JP2012079971A - Electronic circuit and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem that it is required to minimize the thickness of an electric functional layer for the electrical characteristics and the short response time of a component, and to use a print medium of lower viscosity.SOLUTION: In the electronic circuit, and a manufacturing method of the electronic circuit having at least two electronic components on a common flexible circuit board, the at least two electronic components individually have at least one electric functional layers 5a, 5b composed of the same functional layer material. The electric functional layers 5a, 5b are formed of the same functional layer material, and of the region of a layer formed on the circuit board in strip type form.

Description

  The present invention relates to an electronic circuit comprising at least two electronic components on a common flexible substrate, the at least two electronic components comprising at least one electrical functional layer of the same functional layer material in each case. Have. The invention further relates to a method for the manufacture of an electronic circuit comprising at least two electronic components on a common flexible substrate, the at least two electronic components being made of the same functional layer material in each case It is formed by at least one electric functional layer.

  U.S. Pat. No. 6,057,089 discloses a method for the production of a film, in which case the film comprises at least one component, in particular one or more field effect transistors, using organic semiconductor technology. The structuring of one or more layers of parts is in this case brought about by thermal replication or UV replication. In this case, the replicated layer applied in a large area mode is completely cut partially by replication to form an electrical functional layer structured in a patterning mode. However, the application of a large area layer of the layer to be replicated is not always possible due to space reasons, and further leads to increased material consumption.

  The electrical functional layer already applied to the substrate in the final form is realized, for example, by a printing method. The use of printing methods in the manufacture of electronic components allows the components to be mass produced at a high process speed and at a low cost. The speed of the substrate in the printing direction during printing is preferably chosen at least 0.5 m / min, preferably in the range 5 to 200 m / min. In order to ensure the electrical values that are as uniform as possible and the functionality of the electronic components, the individual electrical functional layers from which the electronic components are composed must be formed one after the other, in this case a predetermined layout. Must be placed one above the other in the correct position and arrangement.

  Furthermore, it is necessary to minimize the layer thickness of the electrical functional layer with respect to the electrical properties of the component and the short response time. In order to be able to achieve this, for example in the case of a printed electrical functional layer, it is necessary to use even lower viscosity printing media.

  At the high process speeds required during the formation of an electrical functional layer using a low viscosity medium, first of all, an inaccurate edge for the electrical functional layer is the only partial, i.e. of the electrical functional layer. The problem of forming during patterning application will later occur. The edge or margin of the electrical functional layer is unclear in the region of the separation line. This is because the print media that opposes the direction of substrate movement is pushed, pulled or rotated beyond the desired ideal boundary for high process speeds. Smearing gets worse as the viscosity of the medium decreases. However, the effect is always present (microscopically), i.e. even in the case of highly viscous print media. The more critical the dimensions, the more pronounced this effect is even with high viscosity media. Furthermore, functional layers smeared in the printing direction do not allow precise alignment of subsequent functional layers to be placed on them.

  The high process speeds required during the formation of an electrical functional layer using a low viscosity medium allow each functional layer to be applied in an already structured form, i.e. during application in the final form of each functional layer. A further problem arises that it is not possible to form a sufficiently uniform layer thickness over this region. This action occurs particularly near the edge of the functional layer.

International Publication No. 2004 / 032257A2 Pamphlet

  The object of the present invention is therefore to provide an electronic circuit and a method for the manufacture of the electronic circuit that overcome the disadvantages of the prior art.

  The object is achieved for an electronic circuit comprising at least two electronic components on a common flexible substrate, wherein at least two electronic components in each case have an electrical functional layer made of the same functional layer material strip-type on the substrate. Due to the fact that it is formed from layer regions of layers formed in a manner, it has at least one electrical functional layer made of the same functional layer material.

  The object is achieved for a method for the manufacture of an electronic circuit comprising at least two electronic components on a common flexible substrate, where at least two electronic components are in each case at least one strip-type layer on the substrate. Formed by at least one electric functional layer made of the same functional layer material due to the fact that it is formed and in that the electric functional layer made of the same functional layer material is formed from the layer region of the individual strip-type layers Is done.

  The strip-type application of functional layer material to the substrate allows for the application of a layer of uniform thickness with a clean contour and at the same time saving space. Substrates made in this way and comprising at least one strip-type layer of functional layer material can be used in various ways and can be individually adapted to each desired electronic circuit.

In this case, it is particularly preferred if each group of different electronic components is embodied by a different strip type layer attached thereto. For example, two or more first electronic components of the same type are provided, for example forming a transistor, a diode, a non-reactive resistor, or a capacitor. Further, unlike the first electronic component, two or more second electronic components of the same type are provided, for example selected from the group comprising transistors, diodes, resistors and capacitors. At this time, the first electronic component is embodied by a layer region of one or more first strip type layers, and the second electronic component is a layer of one or more second strip type layers. Embodied by region. The first and second electronic components are arranged in two or more rows arranged parallel to each other, which on the one hand obviously increases the wiring costs, but on the other hand in particular the printing process. This leads to significant production engineering advantages when manufacturing electronic circuits in a continuous process.
It has been found to be particularly valuable when a layer formed in a strip-type manner on a substrate is formed in a continuous process on the substrate in a specific application direction. The layer formed in a strip-type manner on the substrate is preferably a printed layer or a layer formed by applying a liquid medium on the substrate.

  In particular, in this case, the continuous process used is a printing method, in particular a printing method from the group of intaglio printing, relief printing, screen printing, or the continuous process used is that at least one strip-type layer is applied to the substrate. Any other coating method that applies a liquid medium to form (eg, blade coating, spin coating, spraying or ink jet printing). During printing of the strip type layer, the application direction consequently corresponds to the printing direction. In particular, it is preferred for the method according to the invention if a printing tool developed on the substrate at least in region units is used for printing at least one strip-type layer. For example, flexible rubber tools such as printing rollers or pads are suitable here as printing tools.

  In this case, printing media or liquid media having an absolute viscosity of less than 200 mPas, in particular less than 50 mPas when considered at a temperature of 20 ° C. are preferred for forming at least one strip-type layer. Such a low-viscosity medium makes it possible to form a very thin electrical functional layer, while at the same time improving the performance characteristics of the electronic components produced thereby.

  The value when the first electronic component of the at least two electronic components has the first electrical functional layer and the second electronic component of the at least two electronic components has the second electrical functional layer. The first and second electrical functional layers are formed from the same functional layer material, and the first and second electrical functional layers are arranged one after the other or in line with each other in the application direction. It is arrange | positioned on a board | substrate so that it may be arrange | positioned.

  It is particularly preferred if the layer formed in a strip-type manner on the substrate is a semiconductive or electrically insulating layer, in particular an organic semiconductive or organic electrically insulating layer. However, conductive, if appropriate organic conductive strip-type layers can also be used.

  For example, polythiophene is eligible as an organic semiconductor material. In particular, polyvinylphenol has proven to be valuable as an organic insulating material. The inorganic semiconductor or insulating material can be deposited, sputtered or inserted by a paste containing semiconductive or electrically insulating inorganic fine particles, in particular nanoparticles.

  It is particularly advantageous to form a substrate comprising a plurality of strip-type layers arranged side by side in parallel and formed from different functional layer materials. The components required to form the electronic circuit can be constructed therefrom by further, if appropriate and further coating of individual areas with strip-type layers.

  In order to form individual components of an electronic circuit, layers formed in a strip-type manner on the substrate may need to be interrupted and / or subdivided into mutually independent layer regions, When viewed across the cross-section of a layer formed in a strip-type manner above, at least one continuous opening is formed in the layer formed in a strip-type manner on the substrate.

  In this case, it has proven to be valuable if the layer formed in a strip-type manner on the substrate is subdivided in the application direction and / or perpendicular to the application direction. The use of laser beam, embossing, cutting, grinding or scratching has proven valuable as a qualified method for structuring at least one strip type layer.

  Preferably, at least one opening of a layer formed in a strip-type manner on the substrate forms a via so that when viewed perpendicular to the substrate plane (xy plane), the strip-type manner on the substrate Electrical contact is formed between the electrical functional layers disposed above and below the layer formed in (i). This therefore allows a connection in three dimensions (z-plane) between the functional layers.

  It has been found convenient if the aperture has a width in the range of 1 μm to 10 mm, preferably 50 μm to 2 mm. Such dimensions can be realized with high accuracy, for example by intaglio or letterpress printing when using the method according to the invention. Such a width ensures sufficient electrical insulation of the layer region of the strip-type layer during the formation of plated through-holes by such openings and also a sufficient material uptake capability (eg for taking up printing paste). .

  It has proved valuable when at least one electronic component is formed as a transistor, in particular as a field effect transistor. In particular, it has proven to be valuable if at least two electronic components are formed as field effect transistors in individual cases, where the field effect transistor is in each case a half-type formed on a substrate in a strip-type manner. Having a semiconductive electrical functional layer made of the same functional layer material formed from the layer region of the conductive layer, and the field effect transistor in each case is an electrical circuit formed in a strip-type manner on the substrate It has an electrical insulating electrical functional layer made of the same functional layer material formed from the layer region of the insulating layer.

  Furthermore, it has proven advantageous if at least one electronic component is formed as a diode. In particular, it is advantageous if at least two electronic components are formed as diodes in individual cases, the diodes being formed in each case from a layer region of a semiconductive layer formed in a strip-type manner on a substrate. And a semiconductive electric functional layer made of the same functional layer material.

  Furthermore, it has proven valuable when at least one electronic component is formed as a non-reactive resistor. In particular, it is advantageous if at least two electronic components are formed as non-reactive resistors in each case, the resistors being in each case from the layer region of a layer formed in a strip-type manner on the substrate. It has a functional layer made of the same functional layer material to be formed.

  Furthermore, it has been found advantageous if at least one electronic component is formed as a capacitor. In particular, it is advantageous if at least two electronic components are formed as capacitors in individual cases, the capacitors being formed in each case from a layer region of an electrically insulating layer formed in a strip-type manner on the substrate. It has an electrically insulating functional layer made of the same functional layer material.

  For continuous processes, it has been found to be advantageous, especially when the flexible substrate is formed in a tape-type manner. During at least formation of the at least one strip-type layer, the substrate can thereby be transferred from roll to roll accordingly. In this case, the uncoated flexible substrate is wound up on a roll, the substrate is unwound from the roll, e.g. guided in a printing press, printed in a process, and finally wound up on another roll as a printed substrate. This makes it possible to process long substrate tapes, and positioning with respect to the printing press need only be performed once at the beginning of a new substrate roll.

  In this case, at least one layer formed in a strip type manner on the substrate is arranged parallel to the longitudinal side of the tape type substrate, that is, the application direction is arranged parallel to the longitudinal side of the tape type substrate. Is particularly preferred. As a result, strip-type layers can be continuously formed on the substrate from the beginning of the roll to the end of the roll, thereby increasing layer uniformity (in terms of layer thickness, width and surface roughness). .

  The flexible substrate can be formed in a multilayer fashion. If appropriate, it is particularly preferred if the flexible substrate used is a multi-layered elongated plastic film. For example, plastic films made of polyester, polyethylene, polyethylene terephthalate or polyimide are suitable in this case. It has proved to be worthwhile if a flexible substrate thickness in the range 6 μm to 200 μm, preferably in the range 12 μm to 50 μm, is selected.

  It has proved valuable if at least two, in particular 2-20, layers formed in a strip-type manner on the substrate are arranged parallel to each other on the substrate. In this case, the width of such a strip type layer is preferably 50 μm to 2000 μm. The preferred distance between two strip-type layers arranged in parallel next to each other is in this case 2000 μm to 50000 μm

  It is particularly preferred if the at least two layers formed in a strip-type manner on the substrate are arranged in one plane and / or different planes of the substrate when viewed in the substrate cross section. As a result, a three-dimensional circuit can be manufactured in a simple manner.

  It is advantageous if at least two electronic components have at least two electrical functional layers made of different functional layer materials in each case, and in each case one of at least two electrical functional layers of at least two components. One is formed by structuring a strip-type layer that is used jointly by at least two electronic components as a result. This ensures optimal placement of parts and utilization of strip type layers.

  It has been found worthwhile that the first electronic component of the at least two electronic components has the first electrical functional layer, and the second electronic component of the at least two electronic components is the second electrical component. The first and second electric functional layers are formed of the same functional layer material, and the first and second electric functional layers are successively arranged when viewed in the application direction. Alternatively, they are arranged on the substrate so as to be arranged side by side.

  Preferably, the layer formed in a strip-type manner on the substrate is formed with a layer thickness in the range from 1 nm to 300 μm, in particular in the range from 1 nm to 300 nm.

  The at least two electronic components usually further have a functional layer, which is electrically conductive, in particular organic or metallic. The latter can be formed by printing, vapor deposition or sputtering (before or after the formation of the strip-type layer) on an uncoated substrate or an already coated substrate.

  Suitable in this case are conductive materials, in particular conductive polymers or metal or metal alloys, for example deposited or sputtered gold or silicon, or gold, silver or conductive inorganic nanoparticles. is there. Here, the conductive “organic” materials are considered to be all kinds of organic, organometallic and inorganic plastics. Therefore, there is no arbitrary limit to the organic material as the carbon-containing material, and conversely, for example, the use of silicone is also conceivable. Furthermore, the term is not intended to be subject to any restrictions with regard to the size of the molecule, in particular with respect to the polymer and / or oligomer material, on the contrary, the use of “small molecules” is also entirely possible. In particular, polyaniline or polypyrrole has proven valuable as a conductive organic material.

  The electronic circuit is preferably an organic circuit. However, it has been found that the organic circuit is equally valuable if it has parts with only organic electrical functional layers and / or parts with organic and inorganic electrical functional layers.

(A) shows a tape type substrate comprising four strip type layers. (B) shows a cross section through the substrate from FIG. (A) shows a tape type substrate having one strip type layer. (B) shows the substrate from FIG. 2 (a) after laser treatment. (A) shows a tape type substrate having one strip type layer. (B) shows the substrate from FIG. 3a after laser treatment. (A) shows a tape type substrate comprising a plurality of strip type layers and another electrical functional layer. (B) shows a cross section through the substrate from FIG. (A) A tape type substrate provided with an electric functional layer is shown. (B) shows a cross section through the substrate from FIG. (A) shows a tape type substrate comprising a strip type layer and another electrical functional layer. (B) shows a cross section through the substrate from FIG. (A) shows a tape type substrate comprising a strip type layer and another electrical functional layer. (B) shows a cross section through the substrate from FIG. (A) shows a tape type substrate comprising a strip type layer and another electrical functional layer. (B) shows a cross section through the substrate from FIG. (A) shows a tape type substrate with a subdivided strip type layer and another strip type layer. (B) shows a cross section through the substrate from FIG.

  1 (a) -9 (b) are intended to illustrate the present invention by way of illustration.

  FIG. 1 (a) shows a flexible tape type substrate 1 made of PET comprising strip type layers 2a, 2b, 2c and 2d arranged on a tape type substrate 1 in the longitudinal direction and parallel to each other. The strip type layers 2a, 2b, 2c and 2d are printed on the substrate 1 by the intaglio printing method, and the arrow on the left side of FIG. 1 (a) indicates the printing direction. The strip type layers 2a, 2b, 2c and 2d are applied in parallel to the printing direction over the entire length of the substrate 1. The plurality of strip type layers 2a are formed in an organic and semiconductive manner, the plurality of strip type layers 2b are formed in an organic and semiconductive manner, and the strip type layer 2c is again formed in an organic and semiconductive manner. The plurality of strip type layers 2d are formed in an organic and electrically insulating manner. The strip type layers 2a, 2b, 2c, 2d are then used either as-is as an electrical functional layer for assembly of electronic components or in other structured forms. Furthermore, if appropriate, a strip-type electrical functional layer is again applied on the substrate 1 for the assembly of electronic components, which are connected to form the desired electronic circuit. This will be described in detail later with reference to FIGS. 4 (a) to 8 (b). The strip-type application of the functional layer material with the print medium results in a particularly uniform layer thickness and contour of the subsequent functional layer of the electronic component.

  FIG. 1B shows a cross section A-A ′ through the substrate 1 and the strip type layers 2 a, 2 b, 2 c, 2 d in FIG.

  FIG. 2 (a) shows a flexible tape type substrate 1 comprising one strip type layer 2b made of an organic semiconductive functional layer material, here polythiophene. The strip type layer 2b is printed on the substrate 1 in the longitudinal direction, and the arrow on the left side of the figure indicates the coating direction. The example identifies the layer region 3a of the strip type layer 2b, which is oriented in the longitudinal direction of the substrate 1, in which, after the formation of the strip type layer 2b, the opening 4a in the strip type layer 2b. In order to give (refer FIG.2 (b)), it cuts with a laser.

  FIG. 2 (b) further shows the substrate 1 and the strip type layer 2b from FIG. 2 (a) after laser treatment, the strip type layer 2b being parallel in the longitudinal direction of the substrate 1 and separated from each other. Divided into three strips. The three strip type layers 2b are then used as electrical functional layers for the assembly of electronic components, if appropriate after further structuring. Furthermore, if appropriate, again a strip-type electrical functional layer is applied on the substrate 1 for the assembly of electronic components, which are connected to form the desired electronic circuit. The strip-type application of the functional layer material with the print medium results in a particularly uniform layer thickness and contour of the subsequent functional layer of the electronic component.

  FIG. 3 (a) also shows a flexible tape type substrate 1 comprising one strip type layer 2b made of an organic semiconductive functional layer material, here polythiophene. In addition to the strip type layer 2b, one or more strip type layers are further provided on the support substrate 1 as shown in FIG. The strip type layer 2b is printed on the substrate 1 in the longitudinal direction, and the arrow on the left side of the figure indicates the coating direction. The example diagram identifies the layer region 3b of the strip type layer 2b, which faces the lateral direction of the substrate 1, in which, after the formation of the strip type layer 2b, an opening 4b ( In order to give (refer FIG.3 (b)), it will cut by a laser.

  FIG. 3 (b) further shows the substrate 1 and the strip type layer 2b from FIG. 3 (a) after laser treatment, the strip type layer 2b being parallel in the lateral direction of the substrate 1 and separated from each other. Divided into three strips. The three strip type layers 2b are then used as electrical functional layers for the assembly of electronic components, if appropriate after further structuring. Furthermore, if appropriate, again a strip-type electrical functional layer is applied on the substrate 1 for the assembly of electronic components, which are connected to form the desired electronic circuit. The strip-type application of the functional layer material with the print medium results in a particularly uniform layer thickness and contour of the subsequent functional layer of the electronic component.

4 (a) and 4 (b) show the structure of an electronic circuit including a large number of electronic components 6a, 6b, 7a, 7b, 8a, 8b, 9a, 9b, and 9c on a common flexible substrate. Yes. On the substrate, the strip type layers 2b, 2c and 2d already described above are applied. As already explained above, the strip type layers 2b and 2c are layers made of a semiconductive material. At this time, the strip type layer 2b and the strip type layer 2c are made of different semiconductive materials, particularly organic semiconductive materials. The strip type layer 2d is made of an electrically insulating material, particularly an organic electrically insulating material. The strip type layers 2b, 2c and 2d are preferably applied in a roll-to-roll manner by a printing method, in particular by gravure printing. Furthermore, as described above with reference to FIGS. 2 (a) to 3 (b), the strip-type layer can be further structured.
Furthermore, the electronic circuit shown in FIGS. 4A and 4B further includes conductive functional layers 5a and 5b. The conductive functional layers 5a and 5b are preferably made of metal, particularly gold. These layers are preferably applied over the entire surface or in a strip-type manner and then structured, for example by laser, mechanical removal, or stripping by etching, for which FIG. ) To FIG. 3B, as described above as an example. Further, the conductive functional layers 5a and 5b are formed of an organic conductive material, and can be applied in an already structured form by a printing method, preferably by gravure printing.
In order to manufacture this electronic circuit, in the first step, the conductive functional layer 5a is applied to the substrate in a structured form, as shown in FIGS. 5 (a) and 5 (b), for example. ing. Next, a strip type layer 2c made of a semiconductive material is applied by a printing method. This is illustrated in FIGS. 6 (a) and 6 (b). Next, a strip type layer 2b made of a semiconductive material is applied by a printing method, and the state is shown in FIGS. 7 (a) and 7 (b). Next, a strip type layer 2d made of an electrically insulating material is applied by a printing method, and this is shown in FIGS. 8 (a) and 8 (b). Next, the conductive functional layer 5b is applied in a structured form, whereby an electric circuit shown in FIGS. 4A and 4B is prepared on the substrate 1. FIG. As described above, after the application of the conductive functional layer 5a, the different electric functional materials selected from the group of the conductive material, the semiconductive material, and the electric insulating material are stripped in three successive printing processes. Each is applied to the substrate in a type manner.
Thereby, a plurality of the same type of electronic components, that is, electronic components 6a and 6b are formed in the region of the strip type layer 2c, and a plurality of the same type of electronic components, that is, the electronic components 7a and 6b are formed in the region of the strip type layers 2d and 2b. 7b is formed, a plurality of the same type of electronic components, that is, electronic components 8a and 8b are formed in the region of the strip type layer 2d, and a plurality of the same type of electronic components, that is, the electronic components 9a, 9b and 9c are formed. Each of the electronic components 6a and 6b constitutes a diode, each of the electronic components 7a and 7b constitutes a transistor, each of the electronic components 8a and 8b constitutes a capacitor, and each of the electronic components 9a, 9b, and 9c. Each constitute a non-reactive resistor:
The units including the conductive functional layers 5a, 5b and the organic semiconductive layer 2c disposed therebetween form respective diodes. In this case, a strip-type electrically insulating layer (not shown here) can optionally be arranged over the entire area between the organic semiconductive layer 2b and the electrically conductive functional layer 5a, In addition, a via or an opening is provided in a region between the organic semiconductive layer 2b and the conductive functional layer 5b. Direct contact between the organic semiconductive layer 2b and the conductive functional layer 5a is possible by vias.
The unit including the conductive functional layers 5a and 5b, the organic semiconductive layer 2b disposed therebetween, and the electrical insulating layer 2d includes conductive functional layers 5a and 5b structured as shown in FIG. In this case, a transistor is formed.
The conductive functional layers 5a and 5b and the electrical insulating layer 2d disposed therebetween form a capacitor.
The conductive functional layers 5a and 5b and the organic semiconductive layer 2d disposed therebetween form non-reactive resistors, respectively. A semiconductor leakage current causes resistance.
The layer 2b may be a layer made of a conductive material having a higher sheet resistivity than the layer 5a, and may be made of, for example, carbon black.
Furthermore, the non-reactive resistor can also be configured as shown in FIGS. 9 (a) and 9 (b):

  FIG. 9 (a) shows a flexible tape type substrate 1 made of PET with a strip type layer 5a made of a conductive functional layer material, here polyaniline or gold, which is repeatedly applied by a laser. It is subdivided. Therefore, an opening 4b extending in a linear fashion and an opening 4c extending in a serpentine fashion are formed, one of which is from a semiconductive layer 2b (not shown) and further from an electrically insulating functional layer material, here polyvinylphenol. Two further strip-type layers of layer 2d were formed one above the other. The layer 2b may be a layer made of a conductive material having a higher sheet resistivity than the layer 5a, and may be made of, for example, carbon black. In this case, the layer regions of the strip type layer 5a before and after the serpentine opening 4c and also the strip type layers 2b, 2d arranged on the serpentine form in each case a separate unit forming a resistor. . A semiconductor leakage current causes resistance. Thus, two resistor units can be identified in FIG. An example diagram of resistor interconnections or their coupling with electronic circuitry has been omitted here for reasons of clarity. Therefore, the layer regions 5a before and after the meanders forming the electrodes of the resistor must also be correspondingly connected to the conductor tracks in order to realize the interconnection of the components.

  The example diagrams of FIGS. 1 (a) -9 (b) serve only to illustrate the concept of the present invention. Based on this, one of ordinary skill in the art can readily find additional electronic circuits and exemplary applications that can use layers coated in a strip-type fashion on a substrate without departing from the present invention herein. Accordingly, FIGS. 1 (a) -9 (b) are not intended to provide any limitation to the strip type layers, the particular configuration of components, and their number and interconnections.

DESCRIPTION OF SYMBOLS 1 Tape type board | substrate 2a, 2b, 2c, 2d Strip type layer 3a, 3b Layer area | region 4a, 4b, 4c Opening 5a, 5b Conductive functional layer

Claims (26)

  An electronic circuit comprising a number of electronic components on a common flexible substrate (1), wherein at least one first and second strip type layer of functional material is applied on the substrate, The component includes two or more first electronic components of the same type formed as transistors, diodes, non-reactive resistors or capacitors, and a group including transistors, diodes, non-reactive resistors and capacitors Two or more second electronic components of the same type formed as different components from the first component, and the first electronic component is at least one first layer made of the same functional layer material. Each of which has at least one first electric functional layer, the first electric functional layer being a first strip type layer (2a, 2b, 2c, 2d, 5a). Each of the second electronic components has at least one second electric functional layer made of the same functional layer material, and the at least one second electric functional layer has the second electric functional layer. It is composed of layer regions of strip type layers (2a, 2b, 2d, 5a), the first strip type layer is arranged in parallel with the second strip type layer, and the first and second strip types An electronic circuit characterized in that the functional layer materials of the layers are different from each other.   The layer (2a, 2b, 2c, 2d, 5a) formed in a strip-type manner on the substrate (1) is formed in a continuous process on the substrate (1) in a specific application direction. The electronic circuit according to 1.   1. The first and / or second strip type layer (2 a, 2 b, 2 d, 2 c) comprises a semiconductive or electrically insulating layer, in particular an organic semiconductive or organic electrically insulating layer. The electronic circuit according to any one of -2.   The first and / or second strip type layer (2a, 2b, 2c, 2d, 5a) is a printed layer or a layer formed by applying a liquid medium on the substrate (1). The electronic circuit according to any one of claims 1 to 3.   At least one of the first and / or second strip type layers (2a, 2b, 2c, 2d, 5a) is interrupted and / or subdivided into mutually independent layer regions And at least one continuous opening (4a, 4b, 4c) when viewed across the cross section of the layer (2a, 2b, 2c, 2d, 5a) formed in a strip-type manner on the substrate (1) The electronic circuit according to any one of claims 1 to 4, wherein the electronic circuit is formed on a layer (2a, 2b, 2c, 2d, 5a) formed in a strip type manner on (1).   6. The first and / or second strip type layer (2a, 2b, 2c, 2d, 5a) is subdivided in the application direction and / or perpendicular to the application direction. Electronic circuit.   7. The electronic circuit according to claim 1, wherein the transistor is formed as a field effect transistor.   The first electronic component of the electronic circuit is formed as a field effect transistor in each case, the field effect transistor being in each case a semiconductive material formed in a strip-type manner on the substrate (1) Having a semiconductive electrical functional layer made of the same functional layer material formed from the layer region of the layer (2b) as a first layer, the field effect transistor being in each case on the substrate (1) Having an electrically insulating electrical functional layer made of the same functional layer material formed from the layer region of the electrical insulating layer (2d) formed in a strip type manner, wherein the semiconductive layer and / or the electrical insulating layer is at least 8. The electronic circuit according to claim 7, forming one first strip type layer.   The second electronic component of the electronic circuit is formed as a diode in each case, the diode being in each case a semiconductive layer (2b) formed in a strip-type manner on the substrate (1) The electronic circuit according to claim 1, further comprising a semiconductive electric functional layer made of the same functional layer material which is formed from the layer region of the second layer and constitutes the second strip type layer.   The second electronic component of the electronic circuit is formed as a capacitor in each case, the capacitor being in each case from the layer region of the electrically insulating layer (2d) formed in a strip-type manner on the substrate The electronic circuit according to claim 1, comprising an electrically insulating functional layer formed of the same functional layer material that is formed and constitutes the second strip type layer.   11. The electronic circuit according to claim 1, wherein the flexible substrate (1) is formed in a tape type manner.   The first and second strip type layers (2a, 2b, 2c, 2d, 5a) are arranged parallel to the longitudinal side of the tape type substrate (1). Electronic circuit.   The electronic circuit according to claim 1, wherein the flexible substrate is a multilayer.   The first and second strip type layers (2a, 2b, 2c, 2d, 5a) are arranged in one plane or different planes of the substrate (1) when viewed in cross section of the substrate. Item 14. The electronic circuit according to any one of Items 1 to 13.   The first and second strip type layers (2a, 2b, 2c, 2d, 5a) are formed with a layer thickness in the range of 1 nm to 300 μm, in particular in the range of 1 nm to 300 nm. Item 15. The electronic circuit according to any one of Items 1 to 14.   16. The electronic circuit according to claim 1, wherein the at least two electronic components further comprise a conductive, in particular organic or metal functional layer.   The electronic circuit has a part having only an organic electrical functional layer and / or has a part having organic and inorganic electrical functional layers. Electronic circuit.   A method for the manufacture of an electronic circuit comprising at least two electronic components on a common flexible substrate (1), the at least two electronic components being in each case at least one electrical material composed of the same functional layer material The functional layer is formed, and at least two strip type layers (2a, 2b, 2c, 2d, 5a) are formed on the substrate (1), and the electric functional layer made of the same functional layer material is a strip type layer ( At least two parallel layers (2a, 2b, 2c, 2a, 2b, 2c, 2c, 2a, 2a, 2c, 2d, 5a) made of the same or different functional layer materials, formed in a strip-type manner 2d, 5a) are used to form an electrical functional layer of the component on the substrate (1), and at least one first electronic component of the electronic circuit is a transistor, die Different components of the group comprising at least one other electronic component of the electrical circuit, to which the transistor, diode, non-reactive resistor and capacitor are formed. In which at least one joint use of the strip type layers (2a, 2b, 2c, 2d, 5a) is brought about only by the same part.   Method according to claim 18, characterized in that at least two strip-type layers (2a, 2b, 2c, 2d, 5a) are formed in a continuous process on the substrate (1) in a predetermined application direction.   The first electronic component of at least two electronic components has a first electric functional layer, the second electronic component of at least two electronic components has a second electric functional layer, The first and second electric functional layers are formed of the same functional layer material, and the first and second electric functional layers are arranged in such a manner that they are arranged one after another in the application direction or next to each other. 1) A method according to either claim 18 or 19, wherein the method is arranged on top.   The flexible substrate (1) is formed in a tape type manner and is transferred from roll to roll during the formation of at least two strip type layers (2a, 2b, 2c, 2d, 5a). Item 21. The method according to any one of Items 18-20.   The method according to claim 19, characterized in that the application direction is arranged parallel to the longitudinal side of the tape-type substrate (1).   The continuous process used is a printing method, in particular a printing method from the group of intaglio printing, relief printing, screen printing, or the continuous process used forms at least one of the strip type layers on the substrate 21. A method according to any one of claims 18 to 20, characterized in that it is any other coating method in which a liquid medium is applied.   When considered at a temperature of 20 ° C., a printing or liquid medium having an absolute viscosity of less than 200 mPas, in particular less than 50 mPas, forms at least one of the strip-type layers (2a, 2b, 2c, 2d, 5a) The method according to claim 21, wherein the method is used.   23. Any of claims 18 to 21, characterized in that at least one of the strip type layers (2a, 2b, 2c, 2d, 5a) is structured by laser beam, embossing, cutting, grinding or scratching. The method according to claim 1.   23. A method according to any one of claims 18 to 22, wherein the at least two electronic components are formed by a further electrical functional layer formed by printing, vapor deposition or sputtering.

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