A method of forming a resist pattern, comprising: exposing the resist film; and (3) developing the exposed resist film.